JP6357052B2 - Manufacturing method of wooden panel - Google Patents

Description

  The present invention relates to a method for manufacturing a wood panel using a latent heat storage material.

  So far, in the field of building materials such as wooden panels, from the viewpoint of environmental resistance, research and development that make more effective use of thermal energy generated during indoor heating and natural energy such as sunlight Energy conservation and ecological measures based on these research and development are being implemented. In view of such a point, development of a wood-based panel using a latent heat storage material capable of storing heat at a temperature equal to or higher than a melting point (phase change temperature) has been made.

  As a method for producing such a wood-based panel, for example, Patent Documents 1 and 2 propose a method for producing a wood-based floor material in which a latent heat storage material is disposed in a storage recess on the back surface of a wood-based substrate. In this manufacturing method, after filling the container according to the shape of the storage recessed part of a wooden base material with the latent heat storage material and sealing, this container is arrange | positioned in the storage recessed part of a wooden base material.

  According to the wood floor material manufactured by such a manufacturing method, since the latent heat storage material is sealed in the container, even if the latent heat storage material melts during heat storage, it may leak from the wooden base material. Absent.

JP 2012-167842 A JP2013-24001A

  However, when manufacturing a wood panel by the above-described method, after preparing a container according to the shape of the storage recess of the wooden base material in advance, this container is filled with a latent heat storage material and incorporated into the storage recess. Work was necessary, and it took time and effort.

  In particular, if a gap is formed between the container and the storage recess of the wooden base material, the heat storage efficiency of the latent heat storage material is hindered. However, in such a case, there is almost no margin for incorporation between the storage recess of the wooden base material and the container. For this reason, the operation | work which incorporates the container with which the latent heat storage material was filled in the storage recessed part of a wood type base material becomes still more difficult.

  The present invention has been made in view of such points, and the purpose of the present invention is that the molten latent heat storage material does not leak from the wooden base material, and the storage recess on the back surface of the wooden base material is used. An object of the present invention is to provide a method of manufacturing a wood panel that can easily store a latent heat storage material.

  In view of the above problems, a method for manufacturing a wood-based panel according to the first invention includes at least a latent heat storage material and a wood-based substrate on which a storage recess for storing the latent heat storage material on the back surface is formed. A method for producing a wood panel, comprising disposing a resin sheet mainly composed of a thermoplastic resin so as to cover the opening of the housing recess from the back surface of the wood substrate, and heating the resin sheet with a heater. Forming a resin molded body having a recess in which a part of the resin sheet follows the shape of the storage recess, and disposing the latent heat storage material in the recess of the resin molded body, Covering at least the sealing sheet from the back surface of the wooden base material to the opening of the recess, and sealing the latent heat storage material in the recess of the resin molded body with the sealing sheet. Features.

  According to the manufacturing method according to the first aspect of the present invention, the storage recess of the wood-based substrate is regarded as a resin sheet mold, and the resin sheet is molded by the heater so as to follow the shape of the storage recess, thereby forming a resin molded body. A latent heat storage material can be disposed in the recess of the resin molded body, and this can be sealed in the recess with a sealing sheet. Since the latent heat storage material is sealed by the resin molded body and the sealing sheet, it is possible to prevent the latent heat storage material from leaking out of the storage recess of the wooden base material.

  In this way, the latent heat storage material is stored in the storage recess without producing a container in which the latent heat storage material is sealed in advance as in the past and performing a series of operations for incorporating this into the wooden base material. The resin molded body can be molded, and the latent heat storage material can be easily sealed in the housing recess of the wooden base material with the sealing sheet together with the resin molded body.

  More preferably, in the step of arranging the latent heat storage material, the wood panel manufacturing method according to the first aspect of the invention includes pouring the latent heat storage material heated in a flowable state into the recess of the resin molded body, Lay out latent heat storage material.

  According to this aspect, by using the latent heat storage material heated in a flowable state, the latent heat storage material can be molded in accordance with the shape of the concave portion of the resin molded body. As a result, the latent heat storage material can be brought into contact with the wall surface of the concave portion of the resin molded body (a gap is hardly formed between the latent heat storage material and the resin molded body). Thermal conductivity can be increased.

