TW201843682A - Nonvolatile memory apparatus and refresh method thereof - Google Patents
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本發明是有關於一種記憶體裝置,且特別是有關於一種非揮發性記憶體裝置及其刷新方法。The present invention relates to a memory device, and more particularly to a non-volatile memory device and a method of refreshing the same.
傳統快閃記憶體包括複數個記憶體區塊(blocks)。一實體區塊(physical block)中的所有記憶胞為設置在一井結構(well)中,共享井控制信號。各物理區塊有專用的複數條位元線(bit lines)以及字元線(word lines)。各記憶胞位於在位元線與字元線交錯處,以進行編址。Traditional flash memory includes a plurality of memory blocks. All memory cells in a physical block are placed in a well and share well control signals. Each physical block has a dedicated plurality of bit lines and word lines. Each memory cell is located at the intersection of the bit line and the word line for addressing.
快閃記憶體利用施加電壓至記憶胞以設定其臨界電壓,而臨界電壓之準位代表記憶胞中所儲存之資料。通過對選取之記憶胞之閘極施加不同電壓可以驗證記憶胞於寫入、抹除、過度抹除(over-erased)後之臨界電壓準位。一般而言,快閃記憶體在寫入資料之前都會先進行抹除,其中透過對實體區塊的非選擇部份施加適當的反相偏壓,即可對實體區塊進行部份抹除(partial erase)。然如此將對於非選擇區塊的記憶胞造成抹除干擾(erase disturb)而造成之資料錯誤,故須對非選擇區塊的記憶胞逐一地進行刷新(refresh)以保證所儲存的資料正確。如此一來,將使得記憶體操作的時間拉長,而導致刷新效率低下,且刷新的過程中也會對周邊的記憶胞造成寫入干擾而改變其臨界電壓。此外,刷新具有較低臨界電壓、較高臨界電壓或低轉導值的記憶胞,可能會造成位元線驅動電壓不足、資料保存特性變差以及刷新資料錯誤等問題。The flash memory uses a voltage applied to the memory cell to set its threshold voltage, and the threshold voltage level represents the data stored in the memory cell. The threshold voltage level of the memory cell after writing, erasing, and over-erasing can be verified by applying different voltages to the gates of the selected memory cells. In general, the flash memory is erased before writing the data. The physical block can be partially erased by applying an appropriate inversion bias to the non-selected portion of the physical block. Partial erase). However, the data caused by the erase interference of the memory cells of the non-selected block is incorrect, so the memory cells of the non-selected block must be refreshed one by one to ensure that the stored data is correct. As a result, the operation time of the memory is lengthened, and the refresh efficiency is low, and the refreshing process also causes write disturbance to the surrounding memory cells to change the threshold voltage. In addition, refreshing a memory cell with a lower threshold voltage, a higher threshold voltage, or a low transconductance value may cause problems such as insufficient bit line driving voltage, poor data retention characteristics, and refresh data errors.
另外,快閃記憶體具有有限的抹除/寫入次數,隨著抹除以及寫入的次數增加,快閃記憶體會逐步的老化。隨著快閃記憶體的老化,寫入或抹除記憶胞至想要的臨界電壓則需要較長的寫入或抹除時間。In addition, the flash memory has a limited number of erase/write times, and as the number of erases and writes increases, the flash memory gradually ages. As the flash memory ages, writing or erasing the memory cell to the desired threshold voltage requires a longer write or erase time.
本發明提供一種非揮發性記憶體裝置及其刷新方法,可有效提高非揮發性記憶體裝置的刷新效率,並進一步確保刷新後的儲存資料正確。The invention provides a non-volatile memory device and a refreshing method thereof, which can effectively improve the refreshing efficiency of the non-volatile memory device and further ensure that the stored data after the refreshing is correct.
本發明的非揮發性記憶體裝置包括非揮發性記憶體以及控制電路。控制電路耦接非揮發性記憶體,於進行抹除操作時對非選擇區塊進行刷新,非選擇區塊包括多個記憶體區段,各記憶體區段包括多個記憶胞,控制電路判斷記憶體區段的記憶胞的臨界電壓是否大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓,其中若記憶胞的臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓,判斷記憶胞需進行刷新。The non-volatile memory device of the present invention includes non-volatile memory and control circuitry. The control circuit is coupled to the non-volatile memory, and refreshes the non-selected block during the erasing operation. The non-selected block includes a plurality of memory segments, each memory segment includes a plurality of memory cells, and the control circuit determines Whether the threshold voltage of the memory cell of the memory segment is greater than a refresh read reference voltage and less than a refresh write verify reference voltage, wherein if the threshold voltage of the memory cell is greater than the refresh read reference voltage and less than the refresh write verify reference voltage, the memory is determined The cell needs to be refreshed.
在本發明的一實施例中,上述的控制電路更判斷目前位址對應的第一個記憶體區段是否包括臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞,若目前位址對應的第一個記憶體區段未包括臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞,跳過非選擇區塊中剩餘的記憶體區段的刷新操作,而完成非選擇區塊的刷新操作。In an embodiment of the present invention, the control circuit further determines whether the first memory segment corresponding to the current address includes a memory cell having a threshold voltage greater than a refresh read reference voltage and less than a refresh write verify reference voltage. The first memory segment corresponding to the current address does not include a memory cell whose threshold voltage is greater than the refresh read reference voltage and less than the refresh write verify reference voltage, and skips the refresh operation of the remaining memory segments in the non-selected block. And complete the refresh operation of the non-selected block.
