TW201812811A - Electrolytic capacitor - Google Patents
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本發明係關於一種具備排氫膜之電解電容器。The present invention relates to an electrolytic capacitor having a hydrogen discharge film.
近年來,於風力發電及太陽光發電等之逆變器、蓄電池等大型電源等用途中使用鋁電解電容器等電解電容器。 例如,鋁電解電容器之陽極具有於鋁電極之表面電化學地生成之氧化鋁皮膜。於使用鋁電解電容器時,若過度之應力、振動、及衝擊等機械應力、或反向電壓、過電壓、及過電流等電應力施加於陽極,則於氧化鋁皮膜產生缺陷部。鋁電解電容器係使用皮膜修復性優異之電解液,藉由電解液與陽極之鋁之反應而快速地生成氧化鋁皮膜,修復缺陷部。然而,此時,於陽極側發生氧化並且於陰極側發生還原,從而產生氫氣。若於氧化鋁皮膜大量地產生缺陷部,則因皮膜修復作用而大量地產生氫氣,從而存在因鋁電解電容器之內部壓力之上升導致外置殼體膨脹或破裂之虞。 因此,於普通之電解電容器設置有具備特殊膜之安全閥。安全閥係除了將電容器內部之氫氣排出至外部之功能以外,更具有於電容器之內部壓力急遽地上升之情形時,自崩離而使內部壓力下降,防止電容器自身之破裂之功能者。作為此種安全閥之構成構件即特殊膜,例如提出有如下者。 於專利文獻1中,提出一種壓力調整膜,該壓力調整膜具備包含使鈀包含20 wt%(19.8 mol%)之Ag而成之鈀銀(Pd-Ag)合金之箔帶。 然而,專利文獻1之箔帶存在於50~60℃左右以下之環境下易於脆化,無法長時間維持作為壓力調整膜之功能之問題,從而未實現實用化。 為解決上述問題,而於專利文獻2中提出一種排氫膜,該排氫膜係包含Pd-Ag合金者,且Pd-Ag合金中之Ag之含量為20 mol%以上。又,於專利文獻3中提出了一種排氫膜,該排氫膜係包含Pd-Cu合金者,且Pd-Cu合金中之Cu之含量為30 mol%以上。 又,普通之電解電容器為抑制於氧化皮膜產生缺陷部而將氧化皮膜之膜厚增厚。然而,氧化皮膜係電化學地形成,故而將氧化皮膜之膜厚增厚存在需要較多之能量或製造時間之缺點。又,若將氧化皮膜之膜厚增厚,則電容器之靜電電容下降,故而為彌補靜電電容之下降,必須增大氧化皮膜之表面積,從而存在電解電容器之小型化變得困難之問題。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利第4280014號說明書 [專利文獻2]國際公開第2014/098038號 [專利文獻3]國際公開第2015/019906號In recent years, electrolytic capacitors such as aluminum electrolytic capacitors have been used in applications such as inverters and storage batteries for wind power generation and solar power generation, and large power supplies. For example, the anode of an aluminum electrolytic capacitor has an aluminum oxide film that is electrochemically formed on the surface of an aluminum electrode. When an aluminum electrolytic capacitor is used, if excessive stresses, mechanical stresses such as vibration and shock, or electrical stresses such as reverse voltage, overvoltage, and overcurrent are applied to the anode, a defective portion is generated in the alumina film. Aluminum electrolytic capacitors use an electrolyte with excellent film repairability. The aluminum oxide film is quickly formed by the reaction of the electrolyte with the anode's aluminum to repair defective parts. However, at this time, oxidation occurs on the anode side and reduction occurs on the cathode side, thereby generating hydrogen. If a large number of defective portions are generated in the alumina film, a large amount of hydrogen is generated due to the film repairing action, and there is a possibility that the external case may swell or rupture due to an increase in the internal pressure of the aluminum electrolytic capacitor. Therefore, a safety valve with a special film is provided in a common electrolytic capacitor. In addition to the function of venting hydrogen inside the capacitor to the outside, the safety valve has the function