  In a more preferred method for producing a wood panel according to the first aspect of the invention, an adhesive layer that melts by heating is formed on at least the surface of the wood substrate among the surfaces of the resin sheet, and the resin When the sheet is heated by the heater, the adhesive layer is melted by the heat of the heater, and the resin molded body is fused to the woody base material.

  According to this aspect, since the adhesive layer is melted by the heat of the heater and the resin molded body is fused to the wooden base material, the adhesion between the wooden base material and the resin molded body can be improved. Thereby, not only can the latent heat storage material and the wooden base material be integrated, but also the thermal conductivity between the latent heat storage material and the wooden base material can be increased via the resin molding. .

  Furthermore, in this specification, the manufacturing method of the wood type panel which concerns on 2nd invention is disclosed. A method for producing a wood panel according to the second invention is a production of a wood panel comprising at least a latent heat storage material and a wood substrate having a storage recess for storing the latent heat storage material on the back surface. In this method, a resin sheet containing a thermoplastic resin as a main component is disposed so as to cover the opening of the storage recess from the back surface of the wooden base material, and the resin sheet is heated until it becomes a flowable state. The latent heat storage material is formed in the concave portion of the resin molded body while forming a resin molded body having a recess in which a part of the resin sheet is made to follow the shape of the storage recess by heating with the latent heat storage material. A step of pouring, and a step of covering the sealing sheet from the back surface of the wooden base material to the opening of the recess, and sealing the latent heat storage material in the recess of the resin molded body with the sealing sheet. It is characterized by including at least.

  According to the manufacturing method according to the second aspect of the present invention, a resin sheet is formed into a resin molded body by using the heat of the heated latent heat storage material as if the housing concave portion of the wooden base material is regarded as a resin sheet mold. In addition, the latent heat storage material can be poured into the recess formed in the resin molded body. The latent heat storage material poured into the recess of the resin molded body can be sealed in the recess with a sealing sheet. Since the latent heat storage material is sealed by the resin molded body and the sealing sheet, it is possible to prevent the latent heat storage material from leaking out of the storage recess of the wooden base material.

  In this manner, a container in which the latent heat storage material is sealed as in the prior art is manufactured in advance, and the heat of the latent heat storage material is used without performing a series of operations such as incorporating it into the woody base material. A resin molded body in which the latent heat storage material is stored in the storage recess can be molded, and the latent heat storage material can be easily sealed in the storage recess of the wooden base material together with the resin molding.

  Here, in a more preferred embodiment of the method for producing a wood panel according to the second invention, an adhesive layer that melts by heating is formed on at least the surface of the wood substrate side among the surfaces of the resin sheet. When the latent heat storage material is poured into the concave portion of the resin molded body, the adhesive layer is melted by the heat of the latent heat storage material, and the resin molded body is fused to the wooden base material.

  According to this aspect, since the adhesive layer is melted by the heat of the latent heat storage material and the resin molded body is fused to the wooden base material, the adhesion between the wooden base material and the resin molded body can be improved. Thereby, not only can the latent heat storage material and the wooden base material be integrated, but also the thermal conductivity between the latent heat storage material and the wooden base material can be increased via the resin molding. .

  Furthermore, as a more preferable aspect according to the first and second inventions, the storage recess of the wooden base material is formed so as to spread from the bottom surface toward the opening. According to this aspect, since the storage recess is formed so as to spread from the bottom surface toward the opening, the resin sheet is easily traced to the entire wall surface of the storage recess by the heat of the heater or the latent heat storage material. Can be molded.

  According to the present invention, the latent heat storage material can be easily stored in the storage recess on the back surface of the wooden base material without the molten latent heat storage material leaking from the wooden base material.