在本發明的一實施例中,其中若目前位址對應的第一個記憶體區段包括臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞,控制電路對目前位址對應的記憶體區段以及剩餘的區段中需進行刷新的記憶胞進行刷新。In an embodiment of the invention, if the first memory segment corresponding to the current address includes a memory cell having a threshold voltage greater than a refresh read reference voltage and less than a refresh write verify reference voltage, the control circuit is to the current address. The corresponding memory segment and the remaining cells in the remaining segments are refreshed.
在本發明的一實施例中,上述的控制電路為以批次的方式判斷記憶胞是否需進行刷新。In an embodiment of the invention, the control circuit determines whether the memory cell needs to be refreshed in a batch manner.
在本發明的一實施例中,上述的控制電路包括多個感測電路,各感測電路包括第一感測放大器、第二感測放大器以及刷新致能電路。第一感測放大器的正、負輸入端分別接收對應目標感測記憶胞的儲存資料的感測電壓以及第一參考電壓。第二感測放大器的正、負輸入端分別接收對應感測電壓以及第二參考電壓。刷新致能電路耦接第一感測放大器與第二感測放大器,依據第一感測放大器與第二感測放大器的比較結果輸出刷新致能信號,刷新致能信號致能控制電路刷新目標感測記憶胞。In an embodiment of the invention, the control circuit includes a plurality of sensing circuits, and each of the sensing circuits includes a first sensing amplifier, a second sensing amplifier, and a refresh enabling circuit. The positive and negative inputs of the first sense amplifier respectively receive the sensing voltage corresponding to the stored data of the target sensing memory cell and the first reference voltage. The positive and negative inputs of the second sense amplifier respectively receive the corresponding sense voltage and the second reference voltage. The refresh enable circuit is coupled to the first sense amplifier and the second sense amplifier, and outputs a refresh enable signal according to a comparison result between the first sense amplifier and the second sense amplifier, and the refresh enable signal enables the control circuit to refresh the target sense Measure memory cells.
在本發明的一實施例中,上述的控制電路更包括旗標信號產生電路,其依據感測電路輸出的刷新致能信號產生旗標信號,控制電路依據旗標信號判斷感測電路對應的記憶胞中是否有記憶胞需進行刷新。In an embodiment of the invention, the control circuit further includes a flag signal generating circuit, which generates a flag signal according to the refresh enable signal outputted by the sensing circuit, and the control circuit determines the memory corresponding to the sensing circuit according to the flag signal. Whether there are memory cells in the cell needs to be refreshed.
在本發明的一實施例中,上述的旗標信號產生電路包括反及閘電路、反相閘以及鎖存電路。反及閘電路的輸入端接收感測電路輸出的刷新致能信號。反相閘的輸入端耦接反及閘電路的輸出端。鎖存電路耦接反相閘的輸出端,鎖存反相閘的輸出信號而產生旗標信號。In an embodiment of the invention, the flag signal generating circuit includes a reverse gate circuit, an inverse gate, and a latch circuit. The input end of the anti-gate circuit receives the refresh enable signal output by the sensing circuit. The input end of the inverting gate is coupled to the output end of the anti-gate circuit. The latch circuit is coupled to the output end of the inverting gate, and latches the output signal of the inverting gate to generate a flag signal.
本發明的非揮發性記憶體裝置的刷新方法,適於在進行抹除操作時對非選擇區塊進行刷新,非選擇區塊包括多個記憶體區段,各記憶體區段包括多個記憶胞。非揮發性記憶體裝置的刷新方法包括,判斷記憶體區段的記憶胞的臨界電壓是否大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓,若記憶胞的臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓,判斷記憶胞需進行刷新。The method for refreshing a non-volatile memory device of the present invention is adapted to refresh a non-selected block when performing an erase operation, the non-selected block includes a plurality of memory segments, and each memory segment includes a plurality of memories Cell. The refresh method of the non-volatile memory device includes: determining whether a threshold voltage of the memory cell of the memory segment is greater than a refresh read reference voltage and less than a refresh write verify reference voltage, if the threshold voltage of the memory cell is greater than a refresh read reference voltage And less than the refresh write verification reference voltage, it is determined that the memory cell needs to be refreshed.
在本發明的一實施例中,上述非揮發性記憶體裝置的刷新方法包括,判斷目前位址對應的第一個記憶體區段是否包括臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞,若目前位址對應的第一個記憶體區段未包括臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞,跳過非選擇區塊中剩餘的記憶體區段的刷新操作,而完成非選擇區塊的刷新操作。In an embodiment of the present invention, the method for refreshing the non-volatile memory device includes: determining whether the first memory segment corresponding to the current address includes a threshold voltage greater than a refresh read reference voltage and less than a refresh write verification. The memory cell of the reference voltage, if the first memory segment corresponding to the current address does not include the memory cell whose threshold voltage is greater than the refresh read reference voltage and less than the refresh write verify reference voltage, skip the remaining in the non-selected block The refresh operation of the memory segment completes the refresh operation of the non-selected block.
