TW201840260A - Manufacturing method of inspection fixture may not damage the inspected object and can correspond to micro-spacing while inspecting electric property - Google Patents
Manufacturing method of inspection fixture may not damage the inspected object and can correspond to micro-spacing while inspecting electric property Download PDFInfo
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- TW201840260A TW201840260A TW106145015A TW106145015A TW201840260A TW 201840260 A TW201840260 A TW 201840260A TW 106145015 A TW106145015 A TW 106145015A TW 106145015 A TW106145015 A TW 106145015A TW 201840260 A TW201840260 A TW 201840260A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
本技術係關於一種晶圓、晶片、封裝等電子零件之檢查治具之製造方法。The present technology relates to a method of manufacturing an inspection tool for electronic parts such as wafers, wafers, and packages.
目前,晶圓級之半導體裝置之電特性評估係使用探針卡,使探針直接接觸於形成在晶圓正面或背面之導電焊墊或凸塊而實施(例如,參照專利文獻1)。 根據該方法,能夠實現封裝前或三維安裝前之檢查。 然而,為了去除晶圓之焊墊表面之氧化膜而會對表面造成損傷地實施探針檢查,故有安裝檢查合格品後,因檢查所致之損傷而產生不合格品之情形。又,隨著焊墊尺寸變小,凸塊形成或導致安裝時產生不良情況之檢查時之損傷之影響變大。尤其是近年來,半導體晶片之微間距化不斷進展,故而檢查時之損傷不斷成為大問題。 針對裸晶片或封裝,進行使用有橡膠連接器之處理程序測試(handler test)。作為成為檢查探針片之橡膠連接器,例如,提出有將經磁場配向後之導電性粒子以於彈性體片之厚度方向上貫通之方式配置成的各向異性導電性片材(例如,參照專利文獻2)。 專利文獻2中所記載之檢查探針片因於使導電性粒子在橡膠彈性彈性體樹脂中磁場配向時在面內方向上導電性粒子發生連結,故而難以應對微間距。又,為了提高耐久性而以包圍周圍之方式安裝有框架,但框架內側之彈性體樹脂係易因熱膨脹而伸縮之物質,故存在耐久性降低之問題或因接點偏移(位置偏移)導致檢查不良。尤其是,熱循環試驗等中之位置偏移係較為嚴重之問題,於今後之進一步微間距化中難以應對。 又,一般而言,於彈性體樹脂中配置導電性物質之橡膠連接器中,成為微間距之連接器之製造較為困難,例如,200 μmP以下級別之檢查用連接器存在製造困難之情況。因此,實際情況係對組裝後之封裝實施檢查,結果,良率極差,亦導致無法降低價格。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2009-042008號公報 [專利文獻2]日本專利特開2006-024580號公報At present, the evaluation of the electrical characteristics of a wafer-level semiconductor device is carried out by using a probe card to directly contact the probe with a conductive pad or bump formed on the front or back surface of the wafer (for example, refer to Patent Document 1). According to this method, inspection before packaging or before three-dimensional mounting can be achieved. However, in order to remove the oxide film on the surface of the pad of the wafer and perform damage to the surface, the probe inspection is performed. Therefore, after the inspection of the qualified product, the defective product may be damaged due to the inspection. Further, as the size of the pad becomes smaller, the influence of the damage at the time of the formation of the bump or the inspection which causes an abnormality at the time of mounting becomes large. In particular, in recent years, the micro-pitch of semiconductor wafers has progressed, and damage during inspection has become a major problem. For bare wafers or packages, a handler test using a rubber connector is used. For example, an anisotropic conductive sheet in which conductive particles that have been aligned by a magnetic field are penetrated in the thickness direction of the elastic sheet is proposed (for example, reference is made to the rubber connector that serves as the inspection probe sheet). Patent Document 2). In the inspection probe sheet described in Patent Document 2, since the conductive particles are connected in the in-plane direction when the conductive particles are aligned in the magnetic field of the rubber elastic elastomer resin, it is difficult to cope with the fine pitch. Moreover, in order to improve durability, a frame is attached so as to surround the periphery, but the elastomer resin inside the frame is a substance which is easily stretched by thermal expansion, and thus there is a problem of deterioration in durability or contact offset (positional deviation). Lead to poor inspection. In particular, the problem of the positional shift in the thermal cycle test or the like is serious, and it is difficult to cope with further fine