As an embodiment of the wood panel according to the first invention, it is a schematic perspective view of a wood base material of a wood floor material, (a) is a perspective view of a wood base material on the floor (surface) side, (B) is a perspective view of a woody base material on the back side. It is typical sectional drawing for demonstrating the process of shape | molding the resin molding which concerns on embodiment of 1st invention using the wood type base material shown in FIG. 1, (a) is before shaping | molding of a resin molding. The figure which showed the state of (b), The figure which showed the state after shaping | molding of the resin molding. (A) is an enlarged view of the A part of FIG. 2 (a), (b) is an enlarged view of the B part of FIG.2 (b). It is typical sectional drawing for demonstrating the process of arrange | positioning the latent heat storage material which concerns on embodiment of 1st invention, (a) is the figure which showed the state in the middle of pouring a latent heat storage material into the recessed part of a resin molding. (B) is the figure which showed the state after pouring a latent-heat storage material into the resin molding of (a). It is typical sectional drawing for demonstrating the process of sealing the latent heat storage material which concerns on embodiment of 1st invention, (a) is the figure which showed the state before sealing of a latent heat storage material, (b) These are the figures which showed the state after sealing of a latent heat storage material. (A) is an enlarged view of the C section in FIG. 5 (a), and (b) is an enlarged view of the D section in FIG. 5 (b). The typical sectional view showing the state where the wood type flooring was arranged on the floor foundation surface via the heat source. It is typical sectional drawing for demonstrating the manufacturing method of the wood type flooring which concerns on 2nd invention, (a) is the figure which showed the state before pouring a latent heat storage material, (b) is a latent heat storage material. The figure which showed the state in the middle of pouring, (c) is the figure which showed the state after pouring a latent heat storage material. The figure which showed the state of the bottom face vicinity of the accommodation recessed part of a wood type base material shown in FIG.8 (c). It is typical sectional drawing for demonstrating the process of sealing the latent heat storage material which concerns on embodiment of 2nd invention, (a) is the figure which showed the state before sealing of a latent heat storage material, (b) These are the figures which showed the state after sealing of a latent heat storage material.

  The first and second aspects of the invention will be described below with reference to the drawings. Both of the first and second inventions are inventions of wood-based panels, comprising at least a latent heat storage material, and a wooden base material in which a storage recess for storing the latent heat storage material on the back surface is formed. A wood-based panel. In the embodiment shown below, a wooden floor material is exemplified as the wooden panel, and its manufacturing method is disclosed. For example, the wooden panel is a building material such as a wooden wall material and a wooden ceiling material. Also good.

<A. First Embodiment (First Invention)>
As an embodiment according to the following first invention, a method for producing a wooden floor material will be described. This manufacturing method includes three steps: (A-1) a molding step of the resin molded body, (A-2) an arrangement step of the latent heat storage material, and (A-3) a sealing step of the latent heat storage material.

  Before carrying out these steps, first, a wooden base material is prepared. FIG. 1 is a schematic perspective view of a wooden base material of a wooden floor material as an embodiment of a wooden panel according to the first invention, and (a) is a wooden base material on the floor (front surface) side. (B) is a perspective view of the woody base material on the back side.

  As shown in FIG. 1 (a), the woody base material 11 is a base material for ensuring at least the rigidity and strength of the flooring, and the material is a normal plywood made of hardwood or conifer, LVL, LVB. , Laminated materials, and laminates obtained by arbitrarily laminating them. In the present embodiment, as an example, the wood-based substrate 11 is made of plywood in which seven single plates are laminated. A surface decorative material such as oak material, birch material, beech material, teak material, and the like, and a synthetic surface synthetic resin sheet are attached to the surface 11a of the woody base material 11.

  A male real part 12 a and a female real part 12 b are formed on the periphery of the wooden base material 11. As shown in FIG. 3, the wooden flooring can be actually joined by engaging the male and female parts of the adjacent wooden base materials 11, 11.

  As shown in FIG. 1 (b), a storage recess 13 for storing the latent heat storage material 30 is formed on the back surface 11 b of the wooden base material 11. The housing recess 13 is dug from the back surface 11b of the wood base 11 so that the thickness from the surface 11a of the wood base 11 to the bottom surface 13b of the housing recess 13 remains at least 3 mm. For example, when the thickness of the woody base material 11 is 12 mm, the digging depth from the back surface 11b is set to 9 mm or less. Thereby, it can be set as the wooden system floor which does not open a hole by an impact without a sense of incongruity in a walk. In the case of building materials such as wood-based wall materials and wood-based ceiling materials, the remaining thickness may be 3 mm or less unless the panel itself is deformed.

  Further, the storage recess 13 of the wooden base material 11 is formed so as to expand from the bottom surface 13b toward the opening 13a, and the storage recess 13 is formed with a side wall surface 13c inclined from the bottom surface 13b to the opening 13a. (For example, see FIG. 2A described later).

