TW201822290A - Scribing apparatus - Google Patents

Abstract

A scribing apparatus cuts a combined substrate along a pattern of medium. The combined substrate includes a first substrate, a second substrate, and medium interposed between the first substrate and the second substrate in a predetermined pattern. The scribing apparatus includes a scribing unit forming a scribing line along the pattern of the medium on the surface of the combined substrate, a laser-emitting unit illuminating a laser beam toward at least a portion of the medium to change a property of the at least a portion of the medium, a concave-convex measuring unit measuring concave-convex of the surface of the combined substrate, and a moving unit moving the laser-emitting unit toward the combined substrate or away from the combined substrate according to the concave-convex of the surface of the combined substrate measured by the concave-convex measuring unit.

Description

   Dicing equipment   

The present invention relates to an apparatus for forming a scribe line on a substrate for cutting the substrate.

Generally, a liquid crystal display panel, an organic electroluminescence panel, an inorganic electroluminescence panel, a transmission projection substrate, a reflection projection substrate, and the like for a flat panel display are manufactured by using a unit glass panel. The glass panel is obtained by cutting into a predetermined size.

The mother glass panel is an adhesive substrate formed by pasting a first substrate and a second substrate. The first substrate may include a thin film transistor, and the second substrate may include a color filter. The first substrate and the second substrate are attached using an adhesive paste as an adhesive. A liquid crystal and / or an electronic element and the like are provided between the first substrate and the second substrate.

The process (engineering) of cutting the bonded substrate into a unit substrate includes a dicing process and a slicing process in which the scribe process is pressed and moved along an imaginary predetermined cutting line on the first substrate and the second substrate by a diamond such as a diamond. A scribe wheel made of other materials is used to form a scribe line, and the splitting process is to cut the bonded substrate by pressing the bonded substrate along the scribe line to obtain a unit substrate.

In addition, in order to increase the size of an area (effective area) actually occupied between the adhesive substrates such as liquid crystal and / or electronic components, it is possible to consider cutting the adhesive substrate along the adhesive paste pattern formed between the adhesive substrates. Program. At this time, a scribe line is formed on the first substrate and the second substrate along the adhesive paste pattern, whereby the adhesive paste hardened between the adhesive substrates is cut together with the adhesive substrate.

Furthermore, the adhesive paste may be stuck on a black matrix formed on the inner surfaces of the first substrate and the second substrate. That is, the adhesive paste pattern may coincide with the black matrix pattern formed on the inner surfaces of the first substrate and the second substrate.

If the adhesive paste is adhered to the black matrix, when cutting the adhesive substrate, the adhesive paste and the black matrix should be cut together with the adhesive substrate. However, due to the problem of the material of the black matrix and the adhesion between the adhesive paste and the black matrix, there is a problem that the adhesive substrate cannot be cut smoothly.

The above problems exist not only when cutting an adhesive substrate in which an adhesive paste and a black matrix are interposed between the adhesive substrates, but also in a protective film, an electrode, an organic film, an adhesive, a sealant, etc. between the adhesive substrates ( Hereinafter referred to as "intervening substance") also occurs in the process of cutting the bonded substrate by forming a scribing line on the bonded substrate along the pattern of the intervening substance.

Existing literature

Patent literature

Korean Published Patent No. 10-2007-0070824 (2007.07.04)

The present invention is devoted to solving the problems existing in the foregoing prior art, and an object thereof is to provide a dicing apparatus that can easily cut an adhesive substrate along a pattern of an intervening substance, the adhesive substrate including a first substrate, The second substrate and an intervening substance interposed between the first substrate and the second substrate in a predetermined pattern.

