TW201834134A - Chuck module for supporting a substrate and probe station including the same - Google Patents

Abstract

Disclosed is a chuck module. The chuck module includes a chuck plate for supporting a substrate, the chuck plate including an alignment hole at a central portion thereof, a connecting plate disposed under the chuck plate, the connecting plate including first vacuum holes for vacuum adsorbing the chuck plate, and a first alignment pin to be inserted into the alignment hole for aligning the connecting plate with the chuck plate and a heating unit disposed under the connecting plate and connected with the connecting plate, the heating unit being configured to heat the chuck plate. Since the chuck plate can be fixedly connected to the connecting plate by using vacuum, the chuck plate can be easily attached, detached, replaced and assembled.

Description

Sucker module for supporting a substrate and probe station including the same

The exemplary embodiment of the present invention relates to a chuck module for supporting a substrate and a probe station including the same. More specifically, the exemplary embodiment of the present invention relates to a chuck module for supporting a substrate to electrically inspect the substrate using a probe card, and a probe station having the same, in which the substrate A semiconductor device is formed thereon.

Generally, a semiconductor device, such as an integrated circuit device, can be formed by repeatedly performing a series of semiconductor processes on a semiconductor wafer. For example, a semiconductor device can be formed on a wafer by repeatedly performing a deposition process, an etching process, an ion implantation process or a diffusion process, and a cleaning and cleaning process, wherein the deposition process is used to form a thin film on the wafer and the etching process is used to The film is formed into a pattern with electrical characteristics, an ion implantation process or a diffusion process is used to implant or diffuse impurities into the pattern, and a cleaning and cleaning process is used to remove impurities from the wafer.

After the semiconductor device is formed through the series of processes described above, an inspection process can be performed for inspecting the electrical characteristics of the semiconductor device. The inspection process can be performed by a probe station. The probe station includes a probe card and a tester. The probe card has a plurality of probes. The tester is connected to the probe card to provide electrical signals to the probe card.

The probe card may be disposed in an upper part of the inspection room for an inspection process, and a substrate supporting assembly for supporting a wafer may be disposed opposite the probe card. The substrate support assembly includes a chuck module, a rotation drive unit, a vertical drive unit, and a horizontal drive unit, wherein a wafer is mounted on an upper surface of the chuck module, and the rotation drive unit is disposed below the chuck module so that the chuck module Rotating, the vertical driving unit is disposed below the rotating driving unit to move the chuck module in the up-down direction, and the horizontal driving unit is used to move the chuck module in the horizontal direction.

Sucker modules can be manufactured in various types. The sucker module includes a DC sucker module, a hot sucker module, and a cold sucker module. The probe station has a suction cup module of a type suitable for performing an inspection process on a wafer, which can be selected from various types of suction cup modules. Each chuck module includes a chuck, a heater, and a spacer. A wafer can be placed on the chuck. The heater is placed under the chuck and heats the chuck. The spacer is placed under the heater and is used to prevent Heat from the heater is conducted downward.

The chuck may have a substantially disc shape, and a cooling gas may be provided to the chuck to prevent the chuck from being heated above a proper temperature by the heat provided by the heater. The cooling gas can cool the chuck while moving along a cooling channel formed in the chuck. The heater may have a ring shape, and the spacer may have the same disc shape as the suction cup. Here, the suction cup and the heater and the spacer can be connected to each other by bolting.

Various types of suction cup modules have different types of suction cups, however, one type of suction cup module has components including a heater and a heat insulator provided under the suction cup, and other types of suction cup modules. Have the same. That is, the suction cup module can be classified into a DC suction cup, a hot suction cup having a built-in hot wire, and a cold suction cup capable of receiving cooling water or a cooling gas as a coolant.

In a common probe station, the suction cup and the underlying components, such as a heater and a spacer, are connected to each other by bolting. Therefore, when the type of the suction cup installed is changed, or the suction cup is replaced in order to repair the suction cup or because the suction cup has been used for a long time, the entire module must be replaced. In this case, in order to align the wafer with the probe card, it is necessary to readjust and level the chuck, and it takes a long time to replace the chuck module, so it will increase processing time, reduce efficiency, and increase manufacturing costs.

