TW201823481A - Copper alloy powder, method of producing additively-manufactured article, and additively-manufactured article - Google Patents
Copper alloy powder, method of producing additively-manufactured article, and additively-manufactured article Download PDFInfo
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/25—Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
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- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
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- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
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Abstract
Description
本發明係關於一種銅合金粉末、積層造形物之製造方法及積層造形物。The present invention relates to a copper alloy powder, a method for producing a laminate, and a laminate.
日本專利特開2011-21218號公報揭示一種以金屬粉末為對象之雷射積層造形裝置(亦稱為「3D印表機」)。Japanese Laid-Open Patent Publication No. 2011-21218 discloses a laser laminate forming device (also referred to as a "3D printer") for metal powder.
作為金屬製品之加工技術,以金屬粉末為對象之積層造形法備受矚目。根據積層造形法,能夠實現藉由切削加工無法實現之複雜形狀之創製。迄今為止報告有基於鐵合金粉末、鋁合金粉末、鈦合金粉末等之積層造形物之製造例。即,報告有包含鐵合金、鋁合金或鈦合金等之積層造形物。然而,無包含銅合金之積層造形物之報告。 本發明之目的在於提供一種包含銅合金之積層造形物。 〔1〕銅合金粉末係積層造形用之銅合金粉末。銅合金粉末含有多於1.00質量%且2.80質量%以下之鉻、及其餘部分之銅。 〔2〕銅合金粉末亦可含有多於1.05質量%且2.80質量%以下之鉻。 〔3〕銅合金粉末亦可含有多於1.00質量%且2.00質量%以下之鉻。 〔4〕銅合金粉末亦可含有多於1.05質量%且2.00質量%以下之鉻。 〔5〕積層造形物之製造方法包括以下之第1步驟及第2步驟。 第1步驟;準備上述〔1〕至〔4〕中任一項之銅合金粉末。 第2步驟;利用銅合金粉末製造積層造形物。 積層造形物係藉由如下步驟製造:依序重複(i)形成包含銅合金粉末之粉末層、及(ii)藉由於粉末層使特定位置之銅合金粉末固化而形成造形層,且對造形層進行積層。 〔6〕積層造形物之製造方法亦可進而包括對積層造形物進行熱處理之第3步驟。 〔7〕於第3步驟中,亦可利用300℃以上之溫度對積層造形物進行熱處理。 〔8〕於第3步驟中,亦可利用400℃以上之溫度對積層造形物進行熱處理。 〔9〕於第3步驟中,亦可利用700℃以下之溫度對積層造形物進行熱處理。〔10〕於第3步驟中,亦可利用600℃以下之溫度對積層造形物進行熱處理。 〔11〕積層造形物係包含銅合金之積層造形物。積層造形物含有多於1.00質量%且2.80質量%以下之鉻、及其餘部分之銅。積層造形物相對於銅合金之理論密度具有96%以上且100%以下之相對密度,且具有10%IACS以上之導電率。 〔12〕積層造形物亦可含有多於1.05質量%且2.80質量%以下之鉻。 〔13〕積層造形物亦可含有多於1.00質量%且2.00質量%以下之鉻。 〔14〕積層造形物亦可含有多於1.05質量%且2.00質量%以下之鉻。 〔15〕積層造形物亦可具有30%IACS以上之導電率。 〔16〕積層造形物亦可具有50%IACS以上之導電率。 〔17〕積層造形物亦可具有70%IACS以上之導電率。 本發明之上述及其他目的、特徵、態樣及優點根據聯繫隨附圖式而理解之本發明相關之如下詳細說明可明確。