of self-disintegration to reduce the internal pressure when the internal pressure of the capacitor sharply rises, preventing the capacitor from rupturing itself. As a special film which is a constituent member of such a safety valve, the following are proposed, for example. Patent Document 1 proposes a pressure adjustment film including a foil tape including a palladium-silver (Pd-Ag) alloy made of 20 wt% (19.8 mol%) Ag in palladium. However, the foil tape of Patent Document 1 has a problem of being easily embrittlement in an environment of about 50 to 60 ° C. or lower, and the function as a pressure-adjusting film cannot be maintained for a long time, so that it has not been put into practical use. In order to solve the above-mentioned problem, Patent Document 2 proposes a hydrogen-removing film, which includes a Pd-Ag alloy, and the Ag content in the Pd-Ag alloy is 20 mol% or more. In addition, Patent Document 3 proposes a hydrogen removal film including a Pd-Cu alloy, and the content of Cu in the Pd-Cu alloy is 30 mol% or more. In addition, in order to suppress the occurrence of defect portions in the oxide film, the ordinary electrolytic capacitor increases the film thickness of the oxide film. However, since the oxide film is formed electrochemically, there is a disadvantage that increasing the film thickness of the oxide film requires more energy or manufacturing time. In addition, if the film thickness of the oxide film is increased, the electrostatic capacitance of the capacitor is reduced. Therefore, in order to compensate for the decrease in the electrostatic capacitance, the surface area of the oxide film must be increased, which makes it difficult to miniaturize the electrolytic capacitor. [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent No. 4280014 [Patent Literature 2] International Publication No. 2014/098038 [Patent Literature 3] International Publication No. 2015/019906
[發明所欲解決之問題] 本發明係鑒於上述問題研製而成者,其目的在於提供一種即便於大量地產生氫氣之情形時,亦無外置殼體膨脹或破裂之虞,並且靜電電容較大,可實現小型化或高耐電壓化之電解電容器。 [解決問題之技術手段] 本發明係關於一種電解電容器,其特徵在於:其係具備排氫膜者, 上述排氫膜包含於使等莫耳地包含氫氣及氮氣之混合氣體接觸時,選擇性地使99莫耳%以上之氫氣透過之氫氣透過層,且 陽極之氧化皮膜之平均厚度與電容器之額定電壓之比(平均厚度/額定電壓)為1.2~2.9(nm/V)。 本發明之電解電容器係陽極之氧化皮膜之平均厚度與電容器之額定電壓之比(平均厚度/額定電壓)為1.2~2.9(nm/V),與先前之電解電容器相比,上述比值更小(即,與先前之電解電容器相比,氧化皮膜之平均厚度更薄)。 若以本發明之方式,減小陽極之氧化皮膜之平均厚度與電容器之額定電壓之比,則因機械應力或電應力而容易於氧化皮膜中產生缺陷部,且因皮膜修復作用而大量地產生氫氣,因電解電容器之內部壓力之上升導致外置殼體膨脹或破裂之可能性變高。然而,本發明之電解電容器具備包含氫氣透過層之排氫膜,該氫氣透過層係於使等莫耳地含有氫氣及氮氣之混合氣體時,選擇性地將99莫耳%以上之氫氣透過,故而即便於電解電容器內部大量地產生氫氣,亦可僅將氫氣快速地排出至外部,從而可有效地防止外置殼體膨脹或破裂。 於陽極之氧化皮膜之平均厚度與電容器之額定電壓之比未達1.2(nm/V)之情形時,存在於電解電容器內部短時間內產生超過上述排氫膜之排氫能力之大量之氫氣之虞,從而外置殼體膨脹或破裂之危險性增大,或電解電容器之高耐電壓化變得困難。另一方面,若超過2.9(nm/V),則變得難以增大電解電容器之靜電電容,或電解電容器之小型化變得困難。 上述氫氣透過層較佳為金屬層,更佳為Pd合金層。 