TW201812429A - Substrate holding device, method for manufacturing such a device, and apparatus and method for processing or imaging a sample - Google Patents

Abstract

The invention relates to a substrate holding device comprising a holding plate, a base plate, an array of supports, and an array of droplets of a heat absorbing material. The holding plate comprises a first side for holding a substrate. The base plate is arranged at a distance from the holding plate and provides a gap between the base plate and the holding plate at a side of the holding plate opposite to the first side. The array of supports is arranged in between the holding plate and the base plate. The array of liquid and/or solid droplets is arranged in between the holding plate and the base plate, and the droplets are arranged to contact both the base plate and the holding plate. The droplets are arranged spaced apart from each other and from the supports, and are arranged adjacent to each other in a direction along the gap.

Description

   Substrate holding device, method for manufacturing the same, and instrument and method for processing or imaging samples   

The present invention relates to, for example, a substrate holding device for use in a lithography system. The invention further relates to a method for manufacturing the substrate holding device, and to the use of the substrate holding device in a lithography system. The invention further relates to an apparatus for exposing a sample, in particular for processing or imaging a sample, and more particularly for a lithography apparatus. The invention further relates to methods for processing or imaging a sample.

In lithography systems, for example, photons or charged particles such as ions or electrons are used to illuminate and pattern the surface of a substrate such as a silicon wafer. Due to the energy loading of such photons or charged particles, the substrate is at least partially heated. Especially in a charged particle lithography system such as a multi-beam charged particle lithography system, the impact of the charged particles can cause significant heating of the substrate, especially in combination with the local impact of the charged particles on the substrate.

Various substrate holding devices have been proposed which suppress the temperature rise of the substrate and thereby stabilize the temperature of the exposed substrate.

Many of these holding devices rely on the thermal contact of the substrate with a coolant that is configured to flow through the substrate holding device. An example of such a device is disclosed in US 5,685,363, which describes a substrate holding device comprising a heat absorbing fluid chamber under a wafer or target to be exposed. This known substrate holding device includes a heat absorbing fluid covered with a flexible sheet. In use, the substrate is pressed against the sheet by the substrate holder, whereby the sheet and thus the heat-absorbing fluid come into close thermal contact with the rear surface of the substrate that is to be stable in temperature.

In cases where the substrate is only locally heated, such as in a charged particle beam lithography system, when the heat-absorbing fluid actually extends below the entire back of the substrate, the layer of heat-absorbing fluid in this known design serves as In addition to the heat absorbent, it acts as and forms a thermal buffer.

In addition, a temperature stabilizing device as disclosed in US 5,685,363 includes a heat absorbing fluid channel or a coolant channel included in a stabilization substrate through which the heat absorbing fluid flows to cool the substrate holding device, and Heat is transported away from the substrate holding device. This allows the temperature of the substrate holding device below the heat absorption chamber to be stabilized and provides better control of the temperature at which the substrate holding device and the target will be stable.

In lithography exposure systems that are generally adapted to a vacuum environment, such coolant channels are not preferred. One reason is that the associated coolant conduit prevents or interferes with the precise positioning of the substrate, either directly or via hysteresis.

In the field of lithography, patent publication US 2005/0128449 teaches that phase change materials (so-called PCM) can facilitate the removal of heat. PCM can store large amounts of energy as latent heat during a phase change from solid to liquid. Advantageously, a large amount of thermal energy can be stored at a relatively constant temperature. Therefore, the use of PCM can provide temperature stabilization by storing a large amount of thermal energy without significantly changing the temperature. The PCM material can be applied without a coolant conduit, while still safely controlling the temperature at which the target or substrate and the substrate holding device will be stabilized. Materials indicated to achieve this thermal storage and stabilize the system include paraffin and Rubitherm ^tm PX. PCM may be provided as a PCM powder or as a cohesive PCM.

This method of combined thermal storage and temperature control is based on commonly known principles that utilize the phase change of a material at a constant temperature. In applying this principle, as can be further known from a large number of literatures in "A review of on phase change energy storage: materials and applications" (Energy Conversion and Management 45, 2004) by Mohamed M. Farid et al. The materials can usually be selected from the manual. In order to provide a large amount of thermal energy storage at the desired temperature, those skilled in the art will look for materials that have relatively high transformation or latent heat at the desired temperature, under conditions of stabilized temperature. One of the handbooks is "Handbook of chemistry & Physics", which is based on the US Atomic Energy Commission, Report ANL-5750 published research list "thermodynamic properties of the elements". The indicativeness of the prevalence of certain materials in a large number of PCMs is through the choice of "Numerical simulation of solid-liquid phase change phenomena" by Costa et al. Numerical simulation to verify PCM behavior.

Patent publication US 2008/0024743 provides an example of a lithographic target exposure system showing this known temperature stabilization system in the name of the applicant, where the coolant duct is omitted by the application of PCM in the form of, for example, hexadecane. Cetane is selected for the following reason: its phase transition temperature matches the upper end of the typical temperature range of the coolant fluid used in semiconductor manufacturing, thereby preventing the temperature of the substrate thermal buffer from other than that of industrial lithography systems 2. The liquid cooling part usually deviates to an undesired degree. In this regard, the PCM temperature of cetane can be regarded as about 291K by "characterization of Alkanes and Paraffin Waxes for application as Phase Change Energy Storage Medium" (Energy sources, Volume 16, 1994) by Himran and Suwono, And the manufacturer's coolant liquid can be regarded as within the range from 286K to 291K (55F to 65F) by "Bringing energy efficiency to the fab" (McKinsey on semiconductors, Autumn 2013) by Chen, Gautam and Weig.

Although cetane has the advantage of matching the industrial operating temperature, at least the phase transition temperature of the industrial coolant temperature, in practice it appears to suffer from poor performance due to poor thermal conductivity, regardless of the target used to improve the target and as known here The use of thermal conductivity measures between PCMs as taught in PCM-based substrate temperature stabilization systems.

Furthermore, US 7,528,349 discloses a temperature stabilization system comprising a heat absorbing material disposed in thermal contact with a substrate. The heat absorbing material is characterized by a solid-liquid phase transition temperature in a desired temperature range of a material for processing a substrate. According to US 7,528,349, the heat-absorbing material may be provided as a flat layer provided on top of the carrier, may be provided to fill one or more recesses in the surface of the carrier, or may be embedded in the carrier by filling the recess with heat-absorbing material . The heat absorbing material is configured to be in direct contact with the substrate or with a suitable thermally conductive layer, which is in sufficient thermal contact with the two substrates. In a case such as in a charged particle beam lithography system, where the substrate is heated only locally, the resulting heat is locally absorbed by the heat-absorbing material. Due to the heat absorption, the heat absorbing material will at least partially undergo a phase transition at the location where the charged particle beam impacts the substrate. This local phase transition causes local expansion or contraction of the heat-absorbing material. These local expansions or contractions produce unwanted distortion or deformation of the substrate, which makes the temperature stabilization system of US 7,528,349 unsuitable for high-resolution charged particle lithography.

The present invention therefore seeks to provide systems, instruments, and / or methods that provide accurate temperatures for systems, instruments, and / or substrate holding devices by using good thermally conductive, usually metal, phase change materials. Controlling components while still matching the temperature within the semiconductor standard range of coolant liquid. Standard metal materials have a phase transition temperature away from this desired operating range. Gallium with a transition temperature of 303K is closest to the temperature range of the coolant liquid used in semiconductor manufacturing, but still deviates from 12 degrees. Other metal-like materials may be selected from metal-based compound materials. In the case that such liquid metal materials can exhibit gallium-like behavior, the present invention further seeks to optimize the PCM stable type in the combined function of the PCM stabilized substrate support as a container for the liquid metal compound and the substrate temperature stabilizer. A substrate support, thereby providing a new design for this temperature-stabilized substrate support.

Likewise, although the substrate holding device according to US 2008/0024743 provides an extremely compact and precise way to maintain the substrate on the top of the substrate holding device at a substantially constant temperature, it has also proven difficult to manufacture this substrate Hold the device and / or obtain a carrier or thermally conductive frame with a highly accurate and reproducible size suitable for use in lithography systems.

Additionally or alternatively, it is an object of the present invention to provide a design suitable for the specific properties of a metalloid phase change material such as any of the various gallium compounds. In practice, these materials tend to indicate ice-like and water-like behavior in the transformation of ice and water from solid to liquid, because the volume in the solid form can often be greater than in the liquid form, and because of the At least the potential loss of direct contact between the upper layer and the phase change material included below causes poor thermal conductivity.

Additionally or alternatively, the object of the present invention is to provide an exposure method and apparatus for the device, which provides accurate temperature control of a substrate, especially an exposure unit for projecting electromagnetic radiation or particles onto the substrate. Arranged in close proximity to the substrate so that the exposure unit can thermally affect the substrate.

Additionally or alternatively, the object of the present invention is to provide a substrate holding device that at least partially avoids at least one of the above-mentioned disadvantages of the substrate holding devices of the prior art.

According to a first aspect, the present invention provides a substrate holding device including a holding plate, wherein the holding plate includes a first side for holding the substrate, and a base plate, which is disposed at a distance from the substrate plate. A gap between the base plate and the clamping plate is provided at a distance from the clamping plate and at a second side of the clamping plate facing away from the first side, and an array of support members are arranged at least in Between the clamping plate and the base plate, and an array of droplets of one of the heat absorbing materials, the droplets are arranged in the gap between the clamping plate and the base plate, wherein the droplets are configured to Spaced apart from the supports and spaced from other droplets in the array droplets, and wherein the droplets are configured to contact both the base plate and the clamping plate.

The array of supports between the base plate and the clamping plate defines the width of the gap between the base plate and the clamping plate, and provides a frame with highly accurate and reproducible dimensions. This novel design for containing droplets of phase change materials in a manner suitable for successful, at least optimal heat transfer, at least for successful temperature stable thermal buffering, makes flexible use of ball or small parts of the liquid material With the surface tension and cohesion of the drop shape, at least the container design is adapted to the material properties. Therefore, the substrate holding device of the present invention is configured to receive and contain droplets of the phase change material, especially droplets separated from the support and spaced from other droplets in the array droplet, instead of filling the PCM container, That is, it is configured for receiving a PCM in a cavity in a clamping device as described, for example, in US 7,528,349. The holder is preferably provided with a plurality of well-dispersed, relatively small and / or shallow indentations or cavities, each adapted to receive a droplet of PCM.

The droplets are configured to be spaced apart from the support and from other droplets in the array droplets such that the droplets are enabled at least in a direction along the gap between the base plate and the clamping plate. Swell. The droplets in the array droplets are configured to have sufficient lateral space such that the droplets stand freely laterally at least in a direction along a gap between the clamping plate and the base plate. The substrate holding device according to this embodiment can be more easily manufactured because the position or positioning of the droplets does not interfere with the position or positioning of the support.

Preferably, the PCM exhibits greater cohesion than adhesion to the gap-facing surface of the clamping plate and / or the base plate. This enables the flattened PCM droplets to be accommodated in the gap, especially in the indentations or cavities of the gap, so that the flattened droplets can shrink or expand according to the situation, while maintaining the best with the clamping plate and the substrate Good contact, and at the same time provide the desired function as a temperature stable substrate holding device. The latter function is implemented especially without the disadvantages of the solution as described above.

In addition, the array droplets in a liquid phase, a solid phase, or a combination of a liquid phase and a solid phase are configured to bridge the gap between the clamping plate and the substrate plate. Therefore, the droplet is in contact with both the holding plate and the base plate. This can be configured, in particular, by a suitable choice of the volume of the individual droplets and / or the width of the gap between the base plate and the clamping plate. The contact between the holding plate and the droplets provides proper heat conduction from the holding plate to the droplets of the heat absorbing material on the one hand, and the contact between the base plate and the droplets on the other hand provides the Proper thermal conduction of droplets.