As a processing technology for metal products, a laminate method for metal powder has attracted attention. According to the laminated method, it is possible to realize the creation of a complicated shape that cannot be realized by cutting. A manufacturing example based on a laminate of a ferroalloy powder, an aluminum alloy powder, a titanium alloy powder, or the like has been reported so far. That is, a laminate including a ferroalloy, an aluminum alloy, or a titanium alloy is reported. However, there are no reports of laminates containing copper alloys. It is an object of the present invention to provide a laminate comprising a copper alloy. [1] A copper alloy powder for forming a copper alloy powder. The copper alloy powder contains more than 1.00% by mass and 2.80% by mass or less of chromium, and the balance of copper. [2] The copper alloy powder may contain more than 1.05 mass% and 2.80 mass% or less of chromium. [3] The copper alloy powder may contain more than 1.00% by mass and 2.00% by mass or less of chromium. [4] The copper alloy powder may further contain more than 1.05 mass% and 2.00 mass% or less of chromium. [5] The manufacturing method of the laminated product includes the following first step and second step. The first step; the copper alloy powder according to any one of the above [1] to [4]. The second step; manufacturing a laminate product using copper alloy powder. The laminate is produced by sequentially repeating (i) forming a powder layer containing a copper alloy powder, and (ii) forming a shaped layer by solidifying a copper alloy powder at a specific position due to the powder layer, and forming a layer Carry out the layering. [6] The method for producing a laminate may further include a third step of heat-treating the laminate. [7] In the third step, the laminate may be heat-treated at a temperature of 300 ° C or higher. [8] In the third step, the laminate may be heat-treated at a temperature of 400 ° C or higher. [9] In the third step, the laminate may be heat-treated at a temperature of 700 ° C or lower. [10] In the third step, the laminate may be