JP6595313B2 - Heat storage wall panels - Google Patents

Description

  The present invention relates to a heat storage wall panel using a latent heat storage material.

  Conventionally, in the technical field of building materials such as flooring and wall materials, research and development has been actively conducted to more effectively use thermal energy generated during indoor heating and natural energy such as sunlight. Energy conservation and ecological measures are taken based on these research and development.

  In view of such points, in recent years, building materials using heat storage materials have been developed. Here, as a heat storage material, a latent heat storage material that can store heat at a temperature equal to or higher than the melting point (phase change temperature) has been attracting attention, and various building materials using the latent heat storage material have been proposed.

  Here, the latent heat storage material is often stored and used in a storage recess formed in a base material that is a building material. The latent heat storage material is thermally expanded at the time of melting and thermally contracted at the time of solidification due to the phase change according to the temperature, so that a gap is formed between the wall surface (mainly the bottom surface) of the housing recess during the heat contraction. May be. Due to this gap, heat transfer between the latent heat storage material and the base material storing the latent heat storage material may be hindered.

  In view of such points, for example, Patent Document 1 discloses a floor base material in which a storage recess is formed on the back surface, and a latent heat storage material filled in a container stored in the storage recess of the floor base material. There has been proposed a heat storage floor material (heat storage floor panel) including a cushion material that urges the latent heat storage material so as to press the latent heat storage material against the bottom surface of the housing recess.

  According to this heat storage floor material, even if heat shrinks during solidification, the cushion material presses the latent heat storage material against the bottom surface of the storage recess, so that a gap is generated between the latent heat storage material and the bottom surface of the storage recess. Can be suppressed. Thereby, it can be efficiently transmitted from the bottom surface of the storage recess to the latent heat storage material from the heat storage floor material.

JP 2012-077492 A

  However, when the technique according to Patent Literature 1 is applied to a wall material (heat storage wall panel), the latent heat storage material is continuously used as a cushion material due to the effect of displacement due to its own weight, deterioration of the cushion material, and the like. It may be difficult to bias the material (wall substrate). Thereby, a clearance gap is formed between the base material for walls and a latent heat storage material, and there exists a possibility that the heat transfer to a latent heat storage material may be inhibited. Further, since the cushion material is stored in the storage recess, the amount of the latent heat storage material stored in the storage recess is also restricted, so that the heat storage performance of the wall panel is limited.

  The present invention has been made in view of such points, and the object of the present invention is to be able to exhibit the heat storage property of the latent heat storage material according to the size of the storage recess and to the latent heat storage material. It is providing the thermal storage wall panel which can improve the heat transfer of.

  As a result of intensive studies, the inventors have considered that the latent heat storage material is easy to flow in the melted state, taking into account the flow of the latent heat storage material due to its own weight and the heat shrinkage during solidification of the latent heat storage material. It was thought that if the shape of the recess is set, the heat transfer to the latent heat storage material can be improved.

  1st-3rd invention shown below is based on such an idea of the inventors, and the heat storage wall panel which concerns on 1st invention accommodates a latent heat storage material and this latent heat storage material in a back surface. A heat storage wall panel comprising at least a base material for a wall formed with a storage recess and a back material covering an opening of the storage recess so as to seal the latent heat storage material in the storage recess, In the arrangement state in which the heat storage wall panel is disposed, the bottom surface of the storage recess is so that the depth of the storage recess on the upper side of the heat storage wall panel is deeper than the depth of the storage recess on the lower side of the heat storage wall panel. The wall substrate is inclined with respect to the back surface.

  According to the first invention, since the bottom surface of the storage recess is inclined as described above in the state in which the heat storage wall panel is disposed, the storage space on the upper side of the storage recess is larger than the storage space on the lower side. This storage space has a larger storage volume of the latent heat storage material than the lower storage space. As a result, when the molten latent heat storage material is solidified, the upper gap formed between the latent heat storage material and the housing recess due to the thermal contraction of the latent heat storage material is compared to the case where the inclined bottom surface is not provided. Get smaller. As a result, the contact area between the latent heat storage material and the bottom surface of the housing recess and the contact area between the latent heat storage material and the back surface material can be secured larger than those provided with no inclined bottom surface. The heat transfer property to the latent heat storage material can be improved and the heat storage property can be improved.

  Further, when the molten latent heat storage material solidifies, the latent heat storage material in the lower storage space solidifies first, and finally the storage volume is larger than the latent heat storage material in the upper storage space of the storage recess. The latent heat storage material in the upper storage space is solidified. As a result, since the latent heat storage material solidifies in contact with the bottom and back materials of the storage recesses in order from the lower side to the upper side, the latent heat storage material even if it is thermally contracted during solidification of the latent heat storage material And it can suppress that the contact area with the bottom face and back material of a storage recessed part reduces.

  A heat storage wall panel according to a second aspect of the present invention seals the latent heat storage material, a wall base material having a storage recess for storing the latent heat storage material on the back surface, and the latent heat storage material to the storage recess. A heat storage wall panel having at least a back material covering the opening of the storage recess, and in the arrangement state in which the heat storage wall panel is disposed, the area of the opening of the storage recess is divided into two equal parts. As described above, when a virtual plane extending along the depth direction of the storage recess is set and the storage space of the storage recess is divided by the virtual plane, the storage space above the virtual plane is The storage recess is formed so as to be larger than a storage space below the virtual plane.