作為上述Pd合金層之形成材料之Pd合金根據排氫性、耐氧化性、及氫吸藏時之耐脆化優異之觀點,較佳為包含20~65 mol%之第11族元素。又,上述第11族元素較佳為選自由Au、Ag、及Cu所組成之群中之至少1種,尤其根據耐化學性優異之觀點,較佳為Au。 包含Pd-第11族元素合金之Pd合金層具有如下功能:於膜表面將氫分子解離為氫原子,將氫原子固溶於膜內,且使固溶之氫原子自高壓側擴散至低壓側,於低壓側之膜表面再次將氫原子轉換為氫分子後排出。於第11族元素之含量未達20 mol%之情形時,存在Pd合金之強度變得不充分,或上述功能難以顯現之傾向,於超過65 mol%之情形時,存在氫透過速度下降之傾向。 上述金屬層較佳為於單面或兩面具有支持體。支持體係為了防止金屬層於自安全閥或排氫閥脫落時掉落至電解電容器內而設置。又,於金屬層具有當電解電容器之內部壓力成為特定值以上時作為自崩離之安全閥之功能之情況下,若金屬層為薄膜,則金屬層之機械強度較低,故而存在電解電容器之內部壓力成為特定值之前自崩離之虞,從而無法發揮作為安全閥之功能。因此,於金屬層為薄膜情形時,為提昇機械強度,較佳為於金屬層之單面或兩面積層支持體。 作為電解電容器,例如可列舉鋁電解電容器、鉭電解電容器、及鈮電解電容器等。 [發明之效果] 本發明之電解電容器係與先前之電解電容器相比,氧化皮膜之平均厚度更薄。因此,本發明之電解電容器具有與先前之電解電容器相比,雖為相同程度之大小,但靜電電容更大之優點。又,本發明之電解電容器與先前之電解電容器相比,即便具有相同程度之靜電電容,但可實現小型化或高耐電壓化之優點。又,雖本發明之電解電容器與先前之電解電容器相比,氧化皮膜之平均厚度更薄,故能夠以與先前相比更少之能量及製造時間製造,於成本方面優異。 本發明之電解電容器具備一種即便長時間使用後,排氫性亦不易下降,可穩定地排出氫之排氫膜。又,上述排氫膜不僅可僅將電解電容器內部中產生之氫氣快速地排出至外部,而且可防止雜質自外部侵入至電解電容器內部。又,上述排氫膜亦可具有於電解電容器之內部壓力急遽上升之情形時,自崩離而降低內部壓力,從而防止電解電容器自身之破裂之功能。可藉由該等效果而長時間維持電解電容器之初期性能,從而可謀求電解電容器之長壽命化。[Problems to be Solved by the Invention] The present invention has been developed in view of the above-mentioned problems, and an object thereof is to provide an external casing that is free from expansion or cracking even when a large amount of hydrogen is generated, and the electrostatic capacitance is relatively small. Large electrolytic capacitors that can be miniaturized or withstand high voltage. [Technical means for solving the problem] The present invention relates to an electrolytic capacitor, which is characterized in that it is provided with a hydrogen-removing film, and the hydrogen-removing film is included in contact with a mixed gas containing hydrogen and nitrogen, which is selective. A hydrogen permeable layer that allows more than 99 mol% of hydrogen to pass through, and the ratio of the average thickness of the anode oxide film to the rated voltage of the capacitor (average thickness / rated voltage) is 1.2 to 2.9 (nm / V). The ratio of the average thickness of the oxide film of the anode to the rated voltage of the capacitor (average thickness / rated voltage) of the electrolytic capacitor of the present invention is 1.2 to 2.9 (nm / V). Compared with the previous electrolytic capacitor, the above ratio is smaller ( That is, the average thickness of the oxide film is thinner than that of the conventional electrolytic capacitor). If the ratio of the average thickness of the oxide film of the anode to the rated voltage of the capacitor is reduced in the manner of the present invention, defects are easily generated in the oxide film due to mechanical stress or electrical stress, and a large amount is generated due to the repair effect of the film. Hydrogen, due to the increase in the internal pressure of the electrolytic capacitor, may