TW201836038A - Substrate processing device - Google Patents

Substrate processing device Download PDF

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Publication number
TW201836038A
TW201836038A TW107104725A TW107104725A TW201836038A TW 201836038 A TW201836038 A TW 201836038A TW 107104725 A TW107104725 A TW 107104725A TW 107104725 A TW107104725 A TW 107104725A TW 201836038 A TW201836038 A TW 201836038A
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Taiwan
Prior art keywords
pressing member
processing apparatus
end portion
substrate processing
substrate
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TW107104725A
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Chinese (zh)
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TWI654702B (en
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福本靖博
田中裕二
石井丈晴
松尾友宏
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日商斯庫林集團股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers

Abstract

A substrate processing device 1 comprises a housing 11, a lid 13, a pressing member 6, a fastener 7, and a manual adjustment part 8. The housing 11 has an opening in the upper surface thereof. The lid 13 opens and closes the opening of the housing 11 by attaching to and detaching from the housing 11. The pressing member 6 has a first end part 21 and a second end part 22. The pressing member 6 presses the lid 13 against the housing 11. The fastener 7 contacts the first end part 21 of the pressing member 6, and prohibits the first end part 21 from moving upward. The manual adjustment part 8 adjusts the height position of the second end part 22 of the pressing member 6 by a user operation.

Description

基板處理裝置Substrate processing device

本發明是有關於一種對基板進行處理的基板處理裝置。基板為半導體晶圓(wafer)、光罩(photo mask)用基板、液晶顯示用基板、電漿顯示器(plasma display)用基板、有機電激發光(Electro-Luminescence,EL)用基板、場發射顯示器(Field Emission Display,FED)用基板、光顯示器用基板、磁碟用基板、光碟用基板、光磁碟用基板、太陽能電池用基板等。The present invention relates to a substrate processing apparatus for processing a substrate. The substrate is a semiconductor wafer, a photomask substrate, a liquid crystal display substrate, a plasma display substrate, an organic electroluminescence (EL) substrate, and a field emission display. (Field Emission Display, FED) substrate, substrate for optical display, substrate for disk, substrate for optical disk, substrate for optical disk, substrate for solar cell, and the like.

專利文獻1揭示了對基板進行熱處理的基板處理裝置。基板處理裝置具備板(plate)、蓋及蓋升降機構。基板載置於板上。板對板上的基板進行加熱。板的上方的空間是對基板進行處理的處理空間。蓋對處理空間的上方的開口(以下,稱為「上部開口」)進行開閉。蓋升降機構使蓋移動至上方位置及下方位置。蓋處於上方位置時,上部開口開放。即,處理空間開放。蓋處於下方位置時,上部開口閉塞。即,處理空間密閉。控制部對蓋升降機構進行控制。Patent Document 1 discloses a substrate processing apparatus that heat-treats a substrate. The substrate processing apparatus includes a plate, a lid, and a lid lifting mechanism. The substrate is placed on a board. The board heats the substrate on the board. The space above the board is the processing space for processing the substrate. The cover opens and closes an opening above the processing space (hereinafter referred to as an "upper opening"). The lid lifting mechanism moves the lid to the upper position and the lower position. When the lid is in the upper position, the upper opening is open. That is, the processing space is open. When the lid is in the lower position, the upper opening is closed. That is, the processing space is sealed. The control unit controls the lid lifting mechanism.

將基板搬入處理空間的順序如下。蓋升降機構依據控制部的控制而使蓋移動至上方位置。藉此,上部開口開放。基板以大致水平姿勢的狀態自上部開口的上方降下。藉此,基板通過上部開口進入處理空間。基板載置於板上。之後,蓋升降機構依據控制部的控制而使蓋移動至下方位置。藉此,上部開口閉塞。The order in which the substrate is carried into the processing space is as follows. The lid lifting mechanism moves the lid to the upper position according to the control of the control unit. Thereby, the upper opening is open. The substrate is lowered from above the upper opening in a substantially horizontal posture. Thereby, the substrate enters the processing space through the upper opening. The substrate is placed on a board. Thereafter, the lid elevating mechanism moves the lid to the lower position in accordance with the control of the control unit. Thereby, the upper opening is closed.

將基板搬出處理空間的順序如下。蓋升降機構依據控制部的控制而使蓋移動至上方位置。藉此,上部開口開放。基板以大致水平姿勢的狀態,自板離開並向上方移動。藉此,基板通過上部開口而自處理空間送出。The order in which the substrate is carried out of the processing space is as follows. The lid lifting mechanism moves the lid to the upper position according to the control of the control unit. Thereby, the upper opening is open. The substrate is separated from the panel and moved upward in a substantially horizontal posture. Thereby, the substrate is sent out from the processing space through the upper opening.

如此,上部開口相當於用以供基板進入處理空間且自處理空間送出的搬送口。 [現有技術文獻] [專利文獻]In this manner, the upper opening corresponds to a transfer port for the substrate to enter the processing space and be sent out from the processing space. [Prior Art Document] [Patent Literature]

[專利文獻1]日本專利特開2014-22570號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2014-22570

[發明所欲解決之課題][Problems to be solved by the invention]

於先前例的基板處理裝置中,搬送口的面積比較大。因此,有時難以確保處理空間的氣密性。In the substrate processing apparatus of the prior art, the area of the transfer port is relatively large. Therefore, it is sometimes difficult to ensure the airtightness of the processing space.

本發明是鑒於所述情況而成,目的在於提供一種能夠提高處理容器的氣密性的基板處理裝置。 [解決課題之手段]The present invention has been made in view of the above circumstances, and an object thereof is to provide a substrate processing apparatus capable of improving airtightness of a processing container. [Means for solving the problem]

本發明者等嘗試變更處理容器的搬送口的配置。具體而言,本發明者等探討了於側面具有搬送口且於上表面不具有開口的處理容器。於此情況下,基板藉由以大致水平姿勢的狀態沿大致水平方向移動而通過搬送口。因此,即便搬送口的面積小,基板亦能夠通過搬送口。從而,能夠藉由減小搬送口的面積來提高處理容器的氣密性。The inventors of the present invention attempted to change the arrangement of the transfer port of the processing container. Specifically, the inventors of the present invention have examined a processing container having a transfer port on the side surface and no opening on the upper surface. In this case, the substrate passes through the transfer port by moving in a substantially horizontal direction in a substantially horizontal posture. Therefore, even if the area of the transfer port is small, the substrate can pass through the transfer port. Therefore, the airtightness of the processing container can be improved by reducing the area of the transfer port.

但是,本發明者等發現了所述處理容器具有新的問題。即,於所述處理容器的情況下,因搬送口小,因此處理容器的維護困難。However, the inventors have found that the processing container has a new problem. That is, in the case of the processing container, since the transfer port is small, maintenance of the processing container is difficult.

因此,本發明者等探討了於側面具有搬送口且於上表面具有開口(以下,適當地稱為「上部開口」)的處理容器。具體而言,處理容器具備框體、遮擋板(shutter)及蓋部。遮擋板對搬送口進行開閉。蓋部對上部開口進行開閉。Therefore, the inventors of the present invention have examined a processing container having a transfer port on the side surface and an opening on the upper surface (hereinafter, referred to as "upper opening" as appropriate). Specifically, the processing container includes a housing, a shutter, and a lid. The shielding plate opens and closes the conveying port. The lid portion opens and closes the upper opening.

進而,本發明者等探討了藉由多個螺栓(bolt)來將蓋部緊固於框體。藉由螺栓,蓋部與框體牢固地密合。因此,能夠恰當地維持處理容器的氣密性。再者,螺栓的拆裝與蓋部相對於框體的拆裝藉由用戶的手工作業來進行。Further, the inventors of the present invention have considered that the cover portion is fastened to the frame by a plurality of bolts. The cover portion is firmly adhered to the frame by the bolt. Therefore, the airtightness of the processing container can be appropriately maintained. Furthermore, the attachment and detachment of the bolt and the attachment and detachment of the cover to the frame are performed by the user's manual work.

但是,本發明者等發現了所述處理容器具有新的問題。即,將蓋部緊固於框體的螺栓的數量為多個,因此拆裝螺栓的作業變得繁雜。進而,於處理容器的周圍的作業空間狹小的情況下,拆裝螺栓的作業變得困難。進而,於處理容器成為高溫的情況下,有產生螺栓的燒接或黏著之虞。若產生螺栓的燒接或黏著,則無法容易地將螺栓取下。該些的結果,無法容易地將蓋部拆裝於框體。從而,無法容易地進行維護。However, the inventors have found that the processing container has a new problem. That is, since the number of the bolts that fasten the lid portion to the frame body is plural, the work of attaching and detaching the bolt becomes complicated. Further, when the working space around the processing container is narrow, the work of attaching and detaching the bolt becomes difficult. Further, when the processing container is heated to a high temperature, there is a possibility that the bolt is burned or adhered. If the bolt is burned or adhered, the bolt cannot be easily removed. As a result of these results, the lid portion cannot be easily attached and detached to the frame. Therefore, maintenance cannot be easily performed.

本發明者等基於該些見解進一步探討了能夠提高處理容器的氣密性且能夠容易地進行處理容器的維護的基板處理裝置。Based on these findings, the inventors of the present invention further explored a substrate processing apparatus capable of improving the airtightness of the processing container and facilitating maintenance of the processing container.

本發明藉由此種試行、見解以及探討而得,並採用如下構成。即,本發明是一種基板處理裝置,具備:框體,所述框體於其上表面具有開口;蓋部,藉由拆裝於所述框體而對所述開口進行開閉;按壓構件,具有第1端部及第2端部,並對所述框體按壓所述蓋部;止動件,與所述按壓構件的所述第1端部接觸,並禁止所述第1端部向上方移動;以及手動調整部,藉由用戶的操作而對所述按壓構件的所述第2端部的高度位置進行調整。The present invention has been derived from such trials, insights, and discussions, and has the following constitution. That is, the present invention is a substrate processing apparatus including: a frame having an opening on an upper surface thereof; a lid portion opening and closing the opening by being attached to the frame; and a pressing member having The first end portion and the second end portion press the lid portion on the frame body; the stopper contacts the first end portion of the pressing member, and prohibits the first end portion from being upward And a manual adjustment unit that adjusts a height position of the second end portion of the pressing member by a user operation.

基板處理裝置具備按壓構件、止動件及手動調整部。因此,能夠於禁止了按壓構件的第1端部向上方移動的狀態下,降低按壓構件的第2端部的高度位置。藉此,按壓構件能夠對框體適宜地按壓蓋部。藉此,能夠提高處理容器的氣密性。The substrate processing apparatus includes a pressing member, a stopper, and a manual adjustment unit. Therefore, the height position of the second end portion of the pressing member can be lowered in a state where the first end portion of the pressing member is prohibited from moving upward. Thereby, the pressing member can press the lid portion appropriately for the frame body. Thereby, the airtightness of the processing container can be improved.

進而,能夠於禁止了按壓構件的第1端部向上方移動的狀態下,提高按壓構件的第2端部的高度位置。藉此,能夠解除按壓構件對蓋部的按壓。藉此,能夠容易地將蓋部自框體分離。即,能夠容易地開放開口。從而,能夠容易地進行處理容器的維護。Further, in a state where the first end portion of the pressing member is prohibited from moving upward, the height position of the second end portion of the pressing member can be increased. Thereby, the pressing of the lid member by the pressing member can be released. Thereby, the lid portion can be easily separated from the frame body. That is, the opening can be easily opened. Thereby, the maintenance of the processing container can be easily performed.

於所述基板處理裝置中,較佳為,所述按壓構件的所述第1端部於俯視時位於所述蓋部的一側,所述按壓構件的所述第2端部於俯視時位於與所述蓋部的一側相反的另一側。於俯視時,蓋部配置於第1端部與第2端部之間。因此,藉由手動調整部對按壓構件的第2端部的高度位置進行調整,從而能夠恰當地改變按壓構件按壓蓋部的力。In the substrate processing apparatus, preferably, the first end portion of the pressing member is located on one side of the lid portion in a plan view, and the second end portion of the pressing member is located in a plan view. The other side opposite to the side of the cover. The cover portion is disposed between the first end portion and the second end portion in plan view. Therefore, by adjusting the height position of the second end portion of the pressing member by the manual adjustment portion, the force by which the pressing member presses the lid portion can be appropriately changed.

於所述基板處理裝置中,較佳為,所述框體於俯視時具有大致矩形形狀,所述蓋部於俯視時配置於所述框體的大致中央,所述按壓構件的所述第1端部以及所述止動件於俯視時配置於所述框體的第1角部,所述按壓構件的所述第2端部以及所述手動調整部於俯視時配置於與所述第1角部對向的所述框體的第2角部。藉此,能夠利用第1角部的空間來效率良好地配置按壓構件的第1端部以及止動件。進而,能夠利用第2角部的空間來效率良好地配置按壓構件的第2端部以及手動調整部。藉此,能夠減小基板處理裝置的設置面積。In the substrate processing apparatus, preferably, the frame body has a substantially rectangular shape in a plan view, and the cover portion is disposed substantially at a center of the frame body in a plan view, and the first member of the pressing member The end portion and the stopper are disposed at a first corner portion of the frame in a plan view, and the second end portion of the pressing member and the manual adjustment portion are disposed in the first portion in a plan view The second corner of the frame facing the corner. Thereby, the first end portion of the pressing member and the stopper can be efficiently arranged by the space of the first corner portion. Further, the second end portion of the pressing member and the manual adjustment portion can be efficiently arranged by the space of the second corner portion. Thereby, the installation area of the substrate processing apparatus can be reduced.

於所述基板處理裝置中,較佳為,所述基板處理裝置具備配置於所述框體的側方且能夠拆卸的外壁板,所述手動調整部配置於較所述止動件更靠近所述外壁板的位置。於已拆卸下外壁板的狀態下,用戶能夠容易地操作手動調整部。藉此,能夠更容易地進行處理容器的維護。In the substrate processing apparatus, preferably, the substrate processing apparatus includes an outer wall plate that is detachably disposed on a side of the housing, and the manual adjustment unit is disposed closer to the stopper than the substrate The position of the outer wall. The user can easily operate the manual adjustment portion in a state where the lower outer wall panel has been removed. Thereby, maintenance of the processing container can be performed more easily.

於所述基板處理裝置中,較佳為,所述手動調整部安裝於所述框體,並使所述按壓構件的所述第2端部相對於所述框體而上下移動。手動調整部安裝於框體,因此能夠恰當地設置手動調整部。進而,手動調整部使按壓構件的第2端部相對於框體而上下移動,因此,手動調整部能夠恰當地調整按壓構件的第2端部的高度位置。In the substrate processing apparatus, preferably, the manual adjustment unit is attached to the housing, and the second end of the pressing member is moved up and down with respect to the housing. Since the manual adjustment unit is attached to the casing, the manual adjustment unit can be appropriately provided. Further, since the manual adjustment portion vertically moves the second end portion of the pressing member with respect to the casing, the manual adjustment portion can appropriately adjust the height position of the second end portion of the pressing member.

於所述基板處理裝置中,較佳為,所述手動調整部包括螺釘,對應於所述螺釘的轉動,所述按壓構件的所述第2端部進行上下移動。僅由用戶轉動螺釘便能夠容易地對按壓構件的第2端部的高度位置進行調整。In the above substrate processing apparatus, preferably, the manual adjustment unit includes a screw, and the second end portion of the pressing member moves up and down in response to rotation of the screw. The height position of the second end portion of the pressing member can be easily adjusted only by the user turning the screw.

於所述基板處理裝置中,較佳為,所述螺釘是旋輪螺栓。用戶不使用工具便能夠轉動旋輪螺栓。藉此,用戶能夠更容易地對按壓構件的第2端部的高度位置進行調整。In the substrate processing apparatus, preferably, the screw is a screw bolt. The user can turn the wheel bolt without using a tool. Thereby, the user can more easily adjust the height position of the second end portion of the pressing member.

於所述基板處理裝置中,較佳為,所述按壓構件於俯視時具有環形狀,且於俯視時具有與所述蓋部重疊的外框。按壓構件包括外框,因此,按壓構件能夠對框體有效果地按壓蓋部。In the substrate processing apparatus, it is preferable that the pressing member has a ring shape in a plan view and has an outer frame that overlaps the lid portion in a plan view. Since the pressing member includes the outer frame, the pressing member can press the cover portion in an effective manner on the frame.

於所述基板處理裝置中,較佳為,所述外框的輪廓具有大致多邊形狀。外框的輪廓具有大致多邊形狀,因此能夠有效果地防止外框的撓曲或形變。藉此,按壓構件能夠比較均勻地按壓蓋部。In the substrate processing apparatus, preferably, the outline of the outer frame has a substantially polygonal shape. The outline of the outer frame has a substantially polygonal shape, so that the deflection or deformation of the outer frame can be effectively prevented. Thereby, the pressing member can press the lid portion relatively uniformly.

於所述基板處理裝置中,較佳為,所述按壓構件具有增強構件,所述增強構件於俯視時配置於所述外框的內側且所述增強構件的兩端與所述外框接合。按壓構件具有增強構件,因此能夠更有效果地防止外框的撓曲或形變。藉此,按壓構件能夠更均勻地按壓蓋部。In the substrate processing apparatus, preferably, the pressing member has a reinforcing member that is disposed inside the outer frame in a plan view and that both ends of the reinforcing member are joined to the outer frame. The pressing member has the reinforcing member, so that the deflection or deformation of the outer frame can be prevented more effectively. Thereby, the pressing member can press the cover portion more uniformly.

於所述基板處理裝置中,較佳為,所述按壓構件具有三個以上的座部,所述座部直接或間接連接於所述外框且與所述蓋部接觸。按壓構件具有座部,因此,按壓構件能夠更適宜地按壓蓋部。In the substrate processing apparatus, preferably, the pressing member has three or more seat portions, and the seat portion is directly or indirectly connected to the outer frame and is in contact with the cover portion. Since the pressing member has a seat portion, the pressing member can more appropriately press the lid portion.

於所述基板處理裝置中,較佳為,所述按壓構件具有彈性構件,所述彈性構件設於所述外框與所述座部之間。按壓構件具有彈性構件,因此,各座部分別能夠更適宜地按壓蓋部。In the substrate processing apparatus, preferably, the pressing member has an elastic member, and the elastic member is provided between the outer frame and the seat. Since the pressing member has the elastic member, each of the seat portions can press the cover portion more suitably.

於所述基板處理裝置中,較佳為,所述按壓構件能夠自所述止動件以及所述手動調整部分離。於按壓構件已自止動件以及手動調整部分離的狀態下,能夠容易地將蓋部拆裝於框體。進而,於按壓構件已自止動件以及手動調整部分離的狀態下,能夠更容易地進行處理容器的維護。In the substrate processing apparatus, preferably, the pressing member is separable from the stopper and the manual adjustment portion. In a state in which the pressing member has been separated from the stopper and the manual adjustment portion, the lid portion can be easily attached and detached to the frame. Further, in a state where the pressing member has been separated from the stopper and the manual adjustment portion, maintenance of the processing container can be performed more easily.

於所述基板處理裝置中,較佳為,所述止動件固定於所述框體。止動件固定於框體,因此能夠恰當地設置止動件。In the substrate processing apparatus, preferably, the stopper is fixed to the frame. The stopper is fixed to the frame, so that the stopper can be appropriately provided.

於所述基板處理裝置中,較佳為,所述止動件包括沿大致水平方向延伸的軸構件,所述按壓構件能夠繞所述軸構件旋轉。按壓構件能夠繞大致水平的軸構件旋轉,因此,手動調整部能夠恰當地調整按壓構件的第2端部的高度位置。In the substrate processing apparatus, preferably, the stopper includes a shaft member extending in a substantially horizontal direction, and the pressing member is rotatable around the shaft member. Since the pressing member is rotatable about the substantially horizontal shaft member, the manual adjustment portion can appropriately adjust the height position of the second end portion of the pressing member.

於所述基板處理裝置中,較佳為,於所述按壓構件為大致水平姿勢的狀態下,所述按壓構件與所述蓋部接觸。藉此,於按壓構件為大致水平姿勢的狀態下,按壓構件能夠按壓蓋部。因此,按壓構件能夠更均勻地按壓蓋部。In the substrate processing apparatus, it is preferable that the pressing member is in contact with the lid portion in a state where the pressing member is in a substantially horizontal posture. Thereby, the pressing member can press the lid portion in a state where the pressing member is in a substantially horizontal posture. Therefore, the pressing member can press the cover portion more uniformly.

