TW201815231A - Complex protection element and electronic device including the same - Google Patents

Complex protection element and electronic device including the same Download PDF

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Publication number
TW201815231A
TW201815231A TW106134096A TW106134096A TW201815231A TW 201815231 A TW201815231 A TW 201815231A TW 106134096 A TW106134096 A TW 106134096A TW 106134096 A TW106134096 A TW 106134096A TW 201815231 A TW201815231 A TW 201815231A
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protection unit
main body
electrodes
protective member
electrode
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TW106134096A
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Chinese (zh)
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TWI674038B (en
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趙承勳
李東錫
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南韓商摩達伊諾琴股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/40Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/14Protection against electric or thermal overload
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Ceramic Capacitors (AREA)

Abstract

An exemplary embodiment provides a complex protection element and an electronic device including the same. The complex protection element includes a main body, at least two internal electrodes disposed in the main body, at least one protection unit disposed between the two or more internal electrodes, at least two connection electrodes disposed in the main body so as to be connected to the two or more internal electrodes, at least two external electrodes disposed outside the main body so as to be connected to the two or more connection electrodes. Here, the connection electrodes overlap at least a portion of the protection unit.

Description

複合保護構件以及包含該構件的電子裝置Composite protective member and electronic device containing the same

本揭露內容是有關於一種複合保護構件,且更特定而言,是有關於一種設置於各種電子裝置中以保護電子裝置或使用者免受電壓及電流影響的複合保護構件。The present disclosure relates to a composite protection member, and more particularly, to a composite protection member provided in various electronic devices to protect the electronic device or a user from voltage and current.

具有多功能的諸如智慧型手機的電子裝置包含根據功能整合於其中的各種組件。又,電子裝置包含天線,其能夠針對每一功能接收不同頻帶,包含在各種頻帶下的無線區域網路(local area network;LAN)、藍芽(Bluetooth)以及全球定位系統(global positioning system;GPS)。一些天線為裝設於外殼上的嵌入式天線。因此,裝設一用於將裝設於外殼上的天線電連接至電子裝置的內部電路的接觸器。An electronic device such as a smart phone having multiple functions includes various components integrated therein according to functions. In addition, the electronic device includes an antenna that can receive different frequency bands for each function, including a wireless local area network (LAN), Bluetooth, and global positioning system (GPS) in various frequency bands. ). Some antennas are embedded antennas mounted on a housing. Therefore, a contactor is provided for electrically connecting the antenna mounted on the housing to the internal circuit of the electronic device.

同時,由於最近強調智慧型手機的豪華影像及耐久性,因此愈來愈多地提供由金屬材料製成的終端機。亦即,愈來愈多地提供邊緣由金屬製成或除顯示部件外外殼由金屬製成的智慧型手機。At the same time, due to the recent emphasis on luxury images and durability of smartphones, terminals made of metal materials are increasingly being provided. That is, more and more smartphones are provided in which the edges are made of metal or the case is made of metal except for the display part.

然而,當使用具有金屬外殼的智慧型手機同時藉由使用未鑑認充電器對智慧型手機充電時,可發生電擊事故。亦即,當藉由使用不包含過電壓保護電路或使用低品質構件的未鑑認充電或有缺陷充電器對智慧型手機充電時可產生衝擊電流。衝擊電流可傳導至智慧型手機的接地端子且另外傳導至金屬外殼,使得接觸金屬外殼的使用者可受電擊。However, when using a smartphone with a metal case while charging the smartphone by using an unauthenticated charger, an electric shock may occur. That is, an inrush current may be generated when a smartphone is charged by using an unauthenticated charging or defective charger that does not include an overvoltage protection circuit or uses a low-quality component. The inrush current can be transmitted to the ground terminal of the smart phone and also to the metal case, so that users who touch the metal case can be shocked.

因此,能夠防止內部電路歸因於靜電而受到損害且防止使用者受到電擊事故的組件是有必要的。Therefore, a component capable of preventing damage to an internal circuit due to static electricity and protecting a user from an electric shock is necessary.

作為用於上文所描述的功能的構件,韓國登記專利第10-1585604號提供包含安裝於電路板上的外部電極及用於連接至導電墊片的連接電極的主體,外部電極安置於主體的底表面上,連接電極安置於主體的頂表面上。又,在先前專利中,分別連接至外部電極的中間電極設置於兩側(亦即,主體內的邊緣)上。對於上文所描述的電擊保護構件,在700 MHz至3 GHz的無線通信頻帶下的S21插入損耗(在輸入之後輸出的頻率特性)需要小於-0.5 dB。然而,根據先前專利,由於形成電容的電極具有短的長度且中間電極形成為穿過具有窄直徑的通孔,因此寄生電阻及寄生電感可增大。因此,在700 MHz至3 GHz的無線通信頻帶下的S21插入損耗將成問題。 (相關技術文件) 韓國登記專利第10-0876206號 韓國登記專利第10-1585604號As a member for the functions described above, Korean Registered Patent No. 10-1585604 provides a main body including an external electrode mounted on a circuit board and a connection electrode for connection to a conductive pad, and the external electrode is disposed on the main body. On the bottom surface, the connection electrode is disposed on the top surface of the main body. Also, in the previous patent, the intermediate electrodes respectively connected to the external electrodes are provided on both sides (that is, edges in the main body). For the electric shock protection member described above, the S21 insertion loss (frequency characteristic of the output after input) in the wireless communication band of 700 MHz to 3 GHz needs to be less than -0.5 dB. However, according to the previous patent, since the capacitor-forming electrode has a short length and the intermediate electrode is formed to pass through a through-hole having a narrow diameter, parasitic resistance and parasitic inductance can be increased. Therefore, S21 insertion loss in the wireless communication band of 700 MHz to 3 GHz will be a problem. (Related Technical Documents) Korean Registered Patent No. 10-0876206 Korean Registered Patent No. 10-1585604

本揭露內容提供一種複合保護構件,其安置於諸如智慧型手機的電子裝置中以保護電子裝置及使用者免受過電壓及漏電流。This disclosure provides a composite protection member that is disposed in an electronic device such as a smart phone to protect the electronic device and the user from overvoltage and leakage current.

本揭露內容亦提供一種複合保護構件,其可防止使用者受到由自充電器輸入的衝擊電流引起的電擊且保護內部電路免受自外部施加的過電壓。The present disclosure also provides a composite protection member that can protect a user from an electric shock caused by an inrush current input from a charger and protect an internal circuit from an externally applied overvoltage.

本揭露內容亦提供一種複合保護構件,其能夠減小寄生電阻及寄生電感以減小無線通信頻帶中的損耗。This disclosure also provides a composite protection member that can reduce parasitic resistance and parasitic inductance to reduce losses in the wireless communication band.

根據例示性實施例,一種複合保護構件包含:主體;至少兩個內部電極,其設置於主體中;至少一個保護單元,其設置於兩個或大於兩個內部電極之間;至少兩個連接電極,其設置於主體中且分別連接至兩個或大於兩個內部電極;以及至少兩個外部電極,其設置於主體外部且分別連接至兩個或大於兩個連接電極。此處,連接電極與保護單元的至少一部分重疊。According to an exemplary embodiment, a composite protective member includes: a main body; at least two internal electrodes provided in the main body; at least one protective unit provided between two or more internal electrodes; at least two connection electrodes , Which are arranged in the body and connected to two or more internal electrodes, respectively; and at least two external electrodes, which are arranged outside the body and connected to two or more connection electrodes, respectively. Here, the connection electrode overlaps at least a part of the protection unit.

主體可藉由將多個薄片彼此層壓而形成,且外部電極可分別形成於在薄片經層壓的方向上面對彼此的兩個表面上。The main body may be formed by laminating a plurality of sheets to each other, and external electrodes may be respectively formed on two surfaces facing each other in a direction in which the sheets are laminated.

保護單元可在主體的長度、寬度以及厚度的方向上形成於主體的中心部分上。The protection unit may be formed on the central portion of the main body in the direction of the length, width, and thickness of the main body.

保護單元可更包含擴展部件,擴展部件具有直徑不同於其他區域的直徑的至少一個區域。The protection unit may further include an expansion member having at least one region having a diameter different from that of other regions.

連接電極可在主體的長度及寬度的方向上設置於主體的中心部分處。The connection electrode may be provided at a central portion of the main body in the length and width directions of the main body.

連接電極中的每一者的長度可等於或大於主體的長度的1%,且寬度等於或大於主體的寬度的5%。The length of each of the connection electrodes may be equal to or greater than 1% of the length of the body, and the width may be equal to or greater than 5% of the width of the body.

連接電極的水平表面積可等於或小於內部電極中的每一者的水平表面積,且保護單元的水平表面積可等於或小於連接電極的水平表面積。The horizontal surface area of the connection electrode may be equal to or smaller than the horizontal surface area of each of the internal electrodes, and the horizontal surface area of the protection unit may be equal to or smaller than the horizontal surface area of the connection electrode.

連接電極的高度可等於或大於保護單元的高度。The height of the connection electrode may be equal to or greater than the height of the protection unit.

兩個或大於兩個連接電極中的每一者可具有100微米至1000微米的高度,或保護單元可具有5微米至600微米的高度。Each of the two or more connection electrodes may have a height of 100 micrometers to 1000 micrometers, or the protection unit may have a height of 5 micrometers to 600 micrometers.

兩個或大於兩個連接電極在大小及形狀中的至少一者上可不同。Two or more connection electrodes may be different in at least one of size and shape.

複合保護構件可更包含連接至外部電極中的一者的接觸部件。The composite protective member may further include a contact member connected to one of the external electrodes.

電容可形成於兩個或大於兩個內部電極之間,且內部電極的與保護單元重疊的至少一區域可充當放電電極。The capacitor may be formed between two or more internal electrodes, and at least one region of the internal electrode that overlaps the protection unit may serve as a discharge electrode.

外部電極中的一者可連接至電子裝置的內部電路,且外部電極中的另一者可連接至可由外部使用者接觸的導體。One of the external electrodes may be connected to an internal circuit of the electronic device, and the other of the external electrodes may be connected to a conductor accessible by an external user.

根據另一例示性實施例,一種電子裝置包含:複合保護構件,其安置於可由使用者接觸的導體與內部電路之間以阻斷電擊電壓且允許過電壓通過。此處,複合保護構件包含:主體;至少兩個內部電極,其安置於主體中;至少一個保護單元,其安置於兩個或大於兩個內部電極之間;至少兩個連接電極,其安置於主體中以便連接至兩個或大於兩個內部電極;以及至少兩個外部電極,其安置於主體外部以便連接至兩個或大於兩個連接電極,且連接電極與保護單元的至少一部分重疊。According to another exemplary embodiment, an electronic device includes a composite protective member disposed between a conductor accessible by a user and an internal circuit to block an electric shock voltage and allow an overvoltage to pass. Here, the composite protective member includes: a main body; at least two internal electrodes that are disposed in the main body; at least one protective unit that is disposed between two or more internal electrodes; at least two connection electrodes that are disposed on In the body so as to be connected to two or more internal electrodes; and at least two external electrodes that are disposed outside the body so as to be connected to two or more connection electrodes, and the connection electrodes overlap at least a part of the protection unit.

外部電極中的一者可連接至內部電路,且外部電極中的另一者可連接至導體。One of the external electrodes may be connected to an internal circuit, and the other of the external electrodes may be connected to a conductor.

電子裝置可更包含安置於導體與複合保護構件之間的接觸部件The electronic device may further include a contact member disposed between the conductor and the composite protective member

在下文中,將參看隨附圖式詳細地描述特定實施例。然而,本揭露內容可以不同形式體現,且不應解釋為限於本文中所闡述的實施例。確切而言,提供此等實施例使得本揭露內容將為透徹且完整的,且將向熟習此項技術者充分傳達本發明的範疇。Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, this disclosure may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

圖1為根據例示性實施例的複合保護構件的透視圖,且圖2為其橫截面圖。FIG. 1 is a perspective view of a composite protective member according to an exemplary embodiment, and FIG. 2 is a cross-sectional view thereof.

參看圖1及圖2,根據例示性實施例的複合保護構件包含:主體100;至少兩個內部電極200,其安置於主體100中;至少一個保護單元300,其安置於至少兩個內部電極200之間;至少兩個連接電極400,其安置於主體100中以便分別連接至至少兩個內部電極200;以及外部電極500,其安置於主體100外部以便連接至連接電極400。在下文中,在例示性實施例中,保護電子裝置免受自外部施加的過電壓(諸如,靜電放電(electrostatic discharge;ESD))且阻斷來自電子裝置內部的漏電流以保護使用者免受電擊的複合保護構件用作實例。1. 主體 1 and 2, a composite protective member according to an exemplary embodiment includes: a main body 100; at least two internal electrodes 200 disposed in the main body 100; at least one protection unit 300 disposed in at least two internal electrodes 200 Between; at least two connection electrodes 400 disposed in the main body 100 so as to be connected to at least two internal electrodes 200 respectively; and external electrodes 500 disposed outside the main body 100 so as to be connected to the connection electrodes 400. Hereinafter, in an exemplary embodiment, the electronic device is protected from an externally applied overvoltage (such as an electrostatic discharge (ESD)) and a leakage current from inside the electronic device is blocked to protect a user from electric shock. The composite protective member is used as an example. 1. body

主體100可具有大致六面體形狀。亦即,主體100可具有大致六面體形狀,其具有分別在一個方向(例如,X方向)及另一方向(例如,Y方向)上的預定長度及預定寬度,以及在垂直方向(例如,Z方向)上的預定高度。此處,在X方向上的長度可大於在Y方向上的寬度及在Z方向上的高度中的每一者,且在Y方向上的寬度可等於或不同於在Z方向上的高度。當寬度(Y方向)及高度(Z方向)彼此不同時,寬度可大於或小於高度。舉例而言,長度、寬度以及高度的比率可為2至5:1:0.3至1。亦即,相對於寬度,長度可比寬度大大約2倍至大約5倍,且高度可為寬度的0.3倍至1倍。然而,儘管上文所描述的在X、Y以及Z上的大小經描述為實例,但在X、Y以及Z上的大小可根據電子裝置的複合保護構件所連接至的內部結構及複合保護構件的形狀而以各種方式變化。又,至少兩個內部電極200、保護單元300以及連接電極400設置於主體100中,且外部電極500設置於主體100外部。The body 100 may have a substantially hexahedral shape. That is, the main body 100 may have a substantially hexahedral shape having a predetermined length and a predetermined width in one direction (for example, the X direction) and the other direction (for example, the Y direction), and in a vertical direction (for example, Z direction). Here, the length in the X direction may be larger than each of the width in the Y direction and the height in the Z direction, and the width in the Y direction may be equal to or different from the height in the Z direction. When the width (Y direction) and height (Z direction) are different from each other, the width may be larger or smaller than the height. For example, the ratio of length, width, and height may be 2 to 5: 1: 0.3 to 1. That is, relative to the width, the length may be about 2 to about 5 times larger than the width, and the height may be 0.3 to 1 times the width. However, although the sizes on X, Y, and Z described above are described as examples, the sizes on X, Y, and Z may be based on the internal structure to which the composite protective member of the electronic device is connected and the composite protective member The shape varies in various ways. In addition, at least two internal electrodes 200, a protection unit 300, and a connection electrode 400 are disposed in the main body 100, and an external electrode 500 is disposed outside the main body 100.