(A-1) Molding process of resin molding The molding process of a resin molding is implemented using the wood-type base material 11 shown in FIG. FIG. 2 is a schematic cross-sectional view for explaining a step of molding a resin molded body according to the embodiment of the first invention using the woody base material shown in FIG. 1, and (a) is a resin molding. The figure which showed the state before shaping | molding of a body, (b) is the figure which showed the state after shaping | molding of a resin molding. 3A is an enlarged view of a portion A in FIG. 2A, and FIG. 3B is an enlarged view of a portion B in FIG.

  In this step, as shown in FIG. 2A, a resin sheet 20 mainly composed of a thermoplastic resin is disposed so as to cover the opening 13 a of the storage recess 13 from the back surface 11 b of the wooden base material 11. At this time, a heater 50 for thermoforming the resin sheet 20 is disposed on the back surface 11b side of the woody base material 11 on which the resin sheet 20 is disposed.

  Next, as shown in FIG. 2B, the resin sheet 20 is heated by the heater 50 to soften (melt) the resin sheet 20, and a part of the resin sheet 20 is copied to the shape of the storage recess 13. A resin molded body 21 having the recessed portion 23 is molded. Thus, in the present embodiment, the resin recess 20 of the wood base 11 is regarded as a mold for the resin sheet 20, and the resin sheet 20 is made to follow the bottom surface 13 b and the side wall surface 13 c of the storage recess 13 by the heater 50. The resin molded body 21 is molded.

  In the present embodiment, the storage recess 13 is formed so as to expand from the bottom surface 13 b toward the opening 13 a, so that the resin sheet 20 can easily follow the entire wall surface of the storage recess 13 by the heat of the heater 50. Can be molded.

  Specifically, the bottom wall portion 21b of the resin molded body 21 is formed so as to cover the bottom surface 13b of the storage recess portion 13, and the side wall portion 21c continuous to the bottom wall portion 21b so as to cover the side wall surface 13c of the storage recess portion 13. Is formed. Furthermore, a flange portion 21d that is continuous with the side wall portion 21c is formed so as to cover the peripheral edge portion of the opening 13a of the storage recess 13 (the back surface 11b of the woody base material 11). In the present embodiment, it is possible to obtain the resin molded body 21 in which the flange portion 21d is formed around the opening portion 21a.

  Here, in this embodiment, as shown in FIG. 3A, the resin sheet 20 is mainly composed of a thermoplastic resin in which adhesive layers 20A and 20C are laminated on both surfaces of a base material layer 20B made of a thermoplastic resin. This is a sheet. Examples of the thermoplastic resin constituting the base layer 20B of the resin sheet 20 include polyethylene terephthalate (PET) resin, polyethylene resin, polypropylene resin, vinyl chloride resin, styrene resin, nylon resin, fluorine resin, and the like. The material is not particularly limited as long as it can be thermoformed by the heater 50 described later.

  The materials constituting the adhesive layers 20A and 20C include ethylene vinyl acetate copolymer hot melt adhesive (EVA adhesive), modified olefin hot melt adhesive, moisture curable polyurethane hot melt adhesive, polyamide. Examples thereof include a solid adhesive (hot melt adhesive) that melts by heating, such as a hot melt adhesive, an ethylene vinyl alcohol hot melt adhesive, a polyethylene hot melt adhesive, and a polypropylene hot melt adhesive. Further, the melting point of the adhesive constituting the adhesive layers 20A and 20C is desirably lower than the melting point of the thermoplastic resin constituting the base layer 20B and higher than the melting point of the latent heat storage material.

  Here, according to the experiments by the inventors, the base material layer 20B of the resin sheet 20 is easily deformed when heated, and thus is preferably a polyethylene terephthalate (PET) resin or a nylon resin. Is selected, it is preferable to use an EVA adhesive for the adhesive layers 20A and 20C. When polyethylene terephthalate (PET) resin is used for the base material layer 20B, the base material layer 20B has a thickness of 15 μm, and the adhesive layers 20A and 20C made of EVA adhesive each have 70 μm. desirable. When nylon resin is used for the base material layer 20B, the base material layer 20B preferably has a thickness of 12 μm, and the adhesive layers 20A and 20C made of the EVA adhesive preferably have 70 μm. Thus, by making the thickness of the adhesive layers 20 </ b> A and 20 </ b> C thicker than the base material layer 20 </ b> B, the resin sheet 20 can be suitably bonded to the woody base material 11.