pitch in the future. In addition, in a rubber connector in which a conductive material is disposed in an elastomer resin, it is difficult to manufacture a connector having a fine pitch. For example, a connector having a rating of 200 μmP or less may be difficult to manufacture. Therefore, the actual situation is to check the assembled package, and as a result, the yield is extremely poor, and the price cannot be lowered. [Prior Art Document] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-042008 (Patent Document 2) Japanese Patent Laid-Open Publication No. 2006-024580
[發明所欲解決之問題] 本技術係解決上述問題者,提供一種於電特性之檢查時不會損傷檢查對象物且能夠應對微間距之檢查治具之製造方法。 [解決問題之技術手段] 本技術之發明者等人進行了銳意研究,結果發現:藉由使以特定圖案配置之導電粒子重疊而進行對位,使複數個接著膜積層,而能夠製造於電特性之檢查時不會損傷檢查對象物且能夠應對微間距之檢查治具。 即,本技術之檢查治具之製造方法具有:製作步驟,其係製作導電粒子以特定圖案配置而成之接著膜;及積層步驟,其係使以上述特定圖案配置之導電粒子重疊而進行對位,使複數個接著膜積層。 又,本技術之檢查治具具備:積層體,其積層有導電粒子以特定圖案配置而成之複數個接著膜;及複數個導電部,其等係以上述特定圖案配置之導電粒子於上述積層體之厚度方向上連鎖而形成。 [發明之效果] 根據本技術,藉由使將導電粒子以特定圖案配置成之複數個接著膜積層,可製造於電特性之檢查時不會損傷檢查對象物且能夠應對微間距之檢查治具。[Problems to be Solved by the Invention] The present invention provides a method for manufacturing an inspection jig that can cope with a fine pitch without injuring an object to be inspected during inspection of electrical characteristics. [Means for Solving the Problems] The inventors of the present invention conducted intensive studies and found that by aligning conductive particles arranged in a specific pattern and aligning a plurality of subsequent films, it is possible to manufacture electricity. When the inspection of the characteristics is performed, the inspection object is not damaged and the inspection tool for the fine pitch can be handled. That is, the manufacturing method of the inspection jig of the present technology includes a production step of fabricating an adhesive film in which conductive particles are arranged in a specific pattern, and a lamination step of overlapping the conductive particles arranged in the specific pattern. Bit, so that a plurality of subsequent film layers. Further, the inspection jig of the present invention includes a laminated body in which a plurality of bonding films in which conductive particles are arranged in a specific pattern, and a plurality of conductive portions which are arranged in the above-described specific pattern in the above-mentioned laminated layer The thickness of the body is interlocked in the direction. [Effects of the Invention] According to the present technology, by forming a plurality of subsequent film layers in which conductive particles are arranged in a specific pattern, it is possible to manufacture an inspection jig that can prevent the object to be inspected during inspection of electrical characteristics and can cope with fine pitch. .
以下,按照下述順序對本技術之實施形態詳細地進行說明。 1.檢查治具之製造方法 2.檢查治具 <1.檢查治具之製造方法> 本技術之檢查治具之製造方法具有:製作步驟(A),其係製作將導電粒子以特定圖案配置成之接著膜;及積層步驟(B),其係使以特定圖案配置之導電粒子重疊而進行對位,使複數個接著膜積層。藉此,形成導電粒子於厚度方向上連鎖而成之導電部,故而可製造於電特性之檢查時不會損傷檢查對象物且能夠應對微間距之檢查治具。 [製作步驟(A)] 於製作步驟(A)中,製作導電粒子以特定圖案配置形成之接著膜。例如,使用以導電粒子之配置圖案形成有開口部之基板,對基板之複數個開口部填充溶劑及導電粒子,於填充有導電粒子之基板表面貼合絕緣性樹脂膜,一面對基板進行加熱,一面將絕緣性樹脂膜自基板之表面剝離,將導電粒子轉接著於絕緣性樹脂膜,藉此可獲得導電粒子以特定圖案配置形成之接著膜。 又,於如上所述般使用以導電粒子之配置圖案形成有開口部之基板,對基板之開口部填充導電粒子,使基板之導電粒子轉接著於絕緣性樹脂膜而製作接著膜之情形時,自收容導電粒子之容易度、絕緣性樹脂之壓入容易度等平衡而言,開口直徑相對於導電粒子之平均粒徑之比(=開口之直徑/導電粒子之粒徑)較佳為1.2~2.5。藉此,可降低導電粒子不進入至開口部之機率,提高導電粒子於厚度方向上連鎖而成之導電部之導通性。又,自轉印性提高與導電粒子保持性之平衡而言,導電粒子之粒徑相對於開口之深度之比(=導電粒子之粒徑/開口之深度)較佳為0.4~3.0,更佳為0.5~1.5。 較佳為,接著膜具有可撓性及絕緣性,且熱膨脹係數較低,耐熱性較高。作為接著膜,自耐熱性之觀點而言較佳為包含聚醯亞胺。 俯視下配置於接著膜之導電粒子之位置較佳為具有特定之形狀且具有規則性,較佳為設為格子狀、鋸齒狀等規則性的排列。作為格子狀,可列舉斜方格子、六方格子、正方格子、矩形格子、平行體格子等。又,亦可相對於膜之長邊方向以特定之排列形狀具有規則性。 導電粒子可使用各向異性導電膜中所使用之一般導電粒子。例如,可使用鎳、鈷、鐵等金屬粒子、在樹脂芯粒子或無機芯粒子之表面鍍覆有導電性金屬之粒子。又,作為導電性金屬鍍覆,可列舉Ni/Au鍍覆、Ni/Pd鍍覆、Ni/Pd/Au鍍覆等。該等之中,自減輕對檢查對象之損傷或片材之耐久性之觀點而言,較佳為使用在樹脂芯粒子之表面鍍覆有導電性金屬之粒子。 又,導電粒子之平均粒徑越小,可應對越微小之焊墊或凸塊,故而較佳為20 μm以下,更佳為10 μm以下,進而較佳為5 μm以下。 [積層步驟(B)] 圖1係用以說明檢查治具之製造方法中之積層步驟之一例的立體圖,圖1(A)表示將接著膜對位之狀態,圖1(B)表示貼合有接著膜之狀態。如圖1(A)所示,於積層步驟(B)中,使以特定圖案配置之導電粒子11、21重疊而進行對位,如圖1(B)所示,貼合複數個接著膜10、20。具體而言,藉由相機拍攝導電粒子之圖案,使第1接著膜10之導電粒子11與第2接著膜20之導電粒子21重疊並積層,獲得積層體30。藉此,形成導電粒子於厚度方向上連鎖而成之導電部31。 又,較佳為,於上述製作步驟(A)中,於接著膜之周緣部印刷對位用標記(對準標記)12、22,於積層步驟(B)中,使對位用標記12、22重疊。藉此,可藉由相機識別對準標記,而容易地調整接著膜之積層位置。 作為對準標記12、22之形狀,例如,可使用十字形、圓形、四邊形、八邊形等通常使用之形狀或將該等組合者。又,為了不對檢查治具之使用區域帶來影響,對準標記12、22之尺寸較佳為100 μm以下。又,對準標記12、22除了於X方向及Y方向上進行對準以外,亦會藉由裝置進行旋轉θ之修正,故較佳為於接著膜之周緣部印刷2處以上。 積層有複數個接著膜之積層體30之厚度若過薄則耐久性差,故而較佳為5 μm以上,更佳為10 μm以上。又,積層體30之厚度若過厚則導電部31之導通困難,故而較佳為100 μm以下,更佳為50 μm以下。 又,積層體30中之導電部31之直徑較佳為1~100 μm,導電部間之距離較佳為10~100 μm。 根據此種檢查治具之製造方法,可獲得於電特性之檢查時不會損傷檢查對象物且能夠應對微間距之檢查治具。 <2.檢查治具> 圖2係表示檢查治具之構成例之剖視圖。如圖2所示,檢查治具具備:積層體40,其積層有導電粒子以特定圖案配置而成之複數個接著膜;及複數個導電部41,其等係將以特定圖案配置之導電粒子於上述積層體之厚度方向上連鎖而形成。此種檢查治具例如可藉由上述檢查治具之製造方法而獲得。 較佳為,積層體40具有可撓性及絕緣性,且熱膨脹係數較低,耐熱性較高。作為積層體40,自耐熱性之觀點而言較佳為包含聚醯亞胺。又,積層體40之厚度與上述積層體30同樣地,若過薄則耐久性差,故而較佳為5 μm以上,更佳為10 μm以上。又,積層體40之厚度若過厚則導通部41之導通困難,故而較佳為100 μm以下,更佳為50 μm以下。藉由設定為此種積層體40之厚度,能夠於電特性之檢查時吸收半導體晶片之階差。 導電部41亦可於積層體40之厚度方向導通,且自積層體40之至少一個面突出。導電部41之直徑較佳為1~100 μm,導電部間之距離較佳為10~100 μm。 形成導電部41之導電粒子與上述導電粒子同樣地,自減輕對檢查對象之損傷或片材之耐久性之觀點而言,較佳為使用在樹脂芯粒子之表面鍍覆有導電性金屬之粒子。又,導電粒子之平均粒徑越小,可應對越微小之焊墊或凸塊,故而較佳為20 μm以下,更佳為10 μm以下,進而較佳為5 μm以下。 又,較佳為,複數個接著膜係於周緣部具有對位用標記,積層體40於周緣部進而具備對位用標記於積層體40之厚度方向上重疊形成之對位部。藉此,藉由對位部,可判別積層體之重疊之精度。 根據此種檢查治具,於電特性之檢查時不會損傷半導體晶圓之焊墊或凸塊且可應對微間距化。Hereinafter, embodiments of the present technology will be described in detail in the following order. 1. Inspection method of inspection jig 2. Inspection jig <1. Manufacturing method of inspection jig> The manufacturing method of the inspection jig of the present technology has a production step (A) which is prepared by arranging conductive particles in a specific pattern And a lamination step (B), wherein the conductive particles arranged in a specific pattern are superposed and aligned, and a plurality of subsequent films are laminated. Thereby, since the conductive portion in which the conductive particles are interlocked in the thickness direction is formed, it is possible to manufacture an inspection jig that can cope with the micro-pitch without damaging the object to be inspected during the inspection of the electrical characteristics. [Production Step (A)] In the production step (A), an adhesive film in which conductive particles are arranged in a specific pattern is formed. For example, a substrate having an opening formed in a pattern of conductive particles is used, and a plurality of openings of the substrate are filled with a solvent and conductive particles, and an insulating resin film is bonded to the surface of the substrate filled with the conductive particles to heat the substrate. The insulating resin film is peeled off from the surface of the substrate, and the conductive particles are transferred to the insulating resin film, whereby an adhesive film in which the conductive particles are arranged in a specific pattern can be obtained. In the case where the substrate having the opening is formed in the arrangement pattern of the conductive particles, the conductive particles are filled in the opening of the substrate, and the conductive particles of the substrate are transferred to the insulating resin film to form the adhesive film. The ratio of the opening diameter to the average particle diameter of the conductive particles (=the diameter of the opening/the particle diameter of the conductive particles) is preferably 1.2 in terms of the ease of accommodating the conductive particles and the ease of press-fitting of the insulating resin. ~2.5. Thereby, the probability that the conductive particles do not enter the opening portion can be reduced, and the conductivity of the conductive portion in which the