TW201830211A - 觸控感測器總成以及平坦化膠帶 - Google Patents
觸控感測器總成以及平坦化膠帶 Download PDFInfo
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- TW201830211A TW201830211A TW106143657A TW106143657A TW201830211A TW 201830211 A TW201830211 A TW 201830211A TW 106143657 A TW106143657 A TW 106143657A TW 106143657 A TW106143657 A TW 106143657A TW 201830211 A TW201830211 A TW 201830211A
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- Laminated Bodies (AREA)
Abstract
本文描述一種平坦化膠帶及一種觸控感測器總成,該觸控感測器總成包括一蓋玻璃、透過一光學清透黏著劑層接合至該蓋玻璃的一觸控感測器膜、以及可釋離地接合至該觸控感測器膜的該平坦化膠帶。該平坦化膠帶包括一聚合基材及接合至該基材的一可離型黏著劑層。該基材具有介於250微米與5mm之間的厚度,且該黏著劑層具有介於5微米與100微米之間的厚度。該黏著劑層可經調適以可釋離地接合至玻璃及環烯烴聚合物膜之至少一者。
Description
一顯示器可包括一顯示面板、在該顯示面板上的一蓋玻璃、及在該蓋玻璃與該顯示面板之間的觸控感測器膜。可藉由附接該觸控感測器膜至該蓋玻璃使得該觸控感測器膜呈平坦狀,並接著附接該觸控感測器膜/蓋玻璃至該顯示面板來組裝該顯示器。
在本說明之一些態樣中,提供一觸控感測器總成,其包括一蓋玻璃、一光學清透黏著劑層、透過該光學清透黏著劑層接合至該蓋玻璃的一觸控感測器膜、及相鄰於該觸控感測器膜而與該蓋玻璃相對的一平坦化膠帶。該平坦化膠帶包括一聚合基材及接合至該基材並可釋離地接合至該觸控感測器膜的一可離型黏著劑層。該基材具有介於250微米與5mm之間的厚度,且該可離型黏著劑層具有介於5微米與100微米之間的厚度。
在本說明之一些態樣中,提供一平坦化膠帶,其包括一聚合基材及接合至該基材的一黏著劑層。該基材具有介於250微米與5mm之間的厚度,及不大於3百分比之霧度。該黏著劑層具有介於5 微米與100微米之間的厚度。該黏著劑層經調適以可釋離地接合至玻璃及環烯烴聚合物膜之至少一者。
100‧‧‧平坦化膠帶
110‧‧‧聚合基材、基材
114‧‧‧黏著劑層
200‧‧‧平坦化膠帶
201‧‧‧觸控感測器總成
210‧‧‧聚合基材、基材
214‧‧‧可離型黏著劑層、黏著劑層
220‧‧‧觸控感測器膜、主要表面
221‧‧‧基材
222‧‧‧主要表面
224‧‧‧電極
230‧‧‧光學清透黏著劑層
240‧‧‧蓋玻璃
243‧‧‧油墨梯級
302‧‧‧顯示裝置
370‧‧‧顯示面板
374‧‧‧光學清透黏著劑層
t‧‧‧厚度
T‧‧‧厚度
圖1係一平坦化膠帶之示意性截面圖;圖2係觸控感測器總成之示意性截面圖;及圖3係顯示裝置之示意性截面圖。
以下說明係參照所附圖式進行,該等圖式構成本文一部分且在其中係以圖解說明方式展示各種實施例。圖式非必然按比例繪製。要理解的是,其他實施例係經設想並可加以實現而不偏離本說明的範疇或精神。因此,以下之詳細敘述並非作為限定之用。
一顯示器可包括一觸控感測器膜,其可包括一基材(例如,一玻璃基材或一環烯烴聚合物(COP)基材)及可包括在該基材之相對主要表面上的電極之列。該等電極可自導電透明氧化物(例如,氧化銦錫)或自例如,金屬細篩網(metallic micromesh)而形成。例如,美國專利第9,360,971號(Barton等人)及美國專利申請公開案第2009/0219257號(Frey等人)與第2011/0139516號(Nirmal等人)中描述觸控感測器膜。
可如下將一觸控感測器膜併入一顯示器中。可首先層壓該觸控感測器膜至一蓋玻璃以透過一光學清透黏著劑與該顯示器使用。一般而言,所欲的是在施加該觸控感測器膜/蓋玻璃層壓體至該顯 示器之前,該觸控感測器膜經平坦化。可需要一平坦化步驟,例如,當該蓋玻璃包括三維結構(例如)諸如靠近蓋玻璃之邊界的油墨梯級時。該平坦化可經由透過使用熱及/或壓力(例如,置放該觸控感測器膜/蓋玻璃/額外基材至兩個平面經加熱之板之間並施加壓力至該等板)暫時地附接該觸控感測器膜/蓋玻璃層壓體至額外基材以達成該觸控感測器膜之平坦化,並接著自該觸控感測器膜移除額外基材且施加該觸控感測器/蓋玻璃層壓體至該顯示面板。一旦該第二觸控/蓋玻璃附接至該額外基材,經常所欲的是檢驗該總成之缺陷。可在施加熱及/或壓力之前及/或之後實行檢驗。一般而言,所欲的是該基材具有低霧度以促進此檢驗。檢驗亦也可在程序中之其他步驟實行。例如,層壓該觸控感測器膜至該光學清透黏著劑後、及/或層壓該蓋玻璃/光學清透黏著劑至該蓋玻璃後,可檢驗各種總成之缺陷。該額外基材可係具有一黏著劑層的玻璃。然而,玻璃易於破裂或碎裂除非用足以預防此者的厚度製作,且因為對於簡單去接合而言厚玻璃不具足夠可撓性所以使用厚玻璃可使自該玻璃移除該觸控感測器/蓋玻璃總成變成困難的。此外,可所欲的是該額外基材係可拋棄式,且玻璃基材可能過於昂貴而無法作為可拋棄式組件使用。根據本說明,已發現具有可離型黏著劑層的膠帶及可使用厚聚合基材(例如,至少250微米厚)作為該額外基材。合適用於平坦化程序中的膠帶將在本文中被稱為平坦化膠帶。
