TW201819696A - 4H-SiC crystal growth equipment and method thereof - Google Patents

4H-SiC crystal growth equipment and method thereof Download PDF

Info

Publication number
TW201819696A
TW201819696A TW106112994A TW106112994A TW201819696A TW 201819696 A TW201819696 A TW 201819696A TW 106112994 A TW106112994 A TW 106112994A TW 106112994 A TW106112994 A TW 106112994A TW 201819696 A TW201819696 A TW 201819696A
Authority
TW
Taiwan
Prior art keywords
sic
silicon carbide
crystal
silicon
source
Prior art date
Application number
TW106112994A
Other languages
Chinese (zh)
Inventor
三重野文健
Original Assignee
上海新昇半導體科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海新昇半導體科技有限公司 filed Critical 上海新昇半導體科技有限公司
Publication of TW201819696A publication Critical patent/TW201819696A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/36Carbides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B11/00Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
    • C30B11/04Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt
    • C30B11/08Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt every component of the crystal composition being added during the crystallisation
    • C30B11/12Vaporous components, e.g. vapour-liquid-solid-growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/02Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/08Downward pulling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

This invention provides a 4H-SiC crystal growth equipment and a method thereof, and the 4H-SiC crystal growth equipment comprising: a crystal growth furnace; a carbon graphite crucible, disposed in the crystal growth furnace; a carbon source and silicon source supply system, including a gas source and a gas outlet; one end of the gas outlet connected with the gas source, the other end of the gas outlet extending from the top of the crystal growth furnace to the inner of the carbon graphite crucible and being above the carbon source and the silicon source; a heater, mounted in the crystal growth furnace and being around the carbon graphite crucible. Via the carbon source and silicon source supply system, the supplements of the carbon source and the silicon source can be enough. Simultaneously, the carbon and the silicon sources don't effect a temperature of a carbon and silicon source solution adversely and 4H-SiC crystal doesn't exist defects because they are formed at the surface of the carbon and silicon source solution in the form of SiC.

Description

碳化矽晶體(4H-SiC)生長設備及方法    Silicon carbide crystal (4H-SiC) growth equipment and method   

本發明屬於晶體生長技術領域,具體涉及碳化矽晶體(4H-SiC)生長設備及方法。 The invention belongs to the technical field of crystal growth, and particularly relates to a silicon carbide crystal (4H-SiC) growth device and method.

在現有技術中,碳化矽晶體(4H-SiC)的生長方法主要有TSM(Traveling Solvent Method,移動溶劑法)、SCT(Slow Cooling Technique,慢速降溫法)、VLS(Vapor Liquid Solid,蒸氣液固生長法)及TSSG(Top Seeded Solution Growth,頂部籽晶體拉法)。 In the prior art, the growth methods of silicon carbide crystals (4H-SiC) mainly include TSM (Traveling Solvent Method), SCT (Slow Cooling Technique, slow cooling method), VLS (Vapor Liquid Solid, vapor liquid solid Growth method) and TSSG (Top Seeded Solution Growth).

TSSG法生長碳化矽晶體(4H-SiC)的設備如第1圖所示,包括晶體生長爐10;支撐架11,位於所述晶體生長爐10內,且位於所述晶體生長爐10的底部;石墨坩堝12,位於所述晶體生長爐10內,且位於所述支撐架11的頂部;基座15,位於所述晶體生長爐10內,且位於所述石墨坩堝12的週邊;隔熱層16,位於所述晶體生長爐10內,且位於所述基座15的週邊;加熱器17,位於所述晶體生長爐10內,且位於所述隔熱層16的週邊。使用上述設備採用TSSG法生長4H-碳化矽時,將籽晶13置於所述石墨坩堝12的底部,並將碳源及矽源14置於所述石墨坩堝12內,使用所述加熱器17加熱使得所述碳源及矽源14熔化為液體,當溫度適合時,碳化矽晶體(4H-SiC)在所述籽晶13的表面形成。採用上述設備採用TSSG法進行碳化矽晶體 (4H-SiC)生長的過程中,由於所述碳源及矽源14置於所述石墨坩堝12內,石墨坩堝12可以提供碳化矽晶體(4H-SiC)生長所需的碳源,使得碳源在碳化矽晶體(4H-SiC)生長的過程中得以持續供應,但碳化矽晶體(4H-SiC)生長所需的矽源非常有限,隨著碳化矽晶體(4H-SiC)的生長矽源會出現缺乏從而影響晶體的生長。 The equipment for growing silicon carbide crystals (4H-SiC) by the TSSG method is shown in FIG. 1 and includes a crystal growth furnace 10; a support frame 11 is located in the crystal growth furnace 10 and is located at the bottom of the crystal growth furnace 10; A graphite crucible 12 is located in the crystal growth furnace 10 and is located on the top of the support frame 11; a base 15 is located in the crystal growth furnace 10 and is located around the graphite crucible 12; a heat insulation layer 16 Is located in the crystal growth furnace 10 and is located around the base 15; heater 17 is located in the crystal growth furnace 10 and is located around the heat insulation layer 16. When using the above equipment to grow 4H-silicon carbide using the TSSG method, the seed crystal 13 is placed on the bottom of the graphite crucible 12, and the carbon source and the silicon source 14 are placed in the graphite crucible 12, and the heater 17 is used. The heating causes the carbon source and the silicon source 14 to be melted into a liquid. When the temperature is suitable, a silicon carbide crystal (4H-SiC) is formed on the surface of the seed crystal 13. During the process of growing silicon carbide crystals (4H-SiC) using the TSSG method described above, since the carbon source and silicon source 14 are placed in the graphite crucible 12, the graphite crucible 12 can provide silicon carbide crystals (4H-SiC) ) The carbon source required for growth makes the carbon source continue to be supplied during the growth of silicon carbide crystal (4H-SiC), but the silicon source required for the growth of silicon carbide crystal (4H-SiC) is very limited. Crystal (4H-SiC) growth The lack of silicon source will affect the crystal growth.

