KR102379254B1 - Adhesive composition, support with adhesive layer, adhesive film, laminate and method of manufacturing the same, and method of manufacturing electronic component - Google Patents

Abstract

(Project) An adhesive composition for bonding a support and a substrate, an adhesive composition capable of forming an adhesive layer with higher heat resistance, a support with an adhesive layer using the same, an adhesive film, a laminate and a manufacturing method thereof, and a manufacturing method of an electronic component provides
(Solution) An adhesive composition for bonding the support 12 and the substrate 4, the hydrocarbon resin (P1) and the resin (P2) having a glass transition temperature of 180°C or higher (with the exception of the hydrocarbon resin (P1) Adhesive composition containing as a resin component (P) is employ|adopted.

Description

Adhesive composition, adhesive layer-formed support, adhesive film, laminate and manufacturing method thereof, and manufacturing method of electronic component }

The present invention relates to an adhesive composition, a support having an adhesive layer formed thereon, an adhesive film, a laminate and a manufacturing method thereof, and a manufacturing method of an electronic component.

BACKGROUND ART A semiconductor package (electronic component) including a semiconductor element has various forms depending on a corresponding size, and includes, for example, Wafer Level Capacitance (WLP), Panel Level Capacitance (PLP), and the like.

As a technique of a semiconductor package, a fan doll technique and a fan-out type technique are mentioned. As a semiconductor package by a fan dolling technology, the fan doll WLP (Fan-in Wafer Level Capking) etc. which rearrange the terminal at the end of a bare chip in a chip area are known. As a semiconductor package by a fan-out type|mold technology, the fan-out type WLP (Fan-out Wafer Level Panel) etc. which rearrange the terminal outside a chip area are known.

Recently, in particular, a fan-out type technology has been applied to a fan-out type PLP (Fan-out Panel Level Capacitance) that arranges and packages semiconductor devices on a panel, etc., in a semiconductor package, for higher integration, thinner and It is attracting attention as a method that can realize miniaturization and the like.

In order to achieve size reduction of a semiconductor package, it becomes important to make the thickness of the board|substrate in a mounted element thin. However, when the thickness of the substrate is reduced, the strength thereof is lowered and the substrate is easily damaged during semiconductor package manufacturing. On the other hand, the laminated body which bonded the support body to the board|substrate is employ|adopted.

Here, when bonding a board|substrate and a support body together, the adhesive agent containing the polymer which has a cycloolefin structure from the point excellent in the light transmittance|permeability conventionally is widely used.

Patent Document 1 discloses an adhesive composition containing a polymer having a cycloolefin structure and a (meth)acrylate monomer compatible with the polymer.

Japanese Patent Laid-Open No. 2014-105316

By the way, at the time of semiconductor package manufacture, after bonding a board|substrate and a support body together with an adhesive agent, high temperature processing, such as sealing, thin film formation, and baking, is performed.

And when a board|substrate and a support body are bonded together with the adhesive agent of patent document 1, there existed a problem, such as raise|generating the position shift of a board|substrate before and behind sealing operation, for example under the influence of said high temperature process.

The present invention has been made in view of the above circumstances, and as an adhesive composition for bonding a support and a substrate, an adhesive composition capable of forming an adhesive layer with higher heat resistance, a support with an adhesive layer using the same, an adhesive film, a laminate and the same It is an object to provide a manufacturing method and a manufacturing method of an electronic component.

In order to solve the said subject, this invention employ|adopted the following structures.

That is, the first aspect of the present invention is an adhesive composition for bonding a support and a substrate, wherein the hydrocarbon resin (P1) and the resin (P2) having a glass transition temperature of 180° C. or higher (provided that the hydrocarbon resin (P1) is excluded. It is an adhesive composition characterized by containing as a resin component (P).

A second aspect of the present invention is an adhesive composition for bonding a support and a substrate, wherein the adhesive composition contains at least a hydrocarbon resin (P1) as a resin component (P),

A test piece of 20 mm × 5 mm × thickness 0.5 mm was prepared from the adhesive composition, and the test piece was subjected to dynamic viscoelasticity measurement under the conditions of heating from room temperature to 215° C. at a rate of 5° C./min under a tensile condition of a frequency of 1 Hz. when given,

The complex modulus of elasticity E* ₅₀ at 50°C is less than 1.0×10 ⁹ Pa;

Complex elastic modulus E* ₁₅₀ at 150°C exceeds 3.0×10 ⁶ Pa

It is an adhesive composition which satisfy|fills the requirements of both sides.

A 3rd aspect of this invention is equipped with the support body to which a board|substrate is bonded, and the contact bonding layer formed using the adhesive composition which concerns on the said 1st or 2nd aspect on the said support body, It is a support body with an adhesive bond layer characterized by the above-mentioned.

A fourth aspect of the present invention is an adhesive film comprising a film and an adhesive layer formed on the film using the adhesive composition according to the first or second aspect.

A fifth aspect of the present invention is a laminate in which a support and a substrate are bonded together via an adhesive layer, wherein the adhesive layer is a layer formed using the adhesive composition according to the first or second aspect, It is a laminate characterized in that .

A sixth aspect of the present invention is a method for producing a laminate in which a support and a substrate are bonded together via an adhesive layer, using the adhesive composition according to the first or second aspect on at least one on the support or on the substrate. A method for producing a laminate, comprising: an adhesive layer forming step of forming the adhesive layer; and a bonding step of bonding the support and the substrate through the adhesive layer formed in the adhesive layer forming step.

In a seventh aspect of the present invention, after obtaining a laminate by the method for manufacturing a laminate according to the sixth aspect, the separation layer is irradiated with light through the support substrate to alter the separation layer, It is a manufacturing method of an electronic component characterized by having a separation process of isolating the said support base from the said board|substrate with which a laminated body is equipped, and the removal process of removing the said adhesive layer adhering to the said board|substrate after the said separation process.

According to the present invention, as an adhesive composition for bonding a support and a substrate, an adhesive composition capable of forming an adhesive layer with higher heat resistance, a support with an adhesive layer using the same, an adhesive film, a laminate and a manufacturing method thereof, and an electronic component A manufacturing method can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows one Embodiment of the laminated body to which this invention is applied.
It is a schematic process diagram explaining one Embodiment of the manufacturing method of a laminated body. FIG.2(a) is a figure explaining the process of producing a support body, FIG.2(b) is a figure explaining a contact bonding layer formation process, FIG.2(c) is a figure explaining a bonding process.
It is a schematic process diagram explaining other embodiment of the manufacturing method of a laminated body. Fig. 3(a) is a diagram showing a laminate manufactured by the manufacturing method of the first embodiment, and Fig. 3(b) is a diagram for explaining a sealing step.
It is a schematic process diagram explaining other embodiment of the manufacturing method of a laminated body. Fig. 4(a) is a view showing a sealing body manufactured by the manufacturing method of the second embodiment, Fig. 4(b) is a view for explaining a grinding process, and Fig. 4(c) is a rewiring forming process is a diagram for explaining
5 is a schematic process diagram for explaining an embodiment of a method for manufacturing a semiconductor package (electronic component). Fig. 5 (a) is a diagram showing a laminate manufactured by the manufacturing method of the third embodiment, Fig. 5 (b) is a diagram for explaining a separation step, and Fig. 5 (c) is a removal step It is an explanatory drawing.
6 : is a top view which shows the laminated body 10 by which the support body 1 and the board|substrate 4 (bare chip) were bonded through the contact bonding layer 3. As shown in FIG.

In the present specification and claims, "aliphatic" is a concept relative to aromatic, and is defined as meaning a group, compound, etc. that do not have aromaticity.

"Alkyl group" shall include linear, branched and cyclic monovalent saturated hydrocarbon groups, unless otherwise specified. The alkyl group in the alkoxy group is the same.

The "alkylene group" includes divalent saturated hydrocarbon groups of linear, branched and cyclic, unless otherwise specified.

The "halogenated alkyl group" is a group in which some or all of the hydrogen atoms of the alkyl group are substituted with halogen atoms, and examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

A "fluorinated alkyl group" or "fluorinated alkylene group" refers to a group in which part or all of the hydrogen atoms of an alkyl group or an alkylene group are substituted with fluorine atoms.

"Structural unit" means a monomer unit (monomer unit) constituting a high molecular compound (resin, polymer, copolymer).

When describing "may have a substituent" or "may have a substituent", a case where a hydrogen atom (-H) is substituted with a monovalent group, and a case where a methylene group (-CH ₂ -) is substituted with a divalent group includes both sides of

"Exposure" is a concept including the overall irradiation of radiation.

The "structural unit derived from hydroxystyrene" means a structural unit constituted by cleavage of the ethylenic double bond of hydroxystyrene. The "structural unit derived from a hydroxystyrene derivative" means a structural unit constituted by cleavage of the ethylenic double bond of the hydroxystyrene derivative.

The "hydroxystyrene derivative" is a concept including those in which the hydrogen atom at the α-position of hydroxystyrene is substituted with another substituent such as an alkyl group or a halogenated alkyl group, and derivatives thereof. As those derivatives, the hydrogen atom of the hydroxyl group of the hydroxystyrene which the hydrogen atom at the alpha-position may be substituted with the substituent is substituted by the organic group; The thing etc. which the substituent other than a hydroxyl group couple|bonded with the benzene ring of hydroxystyrene which the hydrogen atom at the alpha-position may be substituted with the substituent is mentioned. Incidentally, the α-position (a carbon atom at the α-position) refers to a carbon atom to which the benzene ring is bonded, unless otherwise specified.

Examples of the substituent for substituting the hydrogen atom at the α-position of hydroxystyrene include the same as those exemplified as the substituent at the α-position in the α-substituted acrylic acid ester.

The alkyl group as the substituent at the α-position is preferably a linear or branched alkyl group, specifically, an alkyl group having 1 to 5 carbon atoms (methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, iso butyl group, tert-butyl group, pentyl group, isopentyl group, neopentyl group) and the like.

Specific examples of the halogenated alkyl group as the substituent at the α-position include a group in which a part or all of the hydrogen atoms in the “alkyl group as a substituent at the α-position” are substituted with halogen atoms. A fluorine atom, a chlorine atom, a bromine atom, an iodine atom etc. are mentioned as this halogen atom, A fluorine atom is especially preferable.

In addition, specific examples of the hydroxyalkyl group as the substituent at the α-position include a group in which a part or all of the hydrogen atoms of the “alkyl group as a substituent at the α-position” are substituted with a hydroxyl group. 1-5 are preferable and, as for the number of the hydroxyl groups in this hydroxyalkyl group, 1 is the most preferable.

(Adhesive composition (first aspect))

The adhesive composition which concerns on the 1st aspect of this invention is for bonding a support body and a board|substrate together. The adhesive composition of this embodiment contains a resin component (P). The resin component (P) contains at least a hydrocarbon resin (P1) and a resin (P2) having a glass transition temperature of 180°C or higher (however, excluding the hydrocarbon resin (P1)).

1 : has shown one Embodiment of the laminated body to which this invention is applied.

The laminate 10 shown in FIG. 1 is provided with the separation layer 2 and the adhesive layer 3 between the support base 1 and the board|substrate 4, The separation layer 2 on the support base 1 ), the adhesive layer 3 and the substrate 4 are laminated in this order.

The support base 1 is made of a material that transmits light. In the laminate 10, since the separation layer 2 is decomposed and decomposed by irradiating light from the support base 1 side to the separation layer 2, the separation layer 2 is separated from the substrate 4 by the support substrate 1 is separated

In this laminated body 10, the support body 12 and the board|substrate 4 are bonded together via the contact bonding layer 3. As shown in FIG. This adhesive layer 3 can be formed using the adhesive composition of this embodiment.

<Resin component (P)>

In the present embodiment, the resin component (P) (hereinafter also referred to as “(P) component”) functions as a component imparting adhesiveness in the adhesive composition, and at least the hydrocarbon resin (P1) and the glass transition temperature resin (P2) (however, except for the hydrocarbon resin (P1)) of 180°C or higher.

(P) component, in addition to said hydrocarbon resin (P1) and resin (P2), may also contain resin other than these.

In addition, the resin component (P) in this embodiment shall contain the monomer which can become the matrix which comprises a contact bonding layer other than resin, for example, the sclerosing|hardenable monomer mentioned later.

≪Hydrocarbon resin (P1)≫

In the present embodiment, the hydrocarbon resin (P1) (hereinafter also referred to as “component (P1)”) may be an aliphatic hydrocarbon resin or an aromatic hydrocarbon resin.

(P1) As a component, an elastomer and a cycloolefin polymer are mentioned from the point of provision of heat resistance or flexibility, for example.

· Elastomer

The elastomer in the component (P1) has, as a structural unit of the main chain, a structural unit derived from styrene or a structural unit derived from a styrene derivative (these are collectively referred to as a “styrene unit”). are preferably mentioned.

Here, "styrene derivative" is a concept including those in which the hydrogen atom at the α-position of styrene is substituted with another substituent such as an alkyl group or a halogenated alkyl group, and derivatives thereof. Examples of these derivatives include those in which a substituent is bonded to a benzene ring of styrene in which the hydrogen atom at the α-position may be substituted with a substituent.

The alkyl group as the substituent at the α-position is preferably a linear or branched alkyl group, specifically, an alkyl group having 1 to 5 carbon atoms (methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, iso butyl group, tert-butyl group, pentyl group, isopentyl group, neopentyl group) and the like.

Specific examples of the halogenated alkyl group as the substituent at the α-position include a group in which part or all of the hydrogen atoms of “the alkyl group as the substituent at the α-position” are substituted with halogen atoms. A fluorine atom, a chlorine atom, a bromine atom, an iodine atom etc. are mentioned as this halogen atom, A fluorine atom is especially preferable.

As a substituent which may couple|bond with the benzene ring of styrene, a C1-C5 alkyl group, a C1-C5 alkoxy group, a C1-C5 alkoxyalkyl group, an acetoxy group, a carboxyl group etc. are mentioned, for example.

Incidentally, the α-position (a carbon atom at the α-position) refers to a carbon atom to which the benzene ring is bonded, unless otherwise specified.

"Structural unit derived from styrene" and "structural unit derived from styrene derivative" mean a structural unit constituted by cleavage of an ethylenic double bond of styrene or a styrene derivative.

Examples of the elastomer in the component (P1) include a polystyrene-poly (ethylene/propylene) block copolymer (SEP), a styrene-isoprene-styrene block copolymer (SIS), and a styrene-butadiene-styrene block copolymer. a polymer (SBS), a styrene-butadiene-butylene-styrene block copolymer (SBBS), or a hydrogenated substance thereof; Styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-ethylene-propylene-styrene block copolymer (styrene-isoprene-styrene block copolymer) (SEPS), styrene-ethylene-ethylene-propylene-styrene block copolymer Polymer (SEEPS), a styrene-ethylene-ethylene-propylene-styrene block copolymer in which a styrene block is a reactive crosslinking type (SeptonV9461 (manufactured by Kuraray Corporation), SeptonV9475 (manufactured by Kuraray Corporation)), styrene-ethylene in which a styrene block is a reactive crosslinking type -Butylene-styrene block copolymer (SeptonV9827 (made by Kuraray Co., Ltd.) which has a reactive polystyrene type hard block) etc. are mentioned.

In the elastomer in the component (P1), the content of the styrene unit is preferably 10 to 70 mass%, more preferably 20 to 60 mass%, based on all the structural units (100 mass%) constituting the elastomer. and 25-50 mass % is more preferable, and 30-45 mass % is especially preferable.

If the content rate of a styrene unit is more than the lower limit of the said preferable range, it becomes easy to use for processes, such as thinning and mounting, without reducing the bonding property or grindability of a support body and a board|substrate. If it is below the upper limit of the said preferable range, the chemical-resistance of the adhesive layer which an adhesive composition forms can be maintained preferably.