主體100可藉由層壓各自具有預定厚度的多個薄片而形成。亦即,主體100可藉由層壓各自具有在X方向上的預定長度、在Y方向上的預定寬度以及在Z方向上的預定厚度的多個薄片而形成。因此,主體100的長度及寬度可由薄片的長度及寬度決定,且主體100的高度可由薄片的疊層的數目決定。同時,形成主體100的多個薄片可包含介電材料如多層電容電路(multilayer capacitance circuit;MLCC)、低溫共燒陶瓷(low temperature co-fired ceramic;LTCC)以及高溫共燒陶瓷(high temperature co-fired ceramic;HTCC)。此處,MLCC介電材料可具有包含鈦酸鋇(BaTiO3 )及鈦酸釹(NdTiO3 )中的至少一者的主要成份,且可向MLCC介電材料添加氧化鉍(Bi2 O3 )、二氧化矽(SiO2 )、氧化銅(CuO)以及氧化鎂(MgO)中的至少一者。LTCC介電材料可包含氧化鋁(Al2 O3 )、二氧化矽(SiO2 )以及玻璃材料。又,薄片中的每一者可由含有鈦酸鋇(BaTiO3 )、鈦酸釹(NdTiO3 )、氧化鉍(Bi2 O3 )、碳酸鋇(BaCO3 )、二氧化鈦(TiO )、三氧化二釹(Nd2 O3 )、二氧化矽(SiO2 )、氧化銅(CuO)、氧化鎂(MgO)、氧化鋅(ZnO)以及氧化鋁(Al2 O3 )中的至少一者的材料形成。替代地,薄片可由具有變阻器特性的諸如鐠(Pr)、鉍(Bi)或鈦酸鍶基陶瓷材料(ST-based ceramic material)的材料形成。因此,薄片中的每一者可具有預定介電常數,例如,5至20000,理想地7至5000,更理想地200至3000。The main body 100 may be formed by laminating a plurality of sheets each having a predetermined thickness. That is, the main body 100 may be formed by laminating a plurality of sheets each having a predetermined length in the X direction, a predetermined width in the Y direction, and a predetermined thickness in the Z direction. Therefore, the length and width of the main body 100 can be determined by the length and width of the sheet, and the height of the main body 100 can be determined by the number of laminations of the sheet. Meanwhile, the plurality of sheets forming the main body 100 may include a dielectric material such as a multilayer capacitance circuit (MLCC), a low temperature co-fired ceramic (LTCC), and a high temperature co-fired ceramic (LTCC). fired ceramic; HTCC). Here, the MLCC dielectric material may have a main component including at least one of barium titanate (BaTiO 3 ) and neodymium titanate (NdTiO 3 ), and bismuth oxide (Bi 2 O 3 ) may be added to the MLCC dielectric material. , At least one of silicon dioxide (SiO 2 ), copper oxide (CuO), and magnesium oxide (MgO). The LTCC dielectric material may include aluminum oxide (Al 2 O 3 ), silicon dioxide (SiO 2 ), and glass materials. In addition, each of the flakes may be made of barium titanate (BaTiO 3 ), neodymium titanate (NdTiO 3 ), bismuth oxide (Bi 2 O 3 ), barium carbonate (BaCO 3 ), titanium dioxide (TiO 2 ), and trioxide. Materials of at least one of neodymium (Nd 2 O 3 ), silicon dioxide (SiO 2 ), copper oxide (CuO), magnesium oxide (MgO), zinc oxide (ZnO), and aluminum oxide (Al 2 O 3 ) form. Alternatively, the sheet may be formed of a material having varistor characteristics such as praseodymium (Pr), bismuth (Bi), or a strontium titanate-based ceramic material. Therefore, each of the sheets may have a predetermined dielectric constant, for example, 5 to 20,000, desirably 7 to 5000, and more desirably 200 to 3000.

又,多個薄片中的全部可具有彼此相同的厚度,且其中的至少一者的厚度可大於或小於其他者中的每一者。亦即,當至少一個薄片設置於內部電極200之間以在至少部分區域上形成ESD保護單元300且多個薄片層壓於內部電極200上方及下方以在至少部分區域上形成連接電極400時,薄片中的每一者可具有彼此相同的厚度,且薄片中的至少一者的厚度可大於或小於其他薄片中的每一者。舉例而言,形成內部電極200之間的ESD保護單元300的薄片中的每一者的厚度可大於其他薄片中的每一者的厚度。同時,多個薄片可具有(例如)1微米至5000微米或等於或小於3000微米的厚度。亦即,根據主體100的厚度,薄片中的每一者可具有1微米至5000微米,理想地5微米至300微米的厚度。又,薄片的疊層的厚度及數目可根據複合保護構件的大小而調整。亦即,當應用於小型複合保護構件時,薄片可具有小的厚度,且當應用於大型複合保護構件時,薄片可具有大的厚度。又,當相同數目個薄片經層壓時,薄片的厚度可隨著複合保護構件的大小及高度減小而減小,且薄片的厚度可隨著複合保護構件的大小增大而增大。替代地,薄的薄片可應用於大型複合保護構件。在此狀況下,薄片的疊層數目可增大。此處,薄片可具有在施加ESD時受到破壞的厚度。亦即,儘管薄片的疊層數目或薄片的厚度彼此不同,但至少一個薄片可具有在重複施加ESD時不會受到破壞的厚度。Also, all of the plurality of sheets may have the same thickness as each other, and the thickness of at least one of them may be greater than or less than each of the others. That is, when at least one sheet is provided between the internal electrodes 200 to form the ESD protection unit 300 on at least a part of the area and a plurality of sheets are laminated above and below the internal electrode 200 to form the connection electrode 400 on at least a part of the area, Each of the sheets may have the same thickness as each other, and the thickness of at least one of the sheets may be larger or smaller than each of the other sheets. For example, the thickness of each of the sheets forming the ESD protection unit 300 between the internal electrodes 200 may be greater than the thickness of each of the other sheets. Meanwhile, the plurality of sheets may have a thickness of, for example, 1 micrometer to 5000 micrometers or equal to or less than 3000 micrometers. That is, depending on the thickness of the main body 100, each of the sheets may have a thickness of 1 to 5000 micrometers, ideally 5 to 300 micrometers. The thickness and number of laminated layers can be adjusted according to the size of the composite protective member. That is, when applied to a small composite protective member, the sheet may have a small thickness, and when applied to a large composite protective member, the sheet may have a large thickness. In addition, when the same number of sheets are laminated, the thickness of the sheet may decrease as the size and height of the composite protective member decrease, and the thickness of the sheet may increase as the size of the composite protective member increases. Alternatively, a thin sheet may be applied to a large composite protective member. In this case, the number of laminated layers can be increased. Here, the sheet may have a thickness that is damaged when ESD is applied. That is, although the number of laminations of the flakes or the thickness of the flakes are different from each other, at least one of the flakes may have a thickness that is not damaged when the ESD is repeatedly applied.

同時,可進一步設置分別安置於主體100的最下層及最上層上的下部覆蓋層(圖中未示)及上部覆蓋層(圖中未示)。此處,最下層可充當下部覆蓋層,且最上層可充當上部覆蓋層。另外設置的下部覆蓋層及上部覆蓋層可具有彼此相同的厚度,且可藉由層壓多個磁性材料薄片而形成。然而,下部覆蓋層及上部覆蓋層可具有彼此不同的厚度。舉例而言,上部覆蓋層的厚度可大於下部覆蓋層。此處,非磁性薄片(例如,玻璃態薄片)可進一步設置於由磁性材料薄片形成的下部覆蓋層及上部覆蓋層的表面(亦即,下表面及上表面)上。又,下部覆蓋層及上部覆蓋層中的每一者的厚度可大於內部薄片中的每一者的厚度。亦即,覆蓋層的厚度可大於一個薄片。因此,當最下薄片及最上薄片充當下部覆蓋及上部覆蓋層時,最下薄片及最上薄片中的每一者的厚度可大於其間的薄片中的每一者。同時,下部覆蓋層及上部覆蓋層可由玻璃態薄片形成,且主體100的表面可塗佈有聚合物或玻璃材料。2. 內部電極 At the same time, a lower cover layer (not shown) and an upper cover layer (not shown), which are respectively disposed on the lowermost layer and the uppermost layer of the main body 100, may be further provided. Here, the lowermost layer may serve as a lower cover layer, and the uppermost layer may serve as an upper cover layer. The separately provided lower cover layer and the upper cover layer may have the same thickness as each other, and may be formed by laminating a plurality of magnetic material sheets. However, the lower cover layer and the upper cover layer may have different thicknesses from each other. For example, the thickness of the upper cover layer may be greater than the thickness of the lower cover layer. Here, a non-magnetic sheet (for example, a glassy sheet) may be further provided on the surface (ie, the lower surface and the upper surface) of the lower cover layer and the upper cover layer formed of the magnetic material sheet. Also, the thickness of each of the lower cover layer and the upper cover layer may be greater than the thickness of each of the inner sheets. That is, the thickness of the cover layer may be larger than one sheet. Therefore, when the lowermost sheet and the uppermost sheet serve as a lower cover and an upper cover layer, each of the lowermost sheet and the uppermost sheet may have a thickness greater than each of the sheets therebetween. Meanwhile, the lower cover layer and the upper cover layer may be formed of glass flakes, and the surface of the main body 100 may be coated with a polymer or a glass material. 2.Internal electrode

在主體100中,至少兩個內部電極200(210、220)可彼此隔開預定距離。亦即,在薄片的層壓方向(亦即,Z方向)上,至少兩個內部電極200可彼此隔開預定距離。又,至少兩個內部電極200可設置為其間具有保護單元300。舉例而言,在Z方向上,第一內部電極210可安置於保護單元300下方,且第二內部電極220可安置於保護單元300上方。替代地,至少一個內部電極可進一步設置於第一及第二內部電極200與最下及最上薄片之間。此處,內部電極200分別連接至連接電極400且連接至保護單元300。亦即,第一內部電極210的一側連接至第一連接電極410且另一側連接至保護單元300。又,第二內部電極220的一側連接至第二連接電極420且另一側連接至保護單元300。此處,第一內部電極210及第二內部電極220的面對彼此的表面連接至保護單元300。In the main body 100, at least two internal electrodes 200 (210, 220) may be separated from each other by a predetermined distance. That is, in the lamination direction of the sheet (ie, the Z direction), at least two internal electrodes 200 may be separated from each other by a predetermined distance. In addition, at least two internal electrodes 200 may be provided with a protection unit 300 therebetween. For example, in the Z direction, the first internal electrode 210 may be disposed below the protection unit 300, and the second internal electrode 220 may be disposed above the protection unit 300. Alternatively, at least one internal electrode may be further disposed between the first and second internal electrodes 200 and the lowermost and uppermost sheets. Here, the internal electrodes 200 are connected to the connection electrodes 400 and to the protection unit 300, respectively. That is, one side of the first internal electrode 210 is connected to the first connection electrode 410 and the other side is connected to the protection unit 300. In addition, one side of the second internal electrode 220 is connected to the second connection electrode 420 and the other side is connected to the protection unit 300. Here, surfaces of the first and second internal electrodes 210 and 220 facing each other are connected to the protection unit 300.

內部電極200中的每一者可由導電材料製成,導電材料包含(例如)含有鋁(Al)、銀(Ag)、金(Au)、鉑(Pt)、鈀(Pd)、鎳(Ni)以及銅(Cu)中的至少一者的金屬或其金屬合金。在合金的狀況下,例如,可使用銀與鈀的合金。同時,在鋁的狀況下,氧化鋁(Al2 O3 )可形成於鋁的表面上,且鋁在成形製程期間可維持在其內部中。亦即,當鋁形成於薄片上時,鋁接觸空氣,且鋁的表面經氧化以在其上形成氧化鋁(Al2 O3 )且鋁按原樣維持在內部上。因此,內部電極200可由被氧化鋁(Al2 O3 )覆蓋的鋁形成,氧化鋁(Al2 O3 )為具有多孔表面的薄絕緣層。替代地,除鋁外,亦可使用各種金屬,其具有形成於其表面上的絕緣層,理想地為多孔絕緣層。當多孔絕緣層形成於內部電極200的表面上時,ESD電壓可經由保護單元300較容易且平滑地放電。亦即,儘管將稍後加以描述,但保護單元300包含多孔絕緣材料,且經由微孔放電。此處,當多孔絕緣層形成於內部電極200的表面上時,除保護單元300的微孔外,微孔的數目可增大且因此放電效率可進一步得到改良。Each of the internal electrodes 200 may be made of a conductive material including, for example, aluminum (Al), silver (Ag), gold (Au), platinum (Pt), palladium (Pd), and nickel (Ni) And a metal of at least one of copper (Cu) or a metal alloy thereof. In the case of an alloy, for example, an alloy of silver and palladium can be used. Meanwhile, in the case of aluminum, alumina (Al 2 O 3 ) can be formed on the surface of aluminum, and aluminum can be maintained in its interior during the forming process. That is, when aluminum is formed on the sheet, the aluminum contacts air, and the surface of the aluminum is oxidized to form alumina (Al 2 O 3 ) thereon and the aluminum is maintained on the inside as it is. Thus, the internal electrodes 200 may be aluminum oxide (Al 2 O 3) is formed to cover aluminum, aluminum oxide (Al 2 O 3) is a thin insulating layer having a porous surface. Alternatively, in addition to aluminum, various metals can also be used, which have an insulating layer formed on the surface thereof, ideally a porous insulating layer. When the porous insulating layer is formed on the surface of the internal electrode 200, the ESD voltage can be easily and smoothly discharged through the protection unit 300. That is, although it will be described later, the protection unit 300 contains a porous insulating material and is discharged via micropores. Here, when the porous insulating layer is formed on the surface of the internal electrode 200, in addition to the micropores of the protection unit 300, the number of micropores can be increased and thus the discharge efficiency can be further improved.

又,內部電極200中的每一者可具有在X方向上的預定長度、在Y方向上的預定寬度以及在Z方向上的預定厚度。舉例而言,內部電極200可具有(例如)1微米至10微米的厚度。此處,內部電極200的至少一個區域可具有小的厚度,或至少一個區域可自內部電極200移除以暴露薄片。然而,儘管內部電極200的至少一個區域具有較大或較小厚度,或至少一個區域自內部電極移除,但可維持總連接狀態而不會產生任何電導率問題。又,內部電極200可具有在X方向上的長度及在Y方向上的寬度,所述長度及寬度小於主體100的長度及寬度。亦即,內部電極200的長度及寬度可小於薄片的長度及寬度。舉例而言,內部電極200的長度及寬度可為主體100或薄片的長度及寬度的10%至90%。又,內部電極200的表面積相對於薄片中的每一者的表面積可為10%至90%。亦即,安置於主體100中的一個薄片上的內部電極200的表面積相對於薄片的表面積為10%至90%。同時,內部電極200可具有各種形狀,諸如正方形、矩形以及具有預定圖案形狀、預定寬度以及預定距離的螺旋形。Also, each of the internal electrodes 200 may have a predetermined length in the X direction, a predetermined width in the Y direction, and a predetermined thickness in the Z direction. For example, the internal electrode 200 may have a thickness of, for example, 1 micrometer to 10 micrometers. Here, at least one region of the internal electrode 200 may have a small thickness, or at least one region may be removed from the internal electrode 200 to expose a sheet. However, although at least one region of the internal electrode 200 has a larger or smaller thickness, or at least one region is removed from the internal electrode, the total connection state can be maintained without causing any conductivity problem. In addition, the internal electrode 200 may have a length in the X direction and a width in the Y direction, and the length and width are smaller than the length and width of the main body 100. That is, the length and width of the internal electrode 200 may be smaller than the length and width of the sheet. For example, the length and width of the internal electrode 200 may be 10% to 90% of the length and width of the main body 100 or the sheet. Also, the surface area of the internal electrode 200 may be 10% to 90% with respect to the surface area of each of the sheets. That is, the surface area of the internal electrode 200 disposed on one sheet in the main body 100 is 10% to 90% with respect to the surface area of the sheet. Meanwhile, the internal electrode 200 may have various shapes such as a square, a rectangle, and a spiral having a predetermined pattern shape, a predetermined width, and a predetermined distance.

內部電極200可同時充當電容以及保護單元300的放電電極。電容是藉由第一及第二內部電極200以及其間的薄片形成。可根據第一及第二內部電極200之間的重疊表面積以及第一及第二內部電極200之間的薄片的厚度調整電容。又,第一及第二內部電極200的與保護單元200重疊的區域充當放電電極,以便將自外部施加的諸如ESD的過電壓傳輸至保護單元300,且傳輸傳遞通過保護單元300的過電壓以旁通至(例如)電子裝置的接地端子。3. 保護單元 The internal electrode 200 can serve as both a capacitor and a discharge electrode of the protection unit 300. The capacitor is formed by the first and second internal electrodes 200 and a sheet therebetween. The capacitance may be adjusted according to an overlapping surface area between the first and second internal electrodes 200 and a thickness of a sheet between the first and second internal electrodes 200. In addition, the areas of the first and second internal electrodes 200 overlapping with the protection unit 200 serve as discharge electrodes, so that an overvoltage such as ESD applied from the outside is transmitted to the protection unit 300, and the overvoltage passed through the protection unit 300 is transmitted to Bypass to, for example, the ground terminal of the electronics. 3. Protection unit

至少一個保護單元300設置於內部電極200之間,且允許自外部引入的諸如ESD的過電壓旁通至電子裝置的接地端子。亦即,來自採用複合保護構件的電子裝置外部的過電壓經由(例如)第二連接電極420及第二內部電極220而引入至保護單元300,且經由第一內部電極210及第一連接電極410另外旁通至電子裝置的內部電路。保護單元300的平面形狀及橫截面形狀中的至少一者可具有包含大致圓形、卵形(oval)、矩形、正方形以及等於或大於五邊形的多邊形的形狀,且形狀可具有預定厚度。亦即,保護單元300可具有圓柱形、六面體或多面體形狀。The at least one protection unit 300 is disposed between the internal electrodes 200 and allows an overvoltage such as ESD introduced from the outside to be bypassed to the ground terminal of the electronic device. That is, an overvoltage from the outside of an electronic device employing a composite protective member is introduced to the protection unit 300 via, for example, the second connection electrode 420 and the second internal electrode 220, and via the first internal electrode 210 and the first connection electrode 410. In addition, it bypasses the internal circuit of the electronic device. At least one of the planar shape and the cross-sectional shape of the protection unit 300 may have a shape including a substantially circular shape, an oval shape, a rectangular shape, a square shape, and a polygon equal to or larger than a pentagon shape, and the shape may have a predetermined thickness. That is, the protection unit 300 may have a cylindrical, hexahedral, or polyhedral shape.