  According to the second invention, similarly to the first invention, the upper storage space divided by the virtual plane and larger than the lower storage space is larger than the lower storage space. As compared with the storage space, the storage volume of the latent heat storage material is increased. Thus, as in the first invention, when the molten latent heat storage material is thermally contracted, the contact area between the latent heat storage material and the bottom surface of the housing recess, and the contact area between the latent heat storage material and the back surface material are set on the upper and lower sides. Since it can be ensured larger than that in which the storage space is made uniform, the heat transfer to the latent heat storage material can be improved, and the heat storage property can be improved. Further, similarly to the first invention, even if the heat is contracted during solidification of the latent heat storage material, it is possible to suppress a decrease in the contact area between the latent heat storage material, the wall surface of the housing recess, and the back surface material.

  As a more preferred aspect of the second invention, in the arrangement state of the heat storage wall panel, the depth of the storage recess on the upper side of the heat storage wall panel is deeper than the depth of the storage recess on the lower side of the heat storage wall panel. Thus, the bottom surface of the storage recess is inclined with respect to the back surface of the wall base material.

  According to this aspect, in the arrangement state of the heat storage wall panel, since the bottom surface of the storage recess is inclined as described above, the storage space on the upper side of the storage recess is made larger than the storage space on the lower side. And the effects described above can be further exhibited.

  A heat storage wall panel according to a third aspect of the present invention is to seal a latent heat storage material, a wall base material in which a storage recess for storing the latent heat storage material on the back surface is formed, and the latent heat storage material in the storage recess. A heat storage wall panel having at least a back surface material covering an opening of the storage recess, wherein the storage recess is at least a part of a storage space of the storage recess in an arrangement state in which the heat storage wall panel is disposed. Is formed so that the area of the cut surface cut along a virtual plane extending along the depth direction of the storage recess decreases from the upper side to the lower side of the storage recess. To do.

  According to the third invention, the storage recess is formed such that the cut surface cut by the virtual plane extending along the depth direction of the storage recess decreases from the upper side to the lower side of the storage recess. Therefore, the storage volume of the latent heat storage material increases from the lower side toward the upper side. As in the first and second inventions, this ensures a larger contact area between the latent heat storage material and the bottom surface of the housing recess and a contact area between the latent heat storage material and the back surface material when the molten latent heat storage material is thermally contracted. be able to. Also, since the volume of the storage space decreases from the upper side to the lower side of the storage concave portion, the storage is performed from the lower side to the upper side of the storage concave portion as in the first and second inventions. The latent heat storage material stored in the recess can be solidified. As a result, even if this heat shrinks during solidification of the latent heat storage material, it is possible to suppress a decrease in the contact area between the latent heat storage material and the wall surface and back surface material of the storage recess.

  As a preferable aspect of the first to third inventions, the latent heat storage material is a molten latent heat storage material poured and solidified so as to fill the storage recess. According to this aspect, even when the latent heat storage material melted in the storage recess is solidified when the heat storage wall panel is used, the gap formed in the storage recess due to the thermal contraction of the latent heat storage material can be further reduced. .

  Furthermore, as a preferable aspect of the first to third inventions, in the arrangement state of the heat storage wall panel, the wall surface forming the storage recess is continuous from the peripheral portion below the opening of the storage recess. The lower wall surface formed in this manner is inclined with respect to the back surface of the wall substrate.

  According to this aspect, by tilting the lower wall surface, the storage space of the storage recess in the vicinity of the lower wall surface can be made smaller, and the latent heat storage material can be preferentially solidified from this vicinity. As a result, as described above, even if the heat is contracted during solidification of the latent heat storage material, it is possible to suppress a decrease in the contact area between the latent heat storage material, the bottom surface of the storage recess, and the back surface material.

  Furthermore, as a preferable aspect of the first to third inventions, a plurality of the storage recesses are formed on the back surface of the wall base material. According to this aspect, by providing the plurality of storage recesses, the more uniform heat storage property can be ensured by dispersing the latent heat storage material in the wall base material. Further, when a thumbtack, a push pin, etc. are pushed into the surface of the wall substrate, even if the thumbtack, the push pin, etc. reach one of the storage recesses, it is stored in the storage recess. Only one latent heat storage material is crystallized or evaporated, so that the heat storage performance is only impaired, and the heat storage performance of the latent heat storage materials in the other storage recesses is not affected.

  Furthermore, as a preferable aspect of the first to third inventions, a fixing mark for fixing the heat storage wall panel is provided on the surface of the wall base material at a position removed from the storage recess. Yes.

  According to this aspect, when fixing the heat storage wall panel with a fixing tool such as a nail or a screw, even if the fixing tool penetrates the wall base material from the surface of the wall base material in accordance with the fixing mark, The fixing tool does not reach the latent heat storage material stored in the storage recess. Thereby, a latent heat storage material does not crystallize or evaporate from the inside of a storage recessed part, and can hold | maintain the thermal storage effect by a latent heat storage material.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to exhibit the thermal storage property by the latent heat storage material according to the magnitude | size of an accommodation recessed part, the heat transfer to a latent heat storage material can be improved.