The range of the weight average molecular weight of 20000-20000 is preferable, and, as for the elastomer in the said (P1) component, the range of 50000-150000 is more preferable.

When the weight average molecular weight of the elastomer is within the above preferred range, it is easy to obtain an adhesive composition capable of forming an adhesive layer that is easily dissolved and removed in a hydrocarbon solvent. Moreover, when the weight average molecular weight of an elastomer is in said preferable range, the chemical-resistance of the adhesive layer which an adhesive composition forms becomes high.

One type may be sufficient as the elastomer in said (P1) component, and 2 or more types may be sufficient as it.

As for the elastomer in the said (P1) component, a hydrogenated substance is more preferable among an elastomer. If it is a hydrogenated substance, stability with respect to heat|fever improves further, and deterioration, such as decomposition and polymerization, does not generate|occur|produce easily. Moreover, it is more preferable also from a viewpoint of the solubility with respect to the hydrocarbon solvent, and the tolerance with respect to a resist solvent.

Moreover, it is more preferable that it is a block polymer in which both ends became styrene among an elastomer. When both ends are blocked with styrene having high thermal stability, higher heat resistance is easily obtained.

More specifically, the elastomer is more preferably a hydrogenated product of a block copolymer of styrene and a conjugated diene. Thereby, the stability to heat is further improved, and deterioration such as decomposition or polymerization is less likely to occur. In addition, higher heat resistance is exhibited because both ends are blocked with styrene having high thermal stability. Moreover, it is more preferable also from a viewpoint of the solubility with respect to the hydrocarbon solvent, and the tolerance with respect to a resist solvent.

Examples of commercially available elastomer products that can be used as the component (P1) include “Septon (trade name)” manufactured by Kuraray Co., Ltd., “Hybra (trade name)” manufactured by Kuraray Co., Ltd., “Hybrae (trade name)” manufactured by Asahi Chemical Co., Ltd. Toughtech (brand name)", JSR Co., Ltd. "Dynaron (brand name)", etc. are mentioned.

· Cycloolefin polymer

Examples of the cycloolefin polymer include preferably an addition polymer obtained by addition polymerization of a ring-opened polymer of a monomer component containing a cycloolefin monomer and a monomer component containing a cycloolefin monomer.

As said cycloolefin monomer, For example, bicyclic bodies, such as norbornene and norbornadiene, tricyclic bodies, such as dicyclopentadiene and hydroxydicyclopentadiene, 4 rings, such as tetracyclododecene 5-ring bodies, such as cyclopentadiene trimer, 7-ring bodies, such as tetracyclopentadiene, or alkyl (methyl, ethyl, propyl, butyl, etc.) substituents of these polycyclic bodies, alkenyl (vinyl, etc.) substituents, alkyl and monomers such as a leadene (ethylidene, etc.) substituent or an aryl (phenyl, tolyl, naphthyl, etc.) substituent.

Among the above, a polymer having a structural unit derived from a monomer having a norbornene structure, particularly selected from the group consisting of norbornene, tetracyclododecene, and alkyl substituents thereof, is preferable. By using such a cycloolefin polymer having a norbornene structure, for example, an adhesive composition capable of forming an adhesive layer that is easily dissolved and removed in a hydrocarbon solvent while having high chemical resistance to a resist solvent This becomes easier to obtain.

The cycloolefin polymer may have a monomer copolymerizable with the cycloolefin monomer as a monomer unit.

As such a copolymerizable monomer, an alkene monomer is mentioned preferably, for example. The alkene monomer may be linear or branched, and examples thereof include alkene monomers having 2 to 10 carbon atoms, for example, α such as ethylene, propylene, 1-butene, isobutene, and 1-hexene. -olefin is preferable, and among these, it is more preferable to use ethylene as a monomer unit.

In the cycloolefin polymer in the component (P1), the content of the cycloolefin monomer unit is preferably from 10 to 100 mol%, and from 20 to 100 mol% with respect to all the structural units (100 mol%) constituting the cycloolefin polymer. 100 mol% is more preferable.

The weight average molecular weight of the cycloolefin polymer in the component (P1) is preferably in the range of 10000 to 2000000, and more preferably in the range of 30000 to 1500000.

When the weight average molecular weight of a cycloolefin polymer is more than the lower limit of the said preferable range, it will become easy to control the softening temperature of the said polymer to the temperature suitable for bonding of a support body and a board|substrate. If it is below the upper limit of said preferable range, it will become easy to obtain the adhesive composition which can melt|dissolve easily in a hydrocarbon solvent and can form the adhesive bond layer removed.

The number of cycloolefin polymers in the said (P1) component may be one, and 2 or more types may be sufficient as them.

In addition, the cycloolefin polymer is, for example, a resin that does not have a polar group, such as a resin formed by polymerizing a monomer component consisting of a cycloolefin monomer and an alkene monomer, from the viewpoint of suppressing the generation of gas at high temperature. .

There is no restriction|limiting in particular about the polymerization method, polymerization conditions, etc. at the time of superposing|polymerizing a monomer component, What is necessary is just to set suitably according to a conventional method.

Examples of commercially available cycloolefin polymers that can be used as the component (P1) include "TOPAS (trade name)" manufactured by Polyplastics Co., Ltd., "APEL (trade name)" manufactured by Mitsui Chemicals, Inc., manufactured by Nippon Zeon Corporation. "ZEONOR (brand name)", "ZEONEX (brand name)" manufactured by Nippon Zeon Corporation, "ARTON (brand name)" manufactured by JSR Corporation, etc. are mentioned.

In the adhesive composition of this embodiment, (P1) component may be used individually by 1 type, and may use 2 or more types together.

It is preferable that the said (P1) component is at least 1 sort(s) chosen from the group which consists of an elastomer and a cycloolefin polymer. Among these, an elastomer is more preferable at a point with more favorable heat resistance and die-bonding property.

The content ratio of the component (P1) in the component (P) is preferably more than 50 mass%, more than 50 mass%, and not more than 90 mass% with respect to the total amount (100 mass%) of the component (P). is more preferable, and 55 mass % or more and 80 mass % or less are still more preferable. By setting it as said preferable range, the removal performance in the washing|cleaning liquid in the removal process mentioned later, especially in the hydrocarbon solvent, improves.

«Resin having a glass transition temperature of 180°C or higher (P2)»

In the present embodiment, the resin (P2) is a resin having a glass transition temperature (Tg) of 180°C or higher (hereinafter also referred to as “component (P2)”) (however, the hydrocarbon resin (P1) is excluded).

The glass transition temperature (Tg/°C) for the resin component is determined by dynamic viscoelasticity measurement. For example, using a dynamic viscoelasticity measuring apparatus Rheologel-E4000 (manufactured by UBM Corporation), the viscoelasticity measured by raising the temperature from 25°C to 300°C at a temperature increase rate of 5°C/min under the condition of a frequency of 1 Hz. It can be obtained based on the change.

The glass transition temperature (Tg) of the component (P2) is 180°C or higher, preferably 180-280°C, more preferably 200-280°C, still more preferably 210-280°C, and still more preferably 220-280°C. Especially preferred.

When Tg of the component (P2) is equal to or greater than the lower limit of the above range, the adhesive layer with higher heat resistance can be easily formed. If it is below the upper limit of the said preferable range, it will become easy to maintain the softness|flexibility of a contact bonding layer.

The component (P2) is not particularly limited as long as it is a resin having a Tg of 180°C or higher, and among them, it is preferable that the component (P1) has high compatibility.

For example, as said component (P2), resin which has the structural unit (u21) induced|guided|derived from the monomer containing a maleimide skeleton is mentioned preferably.

· Structural unit (u21)

The structural unit (u21) is a structural unit derived from a monomer containing a maleimide skeleton. By using resin which has maleimide frame|skeleton, a glass transition temperature becomes high and the heat resistance of a contact bonding layer becomes higher.

As a preferable structural unit (u21), the structural unit represented by the following general formula (p2-1) is mentioned, for example.

[Formula 1]

[In the formula, R ^u10 represents an organic group having 1 to 30 carbon atoms.]

In the formula (p2-1), R ^u10 represents an organic group having 1 to 30 carbon atoms. The organic group in R ^u10 may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. An aliphatic hydrocarbon group means a hydrocarbon group which does not have aromaticity. Moreover, saturated or unsaturated may be sufficient as an aliphatic hydrocarbon group, and it is preferable that it is saturated normally.

Examples of the organic group for R ^u10 include a cyclic group which may have a substituent, a chain alkyl group which may have a substituent, or a chain alkenyl group which may have a substituent.

Cyclic group which may have a substituent:

The cyclic group is preferably a cyclic hydrocarbon group, and the cyclic hydrocarbon group may be an aromatic hydrocarbon group or an aliphatic hydrocarbon group.

The aromatic hydrocarbon group for R ^u10 is a hydrocarbon group having an aromatic ring. It is preferable that carbon number of this aromatic hydrocarbon group is 3-30, It is more preferable that it is 5-30, 5-20 are still more preferable, 6-15 are especially preferable, and 6-10 are the most preferable. However, carbon number in a substituent shall not be included in the carbon number.

Specifically, as the aromatic ring of the aromatic hydrocarbon group in R ^u10 , benzene, fluorene, naphthalene, anthracene, phenanthrene, biphenyl, or an aromatic heterocyclic ring in which some of the carbon atoms constituting these aromatic rings are substituted with hetero atoms, etc. can be heard As a hetero atom in an aromatic heterocyclic ring, an oxygen atom, a sulfur atom, a nitrogen atom, etc. are mentioned.

Specifically, as the aromatic hydrocarbon group for R ^u10 , a group in which one hydrogen atom is removed from the aromatic ring (aryl group: for example, a phenyl group, a naphthyl group, etc.), and one hydrogen atom in the aromatic ring is an alkylene group Substituted groups (For example, arylalkyl groups, such as a benzyl group, a phenethyl group, 1-naphthylmethyl group, 2-naphthylmethyl group, 1-naphthylethyl group, 2-naphthylethyl group, etc.) etc. are mentioned. It is preferable that carbon number of the said alkylene group (alkyl chain in an arylalkyl group) is 1-4, It is more preferable that it is 1-2, It is especially preferable that it is 1.

Examples of the cyclic aliphatic hydrocarbon group for R ^u10 include an aliphatic hydrocarbon group having a ring in its structure.

Examples of the aliphatic hydrocarbon group containing a ring in this structure include an alicyclic hydrocarbon group (a group in which one hydrogen atom is removed from an aliphatic hydrocarbon ring), a group in which one hydrogen atom in the aliphatic hydrocarbon ring is substituted with an alkylene group, and the like. . It is preferable that carbon number of this alkylene group is 1-4.

It is preferable that carbon number is 3-20, and, as for the said aliphatic hydrocarbon ring, it is more preferable that it is 3-12.

Polycyclic or monocyclic may be sufficient as the said aliphatic hydrocarbon ring.

The monocyclic aliphatic hydrocarbon ring is preferably a monocyclic aliphatic hydrocarbon ring having 3 to 8 carbon atoms, and specific examples thereof include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, and cyclopentane and cyclohexane. Do.

The polycyclic aliphatic hydrocarbon ring is preferably one having 7 to 30 carbon atoms, and specifically, a polycyclic skeleton of a bridged ring system such as adamantane, norbornane, isobornane, tricyclodecane and tetracyclododecane. polycycloalkane having; A polycycloalkane having a polycyclic skeleton of a condensed ring system such as a ring having a steroid skeleton is more preferable.

Among them, the cyclic aliphatic hydrocarbon group for R ^u10 is preferably a group obtained by removing at least one hydrogen atom from a monocycloalkane or polycycloalkane, more preferably a group obtained by removing at least one hydrogen atom from a monocycloalkane, , a group in which one hydrogen atom has been removed from monocycloalkane is more preferable, and a group in which one hydrogen atom has been removed from cyclopentane or cyclohexane is particularly preferable.

Examples of the substituent in the cyclic group of R ^u10 include an alkyl group, a halogen atom, and a halogenated alkyl group.

As an alkyl group as a substituent, a C1-C5 alkyl group is preferable, and a methyl group, an ethyl group, a propyl group, n-butyl group, and a tert- butyl group are more preferable.

As a halogen atom as a substituent, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, etc. are mentioned, A fluorine atom is preferable.

Examples of the halogenated alkyl group as the substituent include an alkyl group having 1 to 5 carbon atoms, for example, a group in which part or all of hydrogen atoms such as a methyl group, ethyl group, propyl group, n-butyl group, and tert-butyl group are substituted with the above halogen atoms. there is.

A chain alkyl group which may have a substituent:

The linear alkyl group for R ^u10 may be either linear or branched.

As a linear alkyl group, it is preferable that carbon number is 1-20, It is more preferable that it is 1-15, and 1-12 are still more preferable. Specifically, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decanyl group, an undecyl group, a dodecyl group, a tridecyl group, an isotridecyl group, a tetradecyl group , pentadecyl group, hexadecyl group, isohexadecyl group, heptadecyl group, octadecyl group, nonadecyl group, icosyl group, henicosyl group, docosyl group, etc. are mentioned.

As a branched alkyl group, it is preferable that carbon number is 3-20, It is more preferable that it is 3-15, and 3-10 are still more preferable. Specifically, 1-methylethyl group, 1-methylpropyl group, 2-methylpropyl group, 1-methylbutyl group, 2-methylbutyl group, 3-methylbutyl group, 1-ethylbutyl group, 2-ethylbutyl group , 1-methylpentyl group, 2-methylpentyl group, 3-methylpentyl group, 4-methylpentyl group, and the like.

A chain alkenyl group which may have a substituent:

The chain alkenyl group for R ^u10 may be either linear or branched, preferably having 2 to 10 carbon atoms, more preferably 2 to 5 carbon atoms, still more preferably 2 to 4 carbon atoms. and having 3 carbon atoms is particularly preferable. Examples of the linear alkenyl group include a vinyl group, a propenyl group (allyl group), and a butynyl group. As a branched alkenyl group, 1-methylvinyl group, 2-methylvinyl group, 1-methylpropenyl group, 2-methylpropenyl group etc. are mentioned, for example.

As a linear alkenyl group, among the above, a linear alkenyl group is preferable, a vinyl group and a propenyl group are more preferable, and a vinyl group is especially preferable.

Examples of the substituent in the chain alkyl or alkenyl group of R ^u10 include a halogen atom, a halogenated alkyl group, and a cyclic group in the above R ^u10 .

Among the above, R ^u10 is preferably a cyclic group which may have a substituent, more preferably a cyclic hydrocarbon group which may have a substituent, and still more preferably a cyclic aliphatic hydrocarbon group which may have a substituent.

Specific examples of the structural unit (u21) are shown below.

[Formula 2]

[Formula 3]

[Formula 4]

[Formula 5]

(P2) The number of structural units (u21) which a component has may be 1 type, or 2 or more types may be sufficient as it.

(P2) The ratio of the structural unit (u21) in the component is preferably from 10 to 90 mol%, more preferably from 20 to 80 mol%, with respect to the total (100 mol%) of all the structural units constituting the component (P2). It is preferable, and 40-70 mol% is still more preferable.

A glass transition temperature becomes high that the ratio of a structural unit (u21) is more than the lower limit of the said preferable range, and the heat resistance of a contact bonding layer becomes higher. If it is below the upper limit of said preferable range, it will become easy to take balance with another structural unit.

· Structural unit (u22)

(P2) As a component, you may have structural units other than the said structural unit (u21).

Structural units other than the structural unit (u21) include, for example, a structural unit (u22) derived from cycloolefin.

By using a cycloolefin, that is, a resin having an unsaturated aliphatic hydrocarbon ring composed of carbon atoms, an adhesive composition capable of forming an adhesive layer that is easily dissolved and removed in a hydrocarbon solvent is easily obtained.