conductive particles are interlocked in the thickness direction can be improved. Further, in terms of the balance between the improvement of the transfer property and the retention of the conductive particles, the ratio of the particle diameter of the conductive particles to the depth of the opening (=the particle diameter of the conductive particles/the depth of the opening) is preferably from 0.4 to 3.0, more preferably 0.5 to 1.5. Preferably, the film is provided with flexibility and insulation, and has a low coefficient of thermal expansion and high heat resistance. As the adhesive film, it is preferable to contain a polyimine from the viewpoint of heat resistance. The position of the conductive particles disposed on the adhesive film in plan view is preferably a specific shape and has regularity, and is preferably a regular arrangement such as a lattice shape or a zigzag shape. Examples of the lattice shape include a diagonal square lattice, a hexagonal lattice, a square lattice, a rectangular lattice, and a parallel lattice. Further, it is also possible to have regularity in a specific arrangement shape with respect to the longitudinal direction of the film. As the conductive particles, general conductive particles used in an anisotropic conductive film can be used. For example, metal particles such as nickel, cobalt, or iron, and particles coated with a conductive metal on the surface of the resin core particles or the inorganic core particles can be used. Further, examples of the conductive metal plating include Ni/Au plating, Ni/Pd plating, and Ni/Pd/Au plating. Among these, from the viewpoint of reducing the damage to the object to be inspected or the durability of the sheet, it is preferred to use particles in which a conductive metal is plated on the surface of the resin core particle. Further, the smaller the average particle diameter of the conductive particles, the smaller the pad or the bump can be handled, and therefore it is preferably 20 μm or less, more preferably 10 μm or less, still more preferably 5 μm or less. [Laminating Step (B)] FIG. 1 is a perspective view for explaining an example of a laminating step in the manufacturing method of the inspection jig, and FIG. 1(A) shows a state in which the adhesive film is aligned, and FIG. 1(B) shows a lamination. There is a state of the film. As shown in FIG. 1(A), in the layering step (B), the conductive particles 11 and 21 arranged in a specific pattern are superposed and aligned, and as shown in FIG. 1(B), a plurality of bonding films 10 are bonded. 20. Specifically, the conductive particles 11 of the first adhesive film 10 and the conductive particles 21 of the second adhesive film 20 are superimposed and laminated by the pattern of the conductive particles by the camera to obtain the laminated body 30. Thereby, the conductive portion 31 in which the conductive particles are interlocked in the thickness direction is formed. Further, in the above-described production step (A), alignment marks (alignment marks) 12 and 22 are printed on the peripheral portion of the film, and in the layering step (B), the alignment marks 12 are provided. 22 overlap. Thereby, the position of the laminate of the adhesive film can be easily adjusted by the camera recognizing the alignment mark. As the shape of the alignment marks 12, 22, for example, a commonly used shape such as a cross, a circle, a quadrangle, an octagon, or the like can be used. Further, in order not to affect the use area of the inspection jig, the size of the alignment marks 12 and 22 is preferably 100 μm or less. Further, in addition to the alignment of the alignment marks 12 and 22 in the X direction and the Y direction, the rotation θ is corrected by the apparatus. Therefore, it is