TW201842055A - Resin composition and resin sheet - Google Patents

Abstract

A resin composition that contains a thermosetting component (A). The resin composition is characterized in that the thermosetting component (A) contains a maleimide resin (A1). The resin composition is also characterized in that there are at least two maleimide groups per molecule of the maleimide resin (A1). The resin composition is also characterized in that, before the resin composition has been cured, the complex viscosity [eta] of the resin composition at 90 DEG C is 1.0*10<SP>2- 1.0*10<SP>4</SP> Pa.s.

Description

Resin composition and resin sheet

The present invention relates to a resin composition and a resin sheet.

As a sealing material such as a power semiconductor, a resin composition having high heat resistance has been used. For example, Document 1 (Japanese Patent Application Laid-Open No. 2015-147849) discloses a maleimide compound, a compound having at least one of an allyl group and an epoxy group, an amine compound, and an acetophenone derivative and a tetraphenyl Resin composition of at least one type of radical generator among ethane derivatives. However, the resin composition described in Document 1 has a problem that it does not have both fluidity before curing and heat resistance after curing.

The present invention aims to provide a resin composition and a resin sheet having both fluidity before curing and heat resistance after curing. A resin composition according to an aspect of the present invention is a resin composition containing (A) a thermosetting component, characterized in that the (A) thermosetting component is a resin containing (A1) maleimide, and ( A1) Maleimide imide resin contains two or more maleimide imide groups in one molecule, and the complex viscosity η at 90 ° C of the resin composition before curing is 1.0 × 10 ² Pa ･ s or more 1.0 × 10 ⁴ Pa ･ s or less. As for the resin composition which concerns on one aspect of this invention, it is preferable that the said (A) thermosetting component further contains (A2) allyl resin. As for the resin composition according to one aspect of the present invention, the mass ratio (A1 / A2) of the (A1) maleimide resin to the (A2) allyl resin is preferably 1.5 or more. As for the resin composition which concerns on one aspect of this invention, the said (A1) maleimide resin has the biphenyl skeleton, It is preferable. As for the resin composition which concerns on one aspect of this invention, it is preferable that it further contains a binder component (B). With regard to the resin composition according to one aspect of the present invention, the content of the maleimide resin (A1) is the total amount of the solid content of the thermosetting component (A) and the binder component (B). In the case of a reference, it is preferable that it is 20 mass% or more and 80 mass% or less. It is preferable that the resin composition according to one aspect of the present invention further contains (C) an inorganic filler. It is preferable that the resin composition according to one aspect of the present invention further contains (D) a coupling agent. The resin composition according to one aspect of the present invention is preferably used for sealing power semiconductor devices or used between the power semiconductor devices and other electronic components. The resin composition according to one aspect of the present invention is used for sealing the use of one or more semiconductor elements of silicon carbide and gallium nitride, or for the use of one or more semiconductors of the foregoing silicon carbide and gallium nitride. Components and other electronic parts are preferred. A resin sheet according to one aspect of the present invention is characterized by containing a resin composition according to one aspect of the present invention. According to one aspect of the present invention, a resin composition and a resin sheet having both fluidity before curing and heat resistance after curing can be provided.