一般而言,本說明之平坦化膠帶包括一聚合基材及接合至該基材的一黏著劑層,其中該基材具有介於250微米與5mm之間的厚度,及不大於不大於10百分比之霧度(或較佳地不大於5百分 比,或更佳地不大於3百分比,或甚至更佳地不大於2百分比),且其中該黏著劑層具有介於1微米與100微米之間的厚度(或較佳地介於5微米與100微米之間,或甚至更佳地介於5微米與50微米之間)。如指定於ASTM D1003-13之測試標準中,可使用HAZEGARD PLUS霧度計(可購自BYK Gardner USA,Columbia,MD)判定霧度。該黏著劑層可係一可離型黏著劑,該可離型黏著劑經調適以可釋離地接合至玻璃及環烯烴聚合物膜中之至少一者。若黏著劑可自基材經由在黏著劑與該基材之間之介面的黏著劑失敗而分離,而不是透過在黏著劑主體中之內聚性失敗(其將遺留黏著劑殘渣於該基材上)而分離,黏著劑可被說成可釋離地接合至一基材或可被描述成一可離型黏著劑。
在一些實施例中,平坦化膠帶之基材具有不大於2百分比或不大於1百分比之霧度。在一些實施例中,可離型黏著劑層具有不大於2百分比或不大於1百分比之霧度。在一些實施例中,該觸控感測器膜具有一第一折射率(例如,觸控感測器膜之基材(諸如COP或玻璃)之折射率)且該可離型黏著劑層經選擇以具有類似於第一折射率的一第二折射率。例如,在一些實施例中,第一折射率與第二折射率之間之差之絕對值係不大於0.05或不大於0.02或不大於0.01。在一些實施例中,該可離型黏著劑層及該基材之折射率亦可係大約匹配(例如,在於不大於0.05、或不大於0.02、或不大於0.01的折射率差內)。已發現利用一低霧度基材、及/或利用一低霧度可離型黏著劑、及/或利用具有類似於該觸控感測器膜之折射率的一折射率之一可 離型黏著劑有助於檢驗一觸控感測器總成,該觸控感測器總成包括一蓋玻璃、一光學清透黏著劑層、透過該光學清透黏著劑層接合至該蓋玻璃的一觸控感測器膜、以及相鄰於該觸控感測器膜而與該蓋玻璃相對的一平坦化膠帶。
通常所欲的是該基材係足夠厚且硬以提供平坦化程序中需要之支持,但不能太厚且硬而使自觸控面板總成移除平坦化膠帶係困難的。在一些實施例中,該基材係至少250微米厚、或至少275微米厚、或至少300微米厚、或350微米厚。在一些實施例中,該基材具有不大於2mm或不大於1mm的厚度。在一些實施例中,該基材具有在0.5GPa至10GPa之範圍中的楊氏模數。除非其中不同地指明,不然楊氏模數係指在25℃判定的楊氏模數(一般表示成E)。在一些實施例中,該基材之楊氏模數係至少1GPa,或至少2GPa。在一些實施例中,該基材之楊氏模數係不大於8GPa,或不大於6GPa。在300微米至1mm之範圍中的厚度及在2GPa至6GPa之範圍中的楊氏模數,對於達成剛性及可彎曲性之所欲平衡已發現係特別有利的。
該基材可係來自可提供所欲之機械及光學性質的任何材料。合適使用於該基材中的聚合物包括聚碳酸酯、(甲基)丙烯酸、聚酯、聚二醚酮(PEEK)、聚醯胺、聚醯亞胺、聚苯乙烯、以及其摻合物或其共聚物。在一些實施例中,該基材包括聚酯。例如,在一些實施例中,該基材包括聚對苯二甲酸乙二酯(PET),且在一些實施例中,該基材包括聚對苯二甲酸乙二酯及二醇改質之PET(PETG)的共聚酯。 例如,使用一膜擠製程序可形成該基材。該基材可經可選地定向(例如,單軸地或雙軸地拉伸)以改良該基材之機械性質。例如,美國專利申請公開案第2011/0051040號(Johnson等人)中描述具有低霧度的有用之厚聚酯基材。
在一些實施例中,該可離型黏著劑層係一壓敏性黏著劑(PSA)層。壓敏性黏著劑組成物已為此所屬技術領域中具有通常知識者所熟知,其具備包括下列之性質:(1)膠黏性;(2)以不超過手指壓力來黏著;(3)足以固持在黏附體上之能力;以及(4)足以自黏附體乾淨地移除的充分內聚強度。已發現具良好壓敏性黏著劑作用的材料為經設計及配製以呈現必要黏彈性,產生膠黏性、剝離黏著性以及剪切保持力間之所欲平衡之聚合物。合適的PSA可基於交聯之(甲基)丙烯酸、橡膠、熱塑性彈性體、聚矽氧、聚胺甲酸酯、及類似者,且可包括增黏劑以提供所欲之膠黏性。在一些實施例中,該PSA係基於(甲基)丙烯酸PSA或至少一(甲基)丙烯酸酯,其中(甲基)丙烯酸酯係指丙烯酸酯及甲基丙烯酸酯基團兩者。例如,美國專利第4,726,982號(Traynor等人)中描述基於丙烯酸之壓敏性黏著劑。例如,美國專利第6,730,397號(Melancon等人)中描述基於聚矽氧之壓敏性黏著劑。例如,美國專利申請公開案第2005/0137375號(Hansen等人)中描述基於聚胺甲酸酯之壓敏性黏著劑。
在一些實施例中,該黏著劑層具有在0.1MPa至2MPa之範圍中的剪切儲存模數(一般表示成G'(G prime))。剪切儲存模數係指利用動力機械分析(DMA)在23℃及1Hz(除非不同地指明)而 判定的複數剪切模數之實數部分。在一些實施例中,該可離型黏著劑層具有不大於100微米、或不大於50微米、或不大於40微米、或不大於30微米的厚度。在一些實施例中,該可離型黏著劑層具有一至少1微米、或至少5微米、或至少10微米、或至少20微米的厚度。
在一些實施例中,該可離型黏著劑層係光學清透的。用語「光學清透(optically clear)」係指在至少一部分的可見光光譜(波長係自約400nm至約700nm)內具有高光透射率的黏著劑或物品,且其呈現低霧度。光學清透黏著劑及物品通常具有大於90百分比的可見光之透射率以及不大於5百分比、或不大於2百分比、或不大於1百分比的霧度值。在一些實施例中,該可離型黏著劑係光學清透壓敏性黏著劑。