preferable to print two or more places on the peripheral edge portion of the film. When the thickness of the laminated body 30 in which a plurality of laminated films are laminated is too small, the durability is poor, so that it is preferably 5 μm or more, and more preferably 10 μm or more. Further, when the thickness of the laminated body 30 is too large, conduction of the conductive portion 31 is difficult, and therefore it is preferably 100 μm or less, and more preferably 50 μm or less. Further, the diameter of the conductive portion 31 in the laminated body 30 is preferably from 1 to 100 μm, and the distance between the conductive portions is preferably from 10 to 100 μm. According to the manufacturing method of such an inspection jig, it is possible to obtain an inspection jig that can cope with the micro-pitch without damaging the object to be inspected during the inspection of the electrical characteristics. <2. Inspection jig> Fig. 2 is a cross-sectional view showing a configuration example of the inspection jig. As shown in FIG. 2, the inspection jig includes a laminated body 40 in which a plurality of bonding films in which conductive particles are arranged in a specific pattern are laminated, and a plurality of conductive portions 41 which are conductive particles arranged in a specific pattern. It is formed by interlocking in the thickness direction of the above laminated body. Such an inspection jig can be obtained, for example, by the above-described manufacturing method of the inspection jig. Preferably, the laminated body 40 has flexibility and insulation, and has a low coefficient of thermal expansion and high heat resistance. The laminated body 40 preferably contains a polyimine from the viewpoint of heat resistance. Further, similarly to the laminated body 30, the thickness of the laminated body 40 is less than 5 μm or more, and more preferably 10 μm or more. Further, if the thickness of the laminated body 40 is too large, the conduction of the conductive portion 41 is difficult, and therefore it is preferably 100 μm or less, and more preferably 50 μm or less. By setting the thickness of such a laminate 40, it is possible to absorb the step of the semiconductor wafer at the time of inspection of electrical characteristics. The conductive portion 41 may be electrically connected to the thickness direction of the laminated body 40 and protrude from at least one surface of the laminated body 40. The diameter of the conductive portion 41 is preferably from 1 to 100 μm, and the distance between the conductive portions is preferably from 10 to 100 μm. In the same manner as the above-described conductive particles, the conductive particles forming the conductive portion 41 are preferably coated with a conductive metal particle on the surface of the resin core particle from the viewpoint of reducing damage to the object to be inspected or durability of the sheet. . Further, the smaller the average particle diameter of the conductive particles, the smaller the pad or the bump can be handled, and therefore it is preferably 20 μm or less, more preferably 10 μm or less, still more preferably 5 μm or less. Moreover, it is preferable that the plurality of adhesive films have alignment marks on the peripheral edge portion, and the laminated body 40 further includes a registration portion formed by overlapping the alignment marks in the thickness direction of the laminated body 40 in the peripheral edge portion. Thereby, the accuracy of the overlap of the laminated bodies can be discriminated by the alignment portion. According to such an inspection jig, the pads or bumps of the semiconductor wafer are not damaged during the inspection of the electrical characteristics, and the micro pitch can be handled.