[Resin Composition] The resin composition according to the present embodiment contains (A) a thermosetting component. This (A) thermosetting component is a resin containing (A1) maleimide. The complex viscosity η at 90 ° C. of the resin composition according to this embodiment before curing is 1.0 × 10 ² Above Pa ･ s 1.0 × 10 ⁴ Pa ･ s or less. From the viewpoint of fluidity during heating before the resin composition of this embodiment is cured, the complex viscosity η is 5.0 × 10. ² Above Pa ･ s 1.0 × 10 ⁴ Below Pa ･ s is better, 5.0 × 10 ² Pa ･ s above 8.0 × 10 ³ Pa ･ s or lower is preferred. By maintaining fluidity during heating before the resin composition is hardened, when the resin composition is used in an object, the followability to the surface shape of the object can be improved. In particular, when the resin composition is in the form of a resin sheet, when the heated resin composition is used in an application, the followability to the surface shape of the application is increased. The complex viscosity η of the resin composition of the present embodiment can be adjusted to the above range by, for example, adjusting a component or a compounding amount used in the resin composition. The complex viscosity η in this specification is a resin sheet coated with a resin composition and dried to prepare a resin sheet. The viscoelasticity measuring device is used to measure the complex viscosity of the resin sheet at 90 ° C (unit: Pa ･ s) . ((A) thermosetting component) (A) The thermosetting component (hereinafter sometimes referred to simply as the "(A) component") is a three-dimensional network formed upon heating, and has the property of strongly adhering the coating. . The (A) thermosetting component in this embodiment contains the (A1) maleimide imine resin as described above. (A1) Maleimide imine resin (A1) The maleimide imide resin in this embodiment may be a maleimide imide resin containing two or more maleimide imide groups in one molecule, and There is no particular limitation. From the viewpoint of heat resistance, the (A1) maleimide imide resin in this embodiment is preferably a benzene ring, and more preferably a benzene ring to which a maleimide group is linked. The maleimide imine compound is preferably a structure having two or more maleimide imide groups connected to a benzene ring. The (A1) maleimide imide resin in this embodiment is a maleimide imide resin containing two or more maleimide imide groups and one or more biphenyl skeletons in one molecule (sometimes only (Referred to as "biphenylmaleimide resin"). (A) The thermosetting component contains a biphenyl maleimide resin, which can simultaneously improve the adhesion of the resin composition to the coating body and easily reduce the complex viscosity of the resin composition. In particular, (A) a maleimide resin having a biphenyl skeleton as described later in (A) a thermosetting component, even when the mass ratio (A1 / A2) of the (A2) allyl resin is high, the resin composition The complex viscosity of the material is also easy to decrease. The maleimide imine resin (A1) in this embodiment is preferably one represented by the following general formula (1) from the viewpoints of heat resistance and adhesiveness. In the aforementioned general formula (1), k is an integer of 1 or more, but the average value of k is preferably 1 or more and 10 or less, more preferably 1 or more and 5 or less, and even more preferably 1 or more and 3 or less. m1 and m2 are each independently an integer of 1 to 6, and an integer of 1 to 3 is preferable, and 1 is more preferable. n1 and n2 are each independently an integer of 0 to 4, preferably an integer of 0 to 2, and more preferably 0. R ¹ And R ² Each is independently an alkyl group having 1 to 6 carbon atoms, preferably an alkyl group having 1 to 3 carbon atoms, and more preferably a methyl group. Plural R ¹ They may be the same or different from each other. Plural R ² They may be the same or different from each other. Specific examples of the maleimide resin represented by the general formula (1) in this embodiment include compounds represented by the following general formula (2) or the following general formula (3). In the aforementioned general formulae (2) and (3), k is the same as k in the aforementioned general formula (1). For the aforementioned general formula (2), n1, n2, R ¹ And R ² N1, n2, and R in the general formula (1) ¹ And R ² the same. Examples of commercially available products of the maleimide resin represented by the general formula (3) include "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd. and the like. The maleimide resin (A1) in this embodiment is preferably a maleimide resin containing two or more maleimide groups and two or more phenylene groups in one molecule. From the viewpoint of improving solubility in a solvent and improving sheet formability, it is preferable to have a substituent on a phenylene group. Examples of the substituent include alkyl groups such as methyl and ethyl, and alkylene groups. In addition, the maleimide resin (A1) in this embodiment is from the viewpoint of sheet formation, and the maleimide resin having an ether bond between the maleimide group and the phenylene group is good. The maleimide imide resin containing two or more maleimidine imide groups and two or more phenylene groups in one molecule is represented by the following general formula (4), for example. For the aforementioned general formula (4), R ³ ~ R ⁶ Each independently a hydrogen atom or a C 1-6 alkyl group, L ¹ Is an alkylene group having 1 to 6 carbon atoms, L ² And L ³ Each is independently an alkylene group having 1 to 6 carbon atoms or an arylene group having 6 to 10 carbon atoms, and p and q are each independently 0 or 1. Specific examples of the maleimide resin represented by the general formula (4) in the present embodiment include the following general formula (5) or the following general formula (6). For the foregoing general formulae (5) and (6), L ¹ It is an alkylene group having 1 to 6 carbon atoms. For the aforementioned general formula (5), R ³ ~ R ⁶ Each is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. For the aforementioned general formulae (4) and (5), R ³ With R ⁴ It's better to be different from each other, to R ³ And R ⁴ One is methyl and the other is ethyl. For the foregoing general formulae (4) and (5), use R ⁵ With R ⁶ It ’s better to be different from each other. R ⁵ And R ⁶ One is methyl and the other is ethyl. For the foregoing general formulae (4), (5), and (6), L ¹ The alkylene having 1 to 3 carbon atoms is preferred. As the (A1) maleimide resin in this embodiment, for example, from the viewpoint that a cured product having high sheet formability and high heat resistance can be obtained simultaneously, bis (3-ethyl-5-methyl- 4-maleimidophenyl) methane, N, N'-1,3-phenylene dimaleimide, 4-methyl-1,3-alkylene dimaleimide, Polyphenylmethanemaleimide or 2,2-bis [4- (4-maleimidephenoxy) phenyl] propane is preferred, and from the viewpoint of sheet formability, bis (3 -Ethyl-5-methyl-4-maleiminophenyl) methane is preferred. (A2) Allyl resin The (A) thermosetting component in this embodiment is preferably one containing (A1) maleimide resin and (A2) allyl resin. (A2) The allyl resin is preferably a liquid at normal temperature (23 ° C). (A) Since the thermosetting component contains (A2) allyl resin, the effect of improving the wettability on the resin composition of the coating body can be obtained before the resin composition is cured, and after the resin composition is cured, , Can get the effect of more dense network construction. In this embodiment, the mass ratio (A1) of (A1) maleimide resin to (A2) allyl resin is preferably 1.5 or more, and more preferably 4.5 or more. When the mass ratio (A1 / A2) is within the above range, the storage elastic modulus E 'of the cured product of the resin composition at 250 ° C tends to increase. When the mass ratio (A1 / A2) is within the above range, the heat resistance of the resin composition can be improved. When the mass ratio (A1 / A2) is within the above range, when the complex viscosity η of the resin composition in this embodiment is to satisfy the above range, the fluidity of the resin composition when used in a coating body can be ensured. To further improve the heat resistance of the resin composition after curing can be achieved. In addition, when the mass ratio (A1 / A2) is within the above range, leakage of the (A2) allyl resin from the resin composition can also be suppressed. The upper limit of the mass ratio (A1 / A2) is not particularly limited. For example, the mass ratio (A1 / A2) may be only 50 or less. The (A2) allyl resin in this embodiment is not particularly limited as long as it is a resin having an allyl group. The (A2) allyl resin in this embodiment is, for example, an allyl resin containing two or more allyl groups in one molecule. The (A2) allyl resin in this embodiment is preferably represented by the following general formula (7). For the aforementioned general formula (7), R ⁷ And R ⁸ Each is independently an alkyl group, preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 4 carbon atoms, and more preferably an alkyl group selected from the group consisting of methyl and ethyl groups. good. Specific examples of the (A2) allyl resin in this embodiment include diallyl bisphenol A (2,2-bis (3-allyl-4-hydroxyphenyl) propane) and the like. The (A) thermosetting component in this embodiment is preferably (A1) a maleimide resin containing a compound represented by the general formula (2) or (3), and (A2) an allyl resin. It is also preferable to contain a compound represented by the aforementioned general formula (7). The (A) thermosetting component in this embodiment is preferably a compound containing the compound represented by the general formula (5) or (6) as the (A1) maleimide resin, and is (A2) ene. It is also preferable that the propyl resin contains a compound represented by the general formula (7). The thermosetting component (A) of this embodiment may contain a thermosetting resin other than the component (A1) and a curing agent other than the component (A2), provided that the object of the present invention is not impaired. The thermosetting resin other than the component (A1) may be any thermosetting resin having high heat resistance, and examples thereof include an epoxy resin, a benzoxazine resin, a cyanate resin, and a melamine resin. These thermosetting resins can be used individually by 1 type or in combination of 2 or more types. Examples of the curing agent other than the component (A2) include resins such as a phenol resin and a resin having a C = C double bond other than the component (A2), and amines, acid anhydrides, and formaldehyde. These hardeners can be used individually by 1 type or in combination of 2 or more types. When using a thermosetting resin other than the component (A1) or a hardener other than the component (A2), these contents are based on the total amount of the solid content of the component (A) (that is, the solvent is removed and the total solid content is taken as 100% by mass (Times), preferably 10% by mass or less, and more preferably 5% by mass or less. In this embodiment, the content of the thermosetting component (A) in the resin composition is 2 based on the total amount of the solid content of the resin composition (that is, when the solvent is removed and the total solid content is 100% by mass). It is more preferable that it is more than 75% by mass, and more preferable that it is more than 5% and 70% by mass. When the content of the (A) thermosetting component is within the above range, the handleability of the resin sheet, the sheet formability, and the heat resistance of the resin sheet can be improved. In this embodiment, (A) a thermosetting component may contain a hardening accelerator. Examples of the hardening accelerator include an imidazole compound (for example, 2-ethyl-4-methylimidazole). The content of the hardening accelerator in the resin composition is based on the total amount of the solid content of the resin composition (that is, when the solvent is removed and the total solid content is 100% by mass), preferably 0.005% by mass or more and 12% by mass or less. It is preferably 0.01 mass% or more and 10 mass% or less. ((B) Adhesive Component) In this embodiment, it is preferable that the resin composition contains (B) an adhesive component (hereinafter sometimes referred to simply as "(B) component") in addition to the (A) component. The resin composition according to this embodiment further contains the adhesive component (B), thereby providing film forming properties, and can easily form the resin composition into a sheet shape. The (B) adhesive component of this embodiment is a resin component other than the (A) component, and has a function of joining the (A) component or other components. (B) The adhesive component is preferably a thermoplastic resin or the like. The component (B) may have a function of bonding the component (A) or other components, and may have a functional group. When the (B) adhesive component has a functional group as described above, even if the (B) adhesive component is related to the curing of the resin composition by heating, in the present invention, the (B) adhesive component can be thermally cured with (A) Sexual component distinction. (B) The binder component may be an aliphatic compound or an aromatic compound, and may be selected from a wide range. (B) The binder component is, for example, at least one resin