When the entire gap between the base plate and the clamping plate will be filled with heat absorbing material, any expansion or contraction of the heat absorbing material due to heat absorption will cause the pressure in the heat absorbing material to increase or decrease, which can cause Changes in the size of the substrate holding device and / or deformation of the holding plate. This problem has been identified in patent publication US 2014/0017613, and US 2014/0017613 states that, considering expansion, it is desirable to make the external dimensions of the thermal storage structure in a state where heat I is not absorbed earlier than the clamping unit. The inner diameter is small. However, making the thermal storage structure smaller than the inner diameter of the clamping unit has a notable disadvantage: the thermal storage structure is not configured to be in direct contact with the substrate, as shown in US 2014/0017613. Additional components need to be provided to move the heat generated in the substrate to the thermal storage structure. US 2014/0017613 teaches the use of a liquid, such as water, which completely fills the gap between the substrate and the substrate. The present invention provides a completely different solution to this problem by using an array of droplets of a heat absorbing material, the array of droplets being configured to be separated from the support and spaced from other droplets in the array of droplets, and wherein the The iso droplets are configured to contact the base plate and the clamping plate, preferably wherein the droplets are squeezed, wedged, or retained between the base plate and the clamping plate.

It should be noted that when the PCM container is filled with less heat absorbing material as proposed by US 2014/0017613, that is, a cavity configured to receive a PCM in a clamping device as described in, for example, US 7,528,349, the empty The cavity will be only partially filled and will not be filled to the clamping plate. This provides space for the expansion of the heat absorbing material in the cavity, but it will also deprive the direct contact between the heat absorbing material and the clamping plate, as opposed to the invention as defined in item 1 of the scope of the patent application.

In one embodiment, the droplets are configured to enable the droplets to expand substantially freely in a direction along a gap between the base plate and the clamping plate. The assembly of substantially individual droplets allows each droplet to expand or contract in the direction of the gap, and generally does not provide an increase or decrease in the pressure of the droplets on the clamping plate or the substrate plate.

In one embodiment, the array of supports is fixedly attached to the second side of the clamping plate. By attaching the array of supports to the second side of the clamping plate, the support is configured in a generally fixed position on the clamping plate. This allows the support to be configured in a suitable pattern to provide rigid support to the clamping plate, the rigid support being substantially uniform over the area of the clamping plate. In addition, this allows providing a gap with a highly accurate and reproducible size between the base plate and the clamping plate.

Alternatively or in addition, in one embodiment, the support in the array support is fixedly attached to the base plate. In one embodiment, the base plate is provided with an array hole, and wherein each of the array support members at least partially extends into one of the array holes, preferably wherein the support members are formed by A glue connection is provided in the circumferential gap between the hole and the support member extending into the hole to be fixedly arranged in the holes. By providing glue between the inner wall of the hole and the outer circumferential wall of the support, any shrinkage or expansion of the glue during its hardening results in acting in a direction generally perpendicular to the width of the gap between the base plate and the clamping plate Of force. Therefore, these forces do not substantially affect or change the distance between the base plate and the clamping plate, especially during the hardening or setting of the glue. The substrate holding device according to this embodiment can therefore be related to the width of the gap between the base plate and the holding plate, and also to the total thickness of the substrate holding device, especially in a direction perpendicular to the first side of the holding plate The thickness is manufactured with high accuracy.

In an embodiment, the substrate holding device further includes an array ring, the rings are arranged in a gap between the holding plate and the base plate, and each ring in the array ring is configured to surround the array droplet One of the droplets. Each of these rings can be used as a mold for droplets in the array of droplets of a heat-absorbing material, with the droplets being disposed inside the ring.

In one embodiment, the thickness of the rings is smaller than the width of the gap between the clamping plate and the base plate. Preferably, the size and / or material of the rings is selected such that the thickness of the rings remains less than the width of the gap, regardless of any expansion or expansion of the rings due to temperature changes, particularly within the operating temperature range of the substrate holding device. shrink. The ring is not in contact between both the base plate and the clamping plate, and therefore the ring does not apply a substantial force to the clamping plate and the base plate. Therefore, the ring has no effect on the width of the gap.

When such a ring is used as a mold for droplets, the droplets are also made thinner than the width of the gap between the holding plate and the base plate in the first case, and the droplets are then "solidified" into a solid . These solid droplets of the heat absorbing material can be easily handled during the manufacture of the substrate holding device and are disposed between the base plate and the holding plate. When the holding plate is placed on top of the base plate with the support array and the solid droplet array in between, the droplets of the heat absorbing material melt to produce liquid droplets that contact both the base plate and the holding plate. In addition, the droplets shrink in the direction along the gap, thereby providing space to enable expansion of the droplets in the direction along the gap between the base plate and the clamping plate. Subsequently, the droplets in contact with both the base plate and the holding plate solidified again. These solidified droplets provide a means for absorbing heat from the clamping plate and / or the base plate.

Preferably, the droplet comprises a material having a high surface tension with respect to a surface of the holding plate and / or the base plate that faces a gap between the base plate and the holding plate. The use of a heat absorbing material with a high surface tension advantageously facilitates the contact of both the base plate and the clamping plate by liquid droplets.

Additionally or alternatively, the ring provides means for fixing the position of the droplets in the gap between the base plate and the clamping plate.

Preferably, the ring is made of a flexible or elastic material. The ring of this embodiment also promotes the expansion of the droplets in the direction along the gap between the base plate and the clamping plate.

In an embodiment, the base plate and / or the holding plate is provided with an array bag portion, wherein the width of the gap between the holding plate and the base plate at the bag portion in the array bag portion is larger than the bag portion The width of the surrounding gap between the clamping plate and the base plate, and wherein each of the array pocket portions is configured to clamp one of the array droplets. It should be noted that each pocket may also be provided as an indentation or depression, especially a shallow indentation or depression. The bag portion is disposed in a gap-facing surface of the base plate and / or a gap-facing surface of the clamping plate. Preferably, the depth of the pockets is less than the height of the droplets. The bag section provides a means for fixing the position of the droplets in the gap between the base plate and the clamping plate, especially if a ring is not required. Because no ring or other member is required to substantially secure the droplet's position, the droplets can be configured closer together, which provides better coverage of the heat-absorbing material on the area at the second side of the clamping plate.

In one embodiment, at least one of the array bag portions is substantially shaped as a cone, a conical hammer table, a truncated sphere, or a spherical hammer table. Preferably, the bag portion is shaped so that the width of the gap at or near the peripheral edge of the bag portion is smaller than the width of the gap at or near the center of the bag portion. In this case, the shape of the pockets helps to keep the droplets generally in the desired position, especially when the PCM exhibits greater cohesion than the adhesion to the gap-facing surface of the holding plate and / or base plate .

In one embodiment, the gap-facing surface of the base plate includes an array bag portion, wherein each of the array bag portions includes an elastic member, and the elastic member crosses the bag portion and is configured to be in contact with the bag portion. The bottom surface is spaced apart and each of the pockets contains droplets from the array of droplets, wherein the droplets are disposed between the elastic member and the clamping plate. The elastic member provides a member for occupying any residual expansion in a direction substantially perpendicular to the gap by bending the elastic member toward the bottom surface of the bag portion. In addition, the elastic member can help advance the droplets toward the cover plate to ensure and provide stable contact between the droplets and the cover plate. Preferably, the elasticity of the elastic member is selected such that the spring force provided by the curved elastic member does not substantially cause local deformation of the clamping plate.

In an embodiment, a distance between the elastic member and the clamping plate is greater than a distance between the clamping plate and a surface of the base plate adjacent to the bag portions. Therefore, the elastic member is disposed inside the corresponding pocket portion. In one aspect, the elastic member is configured to be spaced apart from the bottom surface of the bag portion to allow the elastic member to bend toward the bottom surface of the bag portion. On the other hand, the elastic member is disposed below the surface of the base plate surrounding the bag portion, and this provides a member for fixing the position of the droplet in the gap between the base plate and the holding plate.

In one embodiment, the elastic member includes a cover, preferably a cover plate. Therefore, the covering or covering plate covers the bottom surface of the bag portion, and the portion of the covering portion between the covering or covering plate and the bottom surface of the covering portion is preferably separated from the covering or covering plate. In one embodiment, the cover or cover plate is substantially flat. This flat covering or covering plate can be easily produced by cutting the covering or covering plate from a large piece of suitable material. In an alternative embodiment, the covering or covering plate is non-planar and is preferably shaped as a cone, a conical hammer table, a truncated sphere, or a spherical hammer table. In addition to taking advantage of any residual swelling in a direction generally perpendicular to the gap by covering or bending the cover surface towards the bottom surface of the pocket, this non-flat cover provides the same as described above with reference to the tapered pocket The same advantages. In one embodiment, the cover or cover plate is shaped as a cup with a circumferential flange that is placed to be at least partially in contact with the base plate for supporting the cup-shaped cover or cover plate.

In one embodiment, each bag portion includes a support element for supporting at least a portion of the edge of the elastic member, preferably covering or covering the peripheral edge of the board, in the bag portion. Therefore, the support element is configured to support at least a portion of the edge of the elastic member, which allows the central portion of the elastic member to bend toward the bottom surface of the bag portion. Preferably, the droplets of PCM are disposed substantially centrally on top of the elastic member.

In one embodiment, the support element includes a rim or step disposed in a peripheral side wall of the bag portion. The rim or step, which preferably extends at the circumference around the bag portion, can be made by first manufacturing a first bag portion having a first diameter to a first predetermined depth in the base plate, and then at the first bag portion It is relatively easy to manufacture a second bag portion having a second diameter smaller than the first diameter to a second predetermined depth. Alternatively, it may be achieved by first manufacturing a bag portion having a second diameter to a predetermined depth of the bag portion, and then inserting a rotary cutter into the first bag portion to the level of the rim or step, and surrounding the first bag The rotary cutter is cyclically driven in the outward direction to the first portion to the first diameter for milling away the material of the base plate surrounding the first bag portion while maintaining a constant level or depth to make the rim or step. This results in a rim or step arranged at the predetermined depth. By using an elastic member having a diameter smaller than the first diameter but larger than the second diameter, the edge of the elastic member rests on top of the rim or step.

In one embodiment, each bag portion includes a ring or loop disposed in a gap between the clamping plate and the elastic cover plate, and wherein the ring or loop is configured to surround the droplet in the pocket. A ring or loop is disposed in the bag portion, preferably on top of the elastic cover plate, and serves as a restricting member for the droplets of PCM in the bag portion.

In one embodiment, the thickness of the ring or ring is smaller than the distance between the clamping plate and the elastic covering plate. Preferably, the size and / or material of the ring or ring is selected so that the thickness of the ring or ring is smaller than the width between the elastic cover plate and the clamping plate, regardless of the attributes attributed to the substrate holding device in particular. Any expansion or contraction of a ring or loop with a change in temperature within the operating temperature range. The ring or ring is in contact with only one of the cover plate and the clamping plate.

In one embodiment, the ring or loop is made of a flexible or elastic material. The ring or loop of this embodiment also promotes the expansion of the droplets of PCM inside the ring or loop, especially in the direction along the gap between the base plate and the clamping plate.

In one embodiment, the ring or loop includes a generally rectangular cross section. In particular, the ring or loop comprises a rectangular cross section in a direction substantially perpendicular to the first side of the clamping plate. Preferably, the ring or loop comprises a substantially flat upper surface, wherein the substantially flat upper surface is configured to face the second side of the clamping plate. This embodiment is particularly advantageous where the density of the liquid PCM is higher than the density of the ring or ring material. In this condition, the ring or hoop will "float" in the PCM material when it is in a liquid state, which will push the ring or hoop towards the second side of the clamping plate and will allow the ring or hoop to be flat The upper surface abuts the second side of the clamping plate and provides a restriction to the PCM.