於所述基板處理裝置中,較佳為,將自所述軸構件的軸心的方向觀察而自所述軸構件朝向所述第2端部的水平朝向作為第1方向,所述止動件禁止於所述按壓構件為大致水平姿勢的狀態下按壓構件相對於所述軸構件沿所述第1方向移動,所述止動件容許於所述按壓構件朝向所述第1方向而向上方傾斜的狀態下所述按壓構件相對於所述軸構件沿所述第1方向移動。於按壓構件為大致水平姿勢的狀態下,按壓構件能夠按壓蓋部。於按壓構件能夠按壓蓋部的狀態下,禁止按壓構件沿第1方向移動。藉此,按壓構件能夠更恰當地按壓蓋部。於按壓構件朝向第1方向而向上方傾斜的狀態下,按壓構件未按壓蓋部。於按壓構件未按壓蓋部的狀態下,允許按壓構件沿第1方向移動。藉此,能夠容易地將按壓構件自止動件分離。In the substrate processing apparatus, it is preferable that a horizontal direction from the shaft member toward the second end portion is a first direction when viewed from a direction of an axis of the shaft member, and the stopper It is prohibited that the pressing member moves in the first direction with respect to the shaft member in a state where the pressing member is in a substantially horizontal posture, and the stopper allows the pressing member to be inclined upward toward the first direction. The pressing member moves in the first direction with respect to the shaft member. The pressing member can press the lid portion in a state where the pressing member is in a substantially horizontal posture. In a state where the pressing member can press the lid portion, the pressing member is prohibited from moving in the first direction. Thereby, the pressing member can press the lid portion more appropriately. In a state where the pressing member is inclined upward in the first direction, the pressing member does not press the lid portion. The pressing member is allowed to move in the first direction in a state where the pressing member does not press the lid portion. Thereby, the pressing member can be easily separated from the stopper.

於所述基板處理裝置中,較佳為,將較通過所述軸構件的所述軸心的假想的水平面而位於更上方的所述軸構件的部分作為所述軸構件的上部,將所述上部以外的所述軸構件的部分作為所述軸構件的下部,將較通過所述軸構件的所述軸心的假想的鉛垂面而更靠所述第2端部側的所述軸構件的部分作為所述軸構件的表面部,將所述表面部以外的所述軸構件的部分作為所述軸構件的背面部,於所述按壓構件為大致水平姿勢的狀態下,所述第1端部與所述軸構件的所述背面部和所述下部的共通部分接觸,且與所述軸構件的所述表面部和所述下部的共通部分接觸,於所述按壓構件向所述第1方向且向上方傾斜的狀態下,所述第1端部僅與所述軸構件的所述表面部接觸。於按壓構件為大致水平姿勢的狀態下,第1端部與軸構件的背面部和下部的共通部分接觸。因此,於按壓構件按壓著蓋部的狀態下,止動件能夠恰當地禁止按壓構件沿第1方向移動。於按壓構件為大致水平姿勢的狀態下,第1端部與軸構件的表面部和下部的共通部分接觸。因此,於按壓構件按壓著蓋部的狀態下,止動件能夠恰當地禁止按壓構件沿與第1方向相反的方向移動。於按壓構件朝向第1方向而向上方傾斜的狀態下,第1端部僅與軸構件的表面部接觸。因此,於按壓構件未按壓蓋部的狀態下,止動件能夠恰當地容許按壓構件沿第1方向移動。 [發明的效果]In the substrate processing apparatus, preferably, a portion of the shaft member located higher than an imaginary horizontal plane passing through the axial center of the shaft member is referred to as an upper portion of the shaft member, A portion of the shaft member other than the upper portion serves as a lower portion of the shaft member, and the shaft member is closer to the second end portion than a virtual vertical plane passing through the axial center of the shaft member. a portion of the shaft member is a surface portion of the shaft member, and a portion of the shaft member other than the surface portion is a back portion of the shaft member, and the first member is in a substantially horizontal posture. The end portion is in contact with the common portion of the back surface portion and the lower portion of the shaft member, and is in contact with the common portion of the surface portion and the lower portion of the shaft member, wherein the pressing member faces the The first end portion is in contact with only the surface portion of the shaft member in a state of being inclined in one direction and upward. In a state where the pressing member is in a substantially horizontal posture, the first end portion is in contact with the common portion of the back surface portion and the lower portion of the shaft member. Therefore, in a state where the pressing member presses the lid portion, the stopper can appropriately prohibit the pressing member from moving in the first direction. In a state where the pressing member is in a substantially horizontal posture, the first end portion is in contact with the common portion of the surface portion and the lower portion of the shaft member. Therefore, in a state where the pressing member presses the lid portion, the stopper can appropriately prohibit the pressing member from moving in a direction opposite to the first direction. In a state where the pressing member is inclined upward in the first direction, the first end portion is in contact only with the surface portion of the shaft member. Therefore, in a state where the pressing member does not press the lid portion, the stopper can appropriately allow the pressing member to move in the first direction. [Effects of the Invention]

根據本發明的基板處理裝置,能夠提高處理容器的氣密性。According to the substrate processing apparatus of the present invention, the airtightness of the processing container can be improved.

參照圖示對實施形態的基板處理裝置進行說明。A substrate processing apparatus according to an embodiment will be described with reference to the drawings.

1.基板處理裝置的概略構成 圖1是表示基板處理裝置的一部分的概略構成的平面圖。圖2是表示基板處理裝置的一部分的概略構成的側面圖。1. Schematic configuration of a substrate processing apparatus Fig. 1 is a plan view showing a schematic configuration of a part of a substrate processing apparatus. 2 is a side view showing a schematic configuration of a part of a substrate processing apparatus.

圖1、圖2中,示出前後方向X、寬度方向Y、上下方向Z。前後方向X、寬度方向Y與上下方向Z相互正交。前後方向X以及寬度方向Y為水平。將前後方向X的一側稱為「前方」,將前後方向X的另一側稱為「後方」。將寬度方向Y的一側稱為「右方」,將寬度方向Y的另一側稱為「左方」。於不區分前方、後方、右方以及左方的情況下,稱為「水平方向」或簡稱為「側方」。將上下方向Z的一側稱為「上方」,將上下方向Z的另一側稱為「下方」。In FIG. 1 and FIG. 2, the front-back direction X, the width direction Y, and the up-down direction Z are shown. The front-rear direction X, the width direction Y, and the vertical direction Z are orthogonal to each other. The front-rear direction X and the width direction Y are horizontal. One side of the front-rear direction X is referred to as "front", and the other side of the front-rear direction X is referred to as "rear". One side in the width direction Y is referred to as "right side", and the other side in the width direction Y is referred to as "left side". In the case where the front, the rear, the right, and the left are not distinguished, it is called "horizontal direction" or simply "side". One side of the vertical direction Z is referred to as "upper side", and the other side of the vertical direction Z is referred to as "lower side".

本實施形態的基板處理裝置1對基板(例如,半導體晶圓)W進行處理。基板處理裝置1進行的處理為熱處理。熱處理包括對基板W進行加熱的處理、及對基板W進行冷卻的處理。The substrate processing apparatus 1 of the present embodiment processes a substrate (for example, a semiconductor wafer) W. The processing performed by the substrate processing apparatus 1 is heat treatment. The heat treatment includes a process of heating the substrate W and a process of cooling the substrate W.

基板處理裝置1具備多個處理單元2a、處理單元2b、處理單元2c。處理單元2b配置於處理單元2a的右方。處理單元2c配置於處理單元2a的下方。於不區分處理單元2a、處理單元2b、處理單元2c的情況下,稱為「處理單元2」。The substrate processing apparatus 1 includes a plurality of processing units 2a, processing units 2b, and processing units 2c. The processing unit 2b is disposed to the right of the processing unit 2a. The processing unit 2c is disposed below the processing unit 2a. When the processing unit 2a, the processing unit 2b, and the processing unit 2c are not distinguished, it is referred to as "processing unit 2".

處理單元2具備搬送機構3及處理容器4。處理容器4鄰接於搬送機構3。處理容器4配置於搬送機構3的後方。搬送機構3以大致水平姿勢對一枚基板W進行保持。搬送機構3將所保持的基板W沿大致水平方向搬送。具體而言,搬送機構3將所保持的基板W沿大致前後方向X搬送。搬送機構3將基板W搬入至處理容器4。搬送機構3將基板W自處理容器4搬出。處理容器4收容一枚基板W。處理容器4於其內部對基板W進行熱處理。The processing unit 2 includes a transport mechanism 3 and a processing container 4. The processing container 4 is adjacent to the transport mechanism 3. The processing container 4 is disposed behind the conveying mechanism 3. The transport mechanism 3 holds one substrate W in a substantially horizontal posture. The transport mechanism 3 transports the held substrate W in a substantially horizontal direction. Specifically, the transport mechanism 3 transports the held substrate W in the substantially front-rear direction X. The transport mechanism 3 carries the substrate W into the processing container 4. The transport mechanism 3 carries the substrate W out of the processing container 4. The processing container 4 houses a substrate W. The processing container 4 heat-treats the substrate W therein.

處理容器4具備框體11、遮擋板(shutter)12及蓋部13。框體11於俯視時具有大致矩形形狀。遮擋板12安裝於框體11的前部。蓋部13安裝於框體11的上部。蓋部13於俯視時配置於框體11的大致中央。The processing container 4 includes a housing 11 , a shutter 12 , and a lid portion 13 . The casing 11 has a substantially rectangular shape in plan view. The shielding plate 12 is attached to the front portion of the casing 11. The lid portion 13 is attached to the upper portion of the casing 11. The lid portion 13 is disposed substantially at the center of the casing 11 in plan view.

處理單元2具備排氣導管(duct)72。排氣導管72安裝於框體11的後部。The processing unit 2 is provided with an exhaust duct 72. The exhaust duct 72 is attached to the rear of the casing 11.

處理單元2具備按壓構件6。按壓構件6對框體11按壓蓋部13。按壓構件6配置於蓋部13的上方。按壓構件6的至少一部分與蓋部13的上表面接觸。按壓構件6例如使向下的力作用於蓋部13。The processing unit 2 is provided with a pressing member 6. The pressing member 6 presses the lid portion 13 on the frame body 11. The pressing member 6 is disposed above the lid portion 13 . At least a portion of the pressing member 6 is in contact with the upper surface of the lid portion 13. The pressing member 6 applies, for example, a downward force to the lid portion 13.

處理單元2具備止動件7及手動調整部8。按壓構件6具有第1端部21及第2端部22。止動件7與第1端部21接觸。止動件7禁止第1端部21向上方移動。手動調整部8與第2端部22接觸。手動調整部8對第2端部22的高度位置進行調整。手動調整部8藉由用戶進行操作。具體而言,用戶手動對手動調整部8進行操作。手動調整部8對應於用戶的操作而對第2端部22的高度位置進行調整。The processing unit 2 includes a stopper 7 and a manual adjustment unit 8. The pressing member 6 has a first end portion 21 and a second end portion 22 . The stopper 7 is in contact with the first end portion 21. The stopper 7 prohibits the first end portion 21 from moving upward. The manual adjustment unit 8 is in contact with the second end portion 22. The manual adjustment unit 8 adjusts the height position of the second end portion 22. The manual adjustment unit 8 is operated by the user. Specifically, the user manually operates the manual adjustment unit 8. The manual adjustment unit 8 adjusts the height position of the second end portion 22 in accordance with the user's operation.

基板處理裝置1具備多個外壁板9a、外壁板9b、外壁板9c。外壁板9a、外壁板9b、外壁板9c分別配置於處理單元2a、處理單元2b、處理單元2c的後方。於不區分外壁板9a、外壁板9b、外壁板9c的情況下,稱為「外壁板9」。The substrate processing apparatus 1 includes a plurality of outer wall panels 9a, an outer wall panel 9b, and an outer wall panel 9c. The outer wall panel 9a, the outer wall panel 9b, and the outer wall panel 9c are disposed behind the processing unit 2a, the processing unit 2b, and the processing unit 2c, respectively. When the outer wall panel 9a, the outer wall panel 9b, and the outer wall panel 9c are not distinguished, it is called "outer wall panel 9".

外壁板9配置於框體11的側方。具體而言,外壁板9配置於框體11的後方。The outer wall panel 9 is disposed on the side of the casing 11. Specifically, the outer wall panel 9 is disposed at the rear of the casing 11 .

手動調整部8較止動件7更靠近外壁板9而配置。手動調整部8較蓋部13更靠近外壁板9而配置。The manual adjustment portion 8 is disposed closer to the outer wall panel 9 than the stopper 7 . The manual adjustment portion 8 is disposed closer to the outer wall panel 9 than the lid portion 13.

外壁板9能夠拆卸。圖2中,表示拆卸了外壁板9a的狀態。於拆卸了外壁板9時,處理容器4的後方的空間開放。因此,用戶能夠自處理容器4的後方的位置對處理容器4進行維護。例如,用戶能夠容易地對處理單元2a的手動調整部8進行操作。The outer wall panel 9 is detachable. Fig. 2 shows a state in which the outer wall panel 9a is detached. When the outer wall panel 9 is detached, the space behind the processing container 4 is opened. Therefore, the user can perform maintenance on the processing container 4 from the position behind the processing container 4. For example, the user can easily operate the manual adjustment section 8 of the processing unit 2a.

基板處理裝置1具備多個隔壁10a、隔壁10b、隔壁10c。隔壁10a配置於處理單元2的側方。隔壁10b配置於處理單元2的前方。隔壁10c配置於處理單元2的上方以及下方。於不區分隔壁10a、隔壁10b、隔壁10c的情況下,稱為「隔壁10」。The substrate processing apparatus 1 includes a plurality of partition walls 10a, a partition wall 10b, and a partition wall 10c. The partition wall 10a is disposed on the side of the processing unit 2. The partition wall 10b is disposed in front of the processing unit 2. The partition wall 10c is disposed above and below the processing unit 2. When the partition wall 10a, the partition wall 10b, and the partition wall 10c are not partitioned, it is called "partition wall 10".

外壁板9與隔壁10對用以設置處理單元2的多個設置空間進行劃定。處理單元2於各設置空間各配置一個。The outer wall panel 9 and the partition wall 10 define a plurality of installation spaces for arranging the processing unit 2. The processing unit 2 is disposed in each of the setting spaces.

根據圖1、圖2可明確,搬送機構3配置於處理容器4的前方。因此,處理容器4的前方的空間狹小。藉此,用戶難以進入處理容器4的前方的空間。於處理容器4的下方,配置有與所述處理容器4相關聯的未圖示的設備。未圖示的設備例如為後述的支撐銷(pin)驅動機構或配管等。進而,於處理容器4的右方、左方、上方以及下方,配置有隔壁10。進而,於處理容器4的右方、左方、上方以及下方,配置有其他處理容器4。因此,處理容器4的右方、左方、上方以及下方的空間亦狹小。藉此,用戶難以進入處理容器4的右方、左方、上方以及下方的空間。因此,用戶難以自處理容器4的前方、右方、左方、上方以及下方的位置對處理容器4進行維護。As is clear from FIGS. 1 and 2, the transport mechanism 3 is disposed in front of the processing container 4. Therefore, the space in front of the processing container 4 is narrow. Thereby, it is difficult for the user to enter the space in front of the processing container 4. Below the processing container 4, a device (not shown) associated with the processing container 4 is disposed. The device (not shown) is, for example, a pin drive mechanism or a pipe to be described later. Further, the partition wall 10 is disposed on the right, left, above, and below the processing container 4. Further, other processing containers 4 are disposed on the right, left, above, and below the processing container 4. Therefore, the space on the right, left, above, and below the processing container 4 is also narrow. Thereby, it is difficult for the user to enter the space on the right, left, above, and below the processing container 4. Therefore, it is difficult for the user to perform maintenance on the processing container 4 from the positions of the front, the right, the left, the upper, and the lower side of the processing container 4.

2.處理容器4及處理容器4的關聯構成 以下,對處理容器4及處理容器4的關聯構成進行詳細說明。2. Related Structure of Processing Container 4 and Processing Container 4 Hereinafter, the related configuration of the processing container 4 and the processing container 4 will be described in detail.

2-1.處理容器4與加熱部31 圖3是表示基板處理裝置的一部分的概略構成的圖。圖4是處理容器的一部分的分解立體圖。圖4是自上方觀察的立體圖。2-1. Processing Container 4 and Heating Unit 31 FIG. 3 is a view showing a schematic configuration of a part of the substrate processing apparatus. 4 is an exploded perspective view of a portion of the processing container. Fig. 4 is a perspective view as seen from above.

框體11具有扁平的大致箱形狀。框體11具有搬送口A(參照圖4)。搬送口A形成於框體11的前表面。搬送口A是用以供基板W通過的開口。具體而言,搬送口A是用以供搬送機構3將基板W搬入處理容器4內且自處理容器4內搬出基板W的開口。搬送口A具有橫向長的形狀。The frame 11 has a flat substantially box shape. The housing 11 has a transfer port A (see FIG. 4). The transfer port A is formed on the front surface of the casing 11. The transfer port A is an opening through which the substrate W passes. Specifically, the conveyance port A is an opening for the conveyance mechanism 3 to carry the substrate W into the processing container 4 and carry out the substrate W from the processing container 4 . The transfer port A has a laterally long shape.

遮擋板12對搬送口A進行開閉。遮擋板12能夠拆裝於框體11的前部。遮擋板12經由密封構件19而能夠與框體11密接。密封構件19配置於框體11與遮擋板12之間。密封構件19配置於搬送口A的周圍。密封構件19例如為合成樹脂制。密封構件19例如為O形環(ring)。藉由遮擋板12與框體11密合,從而搬送口A密閉。藉由遮擋板12自框體11脫離,從而搬送口A開放。The shielding plate 12 opens and closes the transfer port A. The shielding plate 12 can be attached and detached to the front portion of the casing 11. The shielding plate 12 can be in close contact with the casing 11 via the sealing member 19 . The sealing member 19 is disposed between the frame 11 and the shielding plate 12 . The sealing member 19 is disposed around the transfer port A. The sealing member 19 is made of, for example, a synthetic resin. The sealing member 19 is, for example, an O-ring. When the shielding plate 12 is in close contact with the casing 11, the conveying port A is sealed. When the shielding plate 12 is detached from the casing 11, the conveying port A is opened.

框體11具有開口B(參照圖4)。開口B形成於框體11的上表面。開口B例如具有大致圓形狀。開口B比較大。例如,開口B的面積大於搬送口A的面積。開口B的直徑大於基板W的直徑。開口B是本發明的開口的例子。The casing 11 has an opening B (refer to FIG. 4). The opening B is formed on the upper surface of the casing 11. The opening B has, for example, a substantially circular shape. The opening B is relatively large. For example, the area of the opening B is larger than the area of the transfer port A. The diameter of the opening B is larger than the diameter of the substrate W. The opening B is an example of the opening of the present invention.

蓋部13對開口B進行開閉。蓋部13能夠拆裝於框體11的上部。藉由蓋部13拆裝於框體11而對開口B進行開閉。The lid portion 13 opens and closes the opening B. The lid portion 13 can be attached to and detached from the upper portion of the casing 11. The opening B is opened and closed by the cover portion 13 being detached from the casing 11.

蓋部13具有大致水平的板形狀。蓋部13於俯視時具有大致圓形狀。蓋部13的上表面13a大致平坦。蓋部13的上表面13a大致水平。The cover portion 13 has a substantially horizontal plate shape. The lid portion 13 has a substantially circular shape in plan view. The upper surface 13a of the lid portion 13 is substantially flat. The upper surface 13a of the lid portion 13 is substantially horizontal.

蓋部13經由密封構件19而能夠與框體11密接。密封構件19配置於框體11與蓋部13之間。密封構件19配置於開口B的周圍。蓋部13於開口B的周圍與框體11密合。具體而言,蓋部13的周緣部與框體11密合。藉由蓋部13密合於框體11,從而開口B密閉。藉由蓋部13自框體11脫離,從而開口B開放。The lid portion 13 can be in close contact with the casing 11 via the sealing member 19 . The sealing member 19 is disposed between the frame 11 and the lid portion 13 . The sealing member 19 is disposed around the opening B. The lid portion 13 is in close contact with the frame body 11 around the opening B. Specifically, the peripheral edge portion of the lid portion 13 is in close contact with the frame body 11. When the lid portion 13 is in close contact with the frame 11, the opening B is sealed. When the lid portion 13 is detached from the frame 11, the opening B is opened.

再者,處理單元2不具備用以將框體11與蓋部13結合的構件。框體11與蓋部13不藉由螺栓等緊固構件而結合。蓋部13僅載置於框體11上。藉由按壓構件6對框體11按壓蓋部13,從而蓋部13密接於框體11。Furthermore, the processing unit 2 does not have a member for joining the frame 11 and the lid portion 13. The frame 11 and the lid portion 13 are not joined by a fastening member such as a bolt. The lid portion 13 is placed only on the frame 11. When the lid member 13 is pressed against the frame 11 by the pressing member 6, the lid portion 13 is in close contact with the frame body 11.

處理容器4具備收容部14及底板15。收容部14連接於框體11的下表面。收容部14例如具有大致圓筒形狀。收容部14的內部向框體11的內部開放。即,收容部14的內部與框體11的內部連通。收容部14自框體11的下表面向下方延伸。收容部14的下端開放。底板15安裝於收容部14的下端。底板15經由密封構件19而與收容部14的下端密接。密封構件19配置於收容部14與底板15之間。藉由底板15密合於收容部14,從而收容部14的下端密閉。The processing container 4 includes a housing portion 14 and a bottom plate 15. The accommodating portion 14 is connected to the lower surface of the casing 11. The accommodating portion 14 has, for example, a substantially cylindrical shape. The inside of the accommodating portion 14 is opened to the inside of the casing 11. That is, the inside of the accommodating portion 14 communicates with the inside of the casing 11. The accommodating portion 14 extends downward from the lower surface of the casing 11. The lower end of the accommodating portion 14 is open. The bottom plate 15 is attached to the lower end of the housing portion 14. The bottom plate 15 is in close contact with the lower end of the accommodating portion 14 via the sealing member 19 . The sealing member 19 is disposed between the housing portion 14 and the bottom plate 15 . When the bottom plate 15 is in close contact with the accommodating portion 14, the lower end of the accommodating portion 14 is sealed.