在一些實施例中,該可離型黏著劑層係基於烯烴嵌段共聚物之黏著劑層、基於丙烯酸之壓敏性黏著劑、基於聚矽氧之壓敏性黏著劑、或基於聚胺甲酸酯之壓敏性黏著劑。在一些實施例中,該可離型黏著劑層包括不小於50重量百分比、或不小於60重量百分比、或不小於70重量百分比的烯烴嵌段共聚物。在一些實施例中,烯烴嵌段共聚物包括選自由苯乙烯、乙烯、丙烯、異戊二烯、辛烯、伸丁基、丁烯、及其共聚物所組成之群組的嵌段。在一些實施例中,烯烴嵌段共聚物具有一鏈架構,該鏈架構選自線性雙嵌段、線性三嵌段、支鏈雙嵌段、多嵌段、星型多嵌段、或支鏈多嵌段共聚物。在一些實施例中,基於烯烴嵌段共聚物之黏著劑層係一壓敏性黏著劑層,其可係光學清透壓敏性黏著劑層。例如,美國專利申請公開案第 2014/0335299號(Wang等人)中描述基於烯烴嵌段共聚物之壓敏性黏著劑。
在一些實施例中,該可離型黏著劑層係基於聚胺甲酸酯之黏著劑層。在一些實施例中,基於聚胺甲酸酯之黏著劑包含多元醇組分、聚異氰酸酯組分、及至少一官能性化合物之反應產物。
在一些實施例中,基於聚胺甲酸酯之可離型黏著劑包括包含至少兩個羥基末端基團的芳族及/或脂族(例如:聚酯、聚己內酯、聚碳酸酯)多元醇。當(例如:聚酯)多元醇具有平均2個羥基時,其特徵可為(例如:芳族聚酯)二醇。其他實施例中,(例如:芳族聚酯)多元醇之特徵可為(例如:芳族聚酯)三醇。在又其他實施例中,(例如:芳族聚酯)多元醇可包含二醇與三醇之混合物,其中羥基之數目平均大於2個,且小於3個。其他有用之多元醇具有4個、5個、或6個羥基末端基團。聚酯多元醇可例如:由多元醇組分與酸組分之間之酯化反應製得。酸組分實例包括琥珀酸、甲基琥珀酸、己二酸、庚二酸、壬二酸、癸二酸、1,12-十二碳烷二酸、1,14-十四碳烷二酸、二聚酸、2-甲基-1,4-環己烷二羧酸、2-乙基-1,4-環己烷二羧酸、對酞酸、異酞酸、酞酸、1,4-萘二羧酸、4,4’-聯苯二羧酸、及其酸酐。
在一些實施例中,基於聚胺甲酸酯之可離型黏著劑包括可包括各種多官能性異氰酸酯化合物的脂族聚異氰酸酯組分。此等多官能性異氰酸酯化合物之實例包括多官能性脂族異氰酸酯化合物及多官能性脂族環狀異氰酸酯化合物。
在一些實施例中,基於聚胺甲酸酯之可離型黏著劑包括多官能性脂族異氰酸酯化合物,其可包括二異氰酸三伸甲基酯、二異氰酸四伸甲基酯、二異氰酸六伸甲基酯、二異氰酸五伸甲基酯、二異氰酸1,2-伸丙基酯、二異氰酸1,3-伸丁基酯、二異氰酸十二伸甲基酯、與二異氰酸2,4,4-三甲基六亞甲基酯。
在一些實施例中,基於聚胺甲酸酯之可離型黏著劑包括多官能性脂族環狀異氰酸酯化合物,其可包括二異氰酸1,3-環戊烯酯、二異氰酸1,3-環己烷基酯、二異氰酸1,4-環己烷基酯、異佛爾酮二異氰酸酯、二異氰酸氫化二苯基甲烷基酯、二異氰酸氫化伸二甲苯基酯、二異氰酸氫化伸甲苯基酯、二異氰酸氫化四甲基二甲苯酯、及生質多官能性脂族環狀異氰酸酯,如:來自BASF Corporation,商品名稱為DDI 1410之2-庚基-3,4-雙(9-異氰醯基壬基)-1-戊基環己烷。
在一些實施例中,基於聚胺甲酸酯之可離型黏著劑包括多官能性脂族異氰酸酯化合物,其包含脂族環狀異氰酸酯化合物,如:異佛爾酮二異氰酸酯(IPDI)、六亞甲基二異氰酸酯、或其混合物。其他實施例中,多官能性脂族異氰酸酯化合物可與芳族異氰酸酯化合物(如:1,4-亞甲基二苯基二異氰酸酯(MDI)、二異氰酸間-四亞甲基酯(TMXDI)、或其混合物)混合。
在一些實施例中,基於聚胺甲酸酯之可離型黏著劑包括脂族聚酯多元醇(例如,己內酯區段)或具有環狀脂族聚異氰酸酯的脂族聚碳酸酯聚酯多元醇。在其他實施例中,基於聚胺甲酸酯之可離型黏著劑包括芳族聚酯或聚碳酸酯多元醇。
在一些實施例中,該可離型黏著劑係基於聚矽氧之壓敏性黏著劑。在一些實施例中,聚矽氧黏著劑包括至少50wt百分比(或更佳地至少70wt百分比,或最佳地至少85wt百分比)聚二有機矽氧烷。具有通式R1R2SiO(R2SiO)nSiR2R1及至少20,000之數量平均分子量之合適的聚二有機矽氧烷係可商購自諸如Gelest Inc.,Tullytown,Pa的來源。此處,R1及R2代表烴基。美國專利第5,082,706號(Tangney)中描述實例。對於具體較佳實施例,數量平均分子量係較佳地至少約50,000、更佳地至少約100,000、以及最佳地至少約250,000。
其他合適的聚二有機矽氧烷具有通式R1R2SiO(R2SiO)m(R1RSiO)nSiR2R1且小於20,000之數量平均分子量係可商購自諸如Gelest Inc的來源。較佳的材料具有約250至約10,000、更佳地約250至約5000、最佳地約250至約2000之烯基當量(選擇m及n之結果)。
具有在各分子中之平均至少2矽鍵結氫原子之一些合適的有機氫聚矽氧烷(organohydrogenpolysiloxane)係可商購自諸如Dow Coming,Midland,Mich及General Electric Silicones,Waterford,N.Y的來源。美國專利第5,082,706號(Tangney)中描述實例。
藉由額外固化化學製備此類聚矽氧黏著劑,且一般牽涉使用鉑或其他VIIIB族(亦即,8族、9族、及10族)金屬催化劑(一般為矽氫化催化劑),以影響聚矽氧黏著劑之固化。相較於經由凝結化學製備之聚矽氧黏著劑,額外固化聚矽氧黏著劑之所記述的優 點包括降低之黏度、較高固體含量、對於時間之穩定黏度、以及較低溫度固化。製備方法在例如美國專利第5,082,706號(Tangney)中描述。