在本發明的一實施例中,其中若目前位址對應的第一個記憶體區段包括臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞,對目前位址對應的記憶體區段以及剩餘的區段中需進行刷新的記憶胞進行刷新。In an embodiment of the present invention, if the first memory segment corresponding to the current address includes a memory cell having a threshold voltage greater than a refresh read reference voltage and less than a refresh write verify reference voltage, corresponding to the current address The memory segment and the remaining cells in the remaining segments are refreshed.
在本發明的一實施例中,上述非揮發性記憶體裝置的刷新方法包括,以批次的方式判斷記憶胞是否需進行刷新。In an embodiment of the invention, the method for refreshing the non-volatile memory device includes determining whether the memory cell needs to be refreshed in a batch manner.
基於上述,本發明的實施例判斷記憶體區段中的記憶胞的臨界電壓是否大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓,其中臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞被判斷為需進行刷新,如此可進一步避免對不需進行刷新的記憶胞進行刷新,而可有效提高非揮發性記憶體裝置的刷新效率,並進一步確保刷新後的儲存資料正確。Based on the above, the embodiment of the present invention determines whether the threshold voltage of the memory cell in the memory segment is greater than a refresh read reference voltage and less than a refresh write verify reference voltage, wherein the threshold voltage is greater than the refresh read reference voltage and less than the refresh write The memory cell that verifies the reference voltage is judged to need to be refreshed, so that the refreshing of the memory cells that do not need to be refreshed can be further avoided, and the refreshing efficiency of the non-volatile memory device can be effectively improved, and the stored data after the refreshing can be further ensured. correct.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
圖1是依照本發明一實施例的一種非揮發性記憶體裝置的示意圖,請參照圖1。非揮發性記憶體裝置100包括非揮發性記憶體102以及控制電路104,非揮發性記憶體102包括多個記憶胞,非揮發性記憶體102可例如為快閃記憶體(如NOR快閃記憶體,然不以此為限)。控制電路104耦接非揮發性記憶體102,對非揮發性記憶體102進行記憶體操作,例如寫入操作、抹除操作、部分抹除操作、讀取操作…等等。其中當控制電路104進行部分抹除操作時,會依序執行預先寫入、部份抹除、後續寫入以及刷新等步驟,詳細來說,預先寫入的步驟將所有選擇區塊先寫入資料「0」。然後,部份抹除的步驟可將選擇區塊的記憶胞,即將預先寫入資料「0」之記憶體胞抹除至資料「1」之狀態。由於在抹除的過程中,部分記憶體胞可能會有過度抹除(over-erased)之現象而造成漏電,因此需由後續寫入步驟來將過度抹除的記憶體單元回復至儲存「1」之正常狀態。然而,由於進行部分抹除的動作時,會對共用井區的非選擇區塊的記憶胞造成抹除干擾,因此需藉由刷新步驟將非選擇區塊的記憶胞所儲存之資料讀取出來並再次寫入。1 is a schematic diagram of a non-volatile memory device according to an embodiment of the invention, please refer to FIG. The non-volatile memory device 100 includes a non-volatile memory 102 and a control circuit 104. The non-volatile memory 102 includes a plurality of memory cells, and the non-volatile memory 102 can be, for example, a flash memory (such as a NOR flash memory). Body, but not limited to this). The control circuit 104 is coupled to the non-volatile memory 102 and performs memory operations on the non-volatile memory 102, such as a write operation, an erase operation, a partial erase operation, a read operation, and the like. When the control circuit 104 performs a partial erase operation, the steps of pre-writing, partial erasing, subsequent writing, and refreshing are sequentially performed. In detail, the pre-writing step writes all the selected blocks first. The data is "0". Then, the partial erasing step can erase the memory cells of the selected block, that is, the memory cells of the data "0" pre-written to the state of the data "1". Since some memory cells may be over-erased during the erasing process and cause leakage, it is necessary to restore the over-erased memory cells to the memory by a subsequent writing step. The normal state. However, since the partial erase operation causes erasure interference to the memory cells of the non-selected block in the shared well region, the data stored in the memory cells of the non-selected block needs to be read out by the refresh step. And write again.
其中,非選擇區塊可包括多個記憶體區段,各記憶體區段可包括多個記憶胞,在本實施例中,控制電路104在對非選擇區塊進行刷新時,可判斷記憶體區段中的記憶胞的臨界電壓是否大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓,若記憶胞的臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓,便可判斷記憶胞需進行刷新。相反地,若記憶胞的臨界電壓未大於刷新讀取參考電壓且未小於刷新寫入驗證參考電壓(亦即記憶胞的臨界電壓未落於刷新讀取參考電壓與刷新寫入驗證參考電壓之間),控制電路104可判斷此記憶胞不需進行刷新。The non-selected block may include a plurality of memory segments, and each of the memory segments may include a plurality of memory cells. In this embodiment, the control circuit 104 may determine the memory when refreshing the non-selected blocks. Whether the threshold voltage of the memory cell in the segment is greater than the refresh read reference voltage and less than the refresh write verify reference voltage, and if the threshold voltage of the memory cell is greater than the refresh read reference voltage and less than the refresh write verify reference voltage, the memory can be judged The cell needs to be refreshed. Conversely, if the threshold voltage of the memory cell is not greater than the refresh read reference voltage and is not less than the refresh write verify reference voltage (ie, the threshold voltage of the memory cell does not fall between the refresh read reference voltage and the refresh write verify reference voltage) The control circuit 104 can determine that the memory cell does not need to be refreshed.
