TW201839830A - Cutting method - Google Patents

Abstract

A cutting method performs at least one transversal and longitudinal cutting process on a carrying structure provided with a plurality of packaging units to separate the packaging units, wherein the entire cutting route of the at least one transversal and longitudinal cutting process is not a single line. Therefore, the cutting route can evade the packaging units based on demands, and the packaging units can be prevented from contacting with a cutting tool and be avoided from damaged.

Description

   Cutting method   

The invention relates to a packaging process, in particular to a packaging singulation method.

With the development of the electronics industry, today's electronic products have been designed to be light, thin, short, and functionally diversified. Semiconductor packaging technology has also developed different packaging types. Among them, the ball grid array (BGA) ), Such as PBGA, EBGA, FCBGA, etc., is an advanced semiconductor packaging technology. It uses a packaging substrate to house semiconductor components, and a plurality of solder balls arranged in a grid array are arranged on the back of the packaging substrate to make the same unit area. The circuit board can accommodate more input / output connections to meet the needs of highly integrated semiconductor wafers, and the entire package unit is soldered and electrically connected to external electronic devices by these solder balls.

Please refer to FIG. 1A and FIG. 1B, which is a conventional full-surface package structure 1 of a flip-chip package. The manufacturing method is to first arrange a plurality of package substrates 10 in an array on a tape 1c, and then place semiconductor components 11 on the package substrate 10. Then, pre-baking is performed, and then a molding operation is performed so that the packaging colloid 12 covers the semiconductor element 11 so that the packaging substrate 10, the semiconductor element 11 and the packaging colloid 12 constitute a packaging unit 1a, and the packaging units 1a are connected between each other. The spacers 1 b made of the material of the sealing gel 12 are combined with each other, and each of the spacers 1 b has a single linear shape. Finally, the spacer portion 1b is used as a cutting path S to perform a singulation operation in a continuous straight line, thereby separating each of the packaging units 1a and the tape 1c.

However, in the conventional packaging process, because the packaging substrate 10 is adhered to the tape 1c and pre-baked, an offset will occur (as shown in FIG. 1C). Therefore, during the cutting operation, the linear cutting path S The dicing blade will damage the packaging unit 1a (as shown in FIG. 1C), resulting in an increased scrap rate of the packaging unit 1a.

Furthermore, if the cutting tool is replaced by manual cutting, the accuracy of manual cutting will be lower, which will result in a higher scrap rate of the packaging unit 1a.

Therefore, how to overcome the problems of the above-mentioned conventional technologies has become an urgent problem to be overcome in the industry.

In view of the various shortcomings of the above-mentioned conventional technologies, the present invention discloses a cutting method, which includes: combining a plurality of packaging units to a load-bearing structure; and performing at least one vertical and horizontal cutting operation along a space between any two of the packaging units. In order to separate the packaging units, at least one overall cutting path of the vertical or horizontal cutting operation is not a single straight line.

In the aforementioned cutting method, the supporting structure is an adhesive tape.

In the aforementioned cutting method, the packaging unit includes an electronic component and a packaging material covering the electronic component. Further, the packaging unit further includes a carrier for carrying the electronic component.

In the aforementioned cutting method, the spacer is an air passage, or the spacer is made of a packaging material.

In the foregoing cutting method, the cutting operation is provided with a virtual position table corresponding to a predetermined position of the packaging unit, and at least one identification point is set in the virtual position table, and then the actual position corresponding to the packaging unit is retrieved, according to The set identification point and the corresponding current position of the packaging unit calculate the cutting path.

In the aforementioned cutting method, the overall cutting path is constituted by a plurality of linear cutting line segments.

In the aforementioned cutting method, the packaging unit is not disposed at a predetermined position of the carrying structure. For example, the offset of the packaging unit is at most 100 microns.

In the aforementioned cutting method, the dimensions of the packaging units are the same or different.

In the foregoing cutting method, the cutting operation is to capture a current position corresponding to the packaging unit to calculate a cutting path according to the corresponding current position of the packaging unit.

It can be known from the above that the cutting method of the present invention is to obtain an optimal cutting path according to the identification point selected by the corresponding current position of the packaging unit by capturing the actual current position corresponding to the packaging unit. The whole of the cutting path is a non-single straight line, so that when the packaging unit is displaced, the cutting path can avoid the packaging units and effectively reduce the scrap rate of the packaging unit.