In addition, the sucker module and the components below it are connected to each other by bolting. Therefore, when heat from a hot wire or a heater built in the chuck expands the chuck, assembly tolerances change and the chuck may bend. As a result, the level of the chuck may change, which may cause a poor contact between the probe card and the wafer during the inspection process.

The exemplary embodiment of the present invention provides a chuck module for supporting a substrate and a probe station including the same. The chuck module of the present invention can prevent the chuck module from warping and deforming due to thermal expansion, and is easy. replace.

According to one aspect of the present invention, a suction cup module is provided, which includes: a suction cup plate for supporting a substrate, the suction plate includes an alignment hole in a central portion thereof; a connecting plate disposed under the suction plate, the connecting plate Including a first vacuum hole and a first alignment pin, the first vacuum hole is used for vacuum suction of the chuck plate, the first alignment pin is inserted into the alignment hole for aligning the connecting plate with the chuck plate; and a heating unit, provided Below the connection plate and connected to the connection plate, the heating unit is configured to heat the suction plate.

In an exemplary embodiment, the sucker plate may further include an alignment slit formed at an edge portion thereof, and the connection plate further includes a second alignment pin inserted into the alignment slit.

In an exemplary embodiment, the connection plate may further include a cooling channel configured to flow a cooling fluid for cooling the chuck plate so as to maintain the temperature of the chuck plate within a preset temperature range.

In an exemplary embodiment, the connection plate may further include a first vacuum chamber in communication with the first vacuum hole to provide a space for transmitting a vacuum in the first vacuum hole.

In an exemplary embodiment, the chuck plate may further include a second vacuum hole for vacuum suctioning the substrate.

In an exemplary embodiment, the suction cup module may further include: a first vacuum line connected to the connection plate and in communication with the first vacuum hole, which transmits a vacuum to the first vacuum hole for vacuum suction of the suction plate A first vacuum pump connected to the first vacuum line, a second vacuum line connected to the second vacuum hole, and transferring a vacuum for vacuum suctioning the substrate; and a second vacuum pump connected to the second vacuum line.

Here, the chuck plate may further include a second vacuum chamber communicating with the second vacuum hole and the second vacuum line for providing a space for transmitting a vacuum to the second vacuum hole, and the second vacuum line is connected to the chuck board.

Also, the connection plate may further include: a third vacuum hole formed at a position corresponding to the second vacuum hole to communicate with the second vacuum hole; and a second vacuum chamber, the third vacuum hole, and the second vacuum tube The wires are connected to provide a space for transmitting a vacuum to the third vacuum hole, and the second vacuum line is connected to the connection plate.

In an exemplary embodiment, the heating unit may include a heater disposed below the connection plate and configured to generate heat for heating the chuck plate; and a spacer disposed below the heater and disposed to prevent heat Conducted down from the heater.

According to an aspect of the present invention, there is provided a probe station including: a chuck module for supporting a substrate having a semiconductor device; and a probe card holding module for holding the probe card for performing semiconductor Electrical inspection of the device; wherein the sucker module includes: a sucker plate opposite to the probe card for supporting the substrate, the sucker plate including an alignment hole in a central portion thereof; and a connecting plate provided below the sucker plate, the The connection plate includes a first vacuum hole and a first alignment pin. The first vacuum hole is used for vacuum suction of the chuck plate, and the first alignment pin is inserted into the alignment hole for aligning the connection plate with the chuck plate; and a heating unit. Is arranged below the connection plate and connected to the connection plate, and the heating unit is configured to heat the suction plate.

In an exemplary embodiment, the sucker plate may further include an alignment slit formed at an edge portion thereof, and the connection plate further includes a second alignment pin inserted into the alignment slit.

In an exemplary embodiment, the connection plate may further include a cooling channel configured to flow a cooling fluid for cooling the chuck plate so as to maintain the temperature of the chuck plate within a preset temperature range.

According to the specific embodiment of the present invention as described above, the chuck module can be easily disassembled and assembled by fixing the chuck plate to the connection plate using a vacuum. When the type of the sucker module needs to be changed, or the sucker plate needs to be replaced with a new one because the sucker plate has been used for a long time, it is easy to replace only the sucker plate without having to completely replace the sucker module. As a result, the assemblability of the chuck module can be improved, and the assembling time can be shortened.