heat-treated at a temperature of 600 ° C or lower. [11] The build-up material comprises a laminate of a copper alloy. The laminate product contains more than 1.00% by mass and 2.80% by mass or less of chromium, and the rest of the copper. The laminate has a relative density of 96% or more and 100% or less with respect to the theoretical density of the copper alloy, and has a conductivity of 10% IACS or more. [12] The laminate may also contain more than 1.05 mass% and 2.80 mass% or less of chromium. [13] The laminate may also contain more than 1.00% by mass and 2.00% by mass or less of chromium. [14] The laminate may also contain more than 1.05 mass% and 2.00 mass% or less of chromium. [15] The laminate may also have a conductivity of 30% IACS or more. [16] The laminate may also have a conductivity of 50% IACS or more. [17] The laminate may also have a conductivity of 70% IACS or more. The above and other objects, features, aspects and advantages of the present invention will become apparent from
以下說明本發明之一實施形態(以下記為「本實施形態」)。但以下之說明並不限定本發明之發明範圍。 首先說明發現本實施形態之經過。 於需要機械強度及較高之導電率之機械零件中較多用銅。作為包含銅之機械零件,例如可列舉焊接槍、配電設備之零件等。 首先,研究人員研究了藉由純銅粉末製造積層造形物。然而,藉由純銅粉末無法獲得所需之積層造形物。具體而言,藉由純銅粉末製造之積層造形物具有大量之空隙,相對於緻密之熔製材密度大幅度降低。密度之降低意指機械強度(例如拉伸強度等)之降低。進而相對於緻密之熔製材導電率亦大幅度降低。為了改善密度及導電率,研究人員對各種製造條件進行了研究。然而,無論於任一製造條件下,加工物性均不穩定,難以實現密度及導電率之改善。 因此研究人員對銅合金粉末進行了研究。其結果發現藉由使用特定組成之銅合金粉末,可製造具有實用密度及導電率之積層造形物;進而藉由利用特定溫度以上對積層造形物進行熱處理可顯著地提高積層造形物之機械強度及導電率。以下詳細地說明本實施形態。 <銅合金粉末> 本實施形態之銅合金粉末相當於二維印表機之碳粉或油墨。於本實施形態中,只要可準備下述特定組成之銅合金粉末,則其製造方法無特別限定。 銅合金粉末例如可藉由氣體霧化法或水霧化法而製造。例如,首先製備銅合金之熔液。將熔液放入餵槽中。自餵槽滴加熔液。使滴加中之熔液與高壓氣體或高壓水接觸。藉此,熔液急冷、凝固,從而形成銅合金粉末。此外,亦可藉由電漿霧化法、離心力霧化法等製造銅合金粉末。 於本實施形態中,使用特定組成之銅合金粉末。即銅合金粉末係含有多於1.00質量%且2.80質量%以下之鉻(Cr)、及其餘部分之銅(Cu)之銅合金之粉末。其餘部分中除Cu以外,亦可含有雜質元素。雜質元素例如亦可為於銅合金粉末之製造時刻意地添加之元素(記為以下「添加元素」)。即,其餘部分亦可包含Cu及添加元素。作為添加元素,例如可列舉鎳(Ni)、鋅(Zn)、錫(Sn)、銀(Ag)、鈹(Be)、鋯(Zr)、鋁(Al)、矽(Si)、鈷(Co)、鈦(Ti)、鎂(Mg)、碲(Te)等。雜質元素例如亦可為於銅合金粉末之製造時不可避免地混入之元素(以下記為「不可避免雜質元素」)。即,其餘部分亦可包含Cu及不可避免雜質元素。作為不可避免雜質元素,例如可列舉氧(O)、磷(P)、鐵(Fe)等。其餘部分亦可包含Cu、添加元素及不可避免雜質元素。銅合金粉末例如亦可合計含有未達0.30質量%之添加元素及不可避免雜質元素。例如銅合金粉末之氧含量可藉由依據「JIS H 1067:銅中之氧定量方法」之方法而測定。 