In one embodiment, the base plate is provided with air vents which flow out in the bottom surface of the pockets, and the air vents preferably flow out substantially in the center of the pockets. Due to the vent hole, the pressure inside the pocket portion between the bottom surface and the elastic covering plate is not substantially changed by the bending of the elastic covering plate.

In an embodiment for use in a substrate processing apparatus or a substrate imaging apparatus, the droplets in the array droplets have a temperature at the substrate processing apparatus at least during processing of the substrate, or the substrate imaging apparatus at least A material that has a melting temperature or melting range at or near the temperature during imaging of the substrate. Preferably, the droplets in the array droplets comprise a material having a melting temperature or melting range at or near the operating temperature of the industrial coolant. Preferably, in use, the temperature of the substrate processing instrument is close to or slightly higher than the operating temperature of the industrial coolant, and the operating temperature is preferably at or slightly lower than the indoor temperature, preferably At or slightly below 18 degrees Celsius. Therefore, the machine part of the substrate processing apparatus or the substrate imaging apparatus need not rise in temperature, and the industrial coolant can be easily applied or applied by the substrate processing apparatus or the substrate imaging apparatus including the substrate holding device according to the present invention. The substrate processing apparatus or the substrate imaging apparatus.

In one embodiment, the gap includes an open connection to the outside of the substrate holding device. The air pressure or vacuum pressure inside the gap is substantially equal to the air pressure or vacuum pressure outside the substrate holding device. In one embodiment, the gap is substantially open at a peripheral side edge of the substrate holding device, and preferably the gap is substantially open along a substantially complete peripheral side edge of the substrate holding device.

According to a second aspect, the present invention provides a substrate holding device including a holding plate, wherein the holding plate includes a first side for holding the substrate, and a base plate, which is disposed at a distance from the substrate plate. A gap between the base plate and the clamping plate is provided at a distance from the clamping plate and at a second side of the clamping plate facing away from the first side, and an array of support members are arranged at least in Between the clamping plate and the base plate, and an array of droplets of a heat absorbing material, the droplets are arranged between the clamping plate and the base plate, wherein the droplets are substantially perpendicular to the clamp The direction of the first side of the holding plate is restricted by the clamping plate and the base plate, and wherein the droplets are configured to enable the droplets to be at least between the base plate and the clamping plate. The expansion in the direction of the gap.

An array of droplets preferably containing liquid and / or solid droplets is generally confined between the clamping plate and the substrate plate. Therefore, the droplet is in contact with both the holding plate and the base plate. This can be configured, in particular, by a suitable choice of the volume of the individual droplets and / or the width of the gap between the base plate and the clamping plate. The contact between the holding plate and the droplets provides proper heat conduction from the holding plate to the droplets of the heat absorbing material on the one hand, and the contact between the base plate and the droplets on the other hand provides the Proper thermal conduction of droplets.

According to a third aspect, the present invention provides an apparatus for processing or imaging a sample, wherein the apparatus includes a source for electromagnetic radiation or particles having energy, and an exposure unit for exposing the sample to the Electromagnetic radiation or particles with energy, and a substrate holding device as described above, or an embodiment thereof, for holding the sample at least during the exposure.

In an embodiment, the exposure unit includes a component for at least partially and / or temporarily manipulating and / or blocking at least part of electromagnetic radiation or charged particles, wherein the component is provided with a conduit for guiding a cooling fluid through the conduit Wherein the conduits are configured to be in thermal contact with the component. Accordingly, the cooling fluid in the conduit is configured for removing at least part of the heat generated by electromagnetic radiation or charged particles by at least part of the component and / or temporarily manipulating and / or blocking it. This component contains, for example, a diaphragm, an electrostatic beam deflector, or an electrostatic or magnetic lens system.

Generally, the exposure unit is arranged at the side of the substrate facing away from the substrate holding device. When the exposure unit includes one or more components for at least partially and / or temporarily manipulating and / or blocking at least part of the electromagnetic radiation or charged particles, the component heats up in use. For example, when at least part of such electromagnetic radiation or charged particles impinges on a component. In addition to the heat generated by the electromagnetic radiation or charged particles impinging on the substrate during exposure, the radiant heat from one or more components of the exposure unit can further warm the substrate, especially when one or more components are configured close to When the surface of the substrate. This extra heat from the exposure unit will also be absorbed by the heat absorbing material in the substrate holding device of the present invention, which results in a faster depletion of the heat absorbing material, especially when the heat absorbing material is PCM. Therefore, it is advantageous to reduce the extra heat from the exposure unit as much as possible, and to combine the substrate holding device of the present invention with an exposure unit having a cooling configuration for cooling the at least one component of the exposure unit.

In an embodiment, the projection lens system is configured for use in a multi-beam charged particle lithography system, wherein at least a first portion of the catheter is disposed in an area between two charged particle beams, and wherein the The central axis of the first portion extends in a direction substantially perpendicular to a central axis or an optical axis of the exposure unit. Therefore, the first portion of the catheter is configured to approximate the area in which the charged particle beam travels through the projection lens system in use, which allows effective removal of any generated heat from this area.

In an embodiment, at least a second portion of the catheter is configured to extend such that a central axis of the second portion of the catheter extends in a direction substantially parallel to a central axis or an optical axis of the exposure unit. Therefore, the first part of the catheter may be arranged at or near the first end of the exposure unit facing the substrate in use. The second portion of the conduit provides an extension of the conduit away from the first end of the exposure unit, which allows providing an input connection and / or an output connection for the fluid suitably spaced from the first end, and configuring the first end of the exposure unit It is very close to the substrate. In one embodiment, the assembly includes a projection lens system disposed at the first end of the exposure unit.

According to a fourth aspect, the present invention relates to a projection lens system for use in an exposure unit for exposing a substrate with electromagnetic radiation or charged particles having energy, wherein the projection lens system includes a lens for at least partially and And / or temporarily manipulating and / or blocking at least part of an assembly of electromagnetic radiation or charged particles, wherein the assembly is provided with a conduit for directing a cooling fluid through the conduits, wherein the conduits are configured to be in thermal contact with the component In contact.

The projection lens system therefore provides a temperature-controlled exposure unit for use in, for example, a temperature-stable lithography system. The projection lens is effectively cooled to a temperature range that is well within the temperature range of ordinary manufacturer's temperature, so as to have a lithography system that is stable and internally consistent, that is, in equilibrium with the thermal state, thereby avoiding instrument design on the one hand The complexity and energy savings, and on the other hand promote optimal exposure conditions, such as are required for the ultimate accuracy in exposure and are extremely extreme in contemporary lithography.

In one embodiment, the projection lens system is configured for use in a multi-beam charged particle lithography system, wherein at least a first portion of the catheter is disposed in an area between two charged particle beams, wherein the catheter The central axis of the first part extends in a direction substantially perpendicular to the central or optical axis of the projection lens system.

In an embodiment, at least a second portion of the catheter is configured to extend such that a central axis of the second portion of the catheter extends in a direction substantially parallel to a central or optical axis of the projection lens system.

According to a fifth aspect, the present invention provides a method for manufacturing a substrate holding device, the substrate holding device comprising: a holding plate, wherein the holding plate includes a first side for holding a substrate; a base plate Is arranged at a distance from the clamping plate and provides a gap between the base plate and the clamping plate at a second side of the clamping plate facing away from the first side; an array support, etc. A support is disposed at least between the holding plate and the base plate; and an array of droplets of one of the heat absorbing materials, wherein the method includes the following steps: spaced from the support and other droplets in the array The separated droplets are arranged between the clamping plate and the base plate, wherein the droplets are configured to contact both the clamping plate and the base plate at least in their liquid phase, and / or wherein the small droplets The droplets are bounded by the clamping plate and the base plate in a direction generally perpendicular to the first side of the clamping plate, and wherein the droplets are configured to enable the droplets to run along the base plate and Expansion in the direction of the gap between the clamping plates.

According to a sixth aspect, the present invention relates to a method for assembling a substrate holding device, wherein the method includes the steps of: providing a holding plate, wherein the holding plate includes a first side for holding a substrate, and An array of support members fixed to a second side of the clamping plate facing away from the first side, wherein the support members are configured to extend substantially perpendicular to the second side; a base plate is provided, the base The plate includes an array of holes for mounting the supports in the holes; an array of droplets of heat absorbing material separated from the supports and spaced from other droplets in the array of droplets is on the surface One side of the base plate is arranged on the clamping plate, or one side facing the clamping plate is arranged on the base plate; the clamping plate and the base plate having the supporting members Move towards each other until the desired distance between the holding plate and the base plate has been reached, where the support members are positioned in the holes, and the array droplets are arranged between the holding plate and the base plate In the gap; and fixing one or more of these supports In the corresponding hole.

In one embodiment, the support is fixed to the second side via an adhesive connection. In one embodiment, one or more support members are fixed in the corresponding holes via a glue connection provided in a circumferential gap between the hole and the support member extending into the hole.

According to a seventh aspect, the present invention relates to an apparatus for processing or imaging a sample, as described above, for the substrate holding device, preferably a lithography system, and more preferably a charged particle beam lithography system. , Such as the use of multi-beam charged particle lithography systems.

In an embodiment, an apparatus for processing or imaging a sample includes a source for electromagnetic radiation or particles having energy, and an exposure unit for exposing the sample to the electromagnetic radiation or charged particles having energy, Wherein the exposure unit includes a component for at least partially and / or temporarily manipulating and / or blocking at least part of electromagnetic radiation or charged particles, wherein the component is provided with a conduit for guiding a cooling fluid through the conduit, wherein the The isopipe is configured to be in thermal contact with the assembly.

According to an eighth aspect, the present invention provides an apparatus for exposing a sample, wherein the apparatus includes a source for electromagnetic radiation or particles having energy, and an exposure unit for exposing the sample to the electromagnetic radiation Or particles, wherein the exposure unit includes a component for at least partially and / or temporarily manipulating and / or blocking at least a portion of the electromagnetic radiation or charged particles, wherein the component includes a cooling configuration configured to use The assembly is generally maintained at a predetermined first temperature, and a substrate holding device for holding the sample at least during the exposure, wherein the substrate holding device includes a temperature stable configuration, the temperature stable configuration is configured The temperature of the sample substantially stable disposed on the substrate holding device, wherein the temperature stable configuration includes a phase change material having a phase change at a second temperature, wherein the cooling configuration includes a control device, the control device is It is configured to adjust the first temperature to be near the second temperature or equal to the second temperature.

Because the exposure unit is configured to expose the sample using electromagnetic radiation or particles with energy, the exposure unit and / or sample will absorb at least a portion of the energy and will increase the temperature of the sample on the exposure unit and / or the substrate holding device . It should be noted that, generally, the sample is configured at a distance from the exposure unit so that possible heating of the exposure unit has a negligible effect or substantially no effect on the sample, and any cooling of the exposure unit may be independent of the cooling of the sample. In particular, the cooling configuration for the exposure unit as described in the applicant's WO 2013/171216 is optimized to provide the optimal temperature for the exposure unit, and the effect of this optimal temperature on the sample need not be considered.

The inventors have recognized that it is advantageous to provide a configuration for controlling the temperature of both the substrate holding device and the exposure unit, especially for a system in which the exposure unit is configured close to the sample and is stable based on the temperature of the substrate holding device The configured temperature (second temperature) controls the temperature (first temperature) of the cooling configuration of the exposure unit. By providing both the exposure unit and the substrate holding device with their own cooling configuration and temperature stable configuration, precise temperature control of the substrate can be obtained, which allows the substrate to be exposed by the electromagnetic radiation or particles The temperature of the substrate is at least substantially maintained at the second temperature during the period.

