TW201838021A - Elastic membrane, substrate holding device, and polishing apparatus - Google Patents

Abstract

An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.

Description

   Elastic film, substrate holding device, and polishing device   

The present invention relates to a polishing device for polishing a substrate such as a wafer, a substrate holding device for holding a substrate in the polishing device, and an elastic film for a substrate holding device.

In recent years, with the increase in the density and density of semiconductor devices, the wiring of circuits has become more refined, and the total number of multilayer wirings has also increased. In order to achieve circuit miniaturization and realize multi-layer wiring, the step difference is larger due to the unevenness along the surface of the lower layer. Therefore, as the total number of wiring increases, the film coverage of the step shape (step-type) Coverage). Therefore, in order to realize multilayer wiring, it is necessary to improve the step coverage and perform a flattening process with an appropriate process. In addition, since the depth of focus becomes shallower with the miniaturization of photolithography, the surface of the semiconductor element needs to be flattened so that the unevenness step of the surface of the semiconductor element is limited to the depth of focus.

Therefore, in the manufacturing process of the semiconductor device, the planarization of the surface of the semiconductor device becomes more and more important. One of the most important techniques in this surface planarization is chemical mechanical polishing (CMP). In this chemical mechanical polishing, a polishing liquid containing polishing particles such as silicon dioxide (SiO ₂ ) is supplied to a polishing surface of a polishing pad, and at the same time, a wafer is brought into contact with the polishing surface to perform polishing.

A polishing device for performing CMP includes: a polishing table supporting a polishing pad; and a substrate holding device called an upper ring turntable or a polishing head for holding a wafer. In the case of wafer polishing using such a polishing device, the wafer is held by a substrate holding device, and the wafer is pressed toward the polishing surface of the polishing pad at a specified pressure. At this time, the wafer surface is polished by moving the polishing table and the substrate holding device relatively so that the wafer is in sliding contact with the polishing surface.

If the relative pressing force between the wafer during polishing and the polishing surface of the polishing pad is not uniform over the entire wafer, insufficient or excessive polishing will occur depending on the pressing force applied to each part of the wafer. Therefore, in order to uniformize the pressing force on the wafer, a pressure chamber formed of an elastic film is provided in the lower part of the substrate holding device. A fluid such as air is supplied to the pressure chamber, and the wafer is pressed by the fluid through the elastic film. (For example, refer to Patent Document 1).

The twenty-third figure is a sectional view showing a substrate holding device of the polishing device described in Patent Document 1, and the twenty-fourth figure is an enlarged sectional view of an edge portion of the elastic film of the twenty-third figure. As shown in FIG. 23, the conventional elastic film 110 includes: a contact portion 111 mounted on the lower surface of the head body 102 to form a circular shape in accordance with the shape of the wafer; and a side wall 110h provided upright from the contact portion 111. The lower surface of the abutting portion 111 of the elastic film 110 becomes the bottom surface of the elastic film 110, and the wafer is pressed down under the abutting portion 111, and the wafer is pressed against the polishing surface of the polishing pad.

As shown in the twenty-third and twenty-fourth figures, the abutting portion 111 is provided with a plurality of concentric circular partition walls 120a to 120g extending above the spaced apart portion, and is located at the outer periphery of the abutting portion 111 A side wall 110h extending above is formed. A pressure chamber 116a to 116g is formed between each of the partition walls 120a to 120g, and an outer peripheral end portion forms an edge pressure chamber 116g between the outermost partition wall and the side wall. Then, the pressure of each of the pressure chambers 116a to 116g is controlled by individually sending air from the head body 102 to each of the pressure chambers 116a to 116g. By controlling the pressure of each of the pressure chambers 116a to 116g, the pressing force corresponding to each bottom surface portion of each of the pressure chambers 116a to 116g can be controlled.

In the polishing device having the elastic film configured as described above, since the polishing pad has elasticity, the pressing force applied to the edge portion (peripheral portion) of the wafer during polishing is uneven, and only the edge portion of the wafer is excessively polished. The so-called "collapse". In order to prevent such a slump, the outer peripheral end portion of the elastic film pressing the wafer edge portion should be controlled in a finer range.

The twenty-fifth figure is an enlarged sectional view of an edge portion of an elastic film of another example described in Patent Document 1. In this example, compared with the example of FIG. 24, the partition wall 120f extends from a position closer to the outer peripheral end of the abutting portion 111, and the edge pressure chamber 116g can press the edge portion of the wafer in a relatively narrow range.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-193070

An object of the present invention is to provide a polishing device capable of precisely adjusting a polishing profile especially on a peripheral portion of a substrate, a substrate holding device used for such a polishing device, and an elastic film used for such a substrate holding device.

An aspect of the present invention is an elastic film used for a substrate holding device, and includes: an abutting portion that abuts against the substrate; and a ring-shaped side wall that is set upright at the outer peripheral end of the abutting portion; A partition wall that extends linearly in a cross-sectional view from the side wall toward the inside in the radial direction; and a second partition wall that extends linearly in a cross-section when viewed from the outer peripheral end portion of the abutment portion toward the inside in the radial direction. And forming an edge pressure chamber for pressing the edge of the substrate with the first partition wall, the second partition wall, and the side wall.

With this configuration, since the pressure of the edge pressure chamber is controlled, the pressing force of the abutting portion can be controlled within a narrow range of the outer peripheral end portion. In addition, since the first partition wall and the second partition wall each extend linearly from a cross-sectional view, the first partition wall and the second partition wall are not easily contacted, and thus the pressure control of the edge pressure chamber can be easily performed. In addition, even if the pressure of the edge pressure chamber is increased, the first partition wall linearly extends from the side wall, so that the side wall can be prevented from expanding outward.

In the elastic film, it is preferable that a distance between the first partition wall and the second partition wall gradually increases from a radial inner side of the abutting portion toward a radial outer side.

With this configuration, air can easily flow into the entire space in the edge pressure chamber, so that the pressing force of the contact portion can be controlled in a narrow range at the outer peripheral end portion.

In the elastic film, the substrate holding device preferably includes a head body to which the elastic film is mounted, and the first partition wall has a first engaging portion at a front end that is engaged with the head body; the second partition wall has a front end The second engaging portion is engaged with the head body; the interval between the first partition wall and the second partition wall is preferably gradually increased from the first meshing portion and the second meshing portion toward the side.

Even with this configuration, air can easily flow into the entire space of the edge pressure chamber, and the pressing force of the abutting portion can be controlled in a narrow range at the outer peripheral end portion.

In the elastic film, it is preferable that the second partition wall extends linearly from a position inside 0.5 to 1.5 mm from an inner peripheral surface of the side wall.

With this configuration, the portion from the outer peripheral end of the elastic film to the inner side by 0.5 mm to 1.5 mm (edge pressing width d) is used as the outer peripheral end portion, and the pressing force on the bottom surface can be controlled within a narrow range of the outer peripheral end portion.

In the elastic film, a distance between an outer peripheral surface of the second partition wall on the upper surface of the abutting portion and an inner peripheral surface of the side wall is preferably 1.5 to 8 mm.

With this configuration, even on a substrate on which no film is formed on the outer peripheral end portion, the polishing profile on the outer peripheral end portion of the film can be precisely controlled.

In the elastic film, a base end portion connected to the upper surface of the abutting portion of the second partition wall should be bent to form a base end connection portion, and a length of the base end connection portion should be 0.5 to 3.5 mm.

With this configuration, the distance between each other can be ensured so that the second partition wall and the adjacent partition wall do not contact each other.

In the elastic film, it is preferable that an outer peripheral surface of the side wall constituting the edge pressure chamber is flat.

With this configuration, since there is no step difference in the side wall, it is difficult to cause defective slurry to stay.

The substrate holding device of another aspect of the present invention is a substrate holding device, and includes: the above-mentioned elastic film; and a head body on which the aforementioned elastic film is mounted.

Even with this configuration, by controlling the pressure in the pressure chamber, it is possible to control the pressing force of the abutting portion in the narrow range of the outer peripheral end portion. In addition, since the first partition wall and the second partition wall respectively extend linearly, the first partition wall and the second partition wall are not easily contacted, so that the pressure control of the pressure chamber can be easily performed. Even if the pressure of the pressure chamber increases, the first partition wall linearly extends from the side wall, so that the side wall can be prevented from expanding outward.

The polishing device according to another aspect of the present invention is a polishing substrate, and includes: a polishing table supporting a polishing pad having a polishing surface; and the substrate holding device; the substrate is held by the substrate holding device, and the substrate is directed toward the substrate The polishing surface is pressed at a predetermined pressure, and the substrate is moved by sliding the polishing table and the substrate holding device relative to each other, thereby sliding the substrate and the polishing surface to polish the surface of the substrate.

Even with this configuration, by controlling the pressure in the pressure chamber, it is possible to control the pressing force of the abutting portion in the narrow range of the outer peripheral end portion. In addition, since the first partition wall and the second partition wall respectively extend linearly, the first partition wall and the second partition wall are not easily contacted, so that the pressure control of the pressure chamber can be easily performed. Even if the pressure of the pressure chamber increases, the first partition wall linearly extends from the side wall, so that the side wall can be prevented from expanding outward.

When the present invention is adopted, the pressing force of the contact portion can be controlled in a narrow range of the outer peripheral end portion by controlling the pressure of the pressure chamber. In addition, since the first partition wall and the second partition wall respectively extend linearly, the first partition wall and the second partition wall are not easily contacted, so that the pressure control of the pressure chamber can be easily performed. Even if the pressure of the pressure chamber increases, the first partition wall linearly extends from the side wall, so that the side wall can be prevented from expanding outward.

