TW201835120A - 含氟聚合物、其硬化物之製造方法及發光裝置 - Google Patents

含氟聚合物、其硬化物之製造方法及發光裝置 Download PDF

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Publication number
TW201835120A
TW201835120A TW107106345A TW107106345A TW201835120A TW 201835120 A TW201835120 A TW 201835120A TW 107106345 A TW107106345 A TW 107106345A TW 107106345 A TW107106345 A TW 107106345A TW 201835120 A TW201835120 A TW 201835120A
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TW
Taiwan
Prior art keywords
fluoropolymer
unit
carbon atoms
group
formula
Prior art date
Application number
TW107106345A
Other languages
English (en)
Chinese (zh)
Inventor
杉山德英
Original Assignee
日商旭硝子股份有限公司
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Publication date
Application filed by 日商旭硝子股份有限公司 filed Critical 日商旭硝子股份有限公司
Publication of TW201835120A publication Critical patent/TW201835120A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/48—Isomerisation; Cyclisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW107106345A 2017-03-01 2018-02-26 含氟聚合物、其硬化物之製造方法及發光裝置 TW201835120A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-038283 2017-03-01
JP2017038283 2017-03-01

Publications (1)

Publication Number Publication Date
TW201835120A true TW201835120A (zh) 2018-10-01

Family

ID=63370867

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107106345A TW201835120A (zh) 2017-03-01 2018-02-26 含氟聚合物、其硬化物之製造方法及發光裝置

Country Status (3)

Country Link
JP (1) JP6927283B2 (fr)
TW (1) TW201835120A (fr)
WO (1) WO2018159307A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112017004337T5 (de) 2016-08-29 2019-05-16 AGC Inc. Fluoriertes polymer, verfahren zu dessen herstellung und gegenstand, der ein ausgehärtetes produkt des fluorierten polymers aufweist
DE112018001087T5 (de) 2017-03-02 2019-11-21 AGC Inc. Elektrischer Draht, Spule und Verfahren zur Herstellung eines elektrischen Drahts
WO2018163746A1 (fr) 2017-03-06 2018-09-13 Ａｇｃ株式会社 Composition durcissable, matériau de revêtement, fil électrique, et article résineux
KR20200059236A (ko) 2017-10-12 2020-05-28 에이지씨 가부시키가이샤 함불소 탄성 공중합체 조성물, 도료, 및 도장 물품
KR20210139228A (ko) * 2019-03-08 2021-11-22 에이지씨 가부시키가이샤 가교 고무

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11302394A (ja) * 1998-04-16 1999-11-02 Asahi Glass Co Ltd 架橋含フッ素重合体の成形体及びその製造方法
JP4724918B2 (ja) * 2000-12-14 2011-07-13 旭硝子株式会社 含フッ素共重合体の水性分散体
JP5327057B2 (ja) * 2008-01-28 2013-10-30 旭硝子株式会社 硬化性組成物、含フッ素硬化物
US8288482B2 (en) * 2009-06-17 2012-10-16 E I Du Pont De Nemours And Company Curable fluoroelastomer compositions
EP3088447B1 (fr) * 2013-12-26 2020-12-16 AGC Inc. Procédé de fabrication d'un produit réticulé contenant du fluor et son utilisation
JP6642580B2 (ja) * 2015-09-01 2020-02-05 Ａｇｃ株式会社 含フッ素重合体、その製造方法、および含フッ素重合体の硬化物
DE112017004337T5 (de) * 2016-08-29 2019-05-16 AGC Inc. Fluoriertes polymer, verfahren zu dessen herstellung und gegenstand, der ein ausgehärtetes produkt des fluorierten polymers aufweist

Also Published As

Publication number Publication date
JP6927283B2 (ja) 2021-08-25
JPWO2018159307A1 (ja) 2020-01-16
WO2018159307A1 (fr) 2018-09-07

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