在一些實施例中,該可離型黏著劑係基於丙烯酸之黏著劑。丙烯酸酯型黏著劑包括一或多個可聚合化丙烯酸單體。例如,美國專利第5,965,256號(Barrera)中描述此類丙烯酸黏著劑。一般而言,丙烯酸酯黏著劑係佔主要比例之含有自約4個至約14個碳原子的非三級醇之丙烯酸酯及佔次要部分之至少一個改質之極性丙烯酸型單體的共聚物。在本發明之多層膜之黏著劑中的有用之丙烯酸酯可包括,但不限於,n-丁基丙烯酸酯、丙烯酸己酯、丙烯酸庚酯、丙烯酸辛酯、異辛基丙烯酸酯、丙烯酸2-乙基己酯、異莰基丙烯酸酯、及其組合。較佳的丙烯酸酯包括異辛基丙烯酸酯、丙烯酸2-乙基己酯、異莰基丙烯酸酯、及其組合。改質之極性丙烯酸型單體可包括,但不限於,丙烯酸、甲基丙烯酸、丙烯醯胺、甲基丙烯醯胺、丙烯腈、甲基丙烯腈、N-乙烯基吡咯啶酮、N-經取代之丙烯醯胺諸如、羥烷基丙烯酸酯、馬來酸酐、伊康酸、及其組合。丙烯酸黏著劑可經交聯以增加內聚力及離型能力。
在一些實施例中,該可離型黏著劑層係能夠經交聯(例如,經由施加光化輻射或熱)或已經交聯。黏著劑可經交聯以改良黏著劑之機械性質(例如,剪切儲存模數)。在一些實施例中,該可離型黏著劑層包括交聯劑。該交聯劑可係具有大於2之官能度(其係與黏著劑混溶)的多官能丙烯酸酯。合適的交聯劑包括甘油丙氧基三丙 烯酸酯、季戊四醇四丙烯酸酯、季戊四醇三丙烯酸酯、三羥甲丙烷乙氧基三丙烯酸酯、及其烷氧基化衍生物。
在一些實施例中,該可離型黏著劑層包括光起始劑。合適於製備可離型黏著劑的光起始劑包括醯偶姻醚(例如,苯偶姻乙基醚、苯偶姻異丙基醚、茴香偶姻乙基醚、及茴香偶姻異丙基醚)、經取代醯偶姻醚(例如,α-羥甲基苯偶姻乙基醚)、米其勒酮(4,4'-雙[二甲胺基]二苯基酮)、及類似者。較佳的光起始劑係可以代號KB-1商購自Sartomer Company,Inc.,Exton,Pa的2,2-二甲氧基-2-苯基苯乙酮。合適的光起始劑包括彼等可以商品名IRGACURE購自BASF Corporation(Florham Park,NJ)。例如,光起始劑可係可以商品名IRGACURE 651購自BASF Corporation的2,2-二甲氧基-1,2-二苯基乙-1-酮(CAS第24650-42-8號)。如另一實例,光起始劑可係可以商品名IRGACURE 184購自BASF Corporation的1-羥基-環己基-苯基-酮(CAS第947-19-3號)。
雖然替代地可使用不利用增黏劑的黏著劑配方,但是該可離型黏著劑層可選地可包括足以提供暫時性接合但不足以提供永久接合之位準的增黏劑。在一些實施例中,該可離型黏著劑層包括1至30重量百分比、或5至25重量百分比、或10至20重量百分比的增黏劑。在一些實施例中,增黏劑可選自由C5烴、C9烴、脂族樹脂、芳族樹脂、萜、類萜(terpenoid)、萜酚樹脂、松香、松香酯、及其組合所組成之群組。已發現特別有利的是,包括不小於60重量百分比之烯烴嵌段共聚物、在10至20重量百分比之範圍中之增黏劑、及在10 至30微米之範圍中之厚度的黏著劑層提供對觸控感測器膜所欲程度的可離型接合。
可藉由(例如)擠製平坦化膠帶之基材並接著塗佈可離型黏著劑組成物至該基材上以形成可離型黏著劑層而製作平坦化膠帶。在一些實施例中,在塗佈可離型黏著劑前預處理該基材以改良該基材與該黏著劑層之間的黏著性。該預處理可包括電暈放電、電漿放電、火焰處理、電子束照射、UV照射、酸蝕刻、以及化學底漆處理之一或多者。此類預處理可與(或不與)反應性化學助黏劑(諸如羥乙基丙烯酸酯、或羥乙基丙烯酸甲酯、或其他反應性物種)或具有低或中分子量的底漆而執行。
圖1係平坦化膠帶100之示意性截面圖,其包括聚合基材110及接合至基材110的黏著劑層114。基材110具有介於250微米與5mm之間的厚度T或在本文中別處描述之其他範圍中。在一些實施例中,基材110具有不大於3百分比、或不大於2百分比、或甚至不大於1百分比之霧度。黏著劑層114具有介於5微米與100微米之間的厚度t或在本文中別處描述之其他範圍中。黏著劑層114經調適以可釋離地接合至玻璃及環烯烴聚合物膜之至少一者,且可描述成可離型黏著劑層。基材110及黏著劑層114可自在本文中別處描述之材料而製作且具有在本文中別處描述之機械性質。
圖2係觸控感測器總成201之示意性截面圖,觸控感測器總成包括蓋玻璃240、光學清透黏著劑層230、透過光學清透黏著劑層230接合至蓋玻璃240的觸控感測器膜220、以及相鄰於觸控感 測器膜220而與蓋玻璃240相對的平坦化膠帶200。平坦化膠帶200包括聚合基材210、及接合至基材210並可釋離地接合至觸控感測器膜220的可離型黏著劑層214。平坦化膠帶200可對應平坦化膠帶100。在一些實施例中,基材具有介於250微米與5mm之間的厚度或在本文中別處描述之其他範圍中、且可離型黏著劑層具有介於5微米與100微米之間的厚度或在本文中別處描述之其他範圍中。基材210及黏著劑層214可自在本文中別處描述之材料而製作且具有在本文中別處描述之機械性質。
觸控感測器膜220包括具有主要表面220的基材221,電極224設置於該主要表面上。在一些實施例中,電極224可自透明導體(諸如氧化銦錫(ITO))而形成,且在一些實施例中,電極224可自微絲(microwire)導體而形成。在一些實施例中,觸控感測器膜220包括第二電極層,該第二電極層自繪示在圖2中的電極224之該層間隔開。在一些實施例中,光學清透黏著劑層230覆蓋油墨梯級243且接合至蓋玻璃240、並類似地覆蓋電極224且接合至主要表面222。可離型黏著劑層214可釋離地接合至觸控感測器膜220。
圖3係顯示裝置302之示意性截面圖,顯示裝置包括蓋玻璃240、光學清透黏著劑層230、透過光學清透黏著劑層230接合至蓋玻璃240並透過光學清透黏著劑層374接合至顯示面板370的觸控感測器膜220。藉由提供觸控感測器總成201、自觸控感測器膜220移除平坦化膠帶200、並在顯示面板370上設置觸控感測器膜220而製作顯示裝置302。在繪示之實施例中,觸控感測器膜220係透過光 學清透黏著劑層374層壓至顯示面板370。在一些實施例中,顯示面板370係液晶顯示器(LCD)面板或有機發光二極體(OLED)顯示面板。該OLED顯示面板可係可撓性OLED顯示面板、折彎之OLED顯示面板、可折疊OLED顯示面板、及彎曲之OLED顯示面板之一或多者。在可撓性OLED顯示面板之情況中,蓋玻璃可係可撓性蓋玻璃諸如25微米之厚玻璃(可購自SCHOTT AF(Mainz,Germany)),或蓋玻璃可用替代的保護性層(諸如具有一可選的硬塗層之聚合物層)置換。