銅合金粉末之Cr含量藉由依據「JIS H 1071:銅及銅合金中之鉻定量方法」之ICP(Inductively Coupled Plasma,感應耦合電漿)發光分析法而測定。Cr含量至少測定3次。採用至少3次之平均值作為Cr含量。Cr含量可為1.01質量%以上,或亦可為多於1.05質量%,或亦可為1.10質量%以上,或亦可為1.20質量%以上,或亦可為1.22質量%以上,或亦可為1.78質量%以上。Cr含量亦可為2.70質量%以下,或亦可為2.60質量%以下,或亦可為2.30質量%以下,或亦可為2.00質量%以下,或亦可為1.90質量%以下,或亦可為1.80質量%以下,或亦可為1.78質量%以下,或亦可為1.46質量%以下。 銅合金粉末之Cu含量可藉由依據「JIS H 1051:銅及銅合金中之銅定量方法」之方法而測定。Cu含量至少測定3次。採用至少3次之平均值作為Cu含量。Cu含量例如亦可為高於97.9質量%且未達99.0質量%。 銅合金粉末例如亦可具有1~200 μm之平均粒徑。「平均粒徑」表示於藉由雷射繞射散射法而測定之體積基準之粒度分佈中自微粒側累積50%之粒徑。以下平均粒徑亦可記為「d50」。d50例如可藉由氣體霧化時之氣體壓力、分級等而調整。d50亦可根據積層造形物之積層間距而調整。d50例如可為5~50 μm,或亦可為50~100 μm,或亦可為100~200 μm。粒子形狀並無特別限定。粒子可為大致球狀,或亦可為不規則形狀。 <積層造形物之製造方法> 圖1係表示本實施形態之積層造形物之製造方法之概略之流程圖。本實施形態之製造方法包括第1步驟(S100)及第2步驟(S200)。本實施形態之製造方法亦可進而於第2步驟(S200)之後包括第3步驟(S300)。以下依序說明各步驟。 《第1步驟(S100)》 於第1步驟(S100)中,準備上述銅合金粉末。 《第2步驟(S200)》 於第2步驟(S200)中,利用銅合金粉末製造積層造形物。 此處說明粉末床熔融結合法。其中亦可使用除粉末床熔融結合法以外之附加製造法。例如亦可使用定向性能量沈積法等。於造形中亦可實施切削加工。 此處說明藉由雷射使銅合金粉末固化之態樣。其中雷射僅為一例,只要可使銅合金粉末固化,則固化機構不限定於雷射。例如亦可使用電子束、電漿等。 (資料處理(S201)) 首先藉由3D-CAD等製成三維形狀資料。 三維形狀資料例如亦可轉換為STL資料。圖2係STL資料之一例。於STL資料中,例如可實施利用有限元素法進行之元素分割(所謂「網目化」)。 根據STL資料製成切片資料。圖3係切片資料之一例。STL資料分割為n層。即STL資料分割為第1造形層p1、第2造形層p2、・・・、第n造形層pn。各層之厚度(切片厚度d)例如為10~150 μm即可。 (粉末層之形成(S202)) 形成包含銅合金粉末之粉末層。 圖4係圖解積層造形物之製造過程之第1概略圖。雷射積層造形裝置100具備活塞101、台102、及雷射輸出部103。台102由活塞101支持。活塞101以可升降台102之方式構成。於台102上對積層造形物進行造形。 粉末層之形成(S202)及下述造形層之形成(S203)例如亦可於惰性氣體氛圍中實施。用於抑制積層造形物之氧化。惰性氣體例如亦可為氬氣(Ar)、氮氣(N2
)、氦氣(He)等。亦可使用還原性氣體氛圍代替惰性氣體氛圍。還原性氣體例如為氫氣(H2
)等。進而亦可使用減壓氛圍代替惰性氣體氛圍。 基於切片資料,活塞101使台102降下1層份。於台102上鋪滿1層份之銅合金粉末。藉此,形成包含銅合金粉末之第1粉末層1。例如亦可藉由壓實刮刀(未圖示)等使第1粉末層1之表面平滑化。第1粉末層1亦可實質上僅由銅合金粉末形成。第1粉末層1除銅合金粉末外亦可包含雷射吸收材(例如樹脂粉末等)。 (造形層之形成(S203)) 繼而形成造形層。 造形層構成積層造形物之一部分。圖5係圖解積層造形物之製造過程之第2概略圖。雷射輸出部103基於切片資料向第1粉末層1之特定位置照射雷射光。亦可於雷射光之照射之前預先對第1粉末層1進行加熱。受到雷射光之照射之銅合金粉末經過熔融或燒結而固化。藉此形成第1造形層p1。即,藉由於粉末層中使特定位置之銅合金粉末固化而形成造形層。 雷射輸出部103可為通用之雷射裝置。雷射光之光源例如可為光纖雷射、YAG(Yttrium Aluminum Garnet,釔鋁石榴石)雷射、CO2
雷射、半導體雷射、綠光雷射等。雷射光之輸出例如可為20~1000 W,或亦可為200~500W。雷射光之掃描速度例如可於50~2000 mm/s之範圍內進行調整。 雷射光之能量密度可於10~2000 J/mm3
之範圍內進行調整。能量密度藉由下述式(I): E=P÷(v×s×d)・・・(I) 算出。式(I)中,「E」表示雷射光之能量密度[單位:J/mm3
