TW201809868A - Curable composition, cured film, color filter, light blocking film, solid-state imaging element, image display device, and method for producing cured film - Google Patents

Curable composition, cured film, color filter, light blocking film, solid-state imaging element, image display device, and method for producing cured film Download PDF

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TW201809868A
TW201809868A TW106116203A TW106116203A TW201809868A TW 201809868 A TW201809868 A TW 201809868A TW 106116203 A TW106116203 A TW 106116203A TW 106116203 A TW106116203 A TW 106116203A TW 201809868 A TW201809868 A TW 201809868A
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curable composition
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TWI740942B (en
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森下裕行
浜田大輔
水野明夫
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富士軟片股份有限公司
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02Polythioethers
    • C08G75/04Polythioethers from mercapto compounds or metallic derivatives thereof
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02Polythioethers
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/02Elements
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    • C08K3/28Nitrogen-containing compounds
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
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    • C08K5/17Amines; Quaternary ammonium compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
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    • C08K5/32Compounds containing nitrogen bound to oxygen
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02Polythioethers; Polythioether-ethers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029

Abstract

Provided are: a curable composition which enables the achievement of a cured film that has an excellent pattern shape, while maintaining excellent light blocking properties; a cured film; a color filter; a light blocking film; a solid-state imaging element; an image display device; and a method for producing a cured film. This curable composition contains a coloring agent, a photopolymerization initiator, a polymerizable compound and a polyfunctional thiol compound; and a cured film which is obtained by curing this curable composition has an optical density of 4.0 or more per a film thickness of 1.5 [mu]m in the visible light region.

Description

硬化性組成物、硬化膜、彩色濾光片、遮光膜、固體攝像元件、圖像顯示裝置及硬化膜的製造方法Curable composition, cured film, color filter, light-shielding film, solid-state imaging element, image display device, and method for producing cured film

本發明是有關一種硬化性組成物、硬化膜、彩色濾光片、遮光膜、固體攝像元件、圖像顯示裝置及硬化膜的製造方法。The present invention relates to a method for manufacturing a curable composition, a cured film, a color filter, a light-shielding film, a solid-state imaging device, an image display device, and a cured film.

液晶顯示裝置中使用之彩色濾光片中,為了遮蔽著色像素之間的光,並提高對比度等,具備有被稱作黑矩陣之遮光膜。 並且,固體攝像元件中,為了防止產生噪點、提高畫質等而設置有遮光膜。當前,行動電話及PDA(Personal Digital Assistant,個人數位助理)等電子設備的便攜終端上搭載有小型且薄型的攝像單元。該等攝像單元通常具備CCD(Charge Coupled Device,電荷耦合元件)圖像感測器及CMOS(Complementary Metal-Oxide Semiconductor,互補金屬氧化物半導體)圖像感測器等固體攝像元件及用於在固體攝像元件上形成被攝體像的透鏡。A color filter used in a liquid crystal display device is provided with a light-shielding film called a black matrix in order to block light between colored pixels and improve contrast. In addition, a solid-state imaging device is provided with a light-shielding film in order to prevent noise, improve image quality, and the like. At present, portable terminals of electronic devices such as mobile phones and PDAs (Personal Digital Assistants) are equipped with small and thin camera units. These imaging units usually include solid-state imaging elements such as CCD (Charge Coupled Device) image sensors and CMOS (Complementary Metal-Oxide Semiconductor) image sensors, as well as A lens that forms a subject image on the imaging element.

專利文獻1中記載有一種遮光膜形成用組成物,「一種遮光膜形成用組成物,其特徵為,包含可形成配置於固體攝像元件的有效像素區域(攝像部)的周緣之塗膜,且平均粒徑為40nm以下之黑色著色劑及樹脂成分」,且「黑色著色劑包含碳黑、鈦黑中的至少一種」。 [先前技術文獻] [專利文獻]Patent Document 1 describes a composition for forming a light-shielding film, "a composition for forming a light-shielding film, comprising a coating film capable of forming a periphery of an effective pixel region (imaging section) of a solid-state imaging element, and A black colorant and resin component having an average particle diameter of 40 nm or less "and" a black colorant contains at least one of carbon black and titanium black ". [Prior Art Literature] [Patent Literature]

[專利文獻1]:日本特開2006-156801號公報[Patent Document 1]: Japanese Patent Laid-Open No. 2006-156801

本發明人等對使專利文獻1中記載之遮光膜形成用組成物硬化來獲得之遮光膜進行了深入研究,其結果,確認到其雖然具有優異之遮光性,但所獲得之圖案形狀中存在進一步改善的餘地。具體而言,確認到使專利文獻1中記載之遮光膜形成用組成物硬化來獲得之遮光膜中,與其中心部的膜厚相比,有時端部的膜厚變小。The present inventors conducted intensive studies on a light-shielding film obtained by curing the composition for forming a light-shielding film described in Patent Document 1, and as a result, it was confirmed that although it has excellent light-shielding properties, the obtained pattern shape exists Room for further improvement. Specifically, it was confirmed that in the light-shielding film obtained by curing the light-shielding film-forming composition described in Patent Document 1, the film thickness at the end portion may be smaller than the film thickness at the center portion.

本發明的課題在於提供一種能夠獲得維持優異之遮光性,並且具有優異之圖案形狀之硬化膜之硬化性組成物。 並且,本發明的課題還在於提供一種使用上述硬化性組成物來獲得之硬化膜、包含上述硬化膜之彩色濾光片、遮光膜、固體攝像元件及圖像顯示裝置、以及硬化膜的製造方法。An object of the present invention is to provide a curable composition that can obtain a cured film that maintains excellent light shielding properties and has an excellent pattern shape. Another object of the present invention is to provide a cured film obtained using the curable composition, a color filter including the cured film, a light-shielding film, a solid-state imaging device and an image display device, and a method for producing a cured film. .

本發明人等為了實現上述課題而進行了深入研究。其結果,發現下述硬化性組成物能夠解決上述課題,並完成了本發明,前述硬化性組成物含有著色劑、光聚合起始劑、聚合性化合物及多官能硫醇化合物,其中,使硬化性組成物硬化來獲得之硬化膜在可見光區域中的每1.5μm的膜厚的光學濃度為4.0以上。 亦即,發現藉由以下結構能夠實現上述課題。The present inventors have conducted intensive studies in order to achieve the above-mentioned problems. As a result, it has been found that the above-mentioned curable composition can solve the above-mentioned problems and has completed the present invention. The curable composition contains a colorant, a photopolymerization initiator, a polymerizable compound, and a polyfunctional thiol compound. The optical density of the cured film obtained by curing the sexual composition per 1.5 μm in the visible light region is 4.0 or more. That is, it was found that the above-mentioned problem can be achieved by the following configuration.

[1]一種硬化性組成物,其含有著色劑、光聚合起始劑、聚合性化合物及多官能硫醇化合物,其中,使硬化性組成物硬化來獲得之硬化膜在可見光區域的每1.5μm的膜厚的光學濃度為4.0以上。 [2]如[1]所述之硬化性組成物,其中,相對於硬化性組成物的總固體成分,著色劑的含量為55質量%以上。 [3]如[1]或[2]所述之硬化性組成物,其中,相對於著色劑的含量,多官能硫醇化合物的含量為1~5.5質量%。 [4]如[1]至[3]中任一項所述之硬化性組成物,其還含有聚合抑制劑。 [5]如[4]所述之硬化性組成物,其中,相對於多官能硫醇化合物的含量,聚合抑制劑的含量為0.1~1.5質量%。 [6]如[4]或[5]所述之硬化性組成物,其中,聚合抑制劑含有酚系化合物。 [7]如[4]至[6]中任一項所述之硬化性組成物,其中,聚合抑制劑含有2種以上的酚系化合物。 [8]如[4]至[7]中任一項所述之硬化性組成物,其中,聚合抑制劑含有受阻胺系化合物。 [9]如[1]至[8]中任一項所述之硬化性組成物,其中,著色劑為無機顏料。 [10]如[9]所述之硬化性組成物,其中,無機顏料包含選自由氮化鈦、氮氧化鈦、氮化鈮、氮化釩、含有銀或錫之金屬顔料、以及含有銀及錫之金屬顔料所組成之群組之至少一種。 [11]如[1]至[10]中任一項所述之硬化性組成物,其中,多官能硫醇化合物是具有2個以上的以式(1)表示之基團之化合物。 [12]如[1]至[11]中任一項所述之硬化性組成物,其中,多官能硫醇化合物為3官能以上。 [13]如[1]至[12]中任一項所述之硬化性組成物,其中,多官能硫醇化合物為選自由季戊四醇四(3-巰基丙酸酯)及三羥甲基丙烷三(3-巰基丙酸酯)所組成之群組之至少一種。 [14]如[1]至[13]中任一項所述之硬化性組成物,其中,相對於硬化性組成物的總固體成分,光聚合起始劑的含量為超過1質量%且小於10質量%。 [15]如[1]至[14]中任一項所述之硬化性組成物,其中,相對於硬化性組成物的總固體成分,聚合性化合物的含量為超過3.5質量%且小於20質量%。 [16]如[1]至[15]中任一項所述之硬化性組成物,其還含有分散劑,相對於硬化性組成物的總固體成分,分散劑的含量為17質量%以上。 [17]如[1]至[16]中任一項所述之硬化性組成物,其中,光聚合起始劑為肟化合物。 [18]一種硬化膜,其使[1]至[17]中任一項所述之硬化性組成物硬化來獲得。 [19]一種彩色濾光片,其含有[18]所述之硬化膜。 [20]一種遮光膜,其含有[18]所述之硬化膜。 [21]一種固體攝像元件,其含有[18]所述之硬化膜。 [22]一種圖像顯示裝置,其含有[18]所述之硬化膜。 [23]一種硬化膜的製造方法,其含有:使用[1]至[17]中任一項所述之硬化性組成物,在支撐體上形成硬化性組成物層之硬化性組成物層形成製程;及對硬化性組成物層進行曝光之曝光製程。 [24]如[23]所述之硬化膜的製造方法,其中,曝光製程中的硬化性組成物層的曝光量為200mJ/cm2 以上。 [25]如[23]或[24]所述之硬化膜的製造方法,其中,硬化性組成物層形成製程包含在支撐體上直接塗佈硬化性組成物,從而在支撐體上形成硬化性組成物層之塗佈製程。 [26]如[23]至[25]中任一項所述之硬化膜的製造方法,其還含有:對所曝光之硬化性組成物層進行顯影之顯影製程;及清洗所顯影之硬化性組成物層之清洗製程。 [發明效果][1] A curable composition containing a colorant, a photopolymerization initiator, a polymerizable compound, and a polyfunctional thiol compound, wherein a cured film obtained by curing the curable composition per 1.5 μm in a visible light region The optical density of the film thickness is 4.0 or more. [2] The curable composition according to [1], wherein the content of the colorant is 55% by mass or more based on the total solid content of the curable composition. [3] The curable composition according to [1] or [2], wherein the content of the polyfunctional thiol compound is 1 to 5.5% by mass based on the content of the colorant. [4] The curable composition according to any one of [1] to [3], further comprising a polymerization inhibitor. [5] The curable composition according to [4], wherein the content of the polymerization inhibitor is 0.1 to 1.5% by mass based on the content of the polyfunctional thiol compound. [6] The curable composition according to [4] or [5], wherein the polymerization inhibitor contains a phenolic compound. [7] The curable composition according to any one of [4] to [6], wherein the polymerization inhibitor contains two or more phenolic compounds. [8] The curable composition according to any one of [4] to [7], wherein the polymerization inhibitor contains a hindered amine compound. [9] The curable composition according to any one of [1] to [8], wherein the colorant is an inorganic pigment. [10] The curable composition according to [9], wherein the inorganic pigment comprises a metal pigment selected from the group consisting of titanium nitride, titanium oxynitride, niobium nitride, vanadium nitride, a metal pigment containing silver or tin, and silver and tin. At least one of the group consisting of metallic pigments of tin. [11] The curable composition according to any one of [1] to [10], wherein the polyfunctional thiol compound is a compound having two or more groups represented by formula (1). [12] The curable composition according to any one of [1] to [11], wherein the polyfunctional thiol compound is trifunctional or higher. [13] The curable composition according to any one of [1] to [12], wherein the polyfunctional thiol compound is selected from the group consisting of pentaerythritol tetrakis (3-mercaptopropionate) and trimethylolpropane tri At least one of the group consisting of (3-mercaptopropionate). [14] The curable composition according to any one of [1] to [13], wherein the content of the photopolymerization initiator is more than 1% by mass and less than the total solid content of the curable composition. 10% by mass. [15] The curable composition according to any one of [1] to [14], wherein the content of the polymerizable compound is more than 3.5% by mass and less than 20% by mass relative to the total solid content of the curable composition. %. [16] The curable composition according to any one of [1] to [15], further containing a dispersant, and the content of the dispersant is 17% by mass or more based on the total solid content of the curable composition. [17] The curable composition according to any one of [1] to [16], wherein the photopolymerization initiator is an oxime compound. [18] A cured film obtained by curing the curable composition according to any one of [1] to [17]. [19] A color filter comprising the cured film according to [18]. [20] A light-shielding film comprising the cured film according to [18]. [21] A solid-state imaging device comprising the cured film according to [18]. [22] An image display device comprising the cured film according to [18]. [23] A method for producing a cured film, comprising using the curable composition according to any one of [1] to [17] to form a curable composition layer on a support to form a curable composition layer. A manufacturing process; and an exposure process for exposing the hardenable composition layer. [24] The method for producing a cured film according to [23], wherein the exposure amount of the curable composition layer in the exposure process is 200 mJ / cm 2 or more. [25] The method for producing a cured film according to [23] or [24], wherein the process of forming a hardenable composition layer includes directly applying a hardenable composition on a support to form hardenability on the support. Coating process of the composition layer. [26] The method for producing a cured film according to any one of [23] to [25], further comprising: a developing process of developing the exposed hardenable composition layer; and cleaning the developed hardenability Process for cleaning the composition layer. [Inventive effect]

依本發明,能夠提供一種能夠獲得維持優異之遮光性,並且具有優異之圖案形狀之硬化膜之硬化性組成物。 依本發明,還能夠提供一種使用上述硬化性組成物獲得之硬化膜、包含上述硬化膜之彩色濾光片、遮光膜、固體攝像元件及圖像顯示裝置、以及硬化膜的製造方法。According to the present invention, it is possible to provide a curable composition capable of obtaining a cured film that maintains excellent light shielding properties and has an excellent pattern shape. According to the present invention, it is also possible to provide a cured film obtained using the curable composition, a color filter including the cured film, a light-shielding film, a solid-state imaging device and an image display device, and a method for producing a cured film.

以下,對本發明進行詳細說明。 如下記載之構成要件的說明有時基於本發明的代表性實施態樣進行,但本發明並不限定於該種實施態樣。 另外,本說明書中,利用「~」表示之數值範圍表示作為下限值及上限值包含記載於「~」前後之數值之範圍。 並且,本說明書之基團(原子團)的標記中,未標取代及未取代的標記是包含不含有取代基者和含有取代基者之者。例如,「烷基」是不僅包含不具有取代基之烷基(未取代烷基),還包含具有取代基之烷基(取代烷基)者。 並且,本說明書中之「光化射線」或「放射線」表示例如水銀燈的明線光譜及以準分子雷射為代表之遠紫外線、極紫外線(EUV:Extreme ultraviolet lithography光)、X射線以及電子束等。並且,本說明書中,「光」表示光化射線及放射線。本說明書中之「曝光」只要沒有特別規定,除了利用水銀燈的明線光譜及以準分子雷射為代表之遠紫外線、X射線、以及EUV光等進行之曝光之外,還包含利用電子束及離子束等粒子束進行之描繪。 並且,本說明書中,「(甲基)丙烯酸酯」表示丙烯酸酯及甲基丙烯酸酯。並且,本說明書中,「(甲基)丙烯酸」表示丙烯酸及甲基丙烯酸。並且,本說明書中,「(甲基)丙烯醯基」表示丙烯醯基及甲基丙烯醯基。並且,本說明書中,「(甲基)丙烯醯胺」表示丙烯醯胺及甲基丙烯醯胺。並且,本說明書中,「單體」與「單體(monomer)」的含義相同。單體與低聚物及聚合物有所區別,指重量平均分子量為2,000以下的化合物。本說明書中,聚合性化合物指含有聚合性基團之化合物,可以是單體,亦可以是聚合物。聚合性基團指參與聚合反應之基團。Hereinafter, the present invention will be described in detail. The description of the constituent elements described below may be made based on a representative embodiment of the present invention, but the present invention is not limited to this embodiment. In addition, in this specification, a numerical range indicated by "~" means a range including numerical values described before and after "~" as a lower limit value and an upper limit value. In addition, among the marks of a group (atomic group) in the present specification, unlabeled substitutions and unsubstituted marks include those containing no substituents and those containing substituents. For example, "alkyl" includes not only an alkyl group (unsubstituted alkyl group) having no substituent, but also an alkyl group (substituted alkyl group) having a substituent. In addition, "actinic rays" or "radiation" in this specification means, for example, a bright line spectrum of a mercury lamp, and extreme ultraviolet (EUV: Extreme ultraviolet lithography light), X-ray, and electron beams represented by an excimer laser. Wait. In this specification, "light" means actinic rays and radiation. As long as "exposure" in this manual is not specified, in addition to exposure using the bright-line spectrum of a mercury lamp and far-ultraviolet rays, X-rays, and EUV light represented by an excimer laser, the use of electron beams and Drawing by particle beams such as ion beams. In addition, in this specification, "(meth) acrylate" means an acrylate and a methacrylate. In addition, in this specification, "(meth) acrylic acid" means acrylic acid and methacrylic acid. In the present specification, "(meth) acrylfluorenyl" means acrylfluorenyl and methacrylfluorenyl. In addition, in this specification, "(meth) acrylamide" means acrylamide and methacrylamide. In addition, in this specification, "monomer" and "monomer" have the same meaning. A monomer is different from an oligomer and a polymer, and refers to a compound having a weight average molecular weight of 2,000 or less. In the present specification, the polymerizable compound refers to a compound containing a polymerizable group, and may be a monomer or a polymer. A polymerizable group refers to a group that participates in a polymerization reaction.

[硬化性組成物] 硬化性組成物含有著色劑、光聚合起始劑、聚合性化合物及多官能硫醇化合物,使硬化性組成物硬化來獲得之硬化膜在可見光區域中的每1.5μm的膜厚的光學濃度為4.0以上。 依具有該種結構之上述硬化性組成物,能夠獲得維持優異之遮光性,並且具有優異之圖案形狀之硬化膜(以下,還稱作「本發明的效果」)。 藉由上述硬化性組成物可獲得本發明的效果之機理雖不明確,但本發明人等推斷如下。另外,並不藉由以下推斷限定上述硬化性組成物發揮本發明的效果之機理。[Sclerosing composition] The sclerosing composition contains a colorant, a photopolymerization initiator, a polymerizable compound, and a polyfunctional thiol compound, and the cured film obtained by curing the sclerosing composition is 1.5 μm in the visible light region. The optical thickness of the film thickness is 4.0 or more. According to the curable composition having such a structure, a cured film (hereinafter, also referred to as "effect of the present invention") having an excellent pattern shape while maintaining excellent light shielding properties can be obtained. Although the mechanism by which the effect of this invention is obtained with the said hardenable composition is not clear, the present inventors etc. inferred as follows. In addition, the mechanism by which the above-mentioned curable composition exerts the effects of the present invention is not limited by the following estimation.

包含碳黑等著色劑且不包含多官能硫醇化合物之以往公知的硬化性組成物能夠遍及較寬的波長區域而獲得較高的遮光濃度,故被廣泛利用。但是,硬化性組成物層的光學濃度(還稱作OD:optical density)從長波長側向短波長側逐漸變高,與長波長側相比,短波長區域的光學濃度極高。故,例如藉由g射線、h射線及i射線等紫外區域的光對硬化性組成物層進行圖案曝光時,有時光並未到達硬化性組成物層內部,曝光不充分而圖案形狀變差。 藉由上述,利用按每個製程示意地示出硬化膜的製造製程之圖1~6,對圖案形狀變差之機理進行說明。首先,圖1~3是按每個製程示意地示出使用不包含多官能硫醇之硬化性組成物之硬化膜的製造製程之剖面圖。 首先,如圖1所示,支撐體101上,使用硬化性組成物形成有硬化性組成物層102。接著,通過光罩103的開口部,硬化性組成物層102被曝光(圖1中,箭頭表示光的照射方向,A-B線是光罩的開口部的一端的延長線。以下相同。)。接著,上述曝光之後的硬化性組成物層102被顯影,形成圖案狀的硬化膜201。 上述步驟中的曝光時,硬化性組成物層102的光學濃度較高,故在曝光時光不易到達硬化性組成物層102內部,在硬化性組成物層102的下部,曝光變得不充分。如此一來,若進行顯影,則在硬化性組成物層102中的曝光並不充分之部分,導致硬化性組成物的溶出(圖2)。若在該種狀態下進行加熱硬化膜201之後烘烤處理,則在顯影時溶出之部分中,產生被稱作「受熱下垂」之不良情況。亦即,推斷為在所獲得之後烘烤之後的硬化膜301的端部,膜厚比中央部減少(圖3)。A conventionally known curable composition containing a colorant such as carbon black and not containing a polyfunctional thiol compound can be used widely because it can obtain a high light-shielding concentration over a wide wavelength region. However, the optical density (also referred to as OD: optical density) of the curable composition layer gradually increases from the long wavelength side to the short wavelength side, and the optical density in the short wavelength region is extremely higher than that in the long wavelength side. Therefore, for example, when pattern-exposing the curable composition layer with light in the ultraviolet region such as g-rays, h-rays, and i-rays, the light may not reach the interior of the curable composition layer, and the exposure may be insufficient and the pattern shape may be deteriorated. Based on the above, the mechanism of the deterioration of the pattern shape will be described using FIGS. 1 to 6 which schematically show the manufacturing process of the cured film for each process. First, FIGS. 1 to 3 are cross-sectional views schematically showing a manufacturing process of a cured film using a curable composition not containing a polyfunctional thiol for each process. First, as shown in FIG. 1, a curable composition layer 102 is formed on a support 101 using a curable composition. Next, the hardening composition layer 102 is exposed through the opening of the photomask 103 (in FIG. 1, arrows indicate the direction of light irradiation, and the line A-B is an extension of one end of the opening of the photomask. The same applies hereinafter.). Next, the curable composition layer 102 after the exposure is developed to form a patterned cured film 201. During the exposure in the above steps, the optical density of the curable composition layer 102 is high. Therefore, light does not easily reach the inside of the curable composition layer 102 during exposure, and the exposure becomes insufficient under the curable composition layer 102. In this way, if development is performed, exposure to the hardenable composition layer 102 is insufficient, and the hardenable composition is dissolved out (FIG. 2). If a baking process is performed after the heat-cured film 201 is heated in this state, a problem called "sags due to heat" occurs in a portion eluted during development. That is, it is presumed that the thickness of the end portion of the cured film 301 after being obtained after baking is reduced compared to the center portion (FIG. 3).

圖4~6是按每個製程示意地示出使用本發明的硬化性組成物之硬化膜的製造製程之剖面圖。 首先,如圖4所示,支撐體101上,使用本發明的硬化性組成物形成有硬化性組成物層401。接著,通過光罩103的開口部,硬化性組成物層401被曝光。 此時,硬化性組成物層401含有多官能硫醇化合物,故藉由以下的理由,推斷為充分硬化至硬化性組成物層401內部。 在被曝光之硬化性組成物層401的內部,藉由光聚合起始劑,開始自由基聚合反應。此時,藉由光聚合起始劑產生之自由基與硬化性組成物層401內的氧發生反應,有時會產生過氧自由基。過氧自由基不具有進行聚合反應之作用,故聚合反應在此停止。 另一方面,硬化性組成物層401中存在多官能硫醇化合物時,多官能硫醇化合物中的硫醇基向過氧自由基供給氫,藉此生成不易受氧引起之聚合失活之硫自由基,聚合反應得以進行。故,推斷為含有多官能硫醇化合物之上述硬化性組成物是易充分硬化至硬化性組成物層401內部者。 並且,使上述硬化性組成物硬化來獲得之硬化膜在可見光區域中的每1.5μm的膜厚的光學濃度為4.0以上,硬化性組成物層401的遮光性較高。 通常,通過光罩103的開口部而照射於硬化性組成物層401之光在光罩103的開口部繞射,還照射於比A-B線更靠外側之遮罩遮光部分402(將此稱作「漏光」。)。若硬化性組成物層的遮光性較低,則由於漏光,曝光至罩遮光部的硬化性組成物層,導致圖案形狀變差。 但是,硬化性組成物層401的遮光性較高,故漏光不會對遮罩遮光部分402進行曝光而被吸收(圖4)。 故,若對上述曝光之後的硬化膜進行顯影,則充分硬化至內部,且在光罩的開口部繞射之光被吸收,故可獲得具有優異之圖案形狀之硬化膜501(圖5)。推斷為該硬化膜501中,即使在進行後烘烤處理之後亦不易產生「受熱下垂」,故後烘烤之後的硬化膜601的中央部與端部之間的膜厚差變小,具有優異之圖案形狀(圖6)。4 to 6 are cross-sectional views schematically showing a manufacturing process of a cured film using the curable composition of the present invention for each process. First, as shown in FIG. 4, a curable composition layer 401 is formed on a support 101 using the curable composition of the present invention. Then, the hardening composition layer 401 is exposed through the opening of the photomask 103. At this time, since the curable composition layer 401 contains a polyfunctional thiol compound, it is presumed to be sufficiently cured to the inside of the curable composition layer 401 for the following reasons. In the exposed hardenable composition layer 401, a radical polymerization reaction is started by a photopolymerization initiator. At this time, radicals generated by the photopolymerization initiator react with oxygen in the hardenable composition layer 401, and peroxy radicals may be generated. The peroxy radical does not have the effect of carrying out the polymerization reaction, so the polymerization reaction stops here. On the other hand, when a polyfunctional thiol compound is present in the hardenable composition layer 401, a thiol group in the polyfunctional thiol compound supplies hydrogen to a peroxy radical, thereby generating sulfur that is not easily deactivated by polymerization due to oxygen. Free radicals, polymerization can proceed. Therefore, it is presumed that the above-mentioned curable composition containing a polyfunctional thiol compound is one which is easily cured sufficiently to the inside of the curable composition layer 401. In addition, the optical density of the cured film obtained by hardening the curable composition per 1.5 μm in the visible light region is 4.0 or more, and the light-shielding property of the curable composition layer 401 is high. Generally, the light irradiated on the hardening composition layer 401 through the opening of the mask 103 is diffracted at the opening of the mask 103 and also irradiates the mask light-shielding portion 402 (referred to as this "Light leak."). When the light-shielding property of the curable composition layer is low, the shape of the pattern is deteriorated due to light leakage and exposure to the hardenable composition layer of the cover light-shielding portion. However, since the light-shielding property of the curable composition layer 401 is high, light leakage is not absorbed by the exposure of the light-shielding portion 402 (FIG. 4). Therefore, if the cured film after the exposure is developed, the cured film is sufficiently cured to the inside and the light diffracted at the opening of the photomask is absorbed, so that a cured film 501 having an excellent pattern shape can be obtained (FIG. 5). It is inferred that in this cured film 501, "heating sagging" does not easily occur even after the post-baking treatment, so the film thickness difference between the central portion and the end portion of the cured film 601 after post-baking is small, and it is excellent Pattern shape (Figure 6).

〔光學濃度(OD值)〕 使上述硬化性組成物硬化來獲得之硬化膜在可見光區域的每1.5μm的膜厚的光學濃度為4.0以上。其中,從可獲得具有更優異之本發明的效果之硬化性組成物之角度考慮,光學濃度為4.1以上為更佳,4.3以上為進一步較佳。另外,上限值並無特別限制,通常為8.0以下為較佳。 另外,本說明書中,光學濃度表示藉由實施例中記載之方法測定之光學濃度,可見光區域表示波長400~800nm的光。故,可見光區域中的每1.5μm的膜厚的光學濃度為4.0以上表示在波長400~800nm的整個區域,每1.5μm的膜厚的光學濃度為4.0以上。[Optical Density (OD Value)] The optical density of the cured film obtained by curing the above-mentioned curable composition per 1.5 μm in the visible light region is 4.0 or more. Among these, from the viewpoint of obtaining a curable composition having more excellent effects of the present invention, the optical density is more preferably 4.1 or more, and more preferably 4.3 or more. The upper limit value is not particularly limited, but it is usually preferably 8.0 or less. In addition, in this specification, an optical density means the optical density measured by the method described in an Example, and a visible light area shows the light of wavelength 400-800 nm. Therefore, an optical density of 4.0 or more per 1.5 μm film thickness in the visible light region indicates that the optical density per 1.5 μm of film thickness is 4.0 or more in the entire region with a wavelength of 400 to 800 nm.

以下,對上述硬化性組成物中包含之各成分的態樣進行詳述。Hereinafter, aspects of each component included in the curable composition will be described in detail.

〔著色劑〕 上述硬化性組成物含有著色劑。著色劑為選自由顔料及染料所組成之群組之至少一種。 上述著色劑的含量相對於硬化性組成物的總固體成分,55質量%以上為較佳,56質量%以上為更佳,58質量%以上為進一步較佳。 若著色劑的含量為55質量%以上,則使硬化性組成物硬化來獲得之硬化膜的圖案形狀更優異。 另外,著色劑的含量的上限值並無特別限制,通常相對於硬化性組成物的總固體成分,70質量%以下為較佳。若著色劑的含量為上限值以下,則硬化性組成物具有更優異之塗佈性。[Colorant] The curable composition contains a colorant. The colorant is at least one selected from the group consisting of a pigment and a dye. The content of the colorant is more preferably 55% by mass or more, more preferably 56% by mass or more, and more preferably 58% by mass or more with respect to the total solid content of the curable composition. When the content of the colorant is 55% by mass or more, the pattern shape of the cured film obtained by curing the curable composition is more excellent. In addition, the upper limit value of the content of the colorant is not particularly limited, and it is usually preferably 70% by mass or less based on the total solid content of the curable composition. When the content of the colorant is equal to or less than the upper limit value, the curable composition has more excellent coatability.

<顔料> 作為顔料,並無特別限制,能夠使用公知的無機顏料和/或有機顔料。其中,從可獲得具有更優異之本發明的效果之硬化性組成物之角度考慮,顔料是無機顏料為較佳。<Pigment> There is no restriction | limiting in particular as a pigment, A well-known inorganic pigment and / or organic pigment can be used. Among these, it is preferable that the pigment is an inorganic pigment from the viewpoint that a curable composition having more excellent effects of the present invention can be obtained.

(無機顏料) 作為上述無機顏料,並無特別限制,能夠使用公知的無機顏料。 作為無機顏料,例如可舉出鋅白、鉛白、鋅鋇白、氧化鈦、氧化鉻、氧化鐵、沉降性硫酸鋇及重晶石粉、鉛紅、氧化鐵紅、鉻黃、鋅黃(鋅黃1種、鋅黃2種)、群青藍、普魯士藍(亞鐵氰化鐵鉀)鋯石灰色、鐠黃、鉻鈦黃、鉻綠、孔雀色、維多利亞綠、鐵藍(與普魯士藍無關)、釩鋯藍、鉻錫紅、錳紅、橙紅等。並且,作為黑色的無機顏料,可舉出含有選自由Co、Cr、Cu、Mn,Ru、Fe、Ni、Sn、Ti及Ag所組成之群組之1種或2種以上的金屬元素之金屬氧化物、金屬氮化物。(Inorganic Pigment) The inorganic pigment is not particularly limited, and a known inorganic pigment can be used. Examples of the inorganic pigment include zinc white, lead white, zinc barium white, titanium oxide, chromium oxide, iron oxide, precipitated barium sulfate and barite powder, lead red, iron oxide red, chrome yellow, and zinc yellow (zinc 1 yellow, 2 zinc yellow), ultramarine blue, Prussian blue (ferrous potassium ferrocyanide), zircon gray, ochre yellow, chrome titanium yellow, chrome green, peacock, Victoria green, iron blue (unrelated to Prussian blue ), Vanadium zirconium blue, chrome tin red, manganese red, orange red, etc. In addition, examples of the black inorganic pigment include metals containing one or more metal elements selected from the group consisting of Co, Cr, Cu, Mn, Ru, Fe, Ni, Sn, Ti, and Ag. Oxides, metal nitrides.

作為無機顏料,從即使含量較少亦可獲得能夠形成具有高光學濃度之硬化膜之硬化性組成物之角度考慮,碳黑、鈦黑及金屬顔料等(以下,還稱作「黑色顔料」。)為較佳。作為金屬顔料,例如,可舉出含有選自由Nb、V、Co、Cr、Cu、Mn、Ru、Fe、Ni、Sn、Ti及Ag所組成之群組之1種或2種以上的金屬元素之金屬氧化物或金屬氮化物。 作為無機顏料,含有選自由氮化鈦、氮氧化鈦、氮化鈮、氮化釩、含有銀或錫之金屬顔料、以及含有銀及錫之金屬顔料所組成之群組之至少一種為較佳,含有選自由氮化鈦、氮氧化鈦、氮化鈮及氮化釩所組成之群組之至少一種為更佳。 另外,作為無機顏料,還能夠使用碳黑。作為碳黑的具體例,可舉出作為市售品之C.I.顏料黑 1等有機顔料與C.I.顏料黑 7等無機顏料,但並不限定於該些。As the inorganic pigment, carbon black, titanium black, and metallic pigments (hereinafter, also referred to as "black pigments") are considered from the viewpoint that a curable composition capable of forming a cured film having a high optical concentration can be obtained even if the content is small. ) Is better. Examples of the metal pigment include one or two or more metal elements selected from the group consisting of Nb, V, Co, Cr, Cu, Mn, Ru, Fe, Ni, Sn, Ti, and Ag. Metal oxide or metal nitride. As the inorganic pigment, it is preferable to contain at least one selected from the group consisting of titanium nitride, titanium oxynitride, niobium nitride, vanadium nitride, a metal pigment containing silver or tin, and a metal pigment containing silver and tin. It is more preferable to contain at least one selected from the group consisting of titanium nitride, titanium oxynitride, niobium nitride, and vanadium nitride. As the inorganic pigment, carbon black can also be used. Specific examples of carbon black include organic pigments such as C.I. Pigment Black 1 and inorganic pigments such as C.I. Pigment Black 7 which are commercially available products, but are not limited thereto.

上述硬化性組成物中,除了記載為黑色顔料之顔料以外,還能夠使用具有紅外線吸收性之顔料。 作為具有紅外線吸收性之顔料,鎢化合物及金屬硼化物等為較佳,其中,從紅外區域的波長中的遮光性優異之角度考慮,鎢化合物為較佳。尤其,從與基於曝光之硬化效率相關之光聚合起始劑的光吸收波長區域與可見光區域的透光性優異之觀點考慮,鎢化合物為較佳。In the curable composition, in addition to a pigment described as a black pigment, a pigment having infrared absorption properties can also be used. As the pigment having infrared absorption properties, a tungsten compound, a metal boride, and the like are preferred, and among them, a tungsten compound is preferred from the standpoint of excellent light shielding properties at wavelengths in the infrared region. In particular, a tungsten compound is preferable from the viewpoint that the light absorption wavelength region and the visible light region of the photopolymerization initiator related to the curing efficiency by exposure are excellent.

該些顔料可同時使用2種以上,並且,亦可與後述之染料同時使用。可舉出為了調整色調及為了提高所希望的波長區域的遮光性,例如向黑色或具有紅外線遮光性之顔料混合紅色、綠色、黃色、橙色、紫色及藍色等彩色顏料或者後述之染料之態樣。向黑色或具有紅外線遮光性之顔料混合紅色顔料或者染料、或紫色顔料或者染料為較佳,向黑色或具有紅外線遮光性之顔料混合紅色顔料為更佳。 而且,亦可添加後述之近紅外線吸收劑、紅外線吸收劑。These pigments may be used in combination of two or more types, and may be used in combination with dyes described later. For adjusting the color tone and improving the light-shielding property in a desired wavelength region, for example, a color mixture of red, green, yellow, orange, purple, and blue, or a dye to be described later is mixed with a black or infrared-shielding pigment. kind. It is preferable to mix a red pigment or a dye, or a purple pigment or a dye to a black or a pigment having an infrared light blocking property, and it is more preferable to mix a red pigment to a black or a pigment having an infrared light blocking property. Furthermore, a near-infrared absorber and an infrared absorbent described later may be added.

黑色顔料含有鈦黑和/或氮氧化鈮為較佳。鈦黑是含有鈦原子之黑色粒子。低次氧化鈦、氮氧化鈦或氮化鈦等為較佳。鈦黑粒子能夠為了提高分散性、抑制凝聚性等而依據需要對表面進行修飾。能夠藉由氧化矽、氧化鈦、氧化鍺、氧化鋁、氧化鎂或氧化鋯包覆,並且,還能夠藉由如日本特開2007-302836號公報中表示之防水性物質進行處理。 鈦黑典型地為鈦黑粒子,各個粒子的一次粒徑及平均一次粒徑均較小者為較佳。氮氧化鈮亦相同。 具體而言,平均一次粒徑在10nm~45nm的範圍者為較佳。The black pigment preferably contains titanium black and / or niobium oxynitride. Titanium black is black particles containing titanium atoms. Low-order titanium oxide, titanium oxynitride, titanium nitride, and the like are preferred. The titanium black particles can modify the surface as necessary in order to improve dispersibility, suppress cohesion, and the like. It can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide, or zirconia, and can also be treated with a water-repellent substance as shown in Japanese Patent Application Laid-Open No. 2007-302836. Titanium black is typically titanium black particles, and the primary particle size and average primary particle size of each particle are preferably smaller. The same is true for niobium oxynitride. Specifically, it is preferable that the average primary particle diameter is in a range of 10 nm to 45 nm.

另外,顏料的平均一次粒徑能夠利用透過型電子顯微鏡(Transmission Electron Microscope、TEM)測定。作為透過型電子顯微鏡,例如可利用Hitachi High-Technologies Corporation.製造的透過型顯微鏡HT7700。 測定利用透過型電子顯微鏡獲得之粒子圖像的最大長度(Dmax:粒子圖像的輪廓上的2點中的最大長度)及最大長度垂直長度(DV-max:用與最大長度平行之2條直線夾著圖像時,垂直地連結2條直線之間之最短長度),將其相乘平均值(Dmax×DV-max)1/2 作為粒徑。藉由該方法測定100個粒子的粒徑,將其算術平均值作為平均粒徑,並作為顏料的平均一次粒徑。The average primary particle diameter of the pigment can be measured using a transmission electron microscope (TEM). As the transmission electron microscope, for example, a transmission microscope HT7700 manufactured by Hitachi High-Technologies Corporation can be used. Measure the maximum length of a particle image obtained with a transmission electron microscope (Dmax: the maximum length of 2 points on the outline of the particle image) and the maximum vertical length (DV-max: using two straight lines parallel to the maximum length) When the image is sandwiched, the shortest length between two straight lines is vertically connected), and the multiplied average value (Dmax × DV-max) 1/2 is taken as the particle size. The particle diameter of 100 particles was measured by this method, and the arithmetic average value was taken as the average particle diameter and the average primary particle diameter of the pigment.

鈦黑及氮氧化鈮的比表面積並無特別限制,為了使防水劑對鈦黑及氮氧化鈮進行表面處理之後的防水性成為規定的性能,藉由BET(Brunauer, Emmett, Teller)法測定之值為5m2 /g以上且150m2 /g以下為較佳,20m2 /g以上且120m2 /g以下為更佳。 作為鈦黑的市售品的例子,可舉出鈦黑10S、12S、13R、13M、13M-C、13R、13R-N、13M-T(商品名、Mitsubishi Materials Corporation製造)、Tilack D(商品名、Ako Kasei Co., Ltd.製造)、氮化鈦50nm(商品名、Wako Pure Chemical Industries, Ltd.製造)等。The specific surface area of titanium black and niobium oxynitride is not particularly limited. In order to make the water resistance of the titanium black and niobium oxynitride surface treated by the water-repellent agent a predetermined property, it is measured by the BET (Brunauer, Emmett, Teller) method is 5m 2 / g or more and 150m 2 / g or less is preferred, 20m 2 / g or more and 120m 2 / g or less is more preferred. Examples of commercially available products of titanium black include titanium black 10S, 12S, 13R, 13M, 13M-C, 13R, 13R-N, 13M-T (trade name, manufactured by Mitsubishi Materials Corporation), Tilack D (product Name, manufactured by Ako Kasei Co., Ltd.), titanium nitride 50nm (trade name, manufactured by Wako Pure Chemical Industries, Ltd.), and the like.

作為著色劑,使用氮氧化鈦、氮化鈦或氮氧化鈮為較佳,從所獲得之硬化膜的耐濕性更優異之理由考慮,氮化鈦或氮氧化鈮為更佳,氮氧化鈮為進一步較佳。這是認為該些著色劑為疏水性。As the colorant, titanium oxynitride, titanium nitride, or niobium oxynitride is preferably used. From the reason that the cured film obtained has better moisture resistance, titanium nitride or niobium oxynitride is more preferable, and niobium oxynitride Is even better. This is because these colorants are considered to be hydrophobic.

而且,含有鈦黑作為包含鈦黑及Si原子之被分散體亦較佳。 該形態中,鈦黑是在硬化性組成物中作為被分散體而含有者,被分散體中的Si原子與Ti原子的含有比(Si/Ti)以質量換算計,0.05以上為較佳,0.05~0.5為更佳,0.07~0.4為進一步較佳。 在此,上述被分散體包含鈦黑為一次粒子的狀態者與凝聚體(二次粒子)的狀態者雙方。 為了變更被分散體的Si/Ti(例如,設為0.05以上),能夠使用如下方法。 首先,藉由利用分散機分散氧化鈦與二氧化矽粒子來獲得分散物,在高溫(例如、850~1,000℃)下對該分散物進行還原處理,藉此能夠獲得以鈦黑粒子作為主成分且含有Si與Ti之被分散體。上述還原處理還能夠在氨等還原性氣體的氛圍下進行。 作為氧化鈦,可舉出TTO-51N(商品名、Ishihara Sangyo Kaisha, Ltd.製造)等。 作為二氧化矽粒子的市售品,可舉出AEROSIL(註冊商標)90、130、150、200、255、300、380(商品名、Evonik Japan Co., Ltd.製造)等。 可利用分散劑分散氧化鈦與二氧化矽粒子。作為分散劑,可舉出後述之分散劑一欄中說明者。 上述分散亦可在溶劑中進行。作為溶劑,可舉出水、有機溶劑。可舉出後述之有機溶劑一欄中說明者。 Si/Ti例如調整為0.05以上等之鈦黑例如能夠藉由日本特開2008-266045公報的段落號〔0005〕及段落號〔0016〕~〔0021〕中記載的方法製作。Moreover, it is also preferable to contain titanium black as a dispersion containing titanium black and Si atoms. In this form, titanium black is contained as a dispersion in a hardenable composition, and the content ratio (Si / Ti) of Si atoms to Ti atoms in the dispersion is preferably 0.05 or more in terms of mass conversion. 0.05 to 0.5 is more preferable, and 0.07 to 0.4 is more preferable. Here, the to-be-dispersed body includes both those in a state where titanium black is a primary particle and those in a state of an aggregate (secondary particle). In order to change the Si / Ti of the dispersion (for example, 0.05 or more), the following method can be used. First, a dispersion is obtained by dispersing titanium oxide and silicon dioxide particles with a disperser, and the dispersion is subjected to reduction treatment at a high temperature (for example, 850 to 1,000 ° C), whereby titanium black particles can be obtained as a main component. It contains a dispersion of Si and Ti. The reduction treatment can also be performed in an atmosphere of a reducing gas such as ammonia. Examples of the titanium oxide include TTO-51N (trade name, manufactured by Ishihara Sangyo Kaisha, Ltd.) and the like. Examples of commercially available products of silica particles include AEROSIL (registered trademark) 90, 130, 150, 200, 255, 300, 380 (trade name, manufactured by Evonik Japan Co., Ltd.), and the like. Dispersants can be used to disperse titanium oxide and silica particles. Examples of the dispersant include those described in the column of dispersant described later. The above dispersion can also be performed in a solvent. Examples of the solvent include water and organic solvents. Examples include those described in the column of organic solvents described later. The titanium black whose Si / Ti is adjusted to, for example, 0.05 or more can be produced, for example, by the methods described in paragraph numbers [0005] and paragraph numbers [0016] to [0021] of Japanese Patent Application Laid-Open No. 2008-266045.

藉由將包含鈦黑及Si原子之被分散體中的Si原子與Ti原子的含有比(Si/Ti)調整為較佳範圍(例如0.05以上),使用包含該被分散體之硬化性組成物來形成硬化膜時,硬化膜的形成區域外的源自硬化性組成物的殘渣物減少。另外,殘渣物是包含源自鈦黑粒子、樹脂成分等硬化性組成物之成分者。 雖然殘渣物減少之理由尚不明確,但如上述的被分散體具有粒徑減小之趨勢(例如,粒徑30nm以下),而且該被分散體的包含Si原子之成分增加,藉此整個膜與基底的吸附性降低。推斷此現象有助於提高形成硬化膜時的未硬化的硬化性組成物(尤其,鈦黑)的顯影去除性。 鈦黑對遍及紫外光至紅外光的廣範圍之波長區域的光之遮光性優異,故使用上述包含鈦黑及Si原子之被分散體(Si/Ti以質量換算計,0.05以上者為較佳)來形成之硬化膜發揮優異之遮光性。 另外,被分散體中的Si原子與Ti原子的含有比(Si/Ti)例如能夠利用日本特開2013-249417號公報的段落0033中記載的方法(1-1)或方法(1-2)進行測定。 對於使硬化性組成物硬化來獲得之硬化膜中含有之被分散體,判斷該被分散體中的Si原子與Ti原子的含有比(Si/Ti)是否為0.05以上時,能夠利用日本特開2013-249417號公報的段落0035中記載的方法(2)。The content ratio (Si / Ti) of the Si atom and the Ti atom in the dispersion containing titanium black and Si atoms is adjusted to a preferable range (for example, 0.05 or more), and the hardening composition containing the dispersion is used When a cured film is formed, residues originating from the curable composition outside the region where the cured film is formed are reduced. The residue is a component containing components derived from a hardening composition such as titanium black particles and resin components. Although the reason for the reduction of the residue is not clear, as described above, the dispersion has a tendency to decrease in particle size (for example, the particle diameter is 30 nm or less), and the component containing Si atoms in the dispersion increases, thereby the entire film Adhesion to the substrate is reduced. It is presumed that this phenomenon contributes to the improvement of the development and removal property of an unhardened curable composition (especially, titanium black) when a cured film is formed. Titanium black has excellent light-shielding properties over light in a wide range of wavelengths from ultraviolet to infrared light, so the above-mentioned dispersion containing titanium black and Si atoms (Si / Ti in mass conversion, more than 0.05 is preferred) ) To form a cured film exhibiting excellent light-shielding properties. The content ratio (Si / Ti) of the Si atom and the Ti atom in the dispersion can be, for example, the method (1-1) or the method (1-2) described in paragraph 0033 of Japanese Patent Application Laid-Open No. 2013-249417. Perform the measurement. For the dispersion contained in the cured film obtained by curing the hardenable composition, to determine whether the content ratio (Si / Ti) of Si atoms to Ti atoms in the dispersion is 0.05 or more, Japanese Patent Application Laid-Open can be used Method (2) described in paragraph 0035 of 2013-249417.

包含鈦黑及Si原子之被分散體中,鈦黑能夠使用上述者。 該被分散體中,為了調整分散性、著色性等,可與鈦黑一同組合1種或2種以上的包含Cu、Fe、Mn、V、Ni等複合氧化物、氧化鈷、氧化鐵、碳黑、苯胺黑等之黑色顔料來使用。此時,包含鈦黑之被分散體佔所有被分散體中的50質量%以上為較佳。 該被分散體中,為了調整遮光性等,可在無損本發明的效果之範圍內,依據需要,與鈦黑同時使用其他著色劑(有機顔料和/或染料等)。 以下,對向被分散體導入Si原子時使用之材料進行敘述。向被分散體導入Si原子時,使用二氧化矽等含Si物質即可。 作為可使用之二氧化矽,能夠舉出沉降二氧化矽、煙霧狀二氧化矽、膠體二氧化矽、合成二氧化矽等,適當選擇該些來使用即可。 而且,若二氧化矽粒子的粒徑為在形成遮光膜時小於膜厚之粒徑,則遮光性更優異,故使用微粒類型的二氧化矽為較佳。另外,作為微粒類型的二氧化矽的例子,例如可舉出日本特開2013-249417號公報的段落0039中記載的二氧化矽,該些內容編入本說明書中。Among the dispersions containing titanium black and Si atoms, titanium black can be used. In this dispersion, in order to adjust dispersibility, colorability, etc., one or two or more kinds of composite oxides including cobalt, Fe, Mn, V, Ni, cobalt oxide, iron oxide, and carbon can be combined with titanium black. Black and aniline black pigments are used. In this case, it is preferable that the dispersion containing titanium black accounts for 50% by mass or more of all the dispersions. In this dispersion, in order to adjust the light-shielding property and the like, other colorants (organic pigments and / or dyes, etc.) may be used together with titanium black, as long as the effects of the present invention are not impaired. Hereinafter, materials used when introducing Si atoms into the dispersion will be described. When introducing Si atoms into the dispersion, a Si-containing substance such as silicon dioxide may be used. Examples of the usable silicon dioxide include precipitated silica, fumed silica, colloidal silica, and synthetic silica. These can be appropriately selected and used. In addition, if the particle diameter of the silicon dioxide particles is a particle diameter smaller than the film thickness when the light-shielding film is formed, the light-shielding property is more excellent. Therefore, it is preferable to use microparticle-type silicon dioxide. In addition, examples of the particulate silica include silicon dioxide described in paragraph 0039 of Japanese Patent Application Laid-Open No. 2013-249417, and the contents are incorporated herein.

硬化性組成物能夠使用鎢化合物、和/或金屬硼化物作為顏料。 鎢化合物及金屬硼化物是相對於紅外線(波長約為800~1200nm的光),吸收較高(亦即,相對於紅外線之遮光性(遮蔽性)較高),相對於可見光,吸收較低之紅外線遮蔽材。故,本發明的硬化性組成物藉由含有鎢化合物和/或金屬硼化物,能夠形成紅外區域中的遮光性較高、可見光區域中的透光性較高之圖案。 鎢化合物及金屬硼化物針對比用於形成圖像之高壓水銀燈、KrF、ArF等的曝光中使用之可見區域短波的光,其吸收亦較小。故,藉由與後述之聚合性化合物、鹼可溶性樹脂及光聚合起始劑組合,可獲得優異之圖案,並且形成圖案時,能夠更加抑制顯影殘渣。As the curable composition, a tungsten compound and / or a metal boride can be used as the pigment. Tungsten compounds and metal borides have higher absorption relative to infrared (light having a wavelength of about 800 to 1200 nm) (that is, higher light shielding (shielding) relative to infrared) and lower absorption relative to visible light. Infrared shielding material. Therefore, the curable composition of the present invention can form a pattern having a high light-shielding property in the infrared region and a high light-transmitting property in the visible light region by containing a tungsten compound and / or a metal boride. Tungsten compounds and metal borides are also less absorbing in light in the visible region than those used in the exposure of high-pressure mercury lamps, KrF, ArF, etc. used for image formation. Therefore, by combining with a polymerizable compound, an alkali-soluble resin, and a photopolymerization initiator to be described later, an excellent pattern can be obtained, and when a pattern is formed, development residue can be more suppressed.

作為鎢化合物,能夠舉出氧化鎢系化合物、硼化鎢系化合物、硫化鎢系化合物等,以下述通式(組成式)(I)表示之氧化鎢系化合物為較佳。 Mx Wy Oz ……(I) M表示金屬,W表示鎢,O表示氧。 0.001≤x/y≤1.1 2.2≤z/y≤3.0Examples of the tungsten compound include tungsten oxide-based compounds, tungsten boride-based compounds, tungsten sulfide-based compounds, and the like, and tungsten oxide-based compounds represented by the following general formula (compositional formula) (I) are preferred. M x W y O z (I) M represents metal, W represents tungsten, and O represents oxygen. 0.001≤x / y≤1.1 2.2≤z / y≤3.0

作為M的金屬,例如可舉出鹼金屬、鹼土類金屬、Mg、Zr、Cr、Mn、Fe、Ru、Co、Rh、Ir、Ni、Pd、Pt、Cu、Ag、Au、Zn、Cd、Al、Ga、In、Tl、Sn、Pb、Ti、Nb、V、Mo、Ta、Re、Be、Hf、Os、Bi、Rb、Cs等,鹼金屬為較佳。M的金屬可以為1種亦可以為2種以上。Examples of the metal of M include alkali metals, alkaline earth metals, Mg, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Tl, Sn, Pb, Ti, Nb, V, Mo, Ta, Re, Be, Hf, Os, Bi, Rb, Cs, etc., alkali metals are preferred. The metal of M may be one type or two or more types.

M為鹼金屬為較佳,Rb或Cs為更佳,Cs為進一步較佳。M is preferably an alkali metal, Rb or Cs is more preferred, and Cs is further preferred.

藉由x/y為0.001以上,能夠充分遮蔽紅外線,藉由x/y為1.1以下,能夠更加可靠地避免鎢化合物中生成雜質相。 藉由z/y為2.2以上,能夠更加提高作為材料的化學穩定性,藉由z/y為3.0以下,能夠充分遮蔽紅外線。When x / y is 0.001 or more, infrared rays can be sufficiently shielded, and when x / y is 1.1 or less, it is possible to more reliably avoid the formation of an impurity phase in a tungsten compound. When z / y is 2.2 or more, chemical stability as a material can be further improved, and when z / y is 3.0 or less, infrared rays can be sufficiently shielded.