熱處理裝置1具備加熱部31。加熱部31對基板W進行加熱。加熱部31能夠以比較高的溫度對基板W進行加熱。加熱部31例如能夠以300度以上對基板W進行加熱。進而,加熱部31調整對基板W進行加熱的溫度。The heat treatment apparatus 1 is provided with a heating unit 31. The heating unit 31 heats the substrate W. The heating unit 31 can heat the substrate W at a relatively high temperature. The heating unit 31 can heat the substrate W by, for example, 300 degrees or more. Further, the heating unit 31 adjusts the temperature at which the substrate W is heated.

加熱部31配置於處理容器4內。加熱部31載置於底板15上。加熱部31配置於收容部14的內部。加熱部31具有大致圓盤形狀。加熱部31的外徑較收容部14的內徑稍小。藉此,收容部14與加熱部31的間隙足夠小。The heating unit 31 is disposed in the processing container 4 . The heating unit 31 is placed on the bottom plate 15. The heating unit 31 is disposed inside the housing portion 14 . The heating unit 31 has a substantially disk shape. The outer diameter of the heating portion 31 is slightly smaller than the inner diameter of the housing portion 14. Thereby, the gap between the accommodating portion 14 and the heating portion 31 is sufficiently small.

加熱部31具有大致平坦的上表面31a。加熱部31的上表面31a位於與框體11的內部的底面11b大致相同的高度位置(參照圖1)。The heating portion 31 has a substantially flat upper surface 31a. The upper surface 31a of the heating unit 31 is located at substantially the same height as the bottom surface 11b of the inside of the casing 11 (see Fig. 1).

加熱部31例如具備溫度調節部及板(plate)(均未圖示)。溫度調節部產生熱。進而,溫度調節部調整對基板W進行加熱的溫度。溫度調節部例如為加熱器。溫度調節部安裝於板。溫度調節部例如配置於板的上部或板的內部。板載置基板W。板將溫度調節部產生的熱傳遞至板上的基板W。板例如為金屬製。The heating unit 31 includes, for example, a temperature adjustment unit and a plate (none of which is shown). The temperature adjustment unit generates heat. Further, the temperature adjustment unit adjusts the temperature at which the substrate W is heated. The temperature adjustment unit is, for example, a heater. The temperature adjustment unit is mounted on the board. The temperature adjustment unit is disposed, for example, on the upper portion of the plate or inside the plate. The substrate is placed on the substrate W. The board transfers the heat generated by the temperature adjustment portion to the substrate W on the board. The plate is made of, for example, metal.

框體11具有側部排出口D。側部排出口D形成於框體11的後表面。側部排出口D是用以排出處理容器4內的氣體的開口。側部排出口D具有橫向長的形狀。The frame 11 has a side discharge port D. The side discharge port D is formed on the rear surface of the casing 11. The side discharge port D is an opening for discharging the gas in the processing container 4. The side discharge port D has a laterally long shape.

排氣導管72與側部排出口D連通。排氣導管72能夠拆裝於框體11的後部。排氣導管72經由密封構件19而能夠與框體11密接。密封構件19配置於框體11與排氣導管72之間。密封構件19配置於側部排出口D的周圍。排氣導管72於側部排出口D的周圍與框體11密合。藉由排氣導管72密合於框體11,從而框體11經由側部排出口D而與排氣導管72連通連接。藉由排氣導管72自框體11脫離,從而側部排出口D開放。The exhaust duct 72 is in communication with the side discharge port D. The exhaust duct 72 is detachably attachable to the rear portion of the casing 11. The exhaust duct 72 can be in close contact with the casing 11 via the sealing member 19 . The sealing member 19 is disposed between the frame 11 and the exhaust duct 72. The sealing member 19 is disposed around the side discharge port D. The exhaust duct 72 is in close contact with the casing 11 around the side discharge port D. The casing 11 is connected to the exhaust duct 72 via the side discharge port D by the exhaust duct 72 being in close contact with the casing 11. The side discharge port D is opened by the exhaust duct 72 being detached from the casing 11.

2-2.遮擋板驅動機構35 參照圖3。熱處理裝置1具備遮擋板驅動機構35。遮擋板驅動機構35藉由使遮擋板12移動而使遮擋板12拆裝於框體11。遮擋板驅動機構35配置於處理容器4的外部。遮擋板驅動機構35例如包括氣缸(air cylinder)。2-2. The shutter driving mechanism 35 is referred to FIG. The heat treatment apparatus 1 is provided with a shutter driving mechanism 35. The shutter driving mechanism 35 disassembles and attaches the shutter 12 to the casing 11 by moving the shutter 12 . The shutter driving mechanism 35 is disposed outside the processing container 4. The shutter driving mechanism 35 includes, for example, an air cylinder.

2-3.基板移動機構37以及密封機構41 熱處理裝置1具備基板移動機構37。基板移動機構37使基板W跨及加熱位置PH與冷卻位置PC來移動。2-3. Substrate Moving Mechanism 37 and Sealing Mechanism 41 The heat treatment apparatus 1 includes a substrate moving mechanism 37. The substrate moving mechanism 37 moves the substrate W across the heating position PH and the cooling position PC.

圖3以實線表示處於加熱位置PH的基板W。圖3以虛線表示處於冷卻位置PC的基板W。加熱位置PH是接觸或接近加熱部31的基板W的位置。具體而言,加熱位置PH是載置於加熱部31上的基板W的位置。基板W處於加熱位置PH時,基板W的下表面與加熱部31的上表面31a接觸或接近。冷卻位置PC是與加熱位置PH相比遠離加熱部31的基板W的位置。具體而言,冷卻位置PC是加熱位置PH的上方的位置。基板W處於冷卻位置PC時,基板W不與加熱部31接觸。再者,加熱位置PH以及冷卻位置PC均是處理容器4內的基板W的位置。基板W處於加熱位置PH以及冷卻位置PC的任一位置時,基板W均為大致水平姿勢。Fig. 3 shows the substrate W at the heating position PH in solid lines. Figure 3 shows the substrate W in the cooling position PC in broken lines. The heating position PH is a position at which the substrate W of the heating portion 31 is contacted or approached. Specifically, the heating position PH is the position of the substrate W placed on the heating portion 31. When the substrate W is at the heating position PH, the lower surface of the substrate W is in contact with or close to the upper surface 31a of the heating portion 31. The cooling position PC is a position away from the substrate W of the heating portion 31 as compared with the heating position PH. Specifically, the cooling position PC is a position above the heating position PH. When the substrate W is in the cooling position PC, the substrate W is not in contact with the heating portion 31. Further, both the heating position PH and the cooling position PC are positions of the substrate W in the processing container 4. When the substrate W is at any of the heating position PH and the cooling position PC, the substrate W is in a substantially horizontal posture.

基板移動機構37具備多個(例如三個)支撐銷(support pin)38。多個支撐銷38與一枚的基板W的下表面接觸。藉此,多個支撐銷38對一枚的基板W進行支撐。支撐銷38跨及處理容器4的內部與外部而配置。即,支撐銷38具有位於處理容器4內的前端部。支撐銷38具有位於處理容器4的外部(下方)的基端部。支撐銷38經由形成於底板15的開口15a而貫穿底板15。於處理容器4內,支撐銷38配置於支撐銷孔32。支撐銷孔32是形成於加熱部31的內部的貫穿孔。支撐銷孔32向加熱部31的上方開放。The substrate moving mechanism 37 is provided with a plurality of (for example, three) support pins 38. The plurality of support pins 38 are in contact with the lower surface of the one substrate W. Thereby, the plurality of support pins 38 support the one substrate W. The support pin 38 is disposed across the inside and the outside of the processing container 4. That is, the support pin 38 has a front end portion located inside the processing container 4. The support pin 38 has a base end portion located outside (down) the processing container 4. The support pin 38 penetrates the bottom plate 15 via the opening 15a formed in the bottom plate 15. In the processing container 4, the support pin 38 is disposed in the support pin hole 32. The support pin hole 32 is a through hole formed inside the heating portion 31. The support pin hole 32 is open to the upper side of the heating portion 31.

基板移動機構37具備支撐銷驅動機構39。支撐銷驅動機構39使支撐銷38上下移動。支撐銷驅動機構39配置於處理容器4的外部。支撐銷驅動機構39與支撐銷38的基端部連接。藉由支撐銷38的上下移動,基板W於加熱位置PH與冷卻位置PC之間移動。支撐銷驅動機構39例如包括氣缸。The substrate moving mechanism 37 is provided with a support pin driving mechanism 39. The support pin drive mechanism 39 moves the support pin 38 up and down. The support pin drive mechanism 39 is disposed outside the processing container 4. The support pin drive mechanism 39 is coupled to the base end of the support pin 38. The substrate W is moved between the heating position PH and the cooling position PC by the vertical movement of the support pin 38. The support pin drive mechanism 39 includes, for example, a cylinder.

熱處理裝置1具備密封機構41。密封機構41容許支撐銷38的上下移動並且將底板15的開口15a密閉。密封機構41配置於處理容器4的外部(下方)。The heat treatment apparatus 1 is provided with a sealing mechanism 41. The sealing mechanism 41 allows the support pin 38 to move up and down and seal the opening 15a of the bottom plate 15. The sealing mechanism 41 is disposed outside (below) the processing container 4.

密封機構41具備一個集合部42。集合部42於其內部具有一個空間E。集合部42經由密封構件19而與底板15密接。密封構件19配置於底板15與集合部42之間。密封構件19配置於開口15a的周圍。集合部42於開口15a的周圍與底板15密合。藉此,處理容器4與集合部42連通連接。處理容器4的內部經由開口15a而與集合部42的空間E連通。The sealing mechanism 41 is provided with one collecting portion 42. The collecting portion 42 has a space E inside thereof. The collecting portion 42 is in close contact with the bottom plate 15 via the sealing member 19 . The sealing member 19 is disposed between the bottom plate 15 and the collecting portion 42. The sealing member 19 is disposed around the opening 15a. The collecting portion 42 is in close contact with the bottom plate 15 around the opening 15a. Thereby, the processing container 4 is connected in communication with the collecting portion 42. The inside of the processing container 4 communicates with the space E of the collecting portion 42 via the opening 15a.

密封機構41具備多個(例如三個)軸封部43。軸封部43具有筒部44與密封構件45。筒部44具有圓筒形狀。筒部44與集合部42密接。密封構件45配置於筒部44的內部。密封構件45具有圓環形狀。密封構件45於其中央具有開口。密封構件45與筒部44的內周面密接。密封構件45為金屬製。The sealing mechanism 41 is provided with a plurality of (for example, three) shaft seal portions 43. The shaft seal portion 43 has a tubular portion 44 and a sealing member 45. The tubular portion 44 has a cylindrical shape. The tubular portion 44 is in close contact with the collecting portion 42. The sealing member 45 is disposed inside the tubular portion 44. The sealing member 45 has a circular ring shape. The sealing member 45 has an opening at the center thereof. The sealing member 45 is in close contact with the inner circumferential surface of the tubular portion 44. The sealing member 45 is made of metal.

集合部42以及筒部44收容支撐銷38的一部分。換言之,支撐銷38以貫穿集合部42的內部與筒部44的內部的方式配置。支撐銷38以貫穿密封構件45的開口的方式配置。密封構件45以與支撐銷38能夠滑動的方式與支撐銷38的外周面密接。即使支撐銷38相對於密封構件45滑動,支撐銷38與密封構件45的密合亦得到維持。The collecting portion 42 and the tubular portion 44 accommodate a part of the support pin 38. In other words, the support pin 38 is disposed to penetrate the inside of the collecting portion 42 and the inside of the tubular portion 44. The support pin 38 is disposed to penetrate the opening of the sealing member 45. The sealing member 45 is in close contact with the outer peripheral surface of the support pin 38 so as to be slidable with the support pin 38. Even if the support pin 38 slides relative to the sealing member 45, the adhesion of the support pin 38 to the sealing member 45 is maintained.

密封構件45將筒部44的內部分割為兩個空間F1、空間F2。空間F1是密封構件45的上方的空間。空間F2是密封構件45的下方的空間。空間F1與空間F2不相互連通。The sealing member 45 divides the inside of the tubular portion 44 into two spaces F1 and F2. The space F1 is a space above the sealing member 45. The space F2 is a space below the sealing member 45. The space F1 and the space F2 are not in communication with each other.

開口15a及空間E與空間F1連通。開口15a及空間E、空間F1與空間F2隔斷。空間F2向處理容器4以及密封機構41的外部開放。藉此,開口15a及空間E、空間F1與外部氣體隔斷。The opening 15a and the space E communicate with the space F1. The opening 15a and the space E and the space F1 are separated from the space F2. The space F2 is opened to the outside of the processing container 4 and the sealing mechanism 41. Thereby, the opening 15a, the space E, and the space F1 are blocked from the outside air.

如上所述,處理容器4於開口15a的周圍與集合部42密接,集合部42與筒部44密接,集合部42與筒部44收容支撐銷38的一部分。密封構件45與筒部44的內周面密接,且以與支撐銷38能夠滑動的方式與支撐銷38的外周面密接。藉此,開口15a密閉。As described above, the processing container 4 is in close contact with the collecting portion 42 around the opening 15a, the collecting portion 42 is in close contact with the tubular portion 44, and the collecting portion 42 and the tubular portion 44 are housed in a part of the supporting pin 38. The seal member 45 is in close contact with the inner peripheral surface of the tubular portion 44, and is in close contact with the outer peripheral surface of the support pin 38 so as to be slidable with the support pin 38. Thereby, the opening 15a is sealed.

此處,於不區分集合部42與筒部44的情況下,總稱為「密封殼體(housing)46」。Here, when the assembly portion 42 and the tubular portion 44 are not distinguished, they are collectively referred to as "housing 46".

2-4.上部供給部51 處理單元2具備上部供給部51。上部供給部51將非氧化性氣體供給至處理容器4內。上部供給部51自較冷卻位置PC更高的位置吹出非氧化性氣體。非氧化性氣體例如為惰性氣體。惰性氣體例如為氮氣或氬氣。2-4. Upper Supply Unit 51 The processing unit 2 includes an upper supply unit 51. The upper supply unit 51 supplies a non-oxidizing gas into the processing container 4 . The upper supply portion 51 blows a non-oxidizing gas from a position higher than the cooling position PC. The non-oxidizing gas is, for example, an inert gas. The inert gas is, for example, nitrogen or argon.

上部供給部51具備配管52、供給埠(port)53、開閉閥54及流量調整部55。配管52的一端連接於非氧化性氣體供給源69。非氧化性氣體供給源69供給非氧化性氣體。配管52的另一端連接於供給埠53。供給埠53安裝於蓋部13。供給埠53於俯視時配置於蓋部13的中央。供給埠53與處理容器4的內部連通。開閉閥54與流量調整部55分別設於配管52上。開閉閥54對配管52內的流路進行開閉。流量調整部55對流經配管52的非氧化性氣體的流量進行調整。流量調整部55例如包括針閥(needle valve)或質量流量計(mass flow meter)中的至少任一者。The upper supply unit 51 includes a pipe 52, a supply port 53, an opening and closing valve 54, and a flow rate adjusting unit 55. One end of the pipe 52 is connected to the non-oxidizing gas supply source 69. The non-oxidizing gas supply source 69 supplies a non-oxidizing gas. The other end of the pipe 52 is connected to the supply port 53. The supply port 53 is attached to the lid portion 13. The supply cassette 53 is disposed at the center of the lid portion 13 in plan view. The supply port 53 communicates with the inside of the processing container 4. The opening and closing valve 54 and the flow rate adjusting unit 55 are provided on the pipe 52, respectively. The opening and closing valve 54 opens and closes the flow path in the pipe 52. The flow rate adjustment unit 55 adjusts the flow rate of the non-oxidizing gas flowing through the pipe 52. The flow rate adjustment unit 55 includes, for example, at least one of a needle valve or a mass flow meter.

上部供給部51具備整流板56。整流板56配置於處理容器4內。整流板56配置於開口B。整流板56配置於蓋部13的下方。整流板56配置於冷卻位置PC的上方。整流板56支撐於蓋部13。整流板56具有大致水平的板形狀。整流板56具有多個小孔56a。小孔56a沿鉛垂方向貫穿整流板56。The upper supply unit 51 includes a rectifying plate 56. The flow regulating plate 56 is disposed in the processing container 4. The rectifying plate 56 is disposed at the opening B. The flow regulating plate 56 is disposed below the lid portion 13 . The rectifying plate 56 is disposed above the cooling position PC. The rectifying plate 56 is supported by the lid portion 13. The rectifying plate 56 has a substantially horizontal plate shape. The rectifying plate 56 has a plurality of small holes 56a. The small hole 56a penetrates the rectifying plate 56 in the vertical direction.

此處,將藉由蓋部13與整流板56而劃定的空間稱為「導入室Sp1」。將藉由框體11、遮擋板12、整流板56與加熱部31而劃定的空間稱為「處理室Sp2」。導入室Sp1位於整流板56的上方。處理室Sp2位於整流板56的下方。導入室Sp1與處理室Sp2經由小孔56a而相互連通。再者,導入室Sp1以及處理室Sp2均為處理容器4內的空間。導入室Sp1以及處理室Sp2相當於處理容器4的內部的一部分。Here, the space defined by the lid portion 13 and the rectifying plate 56 is referred to as "introduction chamber Sp1". The space defined by the housing 11, the shutter 12, the rectifying plate 56, and the heating unit 31 is referred to as "processing chamber Sp2". The introduction chamber Sp1 is located above the rectifying plate 56. The processing chamber Sp2 is located below the rectifying plate 56. The introduction chamber Sp1 and the processing chamber Sp2 communicate with each other via the small holes 56a. Further, the introduction chamber Sp1 and the processing chamber Sp2 are spaces in the processing container 4. The introduction chamber Sp1 and the processing chamber Sp2 correspond to a part of the inside of the processing container 4.

藉由打開開閉閥54,非氧化性氣體自非氧化性氣體供給源69經由配管52以及供給埠53而流入導入室Sp1。進而,非氧化性氣體自導入室Sp1經由整流板56的小孔56a而流至處理室Sp2。小孔56a將非氧化性氣體向下方吹出。流量調整部55對經由供給埠53而供給至處理容器4的非氧化性氣體的供給量進行調整。藉由關閉開閉閥54,上部供給部51停止非氧化性氣體的供給。藉由關閉開閉閥54,供給埠53密閉。By opening the on-off valve 54, the non-oxidizing gas flows from the non-oxidizing gas supply source 69 into the introduction chamber Sp1 via the pipe 52 and the supply port 53. Further, the non-oxidizing gas flows from the introduction chamber Sp1 to the processing chamber Sp2 via the small holes 56a of the flow regulating plate 56. The small hole 56a blows a non-oxidizing gas downward. The flow rate adjustment unit 55 adjusts the supply amount of the non-oxidizing gas supplied to the processing container 4 via the supply port 53. By closing the opening and closing valve 54, the upper supply unit 51 stops the supply of the non-oxidizing gas. The supply port 53 is sealed by closing the opening and closing valve 54.

2-5.下部供給部61 處理單元2具備下部供給部61。下部供給部61將非氧化性氣體供給至處理容器4內。下部供給部61自較冷卻位置PC更低的位置吹出非氧化性氣體。2-5. Lower Supply Unit 61 The processing unit 2 includes a lower supply unit 61. The lower supply unit 61 supplies a non-oxidizing gas into the processing container 4 . The lower supply portion 61 blows a non-oxidizing gas from a position lower than the cooling position PC.

下部供給部61具備配管62、埠63、開閉閥64及流量調整部65。配管62的一端連接於非氧化性氣體供給源69。配管62的另一端連接於埠63。埠63安裝於底板15。埠63與處理容器4的內部連通。開閉閥64與流量調整部65分別設於配管62上。開閉閥64對配管62內的流路進行開閉。流量調整部65對流經配管62的非氧化性氣體的流量進行調整。流量調整部65例如包括針閥或質量流量計中的至少任一者。The lower supply unit 61 includes a pipe 62, a weir 63, an opening and closing valve 64, and a flow rate adjusting unit 65. One end of the pipe 62 is connected to a non-oxidizing gas supply source 69. The other end of the pipe 62 is connected to the crucible 63. The crucible 63 is mounted to the bottom plate 15. The crucible 63 is in communication with the inside of the processing container 4. The opening and closing valve 64 and the flow rate adjusting unit 65 are provided on the pipe 62, respectively. The opening and closing valve 64 opens and closes the flow path in the pipe 62. The flow rate adjustment unit 65 adjusts the flow rate of the non-oxidizing gas flowing through the pipe 62. The flow rate adjustment unit 65 includes, for example, at least one of a needle valve and a mass flow meter.

埠63連通連接於氣體流通孔34。氣體流通孔34是形成於加熱部31的內部的貫穿孔。氣體流通孔34通達至加熱部31的上表面31a。氣體流通孔34向加熱部31的上方開放。The crucible 63 is connected in series to the gas circulation hole 34. The gas circulation hole 34 is a through hole formed inside the heating portion 31. The gas circulation hole 34 reaches the upper surface 31a of the heating portion 31. The gas circulation hole 34 is opened to the upper side of the heating unit 31.