The present invention proposes a concept for defining an exposure process and an apparatus for the exposure process, and the concept is suitable for the limitation of the practical environment. In particular, in an exposure unit for projecting electromagnetic radiation or particles onto the substrate is configured in an apparatus very close to the substrate, the temperature of the exposure unit can thermally affect the substrate. By controlling the temperature of the exposure unit, for example, using a cooling configuration, the negative effect of the temperature of the exposure unit on the substrate can be substantially prevented.

Further considering that for obtaining this method or process in the most economical way, any such modality should in addition be maintained with minimal effort. On the one hand, in an economical exposure apparatus or method, the operating temperature should not be at the level where in fact the entire periphery of the wafer carrier should be maintained at an elevated temperature of 29,8 ° C, as would be suggested in gallium Condition of use. The melting temperature of the phase change material used in the substrate holding device should be at a relatively low level.

On the other hand, the operating temperature should not be substantially higher than 18 ° C for the following reasons: When depending on which coolant should be lower, it is preferably only slightly lower than the operating temperature, at least during the exposure period. At the temperature maintained at the target, when further consideration is applied when integrated in the present invention, in this way, standard factory (Fab) coolants can be used in the process directly or only with moderate modulation. Considering that the manufacturer's coolant usually ranges from 12 ° C to 18 ° C, and the deviation should be minimal, the ambient temperature of the factory can usually be indoor temperature, that is, not more than 25 ° C, preferably not more than 22 ° C, which is equal to the second temperature The phase change material melting temperature will be defined according to one embodiment of the present invention, and therefore the selected material will be defined according to the target exposure process to have a factory coolant temperature above 18 ° C, preferably above 18,5 ℃, and the maximum indoor temperature below 25 ° C, preferably below the operating temperature of 22,5 ° C.

It should be noted that the operating temperature as referred to in this application is the temperature of the instrument used to expose the sample during operation.

In one embodiment, the cooling configuration and the temperature stabilization configuration are configured so that the difference between the first temperature and the second temperature does not exceed 4 ° C, and preferably does not exceed 2 ° C. This provides the sample with a generally thermally stable environment. By actively controlling the cooling configuration and by selecting the correct phase change material, the components of the exposure unit and the substrate holding device are configured to substantially maintain the first temperature and the second temperature, respectively, and therefore during the exposure of the sample Maintain this thermally stable environment.

In one embodiment, the first temperature is lower than the second temperature. Therefore, in use, the temperature of at least the components of the exposure unit is lower than the temperature of the substrate holding device and the temperature of the sample on the top of the holding device. This measure generally prevents any temperature rise of the sample by the components of the exposure unit, even when the components of the exposure unit for projecting electromagnetic radiation or particles onto the substrate are arranged in close proximity to the sample.

In a preferred embodiment, the first temperature is substantially equal to the second temperature. In one embodiment, the first temperature and the second temperature are substantially equal to an indoor temperature, and specifically equal to an indoor temperature in a manufacturing plant (Fab).

In one embodiment, the phase change material comprises a metal, an alloy, or a metal-based material. In a preferred embodiment, the phase change material comprises a eutectic metal alloy. Metal-based phase change materials provide high thermal conductivity in both solid and liquid phases, which ensures that even when a significant portion of the phase change material has been liquefied, the heat generated by the exposure of the sample is directed to the phase The change material is absorbed by the phase change material.

In an embodiment, the cooling arrangement includes a conduit for guiding a cooling fluid through the conduits, wherein the conduits are configured to be in thermal contact with the component. Therefore, a standard manufacturing (Fab) coolant such as cooling water can be used to cool at least the components of the exposure unit.

In one embodiment, the cooling configuration is configured such that the difference between the temperature of the cooling fluid and the second temperature does not exceed 4 ° C, and preferably does not exceed 2 ° C. In one embodiment, the cooling configuration includes a temperature control system configured to control the temperature of the cooling fluid relative to the temperature of the substrate holding device. In one embodiment, the apparatus includes a temperature sensor for measuring the temperature of the substrate holding device and / or the exposure unit, and specifically, a portion of the exposure unit adjacent to the substrate holding device. Tester. In one embodiment, the cooling arrangement includes a cooling device for cooling the cooling fluid to a temperature below the first temperature, and a heating device for heating the cooling fluid, wherein the heating device is upstream relative to the component Placed in the catheter. Specifically, a temperature sensor for measuring the temperature of the portion of the exposure unit facing the substrate holding device, a combined cooling device and heating device for precisely controlling the temperature of the cooling fluid, and The combination of a temperature control system with a signal from a temperature sensor to control the temperature of the cooling fluid allows the temperature of the exposure device to be controlled with high precision and the substrate holding device and the exposure unit, specifically the exposure unit facing the substrate holding device The temperature difference between the parts is adjusted to less than 4 ° C, preferably less than 2 ° C, and more preferably less than 1 ° C.

In one embodiment, the component includes a projection lens for projecting electromagnetic radiation or particles onto a sample. In an embodiment in which the cooling configuration includes conduits for directing cooling fluid through the conduits and wherein the conduits are configured to be in thermal contact with the component, the conduits are configured for delivering cooling through or around the projection lens fluid. In particular, in projection lenses for charged particles, the lens effect is established by the magnetic and / or electrostatic fields that need to be generated. In use, magnetic and / or electrostatic lenses also generate heat that can be removed using the cooling arrangement according to this embodiment.

In one embodiment, the component includes a modulation device for modulating electromagnetic radiation or particles. In an embodiment in which the cooling configuration includes a conduit for guiding cooling fluid through the conduit and wherein the conduit is configured to be in thermal contact with the component, the conduits are configured for delivery through or around the modulation device Cooling fluid. In use, the modulation device also generates heat that can be removed using the cooling arrangement according to this embodiment.

In one embodiment, the modulation device includes a beam extinguishing assembly including a beam deflector for deflecting a beam of electromagnetic radiation or particles and a beam terminator for blocking the beam of electromagnetic radiation or particles. Wherein the conduits are configured for conveying the cooling fluid through or around the beam terminator. When a beam of electromagnetic radiation or particles is directed to a beam terminator, the electromagnetic radiation or particles are largely absorbed by the beam terminator. In use, the absorption of electromagnetic radiation by the particles also generates heat in the beam terminator that can be removed using the cooling arrangement according to this embodiment.

In one embodiment, the source is a source for charged particles, and the exposure unit includes a charged particle optical system for projecting one or more charged particle beams onto the sample. In one embodiment, the source is configured to provide a plurality of charged particle beams, and wherein the charged particle optical system is configured to project one or more of the plurality of charged particle beams onto the sample, Wherein at least a first portion of the conduits is disposed in a region between two charged particle beams.

In an embodiment, the exposure unit includes one or more temperature sensors, preferably one of the one or more temperature sensors is disposed at a side of the exposure unit facing the substrate holding device. .

According to a ninth aspect, the present invention provides a method for processing or imaging a sample using the apparatus or embodiments as described above, wherein the temperature-stable configuration tuning is performed before the processing or imaging of the sample, wherein The tuning comprises the steps of: curing at least a portion of the temperature-stable phase change material. When the phase change material absorbs heat, a portion of the phase change material liquefies or melts; the phase of the phase change material changes from a solid to a liquid. This absorbed heat can be removed from the phase change material during the tunable process in which the heat exchange material is cured or solidified; the phase of the phase change material is changed from a liquid back to a solid. After this tuning, the solid phase change material can be used again to absorb heat.

In an embodiment, the tuning further includes the following steps: before the processing or imaging of the sample, the temperature at which the temperature is stably configured is set at the second temperature. The second temperature is the melting temperature of the phase change material, so the phase of the phase change material changes from a solid to a liquid. When both the solid and liquid phases of the phase change material are present and in thermal equilibrium, the phase change material will be at this second temperature. Therefore, in order to ensure that at least a small amount of the phase change material is in the liquid phase and most of the phase change material is in the solid phase, the temperature is stably configured at the second temperature, and is ready to absorb any heat induced by the exposure process.

In an embodiment, the heating device and / or the cooling device are controlled to establish a temperature difference between the substrate holding device and the exposure unit, specifically the portion of the exposure facing the substrate holding device, the temperature difference being less than 4 ° C, preferably less than 2 ° C, and more preferably less than 1 ° C.

In one embodiment, the temperature of the instrument during operation is in a temperature range from 19 ° C to 22 ° C, preferably the first temperature and the second temperature are also configured in a temperature range from 19 ° C to 22 ° C.

According to a tenth aspect, the invention provides the use of an apparatus or embodiment as described above for processing or imaging a sample.

According to an eleventh aspect, the invention provides a method for manufacturing a semiconductor device by means of an apparatus as described above, the method comprising the steps of:-placing a wafer on the substrate holding device and placing the wafer Positioned downstream of the exposure unit;-processing the wafer, including projecting an image or pattern on the wafer by means of the electromagnetic radiation or particles with energy from the source; and-performing subsequent steps to assist by the The processed wafer produces a semiconductor device.

According to a twelfth aspect, the present invention provides a method for inspecting a target by means of an apparatus as described above, the method comprising the steps of:-placing the target on the substrate holding device and the wafer Positioned downstream of the exposure unit;-projecting the electromagnetic radiation or particles with energy from the source onto the target;-when the electromagnetic radiation or particles with energy from the source are incident on the target Detecting electromagnetic radiation or charged particles transmitted, emitted and / or reflected by the target; and-performing subsequent steps to check the target with the information from the step of detecting charged particles.

The embodiments mentioned above with respect to the first aspect can also be suitably applied to the present invention according to other aspects.

Wherever possible, the various aspects and features described and illustrated in the specification can be applied individually. These individual aspects, particularly the aspects and features described in the attached dependent claims, can be made the subject of separate patent applications.

The present invention will be explained based on an exemplary embodiment shown in the accompanying drawings, in which: FIG. 1 is a schematic plan view of a substrate holding device; FIG. 2 is a schematic partial horizontal view taken along line AA in FIG. 3A, 3B, and 3C schematically show the steps of a method for manufacturing a substrate holding device; FIGS. 4A and 4B are a second exemplary embodiment and a third exemplary embodiment of a substrate holding device FIG. 5 is a schematic partial cross-section of a fourth exemplary embodiment of a substrate holding device; FIG. 6 is a schematic partial plan view of a base plate of the substrate holding device of FIG. 5; FIG. 7 is A schematic partial cross-section of a fifth exemplary embodiment of a substrate holding device; FIG. 8 is a schematic partial cross-section of a sixth exemplary embodiment of a substrate holding device; FIG. 9A, FIG. 9B, and FIG. 9C schematically Shows steps for an alternative method for manufacturing a substrate holding device according to a sixth embodiment as shown in FIG. 8; FIG. 10 is a schematic partial cross-section of a seventh exemplary embodiment of a substrate holding device; 11 Schematic presentation of FIG. 12 schematically shows, for example, a cross-section of an embodiment of a projection lens system assembly for use in the instrument as shown schematically in FIG. 11; Fig. 13 schematically shows a cooling device for use in the projection lens system as shown schematically in Fig. 12; Fig. 14 schematically shows a part of an instrument comprising a projection lens system comprising a cooling arrangement And a substrate holding device including a temperature stable configuration, FIG. 15 illustrates an exemplary process for manufacturing a semiconductor device, and FIG. 16 illustrates an exemplary process for inspecting a target.