作為以上述通式(I)表示之氧化鎢系化合物的具體例,能夠舉出Cs0.33 WO3 、Rb0.33 WO3 、K0.33 WO3 、Ba0.33 WO3 等,Cs0.33 WO3 或Rb0.33 WO3 為較佳,Cs0.33 WO3 為更佳。Specific examples of the tungsten oxide-based compound represented by the general formula (I) include Cs 0.33 WO 3 , Rb 0.33 WO 3 , K 0.33 WO 3 , Ba 0.33 WO 3, and the like, Cs 0.33 WO 3 or Rb 0.33 WO. 3 is more preferable, and Cs 0.33 WO 3 is more preferable.

鎢化合物為微粒為較佳。鎢微粒的平均一次粒徑為800nm以下為較佳,400nm以下為更佳,200nm以下為進一步較佳。藉由平均一次粒徑在該種範圍,鎢微粒由於光散射,變得不易遮斷可見光,故能夠使可見光區域內的透光性更加可靠。從避免光散射之觀點考慮,平均一次粒徑越小越佳,但從製造時的易操作性等理由考慮,鎢微粒的平均一次粒徑通常為1nm以上。The tungsten compound is preferably fine particles. The average primary particle diameter of the tungsten particles is preferably 800 nm or less, more preferably 400 nm or less, and even more preferably 200 nm or less. When the average primary particle diameter is in this range, the tungsten fine particles are difficult to block visible light due to light scattering, so that the light transmittance in the visible light region can be made more reliable. From the viewpoint of avoiding light scattering, the smaller the average primary particle diameter is, the better, but for reasons such as ease of handling at the time of production, the average primary particle diameter of the tungsten particles is usually 1 nm or more.

鎢化合物能夠使用2種以上。Two or more tungsten compounds can be used.

鎢化合物能夠作為市售品來獲得。鎢化合物例如為氧化鎢系化合物時,氧化鎢系化合物能夠藉由在惰性氣體氛圍或還原性氣體氛圍中對鎢化合物進行熱處理之方法獲得(參閱專利第4096205號公報)。 氧化鎢系化合物例如還能夠作為Sumitomo Metal Mining Co., Ltd.製造的YMF-02等鎢微粒的分散物來獲得。A tungsten compound can be obtained as a commercial item. When the tungsten compound is, for example, a tungsten oxide-based compound, the tungsten oxide-based compound can be obtained by a method of heat-treating the tungsten compound in an inert gas atmosphere or a reducing gas atmosphere (see Patent No. 4096205). The tungsten oxide-based compound can also be obtained, for example, as a dispersion of tungsten fine particles such as YMF-02 manufactured by Sumitomo Metal Mining Co., Ltd.

作為金屬硼化物,能夠舉出硼化鑭(LaB6 )、硼化鐠(PrB6 )、硼化釹(NdB6 )、硼化鈰(CeB6 )、硼化釔(YB6 )、硼化鈦(TiB2 )、硼化鋯(ZrB2 )、硼化鉿(HfB2 )、硼化釩(VB2 )、硼化鉭(TaB2 )、硼化鉻(CrB、CrB2 )、硼化鉬(MoB2 、Mo2 B5 、MoB)、硼化鎢(W2 B5 )等的1種或2種以上,硼化鑭(LaB6 )為較佳。Examples of the metal boride include lanthanum boride (LaB 6 ), praseodymium boride (PrB 6 ), neodymium boride (NdB 6 ), cerium boride (CeB 6 ), yttrium boride (YB 6 ), and boride Titanium (TiB 2 ), zirconium boride (ZrB 2 ), hafnium boride (HfB 2 ), vanadium boride (VB 2 ), tantalum boride (TaB 2 ), chromium boride (CrB, CrB 2 ), boride One or more types of molybdenum (MoB 2 , Mo 2 B 5 , MoB), tungsten boride (W 2 B 5 ), etc., and lanthanum boride (LaB 6 ) is preferred.

金屬硼化物是微粒為較佳。金屬硼化物微粒的平均一次粒徑為800nm以下為較佳,300nm以下為更佳,100nm以下為進一步較佳。藉由平均一次粒徑在該種範圍,金屬硼化物微粒由於光散射,變得不易遮斷可見光,故能夠使可見光區域中的透光性更加可靠。從避免光散射之觀點考慮,平均一次粒徑越小越佳,但從製造時的易操作性等理由考慮,金屬硼化物微粒的平均一次粒徑通常為1nm以上。It is preferred that the metal borides be fine particles. The average primary particle diameter of the metal boride fine particles is preferably 800 nm or less, more preferably 300 nm or less, and even more preferably 100 nm or less. When the average primary particle diameter is in this range, the metal boride fine particles are difficult to block visible light due to light scattering, so that the transmittance in the visible light region can be made more reliable. From the standpoint of avoiding light scattering, the smaller the average primary particle diameter is, the better, but for reasons such as ease of handling during production, the average primary particle diameter of the metal boride fine particles is usually 1 nm or more.

金屬硼化物能夠使用2種以上。Two or more kinds of metal borides can be used.

金屬硼化物能夠作為市售品來獲得,例如還能夠作為Sumitomo Metal Mining Co., Ltd.製的KHF-7等金屬硼化物微粒的分散物來獲得。The metal boride can be obtained as a commercially available product, for example, it can also be obtained as a dispersion of metal boride fine particles such as KHF-7 manufactured by Sumitomo Metal Mining Co., Ltd.

(含氮化鈦粒子) 作為無機顏料,還能夠使用包含Fe原子之含氮化鈦粒子。製造含氮化鈦粒子時,通常利用氣相反應法,具體而言,可舉出電爐法及熱電漿法等。該些製法中,從雜質的混入較少之角度、粒徑易一致之角度及生產率較高之角度等理由考慮,熱電漿法為較佳。 作為熱電漿的產生方法,可舉出直流電弧放電、多相電弧放電、高頻(RF)電漿及混合式電漿等,從來自電極的雜質的混入較少之高頻電漿為較佳。作為基於熱電漿法之含氮化鈦微粒的具體製造方法,例如,可舉出藉由高頻熱電漿使鈦粉末蒸發,將氮作為載氣導入裝置內,藉由冷卻過程,使鈦粉末氮化,從而合成含氮化鈦粒子之方法等。另外,熱電漿法並不限定於上述。(Titanium nitride-containing particles) As the inorganic pigment, titanium nitride-containing particles containing Fe atoms can also be used. In the production of titanium nitride-containing particles, a gas-phase reaction method is generally used, and specific examples thereof include an electric furnace method and a thermo-plasma method. Among these production methods, a thermoplasma method is preferred from the viewpoints of a small amount of impurities, a point of easy particle size consistency, and a point of high productivity. Examples of the generation method of the thermo-plasma include direct-current arc discharge, multi-phase arc discharge, high-frequency (RF) plasma, and hybrid plasma. The high-frequency plasma with less impurities from the electrode is preferable. . As a specific manufacturing method of the titanium nitride-containing microparticles based on the thermo-plasma method, for example, titanium powder is evaporated by a high-frequency thermo-plasma, nitrogen is introduced into a device as a carrier gas, and titanium powder nitrogen is cooled by a cooling process. Method to synthesize titanium nitride-containing particles. The pyroplasma method is not limited to the above.

作為含氮化鈦粒子的製造方法,並無特別限定,能夠參閱國際公開第2010/147098號的段落<0037>~<0089>中記載的製造方法。例如,能夠如下製造,亦即,代替國際公開第2010/147098號的Ag粉末,使用後述之包含Fe之成分和/或包含Si之成分,將混合該成分與鈦粉末材料(鈦粒子)者作為原料,製造本發明的組成物中包含之含氮化鈦粒子。The method for producing titanium nitride-containing particles is not particularly limited, and the production methods described in paragraphs <0037> to <0089> of International Publication No. 2010/147098 can be referred to. For example, it can be manufactured by replacing the Ag powder of International Publication No. 2010/147098 with a component containing Fe and / or a component containing Si described later, and mixing the component with a titanium powder material (titanium particles) as The raw materials are used to produce titanium nitride-containing particles contained in the composition of the present invention.

含氮化鈦粒子的製造中使用之鈦粉末材料(鈦粒子)是高純度者為較佳。鈦粉末材料並無特別限定,使用鈦元素的純度為99.99%以上者為較佳,使用99.999%以上者為更佳。The titanium powder material (titanium particles) used in the production of titanium nitride-containing particles is preferably one having high purity. The titanium powder material is not particularly limited, and a titanium element having a purity of 99.99% or more is preferable, and a titanium powder having a purity of 99.999% or more is more preferable.

含氮化鈦粒子的製造中使用之鈦粉末材料(鈦粒子)有時含有鈦原子以外的原子。作為鈦粉末材料可包含之其他原子,例如,可舉出Fe原子及Si原子等。 鈦粉末材料含有Fe原子時,Fe原子的含量相對於鈦粉末材料的總質量,超過0.001質量%為較佳。 鈦粉末材料含有Si原子時,Si原子的含量相對於鈦粉末材料總質量,超過0.002質量%且小於0.3質量%為較佳,0.01~0.15質量%為更佳,0.02~0.1質量%為進一步較佳。藉由Si原子的含量超過0.002質量%,硬化膜的圖案形成性更加提高。藉由Si原子的含量小於0.3質量%,所獲得之含氮化鈦粒子的最表層的極性更加穩定化。藉此認為,使含氮化鈦粒子分散時的分散劑向含氮化鈦粒子的吸附性得到優化,含氮化鈦粒子的未分散物減少,能夠抑制產生顆粒。 含氮化鈦粒子的製造中使用之鈦粉末材料(鈦粒子)中的水分相對於鈦粉末材料的總質量,小於1質量%為較佳,小於0.1質量%為更佳,實質上不包含為進一步較佳。The titanium powder material (titanium particles) used in the production of titanium nitride-containing particles may contain atoms other than titanium atoms. Examples of other atoms that may be contained in the titanium powder material include Fe atoms and Si atoms. When the titanium powder material contains Fe atoms, the content of Fe atoms is more than 0.001% by mass relative to the total mass of the titanium powder material. When the titanium powder material contains Si atoms, the content of Si atoms is more than 0.002 mass% and less than 0.3 mass% with respect to the total mass of the titanium powder material, more preferably 0.01 to 0.15 mass%, and more preferably 0.02 to 0.1 mass%. good. When the content of Si atoms exceeds 0.002% by mass, the pattern formability of the cured film is further improved. When the content of Si atoms is less than 0.3% by mass, the polarity of the outermost layer of the obtained titanium nitride-containing particles is more stabilized. From this, it is thought that the dispersant when dispersing the titanium nitride-containing particles is optimized for its adsorption to the titanium nitride-containing particles, the amount of undispersed titanium nitride-containing particles is reduced, and generation of particles can be suppressed. The moisture content of the titanium powder material (titanium particles) used in the production of titanium nitride-containing particles is preferably less than 1% by mass and more preferably less than 0.1% by mass, and does not substantially include Further preferred.

藉由利用熱電漿法來獲得含氮化鈦粒子,可容易將CuKα射線作為X射線源時的源自(200)面之峰的繞射角2θ(詳細內容將進行後述)調整為超過42.6°且43.5°以下的範圍。By using the pyroplasma method to obtain titanium nitride-containing particles, the diffraction angle 2θ (the details will be described later) originating from the peak of the (200) plane when CuKα rays are used as the X-ray source can be easily adjusted to more than 42.6 ° And in the range of 43.5 ° or less.

作為使含氮化鈦粒子含有Fe原子之方法,並無特別限定,例如,可舉出在獲得用作上述含氮化鈦粒子的原料之鈦粒子(鈦粉末)之階段導入Fe原子之方法等。更詳細而言,藉由還原(Kroll)法等製造鈦時,作為反應容器,使用由不銹鋼(SUS)等含有Fe原子之材料構成者,或者作為破碎鈦時的沖壓機及粉碎機的材料使用含有Fe原子者,藉此能夠使Fe原子附著於鈦粒子的表面。 含氮化鈦粒子的製造中利用熱電漿法時,除了作為原料之鈦粒子以外,添加Fe粒子、Fe氧化物等成分,並藉由熱電漿法使該些氮化,藉此能夠使含氮化鈦粒子含有Fe原子。 另外,含氮化鈦粒子中包含之Fe原子可以以離子、金屬化合物(亦包含錯合物)、金屬間化合物、合金、氧化物、複合氧化物、氮化物、氮氧化物、硫化物及硫氧化物等任意形態包含。含氮化鈦粒子中包含之Fe原子可作為晶格間位置的雜質而存在,亦可在晶界以非晶狀態作為雜質而存在。The method for making the titanium nitride-containing particles contain Fe atoms is not particularly limited, and examples thereof include a method for introducing Fe atoms at the stage of obtaining titanium particles (titanium powder) used as a raw material of the titanium nitride-containing particles. . In more detail, when titanium is produced by a reduction (Kroll) method or the like, as a reaction vessel, a material composed of a material containing Fe atoms such as stainless steel (SUS), or as a material for a punch and a crusher when crushing titanium is used. Those who contain Fe atoms can adhere Fe atoms to the surface of the titanium particles. When the thermoplasma method is used in the production of titanium nitride-containing particles, in addition to titanium particles as raw materials, components such as Fe particles and Fe oxides are added, and these are nitrided by the thermoplasma method, thereby enabling nitrogen to be contained. The titanium oxide particles contain Fe atoms. In addition, the Fe atoms contained in the titanium nitride-containing particles may be ions, metal compounds (including complexes), intermetallic compounds, alloys, oxides, composite oxides, nitrides, oxynitrides, sulfides, and sulfur. Any form such as an oxide is included. The Fe atom contained in the titanium nitride-containing particles may exist as an impurity at an inter-lattice position, or may exist in an amorphous state as an impurity at a grain boundary.

本發明人等進行深入研究的結果,發現含氮化鈦粒子中的Fe原子的含量與圖案形成性及電極的防腐性相關。含氮化鈦粒子中包含之Fe原子相對於電極及基板之黏附性優異,認為含氮化鈦粒子中的氮化鈦經由Fe原子而附著於電極及基板。認為顯影處理等硬化膜的圖案形成之後,Fe原子殘留在電極及基板上,易去除氮化鈦。故,推斷為藉由將含氮化鈦粒子中的Fe原子的含量設為規定量以上,硬化膜的圖案形成性得到提高。另一方面,若含氮化鈦粒子中包含之Fe原子的含量過多,則殘留在電極及基板上之Fe原子的量增加,認為會成為電極腐蝕的原因。故,推斷為藉由將含氮化鈦粒子中的Fe原子的含量設為規定量以下,電極的防腐性得到提高。 含氮化鈦粒子中的Fe原子的含量相對於含氮化鈦粒子總質量,超過0.001質量%且小於0.4質量%為較佳。其中,0.01~0.2質量%為更佳,0.02~0.1質量%為進一步較佳。藉由Fe原子的含量超過0.001質量%,硬化膜的圖案形成性更加提高。藉由Fe原子的含量小於0.4質量%,基於硬化膜之電極的防腐性更加提高(能夠抑制硬化膜腐蝕電極)。亦即,藉由含氮化鈦粒子中的Fe原子的含量在上述範圍內,能夠獲得優異之硬化膜的圖案形成性及電極的防腐性。 含氮化鈦粒子中的Fe原子的含量能夠藉由ICP(Inductively Coupled Plasma;高頻電感耦合電漿)發光分光分析法進行測定。As a result of intensive studies conducted by the present inventors, it was found that the content of Fe atoms in the titanium nitride-containing particles is related to the pattern-forming property and the corrosion resistance of the electrode. The Fe atoms contained in the titanium nitride-containing particles are excellent in adhesion to the electrode and the substrate, and it is considered that the titanium nitride in the titanium nitride-containing particles is attached to the electrode and the substrate via Fe atoms. It is considered that after the formation of a pattern of a hardened film such as a development process, Fe atoms remain on the electrode and the substrate, and titanium nitride is easily removed. Therefore, it is presumed that by setting the content of Fe atoms in the titanium nitride-containing particles to a predetermined amount or more, the pattern formability of the cured film is improved. On the other hand, if the content of Fe atoms contained in the titanium nitride-containing particles is too large, the amount of Fe atoms remaining on the electrodes and the substrate increases, which is considered to be a cause of electrode corrosion. Therefore, it is inferred that the corrosion resistance of the electrode is improved by setting the content of Fe atoms in the titanium nitride-containing particles to a predetermined amount or less. The content of Fe atoms in the titanium nitride-containing particles is preferably more than 0.001% by mass and less than 0.4% by mass relative to the total mass of the titanium nitride-containing particles. Among these, 0.01 to 0.2% by mass is more preferred, and 0.02 to 0.1% by mass is even more preferred. When the content of Fe atoms exceeds 0.001% by mass, the pattern formability of the cured film is further improved. When the content of Fe atoms is less than 0.4% by mass, the corrosion resistance of the electrode based on the cured film is further improved (the electrode can be inhibited from being corroded by the cured film). That is, when the content of Fe atoms in the titanium nitride-containing particles is within the above range, it is possible to obtain an excellent pattern formation property of the cured film and an anticorrosive property of the electrode. The content of Fe atoms in the titanium nitride-containing particles can be measured by an ICP (Inductively Coupled Plasma; High Frequency Inductively Coupled Plasma) emission spectroscopic analysis method.

含氮化鈦粒子還含有Si原子(矽原子)為較佳。藉此,硬化膜的圖案形成性更加提高。作為藉由含有Si原子,圖案形成性得到提高之理由,認為與上述之Fe原子相同。 含氮化鈦粒子中的Si原子的含量相對於含氮化鈦粒子總質量,超過0.002質量%且小於0.3質量%為較佳,0.01~0.15質量%為更佳,0.02~0.1質量%為進一步較佳。藉由Si原子的含量超過0.002質量%,硬化膜的圖案形成性更加提高。認為,藉由Si原子的含量小於0.3質量%,含氮化鈦粒子的最表層的極性更加穩定化。藉此,認為使含氮化鈦粒子分散時的分散劑向含氮化鈦粒子的吸附性得到優化,含氮化鈦粒子的未分散物減少,能夠抑制產生顆粒。 含氮化鈦粒子中的Si原子的含量能夠藉由與上述Fe原子相同的方法進行測定。It is preferable that the titanium nitride-containing particles further contain Si atoms (silicon atoms). Thereby, the pattern formation property of a cured film is improved more. The reason why the pattern formability is improved by containing Si atoms is considered to be the same as the aforementioned Fe atoms. The content of Si atoms in the titanium nitride-containing particles is more than 0.002 mass% and less than 0.3 mass% with respect to the total mass of the titanium nitride-containing particles, more preferably 0.01 to 0.15 mass%, and more preferably 0.02 to 0.1 mass%. Better. When the content of Si atoms exceeds 0.002% by mass, the pattern formability of the cured film is further improved. It is considered that when the content of Si atoms is less than 0.3% by mass, the polarity of the outermost layer of the titanium nitride-containing particles is more stabilized. Thereby, it is considered that the dispersant when dispersing the titanium nitride-containing particles is optimized for its adsorption to the titanium nitride-containing particles, the amount of undispersed titanium nitride-containing particles is reduced, and the generation of particles can be suppressed. The Si atom content in the titanium nitride-containing particles can be measured by the same method as the Fe atom.

作為使含氮化鈦粒子含有Si原子之方法,並無特別限定,例如,可舉出在獲得上述用作含氮化鈦粒子的原料之鈦粒子(鈦粉末)之階段導入Si原子之方法等。更詳細而言,藉由還原法等製造鈦時,作為反應容器,使用由含有Si原子之材料構成者,或者作為破碎鈦時的沖壓機及粉碎機的材料使用含有Si原子者,藉此能夠使Si原子附著於鈦粒子的表面。 含氮化鈦粒子的製造中利用熱電漿法時,除了作為原料之鈦粒子以外,添加Si粒子、Si氧化物等成分,並藉由熱電漿法使該些氮化,藉此能夠使含氮化鈦粒子含有Si原子。 含氮化鈦粒子中包含之Si原子可以以離子、金屬化合物(亦包含錯合物)、金屬間化合物、合金、氧化物、複合氧化物、氮化物、氮氧化物、硫化物及硫氧化物等任一形態包含。並且,含氮化鈦粒子中包含之Si原子可以作為晶格間位置的雜質而存在,亦可在晶界以非晶狀態作為雜質而存在。The method for making the titanium nitride-containing particles contain Si atoms is not particularly limited, and examples thereof include a method of introducing Si atoms at the stage of obtaining the titanium particles (titanium powder) used as a raw material for the titanium nitride-containing particles. . In more detail, when titanium is produced by a reduction method or the like, it is possible to use a material containing Si atoms as a reaction container, or use a material containing Si atoms as a material for a punch and a crusher when titanium is crushed. Si atoms are attached to the surface of the titanium particles. When the thermoplasma method is used in the production of titanium nitride-containing particles, in addition to titanium particles as raw materials, components such as Si particles and Si oxides are added, and these are nitrided by the thermoplasma method, thereby enabling nitrogen to be contained. The titanium particles contain Si atoms. The Si atoms contained in titanium nitride-containing particles can be ions, metal compounds (including complexes), intermetallic compounds, alloys, oxides, composite oxides, nitrides, oxynitrides, sulfides, and sulfur oxides. Either form is included. In addition, the Si atoms contained in the titanium nitride-containing particles may exist as impurities at inter-lattice positions, or may exist as impurities at the grain boundaries in an amorphous state.

含氮化鈦粒子中的鈦原子(Ti原子)的含量相對於含氮化鈦粒子的總質量,10~85質量%為較佳,15~75質量%為更佳,20~70質量%為進一步較佳。含氮化鈦粒子中的Ti原子的含量能夠藉由ICP發光分光分析法進行測定。 含氮化鈦粒子中的氮原子(N原子)的含量相對於含氮化鈦粒子的總質量,3~60質量%為較佳,5~50質量%為更佳,10~40質量%為進一步較佳。氮原子的含量能夠藉由惰性氣體熔融熱導法進行分析。 含氮化鈦粒子作為主成分包含氮化鈦(TiN),通常在其合成時混入氧之情況及粒徑較小之情況等時變得顯著,但亦可藉由粒子表面的氧化等,含有一部分氧原子。 含氮化鈦粒子中的氧原子的含量相對於含氮化鈦粒子的總質量,1~40質量%為較佳,1~35質量%為更佳,5~30質量%為進一步較佳。氧原子的含量能夠藉由惰性氣體熔融紅外線吸收法進行分析。The content of titanium atoms (Ti atoms) in the titanium nitride-containing particles is preferably 10 to 85% by mass, more preferably 15 to 75% by mass, and 20 to 70% by mass relative to the total mass of the titanium nitride-containing particles. Further preferred. The content of Ti atoms in the titanium nitride-containing particles can be measured by ICP emission spectrometry. The content of nitrogen atoms (N atoms) in the titanium nitride-containing particles is preferably 3 to 60% by mass, more preferably 5 to 50% by mass, and 10 to 40% by mass relative to the total mass of the titanium nitride-containing particles. Further preferred. The nitrogen atom content can be analyzed by an inert gas fusion thermal conductivity method. Titanium nitride-containing particles contain titanium nitride (TiN) as a main component, and generally become noticeable when oxygen is mixed during the synthesis and when the particle size is small, but they may also be contained by oxidation of the particle surface, etc. Part of the oxygen atom. The content of oxygen atoms in the titanium nitride-containing particles is preferably 1 to 40% by mass, more preferably 1 to 35% by mass, and still more preferably 5 to 30% by mass relative to the total mass of the titanium nitride-containing particles. The content of oxygen atoms can be analyzed by an inert gas melting infrared absorption method.

從分散穩定性及遮光性的觀點考慮,含氮化鈦粒子的比表面積為5m2 /g以上且100m2 /g以下為較佳,10m2 /g以上且60m2 /g以下為更佳。比表面積能夠藉由BET(Brunauer,Emmett,Teller)法求出。From the viewpoint of dispersion stability and light-shielding properties, a specific surface area of titanium nitride-containing particles is 5m 2 / g or more and 100m 2 / g or less is preferred, 10m 2 / g or more and 60m 2 / g or less is more preferred. The specific surface area can be determined by the BET (Brunauer, Emmett, Teller) method.

含氮化鈦粒子可以是包含氮化鈦粒子與金屬微粒之複合微粒。 複合微粒是指,氮化鈦粒子與金屬微粒複合化或處於高度分散之狀態之粒子。其中,「複合化」表示,粒子由氮化鈦與金屬這兩個成分構成,「高度分散之狀態」表示,氮化鈦粒子與金屬粒子分別個別地存在,且少量成分的粒子未凝聚而均勻、相同地分散。 作為金屬微粒,並無特別限定,例如可舉出選自銅、銀、金、鉑、釩、鎳、錫、鈷、銠、銥、釕、鋨、錳、鉬、鎢、鈮、鉭、鈣、鈦、鉍、銻及鉛、以及該些的合金之至少一種。其中,選自銅、銀、金、鉑、鈀、鎳、錫、鈷、銠及銥、以及該些的合金之至少一種為較佳,選自銅、銀、金、鉑及錫、以及該些的合金之至少一種為更佳。從耐濕性更優異之觀點考慮,銀為較佳。 作為含氮化鈦粒子中的金屬微粒的含量,相對於含氮化鈦粒子的總質量,5質量%以上且50質量%以下為較佳,10質量%以上且30質量%以下為更佳。The titanium nitride-containing particles may be composite particles containing titanium nitride particles and metal particles. Composite particles are particles in which titanium nitride particles and metal particles are composited or in a highly dispersed state. Among them, "compositing" indicates that particles are composed of two components, titanium nitride and metal, and "highly dispersed state" indicates that titanium nitride particles and metal particles exist separately, and particles with a small amount of components are not agglomerated and uniform. , The same dispersed. The metal fine particles are not particularly limited, and examples thereof include copper, silver, gold, platinum, vanadium, nickel, tin, cobalt, rhodium, iridium, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantalum, and calcium. , Titanium, bismuth, antimony and lead, and at least one of these alloys. Among them, at least one selected from the group consisting of copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium, and iridium, and these alloys is preferred, and is selected from copper, silver, gold, platinum, and tin, and the At least one of these alloys is more preferred. From the viewpoint of more excellent moisture resistance, silver is preferred. The content of the metal fine particles in the titanium nitride-containing particles is preferably 5 mass% or more and 50 mass% or less, and more preferably 10 mass% or more and 30 mass% or less with respect to the total mass of the titanium nitride-containing particles.

・含氮化鈦粒子的峰繞射角2θ 將CuKα射線作為X射線源時,含氮化鈦粒子的源自(200)面之峰的繞射角2θ超過42.6°且43.5°以下為較佳。使用含有具有該種特徵之含氮化鈦粒子之硬化性組成物來獲得之硬化膜(例如,黑矩陣等)能夠實現較高之OD值。・ The peak diffraction angle 2θ of titanium nitride-containing particles When CuKα rays are used as the X-ray source, the diffraction angle 2θ of the peaks originating from the (200) plane of titanium nitride-containing particles is more than 42.6 ° and less than 43.5 ° . A hardened film (for example, a black matrix, etc.) obtained using a hardenable composition containing titanium nitride particles having such characteristics can achieve a high OD value.

將CuKα射線作為X射線源來測定鈦化合物的X射線繞射光譜時,作為強度最強之峰,關於TiN,源自(200)面之峰出現在2θ=42.5°附近,關於TiO,源自(200)面之峰出現在2θ=43.4°附近。另一方面,雖然不是強度最強之峰,但關於銳鈦礦型TiO2 ,在2θ=48.1°附近觀測到源自(200)面之峰,關於金紅石型TiO2 ,在2θ=39.2°附近觀測到源自(200)面之峰。藉此,越是含有大量氧原子之晶體狀態,峰位置相對於42.5°越向高角度側位移。When CuKα ray is used as the X-ray source to measure the X-ray diffraction spectrum of a titanium compound, as the strongest peak, the peak originating from the (200) plane of TiN appears near 2θ = 42.5 °, and the TiO originates from ( 200) The peak of the plane appears around 2θ = 43.4 °. On the other hand, although not the strongest peak intensity, but on anatase type TiO 2, in the vicinity of 2θ = 48.1 ° derived from the observed (200) plane of the peak near about the rutile type TiO 2, at 2θ = 39.2 ° A peak originating from the (200) plane was observed. Thereby, as the crystal state containing a large amount of oxygen atoms, the peak position shifts toward the high-angle side with respect to 42.5 °.

從粒子的經時穩定性的觀點考慮,含氮化鈦粒子的源自(200)面之峰的繞射角2θ超過42.6°且小於43.5°為較佳,而且,從製造時的工藝餘量優異之觀點考慮,42.7°以上且小於43.5°為更佳,而且,從粒子性能的再現性優異之觀點考慮,42.7°以上且小於43.4°為進一步較佳。作為副成分含有氧化鈦TiO2 時,作為強度最強之峰,源自銳鈦礦型TiO2 (101)之峰出現在2θ=25.3°附近,源自金紅石型TiO2 (110)之峰出現在2θ=27.4°附近。但是,TiO2 為白色,會成為降低黑矩陣的遮光性之主要原因,因此降低至不會作為峰而被觀察之程度為較佳。From the viewpoint of particle stability over time, it is preferable that the diffraction angle 2θ of the peak originating from the (200) plane of the titanium nitride-containing particles exceeds 42.6 ° and is less than 43.5 °, and from the process margin at the time of manufacture From an excellent point of view, 42.7 ° or more and less than 43.5 ° is more preferable, and from the viewpoint of excellent reproducibility of particle performance, 42.7 ° or more and less than 43.4 ° is more preferable. When titanium oxide TiO 2 is contained as a subsidiary component, as the strongest peak, a peak derived from anatase TiO 2 (101) appears near 2θ = 25.3 °, and a peak derived from rutile TiO 2 (110) appears. Now around 2θ = 27.4 °. However, since TiO 2 is white, it is a factor that reduces the light-shielding property of the black matrix. Therefore, it is preferable to reduce it to such an extent that it cannot be observed as a peak.

能夠藉由X射線繞射峰的半寬度求出構成含氮化鈦粒子之微晶尺寸,利用謝勒(Scherrer)公式進行計算。The crystallite size of the titanium nitride-containing particles can be calculated from the half-width of the X-ray diffraction peak, and calculated using the Scherrer formula.

作為微晶尺寸,20nm以上為較佳,20~50nm為更佳。藉由利用微晶尺寸為20nm以上的含氮化鈦粒子形成黑矩陣,硬化膜的透射光呈如其峰波長為475nm以下的藍色至藍紫色,能夠獲得兼具較高遮光性與紫外線靈敏度之黑矩陣。藉由微晶尺寸為20nm以上,具有活性之粒子表面佔粒子體積之比例變小,成為良好的平衡,成為含氮化鈦粒子的耐熱性和/或耐久性更優異者。The crystallite size is preferably 20 nm or more, and more preferably 20 to 50 nm. By forming a black matrix with titanium nitride-containing particles having a crystallite size of 20 nm or more, the transmitted light of the hardened film is blue to blue-violet as its peak wavelength is 475 nm or less, which can achieve both high light shielding and ultraviolet sensitivity. Black matrix. With a crystallite size of 20 nm or more, the ratio of the surface of active particles to the volume of the particles becomes small, which becomes a good balance, and becomes more excellent in heat resistance and / or durability of titanium nitride-containing particles.

(含有原子A之含金屬氮化物粒子) 作為無機顏料,還能夠使用含金屬氮化物粒子,且在上述含金屬氮化物粒子中含有規定的原子A。 作為含金屬氮化物粒子中的金屬,例如可舉出Nb、V、Cr、Y、Zr、Nb、Hf、Ta、W及Re等,從上述硬化性組成物具有更優異之本發明的效果之角度考慮,Nb或V為更佳。 作為上述原子A,例如可舉出B、Al、Si、Mn、Fe、Ni及Ag等。 含金屬氮化物粒子含有上述原子A時,作為其含量,並無特別限制,含金屬氮化物粒子中的原子A的含量為0.00005~10質量%為較佳。(Metal-Nitride Particles Containing Atomic A) As the inorganic pigment, metal-nitride-containing particles can also be used, and a predetermined atom A is contained in the metal-nitride-containing particles. Examples of the metal in the metal-containing nitride particles include Nb, V, Cr, Y, Zr, Nb, Hf, Ta, W, and Re. The above-mentioned curable composition has more excellent effects of the present invention. From the perspective of consideration, Nb or V is more preferable. Examples of the atom A include B, Al, Si, Mn, Fe, Ni, and Ag. When the metal-containing nitride particle contains the atom A, the content is not particularly limited, and the content of the atom A in the metal-containing nitride particle is preferably 0.00005 to 10% by mass.

作為含有上述原子A之含金屬氮化物粒子的製造方法,並無特別限制,能夠利用公知的方法。 製造含金屬氮化物粒子時,通常利用氣相反應法,具體而言,可舉出電爐法及熱電漿法等。該些製法中,從雜質的混入較少之角度、粒徑易一致之角度及生產率較高之角度等理由考慮,熱電漿法為較佳。 作為基於熱電漿法之含金屬氮化物粒子的具體製造方法,例如可舉出利用金屬微粒製造裝置(與後述之「黑色複合微粒製造裝置」相同的裝置)者。金屬微粒製造裝置例如由產生熱電漿之電漿焰炬、向電漿焰炬內供給金屬原料粉末之材料供給裝置、含有冷卻功能之腔室、對所生成之金屬微粒進行分級之旋風分離器及回收金屬微粒之回收部構成。 另外,本說明書中,金屬微粒表示含有金屬元素之一次粒徑為20nm~40μm的粒子。The method for producing the metal-containing nitride particles containing the atom A is not particularly limited, and a known method can be used. In the production of metal-containing nitride particles, a gas-phase reaction method is generally used, and specifically, an electric furnace method and a thermo-plasma method are mentioned. Among these production methods, a thermoplasma method is preferred from the viewpoints of a small amount of impurities, a point of easy particle size consistency, and a point of high productivity. As a specific manufacturing method of the metal nitride-containing particle based on the pyroplasma method, for example, a metal particle manufacturing device (the same device as the "black composite particle manufacturing device" described later) can be used. The metal particle manufacturing device includes, for example, a plasma torch that generates a thermal plasma, a material supply device that supplies metal raw material powder into the plasma torch, a chamber containing a cooling function, a cyclone separator that classifies the generated metal particles, and The collection part which collects metal fine particles is comprised. In addition, in this specification, a metal fine particle means the particle | grains which have a primary particle diameter containing a metal element of 20 nm-40 micrometers.

作為利用金屬微粒製造裝置之含金屬氮化物粒子的製造方法,並無特別限定,能夠利用公知的方法。其中,從下述的規定平均一次粒徑的含金屬氮化物粒子的產率提高之角度考慮,利用金屬微粒製造裝置製造含金屬氮化物粒子之方法含有以下所示之製程為較佳。 製程A:向電漿焰炬內供給不含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程。 製程B:向電漿焰炬內的熱電漿火焰供給含有過渡金屬之金屬原料粉末來使上述金屬原料粉末蒸發,從而獲得氣相原料金屬之製程。 製程C:冷卻上述氣相原料金屬來獲得含有過渡金屬之金屬微粒之製程。 製程D:向電漿焰炬內供給含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程。 製程E:向電漿焰炬內的熱電漿火焰供給含有過渡金屬之金屬微粒來使上述金屬微粒蒸發,從而獲得氣相原料金屬之製程。 製程F:冷卻上述氣相原料金屬來獲得含金屬氮化物粒子之製程。 並且,含金屬氮化物粒子的製造方法在上述製程C和/或製程F之後,可依據需要,還含有下述製程G。 製程G:對所獲得之粒子進行分級之製程。 而且,可在製程A之前、製程A與製程B之間、製程C與製程D之間、或製程D與製程E之間含有以下製程A2。 製程A2:向含有過渡金屬之金屬原料粉末混合原子A之製程。 而且,可在上述製程A2之前含有以下製程A3-1~A3-3。 製程A3-1:向電漿焰炬內供給不含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程。 製程A3-2:向電漿焰炬內的熱電漿火焰供給含有原子A之原料粉末來使上述原料粉末蒸發,從而獲得氣相原子A之製程。 製程A3-3:冷卻上述氣相原子A來獲得微粒化之原子A之製程。 另外,可在製程A3-3之後還含有製程G。 另外,本說明書中,微粒化之原子A表示含有原子A之一次粒徑是20nm~40μm的粒子。The manufacturing method of the metal nitride-containing particle using a metal particle manufacturing apparatus is not specifically limited, A well-known method can be used. Among them, from the viewpoint of improving the yield of the metal nitride-containing particles having a predetermined average primary particle diameter as described below, it is preferable that the method for producing metal nitride-containing particles using a metal microparticle manufacturing apparatus includes a process shown below. Process A: A process of supplying a plasma torch without an inert gas containing nitrogen as a plasma gas to generate a thermoplasma flame. Process B: A process of supplying a metal raw material powder containing a transition metal to a thermoplasma flame in a plasma torch to evaporate the metal raw material powder to obtain a gas phase raw metal. Process C: a process of cooling the gas-phase raw metal to obtain metal particles containing a transition metal. Process D: A process of supplying a plasma torch containing an inert gas containing nitrogen as a plasma gas to generate a thermoplasma flame. Process E: A process of supplying metal particles containing a transition metal to a thermoplasma flame in a plasma torch to evaporate the metal particles, thereby obtaining a gas-phase raw metal. Process F: a process of cooling the gas-phase raw metal to obtain metal nitride-containing particles. In addition, the method for manufacturing metal-containing nitride particles may include the following process G as required after the process C and / or process F described above. Process G: a process of grading the obtained particles. In addition, the following process A2 may be included before the process A, between the process A and the process B, between the process C and the process D, or between the process D and the process E. Process A2: A process in which atom A is mixed into a metal raw material powder containing a transition metal. In addition, the following processes A3-1 to A3-3 may be included before the aforementioned process A2. Process A3-1: A process of supplying a plasma torch without an inert gas containing nitrogen as a plasma gas to generate a thermoplasma flame. Process A3-2: A process in which a raw material powder containing atom A is supplied to a thermoplasma flame in a plasma torch to evaporate the raw material powder to obtain a gas phase atom A process. Process A3-3: A process of cooling the above-mentioned gas phase atom A to obtain atomized atom A in a micronized form. In addition, process G may be included after process A3-3. In this specification, the atomized atom A means particles having a primary particle diameter of the atom A of 20 nm to 40 μm.

而且,上述含金屬氮化物粒子的製造方法在製程F之後(含有製程G時,在製程F之後的製程G之後)還含有下述的製程H為較佳。 製程H:將在製程F(或製程G)中獲得之含金屬氮化物粒子暴露於水蒸氣及氮氣的混合氛圍來進行氮化處理之製程。 另外,依據需要,上述含金屬氮化物粒子的製造方法亦可在製程H之後還含有製程G。以下,對各製程的較佳態様進行詳細說明。In addition, it is preferable that the method for manufacturing the metal nitride-containing particle described above further includes the following process H after the process F (when the process G is included, after the process G after the process F). Process H: a process in which metal nitride-containing particles obtained in process F (or process G) are subjected to a nitriding treatment by exposing them to a mixed atmosphere of water vapor and nitrogen. In addition, according to need, the manufacturing method of the metal-containing nitride particles may further include a process G after the process H. Hereinafter, a preferred embodiment of each process will be described in detail.

・製程A 製程A是向電漿焰炬內供給不含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程。作為熱電漿火焰的產生方法,並無特別限定,可舉出直流電弧放電法、多相電弧放電法、高頻電漿法及混合式電漿法等,來自電極的雜質的混入較少之高頻電漿法為較佳。 作為基於高頻電漿法之熱電漿火焰的產生方法,並無特別限制,例如,可舉出向含有高頻振蕩用線圈與石英管之電漿焰炬內供給電漿氣體,對上述高頻振蕩用線圈施加高頻電流,藉此獲得熱電漿火焰之方法。 作為製程A中的電漿氣體,可舉出不含有氮氣之惰性氣體。作為不含有氮氣之惰性氣體,可舉出氬氣及氫氣等。不含有氮氣之惰性氣體可單獨使用1種,亦可同時使用2種以上。・ Process A Process A is a process in which a plasma torch is supplied with an inert gas that does not contain nitrogen as a plasma gas to generate a thermoplasma flame. The method for generating the pyroplasma flame is not particularly limited, and examples thereof include a DC arc discharge method, a multi-phase arc discharge method, a high-frequency plasma method, and a hybrid plasma method. A frequency plasma method is preferred. There is no particular limitation on the method for generating a pyroplasma flame by the high-frequency plasma method. For example, a plasma gas is supplied into a plasma torch containing a coil for high-frequency oscillation and a quartz tube, and the high-frequency A method for obtaining a pyroplasmic flame by applying a high-frequency current to an oscillation coil. Examples of the plasma gas in the process A include an inert gas that does not contain nitrogen. Examples of the inert gas that does not contain nitrogen include argon and hydrogen. Inert gases that do not contain nitrogen can be used alone or in combination of two or more.

・製程A2 製程A2是向含有過渡金屬之金屬原料粉末混合原子A之製程。作為原料金屬粉末及原子A的混合方法,並無特別限制,能夠利用公知的方法。例如,向電漿焰炬內供給金屬原料粉末之上述材料供給裝置可含有混合及分散功能。具體而言,能夠利用國際公開第2010/147098號公報的段落0047~0058中記載之材料供給裝置,該內容編入本說明書中。含金屬氮化物粒子的製造方法亦可在製程A2之前還含有以下製程A3-1~A3-3。・ Process A2 Process A2 is a process of mixing atom A into a metal raw material powder containing a transition metal. The method for mixing the raw metal powder and the atom A is not particularly limited, and a known method can be used. For example, the above-mentioned material supply device for supplying the metal raw material powder into the plasma torch may include a mixing and dispersing function. Specifically, the material supply device described in paragraphs 0047 to 0058 of International Publication No. 2010/147098 can be used, and this content is incorporated into this specification. The method for producing metal nitride-containing particles may include the following processes A3-1 to A3-3 before the process A2.

・製程B 製程B是向電漿焰炬內的熱電漿火焰供給含有過渡金屬之金屬原料粉末來使上述金屬原料粉末蒸發,從而獲得氣相的原料金屬之製程。作為向電漿焰炬內的熱電漿火焰供給金屬原料粉末之方法,並無特別限制,從所獲得之氣相的原料金屬成為更均勻之狀態之角度考慮,利用載體氣體噴霧為較佳。作為載體氣體,利用不含有氮氣之惰性氣體為較佳。不含有氮氣之惰性氣體的態様如上述。 製造含金屬氮化物粒子之方法含有上述製程A2時,在將金屬原料粉末供給至電漿焰炬內之前,金屬原料粉末維持均勻的分散狀態為較佳。・ Process B Process B is a process of supplying a metal raw material powder containing a transition metal to a thermo-plasma flame in a plasma torch to evaporate the metal raw material powder to obtain a gas phase raw metal. As a method for supplying the metal raw material powder to the pyroplasma flame in the plasma torch, there is no particular limitation. From the standpoint that the obtained raw material metal in the gas phase becomes more uniform, it is preferable to use a carrier gas spray. As the carrier gas, an inert gas containing no nitrogen is preferably used. The state of the inert gas not containing nitrogen is as described above. When the method for manufacturing metal-containing nitride particles includes the above-mentioned process A2, it is preferable that the metal raw material powder is maintained in a uniformly dispersed state before the metal raw material powder is supplied into the plasma torch.

・製程C 製程C是冷卻氣相的原料金屬來獲得含有過渡金屬之金屬微粒之製程。作為冷卻方法,並無特別限制,利用含有冷卻功能之腔室為較佳。將在製程B中獲得之氣相的原料金屬導入含有上述冷卻功能之腔室,在腔室內快速冷卻,藉此能夠生成下述所希望的粒徑的金屬微粒。所生成之金屬微粒例如藉由回收部被回收。作為腔室內的氛圍,不含有氮氣之惰性氣體為較佳。不含有氮氣之惰性氣體的態様如上述。 另外,藉由經過上述製程A~C,可獲得含有過渡金屬之金屬微粒。含有過渡金屬之金屬微粒在製程E中易蒸發。金屬原料粉末含有雜質時,亦能夠藉由經過上述製程A~C來去除上述雜質。・ Process C Process C is a process of cooling the raw metal in the gas phase to obtain metal particles containing transition metals. The cooling method is not particularly limited, and it is preferable to use a chamber containing a cooling function. The raw metal in the gas phase obtained in the process B is introduced into a chamber containing the above-mentioned cooling function, and rapidly cooled in the chamber, thereby generating metal particles having a desired particle size as described below. The generated metal particles are recovered by, for example, a recovery unit. The atmosphere in the chamber is preferably an inert gas that does not contain nitrogen. The state of the inert gas not containing nitrogen is as described above. In addition, metal particles containing a transition metal can be obtained by the processes A to C described above. Metal particles containing transition metals are easily evaporated in Process E. When the metal raw material powder contains impurities, the impurities can also be removed by going through the above processes A to C.

・製程D 製程D是向電漿焰炬內供給含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程。作為含有氮之惰性氣體,可舉出氮氣及含有惰性氣體之氮氣。作為惰性氣體,可舉出氬氣及氫氣等。含有惰性氣體之氮氣並無特別限制,氮氣的含量通常為10~90莫耳%左右,30~60莫耳%程度為較佳。其他態様與製程A相同。・ Process D Process D is a process of supplying a plasma torch with an inert gas containing nitrogen as a plasma gas to generate a thermoplasma flame. Examples of the nitrogen-containing inert gas include nitrogen and nitrogen containing an inert gas. Examples of the inert gas include argon and hydrogen. The nitrogen containing the inert gas is not particularly limited, and the content of nitrogen is usually about 10 to 90 mol%, preferably about 30 to 60 mol%. Other states are the same as in Process A.

・製程E 製程E是向電漿焰炬內的熱電漿火焰供給含有過渡金屬之金屬微粒來使上述金屬微粒蒸發,從而獲得氣相的原料金屬之製程。作為向電漿焰炬內的熱電漿火焰供給金屬微粒之方法,如上所述,作為載體氣體,含有氮之惰性氣體為較佳。含有氮之惰性氣體的態様如上所述。 製程E中,向熱電漿火焰供給藉由製程A~製程C成為金屬微粒之原料金屬,故易獲得氣相的原料金屬,氣相的原料金屬的狀態亦變得更均勻。・ Process E Process E is a process of supplying metal particles containing a transition metal to a thermoplasma flame in a plasma torch to evaporate the metal particles, thereby obtaining a raw material metal in a gas phase. As a method for supplying the metal particles to the plasma flame in the plasma torch, as described above, as the carrier gas, an inert gas containing nitrogen is preferred. The state of the inert gas containing nitrogen is as described above. In the process E, the raw metal that becomes the metal particles by the process A to the process C is supplied to the thermoplasma flame, so it is easy to obtain the raw metal in the gas phase, and the state of the raw metal in the gas phase becomes more uniform.

・製程F 製程F是冷卻氣相的原料金屬來獲得含有過渡金屬的氮化物之含金屬氮化物粒子之製程。冷卻方法的較佳態樣如上所述,但作為腔室內的氛圍,含有氮氣之惰性氣體為較佳。含有氮氣之惰性氣體的較佳態樣如上所述。• Process F Process F is a process of cooling the raw metal in the gas phase to obtain metal-containing nitride particles containing transition metal nitrides. The preferred aspect of the cooling method is as described above, but as the atmosphere in the chamber, an inert gas containing nitrogen is preferred. A preferred aspect of the inert gas containing nitrogen is as described above.

・製程G 製程G是對所獲得之金屬微粒和/或含金屬氮化物粒子進行分級之製程。作為分級方法,並無特別限制,例如,能夠利用旋風分離器。旋風分離器具有圓錐形的容器,具有在容器內產生迴旋流,利用離心力對粒子進行分級之功能。分級在惰性氣體的氛圍下進行為較佳。惰性氣體的態樣如上所述。・ Process G Process G is a process for classifying the obtained metal particles and / or metal nitride-containing particles. The classification method is not particularly limited, and for example, a cyclone can be used. The cyclone separator has a conical container, which has the function of generating a swirling flow in the container and using centrifugal force to classify particles. The classification is preferably performed under an inert gas atmosphere. The state of the inert gas is as described above.

・製程H 製程H是將含金屬氮化物粒子暴露於水蒸氣及氮氣的混合氛圍來進行氮化處理之製程。藉由經過該製程,能夠使含金屬氮化物粒子中的金屬氮化物的含量更多。對於將含金屬氮化物粒子暴露於水蒸氣及氮氣的混合氛圍之方法,並無特別限制,例如,可舉出將含金屬氮化物粒子導入於充滿混合有水蒸氣及氮氣之氣體之恆溫槽中,靜置或攪拌規定時間之方法,從含金屬氮化物粒子的表面及晶界更穩定化之角度考慮,靜置為更佳。 作為水蒸氣及氮氣的混合比例,若在大氣中,則相對濕度成為25~95%之條件為較佳。靜置或攪拌之時間為0.5~72小時為較佳,此時的溫度為10~40℃為較佳。・ Process H Process H is a process in which metal nitride-containing particles are exposed to a mixed atmosphere of water vapor and nitrogen to perform a nitriding treatment. By this process, the content of the metal nitride in the metal-containing nitride particles can be increased. The method for exposing the metal nitride-containing particles to a mixed atmosphere of water vapor and nitrogen is not particularly limited. For example, the method may be such that the metal nitride-containing particles are introduced into a thermostatic bath filled with a gas mixed with water vapor and nitrogen. The method of standing or stirring for a predetermined period of time is more preferable from the standpoint that the surface and grain boundary of the metal nitride-containing particles are more stable. As a mixing ratio of water vapor and nitrogen, if the relative humidity is 25 to 95% in the atmosphere, it is preferable. The time for standing or stirring is preferably 0.5 to 72 hours, and the temperature at this time is preferably 10 to 40 ° C.

・製程A3-1~A3-3 製程A3-1~A3-3是向電漿焰炬內供給不含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程(A3-1)、向電漿焰炬內的熱電漿火焰供給含有原子A之原料粉末來使上述原料粉末蒸發從而獲得氣相的原子A之製程(A3-2)、及冷卻上述氣相原子A來獲得包含原子A之微粒之製程(A3-3)。各個製程中的態様如在上述製程A、製程B(代替含有過渡金屬之金屬原料粉末,使用含有原子A之原料粉末)、及製程C(代替含有過渡金屬之金屬微粒,獲得被微粒化之原子A。)中已說明之內容。 藉由經過上述製程,原子A被微粒化,於製程E中原子A變得易蒸發。並且,藉由經過上述製程,能夠去除含有原子A之原料粉末所含有之雜質(原子A以外的金屬成分等)。・ Process A3-1 ~ A3-3 Process A3-1 ~ A3-3 is a process (A3-1) for supplying a plasma flame to an inert gas that does not contain nitrogen as a plasma gas to generate a plasma flame. The thermoelectric plasma flame in the plasma torch supplies a raw material powder containing atom A to evaporate the raw material powder to obtain a gas phase atom A (A3-2), and cooling the gas phase atom A to obtain particles containing atom A The manufacturing process (A3-3). The states in each process are as follows: in the above process A, process B (instead of the metal raw material powder containing the transition metal, using the raw material powder containing the atom A), and process C (instead of the metal particles containing the transition metal, the atomized atom is obtained A.). Through the above process, atom A is atomized, and in process E, atom A becomes easy to evaporate. In addition, by the above-described process, impurities (metal components other than atom A, etc.) contained in the raw material powder containing atom A can be removed.

・含有原子A之含金屬氮化物粒子的製造方法的較佳態樣 作為含有原子A之含金屬氮化物粒子的製造方法的較佳態樣,可舉出依次具有以下的製程之方法。 ・製程A:向電漿焰炬內供給不含有氮氣之惰性氣體作為電漿氣體來產生電漿火焰之製程。 ・製程B:向電漿焰炬內的熱電漿火焰供給含有過渡金屬之金屬原料粉末來使上述原料金屬粉末蒸發,從而獲得氣相的原料金屬之製程。 ・製程C:冷卻上述氣相的原料金屬來獲得含有過渡金屬之金屬微粒之製程。 ・製程G:對所獲得之粒子進行分級之製程。 ・製程A3-1:向電漿焰炬內供給不含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程 ・製程A3-2:向電漿焰炬內的熱電漿火焰供給含有原子A之原料粉末來使上述原料粉末蒸發,從而獲得氣相的原子A之製程 ・製程A3-3:冷卻上述氣相的原子A來獲得被微粒化之原子A之製程 ・製程G:對所獲得之粒子進行分級之製程。 ・製程A2:向含有過渡金屬之金屬原料粉末(此時,為金屬微粒)混合原子A(此時,為被微粒化之原子A)之製程。 ・製程D:向電漿焰炬內供給含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程。 ・製程E:向電漿焰炬內的熱電漿火焰供給含有過渡金屬之金屬微粒來使上述金屬微粒蒸發,從而獲得氣相的原料金屬之製程。 ・製程F:冷卻上述氣相原料金屬來獲得含金屬氮化物粒子之製程。 ・製程G:對所獲得之粒子進行分級之製程。 ・製程H:將在製程G中獲得之含金屬氮化物粒子暴露於水蒸氣及氮氣的混合氛圍來進行氮化處理之製程。 上述一系列製程中,可替換製程A~C及製程A3-1~A3-3的順序。亦即,可在製程A3-1~A3-3之後實施製程A~C。・ Preferred aspect of the manufacturing method of the atomic A containing metal nitride particle As a preferable aspect of the manufacturing method of the atomic A containing metal nitride particle, the method which has the following manufacturing processes in order is mentioned.・ Process A: A process of supplying a plasma flame to a plasma flame by supplying an inert gas that does not contain nitrogen as a plasma gas. • Process B: A process of supplying a raw metal powder containing a transition metal to a pyroplasma flame in a plasma torch to evaporate the raw metal powder to obtain a raw metal in a gas phase. • Process C: a process of cooling the raw metal in the gas phase to obtain metal particles containing a transition metal.・ Process G: The process of classifying the obtained particles.・ Process A3-1: A process of supplying a plasma flame torch without a nitrogen gas as a plasma gas to generate a thermoplasma flame. Process A3-2: Supplying a plasma flame containing a plasma A Process A3-3 to obtain the atom A of the gas phase by evaporating the raw material powder to obtain the atomic A of the gas phase. Process A3-3 of cooling the atom A of the gas phase to obtain the atomized A atomized. Process G: Particles are classified. • Process A2: A process of mixing atom A (in this case, atomized A) into a metal raw material powder (in this case, metal particles) containing a transition metal.・ Process D: A process of supplying a plasma torch containing an inert gas containing nitrogen as a plasma gas to generate a thermoplasma flame.・ Process E: A process of supplying metal particles containing a transition metal to a thermoplasma flame in a plasma torch to evaporate the metal particles, thereby obtaining a raw material metal in a gas phase. • Process F: a process of cooling the gas-phase raw metal to obtain metal nitride-containing particles.・ Process G: The process of classifying the obtained particles. • Process H: a process in which the metal nitride-containing particles obtained in process G are exposed to a mixed atmosphere of water vapor and nitrogen to perform a nitriding treatment. In the above series of processes, the order of processes A to C and processes A3-1 to A3-3 can be replaced. That is, the processes A to C can be performed after the processes A3-1 to A3-3.