]。「P」表示雷射之輸出[單位:W]。「v」表示掃描速度[單位:mm/s]。「s」表示掃描寬度[單位:mm]。「d」表示切片厚度[單位:mm]。 圖6係圖解積層造形物之製造過程之第3概略圖。形成第1造形層p1後,活塞101使台102降下1層份。藉由與上述相同之順序形成第2粉末層2,繼而形成第2造形層p2。其後,藉由依序重複粉末層之形成(202)及造形層之形成(203)並對造形層進行積層而製造積層造形物。 圖7係圖解積層造形物之製造過程之第4概略圖。最終藉由對第n造形層pn進行積層而完成積層造形物10。於本實施形態中,因使用特定組成之銅合金粉末,故而積層造形物10可具有較高之相對密度。 《第3步驟(S300)》 本實施形態之製造方法亦可進而包括對積層造形物進行熱處理之第3步驟(S300)。藉此,可期待積層造形物之機械強度(例如拉伸強度、維氏硬度等)、以及積層造形物之導電率飛躍性地提高。 於本實施形態中,可使用一般之熱處理爐。熱處理溫度藉由熱處理爐附帶之溫度感測器測定。例如,若熱處理爐之設定溫度為300℃,則視作利用300℃對積層造形物進行熱處理。 積層造形物例如可接受1分鐘以上且10小時以下之熱處理,或亦可接受10分鐘以上且5小時以下之熱處理,或亦可接受30分鐘以上且3小時以下之熱處理,或亦可接受1小時以上且2小時以下之熱處理。熱處理之氛圍例如可為大氣、氮氣、氬氣、氫氣、真空等。 於第3步驟中,可利用300℃以上之溫度對積層造形物進行熱處理,或亦可利用400℃以上之溫度進行熱處理,或亦可利用450℃以上之溫度進行熱處理。藉此可期待機械強度及導電率之進一步提高。 於第3步驟中,可利用700℃以下之溫度對積層造形物進行熱處理,或亦可利用600℃以下之溫度進行熱處理,或亦可利用550℃以下之溫度進行熱處理。藉此,例如可期待機械強度與導電率之平衡提高。亦可利用超過700℃之溫度對積層造形物進行熱處理。但是,利用超過700℃之溫度亦存在機械強度及導電率之提高效果變小之可能性。 <積層造形物> 本實施形態之積層造形物典型而言係藉由上述製造方法而製造。 本實施形態之積層造形物可具有藉由切削加工無法實現之複雜形狀。進而本實施形態之積層造形物可機械強度及導電率兩者均優異。作為本實施形態之積層造形物之一例可為電漿槍。 (組成) 積層造形物包含銅合金。積層造形物含有多於1.00質量%且2.80質量%以下之Cr、及其餘部分之Cu。與上述銅合金粉末相同,其餘部分亦可包含添加元素及不可避免雜質元素之至少一者。積層造形物之Cr含量藉由與銅合金粉末之Cr含量之測定方法同樣之測定方法而測定。Cr含量可為1.01質量%以上,或亦可為多於1.05質量%,或亦可為1.10質量%以上,或亦可為1.20質量%以上,或亦可為1.22質量%以上,或亦可為1.78質量%以上。Cr含量可為2.70質量%以下,或亦可為2.60質量%以下,或亦可為2.30質量%以下,或亦可為2.00質量%以下,或亦可為1.90質量%以下,或亦可為1.80質量%以下,或亦可為1.78質量%以下,或亦可為1.46質量%以下。 積層造形物之Cu含量亦可藉由與銅合金粉末之Cu含量之測定方法同樣之測定方法而測定。Cu含量例如亦可為高於97.9質量%且未達99.0質量%。 (相對密度) 積層造形物相對於銅合金之理論密度具有96%以上且100%以下之相對密度。「相對密度」藉由積層造形物之實測密度除以理論密度而算出。理論密度表示具有與積層造形物相同之組成之熔製材之密度。實測密度藉由依據「JIS Z 2501:燒結金屬材料-密度、含油率及開放氣孔率試驗方法」之方法而測定。液體使用水。相對密度至少測定3次。採用至少3次之平均值作為相對密度。 相對密度較高之積層造形物適於需要較高氣密性之零件。又,相對密度越高,亦越可期待機械強度。相對密度可為97%以上,或亦可為98%以上,或亦可為99%以上,或亦可為99.2%以上,或亦可為99.4%以上,或亦可為99.8%以上。 (機械強度) 積層造形物可具有優異之機械強度。例如,積層造形物可具有250 MPa以上之拉伸強度。即本實施形態之積層造形物可具有與無氧銅(UNS(Unified Numberring System,統一編號系統)編號C10200)同等以上之拉伸強度。 「拉伸強度」藉由以下順序測定。 測定中使用「JIS B 7721:拉伸試驗機、壓縮試驗機-力測量系統之校正方法及驗證方法」所規定之等級1級以上之拉伸試驗裝置。圖8係拉伸試驗所使用之試片之俯視圖。準備圖8所示之啞鈴狀試片20。將啞鈴狀試片20安裝於拉伸試驗裝置之夾具。於夾具使用適於啞鈴狀試片20之形狀之物。啞鈴狀試片20以向其軸方向施加拉伸應力之方式安裝。 利用2 mm/min之速度拉拽啞鈴狀試片20。連續拉拽直至啞鈴狀試片20斷裂。測定直至啞鈴狀試片20斷裂所呈現之最大拉伸應力。 藉由最大拉伸應力除以平行部21之截面面積,而算出拉伸強度。平行部21之截面面積為9.616 mm2