1‧‧‧ grinding head

2‧‧‧ head body

3‧‧‧ buckle

3a‧‧‧ ring member

3b‧‧‧Drive ring

10‧‧‧ Elastic film

10a‧‧‧ substrate holding surface

11‧‧‧ abutment department

14a ~ 14f‧‧‧ partition wall

15‧‧‧ sidewall

16a ~ 16g‧‧‧Pressure chamber

17‧‧‧through hole

18‧‧‧ grinding table

18a‧‧‧shaft

19‧‧‧ Abrasive Pad

19a‧‧‧ polished surface

22‧‧‧ vertical section

23, 23a ~ 23g ‧‧‧ connecting ring

24‧‧‧ Bend

25‧‧‧Grinding liquid supply nozzle

27‧‧‧head shaft

28‧‧‧Horizontal Division

29‧‧‧motors

30‧‧‧ protrusion

31‧‧‧step difference

32‧‧‧ Magnet

33‧‧‧ protrusion

34‧‧‧step difference

35‧‧‧ protrusion

36‧‧‧Inner engagement groove

37‧‧‧Outer meshing groove

38‧‧‧step difference

40‧‧‧control device

41‧‧‧ flange

42‧‧‧ spacer

43‧‧‧ carrier

43a‧‧‧ trench

43b‧‧‧Concave

43c‧‧‧above

43d‧‧‧below

44‧‧‧Sealing member

45‧‧‧ the first recess

46‧‧‧Second recess

47‧‧‧ the third recess

48‧‧‧ Fourth recess

49‧‧‧ fifth recess

50‧‧‧ ring vertical

51‧‧‧Ring slope

51a‧‧‧Inner peripheral surface

51b‧‧‧outer surface

51c‧‧‧Front

51d‧‧‧through hole

51e‧‧‧Sealed trench

53‧‧‧inclined

53a‧‧‧Sealed trench

54‧‧‧Sealed protrusion

55‧‧‧partition body

56‧‧‧Screw hole

60‧‧‧Buckle pressing mechanism

61‧‧‧Piston

62‧‧‧ rotating partition

63‧‧‧Henggou

64‧‧‧ longitudinal trench

65‧‧‧Pressure adjustment device

66‧‧‧ rotating tube

671‧‧‧Timing pulley

672‧‧‧Timing pulley

68‧‧‧head motor

69‧‧‧Timing belt

70‧‧‧ Fixture

71‧‧‧Fixture body

71a‧‧‧above

71b‧‧‧ trench

72‧‧‧ 锷

72a, 72b‧‧‧ inclined surface

73‧‧‧ fluid line

73a, 73b, 73c‧‧‧through holes

74‧‧‧sealing member

75‧‧‧ connecting member

76‧‧‧ Shaft

77‧‧‧ elbow sleeve

78‧‧‧ spokes

79‧‧‧screw

80‧‧‧ Arm shaft

81‧‧‧Up and down movement mechanism

82‧‧‧ Rotary Joint

83‧‧‧bearing

84‧‧‧Bridge

85‧‧‧ spherical bearing

86‧‧‧ Pillar

87‧‧‧Support

88‧‧‧ball screw

88a‧‧‧Screw shaft

88b‧‧‧nut

90‧‧‧Servo motor

91‧‧‧ intermediate wheel

91a‧‧‧ outside

91b‧‧‧ inside

91c‧‧‧through hole

92‧‧‧ Outer wheel

92a‧‧‧ 锷

92b‧‧‧ inside

92c‧‧‧through hole

93‧‧‧Inner wheel

93a‧‧‧ outside

93b‧‧‧through hole

94‧‧‧screw

96‧‧‧ inside opening

97‧‧‧outer opening

102‧‧‧head body

110‧‧‧Elastic film

110h‧‧‧ sidewall

111‧‧‧ abutment department

115‧‧‧ sidewall

116a ~ 116g‧‧‧Pressure chamber

120a ~ 120g‧‧‧partition wall

141e‧‧‧Base end connection

151‧‧‧box

214e, 214f‧‧‧‧partition

216e, 216f‧‧‧Pressure chamber

C1‧‧‧ Vertex

θ , θ ', θ "‧‧‧ tilt angle

O‧‧‧ Fulcrum

CP‧‧‧ Midpoint

L1, L2, d‧‧‧ distance

Q‧‧‧ polishing liquid

W‧‧‧ Wafer

The first diagram is a diagram showing a polishing apparatus according to an embodiment of the present invention.

The second figure is a view showing a polishing head (substrate holding device) provided in the polishing device shown in the first figure.

The third figure is a top view showing the buckle and the connecting ring shown in the second figure.

The fourth figure is a partially enlarged sectional view of the spherical bearing and the coupling ring shown in the second figure.

The fifth figure is a schematic cross-sectional view showing a state where the elastic film according to the embodiment of the present invention is connected to a carrier of the head body.

The sixth diagram is an enlarged sectional view showing a part of the elastic film shown in the fifth diagram.

Fig. 7A is a sectional view of a third link ring according to the embodiment of the present invention.

The seventh diagram B is a diagram viewed from the direction of the arrow A of the seventh diagram A.

The eighth figure is an enlarged sectional view showing an example in which a pressing protrusion is formed on the inner peripheral surface of the ring inclined portion of the coupling ring according to the embodiment of the present invention.

Fig. 9A is a plan view of a fixture according to an embodiment of the present invention.

The ninth diagram B is a sectional view taken along line B-B of the ninth diagram A.

The tenth figure is a schematic view showing a process of connecting the elastic film shown in the sixth figure to the head body.

The eleventh figure is a schematic view showing a process of connecting the elastic film shown in the sixth figure to the head body.

The twelfth figure is a schematic view showing a process of connecting the elastic film shown in the sixth figure to the head body.

The thirteenth figure is a schematic view showing a process of connecting the elastic film shown in the sixth figure to the head body.

The fourteenth figure is a schematic diagram showing an example of the arrangement of the fixtures according to the embodiment of the present invention.

Fig. 15A is a schematic diagram for explaining the advantages of the elastic film according to the embodiment of the present invention.

Figure 15B is a schematic diagram showing a past elastic film.

The fifteenth figure C is a schematic diagram for explaining the problems of the elastic film in the past.

Figure 16A is a schematic diagram for explaining the advantages of the elastic film according to the embodiment of the present invention.

Figure 16B is a schematic diagram showing a past elastic film.

The sixteenth figure C is a schematic diagram for explaining the problems of the elastic film in the past.

Figure 17A is a schematic diagram for explaining the advantages of the elastic film according to the embodiment of the present invention.

Figure 17B is a schematic diagram showing a past elastic film.

The seventeenth figure C is a schematic diagram for explaining the problems of the elastic film in the past.

Figure 18A is a schematic diagram for explaining the advantages of the elastic film according to the embodiment of the present invention.

Figure 18B is a schematic diagram showing a past elastic film.

The eighteenth figure C is a schematic diagram for explaining the problems of the elastic film in the past.

Figure 19A is a schematic diagram for explaining the advantages of the elastic film according to the embodiment of the present invention.

Fig. 19B is a schematic diagram for explaining a problem with a conventional elastic film.

Figure 20A is a schematic diagram for explaining the advantages of the elastic film according to the embodiment of the present invention.

FIG. 20B is a schematic diagram for explaining a problem with a conventional elastic film.

FIG. 21A is an enlarged sectional view showing a part of an elastic film according to a first modified example of the embodiment of the present invention.

FIG. 21B is an enlarged sectional view showing a part of an elastic film according to a second modified example of the embodiment of the present invention.

FIG. 22 is an enlarged cross-sectional view showing a part of an elastic film according to a third modified example of the embodiment of the present invention.

The twenty-third figure is a sectional view showing a substrate holding device of a conventional polishing device.

The twenty-fourth figure is an enlarged sectional view showing a part of the past elastic film.

The twenty-fifth figure is an enlarged sectional view showing a part of an elastic film of another conventional example.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the embodiment described below shows an example when implementing this invention, and does not limit this invention to the specific structure demonstrated below. When the present invention is implemented, an appropriate specific structure is adopted according to the embodiment.

The first figure is a view showing a polishing apparatus according to an embodiment. As shown in the first figure, the polishing apparatus includes a polishing table 18 that supports a polishing pad 19, and a wafer W that holds an example of a substrate to be polished, and holds the substrate of the polishing pad 19 that is pressed on the polishing table 18.装置 1。 Device 1. In the following description, the substrate holding device 1 is referred to as a polishing head 1.

The polishing table 18 is connected to a table motor 29 disposed below it via a table shaft 18a, and is rotatable around the table shaft 18a. The polishing pad 19 is bonded to the upper surface of the polishing table 18, and the surface 19a of the polishing pad 19 constitutes a polishing surface of the polishing wafer W. A polishing liquid supply nozzle 25 is provided above the polishing table 18, and the polishing liquid Q can be supplied to the polishing pad 19 on the polishing table 18 through the polishing liquid supply nozzle 25.

The polishing head 1 includes a head body 2 that presses the wafer W against the polishing surface 19 a, and a retaining ring 3 that holds the wafer W so that the wafer W does not slide out of the polishing head 1. The polishing head 1 is connected to a head shaft 27, and the head shaft 27 moves up and down with respect to the head support arm 64 by an up-and-down movement mechanism 81. With the head shaft 27 moving up and down, the entire grinding head 1 is positioned up and down against the head arm 64. A rotary joint 82 is mounted on the upper end of the head shaft 27.

The up and down movement mechanism 81 for moving the head shaft 27 and the grinding head 1 up and down includes: a bridge 84 that rotatably supports the head shaft 27 via a bearing 83; a ball screw 88 mounted on the bridge 84; A support table 87; and a servo motor 90 provided on the support table 87. A support table 87 that supports the servo motor 90 is fixed to the head arm 64 via a pillar 86.

The ball screw 88 includes a screw shaft 88a connected to the servo motor 90, and a nut 88b to which the screw shaft 88a is screwed. The head shaft 27 can move up and down integrally with the bridge 84. Therefore, when the servo motor 90 is driven, the bridge 84 moves up and down via the ball screw 88, whereby the head shaft 27 and the polishing head 1 move up and down.

The head shaft 27 is connected to the rotary cylinder 66 via a key (not shown). The rotating cylinder 66 includes a timing pulley 671 on an outer peripheral portion thereof. A head motor 68 is fixed to the head arm 64, and the timing pulley 671 is connected to a timing pulley 672 provided on the head motor 68 via a timing belt 69. Therefore, by rotationally driving the head motor 68, the rotating cylinder 66 and the head shaft 27 are integrally rotated via the timing pulley 672, the timing belt 69, and the timing pulley 671, and the polishing head 1 rotates. The head arm 64 is supported by an arm shaft 80 rotatably supported by a frame (not shown). The polishing apparatus includes a control device 40 that controls each device in the apparatus such as the head motor 68 and the servo motor 90.

The polishing head 1 is configured to hold the wafer W under the polishing head 1. The head arm 64 is configured to be rotatable around the arm shaft 80. The polishing head 1 holding the wafer W below is moved between the receiving position of the wafer W and the upper position of the polishing table 18 by the rotation of the head arm 64.

The polishing of the wafer W is performed as follows. The polishing head 1 and the polishing table 18 are respectively rotated, and the polishing liquid Q is supplied onto the polishing pad 19 from a polishing liquid supply nozzle 25 provided above the polishing table 18. In this state, the polishing head 1 is lowered to a predetermined position (designated height), and the wafer W is pressed against the polishing surface 19 a of the polishing pad 19 at the specified position. The wafer W is in sliding contact with the polishing surface 19a of the polishing pad 19, thereby polishing the surface of the wafer W.

Next, the polishing head 1 will be described. The second figure is a schematic cross-sectional view of the polishing head (substrate holding device) 1. As shown in the second figure, the polishing head 1 includes a head body 2 that presses the wafer W against the polishing surface 19 a, and a buckle 3 that is disposed so as to surround the wafer W. The head body 2 and the buckle 3 are integrally rotated by the rotation of the head shaft 27. The buckle 3 is configured to be movable up and down independently of the head body 2.

The head body 2 includes a circular flange 41, a spacer 42 mounted below the flange 41, and a carrier 43 mounted below the spacer 42. The flange 41 is connected to the head shaft 27. The carrier 43 is connected to the flange 41 via the spacer 42, and the flange 41, the spacer 42, and the carrier 43 rotate integrally and move up and down integrally. The head body 2 having the flange 41, the spacer 42, and the carrier 43 is formed of a resin such as an engineering plastic (for example, polyetheretherketone (PEEK)). The flange 41 may be formed of a metal such as SUS or aluminum.