FIG. 1 shows a top view of a first example of a substrate holding device according to the present invention, and FIG. 2 shows a partial cross-section of the first example along a line A-A in FIG. 1. The substrate holding device 1 includes a holding plate 2 having a first side 3 for holding a substrate (not shown). The substrate holding device 1 further includes a base plate 4 disposed at a distance from the holding plate 2 and at a second side 6 of the holding plate 2 facing away from the first side 3. A gap 5 is provided between the base plate 4 and the clamping plate 2, the gap extending in a direction substantially parallel to the first side 3 of the clamping plate 2. An array of support members 7 is arranged between the clamping plate 2 and the base plate 4. The support members define the distance between the clamping plate 2 and the base plate 4, and thus define the width w of the gap 5. The holding plate 2, the base plate 4 and the support 7 provide a frame for providing a heat absorbing material in the gap 5, which heat absorbing material is configured in use for self-configuration on the first side of the substrate holding device 1 The substrate on 3 removes heat.

The holding plate 2 includes, for example, a Si plate. The base plate 4 includes, for example, a silicon carbide plate having an expansion coefficient substantially the same as that of silicon. In addition, silicon carbide is substantially inert and allows the use of a wide range of heat absorbing materials. In addition, silicon carbide has a high thermal conductivity that allows the substrate holding device 1 to be cooled via the base plate 4 and provides a substantially constant temperature along the base plate 4.

The support 7 comprises, for example, titanium supports, which are non-magnetic. When the substrate holding device 1 is used in a charged particle processing or imaging instrument, a non-magnetic support is advantageous. Although the support 7 can be clamped between the holding plate 2 and the base plate 4, it is preferred that the support 7 is fixedly attached to the second side 6 of the holding plate 2 and / or to the base plate 4. As will be explained in more detail below with reference to FIGS. 2, 3A, 3B and 3C.

According to the present invention, an array of droplets 8 of a heat absorbing material is disposed between the holding plate 2 and the base plate 4. The liquid and / or solid droplets 8 are configured to bridge the gap 5 between the substrate plate 4 and the clamping plate 2; therefore, the droplets 8 are configured to contact both the substrate plate 4 and the clamping plate 2. The droplets 8 are configured to be spaced apart from each other, configured to be adjacent to each other in a direction along the gap 5, and configured to be spaced apart substantially from the support 7. The droplet 8 is bounded by the holding plate 2 and the base plate 4 in a direction substantially perpendicular to the first side 3 of the holding plate 2. In addition, the droplets 8 are configured to enable expansion of the droplets 8 in a direction along the gap 5 between the base plate 4 and the clamping plate 2. As shown schematically in FIG. 2, the droplets 8 are arranged in contact with the holding plate 2 and the base plate 4 (thermally). Preferably, the droplet 8 contains a melting temperature or melting range having a temperature at or near the substrate processing instrument at least during the processing of the substrate, or at a temperature at or near the substrate imaging instrument at least at the temperature during the imaging of the substrate. material. Thermal removal is provided by using phase transitions of droplets 8, especially melting. Because the droplets 8 are configured to enable expansion of the droplets 8 in the direction along the gap 5, the shrinkage or expansion of the droplets 8 when they change from a solid to a liquid, and vice versa, generally include the holding plate 2, the The size of the components of the base plate 4 and the support 7 has no effect.

The heat absorbing material is preferably arranged in an array of flat droplets 8 having a diameter of approximately 15 mm and a thickness of approximately 0.8 mm. The use of droplets 8 having a diameter of approximately 15 mm allows an array of supports 7 to be provided between the droplets, the supports 7 being configured close enough to each other to provide a first, highly flat, clamping plate 2 Side 3. In this particular example, the support 7 is configured so as to provide a gap 5 having a width w of approximately 0,8 mm.

In this first example, the base plate 4 is provided with an array of pocket portions 9 which are configured as shallow indentations or cavities in the surface of the base plate 4 facing the gap 5. The bag portion 9 of this first example is substantially shaped as a conical hammer table. For example, the descending slope 91 of the cone may be approximately 15 degrees, and at the center of the bag portion 9, a substantially flat area is configured. The droplets 8 are configured to contact both the base plate 4 and the holding plate 2. The conical edge 91 of the bag portion 9 will substantially fix the position of the droplet 8 of the heat absorbing material. In addition, the surface tension in the liquid phase of the conical edge 91 of the bag portion 9 and the droplet 8 provides a positioning force to substantially hold the liquid droplet 8 in the bag portion 9. No other part is needed to fix the position of the droplet 8. This allows the droplets 8 in the substrate holding device 1 of this first example to be arranged closer to each other, which provides suitable coverage of the areas of the base plate 4 and the holding plate 2 with a heat absorbing material. Due to the substantially flat area in the center of the bag portion 9, the bag portion 9 in the substrate holding device 1 of the first example is shallow, which reduces the amount of heat absorbing material required.

As shown in FIG. 2, the base plate 4 is provided with an array of holes 41, and the first end of each of the support members 7 in the series of support members is arranged in one of the holes 41 and fixed to the hole 41 through an adhesive connection. in. The second end of each support 7 opposite to the first end is fixed to the clamping plate 2 by means of an adhesive connection.

3A, 3B, and 3C schematically illustrate steps for assembling a substrate holding device 1, and particularly for assembling a substrate holding device according to the embodiment of FIG. And the substrate holding device according to the embodiment described below with reference to FIGS. 4A, 4B, 5, 7, and 10 can be assembled in this manner.

First, as shown in FIG. 3A, a base plate 4 is provided, which includes an array bag portion 9. Adjacent to these pockets 9, holes 41 are provided for mounting the support 7 in these holes. In addition, the clamping plate 2 is provided with a series of support members 7 which are fixed to the second side 6 of the clamping plate 2 facing away from the first side 3 for clamping the substrate at least in use. The support member 7 is configured to extend substantially perpendicular to the second side 6 and is fixed to the second side 6 via an adhesive connection 71.

Subsequently, the droplets 8 of the liquid heat-absorbing material are arranged in the bag portion 9, as shown schematically in FIG. 3B. In each bag portion 9 of substantially the same size, a heat absorption material of substantially the same volume is dispensed. Preferably, the heat absorbing material exhibits a greater cohesive force than the adhesion with the surface of the holding plate 2 and / or the base plate 4 facing the gap 5. Due to the surface tension, the liquid droplets 8 have a nearly spherical shape.

Next, the clamping plate 2 with the support 7 is moved toward the base plate 4, and the support 7 is positioned in the hole 41. The clamp plate 2 is moved downward until the desired distance w between the clamp plate 2 and the base plate 4 has been reached. In this position, the droplets 8 are made flat between the base plate 4 and the holding plate 2 as shown in FIG. 3C. The surface tension of the heat absorbing material provides and maintains the droplets 8 in contact with both the clamping plate 2 and the base plate 4.

Subsequently, one or more of the support members 7 are fixed in the corresponding holes 41 via a glue connection provided in a circumferential gap between the hole 41 and the support member 7 extending into the hole 41.

Prior to use, the assembled substrate holding device 1 is configured in a "cold" environment at a temperature below the solidification temperature of the heat absorbing phase change material, and the liquid droplets 8 will be substantially as shown in Fig. 3C Shape solidification. Therefore, the solid droplets 8 bridge the gap 5 between the base plate 4 and the holding plate 2. The substrate holding device 1 is now ready for use.

In the previous first example, the bag portion 9 for holding the solid and / or liquid droplets 8 is arranged in the base plate 4 as described above. However, in the second example of the substrate holding device 1 ', the pocket portion 9' is disposed in the holding plate 2 'and is combined with a base plate 4' having a substantially flat surface facing the gap 5 ', as shown in Fig. 4A Shown schematically.

Alternatively, in the third example of the substrate holding device 1 ", both surfaces of the base plate 4" and the holding plate 2 "facing the gap 5" are provided with pocket portions 92, 93, as schematically shown in Fig. 4B As shown. In this embodiment, compared with the bag portions 9, 9 'of the substrate holding devices 1, 1' according to the first and second examples, the facing gap 5 "of the base plate 4" and the holding plate 2 " The indentations or cavities in the surface forming the pockets 92, 93 may be shallower and not too deep.

FIG. 5 is a schematic partial cross-section of a fourth exemplary embodiment of the substrate holding device 11. FIG. 6 is a schematic partial plan view of the base plate 14 of the substrate holding device of FIG. 5. In this fourth example, the base plate 14 is provided with an array of bag portions 19 that are generally shaped as a cone. For example, the descending slope of the cone may be approximately 15 degrees. The droplets 18 are arranged in the bag portions 19 and are configured to bridge the gap between the base plate 14 and the clamping plate 12. The conical shape of the pocket portion 19 will substantially fix the position of the liquid and / or solid droplets 18 of the heat absorbing material. In addition, the conical shape of the bag portion 19 and the surface tension of the heat-absorbing material in the liquid phase provide a force to substantially hold the liquid droplet 18 in the center of the bag portion 19. No other part is needed to fix the position of the droplet 18.

In addition, in this fourth example, the base plate 14 is provided with an array of holes 141, and each of the support members 17 in a series of support members is arranged on one side of one of the holes 141 and fixed to the hole via an adhesive connection 141. The other side of the support 17 is fixed to the clamping plate 12.

In addition, the base plate 14 may be provided with exhaust holes 142 that flow out substantially at the center of the bag portion 19. The vent hole 142 is configured to prevent air from being included below the droplet 18.

FIG. 7 is a schematic partial cross-section of a fifth exemplary embodiment of the substrate holding device 21. In this fifth example, the base plate 24 is provided with an array of pockets 29 that are generally shaped as straight cylinders with a generally circular bottom region. The droplet 28 is arranged in the bag portion 29 and contacts both the circular bottom region of the bag portion 29 in the base plate 24 and the holding plate 22. To allow the droplets 28 to expand at least in the direction along the gap 25, the volume of the droplets 28 is configured such that the diameter of the droplets 28 in a direction parallel to the bottom region of the bag portion 29 is smaller than the diameter of the cylindrical bag portion 29. The cylindrical bag portion 29 will generally establish the position of droplets 28 of the heat absorbing material in the solid and in the liquid phase. No other part is needed to substantially fix the position of the droplet 28. The advantage of this example is that the configured surface of the bagless portion 29 of the base plate 24 can be configured to be close to the clamping plate 22. Therefore, the clamping plate 22 can be connected to the base plate 24 with an extremely short support member 27, or even without a support member at all, which will result in a highly rigid substrate clamping device 21.

In a sixth example of the substrate holding means 31, shown schematically in FIG. 8, the droplets 38 arranged inside the O-ring 39, the O ring is made of Viton ^®, such as for example a flexible or resilient material such as rubber . Each of the droplets 38 is disposed inside an O-ring 39 that provides lateral containment of the droplets 38 and allows the droplets 38 to run along the edges due to the flexible or elastic material of the O-ring 39 Shrinkage and expansion in the direction of the gap 35.

Preferably, the thickness of the O-ring 39 is smaller than the width w 'of the gap 35 between the clamping plate 32 and the base plate 34. This allows the substrate holding device 31 including the holding plate 32, the base plate 34, and the support 37 to be assembled and obtain a gap 35 having a desired width w 'without interference from the O-ring 39. It is avoided that the O-ring 39 contacts both the clamping plate 32 and the base plate 34 or is compressed between the clamping plate 32 and the base plate 34 because this can have a negative effect on the flatness of the first side 33 of the clamping plate 32.

As indicated in FIG. 8, the gap 35 is substantially opened at the peripheral side edge 310 of the substrate holding device 31. The gap 35 may even be substantially open along substantially the entire peripheral side edge 310 of the substrate holding device 31. Therefore, the gap 35 includes an open connection to the outside of the substrate holding device 31. The air pressure or vacuum pressure inside the gap 35 is substantially equal to the air pressure or vacuum pressure outside the substrate holding device 31.

The steps of a method for constructing a substrate holding device 31 ′ according to the embodiment of FIG. 8 are schematically shown in FIGS. 9A, 9B and 9C, with a support 37 ′ arranged on a base plate 34 ′ in this example. This difference in one of the array holes 341 '.