藉由打開開閉閥64,非氧化性氣體自非氧化性氣體供給源69經由配管62以及埠63而流入處理容器4內。進而,非氧化性氣體經由氣體流通孔34而流至處理室Sp2。氣體流通孔34將非氧化性氣體向上方吹出。流量調整部65對經由埠63而供給至處理容器4的非氧化性氣體的供給量進行調整。藉由關閉開閉閥64,下部供給部61停止非氧化性氣體的供給。藉由關閉開閉閥64,埠63密閉。By opening the opening and closing valve 64, the non-oxidizing gas flows into the processing container 4 from the non-oxidizing gas supply source 69 via the piping 62 and the crucible 63. Further, the non-oxidizing gas flows to the processing chamber Sp2 via the gas circulation hole 34. The gas circulation hole 34 blows the non-oxidizing gas upward. The flow rate adjustment unit 65 adjusts the supply amount of the non-oxidizing gas supplied to the processing container 4 via the crucible 63. By closing the opening and closing valve 64, the lower supply portion 61 stops the supply of the non-oxidizing gas. By closing the opening and closing valve 64, the crucible 63 is sealed.

2-6.側部排出部71 處理單元2具備側部排出部71。側部排出部71將處理容器4內的氣體排出至處理容器4的外部。側部排出部71經由冷卻位置PC的側方的位置將氣體排出。2-6. Side discharge unit 71 The treatment unit 2 includes a side discharge unit 71. The side discharge portion 71 discharges the gas in the processing container 4 to the outside of the processing container 4. The side discharge portion 71 discharges the gas via the position of the side of the cooling position PC.

側部排出部71具備所述排氣導管72。排氣導管72氣密連通於側部排出口D。側部排出部71進而具備排氣管73、開閉閥74及排氣機構75。排氣管73具有連通連接於排氣導管72的第1端。開閉閥74設於排氣管73上。排氣管73具有連通連接於排氣機構75的第2端。排氣機構75抽吸氣體並將其排出。排氣機構75能夠調整氣體的排出量。更具體而言,排氣機構75藉由對氣體的流量或氣體的抽吸壓力進行調整從而能夠調整氣體的排出量。排氣機構75例如為真空泵、排氣送風機(blower)或噴射器(ejector)。The side discharge unit 71 includes the exhaust duct 72. The exhaust duct 72 is hermetically connected to the side discharge port D. The side discharge unit 71 further includes an exhaust pipe 73, an opening and closing valve 74, and an exhaust mechanism 75. The exhaust pipe 73 has a first end that is connected and connected to the exhaust duct 72. The opening and closing valve 74 is provided on the exhaust pipe 73. The exhaust pipe 73 has a second end that is connected to the exhaust mechanism 75. The exhaust mechanism 75 draws in gas and discharges it. The exhaust mechanism 75 is capable of adjusting the amount of gas discharged. More specifically, the exhaust mechanism 75 can adjust the discharge amount of the gas by adjusting the flow rate of the gas or the suction pressure of the gas. The exhaust mechanism 75 is, for example, a vacuum pump, an exhaust blower, or an ejector.

藉由開閉閥74開放且排氣機構75驅動,處理容器4內的氣體經由側部排出口D而被排出至處理容器4的外部。藉此,將處理室Sp2的氣體順利排出。進而,排氣機構75對經由側部排出口D而自處理容器4排出的氣體的排出量進行調整。藉由排氣機構75的驅動停止,側部排出部71停止氣體的排出。藉由關閉開閉閥74,側部排出口D密閉。When the opening and closing valve 74 is opened and the exhaust mechanism 75 is driven, the gas in the processing container 4 is discharged to the outside of the processing container 4 via the side discharge port D. Thereby, the gas in the processing chamber Sp2 is smoothly discharged. Further, the exhaust mechanism 75 adjusts the discharge amount of the gas discharged from the processing container 4 via the side discharge port D. When the driving of the exhaust mechanism 75 is stopped, the side discharge portion 71 stops the discharge of the gas. The side discharge port D is sealed by closing the opening and closing valve 74.

2-7.下部排出部81 處理單元2具備下部排出部81。下部排出部81將密封殼體46內的氣體排出。下部排出部81進而將處理容器4內的氣體排出。下部排出部81經由較冷卻位置PC更低的位置將氣體自處理容器4排出。2-7. Lower discharge portion 81 The processing unit 2 includes a lower discharge portion 81. The lower discharge portion 81 discharges the gas in the sealed casing 46. The lower discharge portion 81 further discharges the gas in the processing container 4. The lower discharge portion 81 discharges the gas from the processing container 4 via a position lower than the cooling position PC.

下部排出部81進而具備配管82、排氣埠83、開閉閥84及排氣機構85。配管82的一端連接於排氣埠83。排氣埠83連通連接於集合部42。排氣埠83與集合部42的空間E連通。開閉閥84設於配管82上。開閉閥84對配管82內的流路進行開閉。排氣機構85與配管82的另一端連通連接。排氣機構85抽吸氣體並將其排出。排氣機構85能夠調整氣體的排出量。更具體而言,排氣機構85藉由對氣體的流量或氣體的抽吸壓力進行調整從而能夠調整氣體的排出量。排氣機構85例如為真空泵、排氣送風機或噴射器。The lower discharge portion 81 further includes a pipe 82, an exhaust port 83, an opening and closing valve 84, and an exhaust mechanism 85. One end of the pipe 82 is connected to the exhaust port 83. The exhaust port 83 is connected in series to the collecting portion 42. The exhaust port 83 communicates with the space E of the collecting portion 42. The opening and closing valve 84 is provided on the pipe 82. The opening and closing valve 84 opens and closes the flow path in the pipe 82. The exhaust mechanism 85 is connected in communication with the other end of the pipe 82. The exhaust mechanism 85 draws gas and discharges it. The exhaust mechanism 85 is capable of adjusting the amount of gas discharged. More specifically, the exhaust mechanism 85 can adjust the discharge amount of the gas by adjusting the flow rate of the gas or the suction pressure of the gas. The exhaust mechanism 85 is, for example, a vacuum pump, an exhaust blower, or an ejector.

藉由開閉閥84開放且排氣機構85驅動,密封殼體46內的氣體與處理容器4內的氣體排出。具體而言,空間F1的氣體流至空間E。處理容器4內的氣體經由支撐銷孔32與開口15a而流至空間E。空間E的氣體經由排氣埠83而流至配管82。藉此,密封殼體46內的氣體與處理容器4內的氣體被排出至密封殼體46以及處理容器4的外部。排氣機構85對經由排氣埠83而自處理容器4排出的氣體的排出量進行調整。When the opening and closing valve 84 is opened and the exhaust mechanism 85 is driven, the gas in the sealed casing 46 and the gas in the processing container 4 are discharged. Specifically, the gas in the space F1 flows to the space E. The gas in the processing container 4 flows to the space E via the support pin hole 32 and the opening 15a. The gas in the space E flows to the pipe 82 via the exhaust port 83. Thereby, the gas in the sealed casing 46 and the gas in the processing container 4 are discharged to the sealed casing 46 and the outside of the processing vessel 4. The exhaust mechanism 85 adjusts the discharge amount of the gas discharged from the processing container 4 via the exhaust port 83.

於假設藉由支撐銷38與密封構件45的滑動而於空間F1產生塵埃的情況下,塵埃自空間F1通過空間E而流入排氣埠83。即,空間F1的塵埃亦經由排氣埠83而排出。因此,能夠切實地防止塵埃進入處理容器4。進而,於開口15a,氣體自處理容器4(支撐銷孔32)向密封殼體46(空間E)流動。此種氣體的流動恰當地阻止塵埃自密封殼體46流入處理容器4。藉此,能夠更切實地防止塵埃進入處理容器4。When it is assumed that dust is generated in the space F1 by the sliding of the support pin 38 and the sealing member 45, the dust flows into the exhaust port 83 through the space E from the space F1. That is, the dust in the space F1 is also discharged through the exhaust port 83. Therefore, it is possible to reliably prevent dust from entering the processing container 4. Further, in the opening 15a, the gas flows from the processing container 4 (the support pin hole 32) to the sealed casing 46 (space E). The flow of such gas properly prevents dust from flowing into the processing vessel 4 from the sealed casing 46. Thereby, dust can be prevented from entering the processing container 4 more reliably.

於假設外部氣體經由支撐銷38與密封構件45的密合部而流入空間F1的情況下,外部氣體自空間F1通過空間E而流入排氣埠83。即,空間F1的外部氣體亦經由排氣埠83而排出。因此,能夠切實地防止外部氣體進入處理容器4。進而,於開口15a,氣體自處理容器4(支撐銷孔32)向密封殼體46(空間E)流動。此種氣體的流動恰當地阻止外部氣體自密封殼體46流入處理容器4。藉此,能夠更切實地防止外部氣體進入處理容器4。When the external air flows into the space F1 via the adhesion portion between the support pin 38 and the sealing member 45, the external air flows into the exhaust port 83 through the space E from the space F1. That is, the outside air in the space F1 is also discharged through the exhaust port 83. Therefore, it is possible to reliably prevent the outside air from entering the processing container 4. Further, in the opening 15a, the gas flows from the processing container 4 (the support pin hole 32) to the sealed casing 46 (space E). The flow of such gas properly prevents external air from flowing into the processing vessel 4 from the sealed casing 46. Thereby, it is possible to more reliably prevent the outside air from entering the processing container 4.

如上所述,藉由經由排氣埠83將密封殼體46內的氣體以及處理容器4內的氣體排出,能夠恰當地防止塵埃或外部氣體等異物進入處理容器4。As described above, by discharging the gas in the sealed casing 46 and the gas in the processing container 4 through the exhaust port 83, it is possible to appropriately prevent foreign matter such as dust or external air from entering the processing container 4.

若排氣機構85的驅動停止,則下部排出部81停止氣體的排出。若關閉開閉閥84,則排氣埠83密閉。When the driving of the exhaust mechanism 85 is stopped, the lower discharge portion 81 stops the discharge of the gas. When the opening and closing valve 84 is closed, the exhaust port 83 is sealed.

2-8.感測器91、感測器93 處理單元2具備壓力感測器91及氧濃度感測器93。壓力感測器91對處理容器4內的氣體的壓力進行檢測。氧濃度感測器93對處理容器4內的氧濃度進行檢測。氧濃度感測器93例如為原電池(galvanic cell)式氧感測器或氧化鋯式氧感測器。2-8. Sensor 91, Sensor 93 The processing unit 2 is provided with a pressure sensor 91 and an oxygen concentration sensor 93. The pressure sensor 91 detects the pressure of the gas in the processing container 4. The oxygen concentration sensor 93 detects the oxygen concentration in the processing container 4. The oxygen concentration sensor 93 is, for example, a galvanic cell type oxygen sensor or a zirconia type oxygen sensor.

2-9.控制部95 處理單元2具備控制部95。控制部95與加熱部31、遮擋板驅動機構35、支撐銷驅動機構39、開閉閥54、開閉閥64、開閉閥74、開閉閥84、流量調整部55、流量調整部65、排氣機構75、排氣機構85、壓力感測器91及氧濃度感測器93以能夠通信的方式連接。控制部95接收壓力感測器91的檢測結果與氧濃度感測器93的檢測結果。控制部95對加熱部31、遮擋板驅動機構35、支撐銷驅動機構39、開閉閥54、開閉閥64、開閉閥74、開閉閥84、流量調整部55、流量調整部65、排氣機構75及排氣機構85進行控制。控制部95藉由執行各種處理的中央運算處理裝置(Central Processing Unit,CPU)、作為運算處理的作業區域的隨機存取記憶體(Random-Access Memory,RAM)、固定碟等儲存媒體等而實現。儲存媒體中儲存有用以處理基板W的處理方案(recipe)(處理程式)或氧濃度的基準值等各種資訊。2-9. Control Unit 95 The processing unit 2 includes a control unit 95. Control unit 95, heating unit 31, shutter driving mechanism 35, support pin driving mechanism 39, opening and closing valve 54, opening and closing valve 64, opening and closing valve 74, opening and closing valve 84, flow rate adjusting unit 55, flow rate adjusting unit 65, and exhausting mechanism 75 The exhaust mechanism 85, the pressure sensor 91, and the oxygen concentration sensor 93 are connected in a communicable manner. The control unit 95 receives the detection result of the pressure sensor 91 and the detection result of the oxygen concentration sensor 93. The control unit 95 controls the heating unit 31, the shutter driving mechanism 35, the support pin driving mechanism 39, the opening and closing valve 54, the opening and closing valve 64, the opening and closing valve 74, the opening and closing valve 84, the flow rate adjusting unit 55, the flow rate adjusting unit 65, and the exhausting mechanism 75. The exhaust mechanism 85 is controlled. The control unit 95 is realized by a central processing unit (CPU) that executes various processes, a random access memory (RAM) as a work area for arithmetic processing, and a storage medium such as a fixed disc. . Various information such as a recipe (processing program) for processing the substrate W or a reference value of the oxygen concentration is stored in the storage medium.

3.按壓構件6、止動件7及手動調整部8 圖5是處理單元2的立體圖。圖6是處理單元2的平面圖。圖7(A)是按壓構件的平面圖,圖7(B)是按壓構件的側面圖。圖8是沿圖6中的VIII-VIII線的剖面圖。3. Pressing member 6, stopper 7 and manual adjustment portion 8 Fig. 5 is a perspective view of the processing unit 2. FIG. 6 is a plan view of the processing unit 2. Fig. 7(A) is a plan view of the pressing member, and Fig. 7(B) is a side view of the pressing member. Figure 8 is a cross-sectional view taken along line VIII-VIII of Figure 6.

參照圖6。第1端部21以及止動件7於俯視時配置於自蓋部13偏離的位置。即,第1端部21以及止動件7於俯視時不與蓋部13重疊。第1端部21以及止動件7於俯視時配置於蓋部13的前方。更嚴格而言,第1端部21以及止動件7於俯視時相對於蓋部13的中央而配置於前方且右方。蓋部13的中央例如是於俯視時與供給埠53重疊的部分。Refer to Figure 6. The first end portion 21 and the stopper 7 are disposed at positions deviated from the lid portion 13 in plan view. That is, the first end portion 21 and the stopper 7 do not overlap the lid portion 13 in plan view. The first end portion 21 and the stopper 7 are disposed in front of the lid portion 13 in plan view. More strictly, the first end portion 21 and the stopper 7 are disposed forward and rightward with respect to the center of the lid portion 13 in plan view. The center of the lid portion 13 is, for example, a portion that overlaps the supply cassette 53 in plan view.

第2端部22以及手動調整部8於俯視時配置於自蓋部13偏離的位置。即,第2端部22以及手動調整部8於俯視時不與蓋部13重疊。第2端部22以及手動調整部8於俯視時配置於蓋部13的後方。更嚴格而言,第2端部22以及手動調整部8於俯視時相對於蓋部13的中央而配置於後方且左方。The second end portion 22 and the manual adjustment portion 8 are disposed at positions deviated from the lid portion 13 in plan view. In other words, the second end portion 22 and the manual adjustment portion 8 do not overlap the lid portion 13 in plan view. The second end portion 22 and the manual adjustment portion 8 are disposed rearward of the lid portion 13 in plan view. More strictly, the second end portion 22 and the manual adjustment portion 8 are disposed rearward and to the left with respect to the center of the lid portion 13 in plan view.

於俯視時,連接第1端部21與第2端部22的假想線L通過蓋部13的中央。按壓構件6於第1端部21與第2端部22之間對框體11按壓蓋部13。The imaginary line L connecting the first end portion 21 and the second end portion 22 passes through the center of the lid portion 13 in plan view. The pressing member 6 presses the lid portion 13 between the first end portion 21 and the second end portion 22 against the frame body 11.

第1端部21與止動件7於俯視時與框體11重疊。即,第1端部21與止動件7配置於框體11的上方。框體11具有第1角部11a。第1角部11a位於框體11的前部且右部。第1端部21與止動件7於俯視時配置於框體11的第1角部11a。The first end portion 21 and the stopper 7 overlap the frame body 11 in plan view. That is, the first end portion 21 and the stopper 7 are disposed above the casing 11. The casing 11 has a first corner portion 11a. The first corner portion 11a is located at the front portion and the right portion of the casing 11. The first end portion 21 and the stopper 7 are disposed on the first corner portion 11a of the casing 11 in plan view.

第2端部22與手動調整部8於俯視時與框體11重疊。即,第2端部22與手動調整部8配置於框體11的上方。框體11具有第2角部11c。第2角部11c於俯視時與第1角部11a對向。蓋部13的中央於俯視時位於第1角部11a與第2角部11c之間。第2角部11c與第1角部11a不相鄰。第2角部11c位於框體11的後部且左部。第2端部22以及手動調整部8於俯視時配置於框體11的第2角部11c。The second end portion 22 and the manual adjustment portion 8 overlap the frame body 11 in plan view. In other words, the second end portion 22 and the manual adjustment portion 8 are disposed above the casing 11 . The casing 11 has a second corner portion 11c. The second corner portion 11c faces the first corner portion 11a in plan view. The center of the lid portion 13 is located between the first corner portion 11a and the second corner portion 11c in plan view. The second corner portion 11c is not adjacent to the first corner portion 11a. The second corner portion 11c is located at the rear portion and the left portion of the casing 11. The second end portion 22 and the manual adjustment portion 8 are disposed in the second corner portion 11c of the casing 11 in plan view.

參照圖5-圖8。按壓構件6具備外框23及兩個增強構件24。外框23於俯視時配置於第1端部21與第2端部22之間。外框23與第1端部21連結。外框23與第2端部22連結。第1端部21連結於外框23的第1側部23b。第2端部22連結於外框23的第2側部23c。Refer to Figures 5-8. The pressing member 6 is provided with an outer frame 23 and two reinforcing members 24 . The outer frame 23 is disposed between the first end portion 21 and the second end portion 22 in plan view. The outer frame 23 is coupled to the first end portion 21. The outer frame 23 is coupled to the second end portion 22. The first end portion 21 is coupled to the first side portion 23b of the outer frame 23. The second end portion 22 is coupled to the second side portion 23c of the outer frame 23.

外框23於俯視時具有環形狀。外框23的輪廓具有大致多邊形狀(例如六邊形狀)。外框23具有開口。外框23的開口於俯視時形成於外框23的內側。外框23配置於蓋部13的上方。外框23於俯視時與蓋部13重疊。The outer frame 23 has a ring shape in plan view. The outline of the outer frame 23 has a substantially polygonal shape (for example, a hexagonal shape). The outer frame 23 has an opening. The opening of the outer frame 23 is formed inside the outer frame 23 in plan view. The outer frame 23 is disposed above the lid portion 13. The outer frame 23 overlaps with the lid portion 13 in plan view.

外框23包括線性延伸的多個(例如六個)直線部23a。各直線部23a相互接合。各直線部23a呈環狀接合。The outer frame 23 includes a plurality of (for example, six) straight portions 23a extending linearly. The straight portions 23a are joined to each other. Each of the straight portions 23a is annularly joined.

外框23的下表面23d大致平坦。外框23的下表面23d大致水平。外框23的下表面23d高於蓋部13的上表面13a。The lower surface 23d of the outer frame 23 is substantially flat. The lower surface 23d of the outer frame 23 is substantially horizontal. The lower surface 23d of the outer frame 23 is higher than the upper surface 13a of the cover portion 13.

增強構件24於俯視時配置於外框23的內側。具體而言,增強構件24線性延伸。增強構件24於俯視時沿與假想線L大致正交的方向延伸。增強構件24的兩端分別與外框23接合。增強構件24具有接合於外框23的第1端及接合於外框23的第2端。The reinforcing member 24 is disposed inside the outer frame 23 in plan view. In particular, the reinforcing member 24 extends linearly. The reinforcing member 24 extends in a direction substantially orthogonal to the imaginary line L in plan view. Both ends of the reinforcing member 24 are respectively engaged with the outer frame 23. The reinforcing member 24 has a first end joined to the outer frame 23 and a second end joined to the outer frame 23.

按壓構件6具有三個以上(例如四個)座部25。座部25連接於外框23。座部25自外框23向下方延伸。座部25的下表面大致平坦。座部25的下表面大致水平。座部25的下表面為大致圓形狀。座部25與蓋部13接觸。具體而言,座部25的下表面與蓋部13的上表面13a接觸。The pressing member 6 has three or more (for example, four) seats 25. The seat portion 25 is coupled to the outer frame 23. The seat portion 25 extends downward from the outer frame 23. The lower surface of the seat portion 25 is substantially flat. The lower surface of the seat portion 25 is substantially horizontal. The lower surface of the seat portion 25 has a substantially circular shape. The seat portion 25 is in contact with the lid portion 13. Specifically, the lower surface of the seat portion 25 is in contact with the upper surface 13a of the lid portion 13.

參照圖6。座部25於俯視時與蓋部13重疊。座部25於俯視時比蓋部13足夠小。座部25於俯視時與框體11和蓋部13的密合部位重疊。座部25於俯視時與配置於開口B的周圍的密封構件19重疊。座部25於俯視時與蓋部13的周緣部重疊。Refer to Figure 6. The seat portion 25 overlaps with the lid portion 13 in plan view. The seat portion 25 is sufficiently smaller than the cover portion 13 in plan view. The seat portion 25 overlaps with the adhesion portion between the frame body 11 and the lid portion 13 in plan view. The seat portion 25 overlaps with the sealing member 19 disposed around the opening B in plan view. The seat portion 25 overlaps with the peripheral edge portion of the lid portion 13 in plan view.

