TW201842124A - Adhesive composition, supporting body having adhesive, adhering film, laminate, method for manufacturing the same and method for manufacturing electronic components capable of preventing position shifting of the substrate while being laminated to a supporting body - Google Patents

Abstract

An object of the present invention is to provide an adhesive composition, a supporting body having an adhering layer using the same, an adhering film, a laminate, a method for manufacturing the same, and a method for manufacturing electronic components, wherein the adhesive composition is an adhesive composition used for laminating a supporting body and a substrate, and capable of forming an adhesion layer having a higher heat resistance. The solution of the present invention is to use an adhesive composition which is an adhesive composition for laminating a supporting body (12) and the substrate (4), and contains a hydrocarbon resin (P1) and a resin (P2) having a glass transition temperature of 180 DEG C or higher. (however, the aforementioned hydrocarbon resin (P1) is not included) as the resin component (P).

Description

Substrate composition, support with adhesive, adhesive film, laminate, method for producing the same, and method for producing electronic component

The present invention relates to an adhesive composition, a support having an adhesive layer, a film, a laminate, a method for producing the same, and a method for producing an electronic component.

In a semiconductor package (electronic component) including a semiconductor element, various forms exist depending on the corresponding size, such as WLP (Wafer Level Package) and PLP (Panel Level Package). Wait. As a technology of a semiconductor package, a fan-in type technique and a fan-out type technique are mentioned. A fan-in type WLP (Fan-in Wafer Level Package) in which a terminal at a bare chip end portion is further disposed in a wafer region is known as a semiconductor package formed by a fan-in type technology. As a semiconductor package formed by the fan-out type technology, a fan-out type WLP (Fan-out Wafer Level Package) or the like in which the terminal is disposed outside the wafer region is known.

In recent years, in particular, the fan-out type technology is used as a fan-out panel level package (Fan-out Panel Level Package) in which a semiconductor element is placed on a panel and packaged, and the semiconductor package can be realized. Further, methods such as high integration, thinning, and miniaturization have attracted attention.

In order to achieve miniaturization of the semiconductor package, it is important to reduce the thickness of the substrate among the incorporated components. However, if the thickness of the substrate is reduced, the strength thereof is lowered, and the substrate is likely to be damaged during the manufacture of the semiconductor package. On the other hand, a laminate in which a support is bonded to a substrate is used.

Here, when the substrate and the support are bonded together, conventionally, an adhesive having a structure having a cycloolefin structure is widely used from the viewpoint of excellent light transmittance. Patent Document 1 discloses an adhesive composition containing a polymer having a cyclic olefin structure and a (meth) acrylate monomer having a phase dissolved in the polymer. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2014-105316

[Problems to be solved by the invention]

Further, at the time of manufacturing a semiconductor package, after bonding the substrate and the support by an adhesive, high-temperature treatment such as sealing, film formation, and baking is performed. In addition, when the substrate and the support are bonded together by the adhesive described in Patent Document 1, there is a problem that the positional displacement of the substrate occurs, for example, after the sealing operation due to the influence of the high temperature treatment described above. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an adhesive composition, a support having the adhesive layer, a film, a laminate, a method for producing the same, and a method for producing an electronic component using the adhesive composition. The adhesive composition for the support and the substrate is bonded to form an adhesive layer having higher heat resistance. [Means for solving the problem]

In order to solve the above problems, the present invention adopts the following constitution. That is, the first aspect of the present invention is an adhesive composition which is a binder composition for bonding a support and a substrate, and is characterized in that it contains the following as a resin component (P), a hydrocarbon resin (P1) and The resin (P2) having a glass transition temperature of 180 ° C or higher (however, the aforementioned hydrocarbon resin (P1) is not included). A second aspect of the present invention is an adhesive composition which is a binder composition for bonding a support and a substrate, wherein the adhesive composition contains at least a hydrocarbon resin (P1) as a resin component (P), from the foregoing A test piece of 20 mm ́5 mm ́ thickness of 0.5 mm was prepared from the composition of the following composition, and the test piece was delivered to the dynamics at a temperature of 5 ° C/min under the tensile condition of 1 Hz from room temperature to 215 ° C. In the determination of viscoelasticity, the following two requirements are met: The complex elastic modulus E* ₅₀ at 50 ° C is less than 1.0 ^{́10 9} Pa, and the complex elastic modulus E* ₁₅₀ at 150 ° C exceeds 3.0 ^{́10 6} Pa.

A third aspect of the present invention provides a support having an adhesive layer, comprising: a support to which a substrate is bonded, and an adhesive as described above in the first or second aspect; An adhesive layer formed by the composition.

According to a fourth aspect of the invention, there is provided a film comprising: a film, and an adhesive layer formed on the film using the adhesive composition of the first or second aspect.

According to a fifth aspect of the present invention, there is provided a laminate comprising a laminate of a support and a substrate via an adhesive layer, wherein the adhesive layer is an adhesive of the first or second aspect. The layer formed by the composition.

According to a sixth aspect of the present invention, in a method of producing a laminate, a method of laminating a laminate of a support and a substrate via an adhesive layer is provided on the support or on the substrate. At least one of the adhesive layer forming step of forming the adhesive layer by using the adhesive composition according to the first or second aspect, and the support layer and the aforesaid support layer formed by the adhesive layer forming step The bonding step of the substrate.

According to a seventh aspect of the present invention, in a method of producing an electronic component, after the laminate is obtained by the method for producing a laminate according to the sixth aspect, the laminate has a support matrix Light is irradiated onto the separation layer to degrade the separation layer, and the separation step of the support substrate is separated from the substrate provided in the laminate; and after the separation step, the adhesion layer attached to the substrate is subjected to Removal step of removal. [Effects of the Invention]

According to the present invention, there are provided an adhesive composition, a support having the adhesive layer, a film, a laminate, a method for producing the same, and a method for producing an electronic component, the adhesive composition being bonded to a support and a substrate The adhesive composition used can form an adhesive layer having higher heat resistance.

[Formation of the Invention]

In the scope of the present specification and the patent application of the present invention, the term "aliphatic" is a relative concept of aromatics, and is defined as a group or a compound which does not have aromaticity. The "alkyl group" is considered to include a linear, branched, and cyclic monovalent saturated hydrocarbon group unless otherwise specified. The same is true for the alkyl group in the alkoxy group. The "alkylene group" is considered to include a linear, branched, and cyclic divalent saturated hydrocarbon group unless otherwise specified. The "halogenated alkyl group" is a group in which a part or all of a hydrogen atom of an alkyl group is substituted with a halogen atom, and examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. The "fluorinated alkyl group" or "fluorinated alkyl group" means a group in which a part or all of a hydrogen atom of an alkyl group or an alkyl group is substituted with a fluorine atom. The term "constituting unit" means a monomer unit constituting a polymer compound (resin, polymer, copolymer). When it is described as "may have a substituent" or "may have a substituent", the case where the hydrogen atom (-H) is substituted with a monovalent group and the methylene group (-CH ₂ -) is substituted with a divalent group By. "Exposure" is considered as the concept of the entire illumination including radiation.

The "constituting unit derived from hydroxystyrene" means a constituent unit composed of the cleavage of the ethylenic double bond of hydroxystyrene. The "constituting unit derived from a hydroxystyrene derivative" means a constituent unit composed of a cleavage of an ethylenic double bond of a hydroxystyrene derivative. The "hydroxystyrene derivative" is a concept in which a hydrogen atom at the a-position including a hydroxystyrene is substituted with another substituent such as an alkyl group or a halogenated alkyl group, and derivatives thereof. Examples of the derivatives thereof include a hydrogen atom in which a hydrogen atom of a hydroxystyrene group in which a hydrogen atom at the a position may be substituted with a substituent is substituted with an organic group; and a hydroxybenzene group in which a hydrogen atom at the a position may be substituted with a substituent. On the benzene ring of ethylene, a substituent other than a hydroxyl group is bonded. Further, the a-position (carbon atom at the a-position) means a carbon atom to which a benzene ring is bonded unless otherwise specified. The substituent which substitutes the hydrogen atom of the a position of the hydroxy styrene is the same as the substituent of the above-mentioned α-substituted acrylate.

The alkyl group as the substituent at the a-position is preferably a linear or branched alkyl group, and specific examples thereof include an alkyl group having 1 to 5 carbon atoms (methyl group, ethyl group, propyl group, Isopropyl, n-butyl, isobutyl, tert-butyl, pentyl, isopentyl, neopentyl) and the like. In addition, the halogenated alkyl group which is a substituent at the a-position is specifically a group in which a part or all of a hydrogen atom of the above-mentioned "alkyl group as a substituent at the α-position" is substituted with a halogen atom. The halogen atom may, for example, be a fluorine atom, a chlorine atom, a bromine atom or an iodine atom, and particularly preferably a fluorine atom. In addition, the hydroxyalkyl group which is a substituent at the a-position is specifically a group in which a part or all of a hydrogen atom of the above-mentioned "alkyl group as a substituent at the α-position" is substituted with a hydroxyl group. The number of hydroxyl groups in the hydroxyalkyl group is preferably from 1 to 5, most preferably 1.

(Adhesive Composition (First Aspect)) The adhesive composition of the first aspect of the present invention is used for bonding a support and a substrate. The adhesive composition of this embodiment contains a resin component (P). This resin component (P) contains at least a hydrocarbon resin (P1) and a resin (P2) having a glass transition temperature of 180 ° C or higher (however, the aforementioned hydrocarbon resin (P1) is not included).

Fig. 1 is a view showing an embodiment of a laminate to which the present invention is applied. The laminate 10 shown in FIG. 1 is provided between the support substrate 1 and the substrate 4, and includes the separation layer 2 and the subsequent layer 3. The separation layer 2, the subsequent layer 3, and the substrate 4 are laminated on the support substrate 1 in this order. The support substrate 1 is composed of a material that transmits light. In the laminate 10, the light is irradiated from the support substrate 1 side to the separation layer 2, and the separation layer 2 is degraded and decomposed. Therefore, the support substrate 1 is separated from the substrate 4. In the laminate 10, the support 12 and the substrate 4 are bonded to each other via the adhesive layer 3. This adhesive layer 3 can be formed using the adhesive composition of this embodiment.

<Resin component (P)> In the present embodiment, the resin component (P) (hereinafter also referred to as "(P) component") is a binder composition, and has a function as a component imparting adhesion, and includes at least The hydrocarbon resin (P1) and the resin (P2) having a glass transition temperature of 180 ° C or higher (however, the aforementioned hydrocarbon resin (P1) is not included). The component (P) may contain a resin other than the above-described hydrocarbon resin (P1) and resin (P2). In addition, the resin component (P) in the present embodiment contains a monomer which can serve as a matrix constituting the adhesive layer in addition to the resin, for example, a curable monomer to be described later.

<<Hydrocarbon Resin (P1)>> In the present embodiment, the hydrocarbon resin (P1) (hereinafter also referred to as "(P1) component") may be an aliphatic hydrocarbon resin or an aromatic hydrocarbon resin. The component (P1) is, for example, an elastomer or a cycloolefin polymer from the viewpoint of imparting heat resistance or flexibility.

- Elastomer The elastomer in the component (P1) is, for example, a constituent unit which is a main chain, and has a constituent unit derived from styrene or a constituent unit derived from a styrene derivative. For the "styrene unit").

The term "styrene derivative" as used herein means a concept in which a hydrogen atom at the a-position of styrene is substituted with another substituent such as an alkyl group or a halogenated alkyl group, and derivatives thereof. Examples of the derivatives thereof include a benzene ring of styrene in which a hydrogen atom at the a position may be substituted with a substituent, and a substituent bond or the like. The alkyl group as the substituent at the a-position is preferably a linear or branched alkyl group, and specific examples thereof include an alkyl group having 1 to 5 carbon atoms (methyl group, ethyl group, propyl group, Isopropyl, n-butyl, isobutyl, tert-butyl, pentyl, isopentyl, neopentyl) and the like. In addition, the halogenated alkyl group which is a substituent at the a-position is specifically a group in which one or all of hydrogen atoms of the "alkyl group as a substituent at the a-position" is substituted with a halogen atom. The halogen atom may, for example, be a fluorine atom, a chlorine atom, a bromine atom or an iodine atom, and particularly preferably a fluorine atom. Examples of the substituent of the benzene ring which may be bonded to styrene include an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxyalkyl group having 1 to 5 carbon atoms, and B. Alkoxy group, carboxyl group, and the like. Further, the a-position (carbon atom at the a-position) means a carbon atom to which a benzene ring is bonded unless otherwise specified. The "constituting unit derived from styrene" and "constituting unit derived from a styrene derivative" mean a constituent unit composed of a vinyl double bond of styrene or a styrene derivative.

Examples of the elastomer in the above (P1) component include polystyrene-poly(ethylene/propylene) block copolymer (SEP) and styrene-isoprene-styrene block copolymer (SIS). , styrene-butadiene-styrene block copolymer (SBS), styrene-butadiene-butene-styrene block copolymer (SBBS) or such hydrides; styrene-ethylene-butyl Alkene-styrene block copolymer (SEBS), styrene-ethylene-propylene-styrene block copolymer (styrene-isoprene-styrene block copolymer) (SEPS), styrene-ethylene- Ethylene-propylene-styrene block copolymer (SEEPS), styrene block is a reaction crosslinked type styrene-ethylene-ethylene-propylene-styrene block copolymer (Septon V9461 (manufactured by KURARAY Co., Ltd.), Septon V9475 (Company KURARAY Co., Ltd.), styrene block is a reaction cross-linked styrene-ethylene-butylene-styrene block copolymer (reactive polystyrene hard block, Septon V9827 (limited shares) Company KURARAY system) and so on.

In the elastomer of the component (P1), the content of the styrene unit is preferably from 10 to 70% by mass, more preferably from 20 to 60% by mass, based on the total constituent unit (100% by mass) of the constituent elastomer. It is particularly preferably 25 to 50% by mass, particularly preferably 30 to 45% by mass. When the content ratio of the styrene unit is at least the lower limit of the above-described preferred range, the adhesion between the support and the substrate and the machinability are not lowered, and the procedure such as thinning and mounting is easy. When it is at most the upper limit of the above preferred range, the chemical resistance of the adhesive layer formed by the adhesive composition can be suitably maintained.

The weight average molecular weight of the elastic system in the component (P1) is preferably in the range of 20,000 to 200,000, more preferably in the range of 50,000 to 150,000. When the weight average molecular weight of the elastomer is within the above preferred range, an adhesive composition which can form an adhesive layer which is easily dissolved and removed in a hydrocarbon solvent can be easily obtained. Further, since the weight average molecular weight of the elastomer is within the above preferred range, the chemical resistance of the adhesive layer formed by the adhesive composition is increased.

The elastic system in the component (P1) may be one type or two or more types.

The hydride in the elastomeric elastomer in the above (P1) component is more preferable. In the case of a hydride, the stability to heat is further increased, and deterioration such as decomposition or polymerization is less likely to occur. Further, it is also preferable from the viewpoints of solubility in a hydrocarbon solvent and resistance to a resist solvent. Further, among the elastomers, it is more preferred that the both ends become a terminal polymer of styrene. It is easy to obtain higher heat resistance by being blocked by styrene having high thermal stability at both ends. More specifically, the elastomer is more preferably a hydride of a block copolymer of styrene and a conjugated diene. Thereby, the stability to heat is further increased, and deterioration such as decomposition or polymerization is less likely to occur. Further, it is closed by styrene having high thermal stability at both ends, and exhibits higher heat resistance. Further, it is also preferable from the viewpoints of solubility in a hydrocarbon solvent and resistance to a resist solvent.