  In this manner, by providing the adhesive layer 20C on the resin sheet 20, the adhesive layer 20C is melted by the heat of the heater 50, and the adhesive layer 20C is exposed from the surface of the wood base 11 (the bottom surface 13b of the storage recess in the figure). The resin molded body 21 is fused to the woody base material 11. Thereby, the adhesiveness of the wood type base material 11 and the resin molding 21 can be improved. In this way, the thermal conductivity between the latent heat storage material 30 and the woody base material 11 described later can be enhanced via the resin molded body 21. Furthermore, by providing the adhesive layer 20A, the adhesive layer 20A can be bonded to the sealing sheet 40 in a sealing process described later.

(A-2) Latent Heat Storage Material Arrangement Step Next, after the resin molded body 21 is molded, the latent heat storage material 30 arrangement step is performed. FIG. 4 is a schematic cross-sectional view for explaining a process of arranging the latent heat storage material 30 according to the embodiment of the first invention. FIG. 4A shows the latent heat storage material 30 in the recess 23 of the resin molded body 21. The figure which showed the state in the middle of pouring, (b) is the figure which showed the state after pouring the latent heat storage material 30 into the resin molding 21 of (a).

  In this step, as shown in FIG. 4A, in the present embodiment, a supply nozzle 51 for supplying the latent heat storage material 30 from the opening 21a of the resin molded body 21 toward the recess 23 is disposed. The latent heat storage material 30 is poured into 23. Thereby, as shown in FIG.4 (b), the latent heat storage material 30 is filled into the recessed part 23 of the resin molding 21. FIG. Here, the latent heat storage material 30 injected from the supply nozzle 51 is a latent heat storage material heated to a temperature higher than the phase change temperature (heated to a flowable state).

  In this way, by using the latent heat storage material 30 heated in a flowable state, the latent heat storage material 30 can be molded in accordance with the shape of the recess 23 of the resin molded body 21. Thereby, the latent heat storage material 30 can be brought into contact with the wall surface of the recess 23 of the resin molded body 21 (a gap is hardly formed between the latent heat storage material 30 and the resin molded body 21). Thermal conductivity with the molded body 21 can be increased. Further, the adhesive layer 20 </ b> C of the resin molded body 21 can be further melted by the heat of the latent heat storage material 30, and can be reliably fused by the woody base material 11.

Such a latent heat storage material 30 is a latent heat storage material that changes phase by indoor heating (heat from a heat source described later), and preferably has a phase change temperature (melting point) in the range of 18 ° C to 30 ° C. It is. Specific examples include sodium sulfate hydrate, calcium chloride hydrate, paraffin (C ₁₈ H ₃₈ ), polyethylene glycol (molecular weight: 500 to 1000), and the like. The material is not particularly limited as long as it can store heat.

  In the present embodiment, the heated latent heat storage material 30 is poured into the concave portion 23 of the resin molded body 21. For example, a solid heat storage material that becomes a gel at a temperature higher than the phase change temperature of the latent heat storage material 30 is used. The latent heat storage material 30 may be arranged. Examples of such a latent heat storage material include sodium sulfate decahydrate, Calslip manufactured by JSR, high-viscosity capsule manufactured by Miki Riken Kogyo, and latent heat storage manufactured by Mitsubishi Cable Industries, Ltd. Materials MHSR series can be mentioned.

(A-3) Latent heat storage material sealing step Next, after the latent heat storage material is arranged, a latent heat storage material sealing step is performed. FIG. 5: is typical sectional drawing for demonstrating the process of sealing the latent heat storage material which concerns on embodiment of 1st invention, (a) is the figure which showed the state before sealing of a latent heat storage material (B) is the figure which showed the state after sealing of a latent-heat storage material. 6A is an enlarged view of a C portion in FIG. 5A, and FIG. 6B is an enlarged view of a D portion in FIG. 5B.

  In this step, as shown in FIG. 5A, the sealing sheet 40 is covered with the opening 21 a of the recess 23 from the back surface 11 b of the wooden base material 11, and the sealing sheet 40 covers the inside of the recess 23 of the resin molded body 21. The latent heat storage material 30 is sealed. In this way, as shown in FIG. 5B, the latent heat storage material 30 is sealed by the resin molded body 21 and the sealing sheet 40, so that the latent heat storage material 30 is stored in the storage recess 13 of the wooden base material 11. It can prevent that 30 leaks out.