As a preferable structural unit (u22), the structural unit represented, for example by the following general formula (p2-2) is mentioned.

[Formula 6]

[In the formula, R ^u11 to R ^u14 each independently represent an organic group having 1 to 30 carbon atoms or a hydrogen atom. n is an integer of 0 to 2.]

In the formula (p2-2), examples of the organic group for R ^u11 to R ^u14 include an alkyl group, an alkenyl group, an alkynyl group, an alkylidene group, an aryl group, an aralkyl group, an alkaryl group, a cycloalkyl group, or a carboxyl group. The organic group which has and the organic group which has a heterocyclic ring are mentioned.

The alkyl group for R ^u11 to R ^u14 is preferably an alkyl group having 1 to 10 carbon atoms, for example, a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, and sec-butyl group. group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, octyl group, nonyl group and decyl group.

Examples of the alkenyl group for R ^u11 to R ^u14 include an allyl group, a pentenyl group, and a vinyl group.

Examples of the alkynyl group for R ^u11 to R ^u14 include an ethynyl group.

Examples of the alkylidene group for R ^u11 to R ^u14 include a methylidene group and an ethylidene group.

Examples of the aryl group for R ^u11 to R ^u14 include a phenyl group, a naphthyl group, and an anthracenyl group.

Examples of the aralkyl group for R ^u11 to R ^u14 include a benzyl group and a phenethyl group.

Examples of the alkaryl group for R ^u11 to R ^u14 include a tolyl group and a xylyl group.

Examples of the cycloalkyl group for R ^u11 to R ^u14 include an adamantyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group.

Examples of the organic group having a heterocyclic ring in R ^u11 to R ^u14 include an organic group having an epoxy group and an organic group having an oxetanyl group.

The organic group in R ^u11 to R ^u14 is preferably an alkyl group from the viewpoint of further improving the solubility in hydrocarbon solvents and from the viewpoint of synthesis. In addition, since it is easy to maintain a high glass transition point, a C1-C8 alkyl group is more preferable, and a C2-C6 alkyl group is still more preferable.

Moreover, it is also preferable that any one or more of ^Ru11 - ^Ru14 is a hydrogen atom from a viewpoint of improving the light transmittance of the adhesive layer formed using an adhesive composition.

Among the above, the organic group in R ^u11 to R ^u14 is preferably a combination of an alkyl group and a hydrogen atom, and it is preferable that any one of R ^u11 to R ^u14 is an alkyl group and the remaining three are hydrogen atoms.

In the organic group for R ^u11 to R ^u14 , one or more hydrogen atoms may be substituted with a halogen atom. A fluorine atom, a chlorine atom, a bromine atom, and an iodine atom are mentioned as this halogen atom.

In said formula (p2-2), n is an integer of 0-2, 0 or 1 is preferable and 0 is more preferable.

Specific examples of the structural unit (u22) are shown below.

[Formula 7]

(P2) The number of structural units (u22) which a component has may be 1 type, or 2 or more types may be sufficient as it.

(P2) The ratio of the structural unit (u22) in the component is preferably from 10 to 90 mol%, more preferably from 20 to 80 mol% with respect to the total (100 mol%) of all the structural units constituting the component (P2). It is preferable, and 30-60 mol% is still more preferable.

When the ratio of the structural unit (u22) is equal to or greater than the lower limit of the above-described preferred range, the solubility in the hydrocarbon solvent tends to increase. If it is below the upper limit of said preferable range, it will become easy to take balance with another structural unit.

In the adhesive composition of this embodiment, (P2) component may be used individually by 1 type, and may use 2 or more types together.

The component (P2) is preferably a resin having a structural unit (u21). Among these, the resin having the structural unit (u21) and the structural unit (u22) is more preferred because the heat resistance tends to increase and an adhesive composition capable of forming an adhesive layer that is easily dissolved and removed in a hydrocarbon solvent is easy to be obtained. desirable.

Below, the specific example of (P2) component is shown.

[Formula 8]

The content rate of the component (P2) in the component (P) is preferably 50 mass% or less, and 5 mass% or more and 50 mass% or less with respect to the total amount (100 mass%) of the component (P). is more preferable, and 10 mass % or more and 40 mass % or less are still more preferable.

The content of the component (P2) is preferably from 5 to 75 parts by mass, more preferably from 10 to 70 parts by mass, still more preferably from 10 to 65 parts by mass, with respect to 100 parts by mass of the component (P1). And it is especially preferable that it is 10-60 mass parts.

In addition to heat resistance, adhesiveness becomes it higher that the content rate of the said (P2) component is below the upper limit of the said preferable range. If it is more than the lower limit of the said preferable range, heat resistance, adhesiveness, and die-bonding property all improve.

≪Other resins (P3)≫

(P) component, in addition to said (P1) component and (P2) component, may also contain resin other than these (this is also called "(P3) component" hereafter).

For example, an acrylic resin etc. are mentioned as (P3) component.

・Acrylic resin

In this embodiment, in addition to said (P1) component and (P2) component, (P) component may also contain an acrylic resin as (P3) component. When (P) component contains an acrylic resin, the adhesiveness of a support body and a board|substrate can be improved more.

As an acrylic resin, resin (homopolymer, copolymer) which superposed|polymerized using (meth)acrylic acid ester as a monomer is mentioned, for example.

"(meth)acryl" means at least one of acryl or methacryl.

As (meth)acrylic acid ester, (meth)acrylic acid alkylester which consists of a chain structure, (meth)acrylic acid ester which has an aliphatic ring, and (meth)acrylic acid ester which has an aromatic ring is mentioned, for example. Among these, it is preferable to use the (meth)acrylic acid ester which has an aliphatic ring.

As (meth)acrylic acid alkylester which consists of a chain|strand structure, the acryl-type alkylester which has a C1-C20 alkyl group is mentioned, for example.

The alkyl group having 1 to 20 carbon atoms as used herein may be linear or branched, for example, methyl group, ethyl group, propyl group, butyl group, 2-ethylhexyl group, isooctyl group, isononyl group, isode Sil group, dodecyl group, lauryl group, tridecyl group, n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group (stearyl group), n-nonadecyl group, n- It is an eicosyl group etc., and the acrylic alkyl ester which has a C15-20 alkyl group is preferable.

As (meth)acrylic acid ester which has an aliphatic ring, For example, cyclohexyl (meth)acrylate, cyclopentyl (meth)acrylate, 1-adamantyl (meth)acrylate, norbornyl (meth)acryl a rate, isobornyl (meth)acrylate, tricyclodecanyl (meth)acrylate, tetracyclododecanyl (meth)acrylate, dicyclopentanyl (meth)acrylate, etc. are mentioned. Among these, 1-adamantyl (meth)acrylate, isobornyl (meth)acrylate, and dicyclopentanyl (meth)acrylate are preferable.

In the (meth)acrylic acid ester having an aromatic ring, examples of the aromatic ring include a phenyl group, a benzyl group, a tolyl group, a xylyl group, a biphenyl group, a naphthyl group, an anthracenyl group, a phenoxymethyl group, and a phenoxyethyl group. and the like. The said aromatic ring may have a substituent and may have a C1-C5 linear or branched alkyl group.

Among acrylic resins, the (meth)acrylic acid ester mentioned above may be used individually by 1 type, and may be used in combination of 2 or more type.

The acrylic resin is a resin obtained by polymerizing at least one selected from the group consisting of (meth)acrylic acid alkyl esters having a chain structure, (meth)acrylic acid esters having an aliphatic ring, and (meth)acrylic acid esters having an aromatic ring. desirable.

Among these, resin which superposed|polymerized the (meth)acrylic-acid alkylester and the (meth)acrylic-acid ester which has an aliphatic ring is more preferable.

Resin which superposed|polymerized the (meth)acrylic acid ester monomer and this and the other monomer which can superpose|polymerize may be sufficient as an acrylic resin.

Examples of such a polymerizable monomer include styrene, a styrene derivative, and a monomer containing a maleimide group. A styrene derivative here is the same as that of the said "styrene derivative." Examples of the monomer containing a maleimide group herein include the same monomers as those derived from the structural unit (u21).

Moreover, resin which superposed|polymerized the (meth)acrylic acid ester monomer and styrene among acrylic resins is preferable. When the acrylic resin has a styrene unit, the heat resistance of the acrylic resin improves. In addition, compatibility with other resins and solubility in hydrocarbon solvents increase.

Among these, as an acrylic resin, the resin which superposed|polymerized the (meth)acrylic-acid alkylester which consists of a chain structure, (meth)acrylic-acid ester which has an aliphatic ring, and styrene is especially preferable.

It is preferable that they are 6 or more and 10 or less, and, as for the solubility parameter (SP value) of an acrylic resin, it is more preferable that they are 6.5 or more and 9.5 or less. When SP value exists in said preferable range, compatibility of an acrylic resin and other resin increases, and a more stable adhesive composition becomes easy to be obtained.

It is preferable that it is 2000-100000, and, as for the weight average molecular weight of an acrylic resin, it is more preferable that it is 5000-50000.

When the weight average molecular weight of an acrylic resin exists in said preferable range, the adhesive composition which has thermal fluidity suitable for bonding of a board|substrate and a support body can be provided easily, for example.

You may use an acrylic resin in combination of 2 or more type.

30 mass % or less is preferable with respect to the total amount (100 mass %) of the said (P) component, as for the content rate of the said acrylic resin occupied in the said (P) component, 25 mass % or less is more preferable, and 0 mass % and more preferably 20 mass% or less.

· Curable monomer

In this embodiment, in addition to the component (P1) and the component (P2) mentioned above (P) component (P), the adhesive composition may also contain a curable monomer as a component (P3). When the adhesive composition contains a curable monomer, the heat resistance of the adhesive layer can be further improved.

It is preferable that a sclerosing|hardenable monomer is a monomer polymerized by radical polymerization, and a polyfunctional sclerosing|hardenable monomer is mentioned typically, A polyfunctional (meth)acrylate monomer is especially preferable.

As a polyfunctional (meth)acrylate monomer, for example, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate ) acrylate, polypropylene glycol di (meth) acrylate, butylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexane glycol di (meth) acrylate, 1,4 -Cyclohexane dimethanol di (meth) acrylate, tricyclodecane dimethanol di (meth) acrylate, 9,9-bis [4- (2- (meth) acryloyloxyethoxy) phenyl] fluorene, Propoxylated bisphenol A di(meth)acrylate, 1,3-adamantanediol di(meth)acrylate, 5-hydroxy-1,3-adamantanediol di(meth)acrylate, 1,3 ,5-Adamantane triol tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, glycerin di (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) Acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 2-hydroxy-3- (meth) acryloyloxypropyl (meth)acrylate, ethylene glycol diglycidyl ether di (meth) acrylate, diethylene glycol diglycidyl ether di (meth) acrylate, phthalic acid diglycidyl ester di (meth) acrylate, glycerin tri (meth)acrylate, glycerin polyglycidyl ether poly(meth)acrylate, urethane (meth)acrylate (ie tolylene diisocyanate), trimethylhexamethylene diisocyanate and hexamethylene diisocyanate and 2-hydroxyethyl ( A reaction product of meth)acrylate, etc. are mentioned.

These polyfunctional (meth)acrylates may be used individually by 1 type, and may be used in combination of 2 or more type.

It is preferable that a sclerosing|hardenable monomer contains a cyclic structure, and it is more preferable that it contains a polycyclic aliphatic structure. When the curable monomer preferably contains a cyclic structure, more preferably a polycyclic aliphatic structure, compatibility with the cycloolefin polymer can be further improved. Moreover, the heat resistance of a contact bonding layer can further be improved by polymerizing the sclerosing|hardenable monomer used together with a cycloolefin polymer.

Among the curable monomers, a (meth)acrylate monomer having a cyclic group is particularly preferable, and tricyclodecanedimethanoldi(meth)acrylate, 1,3-adamantanediol di(meth)acrylate, and 5-hydroxy -1,3-adamantanediol di (meth) acrylate, 1,3,5-adamantane triol tri (meth) acrylate, 1,4-cyclohexanedimethanol di (meth) acrylate, 9 At least one selected from the group consisting of ,9-bis[4-(2-(meth)acryloyloxyethoxy)phenyl]fluorene and propoxylated bisphenol A di(meth)acrylate is more preferable, Cyclodecanedimethanol di(meth)acrylate is particularly preferred.

It is preferable that it is 5-40 mass %, and, as for the content rate of the said sclerosing|hardenable monomer to the said (P) component with respect to the total amount (100 mass %) of the said (P) component, it is more preferable that it is 5-30 mass % And it is more preferable that it is 5-20 mass %.

Moreover, with respect to the adhesive composition, when requesting|requiring the further adhesive improvement, with respect to the content rate of the said curable monomer which occupies in the said (P) component, with respect to the total amount (100 mass %) of the said (P) component, 1-30 Numerical ranges of mass %, 2-20 mass %, and 5-15 mass % can also be set.

The content of the curable monomer is preferably 5 to 40 parts by mass, more preferably 5 to 30 parts by mass, more preferably 5 to 100 parts by mass in total of the component (P1) and the component (P2). It is more preferable that it is 20 mass parts.

Higher heat resistance can be provided to a contact bonding layer as the content rate of the said sclerosing|hardenable monomer is more than the lower limit of the said preferable range. If it is below the upper limit of the said preferable range, the solubility with respect to a hydrocarbon type solvent can be improved more and the washing-removability of an adhesive layer can be made more favorable.

What is necessary is just to adjust content of (P) component in the adhesive composition of this embodiment according to the thickness of the adhesive layer to form, the kind of each resin, etc.

<Optional ingredients>

The adhesive composition of this embodiment may further contain components (arbitrary components) other than (P) component mentioned above.

As such an optional component, a polymerization inhibitor, a polymerization initiator, a solvent component, a plasticizer, an adhesion aid, a stabilizer, a colorant, surfactant etc. which are shown below are mentioned, for example.

≪Polymerization inhibitor≫

The adhesive composition of this embodiment may contain the polymerization inhibitor further.

A polymerization inhibitor means the component which has a function which prevents the radical polymerization reaction by a heat|fever or light. A polymerization inhibitor shows high reactivity with respect to a radical. For this reason, for example, when a cycloolefin polymer is used as component (P1), the reaction between the polymerization inhibitor and the radical proceeds preferentially over the reaction between the cycloolefin polymer and the radical, and polymerization of the cycloolefin polymers is prohibited. . As a result, the formed adhesive layer is heated, thereby increasing the chemical resistance of the adhesive layer.

As a polymerization inhibitor, it is preferable to have a phenol skeleton. For example, as such a polymerization inhibitor, it is possible to use a hindered phenolic antioxidant, pyrogallol, benzoquinone, hydroquinone, methylene blue, tert-butylcatechol, monobenzyl ether, methylhydroquinone, Amylquinone, amyloxyhydroquinone, n-butylphenol, phenol, hydroquinone monopropyl ether, 4,4'-(1-methylethylidene)bis(2-methylphenol), 4,4'-(1- Methylethylidene)bis(2,6-dimethylphenol), 4,4'-[1-[4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl]ethylidene]bisphenol, 4 ,4',4"-ethylidentris(2-methylphenol), 4,4',4"-ethylidentrisphenol, 1,1,3-tris(2,5-dimethyl-4-hydroxy Phenyl)-3-phenylpropane, 2,6-di-tert-butyl-4-methylphenol, 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 4,4'-butylly Denbis(3-methyl-6-tert-butylphenol), 4,4'-thiobis(3-methyl-6-tert-butylphenol), 3,9-bis[2-(3-(3-tert) -Butyl-4-hydroxy-5-methylphenyl)-propionyloxy)-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro (5,5) undecane, triethylene glycol-bis -3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate, n-octyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, Pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] (trade name IRGANOX1010, manufactured by BASF), tris(3,5-di-tert-butylhydride) Roxybenzyl) isocyanurate, thiodiethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], etc. are mentioned.

