CN108770197A - A kind of the pad group and printed circuit board of upper pull down resistor - Google Patents

A kind of the pad group and printed circuit board of upper pull down resistor Download PDF

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Publication number
CN108770197A
CN108770197A CN201810514487.3A CN201810514487A CN108770197A CN 108770197 A CN108770197 A CN 108770197A CN 201810514487 A CN201810514487 A CN 201810514487A CN 108770197 A CN108770197 A CN 108770197A
Authority
CN
China
Prior art keywords
pad
pull
resistor
carry out
needing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810514487.3A
Other languages
Chinese (zh)
Inventor
陈然
张习俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongxin International Electronics Co Ltd
Original Assignee
Zhongxin International Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhongxin International Electronics Co Ltd filed Critical Zhongxin International Electronics Co Ltd
Priority to CN201810514487.3A priority Critical patent/CN108770197A/en
Publication of CN108770197A publication Critical patent/CN108770197A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out

Abstract

The invention discloses a kind of pad groups of upper pull down resistor, including:First pad is used for source of welding current pin, is additionally operable to weld the first end of pull-up resistor when needing to carry out signal pull-up;Second pad is additionally operable to weld the first end of pull down resistor when needing to carry out signal drop-down for welding grounding pin;Third pad is used for welding signal output pin, is additionally operable to weld the second end of pull-up resistor when needing to carry out signal pull-up, the second end of pull down resistor is welded when needing to carry out signal drop-down.Two pads for being used for welding signal output pin in compared with the existing technology, a third pad is only needed in the present invention, the reduction of number of pads directly reduces the area of the pad group occupancy printed circuit board of pull down resistor, cost is reduced, and reduces the wiring on printed circuit board and the layout difficulty of other components.The invention also discloses a kind of printed circuit boards, have advantageous effect identical with pad group as above.