For example, "Septon (trade name)" manufactured by KURARAY Co., Ltd., "Hybrar (trade name)" manufactured by KURARAY Co., Ltd., and Asahi Kasei Co., Ltd., may be mentioned as a commercial product of the elastomer which can be used as the component (P1). "Tuftec (trade name)" manufactured by the company, "Dynaron (trade name)" manufactured by JSR Co., Ltd., etc.

- Cycloolefin polymer As the cycloolefin polymer, for example, a ring-opening polymer containing a monomer component of a cycloolefin monomer and an addition polymer for subjecting a monomer component containing a cycloolefin monomer to addition polymerization can be suitably used. .

Examples of the cycloolefin monomer include a bicyclic ring such as norapene and norbornadiene, a tricyclic ring such as dicyclopentadiene or hydroxydicyclopentadiene, and tetracyclododecene. a pentacyclic ring such as a tetracyclic or cyclopentadiene terpolymer, a heptacyclic ring such as tetracyclopentadiene, or an alkyl group of such a polycyclic ring (methyl, ethyl, propyl, butyl, etc.) a monomer, a substitute of an alkenyl group (vinyl group, etc.), a substituted alkylene (ethylene group) or the like, or a monomer such as an aryl group (phenyl, tolyl, naphthyl, etc.).

Among the above, a polymer having a constituent unit having a norbornene structure selected from the group consisting of norbornene, tetracyclododecene, and alkyl substituents thereof is particularly preferred. By using such a cycloolefin polymer having a decene-reducing structure, for example, an adhesive composition can be easily obtained, which has high chemical resistance to a resist solvent and can be easily dissolved and removed in a hydrocarbon solvent. The next layer.

The cycloolefin polymer may have a monomer which can be copolymerized with the aforementioned cycloolefin monomer as a monomer unit. As the monomer which can be copolymerized, for example, an olefin monomer can be suitably mentioned. The olefin mono-system may be linear or branched, and examples thereof include an olefin monomer having 2 to 10 carbon atoms, and preferably, for example, ethylene, propylene, 1-butene, isobutylene, and 1- Among the a-olefins such as hexene, among them, ethylene is more preferably used as a monomer unit.

In the cycloolefin polymer of the above (P1) component, the content ratio of the cycloolefin monomer unit is preferably from 10 to 100 mol% based on the total constituent unit (100 mol%) constituting the cycloolefin polymer. More preferably, it is 20 to 100 mol%.

The weight average molecular weight of the cycloolefin polymer in the component (P1) is preferably in the range of 10,000 to 2,000,000, more preferably in the range of 30,000 to 1,500,000. When the weight average molecular weight of the cycloolefin polymer is at least the lower limit of the above preferred range, the softening temperature of the polymer is easily controlled to a temperature suitable for bonding the support to the substrate. When it is at most the upper limit of the above preferred range, an adhesive composition can be easily obtained, which can form an adhesive layer which is easily dissolved and removed in a hydrocarbon-based solvent.

The cycloolefin polymer in the component (P1) may be one type or two or more types.

Further, the cycloolefin polymer is, for example, a resin obtained by polymerizing a monomer component composed of a cycloolefin monomer and an olefin monomer, and is a resin having no polar group, from the viewpoint of suppressing gas generation at a high temperature. It is better to look at it. The polymerization method or polymerization conditions at the time of polymerizing the monomer component are not particularly limited, and may be appropriately set according to a usual method.

For example, "TOPAS (trade name)" manufactured by POLYPLASTICS Co., Ltd., "APEL (trade name)" manufactured by Mitsui Chemicals Co., Ltd., and "APEL (trade name)" manufactured by Mitsui Chemicals Co., Ltd., may be mentioned as a commercially available product of the above-mentioned (P1) component. "ZEONOR (trade name)" manufactured by Japan ZEON Co., Ltd., "ZEONEX (trade name)" manufactured by Japan ZEON Co., Ltd., "ARTON (trade name)" manufactured by JSR Co., Ltd., etc.

In the adhesive composition of the present embodiment, the (P1) component may be used singly or in combination of two or more. The component (P1) is preferably at least one selected from the group consisting of an elastomer and a cycloolefin polymer. Among these, an elastomer is more preferable from the viewpoint of better heat resistance and die bondability.

The content ratio of the component (P1) which is contained in the component (P) is preferably more than 50% by mass, more preferably more than 50% by mass, based on the total amount (100% by mass) of the component (P). 90% by mass or less, particularly preferably 55% by mass or more and 80% by mass or less. By the above-described preferable range, the cleaning performance of the cleaning liquid in the removal step described later, in particular, the hydrocarbon-based solvent is improved.

"Resin (P2) having a glass transition temperature of 180 ° C or higher" In the present embodiment, the resin (P2) is a resin having a glass transition temperature (Tg) of 180 ° C or higher (hereinafter also referred to as "(P2) component") ( However, the aforementioned hydrocarbon resin (P1) is not included.

The glass transition temperature (Tg/°C) of the resin component can be determined by dynamic viscoelasticity measurement. For example, by using a dynamic viscoelasticity measuring apparatus Rheologel-E4000 (manufactured by UBM Co., Ltd.), the temperature is raised from 25 ° C to 300 ° C at a temperature increase rate of 5 ° C / min under the condition of a frequency of 1 Hz. The change in the measured viscoelasticity was obtained.

The glass transition temperature (Tg) of the component (P2) is 180 ° C or higher, preferably 180 to 280 ° C, more preferably 200 to 280 ° C, still more preferably 210 to 280 ° C, and particularly preferably 220 to 280 ° C. When the Tg of the component (P2) is at least the lower limit of the above range, an adhesive layer having higher heat resistance can be easily formed. If it is less than the upper limit of the above preferred range, the flexibility of the adhesive layer can be easily maintained.

The component (P2) is not particularly limited as long as it has a Tg of 180 ° C or higher, and among them, it is preferably one having a high compatibility with the component (P1). For example, as the component (P2), a resin having a constituent unit (u21) derived from a monomer containing a maleineimine skeleton can be suitably used.

・Constituent unit (u21) The constituent unit (u21) is a constituent unit derived from a monomer containing a maleimide skeleton. By using a resin having a maleimide skeleton, the glass transition temperature becomes high, and the heat resistance of the layer is further increased. As a preferable structural unit (u21), the structural unit represented by the following general formula (p2-1) is mentioned, for example.

[wherein, R ^u10 represents an organic group having 1 to 30 carbon atoms].

In the above formula (p2-1), R ^u10 represents an organic group having 1 to 30 carbon atoms. The organic group in R ^u10 may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. The aliphatic hydrocarbon group means a hydrocarbon group which does not have aromaticity. Further, the aliphatic hydrocarbon group may be saturated or unsaturated, and is usually preferably saturated. For example, ^examples of the organic group in R ^u10 include a chain alkyl group which may have a substituent ring group, a chain alkyl group which may have a substituent, or a chain alkenyl group which may have a substituent.

Ring group which may have a substituent: The ring group is preferably a cyclic hydrocarbon group, and the cyclic hydrocarbon group may be an aromatic hydrocarbon group or an aliphatic hydrocarbon group.

The aromatic hydrocarbon group in R ^u10 is a hydrocarbon group having an aromatic ring. The carbon number of the aromatic hydrocarbon group is preferably from 3 to 30, more preferably from 5 to 30, still more preferably from 5 to 20, particularly preferably from 6 to 15, most preferably from 6 to 10. However, the carbon number in the substituent is not included in the carbon number. Specific examples of the aromatic ring of the aromatic hydrocarbon group in R ¹⁰ include benzene, anthracene, naphthalene, anthracene, phenanthrene, biphenyl, or a part of carbon atoms constituting the aromatic ring, which are substituted by a hetero atom. An aromatic heterocyclic ring or the like. Examples of the hetero atom in the aromatic hetero ring include an oxygen atom, a sulfur atom, and a nitrogen atom. ^{Specific examples} of the aromatic hydrocarbon group in R ^u10 include a group in which one hydrogen atom is removed from the aromatic ring (an aryl group: for example, a phenyl group or a naphthyl group), and one hydrogen atom of the aromatic ring. An alkyl group substituted with an alkyl group (for example, an arylalkyl group such as benzyl, phenethyl, 1-naphthylmethyl, 2-naphthylmethyl, 1-naphthylethyl, 2-naphthylethyl, etc.) and many more. The carbon number of the alkylene group (alkyl chain in the arylalkyl group) is preferably from 1 to 4, more preferably from 1 to 2, particularly preferably 1.

The cyclic aliphatic hydrocarbon group in R ^u10 may, for example, be an aliphatic hydrocarbon group containing a ring in the structure. Examples of the aliphatic hydrocarbon group containing a ring in the structure include an alicyclic hydrocarbon group (a group obtained by removing one hydrogen atom from an aliphatic hydrocarbon ring), and an alkyl group of a hydrogen atom of an aliphatic hydrocarbon ring. Substituted bases, etc. The carbon number of the alkylene group is preferably from 1 to 4. The carbon number of the aliphatic hydrocarbon ring system is preferably from 3 to 20, more preferably from 3 to 12. The aforementioned aliphatic hydrocarbon ring system may be a polycyclic ring or a single ring. The monocyclic aliphatic hydrocarbon ring is preferably a carbon number of 3 to 8, and specific examples thereof include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, and cyclooctane. Preferably, it is cyclopentane or cyclohexane. The polycyclic aliphatic hydrocarbon ring is preferably a carbon number of 7 to 30, and more preferably a bridge of adamantane, norbornane, isodecane, tricyclodecane or tetracyclododecane. a polycyclic alkane having a polycyclic skeleton of a bicyclic ring system; a polycycloalkane having a polycyclic skeleton having a condensed ring system such as a ring of a steroid skeleton.

In particular, the cyclic aliphatic hydrocarbon group in R ^u10 is preferably a group obtained by removing one or more hydrogen atoms from a monocycloalkane or a polycycloalkane, and more preferably one or more hydrogens are removed from the monocycloalkane. The group after the atom is preferably a group obtained by removing one hydrogen atom from the monocycloalkane, and particularly preferably a group obtained by removing one hydrogen atom from cyclopentane or cyclohexane.

^Examples of the substituent of the cyclic group of ^{Ru 10} include an alkyl group, a halogen atom, a halogenated alkyl group and the like. The alkyl group to be a substituent is preferably an alkyl group having 1 to 5 carbon atoms, more preferably a methyl group, an ethyl group, a propyl group, a n-butyl group or a t-butyl group. The halogen atom to be a substituent may, for example, be a fluorine atom, a chlorine atom, a bromine atom or an iodine atom, and is preferably a fluorine atom. Examples of the halogenated alkyl group to be a substituent include an alkyl group having 1 to 5 carbon atoms, and a part or all of hydrogen atoms such as a methyl group, an ethyl group, a propyl group, a n-butyl group and a t-butyl group may be partially or wholly halogenated. The base replaced by an atom.

A chain alkyl group which may have a substituent: The chain alkyl group as R ^u10 may be either a linear chain or a branched chain. The linear alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 15 carbon atoms, still more preferably 1 to 12 carbon atoms. Specific examples thereof include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a decyl group, a decyl group, an eleven group, a dodecyl group, a thirteen group group, and an iso-deca Three bases, fourteen bases, fifteen bases, sixteen bases, different sixteen bases, seventeen bases, eighteen bases, nineteen bases, twenty bases, twenty one bases, twenty-two bases, and the like. The branched alkyl group preferably has 3 to 20 carbon atoms, more preferably 3 to 15 carbon atoms, still more preferably 3 to 10 carbon atoms. Specific examples thereof include 1-methylethyl, 1-methylpropyl, 2-methylpropyl, 1-methylbutyl, 2-methylbutyl, 3-methylbutyl, and 1 -ethylbutyl, 2-ethylbutyl, 1-methylpentyl, 2-methylpentyl, 3-methylpentyl, 4-methylpentyl, and the like.

Chain alkenyl group which may have a substituent: The chain alkenyl group of R ^u10 may be either linear or branched, and preferably has 2 to 10 carbon atoms, more preferably 2 to 5 carbon atoms. Especially preferred is a carbon number of 2 to 4, and particularly preferably a carbon number of 3. Examples of the linear alkenyl group include a vinyl group, a propenyl group (allyl group), and a butynyl group. Examples of the branched alkenyl group include 1-methylvinyl group, 2-methylvinyl group, 1-methylpropenyl group, and 2-methylpropenyl group. The chain alkenyl group is preferably a linear alkenyl group, more preferably a vinyl group or a propylene group, and particularly preferably a vinyl group.

Examples of the substituent of the chain alkyl group or the alkenyl group of R ^u10 include a halogen atom, a halogenated alkyl group, and a cyclic group in the above R ^u10 .

Among the above, R ^{u10 is} preferably a cyclic group which may have a substituent, more preferably a cyclic hydrocarbon group which may have a substituent, and particularly preferably a cyclic aliphatic hydrocarbon group which may have a substituent.

Hereinafter, a specific example of the constituent unit (u21) will be described.

The constituent unit (u21) of the component (P2) may be one type or two or more types. The ratio of the constituent units (u21) in the component (P2) is preferably from 10 to 90 mol%, more preferably from 20 to 80 mol%, based on the total of all the constituent units (100 mol%) of the component (P2). Ear%, especially preferably 40 to 70 mol%. When the ratio of the constituent unit (u21) is at least the lower limit of the above preferred range, the glass transition temperature becomes high, and the heat resistance of the subsequent layer is higher. If it is at most the upper limit of the above preferred range, it is easy to obtain a balance with other constituent units.

・Component (u22) As the component (P2), it may have a constituent unit other than the above-mentioned constituent unit (u21). The constituent unit other than the constituent unit (u21) may, for example, be a constituent unit (u22) derived from a cyclic olefin. By using a cyclic olefin, that is, a resin having an unsaturated aliphatic hydrocarbon ring composed of carbon atoms, an adhesive composition which can form an adhesive layer which is easily dissolved and removed in a hydrocarbon-based solvent can be easily obtained.

As a preferable structural unit (u22), the structural unit represented by the following general formula (p2-2) is mentioned, for example.

[wherein, R ^u11 to R ^u14 each independently represent an organic group or a hydrogen atom having 1 to 30 carbon atoms; and n is an integer of 0 to 2].