A polymerization inhibitor may be used individually by 1 type, and may be used in combination of 2 or more type.

What is necessary is just to determine content of a polymerization inhibitor suitably according to the kind of resin component, the use of an adhesive composition, and use environment, for example, it is preferable that it is 0.1-10 mass parts with respect to 100 mass parts of (P) component.

When content of a polymerization inhibitor is in said preferable range, the effect which suppresses superposition|polymerization is exhibited favorably, and the chemical|medical agent tolerance of a contact bonding layer becomes higher after a high temperature process.

≪Polymerization Initiator≫

The adhesive composition of this embodiment may contain the polymerization initiator further.

A polymerization initiator means the component which has a function which accelerates|stimulates the polymerization reaction of the sclerosing|hardenable monomer mentioned above.

As a polymerization initiator, a thermal polymerization initiator, a photoinitiator, etc. are mentioned.

As a thermal polymerization initiator, a peroxide, an azo polymerization initiator, etc. are mentioned, for example.

Examples of the peroxide in the thermal polymerization initiator include ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, and peroxyester. Specifically as such peroxides, acetyl peroxide, dicumyl peroxide, tert-butyl peroxide, t-butylcumyl peroxide, propionyl peroxide, benzoyl peroxide (BPO), 2-chlorobenzoyl peroxide, 3-chlorobenzoyl peroxide, 4 peroxide -Chlorobenzoyl, 2,4-dichlorobenzoyl peroxide, 4-bromomethylbenzoyl peroxide, lauroyl peroxide, potassium persulfate, diisopropyl peroxycarbonate, tetralin hydroperoxide, 1-phenyl-2-methyl Propyl-1-hydroperoxide, pertriphenylacetic acid-tert-butyl, tert-butylhydroperoxide, performate tert-butyl, peracetic acid tert-butyl, perbenzoate tert-butyl, perphenylacetate tert-butyl, per tert-butyl 4-methoxyacetate, and tert-butyl N-(3-toluyl)carbamic acid.

The above-mentioned peroxides include, for example, the brand name "Percumyl (registered trademark)" manufactured by Nippon Oil Co., Ltd., the brand name "Perbutyl (registered trademark)", the brand name "Peroyl (registered trademark)", and the brand name "Perocta (registered trademark)" A commercially available thing such as "trademark)" can be used.

Examples of the azo polymerization initiator in the thermal polymerization initiator include 2,2'-azobispropane, 2,2'-dichloro-2,2'-azobispropane, 1,1'-azo(methyl Ethyl)diacetate, 2,2'-azobis(2-amidinopropane) hydrochloride, 2,2'-azobis(2-aminopropane) nitrate, 2,2'-azobisisobutane, 2,2' -Azobisisobutylamide, 2,2'-azobisisobutyronitrile, 2,2'-azobis-2-methylpropionate methyl, 2,2'-dichloro-2,2'-azobisbutane, 2 ,2'-azobis-2-methylbutyronitrile, 2,2'-azobisisobutyrate dimethyl, 1,1'-azobis(1-methylbutyronitrile-3-sulfonate sodium), 2-(4 -Methylphenylazo)-2-methylmalonodinitrile 4,4'-azobis-4-cyanovaleric acid, 3,5-dihydroxymethylphenylazo-2-allylmalonodinitrile, 2,2'-azobis -2-methylvaleronitrile, 4,4'-azobis-4-cyanovaleric acid dimethyl, 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'-azobiscyclohexane Nitrile, 2,2'-azobis-2-propylbutyronitrile, 1,1'-azobiscyclohexanenitrile, 2,2'-azobis-2-propylbutyronitrile, 1,1'-azobis -1-chlorophenylethane, 1,1'-azobis-1-cyclohexanecarbonitrile, 1,1'-azobis-1-cycloheptannitrile, 1,1'-azobis-1-phenylethane, 1 ,1'-azobiscumene, 4-nitrophenylazobenzylcyanoethyl acetate, phenylazodiphenylmethane, phenylazotriphenylmethane, 4-nitrophenylazotriphenylmethane, 1,1'-azobis-1 ,2-diphenylethane, poly(bisphenol A-4,4'-azobis-4-cyanopentanoate), poly(tetraethylene glycol-2,2'-azobisisobutylate), etc. are mentioned. there is.

Examples of the photopolymerization initiator include 1-hydroxycyclohexylphenylketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy) Phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-(4-dode Sylphenyl)-2-hydroxy-2-methylpropan-1-one, 2,2-dimethoxy-1,2-diphenylethan-1-one, bis(4-dimethylaminophenyl)ketone, 2-methyl -1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one; Ethanone 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(o-acetyloxime), 2,4,6-trimethylbenzoyldiphenylphosphine oxide , 4-benzoyl-4'-methyldimethyl sulfide, 4-dimethylaminobenzoic acid, 4-dimethylamino methyl benzoate, 4-dimethylamino ethyl benzoate, 4-dimethylamino butyl benzoate, 4-dimethylamino-2-ethylhexylbenzoic acid , 4-dimethylamino-2-isoamylbenzoic acid, benzyl-β-methoxyethyl acetal, benzyldimethylketal, 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime, o- Methyl benzoylbenzoate, 2,4-diethyl thioxanthone, 2-chlorothioxanthone, 2,4-dimethyl thioxanthone, 1-chloro-4-propoxythioxanthone, thioxanthene, 2-chloroti Oxanthene, 2,4-diethylthioxanthene, 2-methylthioxanthene, 2-isopropylthioxanthene, 2-ethylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3 -Diphenylanthraquinone, azobisisobutyronitrile, benzoyl peroxide, cumene peroxide, 2-mercaptobenzoimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole, 2-(o- Chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) - 4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenyl Imidazole dimer, 2,4,5-triarylimidazole dimer, benzophenone, 2-chlorobenzophenone, 4,4'-bisdimethylaminobenzophenone (ie, Michler's ketone), 4,4'-bisdiethylaminobenzophenone (ie, ethyl Michler's ketone), 4,4'-dichlorobenzophenone, 3,3-dimethyl-4-methoxybenzophenone, Benzyl, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin-n-butyl ether, benzoin isobutyl ether, benzoin-t-butyl ether, acetophenone, 2,2- diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, pt-butylacetophenone, p-dimethylaminoacetophenone, pt-butyltrichloroacetophenone, pt -Butyldichloroacetophenone, α,α-dichloro-4-phenoxyacetophenone, thioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, dibenzosuberone, pentyl-4-dimethylaminobenzo 8, 9-phenylacridine, 1,7-bis-(9-acridinyl)heptane, 1,5-bis-(9-acridinyl)pentane, 1,3-bis-(9-acridinyl)pentane nyl) propane, p-methoxytriazine, 2,4,6-tris(trichloromethyl)-s-triazine, 2-methyl-4,6-bis(trichloromethyl)-s-triazine, 2 -[2-(5-methylfuran-2-yl)ethenyl]-4,6-bis(trichloromethyl)-s-triazine, 2-[2-(furan-2-yl)ethenyl]- 4,6-bis(trichloromethyl)-s-triazine, 2-[2-(4-diethylamino-2-methylphenyl)ethenyl]-4,6-bis(trichloromethyl)-s-tri azine, 2- [2- (3,4-dimethoxyphenyl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxyphenyl) -4,6- Bis(trichloromethyl)-s-triazine, 2-(4-ethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-n-butoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2,4-bis-trichloromethyl-6- (3-bromo-4-methoxy) phenyl-s-triazine, 2,4 -bis-trichloromethyl-6- (2-bromo-4-methoxy) phenyl-s-triazine, 2,4-bis-trichloromethyl-6- (3-bromo-4-methoxy) and styrylphenyl-s-triazine and 2,4-bis-trichloromethyl-6-(2-bromo-4-methoxy)styrylphenyl-s-triazine.

In the above photoinitiator, for example, "IRGACURE OXE02", "IRGACURE OXE01", "IRGACURE 369", "IRGACURE 651", "IRGACURE 907" (all trade names, manufactured by BASF) And "NCI-831" (trade names) , manufactured by ADEKA Corporation) and the like can be used.

A polymerization initiator may be used individually by 1 type, and may be used in combination of 2 or more type.

As a polymerization initiator, a thermal polymerization initiator is preferable and a peroxide is more preferable.

It is preferable to use a polymerization initiator in combination with a sclerosing|hardenable monomer. What is necessary is just to adjust the usage-amount of this polymerization initiator according to the usage-amount of a sclerosing|hardenable monomer.

For example, in the adhesive composition of this embodiment, it is preferable that it is 0.1-10 mass parts with respect to 100 mass parts of sclerosing|hardenable monomers, and, as for the content rate of a polymerization initiator, it is more preferable that it is 0.5-5 mass parts.

≪Solvent ingredient≫

The adhesive composition of this embodiment can melt|dissolve (P) component and an arbitrary component as needed in a solvent component, and can be prepared.

As a solvent component, for example, each component for adhesive compositions can be melt|dissolved, and what can be used as a uniform solution can be used, and may be used individually by 1 type, and may be used in combination of 2 or more type.

As a solvent component, a hydrocarbon solvent and a petroleum solvent are mentioned, for example.

In addition, a hydrocarbon solvent and a petroleum solvent are collectively called below and also called "(S1) component". (S1) Solvent components other than a component may be called "(S2) component."

Examples of the hydrocarbon solvent include linear, branched, or cyclic hydrocarbons, for example, hexane, heptane, octane, nonane, methyloctane, decane, undecane, dodecane, tridecane, etc. chain hydrocarbons; Branched-chain hydrocarbons, such as isooctane, isononane, and isododecane; p-mentane, o-mentane, m-menthane, diphenylmentane, 1,4-terpine, 1,8-terpine, bornane, norbornane, finan, tuzan, karan, longi polene, α-terpinene , β-terpinene, γ-terpinene, α-pinene, β-pinene, α- bullfight zone, β- bullfight zone, cyclohexane, cycloheptane, cyclooctane, indene, pentalene, indane, tetrahydroindene, and cyclic hydrocarbons such as naphthalene, tetrahydronaphthalene (tetralin), and decahydronaphthalene (decalin).

The petroleum solvent is a solvent refined from heavy oil, and examples thereof include white kerosene, a paraffinic solvent, and an isoparaffinic solvent.

Moreover, as component (S2), the terpene solvent which has an oxygen atom, a carbonyl group, an acetoxy group etc. as a polar group is mentioned, For example, geraniol, nerol, linalol, citral, citronellol, menthol , isomenthol, neomenthol, α-terpineol, β-terpineol, γ-terpineol, terpinen-1-ol, terpinen-4-ol, dihydroterpinenyl acetate, 1,4-cine ol, 1,8-cineol, borneol, carbonone, yonone, tuyon, camphor, etc. are mentioned.

Moreover, as (S2) component, Lactones, such as (gamma)-butyrolactone; ketones such as acetone, methyl ethyl ketone, cyclohexanone (CH), methyl-n-pentyl ketone, methyl isopentyl ketone, and 2-heptanone; polyhydric alcohols such as ethylene glycol, diethylene glycol, propylene glycol, and dipropylene glycol; A compound having an ester bond, such as ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate, or dipropylene glycol monoacetate, monomethyl ether, monoethyl ether of the polyhydric alcohol or compound having an ester bond, Derivatives of polyhydric alcohols such as compounds having ether bonds such as monoalkyl ethers such as monopropyl ether and monobutyl ether, or monophenyl ether (among these, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME) is preferable); cyclic ethers such as dioxane; esters such as methyl lactate, ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, and ethyl ethoxypropionate; Aromatic organic solvents, such as anisole, ethyl benzyl ether, crezyl methyl ether, diphenyl ether, dibenzyl ether, phenetol, and butylphenyl ether, are also mentioned.

The content of the solvent component in the adhesive composition of the present embodiment may be appropriately adjusted according to the thickness of the adhesive layer to be formed, for example, in the range of 20 to 90 mass% with respect to the total amount (100 mass%) of the adhesive composition. It is preferable to be mine.

That is, it is preferable that the adhesive composition of this embodiment exists in the range whose solid content (total amount of compounding components except a solvent component) density|concentration is 10-80 mass %.

When content of a solvent component is in said preferable range, viscosity adjustment becomes easy.

As an adhesive composition of this embodiment, the composition (I)-(III) specifically, shown below is mentioned preferably.

Composition (I): A composition comprising component (P1), component (P2), a polymerization inhibitor, and a solvent component

Composition (II): A composition comprising component (P1), component (P2), a curable monomer, a polymerization initiator, and a solvent component

Composition (III): A composition comprising component (P1), component (P2), component (P3), polymerization inhibitor, and solvent component

The adhesive composition of this embodiment can be prepared by mixing each other component with a solvent component, and melt|dissolving or disperse|distributing it.

As this solvent component, it is preferable to use the thing containing a hydrocarbon solvent from the solubility point of (P) component, and it is more preferable to use the thing containing a branched-chain hydrocarbon or cyclic hydrocarbon solvent.

When the solvent component contains a branched chain or cyclic hydrocarbon solvent, clouding that may occur when the adhesive composition is stored in a liquid state (especially at a low temperature) is easily prevented, and storage stability can be further improved.

Moreover, as a solvent component, it is preferable to use the thing containing a condensed polycyclic hydrocarbon or a branched chain hydrocarbon as a hydrocarbon solvent. In this case, the solvent component may be selected from the group consisting of condensed polycyclic hydrocarbons and branched chain hydrocarbons, and may contain other components such as saturated aliphatic hydrocarbons.

Among the solvent components, the content of those selected from the group consisting of condensed polycyclic hydrocarbons and branched chain hydrocarbons is preferably 40 parts by mass or more, more preferably 60 parts by mass or more, with respect to 100 parts by mass of the total hydrocarbon solvent, 80 It is more preferable that it is more than a mass part. If it is 40 mass parts or more of the whole hydrocarbon solvent, the solubility of (P)component will become more favorable.

In the case of the said composition (II), a polymerization initiator can be mix|blended by a well-known method just before using an adhesive composition.

In addition, you may mix|blend a polymerization initiator or a polymerization inhibitor in the form of the solution previously dissolved in the said (S2) component. (S2) What is necessary is just to adjust the usage-amount of component suitably according to the kind etc. of a polymerization initiator or polymerization inhibitor, For example, 1-50 mass parts is preferable with respect to 100 mass parts of (S1) component, 5-30 mass parts more preferably. (S2) A polymerization initiator or a polymerization inhibitor can fully be melt|dissolved as the usage-amount of a component is in said preferable range.

Moreover, it is preferable that the adhesive composition which concerns on this embodiment satisfy|fills at least 1 of the following requirements.

(Requirement 1): A test piece of 20 mm × 5 mm × thickness 0.5 mm was prepared from the adhesive composition, and the test piece was heated from room temperature to 215° C. at a rate of 5° C./min under tensile conditions at a frequency of 1 Hz. When given to dynamic viscoelasticity measurement, the complex elastic modulus E* ₅₀ in 50 degreeC becomes less than 1.0x10< ⁹ >Pa.

(Requirement 2): When a test piece is subjected to dynamic viscoelasticity measurement under the same conditions as (requirement 1), the complex elastic modulus E* ₁₅₀ at 150°C becomes more than 3.0×10 ⁶ Pa.

(Requirement 3): Under the same conditions as (Requirement 1) and (Requirement 2), when the complex elastic modulus E* ₅₀ at 50°C and the complex elastic modulus E* ₁₅₀ at 150°C are obtained, E* ₅₀ /E* A ratio of ₁₅₀ becomes 2000 or less.