以下為本說明之例示性實施例的清單。
實施例1係一種觸控感測器總成,其包含:一蓋玻璃;一光學清透黏著劑層;一觸控感測器膜,其透過該光學清透黏著劑層接合至該蓋玻璃;一平坦化膠帶,其相鄰於該觸控感測器膜而與該蓋玻璃相對;其中該平坦化膠帶包含一聚合基材及接合至該基材並可釋離地接合至該觸控感測器膜的一可離型黏著劑層,該基材具有介於250微米與5mm之間的一厚度,該可離型黏著劑層具有介於5微米與100微米之間的一厚度。
實施例2係如實施例1之觸控感測器總成,其中該基材具有不大於3百分比之一霧度。
實施例3係如實施例1之觸控感測器總成,其中該基材具有不大於2百分比之一霧度。
實施例4係如實施例1之觸控感測器總成,其中該可離型黏著劑層包含1至30重量百分比的增黏劑。
實施例5係如實施例4之觸控感測器總成,其中該增黏劑係選自由C5烴、C9烴、脂族樹脂、芳族樹脂、萜、類萜、萜酚樹脂、松香、松香酯、及其組合所組成之群組。
實施例6係如實施例1之觸控感測器總成,其中該基材包含一聚酯。
實施例7係如實施例6之觸控感測器總成,其中該基材包含聚對苯二甲酸乙二酯。
實施例8係如實施例6之觸控感測器總成,其中該基材包含聚對苯二甲酸乙二酯(PET)及二醇-改質之PET(PETG)的共聚酯。
實施例9係如實施例1之觸控感測器總成,其中該基材之該厚度係至少275微米。
實施例10係如實施例1之觸控感測器總成,其中該基材之該厚度係至少300微米。
實施例11係如實施例1之觸控感測器總成,其中該基材具有在0.5GPa至10GPa之一範圍中的一楊氏模數。
實施例12係如實施例11之觸控感測器總成,其中該基材之楊氏模數係至少1GPa。
實施例13係如實施例11之觸控感測器總成,其中該基材之楊氏模數係至少2GPa。
實施例14係如實施例1之觸控感測器總成,其中該可離型黏著劑層之該厚度係不大於50微米。
實施例15係如實施例1之觸控感測器總成,其中該可離型黏著劑層之該厚度係不大於40微米。
實施例16係如實施例1之觸控感測器總成,其中該可離型黏著劑層之該厚度係不大於30微米。
實施例17係如實施例1之觸控感測器總成,其中該可離型黏著劑層包含不小於50重量百分比的烯烴嵌段共聚物。
實施例18係如實施例17之觸控感測器總成,其中該烯烴嵌段共聚物包含嵌段,該等嵌段係選自由苯乙烯、乙烯、丙烯、異戊二烯、辛烯、伸丁基、丁烯、及其共聚物所組成之群組。
實施例19係如實施例17之觸控感測器總成,其中該烯烴嵌段共聚物包含一鏈架構,該鏈架構係選自線性雙嵌段、線性三嵌段、支鏈雙嵌段、多嵌段、星型多嵌段、或支鏈多嵌段共聚物。
實施例20係如實施例1之觸控感測器總成,其中該可離型黏著劑層包含不小於60重量百分比的烯烴嵌段共聚物。
實施例21係如實施例1之觸控感測器總成,其中該可離型黏著劑層包含不小於70重量百分比的烯烴嵌段共聚物。
實施例22係如實施例1之觸控感測器總成,其中該可離型黏著劑層包含基於丙烯酸之壓敏性黏著劑。
實施例23係如實施例1之觸控感測器總成,其中該可離型黏著劑層包含基於聚矽氧之壓敏性黏著劑。
實施例24係如實施例1之觸控感測器總成,其中該可離型黏著劑層包含基於聚胺甲酸酯之壓敏性黏著劑。
實施例25係如實施例1之觸控感測器總成,其中該觸控感測器膜具有一第一折射率,該可離型黏著劑層具有一第二折射率,且該第一折射率與該第二折射率之間之差之一絕對值係不大於0.05。
實施例26係如實施例25之觸控感測器總成,其中該第一折射率與該第二折射率之間之差之該絕對值係不大於0.01。
實施例27係如實施例1之觸控感測器總成,其中可離型黏著劑層具有不大於1百分比之一霧度。
實施例28係如實施例1之觸控感測器總成,其中該可離型黏著劑層具有在0.1MPa至2MPa之一範圍中的剪切儲存模數。
實施例29係如實施例1之觸控感測器總成,其中該可離型黏著劑層包含交聯劑。
實施例30係如實施例1之觸控感測器總成,其中該可離型黏著劑層包含光起始劑。
實施例31係如實施例1之觸控感測器總成,其中該基材係一聚酯基材,該聚酯基材具有不大於3百分比之一霧度及在2GPa至6GPa之一範圍中的一楊氏模數,其中該基材之厚度係介於300微米與1mm之間,且其中該可離型黏著劑層包含不小於60重量百分比的烯烴嵌段共聚物及在10至20重量百分比之一範圍中之增黏 劑,且其中該可離型黏著劑層之該厚度係介於10微米與30微米之間。
實施例32係製作一顯示裝置之一種方法,其包含:提供如實施例1之觸控感測器總成;自該觸控感測器膜移除該平坦化膠帶;及將該觸控感測器膜設置在一顯示面板上。
實施例33係如實施例32之方法,其中該顯示面板係一OLED顯示面板。
實施例34係如實施例32之方法,其中該顯示面板係一LCD顯示面板。
實施例35係一平坦化膠帶,其包含一聚合基材及接合至該基材的一黏著劑層, 其中該基材具有介於250微米與5mm之間的一厚度,及不大於3百分比之一霧度, 其中該黏著劑層具有介於5微米與100微米之間的一厚度,且 其中該黏著劑層經調適以可釋離地接合至玻璃及環烯烴聚合物膜之至少一者。
實施例36係如實施例35之平坦化膠帶,其中該基材具有不大於2百分比之一霧度。
實施例37係如實施例35之平坦化膠帶,其中該黏著劑層包含1至30重量百分比的增黏劑。