依上述含有原子A之含金屬氮化物粒子的製造方法的較佳態樣,能夠去除金屬原料粉末及原料粒子所含有之雜質,且能夠製造具有所希望的平均一次粒徑之含金屬氮化物粒子。作為其理由,推斷為過渡金屬和/或原子A藉由電漿處理被離子化,上述離子被冷卻時,過渡金屬、原子A及雜質分別反映熔點而被微粒化。此時,熔點較低之原子的粒子化較快,熔點較高之原子的粒子化較慢。故,如上述,推斷經過一次電漿處理之微粒(製程B及C、以及製程A3-2及A3-3)為易成為單一成分(單結晶)者。若對藉由上述來獲得之單一成分的粒子進行分級,則能夠藉由過渡金屬的粒子和/或原子A的粒子與雜質的粒子的密度和/或粒徑的不同來去除雜質的粒子。上述分級例如能夠利用旋風分離器等並適當設定分級條件來進行。According to a preferred aspect of the method for producing metal-containing nitride particles containing atom A, the metal raw material powder and impurities contained in the raw material particles can be removed, and metal nitride-containing particles having a desired average primary particle diameter can be manufactured. . As a reason therefor, it is presumed that the transition metal and / or the atom A are ionized by plasma treatment, and when the ions are cooled, the transition metal, the atom A, and the impurity reflect the melting point and become micronized. At this time, the atomization of the lower melting point is faster, and the atomization of the higher melting point is slower. Therefore, as mentioned above, it is inferred that the particles (processes B and C, and processes A3-2 and A3-3) that have undergone a single plasma treatment are likely to be a single component (single crystal). By classifying the single-component particles obtained as described above, the particles of the transition metal and / or the particles of the atom A and the particles of the impurities have a difference in density and / or particle diameter to remove the particles of the impurities. The classification can be performed using, for example, a cyclone or the like and appropriately setting classification conditions.

・金屬原料粉末及原料粉末的純化 作為能夠在上述製程B中使用之含有過渡金屬之金屬原料粉末(以下,簡單稱作「金屬原料粉末」。)及含有原子A之原料粉末(以下,簡單稱作「原料粉末」。),並無特別限制,高純度者為較佳。金屬原料粉末中的過渡金屬的含量並無特別限定,99.99%以上為較佳,99.999%以上為更佳。原料粉末中的原子A的含量亦相同。・ Purification of metal raw material powders and raw material powders As metal raw material powders containing transition metals (hereinafter, simply referred to as "metal raw material powders") that can be used in the above-mentioned process B, and raw material powders containing atoms A (hereinafter, simply referred to as As "raw material powder.") There is no particular limitation, and high purity is preferred. The content of the transition metal in the metal raw material powder is not particularly limited, and is preferably 99.99% or more, and more preferably 99.999% or more. The content of the atom A in the raw material powder is also the same.

金屬原料粉末和/或原料粉末有時作為雜質含有所希望的過渡金屬和/或原子A以外的原子。作為金屬原料粉末中含有之雜質,可舉出硼、鋁、矽、錳、鐵、鎳及銀等。並且,作為原料粉末中含有之雜質,可舉出金屬元素等。The metal raw material powder and / or raw material powder may contain a desired transition metal and / or atoms other than atom A as impurities. Examples of impurities contained in the metal raw material powder include boron, aluminum, silicon, manganese, iron, nickel, and silver. Examples of the impurities contained in the raw material powder include metal elements.

含金屬氮化物粒子的製造方法可在製程B之前(含有製程A2時,為製程A2之前)還含有以下製程A0。 製程A0:從金屬原料粉末和/或原料粉末去除雜質之製程。The manufacturing method of the metal nitride-containing particle may include the following process A0 before the process B (when the process A2 is included, before the process A2). Process A0: a process for removing impurities from metal raw material powder and / or raw material powder.

・製程A0 製程A0中,作為從原料金屬粉末和/或原料粉末去除雜質之方法(分離純化方法),並無特別限定,例如,對於鈮,能夠利用日本特開2012-211048號公報的段落0013~0030中記載之方法,對於其他原料金屬粉末和/或原料粉末,亦能夠利用依據該內容之方法。・ Process A0 In process A0, the method (separation and purification method) of removing impurities from the raw metal powder and / or raw material powder is not particularly limited. For example, for niobium, paragraph 0013 of Japanese Patent Application Laid-Open No. 2012-211048 can be used. The method described in ~ 0030 can also be used for other raw material metal powders and / or raw material powders.

・含金屬氮化物粒子的包覆 含金屬氮化物粒子可以是被無機化合物包覆之含金屬氮化物粒子。亦即,可以是具有含金屬氮化物粒子及包覆含金屬氮化物粒子之使用無機化合物形成之包覆層之包覆含金屬氮化物粒子。含有被無機化合物包覆之含金屬氮化物粒子之硬化性組成物具有更優異之分散穩定性。 作為無機化合物,並無特別限定,可舉出SiO2 、ZrO2 、TiO2 、GeO2 、Al2 O3 、Y2 O3 及P2 O5 等氧化物、以及氫氧化鋁及氫氧化鋯等氫氧化物。其中,從易形成更薄的被膜且易形成包覆率更高之被膜之角度考慮,氫氧化鋁為較佳。 意圖控制含金屬氮化物粒子的折射率時,作為低折射率被膜,氧化矽為較佳,作為高折射率被膜,氫氧化鋯為較佳。 對於藉由無機化合物包覆含金屬氮化物粒子之方法,並無特別限制,含金屬氮化物粒子的製造方法含有下述無機化合物包覆製程為較佳。• Coating of metal nitride-containing particles The metal nitride-containing particles may be metal nitride-containing particles coated with an inorganic compound. That is, the coated metal nitride-containing particles may include a metal nitride-containing particle and a coating layer formed using an inorganic compound that coats the metal nitride-containing particle. The curable composition containing metal nitride-containing particles coated with an inorganic compound has more excellent dispersion stability. The inorganic compound is not particularly limited, and examples thereof include oxides such as SiO 2 , ZrO 2 , TiO 2 , GeO 2 , Al 2 O 3 , Y 2 O 3 and P 2 O 5 , and aluminum hydroxide and zirconium hydroxide. And other hydroxides. Among them, aluminum hydroxide is preferred from the viewpoint of easily forming a thinner film and easily forming a film with a higher coverage. When the refractive index of the metal-containing nitride particles is intended to be controlled, silicon oxide is preferred as a low refractive index coating, and zirconium hydroxide is preferred as a high refractive index coating. The method for coating the metal nitride-containing particles with an inorganic compound is not particularly limited, and the method for producing a metal nitride-containing particle preferably includes the following inorganic compound coating process.

・無機化合物包覆製程 無機化合物包覆製程是藉由氧化物和/或氫氧化物包覆上述含金屬氮化物粒子之製程。作為包覆方法,並無特別限制,例如可舉出以下的濕式塗佈法等。・ Inorganic compound coating process The inorganic compound coating process is a process in which the above-mentioned metal-containing nitride particles are coated with an oxide and / or a hydroxide. The coating method is not particularly limited, and examples thereof include the following wet coating methods.

作為第1濕式塗佈法,首先,混合上述含金屬氮化物粒子與水來製作漿料。接著,使上述漿料與含有選自由Si、Zr、Ti、Ge、Al、Y及P所組成之群組之至少一種之水溶性化合物(例如,矽酸鈉)反應,藉由傾析法和/或離子交換樹脂等去除多餘的鹼離子。之後,使上述漿料乾燥來獲得被氧化物包覆之含金屬氮化物粒子。As a first wet coating method, first, the metal-containing nitride particles and water are mixed to prepare a slurry. Next, the slurry is reacted with a water-soluble compound (for example, sodium silicate) containing at least one selected from the group consisting of Si, Zr, Ti, Ge, Al, Y, and P. And / or ion exchange resin to remove excess alkali ions. Thereafter, the slurry is dried to obtain metal-containing nitride particles coated with an oxide.

作為第2濕式塗佈法,首先,混合上述含金屬氮化物粒子與醇等有機溶劑來製作漿料。接著,在上述漿料中生成含有選自由Si、Zr、Ti、Ge、Al、Y及P所組成之群組之至少一種之醇鹽等有機金屬化合物,以高溫燒成上述漿料。若以高溫燒成上述漿料,則進行溶膠凝膠反應,可獲得被氧化物包覆之含金屬氮化物粒子。As a second wet coating method, first, the above-mentioned metal-containing nitride particles and an organic solvent such as an alcohol are mixed to prepare a slurry. Next, an organic metal compound such as an alkoxide containing at least one selected from the group consisting of Si, Zr, Ti, Ge, Al, Y, and P is generated in the slurry, and the slurry is fired at a high temperature. When the above slurry is fired at a high temperature, a sol-gel reaction is performed to obtain metal-containing nitride particles coated with an oxide.

作為第3濕式塗佈法,在含金屬氮化物粒子的存在下,利用尿素與氯化鋁,製作含有離子液體之漿料。從該漿料取出含金屬氮化物粒子並使其乾燥,之後,燒成上述含金屬氮化物粒子,藉此可獲得被含有氫氧化鋁之氫氧化物包覆之含金屬氮化物粒子。As a third wet coating method, a slurry containing an ionic liquid was produced using urea and aluminum chloride in the presence of metal-containing nitride particles. The metal nitride-containing particles are taken out from the slurry and dried, and thereafter the metal nitride-containing particles are fired, whereby metal-containing nitride particles coated with a hydroxide containing aluminum hydroxide can be obtained.

(有機顔料) 作為有機顏料,例如可舉出以下:比色指數(C.I.)顏料黃1,2,3,4,5,6,10,11,12,13,14,15,16,17,18,20,24,31,32,34,35,35:1,36,36:1,37,37:1,40,42,43,53,55,60,61,62,63,65,73,74,77,81,83,86,93,94,95,97,98,100,101,104,106,108,109,110,113,114,115,116,117,118,119,120,123,125,126,127,128,129,137,138,139,147,148,150,151,152,153,154,155,156,161,162,164,166,167,168,169,170,171,172,173,174,175,176,177,179,180,181,182,185,187,188,193,194,199,213,214等; C.I.顏料橙 2,5,13,16,17:1,31,34,36,38,43,46,48,49,51,52,55,59,60,61,62,64,71,73等; C.I.顏料紅 1,2,3,4,5,6,7,9,10,14,17,22,23,31,38,41,48:1,48:2,48:3,48:4,49,49:1,49:2,52:1,52:2,53:1,57:1,60:1,63:1,66,67,81:1,81:2,81:3,83,88,90,105,112,119,122,123,144,146,149,150,155,166,168,169,170,171,172,175,176,177,178,179,184,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246,254,255,264,270,272,279等; C.I.顏料綠 7,10,36,37,58,59等; C.I.顏料紫 1,19,23,27,32,37,42等;及 C.I.顏料藍 1,2,15,15:1,15:2,15:3,15:4,15:6,16,22,60,64,66,79,80等。另外,顏料可單獨使用1種,亦可同時使用2種以上。(Organic Pigment) Examples of the organic pigment include: Colorimetric Index (CI) Pigment Yellow 1,2,3,4,5,6,10,11,12,13,14,15,16,17, 18, 20, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169,170,171,172,173,174,175,176,177,179,180,181,182,185,187,188,193,194,199,213,214, etc .; CI Pigment Orange 2,5, 13, 16, 17: 1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73, etc .; CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48: 1, 48: 2, 48: 3, 48: 4, 49, 49: 1,49: 2, 52: 1, 52: 2, 53: 1, 57: 1, 60: 1, 63: 1 66, 67, 81: 1, 81: 2, 81: 3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178, 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 264, 270, 272, 279, etc .; CI Pigment Green 7, 10, 36, 37, 58, 59, etc .; CI Pigment Violet 1, 19, 23, 27, 32, 37, 42, etc .; and CI Pigment Blue 1, 2, 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 22, 60, 64, 66, 79, 80 and so on. The pigment may be used alone or in combination of two or more.

<染料> 作為染料,例如能夠使用日本特開昭64-90403號公報、日本特開昭64-91102號公報、日本特開平1-94301號公報、日本特開平6-11614號公報、日本特登2592207號、美國專利第4808501號說明書、美國專利第5667920號說明書、美國專利第505950號說明書、日本特開平5-333207號公報、日本特開平6-35183號公報、日本特開平6-51115號公報、日本特開平6-194828號公報等中公開之色素。若以化學結構予以區分,則能夠使用吡唑偶氮化合物、吡咯亞甲基化合物、苯胺偶氮化合物、三苯甲烷化合物、蒽醌化合物、亞苄基化合物、氧雜菁化合物、吡唑并三唑偶氮化合物、吡啶酮偶氮化合物、花青化合物、啡噻嗪化合物、吡咯并吡唑甲亞胺化合物等。作為染料,還可使用色素多聚體。作為色素多聚體,可舉出日本特開2011-213925號公報、日本特開2013-041097號公報中記載之化合物。可使用分子內具有聚合性之聚合性染料,作為市售品,例如,可舉出Wako Pure Chemical Industries, Ltd.製RDW系列。<Dye> For example, Japanese Patent Application Laid-Open No. 64-90403, Japanese Patent Application Laid-Open No. 64-91102, Japanese Patent Application Laid-Open No. 1-94301, Japanese Patent Application Laid-Open No. 6-11614, and Japanese Patent Application No. No. 2592207, U.S. Patent No. 4885501, U.S. Patent No. 5,667,920, U.S. Patent No. 505950, Japanese Patent Laid-Open No. 5-333207, Japanese Patent Laid-Open No. 6-35183, Japanese Patent Laid-Open No. 6-51115 And pigments disclosed in Japanese Patent Application Laid-Open No. 6-194828. When distinguished by chemical structure, pyrazole azo compounds, pyrrole methylene compounds, aniline azo compounds, triphenylmethane compounds, anthraquinone compounds, benzylidene compounds, oxacyanine compounds, and pyrazolotriazoles An azole azo compound, a pyridone azo compound, a cyanine compound, a phenothiazine compound, a pyrrolopyrazole imine compound, and the like. As the dye, a pigment multimer can also be used. Examples of the pigment multimer include compounds described in Japanese Patent Application Laid-Open No. 2011-213925 and Japanese Patent Application Laid-Open No. 2013-041097. As a commercially available product, a polymerizable dye having polymerizability in a molecule can be used, and for example, an RDW series manufactured by Wako Pure Chemical Industries, Ltd. can be used.

<紅外線吸收劑> 著色劑可還含有紅外線吸收劑。 紅外線吸收劑表示在紅外區域(波長650~1,300nm為較佳)的波長區域具有吸收之化合物。紅外線吸收劑為在波長675~900nm的波長區域具有極大吸收波長之化合物為較佳。 作為具有該種分光特性之著色劑,例如,可舉出吡咯并吡咯化合物、銅化合物、花青化合物、酞菁化合物、亞銨化合物、硫醇錯合物系化合物、過渡金屬氧化物系化合物、方酸菁化合物、萘酞菁化合物、夸特銳烯化合物、二硫醇金屬錯合物系化合物、克酮鎓化合物等。 酞菁化合物、萘酞菁化合物、亞銨化合物、花青化合物、方酸菁化合物及克酮鎓化合物可使用日本特開2010-111750號公報的段落0010~0081中公開的化合物,該內容編入本說明書中。花青化合物例如能夠參閱「功能性色素、大河原信/松崗賢/北尾悌次郎/平嶋恆亮編著、kodansha Scientific Ltd.」,該內容編入本說明書中。<Infrared absorbing agent> The coloring agent may further contain an infrared absorbing agent. The infrared absorber means a compound having absorption in a wavelength region of an infrared region (wavelength of 650 to 1,300 nm is preferable). The infrared absorber is preferably a compound having a maximum absorption wavelength in a wavelength range of 675 to 900 nm. Examples of the coloring agent having such a spectroscopic property include a pyrrolopyrrole compound, a copper compound, a cyanine compound, a phthalocyanine compound, an ammonium compound, a thiol complex compound, a transition metal oxide compound, Squaric acid cyanine compounds, naphthalocyanine compounds, quartrenene compounds, dithiol metal complex compounds, ketonium compounds, and the like. The phthalocyanine compound, naphthalocyanine compound, immonium compound, cyanine compound, squarocyanine compound, and ketonium compound can use the compounds disclosed in paragraphs 0010 to 0081 of Japanese Patent Laid-Open No. 2010-111750, and the contents are incorporated herein. In the manual. The cyanine compound can be referred to, for example, "functional pigments, edited by Ogawara Shinzo / Matsuoka Ken / Hiro Kitahiro / Hirakuri Hiroshi, kodansha Scientific Ltd.", and this content is incorporated into this specification.

作為具有上述分光特性之著色劑,還能夠使用日本特開平07-164729號公報的段落0004~0016中公開的化合物和/或日本特開2002-146254號公報的段落0027~0062中公開的化合物、日本特開2011-164583號公報的段落0034~0067中公開的包含含有Cu和/或P之氧化物的微晶且數平均凝聚粒徑為5~200nm之近紅外線吸收粒子。As the coloring agent having the above-mentioned spectral characteristics, compounds disclosed in paragraphs 0004 to 0016 of Japanese Patent Application Laid-Open No. 07-164729 and / or compounds disclosed in paragraphs 0027 to 0061 of Japanese Patent Application Laid-Open No. 2002-146254, Near-infrared absorbing particles containing microcrystals of Cu and / or P-containing oxides and having a number-average agglomerated particle diameter of 5 to 200 nm, which are disclosed in paragraphs 0034 to 0066 of Japanese Patent Application Laid-Open No. 2011-164583.

作為在波長675~900nm的波長區域具有極大吸收波長之化合物,選自由花青化合物、吡咯并吡咯化合物、方酸菁化合物、酞菁化合物及萘酞菁化合物所組成之群組之至少一種為較佳。 紅外線吸收劑是在25℃的水中溶解1質量%以上之化合物為較佳,在25℃的水中溶解10質量%以上之化合物為更佳。藉由使用該種化合物,耐溶劑性得到優化。 吡咯并吡咯化合物能夠參閱日本特開2010-222557號公報的段落號0049~0062,該內容編入本說明書中。花青化合物及方酸菁化合物能夠參閱國際公開2014/088063號公報的段落號0022~0063、國際公開2014/030628號公報的段落號0053~0118、日本特開2014-59550號公報的段落號0028~0074、國際公開2012/169447號公報的段落號0013~0091、日本特開2015-176046號公報的段落號0019~0033、日本特開2014-63144號公報的段落號0053~0099、日本特開2014-52431號公報的段落號0085~0150、日本特開2014-44301號公報的段落號0076~0124、日本特開2012-8532號公報的段落號0045~0078、日本特開2015-172102號公報的段落號0027~0067、日本特開2015-172004號公報的段落號0029~0067、日本特開2015-40895號公報的段落號0029~0085、日本特開2014-126642號公報的段落號0022~0036、日本特開2014-148567號公報的段落號0011~0017、日本特開2015-157893號公報的段落號0010~0025、日本特開2014-095007號公報的段落號0013~0026、日本特開2014-80487號公報的段落號0013~0047及日本特開2013-227403號公報的段落號0007~0028等,該內容編入本說明書中。As a compound having a maximum absorption wavelength in a wavelength range of 675 to 900 nm, at least one selected from the group consisting of a cyanine compound, a pyrrolopyrrole compound, a squaraine compound, a phthalocyanine compound, and a naphthalocyanine compound is more preferable. good. The infrared absorber is preferably a compound that dissolves 1% by mass or more in water at 25 ° C, and more preferably that a compound that dissolves 10% by mass or more in water at 25 ° C. By using this compound, the solvent resistance is optimized. The pyrrolopyrrole compounds can be referred to Japanese Patent Application Laid-Open No. 2010-222557, paragraph numbers 0049 to 0061, and the contents are incorporated herein. For cyanine compounds and cyanocyanine compounds, refer to paragraph numbers 0022 to 0063 of International Publication No. 2014/088063, paragraph numbers 0053 to 0118 of International Publication No. 2014/030628, and paragraph number 0028 of Japanese Patent Application Publication No. 2014-59550. ~ 0074, Paragraph Nos. 0013 to 0091 of International Publication No. 2012/169447, Paragraph Nos. 0019 to 0033 of Japanese Patent Laid-Open No. 2015-176046, Paragraph Nos. 0053 to 0099 of Japanese Patent Laid-Open No. 2014-63144, Paragraph Nos. 0085 to 0150 of 2014-52431, Paragraph Nos. 0076 to 0124 of Japanese Patent Laid-Open No. 2014-44301, Paragraph Nos. 0045 to 0078 of Japanese Patent Laid-Open No. 2012-8532, and Japanese Patent Laid-Open No. 2015-172102 Paragraph number 0027-0067, paragraph number 0029-0067 of Japanese Patent Laid-Open No. 2015-172004, paragraph number 0029-0085 of Japanese Patent Laid-open No. 2015-40895, paragraph number 0022- of Japanese Patent Laid-open No. 2014-126642 0036, Japanese Patent Application Laid-Open No. 2014-148567, paragraph numbers 0011 to 0017, Japanese Patent Application Laid-open No. 2015-157893, paragraph numbers 0010 to 0025, Japanese Patent Application Laid-open No. 2014-095007, paragraph numbers 0013 to 0026, Japanese Patent Laid-Open 2014-80487 The paragraph numbers 0013 to 0047 and the paragraph numbers 0007 to 0028 of Japanese Patent Application Laid-Open No. 2013-227403 are incorporated in this description.

紅外線吸收劑是選自由以下述通式1~3表示之化合物所組成之群組之至少一種為較佳。 通式1 【化學式1】通式1中,A1 及A2 分別獨立地表示芳基、雜芳基或以下述通式1-A表示之基團。 通式1-A 【化學式2】通式1-A中,Z1A 表示形成含氮雜環之非金屬原子團,R2A 表示烷基、烯基或芳烷基,d表示0或1,波浪線表示連結鍵。 通式2 【化學式3】通式2中,R1a 及R1b 分別獨立地表示烷基、芳基或雜芳基, R2 ~R5 分別獨立地表示氫原子或取代基,R2 與R3 、R4 與R5 可分別鍵結而形成環, R6 及R7 分別獨立地表示氫原子、烷基、芳基、雜芳基、-BRA RB 或金屬原子,RA 及RB 分別獨立地表示氫原子或取代基, R6 可與R1a 或R3 共價鍵結或配位鍵結, R7 可與R1b 或R5 共價鍵結或配位鍵結。 通式3 【化學式4】通式3中,Z1 及Z2 分別獨立地為形成可以縮環之5員或6員的含氮雜環之非金屬原子團, R101 及R102 分別獨立地表示烷基、烯基、炔基、芳烷基或芳基, L1 表示包含奇數個次甲基之次甲基鏈, a及b分別獨立地為0或1, a為0時,碳原子與氮原子以雙鍵鍵結,b為0時,碳原子與氮原子以單鍵鍵結, 式中以Cy表示之部位為陽離子部時,X1 表示陰離子,c表示為了維持電荷的平衡而所需之數,式中以Cy表示之部位為陰離子部時,X1 表示陽離子,c表示為了維持電荷的平衡而所需之數,式中以Cy表示之部位的電荷在分子內被中和時,c為0。The infrared absorbing agent is preferably at least one selected from the group consisting of compounds represented by the following general formulae 1 to 3. Formula 1 [Chemical Formula 1] In Formula 1, A 1 and A 2 each independently represent an aryl group, a heteroaryl group, or a group represented by the following Formula 1-A. Formula 1-A [Chemical Formula 2] In Formula 1-A, Z 1A represents a non-metal atomic group forming a nitrogen-containing heterocyclic ring, R 2A represents an alkyl group, an alkenyl group, or an aralkyl group, d represents 0 or 1, and a wavy line represents a bonding bond. Formula 2 [Chemical Formula 3] In Formula 2, R 1a and R 1b each independently represent an alkyl group, an aryl group, or a heteroaryl group, R 2 to R 5 each independently represent a hydrogen atom or a substituent, and R 2 and R 3 , R 4 and R 5 May be bonded to form a ring, R 6 and R 7 each independently represent a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, -BR A R B or a metal atom, and R A and R B each independently represent a hydrogen atom Or a substituent, R 6 may be covalently bonded or coordinated to R 1a or R 3 , and R 7 may be covalently bonded or coordinated to R 1b or R 5 . Formula 3 [Chemical Formula 4] In Formula 3, Z 1 and Z 2 are each independently a non-metallic atomic group forming a nitrogen-containing heterocyclic ring of 5 or 6 members, and R 101 and R 102 each independently represent an alkyl group, an alkenyl group, and an alkyne group. Group, aralkyl group or aryl group, L 1 represents a methine chain containing an odd number of methine groups, a and b are independently 0 or 1, and when a is 0, a carbon atom and a nitrogen atom are bonded by a double bond When b is 0, the carbon atom and nitrogen atom are bonded by a single bond. When the site represented by Cy in the formula is a cationic moiety, X 1 represents an anion, and c represents the number required to maintain the balance of the charge. When the site represented by Cy is an anion site, X 1 represents a cation, and c represents a number required to maintain the balance of the charge. When the charge of the site represented by Cy is neutralized in the molecule, c is 0.

<顏料衍生物> 硬化性組成物可含有顏料衍生物。顏料衍生物是具有藉由酸性基、鹼性基或鄰苯二甲酸亞胺甲基取代有機顔料的一部分之結構之化合物為較佳。作為顏料衍生物,從著色劑A的分散性及分散穩定性的觀點考慮,具有酸性基或鹼性基之顏料衍生物為較佳。顏料衍生物具有鹼性基為特佳。上述樹脂(分散劑)與顏料衍生物的組合是分散劑為酸性分散劑且顏料衍生物具有鹼性基之組合為較佳。<Pigment derivative> The curable composition may contain a pigment derivative. The pigment derivative is preferably a compound having a structure in which a part of the organic pigment is replaced by an acidic group, a basic group, or an iminomethyl phthalate. As the pigment derivative, a pigment derivative having an acidic group or a basic group is preferred from the viewpoint of dispersibility and dispersion stability of the colorant A. It is particularly preferred that the pigment derivative has a basic group. The combination of the resin (dispersant) and the pigment derivative is preferably a combination in which the dispersant is an acidic dispersant and the pigment derivative has a basic group.

作為用於構成顏料衍生物之有機顔料,可舉出二氧代吡咯并吡咯系顔料、偶氮系顔料、酞菁系顔料、蒽醌系顔料、喹吖啶酮系顔料、二噁嗪系顔料、紫環酮系顔料、苝系顔料、硫靛系顔料、異吲哚啉系顔料、異吲哚啉酮系顔料、喹酞酮系顔料、士林系顔料及金屬絡合物系顔料等。 作為顏料衍生物所具有之酸性基,磺酸基、羧酸基及其鹽為較佳,羧酸基及磺酸基為更佳,磺酸基為進一步較佳。作為顏料衍生物所具有之鹼性基,胺基為較佳,三級胺基為更佳。Examples of the organic pigment used to constitute the pigment derivative include dioxopyrrolopyrrole-based pigments, azo-based pigments, phthalocyanine-based pigments, anthraquinone-based pigments, quinacridone-based pigments, and dioxazine-based pigments. , Ringone-based pigments, fluorene-based pigments, thioindigo-based pigments, isoindolinone-based pigments, isoindolinone-based pigments, quinophthalone-based pigments, Shihlin-based pigments, and metal complex-based pigments. As the acidic group of the pigment derivative, a sulfonic acid group, a carboxylic acid group, and a salt thereof are preferred, a carboxylic acid group and a sulfonic acid group are more preferred, and a sulfonic acid group is further preferred. As the basic group possessed by the pigment derivative, an amine group is preferable, and a tertiary amine group is more preferable.

硬化性組成物含有顏料衍生物時,顏料衍生物的含量相對於顔料的質量,1~30質量%為較佳,3~20質量%為更佳。顏料衍生物可僅使用1種,亦可同時使用2種以上。When the curable composition contains a pigment derivative, the content of the pigment derivative is preferably 1 to 30% by mass, and more preferably 3 to 20% by mass relative to the mass of the pigment. The pigment derivative may be used singly or in combination of two or more kinds.

〔光聚合起始劑〕 作為光聚合起始劑,只要能夠引發聚合性化合物的聚合,則並無特別限制,能夠使用公知的光聚合起始劑。作為光聚合起始劑,例如,對紫外線區域至可見光線區域具有感光性者為較佳。並且,可以是與被光激發之敏化劑產生某些作用,並生成活性自由基之活性劑,亦可以是依據聚合性化合物的種類而引發陽離子聚合之起始劑。 光聚合起始劑含有至少一種於約300nm~800nm(330nm~500nm為更佳。)的波長區域內具有至少約50莫耳吸光系數之化合物為較佳。[Photopolymerization initiator] The photopolymerization initiator is not particularly limited as long as it can initiate polymerization of a polymerizable compound, and a known photopolymerization initiator can be used. As the photopolymerization initiator, for example, those having photosensitivity in the ultraviolet region to the visible light region are preferred. In addition, it may be an active agent that has some effect with a photosensitized sensitizer and generates active radicals, or may be an initiator that initiates cationic polymerization depending on the type of polymerizable compound. The photopolymerization initiator preferably contains at least one compound having a light absorption coefficient of at least about 50 moles in a wavelength region of about 300 nm to 800 nm (more preferably 330 nm to 500 nm.).

作為光聚合起始劑的含量,相對於硬化性組成物的總固體成分,0.1質量%以上為較佳,0.5質量%以上為更佳,1質量%以上為進一步較佳,超過1質量%為特佳,30質量%以下為較佳,20質量%以下為更佳,10質量%以下為進一步較佳,小於10質量%為特佳。 若光聚合起始劑的含量相對於硬化性組成物的總固體成分,超過1質量%且小於10質量%,則使硬化性組成物硬化來獲得之硬化膜的圖案形狀更優異。 光聚合起始劑可單獨使用1種,亦可同時使用2種以上。同時使用2種以上的光聚合起始劑時,其合計量在上述範圍內為較佳。The content of the photopolymerization initiator is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, more preferably 1% by mass or more, and more than 1% by mass based on the total solid content of the curable composition. Particularly preferred, 30% by mass or less is preferred, 20% by mass or less is more preferred, 10% by mass or less is further preferred, and less than 10% by mass is particularly preferred. When the content of the photopolymerization initiator is more than 1% by mass and less than 10% by mass relative to the total solid content of the curable composition, the pattern shape of the cured film obtained by curing the curable composition is more excellent. The photopolymerization initiator may be used singly or in combination of two or more kinds. When two or more photopolymerization initiators are used at the same time, the total amount thereof is preferably within the above range.

作為光聚合起始劑,例如可舉出鹵代烴衍生物(例如,含有三嗪骨架者,具有噁二唑骨架者等)、醯基氧化膦等醯基膦化合物、六芳基雙咪唑、肟衍生物等肟化合物、有機過氧化物、硫化合物、酮化合物、芳香族鎓鹽、酮肟醚、胺基苯乙酮化合物及對羥基苯乙酮等。 作為含有上述三嗪骨架之鹵代烴化合物,例如可舉出若林等人著、Bull.Chem.Soc.Japan,42、2924(1969)記載之化合物、英國專利1388492號說明書所記載之化合物、日本特開昭53-133428號公報所記載之化合物、德國專利3337024號說明書所記載之化合物、基於F.C.Schaefer等之J.Org.Chem.;29、1527(1964)所記載之化合物、日本特開昭62-58241號公報所記載之化合物、日本特開平5-281728號公報所記載之化合物、日本特開平5-34920號公報所記載之化合物、美國專利第4212976號說明書所記載之化合物等。Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (for example, those containing a triazine skeleton and those having an oxadiazole skeleton), fluorenylphosphine compounds such as fluorenylphosphine oxide, hexaarylbisimidazole, Oxime compounds such as oxime derivatives, organic peroxides, sulfur compounds, ketone compounds, aromatic onium salts, ketoxime ethers, aminoacetophenone compounds, and p-hydroxyacetophenone. Examples of the halogenated hydrocarbon compound containing the triazine skeleton include a compound described in Wakabayashi et al., A compound described in Bull. Chem. Soc. Japan, 42, 2924 (1969), a compound described in British Patent No. 1384492, and Japan Compounds described in JP 53-133428, compounds described in German Patent No. 3370024, compounds based on FC Schaefer et al. J. Org. Chem .; 29, 1527 (1964), Japanese Patent Laid-Open Compounds described in JP 62-58241, compounds described in JP 5-281728, compounds described in JP 5-34920, compounds described in US Patent No. 4212976, and the like.

就曝光靈敏度的觀點而言,是選自包含三鹵代甲基三嗪化合物、苄基二甲基縮酮化合物、α-羥基酮化合物、α-胺基酮化合物、醯基膦化合物、氧化膦化合物、茂金屬化合物、肟化合物、三烯丙基咪唑二聚體、鎓化合物、苯并噻唑化合物、二苯甲酮化合物、苯乙酮化合物及其衍生物、環戊二烯-苯-鐵錯合物及其鹽、鹵代甲基噁二唑化合物以及3-芳基取代香豆素化合物中的化合物為較佳。From the viewpoint of exposure sensitivity, it is selected from the group consisting of trihalomethyltriazine compounds, benzyldimethylketal compounds, α-hydroxyketone compounds, α-aminoketone compounds, fluorenylphosphine compounds, and phosphine oxides. Compounds, metallocene compounds, oxime compounds, triallyl imidazole dimers, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds and their derivatives, cyclopentadiene-benzene-iron Compounds and their salts, halogenated methyloxadiazole compounds, and 3-aryl-substituted coumarin compounds are preferred.

其中,三鹵甲基三嗪化合物、α-胺基酮化合物、醯基膦化合物、氧化膦化合物、肟化合物、三烯丙基咪唑二聚體、鎓化合物、二苯甲酮化合物或苯乙酮化合物為更佳,選自由三鹵甲基三嗪化合物、α-胺基酮化合物、肟化合物、三烯丙基咪唑二聚體及二苯甲酮化合物所組成之群組之至少一種化合物為進一步較佳。Among them, trihalomethyltriazine compounds, α-aminoketone compounds, fluorenylphosphine compounds, phosphine oxide compounds, oxime compounds, triallyl imidazole dimers, onium compounds, benzophenone compounds, or acetophenone More preferably, the compound is at least one compound selected from the group consisting of a trihalomethyltriazine compound, an α-amino ketone compound, an oxime compound, a triallyl imidazole dimer, and a benzophenone compound. Better.

尤其,在遮光膜的製作中使用硬化性組成物時,由於需要將微細的圖案形成為清晰的形狀,故不僅是硬化性而且在未曝光部不留殘渣地進行顯影至關重要。從該種觀點考慮,作為光聚合引發劑使用肟化合物為特佳。尤其,形成微細的圖案時,在硬化用曝光中使用步進機曝光,但該曝光機有時因鹵素而受到損傷,且還需要將光聚合起始劑的添加量抑制得較低。若考慮該些方面,則形成微細圖案時,作為光聚合起始劑使用肟化合物為特佳。 作為光聚合起始劑的具體例,例如,能夠參閱日本特開2013-29760號公報的段落0265~0268,該內容編入本說明書中。In particular, when a curable composition is used in the production of a light-shielding film, it is necessary to develop a fine pattern into a clear shape, so that it is not only curable but also developed in a non-exposed area without leaving a residue. From such a viewpoint, it is particularly preferable to use an oxime compound as a photopolymerization initiator. In particular, when forming a fine pattern, exposure is performed using a stepper for curing exposure. However, the exposure machine may be damaged by halogen, and it is also necessary to suppress the addition amount of the photopolymerization initiator to be low. Considering these points, it is particularly preferable to use an oxime compound as a photopolymerization initiator when forming a fine pattern. As a specific example of the photopolymerization initiator, for example, paragraphs 0265 to 0268 of Japanese Patent Application Laid-Open No. 2013-29760 can be referred to, and the contents are incorporated into this specification.

作為光聚合起始劑,亦能夠適當地使用對羥基苯乙酮化合物、胺基苯乙酮化合物及醯基膦化合物。更具體而言,例如,亦能夠使用日本特開平10-291969號公報中所記載之胺基苯乙酮系起始劑及日本專利第4225898號公報中所記載之醯基膦系起始劑。 作為對羥基苯乙酮化合物,能夠使用IRGACURE-184、DAROCUR-1173、IRGACURE-500、IRGACURE-2959及IRGACURE-127(商品名:均為BASF公司製造)。 作為胺基苯乙酮化合物,能夠使用作為市售品之IRGACURE-907、IRGACURE-369或IRGACURE-379EG(商品名、均為BASF公司製造)。作為胺基苯乙酮化合物,亦能夠使用吸收波長與365nm或405nm等的長波光源匹配之日本特開2009-191179公報中記載之化合物。 作為醯基膦化合物,能夠使用作為市售品之IRGACURE-819或DAROCUR-TPO(商品名、均為BASF公司製造)。As the photopolymerization initiator, a p-hydroxyacetophenone compound, an aminoacetophenone compound, and a fluorenylphosphine compound can also be suitably used. More specifically, for example, an aminoacetophenone-based initiator described in Japanese Patent Application Laid-Open No. 10-291969 and a fluorenylphosphine-based initiator described in Japanese Patent No. 4225898 can also be used. As the p-hydroxyacetophenone compound, IRGACURE-184, DAROCUR-1173, IRGACURE-500, IRGACURE-2959, and IRGACURE-127 (trade names: all manufactured by BASF Corporation) can be used. As the amine acetophenone compound, IRGACURE-907, IRGACURE-369, or IRGACURE-379EG (trade names, all manufactured by BASF) can be used as commercially available products. As the amine acetophenone compound, a compound described in Japanese Patent Application Laid-Open No. 2009-191179 whose absorption wavelength matches a long-wave light source such as 365 nm or 405 nm can also be used. As a fluorenylphosphine compound, IRGACURE-819 or DAROCUR-TPO (trade name, all manufactured by BASF) can be used as a commercial item.

<肟化合物> 作為光聚合起始劑,可更佳地舉出肟化合物(肟系起始劑)。尤其,肟化合物為高靈敏度且聚合效率較高,能夠與著色劑濃度無關地進行硬化性組成物層的硬化,易將著色劑的濃度設計為較高,故較佳。 作為肟化合物的具體例,能夠使用日本特開2001-233842號公報記載的化合物、日本特開2000-80068號公報記載的化合物或日本特開2006-342166號公報記載的化合物。 作為肟化合物,例如可舉出,3-苯甲醯氧基亞胺基丁烷-2-酮、3-乙醯氧基亞胺基丁烷-2-酮、3-丙醯氧基亞胺基丁烷-2-酮、2-乙醯氧基亞胺基戊烷-3-酮、2-苯甲醯氧基亞胺基-1-苯基丙烷-1-酮、3-(4-甲苯磺醯氧基)亞胺基丁烷-2-酮、以及2-乙氧基羰氧基亞胺基-1-苯基丙烷-1-酮等。 並且,亦可舉出J.C.S.PerkinII(1979年)pp.1653-1660、J.C.S.PerkinII(1979年)pp.156-162、Journal of Photopolymer Scienceand Technology(1995年)pp.202-232、日本特開2000-66385號公報記載之化合物、日本特開2000-80068號公報、日本特表2004-534797號公報及日本特開2006-342166號公報的各公報中記載之化合物等。 市售品亦可適宜地使用IRGACURE-OXE01(BASF公司製造)、IRGACURE-OXE02(BASF公司製造)、IRGACURE-OXE03(BASF公司製造)、或IRGACURE-OXE04(BASF公司製造)。並且,亦能夠使用TR-PBG-304(常州強力電子新材料有限公司製造)、ADEKA ARKLS NCI-831及ADEKA ARKLS NCI-930(ADEKA CORPORATION製造)或N-1919(含咔唑肟酯骨架光起始劑(ADEKA CORPORATION製造))。<Oxime compound> As a photopolymerization initiator, an oxime compound (oxime type initiator) is mentioned more preferably. In particular, an oxime compound is preferable because it has high sensitivity and high polymerization efficiency, and can harden the hardenable composition layer regardless of the concentration of the colorant, and it is easy to design the concentration of the colorant to be high. As specific examples of the oxime compound, a compound described in JP 2001-233842, a compound described in JP 2000-80068, or a compound described in JP 2006-342166 can be used. Examples of the oxime compound include 3-benzyloxyiminobutane-2-one, 3-acetamidoiminobutane-2-one, and 3-propanyloxyimine Butan-2-one, 2-ethoxyloxyiminopentane-3-one, 2-benzyloxyimino-1-phenylpropane-1-one, 3- (4- Tosylsulfonyloxy) iminobutane-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropane-1-one, and the like. In addition, JCSPerkinII (1979) pp. 1653-1660, JCSPerkinII (1979) pp. 156-162, Journal of Photopolymer Science and Technology (1995) pp. 202-232, and Japanese Patent Application Laid-Open No. 2000- Compounds described in Japanese Unexamined Patent Publication No. 66385, Japanese Unexamined Patent Publication No. 2000-80068, Japanese Unexamined Patent Publication No. 2004-534797, and Japanese Unexamined Patent Publication No. 2006-342166. Commercially available products can also use IRGACURE-OXE01 (manufactured by BASF), IRGACURE-OXE02 (manufactured by BASF), IRGACURE-OXE03 (manufactured by BASF), or IRGACURE-OXE04 (manufactured by BASF). Also, TR-PBG-304 (manufactured by Changzhou Qiangli Electronics New Material Co., Ltd.), ADEKA ARKLS NCI-831 and ADEKA ARKLS NCI-930 (manufactured by ADEKA CORPORATION) or N-1919 (containing carbazoxime ester backbone light from Initiator (manufactured by ADEKA CORPORATION)).

作為上述記載以外的肟化合物,亦可使用咔唑N位上連結有肟之日本特表2009-519904號公報中記載之化合物;二苯甲酮部位上導入有雜取代基之美國專利第7626957號公報中記載之化合物;色素部位上導入有硝基之日本特開2010-15025號公報及美國專利公開2009-292039號中記載之化合物;國際公開專利2009-131189號公報中記載之酮肟化合物;同一分子內含有三嗪骨架與肟骨架之美國專利第7556910號公報中記載之化合物;於405nm下具有最大吸收且相對於g射線光源具有良好的靈敏度之日本特開2009-221114號公報記載之化合物等。 較佳為,例如能夠參閱日本特開2013-29760號公報的段落0274~0275,該內容編入本說明書中。 具體而言,作為肟化合物,以下述式(OX-1)表示之化合物為較佳。另外,可以是肟化合物的N-O鍵為(E)體的肟化合物,亦可以是(Z)體的肟化合物,還可以是(E)體與(Z)體的混合物。As the oxime compound other than the above description, a compound described in Japanese Patent Publication No. 2009-519904 in which an oxime is linked to the N-position of carbazole may be used; and US Patent No. 7626957 in which a heterosubstituent is introduced into a benzophenone site. Compounds described in the Gazette; compounds described in Japanese Patent Application Laid-Open No. 2010-15025 and US Patent Publication No. 2009-292039 in which a nitro group is introduced into a pigment part; ketoxime compounds described in International Publication No. 2009-131189; A compound described in US Patent No. 7556910 containing a triazine skeleton and an oxime skeleton in the same molecule; a compound described in Japanese Patent Application Laid-Open No. 2009-221114 that has a maximum absorption at 405 nm and a good sensitivity to a g-ray light source Wait. Preferably, for example, paragraphs 0274 to 0275 of Japanese Patent Application Laid-Open No. 2013-29760 can be referred to, and the contents are incorporated into this specification. Specifically, as the oxime compound, a compound represented by the following formula (OX-1) is preferred. In addition, the oxime compound may be an oxime compound having an N-O bond of the (E) form, or an oxime compound of the (Z) form, or a mixture of the (E) form and the (Z) form.

【化學式5】 [Chemical Formula 5]

式(OX-1)中,R及B分別獨立地表示一價的取代基,A表示二價的有機基,Ar表示芳基。 式(OX-1)中,作為R所表示之一價的取代基,是一價的非金屬原子團為較佳。 一作為一價的非金屬原子團,可舉出烷基、芳基、醯基、烷氧基羰基、芳氧基羰基、雜環基、烷硫基羰基及芳硫基羰基等。該等基團可以具有1個以上的取代基。並且,前述之取代基可以進一步被其他取代基取代。 作為取代基,可舉出鹵素原子、芳氧基、烷氧基羰基或芳氧基羰基、醯氧基、醯基、烷基及芳基等。 式(OX-1)中,作為B所表示之一價的取代基,芳基、雜環基、芳基羰基或雜環羰基為較佳。該等基團可具有1個以上的取代基。作為取代基,可舉出前述取代基。 式(OX-1)中,作為A所表示之二價的有機基,碳數1~12的伸烷基、環伸烷基或伸炔基為較佳。該等基團可以具有1個以上的取代基。作為取代基,可舉出前述取代基。In formula (OX-1), R and B each independently represent a monovalent substituent, A represents a divalent organic group, and Ar represents an aryl group. In the formula (OX-1), as the monovalent substituent represented by R, a monovalent nonmetal atomic group is preferred. Examples of the monovalent non-metal atomic group include an alkyl group, an aryl group, a fluorenyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a heterocyclic group, an alkylthiocarbonyl group, and an arylthiocarbonyl group. These groups may have one or more substituents. The aforementioned substituent may be further substituted with another substituent. Examples of the substituent include a halogen atom, an aryloxy group, an alkoxycarbonyl group or an aryloxycarbonyl group, a fluorenyl group, a fluorenyl group, an alkyl group, and an aryl group. In the formula (OX-1), as the monovalent substituent represented by B, an aryl group, a heterocyclic group, an arylcarbonyl group or a heterocyclic carbonyl group is preferred. These groups may have one or more substituents. Examples of the substituent include the aforementioned substituents. In the formula (OX-1), as the divalent organic group represented by A, an alkylene group, a cycloalkylene group, or an alkynyl group having 1 to 12 carbon atoms is preferred. These groups may have one or more substituents. Examples of the substituent include the aforementioned substituents.

作為光聚合起始劑,還能夠使用含有氟原子之肟化合物。作為含有氟原子之肟化合物的具體例,可舉出日本特開2010-262028號公報記載的化合物;日本特表2014-500852號公報記載的化合物24、36~40;日本特開2013-164471號公報記載的化合物(C-3);等。該內容編入本說明書中。As the photopolymerization initiator, a fluorine atom-containing oxime compound can also be used. Specific examples of the fluorine atom-containing oxime compound include compounds described in Japanese Patent Application Laid-Open No. 2010-262028; compounds 24, 36-40 of Japanese Patent Application No. 2014-500852; Japanese Patent Laid-Open No. 2013-164471 Compound (C-3) described in Gazette; etc. This content is incorporated into this manual.

作為光聚合起始劑,還能夠使用以下述通式(1)~(4)表示之化合物。As the photopolymerization initiator, compounds represented by the following general formulae (1) to (4) can also be used.

【化學式6】 [Chemical Formula 6]

【化學式7】 [Chemical Formula 7]

式(1)中,R1 及R2 分別獨立地表示碳數1~20的烷基、碳數4~20的脂環式烴基、碳數6~30的芳基或碳數7~30的芳烷基,R1 及R2 為苯基時,苯基彼此可鍵結而形成茀基,R3 及R4 分別獨立地表示氫原子、碳數1~20的烷基、碳數6~30的芳基、碳數7~30的芳烷基或碳數4~20的雜環基,X表示直接鍵結或羰基。In formula (1), R 1 and R 2 each independently represent an alkyl group having 1 to 20 carbon atoms, an alicyclic hydrocarbon group having 4 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an aryl group having 7 to 30 carbon atoms. An aralkyl group, when R 1 and R 2 are phenyl groups, phenyl groups may be bonded to each other to form a fluorenyl group, and R 3 and R 4 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and 6 to 6 carbon atoms. An aryl group of 30, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 4 to 20 carbon atoms, and X represents a direct bond or a carbonyl group.

式(2)中,R1 、R2 、R3 及R4 的含義與式(1)中的R1 、R2 、R3 及R4 相同,R5 表示-R6 、-OR6 、-SR6 、-COR6 、-CONR6 R6 、-NR6 COR6 、-OCOR6 、-COOR6 、-SCOR6 、-OCSR6 、-COSR6 、-CSOR6 、-CN、鹵原子或羥基,R6 表示碳數1~20的烷基、碳數6~30的芳基、碳數7~30的芳烷基或碳數4~20的雜環基,X表示直接鍵結或羰基,a表示0~4的整數。 (2), R 1, R 2, 1 , R 2, R 3 and the same formula the meanings of R 4 in the formula R (1) in R 3 and R 4, R 5 represents -R 6, -OR 6, -SR 6 , -COR 6 , -CONR 6 R 6 , -NR 6 COR 6 , -OCOR 6 , -COOR 6 , -SCOR 6 , -OCSR 6 , -COSR 6 , -CSOR 6 , -CN, halogen atom or Hydroxyl group, R 6 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or a heterocyclic group having 4 to 20 carbon atoms, and X represents a direct bond or a carbonyl group , A represents an integer of 0 to 4.

式(3)中,R1 表示碳數1~20的烷基、碳數4~20的脂環式烴基、碳數6~30的芳基或碳數7~30的芳烷基,R3 及R4 分別獨立地表示氫原子、碳數1~20的烷基、碳數6~30的芳基、碳數7~30的芳烷基或碳數4~20的雜環基,X表示直接鍵結或羰基。In formula (3), R 1 represents an alkyl group having 1 to 20 carbon atoms, an alicyclic hydrocarbon group having 4 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an aralkyl group having 7 to 30 carbon atoms, and R 3 And R 4 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or a heterocyclic group having 4 to 20 carbon atoms, and X represents Direct bonding or carbonyl.

式(4)中,R1 、R3 及R4 的含義與式(3)中的R1 、R3 及R4 相同,R5 表示-R6 、-OR6 、-SR6 、-COR6 、-CONR6 R6 、-NR6 COR6 、-OCOR6 、-COOR6 、-SCOR6 、-OCSR6 、-COSR6 、-CSOR6 、-CN、鹵原子或羥基,R6 表示碳數1~20的烷基、碳數6~30的芳基、碳數7~30的芳烷基或碳數4~20的雜環基,X表示直接鍵結或羰基,a表示0~4的整數。Formula (4), R 1, R 3 and R 4 defined for the formula (3) in R 1, the same as R 3 and R 4, R 5 represents -R 6, -OR 6, -SR 6 , -COR 6 , -CONR 6 R 6 , -NR 6 COR 6 , -OCOR 6 , -COOR 6 , -SCOR 6 , -OCSR 6 , -COSR 6 , -CSOR 6 , -CN, halogen atom or hydroxyl group, R 6 represents carbon Alkyl group 1 to 20, aryl group 6 to 30 carbon, aralkyl group 7 to 30 carbon or heterocyclic group 4 to 20 carbon, X represents direct bonding or carbonyl group, a represents 0 to 4 Integer.

上述式(1)及式(2)中,R1 及R2 分別獨立地為甲基、乙基、正丙基、異丙基、環己基或苯基為較佳。R3 為甲基、乙基、苯基、甲苯基或二甲苯基為較佳。R4 為碳數1~6的烷基或苯基為較佳。R5 為甲基、乙基、苯基、甲苯基或萘基為較佳。X為直接鍵結為較佳。 上述式(3)及(4)中,R1 分別獨立地為甲基、乙基、正丙基、異丙基、環己基或苯基為較佳。R3 為甲基、乙基、苯基、甲苯基或二甲苯基為較佳。R4 為碳數1~6的烷基或苯基為較佳。R5 為甲基、乙基、苯基、甲苯基或萘基為較佳。X為直接鍵結為較佳。 作為以式(1)及式(2)表示之化合物的具體例,例如,可舉出日本特開2014-137466號公報的段落號0076~0079中記載之化合物。該內容編入本說明書中。In the above formula (1) and formula (2), it is preferable that R 1 and R 2 are each independently methyl, ethyl, n-propyl, isopropyl, cyclohexyl or phenyl. R 3 is preferably methyl, ethyl, phenyl, tolyl or xylyl. R 4 is preferably an alkyl or phenyl group having 1 to 6 carbon atoms. R 5 is preferably methyl, ethyl, phenyl, tolyl or naphthyl. X is preferably directly bonded. In the above formulae (3) and (4), it is preferred that R 1 is independently methyl, ethyl, n-propyl, isopropyl, cyclohexyl or phenyl. R 3 is preferably methyl, ethyl, phenyl, tolyl or xylyl. R 4 is preferably an alkyl or phenyl group having 1 to 6 carbon atoms. R 5 is preferably methyl, ethyl, phenyl, tolyl or naphthyl. X is preferably directly bonded. Specific examples of the compounds represented by the formulas (1) and (2) include, for example, compounds described in paragraphs 0076 to 079 of Japanese Patent Application Laid-Open No. 2014-137466. This content is incorporated into this manual.

以下示出可在硬化性組成物中較佳地使用之肟化合物的具體例。Specific examples of the oxime compound that can be preferably used in the curable composition are shown below.