selected from the group consisting of a phenoxy resin, an acrylic resin, a methacrylic resin, a polyester resin, a urethane resin, and a polyimide resin. From the viewpoint of heat resistance, it is preferable to use at least one resin selected from the group consisting of a phenoxy resin, a polyimide resin, and a polyester resin, and a phenoxy resin. For the better. The polyester resin is preferably a wholly aromatic polyester resin. (B) An adhesive component can be used individually by 1 type or in combination of 2 or more types. As the phenoxy resin, there are selected from a bisphenol A skeleton (hereinafter, bisphenol A may be referred to as "BisA"), a bisphenol F skeleton (hereinafter, bisphenol F may be referred to as "BisF"), biphenyl A phenoxy resin having one or more skeletons formed from a basic skeleton and a naphthalene skeleton is preferred, and a phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton is more preferred. (B) The weight average molecular weight (Mw) of the binder component is preferably from 1 to 1 million, and from 10 to 800,000 from the viewpoint of easily adjusting the complex viscosity of the resin composition to a desired range. More preferably, it is more than 10,000 and less than 100,000. The weight average molecular weight in this specification is a standard polystyrene conversion value measured by a gel permeation chromatography (GPC) method. In this embodiment, the content of the (B) binder component in the resin composition is 0.1 mass based on the total amount of the solid content of the resin composition (that is, when the solvent is removed and the total solid content is 100 mass%). It is more preferable that it is not less than 50% by mass and more preferably not less than 1% by mass and not more than 40% by mass. When the content of the (B) adhesive component in the resin composition is set to the above range, it is easy to adjust the complex viscosity of the resin composition before curing of the resin sheet to a desired range, and to improve the processing of the resin sheet And sheet formation. In this embodiment, the content of the component (A1) is 20% by mass based on the total amount of solid content of the components (A) and (B) (that is, when the solvent is removed and the total solid content is 100% by mass). Above 80% by mass is preferred. When the content of the component (A1) is 20% by mass or more, the heat resistance of the resin composition can be further improved. When the content of the component (A1) is 80% by mass or less, the resin composition can be easily formed into a sheet shape. ((C) Inorganic filler) In this embodiment, the resin composition contains (C) an inorganic filler (hereinafter sometimes referred to simply as "(C) component") in addition to the (A) component and (B) component. Better. By this (C) component, the linear expansion coefficient of a resin composition can be reduced, and the storage elasticity of a resin composition can be improved. Examples of the (C) inorganic filler include a silicon dioxide filler, an alumina filler, and a boron nitride filler. Of these, a silica filler is also preferred. Examples of the silica filler include fused silica and spherical silica. (C) The inorganic filler may be used alone or in combination of two or more. (C) The inorganic filler may be surface-treated. (C) The average particle diameter of the inorganic filler is not particularly limited. (C) The average particle diameter of the inorganic filler is generally a value obtained from a particle size distribution meter, preferably 0.1 nm to 100 μm, and more preferably 10 nm to 10 μm. The average particle diameter of the (C) inorganic filler in this specification is a value measured by a dynamic light scattering method using a particle size distribution measuring device (manufactured by Nikkiso Co., Ltd., product name "Nano trackWave-UT151"). The content of the (C) inorganic filler in the resin composition is 10% by mass or more and 90% by mass or less based on the total amount of the solid content of the resin composition (that is, when the solvent is removed and the total solid content is 100% by mass). It is more preferable that it is 20% by mass or more and 80% by mass or less, and it is more preferable that it is 20% by mass or more and 60% by mass or less. ((D) Coupling agent) In this embodiment, it is preferable that the resin composition further contains (D) a coupling agent in addition to the components (A) to (C). The (D) coupling agent preferably has a functional group that reacts with the functional group of the thermosetting component (A), or a functional group that reacts with the functional group of the (B) adhesive component. The group which reacts the functional group which a hardening component has is preferable. By using the (D) coupling agent, the adhesiveness and adhesion can be improved without impairing the heat resistance of the cured resin, and the water resistance (humidity and heat resistance) can be further improved. The (D) coupling agent is preferably a silane-based (silane coupling agent) from the viewpoints of versatility and cost advantages. (D) A coupling agent can be used individually by 1 type or in combination of 2 or more types. The coupling agent as described above is usually added at a ratio of 0.1 parts by mass to 20 parts by mass with respect to 100 parts by mass of the (A) thermosetting component, and preferably at a ratio of 0.3 to 15 parts by mass. It is more preferably added at a ratio of 0.5 to 10 parts by mass. As an example of the resin composition concerning this embodiment, the resin composition containing only (A) thermosetting component, (B) an adhesive component, (C) an inorganic filler, and (D) a coupling agent is mentioned. In addition, as another example of the resin composition according to the present embodiment, as shown below, (A) a thermosetting component, (B) an adhesive component, (C) an inorganic filler, and (D) A resin composition containing a coupling agent and components other than the components (A) to (D). (Other components) In this embodiment, the resin composition may further contain other components. Examples of the other components include at least any one selected from the group consisting of a cross-linking agent, a pigment, a dye, an antifoaming agent, a leveling agent, an ultraviolet absorber, a foaming agent, an antioxidant, a flame retardant, and an ion trapping agent. One ingredient. For example, the resin composition may further contain a cross-linking agent when it is desired to adjust initial adhesion and cohesiveness before curing. Examples of the crosslinking agent include organic polyvalent isocyanate compounds and organic polyvalent imine compounds. The crosslinking agent may be used singly or in combination of two or more