針對上述設備存在的問題,一種改進設備如第2圖所示,第2圖中所示的設備在第1圖中的設備的基礎上增設了碳源及矽源補充容器18,所述碳源及矽源補充容器18放置有補充碳源及矽源19,在碳化矽晶體(4H-SiC)生長的過程中,所述碳源及矽源補充容器18持續向所述石墨坩堝12中加入所述補充碳源及矽源19,以確保所述碳化矽晶體(4H-SiC)生長所需的碳源及矽源。但如第2圖所示的設備中增設提供所述補充碳源及矽源19的碳源及矽源補充容器18之後,在碳化矽晶體(4H-SiC)生長的過程中,所述補充碳源及矽源19的持續加入會使得所述石墨坩堝12中的熔化的所述碳源及矽源14的溫度降低,從而使得生長的碳化矽晶體(4H-SiC)中產生缺陷。 In view of the problems existing in the above equipment, an improved device is shown in FIG. 2. The device shown in FIG. 2 adds a carbon source and a silicon source supplement container 18 on the basis of the device in FIG. 1. The carbon source A supplemental carbon source and a silicon source 19 are placed in the silicon source replenishment container 18. During the growth of silicon carbide crystal (4H-SiC), the carbon source and silicon source replenishment container 18 continues to add the carbon crucible 12 to the graphite crucible 12 The supplementary carbon source and silicon source 19 are described to ensure the carbon source and silicon source required for the growth of the silicon carbide crystal (4H-SiC). However, after the carbon source and the silicon source supplement container 18 for providing the supplemental carbon source and the silicon source 19 are added to the equipment as shown in FIG. 2, during the process of growing silicon carbide crystal (4H-SiC), the supplemental carbon The continuous addition of the source and the silicon source 19 will cause the temperature of the molten carbon source and the silicon source 14 in the graphite crucible 12 to decrease, thereby causing defects in the grown silicon carbide crystal (4H-SiC).

本發明的目的是克服現有技術中的缺陷,提供一種碳化矽晶體(4H-SiC)生長設備及方法,用於解決現有技術中的碳化矽晶體(4H-SiC)生長設備無法持續補充碳化矽晶體(4H-SiC)生長所需的矽源的問題,以及碳化矽晶體(4H-SiC)生長過程中向石墨坩堝中持續加入補充碳源及矽源而導致的晶體生長所需的碳源及矽源溶液降低,從而使得生長的碳化矽晶體(4H-SiC)記憶體在缺陷的問題。 The purpose of the present invention is to overcome the defects in the prior art and provide a silicon carbide crystal (4H-SiC) growth equipment and method, which are used to solve the problem that the silicon carbide crystal (4H-SiC) growth equipment in the prior art cannot continuously supplement the silicon carbide crystal The problem of the silicon source required for (4H-SiC) growth and the carbon source and silicon required for crystal growth caused by the continuous addition of carbon and silicon sources to the graphite crucible during the growth of silicon carbide crystals (4H-SiC) The source solution is reduced, so that the grown silicon carbide crystal (4H-SiC) memory is defective.

為了實現上述目的及其他相關目標,本發明提供一種碳化矽 晶體(4H-SiC)生長設備,所述碳化矽晶體(4H-SiC)生長設備包括:晶體生長爐;石墨坩堝,位於所述晶體生長爐內;所述石墨坩堝適於放置碳化矽晶體(4H-SiC)生長所需的碳源及矽源;碳源及矽源供給系統,包括氣體源及輸氣管;所述輸氣管一端與所述氣體源相連接,另一端自所述晶體生長爐的頂部延伸至所述石墨坩堝內的碳源及矽源上方;所述碳源及矽源供給系統適於在晶體生長過程中向所述晶體生長爐內通入碳源氣體及矽源氣體,以在所述碳源及矽源表面形成碳化矽;加熱器,位於所述晶體生長爐內,且位於所述石墨坩堝的週邊,適於在晶體生長過程中為所述石墨坩堝內的所述碳源及矽源加熱以使其熔化,並為所述碳源氣體及所述矽源氣體提供反應所需的溫度。 In order to achieve the above object and other related objectives, the present invention provides a silicon carbide crystal (4H-SiC) growth equipment, the silicon carbide crystal (4H-SiC) growth equipment includes: a crystal growth furnace; a graphite crucible, located in the crystal growth Inside the furnace; the graphite crucible is suitable for placing carbon and silicon sources required for the growth of silicon carbide crystals (4H-SiC); the carbon and silicon source supply system includes a gas source and a gas pipe; The gas source is connected, and the other end extends from the top of the crystal growth furnace to a carbon source and a silicon source in the graphite crucible; the carbon source and the silicon source supply system are adapted to the A carbon source gas and a silicon source gas are introduced into the crystal growth furnace to form silicon carbide on the surface of the carbon source and the silicon source; a heater is located in the crystal growth furnace and is located around the graphite crucible, and is suitable for During the crystal growth process, the carbon source and the silicon source in the graphite crucible are heated to cause them to melt, and the carbon source gas and the silicon source gas are provided with a temperature required for a reaction.

作為本發明的碳化矽晶體(4H-SiC)生長設備的一種優選方案,所述碳源氣體為含碳化合物。 As a preferred solution of the silicon carbide crystal (4H-SiC) growth equipment of the present invention, the carbon source gas is a carbon-containing compound.

作為本發明的碳化矽晶體(4H-SiC)生長設備的一種優選方案,所述碳源氣體為CnHn+2,其中,n1。 As a preferred solution of the silicon carbide crystal (4H-SiC) growth equipment of the present invention, the carbon source gas is C n H n + 2 , where n 1.

作為本發明的碳化矽晶體(4H-SiC)生長設備的一種優選方案,所述矽源氣體包括SiH4、Si2H6、SiH2Cl2、SiHCl3、SiCl4、Si2Cl6As a preferred solution of the silicon carbide crystal (4H-SiC) growth device of the present invention, the silicon source gas includes SiH 4 , Si 2 H 6 , SiH 2 Cl 2 , SiHCl 3 , SiCl 4 , and Si 2 Cl 6 .

