TW201818791A - Electronic device - Google Patents
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- TW201818791A TW201818791A TW105136818A TW105136818A TW201818791A TW 201818791 A TW201818791 A TW 201818791A TW 105136818 A TW105136818 A TW 105136818A TW 105136818 A TW105136818 A TW 105136818A TW 201818791 A TW201818791 A TW 201818791A
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Abstract
Description
本發明是有關於電子裝置，特別是有關於將被動元件直立設置於兩電路板之間的電子裝置。 The present invention relates to electronic devices, and more particularly to an electronic device in which a passive component is placed upright between two circuit boards.
在一般的電路設計中，通常會使用大量的被動元件，例如電阻、電容或二極體等等。上述各種被動元件通常具有兩個端部，上述兩個端部一般是位於上述被動元件的不同側面中。因此，在現今的電路設計中，上述被動元件是透過平躺於電路板的方式進行設置。然而，隨著對印刷電路板的要求面積變小，上述被動元件的傳統設置方式，對於電路板的面積會造成一定的限制。因此，需要一種電子裝置，提供有關於上述被動元件之不同的設置方式，減少上述被動元件在電路板中所佔用的面積，藉以改善有關於電路板面積的使用效率。 In general circuit design, a large number of passive components, such as resistors, capacitors or diodes, are often used. The various passive components described above typically have two ends, which are generally located in different sides of the passive component. Therefore, in today's circuit design, the above passive components are arranged by lying on the circuit board. However, as the required area for printed circuit boards becomes smaller, the conventional arrangement of the above passive components imposes certain limitations on the area of the circuit board. Accordingly, there is a need for an electronic device that provides a different arrangement of the passive components described above, reducing the area occupied by the passive components in the circuit board, thereby improving the efficiency of use with respect to the board area.
本發明一實施例提供一種電子裝置，包括一第一電路板、一第二電路板、以及一第一被動元件。該被動元件沿著一第一方向的兩側分別具備一第一端部以及一第二端部。其中，該第一端部連接該第一電路板的第一表面，而該第二端部連接該第二電路板的第一表面。其中，該第一電路板的第一表面以及該第二電路板的第一表面包夾該第一被動元件。 An embodiment of the invention provides an electronic device including a first circuit board, a second circuit board, and a first passive component. The passive component has a first end and a second end respectively along two sides of a first direction. The first end is connected to the first surface of the first circuit board, and the second end is connected to the first surface of the second circuit board. The first surface of the first circuit board and the first surface of the second circuit board sandwich the first passive component.
本發明一實施例提供一種電子裝置，包括一第一電路板、一第二電路板以及第一組被動元件。該等第一組被動元件個別具有沿著一第一方向的兩側的第一端部和第二端部。其中，該等第一組被動元件以該等第一端部向下連接該第一電路板且該等第二端部向上連接該第二電路板的方式，使該等第一組被動元件立於該第一電路板和該第二電路板之間。其中，該第二電路板具有一連接部，用以連接該等第一組被動元件的該等第二端部。 An embodiment of the invention provides an electronic device including a first circuit board, a second circuit board, and a first set of passive components. The first set of passive components individually have a first end and a second end along both sides of a first direction. The first group of passive components are connected such that the first end portions are connected to the first circuit board and the second end portions are connected to the second circuit board. Between the first circuit board and the second circuit board. The second circuit board has a connecting portion for connecting the second ends of the first set of passive components.