In addition, the dynamic viscoelasticity measurement in each requirement can be performed according to the following procedure using the dynamic viscoelasticity measuring apparatus (Rheogel-E4000, UBM Co., Ltd. make) (the same also about the following requirements).

(order)

First, an adhesive composition is apply|coated on the PET film with a mold release agent formed, and it heats in an oven under atmospheric pressure at 50 degreeC and 150 degreeC for 60 minutes, respectively, and forms an adhesive bond layer (thickness 0.5mm).

Next, the complex elastic modulus E* of each temperature of the adhesive bond layer peeled from the PET film is measured using the said dynamic viscoelasticity measuring apparatus.

The measurement conditions were a sample shape of 20 mm × 5 mm × thickness 0.5 mm, under tensile conditions at a frequency of 1 Hz, from room temperature to 215° C., under the condition that the temperature was raised at a rate of 5° C./min, 50° C., 150 The complex modulus of elasticity in °C is measured.

When the adhesive composition according to the present embodiment satisfies (requirement 1), the adhesive composition can exhibit still higher adhesive ability in a temperature range relatively close to room temperature. The complex elastic modulus E* ₅₀ at 50°C is more preferably less than 0.9×10 ⁹ Pa, still more preferably less than 0.6×10 ⁹ Pa.

Although the lower limit of the complex elastic modulus E* ₅₀ in 50 degreeC is not specifically limited, For example, it is 1.0x10< ⁷ >Pa or more.

When the adhesive composition which concerns on this embodiment satisfy|fills (requirement 2), it can suppress with high precision that an adhesive composition produces the flow etc. in a high temperature area|region. Thereby, it becomes difficult to raise|generate the position shift of the board|substrate at the time of high temperature processing. Complex elastic modulus E* ₁₅₀ in 150 degreeC becomes like this. More preferably, it is more than 3.5 x 10 ⁶ Pa, More preferably, it is more than 5.0 x 10 ⁶ Pa.

Although the upper limit of the complex elastic modulus E* ₁₅₀ in 150 degreeC is not specifically limited, For example, it is 1.0x10< ⁸ >Pa or less.

When the adhesive composition which concerns on this embodiment satisfy|fills (requirement 3), the adhesive composition becomes easy to exhibit the stable adhesive function at the time of normal temperature and heating. This ratio of E* ₅₀ /E* ₁₅₀ is more preferably 1000 or less, still more preferably 500 or less, still more preferably 100 or less.

Although the lower limit of the ratio of E* ₅₀ /E* ₁₅₀ is not specifically limited, For example, it is 5 or more, Preferably it is 1.5 or more.

In the adhesive composition of this embodiment demonstrated above, the adhesive layer with which heat resistance became higher can be formed by sharing the hydrocarbon resin (P1) and resin (P2) whose glass transition temperature is 180 degreeC or more. Thereby, the adhesive layer formed with the adhesive composition of this embodiment does not generate|occur|produce easily, for example the position shift of a board|substrate before and behind sealing operation under the influence of high temperature processing at the time of semiconductor package manufacture.

In addition, according to the adhesive composition of this embodiment, a board|substrate (bare chip) adheres to the adhesive layer formed with sufficient intensity|strength (die bonding property is favorable).

Moreover, according to the adhesive composition of this embodiment, the solubility with respect to the hydrocarbon solvent of the adhesive layer formed is high. Accordingly, the adhesive layer can be easily cleaned and removed from the substrate during semiconductor package manufacturing.

(Adhesive composition (second aspect))

Then, the adhesive composition which concerns on the 2nd aspect of this invention is demonstrated.

The adhesive composition which concerns on the 2nd aspect of this invention is for bonding a support body and a board|substrate together. The adhesive composition of this embodiment contains a resin component (P). This resin component (P) contains at least a hydrocarbon resin (P1), and satisfy|fills the following requirements.

(Requirement 1): A test piece of 20 mm × 5 mm × thickness 0.5 mm was prepared from the adhesive composition, and the test piece was heated from room temperature to 215° C. at a rate of 5° C./min under tensile conditions at a frequency of 1 Hz. When given to dynamic viscoelasticity measurement, the complex elastic modulus E* ₅₀ in 50 degreeC becomes less than 1.0x10< ⁹ >Pa.

(Requirement 2): When a test piece is subjected to dynamic viscoelasticity measurement under the same conditions as (requirement 1), the complex elastic modulus E* ₁₅₀ at 150°C becomes more than 3.0×10 ⁶ Pa.

The component (P1), component (P2), component (P3), which can constitute the resin component (P) according to this aspect, and component (P3) and their blending ratio are as described as the adhesive composition according to the first aspect described above. However, the adhesive composition of this embodiment does not necessarily contain the component (P2), and even if the component corresponding to the component (P2) is mix|blended, even if the glass transition temperature (Tg) of this component is not the above-mentioned range, do.

It is preferable that the adhesive composition of this aspect contains the component which has the structural unit (u21) derived from the monomer containing a maleimide skeleton. This structural unit (u21) is typically contained in any of the resins constituting the resin component (P).

Here, typically, the structural unit (u21) is a structural unit represented by the following general formula (p2-1). In addition, with respect to the C1-C30 organic group shown here, what can be employ|adopted is as above-mentioned.

[Formula 9]

[In the formula, R ^u10 represents an organic group having 1 to 30 carbon atoms.]

In addition, the adhesive composition which concerns on this aspect may contain the arbitrary component and solvent component which can be contained in the adhesive composition which concerns on a 1st aspect, The compounding ratio is also as above-mentioned.

As an adhesive composition which concerns on this aspect, the composition (IV)-(VI) shown below specifically, is mentioned preferably. These compositions are obtained by dissolving or dispersing a necessary component in a solvent component.

Composition (IV): Composition containing component (P1), polymerization inhibitor and solvent component

Composition (V): A composition comprising component (P1), a curable monomer, a polymerization initiator, and a solvent component

Composition (VI): A composition comprising component (P1), component (P3), a polymerization inhibitor, and a solvent component

The adhesive composition which concerns on this embodiment makes it essential that said (requirement 1) is satisfy|filled. Thereby, the adhesive composition can exhibit still higher adhesion|attachment ability in the temperature range comparatively close to room temperature. The complex elastic modulus E* ₅₀ at 50°C is more preferably less than 0.9×10 ⁹ Pa, still more preferably less than 0.6×10 ⁹ Pa.

Although the lower limit of the complex elastic modulus E* ₅₀ in 50 degreeC is not specifically limited, For example, it is 1.0x10< ⁷ >Pa or more.

Moreover, in addition to said (requirement 1), the adhesive composition which concerns on this embodiment makes it essential that said (requirement 2) is satisfy|filled. It can suppress with high precision that an adhesive composition causes the flow etc. in a high temperature area|region. Thereby, it becomes difficult to raise|generate the position shift of the board|substrate at the time of high temperature processing. Complex elastic modulus E* ₁₅₀ in 150 degreeC becomes like this. More preferably, it is more than 3.5 x 10 ⁶ Pa, More preferably, it is more than 5.0 x 10 ⁶ Pa.

Although the upper limit of the complex elastic modulus E* ₁₅₀ in 150 degreeC is not specifically limited, For example, it is 1.0x10< ⁸ >Pa or less.

Moreover, it is preferable that the adhesive composition which concerns on this embodiment satisfy|fills the following requirements (requirement 3).

(Requirement 3): Under the same conditions as (Requirement 1) and (Requirement 2), when the complex elastic modulus E* ₅₀ at 50°C and the complex elastic modulus E* ₁₅₀ at 150°C are obtained, E* ₅₀ /E* A ratio of ₁₅₀ becomes 2000 or less.

When the adhesive composition which concerns on this embodiment satisfy|fills (requirement 3), the adhesive composition becomes easy to exhibit the stable adhesive function at the time of normal temperature and heating. This ratio of E* ₅₀ /E* ₁₅₀ is more preferably 1000 or less, still more preferably 500 or less, still more preferably 100 or less.

Although the lower limit of the ratio of E* ₅₀ /E* ₁₅₀ is not specifically limited, For example, it is 5 or more, Preferably it is 1.5 or more.

In the adhesive composition of this embodiment demonstrated above, the adhesive layer with which heat resistance became higher can be formed by satisfying specific requirements, including hydrocarbon resin (P1). Thereby, the adhesive layer formed with the adhesive composition of this embodiment does not generate|occur|produce easily, for example the position shift of a board|substrate before and behind sealing operation under the influence of high temperature processing at the time of semiconductor package manufacture.

In addition, according to the adhesive composition of this embodiment, a board|substrate (bare chip) adheres to the adhesive layer formed with sufficient intensity|strength (die bonding property is favorable).

Moreover, according to the adhesive composition of this embodiment, the solubility with respect to the hydrocarbon solvent of the adhesive layer formed is high. Accordingly, the adhesive layer can be easily cleaned and removed from the substrate during semiconductor package manufacturing.

(Support with adhesive layer formed)

The support body with the adhesive bond layer which concerns on a 3rd aspect of this invention is equipped with the support body to which a board|substrate is bonded, and the adhesive bond layer formed using the adhesive agent composition which concerns on the said 1st or 2nd aspect on the said support body. Therefore, in the support body with such an adhesive layer, heat resistance is high.

In the laminate 10 shown in Fig. 1, the support 12 and the substrate 4 are bonded together via the adhesive layer 3, that is, the substrate 4 is adhered on the support 123 with the adhesive layer formed thereon. will be. The support body 123 with the adhesive layer of this embodiment is equipped with the support body 12 provided with the separation layer 2 on the support base 1, and the adhesive layer 3 formed on the support body 12.

<Support>

The support body 12 in FIG. 1 is equipped with the support base 1 and the separation layer 2 formed on the support base 1 .

≪Support body≫

The support substrate has a property of transmitting light. A support base is a member which supports a board|substrate, and is bonded to a board|substrate via an adhesive layer. Therefore, it is preferable as a support base material which has the intensity|strength required in order to prevent the damage|damage or deformation|transformation of a board|substrate at the time of thinning of a sealing body, conveyance of a board|substrate, mounting on a board|substrate, etc. Moreover, it is preferable that the support base transmits the light of the wavelength which can change the quality of a separation layer.

As a material of a support base, glass, silicone, an acrylic resin, etc. are used, for example. As a shape of a support body, although a rectangle, a circle|round|yen etc. are mentioned, for example, It is not limited to this.

In addition, as a support base, what enlarged the size of the circular support base for further high-density integration or the improvement of production efficiency, and a large panel with a rectangular shape in planar view can also be used.

≪Separation layer≫

A separation layer is a layer which makes it possible to isolate|separate a support base from the board|substrate which is adjacent to a contact bonding layer, changes in quality by irradiation of light, and is bonded to a support body.

This separation layer can be formed using the composition for separation layer formation mentioned later, for example, by baking the component contained in the composition for separation layer formation, or by a chemical vapor deposition (CVD) method. This separation layer is preferably altered by absorbing light irradiated through the support gas.

In addition, although it is preferable that the separation layer is formed only from the material which absorbs light, it may be a layer in which the material which does not have a structure which absorbs light is mix|blended in the range which does not impair the essential characteristic in this invention. .

The term "deformation of the separation layer" refers to a phenomenon in which the separation layer can be destroyed by an external force, or in a state in which the adhesive force between the separation layer and the layer in contact with the separation layer is reduced. A separation layer becomes weak by absorbing light, and loses the intensity|strength or adhesiveness before receiving irradiation of light. The deterioration of the separation layer occurs by causing decomposition by the energy of the absorbed light, a change in steric configuration, or dissociation of a functional group.

It is preferable to exist in the range of 0.05 micrometer or more and 50 micrometers or less, for example, and, as for the thickness of a separation layer, it is more preferable to exist in the range of 0.3 micrometer or more and 1 micrometer or less.

When the thickness of the separation layer is within the range of 0.05 µm or more and 50 µm or less, desired alteration can be generated in the separation layer by short-time light irradiation and low-energy light irradiation. Moreover, it is especially preferable that the thickness of a separation layer exists in the range of 1 micrometer or less from a viewpoint of productivity.

It is preferable that the separation layer has a flat surface (no unevenness is formed) on the side in contact with the adhesive layer, whereby the adhesive layer can be easily formed, and the support base and the substrate are adhered uniformly. it gets easier

(Composition for forming a separation layer)

The composition for forming a separation layer, which is a material for forming the separation layer, includes, for example, fluorocarbon, a polymer having a repeating unit including a structure having light absorption, an inorganic substance, a compound having an infrared absorption structure, and infrared absorption substances, reactive polysilsesquioxane, or those containing a resin component having a phenol skeleton.

In addition, the composition for forming a separation layer contains, as an optional component, a filler, a plasticizer, a thermal acid generator component, a photoacid generator component, an organic solvent component, a surfactant, a sensitizer, or a component capable of improving the separation property of the supporting gas. may contain.

· Fluorocarbon

The separation layer may contain fluorocarbon. The separation layer constituted of fluorocarbon is altered by absorbing light, and as a result, the strength or adhesiveness before being irradiated with light is lost. Therefore, by applying a slight external force (for example, lifting the support body, etc.), the separation layer is broken, and it is possible to easily separate the support body and the substrate. The fluorocarbon constituting the separation layer can be preferably formed by plasma CVD.

Fluorocarbon absorbs light having an intrinsic range of wavelengths depending on its type. By irradiating the separation layer with light having a wavelength in the range absorbed by the fluorocarbon used for the separation layer, the fluorocarbon can be preferably altered. It is preferable that the light absorptivity in a separation layer is 80 % or more.

The light irradiated to the separation layer is, for example, a solid laser such as a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, or a fiber laser, or a dye laser, depending on the wavelength at which the fluorocarbon can be absorbed. A liquid laser, CO ₂ laser, excimer laser, Ar laser, gas laser such as He-Ne laser, laser light such as semiconductor laser, free electron laser, or non-laser light may be appropriately used. As a wavelength which can change fluorocarbon, the wavelength of the range of 600 nm or less can be used, for example.

A polymer having a repeating unit containing a structure having light absorption properties

The separation layer may contain a polymer having a repeating unit having a structure having light absorption properties. The polymer changes in quality when irradiated with light.

The atomic group containing the conjugated pi electron system which consists of a substituted or unsubstituted benzene ring, a condensed ring, or a heterocyclic ring is mentioned to the structure which has light absorption, for example. More specifically, the structure having light absorption is a cardo structure or a benzophenone structure, diphenylsulfoxide structure, diphenylsulfone structure (bisphenylsulfone structure), diphenyl structure present in the side chain of the polymer. Or a diphenylamine structure is mentioned.

The structure having the above-described light absorption can absorb light having a wavelength in a desired range depending on the type thereof. For example, it is preferable to exist in the range of 100-2000 nm, and, as for the wavelength of the light which the structure which has said light absorptivity can absorb, it is more preferable to exist in the range of 100-500 nm.

The light that can be absorbed by the structure having the above light absorption property is, for example, a high-pressure mercury lamp (wavelength 254 nm or more and 436 nm or less), KrF excimer laser (wavelength 248 nm), ArF excimer laser (wavelength 193 nm), Light generated from an F ₂ excimer laser (wavelength 157 nm), XeCl laser (wavelength 308 nm), XeF laser (wavelength 351 nm) or solid-state UV laser (wavelength 355 nm), or g-ray (wavelength 436 nm), h-ray (wavelength 405 nm) or i-line (wavelength 365 nm) or the like.

· Minerals

The separation layer may be formed of an inorganic material. What is necessary is just to change the quality of this inorganic substance by absorbing light, For example, 1 or more types chosen from the group which consists of a metal, a metal compound, and carbon are mentioned preferably. A metal compound is a compound containing a metal atom, For example, a metal oxide and a metal nitride are mentioned.

As such an inorganic substance, _one or more types selected from _the group which consists of gold, silver, copper, iron, nickel, aluminum, titanium, chromium, SiO2, SiN, _Si3N4 , TiN, and carbon are mentioned.