It is the typical exploded perspective view seen from the back side of the thermal storage wall panel concerning a 1st embodiment. (A) is the typical perspective view seen from the back surface side of the thermal storage wall panel shown in FIG. 1, (b) is the typical perspective view seen from the surface side of the thermal storage wall panel shown in FIG. (A) is the typical perspective view which showed the accommodation recessed part of the thermal storage wall panel shown in FIG. 1, (b) is the AA arrow directional cross-sectional view of (a), (c), It is the typical perspective view which showed the storage space shown to (a), (d) is the figure which showed the area change of the cut surface which cut | disconnected the storage space by the virtual plane. (A) is typical sectional drawing which showed the method of filling a latent-heat storage material in the accommodation recessed part shown in FIG.3 (b), (b) is a back surface material in the base material for walls shown in (a). It is sectional drawing which showed the method of attaching, (c) is the figure which showed another method of filling a latent-heat storage material in a storage recessed part. (A) is the figure explaining the method of attaching the thermal storage wall panel shown in FIG. 1 to a wall room side surface, (b) is the figure explaining the method of attaching the thermal storage wall panel shown in FIG. 1 to a wall inner side surface. (A)-(d) is a figure for demonstrating the state until it solidifies from the state with which the latent-heat storage material in the thermal storage wall panel shown in FIG. 1 was fuse | melted. (A) is the figure which showed the solidification state of the latent heat storage material of the thermal storage wall panel shown in FIG. 1, (b) is the figure which showed the solidification state of the latent heat storage material of the conventional thermal storage wall panel. (A) is the typical perspective view which showed the accommodation recessed part of the thermal storage wall panel which concerns on 2nd Embodiment, (b) is BB arrow sectional drawing of (a), (c). (A) is the typical perspective view which showed the storage space shown to (a), (d) is the figure which showed the area change of the cut surface which cut | disconnected the storage space by the virtual plane. (A) is the typical perspective view which showed the accommodation recessed part of the thermal storage wall panel which concerns on 3rd Embodiment, (b) is CC sectional view taken on the line of (a), (c). (A) is the typical perspective view which showed the storage space shown to (a), (d) is the figure which showed the area change of the cut surface which cut | disconnected the storage space by the virtual plane. (A) is the typical perspective view which showed the accommodation recessed part of the thermal storage wall panel which concerns on 4th Embodiment, (b) is DD sectional view taken on the line of (a), (c). (A) is the typical perspective view which showed the storage space shown to (a), (d) is the figure which showed the area change of the cut surface which cut | disconnected the storage space by the virtual plane. It is the figure explaining the method of attaching the thermal storage wall panel which concerns on the modification of 2nd Embodiment as a wall material between a pillar and a stud. (A) is an expansion perspective view of the E part vicinity of FIG. 11, (b) is FF arrow directional cross-sectional view of (a). (A)-(c) is a figure for demonstrating the procedure which attaches a thermal storage wall panel between a pillar and a stud with a fixing tool through a through-hole for fixation.

Hereinafter, the present invention will be described based on the present embodiment with reference to the drawings.
[First Embodiment]
FIG. 1 is a schematic exploded perspective view seen from the back side of the heat storage wall panel 1 according to the first embodiment, and FIG. 2A is a schematic view seen from the back side of the heat storage wall panel 1 shown in FIG. FIG. 2B is a schematic perspective view seen from the surface side of the heat storage wall panel 1 shown in FIG.

  The heat storage wall panel 1 according to the first embodiment is an embodiment including the first to third inventions. As shown in FIG. 1, the heat storage wall panel 1 according to the present embodiment includes a latent heat storage material 20 and a wall base material 10 in which a storage recess 13 for storing the latent heat storage material 20 on the back surface 12 is formed. ing. The heat storage wall panel 1 further includes a back material 30 that covers the opening 13 a of the storage recess 13 so as to seal the latent heat storage material 20 in a state where the latent heat storage material 20 is stored in the storage recess 13.

1. About the base material 10 for walls The base material 10 for walls is a base material for ensuring the rigidity and intensity | strength of a flooring at least, and a wood material, an inorganic material, a resin material etc. can be mentioned as a material. When the wall substrate 10 is made of a wood material, the wall substrate 10 is made of ordinary plywood, LVL, LVB, laminated timber, OSB, PB, MDF, or any other material made of hardwood or conifer. The laminated board etc. which were laminated | stacked can be mentioned. When the wall substrate 10 is made of an inorganic material, examples of the wall substrate 10 include a board in which inorganic fibers are accumulated, a gypsum board, and the like. When the wall base material 10 is made of a resin material, examples of the wall base material 10 include a plate material made of vinyl chloride, acrylic, polyethylene terephthalate, polyolefin, or a plate material made of a foamed material such as styrene, polyurethane, or polyolefin. Can do.

  Further, as shown in FIG. 5A described later, when the heat storage wall panel 1 shown in FIG. 1 is attached to the front wall side surface 61, the surface of the wall substrate 10 shown in FIG. 11, surface decorative materials such as oak material, birch material, beech material, teak material, and the like, and a surface synthetic resin sheet for makeup may be attached.

  A plurality of storage recesses 13, 13,... For storing the latent heat storage material 20 are formed on the back surface 12 of the wall substrate 10. In this way, that is, by dispersing the latent heat storage material 20 in the wall base material 10, gaps due to thermal contraction, which will be described later, can be dispersed and more uniform heat storage performance can be ensured. Note that. In the present embodiment, a plurality of storage recesses 13, 13,... Are provided. However, if the latent heat storage material 20 is stored in the storage recess 13 and a heat transfer effect as described below can be expected, The number of storage recesses is not particularly limited.

  Here, when the wall substrate 10 is a plate made of a nonporous resin material, the latent heat storage material 20 may be stored in the storage recess 13 as it is. In the case of a plate material made of a wood material or a porous plate material made of a porous inorganic material, the wall surface of the storage recess 13 is prevented so that the molten latent heat storage material penetrates into the wall surface of the storage recess 13. In addition, a resin layer or a metal layer may be formed. As another embodiment, the latent heat storage material 20 is filled in a flexible resin or metal packaging bag and then sealed, and the latent heat storage material 20 sealed in the packaging container is used for a wall. You may store in the base material 10. FIG. The details of the shape of the storage recess 13 which is a feature of the present invention will be described later.

2. About the latent heat storage material 20 The latent heat storage material 20 stored in the storage recess 13 of the wall base material 10 is a latent heat storage material that stores indoor heat or the like and changes phase from a solid phase to a liquid phase, preferably a phase. It is a latent heat storage material in the temperature range of 18 ° C to 30 ° C.