In order to achieve the above object, an embodiment of the present invention provides a dicing apparatus that cuts an adhesive substrate along a pattern of an intervening substance, the adhesive substrate including a first substrate, a second substrate, and an intervening first substrate in a predetermined pattern. And an intervening substance between the substrate and the second substrate, the dicing device includes: a dicing unit that forms a scribing line on the surface of the bonded substrate along the pattern of the intervening substance; a laser beam irradiation unit that Irradiating at least a part of the intervening substance with a laser beam to denature at least a part of the intervening substance; a concavo-convex measuring unit for measuring concavo-convex on the surface of the adhesive substrate; and a moving device according to the concavo-convex The unevenness on the surface of the bonded substrate measured by the measurement unit moves the laser beam irradiation unit in a direction toward the bonded substrate and a direction away from the bonded substrate.

The dicing device in the embodiment of the present invention irradiates a laser beam to an intervening substance interposed between the bonding substrates in a predetermined pattern to denature at least a part of the intervening substance, and forms a scribing line on the bonding substrate according to the pattern of the intervening substance, Thereby, the bonded substrate is cut. This makes it possible to easily cut the intervening substance interposed between the adhesive substrates together with the adhesive substrate.

Furthermore, the dicing apparatus in the embodiment of the present invention moves the laser beam irradiation unit to the Z-axis direction according to the unevenness of the surface of the bonded substrate measured by the unevenness measurement unit. Therefore, between the laser beam irradiation unit and the surface of the bonded substrate The interval can be maintained at a predetermined interval. Therefore, even in the case where there is unevenness on the surface of the bonded substrate, the spot of the laser beam emitted from the laser beam irradiation unit can be located at an accurate position in the intervening substance between the adhesive substrates, so that the intervening substance can be achieved. Accurate denaturation.

This makes it possible to easily cut the intervening substance interposed between the adhesive substrates together with the adhesive substrate.

10‧‧‧ Intervening Substance

11‧‧‧ the first intervening substance

12‧‧‧Second Intervening Substance

110‧‧‧First Frame

120‧‧‧ second frame

210‧‧‧ First scribe head

220‧‧‧Second scribe head

310‧‧‧The first scribe unit

311‧‧‧Dicing Wheel

313‧‧‧The first scribing wheel module

315‧‧‧roller

317‧‧‧First Roller Module

320‧‧‧Second scribe unit

321‧‧‧Dicing Wheel

323‧‧‧Second scribing wheel module

325‧‧‧roller

327‧‧‧Second Roller Module

410‧‧‧First laser beam irradiation unit

420‧‧‧Second laser beam irradiation unit

510, 520‧‧‧ mobile devices

610, 620‧‧‧ bump measurement unit

611‧‧‧Concave and convex measuring head

612‧‧‧ Bump measuring part

613‧‧‧Position measuring device

614‧‧‧ benchmark parts

615‧‧‧Sensor

619‧‧‧ Reduce friction parts

700‧‧‧ control unit

810‧‧‧ Bump Measurement Unit

811‧‧‧Concave and convex measuring head

813‧‧‧Distance measuring device

814‧‧‧Lighting Department

815‧‧‧Lighting Department

A‧‧‧Degeneration part

C‧‧‧ Crack

L‧‧‧ line

P‧‧‧light spot

S‧‧‧ substrate

S1‧‧‧First substrate

S2‧‧‧Second substrate

FIG. 1 is a schematic cross-sectional view of a bonded substrate cut by a dicing apparatus in a first embodiment of the present invention.

FIG. 2 is a schematic diagram of a dicing apparatus in the first embodiment of the present invention.

FIG. 3 is a schematic diagram of a laser beam irradiation unit provided in the dicing apparatus according to the first embodiment of the present invention.

4 to 6 are schematic views of a state in which a scribe line is formed on the bonded substrate by irradiating a laser beam to the intervening substance through the dicing apparatus in the first embodiment of the present invention.

7 to 9 are flowcharts for explaining the operation of the dicing apparatus in the first embodiment of the present invention.

FIG. 10 is a schematic diagram of a dicing apparatus in a second embodiment of the present invention.

FIG. 11 is a schematic diagram of a concavo-convex measurement unit of a dicing apparatus in a second embodiment of the present invention.

FIG. 12 is a schematic diagram of a concavo-convex measurement unit of a dicing apparatus in a third embodiment of the present invention.