保護單元300可與第一內部電極210及第二內部電極220的至少一部分重疊。舉例而言,第一內部電極210及第二內部電極220可與保護單元300的水平表面區域重疊10%至100%。亦即,保護單元300的長度及寬度可分別為第一內部電極210及第二內部電極220在X方向及Y方向上的長度及寬度的10%至100%,且可能不偏離第一內部電極210及第二內部電極220。又,保護單元300可安置於第一內部電極210及第二內部電極220的中心區域上。較理想地,保護單元300可安置於主體100的中心區域上。亦即,保護單元300可按預定直徑設置於中心區域上,中心區域安置於主體100的長度方向(亦即,X方向)的一半及寬度方向(亦即,Y方向)的一半處。替代地,當設置多個保護單元300時,保護單元300可與主體100的中心區域隔開預定距離。因此,保護單元300的中心區域可安置於主體100的中心區域或第一內部電極210及第二內部電極220的中心區域上。The protection unit 300 may overlap at least a part of the first and second internal electrodes 210 and 220. For example, the first internal electrode 210 and the second internal electrode 220 may overlap the horizontal surface area of the protection unit 300 by 10% to 100%. That is, the length and width of the protection unit 300 may be 10% to 100% of the length and width of the first and second internal electrodes 210 and 220 in the X and Y directions, respectively, and may not deviate from the first internal electrode. 210 and the second internal electrode 220. In addition, the protection unit 300 may be disposed on a central region of the first internal electrode 210 and the second internal electrode 220. Ideally, the protection unit 300 may be disposed on a central area of the main body 100. That is, the protection unit 300 may be provided on the central area according to a predetermined diameter, and the central area is disposed at half of the length direction (ie, the X direction) and half of the width direction (ie, the Y direction) of the main body 100. Alternatively, when a plurality of protection units 300 are provided, the protection unit 300 may be separated from the center area of the main body 100 by a predetermined distance. Therefore, the central region of the protection unit 300 may be disposed on the central region of the main body 100 or the central regions of the first and second internal electrodes 210 and 220.

保護單元300的厚度可為主體100的厚度的1%至20%,且長度為主體100在一個方向上的長度的3%至50%。此處,當設置多個保護單元300時,多個保護單元300的總厚度可為主體100的厚度的1%至50%。又,保護單元300可具有長孔形狀,其在至少一個方向(例如,X方向)上具有長的長度,且長的長度可為薄片的X方向長度的5%至75%。又,保護單元300的Y方向寬度可為薄片的Y方向寬度的3%至50%。保護單元300的厚度及直徑可等於或小於連接電極400的厚度及直徑。舉例而言,保護單元300的厚度可為連接電極400的厚度的1/5倍至1倍,且直徑為連接電極400的直徑的1/10倍至1倍。詳細而言,保護單元300的直徑可為(例如)50微米至1000微米且厚度為(例如)5微米至600微米。此處,隨著保護單元300的厚度減小,放電起始電壓(discharge inception voltage)減小。The thickness of the protection unit 300 may be 1% to 20% of the thickness of the main body 100, and the length may be 3% to 50% of the length of the main body 100 in one direction. Here, when the plurality of protection units 300 are provided, the total thickness of the plurality of protection units 300 may be 1% to 50% of the thickness of the main body 100. In addition, the protection unit 300 may have a long hole shape having a long length in at least one direction (for example, the X direction), and the long length may be 5% to 75% of the X direction length of the sheet. In addition, the Y-direction width of the protection unit 300 may be 3% to 50% of the Y-direction width of the sheet. The thickness and diameter of the protection unit 300 may be equal to or smaller than the thickness and diameter of the connection electrode 400. For example, the thickness of the protection unit 300 may be 1/5 times to 1 times the thickness of the connection electrode 400 and the diameter may be 1/10 times to 1 times the diameter of the connection electrode 400. In detail, the protection unit 300 may have a diameter of, for example, 50 μm to 1000 μm and a thickness of, for example, 5 μm to 600 μm. Here, as the thickness of the protection unit 300 decreases, a discharge inception voltage decreases.

保護單元300可包含界定於內部電極200之間的薄片的預定區域中的至少一個開口。亦即,至少一個開口中的每一者可充當過電壓保護單元300。此處,保護單元300可藉由將過電壓保護材料塗覆至開口中的至少一部分或掩埋開口而形成。亦即,保護單元300可包含開口,開口的內部為空的且過電壓保護材料形成於開口的至少一部分上。為形成過電壓保護材料,具有預定大小的穿孔可界定於內部電極200之間,且過電壓保護材料可塗覆至穿孔的至少一部分或掩埋穿孔。此處,過電壓保護材料可按預定厚度塗覆至穿孔的側表面的至少一部分、穿孔的上部部分及下部部分中的至少一者的至少一部分以及穿孔的內部。又,在塑膠處理期間揮發的聚合物材料可用以在穿孔的一部分上形成過電壓保護材料。The protection unit 300 may include at least one opening in a predetermined area of a sheet defined between the internal electrodes 200. That is, each of the at least one opening may serve as the overvoltage protection unit 300. Here, the protection unit 300 may be formed by applying an overvoltage protection material to at least a part of the openings or burying the openings. That is, the protection unit 300 may include an opening, an inside of the opening is empty, and an overvoltage protection material is formed on at least a part of the opening. To form an over-voltage protection material, a through-hole having a predetermined size may be defined between the internal electrodes 200, and the over-voltage protection material may be applied to at least a portion of the through-hole or buried the through-hole. Here, the overvoltage protection material may be applied to at least a part of a side surface of the perforation, at least a part of at least one of an upper part and a lower part of the perforation, and an inside of the perforation in a predetermined thickness. Also, the polymer material that is volatilized during the plastic processing can be used to form an overvoltage protection material on a portion of the perforation.

保護單元300可使用導電材料及絕緣材料作為過電壓保護材料。此處,絕緣材料可為具有多個孔隙的多孔絕緣材料。舉例而言,保護單元300可藉由在薄片上印刷導電陶瓷與絕緣陶瓷的混合材料而形成。同時,保護單元300可形成於至少一個薄片上。亦即,例如,保護單元300可形成於經垂直層壓的兩個薄片中的每一者上,且第一內部電極210及第二內部電極220可分別形成於薄片上以便彼此間隔開且連接至保護單元300。稍後將描述關於保護單元300的結構及材料的詳細描述。同時,可根據保護單元300的結構、材料以及大小調整放電起始電壓。舉例而言,複合保護構件可具有1 kV至30 kV的放電起始電壓。4. 連接電極 The protection unit 300 may use a conductive material and an insulating material as an overvoltage protection material. Here, the insulating material may be a porous insulating material having a plurality of pores. For example, the protection unit 300 may be formed by printing a mixed material of a conductive ceramic and an insulating ceramic on a sheet. Meanwhile, the protection unit 300 may be formed on at least one sheet. That is, for example, the protection unit 300 may be formed on each of the two sheets that are vertically laminated, and the first and second internal electrodes 210 and 220 may be respectively formed on the sheets so as to be spaced apart from and connected to each other. To the protection unit 300. A detailed description of the structure and materials of the protection unit 300 will be described later. At the same time, the discharge start voltage can be adjusted according to the structure, material and size of the protection unit 300. For example, the composite protection member may have a discharge initiation voltage of 1 kV to 30 kV. 4. Connect the electrodes

連接電極400可設置於主體100中以及內部電極200與外部電極500之間。亦即,連接電極400經設置以將內部電極200連接至外部電極500。因此,連接電極400可包含分別連接至第一及第二外部電極500(510及520)以及第一及第二內部電極200(210及220)的第一連接電極410及第二連接電極420。連接電極400的平面形狀及橫截面形狀中的至少一者可具有包含大致圓形、卵形(oval)、矩形、正方形以及等於或大於五邊形的多邊形的形狀,且形狀可具有預定厚度。亦即,連接電極400可具有圓柱形、六面體或多面體形狀。又,連接電極400可與保護單元300的至少一部分重疊。理想地,連接電極400可設置於主體100的中心部分上且與保護單元300重疊。The connection electrode 400 may be disposed in the main body 100 and between the internal electrode 200 and the external electrode 500. That is, the connection electrode 400 is provided to connect the internal electrode 200 to the external electrode 500. Therefore, the connection electrode 400 may include a first connection electrode 410 and a second connection electrode 420 connected to the first and second external electrodes 500 (510 and 520) and the first and second internal electrodes 200 (210 and 220), respectively. At least one of a planar shape and a cross-sectional shape of the connection electrode 400 may have a shape including a substantially circular shape, an oval shape, a rectangular shape, a square shape, and a polygon equal to or larger than a pentagon shape, and the shape may have a predetermined thickness. That is, the connection electrode 400 may have a cylindrical, hexahedral, or polyhedral shape. The connection electrode 400 may overlap at least a part of the protection unit 300. Ideally, the connection electrode 400 may be disposed on a central portion of the main body 100 and overlap the protection unit 300.

連接電極400是藉由在層壓於內部電極上的至少一個薄片的預定區域處界定開口而形成,且開口是藉由使用導電材料而掩埋。舉例而言,連接電極400可由含有鋁(Al)、銀(Ag)、金(Au)、鉑(Pt)、鈀(Pd)、鎳(Ni)以及銅(Cu)中的至少一者的金屬或其金屬合金形成。替代地,除金屬外,連接電極400亦可由各種導電材料形成。The connection electrode 400 is formed by defining an opening at a predetermined region of at least one sheet laminated on the internal electrode, and the opening is buried by using a conductive material. For example, the connection electrode 400 may be made of a metal containing at least one of aluminum (Al), silver (Ag), gold (Au), platinum (Pt), palladium (Pd), nickel (Ni), and copper (Cu). Or a metal alloy thereof. Alternatively, in addition to metal, the connection electrode 400 may be formed of various conductive materials.

連接電極400可具有:Z方向高度,亦即,垂直方向高度,其等於或不同於保護單元300的Z方向高度;以及在X及Y方向中的每一者上的寬度,其等於或不同於保護單元300的寬度。亦即,連接電極400的高度可等於或大於保護單元300的高度,且直徑或寬度等於或大於保護單元300的直徑或寬度。理想地,連接電極400的高度可大於保護單元300的高度,且平面區域大於保護單元300的平面區域。舉例而言,第一連接電極410及第二連接電極420中的每一者的高度可為保護單元300的高度的0.5倍至3倍。又,第一連接電極410及第二連接電極420的總高度可為保護單元300的高度的1倍至6倍。舉例而言,第一連接電極410及第二連接電極420可具有100微米至1000微米,理想地200微米至900微米,更理想地400微米至700微米的總高度。此處,第一連接電極410及第二連接電極420的高度可不同,且寬度亦不同。又,連接電極400的X方向寬度可為主體100的X方向寬度的1%至90%,且Y方向寬度為主體100的Y方向寬度的5%至90%。此處,連接電極400的X方向寬度及Y方向寬度可彼此相等或不同。亦即,連接電極400的一個區域的包含X方向寬度及Y方向寬度的寬度可等於或不同於另一區域的寬度。換言之,連接電極400可具有至少一個區域,其具有不對稱形狀。又,連接電極400的X方向寬度及Y方向寬度可為保護單元300的X方向寬度及Y方向寬度的1倍至10倍且為內部電極200的X方向寬度及Y方向寬度的1/10倍至1倍。亦即,連接電極400的寬度可小於主體100的在X方向及Y方向上的長度及寬度,等於或大於保護單元300的寬度且等於或小於內部電極200的寬度。The connection electrode 400 may have: a height in the Z direction, that is, a height in the vertical direction, which is equal to or different from the height in the Z direction of the protection unit 300; and a width in each of the X and Y directions, which is equal to or different from The width of the protection unit 300. That is, the height of the connection electrode 400 may be equal to or greater than the height of the protection unit 300, and the diameter or width may be equal to or greater than the diameter or width of the protection unit 300. Ideally, the height of the connection electrode 400 may be greater than the height of the protection unit 300, and the planar area is larger than the planar area of the protection unit 300. For example, the height of each of the first connection electrode 410 and the second connection electrode 420 may be 0.5 to 3 times the height of the protection unit 300. In addition, the total height of the first connection electrode 410 and the second connection electrode 420 may be 1 to 6 times the height of the protection unit 300. For example, the first connection electrode 410 and the second connection electrode 420 may have a total height of 100 micrometers to 1000 micrometers, ideally 200 micrometers to 900 micrometers, and more desirably 400 micrometers to 700 micrometers. Here, the first connection electrode 410 and the second connection electrode 420 may have different heights and different widths. The X-direction width of the connection electrode 400 may be 1% to 90% of the X-direction width of the main body 100, and the Y-direction width may be 5% to 90% of the Y-direction width of the main body 100. Here, the X-direction width and the Y-direction width of the connection electrode 400 may be equal to or different from each other. That is, a width including the X-direction width and the Y-direction width of one region of the connection electrode 400 may be equal to or different from the width of the other region. In other words, the connection electrode 400 may have at least one region having an asymmetric shape. In addition, the X-direction width and Y-direction width of the connection electrode 400 may be 1 to 10 times the X-direction width and Y-direction width of the protection unit 300 and 1/10 times the X-direction width and Y-direction width of the internal electrode 200. To 1x. That is, the width of the connection electrode 400 may be smaller than the length and width of the main body 100 in the X direction and the Y direction, equal to or larger than the width of the protection unit 300 and equal to or smaller than the width of the internal electrode 200.

連接電極400起將外部電極500連接至內部電極200的作用。因此,經由外部電極500施加的諸如ESD的過電壓經由連接電極400傳輸至內部電極200及保護單元300,且傳輸至保護單元300的過電壓經由內部電極200及連接電極400而再次傳輸至外部電極500。又,由於連接電極400安置於主體100的中心部分上且寬度理想地大於保護單元300的寬度,因此寄生電阻及寄生電感可減小。亦即,相較於連接電極400安置於主體100外部的狀況,寄生電阻及寄生電感可減小。因此,在700 MHz至3 GHz的無線通信頻帶下的S210插入損耗可減小。又,由於連接電極400的寬度理想地大於保護單元300的寬度,因此由重複ESD電壓引起的損壞可被防止以抑制放電起始電壓的增大。亦即,例如,保護單元300允許ESD電壓旁通,此是因為歸因於ESD的能量在保護單元300內部會產生火花。此處,當連接電極400具有小的厚度時,連接電極400可歸因於重複ESD電壓而受到毀壞以增大放電起始電壓。然而,在連接電極400具有等於或大於10微米的厚度時,可防止連接電極400歸因於重複ESD電壓而受到毀壞,且因此可防止放電起始電壓的增大。5. 外部電極 The connection electrode 400 functions to connect the external electrode 500 to the internal electrode 200. Therefore, an overvoltage such as ESD applied via the external electrode 500 is transmitted to the internal electrode 200 and the protection unit 300 via the connection electrode 400, and an overvoltage transmitted to the protection unit 300 is transmitted to the external electrode again via the internal electrode 200 and the connection electrode 400. 500. In addition, since the connection electrode 400 is disposed on the center portion of the main body 100 and the width is ideally larger than the width of the protection unit 300, the parasitic resistance and parasitic inductance can be reduced. That is, the parasitic resistance and the parasitic inductance can be reduced compared to a state where the connection electrode 400 is disposed outside the main body 100. Therefore, the insertion loss of the S210 in the wireless communication band of 700 MHz to 3 GHz can be reduced. In addition, since the width of the connection electrode 400 is ideally larger than the width of the protection unit 300, damage caused by repeated ESD voltages can be prevented to suppress an increase in the discharge start voltage. That is, for example, the protection unit 300 allows the ESD voltage to be bypassed because the energy attributed to the ESD generates a spark inside the protection unit 300. Here, when the connection electrode 400 has a small thickness, the connection electrode 400 may be damaged due to the repeated ESD voltage to increase the discharge start voltage. However, when the connection electrode 400 has a thickness equal to or greater than 10 micrometers, the connection electrode 400 can be prevented from being damaged due to repeated ESD voltages, and therefore an increase in the discharge start voltage can be prevented. 5.External electrode

外部電極500(510及520)可分別安置於主體100的面對彼此的兩個外表面上。舉例而言,外部電極500可分別安置於主體100的在Z方向(亦即,垂直方向)上面對彼此的兩個表面(亦即,底表面及頂表面)上。又,外部電極500可分別連接至主體100中的連接電極400。此處,外部電極500中的一者可連接至電子裝置中的諸如印刷電路板的內部電路,外部電極中的另一者可連接至電子裝置的外部,例如金屬外殼。舉例而言,第一外部電極510可連接至內部電路,且第二外部電極520可連接至金屬外殼。又,第二外部電極520可經由導電元件(例如,接觸器或導電墊片)連接至金屬外殼。The external electrodes 500 (510 and 520) may be respectively disposed on two outer surfaces of the main body 100 facing each other. For example, the external electrodes 500 may be respectively disposed on two surfaces (ie, a bottom surface and a top surface) of the main body 100 facing each other in the Z direction (ie, the vertical direction). Also, the external electrodes 500 may be connected to the connection electrodes 400 in the main body 100, respectively. Here, one of the external electrodes 500 may be connected to an internal circuit such as a printed circuit board in the electronic device, and the other of the external electrodes may be connected to the outside of the electronic device, such as a metal case. For example, the first external electrode 510 may be connected to an internal circuit, and the second external electrode 520 may be connected to a metal case. Also, the second external electrode 520 may be connected to the metal case via a conductive element (for example, a contactor or a conductive pad).