Moreover, since the chuck plate is coupled to the connection plate using a vacuum instead of being bolted, it is possible to prevent the chuck plate from warping and deforming even if the heat from the heating unit causes the chuck plate to expand thermally. As a result, the chuck module of the present invention can prevent the level of the chuck module from changing after the alignment of the wafer and the probe card is completed, and can prevent poor contact between the probe card and the wafer.

In addition, the connecting plate and the chuck plate are accurately aligned with each other through the first and second alignment pins, the alignment hole and the alignment slit, which can further improve the assembly accuracy of the chuck module.

Specifically, since the chuck plate includes an alignment slit having a slit shape instead of a circular hole shape, and the second alignment pin is inserted into the alignment slit, it is possible to prevent the second alignment pin from being caused by the chuck plate. Deformation. Therefore, the chuck module of the present invention can prevent the chuck plate from undergoing thermal deformation, even if the heat from the heating unit causes the chuck plate to expand. As a result, it is possible to prevent the level of the chuck module from changing after the alignment of the wafer and the probe card is completed.

<Specific Example>

The invention will be described more fully hereinafter with reference to the accompanying drawings, in which specific embodiments of the invention are shown. The invention can, however, be embodied in many different forms and should not be construed as limited to the specific embodiments described herein. These specific embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

It should be understood that when an element or layer is referred to as being "on", "connected to" or "coupled to" another element or layer, it can be directly on the other element or layer. On, directly connected to or coupled to other elements or layers, or elements or layers intervening therebetween. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element or layer, it means that there is no Elements or layers in between. Throughout the text, the same symbols indicate the same elements. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

It should be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be Limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below can be termed a second element, component, region, layer or section without departing from the teachings of the present invention.

In this article, for the convenience of explanation, the space-relative terms such as "below", "below", "lower", "above", and "higher" may be used to describe one as shown in the figure. The relationship of an element or feature to another element or feature. It should be understood that the spatial relative term is intended to cover different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below other elements or features" or "below other elements or features" would then be oriented "above other elements or features." Thus, the example term "below" can cover both orientations above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

The terminology used herein is only used to describe a specific specific embodiment and is not intended to limit the present invention. As used herein, the singular forms "a," "an," and "the foregoing / the" are intended to include the plural forms unless the context clearly indicates otherwise. It should be understood that when the terms "comprising" and / or "including / comprising" are used in the description, they explicitly specify the existence of stated features, integers, steps, operations, elements and / or components, but do not exclude the presence or Where one or more other features, integers, steps, operations, elements, components, and / or combinations thereof are added.

The specific embodiments of the present invention are described herein with reference to the schematic sectional views of the ideal specific embodiments (and intermediate structures) of the present invention. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Therefore, specific embodiments of the present invention should not be interpreted as being limited to the specific shape of the regions illustrated herein, but include shape deviations due to, for example, manufacturing. For example, an implanted area illustrated as a rectangle generally has rounded or curved features and / or implantation concentration gradients at its edges, rather than a binary change from the implanted area to the non-implanted area. Likewise, a buried area formed by implantation may result in some implantation in the area between the buried area and the surface through which the implantation progresses. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art. It should be understood that terms, such as those defined in commonly used dictionaries, should be interpreted to have meanings consistent with their context and / or context in the relevant field, and will not be in an idealized or overly formal sense Explain unless explicitly so defined herein.

FIG. 1 is a cross-sectional view showing a probe station according to an exemplary embodiment of the present invention.

Referring to FIG. 1, a probe station 100 according to an exemplary embodiment of the present invention may use a probe card 20 to perform an electrical characteristic test on a substrate 10, such as a wafer, on which a plurality of semiconductor devices are formed.

Specifically, the probe station 100 includes: a test chamber 110 that provides a processing space for performing electrical characteristic tests on the wafer 10; a substrate support assembly 200 that is positioned in the processing space for supporting the wafer 10; and a bottom and an upper portion The alignment cameras 120 and 130 are used to align the wafer 10 with the probe card 20.