【化學式8】 [Chemical Formula 8]

肟化合物是於350nm~500nm的波長區域具有極大吸收波長者為較佳,於360nm~480nm的波長區域具有極大吸收波長者為更佳,365nm及405nm的吸光度較高者為特佳。 從靈敏度的觀點考慮,肟化合物的365nm或405nm下的莫耳吸光系數為1,000~300,000為較佳,2,000~300,000為更佳,5,000~200,000為進一步較佳。 化合物的莫耳吸光系數能夠使用公知的方法,例如,以紫外可見分光光度計(Varian公司製造Cary-5 spctrophotometer)進行並利用乙酸乙酯溶劑,以0.01g/L的濃度進行測定為較佳。 光聚合起始劑可依據需要組合2種以上來使用。The oxime compound is preferably one having a maximum absorption wavelength in a wavelength region of 350 nm to 500 nm, more preferably one having a maximum absorption wavelength in a wavelength region of 360 nm to 480 nm, and one having a higher absorbance at 365 nm and 405 nm is particularly preferable. From the viewpoint of sensitivity, the molar absorption coefficient of the oxime compound at 365 nm or 405 nm is preferably 1,000 to 300,000, more preferably 2,000 to 300,000, and even more preferably 5,000 to 200,000. The molar absorption coefficient of the compound can be measured by a known method. For example, it can be measured with a UV-visible spectrophotometer (Cary-5 spctrophotometer manufactured by Varian Corporation) using an ethyl acetate solvent at a concentration of 0.01 g / L. A photopolymerization initiator can be used in combination of 2 or more types as needed.

〔聚合性化合物〕 硬化性組成物含有聚合性化合物。 聚合性化合物的含量相對於硬化性組成物的總固體成分,0.1~40質量%為較佳。下限例如為1.0質量%以上為更佳,3.5質量%以上為進一步較佳,超過3.5質量%為特佳。上限例如為30質量%以下為更佳,20質量%以下為進一步較佳,小於20質量%為特佳。 若聚合性化合物的含量相對於硬化性組成物的總固體成分,超過3.5質量%且小於20質量%,則使硬化性組成物硬化來獲得之硬化膜的圖案形狀更優異。 聚合性化合物可單獨使用1種,亦可同時使用2種以上。同時使用2種以上的聚合性化合物時,其合計量在上述範圍內為較佳。[Polymerizable Compound] The curable composition contains a polymerizable compound. The content of the polymerizable compound is preferably 0.1 to 40% by mass based on the total solid content of the curable composition. The lower limit is, for example, more preferably 1.0% by mass or more, more preferably 3.5% by mass or more, and particularly preferably more than 3.5% by mass. The upper limit is, for example, preferably 30% by mass or less, more preferably 20% by mass or less, and particularly preferably less than 20% by mass. When the content of the polymerizable compound is more than 3.5% by mass and less than 20% by mass based on the total solid content of the curable composition, the pattern shape of the cured film obtained by curing the curable composition is more excellent. The polymerizable compound may be used singly or in combination of two or more kinds. When two or more polymerizable compounds are used at the same time, the total amount thereof is preferably within the above range.

聚合性化合物是包含1個以上的含有乙烯性不飽和鍵之基團之化合物為較佳,含有2個以上之化合物為更佳,含有3個以上為進一步較佳,含有5個以上為特佳。上限例如為15個以下。作為含有乙烯性不飽和鍵之基團,例如,可舉出乙烯基、(甲基)烯丙基及(甲基)丙烯醯基等。The polymerizable compound is preferably a compound containing one or more ethylenically unsaturated bond-containing groups, more preferably two or more compounds, more preferably three or more compounds, and particularly preferably five or more compounds. . The upper limit is, for example, 15 or less. Examples of the group containing an ethylenically unsaturated bond include a vinyl group, a (meth) allyl group, and a (meth) acrylfluorenyl group.

聚合性化合物例如可以是單體、預聚物、低聚物及該些的混合物、以及該些的多聚體等化學形態的任一個,單體為較佳。 聚合性化合物的分子量為100~3,000為較佳,250~1,500為更佳。 聚合性化合物是3~15官能的(甲基)丙烯酸酯化合物為較佳,3~6官能的(甲基)丙烯酸酯化合物為更佳。 作為單體、預聚物的例子,可舉出不飽和羧酸(例如,丙烯酸、甲基丙烯酸、衣康酸、巴豆酸、異巴豆酸、馬來酸等)或其酯類、醯胺類以及它們的多聚體,較佳為不飽和羧酸與脂肪族多元醇化合物的酯、及不飽和羧酸與脂肪族多元胺化合物的醯胺類、以及它們的多聚體。並且,亦適合使用含有羥基、胺基、巰基等親核性取代基之不飽和羧酸酯或醯胺類、與單官能或多官能異氰酸酯類或環氧類的加成反應物及上述不飽和羧酸酯或醯胺類與單官能或多官能的羧酸的脫水縮合反應物等。並且,含有異氰酸酯基、環氧基等親電子性取代基之不飽和羧酸酯或醯胺類與單官能或多官能的醇類、胺類、硫醇類的反應物、含有鹵代基或甲苯磺醯氧基等脱離性取代基之不飽和羧酸酯或醯胺類與單官能或多官能的醇類、胺類或硫醇類的反應物亦適合。並且,代替上述不飽和羧酸,亦能夠使用置換成不飽和膦酸、苯乙烯等乙烯苯衍生物、乙烯基醚、烯丙醚等之化合物群組。 作為它們的具體化合物,亦能夠將日本特開2009-288705號公報的段落0095~0108中記載之化合物適當地用於本發明中。The polymerizable compound may be, for example, any of chemical forms such as monomers, prepolymers, oligomers, and mixtures thereof, and such polymers, and monomers are preferred. The molecular weight of the polymerizable compound is preferably 100 to 3,000, and more preferably 250 to 1,500. The polymerizable compound is preferably a 3 to 15-functional (meth) acrylate compound, and more preferably a 3 to 6-functional (meth) acrylate compound. Examples of monomers and prepolymers include unsaturated carboxylic acids (for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.) or their esters and amidines. And their multimers are preferably esters of unsaturated carboxylic acid and aliphatic polyhydric alcohol compounds, amidines of unsaturated carboxylic acid and aliphatic polyamine compounds, and these multimers. In addition, it is also suitable to use unsaturated carboxylic acid esters or amidoamines containing nucleophilic substituents such as hydroxyl, amine, and mercapto groups, addition reaction products with monofunctional or polyfunctional isocyanates or epoxy compounds, and the aforementioned unsaturated Dehydration condensation reactants of carboxylic acid esters or amidines with monofunctional or polyfunctional carboxylic acids, and the like. In addition, unsaturated carboxylic acid esters or amidoamines containing electrophilic substituents such as isocyanate groups and epoxy groups, and reactants of monofunctional or polyfunctional alcohols, amines, thiols, or halogenated groups or Also suitable are reactants of unsaturated carboxylic acid esters or amidoamines having detachable substituents such as tosylsulfonyloxy group and monofunctional or polyfunctional alcohols, amines or thiols. Further, instead of the unsaturated carboxylic acid, a group of compounds substituted with an vinyl benzene derivative such as unsaturated phosphonic acid, styrene, vinyl ether, allyl ether, or the like can be used. As their specific compounds, the compounds described in paragraphs 0095 to 0108 of Japanese Patent Application Laid-Open No. 2009-288705 can also be suitably used in the present invention.

聚合性化合物含有1個以上含有乙烯性不飽和鍵之基團且常壓下具有100℃以上的沸點之化合物亦較佳。例如,能夠參閱日本特開2013-29760號公報的段落0227、日本特開2008-292970號公報的段落0254~0257中記載之化合物,且該內容編入於本說明書中。A polymerizable compound containing one or more ethylenically unsaturated bond-containing groups and having a boiling point of 100 ° C. or higher under normal pressure is also preferred. For example, the compounds described in paragraph 0227 of Japanese Patent Application Laid-Open No. 2013-29760 and paragraphs 0254 to 0257 of Japanese Patent Application Laid-Open No. 2008-292970 can be referred to, and the contents are incorporated herein.

聚合性化合物為二季戊四醇三丙烯酸酯(作為市售品為KAYARAD D-330;Nippon Kayaku Co., Ltd.製造)、二季戊四醇四丙烯酸酯(作為市售品為KAYARAD D-320;Nippon Kayaku Co., Ltd.製造)二季戊四醇五(甲基)丙烯酸酯(作為市售品為KAYARAD D-310;Nippon Kayaku Co., Ltd.製造)、二季戊四醇六(甲基)丙烯酸酯(作為市售品為KAYARAD DPHA;Nippon Kayaku Co., Ltd.製、A-DPH-12E;Shin-Nakamura Chemical Co., Ltd.製造)及該等(甲基)丙烯醯基經由二乙醇殘基或丙二醇殘基之結構(例如,由Sartomer Company市售之SR454、SR499)為較佳。亦能夠使用它們的低聚物類型。並且,亦能夠使用NK酯A-TMMT(季戊四醇四丙烯酸酯、Shin-Nakamura Chemical Co., Ltd.製造)及KAYARAD RP-1040(Nippon Kayaku Co.,Ltd.製造)等。 以下示出較佳聚合性化合物的態樣。The polymerizable compound is dipentaerythritol triacrylate (commercially available as KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetraacrylate (commercially available as KAYARAD D-320; Nippon Kayaku Co. , Ltd.) dipentaerythritol penta (meth) acrylate (KAYARAD D-310 as a commercial product; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa (meth) acrylate (as a commercially available product) KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., A-DPH-12E; manufactured by Shin-Nakamura Chemical Co., Ltd.) and the structure of these (meth) acrylfluorenyl groups via diethanol residues or propylene glycol residues (For example, SR454 to SR499 commercially available from Sartomer Company) is more preferred. Their oligomer types can also be used. In addition, NK ester A-TMMT (pentaerythritol tetraacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd.), KAYARAD RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), and the like can also be used. The aspect of a preferable polymerizable compound is shown below.

聚合性化合物可以具有羧酸基、磺酸基或磷酸基等酸基。作為含有酸基之聚合性化合物,脂肪族聚羥基化合物與不飽和羧酸的酯為較佳,使脂肪族聚羥基化合物的未反應的羥基與非芳香族羧酸酐進行反應而具有酸基之聚合性化合物為更佳,在該酯中脂肪族聚羥基化合物為季戊四醇和/或二季戊四醇者為進一步較佳。作為市售品,例如可舉出Toagosei Co., Ltd.製造的ARONIX TO-2349、M-305、M-510及M-520等。The polymerizable compound may have an acid group such as a carboxylic acid group, a sulfonic acid group, or a phosphoric acid group. As the polymerizable compound containing an acid group, an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid is preferable, and an unreacted hydroxyl group of the aliphatic polyhydroxy compound is reacted with a non-aromatic carboxylic acid anhydride to polymerize the acid group. The sexual compound is more preferable, and the aliphatic polyhydroxy compound in the ester is pentaerythritol and / or dipentaerythritol. Examples of commercially available products include ARONIX TO-2349, M-305, M-510, and M-520 manufactured by Toagosei Co., Ltd.

作為含有酸基之聚合性化合物的較佳酸值,為0.1~40mgKOH/g,5~30mgKOH/g為更佳。若聚合性化合物的酸值為0.1mgKOH/g以上,則顯影溶解特性良好,若為40mgKOH/g以下,則有利於製造和/或處理。而且,藉由在上述範圍內,光聚合性能良好,且硬化性優異。The preferable acid value of the polymerizable compound containing an acid group is 0.1 to 40 mgKOH / g, and more preferably 5 to 30 mgKOH / g. If the acid value of the polymerizable compound is 0.1 mgKOH / g or more, the developing and dissolving characteristics are good, and if it is 40 mgKOH / g or less, it is advantageous for production and / or processing. Moreover, when it exists in the said range, a photopolymerization property is favorable and hardenability is excellent.

含有己內酯結構之化合物亦是聚合性化合物的較佳態樣。 作為含有己內酯結構之化合物,只要是在分子內含有己內酯結構,則並沒有特別限定,例如能夠舉出藉由將三羥甲基乙烷、二-三羥甲基乙烷、三羥甲基丙烷、二-三羥甲基丙烷、季戊四醇、二季戊四醇、三季戊四醇、甘油、二甘油、三羥甲基三聚氰胺等多元醇與(甲基)丙烯酸及ε-己內酯進行酯化而獲得之ε-己內酯改質多官能(甲基)丙烯酸酯。其中,含有以下述式(Z-1)表示之己內酯結構之化合物為較佳。A compound containing a caprolactone structure is also a preferable aspect of the polymerizable compound. The compound containing a caprolactone structure is not particularly limited as long as it contains a caprolactone structure in the molecule, and examples thereof include trimethylolethane, di-trimethylolethane, and trimethylolethane. Polyols such as methylolpropane, di-trimethylolpropane, pentaerythritol, dipentaerythritol, tripentaerythritol, glycerol, diglycerol, and trimethylol melamine are esterified with (meth) acrylic acid and ε-caprolactone. The obtained ε-caprolactone modified polyfunctional (meth) acrylate. Among them, a compound containing a caprolactone structure represented by the following formula (Z-1) is preferred.

【化學式9】 [Chemical Formula 9]

式(Z-1)中,6個R均為以下述式(Z-2)表示之基團,或6個R中1~5個為以下述式(Z-2)表示之基團,剩餘為以下述式(Z-3)表示之基團。In formula (Z-1), 6 R are all groups represented by the following formula (Z-2), or 1 to 5 of 6 R are groups represented by the following formula (Z-2), and the rest Is a group represented by the following formula (Z-3).

【化學式10】 [Chemical Formula 10]

式(Z-2)中,R1 表示氫原子或甲基,m表示1或2的數,*表示鍵結鍵。In the formula (Z-2), R 1 represents a hydrogen atom or a methyl group, m represents a number of 1 or 2, and * represents a bonding bond.

【化學式11】 [Chemical Formula 11]

式(Z-3)中,R1 表示氫原子或甲基,*表示鍵結鍵。In formula (Z-3), R 1 represents a hydrogen atom or a methyl group, and * represents a bonding bond.

含有己內酯結構之聚合性化合物例如由Nippon Kayaku Co., Ltd.作為KAYARAD DPCA系列而市售,可舉出DPCA-20(式(Z-1)~(Z-3)中m為1、以式(Z-2)表示之基團的數為2、R1 均為氫原子之化合物)、DPCA-30(該式中,m為1、以式(Z-2)表示之基團的數為3、R1 均為氫原子之化合物)、DPCA-60(該式中,m為1、以式(Z-2)表示之基團的數為6、R1 均為氫原子之化合物)、DPCA-120(該式中,m為2、以式(Z-2)表示之基團的數為6、R1 均為氫原子之化合物)等。The polymerizable compound containing a caprolactone structure is commercially available, for example, as KAYARAD DPCA series from Nippon Kayaku Co., Ltd. Examples include DPCA-20 (where m is 1 in formulas (Z-1) to (Z-3)) The number of groups represented by the formula (Z-2) is 2, and R 1 is a compound having a hydrogen atom), DPCA-30 (in the formula, m is 1, the group of the group represented by the formula (Z-2) Compounds whose number is 3 and R 1 is a hydrogen atom) CADPCA-60 (in the formula, m is 1, the number of groups represented by formula (Z-2) is 6, and R 1 is a compound of hydrogen atom ), DPCA-120 (in the formula, m is 2, a compound having the number of groups represented by formula (Z-2) of 6, and R 1 is a hydrogen atom), and the like.

聚合性化合物能夠使用以下述式(Z-4)或(Z-5)表示之化合物。As the polymerizable compound, a compound represented by the following formula (Z-4) or (Z-5) can be used.

【化學式12】 [Chemical Formula 12]

式(Z-4)及(Z-5)中,E分別獨立地表示-((CH2y CH2 O)-或-((CH2y CH(CH3 )O)-,y分別獨立地表示0~10的整數,X分別獨立地表示(甲基)丙烯醯基、氫原子或羧酸基。 式(Z-4)中,(甲基)丙烯醯基的合計為3個或4個,m分別獨立地表示0~10的整數,各m的合計為0~40的整數。 式(Z-5)中,(甲基)丙烯醯基的合計為5個或6個,n分別獨立地表示0~10的整數,各n的合計為0~60的整數。In formulas (Z-4) and (Z-5), E each independently represents-((CH 2 ) y CH 2 O)-or-((CH 2 ) y CH (CH 3 ) O)-, y respectively Each independently represents an integer of 0 to 10, and X each independently represents a (meth) acrylfluorenyl group, a hydrogen atom, or a carboxylic acid group. In the formula (Z-4), the total number of (meth) acrylfluorenyl groups is three or four, m each independently represents an integer of 0 to 10, and the total of each m is an integer of 0 to 40. In formula (Z-5), the total number of (meth) acrylfluorenyl groups is five or six, n each independently represents an integer of 0 to 10, and the total of each n is an integer of 0 to 60.

式(Z-4)中,m為0~6的整數為較佳,0~4的整數為更佳。 各m的合計為2~40的整數為較佳,2~16的整數為更佳,4~8的整數為進一步較佳。 式(Z-5)中,n為0~6的整數為較佳,0~4的整數為更佳。 各n的合計為3~60的整數為較佳,3~24的整數為更佳,6~12的整數為進一步較佳。 式(Z-4)或式(Z-5)中的-((CH2y CH2 O)-或-((CH2y CH(CH3 )O)-為氧原子側的末端與X鍵結之形態為較佳。In the formula (Z-4), an integer of 0 to 6 is preferable, and an integer of 0 to 4 is more preferable. The total of each m is preferably an integer of 2 to 40, an integer of 2 to 16 is more preferable, and an integer of 4 to 8 is further more preferable. In the formula (Z-5), an integer of 0 to 6 is preferable, and an integer of 0 to 4 is more preferable. The total number of each n is preferably an integer of 3 to 60, an integer of 3 to 24 is more preferable, and an integer of 6 to 12 is further more preferable. -((CH 2 ) y CH 2 O)-or-((CH 2 ) y CH (CH 3 ) O)-in the formula (Z-4) or (Z-5) is the end on the oxygen atom side and The form of the X bond is preferred.

以式(Z-4)或式(Z-5)表示之化合物可以單獨使用1種,亦可以同時使用2種以上。尤其,式(Z-5)中6個X均為丙烯醯基之形態、式(Z-5)中6個X均為丙烯醯基之化合物與6個X中至少1個為氫原子之化合物的混合物之態樣為較佳。藉由設為該種結構,能夠更加提高顯影性。The compound represented by the formula (Z-4) or the formula (Z-5) may be used singly or in combination of two or more kinds. In particular, in the formula (Z-5), the six Xs are all acrylfluorenyl groups, the compound in which (6) X is acrylfluorenyl compounds and at least one of the six Xs is a hydrogen atom. The mixture is preferred. With such a structure, developability can be further improved.

以式(Z-4)或式(Z-5)表示之化合物的聚合性化合物中的總含量,為20質量%以上為較佳,50質量%以上為更佳。The total content of the polymerizable compound of the compound represented by the formula (Z-4) or the formula (Z-5) is preferably 20% by mass or more, and more preferably 50% by mass or more.

以式(Z-4)或式(Z-5)表示之化合物能夠藉由以往公知的製程亦即以下製程合成:藉由使季戊四醇或二季戊四醇與環氧乙烷或環氧丙烷進行開環加成反應,從而鍵結開環骨架之製程;及例如使開環骨架的末端羥基與(甲基)丙烯醯氯反應來導入(甲基)丙烯醯基之製程。各製程為眾所周知之製程,本領域技術人員能夠輕鬆地合成以通式(Z-4)或(Z-5)表示之化合物。The compound represented by the formula (Z-4) or the formula (Z-5) can be synthesized by a conventionally known process, that is, the following process: By ring-opening addition of pentaerythritol or dipentaerythritol with ethylene oxide or propylene oxide A process in which a ring-opening skeleton is bonded; and, for example, a process in which a terminal hydroxyl group of the ring-opening skeleton is reacted with (meth) acrylic acid chloride to introduce a (meth) acrylic acid group. Each process is a well-known process, and those skilled in the art can easily synthesize a compound represented by the general formula (Z-4) or (Z-5).

以式(Z-4)或式(Z-5)表示之化合物中,季戊四醇衍生物和/或二季戊四醇衍生物為更佳。 具體而言,可舉出以下式(a)~(f)表示之化合物(以下,亦稱為「例示化合物(a)~(f)」。),其中,例示化合物(a)、(b)、(e)、(f)為較佳。Of the compounds represented by formula (Z-4) or formula (Z-5), pentaerythritol derivatives and / or dipentaerythritol derivatives are more preferred. Specific examples include compounds represented by the following formulae (a) to (f) (hereinafter, also referred to as "exemplary compounds (a) to (f)"). Among them, exemplary compounds (a) and (b) (E) and (f) are preferred.

【化學式13】 [Chemical Formula 13]

【化學式14】 [Chemical Formula 14]

作為以式(Z-4)及(Z-5)表示之聚合性化合物的市售品,可舉出例如Sartomer Company製造的含有4個伸乙氧基鏈之4官能丙烯酸酯亦即SR-494、Nippon Kayaku Co., Ltd.製造的含有6個伸戊氧基鏈之6官能丙烯酸酯亦即DPCA-60、含有3個異伸丁氧基鏈之3官能丙烯酸酯亦即TPA-330等。Examples of commercially available polymerizable compounds represented by the formulae (Z-4) and (Z-5) include SR-494, a four-functional acrylate containing four ethoxyl chains, manufactured by Sartomer Company. , DPCA-60, a 6-functional acrylate containing 6 pentamyloxy chains, TPA-330, etc., containing 6 isopentyloxy chains, manufactured by Nippon Kayaku Co., Ltd.

作為聚合性化合物,日本特公昭48-41708號公報、日本特開昭51-37193號公報、日本特公平2-32293號公報、日本特公平2-16765號公報中記載之聚胺基甲酸酯丙烯酸酯類;日本特公昭58-49860號公報、日本特公昭56-17654號公報、日本特公昭62-39417號公報及日本特公昭62-39418號公報中記載之含有環氧乙烷系骨架之胺基甲酸酯化合物類亦較佳。並且,藉由使用日本特開昭63-277653號公報、日本特開昭63-260909號公報及日本特開平1-105238號公報中記載之、分子內含有胺結構和/或硫醚結構之加成聚合性化合物類,能夠獲得感光速度非常優異之硬化性組成物。 作為市售品,可舉出胺基甲酸酯低聚物UAS-10、UAB-140(Sanyo Kokusaku Pulp Co., Ltd.製造)、UA-7200(Shin-Nakamura Chemical Co., Ltd.製造)、DPHA-40H(Nippon Kayaku Co., Ltd.製造)、UA-306H、UA-306T、UA-306I、AH-600、T-600及AI-600(Kyoeisha Co., Ltd.製造)等。As the polymerizable compound, Polyurethanes described in Japanese Patent Publication No. 48-41708, Japanese Patent Publication No. 51-37193, Japanese Patent Publication No. 2-32293, and Japanese Patent Publication No. 2-16765. Acrylic esters; those disclosed in Japanese Patent Publication No. 58-49860, Japanese Patent Publication No. 56-17654, Japanese Patent Publication No. 62-39417, and Japanese Patent Publication No. 62-39418 Urethane compounds are also preferred. In addition, by using an addition of an amine structure and / or a thioether structure described in Japanese Patent Application Laid-Open No. 63-277653, Japanese Patent Application Laid-Open No. 63-260909, and Japanese Patent Application Laid-Open No. 1-105238, It becomes a polymerizable compound and can obtain a hardenable composition which is very excellent in the speed of light. Examples of commercially available products include urethane oligomers UAS-10, UAB-140 (manufactured by Sanyo Kokusaku Pulp Co., Ltd.), and UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.) , DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, and AI-600 (manufactured by Kyoeisha Co., Ltd.) and the like.

聚合性化合物的SP(Solubility Parameter:溶解度參數)值為9.50以上為較佳,10.40以上為更佳,10.60以上為進一步較佳。 本說明書中,關於SP值,除非另有指明,則藉由Hoy法求出(H.L.Hoy Journal of Painting,1970,Vol.42,76-118)。關於SP值,省略單位而示出,但其單位為cal1/2 cm-3/2The SP (Solubility Parameter) value of the polymerizable compound is preferably 9.50 or more, more preferably 10.40 or more, and more preferably 10.60 or more. In this specification, the SP value is obtained by the Hoy method unless otherwise specified (HL Hoy Journal of Painting, 1970, Vol. 42, 76-118). Although the SP value is omitted, the unit is shown, but the unit is cal 1/2 cm -3/2 .

從改善顯影殘渣的觀點考慮,硬化性組成物為包含含有卡多骨架之聚合性化合物亦較佳。 作為含有卡多骨架之聚合性化合物,具有9,9-二芳基茀骨架之聚合性化合物為較佳,以下述式(Q3)表示之化合物為更佳。From the viewpoint of improving the development residue, it is also preferable that the curable composition contains a polymerizable compound containing a Cardo skeleton. As the polymerizable compound containing a Cardo skeleton, a polymerizable compound having a 9,9-diarylfluorene skeleton is preferable, and a compound represented by the following formula (Q3) is more preferable.

式(Q3) 【化學式15】 Formula (Q3) [Chemical Formula 15]

上述式(Q3)中,Ar11 ~Ar14 分別獨立地表示含有以虛線包圍之苯環之芳基。X1 ~X4 分別獨立地表示含有聚合性基團之取代基,上述取代基中的碳原子可被雜原子取代。a及b分別獨立地表示1~5的整數,c及d分別獨立地表示0~5的整數。R1 ~R4 分別獨立地表示取代基,e、f、g及h分別獨立地表示0以上的整數,e、f、g及h的上限值分別為從Ar11 ~Ar14 能夠含有之取代基的數減去a、b、c或d之值。其中,Ar11 ~Ar14 分別獨立地為作為縮合環之一而含有以虛線包圍之苯環之多環芳香族烴基時,X1 ~X4 及R1 ~R4 可分別獨立地取代為以虛線包圍之苯環,亦可取代為以虛線包圍之苯環以外的環。In the formula (Q3), Ar 11 to Ar 14 each independently represent an aryl group containing a benzene ring surrounded by a dotted line. X 1 to X 4 each independently represent a polymerizable group-containing substituent, and the carbon atom in the substituent may be substituted with a hetero atom. a and b each independently represent an integer of 1 to 5, and c and d each independently represent an integer of 0 to 5. R 1 to R 4 each independently represent a substituent, e, f, g, and h each independently represent an integer of 0 or more, and the upper limits of e, f, g, and h are those that can be contained from Ar 11 to Ar 14 respectively. The number of substituents minus the value of a, b, c or d. However, when Ar 11 to Ar 14 are each independently a polycyclic aromatic hydrocarbon group containing a benzene ring surrounded by a dotted line as one of the condensed rings, X 1 to X 4 and R 1 to R 4 may be independently substituted with The benzene ring surrounded by a dotted line may be replaced by a ring other than the benzene ring surrounded by a dotted line.

式(Q3)中,Ar11 ~Ar14 所表示之含有以虛線包圍之苯環之芳基為碳數6~14的芳基為較佳,碳數6~10的芳基(例如,苯基、萘基)為更佳,苯基(限於以虛線包圍之苯環)為進一步較佳。In the formula (Q3), the aryl group containing a benzene ring surrounded by a dotted line represented by Ar 11 to Ar 14 is preferably an aryl group having 6 to 14 carbon atoms, and an aryl group having 6 to 10 carbon atoms (for example, phenyl group) , Naphthyl) is more preferred, and phenyl (limited to a benzene ring surrounded by a dashed line) is further preferred.

式(Q3)中,X1 ~X4 分別獨立地表示含有聚合性基團之取代基,上述取代基中的碳原子可被雜原子取代。作為X1 ~X4 所表示之含有聚合性基團之取代基,並無特別限制,但含有聚合性基團之脂肪族基為較佳。 作為X1 ~X4 所表示之含有聚合性基團之脂肪族基,並無特別限制,但聚合性基團以外的碳數為1~12的伸烷基為較佳,碳數2~10的伸烷基為更佳,碳數2~5的伸烷基為進一步較佳。 X1 ~X4 所表示之含有聚合性基團之脂肪族基中,上述脂肪族基被雜原子取代時,被-NR-(R為取代基)、氧原子、硫原子取代為較佳,上述脂肪族基中不相鄰之-CH2 -被氧原子或硫原子取代為更佳,上述脂肪族基中不相鄰之-CH2 -被氧原子取代為進一步較佳。X1 ~X4 所表示之含有聚合性基團之脂肪族基的1~2處被雜原子取代為較佳,被雜原子取代1處為更佳,與Ar11 ~Ar14 所表示之含有以虛線包圍之苯環之芳基相鄰之1處被雜原子取代為進一步較佳。 作為X1 ~X4 所表示之含有聚合性基團之脂肪族基中含有之聚合性基團,能夠進行自由基聚合或陽離子聚合之聚合性基團(以下,還分別稱作自由基聚合性基團及陽離子聚合性基團)為較佳。 作為自由基聚合性基團,能夠使用通常周知之自由基聚合性基團,作為較佳者,能夠舉出含有能夠進行自由基聚合之乙烯性不飽和鍵之聚合性基團,具體而言,可舉出乙烯基、(甲基)丙烯醯氧基等。其中,(甲基)丙烯醯氧基為較佳,丙烯醯氧基為更佳。 作為陽離子聚合性基團,能夠使用通常周知之陽離子聚合性基團,具體而言,可舉出脂環式醚基、環狀縮醛基、環狀內酯基、環狀硫醚基、螺環原酸酯基、乙烯氧基等。其中,脂環式醚基、乙烯氧基為較佳,環氧基、氧雜環丁基、乙烯氧基為特佳。 Ar11 ~Ar14 所含有之取代基所含有之上述聚合性基團為自由基聚合性基團為較佳。 Ar11 ~Ar14 中的2個以上包含含有聚合性基團之取代基,Ar11 ~Ar14 中的2~4個包含含有聚合性基團之取代基為較佳,Ar11 ~Ar14 中的2個或3個包含含有聚合性基團之取代基為更佳,Ar11 ~Ar14 中的2個包含含有聚合性基團之取代基為進一步較佳。 Ar11 ~Ar14 分別獨立地為作為縮合環之一而含有以虛線包圍之苯環之多環芳香族烴基時,X1 ~X4 可分別獨立地取代為以虛線包圍之苯環,亦可取代為以虛線包圍之苯環以外的環。In the formula (Q3), X 1 to X 4 each independently represent a substituent containing a polymerizable group, and a carbon atom in the substituent may be substituted with a hetero atom. The polymerizable group-containing substituent represented by X 1 to X 4 is not particularly limited, but a polymerizable group-containing aliphatic group is preferred. The polymerizable group-containing aliphatic group represented by X 1 to X 4 is not particularly limited, but an alkylene group having a carbon number of 1 to 12 other than the polymerizable group is preferred, and a carbon number is 2 to 10 The alkylene group is more preferable, and the alkylene group having 2 to 5 carbon atoms is more preferable. Among the polymerizable group-containing aliphatic groups represented by X 1 to X 4 , when the aliphatic group is substituted with a hetero atom, it is preferably substituted with -NR- (R is a substituent), an oxygen atom, and a sulfur atom. The non-adjacent -CH 2 -in the aliphatic group is more preferably substituted with an oxygen atom or a sulfur atom, and the non-adjacent -CH 2 -in the aliphatic group is more preferably replaced with an oxygen atom. 1 to 2 positions of the polymerizable group-containing aliphatic group represented by X 1 to X 4 are preferably substituted with a hetero atom, and 1 position substituted with a hetero atom is more preferable, and the content represented by Ar 11 to Ar 14 It is further preferred that the aryl group of the benzene ring surrounded by a dashed line is substituted with a hetero atom next to it. As the polymerizable group contained in the polymerizable group-containing aliphatic group represented by X 1 to X 4 , a polymerizable group capable of radical polymerization or cationic polymerization (hereinafter, also referred to as a radical polymerizable property, respectively) And a cationic polymerizable group) are preferred. As the radically polymerizable group, a generally known radically polymerizable group can be used, and a preferable one includes a polymerizable group containing an ethylenically unsaturated bond capable of radical polymerization, and specifically, Examples include vinyl, (meth) acryloxy, and the like. Among them, (meth) acrylic fluorenyloxy is more preferable, and propylene fluorenyloxy is more preferable. As the cationically polymerizable group, generally known cationically polymerizable groups can be used, and specifically, an alicyclic ether group, a cyclic acetal group, a cyclic lactone group, a cyclic thioether group, and a spiro Cyclic orthoester, vinyloxy, etc. Among them, an alicyclic ether group and a vinyloxy group are preferable, and an epoxy group, an oxetanyl group, and a vinyloxy group are particularly preferable. It is preferred that the polymerizable group contained in the substituents contained in Ar 11 to Ar 14 is a radical polymerizable group. Two or more of Ar 11 to Ar 14 contain a polymerizable group-containing substituent, and two to four of Ar 11 to Ar 14 include a polymerizable group-containing substituent are preferred, and Ar 11 to Ar 14 It is more preferred that 2 or 3 of the substituents include a polymerizable group-containing substituent, and 2 of Ar 11 to Ar 14 further include a polymerizable group-containing substituent. When Ar 11 to Ar 14 are each independently a polycyclic aromatic hydrocarbon group containing a benzene ring surrounded by a dotted line as one of the condensed rings, X 1 to X 4 may be independently replaced by a benzene ring surrounded by a dotted line, or It is substituted with a ring other than a benzene ring surrounded by a dotted line.

式(Q3)中,a及b分別獨立地表示1~5的整數,1或2為較佳,a及b均為1為更佳。 式(Q3)中,c及d分別獨立地表示0~5的整數,0或1為較佳,c及d均為0為更佳。In the formula (Q3), a and b each independently represent an integer of 1 to 5, 1 or 2 is preferable, and a and b are both 1 is more preferable. In the formula (Q3), c and d each independently represent an integer of 0 to 5, 0 or 1 is more preferable, and c and d are both more preferably 0.

式(Q3)中,R1 ~R4 分別獨立地表示取代基。作為R1 ~R4 所表示之取代基,並無特別限制,例如,能夠舉出鹵原子、鹵化烷基、烷基、烯基、醯基、羥基、羥基烷基、烷氧基、芳基、雜芳基及脂環基等。R1 ~R4 所表示之取代基為烷基、烷氧基或芳基為較佳,碳數1~5的烷基、碳數1~5的烷氧基或苯基為更佳,甲基、甲氧基或苯基為進一步較佳。 式(Q3)中,Ar11 ~Ar14 分別獨立地為作為縮合環之一而含有以虛線包圍之苯環之多環芳香族烴基時,R1 ~R4 可分別獨立地取代為以虛線包圍之苯環,亦可取代為以虛線包圍之苯環以外的環。In formula (Q3), R 1 to R 4 each independently represent a substituent. The substituents represented by R 1 to R 4 are not particularly limited, and examples thereof include a halogen atom, a halogenated alkyl group, an alkyl group, an alkenyl group, a fluorenyl group, a hydroxyl group, a hydroxyalkyl group, an alkoxy group, and an aryl group. , Heteroaryl and alicyclic groups. The substituents represented by R 1 to R 4 are preferably an alkyl group, an alkoxy group or an aryl group, more preferably an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms or a phenyl group. A radical, methoxy or phenyl is further preferred. In formula (Q3), when Ar 11 to Ar 14 are each independently a polycyclic aromatic hydrocarbon group containing a benzene ring surrounded by a dotted line as one of the condensed rings, R 1 to R 4 may be independently substituted to be surrounded by a dotted line. The benzene ring may be replaced by a ring other than the benzene ring surrounded by a dotted line.

式(Q3)中,e、f、g及h分別獨立地表示0以上的整數,e、f、g及h的上限值分別為從Ar11 ~Ar14 能夠含有之取代基的數減去a、b、c或d之值。 e、f、g及h分別獨立地為0~8為較佳,0~2為更佳,0為進一步較佳。 Ar11 ~Ar14 分別獨立地為作為縮合環之一而含有以虛線包圍之苯環之多環芳香族烴基時,e、f、g及h為0或1為較佳,0為更佳。In the formula (Q3), e, f, g, and h each independently represent an integer of 0 or more, and the upper limits of e, f, g, and h are respectively subtracted from the number of substituents that Ar 11 to Ar 14 can contain. The value of a, b, c or d. e, f, g, and h are each independently preferably from 0 to 8, preferably from 0 to 2, and even more preferably from 0. When Ar 11 to Ar 14 are each independently a polycyclic aromatic hydrocarbon group containing a benzene ring surrounded by a dotted line as one of the condensed rings, e, f, g, and h are preferably 0 or 1, and 0 is more preferable.

作為以式(Q3)表示之化合物,例如,可舉出9,9-二[4-(2-丙烯醯氧基乙氧基)苯基]茀等。作為含有9,9-二芳基茀骨架之聚合性化合物,還能夠較佳地使用日本特開2010-254732號公報記載的化合物類。Examples of the compound represented by the formula (Q3) include 9,9-bis [4- (2-propenyloxyethoxy) phenyl] fluorene and the like. As the polymerizable compound containing a 9,9-diarylfluorene skeleton, compounds described in Japanese Patent Application Laid-Open No. 2010-254732 can also be preferably used.

作為該種含有卡多骨架之聚合性化合物,並無限定,例如,可舉出Oncoat EX系列(NAGASE & CO., LTD製造)及Ogsol(Osaka Gas Chemicals Co., Ltd.製造)等。The polymerizable compound containing a Cardo skeleton is not limited, and examples thereof include Oncoat EX series (manufactured by NAGASE & CO., LTD) and Ogsol (manufactured by Osaka Gas Chemicals Co., Ltd.).

〔多官能硫醇化合物〕 硬化性組成物含有多官能硫醇化合物。本說明書中,多官能硫醇化合物表示在同一分子內含有2個以上的硫醇基(亦即,以-SH表示之基團)者。 多官能硫醇化合物的含量並無特別限制,通常相對於上述著色劑的含量,為1~10質量%的情況較多。其中,從硬化性組成物具有更優異之本發明的效果之角度考慮,1~5.5質量%為較佳,1.5~3.5質量%為更佳。 多官能硫醇化合物的含量相對於硬化性組成物的總固體成分,0.55~3.5質量%為較佳,0.8~2.0質量%為更佳。 多官能硫醇化合物可單獨使用1種,亦可同時使用2種以上。同時使用2種以上時,其合計在上述範圍內為較佳。[Polyfunctional thiol compound] The curable composition contains a polyfunctional thiol compound. In this specification, a polyfunctional thiol compound means a thing which contains two or more thiol groups (namely, the group represented by -SH) in the same molecule. The content of the polyfunctional thiol compound is not particularly limited, and it is usually 1 to 10% by mass based on the content of the colorant. Among these, from the viewpoint that the curable composition has more excellent effects of the present invention, 1 to 5.5% by mass is more preferable, and 1.5 to 3.5% by mass is more preferable. The content of the polyfunctional thiol compound is more preferably 0.55 to 3.5% by mass, and even more preferably 0.8 to 2.0% by mass based on the total solid content of the curable composition. A polyfunctional thiol compound may be used individually by 1 type, and may use 2 or more types together. When two or more kinds are used at the same time, it is preferable that the total amount is within the above range.

多官能硫醇化合物為分子量100以上的低分子化合物為較佳,具體而言,分子量100~1,500為較佳,150~1,000為更佳。 多官能硫醇化合物在分子內含有2個以上的硫醇基,含有3個以上為較佳,含有10個以下為更佳,含有6個以下為進一步較佳,含有4個以下為更進一步較佳。其中,多官能硫醇化合物為3官能以上為較佳,3官能或4官能為更佳。 若多官能硫醇化合物為3官能以上,則硬化性組成物具有更優異之本發明的效果。The polyfunctional thiol compound is preferably a low-molecular compound having a molecular weight of 100 or more, specifically, a molecular weight of 100 to 1,500 is preferable, and a molecular weight of 150 to 1,000 is more preferable. The polyfunctional thiol compound contains two or more thiol groups in the molecule, preferably three or more, more preferably contains ten or less, more preferably contains six or less, and further contains four or less. good. Among them, the polyfunctional thiol compound is preferably trifunctional or more, and trifunctional or tetrafunctional is more preferred. When the polyfunctional thiol compound is trifunctional or more, the curable composition has more excellent effects of the present invention.

多官能硫醇化合物為具有2個以上的以下述式(1)表示之基團之化合物為較佳。The polyfunctional thiol compound is preferably a compound having two or more groups represented by the following formula (1).

【化學式16】 [Chemical Formula 16]

式(1)中,L1 表示單鍵或-CO-,L2 表示單鍵或2價的連結基。 作為多官能硫醇化合物,在每個分子內含有2~6個以式(1)表示之基團之化合物為較佳,含有2~4個之化合物為更佳,含有3或4個之化合物為進一步較佳。 作為式(1)中的L2 中的2價的連結基,可舉出2價的脂肪族基(例如,伸烷基、取代伸烷基、伸烯基、取代伸烯基、伸炔基、取代伸炔基)、2價的芳香族基(例如,伸芳基、取代伸芳基)、2價的雜環基、氧原子(-O-)、亞胺基(-NH-)、取代亞胺基(-NR31 -,其中,R31 為脂肪族基、芳香族基或雜環基)、羰基(-CO-)及該些的組合等。 2價的連結基為伸烷基時,作為伸烷基的碳數,1~5為較佳,1~2為更佳。In formula (1), L 1 represents a single bond or -CO-, and L 2 represents a single bond or a divalent linking group. As the polyfunctional thiol compound, a compound containing 2 to 6 groups represented by formula (1) in each molecule is preferable, a compound containing 2 to 4 is more preferable, and a compound containing 3 or 4 Is even better. Examples of the divalent linking group in L 2 in formula (1) include a divalent aliphatic group (for example, an alkylene group, a substituted alkylene group, an alkylene group, a substituted alkylene group, and an alkylene group). , Substituted alkynyl), divalent aromatic group (for example, arylene, substituted arylene), divalent heterocyclic group, oxygen atom (-O-), imino group (-NH-), Substituted imino group (-NR 31- , wherein R 31 is an aliphatic group, an aromatic group or a heterocyclic group), a carbonyl group (-CO-), a combination thereof, and the like. When the divalent linking group is an alkylene group, the carbon number of the alkylene group is preferably from 1 to 5, and more preferably from 1 to 2.

作為多官能硫醇化合物,具有2個以上的以式(1)表示之基團之以下述式(2)表示之化合物為更佳。As the polyfunctional thiol compound, a compound represented by the following formula (2) having two or more groups represented by the formula (1) is more preferred.

【化學式17】 [Chemical Formula 17]

式(1)中,L1 表示單鍵或-CO-,L2 表示單鍵或2價的連結基。X表示n價的連結基,n表示2~6的整數。另外,複數個L1 及L2 可分別相同亦可不同。In formula (1), L 1 represents a single bond or -CO-, and L 2 represents a single bond or a divalent linking group. X represents an n-valent linking group, and n represents an integer of 2 to 6. The plurality of L 1 and L 2 may be the same as or different from each other.

式(2)中的L1 及L2 的態様與式(1)相同。 式(2)中的n為2~4為較佳,3或4為更佳。 作為式(2)中的n價的連結基亦即X,例如可舉出:-(CH2m -(m表示2~6的整數。)等2價的連結基;具有3個三羥甲基丙烷殘基及-(CH2p -(p表示2~6的整數。)之異氰脲環等3價的連結基;季戊四醇殘基等4價的連結基;或5價的連結基;二季戊四醇殘基等6價的連結基。The states L of L 1 and L 2 in the formula (2) are the same as those in the formula (1). In formula (2), n is preferably 2 to 4, and 3 or 4 is more preferable. Examples of the n-valent linking group in formula (2), that is, X, include, for example:-(CH 2 ) m- (m represents an integer of 2 to 6.) Equivalent bivalent linking groups; having three trihydroxy groups A trivalent linking group such as a methylpropane residue and-(CH 2 ) p- (p represents an integer of 2 to 6.); a tetravalent linking group such as a pentaerythritol residue; or a pentavalent linking group. A hexavalent linking group such as a dipentaerythritol residue.

作為多官能硫醇化合物的具體例,例如,可舉出1,4-丁二醇雙(巰基乙酸酯)、季戊四醇四(3-巰基丙酸酯)、三羥甲基丙烷三(3-巰基丙酸酯)、季戊四醇四(3-巰基丙酸酯)、四甘醇雙(3-巰基丙酸酯)、二季戊四醇六(3-巰基丙酸酯)、季戊四醇四(巰基乙酸酯)、季戊四醇四(3-巰基丁酸酯)、丁二醇雙(3-巰基丁酸酯)、1,4-雙(3-巰基丁醯氧基)丁烷及1,4-雙(3-巰基丁氧基)丁烷、1,3,5-三(3-巰基丁氧基乙基)-1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮等。 其中,從硬化性組成物具有更優異之本發明的效果之角度考慮,多官能硫醇化合物是選自由季戊四醇四(3-巰基丙酸酯)及三羥甲基丙烷三(3-巰基丙酸酯)所組成之群組之至少一種為更佳。Specific examples of the polyfunctional thiol compound include 1,4-butanediol bis (mercaptoacetate), pentaerythritol tetra (3-mercaptopropionate), and trimethylolpropane tri (3- Mercaptopropionate), pentaerythritol tetra (3-mercaptopropionate), tetraethylene glycol bis (3-mercaptopropionate), dipentaerythritol hexa (3-mercaptopropionate), pentaerythritol tetra (mercaptoacetate) , Pentaerythritol tetrakis (3-mercaptobutyrate), butanediol bis (3-mercaptobutyrate), 1,4-bis (3-mercaptobutoxy) butane and 1,4-bis (3- Mercaptobutoxy) butane, 1,3,5-tris (3-mercaptobutoxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione Wait. Among them, from the viewpoint that the curable composition has more excellent effects of the present invention, the polyfunctional thiol compound is selected from pentaerythritol tetrakis (3-mercaptopropionate) and trimethylolpropane tris (3-mercaptopropionate). More preferably, at least one of the groups consisting of esters is used.

〔任意成分〕 <聚合抑制劑> 硬化性組成物含有聚合抑制劑為較佳。藉由含有聚合抑制劑,硬化性組成物具有更優異之經時穩定性。另外,本說明書中,經時穩定性表示,即使在製備硬化性組成物之後保管規定期間時,亦能夠獲得具有優異之圖案形狀之硬化膜。 聚合抑制劑具有抑制在保管中的硬化性組成物中,進行多官能硫醇化合物與聚合性化合物的反應之作用,推斷為可獲得上述效果。 聚合抑制劑的含量相對於多官能硫醇化合物的含量,0.1~1.5質量%為較佳,0.3~1.0質量%為更佳。 若聚合抑制劑的含量在上述範圍內,則硬化性組成物具有更優異之經時穩定性。 並且,聚合抑制劑的含量相對於硬化性組成物的總固體成分,0.00055~0.055質量%為較佳,0.0015~0.01質量%為更佳。[Optional component] <Polymerization inhibitor> The curable composition preferably contains a polymerization inhibitor. By containing a polymerization inhibitor, the curable composition has more excellent stability over time. In addition, in this specification, stability over time means that a cured film having an excellent pattern shape can be obtained even when stored for a predetermined period after the production of the curable composition. The polymerization inhibitor has a function of inhibiting the reaction between the polyfunctional thiol compound and the polymerizable compound in the hardening composition during storage, and it is estimated that the above-mentioned effect can be obtained. The content of the polymerization inhibitor relative to the content of the polyfunctional thiol compound is preferably 0.1 to 1.5% by mass, and more preferably 0.3 to 1.0% by mass. When the content of the polymerization inhibitor is within the above range, the curable composition has more excellent stability over time. In addition, the content of the polymerization inhibitor is preferably 0.00055 to 0.055 mass%, and more preferably 0.0015 to 0.01 mass% with respect to the total solid content of the curable composition.

作為聚合抑制劑,並無特別限制,能夠使用用作聚合抑制劑之公知的化合物。作為用作聚合抑制劑之化合物,例如,可舉出酚系化合物、醌系化合物、受阻胺系化合物、吩噻嗪系化合物及硝基苯系化合物等。上述化合物可單獨使用1種,亦可同時使用2種以上。The polymerization inhibitor is not particularly limited, and a known compound used as a polymerization inhibitor can be used. Examples of the compound used as a polymerization inhibitor include phenol-based compounds, quinone-based compounds, hindered amine-based compounds, phenothiazine-based compounds, and nitrobenzene-based compounds. These compounds may be used individually by 1 type, and may use 2 or more types together.

作為酚系化合物,例如,可舉出苯酚、4-甲氧基苯酚、氫醌、2-第三丁基氫醌、鄰苯二酚、4-第三丁基鄰苯二酚、2,6-二-第三丁基苯酚、2,6-二-第三丁基4-甲基苯酚、2,6-二-第三丁基4-以及苯酚、4-羥基甲基-2,6-二-第三丁基苯酚、季戊四醇四(3,5-二-第三丁基4-羥基苯基丙酸乙酯)、4-甲氧基-1-萘酚及1,4-二羥基萘等。Examples of the phenol-based compound include phenol, 4-methoxyphenol, hydroquinone, 2-tert-butylhydroquinone, catechol, 4-tert-butylcatechol, and 2,6 -Di-tertiary-butylphenol, 2,6-di-tertiary-butyl 4-methylphenol, 2,6-di-tertiary-butyl 4- and phenol, 4-hydroxymethyl-2,6- Di-Third-Butylphenol, Pentaerythritol Tetrakis (3,5-Di-Third-Butyl 4-Hydroxyphenylpropionate), 4-methoxy-1-naphthol, and 1,4-dihydroxynaphthalene Wait.

作為酚系化合物,以式(IH-1)表示之酚系化合物為較佳。As the phenolic compound, a phenolic compound represented by the formula (IH-1) is preferable.

【化學式18】 [Chemical Formula 18]

式(IH-1)中,R1 ~R5 分別獨立地表示氫原子、烷基、烯基、羥基、胺基、芳基、烷氧基、羧基、烷氧羰基或醯基。R1 ~R5 可分別連結而形成環。In the formula (IH-1), R 1 to R 5 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, a hydroxyl group, an amine group, an aryl group, an alkoxy group, a carboxyl group, an alkoxycarbonyl group, or a fluorenyl group. R 1 to R 5 may be connected to each other to form a ring.

作為式(IH-1)中的R1 ~R5 ,氫原子、碳數1~5的烷基(例如,甲基及乙基等)、碳數1~5的烷氧基(例如,甲氧基及乙氧基等)、碳數2~4的烯基(例如,乙烯基等)或苯基為較佳。 其中,R1 及R5 分別獨立地為氫原子或第三丁基為更佳,R2 及R4 為氫原子為更佳,R3 為氫原子、碳數1~5的烷基或碳數1~5的烷氧基為更佳。As R 1 to R 5 in formula (IH-1), a hydrogen atom, an alkyl group having 1 to 5 carbon atoms (for example, methyl and ethyl), and an alkoxy group having 1 to 5 carbon atoms (for example, methyl An oxy group, an ethoxy group, etc.), an alkenyl group (for example, a vinyl group, etc.) having 2 to 4 carbon atoms, or a phenyl group is preferred. Among them, R 1 and R 5 are each preferably a hydrogen atom or a third butyl group, R 2 and R 4 are more preferably a hydrogen atom, R 3 is a hydrogen atom, or an alkyl group or carbon having 1 to 5 carbon atoms. An alkoxy group having a number of 1 to 5 is more preferred.

作為醌系化合物,例如,可舉出1,4-苯醌、1,2-苯醌及1,4-萘醌等。Examples of the quinone-based compound include 1,4-benzoquinone, 1,2-benzoquinone, and 1,4-naphthoquinone.

作為受阻胺系化合物,例如,可舉出以下述式(IH-2)表示之聚合抑制劑。Examples of the hindered amine-based compound include a polymerization inhibitor represented by the following formula (IH-2).

【化學式19】 [Chemical Formula 19]

式(IH-2)中的R6 表示氫原子、羥基、胺基、烷氧基、烷氧羰基或醯基。其中,氫原子或羥基為較佳,羥基為更佳。 式(IH-2)中的R7 ~R10 分別獨立地表示氫原子或烷基。作為R7 ~R10 所表示之烷基,碳數1~5的烷基為較佳,甲基或乙基為更佳。R 6 in formula (IH-2) represents a hydrogen atom, a hydroxyl group, an amine group, an alkoxy group, an alkoxycarbonyl group, or a fluorenyl group. Among them, a hydrogen atom or a hydroxyl group is preferable, and a hydroxyl group is more preferable. R 7 to R 10 in the formula (IH-2) each independently represent a hydrogen atom or an alkyl group. The alkyl group represented by R 7 to R 10 is preferably an alkyl group having 1 to 5 carbon atoms, and more preferably a methyl group or an ethyl group.

作為聚合抑制劑,可將上述各化合物單獨使用1種,亦可同時使用2種,還可同時使用3種以上。 聚合抑制劑含有酚系化合物為較佳。其中,聚合抑制劑含有2種以上的酚系化合物為更佳。含有不同酚系化合物之硬化性組成物具有更優異之本發明的效果。 聚合抑制劑含有酚系化合物及受阻胺系化合物為較佳。含有酚系化合物及受阻胺系化合物之硬化性組成物具有更優異之本發明的效果。As the polymerization inhibitor, each of the above-mentioned compounds may be used alone or in combination of two or more of them. The polymerization inhibitor preferably contains a phenolic compound. Among them, the polymerization inhibitor preferably contains two or more phenolic compounds. The curable composition containing different phenolic compounds has more excellent effects of the present invention. The polymerization inhibitor preferably contains a phenol-based compound and a hindered amine-based compound. The curable composition containing a phenol-based compound and a hindered amine-based compound has more excellent effects of the present invention.

