CN113118966B - Bearing head for chemical mechanical polishing and using method thereof - Google Patents
Bearing head for chemical mechanical polishing and using method thereof Download PDFInfo
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- CN113118966B CN113118966B CN201911405848.1A CN201911405848A CN113118966B CN 113118966 B CN113118966 B CN 113118966B CN 201911405848 A CN201911405848 A CN 201911405848A CN 113118966 B CN113118966 B CN 113118966B
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
- B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A carrier head for chemical mechanical polishing, comprising: the device comprises a connecting shaft disc, a balance frame, a bearing disc, an annular elastic membrane, a first clamping ring and a second clamping ring; the first clamp ring clamp-bonds an outer edge of the annular elastic membrane to the carrier platter and the second clamp ring clamp-bonds an inner edge of the annular elastic membrane to the coupling platter; the middle shaft part of the balance frame is arranged in the central through hole of the coupling disc in a sliding and sealing manner and can drive the bearing disc to move up and down relative to the coupling disc through the bottom disc part and the flange part; the carrier tray is made of a non-conductive material and has a weight fixed thereon.
Description
Technical Field
The invention belongs to the technical field of chemical mechanical polishing, and particularly relates to a bearing head for chemical mechanical polishing and a using method thereof.
Background
Chemical mechanical polishing is a mainstream substrate polishing method in the field of chip manufacturing. The polishing method generally attracts and holds the substrate at the lower part of a carrier head, one surface of the substrate with a deposition layer is abutted against a rotating polishing pad, and the carrier head is driven by a driving part to rotate in the same direction as the polishing pad and give a downward load to the substrate; meanwhile, the polishing solution is supplied to the upper surface of the polishing pad and distributed between the substrate and the polishing pad, so that the substrate is polished globally under the combined action of chemistry and machinery.
The carrier head is an important component of the chemical mechanical polishing apparatus, and the operation performance of the carrier head is directly related to the chemical mechanical polishing effect of the substrate. US20130065495a1 discloses a carrier head comprising a carrier tray and a flexible membrane detachably arranged at the lower part of the carrier tray; the carrier tray includes a first portion and a second portion, the first portion being movably disposed concentrically within an upper recess of the second portion such that the first portion and the second portion are movable relative to each other in a direction perpendicular to a bottom surface of the carrier tray. The flexible membrane is arranged below the second part, so that a plurality of air cavities are formed between the second part and the flexible membrane, and the pressure profile of the substrate can be adjusted by adjusting the pressure of each independent air cavity. In the prior art, external air enters the channel inside the first part through the air holes on the upper surface of the first part and flows out from the air holes on the side wall of the first part, and then is conveyed to the air holes on the upper surface of the second part which are respectively communicated with the independent air cavities through the air pipes.
The lower portion of the carrier head is provided with a retaining ring, which plays an important role in the chemical mechanical polishing of the substrate. On the one hand, it can prevent the substrate from slipping or flying off the bottom of the carrier head during polishing; on the other hand, the bottom of the retaining ring is provided with a groove which can provide a fluid passage for polishing liquid between the renewed substrate and the polishing pad; moreover, the retaining ring is pressed against the polishing pad to participate in the adjustment of the edge pressure of the substrate, which is beneficial to realizing the global planarization of the substrate and improving the uniformity of the planarization.
In the chemical mechanical polishing process, in order to adjust the material removal rate in real time, the thickness of the material layer to be removed needs to be measured on line, and when the material to be removed is metal, the eddy current film thickness measuring method is more applicable. The existing eddy current film thickness measuring device generates an alternating electromagnetic field signal through a signal generator, so that an eddy current is formed in a metal film of a substrate, and detects an inductance change signal caused by the eddy current in the metal film through a sensor, thereby determining the thickness of the metal film.
The detection accuracy requirement of the chemical mechanical polishing end point detection is improved along with the continuous reduction of the size of the characteristic structure, and because metal parts or metal materials are contained in the components such as the retaining ring of the traditional chemical mechanical polishing bearing head and the like, eddy current can be generated in the metal parts in the eddy current film thickness measurement, so that the signal acquired by the sensor can be interfered, and the accuracy of the end point detection is influenced. It is therefore desirable to ensure that the metal structures of the carrier head interfere as little as possible with the measurement signals when measuring the thickness of the metal structure features of the substrate to determine the chemical mechanical polishing endpoint.