作為本發明的碳化矽晶體(4H-SiC)生長設備的一種優選方案,所述碳化矽晶體(4H-SiC)生長設備還包括第一排氣孔,所述第一排氣孔位於所述晶體生長爐的底部。 As a preferred solution of the silicon carbide crystal (4H-SiC) growth equipment of the present invention, the silicon carbide crystal (4H-SiC) growth equipment further includes a first exhaust hole, and the first exhaust hole is located in the crystal The bottom of the growing furnace.

作為本發明的碳化矽晶體(4H-SiC)生長設備的一種優選方案,所述石墨坩堝包括坩堝主體及蓋體;所述蓋體扣置於所述坩堝主體頂部,所述碳源及所述矽源位於所述坩堝主體內,所述輸氣管穿過所述蓋體 延伸至所述坩堝主體內;所述蓋體內設有上下貫通的第二排氣孔。 As a preferred solution of the silicon carbide crystal (4H-SiC) growth equipment of the present invention, the graphite crucible includes a crucible body and a cover body; the cover body is buckled on the top of the crucible body, the carbon source and the The silicon source is located in the crucible body, and the gas pipe extends through the cover body into the crucible body; the cover body is provided with a second exhaust hole penetrating vertically.

作為本發明的碳化矽晶體(4H-SiC)生長設備的一種優選方案,所述加熱器包括射頻加熱器、電阻加熱器或紅外線加熱器中的至少一種。 As a preferred solution of the silicon carbide crystal (4H-SiC) growth device of the present invention, the heater includes at least one of a radio frequency heater, a resistance heater, or an infrared heater.

作為本發明的碳化矽晶體(4H-SiC)生長設備的一種優選方案,所述碳化矽晶體(4H-SiC)生長設備還包括冷卻壁,所述冷卻壁位於所述晶體生長爐內,且位於所述加熱器與所述石墨坩堝之間。 As a preferred solution of the silicon carbide crystal (4H-SiC) growth equipment of the present invention, the silicon carbide crystal (4H-SiC) growth equipment further includes a cooling wall, which is located in the crystal growth furnace and is located in Between the heater and the graphite crucible.

作為本發明的碳化矽晶體(4H-SiC)生長設備的一種優選方案,所述碳化矽晶體(4H-SiC)生長設備還包括支撐架,所述支撐架位於所述晶體生長爐內,所述石墨坩堝位於所述支撐架的頂部。 As a preferred solution of the silicon carbide crystal (4H-SiC) growth equipment of the present invention, the silicon carbide crystal (4H-SiC) growth equipment further includes a support frame, the support frame is located in the crystal growth furnace, and the A graphite crucible is located on the top of the support frame.

本發明還提供一種碳化矽晶體(4H-SiC)的生長方法,在生長碳化矽晶體(4H-SiC)的同時向晶體生長爐內通入碳源氣體及矽源氣體,以在用於生長碳化矽晶體(4H-SiC)的碳源及矽源表面形成碳化矽。 The invention also provides a method for growing silicon carbide crystals (4H-SiC). When the silicon carbide crystals (4H-SiC) are grown, a carbon source gas and a silicon source gas are introduced into the crystal growth furnace for use in growing carbonization. Silicon carbide (4H-SiC) forms silicon carbide on the carbon source and the surface of the silicon source.

作為本發明的碳化矽晶體(4H-SiC)的生長方法的一種優選方案,採用頂部籽晶提拉法生長所述碳化矽晶體(4H-SiC)。 As a preferred solution of the method for growing silicon carbide crystals (4H-SiC) of the present invention, the silicon carbide crystals (4H-SiC) are grown by a top seed crystal pulling method.

作為本發明的碳化矽晶體(4H-SiC)的生長方法的一種優選方案,所述碳源氣體與所述矽源氣體反應形成形成所述碳化矽的溫度為1000℃~1800℃。 As a preferred solution of the method for growing silicon carbide crystal (4H-SiC) according to the present invention, a temperature at which the carbon source gas reacts with the silicon source gas to form the silicon carbide is 1000 ° C. to 1800 ° C.

本發明的碳化矽晶體(4H-SiC)生長設備及方法具有如下有益效果:本發明的碳化矽晶體(4H-SiC)生長設備通過增設碳源及矽源供給系統,可以在碳化矽晶體(4H-SiC)生長過程中為其提供充足的碳源及矽源補給;同時,由於補充的碳源及矽源以碳化矽的形式形成於碳源及矽源溶液 的表面,不會對碳源及矽源溶液的溫度造成不良影響,生長的碳化矽晶體(4H-SiC)中不會產生缺陷。 The silicon carbide crystal (4H-SiC) growth device and method of the present invention have the following beneficial effects: By adding a carbon source and a silicon source supply system, the silicon carbide crystal (4H-SiC) growth device of the present invention can -SiC) provides sufficient carbon and silicon source replenishment during the growth process; at the same time, because the supplemental carbon source and silicon source are formed in the form of silicon carbide on the surface of the carbon source and silicon source solution, the carbon source and silicon source solution will not be affected. The temperature of the silicon source solution adversely affects and no defects are generated in the grown silicon carbide crystal (4H-SiC).