An elastic film 10 abutting on the back surface of the wafer W is connected to the lower surface of the head body 2. A method of connecting the elastic film 10 to the head body 2 will be described later. The lower surface of the circular contact portion 11 of the elastic film 10 is in contact with the contact surface of the wafer W, and constitutes a substrate holding surface 10a. The side wall 15 is provided upright from the outer peripheral end of the abutting portion 11. The elastic film 10 has a plurality of (six in the second picture series) annular partition walls 14a, 14b, 14c, 14d, 14e, and 14f. These partition walls 14a to 14f are arranged concentrically. The partition walls 14 a to 14 e extend upward from the upper surface of the abutting portion 11, and the partition wall 14 f extends from the side wall 15 inward in the radial direction. By these partition walls 14a to 14f, seven pressure chambers are formed between the elastic membrane 10 and the head body 2, that is, a central pressure chamber 16a having a circular shape in the center, and a peripheral edge pressure chamber 16f having an annular shape on the outermost periphery. And 16g, and intermediate pressure chambers 16b, 16c, 16d, and 16e located between the central pressure chamber 16a and the edge pressure chamber 16f. The edge pressure chamber 16g is formed above the edge pressure chamber 16f.

These pressure chambers 16a to 16g are connected to the pressure adjustment device 65 via a rotary joint 82, and a fluid (such as a gas, more specifically, air or nitrogen) can be supplied from the pressure adjustment device 65 to each of the extended fluid lines 73 to each Pressure chamber 16a ~ 16g. The pressure adjusting device 65 is connected to the control device 40 and can independently adjust the pressure in these 7 pressure chambers 16a-16g. In addition, the pressure adjustment device 65 may form a negative pressure in the pressure chambers 16a to 16g. In this way, in the polishing head 1, by adjusting the fluid pressure supplied to each of the pressure chambers 16a to 16g formed between the head body 2 and the elastic film 10, each wafer W area can be adjusted to be applied to the wafer W. Press the pressure.

The elastic film 10 is formed of a rubber material having excellent strength and durability such as ethylene-propylene rubber (EPDM), urethane rubber, and silicone rubber. Each of the pressure chambers 16a to 16g is also connected to an atmosphere opening mechanism (not shown), and the pressure chambers 16a to 16g can also be opened to the atmosphere.

The upper part of the buckle 3 is connected to a ring-shaped buckle pressing mechanism 60, which applies a uniform downward load to the entire upper surface of the buckle 3 (more specifically, the upper surface of the driving ring 3b). The polishing surface 19a of the pair of polishing pads 19 presses the lower surface of the buckle 3 (that is, the lower surface of the ring member 3a).

The buckle pressing mechanism 60 includes a ring-shaped piston 61 fixed to the upper portion of the drive ring 3 b, and a ring-shaped rotating partition plate 62 connected to the upper surface of the piston 61. A retaining ring pressure chamber 63 is formed inside the rotating partition plate 62. The ring pressure chamber 63 is connected to a pressure adjustment device 65 via a rotary joint 82. When a fluid (for example, air) is supplied from the pressure adjustment device 65 to the ring pressure chamber 63, the rotary diaphragm 62 presses the piston 61 downward, and the piston 61 presses the entire ring 3 downward.

In this manner, the buckle pressing mechanism 60 presses the lower surface of the buckle 3 against the polishing surface 19 a of the polishing pad 19. Further, a negative pressure is formed in the retaining ring pressure chamber 63 by the pressure adjusting device 65, so that the entire retaining ring 3 can be raised. The buckle pressure chamber 63 is also connected to an atmosphere opening mechanism (not shown), and the buckle pressure chamber 63 can also be opened to the atmosphere.

The buckle 3 is detachably connected to the buckle pressing mechanism 60. More specifically, the piston 61 is formed of a magnetic material such as metal, and a plurality of magnets 32 are arranged on the upper portion of the drive ring 3b. The magnet 61 attracts the piston 61 by these magnets 32, and the retaining ring 3 is fixed by the magnetic force of the piston 61. As the magnetic material of the piston 61, for example, corrosion-resistant magnetic stainless steel is used. The driving ring 3 b may be formed of a magnetic material, and a magnet may be disposed on the piston 61.

The buckle 3 is connected to a spherical bearing 85 via a connection member 75. The spherical bearing 85 is arranged on the inner side in the radial direction of the retaining ring 3. The third figure is a plan view showing the buckle 3 and the connecting member 75. As shown in the third figure, the connecting member 75 includes: a shaft portion 76 disposed at the center portion of the head body 2; an elbow sleeve 77 fixed to the shaft portion 76; An example of the formula is 6) spokes 78.

One end of the spoke 78 is fixed to the elbow sleeve 77, and the other end of the spoke 78 is fixed to the driving ring 3 b of the buckle 3. The armband 77 and the spoke 78 are integrally formed with the driving ring 3b. A plurality of pairs of drive pins 80 and 80 are fixed to the carrier 43. The driving pins 80 and 80 of each pair are arranged on both sides of each spoke 78, and the rotation of the carrier 43 is transmitted to the buckle 3 via the driving pins 80 and 80, whereby the head body 2 and the buckle 3 rotate integrally.

As shown in the second figure, the shaft portion 76 extends in the longitudinal direction inside the spherical bearing 85. As shown in the third figure, the carrier 43 is formed with a plurality of radial grooves 43a for accommodating the spokes 78, and each of the spokes 78 can move freely in the longitudinal direction within each of the grooves 43a. The shaft portion 76 of the connecting member 75 is movably supported in the longitudinal direction by a spherical bearing 85 arranged at the center portion of the head body 2. With this configuration, the connecting member 75 and the buckle 3 fixed thereto can move the head body 2 in the longitudinal direction. The buckle 3 is supported by a spherical bearing 85 so as to be tiltable.

Hereinafter, the spherical bearing 85 will be described in more detail. The fourth figure is an enlarged sectional view of a part of the spherical bearing 85 and the connecting member 75. As shown in the fourth figure, the shaft portion 76 is fixed to the armband 77 by a plurality of screws 79. A through hole 88 extending in the longitudinal direction is formed in the shaft portion 76. The through hole 88 functions as an exhaust hole when the shaft portion 76 moves in the longitudinal direction of the spherical bearing 85, and thereby the buckle 3 can smoothly move the head body 2 in the longitudinal direction.

The spherical bearing 85 includes an intermediate wheel 91 which is connected to the buckle 3 via a connection member 75, an intermediate wheel 91 which is slidably supported from above, an outer wheel 92, and an inner wheel 93 which is slidably supported from the bottom. The intermediate wheel 91 has a spherical shell shape that is smaller than the upper half of the spherical shell, and is sandwiched between the outer wheel 92 and the inner wheel 93.

A recessed portion 43b is formed in a center portion of the carrier 43, and the outer ring 92 is disposed in the recessed portion 43b. The outer wheel 92 has a 锷 92a on its outer peripheral portion. The 锷 92a is bolted (not shown) to the stepped portion of the recess 43b. The outer wheel 92 is fixed to the carrier 43, and the intermediate wheel 91 and the inner wheel 93 can be pressed . The inner wheel 93 is disposed on the bottom surface of the recessed portion 43b, and supports the middle wheel 91 from below so that a gap is formed between the lower surface of the intermediate wheel 91 and the bottom surface of the recessed portion 43b.

The inner surface 92b of the outer wheel 92, the outer surface 91a and the inner surface 91b of the intermediate wheel 91, and the outer surface 93a of the inner wheel 93 are composed of rough hemispherical surfaces with the fulcrum O as the center. The outer surface 91a of the intermediate wheel 91 is in sliding contact with the inner surface 92b of the outer wheel 92, and the inner surface 91b of the intermediate wheel 91 is in sliding contact with the outer surface 93a of the inner wheel 93. The inner surface 92b (sliding contact surface) of the outer wheel 92, the outer surfaces 91a and 91b (sliding contact surface) of the intermediate wheel 91, and the outer surface 93a (sliding contact surface) of the inner wheel 93 have smaller portions than the upper half of the spherical surface. Spherical shape. With this configuration, the intermediate wheel 91 can be tilted in all directions (360 °) of the outer wheel 92 and the inner wheel 93, and the fulcrum O at the center of the tilting movement is located below the spherical bearing 85.

The outer wheel 92, the intermediate wheel 91, and the inner wheel 93 are formed with through-holes 92c, 91c, and 93b for inserting the shaft portion 76, respectively. A gap is formed between the through hole 92c of the outer ring 92 and the shaft portion 76. Similarly, a gap is formed between the through hole 93b of the inner ring 93 and the shaft portion 76. The diameter of the through-hole 91c of the intermediate wheel 91 is smaller than that of the through-holes 92c and 93b of the outer wheel 92 and the inner wheel 93. The shaft portion 76 can move the intermediate wheel 91 only in the longitudinal direction. Therefore, the buckle 3 connected to the shaft portion 76 is substantially not allowed to move in the horizontal direction, and the position of the buckle 3 in the horizontal direction (horizontal direction) is fixed by the spherical bearing 85.

The spherical bearing 85 allows the buckle 3 to move up and down and tilt, and restricts the movement of the buckle 3 in the horizontal direction (horizontal movement). During wafer W polishing, the buckle 3 receives from the wafer W a force in the lateral direction (a force toward the outside in the radial direction of the wafer W) due to the friction between the wafer W and the polishing pad 19. This lateral force is received by the spherical bearing 85. In this way, during the wafer W polishing, the spherical bearing 85 exhibits the lateral force (the force toward the outer side in the radial direction of the wafer W) received by the buckle 3 from the wafer W due to the friction between the wafer W and the polishing pad 19, and The function of the support mechanism that restricts the movement of the buckle 3 in the horizontal direction (that is, fixes the position of the buckle 3 in the horizontal direction).

The fifth figure is a schematic cross-sectional view showing a state where the elastic film 10 is connected to the head body 2, and the sixth figure is an enlarged cross-sectional view showing a part of the elastic film 10 shown in the fifth figure. The elastic film 10 includes: a circular abutment portion 11 as an abutment surface of the wafer W; a ring-shaped side wall 15 vertically standing on an outer peripheral end of the abutment portion 11; and connected to the abutment portion 11 A plurality of partition walls 14a, 14b, 14c, 14d, and 14e above; and a partition wall 14f connected to the inner surface of the side wall 15 are provided. The partition walls 14a to 14f are annular partition walls arranged concentrically.

As described above, the seven pressure chambers (that is, the central pressure chamber 16a, the intermediate pressure chambers 16a to 16e, and the edge pressure chambers 16f and 16g) are formed by the six partition walls 14a to 14f. The abutting portion 11 is in contact with the back surface of the wafer W, that is, in contact with the surface opposite to the surface to be polished, and presses the wafer W against the polishing pad 19.

The edge pressure chamber 16g and the edge pressure chamber 16f are separated by a partition wall 14f extending approximately horizontally. Since the partition wall 14f is connected to the side wall 15, the differential pressure between the edge pressure chamber 16g and the edge pressure chamber 16f generates a downward force that presses the side wall 15 in the vertical direction. In other words, when the pressure in the edge pressure chamber 16g is greater than the pressure in the edge pressure chamber 16f, a downward force is generated on the side wall 15 by the differential pressure between the edge pressure chambers 16g and 16f, and the side wall 15 will abut the peripheral edge of the portion 11. The part is pressed vertically on the back surface of the wafer W. As a result, the peripheral edge portion of the contact portion 11 presses the wafer edge portion against the polishing pad 19. In this way, since the downward force of the side wall 15 itself acts on the vertical direction, the peripheral edge portion of the abutting portion 11 can press the polishing pad 19 against the narrow region of the edge portion of the wafer W. Therefore, the contour of the edge portion of the wafer W can be precisely controlled.