舉例來說,圖2是依照本發明一實施例的非選擇區塊的記憶胞的臨界電壓分佈示意圖,請參照圖2。在圖2中,假設處於抹除狀態的記憶胞的臨界電壓分布為臨界電壓分布DA,而處於寫入狀態的記憶胞的臨界電壓分布為臨界電壓分布DB,刷新讀取參考電壓VRD被設計位於臨界電壓分布DA與臨界電壓分布DB之間,而刷新寫入驗證參考電壓VPV則被設計高於刷新讀取參考電壓VRD,例如位於略高於臨界電壓分布DB的邊界的位置。值得注意的是,刷新讀取參考電壓VRD與刷新寫入驗證參考電壓VPV之值並不以本實施例為限,可依設計者的需求進行調整。For example, FIG. 2 is a schematic diagram of a threshold voltage distribution of a memory cell of a non-selected block according to an embodiment of the invention, please refer to FIG. 2. In FIG. 2, it is assumed that the threshold voltage distribution of the memory cell in the erased state is the threshold voltage distribution DA, and the threshold voltage distribution of the memory cell in the write state is the threshold voltage distribution DB, and the refresh read reference voltage VRD is designed to be located. The threshold voltage distribution DA is between the threshold voltage distribution DB and the refresh write verify reference voltage VPV is designed to be higher than the refresh read reference voltage VRD, for example, at a position slightly above the boundary of the threshold voltage distribution DB. It should be noted that the values of the refresh read reference voltage VRD and the refresh write verify reference voltage VPV are not limited to the embodiment, and may be adjusted according to the needs of the designer.
控制電路104可判斷記憶體區段中的記憶胞的臨界電壓是否大於刷新讀取參考電壓VRD且小於刷新寫入驗證參考電壓VPV,若記憶胞的臨界電壓大於刷新讀取參考電壓VRD且小於刷新寫入驗證參考電壓VPV,則判斷記憶胞需進行刷新,而若記憶胞的臨界電壓未落在刷新讀取參考電壓VRD與刷新寫入驗證參考電壓VPV之間,則判斷記憶胞不需進行刷新。由於刷新具有較低臨界電壓、較高臨界電壓或低轉導值的記憶胞,可能會造成位元線驅動電壓不足、資料保存特性變差以及刷新資料錯誤等問題,透過僅對臨界電壓落在刷新讀取參考電壓VRD與刷新寫入驗證參考電壓VPV之間的記憶胞進行刷新可有效地避免刷新後的記憶胞除存錯誤的資料。此外,對臨界電壓落在刷新讀取參考電壓VRD與刷新寫入驗證參考電壓VPV之間的電壓範圍外的記憶胞不進行刷新動作,還可縮短刷新操作所需的時間,而提升非揮發性記憶體裝置的刷新效率。The control circuit 104 can determine whether the threshold voltage of the memory cell in the memory segment is greater than the refresh read reference voltage VRD and less than the refresh write verify reference voltage VPV, if the threshold voltage of the memory cell is greater than the refresh read reference voltage VRD and less than the refresh Writing the verification reference voltage VPV determines that the memory cell needs to be refreshed, and if the threshold voltage of the memory cell does not fall between the refresh read reference voltage VRD and the refresh write verify reference voltage VPV, it is determined that the memory cell does not need to be refreshed. . Since refreshing a memory cell with a lower threshold voltage, a higher threshold voltage, or a low transconductance value may cause problems such as insufficient bit line driving voltage, deterioration of data storage characteristics, and refreshing of data errors, only by falling on the threshold voltage Refreshing the memory cell between the read reference voltage VRD and the refresh write verify reference voltage VPV can effectively avoid the data of the memory cell after the refresh. In addition, the memory cell outside the voltage range between the refresh read reference voltage VRD and the refresh write verify reference voltage VPV is not refreshed, and the time required for the refresh operation can be shortened, and the non-volatile is improved. The refresh rate of the memory device.