To mitigate electromagnetic interference, the body of the carrier head used to polish the metal layer can be made of plastic. This has two further effects: the weight of the bearing head is reduced, the downward pressure during polishing is reduced, and the polishing result is influenced; the rotational inertia of the carrier head is reduced, the inertia of the motor is not matched with the load inertia, and the stability is deteriorated. Thus, two different sets of hardware and software are required for polishing both metallic and non-metallic carrier heads.
Disclosure of Invention
The invention provides a counter weight method of a chemical mechanical polishing bearing head, which aims to solve one of the technical problems to a certain extent, and adopts the following technical scheme: a carrier head for chemical mechanical polishing, comprising: the device comprises a connecting shaft disc, a balance frame, a bearing disc, an annular elastic membrane, a first clamping ring and a second clamping ring; the first clamp ring clamp-bonds an outer edge of the annular elastic membrane to the carrier platter and the second clamp ring clamp-bonds an inner edge of the annular elastic membrane to the coupling platter; the middle shaft part of the balance frame is arranged in the central through hole of the coupling disc in a sliding and sealing manner and can drive the bearing disc to move up and down relative to the coupling disc through the bottom disc part and the flange part; the carrier tray is made of a non-conductive material and has a weight fixed thereon.
Further, the first clamping ring is made of a metal material.
Further, the upper surface of the bearing disc is detachably connected with a first counterweight ring, and the first counterweight ring is made of a metal material.
Furthermore, a balance weight is fixed on the coupling disc.
Further, the second clamping ring is made of a metal material.
Further, a second counterweight ring is detachably connected to the upper surface of the coupling disc, and the second counterweight ring is made of a metal material.
According to another aspect of the present invention, the present invention also provides a method of using a carrier head for chemical mechanical polishing, comprising the steps of: s1, determining the weight of a bearing disc made of a non-conductive material; s2, determining a counterweight value to be increased according to the weight of the bearing plate; s3, determining the material and the volume of the first clamping ring according to the weight value to be increased; and S4, determining the appearance of the first clamping ring according to the rotational inertia of the bearing head.
As an improvement, the use method of the bearing head comprises the following steps: s1, determining the weight of a bearing disc made of a non-conductive material; s2, determining a counterweight value to be increased according to the weight of the bearing plate; s3, determining the material and the volume of the first counterweight ring according to the counterweight value to be increased; and S4, determining the shape of the first counterweight ring according to the rotational inertia of the bearing head.
Further, the using method further comprises the following steps: and S5, determining the material, the volume and the shape of the second clamping ring according to the rotational inertia of the bearing head.
Compared with the prior art, the embodiment of the invention has the beneficial effects that: the interference of the bearing head main body to the detection signal in the process of measuring the thickness of the eddy current metal film is reduced, and the detection precision is improved; the universality of the bearing head is improved, two sets of driving systems do not need to be designed, and the cost is reduced.
Drawings
The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only and do not limit the scope of protection of the invention, wherein:
FIG. 1 is a schematic perspective view of the basic structural configuration of a polishing unit;
FIG. 2 is a cross-sectional view of a prior art chemical mechanical polishing carrier head;
FIG. 3 is a cross-sectional view of a chemical mechanical polishing carrier head used to remove a layer of metallic material;
FIG. 4 is an enlarged partial view of the carrier head shown in FIG. 3;
FIG. 5 shows a carrier head with a first counterweight ring and a first clamp ring removably attached coaxially over the carrier platter;
figure 6 shows the carrier head with the second counterweight ring removably attached to the adapter plate coaxially with the second clamping ring.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the invention, and are presented to illustrate the concepts of the invention; the description is illustrative and exemplary in nature and is not to be construed as limiting the embodiments of the invention and the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein. In order to explain the technical means of the present invention, the following description will be given by way of specific examples.