依據本發明某些實施例所提供的電子裝置，透過直立的方式將被動元件設置在一第一電路板，可減少該被動元件在該第一電路板所占用的面積。依據本發明某些實施例所提供的電子裝置，透過直立的方式將複數被動元件的複數第一端部設置在一第一電路板，且將該等被動元件的複數第二端部連接一第二電路板的複數連接端點(該第二電路板的該等連接端點相互耦接)，另外透過一導電元件連接該第二電路板之該等連接端點與該第一電路板之單一連接端點，藉此在該第一電路板上透過該第一電路板之單一連接端點耦接該等被動元件的該等第二端部，進而提高該第一電路板佈線的彈性空間。依據本發明某些實施例所提供的電子裝置，透過直立的方式設置被動元件，可提高上述被動元件的散熱表現，進一步改善電路的整體效能。 According to some embodiments of the present invention, the passive component is disposed on a first circuit board in an upright manner, thereby reducing the area occupied by the passive component on the first circuit board. According to some embodiments of the present invention, the plurality of first ends of the plurality of passive components are disposed on a first circuit board in an upright manner, and the plurality of second ends of the passive components are connected to each other. a plurality of connection terminals of the two circuit boards (the connection terminals of the second circuit board are coupled to each other), and the connection terminals of the second circuit board and the first circuit board are connected through a conductive component Connecting the end points, thereby coupling the second ends of the passive components through the single connection end of the first circuit board on the first circuit board, thereby improving the flexible space of the first circuit board wiring. According to some embodiments of the present invention, the passive component is disposed in an upright manner to improve the heat dissipation performance of the passive component and further improve the overall performance of the circuit.
100‧‧‧電子裝置 100‧‧‧Electronic devices
110‧‧‧主電路板 110‧‧‧ main board
120‧‧‧輔助電路板 120‧‧‧Auxiliary circuit board
111、121‧‧‧電路板表面 111, 121‧‧‧ board surface
130‧‧‧被動元件 130‧‧‧ Passive components
131、132‧‧‧端部 131, 132‧‧‧ end
140‧‧‧第一方向 140‧‧‧First direction
150、160‧‧‧切線方向 150, 160‧‧‧ Tangential direction
200A、200B‧‧‧電子裝置 200A, 200B‧‧‧ electronic devices
210、220、221、222‧‧‧電路板 210, 220, 221, 222‧‧‧ circuit boards
211、221、2211、2221‧‧‧電路板表面 211, 221, 2211, 2221‧‧‧ board surface
230、240‧‧‧被動元件 230, 240‧‧‧ Passive components
231、232、241、242‧‧‧端部 231, 232, 241, 242‧‧‧ end
300‧‧‧電子裝置 300‧‧‧Electronic devices
310、321、322‧‧‧電路板 310, 321, 322‧‧‧ boards
311、3211、3221‧‧‧電路板表面 311, 3211, 3221‧‧‧ board surface
330、340‧‧‧被動元件 330, 340‧‧‧ Passive components
331、332、341、342‧‧‧端部 331, 332, 341, 342‧‧ ‧ end
400‧‧‧電子裝置 400‧‧‧Electronic devices
410、420‧‧‧電路板 410, 420‧‧‧ circuit board
411、421‧‧‧電路板表面 411, 421‧‧‧ board surface
431-433‧‧‧被動元件 431-433‧‧‧ Passive components
434‧‧‧零歐姆電阻元件 434‧‧‧zero ohmic resistance element
441-444、451-454‧‧‧端部 441-444, 451-454‧‧‧ end
500‧‧‧電子裝置 500‧‧‧Electronic devices
510、520‧‧‧電路板 510, 520‧‧‧ circuit board
511、521‧‧‧電路板表面 511, 521‧‧‧ board surface
531、532、534、535‧‧‧被動元件 531, 532, 534, 535‧‧‧ Passive components
533、536‧‧‧零歐姆電阻元件 533, 536‧‧‧ zero ohm resistance element
541-546、551-556‧‧‧端部 541-546, 551-556‧‧‧ end
600‧‧‧電子裝置 600‧‧‧Electronic devices
610、621、622‧‧‧電路板 610, 621, 622‧‧‧ circuit boards
611、6211、6221‧‧‧電路板表面 611, 6211, 6221‧‧‧ board surface
6212、6222‧‧‧連接部 6212, 6222‧‧‧ Connections
631、632、634、635‧‧‧被動元件 631, 632, 634, 635‧‧‧ Passive components
633、636‧‧‧零歐姆電阻元件 633, 636‧‧‧ zero ohm resistance element
641-646、651-656‧‧‧端部 641-646, 651-656‧‧‧ end