  Specific examples include sodium sulfate hydrate, calcium chloride hydrate, paraffin (for example, C18H38), polyethylene glycol (molecular weight: 500 to 1000), and the like that can store heat above this phase change temperature. If so, the material is not particularly limited. In addition to this, the latent heat storage material 20 includes sodium sulfate decahydrate, Calslip manufactured by JSR, high-viscosity capsule manufactured by Miki Riken Kogyo, and latent heat storage manufactured by Mitsubishi Cable Industries, Ltd. You may use the latent heat storage material which becomes a gel form above phase change temperature, such as material MHSR series.

  Further, as described above, the latent heat storage material 20 is filled in a flexible resin or metal packaging bag and then sealed, and the latent heat storage material 20 sealed in the packaging container is placed on the wall. You may store in the storage recessed part 13 of the base material 10 for an object.

3. About Back Material 30 The back material 30 covers the opening 13a of the storage recess 13 so that the latent heat storage material 20 is sealed in the storage recess 13. The back material 30 is, for example, non-permeable to a liquefied latent heat storage material such as a thermoplastic resin film such as polyethylene terephthalate, nylon or polypropylene, an oil resistant sheet such as a recycled sole nonwoven fabric, or a metal sheet such as aluminum foil. Can be mentioned.

  The back material 30 is adhered to the back surface 12 of the wall substrate 10 via an adhesive or the like. Alternatively, a part of the back material 30 (for example, a thermoplastic resin) may be melted and the back material 30 may be adhered (fused) to the back surface 12 of the wall substrate 10. By providing such a back material 30, it is possible to prevent the latent heat storage material 20 liquefied or softened during the phase change from oozing out or flowing out from the back material 30.

4). About the storage recessed part 13 of the base material 10 for walls The storage recessed part 13 of the base material 10 for walls which concerns on 1st Embodiment includes the structure used as all the characteristics of the 1st-3rd invention. Below, the accommodation recessed part 13 of the base material 10 for walls is explained in full detail. 3A is a schematic perspective view showing the storage recess 13 of the heat storage wall panel 1 shown in FIG. 1, and FIG. 3B is a cross-sectional view taken along line AA in FIG. 3A. 3 (c) is a schematic perspective view showing the storage space shown in FIG. 3 (a), and FIG. 3 (d) shows the change in the area of the cut surface obtained by cutting the storage space along a virtual plane. FIG.

  These drawings are views showing the storage recess 13 in a state in which the heat storage wall panel 1 is arranged on the side surface of the wall room or the inner side surface of the wall. Note that “upper side” and “lower side” in the present specification refer to the heat storage wall panel 1 so that the back surface of the wall substrate 10 intersects the horizontal plane (in the present embodiment, intersects at right angles). It means the positional relationship of each part in a state where is placed.

  In this embodiment, as shown in FIGS. 3A to 3C, the storage recess 13 in which the latent heat storage material 20 is filled (stored) is formed on the back surface 12 of the wall base material 10. An opening 13a is formed in the housing recess 13, and an upper wall surface 14, a lower wall surface 15, and a pair of lateral wall surfaces 16, 16 are formed continuously from the peripheral edge 13b of the opening 13a. A bottom surface 17 is formed continuously with the wall surface. The storage recess 13 can be formed on the back surface 12 of the wall substrate 10 by a general method such as digging or forming.

  Here, in this embodiment, the feature point of 1st invention is included as the example. Specifically, as shown in FIGS. 3A and 3B, the upper wall surface 14, the lower wall surface 15, and the pair of lateral wall surfaces 16, 16 of the storage recess 13 are formed on the back surface of the wall substrate 10. 12 extends in a direction perpendicular to 12. The bottom surface 17 of the storage recess 13 is formed so that the depth DU of the storage recess on the upper side of the heat storage wall panel 1 is deeper than the depth DB of the storage recess on the lower side of the heat storage wall panel 1. Inclined with respect to the back surface 12.

  In the present embodiment, the feature point of the second invention is included as an example. Specifically, as shown in FIG. 3 (c), the depth of the storage recess 13 so that the area of the opening 13 a of the storage recess 13 is divided into two equal parts in the state where the heat storage wall panel 1 is arranged. A virtual plane P extending along the direction d is set. When the storage space S of the storage recess 13 is divided by the set virtual plane P, the storage space SU above the virtual plane P is larger than the storage space SB below the virtual plane P. A storage recess 13 is formed. The depth direction d of the storage recess 13 is a direction coinciding with the normal direction of the back surface 12 of the wall substrate 10.

  Furthermore, in this embodiment, the feature point of 3rd invention is included as the example. As shown in FIGS. 3C and 3D, the storage recess 13 includes a cut surface A obtained by cutting the storage space S of the storage recess 13 along a virtual plane extending along the depth direction d of the storage recess 13. Is formed so as to decrease from the upper side (upper wall surface 14) of the storage recess 13 toward the lower side (lower wall surface 15). FIG. 3C shows the area of the cut surface A when the virtual plane P is located at the center between the upper wall surface 14 and the lower wall surface 15.

5). About the filling method of the latent heat storage material 20 to the storage recessed part 13 The latent heat storage material 20 is stored in such a storage recessed part 13. As long as the latent heat storage material 20 can be stored in the storage recess 13 of the wall substrate 10, the storage method is not particularly limited, but in this embodiment, the latent heat storage material is as follows. The material 20 is stored in the storage recess 13.

  4A is a schematic cross-sectional view showing a method of filling the latent heat storage material 20 in the storage recess 13 shown in FIG. 3B, and FIG. 4B is shown in FIG. It is sectional drawing which showed the method of attaching the back surface material 30 to the base material 10 for walls, and FIG.4 (c) is the figure which showed another method of filling the storage recessed part 13 with the latent heat storage material 20. FIG. In FIG. 4B, the gap formed in the housing recess 13 due to thermal contraction that occurs when the molten latent heat storage material 20A is solidified is omitted.

