TW201834848A - Method for producing laminate, and photocurable resin composition - Google Patents
Method for producing laminate, and photocurable resin composition Download PDFInfo
- Publication number
- TW201834848A TW201834848A TW107105499A TW107105499A TW201834848A TW 201834848 A TW201834848 A TW 201834848A TW 107105499 A TW107105499 A TW 107105499A TW 107105499 A TW107105499 A TW 107105499A TW 201834848 A TW201834848 A TW 201834848A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- heating
- acrylate
- producing
- laminate according
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 227
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 238000010438 heat treatment Methods 0.000 claims abstract description 73
- 238000000576 coating method Methods 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000000178 monomer Substances 0.000 claims abstract description 32
- 239000011248 coating agent Substances 0.000 claims abstract description 31
- 239000004014 plasticizer Substances 0.000 claims description 19
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 17
- 239000004925 Acrylic resin Substances 0.000 claims description 15
- 239000003999 initiator Substances 0.000 claims description 13
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 12
- -1 isostearyl Chemical group 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 8
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 239000010419 fine particle Substances 0.000 claims description 7
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 claims description 3
- 235000010292 orthophenyl phenol Nutrition 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 29
- 230000001678 irradiating effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 22
- 230000004888 barrier function Effects 0.000 description 21
- 239000000945 filler Substances 0.000 description 17
- 239000011521 glass Substances 0.000 description 15
- 239000005871 repellent Substances 0.000 description 7
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 6
- 238000005429 filling process Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 229920001195 polyisoprene Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- RZGZTQYTDRQOEY-UHFFFAOYSA-N 2-phenylethenone Chemical compound O=C=CC1=CC=CC=C1 RZGZTQYTDRQOEY-UHFFFAOYSA-N 0.000 description 2
- VZDDUFFXSBGRMP-UHFFFAOYSA-N 9h-fluoren-1-ylphosphane Chemical compound C12=CC=CC=C2CC2=C1C=CC=C2P VZDDUFFXSBGRMP-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N p-cumyl phenol Natural products CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- STFXXRRQKFUYEU-UHFFFAOYSA-N 16-methylheptadecyl prop-2-enoate Chemical compound CC(C)CCCCCCCCCCCCCCCOC(=O)C=C STFXXRRQKFUYEU-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- PHQSYHHLVVDIFC-UHFFFAOYSA-N CC1=C(C=P(C2=CC=CC=C2)C2=CC=CC=C2)C(=CC(=C1)C)C Chemical compound CC1=C(C=P(C2=CC=CC=C2)C2=CC=CC=C2)C(=CC(=C1)C)C PHQSYHHLVVDIFC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133331—Cover glasses
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Nonlinear Science (AREA)
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Abstract
Description
本技術係關於一種積層體之製造方法及光硬化性樹脂組合物。本申請案係以在日本於2017年2月28日提出申請之日本專利申請案編號特願2017-037614為基礎並主張優先權者,且將該申請案藉由參照而引用至本申請案中。This technology relates to a method for producing a laminate and a photocurable resin composition. The present application is based on Japanese Patent Application No. 2017-037614, the entire disclosure of which is hereby incorporated by .
先前,已知有將構件彼此藉由光硬化性樹脂組合物貼合,藉由透光性樹脂層固定之技術。例如,於例如專利文獻1中,記載有於圖像顯示構件與透光性構件之間配置光硬化性樹脂組合物而形成樹脂組合物層,對樹脂組合物層照射光而形成硬化樹脂層之方法。此處,較理想為圖像顯示裝置中之透光性構件與圖像顯示構件之密接性良好。 又,就抑制光硬化性樹脂組合物自被塗佈體(透光性構件或圖像顯示構件)溢出之觀點而言,存在採用所謂障壁填充製程之情況。於障壁填充製程中,例如使用第1樹脂組合物(障壁材料),於圖像顯示構件之表面形成第2樹脂組合物(填充材料)之塗佈區域。其次,於所形成之塗佈區域塗佈第2樹脂組合物,使圖像顯示構件與透光性構件經由第2樹脂組合物貼合。然後,對第2樹脂組合物照射光而形成硬化樹脂層。 於障壁填充製程中,就防滴液之觀點而言,障壁材料較佳為高黏度。另一方面,就防止氣泡而以較短之產距時間貼合之觀點而言,填充材料較佳為低黏度。此處,為了使障壁材料與填充材料之邊界部之視認性良好,即為了使障壁材料與填充材料之邊界線不明顯,存在使用同一成分之樹脂組合物作為障壁材料與填充材料之情況。然而,若使用同一成分之樹脂組合物作為障壁材料與填充材料,則有會犧牲障壁材料之高黏度性、或填充材料之低黏度性之顧慮。