<溶劑> 硬化性組成物含有溶劑為較佳。作為溶劑,可舉出水及有機溶劑。硬化性組成物含有有機溶劑為較佳。 硬化性組成物含有溶劑時,硬化性組成物的固體成分為10~40質量%為較佳。若硬化性組成物的固體成分為下限值以上,則黏度較低,塗佈性得到優化。而且,藉由反應性較高之化合物的濃度變低,經時穩定性得到優化。若硬化性組成物的固體成分為上限值以下,則黏度保持為較低程度,塗佈性得到優化。而且,比重較重之著色劑不易沉降,經時穩定性得到優化。<Solvent> The curable composition preferably contains a solvent. Examples of the solvent include water and organic solvents. The curable composition preferably contains an organic solvent. When the curable composition contains a solvent, the solid content of the curable composition is preferably 10 to 40% by mass. When the solid content of the curable composition is at least the lower limit value, the viscosity is low, and the coatability is optimized. Furthermore, as the concentration of the more reactive compound becomes lower, the stability over time is optimized. When the solid content of the curable composition is equal to or less than the upper limit value, the viscosity is kept low, and the coatability is optimized. Moreover, the coloring agent with a heavy specific gravity is difficult to settle, and the stability over time is optimized.

(有機溶劑) 硬化性組成物含有有機溶劑時,作為有機溶劑的含量,相對於硬化性組成物的總質量,60~90質量%為較佳。 另外,有機溶劑可單獨使用1種,亦可同時使用2種以上。同時使用2種以上的有機溶劑時,其合計量成為上述範圍為較佳。(Organic Solvent) When the curable composition contains an organic solvent, the content of the organic solvent is preferably 60 to 90% by mass based on the total mass of the curable composition. The organic solvents may be used alone or in combination of two or more. When two or more organic solvents are used at the same time, the total amount thereof is preferably within the above range.

作為有機溶劑,並無特別限制,例如,可舉出丙酮、甲乙酮、環己烷、二氯乙烷、四氫呋喃、甲苯、乙二醇單甲醚、乙二醇單乙醚、乙二醇二甲醚、丙二醇單甲醚、丙二醇單乙醚、乙醯丙酮、環己酮、環戊酮、二丙酮醇、乙二醇單甲醚乙酸酯、乙二醇乙醚乙酸酯、乙二醇單異丙醚、乙二醇單丁醚乙酸酯、3-甲氧基丙醇、甲氧基乙氧基乙醇、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇二甲醚、二乙二醇二乙基醚、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯、3-甲氧基乙酸丙酯、N,N-二甲基甲醯胺、二甲基亞碸、γ-丁內酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、乙基溶纖劑乙酸酯、3-甲氧基丙酸甲酯、2-庚酮、乙基卡必醇乙酸酯、丁基卡必醇乙酸酯、乙酸乙酯、乙酸丁酯、乳酸甲酯及乳酸乙酯等。The organic solvent is not particularly limited, and examples thereof include acetone, methyl ethyl ketone, cyclohexane, dichloroethane, tetrahydrofuran, toluene, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol dimethyl ether. , Propylene glycol monomethyl ether, propylene glycol monoethyl ether, acetone acetone, cyclohexanone, cyclopentanone, diacetone alcohol, ethylene glycol monomethyl ether acetate, ethylene glycol ether acetate, ethylene glycol monoisopropyl Ether, ethylene glycol monobutyl ether acetate, 3-methoxypropanol, methoxyethoxyethanol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether , Diethylene glycol diethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, 3-methoxypropyl acetate, N, N-dimethylformamidine, dimethylmethylene , Γ-butyrolactone, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, methyl 3-methoxypropionate, 2-heptanone , Ethyl carbitol acetate, butyl carbitol acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, and the like.

含有2種以上的有機溶劑時,由選自由上述3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、乙基溶纖劑乙酸酯、乳酸乙酯、二乙二醇二甲醚、乙酸丁酯、3-甲氧基丙酸甲酯、2-庚酮、環己酮、環戊酮、乙基卡必醇乙酸酯、丁基卡必醇乙酸酯、丙二醇單甲醚及丙二醇單甲醚乙酸酯所組成之群組中的2種以上構成為較佳。When two or more organic solvents are contained, it is selected from the group consisting of the above-mentioned methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, and diethylene glycol. Dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone, cyclopentanone, ethylcarbitol acetate, butylcarbitol acetate, propylene glycol It is preferable that two or more types of the group consisting of monomethyl ether and propylene glycol monomethyl ether acetate are constituted.

(水) 硬化性組成物可含有水。水可以是有意添加者,亦可以是藉由添加硬化性組成物中包含之各成分而在硬化性組成物中不可避免地含有者。 水的含量相對於硬化性組成物的總質量,0.01~1質量%為較佳。若水的含量在上述範圍內,則製作硬化膜時抑制產生針孔,而且硬化膜的耐濕性得到提高。(Water) The curable composition may contain water. Water may be intentionally added, or may be unavoidably contained in the hardening composition by adding each component contained in the hardening composition. The content of water is preferably 0.01 to 1% by mass based on the total mass of the curable composition. When the content of water is within the above range, pinholes are suppressed from being produced when the cured film is produced, and the moisture resistance of the cured film is improved.

<分散劑> 硬化性組成物含有分散劑為較佳。分散劑有助於提高著色劑的分散性。本說明書中,分散劑為與後述之黏結樹脂不同之成分。<Dispersant> The curable composition preferably contains a dispersant. The dispersant helps improve the dispersibility of the colorant. In this specification, a dispersant is a component different from the binder resin mentioned later.

硬化性組成物含有分散劑時,分散劑的含量相對於硬化性組成物的總固體成分,0.1質量%以上為較佳,0.5質量%以上為更佳,5質量%以上為進一步較佳,11質量%以上為特佳,17質量%以上為最佳。關於分散劑的含量的上限,相對於硬化性組成物的總固體成分,50質量%以下為較佳,30質量%以下為更佳,22質量%以下為進一步較佳。 若分散劑的含量為17質量%以上,則使硬化性組成物硬化來獲得之硬化膜的圖案形狀更優異。 分散劑可單獨使用1種,亦可同時使用2種以上。同時使用2種以上的分散劑時,合計量在上述範圍內為較佳。When the hardening composition contains a dispersant, the content of the dispersing agent is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and more preferably 5% by mass or more relative to the total solid content of the hardening composition. A mass% or more is particularly preferable, and a mass of 17% or more is best. The upper limit of the content of the dispersant is preferably 50% by mass or less, more preferably 30% by mass or less, and more preferably 22% by mass or less with respect to the total solid content of the curable composition. When the content of the dispersant is 17% by mass or more, the pattern shape of the cured film obtained by curing the curable composition is more excellent. The dispersant may be used singly or in combination of two or more kinds. When two or more dispersants are used simultaneously, the total amount is preferably within the above range.

作為分散劑,例如能夠適當選擇公知的顏料分散劑來使用。其中,高分子化合物為較佳。 作為分散劑,可舉出高分子分散劑〔例如,聚醯胺胺及其鹽、多羧酸及其鹽、高分子量不飽和酸酯、改質聚胺基甲酸酯、改質聚酯、改質聚(甲基)丙烯酸酯、(甲基)丙烯酸系共聚物、萘磺酸甲醛縮合物〕、聚氧乙烯烷基磷酸酯、聚氧乙烯烷基胺及顏料衍生物等。 高分子化合物依其結構,可進一步分類為直鏈狀高分子、末端改質型高分子、接枝型高分子及嵌段型高分子。As the dispersant, for example, a known pigment dispersant can be appropriately selected and used. Among them, a polymer compound is preferred. Examples of the dispersant include polymer dispersants [for example, polyamidoamine and its salts, polycarboxylic acids and their salts, high-molecular-weight unsaturated esters, modified polyurethanes, modified polyesters, Modified poly (meth) acrylate, (meth) acrylic copolymer, naphthalenesulfonic acid formaldehyde condensate], polyoxyethylene alkyl phosphate, polyoxyethylene alkylamine, and pigment derivatives. Based on their structure, polymer compounds can be further classified into linear polymers, terminally modified polymers, graft polymers, and block polymers.

(高分子化合物) 高分子化合物吸附於著色劑(例如,無機顏料)等被分散體的表面,發揮防止被分散體的再凝聚之作用。故,含有針對顏料表面的固定部位之末端改質型高分子、接枝型高分子及嵌段型高分子為較佳。(Polymer Compound) The polymer compound is adsorbed on the surface of the dispersion such as a colorant (for example, an inorganic pigment), and plays a role of preventing re-aggregation of the dispersion. Therefore, it is preferable to include a terminally modified polymer, a graft polymer, and a block polymer that are fixed to the pigment surface.

高分子化合物含有包含接枝鏈之結構單元為較佳。本說明書中,「結構單元」的含義與「重複單元」相同。 該種含有包含接枝鏈之結構單元之高分子化合物藉由接枝鏈具有與溶劑的親和性,故是黑色顏料等著色劑的分散性及經時之後的分散穩定性(經時穩定性)優異者。含有包含接枝鏈之結構單元之高分子化合物藉由接枝鏈的存在,與聚合性化合物或其他能夠同時使用之樹脂等具有親和性。其結果,在鹼性顯影不易產生殘渣。 若接枝鏈變長,則立體排斥效果提高而黑色顏料等的分散性得到提高。另一方面,若接枝鏈過長,則向黑色顏料等著色顏料的吸附力下降,黑色顏料等的分散性處於下降的趨勢。故,接枝鏈為氫原子以外的原子數為40~10,000者為較佳,氫原子以外的原子數為50~2,000者為更佳,氫原子以外的原子數為60~500者為進一步較佳。 其中,接枝鏈表示共聚物的主鏈的根部(從主鏈支化之基團中與主鏈鍵結之原子)至從主鏈支化之基團的末端。The polymer compound preferably contains a structural unit including a graft chain. In this specification, "structural unit" has the same meaning as "repeating unit". This polymer compound containing a structural unit containing a graft chain has an affinity with a solvent through the graft chain, so it is a dispersibility of a colorant such as a black pigment and a dispersion stability over time (stability over time) Outstanding. A polymer compound containing a structural unit containing a graft chain has an affinity with a polymerizable compound or other resins that can be used together due to the presence of the graft chain. As a result, residues are less likely to occur in alkaline development. When the graft chain becomes longer, the steric repulsion effect increases and the dispersibility of a black pigment or the like improves. On the other hand, if the graft chain is too long, the adsorption force to a colored pigment such as a black pigment decreases, and the dispersibility of the black pigment or the like tends to decrease. Therefore, it is preferable that the number of atoms other than hydrogen atoms is 40 to 10,000, the number of atoms other than hydrogen atoms is 50 to 2,000, and the number of atoms other than hydrogen atoms is 60 to 500. good. Herein, the graft chain represents the root of the main chain of the copolymer (the atom bonded to the main chain from the main chain branched group) to the end of the main chain branched group.

接枝鏈含有聚合物結構為較佳,作為該種聚合物結構,例如能夠舉出聚(甲基)丙烯酸酯結構(例如,聚(甲基)丙烯酸結構)、聚酯結構、聚胺基甲酸酯結構、聚脲結構、聚醯胺結構及聚醚結構。 為了提高接枝鏈與溶劑的相互作用性,並藉此提高黑色顏料等的分散性,接枝鏈是含有選自由聚酯結構、聚醚結構及聚(甲基)丙烯酸酯結構所組成之群組之至少一種之接枝鏈為較佳,含有聚酯結構或聚醚結構的至少任一個之接枝鏈為更佳。The graft chain preferably contains a polymer structure. Examples of the polymer structure include a poly (meth) acrylate structure (for example, a poly (meth) acrylic structure), a polyester structure, and a polyurethane. Ester structure, polyurea structure, polyamidine structure and polyether structure. In order to improve the interaction between the graft chain and the solvent and thereby improve the dispersibility of the black pigment, the graft chain contains a group selected from the group consisting of a polyester structure, a polyether structure, and a poly (meth) acrylate structure. A graft chain of at least one of these groups is preferable, and a graft chain containing at least any one of a polyester structure or a polyether structure is more preferable.

作為該種含有接枝鏈之巨單體,並無特別限定,能夠適當使用含有反應性雙鍵性基之巨單體。The macromonomer containing such a graft chain is not particularly limited, and a macromonomer containing a reactive double bond group can be appropriately used.

與高分子化合物所含有之包含接枝鏈之結構單元對應,作為適合用於合成高分子化合物之市售的巨單體,可舉出AA-6(商品名、Toagosei Company, Limited.)、AA-10(商品名、Toagosei Company, Limited.製造)、AB-6(商品名、Toagosei Company, Limited.製造)、AS-6(商品名、Toagosei Company, Limited.)、AN-6(商品名、Toagosei Company, Limited.製造)、AW-6(商品名、Toagosei Company, Limited.製造)、AA-714(商品名、Toagosei Company, Limited.製造)、AY-707(商品名、Toagosei Company, Limited.製造)、AY-714(商品名、Toagosei Company, Limited.製造)、AK-5(商品名、Toagosei Company, Limited.製造)、AK-30(商品名、Toagosei Company, Limited.製造)、AK-32(商品名、Toagosei Company, Limited.製造)、Blemmer PP-100(商品名、NOF CORPORATION.製造)、Blemmer PP-500(商品名、NOF CORPORATION.製造)、Blemmer PP-800(商品名、NOF CORPORATION.製造)、Blemmer PP-1000(商品名、NOF CORPORATION.製造)、Blemmer 55-PET-800(商品名、NOF CORPORATION.製造)、Blemmer PME-4000(商品名、NOF CORPORATION.製造)、Blemmer PSE-400(商品名、NOF CORPORATION.製造)、Blemmer PSE-1300(商品名、NOF CORPORATION.製造)、Blemmer 43PAPE-600B(商品名、NOF CORPORATION.製造)等。其中,使用AA-6(商品名、Toagosei.Company, Limited.製造)、AA-10(商品名、Toagosei Company, Limited.)、AB-6(商品名、Toagosei Company, Limited.製造)、AS-6(商品名、Toagosei Company, Limited.)、AN-6(商品名、Toagosei Company, Limited.製造)及Blemmer PME-4000(商品名、NOF CORPORATION.製造)等為較佳。Corresponding to the structural unit containing the graft chain contained in the polymer compound, examples of commercially available macromonomers suitable for the synthesis of the polymer compound include AA-6 (trade name, Toagosei Company, Limited.), AA -10 (trade name, manufactured by Toagosei Company, Limited.), AB-6 (trade name, manufactured by Toagosei Company, Limited.), AS-6 (trade name, Toagosei Company, Limited.), AN-6 (trade name, Toagosei Company, Limited.), AW-6 (trade name, manufactured by Toagosei Company, Limited.), AA-714 (trade name, manufactured by Toagosei Company, Limited.), AY-707 (trade name, Toagosei Company, Limited. (Manufactured), AY-714 (trade name, manufactured by Toagosei Company, Limited.), AK-5 (trade name, manufactured by Toagosei Company, Limited.), AK-30 (trade name, manufactured by Toagosei Company, Limited.), AK- 32 (trade name, manufactured by Toagosei Company, Limited.), Blemmer PP-100 (trade name, manufactured by NOF CORPORATION.), Blemmer PP-500 (trade name, manufactured by NOF CORPORATION.), Blemmer PP-800 (trade name, NOF CORPORATION.), B lemmer PP-1000 (trade name, manufactured by NOF CORPORATION.), Blemmer 55-PET-800 (trade name, manufactured by NOF CORPORATION.), Blemmer PME-4000 (trade name, manufactured by NOF CORPORATION.), Blemmer PSE-400 (product Name, NOF CORPORATION.), Blemmer PSE-1300 (trade name, manufactured by NOF CORPORATION.), Blemmer 43PAPE-600B (trade name, manufactured by NOF CORPORATION.), Etc. Among them, AA-6 (trade name, manufactured by Toagosei. Company, Limited.), AA-10 (trade name, manufactured by Toagosei Company, Limited.), AB-6 (trade name, manufactured by Toagosei Company, Limited.), And AS- 6 (trade name, Toagosei Company, Limited.), AN-6 (trade name, manufactured by Toagosei Company, Limited.), And Blemmer PME-4000 (trade name, manufactured by NOF CORPORATION.) Are preferred.

分散劑含有選自由聚丙烯酸甲酯、聚甲基丙烯酸甲酯及環狀或鏈狀的聚酯所組成之群組之至少一種結構為較佳。分散劑含有選自由聚丙烯酸甲酯、聚甲基丙烯酸甲酯及鏈狀的聚酯所組成之群組之至少一種結構為更佳。上述分散劑含有選自由聚丙烯酸甲酯結構、聚甲基丙烯酸甲酯結構、聚己內酯結構及聚戊內酯結構所組成之群組之至少一種結構為進一步較佳。分散劑可以是在1個分散劑中單獨含有上述結構者,亦可以是在1個分散劑中含有複數個該種結構者。 其中,聚己內酯結構是指作為重複單元含有對ε-己內酯進行開環之結構者。聚戊內酯結構是指作為重複單元含有對δ-戊內酯進行開環之結構者。 作為含有聚己內酯結構之分散劑的具體例,可舉出下述式(1)及下述式(2)中的j及k為5者。並且,作為含有聚戊內酯結構之分散劑的具體例,可舉出下述式(1)及下述式(2)中的j及k為4者。 作為含有聚丙烯酸甲酯結構之分散劑的具體例,可舉出下述式(4)中的X5 為氫原子且R4 為甲基者。並且,作為含有聚甲基丙烯酸甲酯結構之分散劑的具體例,可舉出下述式(4)中的X5 為甲基且R4 為甲基者。The dispersant preferably contains at least one structure selected from the group consisting of polymethyl acrylate, polymethyl methacrylate, and cyclic or chain polyester. The dispersant preferably contains at least one structure selected from the group consisting of polymethyl acrylate, polymethyl methacrylate, and chain polyester. It is further preferred that the dispersant contains at least one structure selected from the group consisting of a polymethyl acrylate structure, a polymethyl methacrylate structure, a polycaprolactone structure, and a polyvalerolactone structure. The dispersant may include the above-mentioned structure alone in one dispersant, or may include a plurality of such structures in one dispersant. Among them, the polycaprolactone structure refers to a structure containing a ring-opening of ε-caprolactone as a repeating unit. The polyvalerolactone structure refers to a structure containing, as a repeating unit, a ring opening of δ-valerolactone. Specific examples of the dispersant containing a polycaprolactone structure include those in which j and k in the following formula (1) and the following formula (2) are five. Further, specific examples of the dispersant containing a polyvalerolactone structure include those in which j and k are 4 in the following formula (1) and the following formula (2). Specific examples of the dispersant containing a polymethyl acrylate structure include those in which X 5 in the following formula (4) is a hydrogen atom and R 4 is a methyl group. Further, as a specific example of polymethyl methacrylate containing structures of the dispersing agent include the following formula (4) X 5 is methyl and R 4 is methyl persons.

・含有接枝鏈之結構單元 高分子化合物作為含有接枝鏈之結構單元,含有以下述式(1)~式(4)的任一個表示之結構單元為較佳,含有以下述式(1A)、下述式(2A)、下述式(3A)、下述式(3B)及下述(4)的任一個表示之結構單元為更佳。・ The structural unit containing the graft chain The polymer compound as the structural unit containing the graft chain preferably contains a structural unit represented by any one of the following formulae (1) to (4), and contains the following formula (1A) The structural unit represented by any one of the following formula (2A), the following formula (3A), the following formula (3B), and the following (4) is more preferable.

【化學式20】 [Chemical Formula 20]

式(1)~式(4)中,W1 、W2 、W3 及W4 分別獨立地表示氧原子或NH。W1 、W2 、W3 及W4 為氧原子為較佳。 式(1)~式(4)中,X1 、X2 、X3 、X4 及X5 分別獨立地表示氫原子或1價的有機基團。X1 、X2 、X3 、X4 及X5 從合成方面的限制的觀點考慮,分別獨立地為氫原子或碳數(碳原子數)1~12的烷基為較佳,分別獨立地為氫原子或甲基為更佳,甲基為進一步較佳。In Formulae (1) to (4), W 1 , W 2 , W 3, and W 4 each independently represent an oxygen atom or NH. It is preferable that W 1 , W 2 , W 3 and W 4 are oxygen atoms. In the formulae (1) to (4), X 1 , X 2 , X 3 , X 4 and X 5 each independently represent a hydrogen atom or a monovalent organic group. X 1 , X 2 , X 3 , X 4, and X 5 are each independently a hydrogen atom or an alkyl group having 1 to 12 carbon atoms (carbon number (carbon number)) from the viewpoint of limitation in synthesis. A hydrogen atom or a methyl group is more preferable, and a methyl group is more preferable.

式(1)~式(4)中,Y1 、Y2 、Y3 及Y4 分別獨立地表示2價的連結基,連結基的結構方面並無特別的限制。作為以Y1 、Y2 、Y3 及Y4 表示之2價的連結基,具體而言,可舉出下述(Y-1)~(Y-21)的連結基等為例。下述所示之結構中,A、B分別表示鍵結部位。下述所示之結構中,從合成的簡便性考慮,(Y-2)或(Y-13)為更佳。In the formulae (1) to (4), Y 1 , Y 2 , Y 3, and Y 4 each independently represent a divalent linking group, and the structure of the linking group is not particularly limited. Specific examples of the divalent linking group represented by Y 1 , Y 2 , Y 3 and Y 4 include the following linking groups (Y-1) to (Y-21). In the structure shown below, A and B each represent a bonding site. Among the structures shown below, (Y-2) or (Y-13) is more preferable from the viewpoint of simplicity of synthesis.

【化學式21】 [Chemical Formula 21]

式(1)~式(4)中,Z1 、Z2 、Z3 及Z4 分別獨立地表示1價的有機基團。有機基團的結構並無特別限定,具體而言,可舉出烷基、羥基、烷氧基、芳氧基、雜芳氧基、烷硫醚基、芳硫醚基、雜芳硫醚基及胺基等。該些中,作為以Z1 、Z2 、Z3 及Z4 表示之有機基團,尤其從分散性提高的觀點考慮,含有立體排斥效果者為較佳,分別獨立地為碳數5至24的烷基或烷氧基為更佳,其中,分別獨立地為碳數5至24的分支烷基、碳數5至24的環狀烷基或碳數5至24的烷氧基為進一步較佳。另外,烷氧基中包含之烷基可以是直鏈狀、支鏈狀及環狀的任一個。In Formulas (1) to (4), Z 1 , Z 2 , Z 3, and Z 4 each independently represent a monovalent organic group. The structure of the organic group is not particularly limited, and specific examples include an alkyl group, a hydroxyl group, an alkoxy group, an aryloxy group, a heteroaryloxy group, an alkylthioether group, an arylthioether group, and a heteroarylthioether group. And amine groups. Among these, as the organic group represented by Z 1 , Z 2 , Z 3, and Z 4 , especially from the viewpoint of improving dispersibility, it is preferable to include a stereorepulsive effect, and each independently has a carbon number of 5 to 24. Alkyl or alkoxy groups are more preferred, in which branched alkyl groups having 5 to 24 carbon atoms, cyclic alkyl groups with 5 to 24 carbon atoms, or alkoxy groups with 5 to 24 carbon atoms, respectively, are further preferred. good. The alkyl group contained in the alkoxy group may be any of linear, branched, and cyclic groups.

式(1)~式(4)中,n、m、p及q分別獨立地為1至500的整數。 式(1)及式(2)中,j及k分別獨立地表示2~8的整數。從硬化性組成物的經時穩定性及顯影性的觀點考慮,式(1)及式(2)中的j及k為4~6的整數為較佳,5為最佳。In Formulas (1) to (4), n, m, p, and q are each independently an integer of 1 to 500. In formulas (1) and (2), j and k each independently represent an integer of 2 to 8. From the viewpoint of the stability of the curable composition over time and developability, j and k in the formulae (1) and (2) are preferably integers of 4 to 6, and 5 is the most preferable.

式(3)中,R3 表示分支或直鏈的伸烷基,碳數1~10的伸烷基為較佳,碳數2或3的伸烷基為更佳。p為2~500時,存在複數個之R3 可相互相同亦可互不相同。 式(4)中,R4 表示氫原子或1價的有機基團,作為該1價的有機基團,結構上並無特別限定。R4 為氫原子、烷基、芳基或雜芳基為較佳,為氫原子或烷基為更佳。R4 為烷基時,碳數1~20的直鏈狀烷基、碳數3~20的分支狀烷基或碳數5~20的環狀烷基為較佳,碳數1~20的直鏈狀烷基為更佳,碳數1~6的直鏈狀烷基為進一步較佳。式(4)中,q為2~500時,接枝共聚物中存在複數個之X5 及R4 可相互相同亦可互不相同。In the formula (3), R 3 represents a branched or linear alkylene group, an alkylene group having 1 to 10 carbon atoms is preferred, and an alkylene group having 2 or 3 carbon atoms is more preferred. When p is 2 to 500, a plurality of R 3 may be the same as each other or different from each other. In the formula (4), R 4 represents a hydrogen atom or a monovalent organic group, and the monovalent organic group is not particularly limited in structure. R 4 is preferably a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group, and more preferably a hydrogen atom or an alkyl group. When R 4 is an alkyl group, a linear alkyl group having 1 to 20 carbon atoms, a branched alkyl group having 3 to 20 carbon atoms, or a cyclic alkyl group having 5 to 20 carbon atoms is preferred. A linear alkyl group is more preferred, and a linear alkyl group having 1 to 6 carbon atoms is more preferred. In formula (4), when q is 2 to 500, a plurality of X 5 and R 4 in the graft copolymer may be the same as each other or different from each other.

高分子化合物可含有2種以上的不同結構且含有接枝鏈之結構單元。亦即,高分子化合物的分子中可以包含結構互不相同之以式(1)~式(4)表示之結構單元,式(1)~式(4)中,n、m、p及q分別表示2以上的整數時,式(1)及式(2)中,可在側鏈中包含j及k互不相同之結構,式(3)及式(4)中,分子內存在複數個之R3 、R4 及X5 可相互相同亦可互不相同。The polymer compound may contain two or more different structural units having a structural unit of a graft chain. That is, the molecules of the polymer compound may include structural units represented by formulas (1) to (4), which are different from each other. In formulas (1) to (4), n, m, p, and q are respectively When an integer of 2 or more is represented, in the formulae (1) and (2), a structure in which j and k are different from each other may be included in the side chain. In the formulae (3) and (4), a plurality of molecules exist in the molecule. R 3 , R 4 and X 5 may be the same as each other or different from each other.

作為以式(1)表示之結構單元,從硬化性組成物的經時穩定性及顯影性的觀點考慮,以下述式(1A)表示之結構單元為更佳。 作為以式(2)表示之結構單元,從硬化性組成物的經時穩定性及顯影性的觀點考慮,以下述式(2A)表示之結構單元為更佳。As the structural unit represented by the formula (1), a structural unit represented by the following formula (1A) is more preferable from the viewpoint of the stability over time and developability of the curable composition. As the structural unit represented by the formula (2), a structural unit represented by the following formula (2A) is more preferred from the viewpoint of the stability over time and developability of the curable composition.

【化學式22】 [Chemical Formula 22]

式(1A)中,X1 、Y1 、Z1 及n的含義與式(1)中的X1 、Y1 、Z1 及n相同,較佳範圍亦相同。式(2A)中,X2 、Y2 、Z2 及m的含義與式(2)中的X2 、Y2 、Z2 及m相同,較佳範圍亦相同。In the formula (1A), X 1, X Y 1, Z 1 and n are as defined in the formula (1) is 1, Y 1, Z 1 and n, respectively, preferred ranges are also the same. In formula (2A), X 2, Y 2, Z 2 and m are as defined for the formula X (2) is 2, Y 2, Z 2 and the same as m, the preferred range is also the same.

作為以式(3)表示之結構單元,從硬化性組成物的經時穩定性及顯影性的觀點考慮,以下述式(3A)或式(3B)表示之結構單元為更佳。As the structural unit represented by the formula (3), a structural unit represented by the following formula (3A) or formula (3B) is more preferred from the viewpoint of the stability over time and developability of the curable composition.

【化學式23】 [Chemical Formula 23]

式(3A)或(3B)中,X3 、Y3 、Z3 及p的含義與式(3)中的X3 、Y3 、Z3 及p相同,較佳範圍亦相同。Formula (3A) or (3B) in, 3, Y 3, Z 3 and same p X 3, Y 3, Z 3 and p are defined for the formula X (3) is, preferred ranges are also the same.

高分子化合物作為含有接枝鏈之結構單元,含有以式(1A)表示之結構單元為更佳。As a structural unit containing a graft chain, the polymer compound preferably contains a structural unit represented by formula (1A).

高分子化合物中,含有接枝鏈之結構單元(例如,以上述式(1)~式(4)表示之結構單元)以質量換算,相對於高分子化合物的總質量,以2~90%的範圍包含為較佳,以5~30%的範圍包含為更佳。若在該範圍內包含含有接枝鏈之結構單元,則黑色顏料的分散性較高,形成硬化膜時的顯影性良好。In the polymer compound, the structural unit containing the graft chain (for example, the structural unit represented by the above formula (1) to formula (4)) is 2 to 90% by mass conversion with respect to the total mass of the polymer compound. The range is preferable, and the range of 5 to 30% is more preferable. When the structural unit containing a graft chain is included in this range, the dispersibility of a black pigment is high, and the developability at the time of forming a hardened film is favorable.

・疏水性結構單元 高分子化合物含有與含有接枝鏈之結構單元不同(亦即,並不相當於含有接枝鏈之結構單元)之疏水性結構單元為較佳。其中,本說明書中,疏水性結構單元是不具有酸基(例如,羧酸基、磺酸基、磷酸基、酚性羥基等)之結構單元。・ Hydrophobic structural unit It is preferable that the polymer compound contains a hydrophobic structural unit different from the structural unit containing the graft chain (that is, it does not correspond to the structural unit containing the graft chain). In this specification, the hydrophobic structural unit is a structural unit that does not have an acid group (for example, a carboxylic acid group, a sulfonic acid group, a phosphate group, a phenolic hydroxyl group, and the like).

疏水性結構單元是源自(對應)ClogP值為1.2以上的化合物(單體)之結構單元為較佳,是源自ClogP值為1.2~8的化合物之結構單元為更佳。藉此,能夠更可靠地顯現本發明的效果。The hydrophobic structural unit is preferably a structural unit derived from a compound (monomer) having a ClogP value of 1.2 or higher (corresponding), and more preferably a structural unit derived from a compound having a ClogP value of 1.2 to 8. Thereby, the effect of this invention can be shown more reliably.

ClogP值是藉由能夠從Daylight Chemical Information System, Inc,獲得之程序「CLOGP」計算出之值。該程序提供藉由Hansch, Leo的fragmentapproach(參閱下述文獻)計算出之「計算logP」的值。Fragmentapproach依據化合物的化學結構,將化學結構分割為部分結構(片段),合計分配於該片段之logP貢獻量,藉此推算化合物的logP值。其詳細內容記載於以下文獻中。本說明書中,ClogP值表示使用藉由程序CLOGP v4.82計算出之值。 A. J. Leo, Comprehensive Medicinal Chemistry, Vol.4, C. Hansch, P. G. Sammnens, J. B. Taylor and C. A. Ramsden, Eds., p.295, Pergamon Press, 1990 C. Hansch & A. J. Leo. SUbstituent Constants For Correlation Analysis in Chemistry and Biology. John Wiley & Sons. A.J. Leo. Calculating logPoct from structure. Chem. Rev., 93, 1281-1306, 1993.The ClogP value is a value calculated by a program "CLOGP" which can be obtained from Daylight Chemical Information System, Inc. This program provides the value of "calculated logP" calculated by the fragmentapproach (see below) of Hansch, Leo. Fragmentapproach divides the chemical structure into partial structures (fragments) based on the chemical structure of the compound, and totals the logP contribution amount allocated to the fragment to estimate the logP value of the compound. The details are described in the following documents. In this specification, ClogP value means the value calculated by the program CLOGP v4.82. AJ Leo, Comprehensive Medicinal Chemistry, Vol. 4, C. Hansch, PG Sammnens, JB Taylor and CA Ramsden, Eds., P.295, Pergamon Press, 1990 C. Hansch & AJ Leo. SUbstituent Constants For Correlation Analysis in Chemistry and Biology. John Wiley & Sons. AJ Leo. Calculating logPoct from structure. Chem. Rev., 93, 1281-1306, 1993.

logP表示分配係數P(Partition Coefficient)的常用對數,是以定量的數值表示某一有機化合物在油(通常為1-辛醇)與水的2相系的平衡中如何分配之物性值,由以下式表示。 logP=log(Coil/Cwater) 式中,Coil表示油相中的化合物的莫耳濃度,Cwater表示水相中的化合物的莫耳濃度。 若logP的值夾著0而正向(plus)增大,則表示油溶性增加,若絕對值負向(minus)增大,則表示水溶性增加,與有機化合物的水溶性有負相關,作為估計有機化合物的親疏水性之參數而廣泛利用。logP represents the common logarithm of the partition coefficient P (partition coefficient). It is a quantitative value that expresses how the physical properties of an organic compound are distributed in the two-phase equilibrium between oil (usually 1-octanol) and water. Expression. logP = log (Coil / Cwater) In the formula, Coil represents the Mohr concentration of the compound in the oil phase, and Cwater represents the Mohr concentration of the compound in the water phase. If the value of logP increases with a positive (plus) value between 0, it means that the oil solubility increases, and if the absolute value increases with minus (minus), it means an increase in water solubility, which has a negative correlation with the water solubility of organic compounds. Parameters for estimating the hydrophobicity of organic compounds are widely used.

高分子化合物作為疏水性結構單元,含有選自源自以下述式(i)~(iii)表示之單體的結構單元之1種以上的結構單元為較佳。The polymer compound preferably contains, as a hydrophobic structural unit, one or more structural units selected from structural units derived from monomers represented by the following formulae (i) to (iii).

【化學式24】 [Chemical Formula 24]

式(i)~(iii)中,R1 、R2 及R3 分別獨立地表示氫原子、鹵原子(例如,氟原子、氯原子、溴原子等)或碳數為1~6的烷基(例如,甲基、乙基、丙基等)。 R1 、R2 及R3 是氫原子或碳數為1~3的烷基為較佳,氫原子或甲基為更佳。R2 及R3 是氫原子為特佳。 X表示氧原子(-O-)或亞胺基(-NH-),氧原子為較佳。In the formulae (i) to (iii), R 1 , R 2 and R 3 each independently represent a hydrogen atom, a halogen atom (for example, a fluorine atom, a chlorine atom, a bromine atom, etc.) or an alkyl group having 1 to 6 carbon atoms. (For example, methyl, ethyl, propyl, etc.). R 1 , R 2 and R 3 are preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and more preferably a hydrogen atom or a methyl group. R 2 and R 3 are particularly preferably a hydrogen atom. X represents an oxygen atom (-O-) or an imine group (-NH-), and an oxygen atom is preferred.

L是單鍵或2價的連結基。作為2價的連結基,可舉出2價的脂肪族基(例如,伸烷基、取代伸烷基、伸烯基、取代伸烯基、伸炔基、取代伸炔基)、2價的芳香族基(例如,伸芳基、取代伸芳基)、2價的雜環基、氧原子(-O-)、硫原子(-S-)、亞胺基(-NH-)、取代亞胺基(-NR31 -,其中,R31 為脂肪族基、芳香族基或雜環基)、羰基(-CO-)及該些的組合等。L is a single bond or a divalent linking group. Examples of the divalent linking group include a divalent aliphatic group (for example, an alkylene group, a substituted alkylene group, an alkylene group, a substituted alkylene group, an alkylene group, a substituted alkylene group), a divalent Aromatic group (eg, arylene, substituted arylene), divalent heterocyclic group, oxygen atom (-O-), sulfur atom (-S-), imino group (-NH-), substituted An amine group (-NR 31- , wherein R 31 is an aliphatic group, an aromatic group or a heterocyclic group), a carbonyl group (-CO-), a combination thereof, and the like.

2價的脂肪族基可具有環狀結構或分支結構。脂肪族基的碳數為1~20為較佳,1~15為更佳,1~10為進一步較佳。脂肪族基可以是不飽和脂肪族基,亦可以是飽和脂肪族基,飽和脂肪族基為較佳。並且,脂肪族基可具有取代基。取代基的例子可舉出鹵原子、芳香族基及雜環基等。The divalent aliphatic group may have a cyclic structure or a branched structure. The number of carbon atoms of the aliphatic group is preferably 1 to 20, more preferably 1 to 15 and even more preferably 1 to 10. The aliphatic group may be an unsaturated aliphatic group or a saturated aliphatic group, and a saturated aliphatic group is preferred. The aliphatic group may have a substituent. Examples of the substituent include a halogen atom, an aromatic group, and a heterocyclic group.

2價的芳香族基的碳數為6~20為較佳,6~15為更佳,6~10為進一步較佳。芳香族基可具有取代基。取代基的例子可舉出鹵原子、脂肪族基、芳香族基及雜環基等。The carbon number of the divalent aromatic group is preferably 6 to 20, more preferably 6 to 15 and even more preferably 6 to 10. The aromatic group may have a substituent. Examples of the substituent include a halogen atom, an aliphatic group, an aromatic group, and a heterocyclic group.

2價的雜環基作為雜環含有5員環或6員環為較佳。雜環上可縮合有其他雜環、脂肪族環或芳香族環。雜環基可具有取代基。作為取代基的例子,可舉出鹵原子、羥基、氧代基(=O)、硫代基(=S)、亞胺基(=NH)、取代亞胺基(=N-R32 、其中,R32 為脂肪族基、芳香族基或雜環基)、脂肪族基、芳香族基或雜環基。The divalent heterocyclic group preferably contains a 5-membered ring or a 6-membered ring as a heterocyclic ring. The heterocyclic ring may be condensed with other heterocyclic rings, aliphatic rings or aromatic rings. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an oxo group (= O), a thio group (= S), an imino group (= NH), a substituted imino group (= NR 32 , and R 32 is an aliphatic group, an aromatic group or a heterocyclic group), an aliphatic group, an aromatic group or a heterocyclic group.

L是單鍵、伸烷基或含有氧伸烷基結構之2價的連結基為較佳。氧伸烷基結構是氧伸乙基結構或氧伸丙基結構為更佳。L可包含重複含有2個以上的氧伸烷基結構之聚氧伸烷基結構。作為聚氧伸烷基結構,聚氧伸乙基結構或聚氧伸丙基結構為較佳。聚氧伸乙基結構以-(OCH2 CH2 )n-表示,n為2以上的整數為較佳,2~10的整數為更佳。L is preferably a single bond, an alkylene group, or a divalent linking group containing an oxyalkylene structure. The oxyalkylene structure is more preferably an oxyethyl structure or an oxypropyl structure. L may contain a polyoxyalkylene structure which repeatedly contains two or more oxyalkylene structures. The polyoxyalkylene structure is preferably a polyoxyethylene structure or a polyoxypropylene structure. The polyoxyethylene structure is represented by-(OCH 2 CH 2 ) n-, where n is an integer of 2 or more is preferred, and an integer of 2 to 10 is more preferred.

Z可舉出脂肪族基(例如,烷基、取代烷基、不飽和烷基、取代不飽和烷基)、芳香族基(例如,芳基、取代芳基、伸芳基、取代伸芳基)、雜環基或該些的組合。該些基團中可包含氧原子(-O-)、硫原子(-S-)、亞胺基(-NH-)、取代亞胺基(-NR31 -,其中,R31 為脂肪族基、芳香族基或雜環基)、羰基(-CO-)。Examples of Z include an aliphatic group (for example, an alkyl group, a substituted alkyl group, an unsaturated alkyl group, a substituted unsaturated alkyl group), an aromatic group (for example, an aryl group, a substituted aryl group, an arylene group, and a substituted arylene group). ), Heterocyclyl, or a combination of these. These groups may include an oxygen atom (-O-), a sulfur atom (-S-), an imine group (-NH-), a substituted imine group (-NR 31- , where R 31 is an aliphatic group , Aromatic or heterocyclic), carbonyl (-CO-).

脂肪族基可具有環狀結構或分支結構。脂肪族基的碳數為1~20為較佳,1~15為更佳,1~10為進一步較佳。脂肪族基中還包含環集合烴基、交聯環式烴基,作為環集合烴基的例子,包含雙環己基、全氫萘基、聯苯基及4-環己基苯基等。作為交聯環式烴環,例如,可舉出蒎烷(pinane)、莰烷(bornane)、降蒎烷(norpinane)、降莰烷(norbornane)、雙環辛烷環(雙環[2.2.2]辛烷環及雙環[3.2.1]辛烷環等)等2環式烴環、高布雷烷(homobledane)、金剛烷、三環[5.2.1.02 6 ]癸烷及三環[4.3.1.12 5 ]十一烷環等3環式烴環、以及四環[4.4.0.12 5 .17 10 ]十二烷及全氫-1,4-亞甲基-5,8-亞甲基萘環等4環式烴環等。交聯環式烴環中還包含縮合環式烴環,例如,全氫萘(十氫萘)、全氫蒽、全氫菲、全氫苊、全氫茀、全氫茚及全氫葩環等縮合有複數個5~8員環烷烴環之縮合環。 與不飽和脂肪族基相比,脂肪族基是飽和脂肪族基為較佳。脂肪族基可具有取代基。取代基的例子可舉出鹵原子、芳香族基及雜環基。其中,脂肪族基作為取代基不具有酸基。The aliphatic group may have a cyclic structure or a branched structure. The number of carbon atoms of the aliphatic group is preferably 1 to 20, more preferably 1 to 15 and even more preferably 1 to 10. The aliphatic group also includes a ring group hydrocarbon group and a crosslinked cyclic hydrocarbon group. Examples of the ring group hydrocarbon group include dicyclohexyl, perhydronaphthyl, biphenyl, 4-cyclohexylphenyl, and the like. Examples of the crosslinked cyclic hydrocarbon ring include pinane, bornane, norpinane, norbornane, and bicyclic octane ring (bicyclic [2.2.2] Octane ring and bicyclic [3.2.1 octane ring, etc.) and other bicyclic hydrocarbon rings, homoblane (homobledane), adamantane, tricyclic [5.2.1.0 2 , 6 ] decane and tricyclic [4.3. cyclic hydrocarbon ring 3 1.1 2, 5] undecane ring, and tetracyclo [4.4.0.1 2, 5 .1 7, 10] dodecane and perhydro-1,4--5,8 -4-ring hydrocarbon rings such as a methylene naphthalene ring and the like. Crosslinked cyclic hydrocarbon rings also include condensed cyclic hydrocarbon rings, such as perhydronaphthalene (decahydronaphthalene), perhydroanthracene, perhydrophenanthrene, perhydrofluorene, perhydrofluorene, perhydroindene, and perhydrofluorene rings Isocondensation has multiple 5 to 8-membered cycloalkane rings. It is more preferable that the aliphatic group is a saturated aliphatic group than the unsaturated aliphatic group. The aliphatic group may have a substituent. Examples of the substituent include a halogen atom, an aromatic group, and a heterocyclic group. Among them, the aliphatic group does not have an acid group as a substituent.

芳香族基的碳數為6~20為較佳,6~15為更佳,6~10為進一步較佳。芳香族基可具有取代基。取代基的例子可舉出鹵原子、脂肪族基、芳香族基及雜環基。其中,芳香族基作為取代基不具有酸基。The number of carbon atoms of the aromatic group is preferably 6-20, more preferably 6-15, and still more preferably 6-10. The aromatic group may have a substituent. Examples of the substituent include a halogen atom, an aliphatic group, an aromatic group, and a heterocyclic group. However, the aromatic group does not have an acid group as a substituent.

雜環基作為雜環含有5員環或6員環為較佳。雜環上可縮合有其他雜環、脂肪族環或芳香族環。雜環基可具有取代基。作為取代基的例子,可舉出鹵原子、羥基、氧代基(=O)、硫代基(=S)、亞胺基(=NH)、取代亞胺基(=N-R32 ,其中,R32 為脂肪族基、芳香族基或雜環基)、脂肪族基、芳香族基及雜環基。其中,雜環基作為取代基不具有酸基。The heterocyclic group preferably contains a 5-membered ring or a 6-membered ring as a heterocyclic ring. The heterocyclic ring may be condensed with other heterocyclic rings, aliphatic rings or aromatic rings. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an oxo group (= O), a thio group (= S), an imino group (= NH), and a substituted imino group (= NR 32) . 32 is an aliphatic group, an aromatic group or a heterocyclic group), an aliphatic group, an aromatic group, and a heterocyclic group. However, the heterocyclic group does not have an acid group as a substituent.

式(iii)中,R4 、R5 及R6 分別獨立地表示氫原子、鹵原子(例如,氟原子、氯原子及溴原子等)、碳數為1~6的烷基(例如,甲基、乙基、丙基等)、Z或-L-Z。其中,L及Z的含義與上述中的L及Z相同。作為R4 、R5 及R6 ,氫原子或碳數為1~3的烷基為較佳,氫原子為更佳。In formula (iii), R 4 , R 5, and R 6 each independently represent a hydrogen atom, a halogen atom (for example, a fluorine atom, a chlorine atom, and a bromine atom), and an alkyl group having 1 to 6 carbon atoms (for example, Group, ethyl, propyl, etc.), Z or -LZ. Here, the meanings of L and Z are the same as those of L and Z described above. As R 4 , R 5 and R 6 , a hydrogen atom or an alkyl group having 1 to 3 carbon atoms is preferred, and a hydrogen atom is more preferred.

本發明中,作為以上述通式(i)表示之單體,R1 、R2 及R3 為氫原子或甲基、L為單鍵或伸烷基或者包含氧伸烷基結構之2價的連結基、X為氧原子或亞胺基、Z為脂肪族基、雜環基或芳香族基之化合物為較佳。 作為以式(ii)表示之單體,R1 為氫原子或甲基、L為伸烷基、Z為脂肪族基、雜環基或芳香族基之化合物為較佳。 作為以式(iii)表示之單體,R4 、R5 及R6 為氫原子或甲基、Z為脂肪族基、雜環基或芳香族基之化合物為較佳。In the present invention, as the monomer represented by the general formula (i), R 1 , R 2, and R 3 are a hydrogen atom or a methyl group, L is a single bond or an alkylene group, or a divalent structure containing an oxyalkylene group. Compounds in which X is an oxygen atom or an imine group, and Z is an aliphatic group, a heterocyclic group or an aromatic group are preferred. As the monomer represented by the formula (ii), a compound in which R 1 is a hydrogen atom or a methyl group, L is an alkylene group, and Z is an aliphatic group, a heterocyclic group, or an aromatic group is preferable. As the monomer represented by the formula (iii), a compound in which R 4 , R 5 and R 6 are a hydrogen atom or a methyl group, and Z is an aliphatic group, a heterocyclic group or an aromatic group is preferred.

作為以式(i)~(iii)表示之代表性化合物的例子,可舉出選自丙烯酸酯類、甲基丙烯酸酯類及苯乙烯類等之自由基聚合性化合物。 作為以式(i)~(iii)表示之代表性化合物的例子,能夠參閱日本特開2013-249417號公報的段落0089~0093中記載的化合物,該些內容編入本說明書中。Examples of the representative compounds represented by the formulae (i) to (iii) include radical polymerizable compounds selected from the group consisting of acrylates, methacrylates, and styrenes. As examples of the representative compounds represented by the formulae (i) to (iii), the compounds described in paragraphs 0089 to 0093 of Japanese Patent Application Laid-Open No. 2013-249417 can be referred to, and these contents are incorporated herein.

高分子化合物中,疏水性結構單元以質量換算,相對於高分子化合物的總質量,以10~90%的範圍包含為較佳,以20~80%的範圍包含為更佳。藉由含量在上述範圍內,可實現更加良好充分的圖案形成。In the polymer compound, the hydrophobic structural unit is preferably contained in a range of 10 to 90% with respect to the total mass of the polymer compound in terms of mass, and more preferably contained in a range of 20 to 80%. When the content is within the above range, more favorable and sufficient pattern formation can be achieved.

・可與黑色顔料等著色劑形成相互作用之官能基團 高分子化合物能夠導入可與黑色顏料等著色劑形成相互作用之官能基團。其中,高分子化合物還包含含有可與黑色顏料等著色劑形成相互作用之官能基團之結構單元為較佳。 作為可與該黑色顏料等著色劑形成相互作用之官能基團,例如,可舉出酸基、鹼性基、配位性基及具有反應性之官能基團等。 高分子化合物含有酸基、鹼性基、配位性基或具有反應性之官能基團時,分別含有包含酸基之結構單元、含有鹼性基之結構單元、含有配位性基之結構單元或含有反應性之結構單元為較佳。 尤其,高分子化合物進一步含有羧酸基等鹼可溶性基作為酸基,藉此能夠對高分子化合物賦予用於基於鹼顯影之圖案形成的顯影性。 亦即,藉由向高分子化合物導入鹼可溶性基,硬化性組成物中,作為有助於黑色顏料等著色劑的分散之分散劑的高分子化合物具有鹼可溶性。含有該種高分子化合物之硬化性組成物成為曝光部的遮光性優異者,且未曝光部的鹼顯影性得到提高。 藉由高分子化合物具有含有酸基之結構單元,高分子化合物變得易與溶劑整合且塗佈性亦提高之趨勢。 推測這是因為,含有酸基之結構單元中的酸基易與黑色顏料等著色劑相互作用,高分子化合物使黑色顏料等著色劑穩定地分散,並且使黑色顏料等著色劑分散之高分子化合物的黏度變低,高分子化合物本身亦容易穩定地分散。・ Functional groups that can interact with colorants such as black pigments Polymer compounds can introduce functional groups that can interact with colorants such as black pigments. Among them, the polymer compound preferably contains a structural unit containing a functional group capable of interacting with a colorant such as a black pigment. Examples of the functional group that can interact with a colorant such as the black pigment include an acid group, a basic group, a coordinating group, and a reactive functional group. When a polymer compound contains an acid group, a basic group, a coordinating group, or a reactive functional group, it contains a structural unit containing an acid group, a structural unit containing a basic group, and a structural unit containing a coordination group, respectively. Or a reactive structural unit is preferable. In particular, the polymer compound further contains an alkali-soluble group such as a carboxylic acid group as an acid group, whereby the polymer compound can be provided with developability for pattern formation by alkali development. That is, by introducing an alkali-soluble group into the polymer compound, the polymer compound serving as a dispersant that facilitates the dispersion of a colorant such as a black pigment in the curable composition has alkali-solubility. The curable composition containing such a polymer compound becomes an excellent light-shielding property of the exposed portion, and the alkali developability of the unexposed portion is improved. Since the polymer compound has a structural unit containing an acid group, the polymer compound tends to be easily integrated with a solvent, and the coatability is also improved. This is presumably because the acid group in the structural unit containing the acid group easily interacts with the coloring agent such as a black pigment, the polymer compound stably disperses the coloring agent such as the black pigment, and the polymer compound dispersing the coloring agent such as the black pigment. The viscosity becomes low, and the polymer compound itself is easily and stably dispersed.

含有作為酸基的鹼可溶性基之結構單元可以是與含有上述接枝鏈之結構單元相同的結構單元,亦可以是不同的結構單元,但是與上述疏水性結構單元不同的結構單元(亦即,並不相當於上述疏水性結構單元)。The structural unit containing an alkali-soluble group as an acid group may be the same structural unit as the structural unit containing the graft chain described above, or may be a different structural unit, but a structural unit different from the above-mentioned hydrophobic structural unit (that is, Does not correspond to the above-mentioned hydrophobic structural unit).

作為可與黑色顏料等著色劑形成相互作用之官能基團亦即酸基,例如有羧酸基、磺酸基、磷酸基或酚性羥基等,羧酸基、磺酸基及磷酸基中的至少一種為較佳,從針對黑色顏料等著色劑的吸附力良好且著色劑的分散性較高之角度考慮,羧酸基為更佳。 亦即,高分子化合物還具有含有羧酸基、磺酸基及磷酸基中的至少一種之結構單元為較佳。As the functional group that can interact with colorants such as black pigments, that is, acid groups, for example, there are carboxylic acid groups, sulfonic acid groups, phosphate groups, or phenolic hydroxyl groups. At least one of them is preferable, and from the viewpoints of good adsorption of a colorant such as a black pigment and high dispersibility of the colorant, a carboxylic acid group is more preferable. That is, the polymer compound preferably has a structural unit containing at least one of a carboxylic acid group, a sulfonic acid group, and a phosphoric acid group.

高分子化合物可具有1種或2種以上的含有酸基之結構單元。 高分子化合物可含有具有酸基之結構單元,亦可不含有,含有時,具有酸基之結構單元的含量以質量換算,相對於高分子化合物的總質量,5~80%為較佳,從抑制基於鹼顯影之圖像強度的損傷之觀點考慮,10~60%為更佳。The polymer compound may have one or two or more kinds of structural units containing an acid group. The polymer compound may or may not contain a structural unit having an acid group. When it is contained, the content of the structural unit having an acid group is expressed in terms of mass. It is preferably 5 to 80% relative to the total mass of the polymer compound. From the viewpoint of damage to the image strength of alkali development, 10 to 60% is more preferable.

作為可與黑色顏料等著色劑形成相互作用之官能基團亦即鹼性基,例如有一級胺基、二級胺基、三級胺基、含有N原子之雜環及醯胺基等,從針對黑色顏料等著色劑的吸附力良好且顏料的分散性較高之角度考慮,第3級胺基為較佳。高分子化合物能夠含有1種或2種以上的該些鹼性基。 高分子化合物可含有具有鹼性基之結構單元,亦可不含有,含有時,具有鹼性基之結構單元的含量以質量換算,相對於高分子化合物的總質量,0.01%以上且50%以下為較佳,從抑制阻礙顯影性之觀點考慮,0.01%以上且30%以下為更佳。As a functional group that can interact with a colorant such as a black pigment, that is, a basic group, there are, for example, a primary amine group, a secondary amine group, a tertiary amine group, a heterocyclic ring containing an N atom, and amidino group. A tertiary amine group is preferable from the viewpoints that a colorant such as a black pigment has good adsorption and a high dispersibility of the pigment. The polymer compound may contain one or more of these basic groups. The polymer compound may or may not contain a structural unit having a basic group. When contained, the content of the structural unit having a basic group is calculated in terms of mass, and is 0.01% or more and 50% or less with respect to the total mass of the polymer compound. Preferably, from the viewpoint of suppressing the development resistance, 0.01% or more and 30% or less are more preferable.