In the above formula (p2-2), ^examples of the organic group in R ^u11 to R ^u14 include an alkyl group, an alkenyl group, an alkynyl group, an alkylene group, an aryl group, an aralkyl group, an alkylaryl group, and a cycloalkane. a group, an organic group having a carboxyl group, and an organic group having a hetero ring. The alkyl group in R ^u11 to R ^u14 is preferably an alkyl group having 1 to 10 carbon atoms, and examples thereof include a methyl group, an ethyl group, a n-propyl group, an isopropyl group, an n-butyl group, and an isobutyl group. Dibutyl, tert-butyl, pentyl, neopentyl, hexyl, heptyl, octyl, decyl, decyl. ^Examples of the alkenyl group in R ^u11 to R ^u14 include an allyl group, a pentenyl group, and a vinyl group. ^Examples of the alkynyl group in R ^u11 to R ^u14 include an ethynyl group. ^Examples of the alkylene group in R ^u11 to R ^u14 include a methylene group and an ethylene group. ^Examples of the aryl group in R ^u11 to R ^u14 include a phenyl group, a naphthyl group, and an anthracenyl group. ^Examples of the aralkyl group in R ^u11 to R ^u14 include a benzyl group and a phenethyl group. ^Examples of the alkaryl group in R ^u11 to R ^u14 include a tolyl group and a xylyl group. ^Examples of the cycloalkyl group in R ^u11 to R ^u14 include an adamantyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group. ^Examples of the organic group having a hetero ring in R ^u11 to R ^u14 include an organic group having an epoxy group-organic group and an oxetanyl group.

The organic group in R ^u11 to R ^u14 is preferably an alkyl group from the viewpoint of further improving solubility in a hydrocarbon solvent and synthesis. Further, from the viewpoint of easily maintaining a high glass transition point, it is more preferably an alkyl group having 1 to 8 carbon atoms, particularly preferably an alkyl group having 2 to 6 carbon atoms. Moreover, from the viewpoint of improving the light ^{transmittance} of the adhesive layer formed using the adhesive composition, any one of R ^u11 to R ^u14 is preferably a hydrogen atom. In the above, the organic group in R ^u11 to R ^u14 is preferably a combination of an alkyl group and a hydrogen atom, and preferably one of R ^u11 to R ^u14 is an alkyl group, and the remaining three are hydrogen atoms.

The organic group in R ^u11 to R ^u14 may be substituted by one or more hydrogen atoms by a halogen atom. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

In the above formula (p2-2), n is an integer of 0 to 2, preferably 0 or 1, more preferably 0.

Hereinafter, a specific example of the constituent unit (u22) will be described.

The component (u22) which the (P2) component has may be one type or two or more types. The ratio of the constituent units (u22) in the component (P2) is preferably from 10 to 90 mol%, more preferably from 20 to 80 mol%, based on the total of all the constituent units (100 mol%) of the component (P2). Ear%, especially preferably 30 to 60% by mole. When the ratio of the constituent unit (u22) is at least the lower limit of the above preferred range, the solubility in the hydrocarbon solvent tends to be high. If it is at most the upper limit of the above preferred range, it is easy to obtain a balance with other constituent units.

In the adhesive composition of the present embodiment, the (P2) component may be used singly or in combination of two or more. The component (P2) is preferably a resin having a constituent unit (u21). Among them, from the viewpoint of easily improving the heat resistance and easily forming an adhesive composition capable of forming an adhesive layer which is easily dissolved and removed in a hydrocarbon-based solvent, it is preferably a resin having a constituent unit (u21) and a constituent unit (u22). .

Specific examples of the component (P2) are shown below.

The content ratio of the component (P2) which is contained in the component (P) is preferably 50% by mass or less, more preferably 5% by mass or more, based on the total amount (100% by mass) of the component (P). 50% by mass or less, particularly preferably 10% by mass or more and 40% by mass or less.

In addition, the content of the component (P2) is preferably from 5 to 75 parts by mass, more preferably from 10 to 70 parts by mass, even more preferably from 10 to 65 parts by mass, per 100 parts by mass of the component (P1). It is 10 to 60 parts by mass. When the content ratio of the component (P2) is at most the upper limit of the above preferred range, not only heat resistance but also adhesion is further increased. When it is more than the lower limit of the above preferred range, heat resistance, adhesion, and grain bonding property are all increased.

The other resin (P3) (P) component may contain a resin other than the above (P1) component and (P2) component (this is also referred to as "(P3) component hereinafter). For example, as the component (P3), an acrylic resin or the like can be given.

- Acrylic Resin In the present embodiment, the component (P) may contain an acrylic resin as the component (P3) in addition to the components (P1) and (P2) described above. Since the (P) component contains an acrylic resin, the adhesion between the support and the substrate can be further improved. The acrylic resin may, for example, be a resin (homopolymer or copolymer) polymerized using a (meth) acrylate as a monomer. The term "(meth)acrylic acid" means at least one of acrylic acid or methacrylic acid.

Examples of the (meth) acrylate include an alkyl (meth)acrylate formed of a chain structure, a (meth) acrylate having an aliphatic ring, and a (meth) acrylate having an aromatic ring. . Among these, it is preferred to use a (meth) acrylate having an aliphatic ring.

Examples of the (meth)acrylic acid alkyl ester formed by the chain structure include an acrylic alkyl ester having an alkyl group having 1 to 20 carbon atoms. The alkyl group having 1 to 20 carbon atoms as used herein may be linear or branched, for example, methyl, ethyl, propyl, butyl, 2-ethylhexyl, isooctyl, isodecyl, Isoindolyl, dodecyl, lauryl, thirteenth, n-pentadecyl, n-hexadecyl, n-heptyl, n-octadecyl (stearyl), n-xyl, n-tithyl, etc. It is preferably an acrylic alkyl ester having an alkyl group having 15 to 20 carbon atoms.

Examples of the (meth) acrylate having an aliphatic ring include cyclohexyl (meth)acrylate, cyclopentyl (meth)acrylate, 1-adamantyl (meth)acrylate, and (methyl). Isodecyl acrylate, isodecyl (meth) acrylate, tricyclodecyl (meth) acrylate, tetracyclododecyl (meth) acrylate, dicyclopentyl (meth) acrylate, and the like. Among these, 1-adamantyl (meth)acrylate, isodecyl (meth)acrylate, and dicyclopentanyl (meth)acrylate are preferable.

In the (meth) acrylate having an aromatic ring, examples of the aromatic ring include a phenyl group, a benzyl group, a tolyl group, a xylyl group, a biphenyl group, a naphthyl group, an anthracenyl group, and a phenoxy group. Methyl, phenoxyethyl and the like. The aromatic ring may have a substituent, and may have a linear or branched alkyl group having 1 to 5 carbon atoms.

In the acrylic resin, the above (meth) acrylate may be used singly or in combination of two or more.

The acrylic resin is preferably a group selected from the group consisting of alkyl (meth)acrylates formed of a chain structure, (meth)acrylates having an aliphatic ring, and (meth)acrylates having an aromatic ring. One or more kinds of resins to be polymerized. Among them, a resin obtained by polymerizing an alkyl (meth)acrylate and a (meth)acrylate having an aliphatic ring is preferred.

The acrylic resin may also be a resin which polymerizes a (meth) acrylate monomer with another monomer capable of polymerizing therewith. Examples of the polymerizable monomer include styrene, a styrene derivative, and a monomer containing a maleidino group. The styrene derivative herein is the same as the above "styrene derivative". Here, the single system containing the maleidino group may be the same as the monomer derived from the above constituent unit (u21).

Further, among the acrylic resins, a resin obtained by polymerizing a (meth) acrylate monomer and styrene is preferred. Since the acrylic resin has a styrene unit, the heat resistance of the acrylic resin is increased. Further, the compatibility with other resins and the solubility in a hydrocarbon solvent increase. Among them, as the acrylic resin, a resin obtained by polymerizing an alkyl (meth)acrylate formed of a chain structure, a (meth)acrylate having an aliphatic ring, and styrene is particularly preferable.

The solubility parameter (SP value) of the acrylic resin is preferably 6 or more and 10 or less, more preferably 6.5 or more and 9.5 or less. Since the SP value is within the above preferred range, the compatibility of the acrylic resin with other resins can be improved, and a more stable adhesive composition can be easily obtained.

The weight average molecular weight of the acrylic resin is preferably from 2,000 to 100,000, more preferably from 5,000 to 50,000. Since the weight average molecular weight of the acrylic resin is within the above preferred range, for example, an adhesive composition which has a heat fluidity suitable for bonding of the substrate and the support can be easily provided.

The acrylic resin may be used in combination of two or more kinds. The content ratio of the acrylic resin to be contained in the component (P) is preferably 30% by mass or less, more preferably 25% by mass or less, even more preferably the total amount (100% by mass) of the component (P). It is more than 0% by mass and is 20% by mass or less.

- Curable monomer In the present embodiment, the component (P) contains the above-mentioned components (P1) and (P2), and the adhesive composition may contain a curable monomer as the component (P3). Since the adhesive composition contains a hardenable monomer, the heat resistance of the adhesive layer can be further improved. The curable monomer is preferably a monomer which is polymerized by radical polymerization, and typically includes a polyfunctional hardening monomer, and particularly preferably a polyfunctional (meth) acrylate monomer.

Examples of the polyfunctional (meth) acrylate monomer include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, and tetraethylene glycol di(methyl). Acrylate, propylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexyl Diol di(meth)acrylate, 1,4-cyclohexanedimethanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, 9,9-bis[4-( 2-(Methyl)acryloxyethoxyethoxy)phenyl]anthracene, propoxylated bisphenol A di(meth)acrylate, 1,3-adamantanediol di(meth)acrylate, 5-hydroxy-1,3-adamantanediol di(meth)acrylate, 1,3,5-adamantane triol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate , glycerol di(meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol (meth) acrylate, 2-hydroxy-3-(methyl) propyl Eneoxypropyl (meth) acrylate, ethylene glycol diepoxy propyl ether di (meth) acrylate, diethylene glycol diepoxy propyl di(meth) acrylate, o-benzene Diepoxypropyl dicarboxylate di(meth)acrylate, tris(meth)acrylate, glycerol polyepoxypropyl ether poly(meth)acrylate, urethane (meth)acrylate A reaction product of an ester (i.e., toluene diisocyanate), trimethylhexamethylene diisocyanate, hexamethylene diisocyanate, and 2-hydroxyethyl (meth)acrylate.

These polyfunctional (meth) acrylates may be used alone or in combination of two or more. The curable monomer preferably contains a cyclic structure, and more preferably contains a polycyclic aliphatic structure. The curable monomer preferably contains a cyclic structure, more preferably a polycyclic aliphatic structure, and the compatibility with the cycloolefin polymer can be further improved. Further, by polymerizing the curable monomer used in combination with the cycloolefin polymer, the heat resistance of the adhesive layer can be further improved.

Among the hardening monomers, a (meth) acrylate monomer having a cyclic group is particularly preferable, and more preferably selected from tricyclodecane dimethanol di(meth) acrylate, 1,3-gold. Alkylene glycol di(meth)acrylate, 5-hydroxy-1,3-adamantanediol di(meth)acrylate, 1,3,5-adamantane triol tri(meth)acrylate, 1 , 4-cyclohexanedimethanol di(meth)acrylate, 9,9-bis[4-(2-(methyl)acryloxyethoxy)phenyl]anthracene and propoxylated bisphenol At least one selected from the group consisting of A di(meth)acrylate is particularly preferably tricyclodecane dimethanol di(meth)acrylate.

The content ratio of the curable monomer which is contained in the component (P) is preferably 5 to 40% by mass, and more preferably 5 to 30% by mass based on the total amount (100% by mass) of the component (P). It is especially preferably 5 to 20% by mass. In addition, when the adhesive composition is further improved in the adhesiveness, the content ratio of the curable monomer contained in the component (P) is also based on the total amount (100% by mass) of the component (P). A numerical range of 1 to 30% by mass, 2 to 20% by mass, and 5 to 15% by mass can be set.

In addition, the content ratio of the curable monomer is preferably 5 to 40 parts by mass, more preferably 5 to 30 parts by mass, even more preferably 100 parts by mass based on the total of the component (P1) and the component (P2). It is 5 to 20 parts by mass. When the content ratio of the curable monomer is at least the lower limit of the above preferred range, higher heat resistance can be imparted to the adhesive layer. When it is at most the upper limit of the above preferred range, the solubility in the hydrocarbon solvent can be further improved, and the washing and removing property of the adhesive layer can be further improved.

In the adhesive composition of the present embodiment, the content of the component (P) can be adjusted depending on the thickness of the adhesive layer to be formed, the type of each resin, and the like.

<Optional component> The adhesive composition of the present embodiment may further contain a component (optional component) other than the component (P). Examples of the optional component include a polymerization inhibitor, a polymerization initiator, a solvent component, a plasticizer, an auxiliary agent, a stabilizer, a colorant, a surfactant, and the like described below.

<<Polymerization inhibitor>> The adhesive composition of the present embodiment may further contain a polymerization inhibitor. The polymerization inhibitor refers to a component having a function of preventing radical polymerization by heat or light. The polymerization inhibitor exhibits high reactivity to free radicals. Therefore, for example, when a cycloolefin polymer is used as the component (P1), the reaction between the polymerization inhibitor and the radical is more preferentially carried out than the reaction of the cycloolefin polymer with a radical, and the polymerization of the cycloolefin polymer is inhibited. Thereby, the chemical resistance of the adhesive layer can be improved by heating the formed adhesive layer.

As the polymerization inhibitor, those having a phenol skeleton are preferred. For example, among the polymerization inhibitors, hindered phenol-based antioxidants may be used, and examples thereof include pyrogallol, benzoquinone, hydroquinone, methylene blue, t-butylcatechol, monobenzyl ether, and methyl group. Hydroquinone, amyl hydrazine, pentyl hydroquinone, n-butyl phenol, phenol, hydroquinone monopropyl ether, 4,4'-(1-methylethylidene) bis(2-methylphenol), 4,4'-(1-methylethylidene)bis(2,6-dimethylphenol), 4,4'-[1-[4-(1-(4-hydroxyphenyl)-1- Methyl ethyl)phenyl]ethylidene]bisphenol, 4,4',4"-ethylenetris(2-methylphenol), 4,4',4"-ethylenetriphenol, 1 , 1,3-tris(2,5-dimethyl-4-hydroxyphenyl)-3-phenylpropane, 2,6-di-t-butyl-4-methylphenol, 2,2'-Asia Methyl bis(4-methyl-6-tert-butylphenol), 4,4'-butylene bis(3-methyl-6-tert-butylphenol), 4,4'-thiobis ( 3-methyl-6-tert-butylphenol), 3,9-bis[2-(3-(3-tert-butyl-4-hydroxy-5-methylphenyl)-propenyloxy) -1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro(5,5)undecane, triethylene glycol-bis-3-(3-tert-butyl- 4-hydroxy-5-methylphenyl)propionate, n-octyl-3-(3,5-di-t-butyl-4-hydroxyl Propionate, pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate] (trade name: IRGANOX1010, manufactured by BASF), three (3,5-di Tributylhydroxybenzyl)isomeric cyanurate, thiodiethylidene bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], and the like.

The polymerization inhibitor may be used singly or in combination of two or more. The content of the polymerization inhibitor can be appropriately determined depending on the type of the resin component, the use of the adhesive composition, and the use environment. For example, it is preferably 0.1 to 10 parts by mass based on 100 parts by mass of the component (P). When the content of the polymerization inhibitor is within the above preferred range, the effect of suppressing polymerization can be favorably exhibited, and the chemical resistance of the adhesive layer can be further improved after the high-temperature process.