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2014-222350號公報Heretofore, a technique in which members are bonded to each other by a photocurable resin composition and fixed by a translucent resin layer is known. For example, Patent Document 1 discloses that a photocurable resin composition is disposed between an image display member and a translucent member to form a resin composition layer, and the resin composition layer is irradiated with light to form a cured resin layer. method. Here, it is preferable that the adhesion between the light transmissive member and the image display member in the image display device is good. In addition, from the viewpoint of suppressing the overflow of the photocurable resin composition from the object to be coated (translucent member or image display member), there is a case where a so-called barrier filling process is employed. In the barrier filling process, for example, a coating region of the second resin composition (filler) is formed on the surface of the image display member using the first resin composition (barrier material). Next, the second resin composition is applied to the formed coating region, and the image display member and the light transmissive member are bonded together via the second resin composition. Then, the second resin composition is irradiated with light to form a cured resin layer. In the barrier filling process, the barrier material is preferably high in viscosity from the viewpoint of drip prevention. On the other hand, the filler material preferably has a low viscosity from the viewpoint of preventing the bubbles from being bonded at a shorter production time. Here, in order to make the visibility of the boundary portion between the barrier material and the filler material good, that is, in order to make the boundary between the barrier material and the filler material inconspicuous, there is a case where a resin composition of the same composition is used as the barrier material and the filler. However, if a resin composition of the same composition is used as the barrier material and the filler, there is a concern that the high viscosity of the barrier material or the low viscosity of the filler material is sacrificed. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2014-222350
[發明所欲解決之問題] 本技術係鑒於此種先前之實際情況而提出者,提供一種積層體之製造方法及光硬化性樹脂組合物,其即便於使用同一成分之樹脂組合物作為障壁材料與填充材料之情形時,亦兼顧障壁材料之高黏度性與填充材料之低黏度性,可使構件彼此之密接性良好。 [解決問題之技術手段] 本技術之積層體之製造方法具有:步驟(A),其係於第1構件之表面使用第1樹脂組合物形成光硬化性之第2樹脂組合物之塗佈區域;步驟(B),其係於塗佈區域塗佈第2樹脂組合物;步驟(C),其係將第1構件與第2構件經由第2樹脂組合物貼合,使第2樹脂組合物填充於塗佈區域;及步驟(D),其係對第2樹脂組合物照射光而形成硬化樹脂層;且步驟(C)包括將第2樹脂組合物進行加熱,第2樹脂組合物含有於60℃下加熱30分鐘後之加熱殘分為95.0%以上之單官能單體,第2樹脂組合物於80℃下加熱3小時後之加熱殘分為95.0%以上。 本技術之光硬化性樹脂組合物含有於60℃下加熱30分鐘後之加熱殘分為95.0%以上之單官能單體、(甲基)丙烯酸酯樹脂、光聚合起始劑、及塑化劑,且於80℃下加熱3小時後之加熱殘分為95.0%以上。 [發明之效果] 根據本技術,即便於使用同一成分之樹脂組合物作為第1樹脂組合物(障壁材料)與第2樹脂組合物(填充材料)之情形時,亦兼顧障壁材料之高黏度性與填充材料之低黏度性,可使構件彼此之密接性良好。[Problems to be Solved by the Invention] The present invention has been made in view of such a conventional situation, and provides a method for producing a laminate and a photocurable resin composition, which are used as a barrier material even when a resin composition of the same composition is used. In the case of the filler material, the high viscosity of the barrier material and the low viscosity of the filler material are also taken into consideration, and the adhesion between the members is good. [Means for Solving the Problem] The method for producing a laminate according to the present invention includes the step (A) of forming a coating region of the second resin composition which is photocurable using the first resin composition on the surface of the first member. a step (B) of applying a second resin composition to the coating region, and a step (C) of bonding the first member and the second member to the second resin composition to form the second resin composition Filled in the coating region; and step (D), the second resin composition is irradiated with light to form a cured resin layer; and the step (C) includes heating the second resin composition, and the second resin composition is contained in After heating at 60 ° C for 30 minutes, the heating residue was 95.0% or more of the monofunctional monomer, and the second resin composition was heated at 80 ° C for 3 hours, and the heating residue was 95.0% or more. The photocurable resin composition of the present invention contains a monofunctional monomer, a (meth) acrylate resin, a photopolymerization initiator, and a plasticizer having a heating residue of 95.0% or more after heating at 60 ° C for 30 minutes. The heating residue after heating at 80 ° C for 3 hours was 95.0% or more. [Effects of the Invention] According to the present technology, even when the resin composition of the same composition is used as the first resin composition (barrier material) and the second resin composition (filler), the high viscosity of the barrier material is also considered. The low viscosity with the filler material allows the members to have good adhesion to each other.