作為可與黑色顏料等著色劑形成相互作用之官能基團亦即配位性基及具有反應性之官能基團,例如可舉出乙醯基乙醯氧基、三烷氧基甲矽烷基、異氰酸酯基、酸酐及醯氯等。從針對黑色顏料等著色劑的吸附力良好且顏料的分散性較高之角度考慮,乙醯基乙醯氧基為較佳。高分子化合物可具有1種或2種以上的該些基。 高分子化合物可含有具有配位性基之結構單元或具有反應性之官能基團,亦可不含有,含有時,該些結構單元的含量以質量換算,相對於高分子化合物的總質量,10%以上且80%以下為較佳,從抑制阻礙顯影性之觀點考慮,20%以上且60%以下為更佳。Examples of the functional group that can interact with a colorant such as a black pigment, that is, a coordinating group and a reactive functional group include, for example, ethanoylacetoxy, trialkoxysilyl, Isocyanate groups, acid anhydrides, fluorenyl chloride, etc. From the standpoint of good adsorption of colorants such as black pigments and high dispersibility of pigments, ethanoylacetoxy is preferred. The polymer compound may have one or two or more of these groups. The polymer compound may contain a structural unit having a coordinating group or a reactive functional group, or may not contain it. When contained, the content of these structural units is calculated in terms of mass and is 10% relative to the total mass of the polymer compound. It is more preferable that it is more than 80%, and it is more preferable that it is 20% or more and 60% or less from the viewpoint of suppressing the obstructive development property.

高分子化合物除了接枝鏈以外還含有可與黑色顏料等著色劑形成相互作用之官能基團時,含有上述可與各種黑色顏料等著色劑形成相互作用之官能基團即可,並不特別限定該些官能基團如何被導入,高分子化合物含有選自源自以下述通式(iv)~(vi)表示之單體的結構單元之1種以上的結構單元為較佳。When the polymer compound contains a functional group capable of interacting with a colorant such as a black pigment in addition to the graft chain, the functional group capable of interacting with various colorants such as a black pigment may be included, which is not particularly limited. As for how these functional groups are introduced, the polymer compound preferably contains one or more structural units selected from structural units derived from monomers represented by the following general formulae (iv) to (vi).

【化學式25】 [Chemical Formula 25]

式(iv)~式(vi)中,R11 、R12 及R13 分別獨立地表示氫原子、鹵原子(例如,氟原子、氯原子、溴原子等)或碳數為1~6的烷基(例如,甲基、乙基、丙基等)。 式(iv)~式(vi)中,R11 、R12 及R13 分別獨立地為氫原子或碳數為1~3的烷基為較佳,分別獨立地為氫原子或甲基為最佳。通式(iv)中,R12 及R13 分別為氫原子為更佳。In the formulae (iv) to (vi), R 11 , R 12 and R 13 each independently represent a hydrogen atom, a halogen atom (for example, a fluorine atom, a chlorine atom, a bromine atom, etc.) or an alkane having 1 to 6 carbon atoms. (For example, methyl, ethyl, propyl, etc.). In the formulae (iv) to (vi), R 11 , R 12 and R 13 are each preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and each of them is independently a hydrogen atom or a methyl group. good. In the general formula (iv), R 12 and R 13 are each preferably a hydrogen atom.

式(iv)中的X1 表示氧原子(-O-)或亞胺基(-NH-),氧原子為較佳。 式(v)中的Y表示次甲基或氮原子。X 1 in formula (iv) represents an oxygen atom (-O-) or an imine group (-NH-), and an oxygen atom is preferred. Y in formula (v) represents a methine group or a nitrogen atom.

式(iv)~式(v)中的L1 表示單鍵或2價的連結基。作為2價的連結基的例子,可舉出2價的脂肪族基(例如,伸烷基、取代伸烷基、伸烯基、取代伸烯基、伸炔基及取代伸炔基)、2價的芳香族基(例如,伸芳基及取代伸芳基)、2價的雜環基、氧原子(-O-)、硫原子(-S-)、亞胺基(-NH-)、取代亞胺鍵(-NR31 ’-,其中,R31 ’為脂肪族基、芳香族基或雜環基)、羰基鍵(-CO-)及該些組合等。L 1 in formulas (iv) to (v) represents a single bond or a divalent linking group. Examples of the divalent linking group include a divalent aliphatic group (for example, an alkylene group, a substituted alkylene group, an alkylene group, a substituted alkylene group, an alkylene group, and a substituted alkylene group), 2 Valence aromatic group (for example, arylene group and substituted arylene group), divalent heterocyclic group, oxygen atom (-O-), sulfur atom (-S-), imino group (-NH-), Substituted imine bond (-NR 31 '-, wherein R 31 ' is an aliphatic group, an aromatic group or a heterocyclic group), a carbonyl bond (-CO-), and combinations thereof.

2價的脂肪族基可具有環狀結構或分支結構。脂肪族基的碳數為1~20為較佳,1~15為更佳,1~10為進一步較佳。與不飽和脂肪族基相比,脂肪族基為飽和脂肪族基為較佳。脂肪族基可具有取代基。作為取代基的例子,可舉出鹵原子、羥基、芳香族基及雜環基。The divalent aliphatic group may have a cyclic structure or a branched structure. The number of carbon atoms of the aliphatic group is preferably 1 to 20, more preferably 1 to 15 and even more preferably 1 to 10. It is preferable that the aliphatic group is a saturated aliphatic group compared with an unsaturated aliphatic group. The aliphatic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an aromatic group, and a heterocyclic group.

2價的芳香族基的碳數為6~20為較佳,6~15為更佳,6~10為進一步較佳。芳香族基可具有取代基。取代基的例子可舉出鹵原子、羥基、脂肪族基、芳香族基及雜環基。The carbon number of the divalent aromatic group is preferably 6 to 20, more preferably 6 to 15 and even more preferably 6 to 10. The aromatic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an aliphatic group, an aromatic group, and a heterocyclic group.

2價的雜環基作為雜環含有5員環或6員環為較佳。雜環中可縮合有其他雜環、脂肪族環或芳香族環中的1個以上。雜環基可具有取代基。作為取代基的例子,可舉出鹵原子、羥基、氧代基(=O)、硫代基(=S)、亞胺基(=NH)、取代亞胺基(=N-R32 ,其中,R32 為脂肪族基、芳香族基或雜環基)、脂肪族基、芳香族基及雜環基。The divalent heterocyclic group preferably contains a 5-membered ring or a 6-membered ring as a heterocyclic ring. In the heterocyclic ring, one or more of other heterocyclic rings, aliphatic rings, or aromatic rings may be condensed. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an oxo group (= O), a thio group (= S), an imino group (= NH), and a substituted imino group (= NR 32) . 32 is an aliphatic group, an aromatic group or a heterocyclic group), an aliphatic group, an aromatic group, and a heterocyclic group.

L1 是單鍵、伸烷基或含有氧伸烷基結構之2價的連結基為較佳。氧伸烷基結構是氧伸乙基結構或氧伸丙基結構為更佳。L1 可含有重複包含2個以上的氧伸烷基結構之聚氧伸烷基結構。作為聚氧伸烷基結構,聚氧伸乙基結構或聚氧伸丙基結構為較佳。聚氧伸乙基結構以-(OCH2 CH2n -表示,n為2以上的整數為較佳,2~10的整數為更佳。L 1 is preferably a single bond, an alkylene group, or a divalent linking group containing an oxyalkylene structure. The oxyalkylene structure is more preferably an oxyethyl structure or an oxypropyl structure. L 1 may contain a polyoxyalkylene structure containing two or more oxyalkylene structures repeatedly. The polyoxyalkylene structure is preferably a polyoxyethylene structure or a polyoxypropylene structure. The polyoxyethylene structure is represented by-(OCH 2 CH 2 ) n- , n is preferably an integer of 2 or more, and an integer of 2 to 10 is more preferred.

式(iv)~式(vi)中,Z1 表示接枝鏈以外可與黑色顏料等著色劑形成相互作用之官能基團,羧酸基及三級胺基為較佳,羧酸基為更佳。In the formulae (iv) to (vi), Z 1 represents a functional group capable of interacting with a coloring agent such as a black pigment other than the graft chain. A carboxylic acid group and a tertiary amine group are preferred, and a carboxylic acid group is more preferred. good.

式(vi)中,R14 、R15 及R16 分別獨立地表示氫原子、鹵原子(例如,氟原子、氯原子、溴原子等)、碳數為1~6的烷基(例如,甲基、乙基及丙基等)、-Z1 或L1 -Z1 。其中,L1 及Z1 的含義與上述中的L1 及Z1 相同,較佳例亦相同。作為R14 、R15 及R16 ,分別獨立地為氫原子、或碳數為1~3的烷基為較佳,氫原子為更佳。In the formula (vi), R 14 , R 15 and R 16 each independently represent a hydrogen atom, a halogen atom (for example, a fluorine atom, a chlorine atom, a bromine atom, etc.), and an alkyl group having 1 to 6 carbon atoms (for example, , ethyl and propyl, etc.), - Z 1 or L 1 -Z 1. Wherein, L 1 and Z 1 meaning the same as the above L 1 and Z 1, preferred embodiments are also the same. R 14 , R 15 and R 16 are each preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and more preferably a hydrogen atom.

作為以式(iv)表示之單體,R11 、R12 及R13 分別獨立地為氫原子或甲基、L1 為伸烷基或含有氧伸烷基結構之2價的連結基、X1 為氧原子或亞胺基、Z1 為羧酸基之化合物為較佳。 作為以式(v)表示之單體,R11 為氫原子或甲基、L1 為伸烷基、Z1 為羧酸基、Y為次甲基之化合物為較佳。 而且,作為以式(vi)表示之單體,R14 、R15 及R16 分別獨立地為氫原子或甲基、L1 為單鍵或伸烷基、Z1 為羧酸基之化合物為較佳。As a monomer represented by formula (iv), R 11 , R 12 and R 13 are each independently a hydrogen atom or a methyl group, L 1 is an alkylene group or a divalent linking group containing an oxyalkylene structure, and X A compound in which 1 is an oxygen atom or an imine group, and Z 1 is a carboxylic acid group is preferred. As the monomer represented by the formula (v), a compound in which R 11 is a hydrogen atom or a methyl group, L 1 is an alkylene group, Z 1 is a carboxylic acid group, and Y is a methine group is preferable. Further, as the monomer represented by the formula (vi), compounds in which R 14 , R 15 and R 16 are each independently a hydrogen atom or a methyl group, L 1 is a single bond or an alkylene group, and Z 1 is a carboxylic acid group are Better.

以下,示出以式(iv)~式(vi)表示之單體(化合物)的代表例。 作為單體的例子,可舉出甲基丙烯酸、巴豆酸、異巴豆酸、分子內含有加成聚合性雙鍵及羥基之化合物(例如,甲基丙烯酸2-羥乙酯)與琥珀酸酐的反應物、分子內含有加成聚合性雙鍵及羥基之化合物與鄰苯二甲酸酐的反應物、分子內含有加成聚合性雙鍵及羥基之化合物與四羥基鄰苯二甲酸酐的反應物、分子內含有加成聚合性雙鍵及羥基之化合物與偏苯三酸酐的反應物、分子內含有加成聚合性雙鍵及羥基之化合物與均苯四甲酸酐的反應物、丙烯酸、丙烯酸二聚物、丙烯酸低聚物、馬來酸、伊康酸、反丁烯二酸、4-乙烯基安息香酸、乙烯基苯酚及4-羥基苯甲基丙烯醯胺等。Representative examples of the monomer (compound) represented by the formulae (iv) to (vi) are shown below. Examples of the monomer include a reaction of methacrylic acid, crotonic acid, isocrotonic acid, a compound containing an addition polymerizable double bond and a hydroxyl group in the molecule (for example, 2-hydroxyethyl methacrylate) and succinic anhydride. Reactants of compounds containing addition polymerizable double bonds and hydroxyl groups in the molecule and phthalic anhydride, reactants of compounds containing addition polymerizable double bonds and hydroxyl groups in the molecule and tetrahydroxyphthalic anhydride, Reactant of compound containing addition polymerizable double bond and hydroxyl group in molecule and trimellitic anhydride, Reactant of compound containing addition polymerizable double bond and hydroxyl group in molecule and pyromellitic anhydride, acrylic acid, acrylic acid dimer, acrylic acid Oligomers, maleic acid, itaconic acid, fumaric acid, 4-vinyl benzoic acid, vinylphenol, and 4-hydroxybenzyl acrylamide.

從與黑色顏料等著色劑的相互作用、分散穩定性及向顯影液的浸透性的觀點考慮,含有可與黑色顏料等著色劑形成相互作用之官能基團之結構單元的含量相對於高分子化合物的總質量,0.05質量%~90質量%為較佳,1.0質量%~80質量%為更佳,10質量%~70質量%為進一步較佳。From the viewpoints of interaction with a coloring agent such as a black pigment, dispersion stability, and permeability to a developing solution, the content of the structural unit containing a functional group that can interact with the coloring agent such as a black pigment is higher than that of the polymer compound Of the total mass, 0.05% to 90% by mass is more preferred, 1.0% to 80% by mass is more preferred, and 10% to 70% by mass is even more preferred.

・其他結構單元 而且,為了提高圖像強度等各種性能,高分子化合物可在無損本發明的效果之前提下,進一步含有與含有接枝鏈之結構單元、疏水性結構單元及含有可與黑色顏料等著色劑形成相互作用之官能基團之結構單元不同之、具有各種功能之其他結構單元(例如,具有與用於分散物之分散介質含有親和性之官能基團等之結構單元)。 作為該種其他結構單元,例如可舉出源自選自丙烯腈類及甲基丙烯腈類等之自由基聚合性化合物的結構單元。 高分子化合物能夠使用1種或者2種以上的該些其他結構單元,其含量以質量換算,相對於高分子化合物的總質量,0%以上且80%以下為較佳,10%以上且60%以下為更佳。含量在上述範圍內可維持充分的圖案形成性。・ Other structural units In addition, in order to improve various properties such as image strength, polymer compounds can be added before the effects of the present invention are impaired, and further contain structural units containing graft chains, hydrophobic structural units, and containing black pigments. The structural units such that the functional groups that the colorant forms interact with are different from other structural units having various functions (for example, structural units having functional groups that have an affinity with the dispersion medium used for the dispersion, etc.). Examples of such other structural units include structural units derived from a radical polymerizable compound selected from acrylonitrile and methacrylonitrile. The polymer compound can use one or two or more of these other structural units, and its content is expressed in terms of mass, and relative to the total mass of the polymer compound, 0% to 80% is preferred, and 10% to 60% is preferred. The following is better. When the content is within the above range, sufficient pattern-formability can be maintained.

・高分子化合物的物性 高分子化合物的酸值為0mgKOH/g以上且250mgKOH/g以下的範圍為較佳,10mgKOH/g以上且200mgKOH/g以下的範圍為更佳,20mgKOH/g以上且120mgKOH/g以下的範圍進一步較佳。 若高分子化合物的酸值為160mgKOH/g以下,則更有效地抑制形成硬化膜時的顯影中的圖案剝離。若高分子化合物的酸值為10mgKOH/g以上,則鹼顯影性更加良好。並且,若高分子化合物的酸值為20mgKOH/g以上,則能夠更加抑制黑色顏料等著色劑的沉降,能夠使粗大粒子數更少,能夠更加提高硬化性組成物的經時穩定性。・ Physical properties of the polymer compound The acid value of the polymer compound is preferably in a range of 0 mgKOH / g to 250 mgKOH / g, more preferably in a range of 10 mgKOH / g to 200 mgKOH / g, and in a range of 20 mgKOH / g to 120 mgKOH / The range below g is more preferable. When the acid value of the polymer compound is 160 mgKOH / g or less, the pattern peeling during development when forming a cured film is more effectively suppressed. When the acid value of the polymer compound is 10 mgKOH / g or more, alkali developability is further improved. In addition, if the acid value of the polymer compound is 20 mgKOH / g or more, it is possible to further suppress sedimentation of a colorant such as a black pigment, reduce the number of coarse particles, and further improve the stability of the curable composition over time.

高分子化合物的酸值例如能夠由高分子化合物中的酸基的平均含量計算。並且,能夠藉由改變含有高分子化合物的構成成份亦即酸基之結構單元的含量來獲得具有所希望的酸值之樹脂。The acid value of the polymer compound can be calculated, for example, from the average content of acid groups in the polymer compound. In addition, a resin having a desired acid value can be obtained by changing the content of a structural unit that is a component containing a polymer compound, that is, an acid group.

形成遮光膜時,從顯影時的圖案剝離的抑制和顯影性的觀點考慮,本發明中的高分子化合物的重量平均分子量作為藉由GPC (Gel Permeation Chromatography:凝膠滲透層析法)法之聚苯乙烯換算值,4,000以上且300,000以下為較佳,5,000以上且200,000以下為更佳,6,000以上且100,000以下進一步較佳,10,000以上且50,000以下為特佳。 GPC法基於如下方法,亦即,利用HLC-8020GPC(TOSOH CORPORATION.製造),作為管柱使用TSKgel SuperHZM-H、TSKgel SuperHZ4000、TSKgel SuperHZ2000(TOSOH CORPORATION製造、4.6mmID×15cm),作為洗提液使用THF(四氫呋喃)。When the light-shielding film is formed, the weight average molecular weight of the polymer compound in the present invention is aggregated by a GPC (Gel Permeation Chromatography) method from the viewpoints of suppression of pattern peeling at the time of development and developability. The styrene conversion value is preferably from 4,000 to 300,000, more preferably from 5,000 to 200,000, more preferably from 6,000 to 100,000, and even more preferably from 10,000 to 50,000. The GPC method is based on a method using HLC-8020GPC (manufactured by TOSOH CORPORATION.) As a column using TSKgel SuperHZM-H, TSKgel SuperHZ4000, TSKgel SuperHZ2000 (manufactured by TOSOH CORPORATION, 4.6mmID × 15cm), and using it THF (tetrahydrofuran).

高分子化合物能夠依公知的方法合成,作為合成高分子化合物時使用之溶劑,例如可舉出二氯乙烷、環己酮、甲乙酮、丙酮、甲醇、乙醇、丙醇、丁醇、乙二醇單甲醚、乙二醇單乙醚、2-甲氧基乙基乙酸酯、1-甲氧基-2-丙醇、1-甲氧基-2-乙酸丙酯、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、二甲基亞碸、甲苯、乙酸乙酯、乳酸甲酯及乳酸乙酯等。該些溶劑可單獨使用亦可混合2種以上來使用。The polymer compound can be synthesized by a known method. Examples of the solvent used in the synthesis of the polymer compound include dichloroethane, cyclohexanone, methyl ethyl ketone, acetone, methanol, ethanol, propanol, butanol, and ethylene glycol. Monomethyl ether, ethylene glycol monoethyl ether, 2-methoxyethyl acetate, 1-methoxy-2-propanol, 1-methoxy-2-propyl acetate, N, N-dimethyl Methylformamide, N, N-dimethylacetamide, dimethylmethylene, toluene, ethyl acetate, methyl lactate and ethyl lactate. These solvents may be used alone or in combination of two or more.

作為高分子化合物的具體例,可舉出Kusumoto Chemicals, Ltd. 製造「DA-7301」、BYK Chemie公司製造「Disperbyk-101(聚醯胺胺磷酸鹽)、107(羧酸酯)、110(含有酸基之共聚物)、111(磷酸系分散劑)、130(聚醯胺)、161、162、163、164、165、166、170、190(高分子共聚物)」、「BYK-P104、P105(高分子量不飽和聚羧酸)」、EFKA公司製造「EFKA4047、4050~4010~4165(聚胺基甲酸酯系)、EFKA4330~4340(嵌段共聚物)、4400~4402(改質聚丙烯酸酯)、5010(聚酯醯胺)、5765(高分子量聚羧酸鹽)、6220(脂肪酸聚酯)、6745(酞菁衍生物)、6750(偶氮顏料衍生物)」、Ajinomoto Fine-Techno Co.,Inc.製造「AJISPER PB821、PB822、PB880、PB881」、Kyoeisha Chemical Co., Ltd.製造「Flowlen TG-710(胺基甲酸酯低聚物)」、「polyflow No.50E、No.300(丙烯酸系共聚物)」、Kusumoto Chemicals, Ltd.製造「disparon KS-860、873SN、874、#2150(脂肪族多價羧酸)、#7004(聚醚酯)、DA-703-50、DA-705、DA-725」、Kao Corporation 製造「DEMOL RN、N(萘磺酸福馬林縮聚物)、MS、C、SN-B(芳香族磺酸福馬林縮聚物)」、「HOMOGENOL L-18(高分子聚羧酸)」、「EMULGEN920、930、935、985(聚氧乙烯壬基苯基醚)」、「ACETAMIN86(硬脂胺乙酸鹽)」、Lubrizol Japan Limited 製造「Solsperse 5000(酞菁衍生物)、22000(偶氮顏料衍生物)、13240(聚酯胺)、3000、12000、17000、20000、27000(在末端部具有功能部之高分子)、24000、28000、32000、38500(接枝型共聚物)」、Nikko Chemicals Co., Ltd.製造「NIKKOL T106(聚氧乙烯脫水山梨糖醇單油酸酯)、MYS-IEX(聚氧乙烯硬脂酸酯)」、Kawaken Fine Chemicals Co., Ltd.製造「HINOACT T-8000E」等、Shin-Etsu Chemical Co., Ltd.製造「有機矽氧烷聚合物KP341」、Yusho Co.,Ltd.製造「W001:陽離子系界面活性劑」、聚氧乙烯月桂醚、聚氧乙烯硬脂基醚、聚氧乙烯油基醚、聚氧乙烯辛基苯基醚、聚氧乙烯壬基苯基醚、聚乙二醇月桂酸酯、聚乙二醇二硬脂酸酯、脫水山梨糖醇脂肪酸酯等非離子系界面活性劑、「W004、W005、W017」等陰離子系界面活性劑、Morishita Sangyo Co., Ltd.製造「EFKA-46、EFKA-47、EFKA-47EA、EFKA聚合物100、EFKA聚合物400、EFKA聚合物401、EFKA聚合物450」、SAN NOPCO LIMITED製造「Disperse Aid 6、Disperse Aid 8、Disperse Aid 15、Disperse Aid 9100」等高分子分散劑、ADEKA CORPORATION製造「ADEKA Pluronic L31、F38、L42、L44、L61、L64、F68、L72、P95、F77、P84、F87、P94、L101、P103、F108、L121、P-123」、及Sanyo Chemical Industries, Ltd.製造「Ionet(商品名) S-20」等。並且,還能夠使用Acrylic base FFS-6752、Acrylic base FFS-187、Akurikyua-RD-F8及Cyclomer P。 作為兩性樹脂的市售品,例如,可舉出BYK Chemie GmbH製造的DISPERBYK-130、DISPERBYK-140、DISPERBYK-142、DISPERBYK-145、DISPERBYK-180、DISPERBYK-187、DISPERBYK-191、DISPERBYK-2001、DISPERBYK-2010、DISPERBYK-2012、DISPERBYK-2025、BYK-9076、Ajinomoto Fine-Techno Co.,Inc.製造的AJISPER PB821、AJISPER PB822及AJISPER PB881等。 該些高分子化合物可單獨使用1種,亦可同時使用2種以上。Specific examples of the polymer compound include "DA-7301" manufactured by Kusumoto Chemicals, Ltd., and "Disperbyk-101 (polyamidamine phosphate)", 107 (carboxylic acid ester), and 110 (contained by BYK Chemie). Acid-based copolymers), 111 (phosphoric acid-based dispersant), 130 (polyamidamine), 161, 162, 163, 164, 165, 166, 170, 190 (polymer copolymers), "BYK-P104, P105 (high molecular weight unsaturated polycarboxylic acid) "," EFKA4047, 4050-4010 to 4165 (polyurethane type), EFKA4330 to 4340 (block copolymer), 4400 to 4402 (modified polymer) manufactured by EFKA Corporation Acrylate), 5010 (polyesteramide), 5765 (high molecular weight polycarboxylate), 6220 (fatty acid polyester), 6745 (phthalocyanine derivative), 6750 (azo pigment derivative) ", Ajinomoto Fine- "AJISPER PB821, PB822, PB880, PB881" manufactured by Techno Co., Inc., "Flowlen TG-710 (urethane oligomer)" manufactured by Kyoeisha Chemical Co., Ltd., "polyflow No. 50E, No. .300 (acrylic copolymer) "," disparon KS-860, 87 "manufactured by Kusumoto Chemicals, Ltd. 3SN, 874, # 2150 (aliphatic polycarboxylic acid), # 7004 (polyetherester), DA-703-50, DA-705, DA-725 "," DEMOL RN, N (naphthalenesulfonic acid) manufactured by Kao Corporation Formalin polycondensate), MS, C, SN-B (formalin polycondensate of aromatic sulfonic acid) "," HOMOGENOL L-18 (polymeric polycarboxylic acid) "," EMULGEN920, 930, 935, 985 (polyoxygen Ethylene Nonyl Phenyl Ether) "," ACETAMIN86 (Stearamine Acetate) "," Solsperse 5000 (phthalocyanine derivative), 22000 (azo pigment derivative), 13240 (polyesteramine) manufactured by Lubrizol Japan Limited, 3000, 12000, 17000, 20000, 27000 (polymers with functional parts at the ends), 24000, 28000, 32000, 38500 (graft copolymers) "," NIKKOL T106 (Polymer) manufactured by Nikko Chemicals Co., Ltd. Oxyethylene sorbitan monooleate), MYS-IEX (polyoxyethylene stearate) "," HINOACT T-8000E "manufactured by Kawaken Fine Chemicals Co., Ltd., etc., Shin-Etsu Chemical Co. ,, Ltd. manufactures "organosiloxane polymer KP341" and Yusho Co., Ltd. manufactures "W001: cationic surfactant" , Polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol laurate, polyethylene Non-ionic surfactants such as glycol distearate and sorbitan fatty acid esters, anionic surfactants such as "W004, W005, W017", "EFKA-46, manufactured by Morishita Sangyo Co., Ltd. EFKA-47, EFKA-47EA, EFKA polymer 100, EFKA polymer 400, EFKA polymer 401, EFKA polymer 450 ", manufactured by SAN NOPCO LIMITED" Disperse Aid 6, Disperse Aid 8, Disperse Aid 15, Disperse Aid 9100 " Polymer dispersants such as ADEKA Pluronic L31, F38, L42, L44, L61, L64, F68, L72, P95, F77, P84, F87, P94, L101, P103, F108, L121, P-123 manufactured by ADEKA CORPORATION , And "Ionet (trade name) S-20" manufactured by Sanyo Chemical Industries, Ltd. and the like. In addition, Acrylic base FFS-6752, Acrylic base FFS-187, Akurikuya-RD-F8, and Cyclomer P can also be used. Examples of commercially available amphoteric resins include DISPERBYK-130, DISPERBYK-140, DISPERBYK-142, DISPERBYK-145, DISPERBYK-180, DISPERBYK-187, DISPERBYK-191, DISPERBYK-2001, manufactured by BYK Chemie GmbH, and the like. DISPERBYK-2010, DISPERBYK-2012, DISPERBYK-2025, BYK-9076, AJISPER PB821, AJISPER PB822, and AJISPER PB881 manufactured by Ajinomoto Fine-Techno Co., Inc. and the like. These polymer compounds may be used individually by 1 type, and may use 2 or more types together.

作為高分子化合物的具體例,能夠參閱日本特開2013-249417號公報的段落0127~0129中記載的高分子化合物,該些內容編入本說明書中。As specific examples of the polymer compound, reference may be made to the polymer compound described in paragraphs 0127 to 0129 of Japanese Patent Application Laid-Open No. 2013-249417, which are incorporated herein.

作為分散劑,除了上述的高分子化合物以外,還能夠使用日本特開2010-106268號公報的段落0037~0115(對應之US2011/0124824的段落0075~0133一欄)的接枝共聚物,該些內容可援用並編入本說明書中。 上述以外,還能夠使用日本特開2011-153283號公報的段落0028~0084(對應之US2011/0279759的段落0075~0133一欄)的包含含有酸性基經由連結基鍵結而成之側鏈結構之構成成份之高分子化合物,該些內容可援用並編入本說明書中。As the dispersant, in addition to the above-mentioned polymer compounds, graft copolymers of paragraphs 0037 to 0115 of Japanese Patent Application Laid-Open No. 2010-106268 (corresponding to the columns of paragraphs 0075 to 0133 of US2011 / 0124824) can be used. The contents can be referred to and incorporated into this manual. In addition to the above, paragraphs 0028 to 0084 of Japanese Patent Application Laid-Open No. 2011-153283 (corresponding to the columns of paragraphs 0075 to 0133 of US2011 / 0279759) containing side chain structures containing acidic groups bonded through a linking group can also be used. The polymer compounds constituting the constituents can be referred to and incorporated in this specification.

<黏結樹脂> 硬化性組成物含有黏結樹脂為較佳。 黏結樹脂的含量相對於硬化性組成物的總固體成分,0.1質量%以上為較佳,0.3質量%以上為更佳,0.9質量%以上為進一步較佳,1.9質量%以上為特佳,30質量%以下為較佳,25質量%以下為更佳,18質量%以下為進一步較佳,10質量%以下為特佳。 若黏結樹脂的含量為1.9質量%以上且10質量%以下,則使硬化性組成物硬化來獲得之硬化膜的圖案形狀更優異。 黏結樹脂可單獨使用1種,亦可同時使用2種以上。同時使用2種以上的黏結樹脂時,其合計量在上述範圍內為較佳。<Adhesive resin> It is preferable that the curable composition contains an adhesive resin. The content of the binding resin is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, more preferably 0.9% by mass or more, particularly preferably 1.9% by mass or more, and 30% by mass of the total solid content of the curable composition. % Or less is preferred, 25% by mass or less is more preferred, 18% by mass or less is further preferred, and 10% by mass or less is particularly preferred. When the content of the binder resin is 1.9% by mass or more and 10% by mass or less, the pattern shape of the cured film obtained by curing the curable composition is more excellent. The adhesive resin can be used singly or in combination of two or more kinds. When two or more types of adhesive resins are used at the same time, the total amount is preferably within the above range.

作為黏結樹脂,使用線狀有機聚合物為較佳。作為該種線狀有機聚合物,能夠任意地使用公知者。為了實現水顯影或弱鹼性水顯影,選擇對水或弱鹼性水為可溶性或膨潤性之線狀有機聚合物為更佳。其中,作為黏結樹脂,鹼可溶性樹脂(含有促進鹼可溶性之基團之樹脂)為特佳。 作為黏結樹脂,能夠從線狀有機聚合物且分子(較佳地為以(甲基)丙烯酸系共聚物或苯乙烯系共聚物為主鏈之分子)中含有至少1個促進鹼可溶性之基團之鹼可溶性樹脂中適當選擇。從耐熱性的觀點考慮,聚羥基苯乙烯系樹脂、聚矽氧烷系樹脂、(甲基)丙烯酸樹脂、(甲基)丙烯醯胺系樹脂、(甲基)丙烯酸/(甲基)丙烯醯胺共聚物樹脂、環氧系樹脂及聚醯亞胺系樹脂為較佳,從顯影性控制的觀點考慮,(甲基)丙烯酸樹脂、(甲基)丙烯醯胺系樹脂、(甲基)丙烯酸/(甲基)丙烯醯胺共聚物樹脂及聚醯亞胺系樹脂為更佳。 作為促進鹼可溶性之基團(以下,還稱作酸基),例如,可舉出羧基、磷酸基、磺酸基及酚性羥基等。其中,可溶於有機溶劑且能夠藉由弱鹼性水溶液顯影者為較佳,作為更佳者,可舉出含有源自(甲基)丙烯酸的結構單元之鹼可溶性樹脂。該些酸基可以是僅為1種,亦可以是2種以上。As the binder resin, a linear organic polymer is preferably used. As such a linear organic polymer, a known one can be arbitrarily used. In order to achieve water development or weak alkaline water development, it is more preferable to select a linear organic polymer that is soluble or swellable to water or weak alkaline water. Among them, alkali-soluble resins (resins containing groups that promote alkali-solubility) are particularly preferred as the binding resin. As the binding resin, at least one group that promotes alkali solubility can be obtained from a linear organic polymer and a molecule (preferably, a molecule having a (meth) acrylic copolymer or a styrene copolymer as a main chain). The alkali-soluble resin is appropriately selected. From the viewpoint of heat resistance, polyhydroxystyrene resin, polysiloxane resin, (meth) acrylic resin, (meth) acrylamide resin, (meth) acrylic acid / (meth) acrylic resin Amine copolymer resins, epoxy resins, and polyimide resins are preferred. From the viewpoint of development control, (meth) acrylic resin, (meth) acrylamide resin, and (meth) acrylic acid / (Meth) acrylamide copolymer resin and polyimide resin are more preferable. Examples of the group that promotes alkali solubility (hereinafter also referred to as an acid group) include a carboxyl group, a phosphate group, a sulfonic acid group, and a phenolic hydroxyl group. Among them, those which are soluble in an organic solvent and can be developed with a weakly alkaline aqueous solution are preferred, and more preferred are alkali-soluble resins containing a structural unit derived from (meth) acrylic acid. These acid groups may be only one kind, or two or more kinds.

作為黏結樹脂,例如可舉出在側鏈含有羧酸基之自由基聚合物。作為在側鏈含有羧酸基之自由基聚合物,例如,可舉出日本特開昭59-44615號、日本特公昭54-34327號、日本特公昭58-12577號、日本特公昭54-25957號、日本特開昭54-92723號、日本特開昭59-53836號及日本特開昭59-71048號中記載者。作為在側鏈含有羧酸基之自由基聚合物,可舉出對含有羧酸基之單體單獨或使其共聚之樹脂、含有酸酐之單體單獨或使其共聚來獲得之酸酐單元進行水解、半酯化或半醯胺化之樹脂及藉由不飽和單羧酸及酸酐對環氧樹脂進行改性之環氧丙烯酸酯等。 作為含有羧酸基之單體,可舉出丙烯酸、甲基丙烯酸、衣康酸、巴豆酸、馬來酸、富馬酸及4-羧基苯乙烯等。亦可舉出在側鏈含有羧酸基之酸性纖維素衍生物為例。 作為含有酸酐之單體,可舉出馬來酸酐等。此外,對含有羥基之聚合物加成環狀酸酐者等較有用。 並且,含有酸基之縮醛改性聚乙烯醇類黏結樹脂記載於歐洲專利第993966號、歐洲專利第1204000號及日本特開2001-318463號等各公報中。含有酸基之縮醛改性聚乙烯醇類黏結樹脂的膜強度及顯影性的平衡優異,為較佳。 而且,作為水溶性線狀有機聚合物,聚乙烯吡咯烷酮或聚環氧乙烷等較有用。並且,為了提高硬化皮膜的強度,醇溶性尼龍及2,2-雙-(4-羥苯基)-丙烷與環氧氯丙烷的反應物亦即聚醚等亦有用。 國際公開第2008/123097號中記載之聚醯亞胺樹脂亦有用。Examples of the binder resin include a radical polymer containing a carboxylic acid group in a side chain. Examples of the radical polymer containing a carboxylic acid group in a side chain include Japanese Patent Laid-Open No. 59-44615, Japanese Patent No. 54-34327, Japanese Patent No. 58-12577, and Japanese Patent No. 54-25957 No., Japanese Patent Application Laid-Open No. 54-92723, Japanese Patent Application Laid-Open No. 59-53836, and Japanese Patent Application Laid-Open No. 59-71048. Examples of the radical polymer containing a carboxylic acid group in a side chain include hydrolysis of an acid anhydride unit obtained by separately or copolymerizing a monomer containing a carboxylic acid group and an monomer containing an acid anhydride. , Semi-esterified or semi-aminated resins and epoxy acrylates modified by unsaturated monocarboxylic acids and anhydrides. Examples of the carboxylic acid group-containing monomer include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, and 4-carboxystyrene. The acidic cellulose derivative which contains a carboxylic acid group in a side chain can also be mentioned as an example. Examples of the acid anhydride-containing monomer include maleic anhydride. It is also useful to add a cyclic acid anhydride to a polymer containing a hydroxyl group. In addition, acetal-modified polyvinyl alcohol-based adhesive resins containing acid groups are described in various publications such as European Patent No. 993966, European Patent No. 1204000, and Japanese Patent Laid-Open No. 2001-318463. The acetal-modified polyvinyl alcohol-based adhesive resin containing an acid group is preferable because it has excellent balance of film strength and developability. Moreover, as a water-soluble linear organic polymer, polyvinylpyrrolidone, polyethylene oxide, etc. are useful. In addition, in order to increase the strength of the cured film, alcohol-soluble nylon and polyether, which is a reaction product of 2,2-bis- (4-hydroxyphenyl) -propane and epichlorohydrin, are also useful. Polyimide resins described in International Publication No. 2008/123097 are also useful.

該些中,〔苄基(甲基)丙烯酸酯/(甲基)丙烯酸/依據需要之其他加成聚合性乙烯單體〕共聚物及〔(甲基)丙烯酸烯丙酯/(甲基)丙烯酸/依據需要之其他加成聚合性乙烯單體〕共聚物的膜強度、靈敏度及顯影性的平衡優異,為較佳。 作為市售品,例如,可舉出Acrylic base FF-187、FF-426(FUJIKURA KASEI CO.,LTD.製造)、Akurikyua-RD-F8(NIPPON SHOKUBAI CO., LTD.)及DAICEL-ALLNEX LTD.製造Cyclomer P(ACA)230AA等。Among these, [benzyl (meth) acrylate / (meth) acrylic acid / other addition polymerizable ethylene monomers as necessary] copolymers and [allyl (meth) acrylate / (meth) acrylic acid] / Other addition polymerizable ethylene monomers according to need] The copolymer has excellent film strength, sensitivity, and developability, and it is preferable. Examples of commercially available products include Acrylic base FF-187, FF-426 (manufactured by FUJIKURA KASEI CO., LTD.), Akurikuya-RD-F8 (NIPPON SHOKUBAI CO., LTD.), And DAICEL-ALLNEX LTD. Manufacture of Cyclomer P (ACA) 230AA, etc.

黏結樹脂的製造中,例如,能夠適用基於公知的自由基聚合法之方法。本領域技術人員能夠輕鬆設定藉由自由基聚合法製造黏結樹脂時的溫度、壓力、自由基起始劑的種類及其量以及溶劑的種類等聚合條件。In the production of the binder resin, for example, a method based on a known radical polymerization method can be applied. Those skilled in the art can easily set polymerization conditions such as temperature, pressure, the type and amount of radical initiator, and the type of solvent when the adhesive resin is produced by the radical polymerization method.

作為黏結樹脂,使用包含含有接枝鏈之結構單元及含有酸基(鹼可溶性基)之結構單元之聚合物亦較佳。 含有接枝鏈之結構單元的定義與上述之分散劑所含有之含有接枝鏈之結構單元相同,並且較佳範圍亦相同。 作為酸基,例如,可舉出羧酸基、磺酸基、磷酸基或酚性羥基等,羧酸基、磺酸基及磷酸基中的至少一種為較佳,羧酸基為更佳。As the binder resin, it is also preferable to use a polymer containing a structural unit containing a graft chain and a structural unit containing an acid group (alkali-soluble group). The definition of the structural unit containing the graft chain is the same as the structural unit containing the graft chain contained in the dispersant described above, and the preferred range is also the same. Examples of the acid group include a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a phenolic hydroxyl group. At least one of the carboxylic acid group, the sulfonic acid group, and the phosphoric acid group is preferable, and the carboxylic acid group is more preferable.

(含有酸基之結構單元) 作為含有酸基之結構單元,含有選自源自以下述式(vii)~式(ix)表示之單體的結構單元之1種以上的結構單元為較佳。(Constitution unit containing an acid group) As the constitutional unit containing an acid group, it is preferable to contain one or more kinds of constitutional units selected from constitutional units derived from monomers represented by the following formulae (vii) to (ix).

【化學式26】 [Chemical Formula 26]

式(vii)~式(ix)中,R21 、R22 、及R23 分別獨立地表示氫原子、鹵原子(例如,氟原子、氯原子、溴原子等)、或碳數為1~6的烷基(例如,甲基、乙基、丙基等)。 式(vii)~式(ix)中,R21 、R22 及R23 分別獨立地為氫原子或碳數為1~3的烷基為較佳,分別獨立地為氫原子或甲基為更佳。式(vii)中,R21 及R23 分別為氫原子為特佳。In formulas (vii) to (ix), R 21 , R 22 , and R 23 each independently represent a hydrogen atom, a halogen atom (for example, a fluorine atom, a chlorine atom, a bromine atom, etc.), or a carbon number of 1 to 6 Alkyl (for example, methyl, ethyl, propyl, etc.). In the formulae (vii) to (ix), R 21 , R 22 and R 23 are each preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, more preferably a hydrogen atom or a methyl group each independently good. In formula (vii), it is particularly preferred that R 21 and R 23 are each a hydrogen atom.

式(vii)中的X2 表示氧原子(-O-)或亞胺基(-NH-),氧原子為較佳。 式(viii)中的Y表示次甲基或氮原子。X 2 in formula (vii) represents an oxygen atom (-O-) or an imine group (-NH-), and an oxygen atom is preferred. Y in the formula (viii) represents a methine group or a nitrogen atom.

式(vii)~式(ix)中的L2 表示單鍵或2價的連結基。作為2價的連結基的例子,可舉出2價的脂肪族基(例如,伸烷基、取代伸烷基、伸烯基、取代伸烯基、伸炔基及取代伸炔基)、2價的芳香族基(例如,伸芳基及取代伸芳基)、2價的雜環基、氧原子(-O-)、硫原子(-S-)、亞胺基(-NH-)、取代亞胺鍵(-NR41 ’-,其中,R41 ’為脂肪族基、芳香族基或雜環基)、羰基鍵(-CO-)及該些的組合等。L 2 in formulas (vii) to (ix) represents a single bond or a divalent linking group. Examples of the divalent linking group include a divalent aliphatic group (for example, an alkylene group, a substituted alkylene group, an alkylene group, a substituted alkylene group, an alkylene group, and a substituted alkylene group), 2 Valence aromatic group (for example, arylene group and substituted arylene group), divalent heterocyclic group, oxygen atom (-O-), sulfur atom (-S-), imino group (-NH-), Substituted imine bond (-NR 41 '-, wherein R 41 ' is an aliphatic group, an aromatic group or a heterocyclic group), a carbonyl bond (-CO-), a combination thereof, and the like.

2價的脂肪族基可具有環狀結構或分支結構。脂肪族基的碳數為1~20為較佳,1~15為更佳,1~10為進一步較佳。與不飽和脂肪族基相比,脂肪族基為飽和脂肪族基為較佳。脂肪族基可具有取代基。作為取代基的例子,可舉出鹵原子、羥基、芳香族基及雜環基。The divalent aliphatic group may have a cyclic structure or a branched structure. The number of carbon atoms of the aliphatic group is preferably 1 to 20, more preferably 1 to 15 and even more preferably 1 to 10. It is preferable that the aliphatic group is a saturated aliphatic group compared with an unsaturated aliphatic group. The aliphatic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an aromatic group, and a heterocyclic group.

2價的芳香族基的碳數為6~20為較佳,6~15為更佳,6~10為進一步較佳。芳香族基可具有取代基。取代基的例子可舉出鹵原子、羥基、脂肪族基、芳香族基及雜環基。The carbon number of the divalent aromatic group is preferably 6 to 20, more preferably 6 to 15 and even more preferably 6 to 10. The aromatic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an aliphatic group, an aromatic group, and a heterocyclic group.

2價的雜環基作為雜環含有5員環或6員環為較佳。雜環中可縮合有其他雜環、脂肪族環或芳香族環中的一個以上。雜環基可具有取代基。作為取代基的例子,可舉出鹵原子、羥基、氧代基(=O)、硫代基(=S)、亞胺基(=NH)、取代亞胺基(=N-R42 ,其中,R42 為脂肪族基、芳香族基或雜環基)、脂肪族基、芳香族基及雜環基。The divalent heterocyclic group preferably contains a 5-membered ring or a 6-membered ring as a heterocyclic ring. In the heterocyclic ring, one or more of other heterocyclic rings, aliphatic rings, or aromatic rings may be condensed. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an oxo group (= O), a thio group (= S), an imino group (= NH), and a substituted imino group (= NR 42) . 42 is an aliphatic group, an aromatic group or a heterocyclic group), an aliphatic group, an aromatic group, and a heterocyclic group.

L2 為含有單鍵、伸烷基或氧伸烷基結構之2價的連結基為較佳。氧伸烷基結構是氧伸乙基結構或氧伸丙基結構為更佳。L2 可包含重複包含2個以上的氧伸烷基結構之聚氧伸烷基結構。作為聚氧伸烷基結構,聚氧伸乙基結構或聚氧伸丙基結構為較佳。聚氧伸乙基結構以-(OCH2 CH2 )n-表示,n為2以上的整數為較佳,2~10的整數為更佳。L 2 is preferably a divalent linking group containing a single bond, an alkylene group, or an oxyalkylene structure. The oxyalkylene structure is more preferably an oxyethyl structure or an oxypropyl structure. L 2 may include a polyoxyalkylene structure which repeatedly includes two or more oxyalkylene structures. The polyoxyalkylene structure is preferably a polyoxyethylene structure or a polyoxypropylene structure. The polyoxyethylene structure is represented by-(OCH 2 CH 2 ) n-, where n is an integer of 2 or more is preferred, and an integer of 2 to 10 is more preferred.

式(vii)~式(ix)中,Z2 為酸基,羧酸基為較佳。In the formulae (vii) to (ix), Z 2 is an acid group, and a carboxylic acid group is preferred.

式(ix)中,R24 、R25 及R26 分別獨立地表示氫原子、鹵原子(例如,氟、氯、溴等)、碳數為1~6的烷基(例如,甲基、乙基、丙基等)、-Z2 或L2 -Z2 。其中,L2 及Z2 的含義與上述中的L2 及Z2 相同,較佳例亦相同。作為R24 、R25 及R26 ,分別獨立地為氫原子或碳數為1~3的烷基為較佳,氫原子為更佳。In formula (ix), R 24 , R 25, and R 26 each independently represent a hydrogen atom, a halogen atom (for example, fluorine, chlorine, bromine, etc.), and an alkyl group having 1 to 6 carbon atoms (for example, methyl, ethyl, or ethyl). group, propyl, etc.), - Z 2 or L 2 -Z 2. Wherein, L 2, and the meaning is the same as Z 2 in the above-described L 2 and Z 2, preferred examples are also the same. R 24 , R 25, and R 26 are each preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and more preferably a hydrogen atom.

作為以式(vii)表示之單體,R21 、R22 及R23 分別獨立地為氫原子或甲基、L2 為伸烷基或含有氧伸烷基結構之2價的連結基、X2 為氧原子或亞胺基、Z2 為羧酸基之化合物為較佳。 作為以式(vii)表示之單體,R21 為氫原子或甲基、L2 為伸烷基,Z2 為羧酸基、Y為次甲基之化合物為較佳。 而且,作為以式(ix)表示之單體,R24 、R25 及R26 分別獨立地為氫原子或甲基、Z2 為羧酸基之化合物為較佳。As a monomer represented by formula (vii), R 21 , R 22 and R 23 are each independently a hydrogen atom or a methyl group, L 2 is an alkylene group or a divalent linking group containing an oxygen alkylene structure, and X A compound in which 2 is an oxygen atom or an imine group, and Z 2 is a carboxylic acid group is preferred. As the monomer represented by the formula (vii), a compound in which R 21 is a hydrogen atom or a methyl group, L 2 is an alkylene group, Z 2 is a carboxylic acid group, and Y is a methine group is preferable. Further, as the monomer represented by the formula (ix), compounds in which R 24 , R 25 and R 26 are each independently a hydrogen atom or a methyl group, and Z 2 is a carboxylic acid group are preferred.

黏結樹脂能夠藉由與含有上述含有接枝鏈之結構單元之分散劑相同的方法合成,其較佳酸值、重量平均分子量亦相同。The adhesive resin can be synthesized by the same method as the dispersant containing the above-mentioned structural unit containing a graft chain, and its preferred acid value and weight average molecular weight are also the same.

黏結樹脂可具有1種或2種以上的含有酸基之結構單元。 含有酸基之結構單元的含量以質量換算,相對於黏結樹脂的總質量,5~95%為較佳,從抑制鹼顯影引起之圖像強度的損傷之觀點考慮,10~90%為更佳。The adhesive resin may have one or two or more kinds of structural units containing an acid group. The content of the structural unit containing an acid group is calculated in terms of mass, and is preferably 5 to 95% relative to the total mass of the adhesive resin. From the viewpoint of suppressing damage to image strength caused by alkali development, 10 to 90% is more preferable. .

<界面活性劑> 硬化性組成物含有界面活性劑為較佳。界面活性劑有助於提高硬化性組成物的塗佈性。<Surfactant> The curable composition preferably contains a surfactant. The surfactant helps improve the coatability of the curable composition.

硬化性組成物含有界面活性劑時,作為界面活性劑的含量,相對於硬化性組成物的總質量,0.001~2.0質量%為較佳,0.005~1.0質量%為更佳。 界面活性劑可單獨使用1種,亦可同時使用2種以上。同時使用2種以上的界面活性劑時,合計量在上述範圍內為較佳。When the curable composition contains a surfactant, the content of the surfactant is preferably 0.001 to 2.0% by mass, and more preferably 0.005 to 1.0% by mass relative to the total mass of the curable composition. The surfactant can be used singly or in combination of two or more kinds. When two or more surfactants are used simultaneously, the total amount is preferably within the above range.

作為界面活性劑,例如,可舉出氟系界面活性劑、非離子系界面活性劑、陽離子系界面活性劑、陰離子系界面活性劑及矽酮系界面活性劑等。Examples of the surfactant include a fluorine-based surfactant, a non-ionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant.

例如,藉由硬化性組成物含有氟系界面活性劑,硬化性組成物的液特性(尤其,流動性)更加提高。亦即,使用含有氟系界面活性劑之硬化性組成物形成膜時,藉由降低被塗佈面與塗佈液之間的界面張力,向被塗佈面的潤濕性得到改善,向被塗佈面的塗佈性得到提高。故,即使是以少量的液量形成數μm左右的薄膜時,亦可更佳地形成厚度不均較小之膜,在這一點上較有效。For example, when the curable composition contains a fluorine-based surfactant, the liquid characteristics (in particular, the fluidity) of the curable composition are further improved. That is, when a film is formed using a curable composition containing a fluorine-based surfactant, by reducing the interfacial tension between the surface to be coated and the coating liquid, the wettability to the surface to be coated is improved, The coatability of the coated surface is improved. Therefore, even when a thin film having a thickness of several μm is formed with a small amount of liquid, it is more effective to form a thin film with less thickness unevenness.

氟系界面活性劑中的氟含有率3~40質量%為較佳,5~30質量%為更佳,7~25質量%為進一步較佳。氟含有率為該範圍內之氟系界面活性劑在塗佈膜的厚度的均勻性和/或省液性方面較有效,且硬化性組成物中的溶解性亦良好。The fluorine content in the fluorine-based surfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and even more preferably 7 to 25% by mass. A fluorine-based surfactant having a fluorine content ratio within this range is effective in terms of the uniformity of the thickness of the coating film and / or the liquid saving property, and the solubility in the hardening composition is also good.

作為氟系界面活性劑,例如可舉出Megafac F171、Megafac F172、Megafac F173、Megafac F176、Megafac F177、Megafac F141、Megafac F142、Megafac F143、Megafac F144、Megafac R30、Megafac F437、MegafacF475、Megafac F479、Megafac F482、Megafac F554、Megafac F780(以上,DIC公司製造)、Fluorad FC430、Fluorad FC431、Fluorad FC171(以上,Sumitomo 3M Limited製造)、Surflon S-382、Surflon SC-101、Surflon SC-103、Surflon SC-104、Surflon SC-105、Surflon SC-1068、Surflon SC-381、Surflon SC-383、Surflon S-393、Surflon KH-40(以上,ASAHI GLASS CO.,LTD.製造)、PF636、PF656、PF6320、PF6520、PF7002(OMNOVA Solutions Inc.製造)等。 作為氟系界面活性劑,還能夠使用嵌段聚合物,作為具體例,例如可舉出日本特開2011-89090號公報中記載的化合物。作為氟系界面活性劑,還可舉出以下述式表示之化合物(F-1)。化合物(F-1)中,式中以(A)及(B)表示之結構單元分別為62莫耳%、38莫耳%。以式(B)表示之結構單元中,a、b、c分別滿足a+c=14、b=17的關係。另外,下述化合物的重量平均分子量例如為15,311。Examples of the fluorine-based surfactant include Megafac F171, Megafac F172, Megafac F173, Megafac F176, Megafac F177, Megafac F141, Megafac F142, Megafac F143, Megafac F144, Megafac F475, Megafac F475, Megafac F475, Megafac F482, Megafac F554, Megafac F780 (above, manufactured by DIC Corporation), Fluorad FC430, Fluorad FC431, Fluorad FC171 (above, manufactured by Sumitomo 3M Limited), Surflon S-382, Surflon SC-101, Surflon SC-103, Surflon SC- 104, Surflon SC-105, Surflon SC-1068, Surflon SC-381, Surflon SC-383, Surflon S-393, Surflon KH-40 (above, manufactured by ASAHI GLASS CO., LTD.), PF636, PF656, PF6320, PF6520, PF7002 (manufactured by OMNOVA Solutions Inc.), etc. As the fluorine-based surfactant, a block polymer can also be used. As a specific example, for example, a compound described in Japanese Patent Application Laid-Open No. 2011-89090 can be mentioned. Examples of the fluorine-based surfactant include a compound (F-1) represented by the following formula. In the compound (F-1), the structural units represented by (A) and (B) in the formula are 62 mol% and 38 mol%, respectively. In the structural unit represented by formula (B), a, b, and c satisfy the relationships of a + c = 14 and b = 17, respectively. The weight average molecular weight of the following compound is, for example, 15,311.