increase the possibility of expansion or cracking of the external case. However, the electrolytic capacitor of the present invention is provided with a hydrogen discharge film including a hydrogen permeation layer. The hydrogen permeation layer is used to selectively permeate 99 mol% or more of hydrogen gas when a mixed gas containing hydrogen and nitrogen is formed. Therefore, even if a large amount of hydrogen is generated inside the electrolytic capacitor, the hydrogen can be quickly discharged only to the outside, which can effectively prevent the external case from expanding or rupturing. When the ratio of the average thickness of the oxide film on the anode to the rated voltage of the capacitor does not reach 1.2 (nm / V), there is a large amount of hydrogen generated in the electrolytic capacitor in a short time that exceeds the hydrogen discharge capacity of the hydrogen discharge film described above. This may increase the risk of expansion or cracking of the external case, or make it difficult to increase the withstand voltage of the electrolytic capacitor. On the other hand, if it exceeds 2.9 (nm / V), it becomes difficult to increase the electrostatic capacitance of the electrolytic capacitor, or it becomes difficult to miniaturize the electrolytic capacitor. The hydrogen permeable layer is preferably a metal layer, more preferably a Pd alloy layer. The Pd alloy, which is a material for forming the Pd alloy layer, preferably contains 20 to 65 mol% of a Group 11 element from the viewpoints of excellent hydrogen removal performance, oxidation resistance, and embrittlement resistance during hydrogen storage. The Group 11 element is preferably at least one selected from the group consisting of Au, Ag, and Cu. In particular, from the viewpoint of excellent chemical resistance, Au is preferred. The Pd alloy layer containing Pd-group 11 element alloy has the following functions: dissociating hydrogen molecules into hydrogen atoms on the surface of the film, dissolving the hydrogen atoms in the film, and diffusing the dissolved hydrogen atoms from the high-pressure side to the low-pressure side On the low-pressure side of the membrane surface, hydrogen atoms are converted into hydrogen molecules again and discharged. When the content of the Group 11 element is less than 20 mol%, the strength of the Pd alloy may be insufficient, or the above-mentioned function may be difficult to appear. When it exceeds 65 mol%, the hydrogen transmission rate may be reduced. . The metal layer preferably has a support on one or both sides. The support system is provided in order to prevent the metal layer from falling into the electrolytic capacitor when the safety valve or the