[積層體之製造方法] 本實施形態之積層體之製造方法具有下述步驟(A)~(D),且步驟(C)包括將第2樹脂組合物進行加熱。又,本製造方法中所使用之第2樹脂組合物如後文所詳述,含有於60℃下加熱30分鐘後之加熱殘分為95.0%以上之單官能單體,且於80℃下加熱3小時後之加熱殘分為95.0%以上。 步驟(A):於第1構件之表面使用第1樹脂組合物形成光硬化性之第2樹脂組合物之塗佈區域。 步驟(B):於塗佈區域塗佈第2樹脂組合物。 步驟(C):使第1構件與第2構件經由第2樹脂組合物貼合,使第2樹脂組合物填充於塗佈區域。 步驟(D):對第2樹脂組合物照射光而形成硬化樹脂層。 根據本製造方法,於步驟(C)中將第2樹脂組合物進行加熱,藉此可降低第2樹脂組合物之黏度。因此,即便於使用同一成分之樹脂組合物作為第1樹脂組合物與第2樹脂組合物之情形時,亦可兼顧第1樹脂組合物之高黏度性與第2樹脂組合物之低黏度性。又,於本製造方法中,使用於80℃下加熱3小時後之加熱殘分為95.0%以上之第2樹脂組合物,藉此於將第2樹脂組合物進行加熱時,可抑制第2樹脂組合物中之成分之揮發,因此可使第1構件與第2構件之密接性良好。 本製造方法中所使用之第2樹脂組合物於80℃下加熱3小時後之加熱殘分為95.0%以上,較佳為97.0%以上,更佳為98.0%以上,進而較佳為99.0%以上。藉由使加熱殘分更多,於將第2樹脂組合物進行加熱時,可更有效地抑制第2樹脂組合物中之成分之揮發。又,第2樹脂組合物之加熱殘分之上限值並無特別限制。此處,第2樹脂組合物之加熱殘分係指使用熱量計測定裝置(裝置名:Q50,TA Instruments公司製造)測定樹脂組合物10 mg於80℃下加熱3小時前後之質量而求出之值。關於第2樹脂組合物之詳情,將於後文進行敍述。 以下,一面參照圖式一面對各步驟之詳情進行說明。於本製造方法中,例如如圖1所示,獲得圖像顯示構件2(第1構件)與周緣部形成有遮光層4之透光性構件3(第2構件)經由硬化樹脂層1積層而成之圖像顯示裝置5(積層體)。 硬化樹脂層1由後述之第1樹脂組合物6與第2樹脂組合物8形成。硬化樹脂層1之折射率較佳為設為與圖像顯示構件2或透光性構件3之折射率大致相同,較佳為例如1.45以上且1.55以下。藉此,可提高來自圖像顯示構件2之影像光之亮度或對比度,而使視認性良好。又,硬化樹脂層1之透過率較佳為超過90%。藉此,可使形成於圖像顯示構件2之圖像之視認性更良好。硬化樹脂層1之厚度較佳為例如50~200 μm。 圖像顯示構件2例如可列舉液晶顯示面板、觸控面板等。此處,所謂觸控面板,意指將如液晶顯示面板之顯示元件與如觸控板之位置輸入裝置組合而成之圖像顯示、輸入面板。 透光性構件3為具有能夠視認形成於圖像顯示構件2之圖像之透光性者即可。例如可列舉:玻璃、丙烯酸樹脂、聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚碳酸酯等板狀材料或片狀材料。對於該等材料,亦可於至少一面實施硬塗處理、抗反射處理等。透光性構件3之厚度或彈性模數等物性可根據使用目的適當決定。 遮光層4係為了提高圖像之對比度而設置者,例如可藉由網版印刷法等塗佈著色為黑色等之塗料,並使其乾燥、硬化而形成。遮光層4之厚度通常為5~100 μm。 [步驟(A)] 於步驟(A)中,例如如圖2、3所示,於圖像顯示構件2之表面使用第1樹脂組合物6形成第2樹脂組合物8之塗佈區域7。塗佈區域7係例如如圖3、4所示,圖像顯示構件2之顯示區域中被由第1樹脂組合物6形成之框狀之阻液部(障壁)11包圍之區域。 第1樹脂組合物6係用於防止於步驟(B)中塗佈於塗佈區域7之第2樹脂組合物8之滴液之材料。第1樹脂組合物6例如可使用熱硬化性之樹脂組合物、光硬化性(例如紫外線硬化性)之樹脂組合物等。於第1樹脂組合物6為光硬化性之樹脂組合物之情形時,於步驟(A)中,例如如圖4所示,對第1樹脂組合物6自紫外線照射器9照射紫外線10,使第1樹脂組合物6硬化,形成阻液部11,藉此可劃定塗佈區域7。 就防滴液之觀點而言,第1樹脂組合物6較佳為高黏度。例如,第1樹脂組合物6較佳為於25℃下之黏度為10000~50000 mPa・s。 第1樹脂組合物6之塗佈方法可採用各種塗佈方法,例如可列舉使用分注器之方法、使用塗佈機之方法、使用噴霧器之方法等。就抑制滴液之觀點而言,尤佳為使用分注器之方法。第1樹脂組合物6之塗佈厚度例如可設為於本製造方法之步驟(B)中塗佈於塗佈區域7之第2樹脂組合物8之厚度以下。 [步驟(B)] 於步驟(B)中,例如如圖5所示,於塗佈區域7塗佈第2樹脂組合物8。作為第2樹脂組合物8之塗佈方法,可採用各種塗佈方法,例如可列舉上述之第1樹脂組合物6之塗佈方法。又,第2樹脂組合物8之塗佈量例如較佳為設為於步驟(C)中之貼合時可填充於塗佈區域7之量。 第2樹脂組合物8較佳為於步驟(D)中硬化時,與由第1樹脂組合物6形成之阻液部11之邊界線於目視下不明顯。因此,第2樹脂組合物8較佳為與第1樹脂組合物6實質上為同一成分。所謂同一成分,意指至少第1樹脂組合物6與第2樹脂組合物8之光學特性相同,例如透光率及折射率實質上相等。於第1樹脂組成6與第2樹脂組合物8之光學特性實質上相等之情形時,例如即便第1樹脂組合物6與第2樹脂組合物8之黏度不同,亦包含於同一成分。 又,就防止氣泡而以較短之產距時間貼合之觀點而言,第2樹脂組合物8較佳為於步驟(C)中之貼合時為低黏度。例如,第2樹脂組合物8較佳為於貼合時之溫度下之黏度為3000 mPa・s以下,更佳為1000~3000 mPa・s。 於本製造方法中,於以下之步驟(C)中將第2樹脂組合物8進行加熱(加溫),藉此可將第2樹脂組合物8之黏度調整為低黏度(例如3000 mPa・s以下)。