  In this embodiment, as shown in FIG. 6A, the sealing sheet 40 is further laminated on the metal sheet layer 40A, the polymer resin layer 40B laminated on the metal sheet layer 40A, and the polymer resin layer 40B. This is a sheet made of the adhesive layer 40C.

  Examples of the metal material constituting the metal sheet layer 40A include aluminum foil and copper foil, and are particularly limited as long as they are excellent in thermal conductivity and flexible in the state of the sheet. is not.

  Examples of the material constituting the polymer resin layer 40B include polyethylene terephthalate (PET) resin, polypropylene resin, vinyl chloride resin, styrene resin, nylon resin, fluorine resin, and the like. As long as it acts as well and the adhesive strength with the metal sheet layer 40A can be secured, it is not particularly limited. Further, it is preferable that the polymer resin layer 40B is laminated on the metal sheet layer 40A. For example, an aluminum foil layer of 9 μm, a PET resin layer of 38 μm, and an EVA hot melt layer of 70 μm are preferably laminated.

  Further, the material constituting the adhesive layer 40C is not particularly limited as long as it can be bonded to the adhesive layer 20A of the resin sheet 20, and examples thereof include the adhesives exemplified in the above-described adhesive layers 20A and 20C. be able to.

  In this way, with the latent heat storage material 30 housed in the recess 23 of the resin molded body 21, the adhesive layer 40 </ b> C of the sealing sheet 40 is directed toward the back surface 11 b of the wooden substrate 11, and the recess is formed in the sealing sheet 40. 23 openings 21a are covered. Next, the sealing sheet 40 is pressurized and heated by the press machine 52 to bond the adhesive layer 40C of the sealing sheet 40 and the adhesive layer 20A of the flange 21d of the resin molded body 21. Thereby, the latent heat storage material 30 can be sealed in the recess 23 of the resin molded body 21.

  At this time, since the adhesive layer 20C of the flange portion 21d of the resin molded body 21 is also heated and pressurized by the press machine 52, a part of the adhesive layer 20C is impregnated from the back surface 11b of the wood base 11 and fused. Therefore, the resin molded body 21 can be reliably fixed by the wooden base material 11.

  Thus, according to the present embodiment, the container in which the latent heat storage material is sealed as in the prior art is manufactured in advance, and the inside of the storage recess 13 is performed without performing a series of operations for incorporating the container into the woody base material. The resin molded body 21 in which the latent heat storage material 30 is accommodated is molded, and the latent heat storage material 30 is easily sealed in the storage recess 13 of the wooden base material 11 with the sealing sheet 40 together with the resin molded body 21. Can do.

<How to use wooden flooring>
A method of using the wooden floor material obtained in this way will be briefly described. FIG. 7 is a schematic cross-sectional view showing a state in which the wooden floor material is arranged on the floor base surface through a heat source.

  As shown in FIG. 7, in the present embodiment, a plurality of wooden floor materials 10 are laid on the floor ground surface via a hot water mat 60. The hot water mat 60 includes a hot water tube 62 through which hot water is passed as a heat source, and a heat insulating material 61 that insulates heat from the hot water tube 62 to the floor base surface.

  The hot water tube 62 is housed in a groove formed in the heat insulating material 61 and is in contact with the metal sheet layer 40 </ b> A of the wooden floor material 10. Thus, according to the wooden flooring 10 according to the present embodiment, since the sealing sheet 40 has the metal sheet layer 40A, the heat of the hot water tube 62 is directly suitable for the latent heat storage material 30. Can be communicated to.

  Further, since the sealing sheet 40 is formed by laminating the polymer resin layer 40B on the metal sheet layer 40A, the polymer resin layer 40B acts as a reinforcing material for the metal sheet layer 40A, and therefore the sealing is made only from the metal sheet material It is harder to tear than the sheet, and leakage of the latent heat storage material 30 from the inside of the resin molded body 21 can be avoided. For example, in this embodiment, as shown in FIG. 7, the latent heat storage material is stored using hot water as a heat source, but the latent heat storage material may be stored using an electric heater as a heat source.