上文所描述的外部電極500中的每一者可藉由各種方法形成。亦即,外部電極500可藉由使用導電膏的浸漬或印刷方法或諸如沈積(deposition)、濺鍍(sputtering)以及電鍍(plating)的其他各種方法而形成。同時,外部電極500可形成於主體100的底表面及頂表面的整個表面或一部分上。亦即,除自底表面及頂表面的邊緣起的預定寬度外,外部電極500可形成於底表面及頂表面上。舉例而言,除自底表面及頂表面的邊緣起的預定寬度外,外部電極500的表面積可為底表面及頂表面的表面積的50%至95%。又,外部電極500可形成於底表面及頂表面的整個區域上,且自其向上及向下延伸以形成於其他側表面上。亦即,除在Z方向上面對的底表面及頂表面外,外部電極500亦可延伸至在X及Y方向中的每一者上面對的表面的預定區域。舉例而言,當浸漬至導電膏中時,外部電極500可形成於在X及Y方向上的側表面上以及在Z方向上的頂表面及底表面上。相較於此情形,當用諸如印刷、沈積、濺鍍以及電鍍的方法形成時,外部電極500可形成於在Z方向上的底表面及頂表面的預定表面區域上。亦即,外部電極500可取決於形成方法及處理條件而形成於安裝於印刷電路板上的底表面及連接至金屬外殼的頂表面以及其他區域上。替代地,外部電極500可由導電金屬形成。舉例而言,外部電極500可由選自由以下各者組成的群的至少一種金屬形成:金、銀、鉑、銅、鎳、鈀以及其合金。此處,外部電極500可具有形成於外部電極500的連接至連接電極400的至少一部分(亦即,主體100的至少一個表面)上的部分,且連接至連接電極400的部分可由與連接電極400的材料相同的材料形成。舉例而言,當連接電極由銅形成時,外部電極500的接觸連接電極400的區域的至少一部分可由銅形成。此處,如上文所描述,銅可藉由使用導電膏的浸漬或印刷方法或藉由諸如沈積、濺鍍以及電鍍的方法而形成。理想地,外部電極500可藉由電鍍而形成。為經由電鍍製程形成外部電極500,種子層可形成於主體100的頂表面及底表面上,且接著鍍層可自種子層形成以形成外部電極500。此處,外部電極500的連接至連接電極400的至少一部分可為主體100的整個頂表面及底表面或其部分區域。Each of the external electrodes 500 described above may be formed by various methods. That is, the external electrode 500 may be formed by a dipping or printing method using a conductive paste or other various methods such as deposition, sputtering, and plating. Meanwhile, the external electrode 500 may be formed on the entire surface or a part of the bottom surface and the top surface of the body 100. That is, the external electrode 500 may be formed on the bottom surface and the top surface in addition to a predetermined width from edges of the bottom surface and the top surface. For example, the surface area of the external electrode 500 may be 50% to 95% of the surface area of the bottom surface and the top surface except for a predetermined width from the edges of the bottom surface and the top surface. Also, the external electrode 500 may be formed on the entire area of the bottom surface and the top surface, and extend upward and downward from it to be formed on other side surfaces. That is, in addition to the bottom surface and the top surface facing upward in the Z direction, the external electrode 500 may also extend to a predetermined region of the surface facing in each of the X and Y directions. For example, when immersed in a conductive paste, the external electrode 500 may be formed on side surfaces in the X and Y directions and on top and bottom surfaces in the Z direction. In contrast to this, when formed by methods such as printing, deposition, sputtering, and electroplating, the external electrode 500 may be formed on predetermined surface areas of the bottom surface and the top surface in the Z direction. That is, the external electrode 500 may be formed on a bottom surface mounted on a printed circuit board and a top surface connected to a metal case and other areas depending on a forming method and processing conditions. Alternatively, the external electrode 500 may be formed of a conductive metal. For example, the external electrode 500 may be formed of at least one metal selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. Here, the external electrode 500 may have a portion formed on at least a portion of the external electrode 500 connected to the connection electrode 400 (ie, at least one surface of the body 100), and a portion connected to the connection electrode 400 may be connected to the connection electrode 400. The material is formed of the same material. For example, when the connection electrode is formed of copper, at least a part of a region of the external electrode 500 that contacts the connection electrode 400 may be formed of copper. Here, as described above, copper may be formed by a dipping or printing method using a conductive paste or by a method such as deposition, sputtering, and electroplating. Ideally, the external electrode 500 may be formed by electroplating. To form the external electrode 500 through a plating process, a seed layer may be formed on the top surface and the bottom surface of the main body 100, and then a plating layer may be formed from the seed layer to form the external electrode 500. Here, at least a part of the external electrode 500 connected to the connection electrode 400 may be the entire top surface and the bottom surface of the main body 100 or a partial region thereof.

替代地,外部電極500可更包含至少一個鍍層(plating layer)。外部電極500可由諸如銅及銀的金屬層形成,且至少一個鍍層可形成於金屬層上。舉例而言,外部電極500可藉由層壓銅層、鎳鍍層以及錫或錫/銀鍍層而形成。替代地,鍍層可藉由層壓銅鍍層及錫鍍層或層壓銅鍍層、鎳鍍層以及錫鍍層而形成。又,外部電極500可藉由混合(例如)具有0.5%至20%的氧化鉍(Bi2 O3 )或二氧化矽(SiO2 )的主要組份的多組份玻璃料與金屬粉末而形成。此處,玻璃料與金屬粉末的混合物可製備成膏狀且經塗覆至主體100的兩個表面。由於外部電極500中含有玻璃料,因此可改良外部電極500與主體100之間的黏著力,且可改良連接電極400與外部電極500之間的接觸反應。又,可塗覆包含玻璃的導電膏,且接著至少一個鍍層可形成於其上以形成外部電極500。亦即,外部電極500可由包含玻璃的金屬層及形成於金屬層上的至少一個鍍層形成。舉例而言,可按使得形成含有玻璃料、銀以及銅中的至少一者的層且接著經由無電極電鍍依序形成鎳鍍層及錫鍍層的方式形成外部電極500。此處,錫鍍層的厚度可等於或大於鎳鍍層的厚度。替代地,外部電極5000可僅藉由至少一個鍍層形成。亦即,外部電極500可藉由至少經由單一電鍍製程而不塗覆膏狀物形成鍍層的至少一個層來形成。同時,外部電極5000可具有2微米至100微米的厚度,鎳鍍層可具有1微米至10微米的厚度,且錫或錫/銀鍍層可具有2微米至10微米的厚度。6. 表面改質元件 Alternatively, the external electrode 500 may further include at least one plating layer. The external electrode 500 may be formed of a metal layer such as copper and silver, and at least one plating layer may be formed on the metal layer. For example, the external electrode 500 may be formed by laminating a copper layer, a nickel plating layer, and a tin or tin / silver plating layer. Alternatively, the plating layer may be formed by laminating a copper plating layer and a tin plating layer or a laminated copper plating layer, a nickel plating layer, and a tin plating layer. In addition, the external electrode 500 may be formed by mixing, for example, a multi-component glass frit having a main component of bismuth oxide (Bi 2 O 3 ) or silicon dioxide (SiO 2 ) of 0.5% to 20% and metal powder. . Here, the mixture of the glass frit and the metal powder may be prepared in a paste form and applied to both surfaces of the main body 100. Since the external electrode 500 contains a glass frit, the adhesion between the external electrode 500 and the main body 100 can be improved, and the contact reaction between the connection electrode 400 and the external electrode 500 can be improved. Also, a conductive paste including glass may be applied, and then at least one plating layer may be formed thereon to form the external electrode 500. That is, the external electrode 500 may be formed of a metal layer including glass and at least one plating layer formed on the metal layer. For example, the external electrode 500 may be formed such that a layer containing at least one of glass frit, silver, and copper is formed, and then a nickel plating layer and a tin plating layer are sequentially formed through electrodeless plating. Here, the thickness of the tin plating layer may be equal to or greater than the thickness of the nickel plating layer. Alternatively, the external electrode 5000 may be formed only by at least one plating layer. That is, the external electrode 500 may be formed by forming at least one layer of a plating layer without applying a paste through at least a single plating process. Meanwhile, the external electrode 5000 may have a thickness of 2 μm to 100 μm, the nickel plating layer may have a thickness of 1 μm to 10 μm, and the tin or tin / silver plating layer may have a thickness of 2 μm to 10 μm. 6. Surface modification components

同時,表面改質元件(surface modification member)(圖中未示)可形成於主體100的至少一個表面上。表面改質元件可藉由在外部電極500形成之前在主體100的表面上分佈(例如)氧化物而形成。此處,氧化物可按結晶或非結晶狀態分散及分佈於主體100的表面上。當外部電極500經由電鍍製程形成時,表面改質元件可在電鍍製程之前分佈於主體100的表面上。亦即,表面改質元件可在外部電極500的一部分藉由印刷製程形成之前分佈,或在電鍍製程執行之後在電鍍製程之前分佈。替代地,當不執行印刷製程時,可分佈表面改質元件且接著可執行電鍍製程。此處,分佈於表面上的表面改質元件的至少一部分可經熔融。Meanwhile, a surface modification member (not shown) may be formed on at least one surface of the main body 100. The surface modification element may be formed by distributing, for example, an oxide on the surface of the body 100 before the external electrode 500 is formed. Here, the oxide may be dispersed and distributed on the surface of the body 100 in a crystalline or amorphous state. When the external electrode 500 is formed through a plating process, the surface modification elements may be distributed on the surface of the main body 100 before the plating process. That is, the surface modification elements may be distributed before a part of the external electrode 500 is formed by the printing process, or after the plating process is performed and before the plating process. Alternatively, when a printing process is not performed, the surface modification elements may be distributed and then an electroplating process may be performed. Here, at least a part of the surface modifying element distributed on the surface may be melted.

同時,表面改質元件的至少一部分可具有相同大小且均勻地分佈於主體100的表面上,且其至少一部分可具有彼此不同的大小且不均勻地分佈。又,凹陷部分可界定於主體100的表面的至少一部分中。亦即,表面改質元件可經形成以形成突出部分,且上面未形成有表面改質元件的區域的至少一部分可經凹入以形成凹陷部分。此處,表面改質元件可具有比主體100的表面深的至少一部分。亦即,表面改質元件可插入至主體100中達預定深度,且自主體100的表面突出達其餘厚度。此處,插入至主體100中的部分的厚度可為氧化物粒子的平均直徑的1/20至1倍。亦即,氧化物粒子中的全部或一部分可設置於主體100中。替代地,氧化物粒子可僅設置於主體100的表面上。因此,氧化物粒子可在主體100的表面上具有半球形形狀或球形形狀。又,如上文所描述,表面改質元件可分佈於主體100的表面的一部分上或以薄膜形狀分佈於至少一個區域上。亦即,氧化物粒子以島狀形狀分佈於主體100的表面上以形成表面改質元件。亦即,結晶或非結晶狀態下的氧化物可按島狀形狀分佈於主體100的表面上,且因此主體100的表面的至少一部分可被暴露。又,至少兩個氧化物可彼此連接以按薄膜形狀在至少一個區域上及按島狀形狀在至少一些區域上形成表面改質元件。亦即,至少兩個氧化物粒子聚集或彼此鄰近的氧化物粒子連接以形成薄膜形狀。然而,甚至在氧化物以粒子狀態存在或兩個或大於兩個粒子聚集或彼此連接時,主體100的表面的至少一部分亦可藉由表面改質元件向外部暴露。Meanwhile, at least a part of the surface modification element may have the same size and be uniformly distributed on the surface of the main body 100, and at least a part of it may have a size different from each other and be unevenly distributed. Also, the recessed portion may be defined in at least a portion of a surface of the main body 100. That is, the surface modification element may be formed to form a protruding portion, and at least a part of a region on which the surface modification element is not formed may be recessed to form a recessed portion. Here, the surface modification element may have at least a portion deeper than a surface of the body 100. That is, the surface modification element may be inserted into the main body 100 to a predetermined depth and protrude from the surface of the main body 100 to the remaining thickness. Here, the thickness of the portion inserted into the body 100 may be 1/20 to 1 times the average diameter of the oxide particles. That is, all or a part of the oxide particles may be provided in the body 100. Alternatively, the oxide particles may be provided only on the surface of the body 100. Therefore, the oxide particles may have a hemispherical shape or a spherical shape on the surface of the body 100. Also, as described above, the surface modification elements may be distributed on a part of the surface of the main body 100 or in a film shape on at least one region. That is, the oxide particles are distributed on the surface of the body 100 in an island shape to form a surface-modified element. That is, the oxide in a crystalline or amorphous state may be distributed on the surface of the body 100 in an island shape, and thus at least a part of the surface of the body 100 may be exposed. Also, at least two oxides may be connected to each other to form a surface modifying element on at least one region in a film shape and on at least some regions in an island shape. That is, at least two oxide particles are aggregated or adjacent to each other to form a thin film shape. However, even when the oxide exists in a particle state or two or more particles are aggregated or connected to each other, at least a part of the surface of the body 100 may be exposed to the outside through the surface modification element.

此處,表面改質元件的總表面積可為主體100的總表面積的大約5%至大約90%。儘管可基於表面改質元件的表面面積控制主體100的表面上的電鍍散開現象,但在表面改質元件過多地形成時,主體100及外部電極400中的導電圖案在彼此接觸上可具有困難。亦即,當表面改質元件形成於小於主體100的表面積的5%的表面區域上時,電鍍散開現象幾乎不受控制,且當表面改質元件形成於大於主體100的表面積的90%的表面區域上時,主體100及外部電極400中的導電圖案可能不接觸彼此。因此,表面改質元件可理想地形成於能夠控制電鍍散開現象且允許主體100及外部電極400中的導電圖案彼此接觸的表面區域上。為此,表面改質元件可形成於為主體100的表面積的10%至90%,理想地30%至70%,更理想地40%至50%的表面區域上。此處,主體100的表面積可為一個表面的表面積或主體100的形成六面體的六個表面的表面積。同時,表面改質元件的厚度可等於或小於主體100的厚度的10%。亦即,表面改質元件的厚度可為主體100的厚度的0.01%至10%。舉例而言,表面改質元件的大小可為0.1微米至50微米,且因此,自主體100的表面,表面改質元件的厚度可為0.1微米至50微米。亦即,除表面改質元件插入至主體100的表面中所在的區域外,自主體100的表面,表面改質元件的厚度可為0.1微米至50微米。因此,當插入至主體100中的表面改質元件的厚度增加時,表面改質元件的厚度可大於0.1微米至50微米。當表面改質元件的厚度小於主體100的厚度的0.01%時,電鍍散開現象幾乎不受控制,且當表面改質元件的厚度大於主體100的厚度的10%時,主體100及外部電極400中的導電圖案可能不接觸彼此。亦即,根據材料的特性(電導率、半電導率、絕緣以及磁性)以及氧化物粉末的大小、分佈量以及聚集度,表面改質元件可具有各種厚度。Here, the total surface area of the surface modification element may be about 5% to about 90% of the total surface area of the main body 100. Although the plating dispersion phenomenon on the surface of the main body 100 can be controlled based on the surface area of the surface modification element, when the surface modification element is excessively formed, the conductive patterns in the main body 100 and the external electrode 400 may have difficulty in contacting each other. That is, when the surface modifying element is formed on a surface area smaller than 5% of the surface area of the main body 100, the plating spreading phenomenon is almost uncontrolled, and when the surface modifying element is formed on a surface larger than 90% of the surface area of the main body 100 When the area is on, the conductive patterns in the main body 100 and the external electrode 400 may not contact each other. Therefore, the surface modification element can be desirably formed on a surface region capable of controlling the plating dispersion phenomenon and allowing the conductive patterns in the main body 100 and the external electrode 400 to contact each other. For this reason, the surface modification element may be formed on a surface area that is 10% to 90%, ideally 30% to 70%, and more desirably 40% to 50% of the surface area of the main body 100. Here, the surface area of the body 100 may be the surface area of one surface or the surface areas of the six surfaces of the body 100 forming a hexahedron. Meanwhile, the thickness of the surface modification element may be equal to or less than 10% of the thickness of the body 100. That is, the thickness of the surface modification element may be 0.01% to 10% of the thickness of the body 100. For example, the size of the surface modification element may be 0.1 micrometer to 50 micrometers, and therefore, from the surface of the main body 100, the thickness of the surface modification element may be 0.1 micrometer to 50 micrometers. That is, in addition to the surface modification element being inserted into a region in the surface of the main body 100, the thickness of the surface modification element from the surface of the main body 100 may be 0.1 micrometers to 50 micrometers. Therefore, when the thickness of the surface modification element inserted into the body 100 is increased, the thickness of the surface modification element may be greater than 0.1 micrometers to 50 micrometers. When the thickness of the surface-modified element is less than 0.01% of the thickness of the body 100, the plating spreading phenomenon is almost uncontrolled, and when the thickness of the surface-modified element is greater than 10% of the thickness of the body 100, the body 100 and the external electrode 400 The conductive patterns may not touch each other. That is, the surface modification element may have various thicknesses according to the characteristics of the material (conductivity, semi-conductivity, insulation, and magnetic properties) and the size, distribution amount, and degree of aggregation of the oxide powder.