hydrogen exhaust valve falls off. In addition, when the metal layer has a function as a self-crashing safety valve when the internal pressure of the electrolytic capacitor becomes a certain value or more, if the metal layer is a thin film, the mechanical strength of the metal layer is low. There is a risk that the internal pressure will collapse before it reaches a certain value, so that it cannot function as a safety valve. Therefore, when the metal layer is a thin film, in order to improve the mechanical strength, it is preferably on a single-sided or two-area layer support of the metal layer. Examples of the electrolytic capacitor include an aluminum electrolytic capacitor, a tantalum electrolytic capacitor, and a niobium electrolytic capacitor. [Effects of the Invention] The electrolytic capacitor of the present invention has a thinner average thickness of the oxide film than the previous electrolytic capacitor. Therefore, the electrolytic capacitor of the present invention has the advantage that the electrostatic capacitance is larger than that of the previous electrolytic capacitor, although it is the same size. In addition, the electrolytic capacitor of the present invention can achieve the advantages of miniaturization and high withstand voltage even if the electrolytic capacitor has the same degree of electrostatic capacitance as the conventional electrolytic capacitor. In addition, although the electrolytic capacitor of the present invention has a thinner average thickness of the oxide film than the conventional electrolytic capacitor, it can be manufactured with less energy and manufacturing time than before, and is excellent in cost. The electrolytic capacitor of the present invention is provided with a hydrogen-removing film that does not easily decrease hydrogen-exhausting property even after long-term use, and can stably discharge hydrogen. In addition, the above-mentioned hydrogen discharge film can not only quickly discharge hydrogen generated inside the electrolytic capacitor to the outside, but also can prevent impurities from entering the electrolytic capacitor from the outside. In addition, the above-mentioned hydrogen discharge film may have a function of preventing the electrolytic capacitor itself from rupturing by being collapsed to reduce the internal pressure when the internal pressure of the electrolytic capacitor rises sharply. By virtue of these effects, the initial performance of the electrolytic capacitor can be maintained for a long time, so that the life of the electrolytic capacitor can be extended.