10‧‧‧晶體生長爐 10‧‧‧ Crystal Growth Furnace

11‧‧‧支撐架 11‧‧‧ support

12‧‧‧石墨坩堝 12‧‧‧graphite crucible

13‧‧‧籽晶 13‧‧‧seed

14‧‧‧碳源及矽源 14‧‧‧ Carbon source and silicon source

15‧‧‧基座 15‧‧‧ base

16‧‧‧隔熱層 16‧‧‧ Insulation

17‧‧‧加熱器 17‧‧‧ heater

18‧‧‧碳源及矽源補充容器 18‧‧‧ Carbon source and silicon source supplement container

19‧‧‧補充碳源及矽源 19‧‧‧Supplement of carbon and silicon sources

20‧‧‧晶體生長爐 20‧‧‧ Crystal Growth Furnace

21‧‧‧支撐架 21‧‧‧ support frame

22‧‧‧石墨坩堝 22‧‧‧Graphite Crucible

221‧‧‧坩堝主體 221‧‧‧ Crucible body

222‧‧‧蓋體 222‧‧‧ Cover

2221‧‧‧第二排氣孔 2221‧‧‧Second exhaust hole

23‧‧‧輸氣管 23‧‧‧gas tube

24‧‧‧碳源及矽源 24‧‧‧ Carbon source and silicon source

25‧‧‧加熱器 25‧‧‧heater

26‧‧‧第一排氣孔 26‧‧‧First exhaust hole

27‧‧‧冷卻壁 27‧‧‧ cooling wall

28‧‧‧籽晶 28‧‧‧ Seed

第1圖及第2圖顯示為現有技術中提供的碳化矽晶體(4H-SiC)生長設備的結構示意圖。 FIG. 1 and FIG. 2 are schematic structural diagrams of a silicon carbide crystal (4H-SiC) growth apparatus provided in the prior art.

第3圖顯示為本發明的碳化矽晶體(4H-SiC)生長設備的結構示意圖。 FIG. 3 is a schematic diagram showing a structure of a silicon carbide crystal (4H-SiC) growth apparatus according to the present invention.

第4圖顯示為本發明的碳化矽晶體(4H-SiC)生長設備在晶體生長過程中其內部的溫度分佈示意圖。 FIG. 4 is a schematic diagram showing a temperature distribution inside a silicon carbide crystal (4H-SiC) growth device of the present invention during a crystal growth process.

以下透過特定的具體實例說明本發明的實施方式,本領域技術人員可由本說明書所揭露的內容輕易地瞭解本發明的其他優點與功效。本發明還可以通過另外不同的具體實施方式加以實施或應用,本說明書中的各項細節也可以基於不同觀點與應用,在沒有背離本發明的精神下進行各種修飾或改變。 The following describes the embodiments of the present invention through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through different specific implementations, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

請參閱第3圖~第4圖。需要說明的是,本實施例中所提供的圖示僅以示意方式說明本發明的基本構想,雖圖示中僅顯示與本發明中有關的組件而非按照實際實施時的元件數目、形狀及尺寸繪製,其實際實施時各元件的型態、數量及比例可為一種隨意的改變,且其元件佈局形態也可能更為複雜。 Please refer to Figures 3 to 4. It should be noted that the illustrations provided in this embodiment only illustrate the basic idea of the present invention in a schematic manner, although the illustrations only show the components related to the present invention and not the number, shape and For size drawing, the type, quantity, and proportion of each component can be changed at will in actual implementation, and the layout of the components may be more complicated.

實施例一:Embodiment one:

請參閱第3圖,本發明提供一種碳化矽晶體(4H-SiC)生長設 備,所述碳化矽晶體(4H-SiC)生長設備包括:晶體生長爐20;石墨坩堝22,所述石墨坩堝22位於所述晶體生長爐20內;所述石墨坩堝22適於放置碳化矽晶體(4H-SiC)生長所需的碳源及矽源24;碳源及矽源供給系統,所述碳源及矽源供給系統包括氣體源(未示出)及輸氣管23;所述輸氣管23一端與所述氣體源相連接,另一端自所述晶體生長爐20的頂部延伸至所述晶體生長爐20的內部,並延伸至所述石墨坩堝22內的所述碳源及矽源24上方;所述碳源及矽源供給系統適於在晶體生長過程中向所述晶體生長爐20內通入碳源氣體及矽源氣體,以在所述碳源及矽源24表面形成碳化矽;加熱器25,所述加熱器25位於所述晶體生長爐20內,且位於所述石墨坩堝22的週邊,適於在晶體生長過程中為所述石墨坩堝22內的所述碳源及矽源24加熱以使其熔化,並為所述碳源氣體及所述矽源氣體提供反應所需的溫度,以確保通入到所述晶體生長爐20內的所述碳源氣體及矽源氣體可以反應生成碳化矽。通過增設所述碳源及矽源供給系統,可以在碳化矽晶體(4H-SiC)生長過程中向所述晶體生長爐20內提供充足的所述碳化矽晶體(4H-SiC)生長所需的碳源及矽源補給;同時,由於通入的所述碳源氣體及矽源氣體反應生成碳化矽的形式形成於熔化的所述碳源及矽源24的表面,不會對熔化的碳源及矽源24的溫度造成不良影響,生長的碳化矽晶體(4H-SiC)中不會產生缺陷。 Referring to FIG. 3, the present invention provides a silicon carbide crystal (4H-SiC) growth equipment. The silicon carbide crystal (4H-SiC) growth equipment includes: a crystal growth furnace 20; a graphite crucible 22, the graphite crucible 22 is located at Inside the crystal growth furnace 20; the graphite crucible 22 is suitable for placing a carbon source and a silicon source 24 required for the growth of silicon carbide crystals (4H-SiC); a carbon source and a silicon source supply system, the carbon source and the silicon source The supply system includes a gas source (not shown) and a gas pipe 23; one end of the gas pipe 23 is connected to the gas source, and the other end extends from the top of the crystal growth furnace 20 to the inside of the crystal growth furnace 20 And extends above the carbon source and silicon source 24 in the graphite crucible 22; the carbon source and silicon source supply system is adapted to pass a carbon source gas into the crystal growth furnace 20 during the crystal growth process And a silicon source gas to form silicon carbide on the surface of the carbon source and the silicon source 24; a heater 25, which is located in the crystal growth furnace 20 and located around the graphite crucible 22, is suitable for The carbon source and the silicon source 24 in the graphite crucible 22 during the crystal growth process Heat to make it melt, and provide the temperature required for the carbon source gas and the silicon source gas to react, so as to ensure that the carbon source gas and the silicon source gas passed into the crystal growth furnace 20 can react Formation of silicon carbide. By adding the carbon source and the silicon source supply system, it is possible to provide the crystal growth furnace 20 with sufficient silicon carbide crystal (4H-SiC) growth required during the silicon carbide crystal (4H-SiC) growth process. Carbon source and silicon source replenishment; meanwhile, the form of silicon carbide is formed on the surface of the molten carbon source and silicon source 24 due to the reaction between the carbon source gas and the silicon source gas that is passed in, and the molten carbon source is not affected. And the temperature of the silicon source 24 adversely affects, and no defects are generated in the grown silicon carbide crystal (4H-SiC).

