TW201840260A - Manufacturing method of inspection fixture may not damage the inspected object and can correspond to micro-spacing while inspecting electric property - Google Patents

Abstract

The invention provides a manufacturing method of inspection fixture that does not damage inspection objects and capable of corresponding to micro-spacing while inspecting electric property. Conductive particles configured by specific pattern overlap to perform alignment so that a plurality of adhesive films 10, 20 is laminated. Accordingly, in the lamination body 30, the conductive portion 31 formed by conductive particles that chain in thickness direction would not damage inspection objects and can correspond to micro-spacing while inspecting electric property.

Description

Inspection method of manufacturing jig

The present technology relates to a method of manufacturing an inspection tool for electronic parts such as wafers, wafers, and packages.

At present, the evaluation of the electrical characteristics of a wafer-level semiconductor device is carried out by using a probe card to directly contact the probe with a conductive pad or bump formed on the front or back surface of the wafer (for example, refer to Patent Document 1). According to this method, inspection before packaging or before three-dimensional mounting can be achieved. However, in order to remove the oxide film on the surface of the pad of the wafer and perform damage to the surface, the probe inspection is performed. Therefore, after the inspection of the qualified product, the defective product may be damaged due to the inspection. Further, as the size of the pad becomes smaller, the influence of the damage at the time of the formation of the bump or the inspection which causes an abnormality at the time of mounting becomes large. In particular, in recent years, the micro-pitch of semiconductor wafers has progressed, and damage during inspection has become a major problem. For bare wafers or packages, a handler test using a rubber connector is used. For example, an anisotropic conductive sheet in which conductive particles that have been aligned by a magnetic field are penetrated in the thickness direction of the elastic sheet is proposed (for example, reference is made to the rubber connector that serves as the inspection probe sheet). Patent Document 2). In the inspection probe sheet described in Patent Document 2, since the conductive particles are connected in the in-plane direction when the conductive particles are aligned in the magnetic field of the rubber elastic elastomer resin, it is difficult to cope with the fine pitch. Moreover, in order to improve durability, a frame is attached so as to surround the periphery, but the elastomer resin inside the frame is a substance which is easily stretched by thermal expansion, and thus there is a problem of deterioration in durability or contact offset (positional deviation). Lead to poor inspection. In particular, the problem of the positional shift in the thermal cycle test or the like is serious, and it is difficult to cope with further fine pitch in the future. In addition, in a rubber connector in which a conductive material is disposed in an elastomer resin, it is difficult to manufacture a connector having a fine pitch. For example, a connector having a rating of 200 μmP or less may be difficult to manufacture. Therefore, the actual situation is to check the assembled package, and as a result, the yield is extremely poor, and the price cannot be lowered. [Prior Art Document] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-042008 (Patent Document 2) Japanese Patent Laid-Open Publication No. 2006-024580

[Problems to be Solved by the Invention] The present invention provides a method for manufacturing an inspection jig that can cope with a fine pitch without injuring an object to be inspected during inspection of electrical characteristics. [Means for Solving the Problems] The inventors of the present invention conducted intensive studies and found that by aligning conductive particles arranged in a specific pattern and aligning a plurality of subsequent films, it is possible to manufacture electricity. When the inspection of the characteristics is performed, the inspection object is not damaged and the inspection tool for the fine pitch can be handled. That is, the manufacturing method of the inspection jig of the present technology includes a production step of fabricating an adhesive film in which conductive particles are arranged in a specific pattern, and a lamination step of overlapping the conductive particles arranged in the specific pattern. Bit, so that a plurality of subsequent film layers. Further, the inspection jig of the present invention includes a laminated body in which a plurality of bonding films in which conductive particles are arranged in a specific pattern, and a plurality of conductive portions which are arranged in the above-described specific pattern in the above-mentioned laminated layer The thickness of the body is interlocked in the direction. [Effects of the Invention] According to the present technology, by forming a plurality of subsequent film layers in which conductive particles are arranged in a specific pattern, it is possible to manufacture an inspection jig that can prevent the object to be inspected during inspection of electrical characteristics and can cope with fine pitch. .