(=π×3.5 mm×3.5 mm÷4)。拉伸強度至少測定3次。採用至少3次之平均值作為拉伸強度。再者啞鈴狀試片20之各部之尺寸如下所示。 啞鈴狀試片20之總長(L0):36 mm 平行部21之長度(L1):18±0.5 mm 平行部21之直徑(D1):3.5±0.05 mm 肩部23之半徑(R):10 mm 夾持部22之長度(L2):4.0 mm 夾持部22之直徑(D2):6.0 mm 拉伸強度可藉由第3步驟之熱處理溫度而調整。拉伸強度例如可為300 MPa以上,或亦可為400 MPa以上,或亦可為600 MPa以上,或亦可為700 MPa以上。拉伸強度例如可為800 MPa以下,或亦可為750 MPa以下。 積層造形物可具有90 HV以上之維氏硬度。「維氏硬度」藉由依據「JIS Z 2244:維氏硬度試驗-試驗方法」之方法而測定。維氏硬度亦可藉由第3步驟之熱處理溫度而調整。維氏硬度例如可為100 HV以上,或亦可為150 HV以上,或亦可為200 HV以上,或亦可為250 HV以上。維氏硬度例如亦可為300 HV以下。 (導電率) 積層造形物具有10%IACS以上之導電率。「導電率」係由市售之渦流式電導計測定。將退火標準軟銅(International Annealed Copper Standard,IACS)之導電率作為基準對導電率進行評價。即積層造形物之導電率以相對於IACS之導電率之百分率之形式表示。例如,積層造形物之導電率為50%IACS意指積層造形物之導電率為IACS之導電率之一半。導電率至少測定3次。採用至少3次之平均值作為導電率。 導電率可藉由第3步驟之熱處理溫度而調整。積層造形物可具有20%IACS以上之導電率,或亦可具有30%IACS以上之導電率,或亦可具有50%IACS以上之導電率,或亦可具有70%IACS以上之導電率,或亦可具有80%IACS以上之導電率,或亦可具有90%IACS以上之導電率。積層造形物例如亦可具有100%IACS以下之導電率。 [實施例] 以下對實施例進行說明。但以下之例並不限定本發明之發明範圍。 根據圖1所示之流程圖製造積層造形物。 首先,準備含有下述表1所示之化學成分之銅合金粉末A1~A7(S100)。該等銅合金粉末藉由特定霧化法製造。作為比較亦準備純銅粉末X及銅合金粉末Y。純銅粉末X係以市售純銅為原料之粉末。銅合金粉末Y係以市售銅合金(製品名「AMPCO940」)為原料之粉末。以下有時將該等粉末總稱為「金屬粉末」。 [表1]
1‧‧‧第1粉末層1‧‧‧1st powder layer
2‧‧‧第2粉末層2‧‧‧2nd powder layer
10‧‧‧積層造形物10‧‧‧Multilayered objects
20‧‧‧啞鈴狀試片20‧‧‧Dumbbell test piece
21‧‧‧平行部21‧‧‧Parallel
22‧‧‧夾持部22‧‧‧Clamping Department
23‧‧‧肩部23‧‧‧ Shoulder
100‧‧‧雷射積層造形裝置100‧‧‧Laser laminated device
101‧‧‧活塞101‧‧‧Piston
102‧‧‧台102‧‧‧
103‧‧‧雷射輸出部103‧‧‧Laser output
d‧‧‧切片厚度D‧‧‧ slice thickness
D1‧‧‧平行部21之直徑D1‧‧‧diameter of parallel section 21
D2‧‧‧夾持部22之直徑D2‧‧‧diameter of the clamping portion 22
L0‧‧‧啞鈴狀試片20之總長The total length of the L0‧‧‧ dumbbell test piece 20
L1‧‧‧平行部21之長度Length of parallel section 21 of L1‧‧
L2‧‧‧夾持部22之長度L2‧‧‧ Length of the clamping portion 22
p1‧‧‧第1造形層P1‧‧‧1st layer
p2‧‧‧第2造形層P2‧‧‧2nd layer
pn‧‧‧第n造形層Pn‧‧‧ nth layer
R‧‧‧肩部23之半徑R‧‧‧ Radius of the shoulder 23