The probe card 20 is positioned above the substrate support assembly 200. After the wafer 10 is aligned with the probe card 20, the probe 22 of the probe card 20 is in contact with a pad formed on the wafer 10 to apply a test signal to the pad. Here, the probe station 100 can be interconnected with a tester 30, which is used to check the electrical characteristics of the wafer 10. The tester 30 may apply a test signal to the semiconductor device formed on the wafer 10 through the probe card 20, and use the output signal sent from the semiconductor device to check the electrical characteristics of the wafer 10.

The substrate supporting assembly 200 adjusts the position of the wafer 10 so that the test pad of the wafer 10 and the probe 22 of the probe card 20 correspond to each other. After the wafer 10 is aligned with the probe card 20, the wafer 10 is moved up and down to bring the probe into contact with the test pad of the wafer 10. In this case, the alignment between the wafer 10 and the probe card 20 may be performed using the images acquired from the bottom and upper alignment cameras 120 and 130.

In detail, the bottom alignment camera 120 can be moved together with the substrate support assembly 200, and an image of a probe of the probe card 20 can be acquired. The upper alignment camera 130 may be disposed above the substrate support assembly 200 and may acquire an image of a pattern formed on the wafer 10. Although not shown in detail in FIG. 1, the upper registration camera 130 can be moved in a horizontal direction by a bridge driving section (not shown).

Hereinafter, the elements of the substrate support assembly 200 will be described in detail with reference to the drawings.

FIG. 2 is a cross-sectional view illustrating a chuck module according to an exemplary embodiment of the present invention. FIG. 3 is an exploded perspective view showing the chuck module in FIG. 2. FIG. 4 is a plan view showing a connection state between the chuck plate and the connection plate in FIG. 2.

1 and 2, the substrate supporting assembly 200 includes: a chuck module 301 for supporting the wafer 10 on an upper surface thereof; and a rotation driving unit 210 disposed under the chuck module 301 for rotating the chuck module 301. So that the probe 22 of the probe card 20 is aligned with the pad of the wafer 10; the vertical driving unit 220 is provided below the suction cup module 301 for adjusting the upper and lower positions of the suction cup module 301; the suction cup table 230 is positioned at Below the chuck module 301 is used to support the vertical drive unit 220; and the horizontal drive unit 240 is used to adjust the horizontal position of the chuck module 301.

The chuck module 301 is positioned to face the probe card 20 and support the wafer 10, and controls the temperature of the wafer 10 so that it is maintained at a temperature suitable for inspecting the wafer 10.

Specifically, the chuck module 301 includes a chuck plate 310, a connection plate 320, and a heating unit 330. The chuck plate 310 may support a wafer on its upper surface. The connection plate 320 may be disposed below the chuck plate 310 and may vacuum-suck the chuck plate 310 to be interconnected with the chuck plate 310. The heating unit 330 is positioned below the connection plate 320 for heating the chuck plate 310. In particular, the chuck module 301 can fix the chuck plate 310 with a vacuum, so that the chuck plate 310 can be easily released from the connection plate 320 and the chuck plate 310 can be easily replaced.

2 to 4, the suction plate 310 may have a disc shape as shown in FIG. 3. The chuck plate 310 includes an alignment hole 312 formed in a central portion thereof for aligning the chuck plate 310 with the connection plate 320.

As shown in FIG. 3, the connection plate 320 may have a disc shape and size similar to that of the suction plate 310. Specifically, the connection plate 320 includes a plurality of first vacuum holes 321 for vacuum suction of the chuck plate 310 and a first alignment pin 322 inserted into the alignment hole 312 for aligning the connection plate 320 with the suction cup.板 310。 Plate 310.

A first vacuum hole 321 may be formed on an upper surface of the connection plate 320 and is used to provide a vacuum to fix the chuck plate 310 to the connection plate 320. The lower surface of the chuck plate 310 is attracted to the upper surface of the connection plate 320 by a vacuum force provided through the first vacuum hole 321, and thus the chuck plate 310 is connected to the connection plate 320.

The first alignment pin 322 is provided to an upper surface of the connection plate 320 and may be provided at a central portion of the connection plate 320. The first alignment pin 322 is inserted into the alignment hole 312 of the chuck plate 310, whereby the center point of the chuck plate 310 is aligned with the center point of the connection plate 320.