作為示例,所述碳源氣體可以為所有的含碳化合物。優選地,本實施例中,所述碳源氣體為CnHn+2,其中,n1。 As an example, the carbon source gas may be all carbon-containing compounds. Preferably, in this embodiment, the carbon source gas is C n H n + 2 , where n 1.

作為示例,所述矽源氣體包括SiH4、Si2H6、SiH2Cl2、SiHC13、SiCl4、Si2Cl6,及所述矽源氣體可以為SiH4、Si2H6、SiH2Cl2、SiHCl3、SiCl4、 Si2Cl6中的任意一種、任意兩種或兩種以上的組合。 As an example, the silicon source gas includes SiH 4 , Si 2 H 6 , SiH 2 Cl 2 , SiHC 13 , SiCl 4 , Si 2 Cl 6 , and the silicon source gas may be SiH 4 , Si 2 H 6 , SiH Any one of 2 Cl 2 , SiHCl 3 , SiCl 4 , and Si 2 Cl 6 , any two, or a combination of two or more.

作為示例,所述碳化矽晶體(4H-SiC)生長設備還包括第一排氣孔26,所述第一排氣孔26位於所述晶體生長爐20的底部;所述第一排氣孔26適於排出多餘的碳源氣體、矽源氣體及二者的反應生成氣體,以減小所述晶體生長爐20內的壓力,從而減小通入所述碳源氣體及矽源氣體後對所述碳化矽晶體(4H-SiC)生長的不良影響。 As an example, the silicon carbide crystal (4H-SiC) growth device further includes a first exhaust hole 26 located at the bottom of the crystal growth furnace 20; the first exhaust hole 26 It is suitable for exhausting excess carbon source gas, silicon source gas, and the reaction generated gas of the two, so as to reduce the pressure in the crystal growth furnace 20, so as to reduce the impact of the carbon source gas and the silicon source gas on the The adverse effects of silicon carbide crystal (4H-SiC) growth are described.

作為示例,所述石墨坩堝22包括坩堝主體221及蓋體222;所述蓋體222扣置於所述坩堝主體221的頂部,所述碳源及所述矽源24位於所述坩堝主體221內,所述輸氣管23穿過所述蓋體222延伸至所述坩堝主體221內;所述蓋體222內設有上下貫通的第二排氣孔2221;所述第二排氣孔2221適於將多餘的碳源氣體、矽源氣體及二者的反應生成氣體排出所述石墨坩堝22,並經由所述第一排氣孔26排出所述晶體生長爐20,以減小所述晶體生長爐20內的壓力,從而減小通入所述碳源氣體及矽源氣體後對所述碳化矽晶體(4H-SiC)生長的不良影響。 As an example, the graphite crucible 22 includes a crucible body 221 and a cover 222; the cover 222 is buckled on the top of the crucible body 221, and the carbon source and the silicon source 24 are located in the crucible body 221 The gas delivery pipe 23 extends through the cover 222 into the crucible body 221; the cover 222 is provided with a second exhaust hole 2221 penetrating vertically; the second exhaust hole 2221 is suitable for Excess carbon source gas, silicon source gas, and the reaction generated gas of the two are discharged from the graphite crucible 22 and discharged from the crystal growth furnace 20 through the first exhaust hole 26 to reduce the crystal growth furnace. 20 to reduce the adverse effect on the growth of the silicon carbide crystal (4H-SiC) after the carbon source gas and the silicon source gas are introduced.

作為示例,所述加熱器25包括射頻(射頻)加熱器、電阻加熱器或紅外線(紅外)加熱器中的至少一種;即所述加熱器25可以為射頻加熱器;也可以為電阻加熱器;也可以為紅外線加熱器;還可以為射頻加熱器與電阻加熱器的組合,電阻加熱器與紅外線加熱器的組合,射頻加熱器與紅外線加熱器的組合,射頻加熱器、電阻加熱器與紅外線加熱器的組合。 As an example, the heater 25 includes at least one of a radio frequency (radio frequency) heater, a resistance heater, or an infrared (infrared) heater; that is, the heater 25 may be a radio frequency heater; it may also be a resistance heater; It can also be an infrared heater; it can also be a combination of an RF heater and a resistance heater, a combination of a resistance heater and an infrared heater, a combination of an RF heater and an infrared heater, an RF heater, a resistance heater, and infrared heating Device combination.

作為示例,所述碳化矽晶體(4H-SiC)生長設備還包括冷卻壁27,所述冷卻壁27位於所述晶體生長爐20內,且位於所述加熱器25與所述 石墨坩堝22之間。 As an example, the silicon carbide crystal (4H-SiC) growth device further includes a cooling wall 27 located in the crystal growth furnace 20 and between the heater 25 and the graphite crucible 22 .

作為示例,所述碳化矽晶體(4H-SiC)生長設備還包括支撐架21,所述支撐架21位於所述晶體生長爐20內,所述支撐架21用於支持所述石墨坩堝22,即所述石墨坩堝22位於所述支撐架21的頂部。 As an example, the silicon carbide crystal (4H-SiC) growth device further includes a support frame 21 located in the crystal growth furnace 20, and the support frame 21 is used to support the graphite crucible 22, that is, The graphite crucible 22 is located on the top of the support frame 21.