以下,對本發明之實施形態進行說明。 本發明之電解電容器具備排氫膜,且上述排氫膜包含於使等莫耳地含有氫氣及氮氣之混合氣體接觸時,使99莫耳%以上之氫氣選擇性透過之氫氣透過層。又,本發明之電解電容器之特徵在於,陽極之氧化皮膜之平均厚度與電容器之額定電壓之比(平均厚度/額定電壓)為1.2~2.9(nm/V)。 作為電解電容器,可列舉鋁電解電容器、鉭電解電容器、及鈮電解電容器等,但尤佳為鋁電解電容器。除排氫膜及陽極以外之構成構件可無特別限制地使用先前者。又,本發明之電解電容器係除了使用下述排氫膜及陽極以外,亦可藉由先前之方法而製造。以下,對排氫膜及陽極進行詳細敍述。 上述排氫膜包含於使等莫耳地含有氫氣及氮氣之混合氣體接觸時,使99莫耳%以上之氫氣選擇性地透過之氫氣透過層。較佳為使99.9莫耳%以上之氫氣選擇性地透過之氫氣透過層。 又,上述排氫膜係壓力之平方根為76.81 Pa1/2
(0.059 bar)之氫透過量較佳為10 ml/day以上(4.03×10-4
mol/day以上:依據SATP(Standard Temperature And Pressure,標準溫壓)進行計算(溫度25℃、氣壓1 bar下之1 mol之理想氣體之體積為24.8 L))。又,上述排氫膜係50℃下之氫透過係數較佳為1×10-12
(mol・m-1
・sec-1
・Pa-1/2
)以上,更佳為1×10-10
(mol・m-1
・sec-1
・Pa-1/2
)以上,進而較佳為1×10-9
(mol・m-1
・sec-1
・Pa-1/2
)以上。 作為具有該特性之層,例如可列舉Pd合金層等金屬層。 形成作為上述Pd合金層之材料之Pd合金之其他金屬並無特別限制,但例如可列舉Nb、V、Ta、Ni、Fe、Al、Cu、Ru、Re、Rh、Au、Pt、Ag、Cr、Co、Sn、Zr、Y、Ce、Ti、Ir、及Mo等。該等其他金屬既可使用1種,亦可併用2種以上。較佳為使用該等中之第11族元素,更佳為選自由該等中之Au、Ag、及Cu所組成之群中之至少1種。尤其,Pd-Au合金對於電解電容器內部之電解液或自構成構件所產生之氣體成分之耐腐蝕性優異,故而較佳。Pd合金較佳為包含20~65 mol%之第11族元素,更佳為30~65 mol%,進而較佳為30~60 mol%。又,包含Ag含量為20 mol%以上之Pd-Ag合金、Cu含量為30 mol%以上之Pd-Cu合金、或Au含量為20 mol%以上之Pd-Au合金之Pd合金層即便於50~60℃左右以下之低溫範圍,亦不易因氫而脆化,故而較佳。又,Pd合金亦可於不損及本發明之效果之範圍內包含IB族及/或IIIA族之金屬。 Pd合金不僅可為包含Pd之2成分之合金,而且亦可為例如Pd-Au-Ag之3成分之合金,且亦可為Pd-Au-Cu之3成分之合金。進而,亦可為Pd-Au-Ag-Cu之4成分之合金。例如,於包含Pd、Au及其他金屬之多成分系合金之情形時,Pd合金中之Au與其他金屬之合計含量較佳為55 mol%以下,更佳為50 mol%以下,進而較佳為45 mol%以下,尤佳為40 mol%以下。 Pd合金層例如可藉由壓延法、濺鍍法、真空蒸鍍法、離子鍍覆法、及鍍覆法等而製造,但於製造膜厚較厚之Pd合金層之情形時,較佳為使用壓延法,且於製造膜厚較薄之Pd合金層之情形時,較佳為使用濺鍍法。 壓延法可為熱軋或冷軋之任一方法。壓延法係使一對或複數對輥(滾筒)旋轉,於輥間將作為原料之金屬一面施加壓力一面使其通過藉此加工為膜狀之方法。 藉由壓延法而獲得之Pd合金層之膜厚較佳為5~50 μm,更佳為10~30 μm。於膜厚未達5 μm之情形時,於製造時易於產生針孔或裂痕,或者若進行氫吸藏,則易於變形。另一方面,若膜厚超過50 μm,則使氫透過需要時間,故氫透過性下降,或於成本方面較差,故而欠佳。 濺鍍法並無特別限定,可使用平行平板型、單片型、通過型、DC(Direct Current,直流)濺鍍、及RF(Radio Frequency,射頻)濺鍍等濺鍍裝置進行。例如,將基板安裝於設置有金屬靶之濺鍍裝置之後,將濺鍍裝置內進行真空排氣,將Ar氣壓調整為特定值,對金屬靶接通特定之濺鍍電流,於基板上形成Pd合金膜。其後,自基板將Pd合金膜剝離,獲得Pd合金層。再者,作為靶,可根據製造之Pd合金層,使用單一或複數個靶。 作為基板,例如可列舉玻璃板、陶瓷板、矽晶圓、鋁及不鏽鋼等金屬板。 藉由濺鍍法所得之Pd合金層之膜厚較佳為0.01~5 μm,更佳為0.05~2 μm。於膜厚未達0.01 μm之情形時,不僅存在形成針孔之可能性,而且難以獲得所要求之機械強度。又,自基板剝離時易於破損,從而剝離後之操作亦變得困難。另一方面,若膜厚超過5 μm,則製造Pd合金層需要時間,於成本方面較差,故而欠佳。 Pd合金層之膜面積可考慮氫透過量及膜厚而適當進行調整,但於用作安全閥之構成構件之情形時為0.01~100 mm2
左右。再者,於本發明中,Pd合金層之膜面積係於Pd合金層中實際將氫排出之部分之面積,且不包含塗佈有下述環狀之接著劑之部分。 上述金屬層較佳為於單面或兩面具有塗層。可藉由於金屬層之單面或兩面設置塗層,而封堵存在於金屬層之針孔或裂痕。藉此,可抑制電化學元件內部之必要成分(電解液等)洩漏至外部。 塗層之原料並無特別限制,例如可列舉氟系化合物、橡膠系聚合物、矽酮系聚合物、胺基甲酸酯系聚合物、及聚酯系聚合物等。其等之中,根據不易妨礙排氫膜之氫透過性之觀點,較佳為使用選自由氟系化合物、橡膠系聚合物、及矽酮系聚合物所組成之群中之至少1種之化合物。 作為氟系化合物,例如可列舉氟烷基羧酸鹽、氟烷基四級銨鹽、及氟烷基環氧乙烷加成物等含有氟烷基之化合物;全氟烷基羧酸鹽、全氟烷基四級銨鹽、及全氟烷基環氧乙烷加成物等含有全氟烷基之化合物;四氟乙烯/六氟丙烯共聚物、及四氟乙烯/全氟烷基乙烯基醚共聚物等含有氟碳基之化合物;四氟乙烯聚合物;偏二氟乙烯與四氟乙烯之共聚物;偏二氟乙烯與六氟丙烯之共聚物;含氟(甲基)丙烯酸酯;含氟(甲基)丙烯酸酯聚合物;含氟(甲基)丙烯酸烷基酯聚合物;含氟(甲基)丙烯酸酯與其他單體之共聚物等。 又,作為塗層之原料即氟系化合物,亦可使用Harves公司製造之「DURASURF」系列、DAIKIN INDUSTRIES公司製造之「OPTOOL」系列、及信越化學工業公司製造之「KY-100」系列等。 作為橡膠系聚合物,例如可列舉天然橡膠、苯乙烯丁二烯橡膠、丙烯腈丁二烯橡膠、氯丁二烯橡膠、聚異戊二烯橡膠、聚丁二烯橡膠、乙烯丙烯橡膠、乙烯-丙烯-二烯三元聚合物橡膠、氯碸化聚乙烯橡膠、及乙烯-乙酸乙烯酯共聚物橡膠等。 又,作為塗層之原料即橡膠系聚合物,亦可使用Nittoshinko公司製造之「ELEPCOAT」系列等。 