Hereinafter, a dicing apparatus in an embodiment of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the cutting target of the dicing apparatus according to the first embodiment of the present invention is a bonded substrate S to which a first substrate S1 and a second substrate S2 are bonded. For example, the first substrate S1 may include a thin film transistor, and the second substrate S2 may include a color filter. An intervening substance 10 such as an adhesive paste, a black matrix, a protective film, an electrode, an organic film, an adhesive, a sealant, etc. can be interposed in a predetermined pattern between the adhesive substrates S, and the first substrate S1 can be maintained by the intervening substance 10 And the distance between the second substrate S2. FIG. 1 shows a state where a black matrix is formed as the first intervening substance 11 on the inner surfaces of the first substrate S1 and the second substrate S2, and an adhesive paste is formed as the second intervening substance 12 between the black matrices. Liquid crystal and / or electronic components may be arranged between the bonded substrates S. In order to increase the size of the area (effective area) occupied by the liquid crystal and / or electronic components between the bonded substrates S, it is possible to consider intervening substances. A pattern of 10 is a plan for cutting the bonded substrate S.

Therefore, the first embodiment of the present invention provides a dicing apparatus that easily cuts the bonded substrate S together with the intervening substance 10.

In addition, the transfer direction of the bonded substrate S where the scribe line is to be formed is defined as the Y-axis direction, and the direction crossing the transfer direction (Y-axis direction) of the bonded substrate S is defined as the X-axis direction. And, a direction perpendicular to the X-Y plane on which the bonded substrate S is placed is defined as a Z-axis direction.

As shown in FIG. 2, the dicing apparatus according to the first embodiment of the present invention includes: a first frame 110 that extends in the X-axis direction; and a first dicing head 210 that is movably disposed in the X-axis direction on the first Frame 110: a second frame 120 extending below the first frame 110 in the X-axis direction parallel to the first frame 110; a second dicing head 220 which is movably disposed in the second frame 120 in the X-axis direction .

A plurality of first dicing heads 210 are disposed on the first frame 110 toward the X-axis direction, and a plurality of second dicing heads 220 are disposed on the second frame 120 toward the X-axis direction. The first frame 110 and the second frame 120 are integrally formed.

The first dicing head 210 and the second dicing head 220 are disposed facing each other in the Z-axis direction. The first dicing head 210 may include a first dicing unit 310, and the first dicing unit 310 may include a first dicing wheel module 313 having a dicing input 311 and a first roller module 317 having a roller 315. The second dicing head 220 may include a second dicing unit 320, and the second dicing unit 320 may include a second dicing wheel module 323 including a dicing wheel 321 and a second roller module 327 including a roller 325.

The dicing wheel 311 of the first dicing wheel module 313 is aligned with the roller 325 of the second roller module 327, and the dicing wheel 321 of the second dicing wheel module 323 is aligned with the roller 315 of the first roller module 317. Configuration. The scribe wheel 311 of the first scribe wheel module 313 and the roller 315 of the first roller module 317 are aligned in the X-axis direction, and the scribe wheel 321 of the second scribe wheel module 323 and the roller of the second roller module 327 325 is arranged in a row in the X-axis direction.

The scribe wheel 311 of the first scribe wheel module 313 and the roller 315 of the first roller module 317 may press the first substrate S1, and the scribe wheel 321 of the second scribe wheel module 323 and the roller 325 of the second roller module 327 may Press the second substrate S2.

The first dicing wheel module 313 and the second dicing wheel module 323 can be moved in the Z-axis direction, so that the pressing force of the first dicing wheel 311 and the second dicing wheel 321 to press the bonding substrate S can be adjusted. . In addition, by moving the first dicing wheel module 313 and the second dicing wheel module 323 in the Z-axis direction, the cutting depth of the first dicing wheel 311 and the second dicing wheel 321 in the bonded substrate S can be adjusted. .