本發明的碳化矽晶體(4H-SiC)生長設備的工作原理為:將籽晶28與所述碳源及矽源24置於所述石墨坩堝22內,並將裝有所述籽晶28、所述碳源及矽源24的所述石墨坩堝22置於所述晶體生長爐20內,使用所述加熱器25加熱使得所述碳源及矽源24熔化,當溫度適合時,所述碳化矽晶體(4H-SiC)在所述籽晶28的表面形成;所述碳源及矽源供給系統可以在所述碳化矽晶體(4H-SiC)開始生長時即向所述晶體生長爐20內通入所述碳源氣體及所述矽源氣體,也可以在所述碳化矽晶體(4H-SiC)生長一段時間後向所述晶體生長爐20內通入所述碳源氣體及所述矽源氣體。在所述碳化矽晶體(4H-SiC)生長過程中,所述晶體生長爐20內的溫度如第4圖所示,由第4圖可知,所述石墨坩堝20內的最大溫度也可以達到1800℃,而所述碳源與所述矽源反應生成所述碳化矽所需的溫度為1000℃~1800℃,由此可知,在所述碳化矽晶體(4H-SiC)生長過程中,所述加熱器25可以提供所述碳源與所述矽源反應所需的溫度。 The working principle of the silicon carbide crystal (4H-SiC) growth device of the present invention is: placing a seed crystal 28, the carbon source and silicon source 24 in the graphite crucible 22, and installing the seed crystal 28, The graphite crucible 22 of the carbon source and the silicon source 24 is placed in the crystal growth furnace 20, and the heater 25 is used to heat the carbon source and the silicon source 24 to melt. When the temperature is suitable, the carbonization A silicon crystal (4H-SiC) is formed on the surface of the seed crystal 28; the carbon source and the silicon source supply system can be inserted into the crystal growth furnace 20 when the silicon carbide crystal (4H-SiC) starts to grow. The carbon source gas and the silicon source gas may be introduced, or the carbon source gas and the silicon may be introduced into the crystal growth furnace 20 after the silicon carbide crystal (4H-SiC) is grown for a period of time. Source gas. During the growth of the silicon carbide crystal (4H-SiC), the temperature in the crystal growth furnace 20 is shown in FIG. 4. As can be seen from FIG. 4, the maximum temperature in the graphite crucible 20 can also reach 1800. ℃, and the temperature required for the carbon source to react with the silicon source to generate the silicon carbide is 1000 ° C to 1800 ° C. It can be seen that during the growth of the silicon carbide crystal (4H-SiC), the The heater 25 may provide a temperature required for the carbon source to react with the silicon source.

實施例二:Embodiment two:

本發明還提供一種碳化矽晶體(4H-SiC)的生長方法,在生長碳化矽晶體(4H-SiC)的同時向晶體生長爐內通入碳源氣體及矽源氣體,以在用於生長碳化矽晶體(4H-SiC)的碳源及矽源表面形成碳化矽。所述碳化矽晶體(4H-SiC)的生長方法在實施例一中所述的碳化矽晶體(4H-SiC)生長設備 中進行,所述碳化矽晶體(4H-SiC)生長設備的具體結構及工作原理請參閱實施例一,此處不再累述。 The invention also provides a method for growing silicon carbide crystals (4H-SiC). When the silicon carbide crystals (4H-SiC) are grown, a carbon source gas and a silicon source gas are introduced into the crystal growth furnace for use in growing carbonization. Silicon carbide (4H-SiC) forms silicon carbide on the carbon source and the surface of the silicon source. The method for growing silicon carbide crystals (4H-SiC) is performed in the silicon carbide crystal (4H-SiC) growth equipment described in Example 1. The specific structure of the silicon carbide crystal (4H-SiC) growth equipment and For the working principle, please refer to the first embodiment, which will not be repeated here.

作為示例,採用頂部籽晶提拉法(TSSG)生長所述碳化矽晶體(4H-SiC)。 As an example, the top seed crystal pulling method (TSSG) is used to grow the silicon carbide crystal (4H-SiC).

作為示例,所述碳源氣體與所述矽源氣體反應形成形成所述碳化矽的溫度為1000℃~1800℃。 As an example, the temperature at which the carbon source gas reacts with the silicon source gas to form the silicon carbide is 1000 ° C to 1800 ° C.

綜上所述,本發明提供一種碳化矽晶體(4H-SiC)生長設備及方法,所述碳化矽晶體(4H-SiC)生長設備包括:晶體生長爐;石墨坩堝,位於所述晶體生長爐內;所述石墨坩堝適於放置碳化矽晶體(4H-SiC)生長所需的碳源及矽源;碳源及矽源供給系統,包括氣體源及輸氣管;所述輸氣管一端與所述氣體源相連接,另一端自所述晶體生長爐的頂部延伸至所述石墨坩堝內的碳源及矽源上方;所述碳源及矽源供給系統適於在晶體生長過程中向所述晶體生長爐內通入碳源氣體及矽源氣體,以在所述碳源及矽源表面形成碳化矽;加熱器,位於所述晶體生長爐內,且位於所述石墨坩堝的週邊,適於在晶體生長過程中為所述石墨坩堝內的所述碳源及矽源加熱以使其熔化,並為所述碳源氣體及所述矽源氣體提供反應所需的溫度。本發明的碳化矽晶體(4H-SiC)生長設備通過增設碳源及矽源供給系統,可以在碳化矽晶體(4H-SiC)生長過程中為其提供充足的碳源及矽源補給;同時,由於補充的碳源及矽源以碳化矽的形式形成於碳源及矽源溶液的表面,不會對碳源及矽源溶液的溫度造成不良影響,生長的碳化矽晶體(4H-SiC)中不會產生缺陷。 In summary, the present invention provides a silicon carbide crystal (4H-SiC) growth equipment and method. The silicon carbide crystal (4H-SiC) growth equipment includes: a crystal growth furnace; a graphite crucible located in the crystal growth furnace. The graphite crucible is suitable for placing a carbon source and a silicon source required for the growth of silicon carbide crystals (4H-SiC); a carbon source and a silicon source supply system including a gas source and a gas pipe; one end of the gas pipe and the gas The source is connected, and the other end extends from the top of the crystal growth furnace to the carbon source and silicon source in the graphite crucible; the carbon source and silicon source supply system is adapted to grow to the crystal during the crystal growth process. A carbon source gas and a silicon source gas are passed into the furnace to form silicon carbide on the surface of the carbon source and the silicon source; a heater is located in the crystal growth furnace and is located around the graphite crucible, and is suitable for During the growth process, the carbon source and the silicon source in the graphite crucible are heated to melt them, and the carbon source gas and the silicon source gas are provided with a temperature required for a reaction. By adding a carbon source and a silicon source supply system, the silicon carbide crystal (4H-SiC) growth device of the present invention can provide sufficient carbon source and silicon source replenishment during the growth process of the silicon carbide crystal (4H-SiC); at the same time, Since the supplemental carbon source and silicon source are formed on the surface of the carbon source and silicon source solution in the form of silicon carbide, the temperature of the carbon source and silicon source solution will not adversely affect the growth of silicon carbide crystals (4H-SiC). No defects.