Hereinafter, embodiments of the present technology will be described in detail in the following order. 1. Inspection method of inspection jig 2. Inspection jig <1. Manufacturing method of inspection jig> The manufacturing method of the inspection jig of the present technology has a production step (A) which is prepared by arranging conductive particles in a specific pattern And a lamination step (B), wherein the conductive particles arranged in a specific pattern are superposed and aligned, and a plurality of subsequent films are laminated. Thereby, since the conductive portion in which the conductive particles are interlocked in the thickness direction is formed, it is possible to manufacture an inspection jig that can cope with the micro-pitch without damaging the object to be inspected during the inspection of the electrical characteristics. [Production Step (A)] In the production step (A), an adhesive film in which conductive particles are arranged in a specific pattern is formed. For example, a substrate having an opening formed in a pattern of conductive particles is used, and a plurality of openings of the substrate are filled with a solvent and conductive particles, and an insulating resin film is bonded to the surface of the substrate filled with the conductive particles to heat the substrate. The insulating resin film is peeled off from the surface of the substrate, and the conductive particles are transferred to the insulating resin film, whereby an adhesive film in which the conductive particles are arranged in a specific pattern can be obtained. In the case where the substrate having the opening is formed in the arrangement pattern of the conductive particles, the conductive particles are filled in the opening of the substrate, and the conductive particles of the substrate are transferred to the insulating resin film to form the adhesive film. The ratio of the opening diameter to the average particle diameter of the conductive particles (=the diameter of the opening/the particle diameter of the conductive particles) is preferably 1.2 in terms of the ease of accommodating the conductive particles and the ease of press-fitting of the insulating resin. ~2.5. Thereby, the probability that the conductive particles do not enter the opening portion can be reduced, and the conductivity of the conductive portion in which the conductive particles are interlocked in the thickness direction can be improved. Further, in terms of the balance between the improvement of the transfer property and the retention of the conductive particles, the ratio of the particle diameter of the conductive particles to the depth of the opening (=the particle diameter of the conductive particles/the depth of the opening) is preferably from 0.4 to 3.0, more preferably 0.5 to 1.5. Preferably, the film is provided with flexibility and insulation, and has a low coefficient of thermal expansion and high heat resistance. As the adhesive film, it is preferable to contain a polyimine from the viewpoint of heat resistance. The position of the conductive particles disposed on the adhesive film in plan view is preferably a specific shape and has regularity, and is preferably a regular arrangement such as a lattice shape or a zigzag shape. Examples of the lattice shape include a diagonal square lattice, a hexagonal lattice, a square lattice, a rectangular lattice, and a parallel lattice. Further, it is also possible to have regularity in a specific arrangement shape with respect to the longitudinal direction of the film. As the conductive particles, general conductive particles used in an anisotropic conductive film can be used. For example, metal particles such as nickel, cobalt, or iron, and particles coated with a conductive metal on the surface of the resin core particles or the inorganic core particles can be used. Further, examples of the conductive metal plating include Ni/Au plating, Ni/Pd plating, and Ni/Pd/Au plating. Among these, from the viewpoint of reducing the damage to the object to be inspected or the durability of the sheet, it is preferred to use particles in which a conductive metal is plated on the surface of the resin core particle. Further, the smaller the average particle diameter of the conductive particles, the smaller the pad or the bump can be handled, and therefore it is preferably 20 μm or less, more preferably 10 μm or less, still more preferably 5 μm or less. [Laminating Step (B)] FIG. 1 is a perspective view for explaining an example of a laminating step in the manufacturing method of the inspection jig, and FIG. 1(A) shows a state in which the adhesive film is aligned, and FIG. 1(B) shows a lamination. There is a state of the film. As shown in FIG. 1(A), in the layering step (B), the conductive particles 11 and 21 arranged in a specific pattern are superposed and aligned, and as shown in FIG. 1(B), a plurality of bonding films 10 are bonded. 20. Specifically, the conductive particles 11 of the first adhesive film 10 and the conductive particles 21 of the second adhesive film 20 are superimposed and laminated by the pattern of the conductive particles by the camera to obtain the laminated body 30. Thereby, the conductive portion 31 in which the conductive particles are interlocked in the thickness direction is formed. Further, in the above-described production step (A), alignment marks (alignment marks) 12 and 22 are printed on the peripheral portion of the film, and in the layering step (B), the alignment marks 12 are provided. 22 overlap. Thereby, the position of the laminate of the adhesive film can be easily adjusted by the camera recognizing the alignment mark. As the shape of the alignment marks 12, 22, for example, a commonly used shape such as a cross, a circle, a quadrangle, an octagon, or the like can be used. Further, in order not to affect the use area of the inspection jig, the size of the alignment marks 12 and 22 is preferably 100 μm or less. Further, in addition to the alignment of the alignment marks 12 and 22 in the X direction and the Y direction, the rotation θ is corrected by the apparatus. Therefore, it is preferable to print two or more places on the peripheral edge portion of the film. When the thickness of the laminated body 30 in which a plurality of laminated films are laminated is too small, the durability is poor, so that it is preferably 5 μm or more, and more preferably 10 μm or more. Further, when the thickness of the laminated body 30 is too large, conduction of the conductive portion 31 is difficult, and therefore it is preferably 100 μm or less, and more preferably 50 μm or less. Further, the diameter of the conductive portion 31 in the laminated body 30 is preferably from 1 to 100 μm, and the distance between the conductive portions is preferably from 10 to 100 μm. According to the manufacturing method of such an inspection jig, it is possible to obtain an inspection jig that can cope with the micro-pitch without damaging the object to be inspected during the inspection of the electrical characteristics. <2. Inspection jig> Fig. 2 is a cross-sectional view showing a configuration example of the inspection jig. As shown in FIG. 2, the inspection jig includes a laminated body 40 in which a plurality of bonding films in which conductive particles are arranged in a specific pattern are laminated, and a plurality of conductive portions 41 which are conductive particles arranged in a specific pattern. It is formed by interlocking in the thickness direction of the above laminated body. Such an inspection jig can be obtained, for example, by the above-described manufacturing method of the inspection jig. Preferably, the laminated body 40 has flexibility and insulation, and has a low coefficient of thermal expansion and high heat resistance. The laminated body 40 preferably contains a polyimine from the viewpoint of heat resistance. Further, similarly to the laminated body 30, the thickness of the laminated body 40 is less than 5 μm or more, and more preferably 10 μm or more. Further, if the thickness of the laminated body 40 is too large, the conduction of the conductive portion 41 is difficult, and therefore it is preferably 100 μm or less, and more preferably 50 μm or less. By setting the thickness of such a laminate 40, it is possible to absorb the step of the semiconductor wafer at the time of inspection of electrical characteristics. The conductive portion 41 may be electrically connected to the thickness direction of the laminated body 40 and protrude from at least one surface of the laminated body 40. The diameter of the conductive portion 41 is preferably from 1 to 100 μm, and the distance between the conductive portions is preferably from 10 to 100 μm. In the same manner as the above-described conductive particles, the conductive particles forming the conductive portion 41 are preferably coated with a conductive metal particle on the surface of the resin core particle from the viewpoint of reducing damage to the object to be inspected or durability of the sheet. . Further, the smaller the average particle diameter of the conductive particles, the smaller the pad or the bump can be handled, and therefore it is preferably 20 μm or less, more preferably 10 μm or less, still more preferably 5 μm or less. Moreover, it is preferable that the plurality of adhesive films have alignment marks on the peripheral edge portion, and the laminated body 40 further includes a registration portion formed by overlapping the alignment marks in the thickness direction of the laminated body 40 in the peripheral edge portion. Thereby, the accuracy of the overlap of the laminated bodies can be discriminated by the alignment portion. According to such an inspection jig, the pads or bumps of the semiconductor wafer are not damaged during the inspection of the electrical characteristics, and the micro pitch can be handled.

