TW201818039A - 使用可遠程控制及可參數控制之冷卻器的循環液溫度控制方法及其維護方法 - Google Patents

使用可遠程控制及可參數控制之冷卻器的循環液溫度控制方法及其維護方法 Download PDF

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Publication number
TW201818039A
TW201818039A TW106131523A TW106131523A TW201818039A TW 201818039 A TW201818039 A TW 201818039A TW 106131523 A TW106131523 A TW 106131523A TW 106131523 A TW106131523 A TW 106131523A TW 201818039 A TW201818039 A TW 201818039A
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TW
Taiwan
Prior art keywords
cooler
parameter
circulating fluid
circulating
controllable
Prior art date
Application number
TW106131523A
Other languages
English (en)
Chinese (zh)
Inventor
酒井豊
谷口啓旨
Original Assignee
中屋有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中屋有限公司 filed Critical 中屋有限公司
Publication of TW201818039A publication Critical patent/TW201818039A/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/02—Compressor control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/25—Control of valves
    • F25B2600/2513—Expansion valves
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
TW106131523A 2016-11-08 2017-09-14 使用可遠程控制及可參數控制之冷卻器的循環液溫度控制方法及其維護方法 TW201818039A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2016-218462 2016-11-08
JP2016218462A JP2018076995A (ja) 2016-11-08 2016-11-08 遠隔制御によるエリア別パラメータ制御方式チラーを用いた循環液温度制御方法及びメンテナンス方法。

Publications (1)

Publication Number Publication Date
TW201818039A true TW201818039A (zh) 2018-05-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106131523A TW201818039A (zh) 2016-11-08 2017-09-14 使用可遠程控制及可參數控制之冷卻器的循環液溫度控制方法及其維護方法

Country Status (4)

Country Link
JP (1) JP2018076995A (ko)
KR (1) KR20180051423A (ko)
CN (1) CN108072215A (ko)
TW (1) TW201818039A (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6570390B2 (ja) * 2015-09-24 2019-09-04 東京エレクトロン株式会社 温度調整装置及び基板処理装置
JP2020020412A (ja) * 2018-08-01 2020-02-06 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード 容器に加圧ガスを補給するための装置および方法
JP6624623B1 (ja) * 2019-06-26 2019-12-25 伸和コントロールズ株式会社 温度制御装置及び温調装置
CN110926064B (zh) * 2019-12-10 2020-08-07 北京京仪自动化装备技术有限公司 电子膨胀阀的控制方法、装置、电子设备及存储介质
KR102403661B1 (ko) * 2020-02-19 2022-05-31 (주)피티씨 반도체 공정용 칠러 장치
KR102345640B1 (ko) * 2020-02-21 2021-12-31 (주)피티씨 반도체 공정용 칠러 장치
CN114442693B (zh) * 2021-12-31 2023-04-07 北京京仪自动化装备技术股份有限公司 耦合温控系统及方法
CN115727579B (zh) * 2022-11-28 2023-09-29 江苏拓米洛高端装备股份有限公司 制冷系统的控制方法及装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231595A (ja) * 2001-01-31 2002-08-16 Hitachi Ltd 半導体製造装置管理システム
US8343280B2 (en) * 2006-03-28 2013-01-01 Tokyo Electron Limited Multi-zone substrate temperature control system and method of operating
BRPI0904208B1 (pt) * 2009-10-21 2019-04-16 Embraco Indústria De Compressores E Soluções E Refrigeração Ltda. Sistema e método de comunicação de dados e comandos entre compressor de capacidade variável e termostato eletrônico para um sistema de refrigeração e refrigerador.
TWI458034B (zh) * 2010-01-15 2014-10-21 Advanced Semiconductor Eng 半導體製造與測試製程之冷卻系統
US9032752B2 (en) * 2012-01-19 2015-05-19 General Electric Company Condenser cooling system and method including solar absorption chiller
JP5762493B2 (ja) * 2013-09-20 2015-08-12 株式会社ナカヤ エリア別パラメータ制御方式ハイブリッドチラーを用いた循環液温度調節方法

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Publication number Publication date
JP2018076995A (ja) 2018-05-17
KR20180051423A (ko) 2018-05-16
CN108072215A (zh) 2018-05-25

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