因此,即便於使用同一成分之樹脂組合物作為第1樹脂組合物6與第2樹脂組合物8之情形時,亦可兼顧第1樹脂組合物6之高黏度性與第2樹脂組合物8之低黏度性。 又,於本製造方法中,藉由使用於80℃下加熱3小時後之加熱殘分為95.0%以上之第2樹脂組合物8,於以下之步驟(C)中將第2樹脂組合物8進行加熱時,可抑制第2樹脂組合物8中之成分(例如後述之單官能單體)之揮發。因此,可使透光性構件3與圖像顯示構件2之密接性良好。 [步驟(C)] 於步驟(C)中,例如如圖6所示,將圖像顯示構件2與透光性構件3經由第2樹脂組合物8貼合,使第2樹脂組合物8填充於塗佈區域7。圖像顯示構件2與透光性構件3之貼合例如可使用公知之壓接裝置進行。 又,步驟(C)包括如上所述般將第2樹脂組合物8進行加熱。藉由將第2樹脂組合物8進行加熱,於使第2樹脂組合物8減黏之狀態下填充於塗佈區域7。藉此,可防止第2樹脂組合物8中之氣泡而以較短之產距時間貼合。加熱條件較佳為設定為可將第2樹脂組合物8之黏度調整為低黏度(例如例如3000 mPa・s以下)。例如,加熱溫度係考慮熱對圖像顯示構件2或透光性構件3之影響而較佳為80℃以下,更佳為60~80℃。加熱時間例如可設為30分鐘~3小時左右。關於加熱之時點,可於圖像顯示構件2與透光性構件3之貼合前進行,可於貼合時進行,亦可於貼合後進行。作為加熱方法,例如可列舉使用加熱器等之方法等。 [步驟(D)] 於步驟(D)中,例如如圖7所示,對第2樹脂組合物8自紫外線照射器9照射紫外線10,形成硬化樹脂層1(參照圖1)。步驟(D)中之光照射較佳為使於步驟(C)中加熱之第2樹脂組合物8散熱後進行。 此處,於第2樹脂組合物8與第1樹脂組合物6實質上為同一成分之情形時,光照射後之第2樹脂組合物8與阻液部11一體化,成為光學上具有相同性質之單一之硬化樹脂層1。藉此,可使阻液部11與硬化後之第2樹脂組合物8之邊界部之視認性更良好。 如上所述,根據本製造方法,於步驟(C)中將第2樹脂組合物8進行加熱,藉此第2樹脂組合物8之黏度降低。因此,即便於使用同一成分之樹脂組合物作為第1樹脂組合物6與第2樹脂組合物8之情形時,亦可兼顧第1樹脂組合物6之高黏度性與第2樹脂組合物8之低黏度性。又,於本製造方法中,使用光硬化性樹脂組合物作為第2樹脂組合物8,該光硬化性樹脂組合物含有於60℃下加熱30分鐘後之加熱殘分為95.0%以上之單官能單體,且於80℃下加熱3小時後之加熱殘分為95.0%以上。藉此,於將第2樹脂組合物8進行加熱時,可抑制第2樹脂組合物8中之成分之揮發,而使透光性構件3與圖像顯示構件2之密接性良好。 再者,上述之製造方法係於圖像顯示構件2之表面塗佈第1樹脂組合物6與第2樹脂組合物8,但並不限定於該方法。例如,亦可於透光性構件3之表面塗佈第1樹脂組合物6與第2樹脂組合物8。又,於上述之製造方法中,使用形成有遮光層4之透光性構件3,但並不限定於該例。例如,亦可使用未形成遮光層之透光性構件。 又,於上述之步驟(A)中,藉由光照射使光硬化性之樹脂組合物6硬化而形成阻液部11,但並不限定於該方法。例如,於步驟(A)中,亦可使用熱硬化性之第1樹脂組合物6,將第1樹脂組合物6進行加熱而使其硬化,從而形成阻液部11。又,於第1樹脂組合物6之黏度足夠高至可防止第2樹脂組合物8之滴液之情形時,亦可不藉由熱或光使第1樹脂組合物6硬化。 [光硬化性樹脂組合物] 本實施形態之光硬化性樹脂組合物含有於60℃下加熱30分鐘後之加熱殘分為95.0%以上之單官能單體、(甲基)丙烯酸酯樹脂、光聚合起始劑、及塑化劑,且於80℃下加熱3小時後之加熱殘分為95.0%以上。此處,(甲基)丙烯酸酯包含甲基丙烯酸酯及丙烯酸酯之兩者。光硬化性樹脂組合物可較佳地用作上述之第1樹脂組合物6及第2樹脂組合物8。 [單官能單體] 單官能單體之於60℃下加熱30分鐘後之加熱殘分較佳為95.0%以上,更佳為97.0%以上,進而較佳為98.0%以上,尤佳為99.50%以上。 此處,單官能單體之加熱殘分係指使用熱量計測定裝置(裝置名:Q50,TA Instruments公司製造),測定單官能單體10 mg於60℃下加熱30分鐘前後之質量而求出之值。 藉由光硬化性樹脂組合物含有上述之單官能單體,於上述之步驟(C)中將第2樹脂組合物進行加熱時,可更有效地抑制該單官能單體之揮發。因此,可使透光性構件3與圖像顯示構件2之密接性更良好。 具體而言,單官能單體較佳為單官能(甲基)丙烯酸酯,例如較佳為式(A)所表示之化合物及式(B)所表示之化合物之至少1種。 [化1]式(A)中,R1
表示氫原子或甲基。R2
表示碳數2或3之伸烷基。R3
表示烴基,可為脂肪族烴基,亦可為芳香族烴基。於R3
為脂肪族烴基之情形時,較佳為碳數5~10之脂肪族烴基。又,於R3
為芳香族烴基之情形時,較佳為碳數6~12之芳香族烴基,更佳為碳數6~8之芳香族烴基。又,於R3
為芳香族烴基之情形時,R3
亦可具有取代基。作為取代基,可列舉碳數1~10之直鏈狀之烷基、碳數3~10之支鏈狀之烷基、碳數6~12之芳香族烴基等。n表示1~15之整數,較佳為表示1~10之整數。 式(B)中,R4
表示氫原子或甲基。R5
之碳數為11~20,較佳為15~20。R5