值得注意的是,在部分實施例中,控制電路104還可判斷目前位址對應的第一個記憶體區段是否包括臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞。當目前位址對應的第一個記憶體區段未包括臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞時,亦即目前位址對應的第一個記憶體區段中所有的記憶胞的臨界電壓皆未落於刷新讀取參考電壓與刷新寫入驗證參考電壓之間時,控制電路104亦可直接跳過非選擇區塊中剩餘的記憶體區段的刷新操作,而完成非選擇區塊的刷新操作,如此可進一步地縮短刷新操作所需的時間,提升非揮發性記憶體裝置的刷新效率。而若目前位址對應的第一個記憶體區段包括臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞,則需對目前位址對應的記憶體區段以及剩餘的區段進行刷新操作,例如對記憶體區段中需進行刷新的記憶胞進行刷新。並在完成目前位址對應的記憶體區段的刷新操作後,接著對下一位址的記憶體區段的記憶胞進行是否需進行刷新的判斷與刷新操作,直到完成非選擇區塊的刷新操作。It should be noted that, in some embodiments, the control circuit 104 may further determine whether the first memory segment corresponding to the current address includes a memory cell whose threshold voltage is greater than a refresh read reference voltage and less than a refresh write verify reference voltage. . When the first memory segment corresponding to the current address does not include a memory cell whose threshold voltage is greater than the refresh read reference voltage and less than the refresh write verify reference voltage, that is, the first memory segment corresponding to the current address When the threshold voltage of all the memory cells does not fall between the refresh read reference voltage and the refresh write verify reference voltage, the control circuit 104 can directly skip the refresh operation of the remaining memory segments in the non-selected block. The refresh operation of the non-selected block is completed, so that the time required for the refresh operation can be further shortened, and the refresh efficiency of the non-volatile memory device is improved. If the first memory segment corresponding to the current address includes a memory cell whose threshold voltage is greater than the refresh read reference voltage and less than the refresh write verify reference voltage, the memory segment corresponding to the current address and the remaining The segment performs a refresh operation, such as refreshing a memory cell in the memory segment that needs to be refreshed. After the refresh operation of the memory segment corresponding to the current address is completed, the memory cell of the memory segment of the next address is subsequently subjected to a judgment and refresh operation of the refresh, until the refresh of the non-selected block is completed. operating.
進一步來說,控制電路104可例如包括感測電路,感測電路可依據對應的目標記憶胞的儲存資料的感測電壓是否落於第一參考電壓與第二參考電壓之間來判斷記憶胞是否需進行刷新。圖3是依照本發明一實施例的感測電路的示意圖。如圖3所示,感測電路300可包括感測放大器302、304以及刷新致能電路306。感測放大器302的正、負輸入端分別接收目標感測記憶胞的感測電壓VS以及第一參考電壓VR1,感測放大器304的正、負輸入端分別接收目標感測記憶胞的感測電壓VS以及第二參考電壓VR2,其中第一參考電壓VR1與第二參考電壓VR2的電壓值可例如分別參考刷新讀取參考電壓VRD與刷新寫入驗證參考電壓VPV的電壓值來設定,然不以此為限,設計者亦可依據實際需求設定第一參考電壓VR1與第二參考電壓VR2的電壓值。Further, the control circuit 104 can include, for example, a sensing circuit, and the sensing circuit can determine whether the memory cell is determined according to whether the sensing voltage of the stored data of the corresponding target memory cell falls between the first reference voltage and the second reference voltage. Need to refresh. 3 is a schematic diagram of a sensing circuit in accordance with an embodiment of the present invention. As shown in FIG. 3, the sensing circuit 300 can include sense amplifiers 302, 304 and a refresh enable circuit 306. The positive and negative inputs of the sense amplifier 302 respectively receive the sensing voltage VS of the target sensing memory cell and the first reference voltage VR1, and the positive and negative inputs of the sensing amplifier 304 respectively receive the sensing voltage of the target sensing memory cell. VS and the second reference voltage VR2, wherein the voltage values of the first reference voltage VR1 and the second reference voltage VR2 can be set, for example, with reference to the voltage values of the refresh read reference voltage VRD and the refresh write verify reference voltage VPV, respectively, For this reason, the designer can also set the voltage values of the first reference voltage VR1 and the second reference voltage VR2 according to actual needs.
另外,刷新致能電路306耦接感測放大器302與感測放大器304的輸出端,依據感測放大器302與感測放大器304的比較結果輸出刷新致能信號REN,刷新致能信號REN用以致能控制電路104刷新目標感測記憶胞。刷新致能電路306可例如以邏輯電路來實施,舉例來說,本實施例的刷新致能電路306可包括反相閘INV1以及反及閘NAND1,其中反相閘INV1的輸入端與輸出端分別耦接感測放大器302的輸出端與反及閘NAND1的一輸入端,反及閘NAND1的另一輸入端則耦接感測放大器304的輸出端,反及閘NAND1的輸出端用以輸出刷新致能信號REN。假設在本實施例中第一參考電壓VR1與第二參考電壓VR2可分別設定為5伏特(V)與7伏特,當感測電壓VS小於5V時,感測放大器302、304的輸出皆為低電壓準位(邏輯“1”),如此刷新致能電路306將輸出邏輯“1”的刷新致能信號REN,而使得控制電路104不刷新對應的目標感測記憶胞。當感測電壓VS大於7V時,感測放大器302、304的輸出皆為高電壓準位(邏輯“0”),如此刷新致能電路306將輸出邏輯“1”的刷新致能信號REN,同樣將使得控制電路104不刷新對應的目標感測記憶胞。而當感測電壓VS的電壓值落於5V~7V之間時,感測放大器302、304的輸出分別為高電壓準位(邏輯“0”)與低電壓準位(邏輯“1”),如此刷新致能電路306將輸出邏輯“0”的刷新致能信號REN,而使得控制電路104刷新對應的目標感測記憶胞。值得注意的是,本實施例的刷新致能電路306僅為一示範性的實施例,刷新致能電路306亦可例如以不同的邏輯閘組合來實施,而並不以本實施例為限。