Fig. 1 is a schematic perspective view of the basic structural configuration of a polishing unit including a polishing disk 10, a polishing pad 20, a substrate carrier device 30, a dressing device 40, and a polishing liquid supply device 50; the polishing pad 20 is disposed on the upper surface of the polishing disk 10 and rotates around the shaft synchronously therewith; a horizontally movable substrate carrier 30 disposed above the polishing pad 20, and coupled to a lower surface of a carrier head to which a substrate W to be polished is sucked; the dressing device 40 comprises a dressing arm 41 and a dressing head 42, wherein the dressing arm 41 drives the rotating dressing head 42 to swing so as to dress the surface of the polishing pad 20 to an optimal state suitable for polishing; the polishing liquid supply device 50 spreads the polishing liquid over the upper surface of the polishing pad 20; when performing the chemical mechanical polishing operation, the substrate carrier 30 presses the surface of the substrate W to be polished against the upper surface of the polishing pad 20, and the polishing liquid is distributed between the polishing pad 20 and the substrate W, so as to remove the substrate material under the chemical and mechanical actions. The substrate carrier 30 includes a carrier head 31 and an Upper Pneumatic Assembly 32 (UPA), the carrier head 31 being coupled to the Upper Pneumatic Assembly 32 by a connection Assembly (not shown). When the material layer to be removed on the substrate is a metal layer, the thickness of the metal layer and the polishing endpoint can be detected in real time by adopting an eddy current mode, the eddy current detection device 11 embedded between the polishing disk 10 and the polishing pad 20 emits electromagnetic waves in the direction of the substrate W to measure the thickness of the metal layer on the surface of the substrate to capture the polishing endpoint, but metal parts inside the carrier head 31 can generate eddy currents and electromagnetic wave reflection to further influence the signal measurement accuracy of the eddy current detection device 11, and particularly, metal parts which are positioned lower in the carrier head and are close to the substrate W can obviously influence the detection of the polishing endpoint.
Fig. 2 is a cross-sectional view of a prior art cmp carrier head, the carrier head 31 including a coupling plate 311, a balance frame 312, a carrier plate 313, an annular elastic membrane 314, a first clamp ring 315, a second clamp ring 316, and the like. Wherein, the coupling disc 311 is coupled to an external driving assembly through a not-shown connecting assembly to drive the whole carrier head 31 to move and/or rotate; the first clamp ring 315 clamp-couples the outer edge of the annular elastic membrane 314 to the carrier disc 313 and the second clamp ring 316 clamp-couples the inner edge of the annular elastic membrane 314 to the coupling disc 311 so that the carrier disc 313 can rotate integrally with the coupling disc 311; a balance frame 312 having a middle shaft portion, a base portion, a peripheral wall portion, and a flange portion is coaxially disposed with the coupling plate 311, wherein the shaft portion is slidably inserted into a central shaft hole of the coupling plate 311 and is movable in a vertical direction therein, and the flange portion thereof is coupled to a central stepped hole of the carrier plate 313 by means of a washer, a third clip ring, and a bolt, not shown, so that the carrier plate 313 rotates together with the balance frame 312 and/or moves in the vertical direction; the pressure of the pressure-adjustable chamber can be adjusted by a through hole in the coupling disc 311 extending in the vertical direction parallel to the middle shaft portion of the balance frame 312 to adjust the displacement of the carrier disc 313 in the vertical direction relative to the coupling disc 311; in the carrier head 31, the carrier plate 313 and the portion fixedly connected with the carrier plate 313 may be collectively referred to as a floating portion, the coupling plate 311 and the portion fixedly connected with the coupling plate 311 may be collectively referred to as a fixed portion, and the floating portion may be controlled to move up and down in the vertical direction with respect to the fixed portion while rotating integrally with the fixed portion and/or translating integrally.
Fig. 3 is a cross-sectional view of a cmp carrier head for removing a metal material layer, and since the carrier plate 313 of the carrier head 31 in the prior art is usually made of a metal material such as an aluminum alloy, an eddy current is also generated in the carrier plate 313 made of a metal material in the eddy current measurement, which may interfere with the signal obtained by the eddy current detecting device 11 and affect the accuracy of the end point detection. For this reason, the carrier plate 313 may be made of hard engineering plastic such as PPS, PEEK, polycarbonate, polyurethane, or PET, and the insulating property of the plastic may be used to prevent the generation of eddy current and improve the detection accuracy. Because the density of the plastic is low, if the carrier disc 313 in the existing carrier head 31 is directly replaced by a non-metal material from a metal material, the total weight of the carrier head 31 will be reduced, and if the carrier head 31 after the replacement is directly applied to the original polishing unit, the lower pressure will be reduced, and if the original polishing parameters are continuously adopted, the obtained polishing results will be different; meanwhile, the improved moment of inertia of the carrier head 31 is reduced, so that the moment of inertia of the motor of the original driving assembly is not matched with the moment of inertia of the load, and the stability of the system is deteriorated. Therefore, if the carrier plate 313 is directly replaced by a non-metal material, the hardware and software of the polishing unit need to be modified adaptively, i.e. the original carrier head of the metal carrier plate and the improved carrier head of the plastic carrier plate need to correspond to two different sets of hardware and software in use.