<B. Second Embodiment (Second Invention)>
Hereinafter, as an embodiment according to the second invention, a method for producing a wooden floor material will be described. This manufacturing method is composed of two steps: (B-1) a latent heat storage material pouring step and (B-2) a latent heat storage material sealing step. The manufacturing method of the present embodiment is different from the manufacturing method of the first embodiment described above in that (A-1) the molding step of the resin molded body of the first embodiment and (A-2) arrangement of the latent heat storage material. This is a point in which the process is simultaneously performed in the (B-1) latent heat storage material pouring process. Since the woody base material, latent heat storage material, and sealing material used in the present embodiment are the same as those used in the first embodiment, detailed description including the effects of using them will be omitted.

(B-1) Pouring process of latent heat storage material The casting process of a latent heat storage material is implemented using the wood-type base material 11 shown to Fig.1 (a), (b). FIG. 8 is a schematic cross-sectional view for explaining a method for producing a wooden floor material according to the second invention, wherein (a) is a diagram showing a state before pouring the latent heat storage material 30, (b). These are the figures which showed the state in the middle of pouring the latent heat storage material 30, (c) is the figure which showed the state after pouring the latent heat storage material 30. FIG. FIG. 9 is a view showing a state in the vicinity of the bottom surface of the storage recess 13 of the woody base material 11 shown in FIG.

  In this step, first, as shown in FIG. 8A, a resin sheet 20 mainly composed of a thermoplastic resin is disposed so as to cover the opening 13a of the storage recess 13 from the back surface 11b of the wooden base material 11. . Next, a supply nozzle 51 that supplies the latent heat storage material 30 toward the resin sheet 20 is disposed.

  Next, as shown in FIG. 8B, the latent heat storage material 30 heated from the supply nozzle 51 until it can flow is injected. At this time, the resin sheet 20 is thermally deformed by heating the resin sheet 20 with the latent heat storage material 30.

  Further, as shown in FIG. 8C, the latent heat storage material 30 is continuously injected. Thereby, the resin molding 21 which has the recessed part 23 which made a part of the resin sheet 20 follow the shape of the accommodation recessed part 13 is shape | molded. At the same time, the latent heat storage material 30 is poured into the recess 23 of the resin molded body 21 to fill the recess 23. Thus, in the present embodiment, unlike the first embodiment, the resin molded body 21 is molded with the heat of the heated latent heat storage material 30 without using a heater, and the concave portion of the resin molded body 21 is formed. 23 can be filled with the latent heat storage material 30.

  Similarly to the first embodiment, since the adhesive layer 20C is formed on the resin sheet 20 in the present embodiment, when the latent heat storage material 30 is poured into the recess 23 of the resin molded body 21, as shown in FIG. The adhesive layer 20 </ b> C is melted by the heat of the latent heat storage material 30, and the resin molded body 21 can be fused to the woody base material 11. Further, the adhesive layer 20 </ b> C can be impregnated inside the wooden base material 11 by the dead weight of the latent heat storage material 30.

  In this way, by using the latent heat storage material 30 heated to a flowable state, the resin molded body 21 is molded, and the latent heat storage material 30 is molded in accordance with the shape of the recess 23 of the resin molded body 21. be able to. Thereby, the latent heat storage material 30 can be brought into contact with the wall surface of the recess 23 of the resin molded body 21 (a gap is hardly formed between the latent heat storage material 30 and the resin molded body 21). Thermal conductivity with the molded body 21 can be increased. Further, the adhesive layer 20 </ b> A of the resin molded body 21 can be further melted by the heat of the latent heat storage material 30, and can be reliably fused by the woody base material 11.

(B-2) Latent heat storage material sealing step Next, the latent heat storage material sealing step is performed after the latent heat storage material pouring step. FIG. 10: is typical sectional drawing for demonstrating the process of sealing the latent heat storage material which concerns on embodiment of 2nd invention, (a) is the figure which showed the state before sealing of a latent heat storage material (B) is the figure which showed the state after sealing of a latent-heat storage material.

  This step is the same as the latent heat storage material sealing step shown in the first embodiment, and the latent heat storage material 30 is housed in the recess 23 of the resin molded body 21 as shown in FIG. The opening 21 a of the recess 23 is covered with the sealing sheet 40 with the adhesive layer of the sealing sheet 40 facing the back surface 11 b of the woody substrate 11.