可為直鏈狀、支鏈狀、或環狀之烷基之任一者,較佳為直鏈狀或支鏈狀之烷基,更佳為支鏈狀之烷基。 作為單官能單體之具體例,可列舉:(甲基)丙烯酸異硬脂酯、壬基苯酚EO改性(甲基)丙烯酸酯、壬基苯酚PO改性(甲基)丙烯酸酯、2-乙基己基EO改性(甲基)丙烯酸酯、苯酚EO改性(甲基)丙烯酸酯、鄰苯基苯酚EO改性丙烯酸酯、對異丙苯基苯酚EO改性丙烯酸酯、N-丙烯醯氧基乙基六氫鄰苯二甲醯亞胺、及丙烯酸2-羥基-3-苯氧基丙酯等。 光硬化性樹脂組合物中,單官能單體之含量較佳為5~60質量%,更佳為5~40質量%,進而較佳為10~30質量%。單官能單體可單獨使用1種,亦可併用2種以上。於併用2種以上之單官能單體之情形時,較佳為其含量滿足上述含量之範圍。 [(甲基)丙烯酸酯樹脂] (甲基)丙烯酸酯樹脂例如為光硬化性之(甲基)丙烯酸酯樹脂,可為聚合物,亦可為低聚物。(甲基)丙烯酸酯樹脂例如較佳為聚(甲基)丙烯酸胺基甲酸酯低聚物、聚異戊二烯(甲基)丙烯酸酯低聚物、聚丁二烯(甲基)丙烯酸酯低聚物、及聚醚(甲基)丙烯酸酯低聚物之至少1種。作為(甲基)丙烯酸酯樹脂之具體例,可列舉UC-203(可樂麗公司製造)、UV3700B(日本合成化學公司製造)等。 光硬化性樹脂組合物中,(甲基)丙烯酸酯樹脂之含量較佳為5~80質量%,更佳為10~70質量%,進而較佳為10~60質量%,尤佳為30~50質量%。(甲基)丙烯酸酯樹脂可單獨使用1種,亦可併用2種以上。於併用2種以上之(甲基)丙烯酸酯樹脂之情形時,較佳為其含量滿足上述含量之範圍。 [光聚合起始劑] 光聚合起始劑較佳為光自由基聚合起始劑,更佳為含有苯烷酮系光聚合起始劑及醯基氧化膦系光聚合起始劑之至少1種。作為苯烷酮系光聚合起始劑,可使用1-羥基環己基苯基酮(Irgacure 184,BASF公司製造)、2-羥基-1-{4-[4-(2-羥基-2-甲基-丙醯基)苄基]苯基}-2-甲基-1-丙烷-1-酮(Irgacure 127,BASF公司製造)等。作為醯基氧化膦系光聚合起始劑,可使用2,4,6-三甲基苯甲醯基-二苯基-氧化膦(TPO,BASF公司製造)等。此外,作為光聚合起始劑,亦可使用二苯甲酮、苯乙酮等。 光硬化性樹脂組合物中,光聚合起始劑之含量相對於上述之單官能單體及(甲基)丙烯酸酯樹脂之合計100質量份,較佳為0.1~5質量份,更佳為0.2~3質量份。藉由設為此種範圍,可更有效地防止光照射時發生硬化不足,並且可更有效地防止裂解所導致之釋氣之增加。光聚合起始劑可單獨使用1種,亦可併用2種以上。於併用2種以上之光聚合起始劑之情形時,較佳為其合計量滿足上述範圍。 [塑化劑] 塑化劑係其自身不因光照射而發生光硬化,對光硬化後之硬化樹脂層賦予柔軟性者。例如可使用聚異戊二烯系塑化劑、聚醚系塑化劑、聚丁二烯系塑化劑、鄰苯二甲酸酯系塑化劑、己二酸酯系塑化劑等。作為聚異戊二烯系塑化劑之具體例,可列舉LIR-30、LIR-50(以上係可樂麗公司製造)、EPOL(出光興產公司製造)等。作為聚醚系塑化劑之具體例,可列舉P-3000(ADEKA公司製造)等。作為聚丁二烯系塑化劑之具體例,可列舉HLBH-P2000、HLBH-P3000、LBH-P2000、LBHP3000、LBH-P5000(以上係Cray Valley公司製造)等。 光硬化性樹脂組合物中,塑化劑之含量較佳為5~70質量%,更佳為10~70質量%,進而較佳為15~50質量%。塑化劑可單獨僅使用1種,亦可併用2種以上。於併用2種以上之塑化劑之情形時,較佳為其合計量滿足上述範圍。 [其他成分] 光硬化性樹脂組合物中,於不損害本技術之效果之範圍內,亦可進而含有除上述之成分以外之其他成分。例如可列舉無機微粒子、黏著賦予劑等。 光硬化性樹脂組合物亦可含有無機微粒子,以調整上述之第1樹脂組合物6及第2樹脂組合物8之至少一者之折射率。無機微粒子例如可使用表面經烷基矽烷基修飾之氧化矽粒子。作為烷基矽烷基,可使用單烷基矽烷基、二烷基矽烷基、三烷基矽烷基。無機微粒子之形狀例如可列舉球狀、橢圓形狀、扁平狀、棒狀、纖維狀等。無機微粒子之平均粒徑若考慮於光硬化性樹脂組合物中之分散性等,則例如較佳為設為1~1000 nm。無機微粒子之比表面積(BET(Brunauer-Emmett-Teller,布厄特)吸附法)例如為50~400 m2
/g左右。 黏著賦予劑對由光硬化性樹脂組合物形成之硬化樹脂層賦予柔軟性,進一步提高硬化樹脂層之初期接著強度(所謂之黏性)。作為黏著賦予劑,例如可使用萜烯樹脂、萜酚樹脂、氫化萜烯樹脂等萜烯系樹脂、天然松香、聚合松香、松香酯、氫化松香等松香樹脂、聚丁二烯、聚異戊二烯等石油樹脂等。 光硬化性樹脂組合物較佳為透過率超過90%。藉此,於形成硬化樹脂層1時,可使形成於圖像顯示構件2之圖像之視認性更良好。 光硬化性樹脂組合物之折射率較佳為與圖像顯示構件2或透光性構件3之折射率大致相同,較佳為例如1.45以上且1.55以下。藉此,可提高來自圖像顯示構件2之影像光之亮度或對比度,而提高視認性。 光硬化性樹脂組合物可藉由將上述之各成分按照公知之混合方法均勻混合而製備。 [實施例] 以下,對本技術之實施例進行說明。 [(甲基)丙烯酸酯樹脂] UC-203:異戊二烯低聚物,可樂麗公司製造 UV3700B:丙烯酸胺基甲酸酯低聚物,日本合成化學公司製造 [單官能單體] ISTA:丙烯酸異硬脂酯,大阪有機化學工業公司製造 M-111:壬基苯酚EO改性丙烯酸酯,東亞合成公司製造 M-113:壬基苯酚EO改性丙烯酸酯,東亞合成公司製造 M-117:壬基苯酚PO改性丙烯酸酯,東亞合成公司製造 M-120:2-乙基己基EO改性丙烯酸酯,東亞合成公司製造 M-101A:苯酚EO改性丙烯酸酯,東亞合成公司製造 M-102:苯酚EO改性丙烯酸酯,東亞合成公司製造 M-106:鄰苯基苯酚EO改性丙烯酸酯,東亞合成公司製造 M-110:對異丙苯基苯酚EO改性丙烯酸酯,東亞合成公司製造 M-140:N-丙烯醯氧基乙基六氫鄰苯二甲醯亞胺,東亞合成公司製造 M-5700:丙烯酸2-羥基-3-苯氧基丙酯,東亞合成公司製造 IBXA:丙烯酸異𦯉基酯,大阪有機化學工業公司製造 HPA:丙烯酸羥基丙酯,大阪有機化學工業公司製造 [塑化劑] LIR-30:異戊二烯聚合物,可樂麗公司製造 P-3000:聚醚多元醇,ADEKA公司製造 [聚合起始劑] Irg184:1-羥基環己基苯基酮,BASF公司製造 [單官能單體之加熱殘分] 各單官能單體之加熱殘分(%)係使用熱量計測定裝置(裝置名:Q50,TA Instruments公司製造)而求出。