Description

A kind of the pad group and printed circuit board of upper pull down resistor
Technical field
The present invention relates to field of power electronics, more particularly to a kind of pad group of upper pull down resistor, the invention further relates to A kind of printed circuit board.
Background technology
In daily life, can often touch various processors, certain signals that processor is exported into It when row processing, needs that these signals are pulled up or pulled down, the effect of pull-up is that uncertain signal is electric by pulling up Hinder clamped in high level, pull-up resistor plays metering function simultaneously, and drop-down is to be generally used for signal ground by pull down resistor Protection signal is provided with the pad group for connecting upper pull down resistor, including four welderings on a printed circuit in the prior art Disk, two of which pad are used for the signal output pin of soldering device, other two pad is respectively used to source of welding current pin And ground pin, when needing to carry out signal pull-up, by the both ends of pull-up resistor respectively with the pad of power pins and wherein The pad solder of one signal output pin, when need carry out signal drop-down when, by the both ends of pull down resistor respectively with ground pin Pad and the pad of another signal output pin welded, the signal in the prior art for soldering device is defeated The area for going out two pads occupancy printed circuit board of pin is excessive, increases cost, and increase the cloth in printed circuit board The difficulty of the layout of line and other elements.
Therefore, how to provide it is a kind of solve above-mentioned technical problem scheme be that those skilled in the art need to solve at present Problem.
Invention content
The object of the present invention is to provide a kind of pad groups of upper pull down resistor, and the area for occupying printed circuit board is smaller, drop Low cost, and reduce the wiring on printed circuit board and the layout difficulty of other components;Another object of the present invention It is to provide a kind of printed circuit board of the pad group including above-mentioned upper pull down resistor, the area for occupying printed circuit board is smaller, drop Low cost, and reduce the wiring on printed circuit board and the layout difficulty of other components.
In order to solve the above technical problems, the present invention provides a kind of pad groups of upper pull down resistor, including:
First pad is used for source of welding current pin, is additionally operable to the of the welding pull-up resistor when needing to carry out signal pull-up One end;
Second pad is additionally operable to weld the first of pull down resistor when needing to carry out signal drop-down for welding grounding pin End;
Third pad is used for welding signal output pin, is additionally operable to weld the pull-up when needing to carry out signal pull-up The second end of resistance welds the second end of the pull down resistor when needing to carry out signal drop-down.
Preferably, the surface of at least one of first pad, second pad and described third pad is set Help weldering film.
Preferably, described that weldering film is helped to weld film OSP for organic guarantor.
Preferably, at least one of first pad, second pad and described third pad are round weld Disk.
Preferably, adjacent spacing model between the two in first pad, second pad and the third pad It encloses for 1mm to 2mm.
In order to solve the above technical problems, the present invention also provides a kind of printed circuit board, including any one of them as above The pad group of upper pull down resistor.
The present invention provides a kind of pad groups of upper pull down resistor, including:First pad is used for source of welding current pin, also First end for welding pull-up resistor when needing to carry out signal pull-up;Second pad is additionally operable to work as welding grounding pin Need to carry out the first end of welding pull down resistor when signal drop-down;Third pad is used for welding signal output pin, is additionally operable to work as The second end for needing to carry out welding pull-up resistor when signal pull-up, the second of pull down resistor is welded when needing to carry out signal drop-down End.
As it can be seen that in the present invention, third pad can welding signal output pin will be upper when needing to carry out signal pull-up The both ends of pull-up resistor are electric by drop-down when needing to carry out signal drop-down respectively with the first pad and third pad solder The both ends of resistance respectively with the second pad and third pad solder, compared with the existing technology in two be used for welding signal The pad of output pin only needs a third pad, the reduction of number of pads to directly reduce drop-down in of the invention The pad group of resistance occupies the area of printed circuit board, reduces cost, and reduce the wiring on printed circuit board and its The layout difficulty of his component.
The present invention also provides a kind of printed circuit boards, have advantageous effect identical with pad group as above.
Description of the drawings
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to institute in the prior art and embodiment Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings Obtain other attached drawings.
Fig. 1 is a kind of structural schematic diagram of the pad group of upper pull down resistor provided by the invention.
Specific implementation mode
Core of the invention is to provide a kind of pad group of upper pull down resistor, and the area for occupying printed circuit board is smaller, drop Low cost, and reduce the wiring on printed circuit board and the layout difficulty of other components;Another core of the present invention It is to provide a kind of printed circuit board of the pad group including above-mentioned upper pull down resistor, the area for occupying printed circuit board is smaller, drop Low cost, and reduce the wiring on printed circuit board and the layout difficulty of other components.
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art The every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Referring to FIG. 1, Fig. 1 is a kind of structural schematic diagram of the pad group of upper pull down resistor provided by the invention, including:
First pad 1 is used for source of welding current pin, is additionally operable to the of the welding pull-up resistor when needing to carry out signal pull-up One end;
Second pad 2 is additionally operable to weld the first of pull down resistor when needing to carry out signal drop-down for welding grounding pin End;
Third pad 3 is used for welding signal output pin, is additionally operable to weld pull-up resistor when needing to carry out signal pull-up Second end, when need carry out signal drop-down when weld pull down resistor second end.
In view of the technical problem in above-mentioned background technology, in the embodiment of the present invention, for welding signal output pin Pad is only with a third pad 3, the pad for being used for welding signal output pin instead of two in the prior art, The reduction of number of pads directly reduces the area of pad group, and then reduces the area of printed circuit board, saves cost, and The reduction of the pad group area of upper pull down resistor is conducive to the layout of other components on printed circuit board, is also beneficial to printing electricity The wiring of road plate.
Specifically, the signal in signal output pin can be multi-signal, such as can be the output of various processors Multi-signal etc. can be connected to the embodiment of the present invention and be carried when certain signal is pulled up or pulls down processing On the third pad 3 of confession, then by pull-up resistor, either pull down resistor is welded with power supply or ground, is operated Compare easy.
Wherein, the signal output pin in the embodiment of the present invention can be GPIO (General Purpose Input Output, general I/O port).
Certainly, other than GPIO, signal output pin can also be other types, and the embodiment of the present invention does not limit herein It is fixed.
Specifically, the power pins in the embodiment of the present invention can be VCC (Volt Current Condenser, power supply Voltage), ground pin can be in GND (electric wire ground terminal) digitally or simulation ground, the embodiment of the present invention do not limit herein It is fixed.
The present invention provides a kind of pad groups of upper pull down resistor, including:First pad is used for source of welding current pin, also First end for welding pull-up resistor when needing to carry out signal pull-up;Second pad is additionally operable to work as welding grounding pin Need to carry out the first end of welding pull down resistor when signal drop-down;Third pad is used for welding signal output pin, is additionally operable to work as The second end for needing to carry out welding pull-up resistor when signal pull-up, the second of pull down resistor is welded when needing to carry out signal drop-down End.
As it can be seen that in the present invention, third pad can welding signal output pin will be upper when needing to carry out signal pull-up The both ends of pull-up resistor are electric by drop-down when needing to carry out signal drop-down respectively with the first pad and third pad solder The both ends of resistance respectively with the second pad and third pad solder, compared with the existing technology in two be used for welding signal The pad of output pin only needs a third pad, the reduction of number of pads to directly reduce drop-down in of the invention The pad group of resistance occupies the area of printed circuit board, reduces cost, and reduce the wiring on printed circuit board and its The layout difficulty of his component.
On the basis of the above embodiments:
Embodiment as one preferred, the table of at least one of the first pad 1, the second pad 2 and third pad 3 Face is equipped with and helps weldering film.
Specifically, help weldering film have reduce solder surface tension, improve welding performance and ensure welding process smoothly into The effects that row.
Embodiment as one preferred, it is OSP to help weldering film (Organic Solderability, organic guarantor weld film).
Specifically, OSP has many advantages, such as that oxygen-proof property is good, thermal shock resistance is good, moisture-proof is good.
Certainly, other than OSP, it can also be other types to help weldering film, and the embodiment of the present invention does not limit herein.
Embodiment as one preferred, at least one of the first pad 1, the second pad 2 and third pad 3 are circle Shape pad.
Specifically, circular pad has many advantages, such as that putting forth effort property of welding is good, soldering reliability is good and area occupied is small.
Certainly, other than circular pad, at least one of the first pad 1, the second pad 2 and third pad 3 may be used also Think other shapes, such as rectangular etc., the embodiment of the present invention does not limit herein.
Embodiment as one preferred, in the first pad 1, the second pad 2 and third pad 3 it is adjacent between the two between Away from ranging from 1mm to 2mm.
Specifically, the range of 1mm to 2mm is the small distance range that can be arranged between adjacent pad, it can be by Adjacent spacing between the two is set as 1mm etc. in one pad 1, the second pad 2 and third pad 3, is conducive to further decrease The area of pad group facilitates the arrangement of other components.
Certainly, adjacent in the first pad 1, the second pad 2 and third pad 3 other than the spacing range of 1mm to 2mm Spacing between the two can also be other numerical value, and the embodiment of the present invention does not limit herein.
Any one of in order to solve the above technical problems, the present invention also provides a kind of printed circuit boards, including as above up and down The pad group of pull-up resistor.
Please refer to the embodiment of above-mentioned pad group for the introduction of printed circuit board provided by the invention, the present invention is herein not It repeats again.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with other The difference of embodiment, just to refer each other for identical similar portion between each embodiment.It should also be noted that, in this theory In bright book, relational terms such as first and second and the like be used merely to by an entity or operation with another entity or Operation distinguishes, without necessarily requiring or implying between these entities or operation there are any this actual relationship or Sequentially.Moreover, the terms "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, so that Process, method, article or equipment including a series of elements includes not only those elements, but also includes being not explicitly listed Other element, or further include for elements inherent to such a process, method, article, or device.Do not limiting more In the case of system, the element that is limited by sentence "including a ...", it is not excluded that in the process including the element, method, object There is also other identical elements in product or equipment.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one The widest range caused.