kinds. Examples of the organic polyvalent isocyanate compound include an aromatic polyvalent isocyanate compound, an aliphatic polyvalent isocyanate compound, an alicyclic polyvalent isocyanate compound, and a terpolymer of these polyvalent isocyanate compounds, and these polyvalent isocyanate compounds and A terminal isocyanate urethane prepolymer and the like obtained by reacting a polyol compound. As further specific examples of the organic polyvalent isocyanate compound, for example, 2,4-xylylene diisocyanate, 2,6-xylylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-di Toluene diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylidene diisocyanate, isophor Ketone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, and lysine isocyanate. The organic polyvalent isocyanate compound may be used singly or in combination of two or more kinds. Specific examples of the organic polyvalent imine compound include, for example, N, N'-diphenylmethane-4,4'-bis (1-azacyclopropanecarboxyamidine), trimethylolpropane-tri -β-aziridine propionate, tetramethylolmethane-tri-β-aziridine propionate, and N, N'-toluene-2,4-bis (1-azetidinylcarboxamide) Triethylene melamine and so on. The organic polyvalent imine compound may be used singly or in combination of two or more kinds. As described above, the crosslinking agent may be added at a ratio of generally 0.01 mass part or more and 12 mass parts or less, and preferably 0.1 mass part or more and 10 mass parts or less for 100 mass parts of the (B) adhesive component. As a more specific example of the resin composition of this embodiment, the following resin composition is mentioned, for example, However, This invention is not limited to these examples. As an example of the resin composition according to this embodiment, it is a resin composition containing (A) a thermosetting component, (B) a binder component, (C) an inorganic filler, and (D) a coupling agent. A) The thermosetting component contains (A1) the maleimide resin represented by the general formula (3) and (A2) the allyl resin represented by the general formula (7), and the (B) adhesive component is As the phenoxy resin, the (C) inorganic filler includes a resin composition of a silicon dioxide filler. The resin composition of this embodiment is preferably used for semiconductor devices. Specifically, the resin composition according to this embodiment is preferably used for sealing semiconductor devices. The resin composition according to this embodiment is preferably used between a semiconductor device and other electronic components. The semiconductor device is preferably a power semiconductor. The resin composition of the present embodiment is preferably used for sealing the use of one or more semiconductor elements of silicon carbide and gallium nitride. Or the resin composition according to this embodiment is preferably used between a semiconductor device using any one or more of silicon carbide and gallium nitride and other electronic components. Examples of other electronic components include a printed wiring board, a lead frame, and the like. [Resin Sheet] The resin sheet according to this embodiment contains a resin composition according to this embodiment. By thinning the resin composition according to this embodiment, a resin sheet according to this embodiment can be obtained. Since the resin composition is in the form of a sheet, the use of the coating body becomes simple and convenient, especially when the coating body has a large area. If the resin composition is in the form of a sheet, the shape after the sealing step is formed into a suitable shape in advance to some extent, so only a sealing material that can provide a certain degree of uniformity is used. In addition, if the resin composition is in the form of a sheet, it has no fluidity, so the handleability is excellent. The method for thinning the resin composition may be a conventionally known thinning method, and is not particularly limited. The resin sheet according to this embodiment may be a strip-shaped sheet, and may be provided in a state of being rolled up into a roll shape. The roll-shaped resin sheet according to this embodiment can be wound up to be cut into a desired size after being ejected from the roll, and used. The thickness of the resin sheet in this embodiment is, for example, preferably 10 μm or more, and more preferably 20 μm or more. The thickness is preferably 500 μm or less, more preferably 400 μm or less, and more preferably 300 μm or less. The resin sheet according to this embodiment is preferably used for the entirety of a plurality of semiconductor elements. For example, if the resin composition is in the form of a sheet, a resin sheet can be used for a structure in which semiconductor elements are arranged per gap of a frame provided with a plurality of gaps. The overall sealing frame and semiconductor elements can be used for so-called panel-level packaging. The storage elastic modulus E 'of the resin sheet according to this embodiment after curing is 1.0 × 10 at a temperature of 250 ° C. ² Above MPa is preferred, with 2.0 × 10 ² The MPa or more is preferable. The upper limit of the storage elastic modulus E 'at a temperature of 250 ° C after curing is not particularly limited, and is 2.0 × 10 ³ Preferably below MPa, 1.0 × 10 ³ Below MPa is better, with 0.8 × 10 ³ Those below MPa are more preferred. The storage elastic modulus E 'after hardening of a resin sheet can be measured by the method as described in an Example. The storage elastic modulus E ′ after curing can be achieved, for example, by using the components used in the resin composition and adjusting the blending amount. [Laminated Body] FIG. 1 is a schematic cross-sectional view of a laminated body 1 according to this embodiment. The laminated body 1 of this embodiment is a resin sheet 3 provided with a first release material 2, a second release material 4, and a first release material 2 and a second release material 4. The resin sheet 3 contains a resin composition according to this embodiment. The first release material 2 and the second release material 4 have releasability, and it is preferable that there is a difference between the release force of the first release material 2 from the resin sheet 3 and the release force of the second release material 4 from the resin sheet 3. The materials of the first release material 2 and the second release material 4 are not particularly limited. The ratio (P2 / P1) of the peeling force P1 of the first peeling material 2 to the peeling force P2 of the second peeling material 4 is preferably 0.02 ≦ P2 / P1 <1 or 1 <P2 / P1 ≦ 50. The first release material 2 and the second release material 4 may be, for example, a member to which a release treatment is applied, or a member in