上述實施例僅例示性說明本發明的原理及其功效,而非用於 限制本發明。任何熟悉此技術的人士皆可在不違背本發明的精神及範疇下,對上述實施例進行修飾或改變。因此,舉凡所屬技術領域中具有通常知識者在未脫離本發明所揭示的精神與技術思想下所完成的一切等效修飾或改變,仍應由本發明的申請專利範圍所涵蓋。 The above-mentioned embodiments merely exemplify the principle of the present invention and its effects, and are not intended to limit the present invention. Anyone familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field to which they belong without departing from the spirit and technical ideas disclosed by the present invention should still be covered by the scope of patent application of the present invention.

Claims (12)

一種碳化矽晶體(4H-SiC)生長設備,包括:晶體生長爐;石墨坩堝,位於所述晶體生長爐內;所述石墨坩堝適於放置碳化矽晶體(4H-SiC)生長所需的碳源及矽源;碳源及矽源供給系統,包括氣體源及輸氣管;所述輸氣管一端與所述氣體源相連接,另一端自所述晶體生長爐的頂部延伸至所述石墨坩堝內的碳源及矽源上方;所述碳源及矽源供給系統適於在晶體生長過程中向所述晶體生長爐內通入碳源氣體及矽源氣體,以在所述碳源及矽源表面形成碳化矽;加熱器,位於所述晶體生長爐內,且位於所述石墨坩堝的週邊,適於在晶體生長過程中為所述石墨坩堝內的所述碳源及矽源加熱以使其熔化,並為所述碳源氣體及所述矽源氣體提供反應所需的溫度。     A silicon carbide crystal (4H-SiC) growth device includes: a crystal growth furnace; a graphite crucible located in the crystal growth furnace; the graphite crucible is suitable for placing a carbon source required for the growth of silicon carbide crystal (4H-SiC) And a silicon source; a carbon source and a silicon source supply system including a gas source and a gas pipe; one end of the gas pipe is connected to the gas source, and the other end extends from the top of the crystal growth furnace into the graphite crucible Above the carbon source and the silicon source; the carbon source and the silicon source supply system are adapted to pass a carbon source gas and a silicon source gas into the crystal growth furnace during a crystal growth process so as to surface the carbon source and the silicon source Forming silicon carbide; a heater, located in the crystal growth furnace and at the periphery of the graphite crucible, is suitable for heating the carbon source and silicon source in the graphite crucible to cause melting during the crystal growth process And provide a temperature required for the carbon source gas and the silicon source gas to react.     如請求項1所述的碳化矽晶體(4H-SiC)生長設備,其中所述碳源氣體為含碳化合物。     The silicon carbide crystal (4H-SiC) growth apparatus according to claim 1, wherein the carbon source gas is a carbon-containing compound.     如請求項2所述的碳化矽晶體(4H-SiC)生長設備,其中所述碳源氣體為C nH n+2,其中n 1。 The silicon carbide crystal (4H-SiC) growth apparatus according to claim 2 , wherein the carbon source gas is C n H n + 2 , where n 1. 如請求項1所述的碳化矽晶體(4H-SiC)生長設備,其中所述矽源氣體包括SiH 4、Si 2H 6、SiH 2Cl 2、SiHCl 3、SiCl 4、Si 2Cl 6The silicon carbide crystal (4H-SiC) growth apparatus according to claim 1, wherein the silicon source gas includes SiH 4 , Si 2 H 6 , SiH 2 Cl 2 , SiHCl 3 , SiCl 4 , Si 2 Cl 6 . 如請求項1所述的碳化矽晶體(4H-SiC)生長設備,其中所述碳化矽晶體(4H-SiC)生長設備還包括第一排氣孔,所述第一排氣孔位於所述晶體生長爐的底部。     The silicon carbide crystal (4H-SiC) growth apparatus according to claim 1, wherein the silicon carbide crystal (4H-SiC) growth apparatus further includes a first exhaust hole, and the first exhaust hole is located in the crystal The bottom of the growing furnace.     如請求項1所述的碳化矽晶體(4H-SiC)生長設備,其中所述石墨坩堝包括坩堝主體及蓋體;所述蓋體扣置於所述坩堝主體之頂部,所述碳源及所述矽源位於所述坩堝主體內,所述輸氣管穿過所述蓋體延伸至所述坩堝主體內;所述蓋體內設有上下貫通的第二排氣孔。     The silicon carbide crystal (4H-SiC) growth equipment according to claim 1, wherein the graphite crucible includes a crucible body and a cover body; the cover body is buckled on the top of the crucible body, the carbon source and the The silicon source is located in the crucible body, and the gas pipe extends through the cover body into the crucible body; the cover body is provided with a second exhaust hole penetrating vertically.     如請求項1所述的碳化矽晶體(4H-SiC)生長設備,其中所述加熱器包括射頻加熱器、電阻加熱器或紅外線加熱器中的至少一種。     The silicon carbide crystal (4H-SiC) growth apparatus according to claim 1, wherein the heater includes at least one of a radio frequency heater, a resistance heater, or an infrared heater.     如請求項1所述碳化矽晶體(4H-SiC)生長設備,其中所述碳化矽晶體(4H-SiC)生長設備還包括冷卻壁,所述冷卻壁位於所述晶體生長爐內,且位於所述加熱器與所述石墨坩堝之間。     The silicon carbide crystal (4H-SiC) growth equipment according to claim 1, wherein the silicon carbide crystal (4H-SiC) growth equipment further includes a cooling wall, the cooling wall is located in the crystal growth furnace, and is located in the crystal growth furnace. The heater and the graphite crucible.     如請求項1所述碳化矽晶體(4H-SiC)生長設備,其中所述碳化矽晶體(4H-SiC)生長設備還包括支撐架,所述支撐架位於所述晶體生長爐內,所述石墨坩堝位於所述支撐架的頂部。     The silicon carbide crystal (4H-SiC) growth equipment according to claim 1, wherein the silicon carbide crystal (4H-SiC) growth equipment further comprises a support frame, the support frame is located in the crystal growth furnace, and the graphite The crucible is located on the top of the support frame.     一種碳化矽晶體(4H-SiC)的生長方法,包括: 在生長碳化矽晶體(4H-SiC)的同時向晶體生長爐內通入碳源氣體及矽源氣體;以及在用於生長碳化矽晶體(4H-SiC)的碳源及矽源表面形成碳化矽。     A method for growing silicon carbide crystals (4H-SiC) includes: introducing carbon source gas and silicon source gas into a crystal growth furnace while growing silicon carbide crystals (4H-SiC); and growing silicon carbide crystals. (4H-SiC) The surface of the carbon source and silicon source forms silicon carbide.     如請求項10所述的碳化矽晶體(4H-SiC)的生長方法,其中採用頂部籽晶提拉法生長所述碳化矽晶體(4H-SiC)。     The method for growing a silicon carbide crystal (4H-SiC) according to claim 10, wherein the silicon carbide crystal (4H-SiC) is grown using a top seed crystal pulling method.     如請求項10所述的碳化矽晶體(4H-SiC)的生長方法,其中所述碳源氣體與所述矽源氣體反應形成形成所述碳化矽的溫度為1000℃~1800℃。     The method for growing silicon carbide crystal (4H-SiC) according to claim 10, wherein a temperature at which the carbon source gas reacts with the silicon source gas to form the silicon carbide is 1000 ° C to 1800 ° C.    
TW106112994A 2016-11-17 2017-04-18 4H-SiC crystal growth equipment and method thereof TW201819696A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??201611022469.0 2016-11-17
CN201611022469.0A CN108070908A (en) 2016-11-17 2016-11-17 4H-SiC crystal growth equipments and method