參照圖5-圖8。止動件7固定於框體11。止動件7具備兩個撐桿(stay)26與一根軸構件27。撐桿26固定於框體11的上表面。撐桿26自框體11的上表面向上方突出。軸構件27支撐於撐桿26。軸構件27具有連結於一者的撐桿26的第1端與連結於另一撐桿26的第2端。Refer to Figures 5-8. The stopper 7 is fixed to the frame 11. The stopper 7 is provided with two stays 26 and a shaft member 27. The stay 26 is fixed to the upper surface of the casing 11. The stay 26 protrudes upward from the upper surface of the casing 11. The shaft member 27 is supported by the stay 26. The shaft member 27 has a first end connected to one of the stays 26 and a second end connected to the other stay 26 .

軸構件27沿大致水平方向延伸。即,軸構件27的軸心C與水平方向大致平行。軸構件27具有大致圓柱形狀。軸構件27的下端與外框23的下表面23d為大致相同高度。軸構件27的下端高於蓋部13的上表面13a。The shaft member 27 extends in a substantially horizontal direction. That is, the axis C of the shaft member 27 is substantially parallel to the horizontal direction. The shaft member 27 has a substantially cylindrical shape. The lower end of the shaft member 27 is substantially the same height as the lower surface 23d of the outer frame 23. The lower end of the shaft member 27 is higher than the upper surface 13a of the cover portion 13.

軸構件27與第1端部21接觸。具體而言,軸構件27與第1端部21的上表面接觸。藉此,軸構件27禁止第1端部21向上方移動。The shaft member 27 is in contact with the first end portion 21. Specifically, the shaft member 27 is in contact with the upper surface of the first end portion 21. Thereby, the shaft member 27 prohibits the first end portion 21 from moving upward.

參照圖7(A)、圖7(B)。第1端部21具有與軸構件27的外周面接觸的接觸面21a。接觸面21a形成於第1端部21的上表面。7(A) and 7(B). The first end portion 21 has a contact surface 21a that is in contact with the outer peripheral surface of the shaft member 27. The contact surface 21a is formed on the upper surface of the first end portion 21.

接觸面21a進而能夠與軸構件27的外周面滑動。接觸面21a彎曲。藉此,第1端部21能夠繞軸構件27旋轉。即,按壓構件6能夠繞軸構件27旋轉。The contact surface 21a can further slide with the outer peripheral surface of the shaft member 27. The contact surface 21a is curved. Thereby, the first end portion 21 can be rotated around the shaft member 27. That is, the pressing member 6 is rotatable around the shaft member 27.

圖8表示大致水平姿勢的按壓構件6。於按壓構件6為大致水平姿勢的狀態下,外框23的下表面23d大致水平。於按壓構件6為大致水平姿勢的狀態下,按壓構件6(具體而言為座部25)與蓋部13接觸。於按壓構件6為大致水平姿勢的狀態下,按壓構件6能夠按壓蓋部13。Fig. 8 shows the pressing member 6 in a substantially horizontal posture. In a state where the pressing member 6 is in a substantially horizontal posture, the lower surface 23d of the outer frame 23 is substantially horizontal. The pressing member 6 (specifically, the seat portion 25) is in contact with the lid portion 13 in a state where the pressing member 6 is in a substantially horizontal posture. The pressing member 6 can press the lid portion 13 in a state where the pressing member 6 is in a substantially horizontal posture.

圖9表示傾斜姿勢的按壓構件6。圖9中,第2端部22的高度位置高於第1端部21。Fig. 9 shows the pressing member 6 in an inclined posture. In FIG. 9, the height position of the second end portion 22 is higher than that of the first end portion 21.

此處,將自軸構件27的軸心C的方向觀察而自軸構件27朝向第2端部22的水平朝向作為「第1方向d1」。將與第1方向d1相反的朝向稱為「第2方向d2」。如此,於圖9中,按壓構件6朝向第1方向d1而向上方傾斜。換言之,按壓構件6向第1方向d1且向上方傾斜。於按壓構件6朝向第1方向d1而向上方傾斜的狀態下,外框23的下表面23d亦朝向第1方向d1而向上方傾斜。於按壓構件6朝向第1方向d1而向上方傾斜的狀態下,按壓構件6不與蓋部13接觸。Here, the horizontal direction from the shaft member 27 toward the second end portion 22 as viewed from the direction of the axis C of the shaft member 27 is referred to as "first direction d1". The direction opposite to the first direction d1 is referred to as "the second direction d2". As described above, in FIG. 9 , the pressing member 6 is inclined upward in the first direction d1 . In other words, the pressing member 6 is inclined upward in the first direction d1. In a state where the pressing member 6 is inclined upward in the first direction d1, the lower surface 23d of the outer frame 23 is also inclined upward in the first direction d1. In a state where the pressing member 6 is inclined upward in the first direction d1, the pressing member 6 does not come into contact with the lid portion 13.

接觸面21a向上方開放。接觸面21a向下方凹陷。接觸面21a不接觸軸構件27的全周。與接觸面21a接觸的軸構件27的圓周方向的長度小於軸構件27的全周的二分之一。藉此,第1端部21能夠自軸構件27分離。即,按壓構件6能夠自軸構件27分離。The contact surface 21a is open upward. The contact surface 21a is recessed downward. The contact surface 21a does not contact the entire circumference of the shaft member 27. The length of the shaft member 27 in contact with the contact surface 21a in the circumferential direction is smaller than one-half of the entire circumference of the shaft member 27. Thereby, the first end portion 21 can be separated from the shaft member 27. That is, the pressing member 6 can be separated from the shaft member 27.

圖10、圖11是第1端部21與軸構件27的剖面詳細圖。圖10表示按壓構件6為大致水平姿勢的狀態下的第1端部21與軸構件27。圖11表示按壓構件6朝向第1方向d1而向上方傾斜的狀態下的第1端部21與軸構件27。10 and 11 are cross-sectional detailed views of the first end portion 21 and the shaft member 27. FIG. 10 shows the first end portion 21 and the shaft member 27 in a state in which the pressing member 6 is in a substantially horizontal posture. FIG. 11 shows the first end portion 21 and the shaft member 27 in a state where the pressing member 6 is inclined upward in the first direction d1.

此處,將較通過軸構件27的軸心C的假想的水平面H而位於更上方的軸構件27的部分稱為「上部27T」。將上部27T以外的軸構件27的部分稱為「下部27B」。將較通過軸構件27的軸心C的假想的鉛垂面V而位於第2端部22側(即第1方向d1)的軸構件27的部分稱為「表面部27F」。將表面部27F以外的軸構件27的部分稱為「背面部27R」。將表面部27F與下部27B的共通部分稱為「表面下部27FB」。將背面部27R與下部27B的共通部分稱為「背面下部27RB」。Here, a portion that is located above the shaft member 27 that passes above the virtual horizontal plane H of the axial center C of the shaft member 27 is referred to as "upper portion 27T". A portion of the shaft member 27 other than the upper portion 27T is referred to as a "lower portion 27B". The portion of the shaft member 27 located on the second end portion 22 side (that is, the first direction d1) that passes through the virtual vertical plane V of the axial center C of the shaft member 27 is referred to as "surface portion 27F". A portion of the shaft member 27 other than the surface portion 27F is referred to as a "back surface portion 27R". The common portion between the surface portion 27F and the lower portion 27B is referred to as "surface lower portion 27FB". The common portion of the back surface portion 27R and the lower portion 27B is referred to as "back surface lower portion 27RB".

參照圖10。於按壓構件6為大致水平姿勢的狀態下,接觸面21a與軸構件27的背面下部27RB接觸。於按壓構件6為大致水平姿勢的狀態下,接觸面21a與軸構件27的背面下部27RB稍微接觸。於按壓構件6為大致水平姿勢的狀態下,接觸面21a與軸構件27的背面下部27RB的一部分(具體而言,背面下部27RB的下部)接觸。因此,軸構件27(止動件7)禁止於按壓構件6為大致水平姿勢的狀態下第1端部21(按壓構件6)沿第1方向d1移動。Refer to Figure 10. In a state where the pressing member 6 is in a substantially horizontal posture, the contact surface 21a is in contact with the lower surface lower portion 27RB of the shaft member 27. In a state where the pressing member 6 is in a substantially horizontal posture, the contact surface 21a is slightly in contact with the lower surface lower portion 27RB of the shaft member 27. In a state where the pressing member 6 is in a substantially horizontal posture, the contact surface 21a is in contact with a part of the back surface lower portion 27RB of the shaft member 27 (specifically, a lower portion of the back surface lower portion 27RB). Therefore, the shaft member 27 (the stopper 7) is prohibited from moving in the first direction d1 in a state where the pressing member 6 is in a substantially horizontal posture in the first end portion 21 (the pressing member 6).

於按壓構件6為大致水平姿勢的狀態下,接觸面21a與軸構件27的表面下部27FB接觸。因此,軸構件27(止動件7)禁止於按壓構件6為大致水平姿勢的狀態下第1端部21(按壓構件6)沿第2方向d2移動。In a state where the pressing member 6 is in a substantially horizontal posture, the contact surface 21a is in contact with the lower surface portion 27FB of the shaft member 27. Therefore, the shaft member 27 (the stopper 7) is prohibited from moving in the second direction d2 in a state where the pressing member 6 is in a substantially horizontal posture in the first end portion 21 (the pressing member 6).

參照圖11。於按壓構件6朝向第1方向d1而向上方傾斜的狀態下,接觸面21a僅與軸構件27的表面部27F接觸。即,於按壓構件6朝向第1方向d1而向上方傾斜的狀態下,接觸面21a不與軸構件27的背面部27R接觸。因此,軸構件27(止動件7)容許於按壓構件6朝向第1方向d1而向上方傾斜的狀態下第1端部21(按壓構件6)沿第1方向d1移動。即,於按壓構件6朝向第1方向d1而向上方傾斜的狀態下,第1端部21(按壓構件6)能夠自軸構件27(止動件7)脫離。Refer to Figure 11. In a state where the pressing member 6 is inclined upward in the first direction d1, the contact surface 21a is in contact only with the surface portion 27F of the shaft member 27. In other words, in a state where the pressing member 6 is inclined upward in the first direction d1, the contact surface 21a does not come into contact with the back surface portion 27R of the shaft member 27. Therefore, the shaft member 27 (the stopper 7) allows the first end portion 21 (the pressing member 6) to move in the first direction d1 in a state where the pressing member 6 is inclined upward in the first direction d1. In other words, the first end portion 21 (the pressing member 6) can be detached from the shaft member 27 (the stopper 7) in a state where the pressing member 6 is inclined upward in the first direction d1.

按壓構件6能夠與止動件7進行拆裝的、按壓構件6的傾斜角度較佳為15度以上。按壓構件6能夠與止動件進行拆裝的、按壓構件6的傾斜角度進而佳為10度以上。按壓構件6能夠與止動件進行拆裝的、按壓構件6的傾斜角度更佳為5度以上。此處,所謂按壓構件6的傾斜角度例如為外框23的下表面23d與水平面H所成的角度。The inclination angle of the pressing member 6 in which the pressing member 6 can be attached and detached to the stopper 7 is preferably 15 degrees or more. The inclination angle of the pressing member 6 in which the pressing member 6 can be attached and detached to the stopper is preferably 10 degrees or more. The inclination angle of the pressing member 6 in which the pressing member 6 can be attached and detached to the stopper is more preferably 5 degrees or more. Here, the inclination angle of the pressing member 6 is, for example, an angle formed by the lower surface 23d of the outer frame 23 and the horizontal plane H.

再者,本實施形態中,與接觸面21a接觸的軸構件27的圓周方向的長度為軸構件27的全周的四分之一以上。Further, in the present embodiment, the length of the shaft member 27 in contact with the contact surface 21a in the circumferential direction is one quarter or more of the entire circumference of the shaft member 27.

參照圖5-圖8。手動調整部8安裝於框體11。手動調整部8使第2端部22相對於框體11而上下移動。Refer to Figures 5-8. The manual adjustment unit 8 is attached to the housing 11 . The manual adjustment unit 8 moves the second end portion 22 up and down with respect to the casing 11 .

手動調整部8具備結合部28及螺釘29。結合部28固定於框體11。結合部28自框體11的上表面向上方突出。結合部28具有螺釘孔。螺釘孔形成於結合部28的內部。螺釘孔沿大致上下方向Z延伸。螺釘孔向上方開放。The manual adjustment unit 8 includes a joint portion 28 and a screw 29 . The joint portion 28 is fixed to the frame body 11. The joint portion 28 protrudes upward from the upper surface of the casing 11. The joint portion 28 has a screw hole. A screw hole is formed inside the joint portion 28. The screw holes extend in a substantially up and down direction Z. The screw holes are open to the top.

螺釘29例如為螺栓。螺釘29例如為旋輪螺栓。螺釘29與結合部28(螺釘孔)結合。螺釘29的軸部29a與上下方向Z大致平行。螺釘29的頭部29b配置於螺釘29的軸部29a的上端。The screw 29 is, for example, a bolt. The screw 29 is, for example, a screw bolt. The screw 29 is coupled to the joint portion 28 (screw hole). The shaft portion 29a of the screw 29 is substantially parallel to the vertical direction Z. The head portion 29b of the screw 29 is disposed at the upper end of the shaft portion 29a of the screw 29.

按壓構件6的第2端部22具有安裝座22a及切口22b。安裝座22a具有平坦的板形狀。切口22b形成於安裝座22a。螺釘29的軸部29a配置於切口22b。第2端部22(安裝座22a)配置於螺釘29的頭部29b與結合部28之間。對應於螺釘29的轉動,第2端部22進行上下移動。進而,第2端部22(安裝座22a)能夠自結合部28以及螺釘29分離。即,按壓構件6能夠自手動調整部8分離。The second end portion 22 of the pressing member 6 has a mounting seat 22a and a slit 22b. The mount 22a has a flat plate shape. The slit 22b is formed in the mount 22a. The shaft portion 29a of the screw 29 is disposed in the slit 22b. The second end portion 22 (mounting seat 22 a ) is disposed between the head portion 29 b of the screw 29 and the joint portion 28 . The second end portion 22 moves up and down in response to the rotation of the screw 29. Further, the second end portion 22 (mounting seat 22a) can be separated from the joint portion 28 and the screw 29. That is, the pressing member 6 can be separated from the manual adjustment portion 8.

4.拆裝蓋部13的作業 圖12(A)-圖12(D)是表示將蓋部13自框體11拆卸下的順序的示意圖。對將蓋部13自框體11拆卸下的作業進行說明。再者,該作業藉由用戶的手工作業來進行。即,該作業不藉由控制部95的控制來執行。4. Operation of attaching and detaching the lid portion 13 Figs. 12(A) to 12(D) are schematic views showing the procedure of detaching the lid portion 13 from the frame body 11. The operation of detaching the lid portion 13 from the casing 11 will be described. Furthermore, the job is performed by the user's manual work. That is, the job is not executed by the control of the control unit 95.

參照圖12(A)。用戶位於處理單元2以及外壁板9的後方。用戶拆卸下外壁板9。Refer to Figure 12 (A). The user is located behind the processing unit 2 and the outer wall panel 9. The user removes the lower outer wall panel 9.

參照圖12(B)。用戶轉動螺釘29,從而將第2端部22自手動調整部8拆卸下。螺釘29為旋輪螺栓,因此用戶能夠徒手轉動螺釘。藉此,解除按壓構件6對蓋部13的按壓。用戶將按壓構件6自手動調整部8分離。用戶使按壓構件6繞軸構件27轉動。例如,用戶將第2端部22抬起。藉此,按壓構件6朝向第1方向d1而向上方傾斜。Refer to Figure 12 (B). The user turns the screw 29 to detach the second end portion 22 from the manual adjustment portion 8. The screw 29 is a screw bolt so that the user can turn the screw by hand. Thereby, the pressing of the lid member 13 by the pressing member 6 is released. The user separates the pressing member 6 from the manual adjustment portion 8. The user rotates the pressing member 6 about the shaft member 27. For example, the user lifts the second end portion 22. Thereby, the pressing member 6 is inclined upward in the first direction d1.

參照圖12(C)。用戶於按壓構件6朝向第1方向d1而向上方傾斜的狀態下,將按壓構件6向第1方向d1拉。藉此,按壓構件6(第1端部21)自止動件7分離。用戶將按壓構件6移動至自框體11的上方的空間偏離的位置。例如,用戶將按壓構件6移動至處理單元2的後方。Refer to Figure 12 (C). When the pressing member 6 is inclined upward in the first direction d1, the pressing member 6 pulls the pressing member 6 in the first direction d1. Thereby, the pressing member 6 (first end portion 21) is separated from the stopper 7. The user moves the pressing member 6 to a position deviated from the space above the casing 11. For example, the user moves the pressing member 6 to the rear of the processing unit 2.

參照圖12(D)。用戶將蓋部13抬起。藉此,蓋部13脫離框體11。此時,整流板56亦與蓋部13一體地自框體11脫離。即,開口B開放。用戶將蓋部13移動至自框體11的上方的空間偏離的位置。例如,用戶將蓋部13移動至處理單元2的後方。Refer to Figure 12 (D). The user lifts the lid portion 13. Thereby, the lid portion 13 is separated from the frame body 11. At this time, the rectifying plate 56 is also detached from the casing 11 integrally with the lid portion 13. That is, the opening B is open. The user moves the lid portion 13 to a position where the space above the frame body 11 is deviated. For example, the user moves the lid portion 13 to the rear of the processing unit 2.

對將蓋部13安裝於框體11的作業進行說明。再者,該作業亦藉由用戶的手工作業來進行。The operation of attaching the lid portion 13 to the casing 11 will be described. Furthermore, the work is also performed by the user's manual work.

用戶位於處理單元2的後方。用戶將蓋部13載置於框體11的上部。用戶使按壓構件6的第1端部21接觸(卡合於)止動件7。具體而言,用戶於按壓構件6朝向第1方向d1而向上方傾斜的狀態下,使按壓構件6向第2方向d2移動。並且,用戶將第1端部21插入軸構件27的下方。藉此,第1端部21(接觸面21a)與軸構件27接觸(銜接)。用戶使按壓構件6繞軸構件27轉動。例如,用戶將第2端部22放下。用戶使按壓構件6為大致水平姿勢。藉此,按壓構件6(座部25)與蓋部13接觸。用戶將按壓構件6的第2端部22安置(set)於手動調整部8。具體而言,用戶將按壓構件6的第2端部22配置於結合部28與螺釘29之間。用戶轉動螺釘29從而對第2端部22的高度位置進行調整。具體而言,用戶轉動螺釘29,從而使第2端部22向下方移動。藉此,於第1端部21的高度位置保持為固定的狀態下,第2端部22的高度位置變低。因此,按壓構件6以適宜的力對框體11按壓蓋部13。其結果,蓋部13與框體11密合。之後,用戶安裝外壁板9。The user is located behind the processing unit 2. The user places the lid portion 13 on the upper portion of the casing 11. The user brings (engages) the first end portion 21 of the pressing member 6 into the stopper 7. Specifically, the user moves the pressing member 6 in the second direction d2 in a state where the pressing member 6 is inclined upward in the first direction d1. Further, the user inserts the first end portion 21 into the lower side of the shaft member 27. Thereby, the first end portion 21 (contact surface 21a) is in contact (engagement) with the shaft member 27. The user rotates the pressing member 6 about the shaft member 27. For example, the user puts down the second end portion 22. The user places the pressing member 6 in a substantially horizontal posture. Thereby, the pressing member 6 (seat portion 25) comes into contact with the lid portion 13. The user sets the second end portion 22 of the pressing member 6 to the manual adjustment portion 8. Specifically, the user places the second end portion 22 of the pressing member 6 between the coupling portion 28 and the screw 29 . The user turns the screw 29 to adjust the height position of the second end portion 22. Specifically, the user turns the screw 29 to move the second end portion 22 downward. Thereby, the height position of the second end portion 22 is lowered in a state where the height position of the first end portion 21 is kept constant. Therefore, the pressing member 6 presses the lid portion 13 against the frame body 11 with an appropriate force. As a result, the lid portion 13 is in close contact with the casing 11. After that, the user installs the outer wall panel 9.

5.處理基板的處理例 其次,對處理單元2處理基板W的處理例進行說明。 本處理例中,基板處理裝置1對塗佈有自組織材料的基板W進行熱處理。基板處理裝置1藉由對基板W進行加熱從而使自組織材料相分離。相分離的自組織材料具有規則性高的構造。進而,基板處理裝置1藉由對基板W進行冷卻從而保護相分離的自組織材料的構造免於劣化或衰變。5. Processing Example of Processing Substrate Next, a processing example of processing the substrate W by the processing unit 2 will be described. In the present processing example, the substrate processing apparatus 1 heat-treats the substrate W coated with the self-organizing material. The substrate processing apparatus 1 separates the self-organizing material by heating the substrate W. The phase separated self-organizing material has a highly regular structure. Further, the substrate processing apparatus 1 protects the structure of the phase-separated self-organizing material from deterioration or decay by cooling the substrate W.