第1A圖是依據本發明一實施例之電子裝置的示意圖； 第1B圖是第1A圖的俯視圖；第2A圖是依據本發明一實施例之電子裝置的示意圖；第2B圖是依據本發明一實施例之電子裝置的示意圖；第3圖是依據本發明一實施例之電子裝置的示意圖；第4圖是依據本發明一實施例之電子裝置的示意圖；第5圖是依據本發明一實施例之電子裝置的示意圖；第6A圖是依據本發明一實施例之電子裝置的示意圖；第6B圖是第6A圖的俯視圖。 1A is a schematic view of an electronic device according to an embodiment of the present invention; FIG. 1B is a plan view of FIG. 1A; FIG. 2A is a schematic view of an electronic device according to an embodiment of the present invention; FIG. 3 is a schematic diagram of an electronic device according to an embodiment of the invention; FIG. 4 is a schematic diagram of an electronic device according to an embodiment of the invention; FIG. 5 is a schematic diagram of an electronic device according to an embodiment of the invention; A schematic diagram of an electronic device; FIG. 6A is a schematic diagram of an electronic device according to an embodiment of the present invention; and FIG. 6B is a plan view of FIG. 6A.
為讓本發明之上述目的、特徵和優點能更明顯易懂，下文特舉出本發明之具體實施例，並配合所附圖式，做詳細說明如下。 The above described objects, features and advantages of the present invention will become more apparent from the aspects of the invention.
第1A圖是依據本發明一實施例之電子裝置100的示意圖。電子裝置100包括主電路板110、輔助電路板120以及被動元件130。被動元件130沿著第一方向140的兩側分別具備端部131與端部132。端部131連接主電路板110的電路板表面111；而端部132連接輔助電路板120的電路板表面121。在此實施例中，被動元件130被包夾於主電路板110與輔助電路板120之間，在此情況下，由端部131指向端部132的第一方向140與電路板表面111的表面切線方向150不為平行關係(亦即，第一方向140與切線方向150相互交錯)；由端部131指向端部132的第一方向140與電路板表面121的表面切線方向160亦不為平行關係(亦即，第一方向140與切線方向160相互交錯)。在此實施例中，輔助電路板120之電路板表面121的面積，在第一方向140 上與主電路板110之電路板表面111的面積重疊，如第1B圖所示。 FIG. 1A is a schematic diagram of an electronic device 100 in accordance with an embodiment of the present invention. The electronic device 100 includes a main circuit board 110, an auxiliary circuit board 120, and a passive component 130. The passive element 130 is provided with an end portion 131 and an end portion 132 along both sides of the first direction 140, respectively. The end portion 131 is connected to the circuit board surface 111 of the main circuit board 110; and the end portion 132 is connected to the circuit board surface 121 of the auxiliary circuit board 120. In this embodiment, the passive component 130 is sandwiched between the main circuit board 110 and the auxiliary circuit board 120, in this case, the end 131 is directed toward the first direction 140 of the end 132 and the surface of the board surface 111. The tangential direction 150 is not in a parallel relationship (ie, the first direction 140 and the tangential direction 150 are interdigitated); the first direction 140 from the end 131 directed toward the end 132 is not parallel to the surface tangential direction 160 of the board surface 121. The relationship (ie, the first direction 140 and the tangential direction 160 are interdigitated). In this embodiment, the area of the board surface 121 of the auxiliary circuit board 120 overlaps the area of the board surface 111 of the main circuit board 110 in the first direction 140, as shown in FIG. 1B.
在一些實施例中，電路板表面121有至少一部份的面積，在第一方向140上與主電路板110之電路板表面111的面積重疊。在一些實施例中，被動元件130可為電容、電感、電阻或二極體等元件，而本發明並不受限於此。在一些實施例中，被動元件130為表面黏著元件(surface mount device (SMD))。在一些實施例中，主電路板110通常亦設置有其他的電路、電源節點、元件等，為簡潔起在此不予圖示。 In some embodiments, the board surface 121 has at least a portion of the area that overlaps the area of the board surface 111 of the main circuit board 110 in the first direction 140. In some embodiments, the passive component 130 can be a component such as a capacitor, an inductor, a resistor, or a diode, and the invention is not limited thereto. In some embodiments, passive component 130 is a surface mount device (SMD). In some embodiments, the main circuit board 110 is also typically provided with other circuits, power supply nodes, components, etc., which are not shown here for brevity.