In order to improve the versatility of the carrier head and reduce the cost of use, the carrier head may be counterbalanced. Fig. 4 is a partial enlarged view of fig. 3, and when the carrier plate 313 is made of plastic, a weight is fixed above the carrier plate 313. For example, the weight of the first clamping ring 315 of the conventional carrier head 31 can be increased, and the material thereof is changed from engineering plastics to a material with a higher density, such as stainless steel or tungsten alloy, and the outer diameter, thickness, etc. of the first clamping ring 315 can be increased, so that the increased weight of the first clamping ring 315 in the improved carrier head 31 is the same as the reduced weight of the carrier disc 313, and thus the total weight of the floating portion of the carrier head 31 is not changed, thereby ensuring that the downforce of the carrier head 31 is not changed when the same polishing parameters are adopted. Because the first clamping ring 315 is located above the carrier plate 313 and is far from the eddy current testing device 11, the intensity of eddy current generated inside the first clamping ring is low, and the interference on the eddy current thickness measurement is small and can be ignored.
On the other hand, the profile of the first clamp ring 315 may be designed with consideration to the moment of inertia of the carrier head 31 after modification, and the moment of inertia may be as close as possible to the moment of inertia of an existing carrier head, and the steps for weighting the carrier head 31 according to the above method are as follows: determining the weight of the carrier plate 313 made of a non-conductive material such as plastic; determining the weight value to be increased according to the weight of the bearing disc 313; determining the material and volume of the first clamping ring 315 according to the weight value to be added; the profile of the first clamp ring 315 is determined based on the moment of inertia of the carrier head 31.
Similarly, a separate first weight ring 317 may be provided on the upper surface of the carrier plate 313, as shown in fig. 5, the first weight ring 317 being coaxially provided with the first clamping ring 315 and being detachably attached to the carrier plate 313. The first weight ring 317 may be made of a material with a relatively high density, such as stainless steel or tungsten alloy, and the first weight ring 317 may be sized according to the weight reduction of the carrier plate 313 made of plastic, so that the weight of the first weight ring 317 is the same as the weight reduction of the carrier plate 313.
On the other hand, the profile of the first weight ring 317 may be designed with consideration of the moment of inertia of the carrier head 31 after modification, and the moment of inertia should be as close as possible to the moment of inertia of the conventional carrier head, and the steps of weighting the carrier head 31 according to the above method are as follows: determining the weight of the carrier plate 313 made of a non-conductive material such as plastic; determining the weight value to be increased according to the weight of the bearing disc 313; determining the material and the volume of the first counterweight ring 317 according to the counterweight value required to be increased; the profile of the first counterweight ring 317 is determined by the moment of inertia of the carrier head 31.
The weight design can ensure that the weight of the floating part of the carrier head 31 is not changed, so that the downward pressure of the carrier head on the substrate is not changed under the same polishing parameters. However, because the radial weight distribution of the carrier platter 313 is closer to its outer circumference, the moment of inertia of the carrier head 31 may still be reduced due to the weighted design of the carrier platter 313, which may be made of plastic. For this purpose, the fixed part of the carrier head 31 may be further weighted. For example, the second clamp ring 316 of the conventional carrier head 31 may be weighted, and the material thereof may be changed from engineering plastics to a material with a higher density, such as stainless steel or tungsten alloy, and the outer diameter, thickness, etc. of the second clamp ring 316 may also be increased, so that the increased rotational inertia of the fixed portion in the improved carrier head 31 is the same as the decreased rotational inertia of the floating portion, thereby keeping the overall rotational inertia of the carrier head 31 constant, and further ensuring that the system stability is not changed when the same driving assembly is used. Since the second clamping ring 316 is located above the carrier plate 313 and is far away from the eddy current testing device 11, the intensity of the eddy current generated inside the second clamping ring is low, and the interference on the eddy current thickness measurement is small and can be ignored. The steps of weighting the carrier head 31 according to the above method are as follows: determining the weight of the carrier plate 313 made of a non-conductive material such as plastic; determining the weight value to be increased according to the weight of the bearing disc 313; determining the material and volume of the first clamping ring 315 and/or the first counterweight ring 317 according to the counterweight value to be added; determining the profile of the first clamping ring 315 and/or the first counterweight ring 317 based on the moment of inertia of the carrier head 31; the material, volume and profile of the second clamp ring 316 are determined by the moment of inertia of the carrier head 31.