The connection plate 320 may further include a second alignment pin 323 for alignment with the suction plate 310. The second alignment pin 323 may be provided to an edge portion of the upper surface of the connection plate 320, and the chuck plate 310 may have an alignment slit 314 into which the second alignment pin 323 is inserted. As shown in FIG. 4, a registration slit 314 is formed at an edge portion of the chuck plate 310, and a second registration pin 323 can be inserted into the registration slit 314. Although not shown, according to this, the chuck plate 310 and the connection plate 320 can be more accurately aligned with each other.

The connection plate 320 may further include a first vacuum chamber 324, which is in communication with the first vacuum hole 321. Also, the chuck module 301 may further include: a first vacuum line 342 coupled to the connection plate 320 for providing a vacuum for adsorbing and fixing the chuck plate 310; and a first vacuum pump 350 coupled to the first vacuum line 342.

As shown in FIG. 2, the first vacuum chamber 324 may be formed in the connection plate 320 and may communicate with the first vacuum line 342. The first vacuum chamber 324 has a space for providing a vacuum to the first vacuum hole 321. Therefore, the first vacuum pump 350 is driven to form a vacuum state in the first vacuum chamber 324. When a vacuum is formed in the first vacuum chamber 324, the first vacuum hole 321 communicating with the first vacuum chamber 324 is in a vacuum state, and thus the lower surface of the chuck plate 310 can be adsorbed and fixed to the connection plate 320. On the surface.

Hereinafter, a process of attaching and detaching the chuck plate 310 to and from the connection plate 320 by using a vacuum will be described in detail with reference to the drawings.

FIG. 5 is a cross-sectional view showing the suction cup module in FIG. 2 with the suction cup plate removed.

Referring to FIGS. 2 and 5, a process of coupling the suction plate 310 to the connection plate 320 using a vacuum is described in detail below. First, the chuck plate 310 and the connection plate 320 are aligned with each other. Specifically, the alignment holes 312 of the suction plate 310 are positioned to correspond to the first alignment pins 322 of the connection plate 320, and the alignment slits 314 of the suction plate 310 are aligned with the second alignment pins 323 of the connection plate 320. . Then, the suction plate 310 is placed on the upper surface of the connection plate 320. The first alignment pin 322 is inserted into the alignment hole 312 and the second alignment pin 323 is inserted into the alignment slit 314, whereby the suction plate 310 is aligned with the connection plate 320.

Then, the first vacuum pump 350 is driven to form a vacuum in the first vacuum chamber 324, and thus, as shown in FIG. 2, a vacuum is formed in the first vacuum hole 321, so that the chuck plate 310 is fixedly coupled to the connection plate 320. . Therefore, the chuck module 301 is equipped with a chuck plate 310 and a connection plate 320.

Meanwhile, a process of separating the suction plate 310 from the suction plate module 301 to replace the suction plate 310 with another suction plate will be described. First, after the driving of the first vacuum pump 350 is stopped, the vacuum of the vacuum hole 321 is broken. As a result, as shown in FIG. 5, the chuck plate 310 can be easily separated from the connection plate 320. Specifically, since the connecting plate 320 and the sucker plate 310 of the present invention are connected by vacuum instead of using a bolt connection method using bolts, it is easy to separate one of them from the other, and it is easy to assemble each other. Reduce the time of separation or assembly.

As described above, the chuck module 301 can be easily disassembled and assembled by fixing the chuck plate 310 to the connection plate 320 using a vacuum. When the type of the sucker module 301 needs to be changed, or the sucker plate 310 needs to be replaced with a new one because the sucker plate 310 has been used for a long time, it is easy to replace only the sucker plate 310 without having to completely replace the sucker module 301. As a result, the assemblability of the chuck module 301 can be improved, and the assembling time can be shortened.

Also, since the chuck plate 310 is coupled to the connection plate 320 using a vacuum instead of being bolted, it is possible to prevent the chuck plate 310 from warping and deforming even if heat from the heating unit 330 causes the chuck plate 310 to expand thermally. As a result, the chuck module 301 can prevent the level of the chuck module 301 from changing after the alignment of the wafer 10 and the probe card 20 is completed, and can prevent poor contact between the probe card 20 and the wafer 10.