如上文所描述,由於表面改質元件形成於主體100的表面上,因此主體100的表面可具有在成份上不同的兩個區域。亦即,表面改質元件可具有取決於是否形成有表面改質元件而在區域上不同的成份。舉例而言,表面改質元件的成份(亦即,氧化物)可存在於上面形成有表面改質元件的區域上,且主體100的成份(亦即,薄片的成份)可存在於上面未形成表面改質元件的區域上。如上文所描述,表面改質元件在電鍍製程之前分佈於主體100的表面上,粗糙度可應用於主體100的表面且因此表面可經改質。因此,可均勻地執行電鍍製程,且因此可控制外部電極500的形狀。亦即,主體100的表面可具有在電阻上與其他區域不同的至少一個區域,且當在電阻不穩定的狀態下執行電鍍製程時,鍍層經不均勻地生長。為解決上文所描述的現象,主體100的表面可藉由在主體100的表面上分佈在粒子狀態或熔融狀態下的氧化物而改質,且鍍層的生長可得到控制。As described above, since the surface modification element is formed on the surface of the main body 100, the surface of the main body 100 may have two regions that are different in composition. That is, the surface modification element may have a composition which is different in area depending on whether or not the surface modification element is formed. For example, a component (that is, an oxide) of the surface modification element may be present on a region on which the surface modification element is formed, and a component of the body 100 (that is, a composition of a sheet) may be present on the surface not formed On the area of the surface modified element. As described above, the surface modification elements are distributed on the surface of the main body 100 before the electroplating process, and the roughness can be applied to the surface of the main body 100 and thus the surface can be modified. Therefore, the plating process can be performed uniformly, and thus the shape of the external electrode 500 can be controlled. That is, the surface of the main body 100 may have at least one region that is different in resistance from other regions, and when the plating process is performed in a state where the resistance is unstable, the plating layer grows unevenly. In order to solve the phenomenon described above, the surface of the main body 100 can be modified by the oxide distributed in the particle state or the molten state on the surface of the main body 100, and the growth of the plating layer can be controlled.

此處,用以實現主體100的均勻表面電阻的在粒子或熔融狀態下的氧化物可使用以下各者中的至少一者:例如,氧化鉍(Bi2 O3 )、二氧化硼(BO2 )、三氧化二硼(B2 O3 )、氧化鋅(ZnO)、Co3 O4 、二氧化矽(SiO2 )、氧化鋁(Al2 O3 )、氧化錳(MnO)、硼酸(H2 BO3 )、碳酸鈣(Ca(CO3 ) )、硝酸鈣(Ca(NO3 )2 )以及碳酸鈣(CaCO3 )。同時,表面改質元件可形成於主體100中的至少一個薄片上。亦即,各種形狀的導電圖案可經由電鍍製程形成於薄片上,且導電圖案的形狀可藉由形成表面改質元件而控制。Here, at least one of the following oxides may be used in the particles or in the molten state to achieve uniform surface resistance of the main body 100: for example, bismuth oxide (Bi 2 O 3 ), boron dioxide (BO 2 ), Boron trioxide (B 2 O 3 ), zinc oxide (ZnO), Co 3 O 4 , silicon dioxide (SiO 2 ), aluminum oxide (Al 2 O 3 ), manganese oxide (MnO), boric acid (H 2 BO 3 ), calcium carbonate (Ca (CO 3 ) 2 ), calcium nitrate (Ca (NO 3 ) 2 ), and calcium carbonate (CaCO 3 ). Meanwhile, the surface modification element may be formed on at least one sheet in the main body 100. That is, the conductive patterns of various shapes can be formed on the sheet through the electroplating process, and the shape of the conductive patterns can be controlled by forming the surface modification element.

圖3及圖4為根據例示性實施例的複合保護構件的示意性橫截面圖及橫截面相片。亦即,保護單元300可具有厚度不同於其他區域中的每一者的厚度的一個區域。圖3及圖4為保護單元300的一部分的示意性放大橫截面圖及橫截面相片。3 and 4 are schematic cross-sectional views and cross-sectional photos of a composite protective member according to an exemplary embodiment. That is, the protection unit 300 may have one region having a thickness different from that of each of the other regions. 3 and 4 are schematic enlarged cross-sectional views and cross-sectional photos of a part of the protection unit 300.

如圖3的(a)及圖4的(a)中所說明,保護單元300可由絕緣材料製成。此處,絕緣材料可為具有多個孔隙的多孔絕緣材料(圖中未示)。亦即,多個孔隙(圖中未示)可界定於保護單元300中。由於界定了孔隙,因此可較容易地使諸如ESD的過電壓旁通。又,保護單元300可藉由混合導電材料與絕緣材料而形成。舉例而言,保護單元300可藉由混合導電材料與絕緣材料而形成。在此狀況下,保護單元300可藉由以10:90至90:10的混合比率混合導電陶瓷與絕緣陶瓷而形成。隨著絕緣陶瓷的混合比率增大,放電起始電壓可增大,且隨著導電陶瓷的混合比率增大,放大起始電壓可減小。因此,可調整導電陶瓷與絕緣陶瓷的混合比率以便得到預定放電起始電壓。As illustrated in FIGS. 3 (a) and 4 (a), the protection unit 300 may be made of an insulating material. Here, the insulating material may be a porous insulating material (not shown) having a plurality of pores. That is, a plurality of pores (not shown) may be defined in the protection unit 300. Since the pores are defined, it is easier to bypass an overvoltage such as ESD. In addition, the protection unit 300 may be formed by mixing a conductive material and an insulating material. For example, the protection unit 300 may be formed by mixing a conductive material and an insulating material. In this case, the protection unit 300 may be formed by mixing a conductive ceramic and an insulating ceramic at a mixing ratio of 10:90 to 90:10. As the mixing ratio of the insulating ceramic increases, the discharge starting voltage can increase, and as the mixing ratio of the conductive ceramic increases, the amplification starting voltage can decrease. Therefore, the mixing ratio of the conductive ceramic and the insulating ceramic can be adjusted so as to obtain a predetermined discharge starting voltage.

又,保護單元300可藉由層壓導電層及絕緣層而具有預定層壓結構。亦即,保護單元300可藉由在劃分導電層及絕緣層時層壓導電層及絕緣層至少一次而形成。舉例而言,保護單元300可具有導電層及絕緣層經層壓的雙層結構,或導電層、絕緣層以及導電層經層壓的三層結構。又,導電層310(311及312)及絕緣層320可重複地層壓多次以形成三或大於三層結構。舉例而言,如圖3的(b)中所說明,保護單元300可具有三層結構,其中第一導電層311、絕緣層320以及第二導電層312經層壓。圖4的(b)為繪示在薄片與內部電極之間的具有三層結構的ESD保護層的相片。同時,當導電層及絕緣層經層壓多次時,最上層及最下層可為導電層。此處,多個孔隙(圖中未示)可界定於導電層310及絕緣層320的至少一部分中。舉例而言,由於安置於導電層310之間的絕緣層320具有多孔結構,因此絕緣層320可具有多個孔隙。In addition, the protection unit 300 may have a predetermined laminated structure by laminating a conductive layer and an insulating layer. That is, the protection unit 300 may be formed by laminating a conductive layer and an insulating layer at least once when dividing the conductive layer and the insulating layer. For example, the protection unit 300 may have a two-layer structure in which a conductive layer and an insulating layer are laminated, or a three-layer structure in which a conductive layer, an insulating layer, and a conductive layer are laminated. In addition, the conductive layer 310 (311 and 312) and the insulating layer 320 may be repeatedly laminated multiple times to form a three-layer structure or more. For example, as illustrated in (b) of FIG. 3, the protection unit 300 may have a three-layer structure in which a first conductive layer 311, an insulating layer 320, and a second conductive layer 312 are laminated. FIG. 4 (b) is a photograph showing an ESD protective layer having a three-layer structure between the sheet and the internal electrode. Meanwhile, when the conductive layer and the insulating layer are laminated multiple times, the uppermost layer and the lowermost layer may be conductive layers. Here, a plurality of pores (not shown) may be defined in at least a part of the conductive layer 310 and the insulating layer 320. For example, since the insulating layer 320 disposed between the conductive layers 310 has a porous structure, the insulating layer 320 may have multiple pores.

又,空隙可進一步界定於保護單元300的預定區域中。舉例而言,空隙可界定於導電材料及絕緣材料混合所在的層之間,且空隙可界定於導電層與絕緣層之間。亦即,導電材料及絕緣材料混合所在的第一混合層、空隙以及第二混合層可經層壓,且導電層、空隙以及絕緣層可經層壓。舉例而言,如圖3的(c)中所說明,保護單元300可藉由層壓第一導電層311、第一絕緣層321、空隙330、第二絕緣層322以及第二導電層312而形成。亦即,絕緣層320(321及322)可安置於導電層310(311及312)之間,且空隙330可界定於絕緣層320之間。圖4的(c)為具有上文所描述的層壓結構的保護單元300的橫截面相片。替代地,導電層、絕緣層以及空隙可重複地經層壓以形成保護單元300。同時,當導電層310、絕緣層320以及空隙330經層壓時,其全部可具有彼此相同的厚度,或其中的至少一者的厚度可小於其他者中的每一者的厚度。舉例而言,空隙330的厚度可小於導電層310及絕緣層320中的每一者的厚度。又,導電層310的厚度可等於絕緣層320的厚度,或大於或小於絕緣層320的厚度。同時,空隙330可藉由填充聚合物材料而形成,且接著成形製程經執行以移除聚合物材料。舉例而言,含有導電陶瓷的第一聚合物材料、含有絕緣陶瓷的第二聚合物材料以及不含導電陶瓷及絕緣陶瓷的第三聚合物材料可填充至通孔中,且接著成形製程經執行以移除聚合物材料,藉此形成導電層、絕緣層以及空隙。同時,空隙330可在未分層時形成。舉例而言,絕緣層320可安置於導電層311與312之間,且空隙330可藉由連接絕緣層320中的在垂直或水平方向上的多個孔隙而界定。亦即,空隙330可藉由絕緣層320中的多個孔隙而界定。替代地,空隙可藉由多個孔而界定於導電層310中。In addition, the gap may be further defined in a predetermined area of the protection unit 300. For example, the void may be defined between the layers where the conductive material and the insulating material are mixed, and the void may be defined between the conductive layer and the insulating layer. That is, the first mixed layer, the void, and the second mixed layer where the conductive material and the insulating material are mixed may be laminated, and the conductive layer, the void, and the insulating layer may be laminated. For example, as illustrated in FIG. 3 (c), the protection unit 300 may be formed by laminating the first conductive layer 311, the first insulating layer 321, the gap 330, the second insulating layer 322, and the second conductive layer 312. form. That is, the insulating layers 320 (321 and 322) may be disposed between the conductive layers 310 (311 and 312), and the gap 330 may be defined between the insulating layers 320. FIG. 4 (c) is a cross-sectional photograph of the protection unit 300 having the laminated structure described above. Alternatively, the conductive layer, the insulating layer, and the void may be repeatedly laminated to form the protection unit 300. Meanwhile, when the conductive layer 310, the insulating layer 320, and the gap 330 are laminated, all of them may have the same thickness as each other, or the thickness of at least one of them may be smaller than the thickness of each of the others. For example, the thickness of the gap 330 may be smaller than the thickness of each of the conductive layer 310 and the insulating layer 320. In addition, the thickness of the conductive layer 310 may be equal to the thickness of the insulating layer 320 or greater than or less than the thickness of the insulating layer 320. Meanwhile, the void 330 may be formed by filling a polymer material, and then a forming process is performed to remove the polymer material. For example, a first polymer material containing conductive ceramics, a second polymer material containing insulating ceramics, and a third polymer material containing no conductive ceramics and insulating ceramics can be filled into the through holes, and then the forming process is performed. The polymer material is removed to form a conductive layer, an insulating layer, and a void. Meanwhile, the void 330 may be formed when the layer is not delaminated. For example, the insulating layer 320 may be disposed between the conductive layers 311 and 312, and the gap 330 may be defined by connecting a plurality of pores in the insulating layer 320 in a vertical or horizontal direction. That is, the void 330 may be defined by a plurality of voids in the insulating layer 320. Alternatively, the void may be defined in the conductive layer 310 by a plurality of holes.

同時,用於保護單元300中的導電層310可具有預定電阻且允許電流流經。舉例而言,導電層310可為具有若干歐姆至數百百萬歐姆的電阻器。當諸如ESD的過電壓被引入時,導電層310降低能階以防止複合保護構件歸因於過電壓而在結構上受到破壞。亦即,導電層310充當將電能轉換成熱能的散熱片。導電層310可由導電陶瓷形成,且導電陶瓷可使用含有以下各者中的至少一者的混合物:鑭(La)、鎳、鈷、銅、鋅、釕(Ru)、銀、鈀、鉑、鎢、鐵以及鉍。又,導電層310可具有1微米至50微米的厚度。亦即,當導電層310包含多個層時,其總厚度可為1微米至50微米。Meanwhile, the conductive layer 310 used in the protection unit 300 may have a predetermined resistance and allow a current to flow therethrough. For example, the conductive layer 310 may be a resistor having several ohms to several millions of ohms. When an overvoltage such as ESD is introduced, the conductive layer 310 reduces the energy level to prevent the composite protective member from being structurally damaged due to the overvoltage. That is, the conductive layer 310 functions as a heat sink that converts electrical energy into thermal energy. The conductive layer 310 may be formed of a conductive ceramic, and the conductive ceramic may use a mixture containing at least one of the following: lanthanum (La), nickel, cobalt, copper, zinc, ruthenium (Ru), silver, palladium, platinum, tungsten , Iron, and bismuth. Also, the conductive layer 310 may have a thickness of 1 micrometer to 50 micrometers. That is, when the conductive layer 310 includes a plurality of layers, its total thickness may be 1 micrometer to 50 micrometers.