<<Polymerization Initiator>> The adhesive composition of the present embodiment may further contain a polymerization initiator. The polymerization initiator refers to a component having a function of promoting the polymerization reaction of the above-mentioned curable monomer. Examples of the polymerization initiator include a thermal polymerization initiator, a photopolymerization initiator, and the like. Examples of the thermal polymerization initiator include a peroxide, an azo polymerization initiator, and the like.

Examples of the peroxide in the thermal polymerization initiator include a ketone peroxide, a peroxyketal, a hydroperoxide, a dialkyl peroxide, a peroxyester, and the like. Specific examples of such a peroxide include ethylene peroxide, dicumyl peroxide, tributyl peroxide, tributyl cumyl peroxide, and propylene peroxide. Benzoyl peroxide (BPO), 2-chlorobenzhydryl peroxide, 3-chlorobenzylidene peroxide, 4-chlorobenzylidene peroxide, 2,4-dichlorobenzene peroxide Formamyl, 4-bromomethylbenzhydryl peroxide, lauryl peroxide, potassium persulfate, diisopropyl peroxycarbonate, tetrahydronaphthalene hydroperoxide, 1-phenyl-2-methyl Propyl-1-hydroperoxide, tert-butyl pertriphenylacetate, tert-butyl hydroperoxide, tert-butyl percarboxylic acid, tert-butyl peracetate, tert-butyl perbenzoate Ester, tert-butyl perphenylacetate, tert-butyl 4-methoxyacetate, tert-butyl N-(3-tolyl)carbamate, and the like.

For the above-mentioned peroxide, for example, the product name "Percumyl (registered trademark)", the trade name "Perbutyl (registered trademark)", the trade name "Peroyl (registered trademark)", and the trade name, manufactured by Nippon Oil & Fats Co., Ltd., can be used. A marketer such as "Perocta (registered trademark)".

Examples of the azo polymerization initiator in the thermal polymerization initiator include 2,2'-azobispropane, 2,2'-dichloro-2,2'-azobispropane, and 1, 1'-azo(methylethyl) diacetate, 2,2'-azobis(2-methylamidinopropane) hydrochloride, 2,2'-azobis(2-aminopropane) Nitrate, 2,2'-azobisisobutane, 2,2'-azobisisobutylguanamine, 2,2'-azobisisobutyronitrile, 2,2'-azo double Methyl 2-methylpropionate, 2,2'-dichloro-2,2'-azobisbutane, 2,2'-azobis-2-methylbutyronitrile, 2,2'- Dimethyl azobisisobutyrate, 1,1'-azobis(sodium 1-methylbutyronitrile-3-sulfonate), 2-(4-methylphenylazo)-2-methyl Malononitrile 4,4'-azobis-4-cyanovaleric acid, 3,5-dihydroxymethylphenylazo-2-allylpropane dinitrile, 2,2'-azobis- 2-methylvaleronitrile, dimethyl 4,4'-azobis-4-cyanovalerate, 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'- Azobiscyclohexanecarbonitrile, 2,2'-azobis-2-propylbutyronitrile, 1,1'-azobiscyclohexanecarbonitrile, 2,2'-azobis-2-propylbutyronitrile 1,1'-azobis-1-chlorophenylethane, 1,1'-azobis-1-cyclohexane Nitrile, 1,1'-azobis-1-cycloheptanenitrile, 1,1'-azobis-1-phenylethane, 1,1'-azobismethane, 4-nitrophenyl Azobenzyl cyanoacetate, phenylazodiphenylmethane, phenylazotriphenylmethane, 4-nitrophenylazotriphenylmethane, 1,1'-azobis- 1,2-diphenylethane, poly(bisphenol A-4,4'-azobis-4-cyanovalerate), poly(tetraethylene glycol-2,2'-azobisiso Butyrate) and the like.

Examples of the photopolymerization initiator include 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, and 1-[4-(2-hydroxyethoxyl). Phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1 -(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one, bis ( 4-Dimethylaminophenyl)one, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinylpropan-1-one, 2-benzyl-2-di Methylamino-1-(4-morpholinylphenyl)-butan-1-one, ethyl ketone 1-[9-ethyl-6-(2-methylbenzhydryl)-9H-indole Zyrid-3-yl]-1-(o-ethylindenyl), 2,4,6-trimethylbenzimidyldiphenylphosphine oxide, 4-benzylidene-4'-methyldi Methyl sulfide, 4-dimethylaminobenzoic acid, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, butyl 4-dimethylaminobenzoate , 4-dimethylamino-2-ethylhexylbenzoic acid, 4-dimethylamino-2-isopentylbenzoic acid, benzyl-β-methoxyethyl acetal, benzyl dimethyl Ketal ketone, 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl) fluorene, adjacent Methylmercaptobenzoate, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 1-chloro-4-propoxythioxanthone, Thiophene, 2-chlorothioxanthene, 2,4-diethylthioxanthene, 2-methylthioxanthene, 2-isopropylthioxanthene, 2-ethylhydrazine, octamethylguanidine, 1,2 -benzoxanthene, 2,3-diphenylanthracene, azobisisobutyronitrile, benzhydryl peroxide, cumene peroxide, 2-mercaptobenzimidazole, 2-mercaptobenzoene Azole, 2-mercaptobenzothiazole, 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di(methoxyphenyl) Imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer, 2,4,5-triarylimidazole dimer, diphenyl ketone, 2-chlorodiphenyl ketone, 4 , 4'-bisdimethylaminodiphenyl ketone (ie, mazakirone), 4,4'-bisdiethylaminodiphenyl ketone (ie, ethyl mazinone), 4 , 4'-dichlorodiphenyl ketone, 3,3-dimethyl-4-methoxydiphenyl ketone, diphenylethylenedione, benzoin, benzoin methyl ether, benzoin B Ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, benzoin tert-butyl ether, acetophenone, 2,2-diethoxybenzene Ketone, p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, p-tert-butylacetophenone, p-dimethylaminoacetophenone, Tert-butyltrichloroacetophenone, p-tert-butyldichloroacetophenone, a,a-dichloro-4-phenoxybenzene Ketone, thioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, dibenzocycloheptanone, pentyl-4-dimethylaminobenzoate, 9-phenylindole Pyridine, 1,7-bis-(9-acridinyl)heptane, 1,5-bis-(9-acridinyl)pentane, 1,3-bis-(9-acridinyl)propane, Methoxy three , 2,4,6-tris(trichloromethyl)-s-three 2-methyl-4,6-bis(trichloromethyl)-s-three ,2-[2-(5-methylfuran-2-yl)vinyl]-4,6-bis(trichloromethyl)-s-three ,2-[2-(furan-2-yl)vinyl]-4,6-bis(trichloromethyl)-s-three 2-[2-(4-Diethylamino-2-methylphenyl)vinyl]-4,6-bis(trichloromethyl)-s-three ,2-[2-(3,4-dimethoxyphenyl)vinyl]-4,6-bis(trichloromethyl)-s-three , 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-s-three , 2-(4-ethoxystyryl)-4,6-bis(trichloromethyl)-s-three ,2-(4-n-butoxyphenyl)-4,6-bis(trichloromethyl)-s-three 2,4-bis-trichloromethyl-6-(3-bromo-4-methoxy)phenyl-s-three 2,4-bis-trichloromethyl-6-(2-bromo-4-methoxy)phenyl-s-three 2,4-bis-trichloromethyl-6-(3-bromo-4-methoxy)styrylphenyl-s-three 2,4-bis-trichloromethyl-6-(2-bromo-4-methoxy)styrylphenyl-s-three Wait.

For the photopolymerization initiator, for example, "IRGACURE OXE02", "IRGACURE OXE01", "IRGACURE 369", "IRGACURE 651", "IRGACURE 907" (all manufactured by BASF Corporation), and "NCI-" can be used. 831" (trade name, manufactured by ADEKA Co., Ltd.) and other commercials.

The polymerization initiator may be used singly or in combination of two or more. As the polymerization initiator, a thermal polymerization initiator is preferred, and a peroxide is more preferred. The polymerization initiator is preferably used in combination with a curable monomer. The amount of the polymerization initiator to be used is preferably adjusted in accordance with the amount of the curable monomer used. For example, in the adhesive composition of the present embodiment, the content of the polymerization initiator is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the curable monomer.

<<Solvent Component>> The adhesive composition of the present embodiment can be prepared by dissolving a component (P) and an optional component as necessary in a solvent component. In the solvent component, for example, one of the components which can be used for the composition of the adhesive can be used, and it can be used alone or in combination of two or more.

Examples of the solvent component include a hydrocarbon solvent and a petroleum solvent. In addition, the hydrocarbon solvent and the petroleum solvent are collectively referred to as "(S1) component". The solvent component other than the component (S1) is also referred to as "(S2) component".

Examples of the hydrocarbon solvent include linear, branched or cyclic hydrocarbons, and examples thereof include hexane, heptane, octane, decane, methyl octane, decane, undecane, and dodecane. a linear hydrocarbon such as tridecane; a branched hydrocarbon such as isooctane, isodecane or isododecane; p-menthane, o-menthane, m-menthane, diphenylmethane, 1, 4-萜,1,8-萜, decane, norbornane, decane, arborane, decane, longene, a-terpinene, β-terpinene, g-terpinene , a-pinene, β-pinene, a-tertene ketone, β-terbinone, cyclohexane, cycloheptane, cyclooctane, anthracene, pentene, decane, tetrahydroanthracene, naphthalene, A cyclic hydrocarbon such as tetralin or decalin.

The petroleum-based solvent is a solvent purified from heavy oil, and examples thereof include kerosene, a paraffin-based solvent, and an isoparaffin-based solvent.

In addition, the (S2) component may, for example, be a terpene solvent having a polar group such as an oxygen atom, a carbonyl group or an ethoxylated group, and examples thereof include geraniol, nerol, linalool, citral, and lemongrass. Alcohol, menthol, isomenthol, neomenthol, a-terpineol, beta-terpineol, g-terpineol, terpinene-1-ol, terpinen-4-ol, dihydrogen acetate Terpene ester, 1,4-nonyl oleyl alcohol, 1,8-nonyl oleyl alcohol, borneol, carvone, ionone, flavonoids, camphor, and the like.

Further, examples of the (S2) component include lactones such as g-butyrolactone; acetone, methyl ethyl ketone, cyclohexanone (CH), methyl n-amyl ketone, and methyl isoamyl group; Ketones such as ketone and 2-heptanone; polyols such as ethylene glycol, diethylene glycol, propylene glycol and dipropylene glycol; ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoethyl a compound having an ester bond such as an acid ester or dipropylene glycol monoacetate, a monomethyl ether, a monoethyl ether, a monopropyl ether or a monobutyl ether of the above polyhydric alcohol or a compound having the above ester bond; A derivative of a polyhydric alcohol such as a compound having an ether bond such as a monoalkyl ether or a monophenyl ether. Among them, propylene glycol monomethyl ether acetate (PGMEA) or propylene glycol monomethyl group is preferred. Ether (PGME)); Alkyl ethers; methyl lactate, ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, ethoxypropionic acid An ester such as an ester; an aromatic organic solvent such as anisole, ethylbenzyl ether, cresyl methyl ether, diphenyl ether, dibenzyl ether, phenethyl ether or butylphenyl ether.

The content of the solvent component in the adhesive composition of the present embodiment may be appropriately adjusted according to the thickness of the adhesive layer to be formed. For example, the total amount (100% by mass) of the adhesive composition is preferably 20%. ～90% by mass. In other words, the concentration of the solid component (the total amount of the components other than the solvent component) of the adhesive composition of the present embodiment is preferably in the range of 10 to 80% by mass. When the content of the solvent component is within the above preferred range, the viscosity adjustment becomes easy.

Specific examples of the composition of the adhesive agent of the present embodiment include the following compositions (I) to (III). Composition (I): composition (II) containing (P1) component, (P2) component, polymerization inhibitor and solvent component: containing (P1) component, (P2) component, curable monomer, polymerization Composition (III) of composition of starting agent and solvent component: composition containing (P1) component, (P2) component, (P3) component, polymerization inhibitor and solvent component

The adhesive composition of the present embodiment can be prepared by mixing and dissolving other components in a solvent component. Among the solvent components, those containing a hydrocarbon solvent are preferably used from the viewpoint of solubility of the component (P), and those containing a branched hydrocarbon or a cyclic hydrocarbon solvent are more preferably used. Since the solvent component contains a branched or cyclic hydrocarbon solvent, it is easy to prevent clouding which may occur when the adhesive composition is stored in a liquid state (especially at a low temperature), and the storage stability can be further improved.

Further, among the solvent components, those containing a condensed polycyclic hydrocarbon or a branched hydrocarbon as a hydrocarbon solvent are preferably used. In this case, the solvent component may be selected only from the group consisting of condensed polycyclic hydrocarbons and branched hydrocarbons, or may be other components such as saturated aliphatic hydrocarbons. In the solvent component, the content of the group selected from the group consisting of a condensed polycyclic hydrocarbon and a branched hydrocarbon is preferably 40 parts by mass or more, and more preferably 60 parts by mass or more based on 100 parts by mass of the total hydrocarbon solvent. More preferably, it is 80 parts by mass or more. When it is 40 parts by mass or more of the entire hydrocarbon solvent, the solubility of the component (P) is changed well.

In the case of the above composition (II), the polymerization initiator may be blended by a well-known method immediately before the use of the adhesive composition. Further, the polymerization initiator or the polymerization inhibitor may be blended in a form which is previously dissolved in the above (S2) component. The amount of the component (S2) to be used may be appropriately adjusted according to the type of the polymerization initiator or the polymerization inhibitor. For example, it is preferably 1 to 50 parts by mass, more preferably 5 parts by mass based on 100 parts by mass of the (S1) component. ~ 30 parts by mass. When the amount of the component (S2) used is within the above preferred range, the polymerization initiator or the polymerization inhibitor can be sufficiently dissolved.

Further, the adhesive composition of the present embodiment preferably satisfies at least one of the following requirements. (Requirement 1): A test piece having a thickness of 0.5 mm and a thickness of 0.5 mm was prepared from the above-mentioned adhesive composition, and the temperature was raised at a rate of 5 ° C / min from room temperature to 215 ° C under a stretching condition of a frequency of 1 Hz. When the test piece was delivered to the dynamic viscoelasticity measurement, the complex elastic modulus E* ₅₀ at 50 ° C did not reach 1.0 ^{́10 9} Pa. (Requirement 2): Under the same conditions as in (Requirement 1), when the test piece was delivered to the dynamic viscoelasticity measurement, the complex elastic modulus E* ₁₅₀ at 150 ° C exceeded 3.0 ^{́10 6} Pa. (Requirement 3): at the (Requirement 1) The same conditions and (Requirement 2), obtained at 50 deg.] C the complex elastic modulus E * ₅₀ at 150 deg.] C and the complex elastic modulus E * _150, E * The ratio of ₅₀ / E * ₁₅₀ is less than 2000. Further, the dynamic viscoelasticity measurement system in each of the requirements can be carried out by using a dynamic viscoelasticity measuring apparatus (Rheogel-E4000, manufactured by UBM Co., Ltd.) in accordance with the following procedure (the same applies to the following requirements). (Procedure) First, the adhesive composition was applied onto a PET film with a release agent, and heated at 50 ° C and 150 ° C for 60 minutes in an oven under atmospheric pressure to form an adhesive layer (thickness: 0.5 mm). Next, the complex elastic modulus E* of each temperature of the adhesive layer peeled off from the PET film was measured using the dynamic viscoelasticity measuring apparatus described above. The measurement conditions were such that the sample shape was 20 mm ́5 mm ́ thickness 0.5 mm, and the temperature was measured at 50 ° C and 150 ° C under the conditions of a tensile condition of 1 Hz from room temperature to 215 ° C at a temperature of 5 ° C / min. Complex elastic modulus.