which a release agent layer is laminated, in addition to a member in which the release member itself has releasability. When the first release material 2 and the second release material 4 are not subjected to a release treatment, examples of the material of the first release material 2 and the second release material 4 include an olefin resin and a fluororesin. The first release material 2 and the second release material 4 can be used as a release material including a release substrate and a release agent layer formed by applying a release agent to the release substrate. By using a release material having a release base material and a release agent layer, handling properties can be facilitated. The first release material 2 and the second release material 4 may be provided with a release agent layer only on one side of the release substrate, or may be provided with a release agent layer on both sides of the release substrate. Examples of the release substrate include a paper substrate, a laminated paper in which a thermoplastic resin such as polyethylene is laminated on the paper substrate, and a plastic film. Examples of the paper substrate include cellophane, coated paper, and cast-coated paper. Examples of the plastic film include polyester films (for example, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.), and poly (ethylene terephthalate). Olefin film (for example, polypropylene, polyethylene, etc.). Of these, polyester films are preferred. Examples of the release agent include a silicone-based release agent composed of a silicone resin, and a long-chain alkyl compound containing a long-chain alkyl group such as a polyvinyl carbamate and an alkylurea derivative. Alkyl compound-based release agents; alkyd resin-based release agents composed of alkyd resins (e.g., non-convertible alkyd resins and convertible alkyd resins); hydrocarbon resins (e.g., polyethylene (e.g. , High-density polyethylene, low-density polyethylene and linear low-density polyethylene, etc.), isotactic structure or isotactic structure of propylene alone polymer and propylene-α-olefin Olefin resin-based release agents composed of crystalline polypropylene resins such as copolymers; natural rubber and synthetic rubbers (e.g., butadiene rubber, isoprene rubber, styrene-butadiene rubber, methyl formaldehyde) Rubber-based release agents composed of rubbers such as acrylic acrylate-butadiene rubber and acrylonitrile-butadiene rubber; and acrylic resin-based release agents composed of acrylic resins such as (meth) acrylate copolymers And other stripping agents, these can be single Used alone or in combination of two or more after use. Of these, polysiloxane-based release agents are preferred. The thickness of the first release material 2 and the second release material 4 is not particularly limited. The thickness of the first release material 2 and the second release material 4 is usually 1 μm or more and 500 μm or less, and preferably 3 μm or more and 100 μm or less. The thickness of the release agent layer is not particularly limited. When forming a release agent layer for applying a solution containing a release agent, the thickness of the release agent layer is preferably 0.01 μm or more and 3 μm or less, and more preferably 0.03 μm or more and 1 μm or less. The manufacturing method of the laminated body 1 is not specifically limited. For example, the laminated body 1 can be manufactured as follows. First, a resin composition is applied on the upper surface of the first release material 2 to form a coating film. Next, the coating film is dried to form a resin sheet 3. Next, the resin sheet 3 and the second release material 4 are laminated at normal temperature to obtain a laminate 1. [Semiconductor Device] The semiconductor device according to this embodiment includes a resin composition according to this embodiment or a semiconductor element sealed with a resin sheet. The sealing of the semiconductor element using the resin sheet of this embodiment can be performed as follows, for example. A resin sheet is placed so as to cover the semiconductor element, and the semiconductor element is sealed by pressing with a vacuum layer. When the laminated body 1 of this embodiment is used, one of the release materials of the laminated body 1 is peeled off, and then a resin sheet is placed to cover the semiconductor element. After that, the other release materials were peeled. Thereafter, the semiconductor element is sealed by legal pressing by a vacuum layer. The joining of the semiconductor element and other electronic components using the resin sheet of this embodiment can be performed as follows, for example. A resin sheet is carried on other electronic parts, and a semiconductor element is further placed on the resin sheet. Thereafter, the resin sheet and the semiconductor element are temporarily pressed, and the resin sheet is heated and hardened. Thereby, the resin composition is interposed between the semiconductor element and other electronic parts, and the semiconductor element and other electronic parts are bonded. [Effect of Embodiment] According to the resin composition and the resin sheet according to this embodiment, it is possible to have both fluidity before curing and heat resistance after curing. As described above, the power semiconductor device can be used as the resin composition of the present embodiment. In other words, for the semiconductor device according to this embodiment, the semiconductor device is preferably a power semiconductor device. The driving of the power semiconductor element at a high temperature of 200 ° C or higher is also set. A material using a semiconductor device having a power semiconductor element is required to have heat resistance. Since the resin composition and the resin sheet according to this embodiment have excellent heat resistance, those that cover power semiconductor elements can be preferably used for semiconductor devices. Alternatively, the resin composition and the resin sheet according to the present embodiment can be preferably used by being interposed between the power semiconductor element and other parts. As described above, the resin composition according to this embodiment can be a semiconductor device using any one or more of silicon carbide and gallium nitride. In other words, for the semiconductor device according to this embodiment, it is preferable that the semiconductor element is a semiconductor element using any one or more of silicon carbide and gallium nitride. The use of any one or more of silicon carbide and gallium nitride semiconductor elements has characteristics different from those of silicon semiconductors, so it can be used for power semiconductors, high-output devices for base stations, sensors, detectors, and Schottky barrier