In the following description, when it is not necessary to distinguish between the partition walls 14 a to 14 f and when the partition walls 14 a to 14 f are collectively referred to as the partition wall 14. In addition, the pressure chambers 16a to 16g are also referred to as the pressure chamber 16 when it is not necessary to distinguish between these times and collectively refer to these times.

Among the partition walls 14 a to 14 e extending from the upper surface of the abutting portion 11, the partition wall 14 e is connected to the outer peripheral end portion of the abutting portion 11, the partition wall 14 d is disposed radially inward of the partition wall 14 e, and the partition wall 14 c is disposed at a score The partition wall 14d is located radially inward, the partition wall 14b is located radially inward of the partition wall 14c, and the partition wall 14a is located radially inward of the partition wall 14b. The following description refers to the partition wall 14f as the first partition wall 14f, the partition wall 14e as the second partition wall 14e, the partition wall 14d as the third partition wall 14d, and the partition wall 14c as the fourth partition wall. 14c, the partition wall 14b is referred to as a fifth partition wall 14b, and the partition wall 14a is referred to as a sixth partition wall 14a. The partition walls 14 a to 14 e extending from the upper surface of the abutting portion 11 extend upward from the upper surface of the abutting portion 11.

The abutting portion 11 is formed at a predetermined pitch in the circumferential direction with a plurality of through holes 17 communicating with the pressure chamber 16c formed between the fifth partition wall 14b and the fourth partition wall 14c. The fifth and sixth figures show only one through hole 17. In a state where the wafer W is in contact with the abutting portion 11, when the intermediate pressure chamber 16 c in which the plurality of through holes 17 are formed is decompressed, the wafer W is held below the abutting portion 11. That is, the wafer W is held on the polishing head 1 by vacuum suction. When the wafer W is separated from the polishing pad 19 and the fluid is supplied into the intermediate pressure chamber 16 c in which the plurality of through holes 17 are formed, the wafer W is released from the polishing head 1. The through hole 17 may be formed in another pressure chamber instead of the intermediate pressure chamber 16c. At this time, the vacuum suction and release of the wafer W is performed by controlling the pressure of the pressure chamber in which the through hole 17 is formed.

In the present embodiment, the partition walls 14a to 14e extending from the upper surface of the abutment portion 11 constitute inclined partition walls inclined to the inner side in the radial direction, and all have a linear shape (linear shape). Hereinafter, the configuration of the partition wall 14e located at the outermost side will be described as a representative of the partition walls 14a to 14e of the inclined partition wall.

The second partition wall 14e of the inclined partition wall extends linearly when viewed from the upper cross section of the outer peripheral end portion of the abutment portion 11 toward the inner side in the radial direction. The second partition wall 14e includes a partition wall body 55 extending linearly from the upper surface of the abutment portion 11 inward and upward in the radial direction, and a ring-shaped sealing protrusion 54 formed at the front end of the partition wall body 55. The sealing protrusion 54 of this embodiment has a circular cross-sectional shape, and the partition wall body 55 extends in a tangential direction of the sealing protrusion 54.

The second partition wall 14e is inclined from the lower end portion (base end portion) to the upper end portion at a predetermined angle θ inside the radial direction and extends upward. The lower end portion of the second partition wall 14e is connected to the abutting portion 11, and the upper end portion of the second partition wall 14e (that is, the sealing protrusion 54) is connected to a connecting ring 23d of the head body 2 described later.

The inclination angle θ of the partition wall 14e to the bottom surface should be set in a range of 20 ° to 70 °. When the inclination angle θ is smaller than 20 °, if the pressure difference of the fluid supplied to the adjacent pressure chambers 16 is large, the adjacent partition walls 14 may come into contact. When the inclination angle θ is larger than 70 °, the elastic film 10 may be prevented from expanding and contracting in the vertical direction (that is, the deformation of the elastic film 10) by the partition wall 14. At this time, since the elastic film 10 cannot properly expand and contract according to the fluid pressure supplied to the pressure chamber 16, it may be difficult to adjust the pressing force applied to the wafer W in each wafer W region.

As shown in the sixth figure, since the partition walls 14a to 14e constituting the inclined partition wall have the same shape as each other, the partition walls 14a to 14e extend parallel to each other. More specifically, the partition wall bodies 55 of the partition walls 14a to 14e are parallel to each other. As shown in the fifth figure, a pressure chamber 16b is formed between the sixth partition wall 14a and the fifth partition wall 14b, and a pressure chamber 16c is formed between the fifth partition wall 14b and the fourth partition wall 14c. A pressure chamber 16d is formed between 14c and the third partition wall 14d, a pressure chamber 16e is formed between the third partition wall 14d and the second partition wall 14e, and an edge pressure is formed between the second partition wall 14e and the first partition wall 14f Room 16f.

Furthermore, in the elastic film 10 shown in the fifth and sixth figures, the partition walls 14a to 14e constituting the inclined partition wall extend parallel to each other. That is, the inclination angles θ of the partition wall bodies 55 of the partition walls 14a to 14e are the same. At this time, since the adjacent partition walls 14 can be arranged at extremely narrow intervals, the width in the radial direction of the pressure chamber 16 is extremely narrow.

When the partition walls 14a to 14e constituting the inclined partition wall are not in contact with each other, the partition walls 14a to 14e may extend substantially parallel to each other. More specifically, the inclination angle θ of the partition wall body 55 of the partition walls 14a to 14e constituting the inclined partition wall may be different from each other to some extent. In the present specification, the expression "roughly parallel" refers to the inclination angle of one of the partition walls 14 constituting the inclined partition wall 14 (explained expediently, this inclination angle is referred to as the reference inclination angle θs) as a reference. In this case, it means that the inclination angle θ of the other partition wall 14 constituting the inclined partition wall is within a range of ± 10 ° from the reference inclination angle θs (that is, θs-10 ≦ θ ≦ θs + 10). For example, when the inclination angle of the partition wall 14a is 45 ° and the inclination angle of the partition wall 14a is used as the reference inclination angle θs, the reference inclination angle θs of the partition walls 14b to 14e is equal to the reference inclination angle θs' of the partition wall 14a (= 45 °) in the range of ± 10 ° (that is, in the range of 35 ° ~ 55 °).

The side wall 15 of this embodiment is formed by: a vertical portion 22 extending vertically from the outer peripheral end of the abutting portion 11; a horizontal portion 28 formed on the upper end; and a horizontal portion 28 formed on the upper end of the vertical portion 22 and the outer end portion of the horizontal portion 28 The curved portion 24 is formed to be convexly curved inward in the radial direction. In addition, a sealing protrusion 54 is formed at the front end (inner end) of the horizontal portion 28 similarly to the partition walls 14a to 14f.

The first partition wall 14f extends horizontally from the upper end portion of the vertical portion 22 of the side wall 15 toward the inside in the radial direction. The partition wall 14f also has a linear shape as a whole as the partition walls 14a to 14e, and is composed of a partition wall body 55 extending linearly; and a ring-shaped sealing protrusion 54 formed at the front end of the partition wall body 55. However, the partition wall body 55 of the partition wall 14f extends horizontally from the inner surface of the side wall 15 toward the inside in the radial direction.

The edge pressure chamber 16f composed of the first partition wall 14f, the vertical portion 22 of the side wall 15, and the second partition wall 14e will be further described below. The first partition wall 14f and the second partition wall 14e have a linear shape (straight shape) when viewed in cross section. Except for the end portion of the partition wall body 55, there are no meandering portions or curved portions. In addition, the vertical portion 22 of the side wall 15 also has a linear shape (straight shape) when viewed in cross section, and there are no meandering portions or curved portions in the vertical portion 22. Therefore, the extension line of the first partition wall 14f, the vertical portion 22 of the side wall 15, and the extension line of the second partition wall 14e constitute a triangle T when viewed in cross section. A position of one vertex C1 of the triangle T in the radial direction is an outer peripheral end of the abutting portion 11 of the elastic film 10.

In the edge pressure chamber 16f, the interval between the first partition wall 14f and the second partition wall 14e gradually increases from the inside in the radial direction of the contact portion 11 to the outside. In addition, the vertical portion 22 of the side wall 15, that is, at least a portion constituting the edge pressure chamber 16 f, has an outer peripheral surface that is flat and has no step.

Among the partition walls 14 a to 14 e formed on the upper surface of the contact portion 11, the second partition wall 14 e of the outermost partition wall is connected to the outer peripheral end portion of the contact portion 11. In the present specification, the term “outer peripheral end portion” means a range including the outer peripheral end of the abutting portion 11 and a number of inner portions from here. Specifically, as viewed in the cross section of the sixth figure, the distance between the point where the upper surface of the second partition wall 14e intersects the upper surface of the abutting portion 11 and the point where the inner surface of the side wall 15 intersects the upper surface of the abutting portion 11 (edge press When the width d is 0 to 8 mm, the second partition wall 14e is connected to the outer peripheral end portion of the abutting portion 11 or extends from the outer peripheral end portion of the abutting portion 11. In addition, the edge pressing width d of this embodiment is set to 0.5 to 1.5 mm.

In addition, the elastic film 10 may not automatically maintain the shapes shown in the fifth and sixth figures due to its elasticity. However, in this specification, when describing the shape of the elastic film 10, it means that it is mounted on the head body 2 for polishing. The shape at the time.

The partition walls 14a to 14f, the side walls 15, and the elastic film 10 having the contact portion 11 can be integrally molded using a metal type or the like.

As described above, fluid is supplied to each of the pressure chambers 16 a to 16 f from the pressure adjustment device 65 through the fluid line 73 (see the first and second figures) extending through the rotary joint 82. The fifth figure shows only a part of the fluid line 73 for supplying fluid from the pressure adjustment device 65 to the pressure chamber 16d.

A part of the fluid line 73 shown in the fifth figure is formed by: a through hole 73a formed in the spacer 42; a through hole 73b formed in the carrier 43 and communicating with the through hole 73a; and a connecting ring 23 formed later, and A through-hole 73c communicating with the through-hole 73b is configured. These through holes 73a, 73b, 73c have the same diameter. An annular recessed portion is formed in the upper end of the through-hole 73c formed in the coupling ring 23, and a sealing member (for example, an O-ring) 74 that seals the gap between the coupling ring 23 and the carrier 43 is disposed in the recessed portion. The sealing member 74 prevents the fluid flowing through the through holes 73 b and 73 c from leaking from the gap between the connection ring 23 and the carrier 43.

Similarly, a ring-shaped recessed portion is formed at the upper end of the through hole 73 b formed in the carrier 43, and a sealing member (for example, an O-ring) 44 that seals the gap between the carrier 43 and the spacer 42 is disposed in the recessed portion. The seal member 44 prevents the fluid flowing through the through holes 73 a and 73 b from leaking from the gap between the spacer 42 and the carrier 43.

The head body 2 further includes a plurality of connecting rings 23 a to 23 f that connect the partition walls 14 a to 14 f and the side wall 15. The connecting ring 23a is disposed between the sixth partition wall 14a and the fifth partition wall 14b, and will be referred to as a sixth connecting ring 23a in the following description. The connecting ring 23b is disposed between the fifth partition wall 14b and the fourth partition wall 14c, and will be referred to as a fifth connecting ring 23b in the following description. The connecting ring 23c is disposed between the fourth partition wall 14c and the third partition wall 14d, and will be referred to as a fourth connecting ring 23c in the following description. The connecting ring 23d is disposed between the third partition wall 14d and the second partition wall 14e, and will be referred to as a third connecting ring 23d in the following description.