In addition, carbon is a concept in which the allotrope of carbon can also be included, for example, diamond, fullerene, diamond-like carbon, carbon nanotube, etc. are included.

The inorganic material absorbs light having an intrinsic wavelength range according to its type.

The light irradiated to the separation layer made of an inorganic material is, for example, a solid laser such as a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, a fiber laser, or a dye laser, depending on the wavelength at which the inorganic material can be absorbed. A liquid laser such as a CO ₂ laser, an excimer laser, an Ar laser, a gas laser such as a He-Ne laser, laser light such as a semiconductor laser, a free electron laser, or a non-laser light may be appropriately used.

The separation layer made of an inorganic material may be formed on the support substrate by a known technique such as, for example, sputtering, chemical vapor deposition (CVD), plating, plasma CVD, or spin coating.

· A compound with a structure that absorbs infrared rays

The separation layer may contain a compound having an infrared absorptive structure. This compound having an infrared absorptive structure changes in quality by absorbing infrared rays.

As a structure having infrared absorption, or a compound having this structure, for example, alkane, alkene (vinyl, trans, cis, vinylidene, trisubstituted, tetrasubstituted, conjugated, cumulene, cyclic), alkyne ( monocyclic aromatics (benzene, monosubstituted, disubstituted, trisubstituted), alcohols or phenols (free OH, intramolecular hydrogen bonding, intermolecular hydrogen bonding, saturated secondary, saturated tertiary, unsaturated secondary, unsaturated tertiary), acetal, ketal, aliphatic ether, aromatic ether, vinyl ether, oxylan ring ether, peroxide ether, ketone, dialkylcarbonyl, aromatic carbonyl, enol of 1,3-diketone; o-hydroxyaryl ketone, dialkylaldehyde, aromatic aldehyde, carboxylic acid (dimer, carboxylic acid anion), formic acid ester, acetate ester, conjugated ester, non-conjugated ester, aromatic ester, lactone (β-, γ -, δ-), aliphatic acid chloride, aromatic acid chloride, acid anhydride (conjugated, non-conjugated, cyclic, acyclic), primary amide, secondary amide, lactam, primary amine (aliphatic, aromatic), secondary secondary amine (aliphatic, aromatic), tertiary amine (aliphatic, aromatic), primary amine salt, secondary amine salt, tertiary amine salt, ammonium ion, aliphatic nitrile, aromatic nitrile, carbodiimide; Aliphatic isonitrile, aromatic isonitrile, isocyanic acid ester, thiocyanate, aliphatic isothiocyanate, aromatic isothiocyanate, aliphatic nitro compound, aromatic nitro compound, nitroamine, nitrosoamine, nitrate ester, Nitrite ester, nitroso bond (aliphatic, aromatic, monomer, dimer), mercaptan or sulfur compounds such as thiophenol or thiolic acid, thiocarbonyl group, sulfoxide, sulfone, sulfonyl chloride, primary sulfonamide, secondary Sulfonamide, sulfuric ester, carbon-halogen bond, Si-A ¹ bond (A ¹ is, H, C, O or halogen), PA ² bond (A ² is, H, C or O) or Ti-O bond can be heard .

Examples of the structure including the carbon-halogen bond include -CH ₂ Cl, -CH ₂ Br, -CH ₂ I, -CF ₂ -, -CF ₃ , -CH=CF ₂ , -CF=CF ₂ , aryl fluoride or aryl chloride; and the like.

As a structure containing said Si-A ¹ bond, SiH, SiH ₂ , SiH ₃ , Si-CH ₃ , Si-CH ₂ -, Si-C ₆ H ₅ , SiO-aliphatic, Si- OCH ₃ , Si-OCH ₂ CH ₃ , Si-OC ₆ H ₅ , Si-O-Si, Si-OH, SiF, SiF ₂ or SiF ₃ , and the like. As ^a structure containing Si-A1 bond, it is preferable to form especially siloxane skeleton or silsesquioxane skeleton.

As a structure including the PA ² bond, for example, PH, PH ₂ , P-CH ₃ , P-CH ₂ -, PC ₆ H ₅ , A ³ ₃ -PO (A ³ is an aliphatic group or an aromatic group) group), (A ⁴ O) ₃ -PO (A ⁴ is an alkyl group), P-OCH ₃ , P-OCH ₂ CH ₃ , P-OC ₆ H ₅ , POP, P-OH or O=P-OH, etc. can be heard

As the compound containing the Ti-O bond, for example, (i) tetra-i-propoxytitanium, tetra-n-butoxytitanium, tetrakis(2-ethylhexyloxy)titanium or titanium- Alkoxy titanium, such as i- propoxy octylene glycolate; (ii) chelate titanium such as di-i-propoxy/bis(acetylacetonato)titanium or propanedioxytitaniumbis(ethylacetoacetate); (iii) iC ₃ H ₇ O-[-Ti(OiC ₃ H ₇ ) ₂ -O-] _n -iC ₃ H ₇ or nC ₄ H ₉ O-[-Ti(OnC ₄ H ₉ ) ₂ -O-] titanium polymers such as _n -nC ₄ H ₉ ; (iv) acylates such as tri-n-butoxytitanium monostearate, titanium stearate, di-i-propoxytitanium diisostearate or (2-n-butoxycarbonylbenzoyloxy)tributoxytitanium titanium ; (v) water-soluble titanium compounds, such as di-n-butoxy bis(triethanolaminato)titanium, etc. are mentioned.

Among them, as a compound containing a Ti-O bond, di-n-butoxy bis(triethanolaminato)titanium (Ti(OC ₄ H ₉ ) ₂ [OC ₂ H ₄ N(C ₂ H ₄ OH) ₂ ] ₂ ) is preferable.

The above-mentioned infrared absorptive structure can absorb infrared rays having a wavelength in a desired range depending on the selection of the type. The wavelength of the infrared rays which said infrared ray absorptive structure can absorb specifically, exists in the range of 1-20 micrometers, for example, and can absorb the inside of the range of 2-15 micrometers more preferably.

Moreover, when the said structure is a Si-O bond, a Si-C bond, or a Ti-O bond, the inside of the range of 9-11 micrometers is preferable.

In addition, the wavelength of infrared rays which can be absorbed by each said structure can be understood easily by a person skilled in the art. For example, as the absorption band in each structure, Non-Patent Document: SILVERSTEIN · BASSLER · MORRILL "Identification method by spectrum of organic compounds (5th edition) -Combination of MS, IR, NMR, UV-" (1992) Published in year) pages 146 to 151 can be referred to.

As a compound having an infrared absorptive structure used for forming the separation layer, among the compounds having a structure as described above, if it can be dissolved in a solvent for application and solidified to form a high layer, It is not specifically limited. However, in order to effectively modify the compound in the separation layer and to facilitate separation of the support substrate and the substrate, the separation layer has a large infrared absorption, that is, the infrared transmittance when the separation layer is irradiated with infrared rays. It is preferable that this is low. Specifically, it is preferable that the infrared transmittance in a separation layer is lower than 90 %, and it is more preferable that the infrared transmittance is lower than 80 %.

· Infrared absorbing material

The separation layer may contain an infrared absorbing substance. This infrared absorbing substance may change in quality by absorbing light, and for example, carbon black, iron particles, or aluminum particles can be preferably used.

The infrared absorbing material absorbs light having a wavelength in an intrinsic range according to its type. By irradiating the separation layer with light having a wavelength in the range that the infrared absorption material used for the separation layer absorbs, the infrared absorption material can be preferably altered.

· Reactive polysilsesquioxane

The separation layer can be formed by polymerizing reactive polysilsesquioxane. The separation layer thus formed has high chemical resistance and high heat resistance.

"Reactive polysilsesquioxane" refers to polysilsesquioxane having a silanol group or a functional group capable of forming a silanol group by hydrolysis at the terminal of the polysilsesquioxane skeleton. By condensing the said silanol group or the functional group which can form a silanol group, it can mutually superpose|polymerize. In addition, if the reactive polysilsesquioxane has a silanol group or a functional group capable of forming a silanol group, the reactive polysil having a silsesquioxane skeleton such as a random structure, a cage structure, or a ladder structure Sesquioxane can be employ|adopted.

It is preferable that it is 70-99 mol%, and, as for siloxane content of reactive polysilsesquioxane, it is more preferable that it is 80-99 mol%.

If the siloxane content of the reactive polysilsesquioxane is within the above preferred range, a separation layer that can be preferably altered is formed by irradiating infrared rays (preferably far-infrared rays, more preferably light with a wavelength of 9 to 11 µm). can do.

It is preferable that it is 500-50000, and, as for the weight average molecular weight (Mw) of reactive polysilsesquioxane, it is more preferable that it is 1000-10000.

If the weight average molecular weight (Mw) of reactive polysilsesquioxane is in said preferable range, it can melt|dissolve suitably in a solvent, and can apply|coat it on a support plate suitably.

As a commercial item which can be used as reactive polysilsesquioxane, SR-13, SR-21, SR-23, SR-33 (brand name) etc. by the Konishi Chemical Industry Co., Ltd. product are mentioned, for example.

· A resin component having a phenol skeleton

The separation layer may contain a resin component having a phenol skeleton. By having a phenol skeleton, it changes easily (oxidation etc.) by heating etc., and photoreactivity becomes high.

"It has a phenol skeleton" here means that the hydroxybenzene structure is included.

The resin component having a phenol skeleton has film-forming ability, and preferably has a molecular weight of 1000 or more. When the molecular weight of the said resin component is 1000 or more, film-forming ability improves. As for the molecular weight of the said resin component, 1000-30000 are more preferable, 1500-20000 are still more preferable, 2000-15000 are especially preferable. When the molecular weight of the said resin component is below the upper limit of the said preferable range, the solubility with respect to the solvent of the composition for separation layer formation increases.

In addition, as molecular weight of a resin component, the weight average molecular weight (Mw) of polystyrene conversion by GPC (gel permeation chromatography) shall be used.

Examples of the resin component having a phenol skeleton include novolak-type phenol resin, resor-type phenol resin, hydroxystyrene resin, hydroxyphenylsilsesquioxane resin, hydroxybenzylsilsesquioxane resin, and phenol skeleton-containing acrylic. Resin and the like resin which has a repeating unit represented by General formula (P2) mentioned later are mentioned. Among these, a novolak-type phenol resin and a resor-type phenol resin are more preferable.

<Adhesive layer>

The contact bonding layer 3 is a layer for bonding the support base 1 and the board|substrate 4 together, and can be formed using the composition for contact bonding layer formation of embodiment mentioned above.

It is preferable to exist in the range of 0.1 micrometer or more and 50 micrometers or less, for example, and, as for the thickness of the contact bonding layer 3, it is more preferable to exist in the range of 1 micrometer or more and 10 micrometers or less.

The support base 1 and the board|substrate 4 can be bonded together more favorably as the thickness of a contact bonding layer exists in the range of 0.1 micrometer or more and 50 micrometers or less. In addition, when the thickness of the adhesive layer is 1 µm or more, the substrate can be sufficiently fixed on the support base, and when the thickness of the adhesive layer is 10 µm or less, the adhesive layer can be easily removed in a subsequent removal step.

The support body with an adhesive layer of this embodiment can be manufactured by carrying out similarly operation of the [adhesive layer formation process] mentioned later.

Since the adhesive layer to which the composition for adhesive layer formation of the above-mentioned embodiment is applied is formed in the support body with the adhesive layer of the above-mentioned embodiment, heat resistance is high, More preferably, die bonding property and washing-removability are also high.

(adhesive film)

An adhesive film according to a fourth aspect of the present invention is provided with a film and an adhesive layer formed on the film using the adhesive composition according to the first or second aspect.

By applying such an adhesive film, it is possible to preferably form an adhesive layer on the support. Compared with the case where an adhesive composition is directly applied on a support body to form an adhesive layer, an adhesive layer with favorable film thickness uniformity and surface smoothness can be formed easily.

As a film, for example, it is easy to peel the adhesive layer formed on the film from the said film, Preferably, the release film which can transcribe|transfer the adhesive layer on to-be-processed surfaces, such as a support body, is mentioned.

Specific examples of the film include synthetic resin films such as polyethylene terephthalate, polyethylene, polypropylene, polycarbonate or polyvinyl chloride, and a flexible film is more preferred.

It is preferable that the release process is given to the said film so that transcription|transfer may become easy as needed.

What is necessary is just to set the thickness of a film suitably, and it is 15-125 micrometers, for example.

Such an adhesive film is manufactured by forming an adhesive bond layer on a film. For example, the method of apply|coating an adhesive agent composition on a film is used so that the dry film thickness of an adhesive bond layer may be set to 10-1000 micrometers. In that case, a well-known method can be used suitably according to the film thickness and uniformity of a desired contact bonding layer.

In addition, you may protect an adhesive film by coat|covering the exposed surface of a contact bonding layer with a protective film. A protective film is not limited as long as it can peel from a contact bonding layer, For example, a polyethylene terephthalate film, a polypropylene film, and a polyethylene film are preferable. Moreover, in order that each protective film may make peeling from an adhesive layer easy, it is preferable that silicone was coated or baked.

The method of using the adhesive film is, for example, in the case of using a protective film, after peeling it, overlapping the exposed adhesive layer on the surface of the support, and moving the heating roller from the top of the film (the back side of the surface on which the adhesive layer is formed) , a method in which the adhesive layer is thermocompressed to the surface of the support is exemplified.

In addition, if the protective film peeled from the adhesive film is wound up in roll shape with rollers, such as a winding-up roller, one by one, it can be reused.

(Laminate)

As for the laminated body which concerns on the 5th aspect of this invention, a support body and a board|substrate are bonded together via an adhesive layer.

As shown in Fig. 1, the laminate 10 of the present embodiment includes a support 12 and a substrate 4 bonded together via an adhesive layer 3, that is, a support 123 with an adhesive layer formed thereon; It is equipped with the board|substrate 4 arrange|positioned on the surface 3s on the opposite side to the support body 12 side of the contact bonding layer 3 with which the support body 123 with an adhesive bond layer was provided.

The support body 12 is the thing in which the support base 1 and the separation layer 2 were laminated|stacked, and description about this is the same as the description in the said <support body>.

Description of the adhesive layer 3 is the same as the description in the said <Adhesive layer>.

<substrate>

The board|substrate 4 is the state supported by the support base 1, and is provided for processes, such as thinning and mounting. Structures, such as an integrated circuit and a metal bump, are mounted on the board|substrate 4, for example.

As the board|substrate 4, although a silicon wafer board|substrate is used typically, it is not limited to this, A ceramic board|substrate, a thin film board|substrate, a flexible board|substrate, etc. may be used.

In the present embodiment, the element is a semiconductor element or other element, and may have a structure of a single layer or a plurality of layers. Moreover, when an element is a semiconductor element, the electronic component obtained by dicing a sealing substrate becomes a semiconductor device.

Since the adhesive layer to which the composition for adhesive layer formation of the above-mentioned embodiment is applied is formed in the laminated body of embodiment mentioned above, heat resistance is higher more. Thereby, in the laminated body of this embodiment, it is hard to generate|occur|produce the position shift of a board|substrate before and behind sealing operation, for example under the influence of high temperature processing at the time of semiconductor package manufacture.

In addition, in the laminate of the present embodiment, the substrate (bare chip) is fixed to the adhesive layer to be formed with sufficient strength (the die bonding property is good).

Moreover, in the laminated body of this embodiment, the solubility with respect to the hydrocarbon solvent of an adhesive layer is high. Accordingly, the adhesive layer can be easily cleaned and removed from the substrate during semiconductor package manufacturing.