By the adhesive composition of the present embodiment satisfying (Requirement 1), the adhesive composition system can exert a higher adhesive ability in a temperature region closer to room temperature. The complex elastic modulus E* ₅₀ at 50 ° C is preferably less than 0.9 ^{́10 9} Pa, and particularly preferably less than 0.6 ^{́10 9} Pa. The lower limit of the complex elastic modulus E* ₅₀ at 50 ° C is not particularly limited and is, for example, 1.0 ^{́10 7} Pa or more.

The adhesive composition of the present embodiment satisfies (claim 2), and the adhesive composition system can suppress the flow and the like which occur in a high temperature region with high precision. Thereby, the positional displacement of the substrate is less likely to occur at the time of high temperature processing. The complex elastic modulus E* ₁₅₀ at 150 ° C is more preferably more than 3.5 ^{́10 6} Pa, and particularly preferably more than 5.0 ^{́10 6} Pa. The upper limit of the complex elastic modulus E* ₁₅₀ at 150 ° C is not particularly limited, and is, for example, 1.0 ^{́10 8} Pa or less.

According to the adhesive composition of the present embodiment, the adhesive composition satisfies (claim 3), and the adhesive composition is easy to exert a stable function at room temperature and during heating. The comparison of the E* ₅₀ /E* ₁₅₀ is preferably 1000 or less, more preferably 500 or less, and particularly preferably 100 or less. The lower limit of the ratio of E* ₅₀ /E* ₁₅₀ is not particularly limited, and is, for example, 5 or more, preferably 1.5 or more.

In the adhesive composition of the present embodiment described above, by combining the hydrocarbon resin (P1) and the resin (P2) having a glass transition temperature of 180 ° C or higher, a heat-resistant adhesive layer can be formed. As a result, the adhesive layer formed of the adhesive composition of the present embodiment is less likely to cause a positional shift of the substrate after the sealing operation due to the influence of the high-temperature processing.

Further, according to the adhesive composition of the present embodiment, the substrate (bare wafer) is fixed to the formed underlayer with sufficient strength (good grain bonding property). Further, according to the adhesive composition of the present embodiment, the formed subsequent layer has high solubility in a hydrocarbon solvent. Thereby, the adhesive layer can be easily removed from the substrate during the manufacture of the semiconductor package.

(Adhesive Composition (Second Aspect)) Next, an adhesive composition of the second aspect of the present invention will be described. The adhesive composition of the second aspect of the present invention is used for bonding a support and a substrate. The adhesive composition of this embodiment contains a resin component (P). This resin component (P) contains at least a hydrocarbon resin (P1), which satisfies the following requirements. (Requirement 1): A test piece having a thickness of 0.5 mm and a thickness of 0.5 mm was prepared from the above-mentioned adhesive composition under the conditions of a stretching condition of 1 Hz, from room temperature to 215 ° C, at a temperature of 5 ° C / min. When the test piece was delivered to the dynamic viscoelasticity measurement, the complex elastic modulus E* ₅₀ at 50 ° C did not reach 1.0 ^{́10 9} Pa. (Requirement 2): Under the same conditions as in (Requirement 1), when the test piece was delivered to the dynamic viscoelasticity measurement, the complex elastic modulus E* ₁₅₀ at 150 ° C exceeded 3.0 ^{́10 6} Pa.

The (P1) component, the (P2) component, the (P3) component, and the blending ratio of the resin component (P) which can constitute this aspect are as described in the above-described first aspect of the adhesive composition. However, the adhesive composition of the present embodiment may not necessarily contain the component (P2), and may contain a component corresponding to the component (P2), and the glass transition temperature (Tg) of the component may not be in the range described above.

The adhesive composition of this aspect preferably contains a component having a constituent unit (u21) derived from a monomer containing a maleimide skeleton. This constituent unit (u21) is typically included in any of the resins constituting the resin component (P).

Here, the constituent unit (u21) is typically a constituent unit represented by the following general formula (p2-1). Further, the organic group having 1 to 30 carbon atoms shown here can be used as described above. [wherein, R ^u10 represents an organic group having 1 to 30 carbon atoms].

Further, the adhesive composition of the present aspect may contain any component or solvent component which may be contained in the adhesive composition of the first aspect, and the blending ratio thereof is also as described above.

Specific examples of the composition of the adhesive of the present aspect include the following compositions (IV) to (VI). These compositions can be obtained by dissolving or dispersing essential components in a solvent component. Composition (IV): composition (V) containing a component (P1), a polymerization inhibitor, and a solvent component: a composition containing a component (P1), a curable monomer, a polymerization initiator, and a solvent component (VI): a composition containing a component (P1), a component (P3), a polymerization inhibitor, and a solvent component

The adhesive composition of this embodiment must satisfy the above (claim 1). Thereby, the adhesive composition system can exert a higher adhesive ability in a temperature region closer to room temperature. The complex elastic modulus E* ₅₀ at 50 ° C is preferably less than 0.9 ^{́10 9} Pa, and particularly preferably less than 0.6 ^{́10 9} Pa. The lower limit of the complex elastic modulus E* ₅₀ at 50 ° C is not particularly limited, and is, for example, 1.0 ^{́10 7} Pa or more.

Further, in addition to the above (claim 1), the adhesive composition of the present embodiment must satisfy the above (claim 2). The composition of the subsequent agent can suppress the flow and the like which occur in a high temperature region with high precision. Thereby, the positional displacement of the substrate is less likely to occur at the time of high temperature processing. The complex elastic modulus E* ₁₅₀ at 150 ° C is more preferably more than 3.5 ^{́10 6} Pa, and particularly preferably more than 5.0 ^{́10 6} Pa. The upper limit of the complex elastic modulus E* ₁₅₀ at 150 ° C is not particularly limited, and is, for example, 1.0 ^{́10 8} Pa or less.

Further, the adhesive composition of the present embodiment preferably satisfies the following requirements (requirement 3). (Requirement 3): at the (Requirement 1) The same conditions and (Requirement 2), obtained at 50 deg.] C the complex elastic modulus E * ₅₀ at 150 deg.] C and the complex elastic modulus E * _150, E * The ratio of ₅₀ / E * ₁₅₀ is less than 2000. According to the adhesive composition of the present embodiment, the adhesive composition satisfies (claim 3), and the adhesive composition is easy to exert a stable function at room temperature and during heating. The comparison of the E* ₅₀ /E* ₁₅₀ is preferably 1000 or less, more preferably 500 or less, and particularly preferably 100 or less. The lower limit of the ratio of E* ₅₀ /E* ₁₅₀ is not particularly limited, and is, for example, 5 or more, preferably 1.5 or more.

In the adhesive composition of the present embodiment described above, by including the hydrocarbon resin (P1) while satisfying specific requirements, an adhesive layer having higher heat resistance can be formed. As a result, the adhesive layer formed of the adhesive composition of the present embodiment is less likely to cause a positional shift of the substrate after the sealing operation due to the influence of the high-temperature processing.

Further, according to the adhesive composition of the present embodiment, the substrate (bare wafer) is fixed to the formed underlayer with sufficient strength (good grain bonding property). Further, according to the adhesive composition of the present embodiment, the formed subsequent layer has high solubility in a hydrocarbon solvent. Thereby, the adhesive layer can be easily removed from the substrate during the manufacture of the semiconductor package.

(Support having an adhesive layer) The support having the adhesive layer according to the third aspect of the present invention includes: a support to which a substrate is bonded; and the first or second state is used on the support An adhesive layer formed by the composition of the adhesive. Therefore, heat resistance can be improved in the support body with the adhesive layer. In the laminate 10 shown in Fig. 1, the support 12 and the substrate 4 are bonded to each other via the adhesive layer 3, that is, the substrate 4 is fixed to the support 123 to which the adhesive layer is attached. The support body 123 with the adhesive layer of this embodiment is provided with the support body 12 in which the separation layer 2 is provided on the support base 1, and the adhesive layer 3 formed on the support body 12.

<Support> The support 12 in FIG. 1 is provided with a support base 1 and a separation layer 2 provided on the support base 1.

Support Matrix supports the ability of the substrate to penetrate light. The member supporting the substrate supporting the substrate is bonded to the substrate via the adhesive layer. Therefore, as the support base, it is preferable to have the necessary strength for preventing breakage or deformation of the substrate when the sealing body is thinned, the substrate is transported, or the substrate is mounted. Further, the support substrate is preferably light having a wavelength that penetrates the deterioration of the separation layer. As a material of a support base, glass, a hydrazine, an acrylic resin, etc. can be used, for example. Examples of the shape of the support base include a rectangular shape, a circular shape, and the like, but are not limited thereto. Further, as the support base, in order to increase the density and increase the production efficiency, it is also possible to use a large-sized panel having a square shape in a plan view in which the size of the circular support base is increased.

<<Separation Layer>> The separation layer is adjacent to the adhesion layer and is deteriorated by irradiation of light, and the layer of the support substrate can be separated from the substrate bonded to the support. The separation layer can be formed by using a composition for forming a separation layer to be described later, for example, by firing a component contained in the composition for forming a separation layer or by a chemical vapor deposition (CVD) method. This separation layer is suitably deteriorated by absorbing light irradiated through the support substrate. Further, the separation layer is preferably formed only of a material that absorbs light, but may be a layer in which a material having a structure that does not have light absorption is blended, within a range that does not impair the essential characteristics of the present invention.

The "deterioration" of the separation layer refers to a state in which the separation layer can be destroyed by an external force, or a state in which the adhesion between the separation layer and the contact layer is lowered. The separation layer is weakened by absorption of light, and loses strength or adhesion before exposure to light. The deterioration of the separation layer is caused by decomposition due to energy of absorbed light, change in stereo configuration, dissociation of functional groups, and the like.

The thickness of the separation layer is, for example, 0.05 μm or more, preferably 50 μm or less, more preferably 0.3 μm or more and 1 μm or less. When the thickness of the separation layer is in the range of 0.05 μm or more and 50 μm or less, it is possible to cause desired deterioration in the separation layer due to short-time irradiation of light and irradiation of low-energy light. Further, from the viewpoint of productivity, the thickness of the separation layer is particularly preferably in the range of 1 μm or less.

In the separation layer, it is preferable that the surface contacting the side of the subsequent layer is flat (no unevenness is formed), whereby the formation of the subsequent layer is easily performed, and the support substrate and the substrate are easily attached uniformly.

(Composition for forming a separation layer) The composition for forming a separation layer for forming a material for a separation layer may, for example, be fluorocarbon, a polymer having a repeating unit having a structure having a light absorbing property, an inorganic substance, or an infrared absorbing property. The compound of the structure, the infrared absorbing material, the reactive polysesquioxane, or the resin component having a phenol skeleton. Further, the separation layer forming composition may further contain a filler, a plasticizer, a thermal acid generator component, a photoacid generator component, an organic solvent component, a surfactant, a sensitizer, or a component capable of improving the separation property of the support matrix. As an optional ingredient.

・The fluorocarbon separation layer may contain fluorocarbon. The separation layer composed of fluorocarbon is deteriorated by absorbing light, and as a result, the strength or adhesion before irradiation with light is lost. Therefore, the support layer and the substrate can be easily separated by applying a slight external force (for example, lifting the support or the like) to break the separation layer. The fluorocarbon constituting the separation layer can be suitably formed into a film by a plasma CVD method. Fluorocarbons absorb light of a wavelength having an intrinsic range depending on the kind thereof. The fluorocarbon can be suitably deteriorated by irradiating light of a wavelength of a range absorbed by the fluorocarbon for the separation layer to the separation layer. The light absorption rate of the separation layer is preferably 80% or more.

As the light irradiated to the separation layer, a wavelength which can be absorbed by fluorocarbon, for example, a solid laser which is suitable for use of a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, a fiber laser, or the like, Laser light, non-laser light such as liquid laser, CO ₂ laser, excimer laser, Ar laser, He-Ne laser, etc., laser laser, semiconductor laser, etc. Just fine. As the wavelength at which the fluorocarbon can be deteriorated, for example, a wavelength in the range of 600 nm or less can be used.

The polymer separation layer having a repeating unit having a light absorbing structure also contains a polymer having a repeating unit containing a light absorbing structure. The polymer is degraded by irradiation with light. The light absorbing structure includes, for example, a conjugated π electron system consisting of a substituted or unsubstituted benzene ring, a condensed ring or a hetero ring. The light absorbing structure, more specifically, a cardo structure, a diphenyl ketone structure present in a side chain of the polymer, a diphenyl fluorene structure, and a diphenyl fluorene structure (diphenylhydrazine structure), diphenyl structure or diphenylamine structure. The light absorbing structure described above can absorb light having a wavelength of a desired range depending on the type thereof. For example, the wavelength of light that can be absorbed by the light absorbing structure described above is preferably in the range of 100 to 2000 nm, more preferably in the range of 100 to 500 nm.

The light absorbable by the above light absorbing structure is, for example, a high pressure mercury lamp (wavelength 254 nm or more, 436 nm or less), a KrF excimer laser (wavelength 248 nm), an ArF excimer laser (wavelength 193 nm), F ₂ standard. Molecular laser (wavelength 157 nm), XeCl laser (wavelength 308 nm), XeF laser (wavelength 351 nm) or solid UV laser (wavelength 355 nm), or g-line (wavelength 436 nm), h-line (wavelength 405 nm) ) or i line (wavelength 365 nm) and the like.

・The inorganic separation layer may be composed of inorganic materials. The inorganic material may be one or more types selected from the group consisting of metals, metal compounds, and carbon, as long as it is deteriorated by absorption of light. The metal compound is a compound containing a metal atom, and examples thereof include a metal oxide and a metal nitride. Examples of such an inorganic material include one or more types selected from the group consisting of gold, silver, copper, iron, nickel, aluminum, titanium, chromium, SiO ₂ , SiN, Si ₃ N ₄ , TiN, and carbon. Also, the so-called carbon is a concept that can include allotropes of carbon, and includes, for example, diamonds, fullerenes, diamond-like carbons, carbon nanotubes, and the like. The above inorganic substance absorbs light having a wavelength of an intrinsic range depending on its kind.

As the light that is irradiated to the separation layer made of the inorganic substance, for example, a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, a fiber laser, or the like is preferably used in accordance with the wavelength that the inorganic substance can absorb. Thunder of liquid lasers such as solid lasers, pigment lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers, semiconductor lasers, free electron lasers, etc. Light or non-laser light can be used. The separation layer composed of an inorganic material can be formed on the support substrate by a well-known technique such as sputtering, chemical vapor deposition (CVD), plating, plasma CVD, spin coating or the like.