diodes Better. In these applications, the heat resistance of semiconductor devices using any one of silicon carbide and gallium nitride is also valued. The resin composition and resin sheet of this embodiment have excellent heat resistance and can be used with silicon carbide and silicon carbide. Any one or more semiconductor elements in gallium nitride are used in combination. [Modifications of Embodiments] The present invention is not limited to the foregoing embodiments, and modifications and improvements within a range that can achieve the object of the present invention are included in the present invention. In the foregoing embodiment, the laminated body having the first release material, the second release material, and a resin sheet provided between the first release material and the second release material is described. A laminate having a release material on one side. In addition, although the semiconductor sealing application is described in the embodiment of the semiconductor device, the resin composition and the resin sheet of the present invention can be used as a circuit board insulating material (for example, a hard printed circuit board material, Materials for flexible wiring substrates, interlayer insulation materials for accumulation substrates, etc.), adhesion films for accumulation, and adhesives are used. EXAMPLES The present invention will be described in more detail with reference to the following examples. The invention is not limited in any way by these examples. [Preparation of Resin Composition] The resin compositions related to Examples 1 to 5 and Comparative Examples 1 to 3 were prepared at the mixing ratios (mass% (solid content conversion ratio)) shown in Table 1. The materials used for the preparation of the resin composition are shown below. (Thermosetting component) • BMI resin-1: a maleimide resin having a biphenyl group (the maleimide resin represented by the aforementioned general formula (3), manufactured by Nippon Kayaku Co., Ltd. "MIR-3000-70MT ”) • BMI resin-2: bis (3-ethyl-5-methyl-4-maleimidephenyl) methane • Allyl resin: diallyl bisphenol A (binder component) • Binder resin: BisA / BisF mixed type phenoxy resin ("ZX-1356-2" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., weight average molecular weight 65,000) (inorganic filler) • Silicon dioxide filler: fused silica (Modified with epoxy silane, average particle size 0.5 μm, maximum particle size 2.0 μm) (Other additives) • Coupling agent: 3-glycidoxypropyltriethoxysilane [Production of resin sheet] First peel Material (polyethylene terephthalate with a release layer formed by an alkyd resin-based release agent, thickness 38 μm), and a resin coating (dissolved in methyl ethyl ketone) was applied with a die coater. Resin composition to a coating solution prepared with a solid content concentration of 40% by mass), and dried at 100 ° C for 2 minutes to the dried resin composition Have a thickness of 20μm. Immediately after taking out from the drying furnace, the dried resin composition (thickness: 20 μm) and the second release material (polyethylene terephthalate provided with a release layer made of a silicone release agent, Thickness: 38 μm) Lamination was performed at normal temperature (23 ° C.) to produce a laminated body laminated in the order of a first release material, a resin sheet made of a resin composition, and a second release material. <Evaluation of the resin composition before hardening> [Revised viscosity] The obtained resin composition was applied to a release material and dried at 100 ° C for 2 minutes to produce a resin sheet having a thickness of 20 µm. Two resin sheets were laminated to produce a resin sheet laminate having a thickness of 40 μm. Two resin sheet laminates were further laminated to produce a resin sheet laminate of 80 μm, and by repeating this procedure, a measurement sample having a thickness of 1280 μm was produced. With respect to this measurement sample, the measurement viscosity and the measurement viscosity (unit: Pa ･ s) at 90 ° C. were measured using a measurement device and measurement conditions as shown below. The results obtained are shown in Table 1. • Measuring device: Viscoelasticity measuring device, "MCR301" manufactured by Anton Pearl Co., Ltd. • Measuring conditions: frequency 1Hz, temperature range 30 to 150 ° C, temperature rise rate 5 ° C / min [Evaluation of adhesion to metal] The obtained resin sheet It is bonded to the following coating body under reduced pressure under the following bonding conditions. The lamination system is a vacuum laminate PVL0505S made by Nisshinbo. • Cover (1) Si wafer size: 6 inches, thickness: 800 μm Lamination of the resin composition to the mirror surface of the Si wafer. (2) Cu plate size: 30mm × 30mm, thickness: 0.3mm Specification: JIS H3100 C1100P • Lamination conditions Lamination temperature: 90 ° C Arrive pressure: 100Pa Time: 60sec After lamination, observe visually, if there are no bubbles, A uniformly bonded case is evaluated as A, and a case where bubbles can be confirmed by visual observation is evaluated as B. The evaluation results when the Si wafer is used as the coating are referred to as adhesion (for Si), and the evaluation results when the Cu plate is used as the coating are referred to as adhesion (for Cu), as shown in Table 1. <Evaluation of the resin composition after hardening> [Storage elasticity E '] The obtained resin composition was applied to a release material and dried at 100 ° C. for 2 minutes to produce a resin sheet having a thickness of 20 μm. Ten resin sheets were laminated so as to have a thickness of 200 μm, and thereafter peeled from the release material to be used as a sample. This sample was hardened under the above-mentioned thermosetting conditions (temperature: 200 ° C, time: 4 hours), and was used as a measurement sample. For this measurement sample, "DMA Q800" manufactured by TA Instruments was used to measure the storage elasticity E 'at 250 ° C at a temperature rise rate of 3 ° C / min, a temperature range of 30 to 300 ° C, and a frequency of 11Hz. Value (unit: MPa). The obtained results are shown in Table 1. The resin composition of Comparative Example 3 cannot be measured due to its high brittleness. The resin compositions of Examples 1 to 5 were compared with the resin compositions of Comparative Examples 1 to 3, and it was confirmed that they have both fluidity before curing and heat resistance after curing. The resin compositions of Examples 1 to 5 had appropriate fluidity before curing, and therefore had good adhesion and good adhesion to the coating. In addition, the resin compositions of Examples 1 to 5 have good storage elasticity after thermal curing, and thus can be applied to the production of energy-based modules and the like.