In the laminate of the above-described embodiment, the support substrate 1 and the separation layer 2 are adjacent to each other, but it is not limited to this, and another layer is added between the support substrate 1 and the separation layer 2 may be formed with In this case, the other layer should just be comprised from the material which transmits light. According to this, the layer which provides desirable properties, etc. to the laminated body 10 can be added suitably, without preventing the incident of light to the separation layer 2 . The wavelength of the light that can be used differs according to the kind of material constituting the separation layer 2 . Therefore, the material constituting the other layer does not need to transmit light of all wavelengths, and can be appropriately selected from materials which transmit light of a wavelength that can alter the material constituting the separation layer 2 .

(Method for manufacturing a laminate)

A 6th aspect of this invention is a manufacturing method of the laminated body by which the support body and the board|substrate were bonded together via the contact bonding layer, Comprising: It has a contact bonding layer formation process and a bonding process.

<First embodiment>

The manufacturing method of the laminated body which concerns on 1st Embodiment has the process of producing a support body, a contact bonding layer formation process, and a bonding process.

It is a schematic process diagram explaining one Embodiment of the manufacturing method of a laminated body.

FIG.2(a) is a figure explaining the process of producing a support body, FIG.2(b) is a figure explaining a contact bonding layer formation process, FIG.2(c) is a figure explaining a bonding process.

In the manufacturing method of the laminated body of this embodiment, what contains a fluorocarbon is used as a composition for separation layer formation. Moreover, as a composition for contact bonding layer formation, the thing containing the component (P1) and (P2) which concerns on embodiment mentioned above is used.

[Process of manufacturing the support]

The process of producing the support body in embodiment is a process of forming a separation layer on one side of a support base body using the composition for separation layer formation, and obtaining a support body.

In Fig. 2(a) , the separation layer 2 is formed on the support base 1 by using a composition for forming a separation layer (that contains a fluorocarbon) (that is, the support substrate with the separation layer formed thereon). has been produced).

Although the formation method of the separation layer 2 with respect to the support base 1 phase is not specifically limited, For example, Methods, such as spin coating, dipping, roller blade, spray application, slit application|coating, chemical vapor deposition (CVD), etc. can be heard

For example, in the step of manufacturing the support, a film is formed by removing the solvent component from the coating layer of the composition for forming a separation layer applied on the support base 1 under a heating environment or a reduced pressure environment, or the support base ( 1) A support body is obtained by forming into a film by vapor deposition on it.

[Adhesive layer forming process]

The contact bonding layer formation process in embodiment is a process of forming a contact bonding layer on one side on a support body using the composition for contact bonding layer formation of embodiment mentioned above.

In FIG.2(b), the adhesive layer 3 is formed on the surface of the separation layer 2 side of the support body 12 using the composition for adhesive layer formation of the above-mentioned embodiment (that is, the support body with an adhesive layer). (123) has been produced).

Although the formation method of the adhesive layer 3 with respect to the support body 12 is not specifically limited, For example, methods, such as spin coating, dipping, a roller blade, spray coating, slit coating, are mentioned. And the adhesive composition is apply|coated and heated on the support body 12, or the solvent component contained in the adhesive composition is removed in a pressure-reduced environment.

Then, when a contact bonding layer contains a sclerosing|hardenable monomer and a thermal polymerization initiator, what is necessary is just to superpose|polymerize the said sclerosing|hardenable monomer by heating. Conditions for heating the adhesive layer 3 may be appropriately set based on the 1-minute half-life temperature and 1-hour half-life temperature in the thermal polymerization initiator, for example, at a temperature within the range of 50 to 300° C., under vacuum. or in an inert gas atmosphere such as nitrogen gas, and more preferably in an inert gas atmosphere.

In addition, when the adhesive layer contains a curable monomer and a photoinitiator, what is necessary is just to polymerize a curable monomer by exposing in inert gas atmosphere, such as nitrogen gas. What is necessary is just to set the conditions to expose suitably according to the kind etc. of a photoinitiator.

[bonding process]

The bonding process in embodiment is a process of bonding the said support body and the said board|substrate through the said contact bonding layer formed in the said contact bonding layer formation process. As described above, when the separation layer 2 is formed on the support base 1, this bonding is the bonding between the support 12 and the substrate 4 while making the separation layer 2 and the adhesive layer 3 face each other. concatenate

In FIG.2(c), the support base 1 (support body 12) on which the separation layer 2 was formed, and the board|substrate 4 which does not form the separation layer 2 are interposed with the adhesive layer 3 It laminated|stacked and the laminated body 10 laminated|stacked in this order of the support base 1, the separation layer 2, the contact bonding layer 3, and the board|substrate 4 is obtained.

In the method of bonding the support 12 and the substrate 4 through the adhesive layer 3, the substrate 4 is placed at a predetermined position on the adhesive layer 3 and heated under vacuum (for example, about 100° C.) , by pressing the support 12 and the substrate 4 with a die bonder or the like.

According to the manufacturing method of the laminated body of 1st Embodiment, since the adhesive layer is formed by applying the composition for adhesive layer formation of the above-mentioned embodiment, heat resistance becomes more high, For example, position shift of the board|substrate before and after sealing operation is generated easily. don't make it In addition, the substrate (bare chip) is fixed with sufficient strength to the adhesive layer to be formed (die bonding property is good).

In the manufacturing method of the laminated body of this embodiment mentioned above, although the separation layer 2 was formed on the support base 1, it is not limited to this, The separation layer 2 is on the board|substrate 4 may be formed.

In the manufacturing method of the laminated body of this embodiment mentioned above, although the adhesive layer 3 was formed on the separation layer 2, it is not limited to this, The adhesive bond layer 3 is formed on the board|substrate 4, there may be

In addition, the separation layer 2 may be formed on both the support base 1 and the board|substrate 4, and in this case, the support base 1 and the board|substrate 4 are the separation layer 2 and the adhesive layer. It is bonded through (3) and the separation layer (2).

<Second embodiment>

It is a schematic process diagram explaining other embodiment of the manufacturing method of a laminated body.

Fig. 3(a) is a diagram showing a laminate manufactured by the manufacturing method of the first embodiment, and Fig. 3(b) is a diagram for explaining a sealing step.

In addition to the process of producing a support body, the contact bonding layer formation process, and the bonding process, the manufacturing method of the laminated body of such another embodiment has a sealing process further.

[Encapsulation process]

The sealing process in embodiment is a process of sealing the said board|substrate bonded by the said support body through the said adhesive layer after the said bonding process with a sealing material, and producing a sealing body.

In FIG.3(b), the sealing body 20 (laminated body) in which the whole board|substrate 4 arrange|positioned on the contact bonding layer 3 was sealed with the sealing material is obtained.

In the sealing step, for example, a sealing material heated to 130 to 170 ° C. is supplied on the adhesive layer 3 so as to cover the substrate 4 while maintaining a high viscosity state, and is compression molded, whereby the adhesive layer 3 The sealing body 20 (laminated body) in which the sealing material layer 5 was formed thereon is produced.

In that case, temperature conditions are 130-170 degreeC, for example.

The pressure applied to the substrate 4 is, for example, 50 to 500 N/cm 2 .

For the sealing material, for example, a composition containing an epoxy-based resin or a silicone-based resin can be used. It is preferable that the sealing material layer 5 is not formed for every individual board|substrate 4, but is formed so that all the board|substrates 4 on the contact bonding layer 3 may be covered.

According to the manufacturing method of the laminated body of 2nd Embodiment, since the adhesive layer is formed by applying the composition for adhesive layer formation of the above-mentioned embodiment, heat resistance becomes more high, For example, position shift of the board|substrate before and after sealing operation is generated easily. don't let

<Third embodiment>

It is a schematic process diagram explaining other embodiment of the manufacturing method of a laminated body.

Fig. 4(a) is a view showing a sealing body manufactured by the manufacturing method of the second embodiment, Fig. 4(b) is a view for explaining a grinding process, and Fig. 4(c) is a rewiring formation It is a figure explaining a process.

In addition to the process of producing a support body, the contact bonding layer formation process, the bonding process, and the sealing process, the manufacturing method of the laminated body of such another embodiment has a grinding process and a rewiring formation process further.

[Grinding process]

The grinding process in embodiment is a process of grinding the sealing material part (sealing material layer 5) in the sealing body 20 so that a part of the board|substrate 4 may be exposed after the said sealing process.

Grinding of the sealing material part is performed, for example, as shown to FIG.4(b), by shaving the sealing material layer 5 until it becomes the board|substrate 4 and substantially equivalent thickness.

[Rewiring Formation Process]

The redistribution forming process in embodiment is a process of forming the redistribution layer 6 on the said exposed board|substrate 4 after the said grinding process.

The redistribution layer is also called RDL (Redistribution Layer), and is a thin-film wiring body constituting wirings connected to elements, and may have a structure of a single layer or a plurality of layers. For example, the redistribution layer is formed of a dielectric (such as a photosensitive resin such as silicon oxide (SiOx) and photosensitive epoxy) with a conductor (a metal such as aluminum, copper, titanium, nickel, gold, silver, or a silver-tin alloy). alloy), but is not limited thereto.

As a method of forming the redistribution layer 6, first, on the sealing material layer 5, dielectric layers, such as a silicon oxide (SiOx) and a photosensitive resin, are formed. The dielectric layer made of silicon oxide can be formed by, for example, a sputtering method, a vacuum vapor deposition method, or the like. The dielectric layer made of the photosensitive resin can be formed by, for example, coating the photosensitive resin on the sealing material layer 5 by a method such as spin coating, dipping, roller blade, spray coating, or slit coating.

Then, wiring is formed in the dielectric layer with a conductor such as a metal.

As a method of forming the wiring, for example, a lithographic process such as photolithography (resist lithography) or a known semiconductor process method such as an etching process can be used. As such a lithographic process, a lithographic process using a positive resist material and a lithographic process using a negative resist material are mentioned, for example.

In this way, when performing photolithography processing and etching processing, etc., the sealing body 20 (laminated body) is used for dissolving an acid such as hydrofluoric acid, an alkali such as tetramethylammonium hydroxide (TMAH), or a resist material. In addition to exposure to resist solvents, they are processed at high temperatures.

However, by forming a contact bonding layer using the composition for contact bonding layer formation of embodiment mentioned above, the contact bonding layer is equipped with high heat resistance. For this reason, on the sealing material layer 5, the redistribution layer 6 can be formed preferably.

According to the manufacturing method of the laminated body of 3rd Embodiment, the support base 1, the separation layer 2, the adhesive layer 3, the sealing material layer 5 which covers the board|substrate 4, and the redistribution layer 6 ), the laminate 30 formed by laminating in this order can be stably manufactured.

Such a laminate 30 is a laminate manufactured in a process based on a fan-out type technology, in which the terminals formed on the substrate 4 are mounted on the redistribution layer 6 extending out of the chip area.

In the manufacturing method of the laminated body of this embodiment, formation of bumps on the redistribution layer 6 or mounting of an element can be performed further. The device may be mounted on the redistribution layer 6 using, for example, a chip mounter.

(Manufacturing method of electronic components)

After obtaining a laminated body by the manufacturing method of the laminated body which concerns on the said 5th aspect, the manufacturing method of the electronic component which concerns on the 6th aspect of this invention has a separation process and a removal process.

5 : is a schematic process diagram explaining one Embodiment of the manufacturing method of a semiconductor package (electronic component). Fig. 5 (a) is a diagram showing a laminate manufactured by the manufacturing method of the third embodiment, Fig. 5 (b) is a diagram for explaining a separation step, and Fig. 5 (c) is a removal step It is an explanatory drawing.

[Separation process]

In the separation step in the embodiment, the separation layer 2 is irradiated with light (arrow) through the support substrate 1 to change the separation layer 2, whereby the laminate 30 includes a substrate ( 4) is a step of separating the support gas (1) from

As shown to Fig.5 (a), in a separation process, the separation layer 2 is altered by irradiating light (arrow) to the separation layer 2 through the support base 1 .

As a wavelength which can change the quality of the separation layer 2, the range of 600 nm or less is mentioned, for example.

The type and wavelength of the light to be irradiated may be appropriately selected according to the transmittance of the support substrate 1 and the material of the separation layer 2, for example, YAG laser, ruby laser, glass laser, YVO ₄ laser, LD laser. , solid lasers such as fiber lasers, liquid lasers such as dye lasers, gas lasers such as CO ₂ lasers, excimer lasers, Ar lasers and He-Ne lasers, laser light such as semiconductor lasers, free electron lasers, etc., and non-laser light can Thereby, the separation layer 2 can be altered in quality, and the support base 1 and the substrate 4 can be easily separated from each other.

When irradiating a laser beam, the following conditions are mentioned as an example of laser beam irradiation conditions.

1.0 W or more and 5.0 W or less are preferable, and, as for the average output value of a laser beam, 3.0 W or more and 4.0 W or less are more preferable. 20 kHz or more and 60 kHz or less are preferable, and, as for the repetition frequency of a laser beam, 30 kHz or more and 50 kHz or less are more preferable. As for the scanning speed of a laser beam, 100 mm/s or more and 10000 mm/s or less are preferable.

After the separation layer 2 is irradiated with light (arrow) to alter the separation layer 2 , as shown in FIG. 5(b) , the support substrate 1 is separated from the substrate 4 .

For example, the support base 1 and the board|substrate 4 are isolate|separated by applying a force in the direction in which the support base 1 and the board|substrate 4 move away from each other. Specifically, while one of the support base 1 or the substrate 4 side (rewiring layer 6) is fixed to the stage, the other is adsorbed and held by a separation plate provided with a suction pad such as a bellows pad. By lifting, the support base 1 and the board|substrate 4 can be isolate|separated.

The force applied to the laminate 30 may be appropriately adjusted depending on the size of the laminate 30 and the like, and is not limited, but for example, if it is a laminate having a diameter of about 300 mm, 0.1 to 5 kgf (0.98 to By applying a force of about 49 N), the support base 1 and the substrate 4 can be preferably separated.

[removal process]

The removal process in embodiment is a process of removing the adhesive layer 3 adhering to the board|substrate 4 after the said isolation|separation process.

In Fig. 5(b) , the adhesive layer 3 and the separation layer 2 are adhered to the substrate 4 after the separation step. In this embodiment, the electronic component 40 is obtained by removing the adhesive layer 3 and the separation layer 2 adhering to the board|substrate 4 in a removal process.

As a method of removing the adhesive layer 3 etc. adhering to the board|substrate 4, the method of removing the residue of the adhesive layer 3 and the separation layer 2 using a washing|cleaning liquid is mentioned, for example.

As the cleaning liquid, a cleaning liquid containing an organic solvent is preferably used. As an organic solvent in this washing|cleaning liquid, it is preferable to use the organic solvent mix|blended with the composition for separation layer formation, and the solvent component mix|blended with the composition for adhesive layer formation.

The adhesive layer formed using the composition for adhesive layer formation of embodiment mentioned above has high solubility with respect to the hydrocarbon solvent. For this reason, in embodiment, the cleaning removability of a contact bonding layer is favorable.

The manufacturing method of the electronic component of this embodiment may perform processing, such as solder ball formation, dicing, or oxide film formation, with respect to the electronic component 40 further after said removal process.

Example

Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited by these examples.

<Preparation of adhesive composition>

(Examples 1 to 10, Comparative Examples 1 to 6)

Each component shown in Tables 1-3 was mixed and dissolved, and the adhesive composition (resin component density|concentration of 20 mass %) of each example was prepared, respectively.

In Tables 1-3, each symbol has the following meaning, respectively. Numerical values in [ ] are compounding amounts (parts by mass).

In addition, the glass transition temperature (degrees C) with respect to the resin component shown below using the dynamic viscoelasticity measuring apparatus Rheogel-E4000 (made by UBM Corporation), under the conditions of a frequency of 1 Hz, at a temperature increase rate of 5 degrees C/min, 25 It calculated|required based on the change of the viscoelasticity measured by raising the temperature from ℃ to 300℃.

