TWI791014B - Elastic membrane, substrate holding device, and polishing apparatus - Google Patents

Elastic membrane, substrate holding device, and polishing apparatus Download PDF

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TWI791014B
TWI791014B TW107112387A TW107112387A TWI791014B TW I791014 B TWI791014 B TW I791014B TW 107112387 A TW107112387 A TW 107112387A TW 107112387 A TW107112387 A TW 107112387A TW I791014 B TWI791014 B TW I791014B
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partition wall
ring
polishing
elastic film
aforementioned
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TW201838021A (en
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山木暁
福島誠
並木計介
鍋谷治
富樫真吾
大和田朋子
加藤良和
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日商荏原製作所股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本發明提供一種在基板邊緣部分可精密調整研磨輪廓之彈性膜。 The invention provides an elastic film which can precisely adjust the grinding profile at the edge of the substrate.

用於研磨頭1之彈性膜10具備:抵接於晶圓W之抵接部11;直立設於抵接部11外周端之圓環狀的側壁15;從側壁15朝向徑方向內側以剖面觀看,係直線狀延伸之第一分隔壁14f;及從抵接部11之外周端部朝向徑方向內側的上方以剖面觀看,係直線狀延伸之第二分隔壁14e;並以第一分隔壁14f、第二分隔壁14e與側壁15構成用於按壓晶圓W邊緣之邊緣壓力室16f。 The elastic film 10 used for the polishing head 1 is provided with: an abutting portion 11 abutting against the wafer W; an annular side wall 15 erected at the outer peripheral end of the abutting portion 11; viewed in cross section from the side wall 15 toward the radially inner side , the first partition wall 14f that extends linearly; and the second partition wall 14e that extends linearly when viewed in cross section from the outer peripheral end of the contact portion 11 toward the radially inner side; and the first partition wall 14f , The second partition wall 14e and the side wall 15 form an edge pressure chamber 16f for pressing the edge of the wafer W.

Description

彈性膜、基板保持裝置、及研磨裝置 Elastic membrane, substrate holding device, and polishing device

本發明係關於一種用於研磨晶圓等基板之研磨裝置、研磨裝置中用於保持基板之基板保持裝置、及用於基板保持裝置之彈性膜。 The present invention relates to a grinding device for grinding substrates such as wafers, a substrate holding device for holding substrates in the grinding device, and an elastic film used for the substrate holding device.

近年來,隨著半導體元件高積體化、高密度化,電路的配線更加微細化,多層配線總數亦增加。為了達到電路微細化而且實現多層配線,由於係沿著下側層的表面凹凸導致階差更大,因此,隨著配線總數增加,在薄膜形成中對階差形狀之膜被覆性(階躍式覆蓋率)惡化。因此,為了實現多層配線,須改善該階躍式覆蓋率,並以適當過程進行平坦化處理。此外,因為隨著光微影術之微細化,焦點深度變淺,所以需要對半導體元件表面進行平坦化處理,使半導體元件表面之凹凸階差限制在焦點深度以下。 In recent years, along with the high integration and high density of semiconductor elements, circuit wiring has become more miniaturized, and the total number of multilayer wiring has also increased. In order to achieve circuit miniaturization and realize multi-layer wiring, the step difference is larger due to the unevenness along the surface of the lower layer. Therefore, as the total number of wiring increases, the film coverage of the step shape in the film formation (step type coverage) worsens. Therefore, in order to realize multilayer wiring, it is necessary to improve the step coverage and planarize with an appropriate process. In addition, since the depth of focus becomes shallower with the miniaturization of photolithography, it is necessary to planarize the surface of the semiconductor element to limit the unevenness of the surface of the semiconductor element below the depth of focus.

因此,在半導體元件之製造工序中,半導體元件表面之平坦化愈來愈重要。該表面平坦化中最重要的一個技術是化學機械研磨(CMP:Chemical Mechanical Polishing)。該化學機械研磨係將含二氧化矽(SiO2)等研磨粒之研磨液供給至研磨墊的研磨面上,同時使晶圓與研磨面滑動接觸來進行研磨者。 Therefore, in the manufacturing process of the semiconductor device, the planarization of the surface of the semiconductor device becomes more and more important. One of the most important techniques for this surface planarization is chemical mechanical polishing (CMP: Chemical Mechanical Polishing). This chemical mechanical polishing is performed by supplying a polishing solution containing abrasive grains such as silicon dioxide (SiO 2 ) to the polishing surface of a polishing pad, and simultaneously bringing the wafer into sliding contact with the polishing surface.

用於進行CMP之研磨裝置具備:支撐研磨墊之研磨台;及用於保持晶圓之稱為上方環形轉盤或研磨頭等的基板保持裝置。使用此種研磨裝置進 行晶圓之研磨情況下,係藉由基板保持裝置保持晶圓,同時將該晶圓朝向研磨墊之研磨面以指定壓力按壓。此時,係藉由使研磨台與基板保持裝置相對運動,而使晶圓與研磨面滑動接觸來研磨晶圓表面。 A polishing apparatus for performing CMP includes: a polishing table supporting a polishing pad; and a substrate holding device called an upper ring turntable or a polishing head for holding a wafer. When using such a polishing device to polish a wafer, the wafer is held by the substrate holding device, and at the same time, the wafer is pressed toward the polishing surface of the polishing pad with a specified pressure. At this time, the surface of the wafer is polished by relatively moving the polishing table and the substrate holding device so that the wafer is brought into sliding contact with the polishing surface.

研磨中之晶圓與研磨墊的研磨面之間的相對按壓力若在整個晶圓上不均勻,則依賦予晶圓各部分之按壓力而產生研磨不足或過度研磨。因此,為了使按壓力對晶圓均勻化,係在基板保持裝置下部設置以彈性膜形成的壓力室,藉由在該壓力室中供給空氣等流體,而經由彈性膜藉著流體壓按壓晶圓(例如,參照專利文獻1)。 If the relative pressing force between the wafer being polished and the polishing surface of the polishing pad is not uniform over the entire wafer, under-grinding or over-grinding will occur depending on the pressing force applied to each part of the wafer. Therefore, in order to uniformize the pressing force on the wafer, a pressure chamber formed of an elastic membrane is provided at the lower part of the substrate holding device, and by supplying fluid such as air in the pressure chamber, the wafer is pressed by fluid pressure through the elastic membrane. (For example, refer to Patent Document 1).

第二十三圖係顯示專利文獻1所記載之研磨裝置的基板保持裝置之剖面圖,第二十四圖係第二十三圖之彈性膜的邊緣部分放大剖面圖。如第二十三圖所示,過去之彈性膜110具有:安裝於頭本體102之下面,配合晶圓形狀形成圓形之抵接部111;及從抵接部111直立設置之側壁110h。該彈性膜110之抵接部111下面成為彈性膜110的底面,藉由該抵接部111之下面將晶圓按壓於下方,而將晶圓按壓於研磨墊的研磨面。 Figure 23 is a cross-sectional view showing the substrate holding device of the polishing device described in Patent Document 1, and Figure 24 is an enlarged cross-sectional view of the edge of the elastic film in Figure 23. As shown in FIG. 23 , the conventional elastic film 110 has: a contact portion 111 installed under the head body 102 and formed circular according to the shape of the wafer; The lower surface of the abutting portion 111 of the elastic film 110 becomes the bottom surface of the elastic film 110 , and the wafer is pressed down by the lower surface of the abutting portion 111 , and the wafer is pressed against the polishing surface of the polishing pad.

如第二十三圖及第二十四圖所示,抵接部111上隔以間隔設有延伸於上方之複數個同心圓狀的分隔壁120a~120g,並在抵接部111之外周端形成延伸於上方的側壁110h。各分隔壁120a~120g之間形成壓力室116a~116g,外周端部係在最外分隔壁與側壁之間形成邊緣壓力室116g。而後,藉由從頭本體102對各壓力室116a~116g個別地輸送空氣來控制各壓力室116a~116g的壓力。藉由控制各壓力室116a~116g之壓力,可控制對應於各壓力室116a~116g之各底面部分的按壓力。 As shown in the twenty-third figure and the twenty-fourth figure, the abutting portion 111 is provided with a plurality of concentric partition walls 120a-120g extending above at intervals, and at the outer peripheral end of the abutting portion 111 A side wall 110h extending above is formed. Pressure chambers 116a to 116g are formed between the partition walls 120a to 120g, and a peripheral pressure chamber 116g is formed between the outermost partition wall and the side wall at the outer peripheral end. Then, the pressure of each of the pressure chambers 116a to 116g is controlled by supplying air from the head body 102 to each of the pressure chambers 116a to 116g individually. By controlling the pressure of each pressure chamber 116a-116g, the pressing force corresponding to each bottom surface portion of each pressure chamber 116a-116g can be controlled.

具有如上述過去構成之彈性膜的研磨裝置中,因為研磨墊具有彈性,所以研磨中施加於晶圓之邊緣部(周緣部)的按壓力不均勻,而發生僅晶圓之邊緣部研磨過多的所謂「塌緣」。為了防止此種塌緣,按壓晶圓邊緣部之彈性膜的外周端部宜以更微細之範圍控制按壓力。 In a polishing apparatus having an elastic film as described above, since the polishing pad has elasticity, the pressing force applied to the edge (periphery) of the wafer during polishing is not uniform, and only the edge of the wafer is excessively polished. The so-called "collapse edge". In order to prevent such edge collapse, it is preferable to control the pressing force in a finer range at the outer peripheral end of the elastic film that presses the edge of the wafer.

第二十五圖係專利文獻1中記載之另外例的彈性膜之邊緣部分的放大剖面圖。該例中,與第二十四圖之例比較,分隔壁120f係從更靠近抵接部111外周端之位置延伸,而邊緣壓力室116g可以比較窄之範圍按壓晶圓的邊緣部分。 Fig. 25 is an enlarged cross-sectional view of an edge portion of another example of an elastic film described in Patent Document 1. In this example, compared with the example of FIG. 24, the partition wall 120f extends from a position closer to the outer peripheral end of the contact portion 111, and the edge pressure chamber 116g can press the edge portion of the wafer in a relatively narrow range.

【先前技術文獻】 [Prior technical literature]

【專利文獻】 【Patent Literature】

[專利文獻1]日本特開2015-193070號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2015-193070

本發明之目的為提供一種特別是在基板邊緣部分可精密調整研磨輪廓之研磨裝置、用於此種研磨裝置之基板保持裝置、及用於此種基板保持裝置之彈性膜。 An object of the present invention is to provide a grinding device capable of finely adjusting the grinding profile especially at the edge portion of a substrate, a substrate holding device used in the grinding device, and an elastic film used in the substrate holding device.

本發明一種樣態之彈性膜,係用於基板保持裝置,且具備:抵接部,其係抵接於基板;圓環狀之側壁,其係直立設於前述抵接部之外周端;第一分隔壁,其係從前述側壁朝向徑方向內側以剖面觀看係直線狀延伸;及第二分隔壁,其係從前述抵接部外周端部朝向徑方向內側之上方以剖面觀看係直線狀延 伸;並以前述第一分隔壁、前述第二分隔壁與前述側壁構成用於按壓前述基板之邊緣的邊緣壓力室。 An elastic film according to one aspect of the present invention is used in a substrate holding device, and has: an abutment portion, which abuts on the substrate; an annular side wall, which is erected on the outer peripheral end of the aforesaid abutment portion; A partition wall extending linearly in cross-section from the side wall toward the inner side in the radial direction; and a second partition wall extending linearly in cross-sectional view from the outer peripheral end of the contact portion toward the inner side in the radial direction. and the edge pressure chamber for pressing the edge of the aforementioned substrate is formed by the aforementioned first partition wall, the aforementioned second partition wall and the aforementioned side wall.

藉由該構成,因為控制邊緣壓力室之壓力,所以可在外周端部之狹窄範圍控制抵接部的按壓力。此外,由於第一分隔壁與第二分隔壁分別從剖面觀看係直線狀延伸,因此第一分隔壁與第二分隔壁不易接觸,因而可輕易進行邊緣壓力室之壓力控制。此外,即使邊緣壓力室之壓力提高,由於第一分隔壁係從側壁直線狀延伸,因此可抑制側壁向外側膨脹。 With this configuration, since the pressure of the edge pressure chamber is controlled, the pressing force of the abutting portion can be controlled within a narrow range of the outer peripheral end. In addition, since the first partition wall and the second partition wall respectively extend in a straight line when viewed in cross-section, the first partition wall and the second partition wall are not easily contacted, so that the pressure control of the edge pressure chamber can be easily performed. In addition, even if the pressure of the peripheral pressure chamber increases, since the first partition wall extends linearly from the side wall, outward expansion of the side wall can be suppressed.

上述彈性膜中,前述第一分隔壁與前述第二分隔壁之間隔宜從前述抵接部的徑方向內側朝向徑方向外側逐漸擴大。 In the above-mentioned elastic film, it is preferable that the distance between the first partition wall and the second partition wall gradually increases from the inner side in the radial direction of the contact portion toward the outer side in the radial direction.

藉由該構成,空氣容易流到邊緣壓力室內的整個空間,因此可在外周端部之狹窄範圍控制抵接部的按壓力。 With this configuration, air can easily flow into the entire space of the edge pressure chamber, so that the pressing force of the abutting portion can be controlled within a narrow range of the outer peripheral end.

上述彈性膜中,前述基板保持裝置宜具備頭本體,其係安裝前述彈性膜,前述第一分隔壁在前端具有第一嚙合部,其係與前述頭本體嚙合;前述第二分隔壁在前端具有第二嚙合部,其係與前述頭本體嚙合;前述第一分隔壁與前述第二分隔壁之間隔宜從前述第一嚙合部及前述第二嚙合部朝向前述側面逐漸擴大。 In the above-mentioned elastic film, the above-mentioned substrate holding device preferably has a head body, which is installed with the above-mentioned elastic film, and the above-mentioned first partition wall has a first engaging portion at the front end, which is engaged with the aforementioned head body; The second engaging portion is engaged with the head body; the interval between the first partition wall and the second partition wall is preferably gradually enlarged from the first engaging portion and the second engaging portion toward the side.

即使藉由該構成,空氣仍然容易流到邊緣壓力室內的整個空間,可在外周端部之狹窄範圍控制抵接部的按壓力。 Even with this configuration, air can easily flow into the entire space of the edge pressure chamber, and the pressing force of the abutting portion can be controlled in a narrow range at the outer peripheral end.

上述彈性膜中,前述第二分隔壁宜從比前述側壁之內周面在0.5~1.5mm內側的位置直線狀延伸。 In the above elastic film, the second partition wall preferably extends linearly from a position 0.5 to 1.5 mm inside the inner peripheral surface of the side wall.

藉由該構成,將從彈性膜之外周端至內側0.5mm到1.5mm為止(邊緣按壓寬d)的部分作為外周端部,可在外周端部之狹窄範圍控制底面的按壓力。 With this configuration, the portion from the outer peripheral end of the elastic film to the inner side of 0.5 mm to 1.5 mm (edge pressing width d) is used as the outer peripheral end, and the pressing force of the bottom surface can be controlled in a narrow range of the outer peripheral end.

上述彈性膜中,在前述抵接部上面之前述第二分隔壁的外周面與前述側壁內周面之間的距離宜為1.5~8mm。 In the elastic film, the distance between the outer peripheral surface of the second partition wall on the upper surface of the contact portion and the inner peripheral surface of the side wall is preferably 1.5 to 8 mm.

藉由該構成,即使是外周端部並未形成膜之基板,仍可精密控制在膜外周端部之研磨輪廓。 With this configuration, even for a substrate on which no film is formed on the outer peripheral end, the polishing profile at the outer peripheral end of the film can be precisely controlled.

上述彈性膜中,前述第二分隔壁連接於前述抵接部上面之基端部宜彎曲而形成基端連接部,前述基端連接部之長度宜為0.5~3.5mm。 In the above elastic film, the base end of the second partition wall connected to the abutting portion is preferably bent to form a base end connection portion, and the length of the base end connection portion is preferably 0.5-3.5 mm.

藉由該構成,可確保彼此之距離,使第二分隔壁與鄰接之分隔壁不接觸。 With this structure, the mutual distance can be ensured, and the 2nd partition wall and the adjacent partition wall will not contact.

上述彈性膜中,構成前述邊緣壓力室之前述側壁的外周面宜平坦。 In the above-mentioned elastic film, the outer peripheral surface of the side wall constituting the edge pressure chamber is preferably flat.

藉由該構成,由於側壁無階差,因此會造成缺陷之漿液不易滯留。 With this structure, since the side wall has no level difference, the slurry causing defects is not easy to stagnate.

本發明其他樣態之基板保持裝置,係保持基板,且具備:上述之彈性膜;及頭本體,其係安裝前述彈性膜。 A substrate holding device according to another aspect of the present invention holds a substrate and includes: the above-mentioned elastic film; and a head body on which the above-mentioned elastic film is mounted.

即使藉由該構成,仍然可藉著控制壓力室之壓力,在外周端部之狹窄範圍控制抵接部的按壓力。此外,由於第一分隔壁與第二分隔壁分別直線狀延伸,因此第一分隔壁與第二分隔壁不易接觸,因而可輕易進行壓力室之壓力控制。即使壓力室之壓力提高,由於第一分隔壁係從側壁直線狀延伸,因此可抑制側壁向外側膨脹。 Even with this configuration, by controlling the pressure of the pressure chamber, the pressing force of the abutting portion can be controlled within a narrow range of the outer peripheral end. In addition, since the first partition wall and the second partition wall respectively extend linearly, the first partition wall and the second partition wall are less likely to be in contact, and thus the pressure control of the pressure chamber can be easily performed. Even if the pressure of the pressure chamber increases, since the first partition wall extends linearly from the side wall, the side wall can be suppressed from expanding outward.

本發明另外樣態之研磨裝置,係研磨基板,且具備:研磨台,其係支撐具有研磨面之研磨墊;及上述基板保持裝置;以前述基板保持裝置保持前述基板,同時將前述基板朝向前述研磨面以指定壓力按壓,並且藉由使前述研磨 台與前述基板保持裝置相對運動,而使前述基板與前述研磨面滑動接觸,來研磨前述基板表面。 A polishing apparatus according to another aspect of the present invention is to polish a substrate, and is provided with: a polishing table supporting a polishing pad having a polishing surface; and the aforementioned substrate holding device; the aforementioned substrate is held by the aforementioned substrate holding device while the aforementioned substrate is directed toward the aforementioned The polishing surface is pressed with a predetermined pressure, and the substrate is brought into sliding contact with the polishing surface by relatively moving the polishing table and the substrate holding device, thereby polishing the surface of the substrate.

即使藉由該構成,仍然可藉著控制壓力室之壓力,在外周端部之狹窄範圍控制抵接部的按壓力。此外,由於第一分隔壁與第二分隔壁分別直線狀延伸,因此第一分隔壁與第二分隔壁不易接觸,因而可輕易進行壓力室之壓力控制。即使壓力室之壓力提高,由於第一分隔壁係從側壁直線狀延伸,因此可抑制側壁向外側膨脹。 Even with this configuration, by controlling the pressure of the pressure chamber, the pressing force of the abutting portion can be controlled within a narrow range of the outer peripheral end. In addition, since the first partition wall and the second partition wall respectively extend linearly, the first partition wall and the second partition wall are less likely to be in contact, and thus the pressure control of the pressure chamber can be easily performed. Even if the pressure of the pressure chamber increases, since the first partition wall extends linearly from the side wall, the side wall can be suppressed from expanding outward.

採用本發明時,可藉由控制壓力室之壓力,在外周端部之狹窄範圍控制抵接部的按壓力。此外,由於第一分隔壁與第二分隔壁分別直線狀延伸,因此第一分隔壁與第二分隔壁不易接觸,因而可輕易進行壓力室之壓力控制。即使壓力室之壓力提高,由於第一分隔壁係從側壁直線狀延伸,因此可抑制側壁向外側膨脹。 According to the present invention, by controlling the pressure of the pressure chamber, the pressing force of the abutting portion can be controlled within a narrow range of the outer peripheral end. In addition, since the first partition wall and the second partition wall respectively extend linearly, the first partition wall and the second partition wall are less likely to be in contact, and thus the pressure control of the pressure chamber can be easily performed. Even if the pressure of the pressure chamber increases, since the first partition wall extends linearly from the side wall, the side wall can be suppressed from expanding outward.