Similarly, a separate second weight ring 318 may be provided on the upper surface of the coupling disk 311, as shown in fig. 6, the second weight ring 318 being disposed coaxially with the second clip ring 316 and being detachably attached to the coupling disk 311. The second counter-weight ring 318 may be made of a denser material such as stainless steel or tungsten alloy, and the second counter-weight ring 318 may be sized to reduce the moment of inertia of the carrier head 31 as a whole, depending on the reduction in moment of inertia of the carrier plate 313 when it is made of plastic. The steps of weighting the carrier head 31 according to the above method are as follows: determining the weight of the carrier plate 313 made of a non-conductive material such as plastic; determining the weight value to be increased according to the weight of the bearing disc 313; determining the material and volume of the first clamping ring 315 and/or the first counterweight ring 317 according to the counterweight value to be added; determining the profile of the first clamp ring 315 and/or the first counterweight ring 317 based on the moment of inertia of the carrier head 31; the material, volume and profile of the second weight ring 318 are determined by the moment of inertia of the carrier head 31.
In the above embodiments, the description of each embodiment has a respective emphasis, and the embodiments may be combined arbitrarily, and a new embodiment formed by combining the embodiments is also within the scope of the present application. For parts which are not described or illustrated in a certain embodiment, reference may be made to the description of other embodiments.
The above-mentioned embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present invention, and they should be construed as being included therein.
Claims (8)
1. A carrier head for chemical mechanical polishing, comprising: the device comprises a connecting shaft disc, a balance frame, a bearing disc, an annular elastic membrane, a first clamping ring and a second clamping ring; the first clamp ring clamp-bonds an outer edge of the annular elastic membrane to the carrier platter and the second clamp ring clamp-bonds an inner edge of the annular elastic membrane to the coupling platter; the middle shaft part of the balance frame is arranged in the central through hole of the coupling disc in a sliding and sealing manner and can drive the bearing disc to move up and down relative to the coupling disc through the bottom disc part and the flange part; the bearing disc is made of non-conductive materials, and a first counterweight ring is fixed above the bearing disc; a balance weight is fixed on the coupling disc; the upper surface of the coupling disc is detachably connected with a second counterweight ring, and the second counterweight ring is made of a metal material; and determining the material, volume and appearance of the first counterweight ring and the second counterweight ring according to the rotational inertia of the bearing head.
2. The carrier head of claim 1, wherein the first clamp ring is made of a metallic material.
3. The carrier head of claim 1, wherein the first weighted ring is removably attached to the upper surface of the carrier platter, the first weighted ring being made of a metallic material.
4. The carrier head of claim 1, wherein the second clamp ring is made of a metallic material.
5. A method of using a carrier head for chemical mechanical polishing, adapted for use with the carrier head of any of claims 1-4, comprising the steps of:
s1, determining the weight of a bearing disc made of a non-conductive material;
s2, determining a counterweight value to be increased according to the weight of the bearing plate;
s3, determining the material and the volume of the first clamping ring according to the weight value to be increased;
and S4, determining the appearance of the first clamping ring according to the rotational inertia of the bearing head.
6. A method of using a carrier head for chemical mechanical polishing, adapted for use with the carrier head of any of claims 1-4, comprising the steps of:
s1, determining the weight of a bearing disc made of a non-conductive material;
s2, determining a counterweight value to be increased according to the weight of the bearing plate;
s3, determining the material and the volume of the first counterweight ring according to the counterweight value to be increased;
and S4, determining the shape of the first counterweight ring according to the rotational inertia of the bearing head.
7. Use according to claim 5 or 6, further comprising the steps of:
and S5, determining the material, the volume and the shape of the second clamping ring according to the rotational inertia of the bearing head.
8. Use according to claim 5 or 6, further comprising the steps of:
and S5, determining the material, the volume and the shape of the second counterweight ring according to the rotational inertia of the bearing head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911405848.1A CN113118966B (en) | 2019-12-31 | 2019-12-31 | Bearing head for chemical mechanical polishing and using method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911405848.1A CN113118966B (en) | 2019-12-31 | 2019-12-31 | Bearing head for chemical mechanical polishing and using method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN113118966A CN113118966A (en) | 2021-07-16 |
| CN113118966B true CN113118966B (en) | 2022-08-16 |
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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