Thereby, the first scribe head 210 and the second scribe head 220 move in the X-axis direction with respect to the bonded substrate S1 by the first scribe head 210 and the second scribe head 220 in a state where the plurality of scribe wheels 311 and 321 press the first substrate S1 and the second substrate S2, respectively. The scribe lines may be formed on the first substrate S1 and the second substrate S2, respectively. In this process, the plurality of rollers 315 and 325 play a role of supporting the strength of the plurality of dicing wheels 311 and 321 pressing the first substrate S1 and the second substrate S2.

At this time, the plurality of scribe wheels 311 and 321 are aligned with the line L parallel to the pattern of the intervening substance 10, and thus, the scribe lines formed by the plurality of scribe wheels 311 and 321 can be parallel to the The lines L of the pattern are aligned. Therefore, the adhesive substrate S can be cut along the pattern of the intervening substance 10.

As shown in FIGS. 2 to 4, the first dicing head 210 may be provided with a first laser beam irradiation unit 410, and the second dicing head 220 may be provided with a second laser beam irradiation unit 420. The first laser beam irradiation unit 410 and the second laser beam irradiation unit 420 irradiate at least a part of the intervention substance 10 with a laser beam to denature at least a part of the intervention substance 10. When the laser beam is irradiated onto the intervening substance 10, the intervening substance 10 is burned. Therefore, when the adhesive substrate S is cut along the pattern of the intervening substance 10, the intervening substance 10 is also easily cut.

The first laser beam irradiation unit 410 and the second laser beam irradiation unit 420 may emit a laser beam in a wavelength band that can be absorbed by the intervening substance 10. The first laser beam irradiation unit 410 and the second laser beam irradiation unit 420 may be connected to a laser source (not shown) that generates a laser beam. As the laser source, a CO ₂ laser, a YAG laser, a pulse laser, a femtosecond laser, or the like may be used. Various laser sources. In addition, an optical element such as a beam expander and a collimator may be included between the laser source and the first laser beam irradiation unit 410 and the second laser beam irradiation unit 420 as required.

The first laser beam irradiation unit 410 and the second laser beam irradiation unit 420 can be moved in the Z-axis direction, thereby adjusting the spot P of the laser beam irradiated by the first laser beam irradiation unit 410 and the second laser beam irradiation unit 420. Position in the Z-axis direction. As the position of the spot P of the laser beam in the Z-axis direction is adjusted, the laser beam is irradiated on the first intervention substance 11 and the second intervention substance 12 in this order. Thus, the first intervention substance 11 and the second intervention substance 12 will be sequentially Degeneration occurs.

The operation of the dicing apparatus in the first embodiment of the present invention will be described with reference to FIGS. 4 to 9.

First, as shown in FIGS. 4 and 7, step S110: the first laser beam irradiating unit 410 and the second laser beam irradiating unit 420 are located at positions aligned with the pattern of the intervention substance 10, and irradiate the laser beam to the intervention substance 10. As the spot P of the laser beam is located on the intervention substance 10, at least a part of the intervention substance 10 is denatured under the influence of light and heat of the laser beam.

As a result, as shown in FIG. 5, a denatured portion A exists in the intervention substance 10, and the denatured portion A is easier to be cut than other portions of the intervention substance 10.

Furthermore, as in the first embodiment of the present invention, when the intervention substance 10 includes a black matrix as the first intervention substance 11 and an adhesive paste as the second intervention substance 12, the first laser beam irradiation unit 410 and the second laser beam The irradiation unit 420 sequentially irradiates the first intervention substance 11 and the second intervention substance 12 with a laser beam while moving in the Z-axis direction. As a result, there is a denatured portion on the first intervention substance 11 and the second intervention substance 12, and the first intervention substance 11 and the second intervention substance 12 are easily cut.

As described above, after at least a part of the intervening substance 10 is denatured, as shown in FIG. 5 and FIG. 7, step S120: pressing the bonding substrate S with the dicing wheels 311 and 321 corresponding to the denatured part of the intervening substance 10, A scribe line is formed on the bonding substrate S. Under the pressure of the dicing wheels 311 and 321, the scribe line is formed as a crack C in the bonding substrate S. Thereby, the bonded substrate S can be cut along the scribe line.