The connecting ring 23e is disposed between the second partition wall 14e and the first partition wall 14f, and will be referred to as a second connecting ring 23e in the following description. The connecting ring 23f is disposed between the first partition wall 14f and the curved portion 24 and the horizontal portion 28 of the side wall 15, and will be referred to as a first connecting ring 23f in the following description. In this way, each of the connecting rings 23 a to 23 e is arranged between the adjacent partition walls 14.

In this embodiment, since the sixth partition wall 14a also constitutes an inclined partition wall, the head body 2 has a connecting ring 23g that connects the partition wall 14a. In the following description, the connecting ring 23g is referred to as an additional connecting ring 23g.

The structures of the sixth link ring 23a, the fifth link ring 23b, the fourth link ring 23c, the third link ring 23d, the second link ring 23e, and the first link ring 23f are the same. Hereinafter, the structure of the fourth connection ring 23c will be described in detail as a representative example.

The seventh diagram A is a cross-sectional view of the fourth connecting ring 23c, and the seventh diagram B is a view viewed in the direction of the arrow of the line A in the seventh diagram A. The seventh A drawing depicts the above-mentioned sealing member 74 with a dotted line (dotted line). The fourth connecting ring 23 c includes a ring vertical portion 50 extending perpendicularly to the carrier 43 of the head body 2, and a ring inclined portion 51 extending from the ring vertical portion 50 to the outside in the radial direction and inclined downward from the ring vertical portion 50. The inclination angle θ 'of the inner peripheral surface 51a of the ring inclined portion 51 to the horizontal plane P parallel to the abutting portion 11 of the elastic film 10 is greater than the inclination angle θ of the fourth partition wall 14c constituting the inclined partition wall (see the sixth figure) The inclination angle θ "of the outer peripheral surface 51b of the ring inclined portion 51 with respect to the horizontal plane P is smaller than the inclination angle θ of the second partition wall 14e constituting the inclined partition wall.

The outer peripheral surface 51 b of the ring inclined portion 51 and the inner peripheral surface 51 a of the ring inclined portion 51 are connected to the front end 51 c of the ring inclined portion 51. Therefore, the ring inclined portion 51 has a cross-sectional shape that tapers toward the front end 51 c of the ring inclined portion 51. The front end 51c of the ring inclined portion 51 connecting the inner peripheral surface 51a and the outer peripheral surface 51b has a cross-sectional shape (for example, a semicircular cross-sectional shape). The fourth connecting ring 23c includes a through hole 51d extending from the inner peripheral surface 51a of the ring inclined portion 51 of the fourth connecting ring 23c to the outer peripheral surface 51b. Further, an annular sealing groove 51e is formed on the outer peripheral surface 51b of the ring inclined portion 51 and extends over the entire periphery of the outer peripheral surface 51b.

As shown in FIG. 7B, the inner peripheral surface 51a of the ring inclined portion 51 of the fourth connecting ring 23c is formed with a plurality of horizontal grooves 63 extending in the circumferential direction of the inner peripheral surface 51a; The grooves 63 communicate with each other with a plurality of vertical grooves 64. The through-hole 73c of the fluid line 73 of this embodiment is opened in a transverse groove 63 formed in the inner peripheral surface 51a of the ring inclined portion 51, and the through-hole 51d is opened in a transverse groove 63 different from the transverse groove 63 of the fluid line 73 .

The through-hole 73c and the through-hole 51d of the fluid line 73 may be opened in the vertical groove 64 formed in the inner peripheral surface 51a of the ring inclined portion 51, respectively. The outer peripheral surface 51b of the ring inclined portion 51 of the fourth connecting ring 23c is formed with a plurality of horizontal grooves extending in the circumferential direction of the outer peripheral surface 51b; and a plurality of vertical grooves that communicate adjacent horizontal grooves with each other, but no Icon. The through hole 51 d is preferably opened in a horizontal groove or a vertical groove formed on the outer peripheral surface 51 b of the ring inclined portion 51.

The seal protrusion 54 of the partition wall 14 shown in the sixth figure is fitted into a seal groove 51 e formed in the outer peripheral surface 51 b of the ring inclined portion 51. When the elastic film 10 is connected to the head body 2, the seal protrusion 54 is pressed against the bottom surface of the seal groove 51 e by the inner peripheral surface 51 a of the ring inclined portion 51 of the connection ring 23 located on the outer side in the radial direction of the seal protrusion 54. For example, the seal protrusion 54 formed on the front end of the fifth partition wall 14b is fitted into the seal groove 51e formed on the outer peripheral surface 51b of the ring inclined portion 51 of the sixth connection ring 23a, The inner peripheral surface 51a is pressed against the bottom surface of the seal groove 51e of the sixth connection ring 23a.

Thereby, the gap between the fifth partition wall 14b and the ring inclined portion 51 of the sixth connecting ring 23a; and the gap between the fifth partition wall 14b and the outer peripheral surface 51b of the ring inclined portion 51 of the fifth connecting ring 23b are sealed. With this configuration, the fluid supplied to each of the pressure chambers 16a to 16e is prevented from leaking from each of the pressure chambers 16a to 16e. In this way, the sealing protrusion 54 in the partition wall 14 engages the head body 2 and fixes the partition wall 14 to the head body 2 so that the elastic film 10 is supported on the head body 2 and corresponds to the engaging portion of the present invention. In particular, the sealing protrusion 54 of the first partition wall 14f corresponds to the first engaging portion of the present invention, and the sealing protrusion 54 of the second partition wall 14e corresponds to the second engaging portion of the present invention.

As shown in FIG. 8, an annular pressing protrusion 51 f may be formed on the inner peripheral surface 51 a of the ring inclined portion 51 of the connecting ring 23 so as to face the sealing protrusion 54 fitted in the sealing groove 51 e. The pressing protrusion 51f extends over the entire periphery of the inner peripheral surface 51a of the ring inclined portion 51. By pressing the projection 51f, the bottom surface of the seal groove 51e can be used to press the seal projection 54 with a strong pressing force. As a result, the fluid supplied to the pressure chambers 16a to 16e can be more effectively prevented from leaking from the pressure chambers 16a to 16e.

As shown in the fifth figure, the partition walls 14 a to 14 f are connected to the connecting rings 23 a to 23 f only by the sealing protrusions 54, respectively. That is, a gap is formed between the ring inclined portion 51 having a cross-sectional shape tapering toward the front end 51 c and the partition wall 14 other than the sealing protrusion 54. When the pressurized fluid is supplied to each of the pressure chambers 16a to 16f through this gap, the partition walls 14a to 14f are allowed to move in the radial direction (that is, the seal protrusion 54 is rotated as a fulcrum). As a result, since the elastic membrane 10 can be smoothly expanded according to the fluid pressure supplied to the pressure chambers 16a to 16f, the polishing profile can be precisely adjusted.

As described above, when the pressurized fluid is supplied to each of the pressure chambers 16a to 16f, the elastic membrane 10 expands, and the connecting portions of the partition walls 14a to 14e and the abutting portion 11 also move in the radial direction. However, the portions other than the sealing protrusions 54 of the partition walls 14a to 14e have the above-mentioned gap formed between the partition walls 14a to 14e and the connecting rings 23a to 23e, and therefore move to some extent in the radial direction of the partition walls 14a to 14e. Not hindered by the connecting rings 23a to 23f. Therefore, the elastic membrane 10 can be expanded according to the fluid pressure supplied to each of the pressure chambers 16a to 16f.

When there is a pressure difference between the fluids respectively supplied to the adjacent pressure chambers 16, the partition walls dividing these pressure chambers 16 are deformed in the radial direction. However, since the deformation in the radial direction of the partition wall 14 is restricted by the inner peripheral surface 51 a or the outer peripheral surface 51 b of the ring inclined portion 51 of the connecting ring 23, it is possible to effectively prevent the partition wall 14 from contacting the upper surface of the abutting portion 11 and effectively prevent abutment The partition walls 14 are in contact with each other. The front end 51c of the ring inclined portion 51 of the connecting ring 23 in this embodiment has a cross-sectional shape composed of a curved surface. Therefore, when the partition wall 14 contacts the front end 51 c of the ring inclined portion 51, the partition wall 14 can be prevented from being damaged.

As described above, the connecting ring 23 includes the lateral grooves 63 and the longitudinal grooves 64 formed in the inner peripheral surface 51a and the outer peripheral surface 51b of the ring inclined portion 51, and extends from the inner peripheral surface 51a to the outer peripheral surface 51b. Or the longitudinal groove 64) is a through hole 51d opened. In addition, a through-hole 73c (see the fifth figure) of the fluid line 73 through which the fluid supplied to each of the pressure chambers 16a to 16f flows is opened in the lateral groove 63.

Therefore, even if the partition wall 14 contacts the inner peripheral surface 51 a and / or the outer peripheral surface 51 b of the ring inclined portion 51 of the connecting ring 23 by the pressure difference of the fluids supplied to the adjacent pressure chambers 16, the fluid line can still be used. The fluid flowing in 73 is quickly and smoothly supplied to the pressure chamber 16 through the lateral grooves 63 and the longitudinal grooves 64 formed in the ring inclined portion 51 and the through-hole 51d. As a result, even when the partition wall 14 is in contact with the inner peripheral surface 51 a and / or the outer peripheral surface 51 b of the ring inclined portion 51 of the connecting ring 23, the pressure of the fluid supplied from the fluid line 73 can be quickly applied to the abutting portion 11. .

As shown in the fifth figure, the front end 51c of the ring inclined portion 51 is preferably located below the intermediate point CP of the partition walls 14a to 14e constituting the inclined partition wall. As shown in the sixth figure, the intermediate point CP is located at the center of the partition walls 14a to 14e extending above at a specified inclination angle θ. That is, the distance L1 between the intermediate point CP of the partition walls 14a to 14e and the upper surface of the abutting portion 11 is equal to the distance L2 between the intermediate point CP and the front ends of the partition walls 14a to 14e.

In order to attract the wafer W to the substrate holding surface 10 a (the lower surface of the contact portion 11) of the elastic film 10, when a vacuum is formed in the pressure chamber (for example, the intermediate pressure chamber 16 c), the elastic film 10 is deformed toward the head body 2. When the amount of deformation of the elastic film 10 is large, the stress occurring on the wafer W increases, which may cause damage to the electronic circuit formed on the wafer W, or the wafer W may be cracked. In this embodiment, since the front end 51c of the ring inclined portion 51 is located below the middle point CP of the partition walls 14a to 14c, the distance between the upper surface of the contact portion 11 and the front end 51c of the ring inclined portion 51 is shortened.

Therefore, when the wafer W is adsorbed on the substrate holding surface 10 a (refer to the second figure) of the elastic film 10, the elastic film 10 contacts the front end 51 c of the ring inclined portion 51, and the amount of deformation of the elastic film 10 can be reduced. As a result, the stress occurring on the wafer W can be reduced. Furthermore, since the front end 51c of the ring inclined portion 51 has a cross-sectional shape formed by a curved surface, when the elastic film 10 contacts the front end 51c of the ring inclined portion 51, the elastic film 10 can be prevented from being damaged.