1‧‧‧研磨頭 1‧‧‧Grinding head

2‧‧‧頭本體 2‧‧‧head body

3‧‧‧扣環 3‧‧‧Buckle

3a‧‧‧環構件 3a‧‧‧ring member

3b‧‧‧驅動環 3b‧‧‧Drive ring

10‧‧‧彈性膜 10‧‧‧elastic film

10a‧‧‧基板保持面 10a‧‧‧Substrate holding surface

11‧‧‧抵接部 11‧‧‧Abutment

14a~14f‧‧‧分隔壁 14a~14f‧‧‧Partition wall

15‧‧‧側壁 15‧‧‧side wall

16a~16g‧‧‧壓力室 16a~16g‧‧‧pressure chamber

17‧‧‧通孔 17‧‧‧through hole

18‧‧‧研磨台 18‧‧‧Grinding table

18a‧‧‧台軸 18a‧‧‧Table shaft

19‧‧‧研磨墊 19‧‧‧Grinding pad

19a‧‧‧研磨面 19a‧‧‧Grinding surface

22‧‧‧垂直部 22‧‧‧vertical part

23、23a~23g‧‧‧連結環 23. 23a~23g‧‧‧connecting ring

24‧‧‧彎曲部 24‧‧‧bending part

25‧‧‧研磨液供給噴嘴 25‧‧‧Abrasive liquid supply nozzle

27‧‧‧頭軸桿 27‧‧‧head shaft

28‧‧‧水平部 28‧‧‧Horizontal Department

29‧‧‧台馬達 29‧‧‧motors

30‧‧‧突出部 30‧‧‧protruding part

31‧‧‧階差部 31‧‧‧Level Department

32‧‧‧磁鐵 32‧‧‧Magnet

33‧‧‧突出部 33‧‧‧protruding part

34‧‧‧階差部 34‧‧‧Level Department

35‧‧‧突出部 35‧‧‧protruding part

36‧‧‧內側嚙合溝 36‧‧‧Internal engagement groove

37‧‧‧外側嚙合溝 37‧‧‧Outside engagement groove

38‧‧‧階差部 38‧‧‧Level Department

40‧‧‧控制裝置 40‧‧‧Control device

41‧‧‧凸緣 41‧‧‧flange

42‧‧‧間隔物 42‧‧‧Spacer

43‧‧‧載體 43‧‧‧carrier

43a‧‧‧溝 43a‧‧‧ditch

43b‧‧‧凹部 43b‧‧‧Concave

43c‧‧‧上面 43c‧‧‧above

43d‧‧‧下面 43d‧‧‧below

44‧‧‧密封構件 44‧‧‧Sealing components

45‧‧‧第一凹部 45‧‧‧First recess

46‧‧‧第二凹部 46‧‧‧Second recess

47‧‧‧第三凹部 47‧‧‧The third recess

48‧‧‧第四凹部 48‧‧‧Fourth recess

49‧‧‧第五凹部 49‧‧‧Fifth recess

50‧‧‧環垂直部 50‧‧‧Ring vertical part

51‧‧‧環傾斜部 51‧‧‧Ring inclined part

51a‧‧‧內周面 51a‧‧‧inner peripheral surface

51b‧‧‧外周面 51b‧‧‧outer peripheral surface

51c‧‧‧前端 51c‧‧‧Frontend

51d‧‧‧貫穿孔 51d‧‧‧through hole

51e‧‧‧密封溝 51e‧‧‧Sealing groove

53‧‧‧傾斜面 53‧‧‧Inclined surface

53a‧‧‧密封溝 53a‧‧‧Sealing groove

54‧‧‧密封突起 54‧‧‧Sealing protrusion

55‧‧‧分隔壁本體 55‧‧‧Partition wall body

56‧‧‧螺絲孔 56‧‧‧Screw hole

60‧‧‧扣環按壓機構 60‧‧‧Clasp pressing mechanism

61‧‧‧活塞 61‧‧‧piston

62‧‧‧旋轉隔板 62‧‧‧rotating partition

63‧‧‧橫溝 63‧‧‧Henggou

64‧‧‧縱溝 64‧‧‧longitudinal groove

65‧‧‧壓力調整裝置 65‧‧‧Pressure adjustment device

66‧‧‧旋轉筒 66‧‧‧Rotating drum

671‧‧‧定時滑輪 671‧‧‧timing pulley

672‧‧‧定時滑輪 672‧‧‧timing pulley

68‧‧‧頭馬達 68‧‧‧head motor

69‧‧‧定時皮帶 69‧‧‧Timing belt

70‧‧‧固定具 70‧‧‧Fixer

71‧‧‧固定具本體 71‧‧‧fixture body

71a‧‧‧上面 71a‧‧‧above

71b‧‧‧溝 71b‧‧‧ditch

72‧‧‧鍔 72‧‧‧E

72a、72b‧‧‧傾斜面 72a, 72b‧‧‧inclined surface

73‧‧‧流體管線 73‧‧‧fluid pipeline

73a、73b、73c‧‧‧貫穿孔 73a, 73b, 73c‧‧‧through hole

74‧‧‧密封構件 74‧‧‧Sealing components

75‧‧‧連結構件 75‧‧‧connecting components

76‧‧‧軸部 76‧‧‧Shaft

77‧‧‧肘套 77‧‧‧Elbow sleeve

78‧‧‧輻條 78‧‧‧spokes

79‧‧‧螺絲 79‧‧‧Screws

80‧‧‧支臂軸桿 80‧‧‧arm shaft

81‧‧‧上下運動機構 81‧‧‧Up and down movement mechanism

82‧‧‧旋轉接頭 82‧‧‧rotary joint

83‧‧‧軸承 83‧‧‧Bearing

84‧‧‧橋接物 84‧‧‧bridge

85‧‧‧球面軸承 85‧‧‧Spherical bearing

86‧‧‧支柱 86‧‧‧Pillar

87‧‧‧支撐台 87‧‧‧support table

88‧‧‧滾珠螺桿 88‧‧‧Ball screw

88a‧‧‧螺旋軸 88a‧‧‧Screw shaft

88b‧‧‧螺帽 88b‧‧‧Nut

90‧‧‧伺服馬達 90‧‧‧Servo motor

91‧‧‧中間輪 91‧‧‧Intermediate wheel

91a‧‧‧外面 91a‧‧‧outside

91b‧‧‧內面 91b‧‧‧Inside

91c‧‧‧貫穿孔 91c‧‧‧through hole

92‧‧‧外輪 92‧‧‧outer ship

92a‧‧‧鍔 92a‧‧‧E

92b‧‧‧內面 92b‧‧‧inside

92c‧‧‧貫穿孔 92c‧‧‧through hole

93‧‧‧內輪 93‧‧‧inner wheel

93a‧‧‧外面 93a‧‧‧outside

93b‧‧‧貫穿孔 93b‧‧‧through hole

94‧‧‧螺絲 94‧‧‧Screws

96‧‧‧內側開口 96‧‧‧Inside opening

97‧‧‧外側開口 97‧‧‧outside opening

102‧‧‧頭本體 102‧‧‧head body

110‧‧‧彈性膜 110‧‧‧elastic film

110h‧‧‧側壁 110h‧‧‧side wall

111‧‧‧抵接部 111‧‧‧Abutment

115‧‧‧側壁 115‧‧‧side wall

116a~116g‧‧‧壓力室 116a~116g‧‧‧pressure chamber

120a~120g‧‧‧分隔壁 120a~120g‧‧‧Partition wall

141e‧‧‧基端連接部 141e‧‧‧Base end connection

151‧‧‧方塊 151‧‧‧blocks

214e、214f‧‧‧分隔壁 214e, 214f‧‧‧partition wall

216e、216f‧‧‧壓力室 216e, 216f‧‧‧pressure chamber

C1‧‧‧頂點 C1‧‧‧Apex

θθ'、θ"‧‧‧傾斜角度 θ , θ ', θ "‧‧‧Inclination angle

O‧‧‧支點 O‧‧‧Fulcrum

CP‧‧‧中間點 CP‧‧‧intermediate point

L1、L2、d‧‧‧距離 L1, L2, d‧‧‧distance

Q‧‧‧研磨液 Q‧‧‧Grinding liquid

W‧‧‧晶圓 W‧‧‧Wafer

第一圖係顯示本發明實施形態之研磨裝置的圖。 The first figure is a view showing a grinding device according to an embodiment of the present invention.

第二圖係顯示設於第一圖所示之研磨裝置的研磨頭(基板保持裝置)之圖。 The second figure is a figure showing the polishing head (substrate holding device) provided in the polishing apparatus shown in the first figure.

第三圖係顯示第二圖所示之扣環及連結環的俯視圖。 The third figure is a top view showing the clasp and connecting ring shown in the second figure.

第四圖係第二圖所示之球面軸承及連結環的部分放大剖面圖。 Figure 4 is a partially enlarged cross-sectional view of the spherical bearing and connecting ring shown in Figure 2.

第五圖係顯示本發明實施形態之彈性膜連結於頭本體之載體狀態的概略剖面圖。 Figure 5 is a schematic cross-sectional view showing the state of the carrier in which the elastic film is connected to the head body according to the embodiment of the present invention.

第六圖係顯示第五圖所示之彈性膜的一部分之放大剖面圖。 Figure 6 is an enlarged cross-sectional view of a part of the elastic film shown in Figure 5 .

第七A圖係本發明實施形態之第三連結環的剖面圖。 The seventh figure A is a cross-sectional view of the third connecting ring of the embodiment of the present invention.

第七B圖係第七A圖之A線箭頭方向觀看圖。 The seventh picture B is a view viewed from the direction of the arrow of line A in the seventh picture A.

第八圖係顯示在本發明實施形態之連結環的環傾斜部內周面形成按壓突起之一例的放大剖面圖。 Fig. 8 is an enlarged cross-sectional view showing an example of forming a pressing protrusion on the inner peripheral surface of the ring inclined portion of the coupling ring according to the embodiment of the present invention.

第九A圖係本發明實施形態之固定具的俯視圖。 The ninth figure A is a top view of the fixture of the embodiment of the present invention.

第九B圖係第九A圖之B-B線剖面圖。 The ninth figure B is the B-B line sectional view of the ninth figure A.

第十圖係顯示將第六圖所示之彈性膜連結於頭本體的工序模式圖。 Figure 10 is a schematic view showing the process of connecting the elastic film shown in Figure 6 to the head body.

第十一圖係顯示將第六圖所示之彈性膜連結於頭本體的工序模式圖。 Figure 11 is a schematic view showing the process of connecting the elastic film shown in Figure 6 to the head body.

第十二圖係顯示將第六圖所示之彈性膜連結於頭本體的工序模式圖。 Figure 12 is a schematic view showing the process of connecting the elastic film shown in Figure 6 to the head body.

第十三圖係顯示將第六圖所示之彈性膜連結於頭本體的工序模式圖。 Fig. 13 is a schematic view showing the process of connecting the elastic film shown in Fig. 6 to the head body.

第十四圖係顯示本發明實施形態之固定具的配置一例之模式圖。 Fig. 14 is a schematic diagram showing an example of the arrangement of fixtures according to the embodiment of the present invention.

第十五A圖係用於說明本發明實施形態之彈性膜的優點之模式圖。 Fig. 15A is a schematic diagram for explaining the advantages of the elastic film according to the embodiment of the present invention.

第十五B圖係顯示過去彈性膜之模式圖。 Figure 15B is a schematic diagram showing the elastic membrane in the past.

第十五C圖係用於說明過去彈性膜之問題的模式圖。 Fig. 15C is a schematic diagram for explaining the problems of elastic membranes in the past.

第十六A圖係用於說明本發明實施形態之彈性膜的優點之模式圖。 Figure 16A is a schematic diagram for explaining the advantages of the elastic film according to the embodiment of the present invention.

第十六B圖係顯示過去彈性膜之模式圖。 Figure 16B is a schematic diagram showing an elastic membrane in the past.

第十六C圖係用於說明過去彈性膜之問題的模式圖。 Figure 16C is a schematic diagram for explaining the problems of the elastic membrane in the past.

第十七A圖係用於說明本發明實施形態之彈性膜的優點之模式圖。 Figure 17A is a schematic view for explaining the advantages of the elastic film according to the embodiment of the present invention.

第十七B圖係顯示過去彈性膜之模式圖。 Figure 17B is a schematic diagram showing the elastic membrane in the past.

第十七C圖係用於說明過去彈性膜之問題的模式圖。 Figure 17C is a schematic diagram for explaining the problems of the elastic membrane in the past.

第十八A圖係用於說明本發明實施形態之彈性膜的優點之模式圖。 Figure 18A is a schematic view for explaining the advantages of the elastic film according to the embodiment of the present invention.

第十八B圖係顯示過去彈性膜之模式圖。 Figure 18B is a schematic diagram showing an elastic membrane in the past.

第十八C圖係用於說明過去彈性膜之問題的模式圖。 Figure 18C is a schematic diagram for explaining the problems of the elastic membrane in the past.

第十九A圖係用於說明本發明實施形態之彈性膜的優點之模式圖。 Figure 19A is a schematic view for explaining the advantages of the elastic film according to the embodiment of the present invention.

第十九B圖係用於說明過去彈性膜之問題的模式圖。 Figure 19B is a schematic diagram for explaining the problems of the elastic membrane in the past.

第二十A圖係用於說明本發明實施形態之彈性膜的優點之模式圖。 Fig. 20A is a schematic diagram illustrating the advantages of the elastic film according to the embodiment of the present invention.

第二十B圖係用於說明過去彈性膜之問題的模式圖。 Fig. 20B is a schematic diagram for explaining the problems of the elastic membrane in the past.

第二十一A圖係顯示本發明實施形態之第一變形例的彈性膜之一部分的放大剖面圖。 Fig. 21A is an enlarged cross-sectional view showing part of an elastic film according to the first modified example of the embodiment of the present invention.

第二十一B圖係顯示本發明實施形態之第二變形例的彈性膜之一部分的放大剖面圖。 Fig. 21B is an enlarged cross-sectional view showing part of an elastic film according to a second modified example of the embodiment of the present invention.

第二十二圖係顯示本發明實施形態之第三變形例的彈性膜之一部分的放大剖面圖。 Fig. 22 is an enlarged cross-sectional view showing part of an elastic film according to a third modified example of the embodiment of the present invention.

第二十三圖係顯示過去研磨裝置之基板保持裝置的剖面圖。 Fig. 23 is a sectional view showing a substrate holding device of a conventional polishing device.

第二十四圖係顯示過去之彈性膜的一部分之放大剖面圖。 Fig. 24 is an enlarged sectional view showing a part of a conventional elastic film.

第二十五圖係顯示過去另外例之彈性膜的一部分之放大剖面圖。 Fig. 25 is an enlarged sectional view showing a part of an elastic film of another conventional example.

以下,參照圖式說明本發明之實施形態。另外,以下說明之實施形態係顯示實施本發明時的一例者,而並非將本發明限定為以下說明之具體構成者。本發明在實施時,係依實施形態採用適當的具體構成。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the embodiment described below shows an example at the time of carrying out this invention, and does not limit this invention to the thing of the concrete structure demonstrated below. When the present invention is implemented, appropriate specific configurations are adopted according to the embodiment.

第一圖係顯示實施形態之研磨裝置的圖。如第一圖所示,研磨裝置具備:支撐研磨墊19之之研磨台18:及保持作為研磨對象物之基板的一例之晶 圓W,並按壓於研磨台18上之研磨墊19的基板保持裝置1。以下說明時,將基板保持裝置1稱為研磨頭1。 The first figure is a figure which shows the grinding|polishing apparatus of embodiment. As shown in the first figure, the polishing apparatus includes: a polishing table 18 supporting a polishing pad 19; device 1. In the following description, the substrate holding device 1 is referred to as a polishing head 1 .

研磨台18經由台軸18a連結於配置在其下方之台馬達29,可在其台軸18a周圍旋轉。研磨墊19貼合在研磨台18上面,研磨墊19之表面19a構成研磨晶圓W的研磨面。在研磨台18上方設置研磨液供給噴嘴25,可藉由該研磨液供給噴嘴25在研磨台18上之研磨墊19上供給研磨液Q。 The grinding table 18 is connected to a table motor 29 disposed below it via a table shaft 18a, and is rotatable around the table shaft 18a. The polishing pad 19 is attached to the upper surface of the polishing table 18 , and the surface 19 a of the polishing pad 19 constitutes a polishing surface for polishing the wafer W. A polishing liquid supply nozzle 25 is provided above the polishing table 18 , and the polishing liquid Q can be supplied on the polishing pad 19 on the polishing table 18 through the polishing liquid supply nozzle 25 .

研磨頭1具備:對研磨面19a按壓晶圓W之頭本體2;及保持晶圓W,不使晶圓W從研磨頭1滑出之扣環3。研磨頭1連接於頭軸桿27,該頭軸桿27藉由上下運動機構81而對頭支臂64上下運動。藉由頭軸桿27上下運動,整個研磨頭1對頭支臂64升降定位。在頭軸桿27之上端安裝有旋轉接頭82。 The polishing head 1 includes: a head body 2 for pressing the wafer W against the polishing surface 19a; The grinding head 1 is connected to the head shaft 27 , and the head shaft 27 moves up and down against the head support arm 64 through the up and down movement mechanism 81 . By the up and down movement of the head shaft rod 27, the entire grinding head 1 is positioned up and down on the head support arm 64. A swivel joint 82 is mounted on the upper end of the head shaft 27 .

使頭軸桿27及研磨頭1上下運動之上下運動機構81具備:經由軸承83可旋轉地支撐頭軸桿27之橋接物84;安裝於橋接物84之滾珠螺桿88;藉由支柱86所支撐之支撐台87;及設於支撐台87上之伺服馬達90。支撐伺服馬達90之支撐台87經由支柱86而固定於頭支臂64。 The up and down movement mechanism 81 for making the head shaft 27 and the grinding head 1 move up and down includes: a bridge 84 that rotatably supports the head shaft 27 via a bearing 83; a ball screw 88 installed on the bridge 84; supported by a pillar 86 The support platform 87; And the servo motor 90 located on the support platform 87. The support base 87 that supports the servo motor 90 is fixed to the head arm 64 via the pillar 86 .

滾珠螺桿88具備:連結於伺服馬達90之螺旋軸88a;及該螺旋軸88a螺合之螺帽88b。頭軸桿27可與橋接物84一體地上下運動。因此,驅動伺服馬達90時,橋接物84經由滾珠螺桿88而上下運動,藉此頭軸桿27及研磨頭1上下運動。 The ball screw 88 includes: a screw shaft 88a connected to the servo motor 90; and a nut 88b screwed to the screw shaft 88a. The head shaft 27 is movable up and down integrally with the bridge 84 . Therefore, when the servo motor 90 is driven, the bridge 84 moves up and down via the ball screw 88 , whereby the head shaft 27 and the grinding head 1 move up and down.

頭軸桿27經由鍵(無圖示)而連結於旋轉筒66。該旋轉筒66在其外周部具備定時滑輪671。頭支臂64上固定有頭馬達68,上述定時滑輪671經由定時皮帶69而連接於設置在頭馬達68上的定時滑輪672。因此,藉由旋轉驅動頭馬達68,旋轉筒66及頭軸桿27經由定時滑輪672、定時皮帶69及定時滑輪671而一體旋轉,且研磨頭1旋轉。頭支臂64藉由可旋轉地支撐於框架(無圖示)的支臂軸 桿80而支撐。研磨裝置具備控制頭馬達68、伺服馬達90等裝置內之各設備的控制裝置40。 The head shaft 27 is connected to the rotary cylinder 66 via a key (not shown). The rotary drum 66 is provided with a timing pulley 671 on its outer peripheral portion. A head motor 68 is fixed to the head arm 64 , and the timing pulley 671 is connected to a timing pulley 672 provided on the head motor 68 via a timing belt 69 . Therefore, by rotationally driving the head motor 68 , the rotary drum 66 and the head shaft 27 are integrally rotated via the timing pulley 672 , the timing belt 69 , and the timing pulley 671 , and the grinding head 1 is rotated. The head arm 64 is supported by an arm shaft 80 rotatably supported by a frame (not shown). The polishing apparatus includes a control device 40 for controlling various devices in the apparatus, such as the head motor 68 and the servo motor 90 .

研磨頭1構成可在其下面保持晶圓W。頭支臂64以支臂軸桿80為中心可回轉地構成。在下面保持了晶圓W之研磨頭1,藉由頭支臂64之回轉而在晶圓W之接收位置與研磨台18的上方位置之間移動。 The polishing head 1 is configured to hold a wafer W therebelow. The head arm 64 is configured to be rotatable around the arm shaft 80 . The polishing head 1 holding the wafer W below moves between the receiving position of the wafer W and the position above the polishing table 18 by the rotation of the head support arm 64 .

晶圓W之研磨進行如下。使研磨頭1及研磨台18分別旋轉,並從設於研磨台18上方之研磨液供給噴嘴25供給研磨液Q至研磨墊19上。在該狀態下,使研磨頭1下降至指定位置(指定高度),在該指定位置將晶圓W按壓於研磨墊19之研磨面19a。晶圓W與研磨墊19之研磨面19a滑動接觸,藉此研磨晶圓W之表面。 The polishing of the wafer W is performed as follows. The polishing head 1 and the polishing table 18 are respectively rotated, and the polishing liquid Q is supplied onto the polishing pad 19 from the polishing liquid supply nozzle 25 provided above the polishing table 18 . In this state, the polishing head 1 is lowered to a predetermined position (designated height), and the wafer W is pressed against the polishing surface 19 a of the polishing pad 19 at the predetermined position. The wafer W is brought into sliding contact with the polishing surface 19a of the polishing pad 19, whereby the surface of the wafer W is polished.