In addition, the connecting plate 320 and the chuck plate 310 are accurately aligned with each other through the first and second alignment pins 322 and 323, and the alignment holes 312 and the alignment slit 314, which can further improve the assembly accuracy of the chuck module 301.

Specifically, the chuck plate 310 includes an alignment slit 314 formed in a slit shape instead of a circular hole shape for inserting the second alignment pin 323. Therefore, the second alignment pin 323 may be coupled to the chuck plate 310 without being affected by the heat deformation of the chuck plate 310. Therefore, the chuck module 301 can prevent the chuck plate 310 from being deformed, that is, it can prevent the chuck plate 310 from generating defects such as warpage and deformation, even if the heat from the heating unit 330 causes the chuck plate 310 to expand thermally. As a result, it is possible to prevent the level of the chuck module 301 from being changed after the wafer 10 is aligned with the probe card 20.

Referring again to FIGS. 2 and 3, the connection plate 320 may further include a cooling channel 325 through which a cooling fluid flows. A cooling channel 325 is formed in the connection plate 320. A cooling fluid for cooling the chuck plate 310 may be introduced into the cooling channel 325 to maintain the chuck plate 310 within a preset temperature range suitable for the inspection process. As a result, the connection plate 320 can prevent the chuck plate 310 from being heated beyond the preset temperature range by the heating unit 330 using a cooling fluid.

In an exemplary embodiment, the cooling channel 325 may be positioned below the first vacuum chamber 324 or above the first vacuum chamber 324.

In an exemplary embodiment, the chuck plate 310 may include a plurality of second vacuum holes 316 for vacuum sucking the wafer 10. As shown in FIG. 3, a second vacuum hole 316 is formed on the upper surface of the chuck plate 310. The second vacuum hole 316 may generate a vacuum inside to attract the wafer 10 to the upper surface of the chuck plate 310. Moreover, the chuck module 301 may further include a second vacuum line 344 communicating with the second vacuum hole 316 and a second vacuum pump 360 interconnected with the second vacuum line 344.

The chuck plate 310 may further include a second vacuum chamber 318 which is in communication with the second vacuum hole 316. The second vacuum chamber 318 may be formed inside the chuck plate 310 and may be in communication with the second vacuum line 344. The second vacuum chamber 318 can be brought into a vacuum state by driving the second vacuum pump 360. Thereby, the second vacuum hole 316 communicating with the second vacuum chamber 318 may be changed to a vacuum state, and a wafer positioned on the upper surface of the chuck plate 310 may be vacuum-adsorbed. As a result, the chuck plate 310 can stably support the wafer 10.

The heating unit 330 is positioned below the connection plate 320. The heating unit 330 may include a heater 332 and a spacer 334. The heater 332 is disposed below the connection plate 320 and is configured to generate heat for heating the chuck plate 310. The spacer 334 is disposed below the heater to prevent heat from being dissipated downward from the heating unit 330.

In an exemplary embodiment, the heater 332 may be arranged in a variety of ways and may have a ring shape. Also, the spacer 334 may include a recessed portion on an upper surface thereof for receiving the heater 332.

Since the cooling channel 325 for cooling the chuck plate 310 is formed in the connection plate 320 instead of the chuck plate 310, the chuck module 301 can be simplified. Accordingly, the chuck plate 310 can be easily replaced.

FIG. 6 is a cross-sectional view illustrating a chuck module according to an exemplary embodiment of the present invention.

The suction cup plate 370 shown in FIG. 6 may have an alignment hole 312 and an alignment slit 314 for alignment with the connection plate 380, like the suction cup plate 310 shown in FIG. 2. However, the chuck plate 370 shown in FIG. 6 has a simpler structure than the chuck plate 310 shown in FIG. 2. That is, the chuck plate 370 may have a plurality of second vacuum holes 316 for vacuum suctioning the wafer 10, but unlike the chuck plate 310 shown in FIG. 2, the chuck plate 370 does not have a second vacuum communicating with the holes 316 Chamber 318 (see FIG. 2).

The connection plate 380 may include a plurality of first vacuum holes 321 for vacuum-suctioning the chuck plate 370, and first and second alignment pins 322 and 323 for aligning the connection plate 380 with the chuck plate 370. Also, the connection plate 380 may include a first vacuum chamber 324 in communication with the first vacuum hole 321.