The compound separation layer having an infrared absorbing structure may also contain a compound having an infrared absorbing structure. This compound having an infrared absorbing structure is deteriorated by absorption of infrared rays. Examples of the structure having an infrared absorbing property or a compound having such a structure include an alkane, an alkene (vinyl group, a trans group, a cis group, a vinylidene group, a trisubstituted group, a tetrasubstituted group, a conjugated group, an alkene group, and a cyclic group). , alkyne (monosubstituted, disubstituted), monocyclic aromatic (benzene, monosubstituted, disubstituted, trisubstituted), alcohol or phenol (free OH, intramolecular hydrogen bonding, intermolecular hydrogen bonding, saturated secondary , saturated tertiary, unsaturated secondary, unsaturated tertiary), acetal, ketal, aliphatic ether, aromatic ether, vinyl ether, oxirane cyclic ether, peroxide ether, ketone, dialkyl Carbonyl, aromatic carbonyl, enol of 1,3-diketone, o-hydroxyaryl ketone, dialkyl aldehyde, aromatic aldehyde, carboxylic acid (dimer, carboxylate anion), formate, acetate , conjugated esters, non-conjugated esters, aromatic esters, lactones (β-, g-, d-), aliphatic acid chlorides, aromatic acid chlorides, acid anhydrides (conjugated, non-conjugated, cyclic , acyclic), primary guanamine, secondary guanamine, indoleamine, primary amine (aliphatic, aromatic), secondary amine (aliphatic, aromatic), tertiary amine (aliphatic, aromatic) Primary amine salt, secondary amine salt, tertiary amine salt, ammonium ion, aliphatic nitrile, aromatic nitrile, carbodiimide, aliphatic isonitrile, aromatic isonitrile, isocyanate, thiocyanate, aliphatic Thiocyanate, aromatic isothiocyanate, aliphatic nitro compound, aromatic nitro compound, nitroamine, nitrosamine, nitrate, nitrite, nitroso bond (aliphatic, aromatic) Group, monomer, dimer), sulfur compounds such as thiol or thiophenol or thiol acid, thiocarbonyl, hydrazine, hydrazine, sulfonium chloride, primary sulfonamide, secondary sulfonamide, sulfate, Carbon-halogen bond, Si-A ¹ bond (A ¹ is H, C, O or halogen), PA ² bond (A ² is H, C or O) or Ti-O bond.

Examples of the structure including the carbon-halogen bond include -CH ₂ Cl, -CH ₂ Br, -CH ₂ I, -CF ₂ -, -CF ₃ , -CH=CF ₂ , -CF=CF ₂ , Fluorinated aryl or aryl chloride.

Examples of the structure containing the Si—Al ¹ bond include SiH, SiH ₂ , SiH ₃ , Si—CH ₃ , Si—CH ₂ —, Si—C ₆ H ₅ , SiO—aliphatic, and Si—OCH _{3 .} , Si—OCH ₂ CH ₃ , Si—OC ₆ H ₅ , Si—O—Si, Si—OH, SiF, SiF ₂ or SiF ₃ . As the structure contains Si-A ^l bond, particularly preferably formed with a silicon or siloxane backbone sesquicarbonate silicon skeleton by alumoxane.

Examples of the structure including the PA ² bond include PH, PH ₂ , P-CH ₃ , P-CH ₂ -, PC ₆ H ₅ , and A ³ ₃ -PO (A ³ is an aliphatic group or an aromatic group). And (A ⁴ O) ₃ -PO (A ⁴ is an alkyl group), P-OCH ₃ , P-OCH ₂ CH ₃ , P-OC ₆ H ₅ , POP, P-OH or O=P-OH.

Examples of the compound containing a Ti-O bond include (i) titanium tetraisopropoxide, titanium tetra-n-butoxide, titanium (2-ethylhexyloxy) titanium or titanium isopropoxyoctene. a titanium alkoxide such as a glycolic acid ester; (ii) a chelated titanium such as diisopropoxy bis (acetyl acetonyl acetonate) titanium or propane dioxy titanium bis (ethyl acetonitrile acetate); (iii) iC ₃ H ₇ O-[-Ti(OiC ₃ H ₇ ) ₂ -O-] _n -iC ₃ H ₇ or nC ₄ H ₉ O-[-Ti(OnC ₄ H ₉ ) ₂ -O-] a titanium polymer of nnC ₄ H ₉ or the like; (iv) tri-n-butoxytitanium monostearate, titanium stearate, diisopropoxy titanium diisostearate or (2-n-butoxy) a titanium hydride such as carbonylbenzylideneoxy) tributoxytitanium; (v) a water-soluble titanium compound such as di-n-butoxy-bis(triethanolamine)titanium or the like. Among them, as the compound containing a Ti-O bond, more preferably di-n-butoxy-bis(triethanolamine)titanium (Ti(OC ₄ H ₉ ) ₂ [OC ₂ H ₄ N(C ₂ H ₄ OH)) ₂ ] ₂ ).

The above-described infrared absorbing structure depends on the type of the infrared ray, and absorbs infrared rays having a wavelength of a desired range. Specifically, the wavelength of the infrared ray which the infrared absorbing structure can absorb is, for example, in the range of 1 to 20 μm, and more preferably in the range of 2 to 15 μm. Further, when the above structure is a Si-O bond, a Si-C bond or a Ti-O bond, it is preferably in the range of 9 to 11 μm.

Further, the wavelength of the infrared ray which can be absorbed by each of the above structures can be easily understood as long as it is a person skilled in the art. For example, as an absorption band of each structure, reference can be made to the non-patent literature: SILVERSTEIN, BASSLER, and MORRILL. "Analysis by Spectra of Organic Compounds (5th Edition) - Combination of MS, IR, NMR, and UV-" (1992) The annual issue is recorded on pages 146 to 151.

The compound having a structure having an infrared absorbing property for use in the formation of the separation layer is not particularly limited as long as it is capable of being cured in a solvent having a structure as described above, and can be cured to form a cured layer. limited. However, in order to effect the deterioration of the compound in the separation layer, it is easy to separate the support substrate from the substrate, and it is preferred that the absorption of infrared rays in the separation layer is large, that is, the transmittance of infrared rays when the infrared rays are irradiated to the separation layer. low. Specifically, the transmittance of infrared rays in the separation layer is preferably less than 90%, and the transmittance of infrared rays is more preferably less than 80%.

・Infrared absorbing material The separation layer may also contain an infrared absorbing material. The infrared ray absorbing material may be deteriorated by absorbing light, and for example, carbon black, iron particles or aluminum particles can be suitably used. The infrared absorbing material absorbs light having a wavelength of an intrinsic range depending on the kind thereof. The infrared absorbing material can be appropriately deteriorated by irradiating light of a wavelength of the absorption range of the infrared absorbing material used in the separation layer to the separation layer.

- The reactive polysesquioxane separation layer can be formed by polymerizing a reactive polysesquioxane. The formed separation layer has high chemical resistance and high heat resistance.

The "reactive polysesquioxane" means a polysesquioxane having a sterol group at the terminal of the polysilsesquioxane skeleton or a functional group capable of forming a sterol group by hydrolysis. The sterol groups or functional groups capable of forming a sterol group can be condensed to each other. Further, as long as the reactive polysesquioxane has a sterol group or a functional group capable of forming a sterol group, reactivity of a sesquiterpene skeleton having a random structure, a cage structure, or a trapezoidal structure can be employed. Polysesquioxane.

The content of the oxime of the reactive polysesquioxane is preferably from 70 to 99 mol%, more preferably from 80 to 99 mol%. When the content of the oxoxane of the reactive polysesquioxane is within the above preferred range, it can be suitably deteriorated by irradiation with infrared rays (preferably, far infrared ray, more preferably light having a wavelength of 9 to 11 μm). Separation layer.

The weight average molecular weight (Mw) of the reactive polysesquioxane is preferably from 500 to 50,000, more preferably from 1,000 to 10,000. When the weight average molecular weight (Mw) of the reactive polysesquioxane is within the above preferred range, it can be suitably dissolved in a solvent, and can be suitably applied to a support plate.

A commercial product which can be used as a reactive polysesquioxane, for example, SR-13, SR-21, SR-23 or SR-33 (trade name) manufactured by Kosei Chemical Industry Co., Ltd., and the like.

・Resin component having a phenol skeleton The separation layer may also contain a resin component having a phenol skeleton. By having a phenol skeleton, it is easily deteriorated by oxidation or the like (oxidation or the like), and the photoreactivity is high. The term "having a phenol skeleton" as used herein means a structure containing a hydroxybenzene. The resin component having a phenol skeleton has a film forming ability, and the molecular weight is preferably 1,000 or more. Since the molecular weight of the resin component is 1000 or more, the film forming ability is increased. The molecular weight of the resin component is more preferably from 1,000 to 30,000, particularly preferably from 1,500 to 20,000, particularly preferably from 2,000 to 15,000. When the molecular weight of the resin component is at most the upper limit of the above preferred range, the solubility of the composition for forming a separation layer in a solvent can be improved. In addition, the molecular weight of the resin component is a weight average molecular weight (Mw) in terms of polystyrene measured by GPC (gel permeation chromatography).

Examples of the resin component having a phenol skeleton include a novolac type phenol resin, a soluble phenol resin, a hydroxystyrene resin, a hydroxyphenylsesquioxane resin, a hydroxybenzyl sesquiterpene oxide resin, and the like. An acrylic resin having a phenol skeleton, a resin having a repeating unit represented by the following formula (P2), and the like. Among these, a novolac type phenol resin and a soluble phenol resin.

<Next Layer> Next, the layer 3 is used to bond the layers of the support substrate 1 and the substrate 4, and can be formed using the composition for forming an adhesive layer of the above embodiment.

The thickness of the layer 3 is preferably in the range of, for example, 0.1 μm or more and 50 μm or less, more preferably in the range of 1 μm or more and 10 μm or less. When the thickness of the adhesive layer is in the range of 0.1 μm or more and 50 μm or less, the support base 1 and the substrate 4 can be bonded more favorably. Further, since the thickness of the adhesive layer is 1 μm or more, the substrate can be sufficiently fixed to the support substrate, and since the thickness of the adhesive layer is 10 μm or less, the adhesive layer can be easily removed in the subsequent removal step.

The support system with the adhesive layer of this embodiment can be manufactured by performing the operation of the [underlayer formation step] which will be described later in the same manner.

The support having the adhesive layer of the above-described embodiment is provided with an adhesive layer to which the composition for forming an adhesive layer of the above-described embodiment is applied, thereby improving heat resistance, and more preferably improving die bondability and cleaning removability.

(Continuous film) The adhesive film according to the fourth aspect of the present invention comprises: a film; and an adhesive layer formed on the film using the adhesive composition of the first or second aspect. By using the adhesive film, an adhesive layer can be suitably formed on the support. The adhesion layer having good film thickness uniformity and surface smoothness can be easily formed as compared with the case where the adhesive composition is directly applied to the support to form an adhesive layer.

As the film, for example, it is easy to peel off the adhesive layer formed on the film from the film, and a release film which can transfer the adhesive layer to the surface to be processed such as a support is preferable. Specific examples of the film include a synthetic resin film of polyethylene terephthalate, polyethylene, polypropylene, polycarbonate, or polyvinyl chloride, and a flexible film is preferable. For the above film, it is preferred to apply a release treatment as needed to facilitate transfer. The thickness of the film may be appropriately set, for example, 15 to 125 μm.

The adhesive film is produced by forming an adhesive layer on the film. For example, a method of applying an adhesive composition to a film so that the dried film thickness of the adhesive layer is 10 to 1000 μm can be used. At this time, a well-known method can be suitably used according to the film thickness or uniformity of the desired adhesive layer.

Further, the film can be protected by coating the exposed surface of the adhesive layer with a protective film. The protective film is not limited as long as it can be peeled off from the adhesive layer. For example, a polyethylene terephthalate film, a polypropylene film, or a polyethylene film is preferable. Further, in order to facilitate peeling from the adhesive layer, each of the protective films is preferably coated with polyfluorene or burned.

Next, when the protective film is used, for example, after peeling off, the exposed adhesive layer is superposed on the support surface, and is formed from the film (the back surface on which the adhesive layer is formed). The method in which the heating roller is moved to thermally bond the bonding layer to the surface of the support. Further, the protective film peeled off from the film can be reused if it is wound into a roll shape on a roll such as a take-up roll in this order.

(Laminate) The laminate system according to the fifth aspect of the present invention has a support and a substrate bonded to each other via an adhesive layer. As shown in FIG. 1 , the laminate 10 of the present embodiment has a support 12 and a substrate 4 bonded to each other via an adhesive layer 3 , that is, a support 123 with an adhesive layer and a support having an adhesive layer attached thereto. The substrate 4 disposed on the surface 3s of the adhesive layer 3 on the side opposite to the side of the support 12 is provided in 123.

The support 12 is laminated with the support base 1 and the separation layer 2, and the description thereof is the same as that described in the above <Support>. The description of the subsequent layer 3 is the same as that described in the above <layer>.

<Substrate> The substrate 4 is a program for being thinned, mounted, or the like in a state supported by the support substrate 1. On the substrate 4, for example, a structure such as an integrated circuit or a metal bump is attached. As the substrate 4, a tantalum wafer substrate is typically used, but is not limited thereto, and a ceramic substrate, a thin film substrate, a flexible substrate, or the like may be used.

In the present embodiment, the element is a semiconductor element or other element, and may have a single layer or a plurality of layers. Further, when the element is a semiconductor element, the electronic component obtained by cutting the sealing substrate becomes a semiconductor device.

In the laminate of the above-described embodiment, the adhesive layer to which the composition for forming an adhesive layer of the above embodiment is applied is provided, and the heat resistance is higher. Therefore, in the laminate of the present embodiment, the positional displacement of the substrate after the sealing operation is less likely to occur due to the influence of the high temperature treatment during the manufacture of the semiconductor package.

Further, in the laminate of the present embodiment, the substrate (bare wafer) is fixed to the formed underlayer with sufficient strength (good grain bonding property). Further, in the laminate of the present embodiment, the subsequent layer has high solubility in a hydrocarbon-based solvent. Thereby, the adhesive layer can be easily removed from the substrate during the manufacture of the semiconductor package.

In the laminate of the above embodiment, the support base 1 and the separation layer 2 are adjacent to each other. However, the present invention is not limited thereto, and another layer may be further formed between the support base 1 and the separation layer 2. At this time, the other layers may be composed of a material that transmits light. Therefore, it is possible to appropriately add a layer having a preferable property or the like to the laminate 10 without hindering the incidence of light on the separation layer 2. The wavelength of light available varies depending on the kind of material constituting the separation layer 2. Therefore, the material constituting the other layer does not have to penetrate all of the wavelength light, and can be suitably selected from materials that penetrate light of a wavelength at which the material constituting the separation layer 2 is deteriorated.

(Manufacturing Method of Laminate) The sixth aspect of the present invention has a method of producing a laminate in which a support and a substrate are bonded via an adhesive layer, and has an adhesive layer forming step and a bonding step.

<First Embodiment> A method for producing a laminate according to the first embodiment includes a step of producing a support, a step of forming a subsequent layer, and a step of bonding. Fig. 2 is a schematic flow chart showing an embodiment of a method for producing a laminate. Fig. 2(a) is a view illustrating a step of fabricating a support, Fig. 2(b) is a view illustrating a step of forming an adhesive layer, and Fig. 2(c) is a view illustrating a bonding step. In the method for producing a laminate of the present embodiment, a composition containing a fluorocarbon is used as a composition for forming a separation layer. Moreover, as the composition for forming an adhesive layer, those containing the (P1) component and the (P2) component of the above embodiment are used.