其次,說明研磨頭1。第二圖係研磨頭(基板保持裝置)1之概略剖面圖。如第二圖所示,研磨頭1具備:對研磨面19a按壓晶圓W之頭本體2;及以包圍晶圓W之方式配置的扣環3。頭本體2及扣環3藉由頭軸桿27之旋轉而一體旋轉。扣環3構成可與頭本體2獨立地上下運動。 Next, the polishing head 1 will be described. The second figure is a schematic cross-sectional view of the polishing head (substrate holding device) 1 . As shown in FIG. 2 , the polishing head 1 includes: a head body 2 that presses the wafer W against the polishing surface 19 a; The head body 2 and the buckle 3 are integrally rotated by the rotation of the head shaft 27 . The clasp 3 is configured to move up and down independently of the head body 2 .

頭本體2具備:圓形之凸緣41;安裝於凸緣41下面之間隔物42;及安裝於間隔物42下面之載體43。凸緣41連結於頭軸桿27。載體43經由間隔物42而連結於凸緣41,凸緣41、間隔物42及載體43一體地旋轉,且一體地上下運動。具有凸緣41、間隔物42、及載體43之頭本體2藉由工程塑膠(例如聚醚醚酮(PEEK))等樹脂而形成。另外,亦可以SUS、鋁等金屬形成凸緣41。 The head body 2 has: a circular flange 41 ; a spacer 42 installed under the flange 41 ; and a carrier 43 installed under the spacer 42 . The flange 41 is connected to the head shaft 27 . The carrier 43 is connected to the flange 41 via the spacer 42, and the flange 41, the spacer 42, and the carrier 43 rotate integrally and move up and down integrally. The head body 2 having the flange 41 , the spacer 42 , and the carrier 43 is formed by resin such as engineering plastic (such as polyetheretherketone (PEEK)). In addition, the flange 41 may be formed of metal such as SUS or aluminum.

在頭本體2下面連結有抵接於晶圓W背面之彈性膜10。關於將彈性膜10連結於頭本體2之方法於後述。彈性膜10之圓形抵接部11的下面係抵接於晶圓W之抵接面,且構成基板保持面10a。側壁15從抵接部11之外周端直立設置。 彈性膜10具有複數個(第二圖係6個)環狀之分隔壁14a、14b、14c、14d、14e、14f,此等分隔壁14a~14f配置成同心狀。分隔壁14a~14e從抵接部11之上面向上方延伸,分隔壁14f從側壁15延伸於徑方向內側。藉由此等分隔壁14a~14f而在彈性膜10與頭本體2之間形成7個壓力室,亦即位於中央之圓形狀的中央壓力室16a、位於最外周之環狀的邊緣壓力室16f及16g、及位於中央壓力室16a與邊緣壓力室16f之間的中間壓力室16b、16c、16d、16e。邊緣壓力室16g形成於邊緣壓力室16f之上方。 An elastic film 10 abutting against the back of the wafer W is attached to the lower surface of the head body 2 . The method of connecting the elastic film 10 to the head body 2 will be described later. The lower surface of the circular abutting portion 11 of the elastic film 10 abuts against the abutting surface of the wafer W, and constitutes the substrate holding surface 10a. The side wall 15 is erected from the outer peripheral end of the contact portion 11 . The elastic membrane 10 has a plurality of (six in the second figure) annular partition walls 14a, 14b, 14c, 14d, 14e, 14f, and these partition walls 14a~14f are arranged concentrically. The partition walls 14 a to 14 e extend upward from the upper surface of the contact portion 11 , and the partition wall 14 f extends radially inward from the side wall 15 . Seven pressure chambers are formed between the elastic membrane 10 and the head body 2 by these partition walls 14a~14f, that is, the circular central pressure chamber 16a located in the center, and the annular edge pressure chamber 16f located in the outermost periphery. and 16g, and intermediate pressure chambers 16b, 16c, 16d, 16e located between the central pressure chamber 16a and the edge pressure chamber 16f. The rim pressure chamber 16g is formed above the rim pressure chamber 16f.

此等壓力室16a~16g經由旋轉接頭82而連接於壓力調整裝置65,並可從壓力調整裝置65通過分別延伸之流體管線73供給流體(例如氣體,更具體而言為空氣或氮)至各壓力室16a~16g。壓力調整裝置65連接於控制裝置40,可獨立調整此等7個壓力室16a~16g內之壓力。再者,壓力調整裝置65亦可在壓力室16a~16g內形成負壓。如此,在研磨頭1中,藉由調整供給至形成於頭本體2與彈性膜10之間的各壓力室16a~16g之流體壓力,即可每個晶圓W區域調整施加於晶圓W之按壓力。 These pressure chambers 16a~16g are connected to the pressure regulating device 65 through the rotary joint 82, and can supply fluid (such as gas, more specifically, air or nitrogen) from the pressure regulating device 65 to each Pressure chambers 16a~16g. The pressure adjusting device 65 is connected to the control device 40, and can independently adjust the pressures in the seven pressure chambers 16a~16g. Furthermore, the pressure adjusting device 65 can also form a negative pressure in the pressure chambers 16a-16g. In this way, in the polishing head 1, by adjusting the fluid pressure supplied to the pressure chambers 16a~16g formed between the head body 2 and the elastic membrane 10, the pressure applied to the wafer W can be adjusted for each area of the wafer W. Press pressure.

彈性膜10係藉由乙丙橡膠(EPDM)、聚氨酯橡膠、矽橡膠等強度及耐用性優異的橡膠材料形成。各壓力室16a~16g亦連接於大氣開放機構(無圖示),亦可將壓力室16a~16g開放於大氣。 The elastic membrane 10 is formed of rubber materials with excellent strength and durability such as ethylene-propylene rubber (EPDM), polyurethane rubber, and silicon rubber. Each of the pressure chambers 16a to 16g is also connected to an atmosphere release mechanism (not shown), and the pressure chambers 16a to 16g can also be released to the atmosphere.

扣環3之上部連接於環狀的扣環按壓機構60,該扣環按壓機構60對扣環3之整個上面(更具體而言,係驅動環3b之上面)賦予均勻向下之負荷,藉此對研磨墊19之研磨面19a按壓扣環3的下面(亦即,環構件3a的下面)。 The upper part of the buckle 3 is connected to the ring-shaped buckle pressing mechanism 60, and the buckle pressing mechanism 60 applies a uniform downward load to the entire upper surface of the buckle 3 (more specifically, the upper surface of the drive ring 3b). The grinding surfaces 19a of the pair of grinding pads 19 press the lower face of the buckle ring 3 (that is, the lower face of the ring member 3a).

扣環按壓機構60具備:固定於驅動環3b上部之環狀的活塞61;及連接於活塞61上面之環狀的旋轉隔板62。旋轉隔板62內部形成有扣環壓力室63。 該扣環壓力室63經由旋轉接頭82而連接於壓力調整裝置65。從該壓力調整裝置65供給流體(例如空氣)至扣環壓力室63時,旋轉隔板62將活塞61壓向下方,進一步活塞61將整個扣環3壓向下方。 The buckle pressing mechanism 60 includes: an annular piston 61 fixed on the top of the drive ring 3b; and an annular rotating partition 62 connected to the upper surface of the piston 61 . A buckle pressure chamber 63 is formed inside the rotating partition 62 . The buckle pressure chamber 63 is connected to the pressure adjusting device 65 via the rotary joint 82 . When fluid (for example, air) is supplied from the pressure adjusting device 65 to the buckle pressure chamber 63 , the rotating partition 62 presses the piston 61 downward, and the piston 61 further presses the entire buckle 3 downward.

如此,扣環按壓機構60對研磨墊19之研磨面19a按壓扣環3的下面。進一步藉由壓力調整裝置65在扣環壓力室63內形成負壓,可使整個扣環3上升。扣環壓力室63亦連接於大氣開放機構(無圖示),亦可將扣環壓力室63開放於大氣。 In this way, the buckle pressing mechanism 60 presses the lower surface of the buckle 3 against the polishing surface 19 a of the polishing pad 19 . Further, the negative pressure is formed in the buckle pressure chamber 63 by the pressure adjusting device 65, so that the whole buckle 3 can be lifted. The buckle pressure chamber 63 is also connected to an atmosphere opening mechanism (not shown), and the buckle pressure chamber 63 can also be released to the atmosphere.

扣環3可裝卸地連結於扣環按壓機構60。更具體而言,活塞61係由金屬等磁性材料形成,並在驅動環3b之上部配置有複數個磁鐵32。藉由此等磁鐵32吸引活塞61,扣環3藉由活塞61之磁力而固定。活塞61之磁性材料例如使用耐腐蝕性之磁性不鏽鋼。另外,亦可以磁性材料形成驅動環3b,並在活塞61上配置磁鐵。 The buckle 3 is detachably connected to the buckle pressing mechanism 60 . More specifically, the piston 61 is formed of a magnetic material such as metal, and a plurality of magnets 32 are arranged on the top of the drive ring 3b. With these magnets 32 attracting the piston 61 , the buckle 3 is fixed by the magnetic force of the piston 61 . The magnetic material of the piston 61 is, for example, corrosion-resistant magnetic stainless steel. In addition, the drive ring 3 b may be formed of a magnetic material, and a magnet may be disposed on the piston 61 .

扣環3經由連結構件75而連結於球面軸承85。該球面軸承85配置於扣環3之徑方向內側。第三圖係顯示扣環3及連結構件75之俯視圖。如第三圖所示,連結構件75具備:配置於頭本體2之中心部的軸部76;固定於該軸部76之肘套77;及從該肘套77放射狀延伸之複數個(圖式之例係6個)輻條78。 The snap ring 3 is connected to the spherical bearing 85 via the connection member 75 . The spherical bearing 85 is disposed radially inside the retaining ring 3 . The third figure shows the top view of the buckle 3 and the connecting member 75. As shown in the third figure, the coupling member 75 has: a shaft portion 76 disposed at the center of the head body 2; an elbow 77 fixed to the shaft 76; The example of formula is 6) spokes 78.

輻條78之一方端部固定於肘套77,輻條78之另一方端部固定於扣環3的驅動環3b。肘套77、輻條78與驅動環3b一體形成。載體43上固定有複數對驅動銷80、80。各對之驅動銷80、80配置於各輻條78的兩側,載體43之旋轉經由驅動銷80、80傳達至扣環3,藉此頭本體2與扣環3一體旋轉。 One end of the spoke 78 is fixed to the elbow 77 , and the other end of the spoke 78 is fixed to the drive ring 3 b of the buckle 3 . The elbow sleeve 77, the spokes 78 are integrally formed with the drive ring 3b. A plurality of pairs of drive pins 80 , 80 are fixed on the carrier 43 . Each pair of driving pins 80 , 80 is arranged on both sides of each spoke 78 , and the rotation of the carrier 43 is transmitted to the buckle 3 through the driving pins 80 , 80 , whereby the head body 2 and the buckle 3 rotate integrally.

如第二圖所示,軸部76在球面軸承85內縱方向延伸。如第三圖所示,載體43上形成有收容輻條78之複數個放射狀的溝43a,各輻條78在各溝43a內 於縱方向移動自如。連結構件75之軸部76在縱方向移動自如地支撐於配置在頭本體2中央部的球面軸承85。藉由如此構成,連結構件75及固定於此之扣環3可對頭本體2在縱方向移動。再者,扣環3藉由球面軸承85可傾斜移動地支撐。 As shown in FIG. 2 , the shaft portion 76 extends longitudinally inside the spherical bearing 85 . As shown in FIG. 3, a plurality of radial grooves 43a are formed on the carrier 43 to accommodate the spokes 78, and each spoke 78 can move freely in the longitudinal direction in each groove 43a. The shaft portion 76 of the coupling member 75 is supported by a spherical bearing 85 disposed at the center of the head body 2 so as to be movable in the longitudinal direction. With this configuration, the connecting member 75 and the buckle 3 fixed thereto can move in the longitudinal direction relative to the head body 2 . Furthermore, the retaining ring 3 is tiltably supported by a spherical bearing 85 .

以下,更詳細說明球面軸承85。第四圖係球面軸承85及連結構件75之一部分的放大剖面圖。如第四圖所示,軸部76藉由複數個螺絲79而固定於肘套77。軸部76中形成有縱方向延伸之貫穿孔88。該貫穿孔88作用為軸部76對球面軸承85縱方向移動時之排氣孔,藉此,扣環3可對頭本體2在縱方向順利地移動。 Hereinafter, the spherical bearing 85 will be described in more detail. The fourth figure is an enlarged cross-sectional view of a part of the spherical bearing 85 and the connecting member 75 . As shown in FIG. 4 , the shaft portion 76 is fixed to the elbow sleeve 77 by a plurality of screws 79 . A through hole 88 extending in the longitudinal direction is formed in the shaft portion 76 . The through hole 88 acts as an exhaust hole when the shaft portion 76 moves longitudinally to the spherical bearing 85, whereby the clasp 3 can smoothly move longitudinally to the head body 2.

球面軸承85具備:經由連結構件75而連結於扣環3之中間輪91;從上滑動自如地支撐中間輪91之外輪92;及從下滑動自如地支撐中間輪91之內輪93。中間輪91具有比球殼上半部分小之部分的球殼形狀,並夾在外輪92與內輪93之間。 The spherical bearing 85 includes: an intermediate wheel 91 connected to the clasp 3 via a connecting member 75; an outer wheel 92 slidably supporting the intermediate wheel 91 from above; and an inner wheel 93 slidably supporting the intermediate wheel 91 from below. The intermediate wheel 91 has a spherical shell shape of a portion smaller than the upper half of the spherical shell, and is sandwiched between the outer wheel 92 and the inner wheel 93 .

在載體43之中央部形成有凹部43b,外輪92配置於凹部43b內。外輪92在其外周部具有鍔92a,藉由將該鍔92a以螺栓(無圖示)固定於凹部43b之階部,外輪92固定於載體43,並且可對中間輪91及內輪93施加壓力。內輪93配置於凹部43b之底面上,並以在中間輪91之下面與凹部43b的底面之間形成間隙的方式,從下支撐中間輪91。 A recess 43b is formed in the center of the carrier 43, and the outer ring 92 is arranged in the recess 43b. The outer ring 92 has a flange 92a on its outer periphery. By fixing the flange 92a to the step of the recess 43b with bolts (not shown), the outer ring 92 is fixed to the carrier 43, and pressure can be applied to the intermediate ring 91 and the inner ring 93. . The inner ring 93 is disposed on the bottom surface of the concave portion 43b, and supports the intermediate wheel 91 from below so that a gap is formed between the bottom surface of the intermediate wheel 91 and the bottom surface of the concave portion 43b.

外輪92之內面92b、中間輪91之外面91a及內面91b、及內輪93之外面93a由將支點O作為中心之概略半球面而構成。中間輪91之外面91a滑動自如地接觸於外輪92的內面92b,中間輪91之內面91b滑動自如地接觸於內輪93的外面93a。外輪92之內面92b(滑動接觸面)、中間輪91之外面91a及內面91b(滑動接觸面)、及內輪93之外面93a(滑動接觸面)具有比球面之上半部分小的部分球 面形狀。藉由此種構成,中間輪91可對外輪92及內輪93全方向(360°)傾斜移動,且傾斜移動中心之支點O位於比球面軸承85下方。 The inner surface 92b of the outer ring 92, the outer surface 91a and the inner surface 91b of the intermediate wheel 91, and the outer surface 93a of the inner ring 93 are composed of roughly hemispherical surfaces centered on the fulcrum O. The outer surface 91 a of the intermediate wheel 91 is in slidable contact with the inner surface 92 b of the outer wheel 92 , and the inner surface 91 b of the intermediate wheel 91 is in slidable contact with the outer surface 93 a of the inner wheel 93 . The inner surface 92b (sliding contact surface) of the outer ring 92, the outer surface 91a and the inner surface 91b (sliding contact surface) of the intermediate wheel 91, and the outer surface 93a (sliding contact surface) of the inner ring 93 have a portion smaller than the upper half of the spherical surface spherical shape. With this configuration, the intermediate wheel 91 can tilt in all directions (360°) between the outer wheel 92 and the inner wheel 93, and the fulcrum O of the tilting center is located below the spherical bearing 85.

外輪92、中間輪91及內輪93中分別形成有插入軸部76之貫穿孔92c、91c、93b。在外輪92之貫穿孔92c與軸部76之間形成有間隙,同樣地,在內輪93之貫穿孔93b與軸部76之間形成有間隙。中間輪91之貫穿孔91c的直徑比外輪92及內輪93之貫穿孔92c、93b小,軸部76對中間輪91僅可在縱方向移動。因此,連結於軸部76之扣環3實質上不容許在橫方向移動,扣環3之橫方向(水平方向)的位置藉由球面軸承85固定。 Through-holes 92c, 91c, and 93b through which the shaft portion 76 is inserted are formed in the outer ring 92, the intermediate ring 91, and the inner ring 93, respectively. A gap is formed between the through hole 92 c of the outer ring 92 and the shaft portion 76 , and similarly, a gap is formed between the through hole 93 b of the inner ring 93 and the shaft portion 76 . The diameter of the through hole 91c of the intermediate wheel 91 is smaller than the through holes 92c, 93b of the outer wheel 92 and the inner wheel 93, and the shaft portion 76 can only move in the longitudinal direction with respect to the intermediate wheel 91. Therefore, the retaining ring 3 connected to the shaft portion 76 is substantially not allowed to move in the lateral direction, and the position of the retaining ring 3 in the lateral direction (horizontal direction) is fixed by the spherical bearing 85 .

球面軸承85容許扣環3之上下移動及傾斜移動,而限制扣環3在橫方向之移動(水平方向的移動)。晶圓W研磨中,扣環3從晶圓W承受因晶圓W與研磨墊19摩擦產生橫方向之力(朝向晶圓W徑方向外側之力)。該橫方向之力藉由球面軸承85承受。如此,球面軸承85在晶圓W研磨中,發揮承受因晶圓W與研磨墊19摩擦,扣環3從晶圓W承受之橫方向的力(朝向晶圓W徑方向外側之力),而且限制扣環3在橫方向之移動(亦即固定扣環3在水平方向之位置)的支撐機構之功能。 The spherical bearing 85 allows the buckle 3 to move up and down and tilt, and restricts the movement of the buckle 3 in the lateral direction (movement in the horizontal direction). During the grinding of the wafer W, the retaining ring 3 receives from the wafer W a force in the lateral direction (a force directed outward in the radial direction of the wafer W) generated by the friction between the wafer W and the polishing pad 19 . The lateral force is received by the spherical bearing 85 . In this way, the spherical bearing 85 exerts and bears the lateral force (the force directed outward in the radial direction of the wafer W) received by the retaining ring 3 from the wafer W due to the friction between the wafer W and the polishing pad 19 during the polishing of the wafer W, and The function of the supporting mechanism that restricts the movement of the buckle 3 in the horizontal direction (that is, fixes the position of the buckle 3 in the horizontal direction).

第五圖係顯示彈性膜10連結於頭本體2之狀態的概略剖面圖,第六圖係顯示第五圖所示之彈性膜10的一部分之放大剖面圖。彈性膜10具有:作為抵接於晶圓W之抵接面的圓形之抵接部11;垂直地直立設置於抵接部11外周端之圓環狀的側壁15;連接於抵接部11上面之複數個(第五圖係5個)分隔壁14a、14b、14c、14d、14e;及連接於側壁15內面之分隔壁14f。分隔壁14a~14f係同心狀配置之環狀分隔壁。 The fifth figure is a schematic cross-sectional view showing the state where the elastic film 10 is connected to the head body 2, and the sixth figure is an enlarged cross-sectional view showing a part of the elastic film 10 shown in the fifth figure. The elastic film 10 has: a circular abutment portion 11 as an abutment surface abutting against the wafer W; an annular side wall 15 vertically erected on the outer peripheral end of the abutment portion 11; connected to the abutment portion 11 A plurality of above (fifth figure is five) partition walls 14a, 14b, 14c, 14d, 14e; and a partition wall 14f connected to the inner surface of the side wall 15. The partition walls 14a to 14f are annular partition walls arranged concentrically.