(P1)-1: Septon8004 (trade name), manufactured by Kuraray Co., Ltd. Styrene content 31 mass %, weight average molecular weight 98000; A hydrocarbon resin having a plurality of structural units represented by the following formula (P1)-1.

[Formula 10]

(P1)-2: Toughtech H1051 (brand name), manufactured by Asahi Chemical Co., Ltd. styrene content 42 mass %, ethylene-butylene content 58 mass %, weight average molecular weight 78000; Hydrogenated styrenic thermoplastic elastomer.

(P1)-3: Septon2002 (trade name), manufactured by Kuraray Co., Ltd. Styrene content 30 mass %, weight average molecular weight 54000; A hydrocarbon resin having a plurality of structural units represented by the following formula (P1)-3.

[Formula 11]

(P1)-4: APL8008T (trade name), manufactured by Mitsui Chemicals Co., Ltd. Glass transition temperature 70 degreeC, weight average molecular weight 100000; A hydrocarbon resin represented by the following formula (P1)-4 (m: n = 80: 20 (molar ratio)).

[Formula 12]

(P1)-5: TOPAS8007 (brand name), manufactured by Polyplastics Co., Ltd. Glass transition temperature 65 degreeC, weight average molecular weight 95000; A hydrocarbon resin represented by the following formula (P1)-5 (m: n = 35: 65 (molar ratio)).

[Formula 13]

(P2)-1: PRZ-10014 (trade name), manufactured by Sumitomo Bakelite Co., Ltd. Glass transition temperature 224 degreeC, weight average molecular weight 8700; A resin represented by the following formula (P2)-1 (m: n = 65: 35 (molar ratio)).

[Formula 14]

(P3)-1: Glass transition temperature 84 degreeC, weight average molecular weight 9800; Copolymer of adamantyl methacrylate (AdMA) unit/stearyl methacrylate (STMA) unit/styrene (Sty) unit = 60/20/20 (mass ratio).

A-DCP: tricyclodecane dimethanol diacrylate, Shin-Nakamura Chemical Co., Ltd. make; A polyfunctional curable monomer represented by the following formula.

[Formula 15]

(Ib)-1: polymerization inhibitor, IRGANOX1010 (trade name), manufactured by BASF. pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]; A compound represented by the following formula.

[Formula 16]

(Ia)-1: Thermal polymerization initiator, Percumyl D (trade name), manufactured by Nichiyu Corporation. bis(1-methyl-1-phenylethyl)peroxide; A compound represented by the following formula.

[Formula 17]

<Adhesive layer forming process>

CVD using C ₄ F ₈ as a reactive gas on a glass support substrate (size 10 cm × 10 cm, thickness 700 μm) under conditions of a flow rate of 400 sccm, a pressure of 700 mTorr, a high-frequency power of 2500 W, and a film formation temperature of 240°C By the method, a fluorocarbon film (thickness of 1 µm) as a separation layer was formed to prepare a support.

Next, the adhesive composition of each example was respectively apply|coated, rotating at 1500 rpm by the spin coating method on the separation layer formed in the glass support base|substrate.

Then, the support body to which the adhesive composition of each case was apply|coated was respectively preheated at 160 degreeC for 4 minutes, and the adhesive layer with a thickness of 5 micrometers was formed.

<Evaluation>

About the adhesive layer formed in the said <Adhesive layer formation process>, the compression mold test shown below was implemented and heat resistance was evaluated. In addition, the measurement of the complex elastic modulus at the time of heat, the die bonding test, and evaluation of washing|cleaning removability were performed, respectively. These results are shown in Tables 4, 5 and 6.

[Compression mold test]

A board|substrate (bare chip) was arrange|positioned at the predetermined position of the contact bonding layer formed in the said <Adhesive layer formation process>, and the said support body and the said board|substrate were bonded together (bonding process).

Then, the said board|substrate bonded to the said support body via the said contact bonding layer was sealed with the sealing material, and the sealing body was produced (sealing process). In this produced sealing body, the position shift (displacement amount) of the bare chip before sealing and after sealing was measured, and heat resistance was evaluated.

Specifically, it carried out as follows.

The position shift (displacement amount) of the bare chip was measured using a die bonder (manufactured by TRESKY).

First, the stage of the die bonder was heated to 50°C and the head to 100°C, and a substrate (bare chip) (5 mm × 5 mm × 0.7 mm) was pressed on the adhesive layer at a pressure of 35 N for 1 second.

6 : has shown the laminated body 10 by which the support body 12 and the board|substrate 4 (bare chip) were bonded together via the contact bonding layer 3 . In Fig. 6, the laminate 10 is substantially rectangular in plan view, and the four corner ends and the central portions on the adhesive layer 3, respectively, located in the vicinity of the four vertices and the center of gravity on the diagonal in the quadrangle are substrates, respectively. (4) (bare chip) is arranged. In addition, with respect to the laminated body 10 seen in plan view, let the horizontal direction be X direction, and let the vertical direction be Y direction.

Next, the laminated body 10 was heated at 200 degreeC in nitrogen atmosphere for 1 hour. After heating, the laminated body 10 was mounted on the stage heated at 50 degreeC.

Next, on the board|substrate 4 (bare chip) of the central part in the laminated body 10 mounted on the stage, 12 g of sealing materials containing an epoxy resin were apply|coated.

Next, under reduced pressure conditions lower than 10 Pa, the laminate 10 is pressed with a pressing plate (300 mmφ) heated to 130° C. using a sticking device, and a force of 10 tons is laminated. While being applied to the sieve 10, the encapsulant was pressed and spread out so as to cover the entire substrate 4 (bare chip) at the four corner ends and the central portion, and compressed for 5 minutes (sealing step). Thereby, the sealing body in which the bare chip was sealed with the sealing material was obtained.

About the obtained sealing body, it observed from the support body 1 (glass support base surface) side using an optical microscope, and the position shift (displacement amount) of the bare chip before sealing and after sealing was measured.

As shown in FIG. 6 , after sealing, the sum of the movement distance in the X direction and the movement distance in the Y direction moved from the position before sealing of each substrate 4 (bare chip) disposed on the adhesive layer 3 after sealing It was calculated|required and it was set as the movement distance of each board|substrate 4 (bare chip). Then, the average value of the movement distance of the board|substrate 4 (bare chip) was calculated|required, and this was made into the evaluation value of a movement distance. And heat resistance was evaluated according to the evaluation criteria shown below.

It means that heat resistance is high, so that the evaluation value of this movement distance is low.

Evaluation standard

(circle): When the evaluation value of the movement distance of the board|substrate 4 (bare chip) is 10 micrometers or less

x: When the evaluation value of the movement distance of the board|substrate 4 (bare chip) exceeds 10 micrometers

[Measurement of complex modulus]

About the adhesive composition of each example, the complex elastic modulus E* in 50 degreeC and 150 degreeC was measured using the dynamic-viscoelasticity measuring apparatus (Rheogel-E4000, the UB Co., Ltd. product), respectively.

First, the adhesive composition was applied on a PET film having a mold release agent formed thereon, and heated in an oven under atmospheric pressure at 50° C. and 150° C. for 60 minutes each to form an adhesive layer (thickness 0.5 mm).

Next, the complex elastic modulus E* of the adhesive bond layer peeled from the PET film was measured using the said dynamic viscoelasticity measuring apparatus.

Measurement conditions were taken as conditions in which the sample shape was 20 mm × 5 mm × thickness 0.5 mm, and the temperature was increased from room temperature to 215° C. at a rate of 5° C./min under tensile conditions with a frequency of 1 Hz, and at 50° C. and 150° C. The complex modulus of elasticity in this was measured.

It can be said that the adhesiveness of the board|substrate with respect to a support body is favorable that the complex elastic modulus E* ₅₀ in 50 degreeC is less than 1.0x10 ⁹ Pa.

It can be said that the heat resistance of a contact bonding layer is high that complex elastic modulus E* ₁₅₀ in 150 degreeC is more than 3.0x10 ⁶ Pa.

In addition, in Tables 4-6, ratio of E* ₅₀ /E* ₁₅₀ was published with the measurement result of complex elastic modulus E* ₅₀ and complex elastic modulus E* ₁₅₀ .

[Die bonding test]

A board|substrate (bare chip) was arrange|positioned at the predetermined position of the contact bonding layer formed in the said <Adhesive layer formation process>, and the said support body and the said board|substrate were bonded together (bonding process).

Specifically, the stage of a die bonder (manufactured by TRESKY) was heated to 23°C and the head was heated to 100°C, and the substrate (bare chip) (5 mm × 5 mm × 0.7 mm) was placed on the adhesive layer at a pressure of 35 N for 1 second. ) was compressed.

And the adhesive state of the board|substrate (bare chip) with respect to the adhesive layer was evaluated according to the evaluation criteria shown below.

Evaluation standard

(circle): The board|substrate (bare chip) was adhering to the adhesive layer with sufficient intensity|strength.

x: When a force was applied, the board|substrate (bare chip) peeled easily from the adhesive layer.

[Evaluation of cleaning removability]

With respect to the sealing body obtained in the said sealing process, the laser beam with a wavelength of 532 nm was irradiated toward the separation layer (fluorocarbon film|membrane) from the glass support base side. Thereby, the said separation layer was altered, the said glass support base was isolate|separated from the said board|substrate (bare chip) with which the said sealing body was equipped, and the sealing board|substrate with an exposed adhesive layer was obtained (separation process).

Next, the obtained sealing substrate was spray-cleaned for 5 minutes using p-mentane as a cleaning liquid, and the adhesive layer adhering to the board|substrate (bare chip) was removed (removing process).

And the washing-removability was evaluated according to the evaluation criteria shown below.

Evaluation standard

○: When no residue of the adhesive layer is seen on the sealing substrate after spray cleaning

×: When the residue of the adhesive layer is seen on the encapsulation substrate after spray cleaning

From the results shown in Tables 4-6, it can be confirmed that the adhesive composition of Examples 1-10 has better results of the compression mold test, ie, more heat resistance than the adhesive composition of Comparative Examples 1-6.

One ; support gas,
2 ; separation layer,
3 ; adhesive layer,
4 ; Board,
5 ; encapsulant layer,
6 ; redistribution layer,
10 ; laminate,
12 ; support,
20 ; envelope,
30 ; laminate,
40 ; Electronic parts,
123 ; A support with an adhesive layer formed thereon.

Claims (27)

As an adhesive composition for bonding a support body and a board|substrate together,
Hydrocarbon resin (P1) and;
Resin (P2) having a glass transition temperature of 180°C or higher (except for the hydrocarbon resin (P1))
containing as the resin component (P),
The resin (P2) is a copolymer comprising a structural unit represented by the following general formula (p2-1) and a structural unit represented by the following general formula (p2-2),
Content of the said resin (P2) is 10-75 mass parts with respect to 100 mass parts of said hydrocarbon resins (P1), The adhesive composition.
[Formula 1]

[In the formula, R ^u10 represents an organic group having 1 to 30 carbon atoms.]
[Formula 2]

[In the formula, R ^u11 to R ^u14 each independently represent an organic group having 1 to 30 carbon atoms or a hydrogen atom. n is an integer of 0 to 2.] delete delete delete delete delete As an adhesive composition for bonding a support body and a board|substrate together,
The adhesive composition contains at least a hydrocarbon resin (P1) as a resin component (P),
A test piece of 20 mm × 5 mm × thickness 0.5 mm was prepared from the adhesive composition, and the test piece was subjected to dynamic viscoelasticity measurement under the conditions of heating from room temperature to 215° C. at a rate of 5° C./min under a tensile condition of a frequency of 1 Hz. when given,
The complex modulus of elasticity E* ₅₀ at 50°C is less than 1.0×10 ⁹ Pa;
Complex modulus of elasticity E* ₁₅₀ at 150°C exceeds 3.0×10 ⁶ Pa;
An adhesive composition satisfying both requirements. 8. The method of claim 7,
Further, the adhesive composition, which satisfies the requirement that a ratio of E* ₅₀ /E* ₁₅₀ is 2000 or less. 8. The method of claim 7,
The adhesive composition, wherein the adhesive composition contains a component having a structural unit (u21) derived from a monomer containing a maleimide skeleton. 10. The method of claim 9,
The said structural unit (u21) is a structural unit represented by the following general formula (p2-1), The adhesive composition.
[Formula 3]

[In the formula, R ^u10 represents an organic group having 1 to 30 carbon atoms.] 11. The method according to any one of claims 1 and 7 to 10,
The said hydrocarbon resin (P1) is at least 1 sort(s) selected from the group which consists of an elastomer and a cycloolefin polymer, The adhesive composition. 11. The method according to any one of claims 1 and 7 to 10,
Further, the adhesive composition containing a polyfunctional curable monomer. 13. The method of claim 12,
The polyfunctional curable monomer is an adhesive composition comprising a polycyclic aliphatic structure. 13. The method of claim 12,
The adhesive composition whose content of the said polyfunctional curable monomer is 5-40 mass % with respect to 100 mass % of the total amount of the said resin component (P). 11. The method according to any one of claims 1 and 7 to 10,
Furthermore, the adhesive composition containing a polymerization inhibitor. 13. The method of claim 12,
Further, the adhesive composition containing a thermal polymerization initiator. 11. The method according to any one of claims 1 and 7 to 10,
Furthermore, the adhesive composition containing a hydrocarbon solvent. a support to which the substrate is bonded;
An adhesive layer formed using the adhesive composition according to any one of claims 1 and 7 to 10 on the support;
A support having an adhesive layer formed thereon. 19. The method of claim 18,
The support includes a support substrate that transmits light, and a separation layer formed on the support substrate,
The support body with an adhesive layer, wherein the separation layer is a layer that is adjacent to the adhesive layer, is altered by light irradiation, and enables separation of the support base from the substrate bonded to the support. film and
An adhesive layer formed using the adhesive composition according to any one of claims 1 to 10 on the film,
provided with, an adhesive film. A laminate in which a support and a substrate are bonded through an adhesive layer,
The said adhesive layer is a layer formed using the adhesive composition in any one of Claims 1 and 7-10, The laminated body. A support on which the adhesive layer according to claim 18 is formed;
a substrate disposed on a surface opposite to the support side of the adhesive layer provided by the support on which the adhesive layer is formed;
provided with, a laminate. A method for producing a laminate in which a support and a substrate are bonded together via an adhesive layer, the method comprising:
An adhesive layer forming step of forming the adhesive layer on at least one of the support body or the substrate using the adhesive composition according to any one of claims 1 and 7 to 10;
The bonding process of bonding the said support body and the said board|substrate together via the said contact bonding layer formed in the said contact bonding layer formation process;
Having, a method for producing a laminate. 24. The method of claim 23,
The manufacturing method of the laminated body which further has the sealing process of sealing the said board|substrate bonded to the said support body through the said adhesive layer after the said bonding process with a sealing material, and producing a sealing body. 25. The method of claim 24,
After the sealing step, a grinding step of grinding the sealing material portion in the sealing body so that a part of the substrate is exposed;
After the grinding process, a redistribution forming process of forming a redistribution on the exposed substrate;
Further having, a method for producing a laminate. 24. The method of claim 23,
It further comprises a step of forming a separation layer altered by irradiation of light on at least one surface of a support substrate that transmits light to produce the support, wherein in the bonding step, the separation layer and the adhesive layer face each other The manufacturing method of the laminated body which bonds the said support body and the said board|substrate together, making it look. After obtaining a laminated body by the manufacturing method of the laminated body of Claim 26,
a separation step of separating the support gas from the substrate included in the laminate by irradiating light to the separation layer through the support gas and modifying the separation layer;
After the separation step, a removal step of removing the adhesive layer adhering to the substrate;
having, a method of manufacturing an electronic component.

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