圖13是表示基板處理裝置1的動作例的順序的流程圖。基板處理裝置1的動作例包括搬入工序(步驟S1)、密閉工序(步驟S2)、置換工序(步驟S3)、加熱工序(步驟S4)、冷卻工序(步驟S5)、開放工序(步驟S6)及搬出工序(步驟S7)。FIG. 13 is a flowchart showing the procedure of an operation example of the substrate processing apparatus 1. The operation example of the substrate processing apparatus 1 includes a loading step (step S1), a sealing step (step S2), a replacement step (step S3), a heating step (step S4), a cooling step (step S5), an opening step (step S6), and The unloading process (step S7).

以下,對各工序進行說明。以下的動作例中,各構件依據控制部95的控制而進行動作。以下的動作例中,按壓構件6對框體11按壓蓋部13,蓋部13密合於框體11。Hereinafter, each step will be described. In the following operation example, each member operates in accordance with the control of the control unit 95. In the following operation example, the pressing member 6 presses the lid portion 13 on the frame body 11, and the lid portion 13 is in close contact with the frame body 11.

<步驟S1> 搬入工序 遮擋板驅動機構35使遮擋板12自框體11脫離。藉此,搬送口A開放。搬送機構3將基板W搬入至處理容器4內。具體而言,搬送機構3於以水平姿勢保持著基板W的狀態下向後方移動,並經由搬送口A而進入處理容器4的內部。藉此,基板W以水平姿勢向後方移動,並經由搬送口A而進入處理容器4內。基板W上已塗佈有自組織材料。支撐銷驅動機構39使支撐銷38上升至上方位置。支撐銷38自搬送機構3接受基板W。支撐銷38接受基板W後,搬送機構3退出至處理容器4的外部。支撐銷38對基板W於冷卻位置PC進行支撐。<Step S1> Loading Step The shutter driving mechanism 35 disengages the shutter 12 from the casing 11. Thereby, the transfer port A is opened. The transport mechanism 3 carries the substrate W into the processing container 4. Specifically, the transport mechanism 3 moves rearward while holding the substrate W in a horizontal posture, and enters the inside of the processing container 4 via the transport port A. Thereby, the substrate W moves rearward in a horizontal posture and enters the processing container 4 via the transfer port A. The substrate W has been coated with a self-organizing material. The support pin drive mechanism 39 raises the support pin 38 to the upper position. The support pin 38 receives the substrate W from the transfer mechanism 3. After the support pin 38 receives the substrate W, the transport mechanism 3 is withdrawn to the outside of the processing container 4. The support pin 38 supports the substrate W at the cooling position PC.

搬入工序中,下部排出部81將氣體自密封殼體46以及處理容器4排出。下部排出部81持續將氣體自密封殼體46以及處理容器4排出,直至後述搬出工序(步驟S7)結束。In the carry-in process, the lower discharge portion 81 discharges the gas from the sealed casing 46 and the processing container 4. The lower discharge portion 81 continuously discharges the gas from the sealed casing 46 and the processing container 4 until the unloading step (step S7) described later is completed.

<步驟S2> 密閉工序 遮擋板驅動機構35將遮擋板12安裝於框體11。遮擋板12經由密封構件19而與框體11密合。藉此,搬送口A密閉。即,處理容器4大致密閉。密閉工序中,支撐銷38處於上方位置,基板W於冷卻位置PC靜止。<Step S2> Sealing Step The shutter driving mechanism 35 attaches the shutter 12 to the casing 11. The shielding plate 12 is in close contact with the casing 11 via the sealing member 19. Thereby, the transfer port A is sealed. That is, the processing container 4 is substantially sealed. In the sealing step, the support pin 38 is at the upper position, and the substrate W is stationary at the cooling position PC.

<步驟S3> 置換工序 置換工序中,將處理容器4內的氣體置換為非氧化性氣體。具體而言,上部供給部51將非氧化性氣體供給至處理容器4內,側部排出部71將處理容器4內的氣體排出。置換工序中,支撐銷38處於上方位置,基板W於冷卻位置PC靜止。<Step S3> Replacement Step In the replacement step, the gas in the processing container 4 is replaced with a non-oxidizing gas. Specifically, the upper supply unit 51 supplies the non-oxidizing gas into the processing container 4, and the side discharge unit 71 discharges the gas in the processing container 4. In the replacement step, the support pin 38 is at the upper position, and the substrate W is stationary at the cooling position PC.

此處,亦可使非氧化性氣體對處理容器4的供給量與氣體自處理容器4的排出量隨時間而發生變化。進而,亦可使處理容器4內的氣體的壓力隨時間發生變化。例如,於置換工序的初期階段將處理容器4內抽真空。具體而言,於置換工序的初期,不供給非氧化性氣體而以大的排出量將氣體排出。藉此,提高處理容器4的真空度。例如,於置換工序的中期階段,以大的供給量供給非氧化性氣體並以大的排出量將氣體排出。藉此,使處理容器4的氣體的壓力為高於初期階段的負壓。例如,於置換工序的終期階段,以大的供給量供給非氧化性氣體並以小的排出量將氣體排出。藉此,使處理容器4內的氣體的壓力為正壓。Here, the supply amount of the non-oxidizing gas to the processing container 4 and the amount of gas discharged from the processing container 4 may be changed with time. Further, the pressure of the gas in the processing container 4 may be changed with time. For example, the inside of the processing container 4 is evacuated in the initial stage of the replacement process. Specifically, in the initial stage of the replacement process, the non-oxidizing gas is not supplied, and the gas is discharged at a large discharge amount. Thereby, the degree of vacuum of the processing container 4 is increased. For example, in the middle stage of the replacement process, the non-oxidizing gas is supplied at a large supply amount and the gas is discharged at a large discharge amount. Thereby, the pressure of the gas of the processing container 4 is made higher than the negative pressure of the initial stage. For example, in the final stage of the replacement process, the non-oxidizing gas is supplied at a large supply amount and the gas is discharged at a small discharge amount. Thereby, the pressure of the gas in the processing container 4 is made into a positive pressure.

藉由置換工序,處理容器4內的氧濃度降低至基準值以下。即,處理容器4內成為非氧化性氣體環境。By the replacement step, the oxygen concentration in the processing container 4 is lowered to the reference value or lower. That is, the inside of the processing container 4 is in a non-oxidizing gas atmosphere.

<步驟S4> 加熱工序 加熱工序於非氧化性氣體環境下對基板W進行加熱。藉由對基板W的加熱,使基板W上的自組織化材料相分離。<Step S4> Heating Step The heating step heats the substrate W in a non-oxidizing gas atmosphere. The self-assembled material on the substrate W is phase-separated by heating the substrate W.

當開始加熱工序時,支撐銷驅動機構39使支撐銷38下降至下方位置。藉此,基板W自冷卻位置PC移動至加熱位置PH。加熱工序中,僅於基板W自冷卻位置PC移動至加熱位置PH期間,下部供給部61將非氧化性氣體供給至處理容器4內。下部供給部61經由加熱部31的氣體流通孔34而將非氧化性氣體吹出。藉此,切實地防止氧滯留於基板W與加熱部31的間隙。When the heating process is started, the support pin drive mechanism 39 lowers the support pin 38 to the lower position. Thereby, the substrate W is moved from the cooling position PC to the heating position PH. In the heating step, the lower supply unit 61 supplies the non-oxidizing gas into the processing container 4 only during the movement of the substrate W from the cooling position PC to the heating position PH. The lower supply unit 61 blows a non-oxidizing gas through the gas flow holes 34 of the heating unit 31. Thereby, oxygen is reliably prevented from remaining in the gap between the substrate W and the heating portion 31.

基板W到達加熱位置PH後,直至加熱工序結束,基板W於加熱位置PH靜止。加熱部31對處於加熱位置PH的基板W進行加熱。對基板W進行加熱的溫度例如為300度以上。對基板W進行加熱的溫度例如為自組織材料的玻璃轉移點以上。玻璃轉移點亦稱為玻璃轉移溫度。對基板W進行加熱的溫度例如為340度至360度的範圍內的值。After the substrate W reaches the heating position PH, the substrate W is stationary at the heating position PH until the heating step is completed. The heating unit 31 heats the substrate W at the heating position PH. The temperature at which the substrate W is heated is, for example, 300 degrees or more. The temperature at which the substrate W is heated is, for example, higher than the glass transition point of the self-organizing material. The glass transition point is also known as the glass transition temperature. The temperature at which the substrate W is heated is, for example, a value in the range of 340 degrees to 360 degrees.

加熱工序中,上部供給部51將非氧化性氣體供給至處理容器4內,側部排出部71將氣體自處理容器4排出。藉此,將處理容器4內保持為非氧化性氣體環境。加熱工序中,處理容器4內的氣體的壓力為負壓。In the heating step, the upper supply unit 51 supplies the non-oxidizing gas into the processing container 4, and the side discharge unit 71 discharges the gas from the processing container 4. Thereby, the inside of the processing container 4 is maintained in a non-oxidizing gas atmosphere. In the heating step, the pressure of the gas in the processing container 4 is a negative pressure.

<步驟S5> 冷卻工序 冷卻工序於非氧化性氣體環境下對基板W進行冷卻。藉此,保護相分離的自組織材料的構造免於衰變或劣化。<Step S5> Cooling Step The cooling step cools the substrate W in a non-oxidizing gas atmosphere. Thereby, the structure of the phase separated self-organizing material is protected from decay or deterioration.

當開始冷卻工序時,支撐銷驅動機構39使支撐銷38移動至上方位置。藉此,基板W自加熱位置PH上升至冷卻位置PC。基板W到達冷卻位置PC後,直至冷卻工序結束,基板W於冷卻位置PC靜止。When the cooling process is started, the support pin drive mechanism 39 moves the support pin 38 to the upper position. Thereby, the substrate W rises from the heating position PH to the cooling position PC. After the substrate W reaches the cooling position PC, the substrate W is stationary at the cooling position PC until the cooling process is completed.

冷卻工序中,上部供給部51以及下部供給部61將非氧化性氣體供給至處理容器4內,側部排出部71將處理容器4內的氣體排出。藉此,將處理容器4內保持為非氧化性氣體環境。冷卻工序中,處理容器4內的氣體的壓力為負壓。In the cooling step, the upper supply unit 51 and the lower supply unit 61 supply the non-oxidizing gas into the processing container 4, and the side discharge unit 71 discharges the gas in the processing container 4. Thereby, the inside of the processing container 4 is maintained in a non-oxidizing gas atmosphere. In the cooling step, the pressure of the gas in the processing container 4 is a negative pressure.

例如,冷卻工序中非氧化性氣體的供給量比加熱工序中非氧化性氣體的供給量大。藉此,能夠以短時間冷卻基板W。例如,冷卻工序中處理容器4內的氣體的排出量比加熱工序中處理容器4內的氣體的排出量大。藉此,能夠以短時間冷卻基板W。For example, the supply amount of the non-oxidizing gas in the cooling step is larger than the supply amount of the non-oxidizing gas in the heating step. Thereby, the substrate W can be cooled in a short time. For example, the discharge amount of the gas in the processing container 4 in the cooling process is larger than the discharge amount of the gas in the processing container 4 in the heating process. Thereby, the substrate W can be cooled in a short time.

<步驟S6> 開放工序 遮擋板驅動機構35使遮擋板12自框體11脫離。藉此,搬送口A開放。即,處理容器4開放。<Step S6> Opening Process The shutter driving mechanism 35 disengages the shutter 12 from the casing 11. Thereby, the transfer port A is opened. That is, the processing container 4 is open.

<步驟S7> 搬出工序 搬送機構3將基板W自處理容器4搬出。具體而言,搬送機構3經由搬送口A而進入處理容器4的內部。支撐銷驅動機構39使支撐銷38下降。搬送機構3自支撐銷38接受基板W。搬送機構3以水平姿勢對基板W進行保持。搬送機構3於以水平姿勢保持著基板W的狀態下向前方移動,並經由搬送口A而退出至處理容器4的外部。藉此,基板W以水平姿勢向前方移動,並經由搬送口A而自處理容器4送出。<Step S7> Carrying out process The conveying mechanism 3 carries out the substrate W from the processing container 4. Specifically, the transport mechanism 3 enters the inside of the processing container 4 via the transport port A. The support pin drive mechanism 39 lowers the support pin 38. The conveying mechanism 3 receives the substrate W from the support pin 38. The transport mechanism 3 holds the substrate W in a horizontal posture. The conveyance mechanism 3 moves forward while holding the substrate W in a horizontal posture, and exits to the outside of the processing container 4 via the transfer port A. Thereby, the substrate W is moved forward in a horizontal posture, and is sent out from the processing container 4 via the transfer port A.

6.實施形態的效果 如此,根據實施形態的基板處理裝置,發揮以下效果。6. Effect of the Embodiment As described above, the substrate processing apparatus according to the embodiment exhibits the following effects.

基板處理裝置1具備按壓構件6、止動件7及手動調整部8。因此,能夠於禁止了按壓構件6的第1端部21向上方移動的狀態下,降低按壓構件6的第2端部22的高度位置。藉此,按壓構件6能夠對框體11適宜地按壓蓋部13。藉此,能夠提高處理容器4的氣密性。The substrate processing apparatus 1 includes a pressing member 6 , a stopper 7 , and a manual adjustment unit 8 . Therefore, the height position of the second end portion 22 of the pressing member 6 can be lowered in a state where the first end portion 21 of the pressing member 6 is prohibited from moving upward. Thereby, the pressing member 6 can press the lid portion 13 appropriately for the frame body 11. Thereby, the airtightness of the processing container 4 can be improved.

進而,能夠於禁止了按壓構件6的第1端部21向上方移動的狀態下,提高按壓構件6的第2端部22的高度位置。藉此,能夠解除按壓構件6對蓋部13的按壓。藉此,能夠容易地將蓋部13自框體11分離。即,能夠容易地開放開口B。從而,能夠容易地進行處理容器4的維護。Further, in a state where the first end portion 21 of the pressing member 6 is prohibited from moving upward, the height position of the second end portion 22 of the pressing member 6 can be increased. Thereby, the pressing of the lid member 13 by the pressing member 6 can be released. Thereby, the lid portion 13 can be easily separated from the casing 11. That is, the opening B can be easily opened. Thereby, the maintenance of the processing container 4 can be easily performed.

按壓構件6的第1端部21於俯視時位於蓋部13的前方,按壓構件6的第2端部22於俯視時位於蓋部13的後方。因此,於俯視時,蓋部13配置於第1端部21與第2端部22之間。藉此,藉由手動調整部8對按壓構件6的第2端部22的高度位置進行調整,從而能夠適宜地調整按壓構件6按壓蓋部13的力。The first end portion 21 of the pressing member 6 is located in front of the lid portion 13 in plan view, and the second end portion 22 of the pressing member 6 is located rearward of the lid portion 13 in plan view. Therefore, the lid portion 13 is disposed between the first end portion 21 and the second end portion 22 in plan view. Thereby, the height position of the second end portion 22 of the pressing member 6 is adjusted by the manual adjustment portion 8, and the force by which the pressing member 6 presses the lid portion 13 can be appropriately adjusted.

按壓構件6的第1端部21以及止動件7於俯視時配置於框體11的第1角部11a,按壓構件6的第2端部22以及手動調整部8於俯視時配置於框體11的第2角部11c。因此,能夠利用第1角部11a的空間來效率良好地配置按壓構件6的第1端部21以及止動件7。進而,能夠利用第2角部11c的空間來效率良好地配置按壓構件6的第2端部22以及手動調整部8。藉此,能夠減小處理單元2(基板處理裝置1)的設置面積。The first end portion 21 of the pressing member 6 and the stopper 7 are disposed in the first corner portion 11a of the casing 11 in a plan view, and the second end portion 22 of the pressing member 6 and the manual adjustment portion 8 are disposed in the casing in a plan view. The second corner portion 11c of 11. Therefore, the first end portion 21 of the pressing member 6 and the stopper 7 can be efficiently arranged by the space of the first corner portion 11a. Further, the second end portion 22 of the pressing member 6 and the manual adjustment portion 8 can be efficiently arranged by the space of the second corner portion 11c. Thereby, the installation area of the processing unit 2 (substrate processing apparatus 1) can be reduced.

手動調整部8配置於較止動件7更靠近外壁板9的位置。因此,於已拆卸下外壁板9的狀態下,用戶能夠容易地操作手動調整部8。藉此,能夠更容易地進行處理容器4的維護。The manual adjustment portion 8 is disposed at a position closer to the outer wall panel 9 than the stopper 7. Therefore, the user can easily operate the manual adjustment portion 8 in a state where the lower outer wall panel 9 has been removed. Thereby, the maintenance of the processing container 4 can be performed more easily.

即便處理容器4的前方、右方、左方、上方以及下方的空間狹小,用戶亦能夠容易地對手動調整部8進行操作。如此,於處理容器4的周圍的空間狹小的情況下,本基板處理裝置1的有用性尤其高。Even if the space in front of the processing container 4, the right side, the left side, the upper side, and the lower side is narrow, the user can easily operate the manual adjustment unit 8. As described above, in the case where the space around the processing container 4 is narrow, the usefulness of the substrate processing apparatus 1 is particularly high.

手動調整部8安裝於框體11。藉此,能夠恰當地設置手動調整部8。The manual adjustment unit 8 is attached to the housing 11 . Thereby, the manual adjustment unit 8 can be appropriately provided.

手動調整部8使按壓構件6的第2端部22相對於框體11而上下移動。藉此,手動調整部8能夠恰當地對按壓構件6的第2端部22的高度位置進行調整。The manual adjustment unit 8 moves the second end portion 22 of the pressing member 6 up and down with respect to the casing 11 . Thereby, the manual adjustment unit 8 can appropriately adjust the height position of the second end portion 22 of the pressing member 6.

手動調整部8包括螺釘29。對應於螺釘29的轉動,按壓構件6的第2端部22進行上下移動。因此,僅由用戶轉動螺釘29便能夠容易地對按壓構件6的第2端部22的高度位置進行調整。即,僅由用戶轉動螺釘29便能夠使蓋部13密合於框體11。進而,僅由用戶轉動螺釘29便能夠解除按壓構件6對蓋部13的按壓。The manual adjustment portion 8 includes a screw 29. The second end portion 22 of the pressing member 6 moves up and down in response to the rotation of the screw 29. Therefore, the height position of the second end portion 22 of the pressing member 6 can be easily adjusted only by the user turning the screw 29. That is, the lid portion 13 can be brought into close contact with the casing 11 only by the user turning the screw 29. Further, the pressing of the screw 29 by the user can release the pressing of the lid member 13 by the pressing member 6.

螺釘29為旋輪螺栓。因此,用戶不使用工具便能夠轉動螺釘29。藉此,用戶能夠更容易地對按壓構件6的第2端部22的高度位置進行調整。The screw 29 is a screw bolt. Therefore, the user can turn the screw 29 without using a tool. Thereby, the user can more easily adjust the height position of the second end portion 22 of the pressing member 6.

按壓構件6具有外框23。因此,按壓構件6能夠有效果地對框體11按壓蓋部13。The pressing member 6 has an outer frame 23. Therefore, the pressing member 6 can effectively press the lid portion 13 against the frame body 11.

外框23的輪廓具有大致多邊形狀。因此,能夠有效果地防止外框23的撓曲或形變。藉此,按壓構件6能夠均勻地按壓蓋部13。The outline of the outer frame 23 has a substantially polygonal shape. Therefore, it is possible to effectively prevent the deflection or deformation of the outer frame 23. Thereby, the pressing member 6 can press the lid portion 13 uniformly.

按壓構件6具有增強構件24。因此能夠更有效果地防止外框23的撓曲或形變。藉此,按壓構件6能夠更均勻地按壓蓋部13。The pressing member 6 has a reinforcing member 24. Therefore, the deflection or deformation of the outer frame 23 can be prevented more effectively. Thereby, the pressing member 6 can press the lid portion 13 more uniformly.

按壓構件6具有座部25。藉此,按壓構件6能夠更適宜地按壓蓋部13。座部25的數量為三個以上。藉此,按壓構件6能夠更均勻地按壓蓋部13。The pressing member 6 has a seat portion 25. Thereby, the pressing member 6 can press the lid portion 13 more suitably. The number of the seats 25 is three or more. Thereby, the pressing member 6 can press the lid portion 13 more uniformly.

按壓構件6能夠自止動件7以及手動調整部8分離。因此,能夠將按壓構件6移動至自蓋體13的上方的空間偏離的位置。藉此,能夠容易地使蓋部13拆裝於框體11。進而,能夠經由開口B而更容易地進行處理容器4的維護。The pressing member 6 can be separated from the stopper 7 and the manual adjustment portion 8. Therefore, the pressing member 6 can be moved to a position deviated from the space above the lid body 13. Thereby, the lid portion 13 can be easily attached and detached to the casing 11. Further, the maintenance of the processing container 4 can be performed more easily via the opening B.

止動件7固定於框體11。藉此,能夠恰當地設置止動件7。The stopper 7 is fixed to the frame 11. Thereby, the stopper 7 can be provided appropriately.

止動件7包括沿大致水平方向延伸的軸構件27。按壓構件6能夠繞軸構件27旋轉。因此,手動調整部8能夠恰當地對按壓構件6的第2端部22的高度位置進行調整。The stopper 7 includes a shaft member 27 that extends in a substantially horizontal direction. The pressing member 6 is rotatable around the shaft member 27. Therefore, the manual adjustment unit 8 can appropriately adjust the height position of the second end portion 22 of the pressing member 6 .