如上述,藉由此等6個分隔壁14a~14f而形成7個壓力室(即中央壓力室16a、中間壓力室16a~16e、及邊緣壓力室16f及16g)。抵接部11接觸於晶圓W之背面,亦即接觸於與須研磨之表面的相反側之面,並對研磨墊19按壓晶圓W。 As mentioned above, the 7 pressure chambers (ie, the central pressure chamber 16a, the intermediate pressure chambers 16a-16e, and the edge pressure chambers 16f and 16g) are formed by these 6 partition walls 14a-14f. The abutting portion 11 contacts the back surface of the wafer W, that is, contacts the surface opposite to the surface to be polished, and presses the wafer W against the polishing pad 19 .

邊緣壓力室16g與邊緣壓力室16f藉由概略水平地延伸之分隔壁14f而隔開。由於分隔壁14f連接於側壁15,因此邊緣壓力室16g與邊緣壓力室16f之差壓產生將側壁15鉛直方向壓下的向下之力。換言之,邊緣壓力室16g內之壓力比邊緣壓力室16f內的壓力大時,藉由邊緣壓力室16g、16f間之差壓在側壁15產生向下之力,側壁15將抵接部11之周緣部鉛直方向地按壓於晶圓W的背面。結果,抵接部11之周緣部對研磨墊19按壓晶圓邊緣部。如此,由於側壁15本身向下之力作用於鉛直方向,因此抵接部11之周緣部可對研磨墊19按壓晶圓W邊緣部之狹窄區域。因此,可精密控制晶圓W邊緣部之輪廓。 The edge pressure chamber 16g and the edge pressure chamber 16f are separated by a partition wall 14f extending substantially horizontally. Since the partition wall 14f is connected to the side wall 15, the differential pressure between the edge pressure chamber 16g and the edge pressure chamber 16f generates a downward force that presses the side wall 15 vertically. In other words, when the pressure in the edge pressure chamber 16g is higher than the pressure in the edge pressure chamber 16f, the pressure difference between the edge pressure chambers 16g and 16f will generate a downward force on the side wall 15, and the side wall 15 will press the periphery of the abutting portion 11. The part is pressed against the back surface of the wafer W in the vertical direction. As a result, the peripheral edge of the contact portion 11 presses the edge of the wafer against the polishing pad 19 . In this way, since the downward force of the side wall 15 itself acts in the vertical direction, the peripheral edge of the abutting portion 11 can press the polishing pad 19 against the narrow area of the edge of the wafer W. Therefore, the contour of the edge portion of the wafer W can be precisely controlled.

以下之說明,在不需要區別分隔壁14a~14f時、及統稱分隔壁14a~14f時註記為分隔壁14。此外,就壓力室16a~16g,亦在不需要區別此等時、及統稱此等時註記為壓力室16。 In the following description, when it is not necessary to distinguish between the partition walls 14a to 14f, and when the partition walls 14a to 14f are collectively referred to as the partition walls 14 . In addition, the pressure chambers 16a to 16g are also described as the pressure chamber 16 when there is no need to distinguish them, and when these are collectively referred to.

在從抵接部11之上面延伸的分隔壁14a~14e中,分隔壁14e連接於抵接部11之外周端部,分隔壁14d配置於比分隔壁14e在徑方向內側,分隔壁14c配置於比分隔壁14d在徑方向內側,分隔壁14b配置於比分隔壁14c在徑方向內側,分隔壁14a配置於比分隔壁14b在徑方向內側。以下之說明係將分隔壁14f稱為第一分隔壁14f,將分隔壁14e稱為第二分隔壁14e,將分隔壁14d稱為第三分隔壁14d,將分隔壁14c稱為第四分隔壁14c,將分隔壁14b稱為第五分隔壁14b,將 分隔壁14a稱為第六分隔壁14a。從抵接部11之上面延伸的分隔壁14a~14e從抵接部11之上面延伸於上方。 Of the partition walls 14a to 14e extending from the upper surface of the contact portion 11, the partition wall 14e is connected to the outer peripheral end portion of the contact portion 11, the partition wall 14d is arranged on the inner side in the radial direction than the partition wall 14e, and the partition wall 14c is arranged on the outer peripheral end portion of the contact portion 11. The partition wall 14d is arranged radially inward, the partition wall 14b is arranged radially inside the partition wall 14c, and the partition wall 14a is arranged radially inside the partition wall 14b. In the following description, the partition wall 14f is referred to as the first partition wall 14f, the partition wall 14e is referred to as the second partition wall 14e, the partition wall 14d is referred to as the third partition wall 14d, and the partition wall 14c is referred to as the fourth partition wall. 14c, the partition wall 14b is called the fifth partition wall 14b, and the partition wall 14a is called the sixth partition wall 14a. The partition walls 14 a to 14 e extending from the upper surface of the contact portion 11 extend upward from the upper surface of the contact portion 11 .

抵接部11在周方向以指定間距形成有與形成於第五分隔壁14b與第四分隔壁14c之間的壓力室16c連通之複數個通孔17。第五圖及第六圖僅顯示1個通孔17。在晶圓W接觸於抵接部11之狀態下,形成有複數個通孔17之中間壓力室16c減壓時,晶圓W保持於抵接部11之下面。亦即,晶圓W藉由真空吸引而保持於研磨頭1。再者,晶圓W從研磨墊19離開之狀態下,在形成有複數個通孔17之中間壓力室16c中供給流體時,則從研磨頭1釋放晶圓W。通孔17亦可取代中間壓力室16c而形成於其他壓力室。此時,晶圓W之真空吸引及釋放係藉由控制形成通孔17之壓力室的壓力來進行。 A plurality of through holes 17 communicating with the pressure chamber 16c formed between the fifth partition wall 14b and the fourth partition wall 14c are formed in the abutting portion 11 at predetermined intervals in the circumferential direction. The fifth and sixth figures only show one through hole 17 . While the wafer W is in contact with the contact portion 11 , when the pressure in the intermediate pressure chamber 16 c formed with a plurality of through holes 17 is reduced, the wafer W is held on the lower surface of the contact portion 11 . That is, the wafer W is held by the polishing head 1 by vacuum suction. Furthermore, when the fluid is supplied to the intermediate pressure chamber 16 c in which the plurality of through holes 17 are formed in the state where the wafer W is separated from the polishing pad 19 , the wafer W is released from the polishing head 1 . The through hole 17 may be formed in another pressure chamber instead of the intermediate pressure chamber 16c. At this time, the vacuum suction and release of the wafer W is performed by controlling the pressure of the pressure chamber in which the through hole 17 is formed.

本實施形態,從抵接部11上面延伸之分隔壁14a~14e係構成傾斜於徑方向內側的傾斜分隔壁,且皆具有直線狀之形狀(直線形狀)。以下,說明位於最外側之分隔壁14e的構成,作為傾斜分隔壁之分隔壁14a~14e的代表。 In this embodiment, the partition walls 14a to 14e extending from the upper surface of the contact portion 11 constitute inclined partition walls inclined radially inward, and all have a linear shape (linear shape). Hereinafter, the structure of the partition wall 14e positioned on the outermost side will be described as a representative of the partition walls 14a to 14e that are inclined partition walls.

傾斜分隔壁之第二分隔壁14e從抵接部11之外周端部朝向徑方向內側的上方剖面觀看時係直線狀延伸。第二分隔壁14e由從抵接部11上面在徑方向內側且上方直線狀延伸之分隔壁本體55;及形成於該分隔壁本體55前端之環狀的密封突起54而構成。本實施形態之密封突起54具有圓狀之剖面形狀,分隔壁本體55在密封突起54之切線方向延伸。 The second partition wall 14e of the inclined partition wall extends linearly when viewed in cross section from the outer peripheral end portion of the contact portion 11 toward the radially inner side upward. The second partition wall 14e is composed of a partition wall main body 55 linearly extending radially inward and upward from the upper surface of the contact portion 11; and an annular sealing protrusion 54 formed at the front end of the partition wall main body 55. The sealing protrusion 54 of this embodiment has a circular cross-sectional shape, and the partition wall body 55 extends in the tangential direction of the sealing protrusion 54 .

第二分隔壁14e從其下端部(基端部)至上端部的整體,在徑方向內側以指定之角度θ傾斜,而且延伸於上方。第二分隔壁14e之下端部連接於抵接部11,第二分隔壁14e之上端部(即密封突起54)連接於後述之頭本體2的連結環23d。 The entirety of the second partition wall 14e from the lower end portion (base end portion) to the upper end portion is inclined at a predetermined angle θ on the inner side in the radial direction, and extends upward. The lower end of the second partition wall 14e is connected to the contact portion 11, and the upper end of the second partition wall 14e (that is, the sealing protrusion 54) is connected to the connecting ring 23d of the head body 2 described later.

分隔壁14e對底面之傾斜角度θ宜設定在20°~70°之範圍。傾斜角度θ比20°小時,若供給至鄰接之壓力室16的流體壓力差大時,可能鄰接之各分隔壁14接觸。傾斜角度θ比70°大時,可能藉由分隔壁14而阻礙彈性膜10在鉛直方向之伸縮(即彈性膜10之變形)。此時,由於彈性膜10無法依供給至壓力室16之流體壓力而適切伸縮,因此每個晶圓W區域調整施加於晶圓W之按壓力可能有困難。 The inclination angle θ of the partition wall 14e to the bottom surface is preferably set in the range of 20°~70°. If the inclination angle θ is smaller than 20°, if the pressure difference of the fluid supplied to the adjacent pressure chambers 16 is large, the adjacent partition walls 14 may contact each other. When the inclination angle θ is larger than 70°, the partition wall 14 may hinder the expansion and contraction of the elastic film 10 in the vertical direction (that is, the deformation of the elastic film 10 ). At this time, since the elastic film 10 cannot properly expand and contract according to the fluid pressure supplied to the pressure chamber 16 , it may be difficult to adjust the pressing force applied to the wafer W for each region of the wafer W.

如第六圖所示,構成傾斜分隔壁之分隔壁14a~14e由於相互具有相同形狀,因此分隔壁14a~14e相互平行地延伸。更具體而言,分隔壁14a~14e之分隔壁本體55相互平行。如第五圖所示,在第六分隔壁14a與第五分隔壁14b之間形成壓力室16b,在第五分隔壁14b與第四分隔壁14c之間形成壓力室16c,在第四分隔壁14c與第三分隔壁14d之間形成壓力室16d,在第三分隔壁14d與第二分隔壁14e之間形成壓力室16e,在第二分隔壁14e與第一分隔壁14f之間形成邊緣壓力室16f。 As shown in FIG. 6 , since the partition walls 14 a to 14 e constituting the inclined partition walls have the same shape, the partition walls 14 a to 14 e extend parallel to each other. More specifically, the partition wall bodies 55 of the partition walls 14 a - 14 e are parallel to each other. As shown in the fifth figure, a pressure chamber 16b is formed between the sixth partition wall 14a and the fifth partition wall 14b, a pressure chamber 16c is formed between the fifth partition wall 14b and the fourth partition wall 14c, and a pressure chamber 16c is formed between the fourth partition wall 14a. A pressure chamber 16d is formed between 14c and the third partition wall 14d, a pressure chamber 16e is formed between the third partition wall 14d and the second partition wall 14e, and an edge pressure is formed between the second partition wall 14e and the first partition wall 14f. Room 16f.

再者,第五圖及第六圖所示之彈性膜10中,構成傾斜分隔壁之分隔壁14a~14e相互平行地延伸。亦即,分隔壁14a~14e之分隔壁本體55的傾斜角度θ相同。此時,由於可以極為狹窄之間隔配置鄰接的分隔壁14,因此使壓力室16之徑方向的寬度極為狹窄。 Furthermore, in the elastic film 10 shown in FIG. 5 and FIG. 6 , the partition walls 14 a to 14 e constituting the inclined partition walls extend parallel to each other. That is, the inclination angles θ of the partition wall bodies 55 of the partition walls 14 a to 14 e are the same. In this case, since the adjacent partition walls 14 can be arranged at extremely narrow intervals, the radial width of the pressure chamber 16 is extremely narrow.

構成傾斜分隔壁之分隔壁14a~14e相互不接觸時,分隔壁14a~14e亦可相互概略平行地延伸。更具體而言,構成傾斜分隔壁之分隔壁14a~14e的分隔壁本體55之傾斜角度θ亦可相互有某種程度差異。本說明書中,「概略平行」之表現,在將構成傾斜分隔壁之分隔壁14中的1個分隔壁14之傾斜角度(權宜上說明,係將該傾斜角度稱為基準傾斜角度θs)作為基準時,是指構成傾斜分隔壁之其他分隔壁14的傾斜角度θ對基準傾斜角度θs在±10°的範圍內(即θs-10≦θ≦ θs+10)。例如,分隔壁14a之傾斜角度係45°,且將分隔壁14a之傾斜角度作為基準傾斜角度θs時,分隔壁14b~14e之基準傾斜角度θs對分隔壁14a之基準傾斜角度θs’(=45°)在±10°的範圍(即35°~55°的範圍)。 When the partition walls 14a to 14e constituting the inclined partition walls are not in contact with each other, the partition walls 14a to 14e may extend approximately parallel to each other. More specifically, the inclination angles θ of the partition wall bodies 55 constituting the partition walls 14 a to 14 e of the inclined partition walls may be different from each other to some extent. In this specification, the expression of "roughly parallel" is based on the inclination angle of one of the partition walls 14 constituting the inclined partition walls (expediently, this inclination angle is referred to as the reference inclination angle θs). , means that the inclination angle θ of the other partition walls 14 constituting the inclined partition walls is within the range of ±10° to the reference inclination angle θs (ie, θs-10≦θ≦θs+10). For example, the inclination angle of the partition wall 14a is 45°, and when the inclination angle of the partition wall 14a is used as the reference inclination angle θs, the reference inclination angle θs of the partition walls 14b~14e is relative to the reference inclination angle θs' of the partition wall 14a (=45 °) in the range of ±10° (that is, the range of 35°~55°).

本實施形態之側壁15係由:從抵接部11之外周端垂直地延伸的垂直部22;形成於上端之水平部28;及形成於垂直部22之上端與水平部28的外側端部之間,且在徑方向內側凸狀彎曲之彎曲部24而構成。此外,在水平部28之前端(內側端)亦與分隔壁14a~14f同樣地形成有密封突起54。 The side wall 15 of this embodiment is composed of: a vertical portion 22 extending vertically from the outer peripheral end of the contact portion 11; a horizontal portion 28 formed at the upper end; Between, and the curved portion 24 that is convexly curved on the inner side in the radial direction is formed. Moreover, the sealing protrusion 54 is formed also in the front end (inside end) of the horizontal part 28 similarly to partition walls 14a-14f.

第一分隔壁14f從側壁15之垂直部22的上端部朝向徑方向內側水平地延伸。分隔壁14f亦與分隔壁14a~14e同樣整體具有直線形狀,並由直線狀延伸之分隔壁本體55;及形成於該分隔壁本體55前端之環狀的密封突起54而構成。不過,分隔壁14f之分隔壁本體55係從側壁15之內面朝向徑方向內側而水平地延伸。 The first partition wall 14 f extends horizontally from the upper end portion of the vertical portion 22 of the side wall 15 toward the inner side in the radial direction. The partition wall 14f also has a linear shape as a whole like the partition walls 14a-14e, and is composed of a partition wall main body 55 extending linearly and an annular sealing protrusion 54 formed at the front end of the partition wall main body 55. However, the partition wall main body 55 of the partition wall 14f extends horizontally from the inner surface of the side wall 15 toward the inner side in the radial direction.

以下進一步說明由第一分隔壁14f、側壁15之垂直部22、第二分隔壁14e構成之邊緣壓力室16f。第一分隔壁14f與第二分隔壁14e從剖面觀看皆為直線狀形狀(直線形狀),分隔壁本體55中除去其端部,並無曲折部位或彎曲部位。此外,側壁15之垂直部22從剖面觀看亦為直線狀形狀(直線形狀),且垂直部22中並無曲折部位或彎曲部位。因而,第一分隔壁14f之延長線、側壁15之垂直部22、及第二分隔壁14e之延長線從剖面觀看係構成三角形T。該三角形T之1個頂點C1在徑方向的位置成為彈性膜10之抵接部11的外周端。 The edge pressure chamber 16f formed by the first partition wall 14f, the vertical portion 22 of the side wall 15, and the second partition wall 14e will be further described below. Both the first partition wall 14f and the second partition wall 14e have a linear shape (linear shape) when viewed in cross-section, and the partition wall body 55 does not have a curved portion or a bent portion except the end portion thereof. In addition, the vertical portion 22 of the side wall 15 also has a linear shape (linear shape) when viewed in cross section, and the vertical portion 22 has no bending or bending portion. Therefore, the extension line of the first partition wall 14f, the vertical portion 22 of the side wall 15, and the extension line of the second partition wall 14e form a triangle T when viewed in section. One vertex C1 of the triangle T is positioned in the radial direction as the outer peripheral end of the contact portion 11 of the elastic membrane 10 .

邊緣壓力室16f中,第一分隔壁14f與第二分隔壁14e之間隔從抵接部11的徑方向內側朝向外側逐漸擴大。此外,側壁15之垂直部22,亦即至少在構成邊緣壓力室16f之部分,外周面係平坦並無階差。 In the edge pressure chamber 16f, the distance between the first partition wall 14f and the second partition wall 14e gradually increases from the inside toward the outside in the radial direction of the contact portion 11 . In addition, the vertical portion 22 of the side wall 15, that is, at least the portion constituting the edge pressure chamber 16f, has a flat outer peripheral surface without any level difference.

形成於抵接部11上面之分隔壁14a~14e中,最外側之分隔壁的第二分隔壁14e連接於抵接部11的外周端部。本說明書中,「外周端部」之用語,是指包含抵接部11之外周端,還包含從此處之若干內側部分的範圍。具體而言,如第六圖之剖面觀看,第二分隔壁14e之上面與抵接部11的上面相交之點、與側壁15內面與抵接部11上面相交之點間的距離(邊緣按壓寬)d為0~8mm時,第二分隔壁14e連接於抵接部11之外周端部,或是從抵接部11之外周端部延伸者。另外,本實施形態之邊緣按壓寬d係設定成0.5~1.5mm。 Among the partition walls 14 a to 14 e formed on the upper surface of the contact portion 11 , the second partition wall 14 e which is the outermost partition wall is connected to the outer peripheral end portion of the contact portion 11 . In this specification, the term "outer peripheral end" refers to the range including the outer peripheral end of the contact portion 11 and some inner parts therefrom. Specifically, as seen in the cross section of the sixth figure, the distance between the point where the top of the second partition wall 14e intersects the top of the abutting portion 11 and the point where the inner surface of the side wall 15 intersects the top of the abutting portion 11 (edge pressing When the width d is 0 to 8 mm, the second partition wall 14 e is connected to the outer peripheral end of the abutting portion 11 , or is extended from the outer peripheral end of the abutting portion 11 . In addition, the edge pressing width d of this embodiment is set at 0.5-1.5 mm.

另外,彈性膜10藉由其彈性未必能自律地維持第五圖及第六圖所示之形狀,不過本說明書中,在說明彈性膜10之形狀時,是指安裝於頭本體2用於研磨狀態時的形狀。 In addition, due to its elasticity, the elastic film 10 may not be able to maintain the shape shown in the fifth and sixth figures autonomously. However, in this specification, when describing the shape of the elastic film 10, it means that it is installed on the head body 2 for grinding. state shape.

分隔壁14a~14f、側壁15、及具有抵接部11之彈性膜10可使用金屬型等而一體成型。 The partition walls 14a to 14f, the side walls 15, and the elastic film 10 having the abutting portion 11 can be integrally formed using a metal mold or the like.

如上述,在各壓力室16a~16f上,從壓力調整裝置65通過經由旋轉接頭82而延伸之流體管線73(參照第一圖及第二圖)分別供給流體。第五圖僅顯示用於從壓力調整裝置65供給流體至壓力室16d之流體管線73的一部分。 As described above, fluid is supplied from the pressure regulator 65 to each of the pressure chambers 16 a to 16 f through the fluid line 73 (see the first and second drawings) extending through the rotary joint 82 . The fifth figure shows only a portion of the fluid line 73 for supplying fluid from the pressure regulating device 65 to the pressure chamber 16d.

第五圖所示之流體管線73的一部分藉由:形成於間隔物42之貫穿孔73a;形成於載體43,並與貫穿孔73a連通之貫穿孔73b;及形成於後述之連結環23,並連通於貫穿孔73b的貫穿孔73c而構成。此等貫穿孔73a、73b、73c具有相同直徑。在形成於連結環23之貫穿孔73c的上端形成有環狀之凹部,且在該凹部配置密封連結環23與載體43間之間隙的密封構件(例如O-形環)74。藉由該密封構件74防止流經貫穿孔73b、73c之流體從連結環23與載體43之間的間隙洩漏。 A part of the fluid line 73 shown in the fifth figure is formed by: the through hole 73a formed in the spacer 42; the through hole 73b formed in the carrier 43 and communicated with the through hole 73a; and the connecting ring 23 formed in the following, and The through hole 73c communicates with the through hole 73b. These through holes 73a, 73b, 73c have the same diameter. An annular recess is formed at the upper end of the through hole 73 c formed in the connecting ring 23 , and a sealing member (for example, an O-ring) 74 for sealing the gap between the connecting ring 23 and the carrier 43 is arranged in the recess. The sealing member 74 prevents the fluid flowing through the through holes 73 b and 73 c from leaking from the gap between the connecting ring 23 and the carrier 43 .