10‧‧‧第1接著膜10‧‧‧1st film
11‧‧‧導電粒子11‧‧‧Electrical particles
12‧‧‧對準標記12‧‧‧ alignment mark
20‧‧‧第2接著膜20‧‧‧2nd follow-up film
21‧‧‧導電粒子21‧‧‧Electrical particles
22‧‧‧對準標記22‧‧‧ alignment mark
30‧‧‧積層體30‧‧‧Layered body
31‧‧‧導電部31‧‧‧Electrical Department
40‧‧‧積層體40‧‧‧Layered body
41‧‧‧導電部41‧‧‧Electrical Department
圖1係用以說明檢查治具之製造方法中之積層步驟之一例的立體圖,圖1(A)表示將接著膜對位之狀態,圖1(B)表示貼合有接著膜之狀態。 圖2係表示檢查治具之構成例之剖視圖。Fig. 1 is a perspective view for explaining an example of a lamination step in a method of manufacturing an inspection jig. Fig. 1(A) shows a state in which a film is aligned, and Fig. 1(B) shows a state in which a film is bonded. Fig. 2 is a cross-sectional view showing a configuration example of an inspection jig.
Claims (8)
Applications Claiming Priority (2)
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JP2017-085675 | 2017-04-24 | ||
JP2017085675A JP7042037B2 (en) | 2017-04-24 | 2017-04-24 | Manufacturing method of inspection jig |
Publications (1)
Publication Number | Publication Date |
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TW201840260A true TW201840260A (en) | 2018-11-01 |
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TW106145015A TW201840260A (en) | 2017-04-24 | 2017-12-21 | Manufacturing method of inspection fixture may not damage the inspected object and can correspond to micro-spacing while inspecting electric property |
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JP (1) | JP7042037B2 (en) |
KR (1) | KR20180119096A (en) |
TW (1) | TW201840260A (en) |
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KR20210058641A (en) * | 2019-11-12 | 2021-05-24 | 화인인스트루먼트 (주) | Probe array and Probe head manufacturing method of the probe card using the same |
KR102257740B1 (en) * | 2020-05-19 | 2021-05-28 | (주)티에스이 | Insulation film for test socket and test socket having the same |
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JPH0426191A (en) * | 1990-05-21 | 1992-01-29 | Fujitsu Ltd | Manufacture of multilayer printed circuit board |
JPH0660930A (en) * | 1992-08-03 | 1994-03-04 | Bridgestone Corp | Anisotropic conductive connector and manufacture thereof |
JP3951333B2 (en) * | 1997-01-10 | 2007-08-01 | Jsr株式会社 | Anisotropic conductive rubber sheet and manufacturing method thereof |
JP2006308413A (en) * | 2005-04-28 | 2006-11-09 | Ibiden Co Ltd | Probe card |
US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
JP4890053B2 (en) * | 2006-03-02 | 2012-03-07 | 旭化成イーマテリアルズ株式会社 | Anisotropic conductive film for microcircuit inspection |
JP4793203B2 (en) * | 2006-09-28 | 2011-10-12 | Jsr株式会社 | Anisotropic conductive connector and method for inspecting test object using this anisotropic conductive connector |
JP6289831B2 (en) * | 2013-07-29 | 2018-03-07 | デクセリアルズ株式会社 | Manufacturing method of conductive adhesive film, conductive adhesive film, and manufacturing method of connector |
KR101974763B1 (en) * | 2015-01-13 | 2019-05-02 | 데쿠세리아루즈 가부시키가이샤 | Multilayer board |
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2017
- 2017-04-24 JP JP2017085675A patent/JP7042037B2/en active Active
- 2017-12-21 TW TW106145015A patent/TW201840260A/en unknown
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JP2018185175A (en) | 2018-11-22 |
JP7042037B2 (en) | 2022-03-25 |
KR20180119096A (en) | 2018-11-01 |
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