In addition, the refresh enable circuit 306 is coupled to the output of the sense amplifier 302 and the sense amplifier 304, and outputs a refresh enable signal REN according to the comparison result of the sense amplifier 302 and the sense amplifier 304. The refresh enable signal REN is used to enable Control circuit 104 refreshes the target sensing memory cell. The refresh enable circuit 306 can be implemented, for example, by a logic circuit. For example, the refresh enable circuit 306 of the present embodiment can include an inverting gate INV1 and an inverse gate NAND1, wherein the input terminal and the output terminal of the inverting gate INV1 are respectively The output of the sense amplifier 302 is coupled to an input of the NAND gate NAND1, and the other input of the gate NAND1 is coupled to the output of the sense amplifier 304, and the output of the gate NAND1 is used for output refresh. Enable signal REN. It is assumed that the first reference voltage VR1 and the second reference voltage VR2 can be set to 5 volts (V) and 7 volts respectively in this embodiment, and the outputs of the sense amplifiers 302, 304 are low when the sensing voltage VS is less than 5V. The voltage level (logic "1"), such refresh enable circuit 306 will output a refresh enable signal REN of logic "1", such that control circuit 104 does not refresh the corresponding target sense memory cell. When the sense voltage VS is greater than 7V, the outputs of the sense amplifiers 302, 304 are all at a high voltage level (logic "0"), such that the refresh enable circuit 306 will output a refresh enable signal REN of logic "1", again The control circuit 104 will be caused not to refresh the corresponding target sensing memory cell. When the voltage value of the sensing voltage VS falls between 5V and 7V, the outputs of the sense amplifiers 302 and 304 are respectively a high voltage level (logic "0") and a low voltage level (logic "1"). Such refresh enable circuit 306 will output a refresh enable signal REN of logic "0", causing control circuit 104 to refresh the corresponding target sense memory cell. It should be noted that the refresh enable circuit 306 of the present embodiment is only an exemplary embodiment, and the refresh enable circuit 306 can also be implemented by using different logic gate combinations, for example, and is not limited to the embodiment.
在部分實施例中,控制電路104可以批次的方式判斷記憶體區段的記憶胞是否需進行刷新(例如一次判斷32個記憶胞是否需進行刷新,然不以此為限),以提高非揮發性記憶體裝置100的刷新效率。舉例來說,控制電路104可包括多個感測電路(例如32個感測電路,然不以此為限)以及圖4所示的旗標信號產生電路400,旗標信號產生電路400可接收多個感測電路所分別輸出的刷新致能信號REN,並據以輸出旗標信號SF1,控制電路104可依據控制電路104判斷此些刷新致能信號REN所對應的記憶胞中是否有需進行刷新的記憶胞。詳細來說,旗標信號產生電路400可例如包括反及閘電路402、反相閘INV2以及鎖存電路404,其中反及閘電路402的輸入端接收多個感測電路輸出的刷新致能信號REN,反相閘INV2的輸入端耦接反及閘電路402的輸出端,鎖存電路404則耦接反相閘INV的輸出端,以鎖存反相閘INV2的輸出信號而產生旗標信號SF1。其中當所有的刷新致能信號REN皆為邏輯 “1”時,旗標信號SF1為邏輯 “1”,代表所有感測電路對應的記憶胞皆不需進行刷新,控制電路104可控制此些感測電路依據下一批次的記憶胞產生刷新致能信號REN,以接著判斷下一批次的記憶胞是否需進行刷新,進而縮短刷新操作所需的時間。而當任一個刷新致能信號REN邏輯為“0“時,旗標信號SF1為邏輯 “0”,代表感測電路對應的記憶胞中有需進行刷新的記憶胞,控制電路104在對需進行刷新的記憶胞進行刷新後,才控制此些感測電路依據下一批次的記憶胞產生刷新致能信號REN,而接著判斷下一批次的記憶胞是否需進行刷新。In some embodiments, the control circuit 104 can determine whether the memory cell of the memory segment needs to be refreshed in a batch manner (for example, determining whether 32 memory cells need to be refreshed at a time, but not limited thereto) to improve non- The refresh efficiency of the volatile memory device 100. For example, the control circuit 104 can include a plurality of sensing circuits (eg, 32 sensing circuits, but not limited thereto) and the flag signal generating circuit 400 shown in FIG. 4, and the flag signal generating circuit 400 can receive The refresh enable signal REN outputted by the plurality of sensing circuits respectively outputs the flag signal SF1, and the control circuit 104 can determine, according to the control circuit 104, whether the memory cells corresponding to the refresh enable signals REN need to be performed. Refreshed memory cells. In detail, the flag signal generating circuit 400 may include, for example, a reverse gate circuit 402, an inverting gate INV2, and a latch circuit 404, wherein the input terminal of the inverse gate circuit 402 receives the refresh enable signal outputted by the plurality of sensing circuits. REN, the input end of the inverting gate INV2 is coupled to the output end of the anti-gate circuit 402, and the latch circuit 404 is coupled to the output end of the inverting gate INV to latch the output signal of the inverting gate INV2 to generate a flag signal. SF1. When all the refresh enable signals REN are logic "1", the flag signal SF1 is logic "1", indicating that the memory cells corresponding to all the sensing circuits do not need to be refreshed, and the control circuit 104 can control the senses. The measuring circuit generates a refresh enable signal REN according to the next batch of memory cells to determine whether the next batch of memory cells needs to be refreshed, thereby shortening the time required for the refresh operation. When any of the refresh enable signals REN logic is “0”, the flag signal SF1 is logic “0”, which represents a memory cell in the memory cell corresponding to the sensing circuit that needs to be refreshed, and the control circuit 104 performs the pairing. After the refreshed memory cells are refreshed, the sensing circuits are controlled to generate a refresh enable signal REN according to the next batch of memory cells, and then it is determined whether the next batch of memory cells needs to be refreshed.