同樣地,在形成於載體43之貫穿孔73b的上端形成有環狀的凹部,在該凹部配置密封載體43與間隔物42間之間隙的密封構件(例如O-形環)44。藉由該密封構件44防止流經貫穿孔73a、73b之流體從間隔物42與載體43之間的間隙洩漏。 Similarly, an annular recess is formed at the upper end of the through hole 73 b formed in the carrier 43 , and a sealing member (for example, an O-ring) 44 for sealing the gap between the carrier 43 and the spacer 42 is arranged in the recess. The sealing member 44 prevents the fluid flowing through the through holes 73a, 73b from leaking from the gap between the spacer 42 and the carrier 43 .

頭本體2進一步具有連接分隔壁14a~14f及側壁15之複數個連結環23a~23f。連結環23a配置於第六分隔壁14a與第五分隔壁14b之間,以下說明時稱為第六連結環23a。連結環23b配置於第五分隔壁14b與第四分隔壁14c之間,以下說明時稱為第五連結環23b。連結環23c配置於第四分隔壁14c與第三分隔壁14d之間,以下說明時稱為第四連結環23c。連結環23d配置於第三分隔壁14d與第二分隔壁14e之間,以下說明時稱為第三連結環23d。 The head body 2 further has a plurality of connecting rings 23 a to 23 f connecting the partition walls 14 a to 14 f and the side wall 15 . The connection ring 23a is arranged between the sixth partition wall 14a and the fifth partition wall 14b, and will be referred to as a sixth connection ring 23a in the following description. The connection ring 23b is arranged between the fifth partition wall 14b and the fourth partition wall 14c, and is referred to as a fifth connection ring 23b in the following description. The connection ring 23c is arranged between the fourth partition wall 14c and the third partition wall 14d, and will be referred to as a fourth connection ring 23c in the following description. The connection ring 23d is arranged between the third partition wall 14d and the second partition wall 14e, and is referred to as a third connection ring 23d in the following description.

連結環23e配置於第二分隔壁14e與第一分隔壁14f之間,以下說明時稱為第二連結環23e。連結環23f配置於第一分隔壁14f與側壁15之彎曲部24及水平部28之間,以下說明時稱為第一連結環23f。如此,各連結環23a~23e配置於鄰接的分隔壁14之間。 The connection ring 23e is arrange|positioned between the 2nd partition wall 14e and the 1st partition wall 14f, and is called the 2nd connection ring 23e in the following description. The connecting ring 23f is disposed between the first partition wall 14f and the curved portion 24 and the horizontal portion 28 of the side wall 15, and is referred to as a first connecting ring 23f in the following description. In this way, each connection ring 23a-23e is arrange|positioned between the partition walls 14 adjacent.

本實施形態由於第六分隔壁14a亦構成傾斜分隔壁,因此頭本體2具有連結該分隔壁14a之連結環23g。以下說明時,將連結環23g稱為追加連結環23g。 In this embodiment, since the sixth partition wall 14a also constitutes an inclined partition wall, the head body 2 has a connecting ring 23g connecting the partition wall 14a. In the following description, the connecting ring 23g is referred to as an additional connecting ring 23g.

第六連結環23a、第五連結環23b、第四連結環23c、第三連結環23d、第二連結環23e、及第一連結環23f之構成相同。以下,將第四連結環23c作為代表例詳細說明其構造。 The configurations of the sixth connecting ring 23a, the fifth connecting ring 23b, the fourth connecting ring 23c, the third connecting ring 23d, the second connecting ring 23e, and the first connecting ring 23f are the same. Hereinafter, the structure of the fourth connection ring 23c will be described in detail as a representative example.

第七A圖係第四連結環23c之剖面圖,第七B圖係第七A圖之A線箭頭方向觀看圖。第七A圖係以虛線(點線)描繪上述密封構件74。第四連結環23c 具有:對頭本體2之載體43垂直延伸的環垂直部50;及與該環垂直部50從該環垂直部50延伸於徑方向外側且傾斜於下方的環傾斜部51。環傾斜部51之內周面51a對與彈性膜10之抵接部11平行的水平面P之傾斜角度θ’,比構成傾斜分隔壁之第四分隔壁14c的傾斜角度θ(參照第六圖)小,環傾斜部51之外周面51b對水平面P的傾斜角度θ",比構成傾斜分隔壁之第二分隔壁14e的傾斜角度θ大。 The seventh A figure is a cross-sectional view of the fourth connecting ring 23c, and the seventh B figure is a view in the direction of the A line arrow in the seventh A figure. The seventh figure A depicts the above-mentioned sealing member 74 with broken lines (dotted lines). The fourth connecting ring 23c has: a ring vertical portion 50 extending vertically against the carrier 43 of the head body 2; and a ring inclined portion 51 extending radially outward from the ring vertical portion 50 and inclined downward. The inclination angle θ' of the inner peripheral surface 51a of the ring inclined portion 51 with respect to the horizontal plane P parallel to the contact portion 11 of the elastic film 10 is greater than the inclination angle θ' of the fourth partition wall 14c constituting the inclined partition wall (see FIG. 6 ). Small, the inclination angle θ" of the outer peripheral surface 51b of the ring inclined portion 51 with respect to the horizontal plane P is larger than the inclination angle θ" of the second partition wall 14e constituting the inclined partition wall.

環傾斜部51之外周面51b與環傾斜部51的內周面51a在環傾斜部51之前端51c連接。因此,環傾斜部51具有朝向環傾斜部51之前端51c而逐漸變細的剖面形狀。連接內周面51a與外周面51b之環傾斜部51的前端51c具有曲面構成之剖面形狀(例如,半圓狀之剖面形狀)。再者,第四連結環23c具有從第四連結環23c之環傾斜部51的內周面51a伸展至外周面51b的貫穿孔51d。再者,在環傾斜部51之外周面51b形成有在該外周面51b全周延伸之環狀的密封溝51e。 The outer peripheral surface 51 b of the ring inclined portion 51 is connected to the inner peripheral surface 51 a of the ring inclined portion 51 at a front end 51 c of the ring inclined portion 51 . Therefore, the ring inclined portion 51 has a cross-sectional shape that tapers toward the front end 51 c of the ring inclined portion 51 . The front end 51c of the ring inclined portion 51 connecting the inner peripheral surface 51a and the outer peripheral surface 51b has a curved cross-sectional shape (for example, a semicircular cross-sectional shape). Furthermore, the fourth connecting ring 23c has a through hole 51d extending from the inner peripheral surface 51a of the ring inclined portion 51 of the fourth connecting ring 23c to the outer peripheral surface 51b. Furthermore, an annular seal groove 51 e extending over the entire circumference of the outer peripheral surface 51 b is formed on the outer peripheral surface 51 b of the ring inclined portion 51 .

如第七B圖所示,在第四連結環23c之環傾斜部51的內周面51a上形成有:在該內周面51a之周方向延伸的複數條橫溝63;及使鄰接之橫溝63相互連通的複數條縱溝64。本實施形態之流體管線73的貫穿孔73c係在形成於環傾斜部51之內周面51a的橫溝63開口,貫穿孔51d則在與流體管線73開口之橫溝63不同的橫溝63開口。 As shown in the seventh B figure, on the inner peripheral surface 51a of the ring inclined portion 51 of the fourth connecting ring 23c, a plurality of transverse grooves 63 extending in the circumferential direction of the inner peripheral surface 51a are formed; The plurality of vertical grooves 64 in which the grooves 63 communicate with each other. The through hole 73c of the fluid line 73 in this embodiment opens at the transverse groove 63 formed on the inner peripheral surface 51a of the ring slope 51, and the through hole 51d opens at a transverse groove 63 different from the transverse groove 63 where the fluid line 73 opens. .

流體管線73之貫穿孔73c及貫穿孔51d亦可分別在形成於環傾斜部51之內周面51a的縱溝64開口。在第四連結環23c之環傾斜部51的外周面51b上形成有:在該外周面51b之周方向延伸的複數條橫溝;及使鄰接之橫溝相互連通的複數條縱溝,不過無圖示。貫穿孔51d宜在形成於環傾斜部51之外周面51b的橫溝或縱溝開口。 The through-hole 73c and the through-hole 51d of the fluid line 73 may open in the longitudinal groove 64 formed in the inner peripheral surface 51a of the ring inclined part 51, respectively. Formed on the outer peripheral surface 51b of the ring inclined portion 51 of the fourth connecting ring 23c are: a plurality of transverse grooves extending in the circumferential direction of the outer peripheral surface 51b; and a plurality of longitudinal grooves communicating adjacent transverse grooves, but without icon. The through hole 51d is preferably opened in a horizontal groove or a vertical groove formed on the outer peripheral surface 51b of the ring inclined portion 51 .

第六圖所示之分隔壁14的密封突起54嵌入形成於環傾斜部51之外周面51b的密封溝51e。將彈性膜10連結於頭本體2時,密封突起54藉由位於該密封突起54之徑方向外側的連結環23之環傾斜部51的內周面51a而按壓於密封溝51e之底面。例如,形成於第五分隔壁14b前端之密封突起54嵌入形成於第六連結環23a之環傾斜部51的外周面51b之密封溝51e,並藉由第五連結環23b之環傾斜部51的內周面51a而按壓於第六連結環23a之密封溝51e的底面。 The seal protrusion 54 of the partition wall 14 shown in FIG. 6 fits into the seal groove 51e formed on the outer peripheral surface 51b of the ring inclined portion 51 . When the elastic membrane 10 is connected to the head body 2, the sealing protrusion 54 is pressed against the bottom surface of the sealing groove 51e by the inner peripheral surface 51a of the ring inclined portion 51 of the connecting ring 23 located outside the sealing protrusion 54 in the radial direction. For example, the sealing protrusion 54 formed at the front end of the fifth partition wall 14b fits into the sealing groove 51e formed on the outer peripheral surface 51b of the ring inclined portion 51 of the sixth connecting ring 23a, and is formed by the ring inclined portion 51 of the fifth connecting ring 23b. The inner peripheral surface 51a is pressed against the bottom surface of the sealing groove 51e of the sixth connecting ring 23a.

藉此,第五分隔壁14b與第六連結環23a的環傾斜部51間之間隙;及第五分隔壁14b與第五連結環23b之環傾斜部51的外周面51b間之間隙被密封。藉由此種構成,防止供給至各壓力室16a~16e之流體從各壓力室16a~16e洩漏。如此,分隔壁14中之密封突起54係藉由與頭本體2嚙合,並將分隔壁14固定於頭本體2,而使彈性膜10支撐於頭本體2者,且相當於本發明之嚙合部,特別是第一分隔壁14f之密封突起54相當於本發明的第一嚙合部,第二分隔壁14e之密封突起54相當於本發明的第二嚙合部。 Thereby, the gap between the fifth partition wall 14b and the ring inclined portion 51 of the sixth connecting ring 23a and the gap between the fifth partition wall 14b and the outer peripheral surface 51b of the ring inclined portion 51 of the fifth connecting ring 23b are sealed. With such a structure, the fluid supplied to each pressure chamber 16a-16e is prevented from leaking from each pressure chamber 16a-16e. In this way, the sealing protrusion 54 in the partition wall 14 engages with the head body 2 and fixes the partition wall 14 to the head body 2 so that the elastic film 10 is supported on the head body 2, and is equivalent to the engagement portion of the present invention. In particular, the sealing protrusion 54 of the first partition wall 14f corresponds to the first engaging portion of the present invention, and the sealing protrusion 54 of the second partition wall 14e corresponds to the second engaging portion of the present invention.

如第八圖所示,亦可在連結環23之環傾斜部51的內周面51a上形成與嵌入密封溝51e之密封突起54相對的環狀按壓突起51f。按壓突起51f在環傾斜部51之內周面51a的全周延伸。藉由按壓突起51f可利用密封溝51e之底面以強按壓力按壓密封突起54。結果,可更有效防止供給至各壓力室16a~16e之流體從各壓力室16a~16e洩漏。 As shown in FIG. 8, an annular pressing protrusion 51f facing the sealing protrusion 54 embedded in the sealing groove 51e may also be formed on the inner peripheral surface 51a of the ring inclined portion 51 of the connecting ring 23. The pressing protrusion 51 f extends over the entire circumference of the inner peripheral surface 51 a of the ring inclined portion 51 . By pressing the protrusion 51f, the bottom surface of the seal groove 51e can be used to press the sealing protrusion 54 with a strong pressing force. As a result, the fluid supplied to the respective pressure chambers 16a to 16e can be more effectively prevented from leaking from the respective pressure chambers 16a to 16e.

如第五圖所示,分隔壁14a~14f分別僅以密封突起54而與連結環23a~23f。亦即,在具有朝向前端51c而逐漸變細之剖面形狀的環傾斜部51、與密封突起54以外的分隔壁14之間形成間隙。藉由該間隙對各壓力室16a~16f供給加壓流體時,容許分隔壁14a~14f在徑方向移動(亦即,將密封突起54作為支點而 轉動)。結果,由於可依供給至壓力室16a~16f之流體壓力使彈性膜10順利膨脹,因此可精密調整研磨輪廓。 As shown in FIG. 5 , the partition walls 14 a to 14 f are connected to the connection rings 23 a to 23 f only by the sealing protrusions 54 , respectively. That is, a gap is formed between the ring inclined portion 51 having a cross-sectional shape tapered toward the front end 51 c and the partition wall 14 other than the seal protrusion 54 . When the pressurized fluid is supplied to each of the pressure chambers 16a to 16f through the gap, the partition walls 14a to 14f are allowed to move in the radial direction (that is, to rotate using the sealing protrusion 54 as a fulcrum). As a result, since the elastic film 10 can be smoothly expanded according to the fluid pressure supplied to the pressure chambers 16a to 16f, the grinding profile can be finely adjusted.

如上述,對各壓力室16a~16f供給加壓流體時彈性膜10膨脹,分隔壁14a~14e與抵接部11之連接部分亦在徑方向移動。但是,分隔壁14a~14e之密封突起54以外的部分,由於在分隔壁14a~14e與連結環23a~23e之間形成有上述間隙,因此在分隔壁14a~14e之徑方向某種程度的移動不受連結環23a~23f的妨礙。因此,可依供給至各壓力室16a~16f之流體壓力使彈性膜10膨脹。 As mentioned above, when the pressurized fluid is supplied to each pressure chamber 16a-16f, the elastic membrane 10 expands, and the connection part of the partition walls 14a-14e and the contact part 11 also moves in the radial direction. However, the portions of the partition walls 14a to 14e other than the sealing protrusions 54 move to some extent in the radial direction of the partition walls 14a to 14e due to the above-mentioned gaps formed between the partition walls 14a to 14e and the connecting rings 23a to 23e. Not hindered by connecting rings 23a~23f. Therefore, the elastic film 10 can be inflated according to the fluid pressure supplied to each of the pressure chambers 16a to 16f.

分別供給至鄰接之壓力室16的流體有壓力差時,劃分此等壓力室16之分隔壁會在徑方向變形。但是,由於分隔壁14之徑方向的變形受到連結環23之環傾斜部51的內周面51a或外周面51b限制,因此可有效防止分隔壁14與抵接部11上面接觸,同時有效防止鄰接之各分隔壁14相互接觸。本實施形態連結環23之環傾斜部51的前端51c具有曲面構成之剖面形狀。因此,分隔壁14接觸於環傾斜部51之前端51c時,亦可防止分隔壁14之損傷。 When there is a pressure difference between the fluids supplied to the adjacent pressure chambers 16 , the partition walls dividing these pressure chambers 16 are deformed in the radial direction. However, since the deformation of the partition wall 14 in the radial direction is limited by the inner peripheral surface 51a or the outer peripheral surface 51b of the ring inclined portion 51 of the connecting ring 23, it can effectively prevent the partition wall 14 from contacting the abutting portion 11, and effectively prevent the abutment. The partition walls 14 are in contact with each other. The front end 51c of the ring inclined portion 51 of the coupling ring 23 in this embodiment has a cross-sectional shape formed of a curved surface. Therefore, when the partition wall 14 is in contact with the front end 51c of the ring inclined portion 51, damage to the partition wall 14 can also be prevented.

如上述,連結環23具有:形成於環傾斜部51之內周面51a及外周面51b的橫溝63與縱溝64;以及從內周面51a延伸至外周面51b,且在橫溝63(或縱溝64)開口之貫穿孔51d。再者,供給至各壓力室16a~16f之流體流動的流體管線73之貫穿孔73c(參照第五圖)係開口於橫溝63。 As mentioned above, the connecting ring 23 has: the transverse groove 63 and the longitudinal groove 64 formed on the inner peripheral surface 51a and the outer peripheral surface 51b of the ring inclined portion 51; Or the through hole 51d of the opening of the vertical groove 64). Moreover, the through-hole 73c (refer to FIG. 5 ) of the fluid line 73 that supplies the fluid flowing to each of the pressure chambers 16 a to 16 f is opened in the lateral groove 63 .

因此,藉由分別供給至鄰接之壓力室16的流體之壓力差,即使分隔壁14接觸於連結環23之環傾斜部51的內周面51a及/或外周面51b,仍可將在流體管線73中流動之流體經由形成於環傾斜部51之橫溝63與縱溝64、及貫穿孔51d而迅速且順利地供給至壓力室16。結果,即使在分隔壁14接觸於連結環23之環傾 斜部51的內周面51a及/或外周面51b之狀態下,仍可使從流體管線73供給之流體壓力迅速作用於抵接部11。 Therefore, even if the partition wall 14 is in contact with the inner peripheral surface 51a and/or the outer peripheral surface 51b of the ring inclined portion 51 of the connecting ring 23 due to the pressure difference of the fluids respectively supplied to the adjacent pressure chambers 16, it is still possible to keep the flow in the fluid line. The fluid flowing in 73 is quickly and smoothly supplied to the pressure chamber 16 through the horizontal groove 63 and the vertical groove 64 formed in the ring inclined portion 51 and the through hole 51d. As a result, even when the partition wall 14 is in contact with the inner peripheral surface 51a and/or the outer peripheral surface 51b of the ring inclined portion 51 of the connecting ring 23, the fluid pressure supplied from the fluid line 73 can be quickly applied to the abutting portion 11. .

如第五圖所示,環傾斜部51之前端51c宜位於比構成傾斜分隔壁之分隔壁14a~14e的中間點CP下方。如第六圖所示,中間點CP位於以指定之傾斜角度θ而延伸於上方的分隔壁14a~14e之中央。亦即,分隔壁14a~14e之中間點CP與抵接部11上面之間的距離L1,等於中間點CP與分隔壁14a~14e前端之間的距離L2。 As shown in FIG. 5 , the front end 51c of the ring inclined portion 51 is preferably located below the midpoint CP of the partition walls 14a to 14e constituting the inclined partition walls. As shown in FIG. 6 , the middle point CP is located at the center of the partition walls 14 a to 14 e extending above at a predetermined inclination angle θ. That is, the distance L1 between the middle point CP of the partition walls 14a-14e and the upper surface of the contact portion 11 is equal to the distance L2 between the middle point CP and the front ends of the partition walls 14a-14e.

為了使晶圓W吸附於彈性膜10之基板保持面10a(抵接部11的下面),而將壓力室(例如,中間壓力室16c)中形成真空時,彈性膜10朝向頭本體2變形。彈性膜10之變形量大時,發生於晶圓W之應力增加,會造成形成於晶圓W上之電子迴路損傷,或是晶圓W產生裂紋。本實施形態由於環傾斜部51之前端51c比分隔壁14a~14c之中間點CP位於下方,因此抵接部11之上面與環傾斜部51的前端51c間之距離縮短。 When vacuum is formed in the pressure chamber (for example, the intermediate pressure chamber 16 c ) to attract the wafer W to the substrate holding surface 10 a (below the abutting portion 11 ) of the elastic membrane 10 , the elastic membrane 10 deforms toward the head body 2 . When the amount of deformation of the elastic film 10 is large, the stress on the wafer W increases, causing damage to the electronic circuits formed on the wafer W, or cracks in the wafer W. In this embodiment, since the front end 51c of the ring slope 51 is located below the middle point CP of the partition walls 14a-14c, the distance between the upper surface of the abutting portion 11 and the front end 51c of the ring slope 51 is shortened.