又,用於保護單元300中的絕緣層320可由放電誘導材料製成且充當具有多孔結構的電障壁。絕緣層320可由絕緣陶瓷製成,且絕緣陶瓷可包含具有50至50000的介電常數的鐵電材料。舉例而言,絕緣陶瓷可由諸如MLCC的介電材料粉末以及含有以下各者中的至少一者的混合物形成:氧化鋯(ZrO)、氧化鋅(ZnO)、鈦酸鋇(BaTiO3 )、五氧化二釹(Nd2 O5 )、碳酸鋇(BaCO3 )、二氧化鈦(TiO2 )、釹(Nd)、鉍(Bi)、鋅(Zn)以及氧化鋁(Al2 O3 )。在多個孔隙各自具有1奈米至5微米的直徑時,絕緣層320可具有孔隙率為30%至80%的多孔結構。此處,孔隙之間的最小距離可為1奈米至5微米。亦即,儘管絕緣層320由電流無法流經的電絕緣材料形成,但由於形成了孔隙,因此電流可流經孔隙。此處,隨著孔隙大小或孔隙率增大,放電起始電壓可減小,且相反,隨著孔隙大小或孔隙率減小,放電起始電壓可增大。然而,當孔隙大小大於5微米或孔隙率大於80%時,保護單元300可能無法維持其形狀。因此,可調整絕緣層320的孔隙大小及孔隙率以調整放電起始電壓,同時維持保護單元300的形狀。同時,當保護單元300由絕緣材料與導電材料的混合材料形成時,具有微孔及其孔隙率的絕緣陶瓷可用作絕緣材料。又,絕緣層320的電阻可歸因於微孔而小於薄片的電阻,且放電可經由微孔部分地實施。亦即,由於微孔界定於絕緣層320中,因此部分放電經由微孔執行。絕緣層320可具有1微米至50微米的厚度。亦即,當絕緣層320包含多個層時,其總厚度可為1微米至50微米。Also, the insulating layer 320 used in the protection unit 300 may be made of a discharge-inducing material and function as an electrical barrier having a porous structure. The insulating layer 320 may be made of an insulating ceramic, and the insulating ceramic may include a ferroelectric material having a dielectric constant of 50 to 50,000. For example, the insulating ceramic may be formed of a dielectric material powder such as MLCC and a mixture containing at least one of: zirconia (ZrO), zinc oxide (ZnO), barium titanate (BaTiO 3 ), pentoxide Two neodymium (Nd 2 O 5 ), barium carbonate (BaCO 3 ), titanium dioxide (TiO 2 ), neodymium (Nd), bismuth (Bi), zinc (Zn), and alumina (Al 2 O 3 ). When the plurality of pores each have a diameter of 1 nanometer to 5 micrometers, the insulating layer 320 may have a porous structure with a porosity of 30% to 80%. Here, the minimum distance between the pores may be 1 nanometer to 5 micrometers. That is, although the insulating layer 320 is formed of an electrically insulating material through which a current cannot flow, since a void is formed, a current can flow through the void. Here, as the pore size or porosity increases, the discharge start voltage can decrease, and conversely, as the pore size or porosity decreases, the discharge start voltage can increase. However, when the pore size is greater than 5 microns or the porosity is greater than 80%, the protection unit 300 may fail to maintain its shape. Therefore, the pore size and porosity of the insulating layer 320 can be adjusted to adjust the discharge start voltage while maintaining the shape of the protection unit 300. Meanwhile, when the protection unit 300 is formed of a mixed material of an insulating material and a conductive material, an insulating ceramic having micropores and its porosity can be used as the insulating material. In addition, the resistance of the insulating layer 320 may be smaller than that of the sheet due to the micropores, and the discharge may be partially performed through the micropores. That is, since the micro holes are defined in the insulating layer 320, a partial discharge is performed through the micro holes. The insulating layer 320 may have a thickness of 1 to 50 micrometers. That is, when the insulating layer 320 includes a plurality of layers, the total thickness thereof may be 1 micrometer to 50 micrometers.

圖5為根據另一例示性實施例的複合保護構件的保護單元300的示意性橫截面圖。亦即,如圖5的(a)中所說明,保護單元300可包含空隙330。亦即,可能不將過電壓保護材料填充至穿過薄片的開口中以在保護單元300中界定空隙330。又,保護單元300的穿孔的至少一個區域可由多孔絕緣材料製成。亦即,如圖5的(b)中所說明,多孔絕緣材料可經塗覆至穿孔的側壁以形成絕緣層320,且如圖5的(c)中所說明,絕緣層320可形成於穿孔的上部部分及下部部分中的至少一者上。FIG. 5 is a schematic cross-sectional view of a protection unit 300 of a composite protection member according to another exemplary embodiment. That is, as illustrated in (a) of FIG. 5, the protection unit 300 may include a gap 330. That is, the over-voltage protection material may not be filled into the opening through the sheet to define a void 330 in the protection unit 300. Also, at least one region of the perforation of the protection unit 300 may be made of a porous insulating material. That is, as illustrated in (b) of FIG. 5, a porous insulating material may be applied to the sidewall of the perforation to form an insulating layer 320, and as illustrated in (c) of FIG. 5, the insulating layer 320 may be formed on the perforated On at least one of the upper part and the lower part.

同時,圖6為根據複合保護構件的又一例示性實施例的保護單元300的示意性橫截面圖。如圖6中所說明,保護單元300可更包含安置於內部電極200(210及220)與過電壓保護單元300之間的放電誘導層340。亦即,放電誘導層340可進一步設置於內部電極200與保護單元300之間。此處,內部電極200可包含導電層211a及212a以及設置於導電層211a及212a的至少一個表面上的多孔絕緣層211b及212b。替代地,內部電極200可為未形成有多孔絕緣層的導電層。Meanwhile, FIG. 6 is a schematic cross-sectional view of a protection unit 300 according to still another exemplary embodiment of a composite protection member. As illustrated in FIG. 6, the protection unit 300 may further include a discharge inducing layer 340 disposed between the internal electrodes 200 (210 and 220) and the overvoltage protection unit 300. That is, the discharge inducing layer 340 may be further disposed between the internal electrode 200 and the protection unit 300. Here, the internal electrode 200 may include conductive layers 211a and 212a and porous insulating layers 211b and 212b provided on at least one surface of the conductive layers 211a and 212a. Alternatively, the internal electrode 200 may be a conductive layer without a porous insulating layer formed.

當保護單元300由多孔絕緣材料製成時,可形成放電誘導層340。此處,放電誘導層340可由密度大於保護單元300的密度的介電層製成。亦即,放電誘導層340可由導電材料或絕緣材料製成。舉例而言,當保護單元300由多孔氧化鋯(ZrO)製成且內部電極200由鋁製成時,由氧化鋯鋁(AlZrO)製成的放電誘導層349可形成於保護單元300與內部電極200之間。同時,氧化鈦(TiO)替代氧化鋯(ZrO)可用於保護單元300,且在此狀況下,放電誘導層340可由氧化鋁鈦(TiAlO)製成。亦即,放電誘導層340可經由內部電極200與保護單元300之間的反應形成。替代地,放電誘導層340可經由內部電極200、保護單元300以及薄片材料之間的反應形成。在此狀況下,放電誘導層340可藉由內部電極材料(例如,鋁)、保護單元材料(例如,氧化鋯(ZrO))以及薄片材料(例如,鈦酸鋇(BaTiO3 ))之間的反應形成。又,放電誘導層340可藉由與薄片材料反應而形成。亦即,放電誘導層340可經由保護單元300與薄片之間的反應形成於保護單元300接觸薄片所在的區域中。因此,放電誘導層340可圍繞保護單元300。此處,保護單元300與放電電極310之間的放電誘導層340以及保護單元300與薄片之間的放電誘導層340可具有彼此不同的組合物。同時,放電誘導層340可具有經移除的至少一個區域,或厚度不同於其他區域的厚度的至少一個區域。亦即,放電誘導層340可具有至少一個經移除區域且經不連續地形成,或具有厚度不同並不均勻地形成的至少一個區域。放電誘導層340可在成形製程期間形成。亦即,當成形製程在預定溫度下執行時,放電電極材料、ESD保護材料以及其類似者可相互擴散以形成內部電極200與保護單元300之間的放電誘導層340。同時,放電誘導層340的厚度可為保護單元300的厚度的10%至70%。亦即,保護單元300的厚度的一部分可轉換成放電誘導層340。因此,放電誘導層340的厚度可小於保護單元300的厚度且等於大於內部電極200的厚度。放電誘導層340可允許ESD電壓被誘導至保護單元300,或誘導至保護單元300的放電能量的準位(level)可降低。因此,ESD電壓可較易於放電以提高放電效率。又,由於形成了放電誘導層340,因此可防止不同種類的材料擴散至保護單元300。亦即,可防止薄片材料及內部電極材料擴散至保護單元300,且可防止過電壓保護材料擴散至外部。因此,放電誘導層340可用作擴散障壁且因此防止保護單元300被破壞。同時,保護單元300可更包含導電材料,且在此狀況下,導電材料可塗佈有絕緣陶瓷。舉例而言,如藉由使用圖3的(a)所描述,當保護單元300藉由混合多孔絕緣材料與導電材料而形成時,導電材料可塗佈有氧化鎳(NiO)、氧化銅(CuO)、氧化鎢(WO)或其類似者。因此,導電材料連同多孔絕緣材料可用作保護單元300的材料。又,當除多孔絕緣材料外,導電材料亦進一步用於保護單元300時(例如,如圖3的(b)及(c)中所說明),在絕緣層320形成於兩個導電層311及312之間時,放電誘導層340可形成於導電層310與絕緣層320之間。同時,內部電極200可具有一部分經移除的形狀。亦即,內部電極200可被部分移除,且放電誘導層340可形成於經移除區域中。然而,儘管內部電極200可被部分移除,但由於內部電極200維持總體連接的形狀,因此電特性可能不會降低。When the protection unit 300 is made of a porous insulating material, a discharge inducing layer 340 may be formed. Here, the discharge inducing layer 340 may be made of a dielectric layer having a density greater than that of the protection unit 300. That is, the discharge inducing layer 340 may be made of a conductive material or an insulating material. For example, when the protection unit 300 is made of porous zirconia (ZrO) and the internal electrode 200 is made of aluminum, a discharge inducing layer 349 made of zirconia aluminum (AlZrO) may be formed on the protection unit 300 and the internal electrode Between 200. Meanwhile, titanium oxide (TiO) instead of zirconia (ZrO) may be used to protect the unit 300, and in this case, the discharge inducing layer 340 may be made of titanium aluminum oxide (TiAlO). That is, the discharge inducing layer 340 may be formed via a reaction between the internal electrode 200 and the protection unit 300. Alternatively, the discharge inducing layer 340 may be formed via a reaction between the internal electrode 200, the protection unit 300, and the sheet material. In this case, discharge may be induced between the layer 340 by internal electrode material (e.g., aluminum), a guard cell material (e.g., zirconium oxide (of ZrO)) and a sheet material (e.g., barium titanate (BaTiO 3)) of Reaction is formed. The discharge inducing layer 340 can be formed by reacting with a sheet material. That is, the discharge inducing layer 340 may be formed in a region where the protection unit 300 contacts the sheet via a reaction between the protection unit 300 and the sheet. Therefore, the discharge inducing layer 340 may surround the protection unit 300. Here, the discharge induction layer 340 between the protection unit 300 and the discharge electrode 310 and the discharge induction layer 340 between the protection unit 300 and the sheet may have different compositions from each other. Meanwhile, the discharge inducing layer 340 may have at least one region removed, or at least one region having a thickness different from that of other regions. That is, the discharge-inducing layer 340 may have at least one removed region and be formed discontinuously, or have at least one region having a different thickness and unevenly formed. The discharge inducing layer 340 may be formed during a forming process. That is, when the forming process is performed at a predetermined temperature, the discharge electrode material, the ESD protection material, and the like may diffuse to each other to form a discharge induction layer 340 between the internal electrode 200 and the protection unit 300. Meanwhile, the thickness of the discharge inducing layer 340 may be 10% to 70% of the thickness of the protection unit 300. That is, a part of the thickness of the protection unit 300 may be converted into the discharge inducing layer 340. Therefore, the thickness of the discharge inducing layer 340 may be smaller than the thickness of the protection unit 300 and equal to the thickness of the internal electrode 200. The discharge inducing layer 340 may allow the ESD voltage to be induced to the protection unit 300, or the level of discharge energy induced to the protection unit 300 may be reduced. Therefore, the ESD voltage can be discharged more easily to improve the discharge efficiency. In addition, since the discharge inducing layer 340 is formed, it is possible to prevent different kinds of materials from diffusing into the protection unit 300. That is, the sheet material and the internal electrode material can be prevented from diffusing to the protection unit 300, and the overvoltage protection material can be prevented from diffusing to the outside. Therefore, the discharge inducing layer 340 can function as a diffusion barrier and thus prevent the protection unit 300 from being damaged. Meanwhile, the protection unit 300 may further include a conductive material, and in this case, the conductive material may be coated with an insulating ceramic. For example, as described by using FIG. 3 (a), when the protection unit 300 is formed by mixing a porous insulating material and a conductive material, the conductive material may be coated with nickel oxide (NiO), copper oxide (CuO ), Tungsten oxide (WO) or similar. Therefore, a conductive material together with a porous insulating material may be used as a material of the protection unit 300. In addition, when a conductive material is further used to protect the unit 300 in addition to the porous insulating material (for example, as illustrated in (b) and (c) of FIG. 3), the insulating layer 320 is formed on the two conductive layers 311 and Between 312, the discharge inducing layer 340 may be formed between the conductive layer 310 and the insulating layer 320. Meanwhile, the internal electrode 200 may have a partially removed shape. That is, the internal electrode 200 may be partially removed, and the discharge induction layer 340 may be formed in the removed region. However, although the internal electrode 200 may be partially removed, since the internal electrode 200 maintains the shape of the overall connection, the electrical characteristics may not be reduced.

內部電極200可由金屬或金屬合金製成,其中絕緣層形成於其表面上。亦即,內部電極200可包含導電層211a及212a以及形成於導電層211a及212a的至少一個表面上的絕緣層211b及212b。此處,多孔絕緣層211b及212b可形成於內部電極200的至少一個表面上。亦即,多孔絕緣層211b及212b可形成於不接觸保護單元300的一個表面以及接觸保護單元300的另一表面中的一者上,或不接觸保護單元300的一個表面以及接觸保護單元300的另一表面中的全部上。又,多孔絕緣層211b及212b可形成於導電層211a及212a的至少整個表面或其至少一部分上。又,多孔絕緣層211b及212b可具有經移除或具有小厚度的至少一個區域。亦即,多孔絕緣層211b及212b可能不形成於導電層211a及212a上的至少一個區域上,且多孔絕緣層211b及212b的至少一個區域的厚度可為薄或厚於其他區域。上文所描述的內部電極可具有在成形製程期間上面形成有氧化物薄膜的表面以及由鋁形成以維持電導率的內部。亦即,當鋁形成於薄片上時,鋁接觸空氣,且鋁的表面經氧化以在其上形成氧化鋁Al2 O3 )且鋁按原樣維持在內部上。因此,內部電極200可由被氧化鋁(Al2 O3 )覆蓋的鋁形成,氧化鋁(Al2 O3 )為具有多孔表面的薄絕緣層。替代地,除鋁外,亦可使用各種金屬,其具有形成於其表面上的絕緣層,理想地為多孔絕緣層。The internal electrode 200 may be made of a metal or a metal alloy in which an insulating layer is formed on a surface thereof. That is, the internal electrode 200 may include conductive layers 211a and 212a and insulating layers 211b and 212b formed on at least one surface of the conductive layers 211a and 212a. Here, the porous insulating layers 211 b and 212 b may be formed on at least one surface of the internal electrode 200. That is, the porous insulating layers 211b and 212b may be formed on one of the surfaces not contacting the protection unit 300 and the other surface of the protection unit 300, or on one surface of the protection unit 300 and contacting the protection unit 300. All on the other surface. Further, the porous insulating layers 211b and 212b may be formed on at least the entire surface or at least a part of the conductive layers 211a and 212a. Also, the porous insulating layers 211b and 212b may have at least one region removed or having a small thickness. That is, the porous insulating layers 211b and 212b may not be formed on at least one region on the conductive layers 211a and 212a, and the thickness of at least one region of the porous insulating layers 211b and 212b may be thinner or thicker than other regions. The internal electrode described above may have a surface on which an oxide film is formed during a forming process and an internal portion formed of aluminum to maintain electrical conductivity. That is, when aluminum is formed on the sheet, the aluminum contacts air, and the surface of the aluminum is oxidized to form alumina Al 2 O 3 thereon) and the aluminum is maintained on the inside as it is. Thus, the internal electrodes 200 may be aluminum oxide (Al 2 O 3) is formed to cover aluminum, aluminum oxide (Al 2 O 3) is a thin insulating layer having a porous surface. Alternatively, in addition to aluminum, various metals can also be used, which have an insulating layer formed on the surface thereof, ideally a porous insulating layer.