As described above, the scribe line is formed on the adhesive substrate S in a state where the intervening substance 10 is weakened due to the degeneration of the intervening substance 10, and therefore, the adhesive substrate S is easily cut. As another example, in a state where the intervening substance 10 is denatured and a scribe line is formed on the adhesive substrate S, the adhesive substrate S is cut after being transferred to the cleavage process.

As another example, as shown in FIG. 6 and FIG. 8, step S130 may be further included: in a state where the intervening substance 10 is denatured and a scribing line is formed on the bonding substrate S, the scribing wheels 311 and 321 are pressed to denature the intervening substance 10. A scribe line is formed in the portion A of the intervening substance 10.

As in the first embodiment of the present invention, when the intervention substance 10 includes a black matrix as the first intervention substance 11 and an adhesive paste as the second intervention substance 12, the first scribe wheel module 313 and the second scribe wheel module 323 Moving in the Z-axis direction, scribe lines are sequentially formed on the first intervening substance 11 and the second intervening substance 12. Accordingly, the scribe lines formed on the first interventional substance 11 and the second interventional substance 12 can easily cut the first interventional substance 11 and the second interventional substance 12.

In order to make the dicing wheels 311 and 321 easily reach the intervening substance 10, in the process of forming scribe lines on the bonded substrate S, the dicing units 310 and 320 can form scribe lines on the bonded substrate S to make the intervening substance 10 The denatured part A is exposed to the outside.

As described above, not only the scribe line is formed on the adhesive substrate S, but also the scribe line is formed on the intervening substance 10, so that the adhesive substrate S can be cut more easily.

As another example, as shown in FIG. 9, step S210 is first performed: pressing the bonding substrate S with the dicing wheels 311 and 321 corresponding to the pattern of the intervening substance 10 to form a scribe line on the bonding substrate S, and then performing the step S220: Irradiate a laser beam to at least a part of the intervention substance 10 existing along the scribe line, so that at least a part of the intervention substance 10 is denatured.

At this time, in the process of forming the scribing line on the adhesive substrate S, the scribing units 310 and 320 may form a scribing line so that a part of the intervention substance 10 is exposed to the outside, so that the laser beam is smoothly radiated to the intervention substance 10.

In addition, in the process of forming a scribe line on the adhesive substrate S, the scribe units 310 and 320 may form a scribe line on a part of the intervening substance 10.

As in the first embodiment of the present invention, when the intervention substance 10 includes a black matrix as the first intervention substance 11 and an adhesive paste as the second intervention substance 12, the first laser beam irradiation unit 410 and the second laser beam irradiation unit 420 Moving in the Z-axis direction, the laser beam is sequentially irradiated on the first intervention substance 11 and the second intervention substance 12.

The dicing apparatus in the first embodiment of the present invention irradiates the intervening substance 10 interposed between the bonding substrates S in a predetermined pattern with a laser beam to denature at least a part of the intervening substance 10. A scribe line is formed on the substrate S, and the bonded substrate S is cut. This makes it possible to easily cut the intervening substance 10 interposed between the adhesive substrates S together with the adhesive substrate S.

Hereinafter, a dicing apparatus in a second embodiment of the present invention will be described with reference to FIGS. 10 to 11. The same components as those of the first embodiment of the present invention will be assigned the same reference numerals, and detailed descriptions thereof will be omitted.

According to circumstances, the surface of the adhesive substrate S does not always remain flat, but slight unevenness is formed. If the adhesive substrate S has irregularities, the position of the adhesive substrate S in the Z-axis direction changes, and the position of the intervening substance 10 interposed between the adhesive substrate S in the Z-axis direction also changes. Therefore, when the adhesive substrate S has unevenness, when the laser beam is irradiated by the laser beam irradiation units 410 and 420, the spot P of the laser beam is not located on the intervening substance 10, and the intervening substance 10 cannot be properly denatured.