因此,將晶圓W吸附於彈性膜10之基板保持面10a(參照第二圖)時,彈性膜10接觸於環傾斜部51之前端51c,可減少彈性膜10之變形量。結果,可減少發生於晶圓W上的應力。再者,因為環傾斜部51之前端51c具有曲面構成的剖面形狀,所以當彈性膜10接觸到環傾斜部51之前端51c時,可防止彈性膜10損傷。 Therefore, when the wafer W is adsorbed on the substrate holding surface 10a of the elastic film 10 (see FIG. 2 ), the elastic film 10 contacts the front end 51c of the ring inclined portion 51, thereby reducing the amount of deformation of the elastic film 10. As a result, stress occurring on wafer W can be reduced. Furthermore, since the front end 51c of the ring inclined portion 51 has a curved cross-sectional shape, when the elastic membrane 10 contacts the front end 51c of the ring inclined portion 51, the elastic membrane 10 can be prevented from being damaged.

採用本實施形態時,分隔壁14a~14e係形成不具過去形成於分隔壁之水平部的直線形狀之分隔壁。再者,此等分隔壁14a~14e具有相同形狀且相互平行(或概略平行)地延伸。因此,即使分別供給至鄰接之壓力室的的流體壓力差大時,分隔壁14a~14e仍不致與抵接部11之上面接觸。 In this embodiment, the partition walls 14a to 14e are partition walls that do not have the linear shape formed in the horizontal portion of the partition wall in the past. Furthermore, these partition walls 14a-14e have the same shape and extend parallel (or substantially parallel) to each other. Therefore, even when the pressure difference of the fluid supplied to the adjacent pressure chambers is large, the partition walls 14 a to 14 e do not come into contact with the upper surface of the abutting portion 11 .

再者,可防止鄰接之分隔壁相互接觸。特別是由於在鄰接的分隔壁14之間設有具備限制分隔壁14在徑方向內側或外側移動之環傾斜部51的連結環23,因此可有效防止分隔壁14與抵接部11之上面接觸及鄰接之各分隔壁14的接觸。結果,可精密調整保持於研磨頭(基板保持裝置)1之晶圓W的研磨輪廓。 Furthermore, adjacent partition walls can be prevented from contacting each other. In particular, since the connecting ring 23 provided with the ring inclined portion 51 that restricts the movement of the partition wall 14 inwardly or outwardly in the radial direction is provided between the adjacent partition walls 14, it is possible to effectively prevent the partition wall 14 from contacting the upper surface of the abutting portion 11. And the contact of each adjacent partition wall 14. As a result, the polishing profile of the wafer W held by the polishing head (substrate holding device) 1 can be finely adjusted.

再者,採用本實施形態時,由於構成傾斜分隔壁之分隔壁14a~14e相互平行地延伸,因此可縮小鄰接的分隔壁14a~14e之間的間隔。結果,由於可縮小各壓力室16a~16e在徑方向之寬度,因此可精密調整保持於研磨頭(基板保持裝置)1之晶圓W的研磨輪廓。 Furthermore, according to the present embodiment, since the partition walls 14a to 14e constituting the inclined partition walls extend parallel to each other, the interval between the adjacent partition walls 14a to 14e can be reduced. As a result, since the radial widths of the pressure chambers 16a to 16e can be reduced, the polishing profile of the wafer W held by the polishing head (substrate holding device) 1 can be finely adjusted.

將分隔壁14a~14e構成傾斜分隔壁時,鄰接的分隔壁14之間的間隔及分隔壁14e與側壁15的垂直部22間之間隔、各壓力室之徑方向寬度可依晶圓W之研磨輪廓而任意設定。亦即,可將鄰接之分隔壁14的間隔設定成希望的間隔(例如,極窄之間隔)。亦可將複數個分隔壁14a~14e中鄰接之至少2個分隔壁構成傾斜分隔壁。例如,亦可將分隔壁14c、分隔壁14d、分隔壁14e構成傾斜分隔壁,亦可將鄰接於側壁15而配置之2個分隔壁14d、14e構成傾斜分隔壁。 When the partition walls 14a-14e are formed as inclined partition walls, the distance between adjacent partition walls 14, the distance between the partition wall 14e and the vertical portion 22 of the side wall 15, and the radial width of each pressure chamber can be adjusted according to the grinding of the wafer W. The outline can be set arbitrarily. That is, the interval between adjacent partition walls 14 can be set to a desired interval (for example, an extremely narrow interval). At least two adjacent partition walls among the plurality of partition walls 14a to 14e may be configured as inclined partition walls. For example, the partition wall 14c, the partition wall 14d, and the partition wall 14e may be configured as inclined partition walls, or the two partition walls 14d and 14e arranged adjacent to the side wall 15 may be configured as inclined partition walls.

連結環23藉由複數個固定具而固定於載體43。藉由固定釘將連結環23固定於載體43,而將彈性膜10連接於頭本體2。將構成傾斜分隔壁之鄰接的分隔壁14間之間隔小的彈性膜10連結於頭本體2時,頭本體2之連結環23在徑方向的寬度亦變小。結果,須將連結環23固定於載體43用之固定具配置在狹窄空間。再者,用於將連結環23固定於載體43之固定具數量多時,在維修時從載體43裝卸彈性膜10之作業量增加。 The connecting ring 23 is fixed on the carrier 43 by a plurality of fixing devices. The connecting ring 23 is fixed to the carrier 43 by means of fixing nails, and the elastic membrane 10 is connected to the head body 2 . When connecting the elastic film 10 with the small space between the adjacent partition walls 14 constituting the inclined partition walls to the head body 2, the radial width of the coupling ring 23 of the head body 2 is also reduced. As a result, a fixing tool for fixing the connecting ring 23 to the carrier 43 must be arranged in a narrow space. Furthermore, when the number of fixtures for fixing the connecting ring 23 to the carrier 43 is large, the workload of attaching and detaching the elastic membrane 10 from the carrier 43 increases during maintenance.

再者,設置用於將連結環23固定於頭本體2之載體43的固定具之空間有限制。更具體而言,在頭本體2之載體43中有將流體供給至各壓力室 16a~16f的複數條流體管線73(參照第二圖)貫穿,固定具須配置成不致干擾此等流體管線73。再者,頭本體2之載體43上形成有收容輻條78之複數條放射狀的溝43a(參照第三圖),而無法將固定具配置在形成有此等溝43a之位置。 Moreover, the space for setting the fixture for fixing the connecting ring 23 to the carrier 43 of the head body 2 is limited. More specifically, in the carrier 43 of the head body 2, there are a plurality of fluid pipelines 73 (refer to the second figure) that supply the fluid to the pressure chambers 16a-16f, and the fixture must be configured so as not to interfere with these fluid pipelines 73. . Furthermore, the carrier 43 of the head body 2 is formed with a plurality of radial grooves 43a (refer to FIG. 3 ) for accommodating the spokes 78, and it is impossible to arrange the fixture at the positions where these grooves 43a are formed.

因此,本實施形態之研磨頭1具有用於將形成傾斜分隔壁之鄰接的2個分隔壁14經由3個或4個連結環23同時固定於頭本體2之固定具70。以下,說明該固定具70、以及使用固定具70將連接有彈性膜10之連結環23固定於頭本體2的方法。 Therefore, the polishing head 1 of the present embodiment has the fixture 70 for simultaneously fixing the adjacent two partition walls 14 forming the inclined partition walls to the head body 2 through the three or four connecting rings 23 . Hereinafter, the fixture 70 and the method of fixing the connecting ring 23 connected with the elastic film 10 to the head body 2 using the fixture 70 will be described.

第九A圖係固定具70之俯視圖,第九B圖係第九A圖之B-B線剖面圖。如第九A圖及第九B圖所示,固定具70具備:圓柱狀之固定具本體71;及從固定具本體71之外周面突出於外側,且具有橢圓形狀之鍔72。鍔72具有2個傾斜面72a、72b,此等傾斜面72a、72b分別延伸至鍔72之外周面。除去傾斜面72a、72b之鍔72在鉛直方向的厚度,與形成於連結環23之環垂直部50的嚙合溝(後述)相同。在固定具本體71之上面71a形成有無圖示之夾具(例如,一字槽扳手)的前端可嚙合之溝71b。藉由使夾具前端嚙合於溝71b,進一步使夾具旋轉,可使固定具70旋轉。 The ninth figure A is a top view of the fixture 70, and the ninth figure B is a cross-sectional view of the B-B line of the ninth figure A. As shown in Figures 9A and 9B, the fixture 70 includes: a cylindrical fixture body 71; The collar 72 has two inclined surfaces 72a, 72b, and these inclined surfaces 72a, 72b extend to the outer peripheral surface of the collar 72, respectively. The thickness in the vertical direction of the flange 72 excluding the inclined surfaces 72 a and 72 b is the same as that of the engaging groove (described later) formed in the ring vertical portion 50 of the connecting ring 23 . On the upper surface 71a of the fixing tool body 71, a groove 71b is formed in which a front end of a jig (for example, a slotted wrench) not shown in the figure can engage. By engaging the tip of the jig with the groove 71b and further rotating the jig, the fixture 70 can be rotated.

其次,說明使用第九A圖及第九B圖所示之固定具70同時將3個或4個連結環23固定於頭本體2之載體43的方法,將3個連結環23固定於載體43時,2個鄰接之分隔壁14同時連結於頭本體2。以下之說明係將3個連結環23中位於徑方向內側的連結環23稱為內側連結環23,並將3個連結環23中在徑方向外側的連結環23稱為外側連結環23,並將位於內側連結環23與外側連結環23間之連結環23稱為中間連結環。此外,將構成傾斜分隔壁之鄰接的2個分隔壁14中位於徑方 向內側之分隔壁14稱為內側分隔壁14,並將構成傾斜分隔壁之鄰接的2個分隔壁14中位於徑方向外側之分隔壁14稱為外側分隔壁14。 Next, the method of fixing three or four connecting rings 23 to the carrier 43 of the head body 2 at the same time using the fixture 70 shown in the ninth figure A and the ninth B figure is described, and the three connecting rings 23 are fixed on the carrier 43 At this time, two adjacent partition walls 14 are connected to the head body 2 at the same time. In the following description, the connecting ring 23 located on the inner side in the radial direction among the three connecting rings 23 is called the inner connecting ring 23, and the connecting ring 23 on the outer side in the radial direction among the three connecting rings 23 is called the outer connecting ring 23, and The connecting ring 23 located between the inner connecting ring 23 and the outer connecting ring 23 is called an intermediate connecting ring. In addition, among the two adjacent partition walls 14 constituting the inclined partition wall, the partition wall 14 positioned on the inner side in the radial direction is referred to as the inner partition wall 14, and among the two adjacent partition walls 14 constituting the inclined partition wall, the partition wall 14 positioned on the radially outer side is called The partition wall 14 is called the outer partition wall 14 .

第十圖至第十三圖係顯示為了將第六圖所示之彈性膜10連結於頭本體2,而使用第九A圖及第九B圖所示之固定具70將3個或4個連結環23同時固定於載體43的各工序之模式圖。 The tenth figure to the thirteenth figure show that in order to connect the elastic film 10 shown in the sixth figure to the head body 2, and use the fixture 70 shown in the ninth figure A and the ninth B figure to connect three or four A schematic view of each process of simultaneously fixing the connecting ring 23 to the carrier 43 .

第五圖所示之彈性膜10,其第五分隔壁14b係內側分隔壁14,第四分隔壁14c係外側分隔壁14。第六連結環23a對第五分隔壁14b與第四分隔壁14c係內側連結環23,第五連結環23b係中間連結環23,第四連結環23c係外側連結環23。藉由固定具70將第六連結環23a~23c固定於載體43,而將第五分隔壁14b與第四分隔壁14c連結於頭本體2。 In the elastic membrane 10 shown in FIG. 5 , the fifth partition wall 14 b is the inner partition wall 14 , and the fourth partition wall 14 c is the outer partition wall 14 . The sixth connecting ring 23a is the inner connecting ring 23 for the fifth partition wall 14b and the fourth partition wall 14c, the fifth connecting ring 23b is the middle connecting ring 23, and the fourth connecting ring 23c is the outer connecting ring 23. The sixth connecting rings 23 a - 23 c are fixed to the carrier 43 by the fixture 70 , and the fifth partition wall 14 b and the fourth partition wall 14 c are connected to the head body 2 .

同樣地,第三分隔壁14d係內側分隔壁14,第二分隔壁14e係外側分隔壁14。第四連結環23c對第三分隔壁14d與第二分隔壁14e係內側連結環23,第三連結環23d係中間連結環23,第二連結環23e係外側連結環23。藉由固定具70將連結環23c~23e固定於載體43,而將第三分隔壁14d與第二分隔壁14e連結於頭本體2。如此,第四連結環23c對第五分隔壁14b與第四分隔壁14c係外側連結環23,對第三分隔壁14d與第二分隔壁14e係內側連結環23。 Similarly, the third partition wall 14d is the inner partition wall 14 , and the second partition wall 14e is the outer partition wall 14 . The fourth connection ring 23c is the inner connection ring 23 for the third partition wall 14d and the second partition wall 14e, the third connection ring 23d is the middle connection ring 23, and the second connection ring 23e is the outer connection ring 23. The connecting rings 23 c to 23 e are fixed to the carrier 43 by the fixture 70 , and the third partition wall 14 d and the second partition wall 14 e are connected to the head body 2 . In this way, the fourth connecting ring 23c is the outer connecting ring 23 for the fifth partition wall 14b and the fourth partition wall 14c, and the inner connecting ring 23 for the third partition wall 14d and the second partition wall 14e.

如第十圖所示,在頭本體2之載體43的上面43c形成有分別插入複數個固定具70之複數個第一凹部45。各第一凹部45從載體43之上面43c朝向載體43的下面43d延伸。第一凹部45具有橢圓形狀之剖面,避免與插入該第一凹部45之固定具70的鍔72接觸。 As shown in FIG. 10 , a plurality of first recesses 45 are formed on the upper surface 43 c of the carrier 43 of the head body 2 into which a plurality of fixtures 70 are respectively inserted. Each first recess 45 extends from the upper surface 43c of the carrier 43 toward the lower surface 43d of the carrier 43 . The first recess 45 has an elliptical cross-section, and avoids contact with the collar 72 of the fixture 70 inserted into the first recess 45 .

再者,在載體43之下面43d形成有:插入中間連結環23之環垂直部50的環狀第三凹部47;插入外側連結環23之環垂直部50的第二凹部46及第四凹 部48;與插入第一連結環23f及第二連結環23e之環垂直部50的第五凹部49。第二凹部46、第三凹部47、第四凹部48、及第五凹部49在包含載體43之全周延伸,且從載體43之下面43d朝向上面43c而延伸。 Furthermore, the lower surface 43d of the carrier 43 is formed with: an annular third concave portion 47 inserted into the ring vertical portion 50 of the intermediate connecting ring 23; a second concave portion 46 and a fourth concave portion 48 inserted into the ring vertical portion 50 of the outer connecting ring 23 ; The fifth concave portion 49 of the ring perpendicular portion 50 inserted into the first connecting ring 23f and the second connecting ring 23e. The second concave portion 46 , the third concave portion 47 , the fourth concave portion 48 , and the fifth concave portion 49 extend over the entire circumference of the carrier 43 and extend from the lower surface 43 d of the carrier 43 toward the upper surface 43 c.

在第一凹部45之徑方向內側的內面形成有內側開口96,在第一凹部45之徑方向外側的內面形成有外側開口97。第一凹部45經由內側開口96而與第二凹部46連通,且經由外側開口97與第四凹部48連通。使插入第一凹部45之固定具70旋轉時,固定具70之鍔72通過內側開口96及外側開口97突出於第二凹部46及第四凹部48的內部。 An inner opening 96 is formed on the radially inner inner surface of the first concave portion 45 , and an outer opening 97 is formed on the radially outer inner surface of the first concave portion 45 . The first recess 45 communicates with the second recess 46 through the inner opening 96 and communicates with the fourth recess 48 through the outer opening 97 . When the fixture 70 inserted into the first recess 45 is rotated, the collar 72 of the fixture 70 protrudes inside the second recess 46 and the fourth recess 48 through the inner opening 96 and the outer opening 97 .

中間連結環23被內側連結環23與外側連結環23夾著,而保持於該內側連結環23與外側連結環23。例如中間連結環23之第五連結環23b保持於內側連結環23之第六連結環23a與外側連結環23的第四連結環23c。同樣地,中間連結環23之第三連結環23d保持於內側連結環23之第四連結環23c與外側連結環23的第二連結環23e。 The intermediate connecting ring 23 is sandwiched between the inner connecting ring 23 and the outer connecting ring 23 , and held by the inner connecting ring 23 and the outer connecting ring 23 . For example, the fifth connecting ring 23b of the middle connecting ring 23 is held by the sixth connecting ring 23a of the inner connecting ring 23 and the fourth connecting ring 23c of the outer connecting ring 23 . Similarly, the third connecting ring 23d of the middle connecting ring 23 is held by the fourth connecting ring 23c of the inner connecting ring 23 and the second connecting ring 23e of the outer connecting ring 23 .

本實施形態,中間連結環23具有從其內周面突出於內側之環狀的突出部30,內側連結環23具有裝載突出部30之環狀的階差部31。再者,外側連結環23具有從其內周面突出於內側之環狀的突出部33,中間連結環23具有裝載突出部33之環狀的階差部34。由於第四連結環23c對第五分隔壁14b與第四分隔壁14c發揮外側連結環23之功能,並對第三分隔壁14d與第二分隔壁14e發揮內側連結環23之功能,因此第四連結環23c具有:環狀之突出部33、與環狀之階差部31。 In this embodiment, the intermediate connecting ring 23 has an annular protruding portion 30 protruding inwardly from its inner peripheral surface, and the inner connecting ring 23 has an annular stepped portion 31 on which the protruding portion 30 is mounted. Furthermore, the outer connecting ring 23 has an annular protruding portion 33 protruding inwardly from its inner peripheral surface, and the intermediate connecting ring 23 has an annular stepped portion 34 on which the protruding portion 33 is mounted. Since the fourth connecting ring 23c functions as the outer connecting ring 23 for the fifth partition wall 14b and the fourth partition wall 14c, and functions as the inner connecting ring 23 for the third partition wall 14d and the second partition wall 14e, the fourth The connecting ring 23c has an annular protruding portion 33 and an annular step portion 31 .

再者,內側連結環23之環垂直部50中形成有固定具70之鍔72可嚙合的內側嚙合溝36,並在外側連結環23之環垂直部50中形成有固定具70之鍔72可嚙合的外側嚙合溝37。由於第四連結環23c對第五分隔壁14b與第四分隔壁14c 發揮外側連結環23之功能,並對第三分隔壁14d與第二分隔壁14e發揮內側連結環23之功能,因此第四連結環23c具有:內側嚙合溝36與外側嚙合溝37。 Furthermore, the inner engaging groove 36 in which the collar 72 of the fixture 70 can engage is formed in the ring vertical portion 50 of the inner connecting ring 23, and the collar 72 of the fixture 70 can be formed in the ring vertical portion 50 of the outer connecting ring 23. Engaging outer engaging groove 37 . Since the fourth connecting ring 23c functions as the outer connecting ring 23 for the fifth partition wall 14b and the fourth partition wall 14c, and functions as the inner connecting ring 23 for the third partition wall 14d and the second partition wall 14e, the fourth The coupling ring 23c has an inner meshing groove 36 and an outer meshing groove 37 .

在形成於內側連結環23(例如第六連結環23a)之環傾斜部51的外周面之密封溝51e中嵌合形成於內側分隔壁14(例如第五分隔壁14b)之前端的密封突起54。在形成於中間連結環23(例如第五連結環23b)之環傾斜部51的外周面之密封溝51e中嵌入形成於外側分隔壁14(例如第四分隔壁14c)之前端的密封突起54。再者,使中間連結環23之突出部33裝載於中間連結環23之階差部34。該狀態顯示於第十圖。 The sealing protrusion 54 formed at the front end of the inner partition wall 14 (such as the fifth partition wall 14b) fits into the seal groove 51e formed on the outer peripheral surface of the ring inclined portion 51 of the inner connecting ring 23 (for example, the sixth connecting ring 23a). The seal protrusion 54 formed at the front end of the outer partition wall 14 (eg, the fourth partition wall 14c) is embedded in the seal groove 51e formed on the outer peripheral surface of the ring inclined portion 51 of the intermediate linking ring 23 (eg, the fifth linking ring 23b). Furthermore, the protruding portion 33 of the intermediate connecting ring 23 is mounted on the stepped portion 34 of the intermediate connecting ring 23 . This state is shown in Figure 10.