First, a base plate 34 'including an array of holes 341' is provided. A series of supports 37 'are provided, and each support 37' in the series of supports is disposed in one of the holes 341 'and is preferably fixed in the hole 341' via an adhesive connection.

Subsequently, the assembly of an O-ring 39 'having a solid pellet or droplet 38' with a heat absorbing material inside is arranged between the supports 37 ', as shown schematically in Fig. 9A. It should be noted that the thickness d of the assemblies 38 ', 39' is smaller than the height h of the supporting member 37 'protruding from the base plate 34'.

Next, the clamping plate 32 'is disposed on the top of the support members 37', and is preferably fixed to the support members 37 'via an adhesive connection. As schematically indicated in FIG. 9B, the clamping plate 32 'is disposed on the top of the support 37' with a gap above the assembly of the O-ring 39 'and the solid droplet 38' of the heat absorbing material.

Subsequently, the solid droplets 38 'of the heat absorbing material are melted, for example, by placing the assembly in a furnace at a temperature above the melting temperature. Due to the surface tension in the liquid droplets 38 'of the heat absorbing material, the liquid droplets 38' will have a more spherical shape, as indicated schematically in Fig. 9C, and contact the second side 36 'of the clamping plate 32'. The droplet 38 'is now configured to bridge the gap 35 between the base plate 34' and the clamping plate 32 '.

Next, the assembled substrate holding device 31 'is placed in a "cold" environment at a temperature below the solidification temperature of the heat absorbing material, and the liquid droplets 38' will solidify substantially in the shape as shown in Fig. 9C. . Therefore, the solid droplet 38 'fills the gap 35' and contacts both the base plate 34 'and the holding plate 32'. The substrate holding device 31 'is now ready for use.

FIG. 10 is a schematic partial cross-section of a seventh exemplary embodiment of the substrate holding device 51. In this seventh example, the base plate 54 is provided with an array of pockets 59 that are generally shaped as straight cylinders having a generally circular bottom surface 591. The pocket portion 59 includes a first or upper pocket portion 592 having a first diameter, and a second or lower pocket portion 593 having a second diameter smaller than the first diameter. The second pocket portion 593 is disposed substantially centrally in the first pocket portion 592. This results in a rim or step 61 disposed inside the bag portion 59, the rim or step extending along the peripheral side wall of the bag portion 59.

Each of the bag portions 59 in the array bag portion includes an elastic member, particularly an elastic cover plate 60, which spans the bag portion 59 and is configured to be spaced apart from a bottom surface 591 of the bag portion 59. The elastic cover plate 60 has a diameter smaller than the first diameter but larger than the second diameter. Therefore, the peripheral edge of the elastic cover plate 60 rests on the top of the rim or step 61. The elastic cover plate 60 provides a means for occupying any residual expansion in a direction substantially perpendicular to the gap 55 by bending or flexing at least a central portion of the cover plate 60 toward the bottom surface 591 of the bag portion 59. Preferably, the elastic covering plate 60 is a titanium plate.

Each pocket portion 59 includes a droplet 58 from the array of droplets, and the droplet 58 is disposed between the elastic cover plate 60 and the second side 56 of the clamping plate 52. The droplets 58 of the PCM are disposed substantially centrally on the top of the elastic cover plate 60.

As shown schematically in FIG. 10, the cover plate 60 is disposed inside the corresponding bag portion 59 and below the surface 63 of the base plate 54 surrounding the bag portion. This provides for fixing between the base plate 54 and the clamping plate 52. The position of the droplet 58 in the gap 55. In order to increase the heat transport between the elastic clamping plate 60 and the base plate 54, the heat conductive paste is preferably disposed between the peripheral edge of the elastic clamping plate 60 and the rim or step 61.

In addition, each pocket portion 59 includes a ring or loop 62 configured to surround the droplets 58 in the pocket portion 59. Preferably, the ring is made of Viton ^®, such as synthetic material or rubber material. A ring or loop 62 is disposed in the bag portion 59, preferably on the top of the elastic cover 60, and serves as a restricting member for the droplet 58 of the PCM in the bag portion 59. The thickness of the ring or ring 62 is smaller than the distance between the clamping plate 52 and the elastic covering plate 60. Therefore, the ring or ring 62 is not in direct contact with both the cover plate 60 and the clamping plate 52. The ring or loop 62 includes a generally rectangular cross-section in a direction that is generally perpendicular to the first side 53 of the clamping plate 52. A substantially flat upper surface of the ring or loop 62 is configured to face the second side 56 of the clamping plate 52. When using a PCM with a high density, such as a metal-like material with a gallium-like behavior, the ring or ring 62 is pushed upward by the PCM, which will push the ring or ring 62 toward the second side 56 of the clamping plate 52. The flat upper surface of the ring or ring 62 is pushed against the second side 56 of the clamping plate 52 and a seal is provided for receiving the PCM inside the ring or ring 62.

In the example shown in FIG. 10, the base plate 54 is provided with exhaust holes 542 which are in the bottom surface 591 of the pocket portions 59 and preferably flow out in the center of the pocket portions 59. Due to the vent hole 591, the pressure inside the portion 593 under the bag portion 59 between the bottom surface 591 and the elastic cover plate 60 is substantially equal to the pressure surrounding the substrate holding device 51.

In addition, in this seventh example, the base plate 54 is provided with an array hole 541, and the clamping plate 52 is provided with an array support 57. Each support member 57 is disposed in a corresponding one of the holes 541 and is fixed in the hole 541 via an adhesive connection.

It should be noted that the examples presented above all describe substrate holding devices suitable for holding an array of droplets of one of heat-absorbing materials, preferably phase change materials (PCM), and more preferably metal-like PCMs according to the present invention. Examples of such materials are presented in the following table:     

FIG. 11 shows a simplified diagram of an instrument used to process or image the sample 130. The apparatus comprises: a module 201 comprising a source for electromagnetic radiation or particles having energy; a module 204 comprising exposing the sample 130 to the electromagnetic radiation or particles having energy; and according to the invention The substrate holding device 209.

In particular, FIG. 11 schematically illustrates a multi-beam charged particle lithography system, which includes:-an illumination optical module 201 including a charged particle beam source 101 and a beam collimation system 102,-an aperture array, and a condenser lens Module 202, which includes an aperture array 103 and a condenser lens array 104, a beam conversion module 203, which includes a beam quenching device array 105, and a projection optical module 204, which includes a beam terminator array 108, a beam deflector An array 109, and a projection lens array 110.

In the example shown in FIG. 11, the modules are arranged in the inner sub-frame 205 and the outer sub-frame 206. The frame 208 supports the alignment sub frames 205 and 206 via a vibration damping frame 207.

The modules 201, 202, 203, and 204 together form charged particles for generating a plurality of charged particle beams, modulating the charged particle beams, and guiding the charged particle beams toward the first side 209 'of the substrate holding device 209. Optical unit.

The substrate holding device 209 is disposed on the top of the chuck 210. On the first side 209 'of the substrate holding device 209, a target such as a wafer 130 may be disposed.

The substrate holding device 209 and the chuck 210 are disposed on a short-stroke stage 211 configured to drive the chuck 210 in a small distance along all six degrees of freedom. A short-stroke stage 211 is mounted on top of the long-stroke stage 212 configured to drive the short-stroke stage 211 in two orthogonal directions (X and Y) in at least a substantially horizontal plane. And chuck 210.

The lithography apparatus 200 is disposed inside a vacuum chamber 230 that includes one or more Armor iron (μmetal) shielding layers 215. The shield 215 is configured as a liner of the vacuum chamber 230 in a convenient manner. The machine rests on a base plate 220 supported by a frame member 221.

The positions of the wafer 130 and the substrate holding device 209 relative to the charged particle optical units 201, 202, 203, and 204 are measured by a measuring device 250, which is attached to the alignment sub-frame 205, which is a measuring device 250 The position of the monitoring chuck 210 relative to the measuring device 250. The measurement device 250 includes, for example, an interferometer system, and the chuck 210 is then provided with a mirror 251 for reflecting a light beam 252 from the interferometer system.

FIG. 12 shows a cross-sectional view of an embodiment of an improved projection lens assembly 300 used, for example, in the projection optical module 204 of the multi-beam charged particle lithography system of FIG. 11. The projection lens assembly 300 includes a housing having an electrically conductive circumferential wall 330, preferably made of metal. The projection lens assembly 300 further includes a cover member 310 and a support member 340 at a downstream end of the housing. The channel for the charged particle beam extends from the through opening 313 in the cover element 310, through the interior of the projection lens assembly toward the first electrode 301, through the support element 340, and finally flows out in the second electrode 302. A large number of charged particle beams can pass through the through opening before impinging on the target 370 disposed on the top of the substrate holding device. The substrate holding device is preferably, but not necessarily, a substrate holder as described in Examples 1 to 6 above.持 装置 1。 Holding device 1. In the embodiment shown, the support element 340 extends substantially parallel to both the first electrode 301 and the second electrode 302. Preferably, the support element 340 extends radially away from the lens hole array in the first electrode 301 and the second electrode 302.

To avoid the formation of an electric field between the target 370 and the projection lens assembly 300, the two can be grounded and / or connected to each other in a conductive manner. The structurally robust projection lens assembly according to the present invention can be placed entirely in a known lithography system, or it can be swapped out or removed for maintenance purposes.

A large number of charged particle beams first pass through the through channels 313 in the cover element 310. Once the charged particle beam has passed through the through-opening 313, it reaches the beam terminator array 308. The beam terminator array 308 is configured to block the charged particle beam that has been deflected by the beam quenching device array 105 of the beam conversion module 203. The charged particle beam deflected by the beam extinguishing device array 105 (see, for example, FIG. 11) is blocked by the beam terminator array 308 and does not reach the target 370. Therefore, the charged particle beam can be individually modulated by the beam extinguishing device array to allow the individually charged particle beam to impinge on the target 370 or not. The beam not deflected by the extinguishing device array travels through the beam terminator array 308 and is projected onto the surface of the target 370 by electrostatic lenses provided by the first electrode 301 and the second electrode 302. Using this modulation and relative movement of the target 370 relative to the exposure unit containing the projection lens assembly 300 allows a pattern to be written on the surface of the target 370.

In some projection lens systems, a deflector unit is disposed between the beam terminator array 308 and the first electrode 301 and the second electrode 302, and the deflector unit is configured to provide a beam terminator array on the surface of the sample 307 Scanning deflection of beam 308. Preferably, the deflector unit includes an X deflector and a Y deflector to deflect the beam in an orthogonal direction perpendicular to the optical axis OA of the projection lens system 300.

As indicated above, the beam terminator array 308 is a component for at least partially and / or temporarily blocking at least a portion of the charged particles in a large number of charged particle beams. To remove the heat generated by the blocking of the charged particle beam, the beam terminator array 308 assembly is provided with a duct 309. In use, the cooling fluid is directed via a conduit 309, wherein the conduit 309 is configured to be in thermal contact with the beam terminator array 308. At least a first portion 307 of the catheter is arranged in the area between the two charged particle beams, as indicated schematically in FIG. 13. The central axis of the first portion 307 of the catheter extends in a direction generally perpendicular to the central axis or optical axis OA of the projection lens system 300.

As indicated in FIGS. 12 and 13, at least a second portion 306 of the catheter is configured to extend such that the central axis of the second portion 306 of the catheter is substantially parallel to the central axis or optical axis OA of the projection lens system 300. Direction. Therefore, the first portion 307 of the catheter may be configured at or near the first end 303 of the projection lens system 300, which is configured to be close to the substrate 370 in use. The second portion of the catheter provides an extension of the catheter away from the first end 303 of the projection lens system 300, which allows providing an input connection 304 and / or an output connection 305 for a fluid suitably spaced from the first end 303, and The first end 303 of the projection lens system 300 is disposed in close proximity to the substrate 370.