  As shown in FIG. 4A, in this embodiment, the molten latent heat storage material 20A is discharged from the nozzle 9 into the storage recess 13, and the molten latent heat storage material 20A is filled into the storage recess 13. The molten latent heat storage material 20A is poured and solidified. Thereafter, as shown in FIG. 4 (b), with the latent heat storage material 20B in a solidified state being accommodated, the back surface material 30 is pasted on the back surface of the wall base material 10 with, for example, an adhesive or the like with a hot breath or the like. To wear.

  In this way, when the heat storage wall panel 1 is used, the housing recess 13 is filled with the latent heat storage material 20A in a molten state without a gap. Thereby, even if the molten latent heat storage material 20A in the storage recess 13 is solidified, the gap formed in the storage recess due to thermal contraction of the latent heat storage material 20A can be further reduced.

  As another method, as shown in FIG. 4 (c), the inlet 31 by the nozzle 9 and the back material 30 in which the air vent holes 32 are formed are adhered to the back surface 12 of the wall substrate 10. Thereafter, the storage recess 13 may be filled with the latent heat storage material 20A in a molten state by the nozzle 9 from the injection port 31. After filling the latent heat storage material 20 </ b> A into the storage recess 13, the inlet 31 and the air vent hole 32 are sealed with a sealing material or the like. According to this aspect, it is possible to fill the latent heat storage material 20 </ b> A in a molten state without any gaps in the housing recess 13 covered with the back material 30.

6). Application of heat storage wall panel 1 and its effect The heat storage wall panel 1 manufactured in this way is attached to a wall surface. FIG. 5A is a diagram for explaining a method of attaching the heat storage wall panel 1 shown in FIG. 1 to the wall room side surface 61, and FIG. 5B shows the heat storage wall panel 1 shown in FIG. It is the figure explaining the method of attaching to.

  As shown in FIGS. 5A and 5B, the large wall base material 6 is fixed between the columns 7A and 7B. When the heat storage wall panel 1 is attached to the wall room side surface 61 facing the room among the surfaces of the large wall base material 6, the back material 30 of the heat storage wall panel 1 is attached to the wall as shown in FIG. With the fixture 70 such as a nail or a screw in contact with the room side surface 61, it is attached to the large wall base material 6 from the surface side. In this case, a surface decorative sheet such as a synthetic synthetic resin sheet may be further adhered to the surface 11 of the heat storage wall panel 1 facing the room so as to cover the fixture.

  On the other hand, as shown in FIG. 5 (b), when the heat storage wall panel 1 is attached to the wall inner side surface 62 that does not face the interior of the surface of the large wall base material 6, the back surface of the heat storage wall panel 1. The material 30 is attached to the large wall base material 6 by using a fixing tool 70 such as a nail or a screw in a state where the material 30 is in contact with the side surface 61 of the wall room.

  The heat storage wall panel 1 attached in this manner can be expected to have the following effects. FIGS. 6A to 6D are views for explaining a state from the state in which the latent heat storage material 20 in the heat storage wall panel 1 shown in FIG. 1 is melted to solidification. FIG. 7A is a diagram illustrating a solidified state of the latent heat storage material 20 of the heat storage wall panel 1 illustrated in FIG. 1, and FIG. 7B is a diagram illustrating solidification of the latent heat storage material 20 of the conventional heat storage wall panel 8. It is the figure which showed the state.

  Since the latent heat storage material 20 (20A) stored in the storage recess 13 of the wall substrate 10 is filled in the storage recess 13 in a molten state at the manufacturing stage, as shown in FIG. The molten latent heat storage material 20A is filled in the storage recess 13 with almost no gap.

  When the molten latent heat storage material 20A is cooled from this state, heat is radiated from the outside as shown in FIG. 6B, so that the solidified latent heat storage material 20B is formed on the outside. At this time, since the bottom surface 17 of the storage recess 13 is inclined, the dead weight of the molten latent heat storage material 20A acts, so that the solidified latent heat storage material 20B in the vicinity of the bottom surface 17 is pressed against the bottom surface 17. Thereby, formation of the clearance gap by heat shrink between the bottom face 17 and the solidified latent heat storage material 20B is reduced.

  Further, when solidification of the molten latent heat storage material 20A proceeds from the state of FIG. 6B, as shown in FIG. 6C, compared to the latent heat storage material in the storage space SU above the storage recess 13. The latent heat storage material 20A in the lower storage space SB solidifies first (becomes a solidified latent heat storage material 20B), and finally the latent heat storage material 20A in the upper storage space SU with a large storage volume solidifies (solidified state). Of latent heat storage material 20B).

  As a result, as shown in FIG. 6 (d), the molten latent heat storage material 20 </ b> A is solidified in contact with the bottom surface 17 and the back surface material 30 of the storage recess 13 in order from the bottom to the top. As a result, even if the heat storage material 20A is thermally contracted when the latent heat storage material 20A is solidified, the bottom surface 87 of the conventional storage recess 83 shown in FIG. A reduction in the contact area between the heat storage material 20 and the bottom surface 17 and the back material 30 of the storage recess 13 can be suppressed.

  In this embodiment, as shown in FIG. 7A, since the bottom surface 17 of the storage recess 13 is inclined as described above, the storage space SU above the storage recess 13 is smaller than the storage space SB below. As shown in FIG. 3C, the upper storage space SU has a larger storage volume of the latent heat storage material 20 than the lower storage space SB.