作為矽酮系聚合物,例如可列舉聚二甲基矽氧烷、烷基改性聚二甲基矽氧烷、羧基改性聚二甲基矽氧烷、胺基改性聚二甲基矽氧烷、環氧基改性聚二甲基矽氧烷、氟改性聚二甲基矽氧烷、及(甲基)丙烯酸酯改性聚二甲基矽氧烷等。 塗層例如可藉由將塗層原料組合物塗佈於金屬層上使其硬化而形成。 塗佈方法並無特別限制,例如可列舉輥式塗佈法、旋轉塗佈法、浸漬塗佈法、噴塗法、棒式塗佈法、刮塗法、模嘴塗佈法、噴墨法、及凹版塗佈法等。 溶劑根據塗層之原料而適當選擇即可。於使用氟系化合物作為塗層之原料之情形時,例如可將氟系溶劑、醇系溶劑、醚系溶劑、酯系溶劑、及烴系溶劑等溶劑單獨或混合地使用。較佳為,將其等之中無易燃性且快速揮發之氟系溶劑單獨或與其他溶劑混合地使用。 作為氟系溶劑,例如可列舉氫氟醚、全氟聚醚、全氟烷烴、氫氟聚醚、氫氟碳、全氟環醚、全氟環烷烴、氫氟環烷烴、六氟代二甲苯、氫氯氟碳、及全氟碳等。 塗層之厚度並無特別限制,但較佳為0.1~40 μm,更佳為0.2~10 μm,進而較佳為0.3~5 μm。 亦可於上述金屬層之單面或兩面設置支持體。尤其,藉由濺鍍法所得之Pd合金層因膜厚較薄,而較佳為於Pd合金層之單面或兩面積層支持體,以提昇機械強度。 圖1及2係表示排氫膜1之構造之概略剖視圖。可如圖1(a)或(b)所示,使用環狀之接著劑3於Pd合金層2之單面或兩面積層支持體4,亦可如圖2(a)或(b)所示,使用治具5於Pd合金層2之單面或兩面積層支持體4。 支持體4為氫透過性且可支持Pd合金層2者即可,並無特別限定,既可為無孔質體,亦可為多孔質體。又,支持體4可為織布、不織布。作為支持體4之形成材料,例如可列舉聚乙烯及聚丙烯等聚烯烴、聚對苯二甲酸乙二酯及聚萘二甲酸乙二酯等聚酯、聚碸及聚醚碸等聚芳醚碸、聚四氟乙烯及聚偏二氟乙烯等氟樹脂、環氧樹脂、聚醯胺、聚醯亞胺等。可較佳地使用其等中之化學及熱穩定之聚碸或聚四氟乙烯。 支持體4較佳為平均孔徑100 μm以下之多孔質體。若平均孔徑超過100 μm,則多孔質體之表面平滑性下降,故而於利用濺鍍法等製造Pd合金層之情形時,變得難以於多孔質體上形成膜厚均一之Pd合金層,或者變得易於在Pd合金層產生針孔或裂痕。 支持體4之厚度並無特別限定,但通常為5~1000 μm左右,較佳為10~300 μm。 於利用濺鍍法製造Pd合金層2之情形時,若使用支持體4作為基板,則可於支持體4上直接形成Pd合金層2,從而不使用接著劑3或治具5便可製造排氫膜1,故而根據排氫膜1之物性及製造效率之觀點而言較佳。於該情形時,作為支持體4,較佳為使用平均孔徑100 μm以下之多孔質體,更佳為平均孔徑5 μm以下之多孔質體,尤佳為使用超過濾膜(UF(Ultrafiltration Membrane)膜)。 上述排氫膜之形狀既可為大致圓形狀,亦可為三角形、四角形、五角形等多角形。可設為與下述用途相應之任意之形狀。 上述排氫膜係作為電解電容器之安全閥之構成構件發揮作用。又,排氫膜亦可與安全閥分開地作為排氫閥設置於電解電容器。 上述排氫膜因於低溫下不脆化,故而存在例如可於150℃以下之溫度、進而110℃以下之溫度下使用之優點。即,可適當地用作未能於高溫(例如,400~500℃)下使用之電解電容器之安全閥或排氫閥。 用於本發明之電解電容器之陽極係氧化皮膜之平均厚度與電容器之額定電壓之比(平均厚度/額定電壓)為1.2~2.9(nm/V),較佳為1.3~2.4(nm/V),更佳為1.4~2.0(nm/V)。 例如,於普通之額定電壓400(V)之鋁電解電容器之情形時,氧化鋁皮膜之平均厚度為1200 nm左右,平均厚度/額定電壓為3(nm/V)左右。因此,於額定電壓相同之情形時,用於本發明之電解電容器之陽極之氧化皮膜之平均厚度為先前之氧化皮膜之平均厚度之僅40~95%,極薄。於使用具有此種極薄之氧化皮膜之陽極作為先前之電解電容器之陽極之情形時,因機械應力或電應力而於氧化皮膜中產生較多之缺陷部,且因皮膜修復作用而大量地產生氫氣,因電解電容器之內部壓力之上升導致外置殼體膨脹或破裂。然而,於本發明中,於電解電容器設置有上述排氫膜,故而即便於使用具有此種極薄之氧化皮膜之陽極之情形時,外置殼體亦不膨脹或破裂。 氧化皮膜之平均厚度可藉由於化學處理步驟(氧化皮膜形成步驟)中,任意地調整化學處理電壓而調整為目標之厚度。 [實施例] 以下,列舉實施例對本發明進行說明,但本發明並不受到該等實施例任何限定。 製造例1 [利用壓延法之Pd-Au合金層(Au含量30 mol%)之製作] 以鑄錠中之Au含量成為30 mol%之方式分別稱量Pd及Au原料,且投入至具備水冷銅坩堝之電弧熔解爐中,於大氣壓之Ar氣氛圍中進行電弧熔解。使用輥直徑100 mm之2段壓延機將所得之鈕狀物鑄錠冷軋至成為厚度5 mm為止,獲得板材。其後,將經壓延之板材放入玻璃管之中,且將玻璃管之兩端密封。於室溫下將玻璃管內部減壓至5×10-4
Pa為止,其後,升溫至700℃且放置24小時之後,冷卻至室溫。藉由該熱處理,而將合金中之Pd及Au之偏析消除。繼而,使用輥直徑100 mm之2段壓延機,將板材進行冷軋至成為厚度100 μm為止,進而,使用輥直徑20 mm之2段壓延機,將板材進行冷軋至成為厚度20 μm為止。其後,將經壓延之板材放入玻璃管之中,且將玻璃管之兩端密封。於室溫下將玻璃管內部減壓至5×10-4
Pa為止,其後,升溫至500℃且放置1小時之後,冷卻至室溫。藉由該熱處理,而將因壓延而產生之Pd-Au合金內部之應變去除,製成厚度20 μm、Au含量30 mol%之Pd-Au合金層。其後,利用浸漬塗佈法將塗層原料組合物(Harves公司製造,DURASURF DS-3302TH)塗佈於上述Pd-Au合金層上,使之乾燥,形成厚度0.3 μm之塗層,從而製作排氫膜。 製造例2 [利用濺鍍法之Pd-Au合金層(Au含量50 mol%)之製作] 於安裝有Au含量為50 mol%之Pd-Au合金靶之RF磁控濺鍍裝置(Sanyu-electron公司製造)安裝作為支持體之聚碸多孔質片材(日東電工公司製造,孔徑0.001~0.02 μm)。其後,將濺鍍裝置內真空排氣至1×10-5