10‧‧‧1st film

11‧‧‧Electrical particles

12‧‧‧ alignment mark

20‧‧‧2nd follow-up film

21‧‧‧Electrical particles

22‧‧‧ alignment mark

30‧‧‧Layered body

31‧‧‧Electrical Department

40‧‧‧Layered body

41‧‧‧Electrical Department

Fig. 1 is a perspective view for explaining an example of a lamination step in a method of manufacturing an inspection jig. Fig. 1(A) shows a state in which a film is aligned, and Fig. 1(B) shows a state in which a film is bonded. Fig. 2 is a cross-sectional view showing a configuration example of an inspection jig.

Claims (8)

A manufacturing method of an inspection jig, comprising: a manufacturing step of fabricating an adhesive film in which conductive particles are arranged in a specific pattern; and a laminating step of superposing conductive particles arranged in the specific pattern to be aligned , so that a plurality of subsequent film layers. The manufacturing method of the inspection jig according to claim 1, wherein in the manufacturing step, the registration mark is printed on the peripheral portion of the adhesive film, and the alignment mark is superimposed in the laminating step. The method for producing an inspection jig according to claim 1, wherein the conductive particles are coated with particles of a conductive metal on a surface of the resin core particle. The method for producing an inspection jig according to claim 2, wherein the conductive particles are coated with particles of a conductive metal on a surface of the resin core particle. The method for producing an inspection jig according to any one of claims 1 to 4, wherein in the manufacturing step, a substrate having an opening formed in a pattern of conductive particles is used, and an opening portion of the substrate is filled with conductive particles to cause a substrate The conductive particles are transferred to an insulating resin film to form a bonding film, and the ratio of the opening diameter to the average particle diameter of the conductive particles is 1.2 to 2.5. An inspection jig comprising: a laminate having a plurality of bonding films in which conductive particles are arranged in a specific pattern; and a plurality of conductive portions, wherein the conductive particles arranged in the specific pattern are in the laminate Formed in a chain in the thickness direction. The inspection jig according to claim 6, wherein the adhesive film has a registration mark on a peripheral portion, and the peripheral portion further includes a alignment portion formed by overlapping the alignment mark in a thickness direction of the laminate. The inspection jig according to claim 6 or 7, wherein the conductive particles are coated with particles of a conductive metal on a surface of the resin core particle.