In the present embodiment, the partition walls 14a to 14e are partition walls that have no linear shape that was previously formed on the horizontal portion of the partition wall. The partition walls 14a to 14e have the same shape and extend parallel (or roughly parallel) to each other. Therefore, even when the pressure difference of the fluids supplied to the adjacent pressure chambers is large, the partition walls 14 a to 14 e do not come into contact with the upper surface of the contact portion 11.

Furthermore, adjacent partition walls can be prevented from contacting each other. In particular, since the connecting ring 23 provided with the ring inclined portion 51 that restricts the movement of the partition wall 14 inside or outside in the radial direction is provided between the adjacent partition walls 14, it is possible to effectively prevent the partition wall 14 from contacting the upper surface of the contact portion 11. And the adjacent partition walls 14. As a result, the polishing profile of the wafer W held by the polishing head (substrate holding device) 1 can be precisely adjusted.

Furthermore, in the present embodiment, the partition walls 14a to 14e constituting the inclined partition wall extend parallel to each other, so that the interval between the adjacent partition walls 14a to 14e can be reduced. As a result, since the width of each of the pressure chambers 16a to 16e in the radial direction can be reduced, the polishing profile of the wafer W held by the polishing head (substrate holding device) 1 can be precisely adjusted.

When the partition walls 14a to 14e are configured as inclined partition walls, the interval between the adjacent partition walls 14 and the interval between the partition wall 14e and the vertical portion 22 of the side wall 15 and the radial width of each pressure chamber can be polished according to the wafer W. The outline is arbitrarily set. That is, the interval between the adjacent partition walls 14 can be set to a desired interval (for example, an extremely narrow interval). An inclined partition wall may be formed by at least two partition walls adjacent to each other among the plurality of partition walls 14a to 14e. For example, the partition wall 14c, the partition wall 14d, and the partition wall 14e may constitute an inclined partition wall, and two partition walls 14d and 14e arranged adjacent to the side wall 15 may constitute an inclined partition wall.

The connecting ring 23 is fixed to the carrier 43 by a plurality of fixing tools. The connecting ring 23 is fixed to the carrier 43 by a fixing nail, and the elastic film 10 is connected to the head body 2. When the elastic film 10 having a small interval between the adjacent partition walls 14 constituting the inclined partition wall is connected to the head body 2, the width of the connection ring 23 of the head body 2 in the radial direction is also reduced. As a result, the fixture for fixing the link ring 23 to the carrier 43 must be arranged in a narrow space. In addition, when the number of fixtures for fixing the coupling ring 23 to the carrier 43 is large, the workload of attaching and detaching the elastic film 10 from the carrier 43 during maintenance increases.

In addition, there is a limit to the space in which a fixture for fixing the coupling ring 23 to the carrier 43 of the head body 2 is provided. More specifically, the carrier 43 of the head body 2 has a plurality of fluid lines 73 (refer to the second figure) for supplying fluid to the pressure chambers 16a to 16f, and the fixture must be arranged so as not to interfere with the fluid lines 73. . Furthermore, the carrier 43 of the head body 2 is formed with a plurality of radial grooves 43a (refer to the third figure) for accommodating the spokes 78, and the fixture cannot be arranged at a position where such grooves 43a are formed.

Therefore, the polishing head 1 of the present embodiment has a fixing tool 70 for simultaneously fixing two adjacent partition walls 14 forming an inclined partition wall to the head body 2 via three or four connecting rings 23. Hereinafter, a description will be given of the fixture 70 and a method of fixing the coupling ring 23 to which the elastic membrane 10 is connected to the head body 2 using the fixture 70.

The ninth diagram A is a plan view of the fixture 70, and the ninth diagram B is a sectional view taken along line B-B of the ninth diagram A. As shown in FIGS. 9A and 9B, the fixture 70 includes: a cylindrical fixture body 71; and an ellipse 锷 72 protruding from the outer peripheral surface of the fixture body 71 to the outside. The cymbal 72 has two inclined surfaces 72a, 72b, and these inclined surfaces 72a, 72b respectively extend to the outer peripheral surface of the cymbal 72. The thickness of 锷 72 in the vertical direction excluding the inclined surfaces 72a and 72b is the same as the engagement groove (described later) formed in the ring vertical portion 50 of the connecting ring 23. A groove 71b is formed on the upper surface 71a of the fixture body 71 so that the tip of the fixture (for example, a slotted wrench) can be engaged. By engaging the front end of the jig with the groove 71b and further rotating the jig, the fixture 70 can be rotated.

Next, a method for simultaneously fixing three or four connecting rings 23 to the carrier 43 of the head body 2 using the fixtures 70 shown in FIGS. 9A and 9B will be described, and the three connecting rings 23 are fixed to the carrier 43. At this time, two adjacent partition walls 14 are connected to the head body 2 at the same time. The following description refers to the connecting ring 23 located on the inner side in the radial direction among the three connecting rings 23 as the inner connecting ring 23, and the connecting ring 23 on the outer side in the radial direction among the three connecting rings 23 as the outer connecting ring 23, and The connection ring 23 located between the inner connection ring 23 and the outer connection ring 23 is called an intermediate connection ring. In addition, among the two adjacent partition walls 14 constituting the inclined partition wall, the partition wall 14 located on the inner side in the radial direction is referred to as an inner partition wall 14, and among the two adjacent partition walls 14 constituting the inclined partition wall, the outer wall is located on the outer radial direction. The partition wall 14 is referred to as an outer partition wall 14.

The tenth to thirteenth figures show that in order to connect the elastic film 10 shown in the sixth figure to the head body 2, three or four are fixed using the fixtures 70 shown in the ninth A and ninth B figures. A schematic view of each step in which the connecting ring 23 is simultaneously fixed to the carrier 43.

In the elastic film 10 shown in the fifth figure, a fifth partition wall 14 b is an inner partition wall 14, and a fourth partition wall 14 c is an outer partition wall 14. The sixth connection ring 23 a is an inner connection ring 23 with respect to the fifth partition wall 14 b and the fourth partition wall 14 c, the fifth connection ring 23 b is an intermediate connection ring 23, and the fourth connection ring 23 c is an outer connection ring 23. The sixth connecting rings 23a to 23c are fixed to the carrier 43 by the fixture 70, and the fifth partition wall 14b and the fourth partition wall 14c are connected to the head body 2.

Similarly, the third partition wall 14 d is the inner partition wall 14, and the second partition wall 14 e is the outer partition wall 14. The fourth connection ring 23c is an inner connection ring 23 for the third partition wall 14d and the second partition wall 14e, the third connection ring 23d is an intermediate connection ring 23, and the second connection ring 23e is an outer connection ring 23. The connecting rings 23c to 23e are fixed to the carrier 43 by the fixture 70, and the third partition wall 14d and the second partition wall 14e are connected to the head body 2. In this manner, the fourth connecting ring 23c is an outer connecting ring 23 to the fifth partition wall 14b and the fourth partition wall 14c, and is an inner connecting ring 23 to the third partition wall 14d and the second partition wall 14e.

As shown in the tenth figure, a plurality of first recesses 45 are formed on the upper surface 43c of the carrier 43 of the head body 2 to insert a plurality of fixtures 70, respectively. Each first recessed portion 45 extends from the upper surface 43 c of the carrier 43 toward the lower surface 43 d of the carrier 43. The first recessed portion 45 has an elliptical cross-section to avoid contact with the cymbal 72 of the fixture 70 inserted into the first recessed portion 45.

Further, on the lower surface 43 d of the carrier 43, a ring-shaped third recessed portion 47 inserted into the ring vertical portion 50 of the intermediate link ring 23, and a second recessed portion 46 and a fourth recessed portion 48 inserted into the ring vertical portion 50 of the outer link ring 23. A fifth recessed portion 49 that is perpendicular to the ring 50 into which the first link ring 23f and the second link ring 23e are inserted. The second concave portion 46, the third concave portion 47, the fourth concave portion 48, and the fifth concave portion 49 extend over the entire circumference including the carrier 43, and extend from the lower surface 43d of the carrier 43 toward the upper surface 43c.

An inner opening 96 is formed on the inner surface on the inner side in the radial direction of the first recessed portion 45, and an outer opening 97 is formed on the inner surface on the outer side in the radial direction of the first recessed portion 45. The first recessed portion 45 communicates with the second recessed portion 46 through the inner opening 96 and communicates with the fourth recessed portion 48 through the outer opening 97. When the fixture 70 inserted into the first recessed portion 45 is rotated, the cymbal 72 of the fixture 70 protrudes from the inside of the second recessed portion 46 and the fourth recessed portion 48 through the inside opening 96 and the outside opening 97.

The intermediate link ring 23 is sandwiched between the inner link ring 23 and the outer link ring 23, and is held by the inner link ring 23 and the outer link ring 23. For example, the fifth link ring 23 b of the middle link ring 23 is held by the sixth link ring 23 a of the inner link ring 23 and the fourth link ring 23 c of the outer link ring 23. Similarly, the third connection ring 23 d of the intermediate connection ring 23 is held by the fourth connection ring 23 c of the inner connection ring 23 and the second connection ring 23 e of the outer connection ring 23.

In this embodiment, the intermediate link ring 23 has a ring-shaped protruding portion 30 protruding from the inner peripheral surface thereof to the inside, and the inside link ring 23 has a ring-shaped stepped portion 31 on which the protruding portion 30 is mounted. In addition, the outer connecting ring 23 has a ring-shaped protruding portion 33 protruding from the inner peripheral surface thereof to the inside, and the middle connecting ring 23 has a ring-shaped step portion 34 on which the protruding portion 33 is mounted. The fourth link ring 23c functions as the outer link ring 23 for the fifth partition wall 14b and the fourth partition wall 14c, and functions as the inner link ring 23 for the third partition wall 14d and the second partition wall 14e. The connecting ring 23 c includes a ring-shaped protruding portion 33 and a ring-shaped step portion 31.

Furthermore, an inner engaging groove 36 is formed in the ring vertical portion 50 of the inner connecting ring 23 to engage with the 锷 72 of the fixture 70, and an 啮合 72 may be formed in the ring vertical portion 50 of the outer connecting ring 23 to be engaged. Engaging outer engagement groove 37. The fourth link ring 23c functions as the outer link ring 23 for the fifth partition wall 14b and the fourth partition wall 14c, and functions as the inner link ring 23 for the third partition wall 14d and the second partition wall 14e. The connecting ring 23 c includes an inner meshing groove 36 and an outer meshing groove 37.

A seal protrusion 54 formed at the front end of the inner partition wall 14 (for example, the fifth partition wall 14b) is fitted into a seal groove 51e formed on the outer peripheral surface of the ring inclined portion 51 of the inner connection ring 23 (for example, the sixth connection ring 23a). A sealing protrusion 54 formed at the front end of the outer partition wall 14 (for example, the fourth partition wall 14c) is fitted in the seal groove 51e formed on the outer peripheral surface of the ring inclined portion 51 of the intermediate link ring 23 (for example, the fifth link ring 23b). The protruding portion 33 of the intermediate link ring 23 is mounted on the stepped portion 34 of the intermediate link ring 23. This state is shown in the tenth figure.