Specifically, the connection plate 380 may further include a third vacuum hole 382 and a second vacuum chamber 384. The third vacuum hole 382 is in communication with the second vacuum hole 316 and is used to provide a vacuum to the second vacuum hole 316. The second vacuum chamber 384 provides a space in communication with the third vacuum hole 382 for vacuum suctioning the wafer 10.

The suction cup module 302 shown in FIG. 6 is different from the suction cup module 301 shown in FIG. 2 in that a second vacuum chamber 384 that communicates with the second vacuum hole 316 is formed in the connection plate 380, and the second The vacuum line 344 is coupled to the connection plate 380 instead of the suction plate 370. The third vacuum hole 382 is formed on the upper surface of the connection plate 380 together with the first vacuum hole 321, and the second vacuum chamber 384 is in communication with the second vacuum line 344. The second vacuum pump 360 connected to the second vacuum line 344 is driven to generate a vacuum in the second vacuum chamber 384 to bring the third vacuum hole 382 into a vacuum state. As a result, the wafer 10 provided on the chuck plate 370 can be sucked and fixed to the chuck plate 370.

As shown in FIG. 6, the second vacuum chamber 384 is positioned above the first vacuum chamber 324, but the second vacuum chamber 384 may also be positioned below the first vacuum chamber 324.

Referring again to FIG. 1, the rotation driving unit 210 is disposed below the chuck module 301 for rotating the chuck module 301 so that the test pad of the wafer 10 is aligned with the probe 22 of the probe card 20. Also, the vertical driving unit 220 may be disposed under the rotation driving unit 210. The vertical driving unit 220 moves the chuck module 301 up and down to adjust the up and down position of the chuck module 301, and the chuck table 230 may be disposed below the vertical driving unit 220. The chuck table 230 may be disposed on the horizontal driving unit 240 and the horizontal driving unit 240 may translate the chuck table 230 to adjust the horizontal position of the chuck module 301.

The foregoing is a description of the invention and should not be construed as limiting the invention. Although several exemplary embodiments of the present invention have been described, those skilled in the art will readily understand that the exemplary embodiments can be performed without substantially departing from the novel teachings and advantages of the present invention. Many modifications. Accordingly, all such modifications are intended to be included within the scope of this invention as defined by the scope of the patent application. In the scope of the patent application, the means-plus-function clause is intended to cover structures described herein as performing the aforementioned functions, not only structural equivalents, but equivalent structures. Therefore, it should be understood that the foregoing is a description of the present invention, and should not be construed to limit the present invention to the disclosed specific embodiments, and the modification of the disclosed specific embodiments and other specific embodiments is intended to be covered in Within the scope of the attached patent application. The invention is defined by the appended claims and equivalents of the claims contained herein.

10‧‧‧ Substrate (wafer)

100‧‧‧ Probe Station

110‧‧‧test room

120‧‧‧ bottom registration camera

130‧‧‧ Upper registration camera

20‧‧‧ Probe Card

22‧‧‧ Probe

200‧‧‧ substrate support assembly

210‧‧‧Rotary drive unit

220‧‧‧Vertical Drive Unit

230‧‧‧ Suction table

240‧‧‧Horizontal Drive Unit

30‧‧‧Tester

301, 302‧‧‧ Suction Module

310‧‧‧ Suction Plate

312‧‧‧Alignment hole

314‧‧‧Alignment slit

316‧‧‧Second vacuum hole

318‧‧‧Second Vacuum Chamber

320‧‧‧Connecting board

321‧‧‧The first vacuum hole

322‧‧‧First registration pin

323‧‧‧Second Registration Pin

324‧‧‧The first vacuum chamber

325‧‧‧cooling channel

330‧‧‧Heating unit

332‧‧‧heater

334‧‧‧Isolator

342‧‧‧The first vacuum line

344‧‧‧Second vacuum line

350‧‧‧The first vacuum pump

360‧‧‧Second Vacuum Pump

370‧‧‧ Suction Plate

380‧‧‧Connecting plate

382‧‧‧Third vacuum hole

384‧‧‧Second vacuum chamber

The above and other features and advantages of the present invention will be more clearly understood through the detailed description of the exemplary embodiments in conjunction with the drawings, in which: FIG. 1 shows a probe station according to an exemplary embodiment of the present invention 2 is a cross-sectional view showing a sucker module according to an exemplary embodiment of the present invention; FIG. 3 is an exploded perspective view showing the sucker module in FIG. 2; FIG. 4 is a sucker module in FIG. 2 FIG. 5 is a cross-sectional view of the suction cup module in FIG. 2 with the suction plate removed, and FIG. 6 is a suction cup module according to an exemplary embodiment of the present invention. Section view.