Therefore, in a second embodiment of the present invention, a dicing apparatus is provided which measures the unevenness of the adhesive substrate S and adjusts the positions of the laser beam irradiation units 410 and 420 in the Z-axis direction according to the unevenness of the adhesive substrate S. Therefore, the spot P of the laser beam is accurately located on the intervention substance 10.

As shown in FIG. 10 and FIG. 11, the dicing apparatus in the second embodiment of the present invention includes: moving devices 510 and 520 that move the laser beam irradiation units 410 and 420 in the Z-axis direction; and unevenness measuring units 610 and 620. For measuring the unevenness on the surface of the bonded substrate S; the control unit 700 controls the mobile devices 510 and 520 according to the unevenness of the bonded substrate S measured by the unevenness measuring units 610 and 620 to adjust the laser beam irradiation units 410 and 420 at Z Position in the axis direction.

The moving devices 510 and 520 are connected to the laser beam irradiation units 410 and 420, respectively, and move the laser beam irradiation units 410 and 420 in a direction adjacent to the bonded substrate S and a direction separated from the bonded substrate S. As the moving devices 510 and 520, an actuator that operates by air pressure or oil pressure, a linear motor that operates by electromagnetic action, or a linear movement device such as a club device can be used.

The unevenness measuring units 610 and 620 include a first unevenness measuring unit 610 provided on the first dicing head 210 and a second unevenness measuring unit 620 provided on the second dicing head 220. The first unevenness measuring unit 610 provided on the first dicing head 210 and the second unevenness measuring unit 620 provided on the second dicing head 220 have the same structure and effects. Hereinafter, the first unevenness measuring unit 610 provided in the first dicing head 210 will be referred to as an unevenness measuring unit 610, and the unevenness measuring unit 610 will be described with reference to FIG. 11.

As shown in FIG. 11, the unevenness measuring unit 610 includes: an unevenness measuring head 611 provided on the first dicing head 210 and moving along the surface of the adhesive substrate S together with the first dicing head 210; On the unevenness measuring head 611, according to the unevenness of the surface of the bonded substrate S, it can be moved toward the surface of the bonded substrate S and away from the surface of the bonded substrate S; a position measuring device 613 is used to measure the Position in the Z axis direction.

The unevenness measuring member 612 maintains a state of being in contact with the surface of the adhesive substrate S. When the unevenness measuring head 611 moves, the unevenness measuring member 612 can move in the Z-axis direction along with the unevenness of the adhesive substrate S.

The unevenness measuring member 612 is slidably provided in the unevenness measuring head 611 in the Z-axis direction, so that the unevenness measuring member 612 can be moved in the Z-axis direction in accordance with the unevenness of the adhesive substrate S. In addition, an elastic member such as a spring may be connected to the unevenness measuring member 612, so that the unevenness measuring member 612 can move in the Z-axis direction along with the unevenness of the surface of the adhesive substrate S. The end of the unevenness measuring member 612 that is in contact with the surface of the adhesive substrate S is preferably provided with a friction reducing member 619 such as a ball or a roller. The friction reducing member 619 can roll while being in contact with the surface of the adhesive substrate S. As another example, the friction reducing member 619 may be a material such as a flexible plastic or resin.

The position measurement device 613 is connected to the control unit 700, and information related to the position and displacement of the unevenness measuring member 612 measured by the position measurement device 613 can be transmitted to the control unit 700.

The position measuring device 613 includes a reference member 614 provided on the uneven measurement member 612 and a sensing member 615 provided on the position measuring head 611 opposite to the reference member 614. As another example, the reference member 614 may be provided on the position measuring head 611, and the sensing member 615 may be provided on the uneven measurement member 612. The position measuring device 613 uses the interaction of the reference member 614 and the sensing member 615 to measure the position and displacement of the unevenness measuring member 612.

As an example, the reference component 614 may include a scale having a predetermined scale, and the sensing component 615 may include a camera that captures the scale. At this time, the relative position between the reference part 614 and the sensing part 615 is measured based on the image of the ruler captured by the sensing part 615, and the position of the unevenness measuring part 612 can be measured based on the measured relative position.