  Thus, when the molten latent heat storage material 20 is solidified, the upper vertical gap C1 formed between the latent heat storage material 20 and the housing recess 13 due to thermal contraction of the latent heat storage material 20B is shown in FIG. It is smaller than the vertical gap C2 when the inclined bottom surface 87 shown in b) is not provided.

  As a result, the contact area between the latent heat storage material 20 and the bottom surface 17 of the storage recess 13 and the contact area between the latent heat storage material and the back surface material should be ensured larger than those provided with no inclined bottom surface. Therefore, the heat transfer property to the latent heat storage material 20 can be improved.

[Second Embodiment]
Fig.8 (a) is the typical perspective view which showed the accommodation recessed part 13 of the thermal storage wall panel 1 which concerns on 2nd Embodiment, FIG.8 (b) is a BB line arrow view of Fig.8 (a). FIG. 8C is a schematic perspective view showing the storage space S shown in FIG. 8A, and FIG. 8D is a cross-sectional view of the storage space S cut along a virtual plane P. FIG. 6 is a diagram showing an area change of a surface A.

  The heat storage wall panel 1 according to the second embodiment is different from that of the first embodiment in the shape of the housing recess 13 of the wall substrate 10. Therefore, only the shape of the storage recess 13 will be described below, and other detailed description will be omitted. The heat storage wall panel 1 according to the second embodiment is also an embodiment including the first to third inventions.

  In the present embodiment, as shown in FIGS. 8A and 8B, the storage recess 13 filled (stored) with the latent heat storage material 20 is formed on the back surface of the wall base material 10 as in the first embodiment. An opening 13 a is formed in the storage recess 13 formed in 12. In the present embodiment, unlike the first embodiment, the upper wall surface 14 formed continuously from the upper peripheral edge portion 13 c of the peripheral edge portion of the opening 13 a is inclined with respect to the back surface 12 of the wall substrate 10. is doing. Similarly, the lower side wall surface 15 formed continuously from the lower peripheral edge portion 13 d of the peripheral edge portion of the opening 13 a is inclined with respect to the back surface 12 of the wall substrate 10.

  As shown in FIGS. 8A and 8B, in this embodiment as well, the pair of side wall surfaces 16, 16 are perpendicular to the back surface 12 of the wall substrate 10 as in the first embodiment. It is extended. The bottom surface 17 of the storage recess 13 is formed so that the depth DU of the storage recess on the upper side of the heat storage wall panel 1 is deeper than the depth DB of the storage recess on the lower side of the heat storage wall panel 1. Inclined with respect to the back surface 12.

  Further, as shown in FIG. 8C, the depth direction d of the storage recess 13 so that the area of the opening 13a of the storage recess 13 is vertically divided into two in the arrangement state in which the heat storage wall panel 1 is arranged. A virtual plane P extending along is set. When the storage space S of the storage recess 13 is divided by the set virtual plane P, the storage space SU above the virtual plane P is larger than the storage space SB below the virtual plane P. A storage recess 13 is formed.

  Further, as shown in FIGS. 8C and 8D, the storage recess 13 is a part of the storage space S of the storage recess 13 (specifically, the storage space including the bottom surface 17 and the lower wall surface 15). The area of the cut surface A cut along a virtual plane extending along the depth direction d of the storage recess 13 is formed so as to decrease from the upper side to the lower side of the storage recess 13. FIG. 8C shows the area of the cut surface A when the virtual plane P is located at the center between the upper peripheral portion 13c and the lower peripheral portion 13d.

  Thus, in this embodiment, as in the first embodiment, the bottom surface 17 that satisfies the relationship between the depths DU and DB of the upper and lower storage recesses is provided, and the upper and lower storage spaces SU and SB are provided. Since the relationship is satisfied and a part thereof satisfies the condition of area change of the cut surface A, the same effect as that of the first embodiment described above can be expected.

  Further, in the present embodiment, in addition to the operational effects shown in the first embodiment described above, the lower wall surface 15 is further inclined with respect to the back surface 12 of the wall base material 10. The storage space of the storage recess 13 in the vicinity of can be made smaller, and the latent heat storage material 20 can be preferentially solidified from this vicinity. Thereby, the reduction | decrease of the contact area of the latent heat storage material 20, the bottom face 17 of the storage recessed part 13, and the back surface material 30 can be suppressed further.

[Third Embodiment]
Fig.9 (a) is the typical perspective view which showed the accommodation recessed part 13 of the thermal storage wall panel 1 which concerns on 3rd Embodiment, FIG.9 (b) is CC arrow view of Fig.9 (a). FIG. 9C is a schematic perspective view showing the storage space S shown in FIG. 9A, and FIG. 9D is a cross-sectional view of the storage space S cut along a virtual plane P. FIG. 6 is a diagram showing an area change of a surface A.

  The heat storage wall panel 1 according to the third embodiment is different from that of the first embodiment in the shape of the housing recess 13 of the wall base material 10. Therefore, only the shape of the storage recess 13 will be described below, and other detailed description will be omitted. The heat storage wall panel 1 according to the third embodiment is an embodiment that encompasses the second and third inventions.

  In the present embodiment, as shown in FIGS. 9A and 9B, unlike the first embodiment, among the peripheral portions of the opening 13a, the lower peripheral portion 13d is inclined toward the upper wall surface 14. An inclined wall surface 18 is formed. In the present embodiment, the upper wall surface 14 extends in a direction perpendicular to the back surface 12 of the wall substrate 10, but it may be inclined as in the second embodiment.

  In the present embodiment, similarly to the first embodiment, as shown in FIG. 9C, when the storage space S of the storage recess 13 is divided by the virtual plane P, the storage space SU above the virtual plane P is divided. However, the storage recess 13 is formed so as to be larger than the storage space SB below the virtual plane P.