實施例38係如實施例37之平坦化膠帶,其中該增黏劑係選自由C5烴、C9烴、脂族樹脂、芳族樹脂、萜、類萜、萜酚樹脂、松香、松香酯、及其組合所組成之群組。
實施例39係如實施例35之平坦化膠帶,其中該基材包含一聚酯。
實施例40係如實施例39之平坦化膠帶,其中該基材包含聚對苯二甲酸乙二酯。
實施例41係如實施例39之平坦化膠帶,其中該基材包含聚對苯二甲酸乙二酯(PET)及二醇-改質之PET(PETG)的共聚酯。
實施例42係如實施例35之平坦化膠帶,其中該基材之該厚度係至少275微米。
實施例43係如實施例35之平坦化膠帶,其中該基材之該厚度係至少300微米。
實施例44係如實施例35之平坦化膠帶,其中該基材具有在0.5GPa至10GPa之一範圍中的一楊氏模數。
實施例45係如實施例44之平坦化膠帶,其中該基材之楊氏模數係至少1GPa。
實施例46係如實施例44之平坦化膠帶,其中該基材之楊氏模數係至少2GPa。
實施例47係如實施例35之平坦化膠帶,其中該黏著劑層之該厚度係不大於50微米。
實施例48係如實施例35之平坦化膠帶,其中該黏著劑層之該厚度係不大於40微米。
實施例49係如實施例35之平坦化膠帶,其中該黏著劑層之該厚度係不大於30微米。
實施例50係如實施例35之平坦化膠帶,其中該黏著劑層具有不大於1百分比之一霧度。
實施例51係如實施例35之平坦化膠帶,其中該黏著劑層具有在0.1MPa至2MPa之範圍中的剪切儲存模數。
實施例52係如實施例35之平坦化膠帶,其中該黏著劑層包含不小於50重量百分比的烯烴嵌段共聚物。
實施例53係如實施例52之平坦化膠帶,其中該烯烴嵌段共聚物包含嵌段,該等嵌段係選自由苯乙烯、乙烯、丙烯、異戊二烯、辛烯、伸丁基、丁烯、及其共聚物所組成之群組。
實施例54係如實施例52之平坦化膠帶,其中該烯烴嵌段共聚物包含一鏈架構,該鏈架構係選自線性雙嵌段、線性三嵌段、支鏈雙嵌段、多嵌段、星型多嵌段、或支鏈多嵌段共聚物。
實施例55係如實施例52之平坦化膠帶,其中該黏著劑層包含不小於60重量百分比的烯烴嵌段共聚物。
實施例56係如實施例52之平坦化膠帶,其中該黏著劑層包含不小於70重量百分比的烯烴嵌段共聚物。
實施例57係如實施例35之平坦化膠帶,其中該黏著劑層包含基於丙烯酸之壓敏性黏著劑。
實施例58係如實施例35之平坦化膠帶,其中該黏著劑層包含基於聚矽氧壓敏性黏著劑。
實施例59係如實施例35之平坦化膠帶,其中該可離型黏著劑層包含基於聚胺甲酸酯之壓敏性黏著劑。
實施例60係如實施例35之平坦化膠帶,其中該黏著劑層包含交聯劑。
實施例61係如實施例35之平坦化膠帶,其中該黏著劑層包含光起始劑。
實施例62係如實施例35之平坦化膠帶,其中該基材係一聚酯基材,該聚酯基材具有在2GPa至6GPa之一範圍中的一楊氏模數,其中該基材之該厚度係介於300微米與1mm之間,且其中該黏著劑層包含不小於60重量百分比的烯烴嵌段共聚物及在10至20重量百分比之一範圍中之增黏劑,且其中該黏著劑層之該厚度係介於10微米與30微米之間。
實施例63係如實施例62之平坦化膠帶,其中該基材之該霧度係不大於2百分比且該黏著劑層具有不大於1百分比之一霧度。
實施例64係製作一顯示裝置之一種方法,其包含:
提供一觸控感測器總成,其包含可釋離地接合至如實施例35之平坦化膠帶的一觸控感測器膜; 自該觸控感測器膜移除該平坦化膠帶;及 將該觸控感測器膜設置在一顯示面板上。
實施例65係如實施例64之方法,其中該顯示面板係一OLED顯示面板。
實施例66係如實施例64之方法,其中該顯示面板係一LCD顯示面板。
PET:聚對苯二甲酸乙二酯(PET)係以粒狀形式得自Nan Ya Plastics Corporation(Taipei,Taiwan)並指定產品等級1N502。
PETg:二醇改質之聚對苯二甲酸乙二酯聚酯(PETg)係得自Eastman Chemical Company(Kingsport,TN)並指定產品等級EASTAR GN071共聚酯。
KRATON D1161:苯乙烯-異戊二烯-苯乙烯崁段共聚物係可商購自且得自Kraton Performance Polymers LLC(Houton,TX)。
TMPTA:三羥甲丙烷三丙烯酸酯可商購自且得自Arkema(Colombes,France)並指定產品等級SR351H。
RE100L:松香酯增黏劑可商購自且得自Arizona Chemical,a Division of Kraton Corp.(Jackonville,FL)並指定商品名稱SYLVALITE RE 100L。
IRGACURE 651:原名為CIBA IRGACURE 651且被認為基本上由2,2-二甲氧基-1,2-二苯基乙-1-酮組成的光起始劑,可商購自BASF Schweiz AG(Basel,Switzerland)。
COP:環烯烴聚合物(COP)係以膜形式得自Zeon Corporation(Tokyo,Japan)並指定產品等級ZEONORFILM ZF-16。
除了任何下列描述之不同處,使用類似於ASTM D882(針對薄塑膠片之拉伸性質的標準測試方法)的測試方法在INSTRON Tensile Tester Model 5500R(Norwood,MA,USA)測試膜。在50.8mm之測試間距及4.23mm/s之拉引速度的情況下拉伸25.4mm寬之膜樣本。楊氏模數及拉伸強度係得自應力應變曲線。在25℃及65%之相對濕度的氛圍中執行該量測。
根據ASTM D1003-61,使用霧度測量裝置(可以商品名稱「HAZEGARD PLUS」(BYK Gardner目錄第4725號)購自BYK Gardner)測量霧度。