[Step of Producing Support] The step of producing a support in the embodiment is a step of forming a separation layer using a composition for forming a separation layer to form a support, using one of the support substrates. In Fig. 2(a), on the support substrate 1, a separation layer 2 (i.e., a support substrate with a separation layer) is formed by using a composition for forming a separation layer (containing fluorocarbon).

The method of forming the separation layer 2 on the support substrate 1 is not particularly limited, and examples thereof include a method such as spin coating, dipping, roll knives, spray coating, slit coating, and chemical vapor deposition (CVD). For example, in the step of producing a support, the solvent component is removed from the coating layer of the separation layer forming composition coated on the support substrate 1 in a heating environment or a reduced pressure environment, or in a support substrate. On the first, a film was formed by a vapor deposition method to obtain a support.

[Next Layer Formation Step] The step of forming the adhesive layer in the embodiment is a step of forming an adhesive layer using one of the support layers of the above-described embodiment. In Fig. 2(b), on the side of the separation layer 2 side of the support 12, the adhesive layer 3 is formed using the composition for forming an adhesive layer of the above-described embodiment (that is, the support 123 having the adhesive layer is formed).

The method of forming the adhesive layer 3 on the support 12 is not particularly limited, and examples thereof include a method such as spin coating, dipping, roll knives, spray coating, and slit coating. Then, the adhesive composition is applied to the support 12 by heating, or the solvent component contained in the adhesive composition is removed under a reduced pressure atmosphere.

Then, when the adhesive layer contains a curable monomer and a thermal polymerization initiator, it is preferred to polymerize the curable monomer by heating. The condition for heating the subsequent layer 3 may be appropriately set as long as it is based on a one-minute half-life temperature and a one-hour half-life temperature of the thermal polymerization initiator, and is preferably, for example, a temperature in the range of from 50 to 300 ° C under vacuum or nitrogen. It is carried out under an inert gas atmosphere, preferably under an inert gas atmosphere.

Further, when the adhesive layer contains a curable monomer and a photopolymerization initiator, it is preferred to polymerize the curable monomer by exposure to an inert gas atmosphere such as nitrogen. The conditions of the exposure may be appropriately set in accordance with the type of the photopolymerization initiator or the like.

[Coating Step] The bonding step in the embodiment is a step of bonding the support and the substrate via the adhesive layer formed in the subsequent layer forming step. As described above, when the separation layer 2 is provided on the support base 1, the bonding system bonds the support 12 and the substrate 4 while the separation layer 2 and the adhesion layer 3 face each other. In FIG. 2(c), the support substrate 1 (support 12) on which the separation layer 2 is formed and the substrate 4 on which the separation layer 2 is not formed are laminated via the adhesion layer 3, and the support substrate 1 and the separation layer 2 are obtained. Then, the laminate 10 in which the layer 3 and the substrate 4 are stacked in this order.

By bonding the support 12 and the substrate 4 via the adhesive layer 3, the substrate 4 is placed at a predetermined position on the adhesive layer 3, and heated by vacuum (for example, at about 100 ° C) while being bonded by a die. The pressure is applied to the support 12 and the substrate 4 by a machine or the like.

According to the method for producing a laminate according to the first embodiment, the adhesive layer is provided by using the composition for forming an adhesive layer of the above-described embodiment, and the heat resistance is higher. For example, it is difficult to cause a positional shift of the substrate after the sealing operation. Further, the substrate (bare wafer) is fixed to the formed underlayer with sufficient strength (good grain bonding property).

In the method for producing a laminate according to the above-described embodiment, the separation layer 2 is formed on the support substrate 1. However, the separation layer 2 may be formed on the substrate 4 without being limited thereto. In the method for producing a laminate according to the above-described embodiment, the adhesive layer 3 is formed on the separation layer 2. However, the laminate 3 is not limited thereto, and the adhesive layer 3 may be formed on the substrate 4. Further, the separation layer 2 may be formed on both the support substrate 1 and the substrate 4. At this time, the support substrate 1 and the substrate 4 are bonded to each other via the separation layer 2, the subsequent layer 3, and the separation layer 2.

<Second Embodiment> Fig. 3 is a schematic view showing another embodiment of a method for producing a laminate. Fig. 3(a) is a view showing a laminate produced by the production method of the first embodiment, and Fig. 3(b) is a view showing a sealing step. The method for producing the laminate according to the other embodiment is further provided with a sealing step in addition to the step of producing a support, the subsequent layer forming step, and the bonding step.

[Sealing Step] The sealing step in the embodiment is a step of producing a sealing body by sealing the substrate to which the support layer is bonded via the sealing layer after the bonding step. In FIG. 3(b), a sealing body 20 (laminate) in which the entire substrate 4 disposed on the adhesive layer 3 is sealed via a sealing material is obtained.

In the sealing step, for example, the sealing material heated to 130 to 170 ° C is supplied to the adhesive layer 4 while maintaining the high viscosity, and is formed on the adhesive layer 3 by compression molding. The sealing body 20 (laminate) of the sealing material layer 5 is provided. At this time, the temperature condition is, for example, 130 to 170 °C. The pressure applied to the substrate 4 is, for example, 50 to 500 N/cm ² .

For the sealing material, for example, a composition containing an epoxy resin or a polyoxymethylene resin can be used. The sealing material layer 5 is preferably provided not on each of the substrates 4 but in such a manner as to cover all of the substrates 4 on the adhesive layer 3.

According to the method for producing a laminate according to the second embodiment, the adhesive layer is provided by using the composition for forming an adhesive layer of the above-described embodiment, and the heat resistance is higher. For example, it is difficult to cause a positional shift of the substrate after the sealing operation.

<Third Embodiment> Fig. 4 is a schematic view showing another embodiment of a method for producing a laminate. Fig. 4(a) is a view showing a sealing body produced by the manufacturing method of the second embodiment, Fig. 4(b) is a view showing a grinding step, and Fig. 4(c) is a view showing a rewiring forming step. In the method for producing a laminate according to another embodiment, in addition to the step of producing a support, the subsequent layer forming step, the bonding step, and the sealing step, a grinding step and a rewiring forming step are further provided.

[Rying Step] The grinding step in the embodiment is a grinding step of grinding the sealing material portion (sealing material layer 5) in the sealing body 20 after the sealing step, so that one portion of the substrate 4 is exposed. Grinding of the sealing material portion is performed, for example, as shown in Fig. 4(b), by grinding the sealing material layer 5 until it is almost the same thickness as the substrate 4.

[Rewiring Forming Step] The rewiring forming step in the embodiment is a step of forming the rewiring layer 6 on the exposed substrate 4 after the grinding step. The rewiring layer is also called RDL (Redistribution Layer), and may have a single layer or a plurality of layers for the wiring body constituting the thin film of the wiring of the connection element. For example, the rewiring layer can be formed on a dielectric (photosensitive resin such as yttria (SiO _x ) or photosensitive epoxy resin) by a conductor (aluminum, copper, titanium, nickel, gold, silver, etc.) The metal and the alloy such as silver-tin alloy are formed by wiring, but are not limited thereto.

As a method of forming the rewiring layer 6, the first dielectric layer is formed a silicon oxide (SiO _x), the photosensitive resin layer 5 on the sealing member. The dielectric layer formed of ruthenium oxide can be formed, for example, by a sputtering method, a vacuum deposition method, or the like. The dielectric layer formed of the photosensitive resin can be formed by applying a photosensitive resin to the sealing material layer 5 by, for example, spin coating, dipping, roll knives, spray coating, or slit coating.

Next, wiring is formed on the dielectric layer by a conductor such as a metal. As a method of forming the wiring, for example, a well-known semiconductor processing method such as lithography or etching treatment such as photolithography (resistance lithography) can be used. Examples of such lithography include lithography using a positive resist material and lithography using a negative resist material.

In the lithography process, the etching process, etc., the sealing body 20 (laminate) is exposed to an acid such as hydrofluoric acid, an alkali such as tetramethylammonium hydroxide (TMAH), or a resist for a dissolved resist material. In the solvent, it is simultaneously treated at high temperature. However, the adhesive layer is formed by using the composition for forming an adhesive layer of the above embodiment, and the adhesive layer has high heat resistance. Therefore, the rewiring layer 6 can be suitably formed on the sealing material layer 5.

According to the method for producing a laminate according to the third embodiment, the layer of the support substrate 1, the separation layer 2, the adhesive layer 3, and the sealing material layer 5 covering the substrate 4 and the rewiring layer 6 can be stably laminated. Fit 30. The laminate 30 is a laminate produced in a process based on a fan-out type technique in which a terminal provided on a substrate 4 is mounted on a rewiring layer 6 extending outside the wafer region.

In the method for producing a laminate of the present embodiment, the formation of bumps or the mounting of components can be further performed on the rewiring layer 6. The mounting of the element on the rewiring layer 6 can be performed, for example, using a wafer mounter or the like.

(Manufacturing Method of Electronic Component) The method for producing an electronic component according to the sixth aspect of the present invention has a separating step and a removing step after obtaining a laminate by the method for producing a laminate of the fifth aspect.

Fig. 5 is a schematic view showing an embodiment of a method of manufacturing a semiconductor package (electronic component). Fig. 5 (a) is a view showing a laminate produced by the production method of the third embodiment, Fig. 5 (b) is a view illustrating a separation step, and Fig. 5 (c) is a view illustrating a removal step.

[Separation Step] In the separation step in the embodiment, the support layer 1 is irradiated with light (arrow) to the separation layer 2 to degrade the separation layer 2, and the support substrate is separated from the substrate 4 provided in the laminate 30. Step 1 of 1.

As shown in FIG. 5(a), in the separation step, light (arrow) is irradiated to the separation layer 2 via the support substrate 1, and the separation layer 2 is deteriorated. The wavelength which can deteriorate the separation layer 2 is, for example, a range of 600 nm or less. The type and wavelength of the light to be irradiated may be appropriately selected in accordance with the permeability of the support substrate 1 and the material of the separation layer 2, and for example, a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, or an LD laser may be used. Liquid lasers such as solid lasers such as shots and fiber lasers, liquid lasers such as laser lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers, semiconductor lasers, and free Laser light, non-laser light such as an electron laser. Thereby, the separation layer 2 is deteriorated, and the support substrate 1 and the substrate 4 can be easily separated.

When the laser beam is irradiated, the following conditions are exemplified as an example of the laser light irradiation condition. The average output value of the laser light is preferably 1.0 w or more and 5.0 W or less, more preferably 3.0 W or more and 4.0 W or less. The repetition frequency of the laser light is preferably 20 kHz or more and 60 kHz or less, more preferably 30 kHz or more and 50 kHz or less. The scanning speed of the laser light is preferably 100 mm/s or more and 10000 mm/s or less.

After the light (arrow) is irradiated onto the separation layer 2 to deteriorate the separation layer 2, the support substrate 1 is separated from the substrate 4 as shown in FIG. 5(b). For example, the support substrate 1 and the substrate 4 are separated by applying a force in a direction in which the support substrate 1 and the substrate 4 are separated from each other. Specifically, in a state in which one of the support base 1 or the substrate 4 side (rewiring layer 6) is fixed to the stage, the other side is adsorbed and held by a separating plate having a suction pad such as a bellows pad. Lifting, the support substrate 1 and the substrate 4 can be separated by this. The force applied to the laminate 30 is not particularly limited as long as it is appropriately adjusted according to the size of the laminate 30. For example, if the laminate has a diameter of about 300 mm, a force of about 0.1 to 5 kgf (0.98 to 49 N) is applied. The support substrate 1 and the substrate 4 can be suitably separated.

[Removal Step] The removal step in the embodiment is a step of removing the adhesion layer 3 attached to the substrate 4 after the separation step. In FIG. 5(b), after the separation step, the subsequent layer 3 and the separation layer 2 are attached to the substrate 4. In the present embodiment, in the removing step, the electronic component 40 is obtained by removing the adhesive layer 3 and the separation layer 2 adhering to the substrate 4.

As a method of removing the adhesion layer 3 or the like adhering to the substrate 4, for example, a method of removing the residue of the adhesion layer 3 and the separation layer 2 using a cleaning liquid can be mentioned. In the washing liquid, a washing liquid containing an organic solvent is suitably used. As the organic solvent in the cleaning liquid, it is preferred to use an organic solvent blended in the composition for forming a separation layer and a solvent component to be blended in the composition for forming a layer. The use of the adhesive layer formed of the composition for forming an adhesive layer of the above embodiment improves the solubility in a hydrocarbon solvent. Therefore, in the embodiment, the cleaning property of the adhesive layer is good.

In the method of manufacturing the electronic component of the present embodiment, after the above-described removal step, the electronic component 40 may be further subjected to processing such as solder ball formation, dicing, or oxide film formation. [Examples]

Hereinafter, the present invention will be described in more detail by way of examples, but the invention is not limited by the examples.

<Preparation of the composition of the adhesive agent> (Examples 1 to 10, Comparative Examples 1 to 6) The respective components shown in Tables 1 to 3 were mixed and dissolved, and the adhesive composition of each example was prepared (resin component concentration: 20% by mass) ).

In Tables 1 to 3, each abbreviation symbol has the following meaning. The value in [ ] is the blending amount (parts by mass). In addition, the glass transition temperature (°C) of the resin component shown below is based on the use of a dynamic viscoelasticity measuring apparatus Rheogel-E4000 (manufactured by UBM Co., Ltd.), and the temperature is raised at 5 ° C/min under the condition of a frequency of 1 Hz. The speed was determined by changing the viscoelasticity measured from 25 ° C to 300 ° C.

(P1)-1: Septon 8004 (trade name), company KURARAY. The styrene content is 31% by mass, the weight average molecular weight is 98,000, and the hydrocarbon resin having a plurality of constituent units represented by the following chemical formula (P1)-1.

(P1)-2: Tuftec H1051 (trade name), manufactured by Asahi Kasei Corporation. The styrene content was 42% by mass, the ethylene/butene content was 58% by mass, the weight average molecular weight was 78,000, and the hydrogenated styrene-based thermoplastic elastomer was used.

(P1)-3: Septon 2002 (trade name), company KURARAY. The styrene content is 30% by mass, the weight average molecular weight is 54,000, and the hydrocarbon resin having a plurality of constituent units represented by the following chemical formula (P1)-3.

(P1)-4: APL8008T (trade name), manufactured by Mitsui Chemicals, Inc. The glass transition temperature was 70 ° C, and the weight average molecular weight was 100,000; the hydrocarbon resin represented by the following chemical formula (P1)-4 (m: n = 80:20 (mole ratio)).

(P1)-5: TOPAS8007 (trade name), manufactured by POLYPLASTICS Co., Ltd. The glass transition temperature was 65 ° C, and the weight average molecular weight was 95,000; a hydrocarbon resin represented by the following chemical formula (P1)-5 (m: n = 35: 65 (mole ratio)).

(P2)-1: PRZ-10014 (trade name), manufactured by SUMITOMO BAKELITE Co., Ltd. The glass transition temperature was 224 ° C, and the weight average molecular weight was 8,700; the resin represented by the following chemical formula (P2)-1 (m: n = 65:35 (mole ratio)).