Claims (12)

A sucker module for supporting a substrate. The sucker module includes: a sucker plate for supporting the substrate; the sucker plate includes an alignment hole in a central portion thereof; a connecting plate provided below the sucker plate; the connecting plate Including a first vacuum hole and a first alignment pin, the first vacuum hole is used for vacuum suction of the suction plate, the first alignment pin is inserted into the registration hole, and the connection plate is aligned with the suction plate And a heating unit disposed below the connection plate and connected to the connection plate, the heating unit being configured to heat the suction plate. The chuck module according to item 1 of the patent application scope, wherein the chuck plate further includes an alignment slit formed at an edge portion thereof, and the connection plate further includes a first chuck inserted into the alignment slit. Two pairs of pins. The suction cup module according to item 1 of the patent application scope, wherein the connection plate further includes a cooling channel configured to allow a cooling fluid to flow for cooling the suction plate, so that the temperature of the suction plate is maintained at a preset value. Temperature range. The suction cup module according to item 1 of the patent application scope, wherein the connection plate further includes a first vacuum chamber connected to the first vacuum hole to provide a vacuum for transmitting a vacuum in the first vacuum hole. space. The chuck module according to item 1 of the scope of the patent application, wherein the chuck plate further includes a second vacuum hole for vacuum suction of the substrate. The sucker module according to item 5 of the patent application scope, further comprising: a first vacuum line connected to the connection plate, communicating with the first vacuum hole, and transmitting a vacuum to the first vacuum hole for The first vacuum pump is connected to the first vacuum line; the second vacuum line is in communication with the second vacuum hole and transfers vacuum for vacuum suction of the substrate; and the second vacuum pump is connected To the aforementioned second vacuum line. The chuck module according to item 6 of the patent application scope, wherein the chuck plate further includes a second vacuum chamber, which is in communication with the second vacuum hole and the second vacuum line for providing a vacuum for transmitting To the space of the aforementioned second vacuum hole, and the aforementioned second vacuum line is connected to the aforementioned sucker plate. The sucker module according to item 6 of the scope of patent application, wherein the connection plate further includes: a third vacuum hole formed at a position corresponding to the second vacuum hole to communicate with the second vacuum hole; And a second vacuum chamber, which is in communication with the third vacuum hole and the second vacuum line, and provides a space for transmitting a vacuum to the third vacuum hole, and the second vacuum line is connected to the connection plate. The suction cup module according to item 1 of the patent application scope, wherein the heating unit includes: a heater disposed below the connection plate and configured to generate heat for heating the suction plate; and a spacer provided at The heater is below, and is configured to prevent heat from being conducted downward from the heater. A probe station includes: a chuck module for supporting a substrate having a semiconductor device; and a probe card holding module for holding the probe card for performing an electrical inspection on the semiconductor device; wherein the aforementioned chuck module It includes: a sucker plate opposite to the probe card for supporting the substrate, the sucker plate including an alignment hole at a central portion thereof; a connecting plate provided below the sucker plate, the connecting plate including a first vacuum A hole and a first alignment pin, the first vacuum hole is used for vacuum suction of the suction plate, the first registration pin is inserted into the registration hole, and the connection plate is aligned with the suction plate; and a heating unit; Is disposed below the connection plate and connected to the connection plate, and the heating unit is configured to heat the suction plate. The probe station according to claim 10, wherein the sucker plate further includes a registration slit formed at an edge portion thereof, and the connection plate further includes a first insertion hole inserted into the registration slit. Two pairs of pins. The probe station according to item 10 of the scope of patent application, wherein the connection plate further includes a cooling channel configured to allow a cooling fluid to flow for cooling the suction plate, so that the temperature of the suction plate is maintained at a preset value. Temperature range.