1‧‧‧ laminated

2‧‧‧ the first peeling material

3‧‧‧ resin sheet

4‧‧‧Second peeling material

FIG. 1 is a schematic cross-sectional view of a laminate according to an embodiment.

Claims (11)

A resin composition comprising a resin composition containing a thermosetting component (A), wherein the thermosetting component (A) is a resin containing (A1) maleimide, and (A1) a maleimide The imine resin contains two or more maleimide imide groups in one molecule, and the complex viscosity at 90 ° C of the resin composition before curing is 1.0 × 10 ² Pa ･ s or more 1.0 × 10 ⁴ Pa ･ s or less. The resin composition according to claim 1, wherein the (A) thermosetting component further comprises (A2) an allyl resin. The resin composition according to claim 2, wherein the mass ratio (A1 / A2) of the (A1) maleimide resin to the (A2) allyl resin is 1.5 or more. The resin composition according to claim 1, wherein the (A1) maleimide resin is a biphenyl skeleton. The resin composition according to claim 1, which further contains (B) an adhesive component. The resin composition of claim 5, wherein the content of the (A1) maleimide resin is 20 based on the total amount of the solid content of the (A) thermosetting component and the (B) adhesive component. Above mass% and below 80 mass%. The resin composition according to claim 1, which further contains (C) an inorganic filler. The resin composition according to claim 1, which further contains (D) a coupling agent. For example, the resin composition of claim 1 is used for sealing a power semiconductor element, or is used between the aforementioned power semiconductor element and other electronic parts. For example, the resin composition of claim 1 is used for sealing a semiconductor device using any one or more of silicon carbide and gallium nitride, or is used for using any one or more of the foregoing silicon carbide and gallium nitride. Between semiconductor components and other electronic parts. A resin sheet comprising the resin composition as claimed in claim 1.