用85℃及150℃之設定溫度,使用能夠維持目標溫度在2℃內的對流爐,在該對流爐中測試收縮率。使用2.54cm寬及30cm長之樣本條帶。在膜上畫出相隔25.4cm之兩個標記以界定起始長度 (L0)。樣本經懸掛在爐中達15分鐘。測量兩個標記之間之最終長度(Lt)。如下計算收縮率:
藉由溶劑澆注黏著劑於一離型襯墊上約25微米之厚度,隨後乾燥並固化而製備黏著劑樣本。接著針對各配方切割經製備之黏著劑成尺寸為25.4mm×50mm之測試條帶。針對各實例製備兩個重複物。自離型襯墊移除黏著劑,接著沿著目標基材表面之長度黏附兩個曝露之黏著劑表面之一者,且黏附另一曝露之表面至經塗50微米底漆之PET膜(可以等級MELINEX 329-200商購自DuPont Teijin Films)之25.4mm×127mm表面。使用三種基材:不鏽鋼、玻璃、以及COP。使用2.0kg橡膠輥將最終總成向下輥壓5次。在施加膠帶之前,先使用拭紙以丙酮擦一次,接著以庚烷擦三次來清潔該基材。在50%之相對濕度(RH)與室溫(RT)下調節72hr後,使用裝備有1000N荷重單元之拉伸測試機(MTS INSIGHT,可購自MTS Systems Corporation,Eden Prairie,MN),以固持在底部固定器中之測試樣品與在頂部固定器中之尾部呈180°之角度,使用300mm/min之十字頭速度,評估剝離黏著力強度。以克/25mm報告兩個測試樣品之平均值。
除了任何下列描述之不同處,根據ASTMD3654/D3654M-06判定黏著劑之靜態剪切強度。使用設定在23℃之爐內的500克負載。藉由層壓一片2.5cm×2.5cm之黏著劑膠帶於不鏽鋼(SS)面板與經塗50微米底漆之PET膜(可以等級MELINEX 329-200商購自DuPont Teijin Films)之間而製備測試樣品。記錄失敗的時間,亦即重量自該面板上拉開黏著劑的時間(以分鐘表示)。若在10,000分鐘後仍未觀察到失敗,則停止試驗並記錄10,000分鐘之數值。
除了任何下列描述之不同處,根據ASTM D 3616-95判定凝膠流份。自黏著劑膠帶切割含有大約0.08g之該膠帶的測試樣品並置放在120篩目不鏽鋼籃(測量大約5cm×10cm)內。該含量之重量為0.1mg且浸泡於含有足夠量的四氫呋喃之金屬盤中以覆蓋該樣品。在萃取達大約24小時之後,取出籃袋(含有剩餘樣品),然後置放於真空下以移除殘餘溶劑。將籃袋秤重,然後以下列方式判定凝膠含量:
測量至少兩個樣品的凝膠含量,並且所記述之值代表樣品之平均。
在熔融擠製線上使用一個雙螺桿擠製機。將該擠製機連接至一膜模。該擠製機具有兩個樹脂給料器。一個給料器以400kg/hr傳遞PETg樹脂。其他給料器以1600kg/hr傳遞PET樹脂。設定熔融線溫度在274℃並設定螺桿速度在300rpm。PET及PETg因此混合、熔融、且泵打至該膜模。來自該膜模的單層熔體經澆注至冷卻輥上,並調整線速度以控制鑄型厚度。接著輸送該鑄型膜通過一長度定向器並接著通過一拉幅拉伸機,以各別在機器方向及橫向方向上拉伸該膜。延伸比在長度定向器中的機器方向上係3.5且在拉幅機中的橫向方向上係3.7。設定拉伸溫度為95℃,且拉伸率係約50%/秒。熱固係以設定在225℃之溫度的拉幅機中持續約15秒完成。調整整體鑄型速度,使得最終膜厚度係355微米。
所得之膜基材具有3GPa之楊氏模數、0.5%之霧度、385lbf之拉伸強度、在85℃/15min的情況下0.25%(MD)及0.15%(TD)之收縮率、以及在150℃/15min的情況下1.7%(MD)及0.5%(TD)之收縮率。
藉由以固體含量約15%至19%將個別原料溶解在MEK溶劑中,並混合達48hrs直到得到一均質溶液來製作塗佈溶液。
接著使用邁耶棒塗佈技術將該溶液塗佈至來自實例1的355微米清透基材上。接著在80℃之爐中乾燥該塗佈之樣品達約15min。藉由選擇妥適的邁耶棒大小而控制最終經乾燥之厚度至25微米左右。接著使用裝備有UVA劑量約2000MJ/cm2強度之「D」燈泡的工作台FUSION UV單元(Heraeus,Gaithersberg,MD)固化該乾燥之樣本。
實例2至實例7之接合層組成物係歸納在表1中。在實例2至實例7之樣品上執行測試,並將結果記述在表2中。在實例2至實例7之各者中,各別記錄在23℃與500克之負載的靜態剪切及剪切潛變為10,000min及0mm。在實例2至實例7之各者中,該平坦化膠帶能夠自一COP表面乾淨地移除。
在此實例中,使用蓋玻璃、光學清透黏著劑(OCA)、及觸控感測器之預組裝堆疊。該預組裝堆疊亦具有附接於該觸控感測器側上的保護性預遮罩膜。接著在環境溫度、約0.5Mpa壓力下,層壓實例2之平坦化膠帶至該保護性預遮罩膜表面達約30秒。接著允許所得之層壓體不受干擾地站立在室溫下達約30分鐘。歸因於PT基材之硬表面,平坦化膠帶在壓力下適當地黏附在預遮罩膜上並平坦化該堆疊。在30分鐘停留時間之後,藉由和緩地將其剝離該預遮罩表面以移除該平坦化膠帶。無殘餘黏著劑遺留在該預遮罩表面上。
在此實例中,使用蓋玻璃、OCA、及觸控感測器之預組裝堆疊。該預組裝堆疊亦具有附接於該觸控感測器側上的保護性預遮罩膜。首先自該堆疊移除保護性預遮罩膜以曝露該觸控感測器表面。接著在環境溫度、約0.5Mpa壓力下,層壓實例2之平坦化膠帶至該觸控感測器表面達約30秒。接著允許所得之層壓體不受干擾地站立在室溫下達約30分鐘。歸因於平坦化膠帶基材之硬表面,平坦化膠帶在壓力下適當地黏附在觸控感測器膜表面上並平坦化該堆疊。在30分鐘停留時間之後,藉由和緩地將其剝離該觸控感測器膜表面以移除該平坦化膠帶。無殘餘黏著劑遺留在該觸控感測器表面上。