於按壓構件6為大致水平姿勢的狀態下,按壓構件6與蓋部13接觸。因此,於按壓構件6為大致水平姿勢的狀態下,按壓構件6能夠恰當地按壓蓋部13。藉此,按壓構件6能夠更均勻地按壓蓋部13。The pressing member 6 is in contact with the lid portion 13 in a state where the pressing member 6 is in a substantially horizontal posture. Therefore, in a state where the pressing member 6 is in a substantially horizontal posture, the pressing member 6 can appropriately press the lid portion 13. Thereby, the pressing member 6 can press the lid portion 13 more uniformly.

止動件7禁止於按壓構件6為大致水平姿勢的狀態下按壓構件6沿第1方向d1移動。藉此,按壓構件6能夠更恰當地按壓蓋部13。The stopper 7 is prohibited from moving in the first direction d1 in a state where the pressing member 6 is in a substantially horizontal posture. Thereby, the pressing member 6 can press the lid portion 13 more appropriately.

於按壓構件6為大致水平姿勢的狀態下,第1端部21與軸構件27的背面部27R(具體而言,背面下部27RB)接觸。因此,止動件7能夠恰當地禁止於按壓構件6按壓著蓋部13的狀態下按壓構件6沿第1方向d1移動。In a state where the pressing member 6 is in a substantially horizontal posture, the first end portion 21 is in contact with the back surface portion 27R (specifically, the back surface lower portion 27RB) of the shaft member 27. Therefore, the stopper 7 can appropriately prevent the pressing member 6 from moving in the first direction d1 in a state where the pressing member 6 presses the lid portion 13.

止動件7禁止於按壓構件6為大致水平姿勢的狀態下按壓構件6沿第2方向d2移動。藉此,按壓構件6能夠更恰當地按壓蓋部13。The stopper 7 is prohibited from moving in the second direction d2 in a state where the pressing member 6 is in a substantially horizontal posture. Thereby, the pressing member 6 can press the lid portion 13 more appropriately.

於按壓構件6為大致水平姿勢的狀態下,第1端部21與軸構件27的表面部27F(具體而言,表面下部27FB)接觸。因此,止動件7能夠恰當地禁止於按壓構件6按壓著蓋部13的狀態下按壓構件6沿第2方向d2移動。The first end portion 21 is in contact with the surface portion 27F (specifically, the surface lower portion 27FB) of the shaft member 27 in a state where the pressing member 6 is in a substantially horizontal posture. Therefore, the stopper 7 can appropriately prevent the pressing member 6 from moving in the second direction d2 in a state where the pressing member 6 presses the lid portion 13.

止動件7容許於按壓構件6朝向第1方向d1而向上方傾斜的狀態下按壓構件6相對於軸構件27而沿第1方向d1移動。藉此,於按壓構件6未按壓著蓋部13的狀態下,能夠容易地將按壓構件6自止動件7分離。The stopper 7 allows the pressing member 6 to move in the first direction d1 with respect to the shaft member 27 in a state where the pressing member 6 is inclined upward in the first direction d1. Thereby, the pressing member 6 can be easily separated from the stopper 7 in a state where the pressing member 6 is not pressed by the lid portion 13.

於按壓構件6朝向第1方向d1而向上方傾斜的狀態下,第1端部21僅與軸構件27的表面部27F接觸。即,於按壓構件6朝向第1方向d1而向上方傾斜的狀態下,第1端部21不與軸構件27的背面部27R接觸。因此,於按壓構件6未按壓蓋部13的狀態下,止動件7能夠恰當地容許按壓構件6沿第1方向d1移動。In a state where the pressing member 6 is inclined upward in the first direction d1, the first end portion 21 is in contact only with the surface portion 27F of the shaft member 27. In other words, the first end portion 21 does not come into contact with the back surface portion 27R of the shaft member 27 in a state where the pressing member 6 is inclined upward in the first direction d1. Therefore, in a state where the pressing member 6 does not press the lid portion 13, the stopper 7 can appropriately allow the pressing member 6 to move in the first direction d1.

於按壓構件6朝向第1方向d1而向上方傾斜的狀態下按壓構件6沿第1方向d1移動,僅藉由此,按壓構件6自止動件分離。於按壓構件6朝向第1方向d1而向上方傾斜的狀態下按壓構件6沿第2方向d2移動,僅藉由此,按壓構件6與止動件7卡合。如此,用戶不操作止動件7便能夠將按壓構件6拆裝於止動件7。換言之,用戶僅藉由使按壓構件6移動便能夠將按壓構件6拆裝於止動件7。藉此,用戶能夠更容易地將按壓構件6拆裝於止動件7。The pressing member 6 is moved in the first direction d1 in a state where the pressing member 6 is inclined upward in the first direction d1, and only the pressing member 6 is separated from the stopper. The pressing member 6 is moved in the second direction d2 in a state where the pressing member 6 is inclined upward in the first direction d1, and only the pressing member 6 is engaged with the stopper 7 by this. In this way, the user can detachably attach the pressing member 6 to the stopper 7 without operating the stopper 7. In other words, the user can detachably attach the pressing member 6 to the stopper 7 only by moving the pressing member 6. Thereby, the user can more easily attach and detach the pressing member 6 to the stopper 7.

按壓構件6能夠與止動件7進行拆裝的、按壓構件6的傾斜角度例如為15度以上、10度以上或5度以上。如此,按壓構件6能夠與止動件7進行拆裝的、按壓構件6的傾斜角度的最小值比較小。藉此,即便處理容器4的上方的空間狹小,亦能夠容易地將按壓構件6拆裝於止動件7。The inclination angle of the pressing member 6 in which the pressing member 6 can be attached and detached to the stopper 7 is, for example, 15 degrees or more, 10 degrees or more, or 5 degrees or more. As described above, the minimum value of the inclination angle of the pressing member 6 that the pressing member 6 can be attached to and detached from the stopper 7 is relatively small. Thereby, even if the space above the processing container 4 is narrow, the pressing member 6 can be easily attached and detached to the stopper 7.

開口B比較大。因此,經由開口B而能夠更容易地進行處理容器4的維護。The opening B is relatively large. Therefore, maintenance of the processing container 4 can be performed more easily via the opening B.

本發明並不限於所述實施形態,能夠如下所述般進行變形實施。The present invention is not limited to the above embodiment, and can be modified as described below.

(1)所述實施形態中,例示了外框23的形狀,但並不限於此。亦可適當變更外框23的形狀。亦可對應於外框23的形狀而適當變更增強構件24的數量以及形狀。亦可對應於外框23的形狀而適當變更座部25的數量。(1) In the above embodiment, the shape of the outer frame 23 is exemplified, but the invention is not limited thereto. The shape of the outer frame 23 can also be changed as appropriate. The number and shape of the reinforcing members 24 may be appropriately changed in accordance with the shape of the outer frame 23. The number of the seat portions 25 can be appropriately changed in accordance with the shape of the outer frame 23.

圖14是變形實施形態的基板處理裝置1的立體圖。再者,針對與實施形態相同的構成,藉由標注相同的符號而省略詳細的說明。Fig. 14 is a perspective view of the substrate processing apparatus 1 according to the modified embodiment. In addition, the same configurations as those of the embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

按壓構件6具備一個外框101與一個增強構件102。外框23於俯視時具有環形狀。外框101的輪廓具有大致四邊形狀。外框101的輪廓具有大致菱形形狀。具體而言,外框101包括線性延伸的多個(例如四個)直線部101a。各直線部101a相互接合。各直線部101a呈環狀接合。The pressing member 6 is provided with an outer frame 101 and a reinforcing member 102. The outer frame 23 has a ring shape in plan view. The outline of the outer frame 101 has a substantially quadrangular shape. The outline of the outer frame 101 has a substantially diamond shape. Specifically, the outer frame 101 includes a plurality of (for example, four) linear portions 101a extending linearly. Each of the straight portions 101a is joined to each other. Each linear portion 101a is annularly joined.

增強構件102於俯視時配置於外框101的內側。具體而言,增強構件102線性延伸。增強構件102沿與假想線L大致正交的方向延伸。增強構件102的兩端分別與外框101接合。增強構件102具有接合於外框101的第1端及接合於外框23的第2端。The reinforcing member 102 is disposed inside the outer frame 101 in plan view. In particular, the reinforcing member 102 extends linearly. The reinforcing member 102 extends in a direction substantially orthogonal to the imaginary line L. Both ends of the reinforcing member 102 are respectively engaged with the outer frame 101. The reinforcing member 102 has a first end joined to the outer frame 101 and a second end joined to the outer frame 23.

再者,本變形實施形態中,按壓構件6具有三個座部25。Further, in the present modified embodiment, the pressing member 6 has three seat portions 25.

根據本變形實施形態,按壓構件6亦能夠恰當地對框體11按壓蓋部13。According to the present modified embodiment, the pressing member 6 can also appropriately press the lid portion 13 on the casing 11.

(2)所述實施形態中,外框23的輪廓具有大致多邊形狀,但並不限於此。亦可針對外框的輪廓,對與大致多邊形狀不同的形狀進行適當變更。(2) In the above embodiment, the outline of the outer frame 23 has a substantially polygonal shape, but is not limited thereto. It is also possible to appropriately change the shape different from the substantially polygonal shape with respect to the outline of the outer frame.

圖15是變形實施形態的基板處理裝置1的立體圖。再者,針對與實施形態相同的構成,藉由標注相同的符號而省略詳細的說明。Fig. 15 is a perspective view of the substrate processing apparatus 1 according to the modified embodiment. In addition, the same configurations as those of the embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

按壓構件6具有外框105。外框105於俯視時具有圓環形狀。外框105的輪廓於俯視時具有大致圓形狀。外框105的輪廓於俯視時彎曲。The pressing member 6 has an outer frame 105. The outer frame 105 has a circular ring shape in plan view. The outline of the outer frame 105 has a substantially circular shape in plan view. The outline of the outer frame 105 is curved in a plan view.

再者,本變形實施形態中,按壓構件6不具有增強構件。本變形實施形態中,按壓構件6具有三個座部25。Further, in the present modified embodiment, the pressing member 6 does not have a reinforcing member. In the present modified embodiment, the pressing member 6 has three seat portions 25.

根據本變形實施形態,按壓構件6亦能夠恰當地對框體11按壓蓋部13。According to the present modified embodiment, the pressing member 6 can also appropriately press the lid portion 13 on the casing 11.

(3)所述實施形態中,外框23於俯視時具有環形狀,但並不限於此。即,外框23亦可於俯視時不具有環形狀。例如,外框23亦可於俯視時不具有開口。例如,外框23亦可具有板形狀。例如,外框23亦可具有圓盤形狀。(3) In the above embodiment, the outer frame 23 has a ring shape in plan view, but is not limited thereto. That is, the outer frame 23 may not have a ring shape in plan view. For example, the outer frame 23 may also have no opening when viewed from above. For example, the outer frame 23 may also have a plate shape. For example, the outer frame 23 may also have a disk shape.

(4)所述實施形態中,外框23與座部25直接連接,但並不限於此。例如,外框23與座部25亦可間接連接。(4) In the above embodiment, the outer frame 23 and the seat portion 25 are directly connected, but the invention is not limited thereto. For example, the outer frame 23 and the seat portion 25 can also be indirectly connected.

(5)所述實施形態中,外框23與座部25亦可經由彈性構件而連接。(5) In the above embodiment, the outer frame 23 and the seat portion 25 may be connected via an elastic member.

圖16是變形實施形態的基板處理裝置1的剖面圖。再者,針對與實施形態相同的構成,藉由標注相同的符號而省略詳細的說明。Fig. 16 is a cross-sectional view showing a substrate processing apparatus 1 according to a modified embodiment. In addition, the same configurations as those of the embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

按壓構件6具有彈性構件107。彈性構件107例如為彈簧。彈性構件107設於外框23與座部25之間。彈性構件107將外框23與座部25連結。彈性構件107具有支撐於外框23的第1端。彈性構件107具有支撐座部25的第2端。對應於彈性構件107的彈性變形,外框23與座部25的相對位置發生改變。例如,對應於彈性構件107的彈性變形,座部25相對於外框23進行上下移動。The pressing member 6 has an elastic member 107. The elastic member 107 is, for example, a spring. The elastic member 107 is provided between the outer frame 23 and the seat portion 25. The elastic member 107 connects the outer frame 23 and the seat portion 25. The elastic member 107 has a first end supported by the outer frame 23. The elastic member 107 has a second end that supports the seat portion 25. Corresponding to the elastic deformation of the elastic member 107, the relative position of the outer frame 23 and the seat portion 25 is changed. For example, the seat portion 25 moves up and down with respect to the outer frame 23 in response to elastic deformation of the elastic member 107.

藉由座部25相對於外框23而向上方移動,彈性構件107壓縮變形(彈性變形)。壓縮變形的彈性構件107將座部25向下方推壓。The seat portion 25 is moved upward with respect to the outer frame 23, and the elastic member 107 is compressively deformed (elastically deformed). The compression-deformed elastic member 107 pushes the seat portion 25 downward.

根據本變形實施形態,彈性構件107能夠對座部25的高度位置進行微調整。藉此,座部25能夠更切實地與蓋部13接觸。進而,座部25能夠更切實地按壓蓋部13。According to the present modified embodiment, the elastic member 107 can finely adjust the height position of the seat portion 25. Thereby, the seat portion 25 can be more reliably brought into contact with the lid portion 13. Further, the seat portion 25 can press the lid portion 13 more reliably.

(6)所述實施形態中,第2端部22具有切口22b,但並不限於此。例如,第2端部22亦可具有貫穿孔。貫穿孔形成於安裝座22a。於貫穿孔配置螺釘29的軸部29a。(6) In the above embodiment, the second end portion 22 has the slit 22b, but the invention is not limited thereto. For example, the second end portion 22 may have a through hole. A through hole is formed in the mount 22a. The shaft portion 29a of the screw 29 is disposed in the through hole.

(7)所述實施形態中,手動調整部8具備結合部28與螺釘29,但並不限於此。亦可適當變更手動調整部8的構成。亦可對應於手動調整部8的變更而亦適當變更第2端部22的構成。(7) In the above embodiment, the manual adjustment unit 8 includes the joint portion 28 and the screw 29, but the invention is not limited thereto. The configuration of the manual adjustment unit 8 can also be changed as appropriate. The configuration of the second end portion 22 may be appropriately changed in accordance with the change of the manual adjustment unit 8.

圖17是變形實施形態的基板處理裝置1的剖面圖。再者,針對與實施形態相同的構成,藉由標注相同的符號而省略詳細的說明。Fig. 17 is a cross-sectional view showing a substrate processing apparatus 1 according to a modified embodiment. In addition, the same configurations as those of the embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

第2端部22具有第1傾斜面22c。第1傾斜面22c形成於第2端部22的上表面。第1傾斜面22c朝向第1方向d1而向下方傾斜。The second end portion 22 has a first inclined surface 22c. The first inclined surface 22 c is formed on the upper surface of the second end portion 22 . The first inclined surface 22c is inclined downward toward the first direction d1.

手動調整部8具有結合部113、螺釘114及可動台115。The manual adjustment unit 8 has a joint portion 113, a screw 114, and a movable table 115.

結合部113固定於框體11。結合部113自框體11的上表面向上方突出。結合部113具有螺釘孔。螺釘孔以貫穿結合部113的方式形成。螺釘孔沿大致水平方向延伸。具體而言,螺釘孔沿第1方向d1/第2方向d2延伸。螺釘孔向結合部113的兩側開放。The joint portion 113 is fixed to the frame body 11. The joint portion 113 protrudes upward from the upper surface of the casing 11. The joint portion 113 has a screw hole. The screw holes are formed to penetrate the joint portion 113. The screw holes extend in a substantially horizontal direction. Specifically, the screw hole extends in the first direction d1/the second direction d2. The screw holes are open to both sides of the joint portion 113.

螺釘114與結合部113(螺釘孔)結合。螺釘114的軸部114a貫穿結合部113。即,軸部114a具有位於結合部113的一側(第1方向d1)的第1端與位於結合部113的另一側(第2方向d2)的第2端。螺釘114的頭部114b連接於軸部114a的第1端。The screw 114 is coupled to the joint portion 113 (screw hole). The shaft portion 114a of the screw 114 penetrates the joint portion 113. In other words, the shaft portion 114a has a first end located on one side (first direction d1) of the joint portion 113 and a second end located on the other side (second direction d2) of the joint portion 113. The head portion 114b of the screw 114 is coupled to the first end of the shaft portion 114a.

可動台115結合於軸部114a的第2端。可動台115較螺釘114的頭部114b更靠近第1端部2。若螺釘114轉動,則可動台115沿第1方向d1以及第2方向d2移動。The movable table 115 is coupled to the second end of the shaft portion 114a. The movable table 115 is closer to the first end portion 2 than the head portion 114b of the screw 114. When the screw 114 rotates, the movable table 115 moves in the first direction d1 and the second direction d2.

可動台115具有第2傾斜面115a。第2傾斜面115a形成於可動台115的下表面。第2傾斜面115a朝向第1方向d1而向下方傾斜。The movable table 115 has a second inclined surface 115a. The second inclined surface 115a is formed on the lower surface of the movable table 115. The second inclined surface 115a is inclined downward toward the first direction d1.

可動台115(第2傾斜面115a)能夠與第2端部22(第1傾斜面22c)接觸。進而,可動台115(第2傾斜面115a)能夠相對於第2端部22(第1傾斜面22c)滑動。The movable table 115 (second inclined surface 115a) can be in contact with the second end portion 22 (first inclined surface 22c). Further, the movable table 115 (second inclined surface 115a) is slidable relative to the second end portion 22 (first inclined surface 22c).

當可動台115沿第2方向d2移動時,可動台115接觸第2端部22。進而,當可動台115沿第2方向d2移動時,可動台115相對於第2端部22滑動並且第2端部22向下方移動。即,第2端部22的高度位置變低。When the movable table 115 moves in the second direction d2, the movable table 115 contacts the second end portion 22. Further, when the movable table 115 moves in the second direction d2, the movable table 115 slides with respect to the second end portion 22 and the second end portion 22 moves downward. That is, the height position of the second end portion 22 is lowered.

當可動台115沿第1方向d1移動時,可動台115容許第2端部22向上方移動。例如,當可動台115沿第1方向d1移動時,第2端部22向上方移動並且第2端部22相對於可動台115滑動。即,第2端部22的高度位置變高。進而,當可動台115沿第2方向d2移動時,可動台115離開第2端部22。When the movable table 115 moves in the first direction d1, the movable table 115 allows the second end portion 22 to move upward. For example, when the movable table 115 moves in the first direction d1, the second end portion 22 moves upward and the second end portion 22 slides relative to the movable table 115. That is, the height position of the second end portion 22 becomes high. Further, when the movable table 115 moves in the second direction d2, the movable table 115 is separated from the second end portion 22.

再者,圖15表示結合部113與螺釘114。軸部114a自結合部113向後方(具體而言後方且左方)延伸。軸部114a的後端與頭部114b連接。頭部114b較結合部113而配置於更後方。從而,用戶能夠自處理單元2的後方的位置更容易地轉動頭部114b(螺釘114)。即,用戶能夠容易地對手動調整部8進行操作。Further, Fig. 15 shows the joint portion 113 and the screw 114. The shaft portion 114a extends rearward (specifically, rearward and leftward) from the joint portion 113. The rear end of the shaft portion 114a is connected to the head portion 114b. The head portion 114b is disposed further rearward than the joint portion 113. Thereby, the user can more easily rotate the head 114b (screw 114) from the position behind the processing unit 2. That is, the user can easily operate the manual adjustment unit 8.

根據本變形實施形態,手動調整部8亦能夠恰當地對第2端部22的高度位置進行調整。According to the present modified embodiment, the manual adjustment unit 8 can appropriately adjust the height position of the second end portion 22.

(8)所述實施形態中,例示了用戶不使用工具便能夠操作的手動調整部8,但並不限於此。亦可變更為用戶使用工具而進行操作的手動調整部。(8) In the above embodiment, the manual adjustment unit 8 that the user can operate without using a tool is exemplified, but the present invention is not limited thereto. It can also be changed to a manual adjustment unit that the user operates using the tool.

(9)所述實施形態中,作為螺釘29例示了旋輪螺栓,但並不限於此。例如,螺釘29亦可為指撚螺釘。例如,螺釘29亦可為蝶型螺栓。例如,螺釘29亦可為用戶使用工具而進行轉動者。(9) In the above embodiment, the screw bolt 29 is exemplified as the screw 29, but the invention is not limited thereto. For example, the screw 29 can also be a finger screw. For example, the screw 29 can also be a butterfly bolt. For example, the screw 29 can also be rotated by a user using a tool.

(10)所述實施形態中,對第1端部21以及止動件7的配置進行了詳細說明,但並不限於此。亦可適當變更第1端部21以及止動件7的配置。例如,第1端部21以及止動件7亦可於俯視時與蓋部13重疊。(10) In the above embodiment, the arrangement of the first end portion 21 and the stopper 7 has been described in detail, but the invention is not limited thereto. The arrangement of the first end portion 21 and the stopper 7 can be appropriately changed. For example, the first end portion 21 and the stopper 7 may overlap the lid portion 13 in plan view.