具體而言,如圖8所示,於容器12中放入10 mg之單官能單體13,測定單官能單體13於60℃下加熱30分鐘前後之質量,藉此而求出。 [光硬化性樹脂組合物之製備] 按照表1所示之調配量(質量份)將各成分均勻混合而製備光硬化性樹脂組合物。 [光硬化性樹脂組合物之黏度] 藉由流變儀(RS600,HAAKE公司製造,錐角度C35/2°),測定光硬化性樹脂組合物於25℃或80℃下之黏度。 [光硬化性樹脂組合物之折射率] 使用阿貝折射率計(鈉D射線(585 nm),25℃),測定各光硬化性樹脂組合物於80℃下加熱3小時後之折射率、及加熱前之折射率。 [光硬化性樹脂組合物之加熱殘分] 各光硬化性樹脂組合物之加熱殘分(%)係使用熱量計測定裝置(裝置名:Q50,TA Instruments公司製造)而求出。具體而言,如圖9所示,於容器14中放入10 mg之光硬化性樹脂組合物15,測定光硬化性樹脂組合物15於80℃下加熱3小時前後之質量,藉此而求出。 [不將光硬化性樹脂組合物進行加熱之情形時之接著強度] 如圖10、圖11所示,於厚度1.1 mm之玻璃板16之中央部滴加光硬化性樹脂組合物,介隔0.15 mm之間隔件19,以正交之方式載置厚度1.1 mm之玻璃板17。藉此,獲得於玻璃板16、17之間形成有直徑6 mm、厚度0.15 mm之樹脂組合物層18之玻璃接合體20。 如圖12、圖13所示,使用紫外線照射器9,以累計光量成為5000 mJ/cm2
之方式,自玻璃板17側照射紫外線10,使樹脂組合物層18硬化,形成硬化樹脂層21。 如圖14所示,將玻璃接合體20之玻璃板16、17由治具22A、22B固定,並且自治具22B側於垂直方向以5 mm/分鐘之速度壓入,按照以下之基準評價接著狀態。接著強度之測定使用負載試驗機(JSV-1000,日本計測系統公司製造)。接著強度係藉由下述方式而算出,即,測定於25℃下至玻璃板16與玻璃板17分離所需之應力,將該應力除以硬化樹脂層21之單位面積。 [將光硬化性樹脂組合物進行加熱之情形時之接著強度] 使用於80℃下加熱3小時者作為滴加至玻璃板16之光硬化性樹脂組合物,除此以外,與上述之不將光硬化性樹脂組合物進行加熱之情形時之接著強度之測定同樣地進行。 [透過率] 使用紫外可見分光光度計(島津製作所製造,UV-2450),測定玻璃接合體20中之硬化樹脂層21之可見光區域之透過率。就實用性而言,硬化樹脂層21之透過率較佳為90%以上。 [表1]
1‧‧‧硬化樹脂層1‧‧‧ hardened resin layer
2‧‧‧圖像顯示構件2‧‧‧Image display component
3‧‧‧透光性構件3‧‧‧Transparent components
4‧‧‧遮光層4‧‧‧ shading layer
5‧‧‧圖像顯示裝置5‧‧‧Image display device
6‧‧‧第1樹脂組合物6‧‧‧1st resin composition
7‧‧‧第2樹脂組合物之塗佈區域7‧‧‧ Coating area of the second resin composition
8‧‧‧第2樹脂組合物8‧‧‧2nd resin composition
9‧‧‧紫外線照射器9‧‧‧UV illuminator
10‧‧‧紫外線10‧‧‧ UV
11‧‧‧阻液部(障壁)11‧‧‧Resistance section (barrier)
12‧‧‧容器12‧‧‧ Container
13‧‧‧單官能單體13‧‧‧Monofunctional monomer
14‧‧‧容器14‧‧‧ Container
15‧‧‧光硬化性樹脂組合物15‧‧‧Photocurable resin composition
16‧‧‧玻璃板16‧‧‧ glass plate
17‧‧‧玻璃板17‧‧‧ glass plate
18‧‧‧樹脂組合物層18‧‧‧Resin composition layer
19‧‧‧間隔件19‧‧‧ spacers
20‧‧‧玻璃接合體20‧‧‧glass joint
21‧‧‧硬化樹脂層21‧‧‧ hardened resin layer
22A、22B‧‧‧治具22A, 22B‧‧‧ fixture
圖1係表示圖像顯示裝置之一例之剖視圖。 圖2(A)係表示圖像顯示構件之一例之前視圖,圖2(B)係圖2(A)所示之A-A'剖視圖。 圖3(A)係用於說明於圖像顯示構件之表面使用第1樹脂組合物形成第2樹脂組合物之塗佈區域之方法之一例之前視圖,圖3(B)係圖3(A)所示之A-A'剖視圖。 圖4係用於說明於圖像顯示構件之表面使用第1樹脂組合物形成第2樹脂組合物之塗佈區域之方法之一例之剖視圖。 圖5(A)係用於說明塗佈第2樹脂組合物之方法之一例之前視圖,圖5(B)係圖5(A)所示之A-A'剖視圖。 圖6(A)係用於說明使圖像顯示構件與透光性構件經由第2樹脂組合物貼合之方法之一例之前視圖,圖6(B)係圖6(A)所示之A-A'剖視圖。 圖7係用於說明對第2樹脂組合物照射光而形成硬化樹脂層之方法之一例之剖視圖。 圖8係用於說明單官能單體之加熱殘分之測定方法之圖。 圖9係用於說明光硬化性樹脂組合物之加熱殘分之測定方法之圖。 圖10係用於說明接著強度試驗之測定方法之立體圖。 圖11係圖10中之A-A'剖視圖。 圖12係用於說明接著強度試驗之測定方法之立體圖。 圖13係圖12中之A-A'剖視圖。 圖14係用於說明接著強度試驗之測定方法之立體圖。