  Further, as shown in FIGS. 9C and 9D, the storage recess 13 is a virtual plane that extends the storage space S formed by the inclined wall surface 18 along the depth direction d of the storage recess 13. The cut surface A is formed so that the area of the cut surface A decreases from the upper side (upper wall surface 14) of the storage recess 13 toward the lower side (lower peripheral portion 13d). FIG. 9C shows the area of the cut surface A when the virtual plane P is located at the center between the upper peripheral edge 13c and the lower peripheral edge 13d.

  Thus, in the present embodiment, as in the first embodiment, the relationship between the upper and lower storage spaces SU, SB is satisfied and the area change condition of the cut surface A is satisfied, so the first embodiment described above. The same effect can be expected.

[Fourth Embodiment]
Fig.10 (a) is the typical perspective view which showed the accommodation recessed part 13 of the thermal storage wall panel 1 which concerns on 4th Embodiment, FIG.10 (b) is the DD line | wire arrow view of Fig.10 (a). FIG. 10C is a schematic perspective view showing the storage space S shown in FIG. 10A, and FIG. 10D is a cross-sectional view of the storage space S cut along a virtual plane P. FIG. 6 is a diagram showing an area change of a surface A.

  The heat storage wall panel 1 according to the fourth embodiment is different from that of the first embodiment in the shape of the housing recess 13 of the wall base material 10. Therefore, only the shape of the storage recess 13 will be described below, and other detailed description will be omitted. A heat storage wall panel 1 according to the fourth embodiment is an embodiment according to the third invention.

  In this embodiment, as shown in FIGS. 10A to 10D, unlike the first embodiment, the bottom surface 17 of the storage recess 13 is parallel to the back surface 12 of the wall substrate 10, and the storage recess 13 Of the storage space S is cut in a virtual plane extending along the depth direction d of the storage recess 13 so that the area of the cut surface A decreases from the upper side to the lower side of the storage recess 13. Side wall surfaces 16A and 16B are formed. In the present embodiment, since the area change condition of the cut surface A is satisfied as in the first embodiment, the same effect as in the first embodiment described above can be expected.

7). Further Modifications of Heat Storage Wall Panel In FIGS. 5A and 5B described above, when fixing the heat storage wall panel 1 with a fixing tool 70 such as a nail or a screw, the fixing tool 70 is attached to the heat storage wall panel 1. To penetrate. At this time, when the fixture 70 reaches the latent heat storage material 20 stored in the storage recess 13 of the wall base material 10, the latent heat storage material 20 crystallizes or evaporates from the storage recess 15. Is assumed. In view of such points, the following modifications are disclosed.

  FIG. 11 is a diagram illustrating a method of attaching the heat storage wall panel 1 according to the modification of the second embodiment as a wall material between the column 7A and the inter-column 7B. 12A is an enlarged perspective view of the vicinity of the E portion in FIG. 11, and FIG. 12B is a cross-sectional view taken along line FF in FIG. FIGS. 13A to 13C are views for explaining a procedure for attaching the heat storage wall panel 1 between the pillars 7A and 7B by the fixture 70 through the fixing through holes 72. FIG.

  As shown in FIG. 11, a fixing through-hole for fixing the heat storage wall panel 1 to the surface 11 of the wall base material 10 of the heat storage wall panel 1 according to the modified example at a position removed from the storage recess 13. 72 (fixing mark) is provided. The heat storage wall panel 1 is fixed by a fixing tool 70 such as a nail or a screw through a fixing through hole 72.

  As shown in FIG. 12A and FIGS. 13A and 13B, the fixing through-hole 72 is a hole penetrating in the thickness direction of the heat storage wall panel 1, and from the shaft portion 70 a of the fixture 70. Also has a through hole 72a having a small diameter and a recess 72b in which the head 70b of the fixture 70 is accommodated.

  When the heat storage wall panel 1 is fixed to the pillars 7A and 7B, the heat storage wall panel 1 is brought into contact with the pillars 7A and the pillars 7B, and the surfaces of the pillars 7A and 7B can be visually recognized through the fixing through holes 72. Is confirmed (see FIG. 13A).

  Next, until the head 70 of the fixture 70 is received in the recess 72b, the fixture 70 is pushed toward the column 7A and the inter-column 7B, and the shaft portion 70a of the fixture 70 is inserted into the through hole 72a of the fixing through hole 72. To reach the pillars 7A and 7B (see FIG. 13B).

  Finally, the lid 73 according to the shape of the recess 72b is fitted so that the surface of the lid 73 coincides with the surface 11 of the wall base 11, and the surface 11 of the wall base 11 is A surface decorative sheet 75 such as a synthetic resin sheet for makeup is attached (see FIG. 13C).

  As described above, when the heat storage wall panel 1 is fixed by the fixing tool 70, the fixing tool 70 may be penetrated from the surface 11 of the wall base material 10 to the wall base material 11 according to the fixing through hole 72. The fixing tool 70 does not reach the latent heat storage material 20 stored in the storage recess 13. Thereby, the latent heat storage material 20 is not crystallized or evaporated from the inside of the storage recess, and the heat storage effect by the latent heat storage material 20 can be maintained.

  Further, in this modified example, the fixing through hole 72 is a hole penetrating the wall base material 11 and the back surface material 30, so that the back surface material 30 is peeled off from the wall base material 11 when the fixing tool 70 is fixed. It is difficult to apply force in the direction. Thereby, the reliability of the thermal storage wall panel 1 at the time of construction can be improved.

  In the present embodiment, the fixing mark is the fixing through hole 72. However, a color mark, a hole or a concave portion that does not penetrate the heat storage wall panel 1 at a position removed from the storage concave portion 13, etc. A mark may be provided.