It should be noted that the cooling unit as shown in FIG. 13 can also be used to cool active components, such as, but not limited to, electrostatic deflectors or lenses, for at least partially or temporarily manipulating a charged particle beam to move by disposing in such Heat from electronic components on or in active components. Active components such as the first electrode 301 and the second electrode 302 may be disposed between the catheters 307.

14 shows a cross-sectional view showing an embodiment of an assembly including an exposure unit for exposing a sample 470 and a substrate holding device 480 for holding the sample 470 at least during the exposure. The assembly shown in FIG. 14 is suitable for use in the projection optical module 204 of the multi-beam charged particle lithography system of FIG. 11, for example.

The exposure unit includes a projection lens assembly 400 including a housing having an electrically conductive circumferential wall 430, preferably made of metal. As shown in the projection lens assembly 300 in FIG. 12, the projection lens assembly 400 includes a cover element 410, a through opening 413 in the cover element 410, a beam terminator array 408, a support element 440, a first electrode 401, and a second electrode 402.

In addition, the projection lens assembly 400 includes components for at least partially and / or temporarily manipulating and / or blocking at least a portion of a charged particle beam. One such component is a beam terminator array 408 configured to block a charged particle beam that has been deflected by the beam quenching device array 105 of the beam conversion module 203 shown in FIG. 11. The beam terminator array 408 includes a cooling configuration configured to maintain the beam terminator array 408 substantially at a predetermined first temperature. In the example shown in FIG. 14, the cooling arrangement also cools other parts of the projection lens assembly, and in use, substantially the entire projection lens assembly is at the first temperature. The projection lens assembly includes a first temperature sensor T1, which is disposed at, for example, the support member 440. The first temperature sensor T1 is configured to measure the projection lens assembly. The temperature of the portion of the projection lens assembly facing the substrate holding device 480.

The cooling arrangement includes a substantially closed circuit for a cooling fluid, especially a cooling liquid, such as a conduit or pipe of high purity water. The cooling arrangement further comprises a cooling device 450 for cooling the cooling fluid to a temperature below the first temperature. The cooling device 450 includes a heat exchange circuit 451 that is coupled to a factory coolant circuit.

Downstream of the cooling device 450, a heating device 470 is arranged in a closed circuit. The heating device 470 is configured for heating a cooling liquid. The combination of the cooling device 450 and the heating device 470 provides a means for precisely controlling the temperature of the cooling fluid. The heating device is disposed in a duct at an upstream position with respect to the projection lens assembly 400.

As indicated above, the beam terminator array 408 is a component for at least partially and / or temporarily blocking at least a portion of the charged particles in a large number of charged particle beams. In order to remove the heat generated by the blocking of the charged particle beam, the beam terminator array 408 assembly is provided with a duct 409 which is a part configured for cooling. In use, the cooling fluid from the cooling device 450 and from the heating device 470 are configured to flow toward the tube 409 via the tube 406, wherein the tube 409 is configured to be in thermal contact with the beam terminator array 408. The cooling fluid then flows back to the cooling device 450 via the conduits 406 ', 405. As indicated in FIG. 14, the catheter 409 is disposed inside the projection lens system 400 at or near the first end 403 of the projection lens system 400, which is configured to be close to the substrate 470 in use.

In addition, the closed loop includes one or more temperature sensors for measuring the temperature of the cooling fluid in the conduits 404, 406, 409, 406 ', 405. In the specific example shown in FIG. 14: the second temperature sensor T2 is disposed in the duct between the cooling device 450 and the heating device 470; the third temperature sensor T3 is disposed in the heating device 470 and the beam terminator array 408; and the fourth temperature sensor T4 is disposed in a conduit downstream of the beam terminator array 408.

The temperature sensors T1, T2, T3, and T4 provide inputs for a temperature control system 490 configured to control the flow of cooling liquid through the manufacturing plant's heat exchange circuit 451 in the cooling device 450 and / or The heating of the cooling fluid by the heating device 470 is controlled. The temperature control system 490 is configured to control the heating device 470 and / or the cooling device 450 so that the substrate holding device 480 and the projection lens system 400, especially the first end 403 of the projection lens system 400 facing the substrate holding device 480 A temperature difference is established between, and the temperature difference is preferably in a range of 1 ° C to 1,5 ° C.

The sample 470 is configured on top of a substrate holding device 480 for holding the sample 470 at least during exposure. The substrate holding device 480 includes a holding plate 481, wherein the holding plate includes a first side for holding the substrate 470, and a base plate 482. Between the clamp plate 481 and the base plate 482, a temperature-stable arrangement including a phase change material 483 is provided, which has a phase change at a second temperature. The substrate holding device 480 is preferably, but not necessarily, a substrate holding device as described in Examples 1 to 6 above.

In the example shown in FIG. 14, each of the substrate holding device 480 and the projection lens system 400 is provided with a configuration for controlling the temperature thereof. In particular, because the projection lens system 400 is configured to expose the sample 470 using a charged particle beam with energy, the projection lens system 400, and especially the beam terminator array 408 and / or the sample 470, will absorb at least a portion of the energy. By providing both the projection lens system 400 and the substrate holding device 480 with their own cooling configuration and temperature stable configuration, accurate temperature control of the substrate 470 can be obtained. This temperature control allows better use of readily available factory cooling The agent maintains at least substantially the temperature of the projection lens system 400, especially the beam terminator array 408 of the projection lens system, at a first temperature, and the temperature of the substrate 470 using a phase change material having a phase change at a second temperature. Maintained at the second temperature.

It should be noted that the schematic diagrams 12 and 14 are not drawn to scale, especially for charged particle beam exposure systems using low-kV charged particles. The low-kV charged particles have, for example, an energy generally below 10 keV, preferably about 5 keV. Of charged particles. In such a charged particle beam exposure system using low kiloelectron volt charged particles, the distance s between the first end 403 of the projection lens system 400 and the top surface of the substrate 470 is extremely small. The distance s is preferably smaller than the thickness d2 of the sample 470. In the case where the sample 470 is a silicon wafer, the thickness d2 is usually 330 micrometers. Preferably, the distance s is smaller than the thickness d1 of the second electrode 402, which defines the first end 403 of the projection lens system 400. In particular, the distance s is less than 100 microns, preferably 50 microns.

As shown in the examples of FIGS. 12 and 14, the substrate holding device 480 and the exposure unit, in particular, the projection lens system 400 of the exposure unit are both provided with a configuration for controlling the temperature thereof. In addition, as schematically shown in FIG. 14, the temperature of the cooling arrangement of the exposure unit is controlled based on the temperature of the temperature at which the substrate holding device 480 is stably arranged. Therefore, the cooling configuration includes a control device 490 that is configured to adjust the first temperature, especially the temperature measured by the first temperature sensor T1, to a second temperature that exhibits a phase change at the phase change material 483 Nearby or equal to the second temperature.

Preferably, the cooling configuration and the temperature stabilization configuration are configured such that the second temperature is at or near the first temperature at least during the exposure of the substrate by the charged particle beams.

FIG. 15 shows a schematic flowchart 150 of an example of a method for manufacturing a semiconductor device by means of an apparatus as described above. The method includes the following steps: 151: placing a wafer on a substrate holding device and positioning the wafer downstream of the exposure unit; 152: processing the wafer, including by means of electromagnetic radiation with energy from the source Or particles project an image or pattern onto the wafer; and 153: perform subsequent steps to generate a semiconductor device by means of the processed wafer.

FIG. 16 shows a schematic flowchart 160 of an example of a method for inspecting a target by means of an instrument as described above, which method comprises the following steps: 161: placing the target on a substrate holding device and placing the wafer Positioned downstream of the exposure unit; 162: Project the electromagnetic radiation or particles with energy from the source onto the target; 163: The electromagnetic radiation or particles with energy from the source incident on the target Real-time detection of electromagnetic radiation or charged particles transmitted, emitted, and / or reflected by the target; and 164: performing subsequent steps to check the target with the data from the step of detecting charged particles.

It should be understood that the above description is included to illustrate the operation of the preferred embodiment and is not meant to limit the scope of the invention. From the above discussion, those skilled in the art will recognize many variations that will still be encompassed by the spirit and scope of the invention.

For example, although the shape and diameter of the pockets in the examples described above are substantially the same for all of the illustrated pockets, the base plate may also be provided with pockets having different sizes and / or different shapes. In particular, the pockets along the edges of the substrate holding device may be smaller than the pockets to obtain better coverage of the heat absorbing material along the edges of the substrate holding device.

In addition, a large amount of heat absorbing material can be used. As indicated, the heat absorbing material is preferably selected so as to have a melting temperature or melting range at or near the operating temperature of the substrate processing apparatus using a substrate holding device. Such heat absorbing materials are also known under the name of phase change materials or PCM for short.

In summary, the present invention relates to a substrate holding device, which includes a holding plate, a base plate, an array support, and an array droplet of a heat absorbing material. The holding plate includes a first side for holding the substrate. The base plate is disposed at a distance from the holding plate and provides a gap between the base plate and the holding plate at a side of the holding plate opposite to the first side. The array support is disposed between the holding plate and the base plate. The array of liquid and / or solid droplets are disposed between the holding plate and the base plate, and the droplets are configured to contact both the base plate and the holding plate. The droplets are configured to be spaced apart from each other and are configured to be adjacent to each other in a direction along the gap.

Additionally or alternatively, the invention relates to an apparatus and method for exposing a sample. The apparatus includes a source for electromagnetic radiation or particles having energy, an exposure unit for exposing the sample to the electromagnetic radiation or particles, and a substrate holding device for holding the sample at least during the exposure. The exposure unit includes components for manipulating and / or blocking at least part of electromagnetic radiation or charged particles. The wire includes a cooling configuration configured to maintain the component substantially at a predetermined first temperature. The substrate holding device includes a temperature stable configuration configured to substantially stabilize the temperature of a sample disposed on the substrate holding device. The temperature stable configuration includes a phase change material having a phase change at a second temperature, the second temperature being at or near the first temperature.