1,2,4‧‧‧‧Full layout package structure

1a, 2a, 4a, 4a’‧‧‧package unit

1b, 2b, 2b’‧‧‧spacer

1c‧‧‧Tape

10‧‧‧ package substrate

11‧‧‧Semiconductor

12‧‧‧ encapsulated colloid

2c‧‧‧bearing structure

20‧‧‧carrying parts

21‧‧‧Electronic components

22‧‧‧Packaging material

3‧‧‧ calculator

L, L ’, L” ‧‧‧ cutting path

L1, L2, L3, L4‧‧‧Straight cutting line segments

P‧‧‧Identification point

P ’, P” ‧‧‧ current position

S‧‧‧ cutting path

Y‧‧‧offset

Fig. 1A is a schematic partial cross-sectional view of a conventional flip-chip package; Fig. 1B is a schematic top-view schematic view of a conventional flip-chip package; Top view schematic; Figure 2A is a top schematic view of the cutting method omitting the packaging material of the present invention; Figure 2B is a partial top schematic view of a packaging unit to which the cutting method of the present invention is applied; and Figure 2C is a schematic view of the present invention The schematic diagram of the virtual position table corresponding to the predetermined position of the packaging unit configured by the calculator applied by the cutting method; FIG. 2C ′ is the current position corresponding to the packaging unit captured by the image capture unit applied by the cutting method of the present invention FIG. 3 is a schematic view of a cutting path of the cutting method of the present invention; and FIG. 4 is a schematic top view of another embodiment corresponding to FIG. 2A.

The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The limited conditions are not technically significant. Any modification of the structure, change of the proportional relationship, or adjustment of the size shall still fall within the scope of this invention without affecting the effects and goals that the invention can produce. The technical content disclosed by the invention can be covered. At the same time, the terms such as “上” and “一” used in this specification are only for the convenience of description, and are not intended to limit the scope of the present invention. Substantially changing the technical content should also be regarded as the scope in which the present invention can be implemented.

FIG. 2A is a schematic top view of the cutting method of the present invention in which the packaging material is omitted. In this embodiment, the dicing method is applied to a semiconductor packaging process (such as a package singulation process).

First, a full-page package structure 2 is provided, which is provided with a plurality of packaging units 2a on a carrier structure 2c. The plurality of packaging units 2a are arranged in an array, and the packaging units 2a are connected to each other with a space 2b. . Then, a cutting operation is performed along the spacer portion 2b (that is, multiple or at least one cutting operation is performed along the lateral direction and the longitudinal direction of the entire layout packaging structure 2) to separate each of the packaging units 2a and the carrying structure 2c, and at least one The entire cutting path L of the horizontal or vertical cutting operation is not a single straight line.

In this embodiment, the supporting structure 2c is an adhesive tape, and the packaging units 2a have the same size, and as shown in FIG. 2B, the packaging unit 2a includes a supporting member 20 and at least one provided on the supporting member. An electronic component 21 on 20 and a packaging material 22 covering the electronic component 21.

The carrier 20 is, for example, a package substrate having a core layer and a circuit structure or a coreless circuit structure, which has a plurality of circuit layers, such as a fan-out redistribution circuit layer (redistribution layer, RDL for short). It should be understood that the supporting member 20 may also be other supporting units for supporting electronic components such as wafers, such as lead frames, and is not limited to the above.

The electronic component 21 is an active component, a passive component, or a combination thereof, and the active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor.

The material of the packaging material 22 is polyimide (PI), dry film, epoxy, or molding compound.

Furthermore, the spacer 2b may be an air passage, as shown in FIG. 2A; or, as shown in FIG. 2B, a packaging material is formed in the spacer 2b '.

In addition, as shown in FIGS. 2A and 2B, part of the packaging unit 2a is not provided at a predetermined position of the carrying structure 2c. For example, part of the packaging unit 2a is offset from the position originally located on the carrying structure 2c (its offset Y (At most 100 microns), so that the arrangement positions of some adjacent packaging units 2a are not aligned with each other. Specifically, before the packaging material 22 is formed, pre-baking is performed to fix the adhesive material between the carrier 20 and the carrier structure 2c (or between the carrier 20 and the electronic component 21). The bearing member 20 is displaced by the influence of the rubber material, and therefore, the layout positions of some of the packaging units 2a are not located at predetermined positions.

In addition, the cutting operation is a cutting operation, and the entire cutting path L is not a single straight line. Specifically, as shown in FIG. 2C, the calculator 3 (such as a built-in computer) of the cutting machine used in the cutting operation is configured in advance with a pair of virtual correct position tables corresponding to predetermined positions of the packaging unit 2a, and is stored in the virtual position table Set at least one identification point P (predetermined position of the packaging unit), and then make the image capture unit (or camera, not shown) of the cutting machine, such as a Charge-coupled Device (CCD), capture the package The actual current position P 'corresponding to the unit 2a, after that, the calculator 3 is instructed to determine whether the current position P' is located at a predetermined position in the virtual correct position table according to the recognition point P set by it, so if the current position P ' When it meets the predetermined position, the optimal path calculated by the calculator 3 is a single straight line; if the current position P 'does not match the predetermined position, the calculator 3 will calculate the position according to the recognition point P and the current position P'. Calculate the optimal cutting path L.