第2A圖是依據本發明一實施例之電子裝置200A的示意圖。電子裝置200包括電路板210、電路板220、被動元件230以及被動元件240。被動元件230具備端部231與端部232，而被動元件240具備端部241與端部242。其中，端部231與端部241連接電路板210的電路板表面211；而端部232與端部242連接電路板220的電路板表面221。在此實施例中，被動元件230與被動元件240皆被包夾於電路板210與電路板220之間；端部232連接電路板220之一電壓節點(例如供應電壓的節點)，而端部242連接電路板220之另一電壓節點(例如一接地電位的節點)。在一些實施例中，電路板220可透過不同的電壓節點連接不同的被動元件，藉此讓整體電路設計在佈線上有更有彈性。在一些實施例中，端部232與端部242亦可連接電路板220之同一個電壓節點。 2A is a schematic diagram of an electronic device 200A in accordance with an embodiment of the present invention. The electronic device 200 includes a circuit board 210, a circuit board 220, a passive component 230, and a passive component 240. The passive component 230 has an end 231 and an end 232, and the passive component 240 has an end 241 and an end 242. The end portion 231 and the end portion 241 are connected to the circuit board surface 211 of the circuit board 210; and the end portion 232 and the end portion 242 are connected to the circuit board surface 221 of the circuit board 220. In this embodiment, both the passive component 230 and the passive component 240 are sandwiched between the circuit board 210 and the circuit board 220; the end 232 connects one of the voltage nodes of the circuit board 220 (eg, a node for supplying voltage), and the end portion 242 is connected to another voltage node of the circuit board 220 (for example, a node of a ground potential). In some embodiments, the circuit board 220 can connect different passive components through different voltage nodes, thereby making the overall circuit design more flexible in wiring. In some embodiments, end 232 and end 242 may also be connected to the same voltage node of circuit board 220.
第2B圖是依據本發明一實施例之電子裝置200B的示意圖。電子裝置200B包括電路板210、電路板221、電路板 222、被動元件230以及被動元件240。被動元件230具備端部231與端部232，而被動元件240具備端部241與端部242。其中，端部231與端部241連接電路板210的電路板表面211；而端部232與端部242個別連接電路板221的電路板表面2211以及電路板222的電路板表面2221，如第2B圖所示。在此實施例中，被動元件230被包夾於電路板210與電路板221之間，而被動元件240則是被包夾於電路板210與電路板222之間。在此實施例中，被動元件230與被動元件240個別連接至電路板221與電路板222，而透過使用電路板221與電路板222，可使用相較於第2A圖中電路板220更少的電路板面積。在一些實施例中，端部232與端部242可耦接至同一個電壓節點。在一些實施例中，端部232與端部242可個別耦接至不同的電壓節點。 2B is a schematic diagram of an electronic device 200B in accordance with an embodiment of the present invention. The electronic device 200B includes a circuit board 210, a circuit board 221, a circuit board 222, a passive component 230, and a passive component 240. The passive component 230 has an end 231 and an end 232, and the passive component 240 has an end 241 and an end 242. Wherein, the end portion 231 and the end portion 241 are connected to the circuit board surface 211 of the circuit board 210; and the end portion 232 and the end portion 242 are individually connected to the circuit board surface 2211 of the circuit board 221 and the circuit board surface 2221 of the circuit board 222, such as the 2B. The figure shows. In this embodiment, the passive component 230 is sandwiched between the circuit board 210 and the circuit board 221, and the passive component 240 is sandwiched between the circuit board 210 and the circuit board 222. In this embodiment, the passive component 230 and the passive component 240 are individually connected to the circuit board 221 and the circuit board 222, and by using the circuit board 221 and the circuit board 222, less can be used than the circuit board 220 of FIG. 2A. Board area. In some embodiments, end 232 and end 242 can be coupled to the same voltage node. In some embodiments, end 232 and end 242 can be individually coupled to different voltage nodes.