In addition, as shown in the tenth figure, the sixth partition wall 14a of the elastic film 10 also constitutes an inclined partition wall. The sixth partition wall 14a is connected to the additional connection ring 23g, and is connected to the head body 2 by fixing the additional connection ring 23g to the carrier 43. More specifically, the additional connecting ring 23 g has an inclined surface 53, and a sealing groove 53 a is formed in the inclined surface 53 so as to fit into the sealing protrusion 54 formed at the front end of the sixth partition wall 14 a. The sixth partition wall 14a is sandwiched between the sixth link ring 23a and the additional link ring 23g in a state where the sealing protrusion 54 of the sixth partition wall 14a is fitted into the seal groove 53a of the additional link ring 23g. 14a is held by the sixth connection ring 23a and the additional connection ring 23g.

Further, as shown in the tenth figure, the connecting ring 23f has a ring-shaped protruding portion 35 protruding from the inner peripheral surface thereof to the inside, and the connecting ring 23e has a ring-shaped step portion 38 on which the protruding portion 35 is mounted. The side wall 15 of the elastic film 10 has a horizontal portion 28. A seal protrusion 54 is formed at the front end of the horizontal portion 28, and a seal groove 51e is formed in the outer peripheral surface of the first connection ring 23f to fit in the seal protrusion 54. When the elastic film 10 is connected to the carrier 43 of the head body 2, the partition walls 14b to 14e of the elastic film 10 are held in advance by the connecting rings 23a to 23f, and the partition wall 14a is held in advance by the additional connecting ring 23g.

Next, as shown in the eleventh figure, the elastic film 10, the connecting rings 23a to 23f, and the additional connecting ring 23g are moved toward the carrier 43, and each of the connecting rings 23a to 23f is inserted into the recess 46 formed on the lower surface 43b of the carrier 43, 47, 48, 49 (refer to the tenth figure). As shown in the tenth figure, the recessed portion inserted into the fourth connecting ring 23c is opposite to the fourth recessed portion 48 of the fifth partition wall 14b and the fourth partition wall 14c, and is the first to the third partition wall 14d and the second partition wall 14e. Two recesses 46.

As shown in Figs. 9A and 9B, two inclined surfaces 72a and 72b are formed on the cymbal 72 of the fixture 70. The inclined surfaces 72a and 72b extend to the outer peripheral surface of the cymbal 72, respectively.锷 72 can smoothly enter the engagement grooves 36 and 37 through the inclined surfaces 72a and 72b.

Since the thickness of the cymbal 72 except for the inclined surfaces 72a and 72b is the same as the thickness of the engaging grooves 36 and 37, the yoke 72 smoothly entering the engaging grooves 36 and 37 is strongly engaged with the engaging grooves 36 and 37. As a result, the inner connecting ring (for example, the sixth connecting ring 23a) and the outer connecting ring (for example, the fourth connecting ring 23c) are firmly fixed to the carrier 43. At this time, the intermediate connection ring 23 (for example, the fifth connection ring 23 b) held by the inner connection ring 23 and the outer connection ring 23 is also strongly connected to the inner connection ring 23 and the outer connection ring 23.

At the same time, the sealing protrusion 54 of the inner partition wall (for example, the fifth partition wall 14 b) is pressed against the outer peripheral surface 51 b of the ring inclined portion 51 of the inner connection ring 23 by the inner peripheral surface 51 a of the ring inclined portion 51 of the intermediate connection ring 23. In the formed sealing groove 51e, the sealing protrusion 54 of the outer partition wall (for example, the partition wall 14c) is pressed against the ring inclined portion 51 of the middle link ring 23 by the inner peripheral surface 51a of the ring inclined portion 51 of the outer link ring 23. In the sealing groove 51e formed on the outer peripheral surface 51b.

Thereby, the gap between the inner partition wall 14 and the inner link ring 23 and the gap between the inner partition wall 14 and the intermediate link ring 23 are sealed, and the gap between the outer partition wall 14 and the intermediate link ring 23 and the outer partition wall are sealed. 14 and a gap between the outer connecting ring 23. As described with reference to the eighth figure, a pressing protrusion 51f that presses the sealing protrusion 54 against the sealing groove 51e may be formed on the inner peripheral surface 51a of the ring inclined portion 51 of the connecting ring 23.

The sealing protrusion 54 of the side wall 15 is pressed against the sealing groove 51e formed on the outer peripheral surface 51b of the ring inclined portion 51 of the first connecting ring 23f by the lower surface 43d (refer to the tenth figure) of the carrier 43, thereby sealing the side wall 15 The gap between the first connecting ring 23f and the gap between the side wall 15 and the carrier 43.

An annular pressing protrusion 51f described with reference to the eighth figure may be disposed on the lower surface 43d of the carrier 43. When the elastic film 10 is connected to the head body 2, the sealing protrusion 54 of the side wall 15 is pressed against the outer peripheral surface 51b of the ring inclined portion 51 of the first connecting ring 23f with a strong pressing force by the pressing protrusion 51f provided on the lower surface 43d. The sealing groove 51e is formed on it.

In this embodiment, the additional connecting ring 23g is fixed to the carrier 43 by a plurality of screws 94. The carrier 43 is formed with a through hole 43f (refer to the tenth figure) for inserting the screw 94, and the additional connection ring 23g is formed with a screw hole 56 extending from the upper surface to the lower surface. By inserting the screw 94 into the through hole 43f and screwing the screw 94 into the screw hole 56, the additional connection ring 23g is firmly fixed to the carrier 43.

At this time, the sealing protrusion 54 of the sixth partition wall 14a is a sealing groove 53a formed on the inclined surface 53 of the additional connecting ring 23g by pressing the inner peripheral surface 51a of the ring inclined portion 51 of the sixth connecting ring 23a. Thereby, the gap between the sixth partition wall 14a and the additional connection ring 23g, the gap between the sixth partition wall 14a and the sixth connection ring 23a, and the gap between the sixth partition wall 14a and the sixth connection ring 23a are sealed.

The fourteenth figure is a schematic diagram showing an example of the arrangement of the fixture 70. As shown in the fourteenth figure, the sixth link ring 23a, the fifth link ring 23b, and the fourth link ring 23c are fixed to the carrier 43 by a plurality of fixtures 70 arranged along the circumferential direction of the fifth link ring 23b. The fourth link ring 23c, the third link ring 23d, and the second link ring 23e are fixed to the carrier 43 by a plurality of fixtures 70 arranged along the circumferential direction of the third link ring 23d.

As described above, when the three or four connecting rings 23 are simultaneously fixed to the carrier 43 using the fixture 70 described above, the elastic membrane 10 can be connected to the head body 2 even if the width of the pressure chambers 16a to 16f is small. Furthermore, since the number of the fixtures 70 can be reduced, the amount of work required when attaching and detaching the elastic film 10 can be reduced.

As shown in FIG. 14, the carrier 43 is provided with a sealing member 44 (see FIG. 5) that prevents fluid leakage through the through-holes 73 a and 73 b of the fluid line 73 for supplying fluid to the pressure chambers 16 a to 16 f. . In addition, as described with reference to the third figure, the carrier 43 is formed with a plurality of radial grooves 43 a for receiving the spokes 78.

As in this embodiment, in order to connect the two adjacent partition walls 14 to the head body 2, when the three connecting rings 23 are fixed to the carrier 43 of the head body 2 by the fixing tool 70, the fixing tool 70 can be easily disposed at Different positions of the through hole 73b and the groove 43a. Furthermore, since the number of the fixtures 70 can be reduced, the mounting and dismounting of the elastic film 10 is easy.

In the above embodiment, at least two adjacent partition walls of the plurality of partition walls 14 constitute an inclined partition wall which is inclined to the inner side in the radial direction. The shape of the partition wall 14 other than the partition wall 14 constituting the inclined partition wall is not limited. For example, the partition walls 14d and 14e may be configured as inclined partition walls, and partition walls 14a to 14c other than the partition walls 14d and 14e may be configured as inclined portions having an inward radial direction from the contact portion 11 and from the inclined portions. Partition wall that extends horizontally.

As described above, the present embodiment relates to the outermost edge pressure chamber 16f of the plurality of pressure chambers formed between the elastic film 10 and the head body 2. The first partition wall 14f and the first partition wall constituting the partition wall of the edge pressure chamber 16f. The two partition walls 14e are formed in a straight line shape, and are configured to go from the inside in the radial direction of the abutting portion 11 toward the outside, and the interval between the first partition wall 14f and the second partition wall 14e is gradually enlarged. Various effects can be obtained by the configuration of the edge pressure chamber 16f.

The fifteenth to twentieth figures are schematic diagrams for explaining the effects obtained by the edge pressure chamber 16f by the above configuration. As in the past example shown in FIG. 15B, when the partition walls 214f and 214e constituting the pressure chamber 216f extend in parallel, and the intervals are narrow, the pressure of the edge pressure chamber 216e is greater than the pressure of the pressure chamber 216f, and the differential pressure is large At this time, as shown in FIG. 15C, the pressure chamber 216e expands and the partition wall 214e is deformed, which may cause the partition wall 214e to contact the partition wall 214f.

As shown in FIG. 15C, when the partition wall 214e is in contact with the partition wall 214f, the pressure of the outer pressure chamber 216f cannot be accurately controlled from the contact portion, so the pressing force of the elastic film 10 on the edge portion of the wafer W cannot be accurately controlled. .

On the other hand, the elastic film 10 of this embodiment forms the first partition wall 14f and the second partition wall 14e in a straight line shape, and is formed from the inside of the radial direction of the abutting portion 11 to the outside, and the first partition wall 14f and the second partition The interval between the partition walls 14e is gradually enlarged, so as shown in FIG. 15A, the pressure of the edge pressure chamber 16f is smaller than the pressure of the pressure chamber 16e, and even if the differential pressure becomes large, the first partition wall 14f and the second partition wall 14e Still not easily accessible. Therefore, the pressure of the edge pressure chamber 16f can be precisely adjusted, and the pressing force on the edge portion of the wafer W can also be precisely adjusted.

In addition, as in the conventional example shown in FIG. 16B, when the distance (edge pressing width) between the contact portion between the second partition wall 114e and the upper portion of the contact portion 111 and the outer peripheral end of the contact portion 111 is large, such as the tenth As shown in FIG. 6C, the pressing force cannot be controlled in a small range at the edge portion of the elastic film 10, and problems such as slumping occur.

On the other hand, as shown in FIG. 16A of the elastic film 10 of this embodiment, the contact portion between the partition wall 14e constituting the partition wall below the edge pressure chamber 16f and the contact portion 11 is near the outer peripheral end of the contact portion 11, In addition, the partition wall 14e extends from the outer peripheral end portion of the abutting portion 11, so that the edge pressing width becomes smaller, and the pressing force can be controlled in a small range at the edge portion of the elastic film 10.

In addition, as in the conventional example shown in FIG. 17B, when the portion of the side wall 115 constituting the edge pressure chamber 116f is long, when the pressure of the edge pressure chamber 116f is increased, as shown in FIG. 17C, the edge pressure chamber In 116f, the side wall 115 expands outward in the radial direction and contacts the retaining ring 3. The pressing force at the edge portion is unstable, which may cause the polishing rate of the edge portion of the wafer W to be unstable.