在此實例中,使用蓋玻璃、OCA、及觸控感測器之預組裝堆疊。該預組裝堆疊亦具有附接於該觸控感測器側上的保護性預遮罩膜。首先自該堆疊移除保護性預遮罩膜以曝露該觸控感測器表面。層壓結構之平坦化膠帶,該層壓結構包括實例1之該基材、光學清透黏著劑(可商購自3M Company,St.Paul,MN的3M OCA 8171)、及PU黏著劑塗佈之膠帶(可商購自3M Company的3M 87332膠帶)。該OCA 8171經定位於實例1之基材與該87332膠帶之間。該層壓之平坦化膠帶之整體厚度係440微米。接著在環境溫度、約0.5Mpa壓力下,將該層壓之平坦化膠帶之該PU黏著劑側層壓至該觸控感測器表面達約30秒。接著允許所得之層壓體不受干擾地站立在室溫下達約30分鐘。歸因於平坦化膠帶基材之硬表面,平坦化膠帶在壓力下適當地黏附在觸控感測器膜表面上並平坦化該堆疊。在30分鐘停留時間之後,藉由和緩地將其剝離該觸控感測器膜表面以移除該平坦化膠帶。無殘餘黏著劑遺留在該觸控感測器表面上。
在此實例中,使用蓋玻璃、OCA、及觸控感測器之預組裝堆疊。該預組裝堆疊亦具有附接於該觸控感測器側上的保護性預遮罩膜。首先自該堆疊移除保護性預遮罩膜以曝露該觸控感測器表面。層壓結構之平坦化膠帶,該層壓之結構包括實例1之該基材、光學清 透黏著劑(可商購自3M Company的3M OCA 8171)、及聚矽氧黏著劑塗佈之膠帶(可商購自3M Company的3M 87250膠帶)。該OCA 8171經定位於實例1之基材與該87250膠帶之間。該層壓之平坦化膠帶之整體厚度係大約440微米。接著在環境溫度、約0.5Mpa壓力下,將該層壓之平坦化膠帶之該聚矽氧黏著劑側層壓至該觸控感測器表面達約30秒。接著允許所得之層壓體不受干擾地站立在室溫下達約30分鐘。歸因於平坦化膠帶基材之硬表面,平坦化膠帶在壓力下適當地黏附在觸控感測器膜表面上並平坦化該堆疊。在30分鐘停留時間之後,藉由和緩地將其剝離該觸控感測器膜表面以移除該平坦化膠帶。無殘餘黏著劑遺留在該觸控感測器表面上。
除非另有所指,對圖式中元件之描述應理解成同樣適用於其他圖式中相對應的元件。雖在本文中是以具體實施例進行說明及描述,但所屬技術領域中具有通常知識者將瞭解可以各種替代及/或均等實施方案來替換所示及所描述的具體實施例,而不偏離本揭露的範疇。本申請案意欲涵括本文所討論之特定具體實施例的任何調適形式或變化形式。因此,本揭露意圖僅受限於申請專利範圍及其均等者。
Claims (17)
- 一種觸控感測器總成,其包含:一蓋玻璃;一光學清透黏著劑層;一觸控感測器膜,其透過該光學清透黏著劑層接合至該蓋玻璃;一平坦化膠帶,其相鄰於該觸控感測器膜而與該蓋玻璃相對;其中該平坦化膠帶包含一聚合基材及接合至該基材並可釋離地接合至該觸控感測器膜的一可離型黏著劑層,該基材具有介於250微米與5mm之間的一厚度,該可離型黏著劑層具有介於5微米與100微米之間的一厚度。
- 如請求項1之觸控感測器總成,其中該基材具有不大於3百分比之一霧度。
- 如請求項1之觸控感測器總成,其中該可離型黏著劑層包含1至30重量百分比的增黏劑。
- 如請求項3之觸控感測器總成,其中該增黏劑係選自由C5烴、C9烴、脂族樹脂、芳族樹脂、萜、類萜(terpenoid)、萜酚樹脂、松香、松香酯、及其組合所組成之群組。
- 如請求項1之觸控感測器總成,其中該基材之該厚度係至少275微米。
- 如請求項1之觸控感測器總成,其中該基材具有在0.5GPa至10GPa之一範圍中的一楊氏模數。
- 如請求項1之觸控感測器總成,其中該可離型黏著劑層包含不小於50重量百分比的烯烴嵌段共聚物。
- 如請求項1之觸控感測器總成,其中該觸控感測器膜具有一第一折射率,該可離型黏著劑層具有一第二折射率,且該第一折射率與該第二折射率之間之一差之一絕對值係不大於0.05。
- 如請求項1之觸控感測器總成,其中該基材係一聚酯基材,該聚酯基材具有不大於3百分比之一霧度及在2GPa至6GPa之一範圍中的一楊氏模數,其中該基材之該厚度係介於300微米與1mm之間,且其中該可離型黏著劑層包含不小於60重量百分比的烯烴嵌段共聚物及在10至20重量百分比之一範圍中之增黏劑,且其中該可離型黏著劑層之該厚度係介於10微米與30微米之間。
- 一種製作一顯示裝置之方法,其包含:提供如請求項1之觸控感測器總成;自該觸控感測器膜移除該平坦化膠帶;及將該觸控感測器膜設置在一顯示面板上。
- 一種平坦化膠帶,其包含一聚合基材及接合至該基材的一黏著劑層,其中該基材具有介於250微米與5mm之間的一厚度,及不大於3百分比之一霧度, 其中該黏著劑層具有介於5微米與100微米之間的一厚度,且其中該黏著劑層經調適以可釋離地接合至玻璃及環烯烴聚合物膜之至少一者。
- 如請求項11之平坦化膠帶,其中該基材之該霧度係不大於2百分比。
- 如請求項11之平坦化膠帶,其中該黏著劑層包含1至30重量百分比的增黏劑。
- 如請求項13之平坦化膠帶,其中該增黏劑係選自由C5烴、C9烴、脂族樹脂、芳族樹脂、萜、類萜、萜酚樹脂、松香、松香酯、及其組合所組成之群組。
- 如請求項11之平坦化膠帶,其中該基材係一聚酯基材,該聚酯基材具有在2GPa至6GPa之一範圍中的一楊氏模數,其中該基材之該厚度係介於300微米與1mm之間,且其中該黏著劑層包含不小於60重量百分比的烯烴嵌段共聚物及在10至20重量百分比之一範圍中之增黏劑,且其中該黏著劑層之該厚度係介於10微米與30微米之間。
- 如請求項15之平坦化膠帶,其中該基材之該霧度係不大於2百分比且該黏著劑層具有不大於1百分比之一霧度。
- 一種製作一顯示裝置之方法,其包含:提供一觸控感測器總成,其包含可釋離地接合至如請求項11之平坦化膠帶的一觸控感測器膜; 自該觸控感測器膜移除該平坦化膠帶;及將該觸控感測器膜設置在一顯示面板上。
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