圖1係表示本發明之實施形態之積層造形物之製造方法之概略之流程圖。 圖2係STL(Standard Template Library,標準模板庫)資料之一例。 圖3係切片資料之一例。 圖4係圖解積層造形物之製造過程之第1概略圖。 圖5係圖解積層造形物之製造過程之第2概略圖。 圖6係圖解積層造形物之製造過程之第3概略圖。 圖7係圖解積層造形物之製造過程之第4概略圖。 圖8係拉伸試驗所使用之試片之俯視圖。 圖9係表示第3步驟之熱處理溫度與導電率之關係之曲線圖。 圖10係表示第3步驟之熱處理溫度與拉伸強度之關係之曲線圖。 圖11係表示第3步驟之熱處理溫度與維氏硬度之關係之曲線圖。Fig. 1 is a flow chart showing the outline of a method for producing a laminated article according to an embodiment of the present invention. FIG. 2 is an example of an STL (Standard Template Library) data. Figure 3 is an example of slice data. Fig. 4 is a first schematic view showing a manufacturing process of a laminate. Fig. 5 is a second schematic view showing a manufacturing process of a laminate. Fig. 6 is a third schematic view showing a manufacturing process of a laminated formed article. Fig. 7 is a fourth schematic view showing a manufacturing process of a laminate. Fig. 8 is a plan view of a test piece used in a tensile test. Fig. 9 is a graph showing the relationship between the heat treatment temperature and the electrical conductivity in the third step. Fig. 10 is a graph showing the relationship between the heat treatment temperature and the tensile strength in the third step. Fig. 11 is a graph showing the relationship between the heat treatment temperature and the Vickers hardness in the third step.
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Publication number | Priority date | Publication date | Assignee | Title |
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TWI726557B (en) * | 2018-12-27 | 2021-05-01 | 日商Jx金屬股份有限公司 | Pure copper powder with Si film and its manufacturing method |
Also Published As
Publication number | Publication date |
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ES2781565T3 (en) | 2020-09-03 |
DK3315229T4 (en) | 2024-01-08 |
KR102239261B9 (en) | 2022-10-05 |
SG11201903358TA (en) | 2019-05-30 |
DK3315229T3 (en) | 2020-03-30 |
TW201907016A (en) | 2019-02-16 |
KR102239261B1 (en) | 2021-04-12 |
HUE048367T2 (en) | 2020-07-28 |
TWI730263B (en) | 2021-06-11 |
TWI730265B (en) | 2021-06-11 |
TW201907018A (en) | 2019-02-16 |
JP2018197389A (en) | 2018-12-13 |
JP6389557B1 (en) | 2018-09-12 |
ES2781565T5 (en) | 2024-05-10 |
TWI659116B (en) | 2019-05-11 |
KR20190075987A (en) | 2019-07-01 |
TWI730264B (en) | 2021-06-11 |
TW201907017A (en) | 2019-02-16 |
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