As shown in FIG. 17A, the elastic film 10 of this embodiment has a linear partition wall 14f connected to the side wall 15. Therefore, even if the pressure of the edge pressure chamber 16f increases, the partition wall 14f can suppress the expansion of the side wall 15 Therefore, the side wall 15 is difficult to contact the buckle ring 3. Therefore, the pressing force of the elastic film 10 in this embodiment is stable at the edge portion, and the polishing rate at the edge portion of the wafer W is stable.

In addition, even in the conventional examples shown in FIGS. 23 and 24, the partition wall 120g corresponding to the partition wall 14f of the elastic film 10 of this embodiment is connected to the side wall 110h, but the partition wall 120g is not straight. The shape is curved, and the partition wall 120f is also curved. Therefore, when the pressure of the edge pressure chamber 116g increases, these curved portions stretch straight, and the side wall 110h can expand outward in the radial direction.

In the elastic film 10 of this embodiment, as shown in FIG. 17A, since the partition wall 14f connected to the side wall 15 has a linear shape, there is very little room for the partition wall 14f to extend outward in the radial direction, which can effectively suppress the side wall 15 Swell.

In addition, as in the past example shown in FIG. 18B, when the end section of the abutting portion 111 is square, as shown in FIG. 18C, the pressing force generated by the pressure of the edge pressure chamber 116f is the square width. Give wafer W. Thus, the wafer W cannot be pressed in a narrow range at the edge portion, and the pressing force cannot be precisely adjusted at the edge portion.

As shown in FIG. 18A of the elastic film 10 of this embodiment, since the partition wall 14e is connected to the outer peripheral end portion of the abutment portion 11, the edge pressing width of the edge pressure chamber 16f can be reduced, and the edge portion can be precisely adjusted. Press the pressure.

In addition, as in the past example of FIG. 19B, when there is a step on the side wall 115, the slurry S tends to stay on the step to form a defect cause. On the other hand, as shown in FIG. 19A of the elastic film 10 of this embodiment, since the outer peripheral surface of the side wall 15 is flat, the slurry is not easily retained.

In addition, as in the conventional example shown in FIG. 20B, the partition wall 114e constituting the edge pressure chamber 116f is bent, whereby when the edge pressure chamber 116f is bent, a pressure loss occurs at the bending angle, and the pressure cannot be transmitted to the edge. It is difficult to precisely adjust the pressing force at the edge portion of the pressure chamber 116f, that is, the outer peripheral end portion of the abutting portion 111.

On the other hand, as shown in FIG. 20A, the elastic membrane 10 of this embodiment is a fluid line 73 of a fluid source for the edge pressure chamber 16f. The distance between 14f and the second partition wall 14e gradually increases, and the edge pressure chamber 16f becomes wider. Therefore, the passage of the fluid is not blocked, and the fluid easily flows to the entire edge pressure chamber 16f, and the pressing force can be precisely adjusted at the edge portion.

Next, a modification of the elastic film 10 according to this embodiment will be described. Figure 21A is an enlarged sectional view showing a part of the elastic film of the first modification. The partition wall 14f on the upper side of the edge pressure chamber 16f in the above embodiment extends horizontally from the side wall 15. In the elastic film 10 'of this modification, the partition wall 14f' is slightly inclined upward from the outside in the radial direction toward the inside.

Even with the configuration of this modified example, since the first partition wall 14f still has a linear shape extending from the side wall 15 toward the inside in the radial direction, the second partition wall 14e is formed from the outer peripheral end portion of the abutment portion 11 toward the inside in the radial direction. The linear shape is extended, and the edge pressure chamber 16f is constituted by the first partition wall 14f, the second partition wall 14e, and the side wall 15. Therefore, the same effects as described above can be obtained. In addition, the partition wall 14f may be parallel to the partition wall 14e or may form an angle inclined upward toward the inner side in the radial direction.

FIG. 21B is an enlarged sectional view showing a part of the elastic film of the second modification. In addition to the configuration of FIG. 21A, the elastic film 10 of this modification is formed with a block 151 on the inner side of the side wall 15 'for suppressing the side wall 15' from expanding in the radial direction. Inside the side wall 15 ', the blocks 151 may be continuous in the circumferential direction to form a ring shape, or a plurality of blocks 151 may be provided at intervals in the circumferential direction.

Even with the configuration of this modification, the first partition wall 14f is formed in a linear shape extending from the side wall 15 toward the inside in the radial direction, and the second partition wall 14e is formed from the outer peripheral end portion of the abutment portion 11 toward the inside in the radial direction. The linear shape is extended, and the edge pressure chamber 16f is constituted by the first partition wall 14f, the second partition wall 14e, and the side wall 15. Therefore, the same effects as described above can be obtained.

In addition, the second partition wall 14e of the elastic film shown in Figures 21A and 21B is bent at its base end in a vertical direction to form a base end connection portion 141e, and the base end connection portion 141e is connected On the abutting portion 11. The distance between the outer peripheral surface of the base end connection portion 141e and the inner peripheral surface of the side wall 15 (equivalent to the edge pressing width d) may be 1.5 to 8 mm (preferably 3 to 6 mm).

In this way, when the second partition wall 14e is formed from the outer peripheral end of the abutting portion 11 from a position inside the distance d, such a second partition wall 14e also belongs to a partition wall extending from the outer peripheral end of the abutting portion 11. In addition, the length L of the base end connection portion 141e may be 0.5 to 3.5 mm (and preferably about 1 to 2.5 mm). Even if the second partition wall 14e of such a base end connection portion 141e is formed, most of the partition wall body 55 is formed in a linear shape, and belongs to a linearly extending partition wall.

The twenty-second figure is a third modified example showing an example with a more specific distance d and a length L. In the modification shown in FIG. 22, the distance d between the outer peripheral surface of the base end connection portion 141e and the inner peripheral surface of the side wall 15 is 5 mm, and the length L of the base end connection portion 141e is 3 mm. That is, an extremely small (5 mm wide) portion of the outer peripheral end portion of the abutment portion 11 in this example also constitutes the edge pressure chamber 16f.

When a metal film such as copper or tungsten is formed on the wafer W, the range of the coating film is from the outer periphery of the wafer W to the inside, and no film is formed on the outer peripheral end portion of the wafer W. In this case, it is necessary to precisely control a portion inside the outer peripheral end of the wafer W, that is, the polishing profile of the outer peripheral end portion of the film.

In the above-mentioned modified example, by ensuring the distance d to some extent, the polishing process of the outer peripheral end portion of the film formed on the wafer W can be precisely controlled. In addition, by forming the base end connection portion 141e, the position and attitude of the portion other than the base end connection portion 141e of the second partition wall 14e can be made the same as the second partition wall 14e of the above-mentioned embodiment shown in FIG.

That is, when the second partition wall 14e of the sixth figure is also moved in parallel to the inside, the distance between the second partition wall 14e and the third partition wall 14d is narrowed, and the base end portion of the second partition wall 14e is bent. By forming the base end connection portion 141e, the distance between the second partition wall 14e and the third partition wall 14d can be kept the same as the above embodiment, and the edge pressing width d can be ensured. In addition, when the edge pressing width d is 8 mm or less and the length L is 3.5 mm or less, the effects described in the above embodiment can be fully enjoyed.

The above-mentioned embodiment is described for the purpose that a person having ordinary knowledge in the technical field to which the present invention pertains can implement the present invention. Of course, those skilled in the art can form various modifications of the above embodiment, and the technical idea of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but should be interpreted in the widest scope in accordance with the technical ideas defined in the scope of the patent application.

Claims (15)

    An elastic film is used for a substrate holding device, and includes: an abutment portion that abuts on a substrate; an annular side wall that is erected on the outer peripheral end of the abutment portion; a first partition wall that The second partition wall extends linearly from the side wall toward the inner side in the radial direction in a cross-sectional view; and the second partition wall extends linearly in cross-section when viewed from the outer peripheral end portion of the abutment portion toward the upper side in the radial direction; A partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the substrate.         For example, the elastic film of the scope of patent application, wherein the interval between the first partition wall and the second partition wall gradually increases from the radial inside of the abutting portion toward the radial outside.         For example, the elastic film of the first patent application range, wherein the substrate holding device is provided with a head body to which the elastic film is mounted, and the first partition wall has a first engaging portion at a front end which is engaged with the head body; The two partition walls have a second engaging portion at the front end, which is engaged with the head body; the interval between the first partition wall and the second partition wall is gradually enlarged from the first engaging portion and the second engaging portion toward the side. .         For example, the elastic film according to any one of claims 1 to 3, wherein the second partition wall linearly extends from a position that is 0.5 to 1.5 mm inside the inner peripheral surface of the side wall.         For example, the elastic film according to any one of claims 1 to 3, wherein a distance between an outer peripheral surface of the second partition wall above the abutting portion and an inner peripheral surface of the side wall is 1.5 to 8 mm.         For example, the elastic film of the fifth scope of the application, wherein the base end portion connected to the abutting portion of the second partition wall is bent to form a base end connection portion, and the length of the base end connection portion is 0.5 to 3.5 mm.         For example, the elastic film according to any one of claims 1 to 6, wherein the outer peripheral surface of the side wall constituting the edge pressure chamber is flat.         A substrate holding device is used for holding a substrate and includes: an elastic film; and a head body for mounting the elastic film; the elastic film includes: an abutting section for abutting on a substrate; and a ring-shaped side wall for The first partition wall extends straight from the side wall toward the inside in the radial direction in a cross-section when viewed from the side; the second partition wall extends straight from the outer peripheral end of the abutment portion; Above the inner side in the radial direction, it extends linearly in a sectional view; and an edge pressure chamber for pressing the edge of the substrate is formed by the first partition wall, the second partition wall, and the side wall.         For example, the substrate holding device of the eighth patent application range, wherein a distance between the first partition wall and the second partition wall gradually increases from a radial inner side of the abutting portion toward a radial outer side.         For example, the substrate holding device of the eighth patent application range, wherein the first partition wall has a first engaging portion at the front end, which is engaged with the head body; the second partition wall has a second engaging portion at the front end, which is Engages with the head body; the interval between the first partition wall and the second partition wall gradually increases from the first meshing portion and the second meshing portion toward the side.         For example, the substrate holding device according to any one of claims 8 to 10, wherein the second partition wall linearly extends from a position that is 0.5 to 1.5 mm inside the inner peripheral surface of the side wall.         For example, the substrate holding device according to any one of claims 8 to 10, wherein a distance between an outer peripheral surface of the second partition wall above the abutting portion and an inner peripheral surface of the side wall is 1.5 to 8 mm.         For example, the substrate holding device according to item 12 of the patent application, wherein the base end portion connected to the abutting portion of the second partition wall is bent to form a base end connection portion, and the length of the base end connection portion is 0.5 to 3.5 mm.         For example, in the substrate holding device according to any of claims 8 to 13, the outer peripheral surface of the side wall constituting the edge pressure chamber is flat.         A polishing device is for polishing a substrate, and comprises: a polishing table supporting a polishing pad having a polishing surface; and a substrate holding device for applying for a patent item No. 8; the substrate is held by the substrate holding device while the substrate is oriented The polishing surface is pressed with a predetermined pressure, and the substrate is slidably brought into contact with the polishing surface by moving the polishing table and the substrate holding device relatively, thereby polishing the surface of the substrate.