圖5是依照本發明一實施例的非揮發性記憶體裝置的刷新方法的步驟流程圖,請參照圖5。由上述實施例可知,非揮發性記憶體裝置的刷新方法可包括下列步驟。首先,依據記憶體區段的記憶胞的臨界電壓是否落於特定電壓範圍內來分別判斷記憶體區段的記憶胞是否需進行刷新(步驟S502)。例如可判斷記憶體區段的各個記憶胞的臨界電壓是否大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓(步驟S504),若記憶胞的臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓,判斷此記憶胞需進行刷新(步驟S506),而若記憶胞的臨界電壓未大於刷新讀取參考電壓或未小於刷新寫入驗證參考電壓,則判斷此記憶胞不需進行刷新(步驟S508)。其實施方式可例如為判斷對記憶胞執行刷新讀取所獲得的感測電壓是否介於第一參考電壓與第二參考電壓之間,若感測電壓介於第一參考電壓與第二參考電壓之間,代表此記憶胞需進行刷新,其中第一參考電壓與第二參考電壓的電壓值可例如分別參考刷新讀取參考電壓與刷新寫入驗證參考電壓的電壓值來設定,然不以此為限。其中,在部分實施例中可以批次的方式同時判斷多個記憶胞是否需進行刷新。FIG. 5 is a flow chart showing the steps of a method for refreshing a non-volatile memory device according to an embodiment of the invention. Please refer to FIG. 5. It can be seen from the above embodiments that the refresh method of the non-volatile memory device can include the following steps. First, whether the memory cell of the memory segment needs to be refreshed depends on whether the threshold voltage of the memory cell of the memory segment falls within a specific voltage range (step S502). For example, it can be determined whether the threshold voltage of each memory cell of the memory segment is greater than the refresh read reference voltage and less than the refresh write verify reference voltage (step S504), if the threshold voltage of the memory cell is greater than the refresh read reference voltage and less than the refresh write Entering the verification reference voltage, determining that the memory cell needs to be refreshed (step S506), and if the threshold voltage of the memory cell is not greater than the refresh read reference voltage or not less than the refresh write verification reference voltage, determining that the memory cell does not need to be refreshed (Step S508). The implementation may be, for example, determining whether the sensing voltage obtained by performing refresh reading on the memory cell is between the first reference voltage and the second reference voltage, if the sensing voltage is between the first reference voltage and the second reference voltage. Between the two, the voltage value of the first reference voltage and the second reference voltage may be set, for example, by referring to the voltage values of the refresh read reference voltage and the refresh write verify reference voltage, respectively. Limited. In some embodiments, it is possible to simultaneously determine whether a plurality of memory cells need to be refreshed in a batch manner.
接著,可判斷目前位址對應的第一個記憶體區段是否包括臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞(步驟S510),若目前位址對應的第一個記憶體區段未包括臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞,可跳過非選擇區塊中剩餘的記憶體區段的刷新操作(步驟S512),而完成非選擇區塊的刷新操作(步驟S514)。而若目前位址對應的第一個記憶體區段包括臨界電壓大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓的記憶胞,則對目前位址對應的記憶體區段以及剩餘的區段中需進行刷新的記憶胞進行刷新(步驟S516)。在完成目前位址對應的記憶體區段的刷新操作後,接著判斷目前位址對應的記憶體區段是否為非選擇區塊的最後一個記憶體區段(步驟S518),若是,則進入步驟S514,完成非選擇區塊的刷新操作,若否,則移往下一個位址(步驟S520),並回到步驟S502,繼續判斷下一個位址所對應的記憶體區段的記憶胞是否需進行刷新。Then, it can be determined whether the first memory segment corresponding to the current address includes a memory cell whose threshold voltage is greater than the refresh read reference voltage and less than the refresh write verification reference voltage (step S510), if the current address corresponds to the first The memory segment does not include a memory cell whose threshold voltage is greater than the refresh read reference voltage and less than the refresh write verify reference voltage, and the refresh operation of the remaining memory segments in the non-selected block may be skipped (step S512), and The refresh operation of the non-selected block is completed (step S514). If the first memory segment corresponding to the current address includes a memory cell whose threshold voltage is greater than the refresh read reference voltage and less than the refresh write verify reference voltage, the memory segment corresponding to the current address and the remaining region The memory cells to be refreshed in the segment are refreshed (step S516). After the refresh operation of the memory segment corresponding to the current address is completed, it is determined whether the memory segment corresponding to the current address is the last memory segment of the non-selected block (step S518), and if yes, the step is entered. S514, completing the refresh operation of the non-selected block, if not, moving to the next address (step S520), and returning to step S502, continuing to determine whether the memory cell of the memory segment corresponding to the next address needs to be Refresh.