  Next, as shown in FIG. 10 (b), the sealing sheet 40 is pressurized and heated by a press 52, and the adhesive layer of the sealing sheet 40 and the adhesive layer of the flange 21 d of the resin molded body 21 are Glue. Thereby, the latent heat storage material 30 can be sealed in the recess 23 of the resin molded body 21.

  Thus, since the latent heat storage material 30 is sealed by the resin molded body 21 and the sealing sheet 40, it is possible to prevent the latent heat storage material 30 from leaking out of the storage recess 13 of the wooden base material 11. it can.

  According to the present embodiment, the latent heat storage material 30 is sealed in the storage recess 13 without performing a series of operations such as manufacturing a container in which the latent heat storage material is sealed in advance and incorporating the same into a wooden base material. Can be molded, and the latent heat storage material 30 can be easily sealed in the housing recess 13 of the wood-based substrate 11 with the sealing sheet 40 together with the resin molded body 21.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various designs can be made without departing from the spirit of the present invention described in the claims. It can be changed.

  10: wood flooring, 11: wood base, 11a: surface of wood base, 11b: back of wood base, 12a: male part, 12b: female part, 13: storage recess, 13a : Opening of storage recess, 13b: Bottom surface of storage recess, 13c: Side wall surface of storage recess, 20: Resin sheet, 20a: Opening of resin sheet, 20A, 20C: Adhesive layer, 20B: Base material layer, 21: Resin molding, 21b: bottom wall part, 21c: side wall part, 21d: collar part, 30: latent heat storage material, 40: sealing sheet, 40A: metal sheet layer, 40B: polymer resin layer, 40C: adhesive layer, 50: heater, 51: supply nozzle, 52: press machine, 60: hot water mat, 61: heat insulating material, 62: hot water tube

Claims (5)

A method for producing a wood panel comprising at least a latent heat storage material and a wood substrate having a storage recess for storing the latent heat storage material on the back surface,
The manufacturing method of the said wood type panel arrange | positions the resin sheet which has a thermoplastic resin as a main component so that the opening part of the said storage recessed part may be covered from the back surface of the said wood type base material, and this resin sheet is heated with a heater. Forming a resin molded body having a recess in which a part of the resin sheet is made to follow the shape of the storage recess;
Arranging the latent heat storage material in the recess of the resin molded body;
In which the cover encapsulating sheet to the opening of the recess from the rear surface of the wood-based substrate, comprising at least a step of sealing the latent heat storage material in the recess of the resin molded body by the sealing sheet Yes,
In the step of arranging the latent heat storage material, the latent heat storage material heated to be in a flowable state is poured into the concave portion of the resin molded body to arrange the latent heat storage material, or phase change as the latent heat storage material. A method for producing a wood-based panel, wherein a solid latent heat storage material is disposed in the recess of the resin molded body using a latent heat storage material that becomes a gel at a temperature or higher . Of the surface of the resin sheet, at least the surface of the wood-based substrate side is formed with an adhesive layer that melts by heating,
When heating the resin sheet in the heater, wood of claim 1 by melting the adhesive layer by the heat of the heater, characterized by fusing the resin molded body into the woody substrate Method of manufacturing a panel. A method for producing a wood panel comprising at least a latent heat storage material and a wood substrate having a storage recess for storing the latent heat storage material on the back surface,
A latent heat storage material in which a resin sheet mainly composed of a thermoplastic resin is disposed so as to cover the opening of the storage recess from the back surface of the wooden base material, and the resin sheet is heated until it is in a flowable state. Pouring the latent heat storage material into the concave portion of the resin molded body while forming a resin molded body having a concave portion in which a part of the resin sheet follows the shape of the housing concave portion by heating.
Covering at least the sealing sheet from the back surface of the wooden base material to the opening of the recess, and sealing the latent heat storage material in the recess of the resin molded body with the sealing sheet. A manufacturing method of a wood-based panel characterized by Of the surface of the resin sheet, at least the surface of the wood-based substrate side is formed with an adhesive layer that melts by heating,
When the latent heat storage material is poured into the concave portion of the resin molded body, the adhesive layer is melted by the heat of the latent heat storage material, and the resin molded body is fused to the wooden base material. Item 4. A method for producing a woody panel according to Item 3 . The method for producing a wood-based panel according to any one of claims 1 to 4 , wherein the storage recess of the wood-based base material is formed so as to spread from the bottom surface toward the opening.

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