As another example, the reference member 614 may include reflecting surfaces having different reflection angles according to different positions, and the sensing member 615 includes a light emitting sensor that emits light to the reflecting surface and a light receiving sensor that receives light reflected from the reflecting surface. At this time, the relative position between the reference member 614 and the sensing member 615 is measured by measuring the reflection angle of the light reflected from the reflecting surface, and the position of the unevenness measuring member 612 is measured based on the measured relative position.

According to the above configuration, in a state where the end of the unevenness measuring member 612 is in contact with the surface of the adhesive substrate S, the unevenness measuring head 611 moves along the surface of the adhesive substrate S, and the unevenness measuring member 612 is based on the surface of the adhesive substrate S. The unevenness moves in the Z-axis direction.

As the unevenness measuring member 612 moves, the relative position between the reference member 614 and the sensing member 615 changes, and the displacement of the unevenness measuring member 612 can be measured based on the change in the relative position.

The displacement of this unevenness measuring member 612 indicates the size of the unevenness on the surface of the adhesive substrate S. At this time, the control unit 700 controls the mobile device 510 based on the displacement of the unevenness measuring member 612 measured by the position measuring device 613, so that the mobile device 510 moves the laser beam irradiation unit 410 corresponding to the displacement of the unevenness measuring member 612.

Accordingly, according to the displacement of the unevenness measuring member 612 measured by the position measuring device 613, the laser beam irradiation unit 410 can move in a direction toward and away from the bonded substrate S. Therefore, the laser beam irradiation unit 410 and The interval between the surfaces of the adhesive substrate S can be maintained at a predetermined interval in equilibrium.

Here, the predetermined interval refers to an interval when the spot P of the laser beam irradiated by the laser beam irradiation unit 410 is located at an accurate position within the intervention substance 10. The predetermined interval can be set through multiple experiments or simulations.

As described above, the laser beam irradiation unit 410 moves in the Z-axis direction according to the unevenness of the surface of the bonded substrate S measured by the unevenness measurement unit 610, and therefore, the interval between the laser beam irradiation unit 410 and the surface of the bonded substrate S can be maintained in a balanced manner Predetermined interval. Thus, even if unevenness is formed on the surface of the adhesive substrate S, the spot P of the laser beam irradiated by the laser beam irradiation unit 410 can be located at an accurate position within the intervening substance 10 between the adhesive substrates S, so that the intervening substance 10 can be made With accurate denaturation, the intervening substance 10 interposed between the adhesive substrates S can be easily cut together with the adhesive substrate S.

Hereinafter, a dicing apparatus in a third embodiment of the present invention will be described with reference to FIG. 12. The same components as those described in the first and second embodiments of the present invention are denoted by the same reference numerals, and detailed descriptions thereof will be omitted.

As shown in FIG. 12, the dicing apparatus in the third embodiment of the present invention includes: a moving device 510 that moves the laser beam irradiation units 410 and 420 in the Z-axis direction; and an unevenness measuring unit 810 for measuring the surface of the bonded substrate S The control unit 700 controls the mobile device 510 to adjust the position of the laser beam irradiation unit 410 in the Z-axis direction according to the unevenness of the adhesive substrate S measured by the unevenness measurement unit 810.

The unevenness measuring unit 810 includes: an unevenness measuring head 811 provided on the first dicing head 210 and moving along the surface of the adhesive substrate S together with the first dicing head 210; and a distance measuring device 813 provided on the unevenness measuring head 811, The distance from the bonded substrate S is measured.

When the unevenness measuring head 811 is moved, the distance measuring device 813 measures the distance from the adhesive substrate S in real time, and measures the unevenness of the adhesive substrate S based on the change in the distance from the adhesive substrate S.

The distance measuring device 813 includes a light emitting section 814 that emits laser light to the surface of the adhesive substrate S, and a light receiving section 815 that is spaced apart from the light emitting section 814 by a predetermined distance and receives the laser light reflected by the adhesive substrate S.