Fig. 1 is a cross-sectional view showing an example of an image display device. Fig. 2(A) is a front view showing an example of an image display member, and Fig. 2(B) is a cross-sectional view taken along line A-A' of Fig. 2(A). Fig. 3(A) is a front view showing an example of a method of forming a coating region of a second resin composition using a first resin composition on the surface of an image display member, and Fig. 3(B) is a view of Fig. 3(A) A-A' cross-sectional view shown. 4 is a cross-sectional view for explaining an example of a method of forming a coating region of the second resin composition using the first resin composition on the surface of the image display member. Fig. 5(A) is a front view for explaining an example of a method of applying the second resin composition, and Fig. 5(B) is a cross-sectional view taken along line A-A' of Fig. 5(A). Fig. 6(A) is a front view for explaining an example of a method of bonding an image display member and a light transmissive member via a second resin composition, and Fig. 6(B) is a view of Fig. 6(A). A' section view. FIG. 7 is a cross-sectional view for explaining an example of a method of forming a cured resin layer by irradiating light to the second resin composition. Fig. 8 is a view for explaining a method of measuring the heating residue of a monofunctional monomer. Fig. 9 is a view for explaining a method of measuring the heating residue of the photocurable resin composition. Fig. 10 is a perspective view for explaining a measuring method of a strength test. Figure 11 is a cross-sectional view taken along line A-A' of Figure 10. Fig. 12 is a perspective view for explaining a measuring method of a strength test. Figure 13 is a cross-sectional view taken along line A-A' of Figure 12. Fig. 14 is a perspective view for explaining a measuring method of a strength test.
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JP2013203843A (en) * | 2012-03-28 | 2013-10-07 | Kyoritsu Kagaku Sangyo Kk | Photocurable resin composition for laminating decoratively printed front plate and optical display panel or touch panel, and optical display or touch sensor made by laminating using the resin composition |
CN104364282B (en) * | 2012-06-15 | 2017-04-12 | 昭和电工株式会社 | Polymerizable composition, polymer, optical adhesive sheet, image display device, and method for manufacturing image display device |
TW201420718A (en) * | 2012-09-20 | 2014-06-01 | Mitsubishi Rayon Co | Photocuring adhesive agent composition, cured object, adhesive sheet and display panel and producing method thereof |