如上文所描述,如圖7中所說明,根據例示性實施例的複合保護構件可設置於金屬外殼10與內部電路20之間。亦即,外部電極500中的一者可連接至接地端子,且外部電極中的另一者可連接至電子裝置的金屬外殼10。此處,接地端子可安置於內部電路20中。舉例而言,第一外部電極510可連接至接地端子,且第二外部電極520可連接至金屬外殼10。又,諸如接觸器及導電墊片的導電元件可進一步設置於第二外部電極520與金屬外殼10之間。因此,自內部電路20的接地端子傳輸至金屬外殼的電擊電壓可被阻斷,且自外部施加至內部電路的ESD電壓可旁通至接地端子。亦即,根據例示性實施例的複合保護構件可使電流無法在處於額定電壓及電擊電壓下的外部電極500之間流動,且使電流能夠流經保護單元300,使得過電壓被旁通至接地端子。同時,複合保護構件可具有大於額定電壓且小於ESD電壓的放電起始電壓。舉例而言,複合保護構件可具有100V至240V的額定電壓,電擊電壓可等於或大於電路的工作電壓,且由外部靜電產生的ESD電壓可大於電擊電壓。又,來自外部的通信信號(亦即,交流電頻率)可藉由形成於內部電極200之間的電容而傳輸至內部電路20。因此,甚至在金屬外殼10用作天線而不製備額外天線時,亦可自外部接收通信信號。結果,根據例示性實施例的複合保護構件可阻斷電擊電壓,將ESD電壓旁通至接地端子且將通信信號施加至內部電路。As described above, as illustrated in FIG. 7, a composite protective member according to an exemplary embodiment may be disposed between the metal case 10 and the internal circuit 20. That is, one of the external electrodes 500 may be connected to a ground terminal, and the other of the external electrodes may be connected to the metal case 10 of the electronic device. Here, the ground terminal may be disposed in the internal circuit 20. For example, the first external electrode 510 may be connected to a ground terminal, and the second external electrode 520 may be connected to the metal case 10. In addition, a conductive element such as a contactor and a conductive pad may be further disposed between the second external electrode 520 and the metal case 10. Therefore, the electric shock voltage transmitted from the ground terminal of the internal circuit 20 to the metal case can be blocked, and the ESD voltage applied from the outside to the internal circuit can be bypassed to the ground terminal. That is, the composite protection member according to the exemplary embodiment may prevent current from flowing between the external electrodes 500 at the rated voltage and the shock voltage, and enables the current to flow through the protection unit 300 so that the overvoltage is bypassed to ground Terminal. Meanwhile, the composite protection member may have a discharge initiation voltage greater than a rated voltage and less than an ESD voltage. For example, the composite protection member may have a rated voltage of 100V to 240V, the electric shock voltage may be equal to or greater than the operating voltage of the circuit, and the ESD voltage generated by external static electricity may be greater than the electric shock voltage. In addition, a communication signal (ie, an alternating current frequency) from the outside can be transmitted to the internal circuit 20 through a capacitance formed between the internal electrodes 200. Therefore, even when the metal case 10 is used as an antenna without preparing an additional antenna, a communication signal can be received from the outside. As a result, the composite protective member according to the exemplary embodiment can block the electric shock voltage, bypass the ESD voltage to the ground terminal, and apply a communication signal to the internal circuit.

又,在主體100是藉由層壓具有高電壓電阻特性的多個薄片而形成時,根據例示性實施例的複合保護構件可維持絕緣電阻狀態,例如因為有缺陷充電器自內部電路引入310V的電擊電壓至金屬外殼10中使得漏電流無法流動,且保護單元300亦可藉由在過電壓自金屬外殼10引入至內部電路20時使過電壓旁通而不損害元件來維持高絕緣電阻狀態。亦即,由於保護單元300包含具有多孔結構以允許電流流經微孔的多孔絕緣材料且更包含降低能階以將電能轉換成熱能的導電材料,因此自外部引入的過電壓可被旁通以保護電路。因此,甚至在過電壓情況下亦可能不會出現絕緣破壞,且因此,保護單元300可安置於包含金屬外殼10的電子裝置中以持續地防止自有缺陷充電器產生的電擊電壓經由電子裝置的金屬外殼10傳輸至使用者。同時,通用多層電容電路(general multilayer capacitance circuit;MLCC)保護構件免受電擊電壓,但針對ESD的保護是弱的。因此,當重複地施加ESD時,可歸因於充電而在洩漏點處產生火花以出現構件破壞現象。然而,根據例示性實施例,由於包含多孔絕緣材料的保護單元300形成於內部電極之間,因此過電壓傳遞通過保護單元300,且因此主體100的至少一部分未受到破壞。Also, when the main body 100 is formed by laminating a plurality of sheets having high voltage resistance characteristics, the composite protective member according to the exemplary embodiment can maintain an insulation resistance state, for example, because a defective charger introduces 310V from an internal circuit The shock voltage into the metal case 10 prevents leakage current from flowing, and the protection unit 300 can also maintain a high insulation resistance state by bypassing the overvoltage without damaging the components when the overvoltage is introduced from the metal case 10 to the internal circuit 20. That is, since the protection unit 300 includes a porous insulating material having a porous structure to allow current to flow through the micropores, and further includes a conductive material that reduces the energy level to convert electrical energy into thermal energy, an overvoltage introduced from the outside can be bypassed to protect the circuit. Therefore, insulation damage may not occur even in an overvoltage situation, and therefore, the protection unit 300 may be disposed in an electronic device including the metal case 10 to continuously prevent an electric shock voltage generated from a defective charger from passing through the electronic device. The metal casing 10 is transmitted to a user. At the same time, a general multilayer capacitance circuit (MLCC) protects components from electric shock voltage, but protection against ESD is weak. Therefore, when the ESD is repeatedly applied, a spark may be generated at a leak point due to charging to cause a component failure phenomenon. However, according to the exemplary embodiment, since the protection unit 300 including a porous insulating material is formed between the internal electrodes, an overvoltage is transmitted through the protection unit 300, and thus at least a part of the body 100 is not damaged.

又,由於連接電極400安置於主體100的中心部分上且寬度理想地大於保護單元300的寬度,因此寄生電阻及寄生電感可減小。亦即,相較於連接電極400安置於主體100外部的狀況,寄生電阻及寄生電感可減小。因此,在700 MHz至3 GHz的無線通信頻帶下的S21插入損耗可減小。又,由於連接電極400的寬度理想地大於保護單元300的寬度,因此由重複ESD電壓引起的損壞可被防止以抑制放電起始電壓的增大。亦即,例如,保護單元300允許ESD電壓旁通,此是因為歸因於ESD的能量在保護單元300內部會產生火花。此處,當連接電極400具有小的厚度時,連接電極400可歸因於重複ESD電壓而受到毀壞以增大放電起始電壓。然而,在連接電極400具有等於或大於10微米的厚度時,可防止連接電極400歸因於重複ESD電壓而受到毀壞,且因此可防止放電起始電壓增大的現象。In addition, since the connection electrode 400 is disposed on the center portion of the main body 100 and the width is ideally larger than the width of the protection unit 300, the parasitic resistance and parasitic inductance can be reduced. That is, the parasitic resistance and the parasitic inductance can be reduced compared to a state where the connection electrode 400 is disposed outside the main body 100. Therefore, the S21 insertion loss in the wireless communication band of 700 MHz to 3 GHz can be reduced. In addition, since the width of the connection electrode 400 is ideally larger than the width of the protection unit 300, damage caused by repeated ESD voltages can be prevented to suppress an increase in the discharge start voltage. That is, for example, the protection unit 300 allows the ESD voltage to be bypassed because the energy attributed to the ESD generates a spark inside the protection unit 300. Here, when the connection electrode 400 has a small thickness, the connection electrode 400 may be damaged due to the repeated ESD voltage to increase the discharge start voltage. However, when the connection electrode 400 has a thickness equal to or greater than 10 micrometers, the connection electrode 400 can be prevented from being damaged due to repeated ESD voltages, and thus a phenomenon that the discharge start voltage is increased can be prevented.

同時,根據例示性實施例,描述安置於智慧型手機的電子裝置中以保護電子裝置免受諸如ESD的過電壓且阻斷來自電子裝置的內部的漏電流藉此保護使用者的複合保護構件作為實例。然而,除智慧型手機外,根據例示性實施例的複合保護構件亦可安置於電及電子裝置中以執行至少兩個保護功能。Meanwhile, according to an exemplary embodiment, a composite protective member that is disposed in an electronic device of a smart phone to protect the electronic device from an overvoltage such as ESD and block a leakage current from the inside of the electronic device to thereby protect a user is described as Instance. However, in addition to a smart phone, the composite protection member according to the exemplary embodiment may also be disposed in an electric and electronic device to perform at least two protection functions.

圖8為根據另一例示性實施例的複合保護構件的橫截面圖。FIG. 8 is a cross-sectional view of a composite protective member according to another exemplary embodiment.

參看圖8,根據另一例示性實施例的複合保護構件包含:主體100,其中多個薄片經層壓;至少兩個內部電極200,其安置於主體100中;至少一個保護單元300,其安置於至少兩個內部電極200之間;連接電極400,其安置於主體100中以便連接至至少兩個內部電極200;以及外部電極500,其安置於主體100外部以便連接至連接電極400。此處,保護單元300可更包含擴展部件350使得至少一個區域具有較寬的寬度。亦即,保護單元300可藉由更包含擴展部件350而形成使得至少一個區域具有較寬的寬度。擴展部件350的寬度可為保護單元300的直徑的1%至150%。亦即,擴展部件350的寬度可為保護單元300的上面未形成有擴展部件350的其他區域的寬度的1%至150%。舉例而言,擴展部件350可具有藉由將10微米至100微米加至保護單元300的直徑而獲得的直徑。又,擴展部件350的高度可為保護單元300的總高度的10%至70%。在擴展部件350如上文所描述而形成時,擴展部件350可阻斷保護單元300的短路路徑。亦即,當重複地施加諸如ESD的過電壓時,可出現連接電極400的熔融現象,且因此連接電極材料可堵塞至保護單元300的穿孔的側壁以出現短路現象。然而,由於具有不同直徑的擴展部件350形成於保護單元300上,因此短路路徑可被阻斷。Referring to FIG. 8, a composite protective member according to another exemplary embodiment includes: a main body 100 in which a plurality of sheets are laminated; at least two internal electrodes 200 that are disposed in the main body 100; and at least one protective unit 300 that is disposed Between at least two internal electrodes 200; a connection electrode 400 disposed in the body 100 so as to be connected to the at least two internal electrodes 200; and an external electrode 500 disposed outside the body 100 so as to be connected to the connection electrode 400. Here, the protection unit 300 may further include an expansion member 350 such that at least one region has a wider width. That is, the protection unit 300 may be formed by further including the expansion member 350 so that at least one region has a wider width. The width of the extension part 350 may be 1% to 150% of the diameter of the protection unit 300. That is, the width of the expansion member 350 may be 1% to 150% of the width of other regions on the protection unit 300 where the expansion member 350 is not formed. For example, the expansion member 350 may have a diameter obtained by adding 10 to 100 micrometers to the diameter of the protection unit 300. In addition, the height of the expansion member 350 may be 10% to 70% of the total height of the protection unit 300. When the expansion member 350 is formed as described above, the expansion member 350 may block the short-circuit path of the protection unit 300. That is, when an overvoltage such as ESD is repeatedly applied, a melting phenomenon of the connection electrode 400 may occur, and thus the connection electrode material may block to the perforated sidewall of the protection unit 300 to cause a short-circuit phenomenon. However, since the expansion members 350 having different diameters are formed on the protection unit 300, the short-circuit path may be blocked.

圖9及圖10為根據例示性實施例的經修改實例的複合保護構件的橫截面圖。例示性實施例的經修改實例更包含接觸諸如金屬外殼10的導體的接觸部件。亦即,複合保護構件設置於金屬外殼10與內部電路20之間,且如圖9及圖10中的每一者中所說明,具有夾具形狀的接觸部件610或藉由使用導電材料層形成的接觸部件620可設置於複合保護構件的第二外部電極520上。接觸部件610及620具有彈力以在外力自外部施加至電子裝置時吸收衝擊,且由包含導電材料的材料製成。同時,第一外部電極510可安置成接觸內部電路20,且諸如不鏽鋼的金屬的層可進一步設置於內部電路20與第一外部電極510之間。9 and 10 are cross-sectional views of a composite protective member according to a modified example of the exemplary embodiment. A modified example of the illustrative embodiment further includes a contact member that contacts a conductor such as the metal case 10. That is, the composite protective member is disposed between the metal case 10 and the internal circuit 20, and as illustrated in each of FIGS. 9 and 10, the contact member 610 having a jig shape or formed by using a conductive material layer The contact member 620 may be disposed on the second external electrode 520 of the composite protective member. The contact members 610 and 620 have an elastic force to absorb an impact when an external force is externally applied to the electronic device, and are made of a material including a conductive material. Meanwhile, the first external electrode 510 may be disposed to contact the internal circuit 20, and a layer of a metal such as stainless steel may be further disposed between the internal circuit 20 and the first external electrode 510.

接觸部件可具有如圖9中所說明的夾具形狀。夾具形接觸部件可包含:支撐部分611,其安置於複合保護構件上;接觸部分612,其安置於支撐部分611上方以面對諸如金屬外殼的導體且其至少一部分接觸導體;以及連接部分613,其安置於支撐部分611的一側與接觸部分612的一側之間以便將支撐部分611連接至接觸部分612且具有彈力。此處,連接部分613將支撐部分611的一個末端連接至接觸部分612的一個末端且具有曲率。亦即,連接部分613具有彈力,藉由彈力,連接部分613在受外力按壓時被壓向電路板20且在外力被釋放時恢復至原始狀態。因此,接觸部件610可由具有彈力的金屬材料製成,使得連接部分613具有彈力。The contact member may have a jig shape as illustrated in FIG. 9. The jig-shaped contact member may include: a support portion 611 disposed on the composite protective member; a contact portion 612 disposed above the support portion 611 to face a conductor such as a metal case and at least a portion thereof contacting the conductor; and a connection portion 613, It is disposed between one side of the support portion 611 and one side of the contact portion 612 so as to connect the support portion 611 to the contact portion 612 with elastic force. Here, the connection portion 613 connects one end of the support portion 611 to one end of the contact portion 612 and has a curvature. That is, the connecting portion 613 has an elastic force. With the elastic force, the connecting portion 613 is pressed toward the circuit board 20 when it is pressed by an external force, and returns to the original state when the external force is released. Therefore, the contact member 610 may be made of a metal material having an elastic force, so that the connection portion 613 has an elastic force.

又,根據例示性實施例的接觸部件可包含導電橡膠、導電矽、供插入導電線的彈性體以及墊片,墊片的表面塗佈有或結合有導體。亦即,如圖10中所說明,接觸部件620可包含導電材料層。舉例而言,導電墊片可具有由非導電彈性材料製成的內部以及塗佈有導電材料的外部。儘管未說明,但導電墊片可包含:絕緣彈性芯,其具有界定於其中的穿孔;以及導電層,其圍繞絕緣彈性芯。絕緣彈性芯具有管形狀,其具有界定於其中的穿孔。儘管絕緣彈性芯可具有大致矩形或圓形的橫截面,但例示性實施例不限於此。亦即,絕緣彈性芯可具有各種形狀。舉例而言,絕緣彈性芯中可能不包含穿孔。絕緣彈性芯可由矽或彈性橡膠製成。導電層可圍繞絕緣彈性芯。導電層可包含由(例如)金、銀以及銅製成的至少一個金屬層。替代地,導電粉末可混合至彈性芯而不形成導電層。In addition, the contact member according to the exemplary embodiment may include conductive rubber, conductive silicon, an elastic body for inserting a conductive wire, and a gasket, and a surface of the gasket is coated or bonded with a conductor. That is, as illustrated in FIG. 10, the contact member 620 may include a conductive material layer. For example, a conductive gasket may have an interior made of a non-conductive elastic material and an exterior coated with a conductive material. Although not illustrated, the conductive gasket may include: an insulating elastic core having a through hole defined therein; and a conductive layer surrounding the insulating elastic core. The insulating elastic core has a tube shape with a perforation defined therein. Although the insulating elastic core may have a substantially rectangular or circular cross section, exemplary embodiments are not limited thereto. That is, the insulating elastic core may have various shapes. For example, perforations may not be included in the insulating elastic core. The insulating elastic core may be made of silicon or elastic rubber. The conductive layer may surround the insulating elastic core. The conductive layer may include at least one metal layer made of, for example, gold, silver, and copper. Alternatively, the conductive powder may be mixed to the elastic core without forming a conductive layer.