此外,如第十圖所示,彈性膜10之第六分隔壁14a亦構成傾斜分隔壁。第六分隔壁14a連接於追加連結環23g,藉由將該追加連結環23g固定於載體43而連結於頭本體2。更具體而言,追加連結環23g具有傾斜面53,傾斜面53上形成有嵌入形成於第六分隔壁14a前端之密封突起54的密封溝53a。第六分隔壁14a在將該第六分隔壁14a之密封突起54嵌入追加連結環23g的密封溝53a狀態下,被第六連結環23a與追加連結環23g夾著,藉此,第六分隔壁14a被第六連結環23a與追加連結環23g保持。 In addition, as shown in FIG. 10, the sixth partition wall 14a of the elastic film 10 also constitutes an inclined partition wall. The sixth partition wall 14 a is connected to the additional connecting ring 23 g, and is connected to the head main body 2 by fixing the additional connecting ring 23 g to the carrier 43 . More specifically, the additional connecting ring 23g has an inclined surface 53 on which a sealing groove 53a is formed to fit the sealing protrusion 54 formed at the front end of the sixth partition wall 14a. The sixth partition wall 14a is sandwiched by the sixth connection ring 23a and the additional connection ring 23g in a state where the seal protrusion 54 of the sixth partition wall 14a is inserted into the seal groove 53a of the additional connection ring 23g, whereby the sixth partition wall 14a is held by the sixth connection ring 23a and the additional connection ring 23g.

再者,如第十圖所示,連結環23f具有從其內周面突出於內側之環狀的突出部35,連結環23e具有裝載突出部35之環狀的階差部38。彈性膜10之側壁15具有水平部28。在該水平部28前端形成有密封突起54,在第一連結環23f之外周面形成有嵌入該密封突起54之密封溝51e。將彈性膜10連結於頭本體2之載體43時,使彈性膜10之分隔壁14b~14e預先保持於連結環23a~23f,且使分隔壁14a預先保持於追加連結環23g。 Furthermore, as shown in FIG. 10 , the connecting ring 23f has an annular protruding portion 35 protruding inwardly from its inner peripheral surface, and the connecting ring 23e has an annular step portion 38 on which the protruding portion 35 is mounted. The side wall 15 of the elastic membrane 10 has a horizontal portion 28 . A seal protrusion 54 is formed at the front end of the horizontal portion 28, and a seal groove 51e into which the seal protrusion 54 is fitted is formed on the outer peripheral surface of the first coupling ring 23f. When connecting the elastic film 10 to the carrier 43 of the head body 2, the partition walls 14b-14e of the elastic film 10 are held in the connecting rings 23a-23f, and the partition wall 14a is held in the additional connecting ring 23g.

其次,如第十一圖所示,使彈性膜10、連結環23a~23f及追加連結環23g朝向載體43移動,並將各連結環23a~23f插入形成於載體43之下面43b的凹部46、47、48、49(參照第十圖)。如第十圖所示,插入第四連結環23c之凹部係對第五分隔壁14b及第四分隔壁14c之第四凹部48,另外係對第三分隔壁14d及第二分隔壁14e之第二凹部46。 Next, as shown in the eleventh figure, the elastic membrane 10, the connecting rings 23a-23f and the additional connecting ring 23g are moved toward the carrier 43, and the connecting rings 23a-23f are inserted into the recesses 46, 43b formed on the lower surface 43b of the carrier 43. 47, 48, 49 (refer to the tenth figure). As shown in the tenth figure, the recess for inserting the fourth connecting ring 23c is the fourth recess 48 for the fifth partition wall 14b and the fourth partition wall 14c, and the fourth recess 48 for the third partition wall 14d and the second partition wall 14e. Two recesses 46 .

如第九A圖及第九B圖所示,在固定具70之鍔72上形成有2個傾斜面72a、72b。傾斜面72a、72b分別延伸至鍔72之外周面。鍔72藉由該傾斜面72a、72b可順利地進入嚙合溝36、37。 As shown in the ninth figure A and the ninth figure B, two inclined surfaces 72a, 72b are formed on the flange 72 of the fixture 70 . The inclined surfaces 72a and 72b extend to the outer peripheral surface of the collar 72, respectively. The flange 72 can smoothly enter the engagement grooves 36, 37 through the inclined surfaces 72a, 72b.

因為除去傾斜面72a、72b之鍔72的厚度與嚙合溝36、37的厚度相同,所以順利進入嚙合溝36、37之鍔72與嚙合溝36、37強固地嚙合。結果,內側連結環(例如第六連結環23a)、外側連結環(例如第四連結環23c)強固地固定於載體43。此時,保持於內側連結環23與外側連結環23之中間連結環23(例如第五連結環23b)亦強固地連結於內側連結環23與外側連結環23。 Since the thickness of the flange 72 excluding the inclined surfaces 72a, 72b is the same as that of the engaging grooves 36, 37, the flange 72 smoothly entering the engaging grooves 36, 37 is firmly engaged with the engaging grooves 36, 37. As a result, the inner connecting ring (for example, the sixth connecting ring 23 a ) and the outer connecting ring (for example, the fourth connecting ring 23 c ) are firmly fixed to the carrier 43 . At this time, the intermediate connecting ring 23 (for example, the fifth connecting ring 23 b ) held by the inner connecting ring 23 and the outer connecting ring 23 is also firmly connected to the inner connecting ring 23 and the outer connecting ring 23 .

同時,內側分隔壁(例如第五分隔壁14b)之密封突起54藉由中間連結環23之環傾斜部51的內周面51a而按壓於內側連結環23之環傾斜部51的外周面51b上所形成之密封溝51e中,外側分隔壁(例如分隔壁14c)之密封突起54藉由外側連結環23之環傾斜部51的內周面51a而按壓於中間連結環23之環傾斜部51的外周面51b上所形成之密封溝51e中。 Simultaneously, the sealing protrusion 54 of the inner side partition wall (for example, the fifth partition wall 14b) is pressed on the outer peripheral surface 51b of the ring inclined portion 51 of the inner connecting ring 23 by the inner peripheral surface 51a of the ring inclined portion 51 of the intermediate connecting ring 23 In the formed sealing groove 51e, the sealing protrusion 54 of the outer partition wall (such as the partition wall 14c) is pressed against the ring inclined portion 51 of the intermediate connecting ring 23 by the inner peripheral surface 51a of the ring inclined portion 51 of the outer connecting ring 23. In the sealing groove 51e formed on the outer peripheral surface 51b.

藉此,密封內側分隔壁14與內側連結環23間之間隙、及內側分隔壁14與中間連結環23間的間隙,並密封外側分隔壁14與中間連結環23間之間隙、及外側分隔壁14與外側連結環23間的間隙。如參照第八圖之說明,亦可在連結環 23之環傾斜部51的內周面51a上形成將密封突起54按壓於密封溝51e之按壓突起51f。 Thereby, the gap between the inner partition wall 14 and the inner connecting ring 23 and the gap between the inner partition wall 14 and the middle connecting ring 23 are sealed, and the gap between the outer partition wall 14 and the middle connecting ring 23 and the outer partition wall are sealed. 14 and the gap between the outer connecting ring 23. As described with reference to FIG. 8, a pressing protrusion 51f for pressing the sealing protrusion 54 against the sealing groove 51e may also be formed on the inner peripheral surface 51a of the ring inclined portion 51 of the connecting ring 23.

側壁15之密封突起54藉由載體43之下面43d(參照第十圖)而按壓於第一連結環23f之環傾斜部51的外周面51b上所形成之密封溝51e,藉此,密封側壁15與第一連結環23f間之間隙、及側壁15與載體43間的間隙。 The sealing protrusion 54 of the side wall 15 is pressed against the sealing groove 51 e formed on the outer peripheral surface 51 b of the ring inclined portion 51 of the first connecting ring 23 f through the lower surface 43 d of the carrier 43 (see FIG. 10 ), thereby sealing the side wall 15 and the gap between the first connecting ring 23f and the gap between the side wall 15 and the carrier 43 .

亦可在載體43之下面43d配置參照第八圖而說明之環狀的按壓突起51f。將彈性膜10連結於頭本體2時,藉由設於下面43d之按壓突起51f,而將側壁15之密封突起54以強按壓力按壓於第一連結環23f之環傾斜部51的外周面51b上所形成之密封溝51e。 On the lower surface 43d of the carrier 43, the ring-shaped pressing protrusion 51f described with reference to FIG. 8 may be arranged. When the elastic membrane 10 is connected to the head body 2, the sealing protrusion 54 of the side wall 15 is pressed against the outer peripheral surface 51b of the ring inclined portion 51 of the first connecting ring 23f with a strong pressing force by means of the pressing protrusion 51f provided on the lower surface 43d. The sealing groove 51e formed above.

本實施形態,追加連結環23g係藉由複數個螺絲94而固定於載體43。在載體43中形成有插入螺絲94之貫穿孔43f(參照第十圖),追加連結環23g上形成有從其上面朝向下面延伸之螺絲孔56。藉由將螺絲94插入貫穿孔43f,並使螺絲94螺合於螺絲孔56,而將追加連結環23g強固地固定於載體43。 In this embodiment, the additional connection ring 23g is fixed to the carrier 43 by a plurality of screws 94 . A through hole 43f (refer to FIG. 10 ) for inserting a screw 94 is formed in the carrier 43, and a screw hole 56 extending from the upper surface toward the lower surface is formed in the additional connecting ring 23g. By inserting the screw 94 into the through hole 43f and screwing the screw 94 into the screw hole 56, the additional connection ring 23g is firmly fixed to the carrier 43.

此時,第六分隔壁14a之密封突起54係藉由第六連結環23a之環傾斜部51的內周面51a按壓於追加連結環23g之傾斜面53上所形成的密封溝53a。藉此,密封第六分隔壁14a與追加連結環23g間之間隙、第六分隔壁14a與第六連結環23a間之間隙、及第六分隔壁14a與第六連結環23a間之間隙。 At this time, the sealing protrusion 54 of the sixth partition wall 14a is a sealing groove 53a formed by pressing the inner peripheral surface 51a of the ring inclined portion 51 of the sixth connecting ring 23a on the inclined surface 53 of the additional connecting ring 23g. Thereby, the gap between the sixth partition wall 14a and the additional connection ring 23g, the gap between the sixth partition wall 14a and the sixth connection ring 23a, and the gap between the sixth partition wall 14a and the sixth connection ring 23a are sealed.

第十四圖係顯示固定具70之配置的一例之模式圖。如第十四圖所示,第六連結環23a、第五連結環23b及第四連結環23c藉由沿著第五連結環23b之周方向而配置的複數個固定具70固定於載體43。第四連結環23c、第三連結環23d、及第二連結環23e藉由沿著第三連結環23d之周方向而配置的複數個固定具70固定於載體43。 FIG. 14 is a schematic diagram showing an example of the arrangement of the fixture 70 . As shown in FIG. 14, the sixth connection ring 23a, the fifth connection ring 23b, and the fourth connection ring 23c are fixed to the carrier 43 by a plurality of fixtures 70 arranged along the circumferential direction of the fifth connection ring 23b. The fourth connection ring 23c, the third connection ring 23d, and the second connection ring 23e are fixed to the carrier 43 by a plurality of fixtures 70 arranged along the circumferential direction of the third connection ring 23d.

如此,使用上述固定具70將3個或4個連結環23同時固定於載體43時,即使壓力室16a~16f在徑方向之寬度小時,仍可將彈性膜10連結於頭本體2。再者由於可減少固定具70數量,因此可減少裝卸彈性膜10時之作業量。 In this way, when three or four connecting rings 23 are simultaneously fixed to the carrier 43 using the fixture 70, the elastic membrane 10 can still be connected to the head body 2 even if the radial width of the pressure chambers 16a-16f is small. Furthermore, since the number of fixtures 70 can be reduced, the workload of loading and unloading the elastic film 10 can be reduced.

如第十四圖所示,載體43配置防止流經用於對各壓力室16a~16f供給流體之流體管線73的複數個貫穿孔73a、73b之流體洩漏的密封構件44(參照第五圖)。再者,如參照第三圖之說明,載體43形成有收容輻條78之複數個放射狀的溝43a。 As shown in FIG. 14, the carrier 43 is configured with a sealing member 44 that prevents fluid leakage through a plurality of through holes 73a, 73b of the fluid pipeline 73 for supplying fluid to the pressure chambers 16a-16f (see FIG. 5 ). . Furthermore, as described with reference to the third figure, the carrier 43 is formed with a plurality of radial grooves 43a for accommodating the spokes 78 .

如本實施形態,為了將鄰接之2個分隔壁14連結於頭本體2,而藉由固定具70將3個連結環23固定於頭本體2之載體43時,可使固定具70輕易配置在貫穿孔73b及溝43a之不同位置。再者,由於可減少固定具70數量,因此彈性膜10之裝卸容易。 Like this embodiment, in order to connect the two adjacent partition walls 14 to the head body 2, when the three connecting rings 23 are fixed to the carrier 43 of the head body 2 by the fixture 70, the fixture 70 can be easily arranged on the Through the different positions of the hole 73b and the groove 43a. Furthermore, since the number of fixtures 70 can be reduced, the elastic membrane 10 is easy to attach and detach.

上述之實施形態中,複數個分隔壁14中之至少2個鄰接的分隔壁係構成傾斜於徑方向內側之傾斜分隔壁。構成傾斜分隔壁之分隔壁14以外的分隔壁14形狀不拘。例如,亦可將分隔壁14d、14e構成傾斜分隔壁,並將分隔壁14d、14e以外之分隔壁14a~14c構成具有從抵接部11傾斜於徑方向內側之傾斜部、與從該傾斜部水平延伸之水平部的分隔壁。 In the above-mentioned embodiment, at least two adjacent partition walls among the plurality of partition walls 14 constitute an inclined partition wall inclined inward in the radial direction. The shape of the partition walls 14 other than the partition walls 14 constituting the inclined partition walls is not limited. For example, the partition walls 14d and 14e may also be configured as inclined partition walls, and the partition walls 14a to 14c other than the partition walls 14d and 14e may be configured to have an inclined portion inclined from the contact portion 11 inward in the radial direction, and an inclined portion from the inclined portion. The partition wall of the horizontal portion extending horizontally.

本實施形態如上述,關於形成於彈性膜10與頭本體2之間的複數個壓力室中在最外側之邊緣壓力室16f,構成該邊緣壓力室16f之分隔壁的第一分隔壁14f與第二分隔壁14e係形成直線形狀,且構成從抵接部11之徑方向內側朝向外側,第一分隔壁14f與第二分隔壁14e之間隔逐漸擴大。藉由邊緣壓力室16f之此種構成可獲得各種效果。 In this embodiment, as described above, regarding the peripheral pressure chamber 16f that is the outermost among the plurality of pressure chambers formed between the elastic membrane 10 and the head body 2, the first partition wall 14f and the second partition wall that constitute the partition wall of the peripheral pressure chamber 16f The two partition walls 14e are formed in a linear shape, and are configured to gradually expand the distance between the first partition wall 14f and the second partition wall 14e from the inside toward the outside in the radial direction of the contact portion 11 . Various effects can be obtained by such a configuration of the edge pressure chamber 16f.

第十五圖至第二十圖係用於說明邊緣壓力室16f因上述構成獲得之效果的模式圖。如第十五B圖所示之過去例,構成壓力室216f之分隔壁214f與214e平行延伸,且此等間隔窄時,邊緣壓力室216e之壓力比壓力室216f的壓力大,其差壓大時,如第十五C圖所示,壓力室216e膨脹,且分隔壁214e變形,可能導致分隔壁214e與分隔壁214f接觸。 Fig. 15 to Fig. 20 are schematic diagrams for explaining the effect of the edge pressure chamber 16f obtained by the above-mentioned configuration. As in the past example shown in Figure 15B, the partition walls 214f and 214e forming the pressure chamber 216f extend in parallel, and when the interval is narrow, the pressure of the edge pressure chamber 216e is higher than the pressure of the pressure chamber 216f, and the pressure difference is large. , as shown in Figure 15C, the pressure chamber 216e expands, and the partition wall 214e deforms, possibly causing the partition wall 214e to come into contact with the partition wall 214f.

如第十五C圖所示,分隔壁214e與分隔壁214f接觸時,無法從接觸部分正確控制外側之壓力室216f的壓力,因而無法正確控制彈性膜10對晶圓W之邊緣部分的按壓力。 As shown in FIG. 15C, when the partition wall 214e is in contact with the partition wall 214f, the pressure of the outer pressure chamber 216f cannot be accurately controlled from the contact portion, so the pressing force of the elastic film 10 on the edge of the wafer W cannot be accurately controlled. .

而本實施形態之彈性膜10,由於係將第一分隔壁14f與第二分隔壁14e形成直線形狀,且構成從抵接部11之徑方向內側朝向外側,第一分隔壁14f與第二分隔壁14e之間隔逐漸擴大,因此如第十五A圖所示,邊緣壓力室16f之壓力比壓力室16e的壓力小,且即使其差壓變大,第一分隔壁14f與第二分隔壁14e仍不易接觸。因而,可精密調整邊緣壓力室16f之壓力,亦可精密調整對晶圓W之邊緣部分的按壓力。 In the elastic membrane 10 of the present embodiment, since the first partition wall 14f and the second partition wall 14e are formed into a linear shape, and the first partition wall 14f and the second partition wall 14f and the second partition wall are formed from the radial direction inner side to the outer side of the abutting portion 11, the first partition wall 14f and the second partition wall The interval between the partition walls 14e gradually expands, so as shown in Fig. 15A, the pressure of the edge pressure chamber 16f is lower than the pressure of the pressure chamber 16e, and even if the pressure difference becomes larger, the first partition wall 14f and the second partition wall 14e Still not easily accessible. Therefore, the pressure of the edge pressure chamber 16f can be finely adjusted, and the pressing force on the edge portion of the wafer W can also be finely adjusted.

此外,如第十六B圖所示之過去例,第二分隔壁114e與抵接部111上面之接觸部位與抵接部111的外周端間之距離(邊緣按壓寬)大時,如第十六C圖所示,在彈性膜10之邊緣部分無法在細小範圍控制按壓力,而產生塌緣等的問題。 In addition, as in the past example shown in Figure 16B, when the distance (edge pressing width) between the contact portion of the second partition wall 114e and the upper surface of the contact portion 111 and the outer peripheral end of the contact portion 111 is large, as shown in the tenth As shown in Figure 6C, the pressing force cannot be controlled in a small range at the edge of the elastic film 10, resulting in problems such as edge collapse.

而本實施形態之彈性膜10如第十六A圖所示,由於構成邊緣壓力室16f之下側分隔壁的分隔壁14e與抵接部11之接觸部位在接近抵接部11外周端的部位,且分隔壁14e從抵接部11之外周端部延伸,因此邊緣按壓寬變小,在彈性膜10之邊緣部分可在細小範圍控制按壓力。 In the elastic membrane 10 of the present embodiment, as shown in FIG. 16A, since the partition wall 14e constituting the partition wall on the lower side of the edge pressure chamber 16f and the contact portion 11 is in contact with the contact portion 11 at a position close to the outer peripheral end of the contact portion 11, Moreover, the partition wall 14e extends from the outer peripheral end of the abutting portion 11, so the edge pressing width becomes smaller, and the pressing force can be controlled in a narrow range at the edge of the elastic film 10.

此外,如第十七B圖所示之過去例,構成邊緣壓力室116f之側壁115的部分長時,當提高邊緣壓力室116f之壓力時,如第十七C圖所示,在邊緣壓力室116f中,側壁115向徑方向外側膨脹而接觸於扣環3,邊緣部分之按壓力不穩定,可能造成晶圓W邊緣部分之研磨率不穩定。 In addition, as in the conventional example shown in FIG. 17B, when the part of the side wall 115 constituting the edge pressure chamber 116f is long, when the pressure of the edge pressure chamber 116f is increased, as shown in FIG. 17C, the edge pressure chamber In 116f, the side wall 115 swells outward in the radial direction and contacts the retaining ring 3, and the pressing force on the edge portion is unstable, which may cause the polishing rate of the edge portion of the wafer W to be unstable.

而本實施形態之彈性膜10如第十七A圖所示,由於直線形狀之分隔壁14f連接於側壁15,因此,即使邊緣壓力室16f之壓力提高,分隔壁14f仍可抑制側壁15之膨脹,因此側壁15不易接觸到扣環3。因而,本實施形態之彈性膜10在邊緣部分的按壓力穩定,且在晶圓W之邊緣部分的研磨率穩定。 In the elastic membrane 10 of this embodiment, as shown in Figure 17A, since the linear partition wall 14f is connected to the side wall 15, even if the pressure in the edge pressure chamber 16f increases, the partition wall 14f can still suppress the expansion of the side wall 15. , so the side wall 15 is not easy to contact the buckle 3 . Therefore, the pressing force of the elastic film 10 in the present embodiment is stable at the edge portion, and the polishing rate at the edge portion of the wafer W is stable.