JP5935668B2 (en) * | 2012-11-27 | 2016-06-15 | 東亞合成株式会社 | Active energy ray-curable coating agent composition |
JP6130154B2 (en) * | 2013-01-31 | 2017-05-17 | デンカ株式会社 | Curable resin composition |
JP6335881B2 (en) * | 2013-03-28 | 2018-05-30 | セーレン株式会社 | Decorative film for insert molding and decorative insert molded product |
WO2015033610A1 (en) * | 2013-09-09 | 2015-03-12 | 日本化薬株式会社 | Method for producing optical member and ultraviolet curable resin composition used in same |
JP6404552B2 (en) * | 2013-09-13 | 2018-10-10 | デンカ株式会社 | Curable resin composition |
TW201522081A (en) * | 2013-09-27 | 2015-06-16 | Denki Kagaku Kogyo Kk | Laminate, manufacturing method thereof, and separation method thereof |
JP2015067677A (en) * | 2013-09-27 | 2015-04-13 | 三洋化成工業株式会社 | Photocurable composition for adhesion |
JP2015147916A (en) * | 2014-02-10 | 2015-08-20 | 日本化薬株式会社 | Uv-curable adhesive composition for touch panel, and bonding method and article using the same |
CN106459237B (en) * | 2014-05-22 | 2020-08-07 | 迪睿合株式会社 | Acrylic heat conductive composition and heat conductive sheet |
KR20190092486A (en) * | 2016-12-14 | 2019-08-07 | 덴카 주식회사 | Composition |
-
2017
- 2017-02-28 JP JP2017037614A patent/JP6938168B2/en active Active
-
2018
- 2018-01-12 KR KR1020247007186A patent/KR20240034266A/en active IP Right Grant
- 2018-01-12 CN CN201880010675.0A patent/CN110234506B/en active Active
- 2018-01-12 DE DE112018001039.2T patent/DE112018001039T5/en active Pending
- 2018-01-12 KR KR1020217034227A patent/KR20210130272A/en not_active Application Discontinuation
- 2018-01-12 KR KR1020197014614A patent/KR102318425B1/en active IP Right Grant
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- 2018-02-14 TW TW107105499A patent/TW201834848A/en unknown
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JP2018140601A (en) | 2018-09-13 |
WO2018159110A1 (en) | 2018-09-07 |
CN113372823B (en) | 2023-05-26 |
KR20210130272A (en) | 2021-10-29 |
KR20240034266A (en) | 2024-03-13 |
JP2022000508A (en) | 2022-01-04 |
JP6938168B2 (en) | 2021-09-22 |
CN113372823A (en) | 2021-09-10 |
CN110234506B (en) | 2021-05-11 |
JP2023086991A (en) | 2023-06-22 |
DE112018001039T5 (en) | 2019-11-28 |
KR20190072606A (en) | 2019-06-25 |
CN110234506A (en) | 2019-09-13 |
KR102318425B1 (en) | 2021-10-28 |
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