第3圖是依據本發明一實施例之電子裝置300的示意圖。電子裝置300包括電路板310、電路板321、電路板322、被動元件330以及被動元件340。被動元件330具備端部331與端部332，而被動元件340具備端部341與端部342。如第3圖所示，端部331與端部341連接電路板310的電路板表面311；而端部332與端部342個別連接電路板321的電路板表面3211以及電路板322的電路板表面3221。在此實施例中，被動元件330被包夾於電路板310與電路板321之間，而被動元件340則是被包夾於電路板310與電路板322之間。在此實施例中，電路板321與電路板322可用以連接不同元件尺寸的被動元件(例如被動元件330與被動元件340)，藉此使不同元件尺寸的被動元件皆可被直立地設置。在一些實施例中，被動元件330是使用0402規格 的表面黏著元件，而被動元件340則是使用0201規格的表面黏著元件。 FIG. 3 is a schematic diagram of an electronic device 300 in accordance with an embodiment of the present invention. The electronic device 300 includes a circuit board 310, a circuit board 321, a circuit board 322, a passive component 330, and a passive component 340. The passive component 330 has an end 331 and an end 332, and the passive component 340 has an end 341 and an end 342. As shown in FIG. 3, the end portion 331 and the end portion 341 are connected to the circuit board surface 311 of the circuit board 310; and the end portion 332 and the end portion 342 are individually connected to the circuit board surface 3211 of the circuit board 321 and the circuit board surface of the circuit board 322. 3221. In this embodiment, the passive component 330 is sandwiched between the circuit board 310 and the circuit board 321, and the passive component 340 is sandwiched between the circuit board 310 and the circuit board 322. In this embodiment, the circuit board 321 and the circuit board 322 can be used to connect passive components of different component sizes (such as the passive component 330 and the passive component 340), whereby passive components of different component sizes can be placed upright. In some embodiments, the passive component 330 is a surface-adhesive component of the 0402 size and the passive component 340 is a surface-adhesive component of the 0201 gauge.
基於上述各實施例，被動元件可透過直立的設置方式進行配置，若複數個被動元件具有連接至相同電壓節點的複數端部，則該等端部可被統合連接至相同的電路板，如第4圖所示。第4圖是依據本發明一實施例之電子裝置400的示意圖。電子裝置400包括電路板410、電路板420、被動元件431~433以及零歐姆電阻元件434。零歐姆電阻元件434具備端部444與端部454，而被動元件431~433個別具備端部441~443以及端部451~453。如第4圖所示，被動元件431~433以及零歐姆電阻元件434透過端部441~444連接電路板表面411；此外，被動元件431~433透過端部451~453，連接電路板表面421中連接一第一電位的一連接部，而電路板表面421之上述連接部再透過零歐姆電阻元件434連接至電路板表面411中連接上述第一電位的電壓節點。在此實施例中，透過將被動元件431~433以直立的方式進行設置，可在電路板410中透過單一個連接端點(亦即連接端部444的連接端點)來耦接被動元件431~433的端部451~453，藉此簡化電路板410的佈線複雜度，同時也可節省電路板410的使用面積。此外，基於本發明所提供之各種實施例，透過直立的方式設置被動元件，可提高上述被動元件的散熱表現，進一步改善電路的整體效能。另外，在一些實施例中，可透過其他導電元件取代零歐姆電組元件434，例如透過導線連接電路板420之上述連接部，以及連接電路板410之連接上述第一電位的電壓節點。 Based on the above embodiments, the passive component can be configured in an upright arrangement. If the plurality of passive components have a plurality of ends connected to the same voltage node, the ends can be integrated and connected to the same circuit board, such as Figure 4 shows. 4 is a schematic diagram of an electronic device 400 in accordance with an embodiment of the present invention. The electronic device 400 includes a circuit board 410, a circuit board 420, passive components 431-433, and a zero ohmic resistance component 434. The zero ohmic resistance element 434 includes an end portion 444 and an end portion 454, and the passive elements 431 to 433 individually have end portions 441 to 443 and end portions 451 to 453. As shown in FIG. 4, the passive components 431 to 433 and the zero ohmic resistance component 434 are connected to the circuit board surface 411 through the end portions 441 to 444. Further, the passive components 431 to 433 are connected to the circuit board surface 421 through the end portions 451 to 453. A connection portion of a first potential is connected, and