It should be understood that the calculator 3 of the cutting machine used in the cutting operation may not need to be configured with a virtual correct position table, so that the image capturing unit (not shown) of the cutting machine captures the actual current corresponding to the packaging unit 2a. After the position P ′, the calculator 3 is caused to select the recognition point P ”according to the current positions P ′ (as shown in FIG. 2C ′) to directly calculate the optimal cutting path L.

Therefore, when the number of the identification points P, P ”is set more, the cutting accuracy of the singulation process is higher, so the probability of the cutting tool touching the packaging unit 2a can be reduced, and the packaging unit 2a can be reduced. Scrap quantity, and the number of linear cutting line segments can be defined according to the operation mode of the cutting machine. For example, the optimal cutting path calculated by the calculator 3 includes a plurality of straight cutting line segments, as shown in the cutting path L in FIG. 3 ', Its overall cutting path is composed of a plurality of linear cutting line segments L1, L2, L3, L4, that is, the overall cutting path is completed in sections. In addition, each of these straight cutting line segments L1, L2, L3, L4 The cutting path must be larger than the diameter of the cutting tool, so the overall cutting path must be divided into several sections and will be determined according to the size of the tool.

It should be understood that, because the entirety of the cutting paths L, L 'is a non-single straight line, the cutting method of the present invention can also be applied to a full-page packaging structure 4 including packaging units 4a, 4a' of different sizes, as shown in the figure. The cutting path L "shown in Fig. 4.

To sum up, the cutting method of the present invention is to calculate the actual position P 'corresponding to the packaging unit 2a to obtain the identification point P "selected by the corresponding current position P' of the packaging unit 2a. The optimal cutting path L, L ', L ", and the whole of the cutting path L, L', L" is a non-single straight line, so that when the bearing member 20 is displaced, the cutting path L, L ' "L" can avoid the packaging units 2a, 4a, 4a ', so compared with the conventional technology, the cutting method of the present invention can make the cutting machine avoid the packaging units 2a, 4a, 4a' without the need. Will touch the packaging units 2a, 4a, 4a ', so that the packaging units 2a, 4a, 4a' can be prevented from being damaged, and the scrapping rate of the packaging units 2a, 4a, 4a 'can be effectively reduced.

The above embodiments are used to exemplify the principle of the present invention and its effects, but not to limit the present invention. Anyone skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.

Claims (12)

    A cutting method includes: combining a plurality of packaging units to a load-bearing structure; and performing at least one vertical and horizontal cutting operation along a space between any two of the packaging units to separate each of the packaging units, of which at least one The overall cutting path of a longitudinal or transverse cutting operation is not a single straight line.         The cutting method according to item 1 of the scope of patent application, wherein the bearing structure is an adhesive tape.         The cutting method according to item 1 of the scope of patent application, wherein the packaging unit comprises an electronic component and a packaging material covering the electronic component.         The cutting method according to item 3 of the patent application scope, wherein the packaging unit further comprises a carrier for carrying the electronic component.         The cutting method according to item 1 of the scope of patent application, wherein the spacer is an air channel.         The cutting method according to item 1 of the scope of patent application, wherein the spacer is made of a packaging material.         The cutting method according to item 1 of the scope of patent application, wherein the cutting operation is provided with a virtual position table corresponding to a predetermined position of the packaging unit, and at least one identification point is set in the virtual position table, and then the packaging unit is retrieved. The actual corresponding current position is used to calculate the cutting path according to the set identification point and the corresponding current position of the packaging unit.         The cutting method according to item 1 of the scope of patent application, wherein the overall cutting path is composed of a plurality of straight cutting line segments.         The cutting method according to item 1 of the scope of patent application, wherein the packaging unit is not provided at a predetermined position of the bearing structure.         The cutting method according to item 9 of the scope of patent application, wherein the offset of the packaging unit is at most 100 microns.         The cutting method according to item 1 of the scope of patent application, wherein the dimensions of the packaging units are the same or different.         The cutting method according to item 1 of the scope of patent application, wherein the cutting operation is to capture the actual current position corresponding to the packaging unit, and calculate the cutting path according to the identification point selected by the corresponding current position of the packaging unit. .