綜上所述,本發明的實施例依據記憶體區段中的記憶胞的臨界電壓是否大於刷新讀取參考電壓且小於刷新寫入驗證參考電壓,來判斷記憶胞是否需進行刷新,如此可進一步避免對不需進行刷新的記憶胞進行刷新,以提高非揮發性記憶體裝置的刷新效率,並避免刷新具有較低臨界電壓、較高臨界電壓或低轉導值的記憶胞所造成位元線驅動電壓不足、資料保存特性變差以及刷新資料錯誤等問題,而可進一步確保刷新後的儲存資料正確。此外,在部分實施例中,還可在目前位址對應的第一個記憶體區段中所有的記憶胞的臨界電壓皆未落於刷新讀取參考電壓與刷新寫入驗證參考電壓之間時,直接跳過非選擇區塊中剩餘的記憶體區段的刷新操作,而完成非選擇區塊的刷新操作,以進一步地縮短刷新操作所需的時間,提升非揮發性記憶體裝置的刷新效率。In summary, the embodiment of the present invention determines whether the memory cell needs to be refreshed according to whether the threshold voltage of the memory cell in the memory segment is greater than the refresh read reference voltage and less than the refresh write verification reference voltage, so that the memory cell can be further refreshed. Avoid refreshing the memory cells that do not need to be refreshed to improve the refresh efficiency of the non-volatile memory device and avoid refreshing the bit lines caused by memory cells with lower threshold voltage, higher threshold voltage or low transduction value. Problems such as insufficient driving voltage, poor data storage characteristics, and incorrect data refreshing can further ensure that the stored data after refreshing is correct. In addition, in some embodiments, when the threshold voltage of all the memory cells in the first memory segment corresponding to the current address does not fall between the refresh read reference voltage and the refresh write verify reference voltage, Directly skipping the refresh operation of the remaining memory segments in the non-selected block, and completing the refresh operation of the non-selected block to further shorten the time required for the refresh operation and improve the refresh efficiency of the non-volatile memory device .
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
100‧‧‧非揮發性記憶體裝置100‧‧‧Non-volatile memory device
102‧‧‧非揮發性記憶體102‧‧‧ Non-volatile memory
104‧‧‧控制電路104‧‧‧Control circuit
300‧‧‧感測電路300‧‧‧Sensor circuit
302、304‧‧‧感測放大器302, 304‧‧‧Sense Amplifier
306‧‧‧刷新致能電路306‧‧‧Reflecting enable circuit
400‧‧‧旗標信號產生電路400‧‧‧flag signal generation circuit
402‧‧‧反及閘電路402‧‧‧Reverse gate circuit
404‧‧‧鎖存電路404‧‧‧Latch circuit
DA、DB‧‧‧臨界電壓分布DA, DB‧‧‧critical voltage distribution
VRD‧‧‧刷新讀取參考電壓VRD‧‧‧ refresh read reference voltage
VPV‧‧‧刷新寫入驗證參考電壓VPV‧‧‧ refresh write verification reference voltage
VS‧‧‧感測電壓VS‧‧‧Sensor voltage
VR1‧‧‧第一參考電壓VR1‧‧‧ first reference voltage
VR2‧‧‧第二參考電壓VR2‧‧‧second reference voltage
REN‧‧‧刷新致能信號REN‧‧‧ refresh enable signal
INV1、INV2‧‧‧反相閘INV1, INV2‧‧‧ reverse brake
NAND1‧‧‧反及閘NAND1‧‧‧Anti-gate
SF1‧‧‧輸出旗標信號SF1‧‧‧ output flag signal
S502~S520‧‧‧刷新方法的步驟S502~S520‧‧‧Steps for refreshing method
圖1是依照本發明一實施例的一種非揮發性記憶體裝置的示意圖。 圖2是依照本發明一實施例的非選擇區塊的記憶胞的臨界電壓分佈示意圖。 圖3是依照本發明一實施例的感測電路的示意圖。 圖4是依照本發明一實施例的旗標信號產生電路的示意圖。 圖5是依照本發明一實施例的非揮發性記憶體裝置的刷新方法的步驟流程圖。1 is a schematic diagram of a non-volatile memory device in accordance with an embodiment of the present invention. 2 is a schematic diagram showing a threshold voltage distribution of a memory cell of a non-selected block according to an embodiment of the invention. 3 is a schematic diagram of a sensing circuit in accordance with an embodiment of the present invention. 4 is a schematic diagram of a flag signal generating circuit in accordance with an embodiment of the present invention. 5 is a flow chart showing the steps of a method of refreshing a non-volatile memory device in accordance with an embodiment of the present invention.
Claims (11)
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