The distance measuring device 813 outputs an electric signal to the control unit 700 to measure the distance to the bonded substrate S, and the electrical signal is generated based on the imaging position of the laser light reflected by the bonded substrate S after emitting light from the light emitting portion 814.

In the above structure, when the unevenness measuring head 811 moves along the surface of the bonded substrate S, the distance from the surface of the bonded substrate S is measured by the distance measuring device 813.

At this time, the control unit 700 controls the mobile device 510 based on the distance from the surface of the bonded substrate S measured by the distance measuring device 813, so that the mobile device 510 moves the laser beam according to the change in the distance from the surface of the bonded substrate S. Unit 410.

Accordingly, the laser beam irradiation unit 410 moves in a direction toward and away from the bonded substrate S according to a change in the distance from the surface of the bonded substrate S measured by the distance measuring device 813. Therefore, the laser beam is irradiated. The interval between the unit 410 and the surface of the adhesive substrate S can be maintained in a predetermined interval in equilibrium.

Here, the predetermined interval refers to an interval when the spot P of the laser beam irradiated by the laser beam irradiation unit 410 is located at an accurate position within the intervention substance 10. The predetermined interval can be set through multiple experiments or simulations.

As described above, the laser beam irradiation unit 410 moves in the Z-axis direction according to the unevenness of the surface of the bonded substrate S measured by the unevenness measurement unit 810, and therefore, the interval between the laser beam irradiation unit 410 and the surface of the bonded substrate S can be maintained uniformly. Predetermined interval. Thus, even if unevenness is formed on the surface of the adhesive substrate S, the spot P of the laser beam irradiated by the laser beam irradiation unit 410 can be located at an accurate position within the intervening substance 10 between the adhesive substrates S, so that the intervening substance 10 can be made Accurate denaturation. Thus, the intervening substance 10 interposed between the adhesive substrates S can be easily cut together with the adhesive substrate S.

Although the exemplary embodiments of the present invention have been described above, the scope of the present invention is not limited to the specific embodiments described above, and appropriate changes can be made within the scope of the patent application.

Claims (7)

    A dicing apparatus that cuts an adhesive substrate along a pattern of an intervening substance, the adhesive substrate including a first substrate, a second substrate, and an intervening substance interposed between the first substrate and the second substrate in a predetermined pattern, The dicing device includes a dicing unit that forms a scribe line on a surface of the bonding substrate along a pattern of the intervening substance, and a laser beam irradiation unit that directs at least at least the intervening substance to the intervening substance. A part is irradiated with a laser beam to denature at least a part of the intervening substance; a concavo-convex measurement unit for measuring the concavities and convexities on the surface of the bonded substrate; and a moving device according to the adhesion measured by the concavo-convex measurement unit The unevenness on the substrate surface moves the laser beam irradiation unit in a direction toward the bonded substrate and a direction away from the bonded substrate.         The dicing apparatus according to claim 1, wherein the unevenness measuring unit includes: an unevenness measuring head capable of moving along the surface of the bonded substrate; an unevenness measuring member provided on the unevenness measuring head, In contact with the surface of the bonded substrate, the surface of the bonded substrate may move in a direction toward the bonded substrate and away from the bonded substrate; and a position measuring device for measuring The position of the unevenness measuring member.         The dicing apparatus according to claim 2, wherein an end portion of the unevenness measuring member contacting the surface of the adhesive substrate has a friction reducing member.         The dicing device according to claim 3, wherein the friction reducing member is a ball or a roller that rolls in contact with the adhesive substrate.         The dicing apparatus according to claim 1, wherein the unevenness measuring unit includes a distance measuring device including a light emitting portion that radiates laser light to a surface of the adhesive substrate; A predetermined distance from the light emitting portion and receiving laser light reflected by the adhesive substrate.         The dicing device according to claim 1, wherein the dicing unit forms a scribe line on the first substrate and the second substrate so that a degenerate portion of the intervening substance is exposed to the outside.         The dicing apparatus according to claim 6, wherein the dicing unit forms a scribe line on a degenerate portion of the intervention substance exposed to the outside.