(11)所述實施形態中,對第2端部22以及手動調整部8的配置進行了詳細說明,但並不限於此。亦可適當變更第2端部22以及手動調整部8的配置。例如,第2端部22以及手動調整部8亦可於俯視時與蓋部13重疊。(11) In the above embodiment, the arrangement of the second end portion 22 and the manual adjustment portion 8 has been described in detail, but the invention is not limited thereto. The arrangement of the second end portion 22 and the manual adjustment portion 8 can be appropriately changed. For example, the second end portion 22 and the manual adjustment portion 8 may overlap the lid portion 13 in plan view.

(12)所述實施形態中,止動件7固定於框體11,但並不限於此。只要能夠將止動件7固定地設置,則亦可將止動件7固定於框體11以外的構件。(12) In the above embodiment, the stopper 7 is fixed to the casing 11, but the invention is not limited thereto. The stopper 7 can be fixed to a member other than the casing 11 as long as the stopper 7 can be fixedly provided.

(13)所述實施形態中,手動調整部8安裝於框體,但並不限於此。亦可將手動調整部8安裝於框體11以外的構件。(13) In the above embodiment, the manual adjustment unit 8 is attached to the casing, but the invention is not limited thereto. The manual adjustment unit 8 may be attached to a member other than the housing 11 .

(14)所述實施形態中,基板處理裝置1進行的熱處理包括對基板W進行加熱的處理及對基板W進行冷卻的處理,但並不限於此。例如,基板處理裝置1進行的熱處理亦可只包括對基板W進行加熱的處理及對基板W進行冷卻的處理中的任一者。(14) In the above embodiment, the heat treatment performed by the substrate processing apparatus 1 includes a process of heating the substrate W and a process of cooling the substrate W, but the invention is not limited thereto. For example, the heat treatment by the substrate processing apparatus 1 may include only one of the process of heating the substrate W and the process of cooling the substrate W.

(15)所述實施形態中,基板處理裝置1進行的處理是熱處理,但並不限於此。例如,基板處理裝置1亦可進行熱處理以外的處理。所述實施形態中,於基板處理裝置1進行的處理中未使用處理液,但並不限於此。例如,亦可於基板處理裝置1進行的處理中使用處理液(例如,溶劑或疏水化處理劑等)。(15) In the above embodiment, the processing performed by the substrate processing apparatus 1 is heat treatment, but is not limited thereto. For example, the substrate processing apparatus 1 may perform processing other than heat treatment. In the above embodiment, the processing liquid is not used in the processing performed by the substrate processing apparatus 1, but the processing liquid is not limited thereto. For example, a treatment liquid (for example, a solvent or a hydrophobizing agent or the like) may be used in the treatment performed by the substrate processing apparatus 1.

(16)所述實施形態中,基板處理裝置1對塗佈有自組織材料的基板W進行熱處理,但並不限於此。基板處理裝置1亦可對形成有抗蝕膜或防反射膜的基板W進行處理。例如,基板處理裝置1亦可對形成有下層膜的基板W進行處理。下層膜例如為旋塗碳(Spin−on−Carbon,SOC)膜或旋塗玻璃(Spin On Glass,SOG)膜。(16) In the above embodiment, the substrate processing apparatus 1 heat-treats the substrate W coated with the self-organizing material, but the invention is not limited thereto. The substrate processing apparatus 1 can also process the substrate W on which the resist film or the anti-reflection film is formed. For example, the substrate processing apparatus 1 can also process the substrate W on which the underlayer film is formed. The underlayer film is, for example, a spin-on-carbon (SOC) film or a spin on glass (SOG) film.

(17)針對所述各實施形態以及所述(1)至所述(16)所說明的各變形實施形態,亦可例如進而將各構成置換為或組合於其他變形實施形態的構成來進行適當變更。(17) For each of the above-described embodiments and the respective modified embodiments described in the above (1) to (16), for example, the configuration may be replaced by or combined with the configuration of another modified embodiment. change.

1‧‧‧熱處理裝置1‧‧‧ Heat treatment unit

2、2a、2b、2c‧‧‧處理單元2, 2a, 2b, 2c‧ ‧ processing unit

3‧‧‧搬送機構3‧‧‧Transportation agency

4‧‧‧處理容器4‧‧‧Processing container

6‧‧‧按壓構件6‧‧‧ Pressing members

7‧‧‧止動件7‧‧‧stops

8‧‧‧手動調整部8‧‧‧Manual adjustment department

9、9a、9b、9c‧‧‧外壁板9, 9a, 9b, 9c‧‧‧ outer wall panels

10、10a、10b、10c‧‧‧隔壁10, 10a, 10b, 10c‧‧‧ next door

11‧‧‧框體11‧‧‧ frame

11a‧‧‧第1角部11a‧‧‧1st corner

11b‧‧‧底面11b‧‧‧ bottom

11c‧‧‧第2角部11c‧‧‧2nd corner

12‧‧‧遮擋板12‧‧‧ visor

13‧‧‧蓋部13‧‧‧ 盖部

13a、31a‧‧‧上表面13a, 31a‧‧‧ upper surface

14‧‧‧收容部14‧‧‧ Housing Department

15‧‧‧底板15‧‧‧floor

15a、B‧‧‧開口15a, B‧‧‧ openings

19、45‧‧‧密封構件19, 45‧‧‧ Sealing components

21‧‧‧第1端部21‧‧‧1st end

21a‧‧‧接觸面21a‧‧‧Contact surface

22‧‧‧第2端部22‧‧‧2nd end

22a‧‧‧安裝座22a‧‧‧ Mounting

22b‧‧‧切口22b‧‧‧ incision

22c‧‧‧第1傾斜面22c‧‧‧1st inclined surface

23、101、105‧‧‧外框23, 101, 105‧‧‧ frame

23a、101a‧‧‧直線部23a, 101a‧‧‧ Straight line

23b‧‧‧第1側部23b‧‧‧1st side

23c‧‧‧第2側部23c‧‧‧2nd side

23d‧‧‧下表面23d‧‧‧lower surface

24、102‧‧‧增強構件24, 102‧‧‧ reinforcement components

25‧‧‧座部25‧‧‧

26‧‧‧撐桿26‧‧‧ poles

27‧‧‧軸構件27‧‧‧Axis components

27B‧‧‧下部27B‧‧‧ lower

27F‧‧‧表面部27F‧‧‧Surface

27R‧‧‧背面部27R‧‧‧Back part

27T‧‧‧上部27T‧‧‧ upper

27FB‧‧‧表面下部27FB‧‧‧lower surface

27RB‧‧‧背面下部27RB‧‧‧The lower part of the back

28、113‧‧‧結合部28, 113‧‧‧ Joint Department

29、114‧‧‧螺釘29, 114‧‧‧ screws

29a、114a‧‧‧軸部29a, 114a‧‧‧Axis

29b、114b‧‧‧頭部29b, 114b‧‧‧ head

31‧‧‧加熱部31‧‧‧ heating department

32‧‧‧支撐銷孔32‧‧‧Support pin hole

34‧‧‧氣體流通孔34‧‧‧ gas circulation holes

35‧‧‧遮擋板驅動機構35‧‧‧Baffle drive mechanism

37‧‧‧基板移動機構37‧‧‧Substrate moving mechanism

38‧‧‧支撐銷38‧‧‧Support pins

39‧‧‧支撐銷驅動機構39‧‧‧Support pin drive mechanism

41‧‧‧密封機構41‧‧‧ Sealing mechanism

42‧‧‧集合部42‧‧‧ Collection Department

43‧‧‧軸封部43‧‧‧ shaft seal

44‧‧‧筒部44‧‧‧ Tube

46‧‧‧密封殼體46‧‧‧ Sealed housing

51‧‧‧上部供給部51‧‧‧Upper Supply Department

52、62、82‧‧‧配管52, 62, 82‧‧‧ piping

53‧‧‧供給埠53‧‧‧Supply

54、64、74、84‧‧‧開閉閥54, 64, 74, 84‧‧‧ Open and close valves

55、65‧‧‧流量調整部55, 65‧‧‧ Flow Adjustment Department

56‧‧‧整流板56‧‧‧Rectifier board

56a‧‧‧小孔56a‧‧‧Small hole

61‧‧‧下部供給部61‧‧‧ Lower Supply Department

63‧‧‧埠63‧‧‧埠

69‧‧‧非氧化性氣體供給源69‧‧‧ Non-oxidizing gas supply source

71‧‧‧側部排出部71‧‧‧Side discharge

72‧‧‧排氣導管72‧‧‧Exhaust duct

73‧‧‧排氣管73‧‧‧Exhaust pipe

75、85‧‧‧排氣機構75, 85‧‧‧ exhaust mechanism

81‧‧‧下部排出部81‧‧‧ Lower discharge section

83‧‧‧排氣埠83‧‧‧Exhaust gas

91‧‧‧感測器(壓力感測器)91‧‧‧Sensor (pressure sensor)

93‧‧‧感測器(氧濃度感測器)93‧‧‧Sensor (oxygen concentration sensor)

95‧‧‧控制部95‧‧‧Control Department

107‧‧‧彈性構件107‧‧‧Flexible components

115‧‧‧可動台115‧‧‧ movable table

115a‧‧‧第2傾斜面115a‧‧‧2nd inclined surface

A‧‧‧搬送口A‧‧‧Transportation port

C‧‧‧軸心C‧‧‧Axis

D‧‧‧側部排出口D‧‧‧Side discharge

d1‧‧‧第1方向D1‧‧‧1st direction

d2‧‧‧第2方向D2‧‧‧2nd direction

E、F1、F2‧‧‧空間E, F1, F2‧‧‧ space

H‧‧‧水平面H‧‧‧ water level

L‧‧‧假想線L‧‧‧ imaginary line

PH‧‧‧加熱位置PH‧‧‧heating position

PC‧‧‧冷卻位置PC‧‧‧ Cooling position

Sp1‧‧‧導入室Sp1‧‧‧Importing room

Sp2‧‧‧處理室Sp2‧‧‧Processing Room

S1~S7‧‧‧工序S1~S7‧‧‧ Process

V‧‧‧鉛垂面V‧‧‧ vertical plane

W‧‧‧基板W‧‧‧Substrate

X‧‧‧前後方向X‧‧‧ direction

Y‧‧‧寬度方向Y‧‧‧Width direction

Z‧‧‧上下方向Z‧‧‧Up and down direction

圖1是表示基板處理裝置的一部分的概略構成的平面圖。 圖2是表示基板處理裝置的一部分的概略構成的側面圖。 圖3是表示基板處理裝置的一部分的概略構成的圖。 圖4是處理容器的一部分的分解立體圖。 圖5是處理單元的立體圖。 圖6是處理單元的平面圖。 圖7(A)是按壓構件的平面圖,圖7(B)是按壓構件的側面圖。 圖8是沿圖6中的VIII-VIII線的剖面圖。 圖9是表示傾斜姿勢的按壓構件的剖面圖。 圖10是第1端部與軸構件的剖面詳細圖。 圖11是第1端部與軸構件的剖面詳細圖。 圖12(A)-圖12(D)是表示將蓋部自框體拆卸下的順序的示意圖。 圖13是表示基板處理裝置的動作例的順序的流程圖。 圖14是變形實施形態的基板處理裝置的立體圖。 圖15是變形實施形態的基板處理裝置的立體圖。 圖16是變形實施形態的基板處理裝置的剖面圖。 圖17是變形實施形態的基板處理裝置的剖面圖。FIG. 1 is a plan view showing a schematic configuration of a part of a substrate processing apparatus. 2 is a side view showing a schematic configuration of a part of a substrate processing apparatus. 3 is a view showing a schematic configuration of a part of a substrate processing apparatus. 4 is an exploded perspective view of a portion of the processing container. Figure 5 is a perspective view of the processing unit. Figure 6 is a plan view of the processing unit. Fig. 7(A) is a plan view of the pressing member, and Fig. 7(B) is a side view of the pressing member. Figure 8 is a cross-sectional view taken along line VIII-VIII of Figure 6. Fig. 9 is a cross-sectional view showing a pressing member in an inclined posture. Fig. 10 is a cross-sectional detailed view of the first end portion and the shaft member. Fig. 11 is a cross-sectional detailed view of the first end portion and the shaft member. 12(A) to 12(D) are schematic views showing the procedure of detaching the lid portion from the frame body. FIG. 13 is a flowchart showing the procedure of an operation example of the substrate processing apparatus. Fig. 14 is a perspective view of a substrate processing apparatus according to a modified embodiment. Fig. 15 is a perspective view of a substrate processing apparatus according to a modified embodiment. Figure 16 is a cross-sectional view showing a substrate processing apparatus according to a modified embodiment. Figure 17 is a cross-sectional view showing a substrate processing apparatus according to a modified embodiment.

Claims (18)

一種基板處理裝置,具備: 框體,所述框體於其上表面具有開口; 蓋部,藉由拆裝於所述框體而對所述開口進行開閉; 按壓構件,具有第1端部及第2端部,並對所述框體按壓所述蓋部; 止動件,與所述按壓構件的所述第1端部接觸,並禁止所述第1端部向上方移動;以及 手動調整部,藉由用戶的操作而對所述按壓構件的所述第2端部的高度位置進行調整。A substrate processing apparatus comprising: a frame having an opening on an upper surface thereof; a lid portion opening and closing the opening by being attached to the frame; and the pressing member having a first end portion and a second end portion that presses the lid portion on the frame body; a stopper that comes into contact with the first end portion of the pressing member, prohibits the first end portion from moving upward; and manual adjustment The height position of the second end portion of the pressing member is adjusted by a user's operation. 如申請專利範圍第1項所述的基板處理裝置,其中, 所述按壓構件的所述第1端部於俯視時位於所述蓋部的一側, 所述按壓構件的所述第2端部於俯視時位於與所述蓋部的一側相反的另一側。The substrate processing apparatus according to the first aspect of the invention, wherein the first end portion of the pressing member is located on a side of the lid portion in a plan view, and the second end portion of the pressing member It is located on the other side opposite to the side of the cover portion in plan view. 如申請專利範圍第1項或第2項所述的基板處理裝置,其中, 所述框體於俯視時具有大致矩形形狀, 所述蓋部於俯視時配置於所述框體的大致中央, 所述按壓構件的所述第1端部以及所述止動件於俯視時配置於所述框體的第1角部, 所述按壓構件的所述第2端部以及所述手動調整部於俯視時配置於與所述第1角部對向的所述框體的第2角部。The substrate processing apparatus according to the first or second aspect of the invention, wherein the frame body has a substantially rectangular shape in a plan view, and the cover portion is disposed substantially at a center of the frame body in a plan view. The first end portion of the pressing member and the stopper are disposed in a first corner portion of the frame in a plan view, and the second end portion of the pressing member and the manual adjustment portion are viewed from above The second corner portion of the casing that faces the first corner portion is disposed. 如申請專利範圍第1項至第3項中任一項所述的基板處理裝置,其中, 所述基板處理裝置具備配置於所述框體的側方且能夠拆卸的外壁板, 所述手動調整部配置於較所述止動件更靠近所述外壁板的位置。The substrate processing apparatus according to any one of the preceding claims, wherein the substrate processing apparatus includes an outer wall panel that is disposed on a side of the housing and is detachable, and the manual adjustment The portion is disposed at a position closer to the outer wall than the stopper. 如申請專利範圍第1項至第4項中任一項所述的基板處理裝置,其中, 所述手動調整部安裝於所述框體,並使所述按壓構件的所述第2端部相對於所述框體而上下移動。The substrate processing apparatus according to any one of the preceding claims, wherein the manual adjustment unit is attached to the housing, and the second end of the pressing member is opposed to Move up and down in the frame. 如申請專利範圍第1項至第5項中任一項所述的基板處理裝置,其中, 所述手動調整部包括螺釘, 對應於所述螺釘的轉動,所述按壓構件的所述第2端部進行上下移動。The substrate processing apparatus according to any one of claims 1 to 5, wherein the manual adjustment portion includes a screw, the second end of the pressing member corresponding to rotation of the screw The department moves up and down. 如申請專利範圍第6項所述的基板處理裝置,其中, 所述螺釘是旋輪螺栓。The substrate processing apparatus according to claim 6, wherein the screw is a screw bolt. 如申請專利範圍第1項至第7項中任一項所述的基板處理裝置,其中, 所述按壓構件於俯視時具有環形狀,且於俯視時具有與所述蓋部重疊的外框。The substrate processing apparatus according to any one of the first aspect of the present invention, wherein the pressing member has a ring shape in a plan view and has an outer frame that overlaps the lid portion in a plan view. 如申請專利範圍第8項所述的基板處理裝置,其中, 所述外框的輪廓具有大致多邊形狀。The substrate processing apparatus according to claim 8, wherein the outline of the outer frame has a substantially polygonal shape. 如申請專利範圍第8項或第9項所述的基板處理裝置,其中, 所述按壓構件具有增強構件,所述增強構件於俯視時配置於所述外框的內側且所述增強構件的兩端與所述外框接合。The substrate processing apparatus according to claim 8 or 9, wherein the pressing member has a reinforcing member disposed inside the outer frame and two of the reinforcing members in a plan view The end is engaged with the outer frame. 如申請專利範圍第8項至第10項中任一項所述的基板處理裝置,其中, 所述按壓構件具有三個以上的座部,所述座部直接或間接連接於所述外框且與所述蓋部直接接觸。The substrate processing apparatus according to any one of claims 8 to 10, wherein the pressing member has three or more seat portions, and the seat portion is directly or indirectly connected to the outer frame and Direct contact with the cover. 如申請專利範圍第11項所述的基板處理裝置,其中, 所述按壓構件具有彈性構件,所述彈性構件設於所述外框與所述座部之間。The substrate processing apparatus according to claim 11, wherein the pressing member has an elastic member provided between the outer frame and the seat. 如申請專利範圍第1項至第12項中任一項所述的基板處理裝置,其中, 所述按壓構件能夠自所述止動件以及所述手動調整部分離。The substrate processing apparatus according to any one of the preceding claims, wherein the pressing member is separable from the stopper and the manual adjustment unit. 如申請專利範圍第1項至第13項中任一項所述的基板處理裝置,其中, 所述止動件固定於所述框體。The substrate processing apparatus according to any one of claims 1 to 13, wherein the stopper is fixed to the frame. 如申請專利範圍第1項至第14項中任一項所述的基板處理裝置,其中, 所述止動件包括沿大致水平方向延伸的軸構件, 所述按壓構件能夠繞所述軸構件旋轉。The substrate processing apparatus according to any one of claims 1 to 14, wherein the stopper includes a shaft member extending in a substantially horizontal direction, and the pressing member is rotatable around the shaft member . 如申請專利範圍第15項所述的基板處理裝置,其中, 於所述按壓構件為大致水平姿勢的狀態下,所述按壓構件與所述蓋部接觸。The substrate processing apparatus according to claim 15, wherein the pressing member is in contact with the lid portion in a state where the pressing member is in a substantially horizontal posture. 如申請專利範圍第15項或第16項所述的基板處理裝置,其中, 將自所述軸構件的軸心的方向觀察而自所述軸構件朝向所述第2端部的水平朝向作為第1方向, 所述止動件禁止於所述按壓構件為大致水平姿勢的狀態下按壓構件相對於所述軸構件沿所述第1方向移動, 所述止動件容許於所述按壓構件朝向所述第1方向而向上方傾斜的狀態下所述按壓構件相對於所述軸構件沿所述第1方向移動。The substrate processing apparatus according to claim 15, wherein the horizontal direction from the shaft member toward the second end portion is observed from a direction of an axis of the shaft member. In one direction, the stopper is prohibited from moving in the first direction with respect to the shaft member in a state where the pressing member is in a substantially horizontal posture, and the stopper is allowed to face the pressing member The pressing member moves in the first direction with respect to the shaft member in a state where the first direction is inclined upward. 如申請專利範圍第17項所述的基板處理裝置,其中, 將較通過所述軸構件的所述軸心的假想的水平面而位於更上方的所述軸構件的部分作為所述軸構件的上部, 將所述上部以外的所述軸構件的部分作為所述軸構件的下部, 將較通過所述軸構件的所述軸心的假想的鉛垂面而更靠所述第2端部側的所述軸構件的部分作為所述軸構件的表面部, 將所述表面部以外的所述軸構件的部分作為所述軸構件的背面部, 於所述按壓構件為大致水平姿勢的狀態下,所述第1端部與所述軸構件的所述背面部和所述下部的共通部分接觸,且與所述軸構件的所述表面部和所述下部的共通部分接觸, 於所述按壓構件向所述第1方向且向上方傾斜的狀態下,所述第1端部僅與所述軸構件的所述表面部接觸。The substrate processing apparatus according to claim 17, wherein a portion of the shaft member located higher than an imaginary horizontal plane passing through the axial center of the shaft member is referred to as an upper portion of the shaft member a portion of the shaft member other than the upper portion as a lower portion of the shaft member, which is closer to the second end portion than a virtual vertical plane passing through the axial center of the shaft member a portion of the shaft member is a surface portion of the shaft member, and a portion of the shaft member other than the surface portion is a back portion of the shaft member, and the pressing member is in a substantially horizontal posture. The first end portion is in contact with the common portion of the back surface portion and the lower portion of the shaft member, and is in contact with the common portion of the surface portion and the lower portion of the shaft member, and the pressing member The first end portion is in contact with only the surface portion of the shaft member in a state of being inclined upward in the first direction.
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