【化學式27】 [Chemical Formula 27]

作為非離子系界面活性劑,具體而言可舉出甘油、三羥甲基丙烷、三羥甲基乙烷以及該等的乙氧基化物及丙氧基化物(例如甘油丙氧基化物、甘油乙氧基化物等)、聚氧乙烯月桂醚、聚氧乙烯硬脂基醚、聚氧乙烯油基醚、聚氧乙烯辛基苯基醚、聚氧乙烯壬基苯基醚、聚乙二醇二月桂酸酯、聚乙二醇二硬脂酸酯、脫水山梨糖醇脂肪酸酯(BASF公司製造的Pluronic L10、L31、L61、L62、10R5、17R2、25R2,Tetronic 304、701、704、901、904、150R1),Solsperse20000(Japan Lubrizol Corporation製造)等。並且,亦能夠使用TAKEMOTO OIL & FAT CO.,LTD製造Pionin D-6112-W、Wako Pure Chemical Industries, Ltd.製造的NCW-101、NCW-1001、NCW-1002。Specific examples of the non-ionic surfactant include glycerol, trimethylolpropane, trimethylolethane, and ethoxylates and propoxylates such as glycerol propoxylate and glycerol. Ethoxylates, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol Dilaurate, polyethylene glycol distearate, sorbitan fatty acid esters (Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2, Tetronic 304, 701, 704, 901 manufactured by BASF) , 904, 150R1), Solsperse 20000 (manufactured by Japan Lubrizol Corporation), and the like. In addition, Pionin D-6112-W manufactured by TAKEMOTO OIL & FAT CO., LTD, NCW-101, NCW-1001, NCW-1002 manufactured by Wako Pure Chemical Industries, Ltd. can also be used.

作為陽離子系界面活性劑,具體而言可舉出酞菁衍生物(商品名稱、EFKA-745、MORISHITA&CO., LTD.製造)、有機基矽氧烷聚合物KP341(Shin-Etsu Chemical Co., Ltd.製造)、(甲基)丙烯酸系(共)聚合體polyflow No.75、No.90、No.95(KYOEISHA CHEMICAL CO., LTD.製造)、W001(Yusho Co.,Ltd.)等。Specific examples of the cationic surfactant include a phthalocyanine derivative (trade name, EFKA-745, manufactured by MORISHITA & CO., LTD.), And an organosiloxane polymer KP341 (Shin-Etsu Chemical Co., Ltd. (Manufactured), (meth) acrylic (co) polymer polyflow No. 75, No. 90, No. 95 (manufactured by KYOEISHA CHEMICAL CO., LTD.), W001 (Yusho Co., Ltd.), and the like.

作為陰離子系界面活性劑,具體而言可舉出W004、W005、W017(Yusho Co.,Ltd.製造)等。Specific examples of the anionic surfactant include W004, W005, and W017 (manufactured by Yusho Co., Ltd.).

作為矽酮系界面活性劑,例如可舉出Dow Corning Toray Co.,Ltd.製造「Toray Silicone DC3PA」、「Toray Silicone SH7PA」、「Toray Silicone DC11PA」、「Toray Silicone SH21PA」、「Toray Silicone SH28PA」、「Toray Silicone SH29PA」、「Toray Silicone SH30PA」、「Toray Silicone SH8400」、Momentive Performance Materials Inc.製造「TSF-4440」、「TSF-4300」、「TSF-4445」、「TSF-4460」、「TSF-4452」、Shin-Etsu Chemical Co., Ltd.製造「KP341」、「KF6001」、「KF6002」、BYK Chemie GmbH製造「BYK307」、「BYK323」、「BYK330」等。Examples of the silicone-based surfactants include "Toray Silicone DC3PA", "Toray Silicone SH7PA", "Toray Silicone DC11PA", "Toray Silicone SH21PA", "Toray Silicone SH28PA" manufactured by Dow Corning Toray Co., Ltd. , "Toray Silicone SH29PA", "Toray Silicone SH30PA", "Toray Silicone SH8400", Momentive Performance Materials Inc. manufacture "TSF-4440", "TSF-4300", "TSF-4445", "TSF-4460", " TSF-4452 "," KP341 "," KF6001 "," KF6002 "manufactured by Shin-Etsu Chemical Co., Ltd.," BYK307 "," BYK323 "," BYK330 ", etc. manufactured by BYK Chemie GmbH.

<矽烷偶聯劑> 矽烷偶聯劑是指在分子中含有水解性基團及其以外的官能基團之化合物。另外,烷氧基等水解性基團與矽原子鍵結。 水解性基團是指,與矽原子直接鍵結,並且可藉由水解反應和/或縮合反應生成矽氧烷鍵之取代基。作為水解性基團,例如,可舉出鹵原子、烷氧基、醯氧基及烯氧基。水解性基團含有碳原子時,其碳數為6以下為較佳,4以下為更佳。碳數4以下的烷氧基或碳數4以下的烯氧基為特佳。 在基板上形成硬化膜時,為了提高基板與硬化膜之間的黏附性,矽烷偶聯劑不包含氟原子及矽原子(其中,水解性基團所鍵結之矽原子除外)為較佳,不包含氟原子、矽原子(其中,水解性基團所鍵結之矽原子除外)、被矽原子取代之伸烷基、碳數8以上的直鏈烷基及碳數3以上的支鏈烷基為較佳。<Silane coupling agent> A silane coupling agent is a compound containing a hydrolyzable group and a functional group other than it in a molecule. A hydrolyzable group such as an alkoxy group is bonded to a silicon atom. The hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and can generate a siloxane bond through a hydrolysis reaction and / or a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, a fluorenyloxy group, and an alkenyloxy group. When the hydrolyzable group contains a carbon atom, its carbon number is preferably 6 or less, and more preferably 4 or less. An alkoxy group having 4 or less carbon atoms or an alkenyl group having 4 or less carbon atoms is particularly preferred. When forming a cured film on a substrate, in order to improve the adhesion between the substrate and the cured film, it is preferable that the silane coupling agent does not contain fluorine atoms and silicon atoms (except for silicon atoms bonded by hydrolyzable groups). Does not include fluorine atoms, silicon atoms (except for silicon atoms bonded by hydrolyzable groups), alkylene groups substituted with silicon atoms, straight-chain alkyl groups with 8 or more carbon atoms, and branched alkanes with 3 or more carbon atoms Basis is better.

矽烷偶聯劑含有以以下的式(Z)表示之基團為較佳。*表示鍵結位置。 式(Z)*-Si-(RZ13 式(Z)中,RZ1 表示水解性基團,其定義如上述。The silane coupling agent preferably contains a group represented by the following formula (Z). * Indicates the bonding position. Formula (Z) *-Si- (R Z1 ) 3 In formula (Z), R Z1 represents a hydrolyzable group, and its definition is as described above.

矽烷偶聯劑含有選自由(甲基)丙烯醯氧基、環氧基及氧雜環丁基所組成之群組之1種以上的硬化性官能基團為較佳。硬化性官能基團可直接與矽原子鍵結,亦可經由連結基與矽原子鍵結。 另外,作為上述矽烷偶聯劑中包含之硬化性官能基團的較佳態樣,還可舉出自由基聚合性基團。The silane coupling agent preferably contains one or more hardenable functional groups selected from the group consisting of (meth) acrylic fluorenyloxy, epoxy, and oxetanyl. The hardening functional group may be directly bonded to the silicon atom, or may be bonded to the silicon atom through a linking group. Moreover, as a preferable aspect of the curable functional group contained in the said silane coupling agent, a radical polymerizable group is mentioned.

矽烷偶聯劑的分子量並無特別限制,從操作性的角度考慮,100~1,000的情況較多,270以上為較佳,270~1,000為更佳。The molecular weight of the silane coupling agent is not particularly limited. From the viewpoint of operability, 100 to 1,000 are often used, 270 or more is preferable, and 270 to 1,000 is more preferable.

作為矽烷偶聯劑的較佳態樣之一,可舉出以式(W)表示之矽烷偶聯劑X。 式(W) RZ2 -Lz-Si-(RZ13 Rz1 表示水解性基團,定義如上述。 Rz2 表示硬化性官能基團,定義如上述,較佳範圍亦如上述。 Lz表示單鍵或2價的連結基。Lz表示2價的連結基時,作為2價的連結基,可舉出鹵原子可取代之伸烷基、鹵原子可取代之伸芳基、-NR12 -、-CONR12 -、-CO-、-CO2 -、SO2 NR12 -、-O-、-S-、-SO2 -或該些的組合。其中,選自由碳數2~10的鹵原子可取代之伸烷基及碳數6~12的鹵原子可取代之伸芳基所組成之群組之至少一種、或包含該些基團與選自由-NR12 -、-CONR12 -、-CO-、-CO2 -、SO2 NR12 -、-O-、-S-及SO2 -所組成之群組之至少一種基團的組合之基團為較佳,包含碳數2~10的鹵原子可取代之伸烷基、-CO2 -、-O-、-CO-、-CONR12 -或該些基團的組合之基團為更佳。其中,上述R12 表示氫原子或甲基。One of the preferable aspects of the silane coupling agent includes a silane coupling agent X represented by the formula (W). The formula (W) R Z2 -Lz-Si- (R Z1 ) 3 R z1 represents a hydrolyzable group, and is defined as described above. R z2 represents a hardenable functional group, as defined above, and the preferred range is also as described above. Lz represents a single bond or a divalent linking group. When Lz represents a divalent linking group, examples of the divalent linking group include a halogen atom-substituted alkylene group, a halogen atom-substituted alkylene group, -NR 12- , -CONR 12- , -CO- , -CO 2- , SO 2 NR 12- , -O-, -S-, -SO 2 -or a combination of these. Among them, at least one selected from the group consisting of an alkylene group which can be substituted with a halogen atom having 2 to 10 carbon atoms and an alkylene group which can be substituted with a halogen atom having 6 to 12 carbon atoms, or contains these groups and an optional group Free combination of at least one group of the group consisting of -NR 12- , -CONR 12- , -CO-, -CO 2- , SO 2 NR 12- , -O-, -S-, and SO 2- The group is preferably, and a group containing a substituted alkylene group having 2 to 10 carbon atoms, -CO 2- , -O-, -CO-, -CONR 12 -or a combination of these groups is Better. Here, the above R 12 represents a hydrogen atom or a methyl group.

作為矽烷偶聯劑X,可舉出N-β-胺乙基-γ-胺丙基-甲基二甲氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造、商品名 KBM-602)、N-β-胺乙基-γ-胺丙基-三甲氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造、商品名 KBM-603)、N-β-胺乙基-γ-胺丙基-三乙氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造、商品名 KBE-602)、γ-胺丙基-三甲氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造、商品名 KBM-903)、γ-胺丙基-三乙氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造、商品名 KBE-903)、3-甲基丙烯醯氧基丙基三甲氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造、商品名 KBM-503)及環氧丙氧基辛基三甲氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造、商品名 KBM-4803)等。Examples of the silane coupling agent X include N-β-aminoethyl-γ-aminopropyl-methyldimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-602), N-β-aminoethyl-γ-aminopropyl-trimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-603), N-β-aminoethyl-γ-aminopropyl -Triethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBE-602), γ-aminopropyl-trimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM) -903), γ-aminopropyl-triethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBE-903), 3-methacryloxypropyltrimethoxysilane (Shin -Manufactured by Etsu Chemical Co., Ltd., trade name KBM-503), and glycidyloxyoctyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-4803), and the like.

作為矽烷偶聯劑的其他較佳態樣,可舉出在分子內至少具有矽原子、氮原子、硬化性官能基團,且含有與矽原子鍵結之水解性基團之矽烷偶聯劑Y。 該矽烷偶聯劑Y在分子內具有至少1個矽原子即可,矽原子能夠與以下的原子、取代基鍵結。該些可以是相同的原子、取代基,亦可不同。可鍵結之原子、取代基可舉出氫原子、鹵原子、羥基、碳數1至20的烷基、烯基、炔基、芳基、可用烷基和/或芳基取代之胺基、甲矽烷基、碳數1至20的烷氧基、芳氧基等。該些取代基可進一步被甲矽烷基、烯基、炔基、芳基、烷氧基、芳氧基、硫代烷氧基、可用烷基和/或芳基取代之胺基、鹵原子、磺醯胺基、烷氧基羰基、醯胺基、尿素基、銨基、烷基銨基、羧酸基或其鹽、磺基或其鹽等取代。 另外,矽原子上鍵結有至少1個水解性基團。水解性基團的定義如上述。 矽烷偶聯劑Y中可包含以式(Z)表示之基團。As another preferable aspect of the silane coupling agent, a silane coupling agent Y having at least a silicon atom, a nitrogen atom, a hardenable functional group in the molecule, and a hydrolyzable group bonded to a silicon atom may be mentioned. . The silane coupling agent Y only needs to have at least one silicon atom in the molecule, and the silicon atom can be bonded to the following atoms and substituents. These may be the same atom or substituent, or may be different. Examples of the bondable atom and substituent include a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group having 1 to 20 carbon atoms, an alkenyl group, an alkynyl group, an aryl group, an amine group which may be substituted with an alkyl group and / or an aryl group, Silyl, alkoxy, aryloxy having 1 to 20 carbons, and the like. These substituents may be further substituted by silyl, alkenyl, alkynyl, aryl, alkoxy, aryloxy, thioalkoxy, amine groups which may be substituted with alkyl and / or aryl, halogen atoms, Substituted by a sulfonamido group, an alkoxycarbonyl group, a sulfonamide group, a urea group, an ammonium group, an alkylammonium group, a carboxylic acid group or a salt thereof, a sulfo group or a salt thereof, and the like. In addition, at least one hydrolyzable group is bonded to the silicon atom. The definition of the hydrolyzable group is as described above. The silane coupling agent Y may contain a group represented by the formula (Z).

矽烷偶聯劑Y在分子內具有至少1個以上的氮原子,氮原子以二級胺基或者三級胺基的形態存在為較佳,亦即,氮原子作為取代基含有至少1個有機基團為較佳。另外,作為胺基的結構,可以以含氮雜環的部分結構的形態存在於分子內,亦可作為苯胺等取代胺基存在。 其中,作為有機基團,可舉出烷基、烯基、炔基、芳基或該些的組合。該些可進一步具有取代基,作為可導入之取代基,可舉出甲矽烷基、烯基、炔基、芳基、烷氧基、芳氧基、硫代烷氧基、胺基、鹵原子、磺醯胺基、烷氧基羰基、羰基氧基、醯胺基、尿素基、伸烷氧基銨基、烷基銨基、羧酸基或其鹽、磺基等。 氮原子經由任意的有機連結基與硬化性官能基團鍵結為較佳。作為較佳之有機連結基,可舉出可導入到上述氮原子及與其鍵結之有機基團之取代基。The silane coupling agent Y has at least one nitrogen atom in the molecule, and the nitrogen atom is preferably in the form of a secondary or tertiary amine group, that is, the nitrogen atom contains at least one organic group as a substituent. Mission is better. The structure of the amine group may exist in the molecule in the form of a partial structure of a nitrogen-containing heterocyclic ring, or may exist as a substituted amine group such as aniline. Among them, examples of the organic group include an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a combination thereof. These may further have a substituent, and examples of the substituent that can be introduced include silyl, alkenyl, alkynyl, aryl, alkoxy, aryloxy, thioalkoxy, amine, and halogen atoms. , Sulfonylamino, alkoxycarbonyl, carbonyloxy, sulfonylamino, urea, alkoxyammonium, alkylammonium, carboxylic acid or its salt, sulfo, and the like. The nitrogen atom is preferably bonded to a hardenable functional group via an arbitrary organic linking group. Preferred examples of the organic linking group include substituents which can be introduced into the nitrogen atom and an organic group bonded thereto.

矽烷偶聯劑Y中包含之硬化性官能基團的定義如上述,較佳範圍亦如上述。 矽烷偶聯劑Y中,在一個分子中具有至少1個以上的硬化性官能基團即可,但亦可含有2個以上的硬化性官能基團。從靈敏度、穩定性的觀點考慮,在分子內含有2~20個硬化性官能基團為較佳,含有4~15個為更佳,含有6~10個為進一步較佳。The definition of the hardenable functional group contained in the silane coupling agent Y is as described above, and the preferred range is also as described above. The silane coupling agent Y may have at least one curable functional group in one molecule, but it may contain two or more curable functional groups. From the viewpoint of sensitivity and stability, it is more preferable to contain 2 to 20 hardenable functional groups in the molecule, it is more preferable to contain 4 to 15 and it is more preferable to contain 6 to 10.

矽烷偶聯劑X及矽烷偶聯劑Y的分子量並無特別限制,可舉出上述範圍(270以上為較佳)。The molecular weights of the silane coupling agent X and the silane coupling agent Y are not particularly limited, and examples thereof include the above range (270 or more is preferred).

硬化性組成物中的矽烷偶聯劑的含量相對於硬化性組成物中的總固體成分,0.1~10質量%為較佳,0.5~8質量%為更佳,1.0~6質量%為進一步較佳。The content of the silane coupling agent in the hardenable composition is preferably 0.1 to 10% by mass, more preferably 0.5 to 8% by mass, and 1.0 to 6% by mass based on the total solids in the hardenable composition. good.

硬化性組成物可單獨含有1種矽烷偶聯劑,亦可含有2種以上。硬化性組成物含有2種以上的矽烷偶聯劑時,其合計在上述範圍內即可。The curable composition may contain one type of silane coupling agent alone, or may contain two or more types. When the curable composition contains two or more kinds of silane coupling agents, the total amount may be within the above range.

<紫外線吸收劑> 硬化性組成物可含有紫外線吸收劑。藉此,能夠將硬化膜的圖案形狀設為更優異(精細)者。 作為紫外線吸收劑,能夠使用柳酸鹽系、二苯甲酮系、苯并三唑系、取代丙烯腈系及三嗪系的紫外線吸收劑。作為該些的具體例,能夠使用日本特開2012-068418號公報的段落0137~0142(所對應之US2012/0068292的段落0251~0254)的化合物,能夠援用該些內容,將其編入本說明書中。 此外,二乙基胺基-苯基磺醯基系紫外線吸收劑(DAITO CHEMICAL CO.,LTD.製造、商品名:UV-503)等亦可較佳地使用。 作為紫外線吸收劑,可舉出日本特開2012-32556號公報的段落0134~0148中例示之化合物。 紫外線吸收劑的含量相對於硬化性組成物的總固體成分,0.001~15質量%為較佳,0.01~10質量%為更佳,0.1~5質量%為進一步較佳。<Ultraviolet absorbent> The curable composition may contain an ultraviolet absorbent. Thereby, the pattern shape of a cured film can be made more excellent (fine). As the ultraviolet absorber, a salicylate-based, benzophenone-based, benzotriazole-based, substituted acrylonitrile-based, and triazine-based ultraviolet absorber can be used. As specific examples of these, compounds of paragraphs 0137 to 0142 of Japanese Patent Application Laid-Open No. 2012-068418 (corresponding paragraphs 0251 to 0254 of US2012 / 0068292) can be used, and those contents can be incorporated into this specification by reference. . In addition, a diethylamino-phenylsulfonyl-based ultraviolet absorber (manufactured by DAITO CHEMICAL CO., LTD., Trade name: UV-503) and the like can also be preferably used. Examples of the ultraviolet absorber include compounds exemplified in paragraphs 0134 to 0148 of Japanese Patent Application Laid-Open No. 2012-32556. The content of the ultraviolet absorber is preferably 0.001 to 15% by mass, more preferably 0.01 to 10% by mass, and even more preferably 0.1 to 5% by mass based on the total solid content of the curable composition.

[硬化性組成物的製造方法] 硬化性組成物的製造方法含有以下的混合及分散製程。含有靜置製程和/或過濾製程為較佳。以下,對各製程,詳細說明較佳態樣。[Manufacturing method of curable composition] The manufacturing method of the curable composition includes the following mixing and dispersion processes. It is preferred to include a static process and / or a filtration process. Hereinafter, preferred aspects of each process will be described in detail.

〔混合及分散製程〕 混合及分散製程是藉由公知的混合方法(例如,攪拌機、均質器、高壓乳化裝置、濕式粉碎機及濕式分散機)混合上述成分來獲得硬化性組成物之製程。混合及分散製程中,可一次性配合構成硬化性組成物之各成分,亦可在將各成分溶解或分散於有機溶劑之後依次配合。配合時的投入順序及作業條件並不特別受限。混合及分散製程可含有製作分散液之製程。[Mixing and Dispersing Process] The mixing and dispersing process is a process for obtaining a hardenable composition by mixing the above components by a known mixing method (for example, a mixer, a homogenizer, a high-pressure emulsification device, a wet pulverizer, and a wet disperser). . In the mixing and dispersing process, the components constituting the hardenable composition may be blended at one time, or the components may be blended sequentially after being dissolved or dispersed in an organic solvent. The input sequence and operating conditions at the time of cooperation are not particularly limited. The mixing and dispersion process may include a process for making a dispersion.

(製作分散液之製程) 製作分散液之製程是混合著色劑、分散劑及溶劑,並藉由上述方法分散著色劑來製作分散液之製程。能夠向所製作之分散液混合其他成分來製造硬化性組成物。 製造分散液之製程中,作為用於顔料的分散之機械力,可舉出壓縮、壓榨、衝擊、裁斷或孔蝕等。作為該些工藝的具體例,可舉出珠磨、混砂、輥磨、高速葉輪、砂磨、噴射流混合、高壓濕式微粒化及超聲波分散等。並且,能夠適當使用「分散技術大全、株式會社資訊機構發行、2005年7月15日」及「以懸浮液(suspension)(固/液分散系統)為中心之分散技術與工業應用的實際綜合資料集、經營開發中心出版部發行、1978年10月10日」中記載之工藝及分散機。 在製作分散液之製程中,可進行基於鹽磨製程之顔料的微細化處理。用於鹽磨製程之原材料、設備及處理條件等例如能夠使用日本特開2015-194521號及日本特開2012-046629號中記載者。 硬化性組成物的製造方法含有藉由熱電漿法獲得上述著色劑之製程為較佳。獲得著色劑之製程在混合上述各成分之前實施。基於熱電漿法之著色劑的具體製造製程的態様如上述。(Manufacturing Process of Dispersion Liquid) The manufacturing process of the dispersion liquid is a process of mixing a colorant, a dispersant, and a solvent, and dispersing the colorant by the method described above to prepare a dispersion liquid. A hardening composition can be manufactured by mixing other components with the produced dispersion liquid. In the manufacturing process of the dispersion liquid, as the mechanical force for dispersing the pigment, compression, pressing, impact, cutting, or pitting can be mentioned. Specific examples of these processes include bead milling, sand mixing, roll milling, high-speed impeller, sand milling, jet flow mixing, high-pressure wet micronization, and ultrasonic dispersion. In addition, it is possible to appropriately use "Comprehensive Dispersion Technology, Issued by Information Corporation, July 15, 2005" and "Distribution technology centered on suspension (solid / liquid dispersion system) and practical comprehensive information on industrial applications Collected and distributed by the Publishing Department of the Operation and Development Center, October 10, 1978 ". In the production process of the dispersion liquid, the pigment can be miniaturized by the salt milling process. The raw materials, equipment, and processing conditions used in the salt milling process can be, for example, those described in Japanese Patent Application Laid-Open No. 2015-194521 and Japanese Patent Application No. 2012-046629. It is preferable that the manufacturing method of a hardenable composition contains the manufacturing process of the said coloring agent by a thermo-plasma method. The process of obtaining a coloring agent is performed before mixing each said component. The state of the specific manufacturing process of the toner based on the thermoplasma method is as described above.

<靜置製程> 著色劑可在供給至混合及分散製程或製作分散液之製程之前經過以下的靜置製程。 靜置製程是將藉由熱電漿法獲得之著色劑在其製造之後並不暴露於大氣,而是在氧濃度得到控制之密封容器內,靜置規定時間(12~72小時為較佳,12~48小時為更佳,12~24小時為進一步較佳)之製程。此時,密封容器內的水分的含量得到控制為較佳。<Standing process> The colorant may be subjected to the following standing process before being supplied to a mixing and dispersion process or a process for preparing a dispersion. The stationary process is a process in which the toner obtained by the thermoelectric plasma method is not exposed to the atmosphere after it is manufactured, but in a sealed container whose oxygen concentration is controlled, and is allowed to stand for a predetermined time (12 to 72 hours is preferred, 12 ~ 48 hours is more preferred, and 12 to 24 hours is more preferred). At this time, it is preferable to control the content of moisture in the sealed container.

此時,密封容器內的氧(O2 )濃度及水分的含量分別為100ppm以下為較佳,10ppm以下為更佳,1ppm以下為進一步較佳。 密封容器內的氧(O2 )濃度及水分的含量能夠藉由調整供給至密封容器內之惰性氣體中的氧濃度及水分量來進行調整。作為惰性氣體,使用氮氣及氬氣為較佳,其中,使用氮氣為更佳。 若經過上述靜置製程,則著色劑的表面及晶界變得穩定。藉此,能夠抑制使硬化性組成物硬化來獲得之硬化膜的針孔的產生。 另外,上述靜置製程能夠被在著色劑的製造方法中說明之製程H代替,從硬化性組成物具有更優異之本發明的效果之角度考慮,藉由製程H代替為較佳。At this time, the oxygen (O 2 ) concentration and the moisture content in the sealed container are preferably 100 ppm or less, more preferably 10 ppm or less, and even more preferably 1 ppm or less. The oxygen (O 2 ) concentration and the water content in the sealed container can be adjusted by adjusting the oxygen concentration and the amount of water in the inert gas supplied into the sealed container. As the inert gas, nitrogen and argon are preferred, and nitrogen is more preferred. After the above-mentioned standing process, the surface and grain boundaries of the colorant become stable. This makes it possible to suppress the occurrence of pinholes in the cured film obtained by curing the curable composition. In addition, the above-mentioned standing process can be replaced by the process H described in the method for producing a colorant. From the viewpoint that the curable composition has more excellent effects of the present invention, it is preferable to replace the process H.

<過濾製程> 過濾製程是藉由過濾器對藉由上述混合及分散製程製造之硬化性組成物進行過濾之製程。過濾製程中,能夠從硬化性組成物去除異物和/或減少缺陷。 作為過濾器,只要是一直以來用於過濾用途等者,則可不特別受限地使用。例如,可舉出基於PTFE(polytetrafluoroethylene:聚四氟乙烯)等氟樹脂、尼龍等聚醯胺系樹脂、聚乙烯及聚丙烯(PP)等聚烯烃樹脂(含有高密度、超高分子量)等之過濾器。該些原材料中,聚丙烯(含有高密度聚丙烯)、尼龍為較佳。 過濾器的適當的孔徑為0.1~7.0μm左右,0.2~2.5μm左右為較佳,0.2~1.5μm左右為更佳,0.3~0.7μm為進一步較佳。藉由設為該範圍,能夠抑制顏料的過濾堵塞,並且可靠地去除顏料中包含之雜質及凝聚物等微細的異物。 使用過濾器時,亦可組合不同的過濾器。此時,藉由第1過濾器的過濾可以僅進行1次,亦可進行2次以上。組合不同的過濾器來進行2次以上過濾時,第2次之後的孔徑與第1次過濾的孔徑相同或大於第1次過濾的孔徑為較佳。亦可組合於上述範圍內不同孔徑的第1過濾器。此處的孔徑能夠參閱過濾器製造商的標稱值。作為市售的過濾器,例如,可從由NIHON PALL LTD.、ADVANTEC TOYO KAISHA, LTD.、Nihon Entegris K.K.(原Mykrolis Corpration)或KITZ MICRO FILTER CORPORATION等提供之各種過濾器中選擇。 第2過濾器可使用以與上述第1過濾器相同的材料等形成者。第2過濾器的適當的孔徑為0.2~10.0μm左右,0.2~7.0μm左右為較佳,0.3~6.0μm左右為更佳。<Filtration process> The filtration process is a process of filtering a hardening composition manufactured by the above-mentioned mixing and dispersion process by a filter. In the filtration process, foreign matter can be removed from the hardening composition and / or defects can be reduced. The filter can be used without particular limitation as long as it has been used for filtering applications and the like. Examples include fluororesins such as PTFE (polytetrafluoroethylene), polyamide resins such as nylon, and polyolefin resins (including high density and ultra high molecular weight) such as polyethylene and polypropylene (PP). filter. Among these raw materials, polypropylene (containing high-density polypropylene) and nylon are preferred. The appropriate pore size of the filter is about 0.1 to 7.0 μm, preferably about 0.2 to 2.5 μm, more preferably about 0.2 to 1.5 μm, and even more preferably 0.3 to 0.7 μm. By setting it as this range, it is possible to suppress the clogging of the pigment and reliably remove fine foreign matters such as impurities and aggregates contained in the pigment. When using filters, you can also combine different filters. At this time, the filtration by the first filter may be performed only once, or may be performed twice or more. When two or more filtrations are performed by combining different filters, the pore diameter after the second filtration is the same as or larger than the pore diameter of the first filtration. It is also possible to combine the first filters with different pore sizes in the above range. The pore size here can refer to the nominal value of the filter manufacturer. As commercially available filters, for example, various filters provided by NIHON PALL LTD., ADVANTEC TOYO KAISHA, LTD., Nihon Entegris K.K. (formerly Mykrolis Corpration), or KITZ MICRO FILTER CORPORATION can be selected. The second filter can be formed from the same material as the first filter. The appropriate pore diameter of the second filter is about 0.2 to 10.0 μm, more preferably about 0.2 to 7.0 μm, and even more preferably about 0.3 to 6.0 μm.

[硬化膜(遮光膜)] 硬化膜使上述硬化性組成物硬化來獲得。硬化膜中包含著色劑。硬化膜適宜用作遮光膜,具體而言,適宜用作圖像感測器的受光部周邊部分的遮光。 以下,作為一例,對硬化膜用作圖像感測器的受光部周邊部分的遮光膜之情況進行說明。[Curable film (light-shielding film)] The cured film is obtained by curing the above-mentioned curable composition. The cured film contains a colorant. The cured film is suitably used as a light-shielding film, and specifically, it is suitably used as a light-shielding portion around the light-receiving portion of the image sensor. Hereinafter, a case where a cured film is used as a light-shielding film in a peripheral portion of a light-receiving portion of an image sensor will be described as an example.

作為遮光膜的膜厚,並無特別限定,從遮光膜具有更優異之本發明的效果之角度考慮,以乾燥後的膜厚計,0.2μm以上且50μm以下為較佳,0.3μm以上且10μm以下為更佳,0.3μm以上且5μm以下為進一步較佳。上述硬化性組成物的每單位體積的光學濃度較高(遮光性較高),故與以往使用黑色顔料之硬化性組成物相比,還能夠更加減小膜厚。 作為遮光膜的尺寸(設置於感測器受光部周邊之遮光膜的一邊的長度),從遮光膜具有更優異之本發明的效果之角度考慮,0.001mm以上且10mm以下為較佳,0.05mm以上且7mm以下為更佳,0.1mm以上且3.5mm以下為進一步較佳。The film thickness of the light-shielding film is not particularly limited. In view of the fact that the light-shielding film has more excellent effects of the present invention, the film thickness after drying is preferably 0.2 μm or more and 50 μm or less, and 0.3 μm or more and 10 μm. The following is more preferred, and more preferably 0.3 μm to 5 μm. The above-mentioned curable composition has a high optical density per unit volume (high light-shielding property), and therefore it is possible to further reduce the film thickness compared with conventional curable compositions using black pigments. As the size of the light-shielding film (the length of one side of the light-shielding film provided around the light-receiving portion of the sensor), from the standpoint that the light-shielding film has more excellent effects of the present invention, 0.001 mm or more and 10 mm or less is preferred, and 0.05 mm It is more preferable that it is 7 mm or more, and it is more preferable that it is 0.1 mm or more and 3.5 mm or less.

〔硬化膜的製造方法〕 接著,對硬化膜(遮光膜)的製造方法進行說明。 以下,按每個製程對製造方法進行詳細說明。[Manufacturing method of cured film] Next, a manufacturing method of the cured film (light-shielding film) will be described. Hereinafter, the manufacturing method will be described in detail for each process.

硬化膜的製造方法含有以下的硬化性組成物層形成製程及曝光製程。硬化膜的製造方法還含有顯影製程為較佳。 硬化性組成物層形成製程:在支撐體上形成硬化性組成物層之製程。 曝光製程:對上述硬化性組成物層進行曝光之製程。 顯影製程:對曝光後的硬化性組成物層進行顯影來形成圖案狀的硬化膜(遮光膜)之製程。The manufacturing method of a cured film contains the following curable composition layer formation process and exposure process. It is preferable that the manufacturing method of a cured film also contains a developing process. Hardening composition layer forming process: a process of forming a hardening composition layer on a support. Exposure process: a process of exposing the curable composition layer. Development process: A process of developing the cured curable composition layer to form a patterned cured film (light-shielding film).

具體而言,將上述硬化性組成物直接或經由其他層塗佈於基板上來形成硬化性組成物層(硬化性組成物層形成製程),經由規定的遮罩圖案進行曝光,並僅使被光照射之塗佈膜部分硬化(曝光製程),利用顯影液進行顯影(顯影製程),藉此能夠製造上述硬化膜。 以下,對上述各製程進行說明。Specifically, the curable composition is applied directly or via another layer on a substrate to form a curable composition layer (curable composition layer forming process), is exposed through a predetermined mask pattern, and is exposed only to light. The irradiated coating film is partially cured (exposure process), and developed using a developer (development process), whereby the cured film can be produced. Each of the above processes will be described below.

<硬化性組成物層形成製程> 硬化性組成物層形成製程是在支撐體(以下,還稱作「基板」。)上形成硬化性組成物層之製程。其中,包含在支撐體上塗佈硬化性組成物來形成硬化性組成物層之塗佈製程為較佳,包含在支撐體上直接塗佈硬化性組成物,從而在支撐體上形成硬化性組成物層之塗佈製程為更佳。 作為基板,例如,用於液晶顯示裝置等之無鹼性玻璃、鈉玻璃、Pyrex(註冊商標)玻璃、石英玻璃及對該些附著透明導電膜者、用於固體攝像元件等之光電轉換元件基板(例如,矽酮基板等)、CCD(Charge Coupled Device(電荷耦合元件))基板、以及CMOS(Complementary Metal-Oxide Semiconductor(互補型金屬氧化物半導體))基板等。 為了改善與上部層的黏附、防止物質的擴散或者基板表面的平坦化,可在該些基板上,依據需要設置底塗層。<Curable composition layer formation process> The curable composition layer formation process is a process of forming a curable composition layer on a support (hereinafter, also referred to as a "substrate"). Among them, a coating process including applying a hardenable composition on a support to form a hardenable composition layer is preferred, and directly including applying a hardenable composition on a support to form a hardenable composition on the support. The coating process is better. As the substrate, for example, alkali-free glass, soda glass, Pyrex (registered trademark) glass, quartz glass used for liquid crystal display devices, and photoelectric conversion element substrates for those having a transparent conductive film attached thereto and used for solid-state imaging elements, etc. (Eg, silicone substrate, etc.), CCD (Charge Coupled Device) substrate, and CMOS (Complementary Metal-Oxide Semiconductor) substrate. In order to improve the adhesion with the upper layer, prevent the diffusion of substances, or flatten the surface of the substrate, an undercoat layer may be provided on these substrates as needed.

作為向基板上塗佈硬化性組成物的方法,能夠適用狹縫塗佈法、噴墨法、旋塗法、流延塗佈法、輥塗法及網版印刷法等各種塗佈方法。As a method of applying a hardenable composition to a substrate, various coating methods such as a slit coating method, an inkjet method, a spin coating method, a cast coating method, a roll coating method, and a screen printing method can be applied.

製造固體攝像元件用的含有黑矩陣之彩色濾光片時,作為硬化性組成物的塗佈膜厚,從解析度的觀點考慮,0.35μm以上且1.5μm以下為較佳,0.40μm以上且1.0μm以下為更佳。When manufacturing a color filter containing a black matrix for a solid-state imaging element, the coating film thickness of the curable composition is preferably 0.35 μm or more and 1.5 μm or less from the viewpoint of resolution, and 0.40 μm or more and 1.0 It is more preferable to be less than μm.

塗佈於基板上之硬化性組成物通常在70℃以上且110℃以下,2分鐘以上且4分鐘以下的程度的條件下進行乾燥。藉此,能夠形成硬化性組成物層。The curable composition applied on the substrate is usually dried under conditions of 70 ° C. to 110 ° C., and about 2 minutes to 4 minutes. Thereby, a curable composition layer can be formed.

<曝光製程> 曝光製程是經由遮罩對在硬化性組成物層形成製程中形成之硬化性組成物層(塗佈膜)進行曝光,並僅使被光照射之塗佈膜部分硬化之製程。 曝光藉由光化射線或放射線的照射來進行為較佳,尤其,可較佳地使用g射線、h射線及i射線等紫外線,高壓水銀燈為更佳。曝光量並無特別限制,200mJ/cm2 以上為較佳,200~1,500mJ/cm2 為更佳,200~1,000mJ/cm2 為進一步較佳,200~500mJ/cm2 為特佳。若曝光量在上述範圍內,則硬化膜的製造方法具有更優異之穩定性及生產性。 從提高解析度的觀點考慮,固體攝像元件用的遮光膜形成中,基於i射線步進機之曝光為較佳。<Exposure Process> The exposure process is a process of exposing the curable composition layer (coating film) formed in the curable composition layer forming process through a mask, and curing only a part of the coating film irradiated with light. The exposure is preferably performed by irradiation with actinic rays or radiation. In particular, ultraviolet rays such as g-rays, h-rays, and i-rays can be preferably used, and a high-pressure mercury lamp is more preferable. Exposure amount is not particularly limited, 200mJ / cm 2 or more is preferred, 200 ~ 1,500mJ / cm 2 is more preferably, 200 ~ 1,000mJ / cm 2 is further preferred, 200 ~ 500mJ / cm 2 is particularly preferred. When the exposure amount is within the above range, the method for producing a cured film has more excellent stability and productivity. From the viewpoint of improving the resolution, in the formation of a light-shielding film for a solid-state imaging element, exposure by an i-ray stepper is preferable.

<顯影製程> 顯影製程是對已曝光之硬化性組成物層進行顯影之製程。藉由顯影製程,能夠獲得圖案狀的硬化膜。 上述硬化膜的製造方法含有顯影製程及下述清洗製程為較佳。顯影製程中,進行鹼性顯影處理(顯影製程),使曝光製程中的光未照射部分溶出於鹼水溶液。藉此,僅殘留已光硬化之部分(被光照射之塗佈膜部分)。 作為顯影液,製作固體攝像元件用的含有黑矩陣之遮光性彩色濾光片時,不會損傷基底的電路等之有機鹼性顯影液為較佳。顯影溫度通常為20~30℃為較佳,顯影時間為20~90秒為較佳。<Developing Process> The developing process is a process of developing the exposed curable composition layer. Through the development process, a patterned cured film can be obtained. It is preferable that the manufacturing method of the said hardened film contains a developing process and the following washing process. During the development process, an alkaline development process (development process) is performed to dissolve the light-irradiated part in the exposure process into an alkaline aqueous solution. Thereby, only the light-hardened portion (the portion of the coating film irradiated with light) remains. As the developing solution, when a light-shielding color filter containing a black matrix for a solid-state imaging element is produced, an organic alkaline developing solution that does not damage the circuit of the substrate or the like is preferable. The developing temperature is usually preferably 20 to 30 ° C, and the developing time is preferably 20 to 90 seconds.

作為鹼性水溶液,例如,可舉出無機系顯影液及有機系顯影液。作為無機系顯影液,可舉出將氫氧化鈉、氫氧化鉀、碳酸鈉、碳酸氫鈉、矽酸鈉或偏矽酸鈉,溶解成濃度為0.001~10質量%,較佳地為0.01~1質量%之鹼性水溶液。作為有機系顯影液,可舉出將氨水、乙胺、二乙胺、二甲基乙醇胺、四甲基氫氧化銨、四乙基氫氧化銨、膽鹼、吡咯、哌啶或1,8-二氮雜雙環-[5.4.0]-7-十一碳烯等有機鹼性化合物,溶解成濃度為0.001~10質量%,較佳地為0.01~1質量%之鹼性水溶液。鹼性水溶液中,例如還能夠添加適量的甲醇及乙醇等水溶性有機溶劑和/或界面活性劑等。另外,作為顯影方法,例如,能夠利用旋覆浸沒顯影及噴淋顯影方法等。Examples of the alkaline aqueous solution include an inorganic developer and an organic developer. Examples of the inorganic developer include sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate, or sodium metasilicate, and the concentration thereof is 0.001 to 10% by mass, and preferably 0.01 to 1% by mass alkaline aqueous solution. Examples of the organic developer include ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline, pyrrole, piperidine, or 1,8- An organic basic compound such as diazabicyclo- [5.4.0] -7-undecene is dissolved into an alkaline aqueous solution having a concentration of 0.001 to 10% by mass, preferably 0.01 to 1% by mass. To the alkaline aqueous solution, for example, an appropriate amount of a water-soluble organic solvent such as methanol and ethanol and / or a surfactant can be added. In addition, as the development method, for example, a spin-on immersion development and a shower development method can be used.

<清洗製程> 清洗製程是藉由純水等對已顯影之硬化性組成物層進行清洗(沖洗)之製程。作為清洗方法,並無特別限制,能夠利用公知的清洗方法。<Washing Process> The washing process is a process of washing (rinsing) the developed curable composition layer with pure water or the like. The cleaning method is not particularly limited, and a known cleaning method can be used.

另外,上述硬化膜的製造方法可在上述顯影製程之後含有加熱硬化膜之後烘烤製程和/或對硬化膜進行整面曝光之硬化製程。In addition, the method for manufacturing a cured film may include a baking process after heating the cured film and / or a curing process of exposing the entire surface of the cured film after the development process.

含有上述硬化膜(黑矩陣)之彩色濾光片適於CCD圖像感測器和/或CMOS圖像感測器等固體攝像元件。尤其適於超過100萬像素之高解析度的CCD圖像感測器和/或CMOS圖像感測器等。亦即,含有上述硬化膜之彩色濾光片適於固體攝像元件。彩色濾光片可含有如下結構,亦即,在藉由隔壁例如分割成格子狀之空間,埋入有形成各顏色像素之硬化膜。 上述硬化膜(黑矩陣)例如配置於構成CCD圖像感測器和/或CMOS圖像感測器等之各像素的受光部與用於聚光的微透鏡之間。The color filter containing the hardened film (black matrix) is suitable for a solid-state imaging element such as a CCD image sensor and / or a CMOS image sensor. It is particularly suitable for high-resolution CCD image sensors and / or CMOS image sensors of more than 1 million pixels. That is, a color filter containing the cured film is suitable for a solid-state imaging element. The color filter may include a structure in which a hardened film forming each color pixel is embedded in a space partitioned into a grid shape by a partition wall, for example. The cured film (black matrix) is disposed, for example, between a light receiving portion of each pixel constituting a CCD image sensor and / or a CMOS image sensor, and a microlens for condensing light.

[固體攝像元件] 上述固體攝像元件含有上述硬化膜(黑矩陣)。固體攝像元件含有黑矩陣,而且,依據需要含有包含其他顏色(3色或者4色)的像素之圖案狀皮膜之彩色濾光片為較佳。 固體攝像元件只要含有上述黑矩陣且作為固體攝像元件發揮作用,則並無特別限制,例如,可舉出在基板上含有包含構成固體攝像元件(CCD圖像感測器及CMOS圖像感測器等)的受光區之複數個光電二極體及多晶矽等之受光元件,在基板的受光元件形成面的相反側的面含有上述黑矩陣之固體攝像元件。 彩色濾光片亦可具有如下結構,亦即,在藉由隔壁例如分割成格子狀之空間,埋入有形成各顏色像素之硬化膜。此時的隔壁相對於各顏色像素為低折射率為較佳。作為含有該種結構之固體攝像元件的例子,可舉出日本特開2012-227478號公報及日本特開2014-179577號公報中記載的固體攝像元件。[Solid-state imaging element] The solid-state imaging element includes the cured film (black matrix). The solid-state imaging device includes a black matrix, and a color filter including a patterned film including pixels of other colors (3 colors or 4 colors) as required. The solid-state imaging device is not particularly limited as long as it contains the black matrix and functions as a solid-state imaging device. For example, the solid-state imaging device may include a solid-state imaging device (CCD image sensor and CMOS image sensor) on the substrate. Etc.) A plurality of light-receiving elements, such as photodiodes and polycrystalline silicon, in the light-receiving area include a solid-state imaging element having the black matrix on a surface opposite to the light-receiving element formation surface of the substrate. The color filter may have a structure in which a hardened film forming each color pixel is embedded in a space partitioned into a grid shape by a partition wall, for example. It is preferable that the partition wall has a low refractive index for each color pixel. Examples of the solid-state imaging device including such a structure include the solid-state imaging devices described in Japanese Patent Application Laid-Open No. 2012-227478 and Japanese Patent Application Laid-Open No. 2014-179577.

[圖像顯示裝置] 上述硬化膜適於用於圖像顯示裝置(例如液晶顯示裝置及有機電致發光顯示裝置等)。[Image display device] The cured film is suitable for an image display device (for example, a liquid crystal display device and an organic electroluminescence display device).

對於圖像顯示裝置的定義及各圖像顯示裝置的詳細內容,例如記載於「電子顯示裝置(佐佐木 昭夫著、Kogyo Chosakai Publishing Co.,Ltd. 1990年發行)」及「顯示裝置(伊吹 順章著、產業圖書(株)平成元年發行)」等中。對於液晶顯示裝置,例如記載於「第二代液晶顯示器技術(內田 龍男編輯、Kogyo Chosakai Publishing Co.,Ltd. 1994年發行)」。上述硬化膜例如適於上述「第二代液晶顯示器技術」中記載之方式的液晶顯示裝置。The definition of image display devices and the details of each image display device are described in, for example, "Electronic Display Device (by Sasaki Akio, Kogyo Chosakai Publishing Co., Ltd. 1990)" and "Display Device (Ibuki Junaki Book, industry book (published in the 1st year of Heisei) ". The liquid crystal display device is described in, for example, "Second Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, Kogyo Chosakai Publishing Co., Ltd., 1994). The cured film is suitable for, for example, a liquid crystal display device according to the method described in the "second generation liquid crystal display technology".

作為含有上述硬化膜之液晶顯示裝置的一態様,例如,可舉出至少1個在光透射性的一對基板之間至少含有彩色濾光片、液晶層及液晶驅動機構(含有單純矩陣驅動方式及有源矩陣驅動方式)之液晶顯示裝置。上述液晶顯示裝置含有複數個像素組,構成該像素組之各像素含有相互藉由上述硬化膜(黑矩陣)分離之彩色濾光片。One aspect of a liquid crystal display device including the cured film includes, for example, at least one light filter having a color filter, a liquid crystal layer, and a liquid crystal driving mechanism (including a simple matrix driving method) between a pair of light-transmitting substrates. And active matrix driving method). The liquid crystal display device includes a plurality of pixel groups, and each pixel constituting the pixel group includes a color filter separated from each other by the hardened film (black matrix).

作為液晶顯示裝置的其他態様,至少1個在光透射性的一對基板之間至少含有彩色濾光片、液晶層及液晶驅動機構,液晶驅動機構含有有源元件(例如,TFT(Thin Film Transistor(薄膜電晶體))),且各有源元件之間包含含有上述硬化膜(黑矩陣)之彩色濾光片。As another aspect of the liquid crystal display device, at least one of the light-transmitting pair of substrates includes at least a color filter, a liquid crystal layer, and a liquid crystal driving mechanism. The liquid crystal driving mechanism includes an active element (for example, TFT (Thin Film Transistor) (Thin film transistor))), and each active element includes a color filter containing the above-mentioned cured film (black matrix).

含有上述硬化膜之彩色濾光片適於彩色TFT(Thin Film Transistor)方式的液晶顯示裝置。對於彩色TFT方式的液晶顯示裝置,例如記載於「彩色TFT液晶顯示器(KYORITSU SHUPPAN CO., LTD.1996年發行)」。而且,上述彩色濾光片還適於IPS(In Plane Switching(平面內切換))等橫向電場驅動方式;MVA(Multi-domain Vertical Alignment(多域垂直配向型))等像素分割方式;等視角被擴大之液晶顯示裝置、STN(Super-Twist Nematic(超扭曲向列))、TN(Twisted Nematic(扭曲向列))、VA(Vertical Alignment(垂直對齊))、OCS(on-chip spacer(片上間隔))、FFS(fringe field switching(邊緣場切換))及R-OCB(Reflective Optically Compensated Bend(反射光學補償彎曲))等。The color filter containing the cured film is suitable for a color TFT (Thin Film Transistor) liquid crystal display device. A color TFT-type liquid crystal display device is described in, for example, "color TFT liquid crystal display (KYORITSU SHUPPAN CO., LTD., 1996)". Moreover, the above color filters are also suitable for lateral electric field driving methods such as IPS (In Plane Switching); pixel division methods such as MVA (Multi-domain Vertical Alignment); etc. Expanded liquid crystal display devices, STN (Super-Twist Nematic), TN (Twisted Nematic), VA (Vertical Alignment), OCS (on-chip spacer) )), FFS (fringe field switching) and R-OCB (Reflective Optically Compensated Bend).

上述彩色濾光片適於明亮且高精細的COA(Color-filter On Array(彩色濾光片陣列))方式的液晶顯示裝置。關於COA方式的液晶顯示裝置,對於彩色濾光片之要求特性除了通常的要求特性以外,有時還要求對於層間絕緣膜之要求特性,亦即,低介電常數及剝離液耐性。含有上述彩色濾光片之COA方式的液晶顯示裝置具有更優異之解析度,或具有更優異之耐久性。另外,為了滿足低介電常數的要求特性,可在彩色濾光片層上進一步含有樹脂被膜。The color filter is suitable for a bright and high-definition COA (Color-filter On Array) type liquid crystal display device. In the liquid crystal display device of the COA method, the required characteristics for a color filter may require the required characteristics for an interlayer insulating film in addition to the usual required characteristics, that is, low dielectric constant and resistance to a peeling liquid. The COA-type liquid crystal display device including the color filter has more excellent resolution or more excellent durability. In addition, in order to meet the required characteristics of a low dielectric constant, a resin film may be further included on the color filter layer.

對於該些圖像顯示方式,例如記載於「EL、PDP、LCD顯示器-技術與市場的最新動向-(TORAY Research Center,Inc.調查研究部門2001年發行)」的43頁等。另外,上述中,EL表示Electroluminescence的簡稱, PDP表示Plasma Display Panel的簡稱,LCD表示liquid crystal display的簡稱。These image display methods are described in, for example, page 43 of "EL, PDP, LCD Display-Latest Trends in Technology and Market-(TORAY Research Center, Inc. Survey and Research Division 2001)". In the above, EL stands for Electroluminescence, PDP stands for Plasma Display Panel, and LCD stands for Liquid Crystal Display.

上述液晶顯示裝置除了上述彩色濾光片以外,由電極基板、偏光膜、相位差膜、背光、間隔物及視角保護膜等各種構件構成。上述彩色濾光片能夠適用於由該些公知構件構成之液晶顯示裝置。對於該些構件,例如記載於「’94液晶顯示器周邊材料・化學製品市場(島 健太郎CMC-Group. 1994年發行)」及「2003液晶関連市場的現狀與未來展望(下卷)(表良吉Fuji Chimera Research Institute, Inc.、2003年發行)」。 關於背光,記載於SID meeting Digest 1380(2005)(A.Konno et.al)和/或月刊顯示器2005年12月號的18~24頁(島 康裕)、記載於SID meeting Digest 1380(2005)25~30頁(八木隆明)等。The liquid crystal display device includes, in addition to the color filter, various members such as an electrode substrate, a polarizing film, a retardation film, a backlight, a spacer, and a viewing angle protective film. The above-mentioned color filter can be applied to a liquid crystal display device including these known members. These components are described in, for example, "'94 Liquid Crystal Display Peripheral Materials and Chemicals Market (Shimadaro CMC-Group. Issued in 1994)" and "2003 Status and Future Outlook of the Liquid Crystal Related Market (Vol. 2) (Table Ryoji Fuji Chimera Research Institute, Inc., 2003) ". The backlight is described in SID meeting Digest 1380 (2005) (A. Konno et.al) and / or Monthly Display December 2005, pages 18 to 24 (Island Kangyu), and SID meeting Digest 1380 (2005) 25 ~ 30 pages (Yaki Taki).

上述硬化膜適於個人計算機、平板電腦、行動電話、智慧型手機及數位相機等便攜式設備;多功能打印機及掃描儀等OA(Office Automation(辦公室自動化))設備;監視攝影機、條碼讀取器及自動存提款機(ATM:automated teller machine)、高速相機及使用人臉圖像認證之本人認證等產業用設備;車載用相機設備;內窺鏡、膠囊內窺鏡及導管等醫療用相機設備;生物體感測器、生物感測器(Biosensor)、軍事偵查用相機、立體地圖用相機、氣象及海洋觀測相機、陸地資源偵查相機、以及宇宙的天文及深空目標用勘探相機等航天設備等中使用之光學濾波器及模組的遮光構件及遮光層,進一步適於防反射構件以及防反射層。The hardened film is suitable for portable devices such as personal computers, tablets, mobile phones, smart phones, and digital cameras; OA (Office Automation) equipment such as multifunction printers and scanners; surveillance cameras, bar code readers, and Industrial teller machines such as automatic teller machine (ATM), high-speed cameras and personal authentication using face image authentication; camera equipment for vehicles; medical camera equipment such as endoscopes, capsule endoscopes, and catheters ; Space sensors such as biometric sensors, biosensors, military reconnaissance cameras, stereo map cameras, meteorological and ocean observation cameras, land resource reconnaissance cameras, and space astronomy and deep space target exploration cameras The light-shielding members and light-shielding layers of optical filters and modules used in such applications are further suitable for anti-reflection members and anti-reflection layers.