  Furthermore, the heat storage wall panel 1 according to this modification is filled with the latent heat storage material 20 in the circular storage recess 13, and compared with the above-described heat storage wall panel (see, for example, FIG. 1). By reducing the storage space of the storage recess 13, a larger number of storage recesses 13 are formed. Thereby, in the heat storage wall panel 1, a smaller amount of latent heat storage material 20 can be divided (dispersed) and the heat storage wall panel can be arranged.

  As a result, when a thumbtack, a push pin, or the like is pushed into the surface 11 of the wall substrate 10, the thumbtack, the push pin, etc. reach the one storage recess 13 out of the plurality of storage recesses 13, 13,. Even if, however, one of the latent heat storage materials 20 stored in the storage recess 13 is crystallized or evaporated, the heat storage performance is only impaired, and the latent heat of the other storage recesses 13, 13. The heat storage properties of the heat storage materials 20, 20... Are not affected.

  Note that, as shown in FIG. 12B, this modification is similar to the cross-sectional shape of the storage recess 13 according to the second embodiment shown in FIG. 8B. In this modification, a protective member 40 is further disposed on the bottom surface 17 of the storage recess 13. The protection member 40 is a member that prevents a thumbtack, a push pin, or the like pushed in from the surface 11 of the wall base material 10 described above from reaching the latent heat storage material 20.

  For example, the protective member 40 may be a metal plate such as aluminum, a resin plate, or the like, and is a highly stretchable polymer resin sheet that deforms so as to follow the pushed thumbtack or the tip of the push pin. Also good. Thereby, it is possible to prevent a thumbtack, a push pin, and the like from reaching the latent heat storage material 20 from the surface 11 of the wall substrate 10.

  In addition to this, even if a thumbtack, a push pin, or the like instead of the protective member 40 reaches the latent heat storage material 20, a thumbtack, a push pin, etc. so that the latent heat storage material 20 does not come out of the storage recess 13. Rubber or sealant that seals the holes of the wall substrate 10 formed by the above may be disposed. Thereby, even if a thumbtack, a push pin, and the like reach the latent heat storage material 20 from the surface 11 of the wall substrate 10, crystallization / evaporation of the latent heat storage material 20 from the storage recess 13 can be suppressed.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various designs can be made without departing from the spirit of the present invention described in the claims. It can be changed.

1: Thermal storage wall panel 6: Large wall base material 7A: Column 7B: Spacer 10: Wall base material 11: Surface of base material for wall 12: Back surface of base material for wall 13: Storage recess 13a: Opening of storage recess 13b: Peripheral edge portion of the storage recess 17: Bottom surface of the storage recess 14: Upper wall surface 16 of the storage recess: Side wall surface 20 of the storage recess: Latent heat storage material 30: Back material 40: Protection member 31: Inlet port 32: Air vent hole 61 : Wall room side surface 62: Wall inner side surface 70: Fixing tool 72: Fixing through hole (fixing mark)
73: Lid 75: Surface decorative sheet

Claims (8)

A latent heat storage material, a base material for a wall formed with a storage recess for storing the latent heat storage material on the back surface, and a back material for covering the opening of the storage recess so as to seal the latent heat storage material in the storage recess A thermal storage wall panel comprising at least
In the arrangement state in which the heat storage wall panel is disposed, the bottom surface of the storage recess is so that the depth of the storage recess on the upper side of the heat storage wall panel is deeper than the depth of the storage recess on the lower side of the heat storage wall panel. The heat storage wall panel is inclined with respect to the back surface of the wall substrate. A latent heat storage material, a base material for a wall formed with a storage recess for storing the latent heat storage material on the back surface, and a back material for covering the opening of the storage recess so as to seal the latent heat storage material in the storage recess A thermal storage wall panel comprising at least
In the arrangement state in which the heat storage wall panel is arranged, a virtual plane extending along the depth direction of the storage recess is set so as to bisect the area of the opening of the storage recess in the vertical direction, When the storage space of the storage recess is divided by a virtual plane,
The heat storage wall panel, wherein the storage recess is formed such that a storage space above the virtual plane is larger than a storage space below the virtual plane.   In the arrangement state of the heat storage wall panel, the bottom surface of the storage recess is such that the depth of the storage recess on the upper side of the heat storage wall panel is deeper than the depth of the storage recess on the lower side of the heat storage wall panel. The thermal storage wall panel according to claim 2, wherein the thermal storage wall panel is inclined with respect to the back surface of the wall base material. A latent heat storage material, a base material for a wall formed with a storage recess for storing the latent heat storage material on the back surface, and a back material for covering the opening of the storage recess so as to seal the latent heat storage material in the storage recess A thermal storage wall panel comprising at least
In the arrangement state in which the heat storage wall panel is arranged, the storage recess has an area of a cut surface obtained by cutting at least a part of the storage space of the storage recess with a virtual plane extending along the depth direction of the storage recess. However, the heat storage wall panel is formed so as to decrease from the upper side to the lower side of the storage recess.   The heat storage wall panel according to any one of claims 1 to 4, wherein the latent heat storage material is obtained by pouring and solidifying a molten latent heat storage material so as to fill the storage recess. .   Of the wall surfaces forming the storage recesses in the arrangement state of the heat storage wall panel, the lower side wall surface continuously formed from the lower peripheral edge of the opening of the storage recesses is the base material for the wall. The thermal storage wall panel according to claim 1, wherein the thermal storage wall panel is inclined with respect to the back surface.   The heat storage wall panel according to claim 1, wherein a plurality of the storage recesses are formed on the back surface of the wall base material.   8. The fixing mark for fixing the heat storage wall panel is provided on the surface of the wall base material at a position removed from the storage recess. 8. Thermal storage wall panel as described.

Images