the connection portion of the surface 421 of the circuit board is further connected to a voltage node connected to the first potential in the surface 411 of the circuit board through the zero ohmic resistance element 434. In this embodiment, by disposing the passive components 431-433 in an upright manner, the passive component 431 can be coupled in the circuit board 410 through a single connection end point (ie, the connection end point of the connection end 444). The ends 451 to 453 of ~433, thereby simplifying the wiring complexity of the circuit board 410, and also saving the use area of the circuit board 410. In addition, based on the various embodiments provided by the present invention, by providing the passive component in an upright manner, the heat dissipation performance of the passive component can be improved, and the overall performance of the circuit can be further improved. In addition, in some embodiments, the zero-ohmic electrical component 434 can be replaced by other conductive components, such as the connection portion of the circuit board 420 through the wire, and the voltage node connecting the circuit board 410 to the first potential.
第5圖是依據本發明一實施例之電子裝置500的示意圖。電子裝置500包括電路板510、電路板520、被動元件531、532、534、535以及零歐姆電阻元件533、536。零歐姆電阻元件533、536個別具備端部543、553、546、556，而被動元件531、532、534、535個別具備端部541、551、542、552、544、554、545、555。在此實施例中，531、532、534、535以及零歐姆電阻元件533、536透過端部541~546連接電路板表面511。此外，被動元件531、532個別透過端部551、552，連接電路板表面521中連接一第一電位的一連接部，而電路板表面521之上述連接部再透過零歐姆電阻元件533連接至電路板表面511中連接上述第一電位的電壓節點；被動元件534、535個別透過端部554、555，連接電路板表面521中連接一第二電位的一第二連接部，而電路板表面521之上述第二連接部再透過零歐姆電阻元件536連接至電路板表面511中連接上述第二電位的電壓節點。在此實施例中，連接至不同電壓節點的被動元件，可透過不同的零歐姆電阻元件進行連接。在一些實施例中，連接至不同電壓節點的被動元件，可透過不同的電路板以及不同的零歐姆電阻元件進行連接。 FIG. 5 is a schematic diagram of an electronic device 500 in accordance with an embodiment of the present invention. The electronic device 500 includes a circuit board 510, a circuit board 520, passive components 531, 532, 534, 535 and zero ohmic resistance elements 533, 536. The zero ohmic resistance elements 533 and 536 are individually provided with end portions 543, 553, 546, and 556, and the passive elements 531, 532, 534, and 535 are individually provided with end portions 541, 551, 542, 552, 544, 554, 545, and 555. In this embodiment, 531, 532, 534, 535 and zero ohmic resistance elements 533, 536 are connected to circuit board surface 511 through ends 541-546. In addition, the passive components 531 and 532 are respectively connected to the connection portion 551 and 552 to connect a connection portion of the circuit board surface 521 to the first potential, and the connection portion of the circuit board surface 521 is further connected to the circuit through the zero ohm resistance element 533. a voltage node of the first potential is connected to the surface 511 of the board; the passive components 534 and 535 are respectively transmitted through the end portions 554 and 555 to connect a second connection portion of the circuit board surface 521 to a second potential, and the surface of the circuit board 521 The second connecting portion is further connected to a voltage node connected to the second potential in the surface 511 of the circuit board through the zero ohmic resistance element 536. In this embodiment, passive components connected to different voltage nodes can be connected through different zero ohmic resistor elements. In some embodiments, passive components connected to different voltage nodes can be connected through different boards and different zero ohmic resistor elements.