Publications (1)

Publication Number Publication Date
TW201819696A true TW201819696A (en) 2018-06-01

Family

ID=62160321

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106112994A TW201819696A (en) 2016-11-17 2017-04-18 4H-SiC crystal growth equipment and method thereof

Country Status (2)

Country Link
CN (1) CN108070908A (en)
TW (1) TW201819696A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7186534B2 (en) 2018-07-25 2022-12-09 昭和電工株式会社 Crystal growth device
CN111676519A (en) * 2020-08-05 2020-09-18 郑红军 Silicon carbide crystal melt growing device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6824611B1 (en) * 1999-10-08 2004-11-30 Cree, Inc. Method and apparatus for growing silicon carbide crystals
JP5120758B2 (en) * 2008-10-08 2013-01-16 東海カーボン株式会社 Method for producing silicon carbide single crystal
US10167573B2 (en) * 2010-11-26 2019-01-01 Shin-Etsu Chemical Co., Ltd. Method of producing SiC single crystal
US8940614B2 (en) * 2013-03-15 2015-01-27 Dow Corning Corporation SiC substrate with SiC epitaxial film

Also Published As

Publication number Publication date
CN108070908A (en) 2018-05-25

Similar Documents

Publication Publication Date Title
CN206624942U (en) A kind of device of physical carbon burdening growth carborundum crystals
CN104695012B (en) Device and method for preparing large-size high-quality graphene single crystal
TW201829860A (en) Crucible and manufacture method thereof, and 4h-sic crystal growth method
JP5921498B2 (en) Method for producing silicon single crystal
JP2018501184A5 (en)
JP6491484B2 (en) Silicon carbide crystal growth by silicon chemical vapor transport
CN114990690B (en) Crucible device for preparing silicon carbide monocrystal by gas phase sublimation method
CN112144110B (en) Growth method for growing silicon carbide crystal by PVT (physical vapor transport) method
JP2007126335A (en) Manufacturing facility for manufacturing silicon carbide single crystal by means of solution method
TW201819696A (en) 4H-SiC crystal growth equipment and method thereof
CN110331438A (en) A method of inhibit carbon package volume defect in conductive silicon carbide crystal growth to generate
CN106435734A (en) Seed crystal treatment method for growing low-defect silicon carbide (SiC) single crystals
CN104264215B (en) Sapphire crystal growing device adopting edge defined film-fed growth techniques and growing method
JP2008001569A (en) SINGLE CRYSTAL SiC AND PRODUCTION METHOD THEREFOR, AND APPARATUS FOR PRODUCING SINGLE CRYSTAL SiC
JP2011507247A (en) SiC wafer annealing method and apparatus
JP2010059031A (en) Aluminum oxide single crystal and method for manufacturing the same
CN117286575A (en) Method and device for growing silicon carbide single crystal by solution method
JP5375783B2 (en) Method for producing silicon carbide single crystal
TW201816202A (en) Heat shield of crystal seed growth crucible and method thereof
CN103541000B (en) A kind of device and method preparing boron nitride monocrystal
PL411695A1 (en) Method for producing a long silicon carbide crystals from gaseous phase
JP2007308355A (en) Apparatus and method for manufacturing silicon carbide single crystal
JP2006096578A (en) Method for producing silicon carbide single crystal and ingot of silicon carbide single crystal
JP2004099414A (en) Method of manufacturing silicon carbide single crystal
JP2008050174A (en) SINGLE CRYSTAL SiC AND METHOD FOR PRODUCING THE SAME