(P3)-1: glass transition temperature 84 ° C, weight average molecular weight 9800; adamantyl methacrylate (AdMA) unit / stearyl methacrylate (STMA) unit / styrene (Sty) unit = 60 / 20 / 20 (mass ratio) copolymer.

A-DCP: tricyclodecane dimethanol diacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd.; a polyfunctional hardening monomer represented by the following chemical formula.

(lb)-1: polymerization inhibitor, IRGANOX 1010 (trade name), manufactured by BASF Corporation. Pentaerythritol oxime [3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate]; a compound represented by the following chemical formula.

(Ia)-1: Thermal polymerization initiator, Percumyl D (trade name), manufactured by Nippon Oil Co., Ltd. Bis(1-methyl-1-phenylethyl) peroxide; a compound represented by the following chemical formula.

<Next layer forming step> On a glass supporting substrate (size: 10 cm ́10 cm, thickness: 700 μm), at a flow rate of 400 sccm, a pressure of 700 mTorr, a high-frequency power of 2,500 W, and a film formation temperature of 240 ° C, by using C ₄ F ₈ as A fluorocarbon film (thickness: 1 μm) as a separation layer was formed by a CVD method of a reaction gas to prepare a support.

Next, each of the adhesive compositions of the respective examples was applied to the separation layer formed on the glass supporting substrate by spin coating at 1,500 rpm while rotating. Subsequently, the support coated with the adhesive composition of each example was separately heated at 160 ° C for 4 minutes to form an adhesive layer having a thickness of 5 μm.

<Evaluation> The pressure-sensitive adhesive layer test was carried out on the adhesive layer formed in the above-mentioned <adhesion layer forming step>, and the heat resistance was evaluated. Further, the measurement of the complex elastic modulus at the time of heat, the die bonding test, and the evaluation of the cleaning removability were carried out. The results of these are shown in Tables 4, 5 and 6.

[Compression Molding Test] A substrate (bare wafer) is placed at a predetermined position of the subsequent layer formed by the above-mentioned <sublayer forming step>, and the support and the substrate are bonded together (bonding step). Then, the substrate is bonded to the substrate via the adhesive layer via the sealing layer, and a sealing body is produced (sealing step). The sealing body produced here was measured for the positional shift (displacement amount) of the bare wafer before sealing and after sealing, and the heat resistance was evaluated. Specifically, it is performed as follows.

The positional shift (displacement amount) of the bare wafer was measured using a die bonder (manufactured by TRESKY Co., Ltd.). First, the stage of the die bonder is heated to 50 ° C and the head is heated to 100 ° C, and the substrate (bare wafer) (5 mm ́5 mm ́ 0.7 mm) is crimped to the adhesive layer at a pressure of 35 N for 1 second. on.

FIG. 6 shows a laminate 10 in which a support 12 and a substrate 4 (bare wafer) are bonded via an adhesive layer 3. In FIG. 6, the laminated body 10 is slightly rectangular in plan view, and the substrate 4 is disposed in the vicinity of four vertices on the diagonal line in the rectangular shape and the four corner end portions and the central portion on the adhesive layer 3 near the center of gravity. Bare wafer). Further, in the laminated body 10 in plan view, the horizontal direction is the X direction and the vertical direction is the Y direction.

Next, the laminate 10 was heated at 200 ° C for 1 hour under a nitrogen atmosphere. After heating, the laminate 10 was placed on a stage heated to 50 °C. Subsequently, 12 g of a sealing material containing an epoxy resin was applied onto the substrate 4 (bare wafer) at the center of the laminate 10 placed on the stage. Next, the laminate 10 was pressed by a pressing device (300 mmf) heated to 130 ° C under reduced pressure conditions lower than 10 Pa, and a force of 10 tons was applied to the laminate 10 while the laminate 10 was pressed. The sealing material was expanded to cover the entire four corners and the central portion of the substrate 4 (bare wafer), and was compressed for 5 minutes (sealing step). Thereby, a sealed body in which the bare wafer is sealed via the sealing material is obtained.

The obtained sealing body was observed from the side of the support 1 (glass supporting substrate surface) using an optical microscope, and the positional shift (displacement amount) of the bare wafer before sealing and after sealing was measured. As shown in FIG. 6, after the sealing is performed, the sum of the moving distance in the X direction and the moving distance in the Y direction of each of the substrates 4 (bare wafers) disposed on the layer 3 from the position before sealing is used as each substrate. 4 (bare wafer) moving distance. Next, the average value of the moving distance of the substrate 4 (bare wafer) was obtained, and this was used as an evaluation value of the moving distance. Then, heat resistance was evaluated in accordance with the evaluation criteria shown below. The lower the evaluation value of this moving distance, the higher the heat resistance. Evaluation criteria ○: The evaluation value of the moving distance of the substrate 4 (bare wafer) is 10 μm or less × The evaluation value of the moving distance of the substrate 4 (bare wafer) exceeds 10 μm.

[Measurement of complex elastic modulus] For each of the adhesive compositions of the examples, a dynamic viscoelasticity measuring device (Rheogel-E4000, manufactured by UBM Co., Ltd.) was used to measure the complex elastic modulus E at 50 ° C and 150 ° C, respectively. *. First, the adhesive composition was applied onto a PET film with a release agent, and heated at 50 ° C and 150 ° C for 60 minutes in an oven under atmospheric pressure to form an adhesive layer (thickness 0.5 mm). Next, the complex elastic modulus E* of the adhesive layer peeled off from the PET film was measured using the dynamic viscoelasticity measuring apparatus described above. The measurement conditions were as follows: the sample shape was 20 mm ́5 mm ́ thickness 0.5 mm, and the temperature was raised from room temperature to 215 ° C under the tensile condition of 1 Hz, and the temperature was raised at a temperature of 5 ° C / min. The measurement was carried out at 50 ° C and 150 ° C. Complex elastic modulus. If the complex elastic modulus E* ₅₀ at 50 ° C is less than 1.0 ^{́10 9} Pa, it can be said that the substrate has good adhesion to the support. When the complex elastic modulus E* ₁₅₀ at 150 ° C exceeds 3.0 ^{́10 6} Pa, it can be said that the heat resistance of the adhesive layer is high. Further, in Tables 4 to 6, the measurement results of the complex elastic modulus E* ₅₀ and the complex elastic modulus E* ₁₅₀ and the ratio of E* ₅₀ /E* ₁₅₀ are described.

[Grain Bonding Test] A substrate (bare wafer) is placed at a predetermined position of the subsequent layer formed in the above-mentioned <sublayer forming step>, and the support and the substrate are bonded together (bonding step). Specifically, the stage of the die bonder (TRESKY) was heated to 23 ° C and the head was heated to 100 ° C, and the substrate (bare wafer) was taken at a pressure of 35 N for 1 second (5 mm ́5 mm ́0.7). Mm) is crimped onto the adhesive layer. Then, the subsequent state of the substrate (bare wafer) with respect to the bonding layer was evaluated in accordance with the evaluation criteria shown below. Evaluation criteria ○: The substrate (bare wafer) was fixed to the adhesive layer with sufficient strength. X: When a force is applied, the substrate (bare wafer) is easily peeled off from the adhesive layer.

[Evaluation of Washing Removability] The sealed body obtained in the above sealing step was irradiated with laser light having a wavelength of 532 nm from the glass supporting substrate side toward the separation layer (fluorocarbon film). Thereby, the separation layer is deteriorated, and the glass supporting substrate is separated from the substrate (bare wafer) provided in the sealing body to obtain a sealing substrate in which the subsequent layer is exposed (separation step). Next, the obtained sealing substrate was subjected to spray cleaning using pentamidine as a cleaning liquid for 5 minutes to remove the adhesion layer adhering to the substrate (bare wafer) (removal step). Then, the washing removability was evaluated in accordance with the evaluation criteria shown below. Evaluation criteria ○: After the spray was washed, the residue of the adhesive layer was not observed on the sealing substrate. ×: After the spray was washed, the residue of the adhesive layer was observed on the sealing substrate.

From the results shown in Tables 4 to 6, it was confirmed that the adhesive compositions of Examples 1 to 10 were excellent in compression molding test, that is, heat resistance, as compared with the adhesive compositions of Comparative Examples 1 to 6. The taller.

1‧‧‧Support matrix

2‧‧‧Separation layer

3‧‧‧Next layer

4‧‧‧Substrate

5‧‧‧ Sealing layer

6‧‧‧Rewiring layer

10‧‧‧Layer

12‧‧‧Support

20‧‧‧ Sealing body

30‧‧‧Layer

40‧‧‧Electronic parts

123‧‧‧Support with an adhesive layer

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an embodiment of a laminate to which the present invention is applied. Fig. 2 is a schematic flow chart showing an embodiment of a method for producing a laminate. Fig. 2(a) is a view illustrating a step of fabricating a support, Fig. 2(b) is a view illustrating a step of forming an adhesive layer, and Fig. 2(c) is a view illustrating a bonding step. Fig. 3 is a schematic view showing another embodiment of a method for producing a laminate. Fig. 3(a) is a view showing a laminate produced by the production method of the first embodiment, and Fig. 3(b) is a view showing a sealing step. Fig. 4 is a schematic view showing another embodiment of a method for producing a laminate. Fig. 4(a) is a view showing a sealing body produced by the manufacturing method of the second embodiment, Fig. 4(b) is a view showing a grinding step, and Fig. 4(c) is a view showing a rewiring forming step. Fig. 5 is a schematic view showing an embodiment of a method of manufacturing a semiconductor package (electronic component). Fig. 5 (a) is a view showing a laminate produced by the production method of the third embodiment, Fig. 5 (b) is a view illustrating a separation step, and Fig. 5 (c) is a view illustrating a removal step. Fig. 6 is a plan view showing a laminate 10 in which a support 1 and a substrate 4 (bare wafer) are bonded via an adhesive layer 3.

Claims (27)

An adhesive composition comprising a binder composition for a support and a substrate, comprising the following as a resin component (P), a hydrocarbon resin (P1), and a resin having a glass transition temperature of 180 ° C or higher (P2) (However, the aforementioned hydrocarbon resin (P1) is not included). The adhesive composition of claim 1, wherein the aforementioned resin (P2) has a constituent unit (u21) derived from a monomer comprising a maleineimine skeleton. The adhesive composition of claim 2, wherein the constituent unit (u21) is a constituent unit represented by the following formula (p2-1); [wherein, R ^u10 represents an organic group having 1 to 30 carbon atoms]. The adhesive composition of claim 2 or 3, wherein the aforementioned resin (P2) further has a constituent unit (u22) derived from a cyclic olefin. The composition of the adhesive of claim 4, wherein the constituent unit (u22) is a constituent unit represented by the following formula (p2-2); [wherein, R ^u11 to R ^u14 each independently represent an organic group or a hydrogen atom having 1 to 30 carbon atoms; and n is an integer of 0 to 2]. The adhesive composition according to any one of claims 1 to 3, wherein the content of the resin (P2) is 5 to 75 parts by mass based on 100 parts by mass of the hydrocarbon resin (P1). An adhesive composition which bonds an adhesive composition for a support and a substrate, wherein the adhesive composition contains at least a hydrocarbon resin (P1) as a resin component (P), and 20 mm ́5 mm from the adhesive composition. The test piece having a thickness of 0.5 mm satisfies the following two conditions when the test piece is delivered to the dynamic viscoelasticity under the conditions of a tensile condition of 1 Hz and from room temperature to 215 ° C at a temperature of 5 ° C / min. The main reason is that the complex elastic modulus E* ₅₀ at 50 ° C is less than 1.0 ^{́10 9} Pa, and the complex elastic modulus E* ₁₅₀ at 150 ° C exceeds 3.0 ^{́10 6} Pa. The adhesive composition of claim 7 further satisfies the requirement that the ratio of E* ₅₀ /E* ₁₅₀ is 2000 or less. The adhesive composition of claim 7 or 8, wherein the aforementioned adhesive composition comprises a component having a constituent unit (u21) derived from a monomer comprising a maleineimine skeleton. The adhesive composition of claim 9, wherein the constituent unit (u21) is a constituent unit represented by the following formula (p2-1); [wherein, R ^u10 represents an organic group having 1 to 30 carbon atoms]. The adhesive composition according to any one of claims 1 to 3, wherein the hydrocarbon resin (P1) is at least one selected from the group consisting of an elastomer and a cycloolefin polymer. The adhesive composition according to any one of claims 1 to 3, 7 and 8, which further contains a polyfunctional hardening monomer. The adhesive composition of claim 12, wherein the polyfunctional hardening monomer comprises a polycyclic aliphatic structure. The adhesive composition of claim 12 or 13, wherein the content of the polyfunctional hardenable monomer is from 5 to 40% by mass based on 100% by mass of the total of the resin component (P). The adhesive composition according to any one of claims 1 to 3, 7 and 8, which further contains a polymerization inhibitor. The adhesive composition of claim 12, which further comprises a thermal polymerization initiator. The adhesive composition according to any one of claims 1 to 3, 7 and 8, which further contains a hydrocarbon solvent. A support having an adhesive layer, comprising: a support body to which a substrate is bonded, and an adhesive layer formed of the adhesive composition according to any one of claims 1 to 17 on the support. The support body of claim 18, wherein the support body includes a support substrate that transmits light and a separation layer provided on the support substrate, and the separation layer is adjacent to the adhesive layer, and is irradiated by light. The layer of the support substrate can be separated from the substrate bonded to the support by deterioration. An adhesive film comprising: a film, and an adhesive layer formed on the film, using the adhesive composition according to any one of claims 1 to 17. A laminate in which a laminate of a support and a substrate is bonded via an adhesive layer, and the adhesive layer is a layer formed by using the adhesive composition according to any one of claims 1 to 17. A laminate comprising: a support having an adhesive layer attached to claim 18 or 19, and a surface of the adhesive layer provided on the support layer with the adhesive layer disposed on a side opposite to the support side Substrate. A method for producing a laminate, which comprises a method of laminating a laminate of a support and a substrate via an adhesive layer, comprising: at least one of the support or the substrate, as claimed in claims 1 to 17 The adhesive composition of any one of the layers forms the adhesive layer forming step of the adhesive layer, and the bonding step of the support and the substrate is bonded to the adhesive layer formed by the adhesive layer forming step. The method for producing a laminate according to claim 23, wherein after the bonding step, the substrate is bonded to the substrate via the sealing layer and bonded to the support via the sealing member to form a seal of the sealing body. step. The method of manufacturing the laminate of claim 24, further comprising: a grinding step of grinding the sealing material portion of the sealing body after the sealing step to expose a portion of the substrate, and after the grinding step, A rewiring forming step of rewiring is formed on the exposed substrate. The method for producing a laminate according to any one of claims 23 to 25, further comprising a step of forming a support layer which is modified by irradiation of light on at least one surface of the support substrate that penetrates the light, and the step of producing the support In the bonding step, the support and the substrate are bonded together while the separation layer and the adhesive layer face each other. A method for producing an electronic component, comprising: obtaining a laminate by the method for producing a laminate according to claim 26, comprising: irradiating light to the separation layer via the support substrate, and deforming the separation layer And a step of separating the support substrate from the substrate provided in the laminate, and removing the adhesion layer attached to the substrate after the separating step.