第6A圖是依據本發明一實施例之電子裝置600的示意圖。電子裝置600包括電路板610、電路板621、電路板622、被動元件631、632、634、635以及零歐姆電阻元件633、636。零歐姆電阻元件633、636個別具備端部643、653、646、656,而被動元件631、632、634、635個別具備端部641、651、642、652、644、654、645、655。在此實施例中，由於被動元件631、 632與被動元件634、635的元件尺寸不同，因此個別透過不同元件尺寸的零歐姆電阻元件633、636進行連接。如第6圖所示，端部641~646連接電路板表面611，而端部651、652、653在電路板621中透過連接部6212連接在一起(如第6B圖所示)，並透過零歐姆電阻元件633連接至電路板表面611；而端部654、655、656在電路板622中透過連接部6222連接在一起(如第6B圖所示)，並透過零歐姆電阻元件636連接至電路板表面611。在此情況下，電路板610可透過單一個連接端點(亦即連接端部643的連接端點)耦接端部651、652，同時可透過另一個連接端點(亦即連接端部646的連接端點)耦接端部654、655，藉此增加電路板的佈線彈性，並且減少電路板610的面積。在一些實施例中，端部651~656可耦接至相同的電位。在一些實施例中，端部651~653可耦接至與端部654~656不同的電位。 FIG. 6A is a schematic diagram of an electronic device 600 in accordance with an embodiment of the present invention. The electronic device 600 includes a circuit board 610, a circuit board 621, a circuit board 622, passive components 631, 632, 634, 635, and zero ohmic resistance elements 633, 636. The zero ohmic resistance elements 633, 636 are individually provided with end portions 643, 653, 646, 656, while the passive elements 631, 632, 634, 635 are individually provided with end portions 641, 651, 642, 652, 644, 654, 645, 655. In this embodiment, since the passive elements 631, 632 and the passive elements 634, 635 have different component sizes, the zero ohmic resistance elements 633, 636 are individually connected through different component sizes. As shown in FIG. 6, the end portions 641 to 646 are connected to the circuit board surface 611, and the end portions 651, 652, and 653 are connected together in the circuit board 621 through the connecting portion 6212 (as shown in FIG. 6B), and are transmitted through zero. The ohmic resistance element 633 is connected to the circuit board surface 611; and the end portions 654, 655, 656 are connected together in the circuit board 622 through the connection portion 6222 (as shown in FIG. 6B) and connected to the circuit through the zero ohm resistance element 636. Board surface 611. In this case, the circuit board 610 can be coupled to the end portions 651, 652 through a single connection end point (ie, the connection end point of the connection end portion 643) while passing through the other connection end point (ie, the connection end portion 646). The connection terminals) couple the ends 654, 655, thereby increasing the wiring flexibility of the board and reducing the area of the board 610. In some embodiments, the ends 651-656 can be coupled to the same potential. In some embodiments, the ends 651-653 can be coupled to different potentials than the ends 654-656.
本發明雖以較佳實施例揭露如上，然其並非用以限定本發明的範圍，任何熟習此項技藝者，在不脫離本發明之精神和範圍內，當可做些許的更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 The present invention has been described above with reference to the preferred embodiments thereof, and is not intended to limit the scope of the present invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
Claims (10)
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| TWI759831B (en) * | 2019-09-06 | 2022-04-01 | 美商伊路米納有限公司 | Pcb interconnect scheme for co-planar led strips |
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| TW200908824A (en) * | 2007-08-13 | 2009-02-16 | Delta Electronics Inc | Surface mount connector and circuit board assembly having same |
| TWM380566U (en) * | 2010-01-22 | 2010-05-11 | Advanced Connection Tech Inc | Transformer module |
| US9934913B2 (en) * | 2011-10-26 | 2018-04-03 | Nokia Technologies Oy | Apparatus and associated methods |
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