Claims (54)

    A substrate holding device includes: a holding plate, wherein the holding plate includes a first side for holding a substrate, and a base plate, which is arranged at a distance from the holding plate and at a distance from the holding plate. A gap between the base plate and the clamp plate is provided at a second side of the clamp plate facing away from the first side, and an array support member is disposed at least between the clamp plate and the base plate. And an array of droplets of a heat absorbing material, the droplets being disposed in the gap between the clamping plate and the base plate, wherein the droplets are configured to be spaced apart from the support and spaced from the array The other droplets in the droplets are spaced apart, and wherein the droplets are configured to contact both the base plate and the clamping plate.         The substrate holding device according to item 1 of the application, wherein the droplet is configured to enable the droplet to expand substantially freely in a direction along the gap.         The substrate holding device according to item 1 or 2 of the patent application scope, wherein the array support is fixedly attached to the second side of the holding plate.         The substrate holding device according to claim 1, 2, or 3, wherein the array support is fixedly attached to the base plate.         The substrate holding device according to item 4 of the scope of patent application, wherein the base plate is provided with an array of holes, and wherein each of the array support members at least partially extends into one of the array holes, preferably The support member is fixedly disposed in the hole by providing an adhesive connection in a circumferential gap between the hole and the support member extending into the hole.         The substrate holding device according to any one of the scope of the previous patent application, wherein the substrate holding device further comprises an array ring, the ring is disposed in the gap between the holding plate and the base plate, and wherein the array Each ring in the ring is configured to surround one of the array of droplets.         According to the substrate clamping device of claim 6, the thickness of one of the rings is smaller than the width of the gap between the clamping plate and the base plate.         The substrate holding device according to claim 6 or 7, wherein the ring is made of a flexible or elastic material.         The substrate holding device according to any one of the scope of the previously applied patents, wherein a surface of the base plate facing the gap and / or a surface of the holding plate facing the gap is provided with an array bag portion, wherein The width of the gap between the clamping plate and the base plate at one of the pocket portions of the array is greater than the width of the gap between the clamping plate and the base plate around the pocket portion, And each of the array bag portions is configured to hold one of the droplets of the array.         The substrate holding device according to item 9 of the application, wherein at least one of the array bag portions is substantially shaped as a cone, a conical hammer table, a truncated sphere, or a spherical hammer table.         The substrate holding device according to any one of claims 1 to 8, wherein a surface of the base plate facing the gap includes an array bag portion, and each of the array bag portions includes an elasticity. Component, the elastic member spanning the pocket portion and configured to be spaced apart from a bottom surface of one of the pocket portions, and each of the pocket portions includes a droplet from the array droplet, wherein the droplet is disposed on the elastic Between the component plate and the clamping plate.         The substrate holding device according to item 11 of the application, wherein the distance between the elastic member and the holding plate is greater than the distance between the holding plate and the surface of the base plate adjacent to the bag portion.         The substrate holding device according to claim 11 or 12, wherein the elastic member includes a cover, preferably a cover plate.         The substrate holding device according to claim 11, 12, or 13, wherein each bag portion includes at least a portion of an edge of the elastic member, and preferably a circumferential edge of the elastic cover is supported on the bag. A support element in the middle.         The substrate holding device according to item 14 of the application, wherein the supporting element includes a rim or a step, and the rim or the step is disposed in a circumferential side wall of the bag portion.         The substrate holding device according to any one of claims 11 to 15, wherein each bag portion includes a ring or a ring, and the ring or the ring is disposed between the holding plate and the elastic member. In a gap, and wherein the ring or loops are configured to enclose a droplet in the pocket.         According to the substrate clamping device of claim 16, the thickness of one of the rings or loops is smaller than the distance between the clamping plate and the elastic member.         The substrate holding device according to claim 16 or claim 17, wherein the ring or loop is made of a flexible or elastic material.         The substrate holding device according to claim 16, 17, or 18, wherein the ring or loop includes a substantially rectangular cross section.         The substrate holding device according to any one of claims 9 to 19, wherein the base plate is provided with a vent hole which flows out in a bottom surface of one of the bag portions, and the vent hole is preferably The ground flows out substantially in the center of the bag.         The substrate holding device according to any one of the scope of the previously applied patents, for use in a substrate processing apparatus or a substrate imaging apparatus, wherein the droplet in the array droplet comprises a substrate processing apparatus or a substrate imaging apparatus. A material at or near an operating temperature, a melting temperature, or a melting range.         The substrate holding device according to any one of the foregoing patent applications, wherein the gap includes an open connection to the outside of the substrate holding device, and preferably the gap is substantially at an edge of one of the sides of the substrate holding device. Open up.         A substrate holding device includes: a holding plate, wherein the holding plate includes a first side for holding a substrate, and a base plate, which is arranged at a distance from the holding plate and at a distance from the holding plate. A gap between the base plate and the clamp plate is provided at a second side of the clamp plate facing away from the first side, and an array support member is disposed at least between the clamp plate and the base plate. And an array of liquid or solid droplets of one of the heat absorbing materials, the droplets being disposed between the clamping plate and the base plate, wherein the droplets are substantially perpendicular to the first side of the clamping plate One side is bounded by the clamping plate and the base plate, and wherein the droplet is configured to enable the droplet to expand at least in one of the directions along the gap between the base plate and the clamping plate.         An apparatus for processing or imaging a sample, wherein the apparatus includes a source for electromagnetic radiation or particles having energy, and an exposure unit for exposing the sample to the electromagnetic radiation or particles having energy And a substrate holding device according to any one of the scope of the previous patent application for holding the sample at least during the exposure.         A method for manufacturing a substrate holding device, the substrate holding device includes: a holding plate, wherein the holding plate includes a first side for holding a substrate; and a base plate, which is arranged at a distance from A gap is provided between the base plate and the clamping plate at a distance from the clamping plate and at a second side of the clamping plate facing away from the first side; an array support member is disposed at least Between the holding plate and the base plate; and an array of droplets of a heat-absorbing material, wherein the method includes the steps of separating the droplet from the support and spaced from other droplets in the array of droplets It is arranged between the clamping plate and the base plate, wherein the droplet is configured to contact both the clamping plate and the base plate at least in its liquid phase.         A method for assembling a substrate holding device, wherein the method includes the following steps: providing a holding plate, wherein the holding plate includes a first side for holding a substrate, and an array support, the A support member is fixed to a second side of the clamping plate facing away from the first side, wherein the support member is configured to extend substantially perpendicular to the second side; a base plate is provided, the base plate includes an array of holes to For mounting the support member in the hole; an array droplet of one of a heat absorbing material separated from the support member and spaced from other droplets in the array droplet at a side facing the base plate Arranged on the clamping plate, or on the base plate at a side facing the clamping plate; moving the clamping plate and the base plate with the support toward each other until the clamp has been reached A desired distance between the holding plate and the base plate, wherein the support is positioned in the hole, and the array droplets are arranged in a gap between the holding plate and the base plate; and the support One or more of them are fixed in the corresponding holes.         The method according to claim 26, wherein the support is fixed to the second side via an adhesive connection.         The method according to claim 26 or claim 27, wherein the one or more supporting members are fixed in the corresponding holes via an adhesive connection provided between the hole and the supporting member extending into the hole. In a circumferential gap.         A substrate holding device according to any one of the scope of application patents 1 to 23 is an instrument for processing or imaging a sample, preferably a lithography system, and more preferably a multi-beam charged particle lithography Use in the surgical system.         An apparatus for exposing a sample, wherein the apparatus comprises a source for electromagnetic radiation or particles having energy, and an exposure unit for exposing the sample to the electromagnetic radiation or particles, wherein the exposure unit Containing a component for at least partially and / or temporarily manipulating and / or blocking at least a portion of the electromagnetic radiation or charged particles, wherein the component includes a cooling configuration configured to substantially maintain the component At a predetermined first temperature, and a substrate holding device for holding the sample at least during the exposure, wherein the substrate holding device includes a temperature stable configuration configured to be substantially stable The temperature of the sample disposed on the substrate holding device, wherein the temperature stable configuration includes a phase change material having a phase change at a second temperature, wherein the cooling configuration includes a control device, the control device It is configured to adjust the first temperature to be near the second temperature or equal to the second temperature.         The apparatus according to item 30 of the scope of patent application, wherein the cooling configuration and the temperature stable configuration are configured so that a difference between the first temperature and the second temperature does not exceed 4 ° C, and preferably does not exceed 2 ° C.         The apparatus according to claim 30 or 31, wherein the first temperature is lower than the second temperature.         An apparatus according to item 30 or 31 of the scope of patent application, wherein the first temperature is substantially equal to the second temperature, preferably wherein the first temperature and the second temperature are substantially equal to room temperature, and specifically equal to the manufacturing plant Room temperature in (Fab).         The apparatus according to any one of claims 30 to 33, wherein the phase change material comprises a eutectic metal alloy.         An apparatus according to any one of claims 30 to 34, wherein the cooling arrangement includes a conduit for guiding a cooling fluid via the conduit, wherein the conduit is configured to be in thermal contact with the component.         The apparatus according to item 35 of the application, wherein the cooling arrangement is configured so that a difference between one temperature of the cooling fluid and the second temperature does not exceed 4 ° C, and preferably does not exceed 2 ° C.         The apparatus according to claim 35 or 36, wherein the cooling configuration includes a temperature control system configured to control the temperature of the cooling fluid relative to the temperature of the substrate holding device.         An apparatus according to item 37 of the scope of patent application, wherein the apparatus includes the temperature for measuring the temperature of the substrate holding device and the exposure unit, and specifically the temperature of a portion of the exposure unit adjacent to the portion of the substrate holding device configured Temperature sensor.         An apparatus according to claim 37 or claim 38, wherein the cooling arrangement includes a cooling device for cooling the cooling fluid to a temperature below the first temperature, and a heating device for heating the cooling Fluid, wherein the heating device is disposed in the conduit at an upstream position relative to the assembly.         An apparatus according to any one of claims 30 to 39, wherein the component includes a projection lens for projecting the electromagnetic radiation or particles onto the sample.         According to the apparatus of the scope of patent application item 40, when subordinate to the scope of patent application scope item 6, the conduit is configured to convey the cooling fluid through or around the projection lens.         The apparatus according to any one of claims 30 to 41, wherein the component includes a modulation device for modulating the electromagnetic radiation or particles.         According to the apparatus of the scope of patent application item 42, when subordinate to the scope of patent application item 35, the conduit is configured to convey the cooling fluid through or around the modulation device.         An apparatus according to item 43 of the application, wherein the modulation device includes a beam extinguishing assembly including a beam deflector for deflecting a beam of electromagnetic radiation or particles and a block for electromagnetic radiation or A bundle terminator of the bundle of particles, wherein the conduit is configured for conveying the cooling fluid through or around the bundle terminator.         An apparatus according to any one of claims 30 to 44, wherein the source is a source for charged particles, and the exposure unit includes one for projecting one or more charged particle beams onto one of the samples. Charged particle optical system.         An apparatus according to claim 45, wherein the source is configured to provide a plurality of charged particle beams, and wherein the charged particle optical system is configured to project one or more of the plurality of charged particle beams to On the sample, at least a first portion of the catheter is disposed in a region between two charged particle beams.         The apparatus according to any one of claims 30 to 46, wherein the exposure unit includes one or more temperature sensors, and preferably one of the one or more temperature sensors is disposed in the exposure. The side of the unit facing the substrate holding device.         A method for exposing a sample using an instrument according to any one of claims 30 to 47, wherein a tuning of the temperature stable configuration is performed before the processing or imaging of the sample, wherein the tuning The method comprises the steps of: curing at least a portion of the liquid phase change material in the temperature-stable configuration.         The method according to claim 48, wherein the modulating further comprises the step of: setting the temperature at which the temperature is stably configured to the second temperature before the processing or imaging of the sample.         According to the method of the patent application scope item 48 or 49, when subordinate to the patent application scope item 10, the heating device and / or the cooling device are controlled to place the substrate holding device and the exposure unit, especially the exposure A temperature difference is established between the part of the unit facing the substrate holding device, and the temperature difference is less than 4 ° C, preferably less than 2 ° C, and more preferably less than 1 ° C.         A method according to any one of claims 48 to 50 in the patent application range, wherein a temperature of the instrument during operation is in a temperature range from 19 ° C to 22 ° C, preferably wherein the first temperature and the second The temperature is also configured in the temperature range from 19 ° C to 22 ° C.         An instrument according to one of claims 30 to 47 of the scope of patent application for exposure specimens, especially for processing or imaging specimens.         A method for manufacturing a semiconductor device by means of an instrument according to any one of claims 24, 30 to 47, the method comprising the steps of:-placing a wafer on the substrate holding device and placing The wafer is positioned downstream of the exposure unit;-processing the wafer includes projecting an image or a pattern on the wafer by means of the electromagnetic radiation or particles with energy from the source; and-performing subsequent steps In order to produce a semiconductor device by means of the processed wafer.         A method for inspecting a target by means of an instrument according to any one of claims 24, 30 to 47, the method comprising the steps of:-placing the target on the substrate holding device and placing The wafer is positioned downstream of the exposure unit;-the electromagnetic radiation or particles with energy from the source are projected on the target; the electromagnetic radiation or particles with energy from the source are incident on the target Real-time detection of electromagnetic radiation or charged particles transmitted, emitted and / or reflected by the target; and-performing subsequent steps to check the target with the data from the step of detecting charged particles.