Pa以下,於Ar氣壓1.0 Pa下,對Pd-Au合金靶接通4.8 A之濺鍍電流,於聚碸多孔質片材上形成厚度100 nm之Pd-Au合金層(Au含量50 mol%)。其後,利用浸漬塗佈法將塗層原料組合物(Harves公司製造,DURASURF DS-3302TH)塗佈於上述Pd-Au合金層上,使其乾燥,形成厚度0.3 μm之塗層,從而製作排氫膜。 實施例1 [鋁電解電容器之製作] 對於厚度90 μm之額定200~450 V用中高壓用化學處理箔(日本蓄電器工業公司製造),將切片為設置有用以引出電極之突出部之正方形(45×45 mm)者設為陽極,對於厚度30 μm之陰極箔(日本蓄電器工業公司製造),將切片為設置有用以引出電極之突出部之正方形(45×45 mm)者設為陰極,將厚度70 μm之麻紙(日本高度紙工業公司製造)切片為較電極箔大一圈之正方形(50×50 mm)作為電解紙。繼而,以各電極之方形部對齊之方式將陽極與陰極重合,將電解紙夾於陽極與陰極之間,形成電容器元件。此時,為防止電極之短路,各電極之突出部以不重疊之方式配置。收納元件之外置殼體係使用2片將依序積層厚度為40 μm之尼龍樹脂膜、厚度約為50 μm之鋁箔、及厚度為30 μm之熱熔性之聚丙烯樹脂膜而形成之鋁積層膜(大日本印刷公司製造)切片為方形(65×130 mm)而成者。此處,於一鋁積層膜之中央部設置f10之開口部,利用接著劑以覆蓋上述開口部之方式自聚丙烯樹脂膜面貼附製造例1中製作之f20之排氫膜。使該等2片鋁積層膜以各膜之聚丙烯樹脂面彼此疊合之方式重合,以寬度10 mm將3邊熱密封(200℃),製作外置殼體。繼而,自未熱密封之剩餘一邊將上述電容器元件放入外置殼體內之後,注入以癸二酸銨為主溶質之乙二醇系電解液。繼而,注入電解液之後,將未熱密封之剩餘1邊亦以10 mm之寬度進行熱熔,獲得鋁電解電容器。 實施例2 [鋁電解電容器之製作] 於實施例1中,代替製造例1中製作之f20之排氫膜,而使用製造例2中製作之f20之排氫膜,除此以外,利用與實施例1同樣之方法獲得鋁電解電容器。 實施例3 [鋁電解電容器之製作] 於實施例1中,將陽極及陰極之大小變更為39×39 mm,除此以外,利用與實施例1同樣之方法獲得鋁電解電容器。 實施例4 [鋁電解電容器之製作] 於實施例3中,代替製造例1中製作之f20之排氫膜,而使用製造例2中製作之f20之排氫膜,除此以外,利用與實施例3同樣之方法獲得鋁電解電容器。 比較例1 [鋁電解電容器之製作] 於實施例1中,於鋁積層膜之中央部不設置f10之開口部,且不使用製造例1中製作之f20之排氫膜,除此以外,利用與實施例1同樣之方法獲得鋁電解電容器。 比較例2 [鋁電解電容器之製作] 於實施例3中,於鋁積層膜之中央部未設置f10之開口部,不使用製造例1中製作之f20之排氫膜,除此以外,利用與實施例3同樣之方法獲得鋁電解電容器。 [測定及評價方法] (氫透過性之評價) 將製作而成之排氫膜安裝於Swagelok公司製造之VCR(Vacuum Coupling Radius Seal,真空連接徑向密封)接頭,且於單側安裝SUS(Steel Use Stainless,不鏽鋼)管,製作密封之空間(63.5 ml)。利用真空泵將管內減壓後,以氫氣之壓力成為0.15 MPa之方式進行調整,且監視105℃之環境下之壓力變化。藉由壓力變化而獲知透過排氫膜之氫莫耳數(體積),故而將其換算為每1天之透過量,運算氫透過量。例如,於2小時內壓力自0.15 MPa變化為0.05 MPa之情形時(變化量0.10 MPa),透過排氫膜之氫體積為63.5 ml。由此,每1天之氫透過量為63.5×24/2=762 ml/day。排氫膜之氫透過量較佳為10 ml/day以上,更佳為100 ml/day以上。製造例1之排氫膜之氫透過量為600 ml/day,製造例2之排氫膜之氫透過量為250 ml/day。 (氫氣之選擇透過性之評價) 將製作而成之排氫膜安裝於Swagelok公司製造之VCR接頭,且於單側安裝SUS管,製作經密封之空間(63.5 ml)。利用真空泵將管內減壓之後,以氮氣之壓力成為150 kPa之方式進行調整,且監視105℃之環境下之壓力變化。藉由壓力變化而獲知透過排氫膜之氮莫耳數(體積),故而,將其換算為每1天之透過量,運算氮透過量。例如,於2小時內壓力自150 kPa變化為149 kPa之情形時(變化量1 kPa),透過排氫膜之氮體積為0.635 ml。由此,每1天之氮透過量成為0.635×24/2=7.62 ml/day。氫氣之選擇透過性以(氫透過量-氮透過量)÷氫透過量×100表示,於上述情形時,成為(762-7.62)÷762×100=99%。製造例1之排氫膜之氮透過量為0 ml/day,製造例2之排氫膜之氮透過量為0 ml/day。因此,製造例1之排氫膜之氫氣之選擇透過性為100%,且製造例2之排氫膜之氫氣之選擇透過性為100%。 (靜電電容及tanδ之測定、外觀變化之評價) 於105℃之環境下,使用菊水電子工業股份有限公司製造之充放電系統控制器PFX2511S,對實施例1~4、比較例1及2中獲得之鋁電解電容器連續10小時施加200~600 V之直流電壓。其後,使用Keysight Technologies公司製造之LCR(Inductance Capacitance Resistance,電感電容電阻)測定計E4980A,測定20℃下之靜電電容(120 Hz)、tanδ(120 Hz),並且觀察外觀變化,以下述基準進行評價。將結果示於表1及2中。 :與初期相比無變化。 ×:與初期相比產生膨脹。 [表1]
1‧‧‧排氫膜1‧‧‧Exhaust hydrogen film
2‧‧‧Pd合金層2‧‧‧Pd alloy layer
3‧‧‧接著劑3‧‧‧ Adhesive
4‧‧‧支持體4‧‧‧ support
5‧‧‧治具5‧‧‧ jig
圖1(a)、(b)係表示本發明之排氫膜之構造之概略剖視圖。 圖2(a)、(b)係表示本發明之排氫膜之其他構造之概略剖視圖。1 (a) and 1 (b) are schematic cross-sectional views showing the structure of a hydrogen-removing film of the present invention. 2 (a) and 2 (b) are schematic cross-sectional views showing other structures of the hydrogen discharge film of the present invention.
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