Claims (6)

1. a kind of pad group of upper pull down resistor, which is characterized in that including:
First pad is used for source of welding current pin, is additionally operable to weld the first end of pull-up resistor when needing to carry out signal pull-up;
Second pad is additionally operable to weld the first end of pull down resistor when needing to carry out signal drop-down for welding grounding pin;
Third pad is used for welding signal output pin, is additionally operable to weld the pull-up resistor when needing to carry out signal pull-up Second end, the second end of the pull down resistor is welded when needing to carry out signal drop-down.
2. pad group according to claim 1, which is characterized in that first pad, second pad and described The surface of at least one of third pad is equipped with and helps weldering film.
3. pad group according to claim 2, which is characterized in that described that weldering film is helped to weld film OSP for organic guarantor.
4. pad group according to claim 3, which is characterized in that first pad, second pad and described At least one of third pad is circular pad.
5. according to claim 1-4 any one of them pad groups, which is characterized in that first pad, second pad And adjacent spacing range between the two is 1mm to 2mm in the third pad.
6. a kind of printed circuit board, which is characterized in that include the pad of upper pull down resistor as described in any one in claim 1-5 Group.
CN201810514487.3A 2018-05-25 2018-05-25 A kind of the pad group and printed circuit board of upper pull down resistor Pending CN108770197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810514487.3A CN108770197A (en) 2018-05-25 2018-05-25 A kind of the pad group and printed circuit board of upper pull down resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810514487.3A CN108770197A (en) 2018-05-25 2018-05-25 A kind of the pad group and printed circuit board of upper pull down resistor

Publications (1)

Publication Number Publication Date
CN108770197A true CN108770197A (en) 2018-11-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810514487.3A Pending CN108770197A (en) 2018-05-25 2018-05-25 A kind of the pad group and printed circuit board of upper pull down resistor

Country Status (1)

Country Link
CN (1) CN108770197A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5990421A (en) * 1997-02-18 1999-11-23 Intel Corporation Built in board resistors
CN104076905A (en) * 2014-06-30 2014-10-01 北京百度网讯科技有限公司 Data center equipment, manufacturing method and corrosion resistance verifying method thereof
CN105430902A (en) * 2015-11-23 2016-03-23 广东欧珀移动通信有限公司 Mobile terminal and PCB for same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5990421A (en) * 1997-02-18 1999-11-23 Intel Corporation Built in board resistors
CN104076905A (en) * 2014-06-30 2014-10-01 北京百度网讯科技有限公司 Data center equipment, manufacturing method and corrosion resistance verifying method thereof
CN105430902A (en) * 2015-11-23 2016-03-23 广东欧珀移动通信有限公司 Mobile terminal and PCB for same

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Application publication date: 20181106