另外,即使第二十三圖及第二十四圖所示之過去例,相當於本實施形態之彈性膜10的分隔壁14f之分隔壁120g係連接於側壁110h,不過該分隔壁120g並非直線形狀而係彎曲,且分隔壁120f亦彎曲,因此當邊緣壓力室116g之壓力提高,此等彎曲部伸展變平直,側壁110h可在徑方向外側膨脹。 In addition, even in the conventional examples shown in FIG. 23 and FIG. 24, the partition wall 120g corresponding to the partition wall 14f of the elastic film 10 of this embodiment is connected to the side wall 110h, but the partition wall 120g is not a straight line. The shape is curved, and the partition wall 120f is also curved, so when the pressure of the edge pressure chamber 116g increases, these curved portions stretch and become straight, and the side wall 110h can expand radially outward.

而本實施形態之彈性膜10如第十七A圖所示,由於連接於側壁15之分隔壁14f係直線形狀,因此該分隔壁14f向徑方向外側延伸的餘地極小,可有效抑制側壁15之膨脹。 And the elastic membrane 10 of the present embodiment is shown in Fig. 17A, because the partition wall 14f connected to the side wall 15 is linear, so the room for the partition wall 14f to extend outward in the radial direction is very small, which can effectively suppress the gap between the side wall 15. swell.

此外,如第十八B圖所示之過去例,抵接部111之端部剖面為四方時,如第十八C圖所示,邊緣壓力室116f之壓力產生的按壓力係以該四方寬度賦予晶圓W。如此,在邊緣部分無法在狹窄範圍按壓晶圓W,邊緣部分無法精密調整按壓力。 In addition, as in the previous example shown in FIG. 18B, when the end section of the abutting portion 111 is square, as shown in FIG. 18C , the pressing force generated by the pressure of the edge pressure chamber 116f is based on the square width. Assign wafer W. In this way, the wafer W cannot be pressed in a narrow range at the edge portion, and the pressing force cannot be precisely adjusted at the edge portion.

而本實施形態之彈性膜10如第十八A圖所示,由於分隔壁14e連接於抵接部11之外周端部,因此可縮小邊緣壓力室16f之邊緣按壓寬,可在邊緣部分精密調整按壓力。 In the elastic membrane 10 of this embodiment, as shown in Figure 18A, since the partition wall 14e is connected to the outer peripheral end of the abutting portion 11, the edge pressing width of the edge pressure chamber 16f can be narrowed and finely adjusted at the edge. Press pressure.

此外,如第十九B圖之過去例,側壁115有階差時,漿液S容易滯留在該階差上形成缺陷原因。而本實施形態之彈性膜10如第十九A圖所示,由於側壁15之外周面平坦,因此漿液不易滯留。 In addition, as in the previous example of FIG. 19B, when the side wall 115 has a step, the slurry S tends to stay on the step and cause defects. In the elastic membrane 10 of this embodiment, as shown in FIG. 19A, since the outer peripheral surface of the side wall 15 is flat, the slurry is not easy to stagnate.

此外,如第二十B圖所示之過去例,構成邊緣壓力室116f之分隔壁114e彎曲,藉此,當邊緣壓力室116f彎曲時,在該彎曲角產生壓力損失,壓力無法傳遞到該邊緣壓力室116f之端,亦即抵接部111之外周端部,精密調整在邊緣部分之按壓力困難。 In addition, as in the conventional example shown in FIG. 20B, the partition wall 114e constituting the edge pressure chamber 116f is bent, whereby when the edge pressure chamber 116f is bent, a pressure loss occurs at the bending angle, and the pressure cannot be transmitted to the edge. The end of the pressure chamber 116f, that is, the outer peripheral end of the abutting portion 111, is difficult to finely adjust the pressing force at the edge.

而本實施形態之彈性膜10如第二十A圖所示,對邊緣壓力室16f而言係流體源之流體管線73係從某個徑方向內側朝向下游側的徑方向外側,第一分隔壁14f與第二分隔壁14e之間隔逐漸擴大,邊緣壓力室16f變寬。因而不致阻擋流體的通道,流體容易流至整個邊緣壓力室16f,在邊緣部分可精密調整按壓力。 In the elastic membrane 10 of the present embodiment, as shown in Figure 20A, the fluid line 73, which is a fluid source for the edge pressure chamber 16f, is from the inner side of a certain radial direction toward the outer radial direction of the downstream side, and the first partition wall The distance between 14f and the second partition wall 14e gradually increases, and the edge pressure chamber 16f becomes wider. Therefore, the passage of the fluid will not be blocked, the fluid can easily flow to the entire edge pressure chamber 16f, and the pressing force can be finely adjusted at the edge.

其次,說明本實施形態之彈性膜10的變形例。第二十一A圖係顯示第一種變形例之彈性膜的一部分之放大剖面圖。上述實施形態構成邊緣壓力室16f之上側的分隔壁14f係從側壁15水平地延伸,而本變形例之彈性膜10',其分隔壁14f'係從徑方向外側朝向內側稍微向上傾斜。 Next, modified examples of the elastic film 10 of this embodiment will be described. Figure 21A is an enlarged cross-sectional view showing a part of the elastic membrane of the first modification. In the above embodiment, the partition wall 14f constituting the upper side of the edge pressure chamber 16f extends horizontally from the side wall 15, but in the elastic membrane 10' of this modification, the partition wall 14f' is slightly inclined upward from the radially outer side toward the inner side.

即使按照該變形例之構成,由於第一分隔壁14f仍然為從側壁15朝向徑方向內側而延伸的直線形狀,第二分隔壁14e形成從抵接部11之外周端部朝向徑方向內側的上方延伸之直線形狀,並由第一分隔壁14f、第二分隔壁14e與側壁15構成邊緣壓力室16f,因此可獲得與上述同樣之效果。另外,分隔壁14f亦可與分隔壁14e平行或形成朝向徑方向內側向上方傾斜的角度。 Even with the configuration of this modified example, since the first partition wall 14f is still in the shape of a straight line extending radially inward from the side wall 15, the second partition wall 14e is formed upward from the outer peripheral end portion of the abutting portion 11 toward the radially inward side. The linear shape is extended, and the edge pressure chamber 16f is formed by the first partition wall 14f, the second partition wall 14e and the side wall 15, so the same effect as above can be obtained. In addition, the partition wall 14f may be parallel to the partition wall 14e or form an angle inclined upward toward the inner side in the radial direction.

第二十一B圖係顯示第二種變形例之彈性膜的一部分之放大剖面圖。本變形例之彈性膜10除了第二十一A圖的構成之外,還在側壁15'內側形成有用於抑制側壁15'向徑方向外側膨脹的方塊151。側壁15'之內側亦可方塊151在周方向連續而形成圓環形狀,亦可在周方向隔以間隔設置複數個方塊151。 Figure 21B is an enlarged cross-sectional view showing a part of the elastic film of the second modification. In addition to the configuration in FIG. 21A, the elastic membrane 10 of this modified example also has a block 151 formed inside the side wall 15' for preventing the side wall 15' from expanding radially outward. The inner side of the side wall 15 ′ can also be formed in a ring shape by continuous squares 151 in the circumferential direction, or a plurality of squares 151 can be arranged at intervals in the circumferential direction.

即使按照該變形例之構成,由於第一分隔壁14f係形成從側壁15朝向徑方向內側而延伸的直線形狀,第二分隔壁14e形成從抵接部11之外周端部朝向徑方向內側的上方延伸之直線形狀,並由第一分隔壁14f、第二分隔壁14e、與側壁15構成邊緣壓力室16f,因此可獲得與上述同樣之效果。 Even according to the structure of this modified example, since the first partition wall 14f is formed in a linear shape extending radially inward from the side wall 15, the second partition wall 14e is formed upward from the outer peripheral end portion of the contact portion 11 toward the radially inward side. The linear shape is extended, and the edge pressure chamber 16f is formed by the first partition wall 14f, the second partition wall 14e, and the side wall 15, so the same effect as above can be obtained.

另外,第二十一A圖及第二十一B圖所示之彈性膜的第二分隔壁14e,在其基端部於垂直方向彎曲形成基端連接部141e,該基端連接部141e連接於抵接部11之上面。該基端連接部141e之外周面與側壁15的內周面間之距離(相當於上述邊緣按壓寬d)可為1.5~8mm(宜為3~6mm)。 In addition, the second partition wall 14e of the elastic membrane shown in the 21st A figure and the 21st B figure is bent in the vertical direction at its base end to form a base end connection portion 141e, and the base end connection portion 141e is connected to on the top of the abutting portion 11 . The distance between the outer peripheral surface of the base-end connecting portion 141e and the inner peripheral surface of the side wall 15 (equivalent to the above-mentioned edge pressing width d) may be 1.5-8 mm (preferably 3-6 mm).

如此,自抵接部11之外周端,從距離d內側的位置形成第二分隔壁14e時,此種第二分隔壁14e亦屬於從抵接部11之外周端部延伸的分隔壁。此外,基端連接部141e之長度L可為0.5~3.5mm(並宜為1~2.5mm程度)。即使形成有此種基端連接部141e之第二分隔壁14e,分隔壁本體55之大部分仍形成直線狀,而屬於直線狀延伸之分隔壁。 In this way, when the second partition wall 14 e is formed at a position inside the distance d from the outer peripheral end of the contact portion 11 , such second partition wall 14 e also belongs to the partition wall extending from the outer peripheral end of the contact portion 11 . In addition, the length L of the base-end connecting portion 141e may be 0.5-3.5 mm (and preferably about 1-2.5 mm). Even if the second partition wall 14e is formed with such a base-end connecting portion 141e, most of the partition wall body 55 is formed in a straight line, and belongs to a partition wall extending in a straight line.

第二十二圖係顯示具有更明確之距離d及長度L之例的第三種變形例圖。第二十二圖所示之變形例,其基端連接部141e之外周面與側壁15的內周面間之距離d係5mm,且基端連接部141e之長度L係3mm。亦即,本例之抵接部11外周端部的極小(5mm寬的)部分亦構成邊緣壓力室16f。 Figure 22 is a figure showing a third modified example with a more definite distance d and length L. In the modified example shown in Figure 22, the distance d between the outer peripheral surface of the base end connecting portion 141e and the inner peripheral surface of the side wall 15 is 5 mm, and the length L of the base end connecting portion 141 e is 3 mm. That is, a very small (5 mm wide) portion of the outer peripheral end of the abutting portion 11 in this example also constitutes the edge pressure chamber 16f.

在晶圓W上形成有銅或鎢等金屬膜時,覆膜之範圍係從晶圓W的外周進入內側,晶圓W之外周端部並未形成膜。此種情況下,需要精密控制比晶圓W外周端若干內側的部分,亦即膜之外周端部的研磨輪廓。 When a metal film such as copper or tungsten is formed on the wafer W, the range of the coating film extends from the outer periphery of the wafer W to the inner side, and no film is formed on the outer peripheral end of the wafer W. In this case, it is necessary to precisely control the polishing profile of the portion slightly inside the outer peripheral end of the wafer W, that is, the outer peripheral end portion of the film.

採用上述之變形例時,藉由某種程度確保距離d,可精密控制形成於晶圓W之膜的外周端部之研磨處理。此外,藉由形成基端連接部141e,可使第二分隔壁14e之基端連接部141e以外的部分之位置及姿態與第六圖所示之上述實施形態的第二分隔壁14e相同。 According to the modification described above, by securing the distance d to some extent, it is possible to precisely control the polishing process of the outer peripheral end portion of the film formed on the wafer W. Furthermore, by forming the base end connection portion 141e, the position and posture of the portion other than the base end connection portion 141e of the second partition wall 14e can be made the same as the second partition wall 14e of the above embodiment shown in FIG. 6 .

亦即,使第六圖之第二分隔壁14e照樣平行移動於內側時,第二分隔壁14e與第三分隔壁14d間之距離變窄,藉由使第二分隔壁14e之基端部彎曲而形成基端連接部141e,可將第二分隔壁14e與第三分隔壁14d間之距離保持與上述實施形態相同,而可確保邊緣按壓寬d。另外,邊緣按壓寬d係8mm以下,且長度L為3.5mm以下時,可充分享受上述實施形態所說明之作用效果。 That is, when the second partition wall 14e of the sixth figure is moved in parallel as it is inside, the distance between the second partition wall 14e and the third partition wall 14d is narrowed by bending the base end portion of the second partition wall 14e By forming the base end connecting portion 141e, the distance between the second partition wall 14e and the third partition wall 14d can be kept the same as that of the above embodiment, and the edge pressing width d can be ensured. In addition, when the edge pressing width d is 8 mm or less and the length L is 3.5 mm or less, the effects described in the above embodiments can be fully enjoyed.

上述實施形態係以具有本發明所屬之技術領域的一般知識者可實施本發明為目的而記載者。熟悉本技術之業者當然可形成上述實施形態的各種變形例,本發明之技術性思想亦可適用於其他實施形態。因此,本發明不限定於所記載之實施形態,而應按照申請專利範圍所定義之技術性思想作最廣範圍的解釋。 The above-mentioned embodiments are described for the purpose that the present invention can be practiced by those having ordinary knowledge in the technical field to which the present invention belongs. Those skilled in the art can of course create various modifications of the above-mentioned embodiments, and the technical idea of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but should be interpreted in the widest range according to the technical ideas defined in the claims.

2‧‧‧頭本體 2‧‧‧head body

3‧‧‧扣環 3‧‧‧Buckle

3a‧‧‧環構件 3a‧‧‧ring member

3b‧‧‧驅動環 3b‧‧‧Drive ring

10‧‧‧彈性膜 10‧‧‧elastic film

11‧‧‧抵接部 11‧‧‧Abutment

14a~14f‧‧‧分隔壁 14a~14f‧‧‧Partition wall

15‧‧‧側壁 15‧‧‧side wall

16a~16f‧‧‧壓力室 16a~16f‧‧‧pressure chamber

17‧‧‧通孔 17‧‧‧through hole

23a~23g‧‧‧連結環 23a~23g‧‧‧connecting ring

41‧‧‧凸緣 41‧‧‧flange

42‧‧‧間隔物 42‧‧‧Spacer

43‧‧‧載體 43‧‧‧carrier

44‧‧‧密封構件 44‧‧‧Sealing components

51b‧‧‧外周面 51b‧‧‧outer peripheral surface

54‧‧‧密封突起 54‧‧‧Sealing protrusion

60‧‧‧扣環按壓機構 60‧‧‧Clasp pressing mechanism

70‧‧‧固定具 70‧‧‧Fixer

73‧‧‧流體管線 73‧‧‧fluid pipeline

73a、73b、73c‧‧‧貫穿孔 73a, 73b, 73c‧‧‧through hole

74‧‧‧密封構件 74‧‧‧Sealing components

94‧‧‧螺絲 94‧‧‧Screws

CP‧‧‧中間點 CP‧‧‧intermediate point

Claims (11)

一種彈性膜,係用於基板保持裝置,且具備:抵接部,其係抵接於基板;圓環狀之側壁,其係直立設於前述抵接部之外周端;第一分隔壁,其係從前述側壁朝向徑方向內側以剖面觀看係直線狀延伸;第二分隔壁,其係連接於前述抵接部上面之基端部彎曲而形成基端連接部,從前述基端連接部朝向前述徑方向內側之上方以剖面觀看係在概略全長直線狀傾斜延伸;及第三分隔壁,其係位於比前述第二分隔壁更接近內周側,朝向前述徑方向內側之上方以剖面觀看係在概略全長直線狀傾斜延伸;前述第二分隔壁之傾斜與前述第三分隔壁之傾斜是平行或概略平行;並以前述第一分隔壁、前述第二分隔壁與前述側壁構成用於按壓前述基板之邊緣的邊緣壓力室。 An elastic membrane is used in a substrate holding device, and has: an abutting portion, which abuts on a substrate; an annular side wall, which is erected on the outer peripheral end of the aforesaid abutting portion; a first partition wall, which It extends linearly from the aforementioned side wall toward the inner side in the radial direction; the second partition wall, which is connected to the base end of the above-mentioned abutting portion, is bent to form a base end connecting portion, and is directed from the aforementioned base end connecting portion toward the aforementioned Viewed in cross-section, the upper part of the inner side in the radial direction extends obliquely in a substantially full length; and the third partition wall, which is located closer to the inner peripheral side than the second partition wall, faces the upper part of the inner side in the radial direction. Roughly the entire length extends linearly and obliquely; the inclination of the second partition wall and the inclination of the third partition wall are parallel or roughly parallel; and the first partition wall, the second partition wall and the side wall are used to press the substrate edge of the edge of the pressure chamber. 如申請專利範圍第1項之彈性膜,其中前述第一分隔壁與前述第二分隔壁之間隔係從前述抵接部的徑方向內側朝向徑方向外側逐漸擴大。 The elastic film as claimed in claim 1, wherein the distance between the first partition wall and the second partition wall gradually expands from the inner side in the radial direction of the contact portion toward the outer side in the radial direction. 如申請專利範圍第1項之彈性膜,其中前述基板保持裝置具備頭本體,其係安裝前述彈性膜,前述第一分隔壁在前端具有第一嚙合部,其係與前述頭本體嚙合;前述第二分隔壁在前端具有第二嚙合部,其係與前述頭本體嚙合;前述第一分隔壁與前述第二分隔壁之間隔係從前述第一嚙合部及前述第二嚙合部朝向前述側壁逐漸擴大。 Such as the elastic film of item 1 of the scope of the patent application, wherein the aforementioned substrate holding device has a head body, which is installed with the aforementioned elastic film, and the aforementioned first partition wall has a first engaging portion at the front end, which is engaged with the aforementioned head body; The two partition walls have a second engagement portion at the front end, which engages with the head body; the gap between the first partition wall and the second partition wall gradually expands from the first engagement portion and the second engagement portion toward the side wall . 如申請專利範圍第1~3項中任一項之彈性膜,其中前述第二分隔壁係從比前述側壁之內周面在0.5~1.5mm內側的位置直線狀延伸。 The elastic film according to any one of claims 1 to 3 of the patent claims, wherein the second partition wall extends linearly from a position 0.5 to 1.5 mm inner than the inner peripheral surface of the side wall. 如申請專利範圍第1~3項中任一項之彈性膜,其中在前述抵接部上面之前述第二分隔壁的外周面與前述側壁內周面之間的距離為1.5~8mm。 For the elastic film according to any one of items 1 to 3 of the scope of application, wherein the distance between the outer peripheral surface of the second partition wall above the abutting portion and the inner peripheral surface of the side wall is 1.5 to 8 mm. 如申請專利範圍第5項之彈性膜,其中在前述第二分隔壁之前述基端連接部之長度為0.5~3.5mm。 For example, the elastic film according to item 5 of the scope of the patent application, wherein the length of the connecting portion at the base end of the second partition wall is 0.5-3.5 mm. 如申請專利範圍第1~3項中任一項之彈性膜,其中構成前述邊緣壓力室之前述側壁的外周面係平坦。 The elastic membrane according to any one of the claims 1 to 3 of the patent claims, wherein the outer peripheral surface of the aforementioned side wall constituting the aforementioned edge pressure chamber is flat. 一種基板保持裝置,係保持基板,且具備:申請專利範圍第1~7項中任一項之彈性膜;及頭本體,其係安裝前述彈性膜。 A substrate holding device is used to hold a substrate, and is provided with: the elastic film according to any one of items 1 to 7 in the scope of the patent application; and a head body on which the aforementioned elastic film is installed. 如申請專利範圍第8項之基板保持裝置,其中,前述第一分隔壁在前端具有第一嚙合部,其係與前述頭本體嚙合;前述第二分隔壁在前端具有第二嚙合部,其係與前述頭本體嚙合;前述第一嚙合部與前述第二嚙合部是大致相同的高度。 The substrate holding device according to item 8 of the scope of the patent application, wherein the first partition wall has a first engaging portion at the front end, which is engaged with the head body; the second partition wall has a second engaging portion at the front end, which is Engaging with the aforementioned head body; the aforementioned first engaging portion and the aforementioned second engaging portion are approximately at the same height. 如申請專利範圍第8項之基板保持裝置,其中,前述頭本體具有延伸於徑方向外側且傾斜於下方的環傾斜部。 The substrate holding device according to claim 8 of the patent application, wherein the head body has a ring inclined portion extending radially outward and inclined downward. 一種研磨裝置,係研磨基板,且具備:研磨台,其係支撐具有研磨面之研磨墊;及申請專利範圍第8項之基板保持裝置; 以前述基板保持裝置保持前述基板,同時將前述基板朝向前述研磨面以指定壓力按壓,並且藉由使前述研磨台與前述基板保持裝置相對運動,而使前述基板與前述研磨面滑動接觸,來研磨前述基板表面。 A polishing device for polishing a substrate, comprising: a polishing table supporting a polishing pad with a polishing surface; and a substrate holding device according to claim 8 of the scope of patent application; The substrate is held by the substrate holding device while the substrate is pressed toward the polishing surface with a predetermined pressure, and the substrate is brought into sliding contact with the polishing surface by relatively moving the polishing table and the substrate holding device to perform grinding the aforementioned substrate surface.
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