同時,接觸部件610及620可相對於複合保護構件的主體100水平地安置且安裝於內部電路20上。亦即,儘管接觸部件610及620在圖9及圖10的經修改實例中安置於主體100的頂表面上,但接觸部件610及620可安置於側表面上同時與主體100間隔開,且安裝於內部電路20上以便經由主體100的外部電極510連接。比較實例及例示性實施例 Meanwhile, the contact members 610 and 620 may be horizontally disposed with respect to the main body 100 of the composite protective member and mounted on the internal circuit 20. That is, although the contact members 610 and 620 are disposed on the top surface of the main body 100 in the modified examples of FIGS. 9 and 10, the contact members 610 and 620 may be disposed on the side surfaces while being spaced apart from the main body 100 and installed. It is connected to the internal circuit 20 via an external electrode 510 of the main body 100. Comparative examples and illustrative examples

檢查根據複合保護構件的連接電極的位置及大小的插入損耗。因此,將根據例示性實施例的複合保護構件製造為具有圖2中的結構。亦即,保護單元300安置於主體100的中心部分上,且大小大於保護單元300的內部電極210及220安置於保護單元300上方及下方,且大小大於保護單元300且大小小於內部電極210及220的連接電極410及420安置於內部電極210及220上方及下方。此處,連接電極410及420安置於主體100內部的中心區域中且與保護單元300重疊。Check the insertion loss according to the position and size of the connection electrode of the composite protective member. Therefore, the composite protective member according to the exemplary embodiment is manufactured to have the structure in FIG. 2. That is, the protection unit 300 is disposed on the center portion of the main body 100, and the internal electrodes 210 and 220 larger than the protection unit 300 are disposed above and below the protection unit 300, and the size is larger than the protection unit 300 and smaller than the internal electrodes 210 and 220. The connection electrodes 410 and 420 are disposed above and below the internal electrodes 210 and 220. Here, the connection electrodes 410 and 420 are disposed in a central region inside the main body 100 and overlap the protection unit 300.

又,根據比較實例的電擊保護構件如圖11中所說明而製造。亦即,基於在韓國登記專利第10-1585604號中所建議的結構,保護單元300a安置於主體100的中心部分上,且第一內部電極210a及210b安置於保護單元300a下方及上方。又,第二內部電極220a及220b以及第三內部電極230a及230b中的每一者安置於內部電極210a及210b下方及上方,且連接電極400a及400b中的每一者連接至第一至第三內部電極210、220以及230。此處,根據比較實例的保護單元300a是在與根據例示性實施例的保護單元300的條件相同的條件下形成。又,根據比較實例的連接電極410a及410b不設置於主體100的中心部分上,而設置於鄰近邊緣的位置處,亦即,藉由將邊緣與中心部分之間的區域四等分而自邊緣起四分之一的區域處。又,根據比較實例的連接電極410a及410b的直徑小於根據例示性實施例的連接電極410及420的直徑。亦即,根據比較實例的連接電極410a及410b的直徑可為根據例示性實施例的連接電極410及420的直徑的1/4。又,除上文所描述的條件外的其他條件與例示性實施例的條件相同。然而,比較實例更包含第二內部電極220及第三內部電極230。Also, the electric shock protection member according to the comparative example was manufactured as illustrated in FIG. 11. That is, based on the structure suggested in Korean Registered Patent No. 10-1585604, the protection unit 300a is disposed on the center portion of the main body 100, and the first internal electrodes 210a and 210b are disposed below and above the protection unit 300a. Also, each of the second internal electrodes 220a and 220b and the third internal electrodes 230a and 230b is disposed below and above the internal electrodes 210a and 210b, and each of the connection electrodes 400a and 400b is connected to the first to the first Three internal electrodes 210, 220, and 230. Here, the protection unit 300a according to the comparative example is formed under the same conditions as those of the protection unit 300 according to the exemplary embodiment. Also, the connection electrodes 410a and 410b according to the comparative example are not provided on the center portion of the main body 100, but are provided at positions adjacent to the edge, that is, from the edge by halving the area between the edge and the center portion From a quarter of the area. Also, the diameters of the connection electrodes 410a and 410b according to the comparative example are smaller than the diameters of the connection electrodes 410 and 420 according to the exemplary embodiment. That is, the diameter of the connection electrodes 410a and 410b according to the comparative example may be 1/4 of the diameter of the connection electrodes 410 and 420 according to the exemplary embodiment. Also, the conditions other than the conditions described above are the same as those of the exemplary embodiment. However, the comparative example further includes a second internal electrode 220 and a third internal electrode 230.

根據比較實例的電擊保護構件410b以及根據例示性實施例的複合保護構件410b的頻率特性說明於圖13及圖14中且示於表1中。 【表1】 The frequency characteristics of the electric shock protection member 410b according to the comparative example and the composite protection member 410b according to the exemplary embodiment are illustrated in FIGS. 13 and 14 and shown in Table 1. 【Table 1】

如圖13及圖14以及表1中所示,根據比較實例的電擊保護構件在等於或大於1.24 GHz的頻率下產生等於或大於-0.5 dB的損耗,而根據例示性實施例的複合保護單元產生的損耗小於比較實例的損耗。亦即,由於連接電極安置於主體的中心部分上且具有寬的寬度,因此相較於連接電極安置於外部部分上且具有小的寬度的狀況,寄生電阻及寄生電感可最小化且插入損耗可減小。As shown in FIGS. 13 and 14 and Table 1, the electric shock protection member according to the comparative example generates a loss equal to or greater than -0.5 dB at a frequency equal to or higher than 1.24 GHz, and the composite protection unit according to the exemplary embodiment generates The loss is smaller than that of the comparative example. That is, since the connection electrode is disposed on the center portion of the main body and has a wide width, compared with the case where the connection electrode is disposed on the outer portion and has a small width, parasitic resistance and parasitic inductance can be minimized and insertion loss can be reduced. Decrease.

由於連接電極理想地安置於主體的中心部分上且寬度大於保護單元的寬度,因此根據例示性實施例的複合保護構件可減小寄生電阻及寄生電感。因此,在700 MHz至3 GHz的無線通信頻帶下的S21插入損耗可減小。Since the connection electrode is ideally disposed on a central portion of the main body and has a width larger than that of the protection unit, the composite protection member according to the exemplary embodiment can reduce parasitic resistance and parasitic inductance. Therefore, the S21 insertion loss in the wireless communication band of 700 MHz to 3 GHz can be reduced.

又,由於連接電極的寬度理想地大於保護單元的寬度,因此由重複ESD電壓引起的損壞可被防止以抑制放電起始電壓的增大。Also, since the width of the connection electrode is desirably larger than the width of the protection unit, damage caused by repeated ESD voltages can be prevented to suppress an increase in the discharge start voltage.

儘管已參考特定實施例描述了本揭露內容,但並不限於此。因此,熟習此項技術者將容易地理解,在不脫離藉由隨附申請專利範圍界定的本發明的精神及範疇的情況下,可對其進行各種修改及改變。Although the disclosure has been described with reference to specific embodiments, it is not limited thereto. Therefore, those skilled in the art will readily understand that various modifications and changes can be made to it without departing from the spirit and scope of the invention as defined by the scope of the accompanying patent application.

10‧‧‧金屬外殼10‧‧‧ metal case

20‧‧‧內部電路/電路板20‧‧‧Internal circuit / circuit board

100‧‧‧主體100‧‧‧ main body

200‧‧‧內部電極200‧‧‧ Internal electrode

210、210a、210b‧‧‧第一內部電極210, 210a, 210b‧‧‧First internal electrode

211a、212a‧‧‧導電層211a, 212a‧‧‧ conductive layer

211b、212b‧‧‧多孔絕緣層211b, 212b‧‧‧ porous insulation layer

220、220a、220b‧‧‧第二內部電極220, 220a, 220b‧‧‧Second internal electrode

230、230a、230b‧‧‧第三內部電極230, 230a, 230b‧‧‧ Third internal electrode

300‧‧‧ESD保護單元/過電壓保護單元300‧‧‧ESD protection unit / overvoltage protection unit

300a‧‧‧保護單元300a‧‧‧protection unit

310‧‧‧導電層310‧‧‧ conductive layer

311‧‧‧第一導電層311‧‧‧first conductive layer

312‧‧‧第二導電層312‧‧‧Second conductive layer

320‧‧‧絕緣層320‧‧‧ Insulation

321‧‧‧第一絕緣層321‧‧‧first insulating layer

322‧‧‧第二絕緣層322‧‧‧Second insulation layer

330‧‧‧空隙330‧‧‧Gap

340‧‧‧放電誘導層340‧‧‧discharge induction layer

350‧‧‧擴展部件350‧‧‧ Expansion Unit

400、410a、410b‧‧‧連接電極400, 410a, 410b

410‧‧‧第一連接電極410‧‧‧first connection electrode

420‧‧‧第二連接電極420‧‧‧Second connection electrode

500‧‧‧外部電極500‧‧‧External electrode

510‧‧‧第一外部電極510‧‧‧First external electrode

520‧‧‧第二外部電極520‧‧‧Second external electrode

610‧‧‧接觸部件610‧‧‧contact parts

611‧‧‧支撐部分611‧‧‧ support

612‧‧‧接觸部分612‧‧‧Contact Section

613‧‧‧連接部分613‧‧‧connection part

620‧‧‧接觸部件620‧‧‧contact parts

自結合隨附圖式進行的以下描述可更詳細地理解例示性實施例,其中: 圖1為根據例示性實施例的複合保護構件的橫截面圖。 圖2為根據例示性實施例的複合保護構件的橫截面圖。 圖3及圖4為繪示根據複合保護構件的例示性實施例的複合保護構件的橫截面的橫截面圖及相片。 圖5為根據另一例示性實施例的複合保護構件的橫截面圖。 圖6為根據又一例示性實施例的複合保護構件的橫截面圖。 圖7為根據例示性實施例的複合保護構件的等效電路圖。 圖8為根據另一例示性實施例的複合保護構件的橫截面圖。 圖9及圖10為根據例示性實施例的經修改實例的複合保護構件的橫截面圖。 圖11為根據比較實例的複合保護構件的橫截面圖。 圖12及圖13為繪示根據比較實例及例示性實施例的複合保護元件的頻率特性的曲線圖。Exemplary embodiments can be understood in more detail from the following description taken in conjunction with the accompanying drawings, in which: FIG. 1 is a cross-sectional view of a composite protective member according to an exemplary embodiment. FIG. 2 is a cross-sectional view of a composite protective member according to an exemplary embodiment. 3 and 4 are cross-sectional views and photographs illustrating a cross-section of a composite protective member according to an exemplary embodiment of the composite protective member. FIG. 5 is a cross-sectional view of a composite protective member according to another exemplary embodiment. FIG. 6 is a cross-sectional view of a composite protective member according to still another exemplary embodiment. FIG. 7 is an equivalent circuit diagram of a composite protective member according to an exemplary embodiment. FIG. 8 is a cross-sectional view of a composite protective member according to another exemplary embodiment. 9 and 10 are cross-sectional views of a composite protective member according to a modified example of the exemplary embodiment. 11 is a cross-sectional view of a composite protective member according to a comparative example. 12 and 13 are graphs illustrating frequency characteristics of a composite protection element according to a comparative example and an exemplary embodiment.

Claims (16)

一種複合保護構件,其包括: 主體; 至少兩個內部電極,其設置於所述主體中; 至少一個保護單元,其設置於所述兩個或大於兩個內部電極之間; 至少兩個連接電極,其設置於所述主體中且分別連接至所述兩個或大於兩個內部電極;以及 至少兩個外部電極,其設置於所述主體外部且分別連接至所述兩個或大於兩個連接電極, 其中所述連接電極與所述保護單元的至少一部分重疊。A composite protective member includes: a main body; at least two internal electrodes provided in the main body; at least one protective unit provided between the two or more internal electrodes; at least two connection electrodes , Provided in the body and connected to the two or more internal electrodes, respectively; and at least two external electrodes, provided outside the body and connected to the two or more internal connections, respectively An electrode, wherein the connection electrode overlaps at least a part of the protection unit. 如申請專利範圍第1項所述的複合保護構件,其中所述主體是藉由將多個薄片彼此層壓而形成,且所述外部電極分別形成於在所述薄片經層壓的方向上面對彼此的兩個表面上。The composite protective member according to item 1 of the patent application scope, wherein the main body is formed by laminating a plurality of sheets to each other, and the external electrodes are respectively formed above the lamination direction of the sheets On both surfaces of each other. 如申請專利範圍第2項所述的複合保護構件,其中所述保護單元是在所述主體的長度、寬度以及厚度的方向上形成於所述主體的中心部分上。The composite protective member according to item 2 of the scope of patent application, wherein the protection unit is formed on a central portion of the main body in a direction of a length, a width, and a thickness of the main body. 如申請專利範圍第3項所述的複合保護構件,其中所述保護單元更包括擴展部件,所述擴展部件具有直徑不同於其他區域的直徑的至少一個區域。The composite protection member according to item 3 of the patent application scope, wherein the protection unit further includes an expansion member having at least one region having a diameter different from that of other regions. 如申請專利範圍第3項或第4項所述的複合保護構件,其中所述連接電極是在所述主體的所述長度及所述寬度的所述方向上設置於所述主體的所述中心部分處。The composite protective member according to claim 3 or claim 4, wherein the connection electrode is provided at the center of the main body in the direction of the length and the width of the main body. Somewhere. 如申請專利範圍第5項所述的複合保護構件,其中所述連接電極中的每一者的長度等於或大於所述主體的長度的1%且寬度等於或大於所述主體的寬度的5%。The composite protective member according to item 5 of the scope of patent application, wherein the length of each of the connection electrodes is equal to or greater than 1% of the length of the body and the width is equal to or greater than 5% of the width of the body . 如申請專利範圍第6項所述的複合保護構件,其中所述連接電極的水平表面積等於或小於所述內部電極中的每一者的水平表面積,且所述保護單元的水平表面積等於或小於所述連接電極的水平表面積。The composite protective member according to item 6 of the patent application scope, wherein a horizontal surface area of the connection electrode is equal to or smaller than a horizontal surface area of each of the internal electrodes, and a horizontal surface area of the protection unit is equal to or less than The horizontal surface area of the connection electrode is described. 如申請專利範圍第7項所述的複合保護構件,其中所述連接電極的高度等於或大於所述保護單元的高度。The composite protective member according to item 7 of the patent application scope, wherein a height of the connection electrode is equal to or greater than a height of the protection unit. 如申請專利範圍第8項所述的複合保護構件,其中所述兩個或大於兩個連接電極中的每一者具有100微米至1000微米的高度,或所述保護單元具有5微米至600微米的高度。The composite protective member according to item 8 of the scope of patent application, wherein each of the two or more connection electrodes has a height of 100 μm to 1000 μm, or the protection unit has a height of 5 μm to 600 μm the height of. 如申請專利範圍第1項所述的複合保護構件,其中所述兩個或大於兩個連接電極在大小及形狀中的至少一者上不同。The composite protective member according to item 1 of the scope of patent application, wherein the two or more connection electrodes are different in at least one of size and shape. 如申請專利範圍第1項所述的複合保護構件,其可更包括連接至所述外部電極中的一者的接觸部件。The composite protective member according to item 1 of the scope of patent application, which may further include a contact member connected to one of the external electrodes. 如申請專利範圍第1項所述的複合保護構件,其中電容形成於所述兩個或大於兩個內部電極之間,且所述內部電極的與所述保護單元重疊的至少一區域充當放電電極。The composite protective member according to item 1 of the scope of patent application, wherein a capacitance is formed between the two or more internal electrodes, and at least one region of the internal electrode that overlaps with the protection unit serves as a discharge electrode . 如申請專利範圍第1項或第12項所述的複合保護構件,其中所述外部電極中的一者連接至電子裝置的內部電路,且所述外部電極中的另一者連接至可由外部使用者接觸的導體。The composite protective member according to claim 1 or claim 12, wherein one of the external electrodes is connected to an internal circuit of an electronic device, and the other of the external electrodes is connected to an externally usable The conductor that the person touches. 一種電子裝置,其包括複合保護構件,所述複合保護構件安置於可由使用者接觸的導體與內部電路之間以阻斷電擊電壓且允許過電壓通過, 其中所述複合保護構件包括: 主體; 至少兩個內部電極,其安置於所述主體中; 至少一個保護單元,其安置於所述兩個或大於兩個內部電極之間; 至少兩個連接電極,其安置於所述主體中以便連接至所述兩個或大於兩個內部電極;以及 至少兩個外部電極,其安置於所述主體外部以便連接至所述兩個或大於兩個連接電極,且 所述連接電極與所述保護單元的至少一部分重疊。An electronic device includes a composite protective member disposed between a conductor accessible by a user and an internal circuit to block an electric shock voltage and allow an overvoltage to pass, wherein the composite protective member includes: a main body; at least Two internal electrodes disposed in the main body; at least one protection unit disposed between the two or more internal electrodes; at least two connection electrodes disposed in the main body so as to be connected to The two or more internal electrodes; and at least two external electrodes disposed outside the main body so as to be connected to the two or more two connection electrodes, and the connection electrodes and the protection unit At least part of it overlaps. 如申請專利範圍第14項所述的電子裝置,其中所述外部電極中的一者連接至所述內部電路,且所述外部電極中的另一者連接至所述導體。The electronic device according to item 14 of the patent application scope, wherein one of the external electrodes is connected to the internal circuit, and the other of the external electrodes is connected to the conductor. 如申請專利範圍第14項所述的電子裝置,其更包括安置於所述導體與所述複合保護構件之間的接觸部件。The electronic device according to item 14 of the patent application scope further includes a contact member disposed between the conductor and the composite protective member.
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