上述硬化膜還能夠使用於微型LED(Light Emitting Diode(發光二極體))及微型OLED(Organic Light Emitting Diode(有機發光二極體))等用途。上述硬化膜除了微型LED及微型OLED中使用之光學濾波器及光學薄膜以外,還適於賦予遮光功能或防反射功能之構件。 作為微型LED及微型OLED的例子,可舉出日本特表2015-500562號及日本特表2014-533890中記載者。The cured film can also be used in applications such as micro LED (Light Emitting Diode) and micro OLED (Organic Light Emitting Diode). In addition to the optical filters and optical films used in micro LEDs and micro OLEDs, the cured film is also suitable for members that provide a light-shielding function or an anti-reflection function. Examples of micro LEDs and micro OLEDs include those described in Japanese Patent Publication No. 2015-500562 and Japanese Patent Publication No. 2014-533890.

上述硬化膜適合作為量子點顯示器中使用之光學濾波器及光學薄膜。並且,上述硬化膜適合作為賦予遮光功能及防反射功能之構件。 作為量子點顯示器的例子,可舉出美國專利申請公開第2013/0335677號、美國專利申請公開第2014/0036536號、美國專利申請公開第2014/0036203號及美國專利申請公開第2014/0035960號中記載者。 [實施例]The cured film is suitable as an optical filter and an optical film used in a quantum dot display. The cured film is suitable as a member that provides a light shielding function and an antireflection function. Examples of quantum dot displays include U.S. Patent Application Publication No. 2013/0335677, U.S. Patent Application Publication No. 2014/0036536, U.S. Patent Application Publication No. 2014/0036203, and U.S. Patent Application Publication No. 2014/0035960 Recorder. [Example]

以下,依據實施例對本發明進行更詳細說明。以下實施例所示之材料、使用量、比例、處理內容、處理步驟等,可在不脫離本發明的宗旨之範圍內進行適當變更。故,並不藉由以下所示之實施例限定地解釋本發明的範圍。Hereinafter, the present invention will be described in more detail based on examples. The materials, usage amounts, proportions, processing contents, processing steps, and the like shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limitedly limited by the examples shown below.

〔著色劑〕 藉由以下方法製作了各著色劑。[Colorant] Each colorant was produced by the following method.

<含氮化鈦粒子(TiN-1)> 首先,將Ti粒子(TC-200、TOHO TECHNICAL SERVICE CO.,LTD.製造)在Ar氣中進行電漿處理,藉此進行了Ti奈米粒子化。將電漿處理之後的Ti奈米粒子在Ar氣氛圍下,在O2 濃度50ppm以下、30℃的條件下靜置了24小時。之後,以O2 濃度成為100ppm之方式,在Ar氛圍中導入有O2 氣之狀態下,在30℃下靜置了24小時(Ti粒子的前處理)。 之後,利用Hosokawa Micron Corporation製造的TTSP分離器,以產率成為10%之條件下,對所獲得之Ti奈米粒子進行分級,從而獲得了Ti粒子粉末。對於所獲得之粉末的一次粒徑,藉由TEM觀察,並藉由算術平均求出了100個粒子的平均粒徑,其結果為120nm。 利用依據國際公開第2010/147098的圖1中記載的黑色複合微粒製造裝置之裝置製造了含氮化鈦粒子TiN-1。 具體而言,黑色複合微粒製造裝置中,對電漿焰炬的高頻振蕩用線圈施加約4MHz及約80kVA的高頻電壓,從電漿氣體供給源,作為電漿氣體供給氬氣50L/min及氮50L/min的混合氣體,在電漿焰炬內產生氬-氮熱電漿火焰。從材料供給裝置的噴霧氣體供給源供給了10L/min的載體氣體。 對如上述那樣來獲得之Ti粒子,以各個質量比成為Ti/Fe/Si=餘量/0.05/0.05之方式,混合了Fe粉(JIP270M、JFE STEEL CORPORATION製造)及Si粉(Silicon powder SI006031)。將該混合物與作為載體氣體之氬氣一同供給至電漿焰炬內的熱電漿火焰中,使其在熱電漿火焰中蒸發,使其以氣相狀態高度分散。 並且,作為藉由氣體供給裝置供給至腔室內之氣體,使用了氮。此時的腔室內的流速設為5m/sec,供給量設為1,000L/min。並且,旋風分離器內的壓力設為50kPa,並且,各原料從腔室向旋風分離器的供給速度設為10m/s(平均值)。 如此獲得了含氮化鈦粒子TiN-1。<Titanium Nitride-Containing Particles (TiN-1)> First, Ti particles (TC-200, manufactured by TOHO TECHNICAL SERVICE CO., LTD.) Were subjected to a plasma treatment in Ar gas, thereby performing Ti nanoparticle granulation. . The Ti nano particles after the plasma treatment were allowed to stand for 24 hours in an Ar gas atmosphere under conditions of an O 2 concentration of 50 ppm or less and 30 ° C. After that, the O 2 concentration was set to 100 ppm, and the O 2 gas was introduced into the Ar atmosphere, and then left to stand at 30 ° C. for 24 hours (pretreatment of Ti particles). Then, using a TTSP separator manufactured by Hosokawa Micron Corporation, the obtained Ti nano particles were classified with a yield of 10%, thereby obtaining Ti particle powder. The primary particle diameter of the obtained powder was observed by TEM, and the average particle diameter of 100 particles was calculated by arithmetic mean. As a result, it was 120 nm. Titanium nitride-containing particles TiN-1 were produced using a device for producing a black composite fine particle according to FIG. 1 according to International Publication No. 2010/147098. Specifically, in a black composite particle manufacturing apparatus, a high-frequency voltage of about 4 MHz and about 80 kVA is applied to a high-frequency oscillation coil of a plasma torch, and 50 L / min of argon gas is supplied as a plasma gas from a plasma gas supply source. And nitrogen 50L / min mixed gas, argon-nitrogen plasma flame is generated in the plasma torch. A carrier gas of 10 L / min was supplied from a spray gas supply source of the material supply device. For the Ti particles obtained as described above, Fe powder (JIP270M, manufactured by JFE Steel Corporation) and Si powder (Silicon powder SI006031) were mixed so that each mass ratio became Ti / Fe / Si = balance / 0.05 / 0.05. . This mixture is supplied together with argon as a carrier gas into a thermoplasma flame in a plasma torch, and is allowed to evaporate in the thermoplasma flame to be highly dispersed in a gas phase state. Further, nitrogen was used as a gas supplied into the chamber by a gas supply device. The flow velocity in the chamber at this time was set to 5 m / sec, and the supply amount was set to 1,000 L / min. The pressure in the cyclone was set to 50 kPa, and the feed rate of each raw material from the chamber to the cyclone was set to 10 m / s (average value). In this way, TiN-1 containing titanium nitride particles was obtained.

對所獲得之含氮化鈦粒子TiN-1,藉由ICP發光分光分析法,測定了鈦(Ti)原子、鐵(Fe)原子及矽(Si)原子的含量。另外,ICP發光分光分析法中,利用了Seiko Instruments Inc.製造的ICP發光分光分析裝置「SPS3000」(商品名)。 利用HORIBA, Ltd.製造的氧・氮分析裝置「EMGA-620W/C」(商品名)測定並藉由惰性氣體熔融熱導法計算出了氮原子的含量。上述的結果,含氮化鈦粒子TiN中包含之各原子的質量比為Ti/N/Fe/Si=57/34/0.0030/0.0020。With respect to the obtained titanium nitride-containing particles TiN-1, the contents of titanium (Ti) atoms, iron (Fe) atoms, and silicon (Si) atoms were measured by ICP emission spectrometry. In the ICP emission spectroscopic analysis method, an ICP emission spectroscopic analysis device "SPS3000" (trade name) manufactured by Seiko Instruments Inc. was used. The nitrogen atom content was measured by an oxygen and nitrogen analyzer "EMGA-620W / C" (trade name) manufactured by HORIBA, Ltd. and calculated by an inert gas fusion thermal conductivity method. As a result of the above, the mass ratio of each atom contained in the titanium nitride-containing particles TiN was Ti / N / Fe / Si = 57/34 / 0.0030 / 0.0020.

關於含氮化鈦粒子TiN-1的X射線繞射,將粉末試樣填充於鋁製標準試樣保持器中,藉由廣角X射線繞射法(Rigaku Corporation製造、商品名「RU-200R」)進行測定。作為測定條件,X射線源設為CuKα射線,輸出設為50kV/200mA,狹縫系統設為1°-1°-0.15mm-0.45mm,測定步長(2θ)設為0.02°,掃描速度設為2°/分鐘。 並且,測定了在繞射角2θ(42.6°)附近觀察到之源自TiN(200)面之峰的繞射角2θ。而且,藉由該源自(200)面之峰的半寬度,利用謝勒(Scherrer)公式,求出了構成粒子之微晶尺寸。其結果,峰的繞射角為42.62°,微晶尺寸為10nm。另外,完全沒有觀察到TiO2 引起之X射線繞射峰。For X-ray diffraction of titanium nitride-containing particles TiN-1, a powder sample was filled in an aluminum standard sample holder, and a wide-angle X-ray diffraction method (manufactured by Rigaku Corporation, trade name "RU-200R") was used. ). As the measurement conditions, the X-ray source was set to CuKα rays, the output was set to 50kV / 200mA, the slit system was set to 1 ° -1 ° -0.15mm-0.45mm, the measurement step (2θ) was set to 0.02 °, and the scanning speed was set to 2 ° / min. Then, a diffraction angle 2θ of a peak originating from the TiN (200) surface observed near the diffraction angle 2θ (42.6 °) was measured. Then, the half-width of the peak originating from the (200) plane was used to determine the crystallite size of the particles using the Scherrer formula. As a result, the diffraction angle of the peak was 42.62 °, and the crystallite size was 10 nm. In addition, no X-ray diffraction peak caused by TiO 2 was observed at all.

<含氮化鈦粒子TiN-2> 作為Ti粒子,代替TOHO TECHNICAL SERVICE CO.,LTD.製造「TC-200」,使用Sigma-Aldrich Co. LLC. 製造「578347」,以各個質量比成為Ti/Fe/Si=餘量/0.5/1之方式,混合了Fe粉及Si粉,除此以外,以與TiN-1相同的方法獲得了含氮化鈦粒子TiN-2。 另外,藉由X射線繞射測定之峰的繞射角為42.81°,微晶尺寸為12nm。<Titanium nitride-containing particles TiN-2> As Ti particles, instead of "TC-200" manufactured by TOHO TECHNICAL SERVICE CO., LTD., And "578347" manufactured by Sigma-Aldrich Co. LLC. The method was the same as TiN-1 except that Fe / Si = remaining amount / 0.5 / 1 was mixed with Fe powder and Si powder, and TiN-2 containing titanium nitride particles was obtained. The diffraction angle of the peak measured by X-ray diffraction was 42.81 °, and the crystallite size was 12 nm.

<含氮化鈦粒子TiN-3> 以各個質量比成為Ti/Fe/Si=餘量/1/2之方式,混合了Fe粉及Si粉,除此以外,以與TiN-1相同的方法獲得了含氮化鈦粒子TiN-3。 另外,藉由X射線繞射測定之峰的繞射角為43.1°,微晶尺寸為12nm。<TiN-3 containing titanium nitride particles> The same method as TiN-1 is used except that Fe powder and Si powder are mixed so that each mass ratio becomes Ti / Fe / Si = balance / 1/2. TiN-3 containing titanium nitride particles was obtained. The diffraction angle of the peak measured by X-ray diffraction was 43.1 °, and the crystallite size was 12 nm.

<鈦黑A-1的製作> 將平均粒徑15nm的氧化鈦MT-150A(商品名、TAYCA CORPORATION製造)秤量100g,將BET(Brunauer,Emmett,Teller)比表面積300m2 /g的二氧化矽粒子AEROSIL300(註冊商標)300/30(Evonik Japan Co., Ltd.製造)秤量25g,及將Disperbyk190(商品名、BYK Chemie GmbH製造)秤量100g,將該些添加到離子電氣交換水71g中,從而獲得了混合物。之後,使用KURABO製造MAZERSTAR KK-400W,在公轉轉速1,360rpm、自轉轉速1,047rpm下,對混合物進行30分鐘的處理,藉此獲得了均勻的混合物水溶液。將該混合物水溶液填充於石英容器中,利用小型回轉爐(MOTOYAMA CO.,LTD製造),在氧氛圍中加熱至920℃。之後,以氮取代小型回轉爐內,在相同溫度下,使氨氣以100mL/min流動5小時,藉此實施了氮化還原處理。藉由乳鉢對結束後回收之粉末進行粉碎,獲得了包含Si原子且粉末狀的比表面積73m2 /g的鈦黑〔包含鈦黑粒子及Si原子之被分散體〕(以下,標記為「鈦黑A-1」)。<Production of Titanium Black A-1> A titanium oxide MT-150A (trade name, manufactured by TAYCA CORPORATION) with an average particle diameter of 15 nm was weighed to 100 g, and a BET (Brunauer, Emmett, Teller) specific surface area of 300 m 2 / g of silicon dioxide was weighed. Particles AEROSIL300 (registered trademark) 300/30 (manufactured by Evonik Japan Co., Ltd.) was weighed 25 g, and Disperbyk 190 (trade name, manufactured by BYK Chemie GmbH) was weighed 100 g, and these were added to 71 g of ion-exchange water, thereby A mixture was obtained. Then, MAZERSTAR KK-400W manufactured by KURABO was used, and the mixture was treated at a revolution speed of 1,360 rpm and a rotation speed of 1,047 rpm for 30 minutes to obtain a homogeneous aqueous solution of the mixture. This mixture aqueous solution was filled in a quartz container, and heated to 920 ° C. in an oxygen atmosphere using a small rotary furnace (manufactured by MOTOYAMA CO., LTD). Thereafter, the inside of the small rotary furnace was replaced with nitrogen, and ammonia gas was flowed at 100 mL / min for 5 hours at the same temperature, thereby performing a nitriding reduction treatment. The powder recovered after completion was pulverized in a mortar to obtain titanium black [a dispersion containing titanium black particles and Si atoms] containing powdered specific surface area of 73 m 2 / g containing Si atoms (hereinafter, designated as "titanium Black A-1 ").

<含有Fe原子之含氮化鈮粒子(NbN)的製作> 藉由以下方法製作了含有Fe原子之含氮化鈮粒子。 首先,準備Mitsuwa Chemicals Co.,Ltd製造鈮(粉末)<100-325mesh>作為原料(以下,還稱作「金屬原料粉末」。)。 接著,將上述金屬原料粉末在Ar氣體中進行電漿處理,藉此進行了Nb奈米粒子化。上述電漿處理的條件依照下述電漿處理(1)。<Production of Fe atom-containing niobium nitride-containing particles (NbN)> Niobium nitride-containing particles containing Fe atoms were produced by the following method. First, niobium (powder) <100-325mesh> manufactured by Mitsuwa Chemicals Co., Ltd was prepared as a raw material (hereinafter, also referred to as "metal raw material powder"). Next, the metal raw material powder was subjected to a plasma treatment in Ar gas, thereby performing Nb nanoparticle granulation. The conditions of the above-mentioned plasma treatment are in accordance with the following plasma treatment (1).

(電漿處理(1)) 藉由以下方法進行了電漿處理(1)。利用依據上述黑色複合微粒製造裝置之裝置,藉由以下條件進行了電漿處理(1)。 ・施加於高頻振蕩用線圈之高頻電壓:頻率 約4MHz、電壓 約80kVA ・電漿氣體:氬氣(供給量 100L/min) ・載體氣體:氬氣(供給量 10L/min) ・腔室內氛圍:氬氣(供給量 1,000L/min、腔室內流速 5m/sec) ・旋風分離器內氛圍:氬氣、內壓 50kPa ・從腔室向旋風分離器的材料供給速度:10m/s(平均值)(Plasma Treatment (1)) The plasma treatment (1) was performed by the following method. Using the apparatus based on the above-mentioned black composite particle manufacturing apparatus, plasma treatment was performed under the following conditions (1).・ High-frequency voltage applied to the coil for high-frequency oscillation: frequency about 4MHz, voltage about 80kVA ・ plasma gas: argon (supply amount 100L / min) ・ carrier gas: argon (supply amount 10L / min) ・ in the chamber Atmosphere: Argon (supply amount 1,000L / min, flow velocity in the chamber 5m / sec) • Atmosphere in cyclone separator: argon, internal pressure 50kPa • Material supply speed from the chamber to the cyclone separator: 10m / s (average value)

接著,準備Fe粉(JIP270M、JFE STEEL CORPORATION製造),藉由電漿處理(1)的條件進行電漿處理,從而進行了Fe奈米粒子化。Next, Fe powder (JIP270M, manufactured by JFE Steel Corporation) was prepared, and plasma treatment was performed under the conditions of the plasma treatment (1) to perform Fe nanoparticle granulation.

接著,混合藉由上述來獲得之Nb奈米粒子及Fe奈米粒子,從而獲得了原料金屬粉末。對該原料金屬粉末,在氮氣中進行電漿處理,藉此獲得了含氮化鈮粒子。上述電漿處理的條件依照下述的電漿處理(2)。Next, the Nb nano particles and Fe nano particles obtained as described above were mixed to obtain a raw metal powder. This raw metal powder was subjected to a plasma treatment in nitrogen to obtain niobium nitride-containing particles. The conditions of the above-mentioned plasma treatment are in accordance with the following plasma treatment (2).

(電漿處理(2)) 藉由以下方法進行了電漿處理(2)。另外,裝置利用了與電漿處理(1)相同者。 ・施加於高頻振蕩用線圈之高頻電壓:頻率 約4MHz、電壓 約80kVA ・電漿氣體:氬氣及氮氣(供給量 分別為50L/min) ・載體氣體:氮氣(供給量 10L/min) ・腔室內氛圍:氮氣(供給量 1,000L/min、腔室內流速 5m/sec) ・旋風分離器內氛圍:氮氣、內壓 50kPa ・從腔室向旋風分離器的材料供給速度:10m/s(平均值)(Plasma treatment (2)) Plasma treatment (2) was performed by the following method. The device uses the same one as the plasma treatment (1).・ High-frequency voltage applied to the coil for high-frequency oscillation: frequency is about 4MHz, voltage is about 80kVA ・ plasma gas: argon and nitrogen (supply amounts are 50L / min) ・ carrier gas: nitrogen (supply amount: 10L / min)・ Atmosphere in the chamber: Nitrogen (supply amount 1,000L / min, flow velocity in the chamber 5m / sec) ・ Atmosphere in the cyclone: Nitrogen, internal pressure 50kPa ・ Supply rate of material from the chamber to the cyclone: 10m / s ( average value)

將結束電漿處理(2)後的粒子,利用Ar氣,藉由NIHON SHINTECH CO.,LTD.製造分流型濕度供給裝置SRH,以在大氣中成為相對濕度95%之條件,導入20℃的氮氣,並靜置了24小時。之後,利用Hosokawa Micron Corporation製造TTSP分離器,以產率成為10%之條件,對所獲得之粒子進行分級,從而獲得了含氮化鈮粒子(NbN)。另外,向分離器供給了氮氣。 對所獲得之含氮化鈮粒子,藉由ICP發光分光分析法測定了鐵(Fe)原子的含量,其結果為50質量ppm。The particles after the plasma treatment (2) were finished, Ar gas was used, and a split-type humidity supply device SRH was manufactured by NIHON SHINTECH CO., LTD. To introduce 95% relative humidity in the atmosphere, and nitrogen at 20 ° C was introduced. And let stand for 24 hours. Thereafter, a TTSP separator manufactured by Hosokawa Micron Corporation was used to classify the obtained particles under the condition that the yield was 10%, thereby obtaining niobium nitride-containing particles (NbN). In addition, nitrogen was supplied to the separator. The content of iron (Fe) atoms in the obtained niobium nitride-containing particles was measured by ICP emission spectrophotometry, and it was 50 mass ppm.

<含有Fe原子之含氮化釩粒子(VN)的製作> 在含有Fe原子之含氮化鈮粒子的製作中,代替Mitsuwa Chemicals Co.,Ltd製造鈮(粉末)<100-325mesh>,使用了TAIYO KOKO Co., LTD.製造金屬釩粉末VHO,除此以外,藉由相同的方法製作了含有Fe原子之含氮化釩粒子(VN)。對所獲得之含氮化釩粒子,藉由ICP發光分光分析法測定了鐵(Fe)原子的含量,其結果為50質量ppm。<Production of Fe atom-containing vanadium nitride-containing particles (VN)> In the production of Fe atom-containing niobium nitride-containing particles, Niobium (powder) <100-325mesh> manufactured by Mitsuwa Chemicals Co., Ltd was used. A vanadium nitride-containing particle (VN) containing Fe atoms was produced by the same method except that metal vanadium powder VHO was produced by TAIYO KOKO Co., LTD. The content of iron (Fe) atoms in the obtained vanadium nitride-containing particles was measured by ICP emission spectrometry, and the result was 50 mass ppm.

〔多官能硫醇化合物〕 作為多官能硫醇化合物,使用了以下的SH-4、SH-3、SH-2。[Polyfunctional thiol compound] As the polyfunctional thiol compound, the following SH-4, SH-3, and SH-2 were used.

・SH-4(季戊四醇四(3-巰基丙酸酯),相當於4官能硫醇化合物。) 【化學式28】 ・ SH-4 (Pentaerythritol tetra (3-mercaptopropionate), which is equivalent to a 4-functional thiol compound.) [Chemical Formula 28]

・SH-3(三羥甲基丙烷三(3-巰基丙酸酯),相當於3官能硫醇化合物。) 【化學式29】 ・ SH-3 (trimethylolpropane tri (3-mercaptopropionate), which is equivalent to a trifunctional thiol compound.) [Chemical Formula 29]

・SH-2(1,4丁二醇雙(巰基乙酸酯),相當於2官能硫醇化合物。) 【化學式30】 ・ SH-2 (1,4 butanediol bis (thioglycolate), which is equivalent to a bifunctional thiol compound.) [Chemical Formula 30]

〔分散劑〕 作為分散劑,使用了以下結構的分散劑A。各結構單元中記載的數值表示各結構單元相對於所有結構單元的質量%。[Dispersant] As the dispersant, a dispersant A having the following structure was used. The numerical value described in each structural unit represents the mass% of each structural unit with respect to all structural units.

・分散劑A 【化學式31】 ・ Dispersant A [Chemical Formula 31]

〔黏結樹脂〕 作為黏結樹脂,使用了以下的樹脂A。各結構單元中記載的數值表示各結構單元相對於所有結構單元的莫耳%。另外,樹脂A的式中,各略號表示以下。 BzMA:甲基丙烯酸芐酯 MMA:甲基丙烯酸甲酯[Adhesive resin] As the adhesive resin, the following resin A was used. The numerical value described in each structural unit represents the mole percentage of each structural unit with respect to all structural units. In the formula of Resin A, each abbreviation indicates the following. BzMA: benzyl methacrylate MMA: methyl methacrylate

・樹脂A 【化學式32】 ・ Resin A [Chemical Formula 32]

〔聚合性化合物〕 ・聚合性化合物M1:二季戊四醇六丙烯酸酯(Nippon Kayaku Co.,Ltd.製造、商品名「KAYARAD」、參閱下述式) 【化學式33】 [Polymerizable Compound]-Polymerizable Compound M1: Dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd., trade name "KAYARAD", see formula below) [Chemical Formula 33]

〔光聚合起始劑〕 ・OXE-01:Irgacure OXE01(商品名、BASF JAPAN LTD.製造) 【化學式34】 [Photopolymerization initiator]-OXE-01: Irgacure OXE01 (trade name, manufactured by BASF JAPAN LTD.) [Chemical Formula 34]

・OXE-02:Irgacure OXE02(商品名、BASF JAPAN LTD.製造) 【化學式35】 ・ OXE-02: Irgacure OXE02 (trade name, manufactured by BASF JAPAN LTD.) [Chemical Formula 35]

・PI-3:具有下述結構之光聚合起始劑・ PI-3: Photopolymerization initiator with the following structure

【化學式36】 [Chemical Formula 36]

・NCI-831(商品名、ADEKA CORPORATION製造) 【化學式37】 ・ NCI-831 (trade name, manufactured by ADEKA CORPORATION) [Chemical Formula 37]

・IRG-379:IRGACURE 379(商品名、BASF JAPAN LTD.製造) 【化學式38】 ・ IRG-379: IRGACURE 379 (trade name, manufactured by BASF JAPAN LTD.) [Chemical Formula 38]

〔聚合抑制劑〕 Ih-1:4-甲氧基苯酚 Ih-2:2,6-二-第三丁基-4-甲基苯酚 Ih-3:4-羥基-2,2,6,6-四甲基哌啶 1-氧基 自由基[Polymerization inhibitor] Ih-1: 4-methoxyphenol Ih-2: 2,6-di-tertiary-butyl-4-methylphenol Ih-3: 4-hydroxy-2, 2, 6, 6 -Tetramethylpiperidine 1-oxyl radical

〔界面活性劑〕 ・F-1:以下述式表示之化合物(重量平均分子量(Mw)=15,311) 其中,下述式中,以式(A)及(B)表示之結構單元分別為62莫耳%、38莫耳%。以式(B)表示之結構單元中,a、b、c分別滿足a+c=14、b=17的關係。[Surfactant] ・ F-1: Compound represented by the following formula (weight average molecular weight (Mw) = 15,311) In the following formula, the structural units represented by formulas (A) and (B) are 62 mole%, 38 mole%. In the structural unit represented by formula (B), a, b, and c satisfy the relationships of a + c = 14 and b = 17, respectively.

【化學式39】 [Chemical Formula 39]

〔有機溶劑〕 ・PGMEA:丙二醇單甲醚乙酸酯 ・環戊酮 ・乙酸丁酯[Organic solvents] • PGMEA: propylene glycol monomethyl ether acetate • Cyclopentanone • Butyl acetate

[著色劑分散液的製備] 首先,利用攪拌機(IKA公司製造EUROSTAR),將著色劑、分散劑及有機溶劑混合15分鐘,從而獲得了上述成分的混合液。接著,對所獲得之混合液,使用SHINMARU ENTERPRISES CORPORATION製造的NPM-Pilot,在下述條件下進行分散處理,從而獲得了著色劑分散液。[Preparation of Colorant Dispersion Liquid] First, a coloring agent, a dispersant, and an organic solvent were mixed for 15 minutes using a stirrer (EURO manufactured by IKA Corporation) to obtain a mixed liquid of the above components. Next, the obtained mixed liquid was subjected to a dispersion treatment under the following conditions using NPM-Pilot manufactured by SHINMARU ENTERPRISES CORPORATION to obtain a colorant dispersion liquid.

<分散條件> ・珠徑:φ0.05mm、(NIKKATO CORPORATION製造氧化鋯珠、YTZ) ・珠填充率:65體積% ・研磨圓周速度:10m/sec ・分離器圓周速度:13m/s ・進行分散處理之混合液量:15kg ・循環流量(泵供給量):90kg/hour ・處理液溫度:19~21℃ ・冷卻水:水 ・處理時間:22小時左右<Dispersion conditions> ・ Bead diameter: φ0.05mm, (zirconia beads manufactured by NIKKATO CORPORATION, YTZ) ・ Bead filling rate: 65% by volume ・ Grinding peripheral speed: 10m / sec ・ Separator peripheral speed: 13m / s ・ Dispersion Amount of mixed liquid to be processed: 15kg • Circulating flow rate (supply amount of pump): 90kg / hour • Temperature of processing liquid: 19 to 21 ° C • Cooling water: water • Processing time: about 22 hours

[硬化性組成物的製備] 接著,混合、攪拌上述著色劑分散液、多官能硫醇化合物、黏結樹脂、聚合性化合物、聚合起始劑、聚合抑制劑及界面活性劑,獲得了下述表1-1、表1-2及表2所示之實施例及比較例的各硬化性組成物。另外,表1-1、表1-2及表2中的各成分的含量均為質量%。 另外,以各硬化性組成物的最終固體成分成為表1-1、表1-2及表2中記載之固體成分濃度之方式,用有機溶劑進行了調整。並且,以各硬化性組成物中的質量比成為PGMEA/乙酸丁酯/環己酮=27/18/27之方式,同時使用了有機溶劑。[Preparation of hardenable composition] Next, the above-mentioned colorant dispersion liquid, polyfunctional thiol compound, adhesive resin, polymerizable compound, polymerization initiator, polymerization inhibitor, and surfactant were mixed and stirred to obtain the following table. Each of the curable compositions of Examples and Comparative Examples shown in 1-1, Tables 1-2, and Table 2 was used. In addition, the content of each component in Table 1-1, Table 1-2, and Table 2 is mass%. Moreover, it adjusted with the organic solvent so that the final solid content of each hardenable composition might become the solid content concentration shown in Table 1-1, Table 1-2, and Table 2. An organic solvent was also used so that the mass ratio in each curable composition was PGMEA / butyl acetate / cyclohexanone = 27/18/27.

[評價] 對實施例及比較例的各硬化性組成物,進行了以下的各評價試驗。將結果綜合示於表1-1及表1-2。[Evaluation] The following evaluation tests were performed on each curable composition of Examples and Comparative Examples. The results are shown in Table 1-1 and Table 1-2.

〔OD值〕 在厚度0.7mm、10cm見方的玻璃板(EagleXG,Corning Incorporated製造)上,使用各硬化性組成物,藉由旋轉塗佈形成了塗膜。此時,調整轉速,以獲得膜厚1.5μm的硬化膜。將所形成之塗膜,在加熱板上藉由100℃、2分鐘的熱處理使其乾燥,以500mJ/cm2 的曝光量進行曝光,從而獲得了硬化膜。對於含有所獲得之硬化膜之玻璃基板,藉由分光光度計U-4100(Hitachi High-Technologies Corporation.製造)測定了OD值。OD值越大,硬化膜越具有優異之遮光性。將結果綜合示於表1-1、表1-2及表2。 另外,表1-1、表1-2及表2所示之OD值是波長400~800nm下的最小值。亦即,各實施例的硬化膜(膜厚1.5μm)在波長400~800nm的整個區域中具有表1-1、表1-2及表2所示之OD值以上的OD值。[OD value] A coating film was formed by spin coating on a glass plate (EagleXG, manufactured by Corning Incorporated) with a thickness of 0.7 mm and 10 cm square, using each curable composition. At this time, the rotation speed was adjusted to obtain a cured film having a film thickness of 1.5 μm. The formed coating film was dried on a hot plate by heat treatment at 100 ° C. for 2 minutes, and exposed at an exposure amount of 500 mJ / cm 2 to obtain a cured film. The OD value of the glass substrate containing the obtained cured film was measured with a spectrophotometer U-4100 (manufactured by Hitachi High-Technologies Corporation.). The larger the OD value, the more excellent the light-shielding property of the cured film. The results are shown in Table 1-1, Table 1-2, and Table 2. The OD values shown in Tables 1-1, 1-2, and 2 are the minimum values at a wavelength of 400 to 800 nm. That is, the cured film (film thickness of 1.5 μm) of each example has an OD value greater than or equal to the OD values shown in Table 1-1, Table 1-2, and Table 2 over the entire region of a wavelength of 400 to 800 nm.

〔圖案形狀〕 在Si基板上,使用各硬化性組成物,以可獲得膜厚1.5μm的硬化膜之方式調整轉速,藉由旋塗法形成了塗膜。將所形成之塗膜,在加熱板上藉由100℃、2分鐘的熱處理使其乾燥,從而獲得了硬化膜。對含有所獲得之硬化膜之Si基板,對上述預烘烤後的附帶塗膜的基板,利用i射線步進機(Canon Inc.製造FPA3000i5+),通過形成有長度200μm×寬度20μm的線圖案之光罩,以表中記載的曝光量,對上述塗膜進行了曝光。將曝光後的塗膜,藉由Tokyo Electron Limited製造的Coater Developer ACT8,作為顯影液,使用氫氧化四甲基銨,進行了30秒的旋覆浸沒顯影。顯影後藉由純水進行了20秒的噴淋沖洗處理。對顯影後的塗膜進行了後烘烤(溫度:220℃、時間:300秒)。藉由測長SEM(Scanning Electron Microscope(掃描型電子顯微鏡))測定了後烘烤後的塗膜的圖案形狀。具體而言,測定線圖案端部的膜厚與中央部的膜厚,計算出比(圖案端部的膜厚/中央部的膜厚),並依據以下基準進行了評價。將結果綜合示於表1-1、表1-2及表2。另外,評價「2」以上為實際使用範圍。 ・7:比超過0.98且1.00以下,基於SEM之觀察中觀察不到圖案中央部與端部的膜厚上存在差。 ・6:比超過0.96且0.98以下,可觀察到圖案中央部與端部的膜厚上存在微小的差。 ・5:比超過0.94且0.96以下,可觀察到圖案中央部與端部的膜厚上存在差。 ・4:比超過0.92且0.94以下,端部的膜厚較薄,且產生微小的變形,但為實際使用上不成問題之級別。 ・3:比超過0.90且0.92以下,端部的膜厚較薄,且產生變形,但為實際使用上不成問題之級別。 ・2:比超過0.80且0.90以下,端部的膜厚較薄,但為可實際使用之級別。 ・1:比為0.80以下,端部的膜厚較薄,為容許範圍之外。[Pattern shape] A coating film was formed by a spin coating method by adjusting the rotational speed so that a cured film having a film thickness of 1.5 μm was obtained using each curable composition on a Si substrate. The formed coating film was dried on a hot plate by a heat treatment at 100 ° C for 2 minutes to obtain a cured film. For the Si substrate containing the obtained cured film, and for the substrate with a coating film after the pre-baking described above, an i-ray stepper (FPA3000i5 + manufactured by Canon Inc.) was used to form a 200 μm × 20 μm line pattern The photomask was exposed to the above-mentioned coating film at the exposure amounts described in the table. The coated film after exposure was subjected to spin-on immersion development using Coater Developer ACT8 manufactured by Tokyo Electron Limited as a developing solution using tetramethylammonium hydroxide for 30 seconds. After the development, a spray rinse process was performed with pure water for 20 seconds. The developed coating film was post-baked (temperature: 220 ° C, time: 300 seconds). The pattern shape of the coating film after the post-baking was measured by a scanning electron microscope (Scanning Electron Microscope). Specifically, the film thickness at the end portion of the line pattern and the film thickness at the center portion were measured, and the ratio (film thickness at the end portion of the pattern / film thickness at the center portion) was calculated and evaluated based on the following criteria. The results are shown in Table 1-1, Table 1-2, and Table 2. In addition, the evaluation "2" or more is a practical use range. • 7: When the ratio exceeds 0.98 and 1.00 or less, no difference in film thickness between the central portion and the end portion of the pattern is observed in the observation by SEM.・ 6: When the ratio exceeds 0.96 to 0.98, a slight difference in film thickness between the central portion and the end portion of the pattern is observed.・ 5: When the ratio exceeds 0.94 to 0.96, a difference in film thickness between the central portion and the end portion of the pattern is observed.・ 4: When the ratio exceeds 0.92 and 0.94 or less, the film thickness at the end portion is thin and slight deformation occurs, but it is a level that is not a problem in practical use.・ 3: When the ratio exceeds 0.90 and 0.92 or less, the thickness of the end portion is thin and deformed, but it is a level that is not a problem in practical use.・ 2: When the ratio exceeds 0.80 and 0.90 or less, the film thickness at the end is thin, but it is a level that can be used practically.・ 1: The ratio is 0.80 or less, and the film thickness at the end is thin, which is outside the allowable range.

〔經時穩定性〕 將製備後的各硬化性組成物密封於100cc的布魯姆瓶中,在45℃的恆溫槽中保管了7天。之後,以與上述相同的方法進行了圖案形狀的評價。將結果示於表2。[Stability over time] Each of the hardenable compositions after the preparation was sealed in a 100 cc Bloom bottle, and stored in a thermostat at 45 ° C. for 7 days. Thereafter, the pattern shape was evaluated by the same method as described above. The results are shown in Table 2.

[表1-1] [Table 1-1]

[表1-2] [Table 1-2]

[表2] [Table 2]

依據表1-1及表1-2所示之結果,各實施例的硬化性組成物是含有著色劑、光聚合起始劑、聚合性化合物及多官能硫醇化合物之硬化性組成物,使硬化性組成物硬化來獲得之硬化膜在可見光區域中的每1.5μm的膜厚的光學濃度為4.0以上,使各實施例的硬化性組成物硬化來獲得之硬化膜具有優異之圖案形狀。而比較例的硬化性組成物並不具有所希望的效果。 著色劑的含量相對於硬化性組成物的總固體成分為55質量%以上之實施例48的硬化性組成物,與分散劑的含量為相同程度且著色劑的含量為53%之實施例49的硬化性組成物相比,所獲得之硬化物的圖案形狀更優異。 多官能硫醇化合物的含量相對於著色劑的含量為1~5.5質量%之實施例1、實施例2及實施例3的硬化性組成物,與實施例4的硬化性組成物相比,所獲得之硬化物的圖案形狀更優異。 作為聚合抑制劑含有2種以上的酚系化合物之實施例45的硬化性組成物,與實施例36的硬化性組成物相比,以更低的曝光量硬化且硬化物的圖案形狀優異。 作為聚合抑制劑含有酚系化合物及受阻胺系化合物之實施例46的硬化性組成物,與實施例36的硬化性組成物相比,以更低的曝光量硬化且硬化物的圖案形狀優異。 多官能硫醇化合物為3官能之實施例5的硬化性組成物,與實施例9的硬化性組成物相比,硬化物的圖案形狀更優異。 多官能硫醇化合物為4官能之實施例1的硬化性組成物,與實施例9及實施例5的硬化性組成物相比,硬化物的圖案形狀更優異。 光聚合起始劑為肟化合物之實施例34的硬化性組成物,與實施例25的硬化性組成物相比,硬化物的圖案形狀更優異。 光聚合起始劑的含量相對於硬化性組成物的總固體成分超過1質量%且小於10質量%之實施例13及實施例48的硬化性組成物,與實施例50及實施例51的硬化性組成物相比,硬化物的圖案形狀更優異。 聚合性化合物的含量相對於硬化性組成物的總固體成分超過3.5質量%且小於20質量%之實施例13及實施例48的硬化性組成物,與實施例50及實施例51的硬化性組成物相比,硬化物的圖案形狀更優異。 分散劑的含量為17質量%以上之實施例2及實施例48的硬化性組成物,與實施例13及實施例54的硬化性組成物相比,硬化物的圖案形狀更優異。Based on the results shown in Tables 1-1 and 1-2, the curable composition of each example is a curable composition containing a colorant, a photopolymerization initiator, a polymerizable compound, and a polyfunctional thiol compound. The optical density of the cured film obtained by curing the curable composition per 1.5 μm in the visible light region is 4.0 or more. The cured film obtained by curing the curable composition of each example has an excellent pattern shape. On the other hand, the curable composition of the comparative example does not have a desired effect. The hardening composition of Example 48 in which the content of the coloring agent was 55 mass% or more with respect to the total solid content of the hardening composition was the same as that in the dispersant and the content of the coloring agent in Example 49 was 53% The pattern shape of the obtained hardened | cured material is more excellent than a hardenable composition. The curable compositions of Example 1, Example 2 and Example 3 in which the content of the polyfunctional thiol compound is 1 to 5.5% by mass based on the content of the colorant are higher than those of the curable composition of Example 4. The pattern shape of the obtained hardened | cured material was more excellent. The curable composition of Example 45 containing two or more phenolic compounds as a polymerization inhibitor hardened at a lower exposure amount than the curable composition of Example 36, and the pattern shape of the cured product was excellent. The curable composition of Example 46 containing a phenol-based compound and a hindered amine-based compound as a polymerization inhibitor was cured at a lower exposure than the curable composition of Example 36, and the pattern shape of the cured product was excellent. The polyfunctional thiol compound was a trifunctional curable composition of Example 5, and the pattern shape of the cured product was more excellent than that of the curable composition of Example 9. The polyfunctional thiol compound is a four-functional curable composition of Example 1, and the pattern shape of the cured product is more excellent than that of the curable compositions of Examples 9 and 5. The photopolymerization initiator was the curable composition of Example 34, which was an oxime compound, and the pattern shape of the cured product was more excellent than that of the curable composition of Example 25. The hardening composition of Examples 13 and 48 of the content of the photopolymerization initiator with respect to the total solid content of the hardening composition of more than 1% by mass and less than 10% by mass, and the hardening of Examples 50 and 51 The pattern shape of the cured product is more excellent than that of the sexual composition. The hardenable composition of Examples 13 and 48 of the content of the polymerizable compound with respect to the total solid content of the hardenable composition is more than 3.5% by mass and less than 20% by mass, and the hardenable composition of Examples 50 and 51 The pattern shape of the cured product is more excellent than that of the cured product. The curable compositions of Examples 2 and 48 in which the content of the dispersant was 17% by mass or more were more excellent in the pattern shape of the cured product than the curable compositions of Examples 13 and 54.

實施例1中,未使用界面活性劑F-1,除此以外,以相同的方法製備硬化性組成物,並用此進行了評價。評價結果,得知可獲得與實施例1相同的結果。Except that the surfactant F-1 was not used in Example 1, a curable composition was prepared by the same method and evaluated using this. As a result of the evaluation, it was found that the same results as in Example 1 were obtained.

[碳黑分散物(CB分散液)的製備與硬化性組成物的評價] 上述的著色劑分散液的製備中,將著色劑設為碳黑(商品名「Color Black S170」、Degussa-Hüls AG製造、平均一次粒徑17nm、BET比表面積200m2 /g、藉由氣黑方式製造之碳黑),除此以外,藉由相同的方法獲得了碳黑分散物(CB分散液)。[Preparation of Carbon Black Dispersion (CB Dispersion) and Evaluation of Hardening Composition] In the preparation of the above-mentioned coloring agent dispersion, carbon black (trade name "Color Black S170", Degussa-Hüls AG A carbon black dispersion (CB dispersion liquid) was obtained by the same method except for manufacturing, carbon black having an average primary particle diameter of 17 nm, a BET specific surface area of 200 m 2 / g, and a gas black method.

實施例1的硬化性組成物的製備中,代替以硬化性組成物中含有58質量%的含氮化鈦粒子TiN-1之方式添加之著色劑分散液,使用了含有含氮化鈦粒子TiN-1之著色劑分散液與上述CB分散液的混合物(硬化性組成物中的含氮化鈦粒子TiN-1:硬化性組成物中的碳黑=45:13(質量比)、上述硬化性組成物中的含氮化鈦粒子TiN-1與碳黑的合計含量為58質量%。),除此以外,以相同的方法製備硬化性組成物,並用此進行了評價。評價結果,得知可獲得與實施例1相同的遮光性、圖案形狀。In the preparation of the curable composition of Example 1, instead of the colorant dispersion liquid added so that the curable composition contained 58% by mass of titanium nitride-containing particles TiN-1, TiN containing titanium nitride-containing particles was used. -1 mixture of the colorant dispersion liquid and the CB dispersion liquid (titanium nitride-containing particles in the hardenable composition TiN-1: carbon black in the hardenable composition = 45:13 (mass ratio), the hardenability Except that the total content of the titanium nitride-containing particles TiN-1 and carbon black in the composition was 58% by mass.), A hardenable composition was prepared by the same method and evaluated using this. As a result of the evaluation, it was found that the same light-shielding property and pattern shape as in Example 1 were obtained.

[彩色顏料分散物(PY分散液)的製備與硬化性組成物的評價] 上述著色劑分散液的製備中,將著色劑設為顏料黃150(Hangzhou Star-up Pigment Co., Ltd.製造、商品名6150顔料黄5GN),除此以外,藉由相同的方法獲得了彩色顏料分散物(PY分散液)。[Preparation of Color Pigment Dispersion (PY Dispersion) and Evaluation of Hardening Composition] In the preparation of the above-mentioned colorant dispersion, the colorant was Pigment Yellow 150 (manufactured by Hangzhou Star-up Pigment Co., Ltd., A color pigment dispersion (PY dispersion liquid) was obtained by the same method except that the product name was 6150 Pigment Yellow 5GN).

實施例1的硬化性組成物的製備中,代替以硬化性組成物中含有58質量%的含氮化鈦粒子TiN-1之方式添加之著色劑分散液,使用了含有含氮化鈦粒子TiN-1之著色劑分散液與上述PY分散液的混合物(硬化性組成物中的含氮化鈦粒子TiN-1:硬化性組成物中的顏料黃150=45:13(質量比)、硬化性組成物中的含氮化鈦粒子TiN-1與顏料黃150的合計含量為58質量%。),除此以外,以相同的方法製備硬化性組成物,並用此進行了評價。評價結果,得知可獲得與實施例1相同的遮光性與圖案形狀,可獲得黑色更濃之膜。In the preparation of the curable composition of Example 1, instead of the colorant dispersion liquid added so that the curable composition contained 58% by mass of titanium nitride-containing particles TiN-1, TiN containing titanium nitride-containing particles was used. -1 mixture of the colorant dispersion liquid and the PY dispersion liquid (containing titanium nitride particles in the hardenable composition TiN-1: Pigment Yellow in the hardenable composition 150 = 45: 13 (mass ratio), hardenability The total content of the titanium nitride-containing particles TiN-1 and Pigment Yellow 150 in the composition was 58% by mass.) Except that, a hardenable composition was prepared by the same method and evaluated using this. As a result of the evaluation, it was found that the same light-shielding property and pattern shape as in Example 1 can be obtained, and a film having a thicker black can be obtained.

[彩色顏料分散物(PR分散液)的製備] 上述著色劑分散液的製備中,將著色劑設為C.I.Pigment Red 254(Ciba Specialty Chemicals製造),除此以外,藉由相同的方法獲得了彩色顏料分散物(PR分散液)。[Preparation of Color Pigment Dispersion (PR Dispersion Liquid)] In the preparation of the above-mentioned colorant dispersion liquid, except that the colorant was CIPigment Red 254 (manufactured by Ciba Specialty Chemicals), a color was obtained by the same method. Pigment dispersion (PR dispersion).

[彩色顏料分散物(PB分散液)的製備] 上述著色劑分散液的製備中,將著色劑設為C.I.Pigment Blue 15:6(DIC CORPORATION製造),除此以外,藉由相同的方法獲得了彩色顏料分散物(PB分散液)。[Preparation of Color Pigment Dispersion (PB Dispersion Liquid)] In the preparation of the above-mentioned colorant dispersion liquid, except that the colorant was CIPigment Blue 15: 6 (manufactured by DIC Corporation), it was obtained by the same method. Color pigment dispersion (PB dispersion).

[彩色顏料分散物(PV分散液)的製備] 上述著色劑分散液的製備中,將著色劑設為C.I.Pigment Violet 23(Clariant製造),除此以外,藉由相同的方法獲得了彩色顏料分散物(PV分散液)。[Preparation of Color Pigment Dispersion (PV Dispersion Liquid)] In the preparation of the above-mentioned colorant dispersion liquid, except that the colorant was CIPigment Violet 23 (manufactured by Clariant), a color pigment dispersion was obtained by the same method. (PV dispersion).

實施例1的硬化性組成物的製備中,代替以硬化性組成物中含有58質量%的含氮化鈦粒子TiN-1之方式添加之著色劑分散液,使用了上述含氮化鈦粒子TiN-1、PY、PR、PB及PV分散液的混合物(硬化性組成物中的含氮化鈦粒子TiN-1、PY、PR、PB及PV的比;含氮化鈦粒子TiN-1:PY:PR:PB:PV=70:17:37:36:10(質量比)、硬化性組成物中的含氮化鈦粒子TiN-1、PY、PR、PB及PV的合計含量為58質量%。),除此以外,以相同的方法製備硬化性組成物,並用此進行了評價。評價結果,得知可獲得與實施例1相同的遮光性與相同的圖案形狀,而且可獲得在紅外區域的遮光性優異之膜。In the preparation of the curable composition of Example 1, the above-mentioned titanium nitride-containing particles TiN were used instead of the colorant dispersion liquid added so that the curable composition contained 58% by mass of titanium nitride-containing particles TiN-1. -1, a mixture of PY, PR, PB, and PV dispersions (ratio of titanium nitride-containing particles TiN-1, PY, PR, PB, and PV in the hardening composition; titanium nitride-containing particles TiN-1: PY : PR: PB: PV = 70: 17: 37: 36: 10 (mass ratio), the total content of titanium nitride-containing particles TiN-1, PY, PR, PB, and PV in the hardening composition is 58% by mass )), And a curable composition was prepared in the same manner and evaluated using this method. As a result of the evaluation, it was found that the same light-shielding property and the same pattern shape as those of Example 1 can be obtained, and a film having excellent light-shielding properties in the infrared region can be obtained.

實施例1的硬化性組成物的製備中,代替以硬化性組成物中含有58質量%的含氮化鈦粒子TiN-1之方式添加之著色劑分散液,使用了上述含氮化鈦粒子TiN-1與以下示出之化合物SQ-23的混合物(硬化性組成物中的含氮化鈦粒子TiN-1及化合物SQ-23的比;含氮化鈦粒子TiN-1:化合物SQ-23=50:8(質量比)、硬化性組成物中的含氮化鈦粒子TiN-1及化合物SQ-23的合計含量為58質量%。),除此以外,以相同的方式製備硬化性組成物,並用此進行了評價。評價結果,得知可獲得與實施例1相同的遮光性與相同的圖案形狀,而且可獲得在紅外區域的遮光性優異之膜。In the preparation of the curable composition of Example 1, the above-mentioned titanium nitride-containing particles TiN were used instead of the colorant dispersion liquid added so that the curable composition contained 58% by mass of titanium nitride-containing particles TiN-1. -1 and a compound SQ-23 shown below (ratio of titanium nitride-containing particles TiN-1 and compound SQ-23 in the hardening composition; titanium nitride-containing particles TiN-1: compound SQ-23 = 50: 8 (mass ratio), the total content of the titanium nitride-containing particles TiN-1 and the compound SQ-23 in the hardening composition was 58% by mass.), Except for this, a hardening composition was prepared in the same manner. , And used this to evaluate. As a result of the evaluation, it was found that the same light-shielding property and the same pattern shape as those of Example 1 can be obtained, and a film having excellent light-shielding properties in the infrared region can be obtained.

實施例1的硬化性組成物的製備中,代替以硬化性組成物中含有58質量%的含氮化鈦粒子TiN-1之方式添加之著色劑分散液,使用了上述含氮化鈦粒子TiN-1與下述化合物A-52的混合物(硬化性組成物中的含氮化鈦粒子TiN-1及化合物A-52的比;含氮化鈦粒子TiN-1:化合物A-52=50:8(質量比)、硬化性組成物中的含氮化鈦粒子TiN-1及化合物A-52的合計含量為58質量%。),除此以外,以相同的方法製備硬化性組成物,並用此進行了評價。評價結果,得知可獲得與實施例1相同的遮光性與相同的圖案形狀,而且可獲得在紅外區域的遮光性優異之膜。In the preparation of the curable composition of Example 1, the above-mentioned titanium nitride-containing particles TiN were used instead of the colorant dispersion liquid added so that the curable composition contained 58% by mass of titanium nitride-containing particles TiN-1. -1 with the following compound A-52 (ratio of titanium nitride-containing particles TiN-1 and compound A-52 in the hardening composition; titanium nitride-containing particles TiN-1: compound A-52 = 50: 8 (mass ratio), the total content of the titanium nitride-containing particles TiN-1 and the compound A-52 in the hardenable composition was 58% by mass.) Except for this, a hardenable composition was prepared by the same method and used This was evaluated. As a result of the evaluation, it was found that the same light-shielding property and the same pattern shape as those of Example 1 can be obtained, and a film having excellent light-shielding properties in the infrared region can be obtained.

化合物SQ-23 【化學式40】 Compound SQ-23 [Chemical Formula 40]

化合物A-52 【化學式41】 Compound A-52 [Chemical Formula 41]

101‧‧‧支撐體
102‧‧‧硬化性組成物層
103‧‧‧光罩
201‧‧‧硬化膜
301‧‧‧後烘烤後的硬化膜
401‧‧‧硬化性組成物層
402‧‧‧遮罩遮光部分
501‧‧‧硬化膜
601‧‧‧後烘烤後的硬化膜
101‧‧‧ support
102‧‧‧hardening composition layer
103‧‧‧Mask
201‧‧‧hardened film
301‧‧‧Post-baking hardened film
401‧‧‧curable composition layer
402‧‧‧Mask part
501‧‧‧hardened film
601‧‧‧Post-bake hardened film

圖1是按每個製程示意地示出使用不包含多官能硫醇化合物之硬化性組成物之硬化膜的製造製程之剖面圖。 圖2是按每個製程示意地示出使用不包含多官能硫醇化合物之硬化性組成物之硬化膜的製造製程之剖面圖。 圖3是按每個製程示意地示出使用不包含多官能硫醇化合物之硬化性組成物之硬化膜的製造製程之剖面圖。 圖4是按每個製程示意地示出使用本發明的實施態樣之硬化性組成物之硬化膜的製造製程之剖面圖。 圖5是按每個製程示意地示出使用本發明的實施態樣之硬化性組成物之硬化膜的製造製程之剖面圖。 圖6是按每個製程示意地示出使用本發明的實施態樣之硬化性組成物之硬化膜的製造製程之剖面圖。FIG. 1 is a cross-sectional view schematically showing a manufacturing process of a cured film using a curable composition that does not include a polyfunctional thiol compound for each process. FIG. 2 is a cross-sectional view schematically showing a production process of a cured film using a curable composition containing no polyfunctional thiol compound for each process. FIG. 3 is a cross-sectional view schematically showing a production process of a cured film using a curable composition that does not contain a polyfunctional thiol compound for each process. 4 is a cross-sectional view schematically showing a manufacturing process of a cured film using a curable composition according to an embodiment of the present invention for each process. 5 is a cross-sectional view schematically showing a manufacturing process of a cured film using a curable composition according to an embodiment of the present invention for each process. 6 is a cross-sectional view schematically showing a manufacturing process of a cured film using a curable composition according to an embodiment of the present invention for each process.

101‧‧‧支撐體 101‧‧‧ support

102‧‧‧硬化性組成物層 102‧‧‧hardening composition layer

103‧‧‧光罩 103‧‧‧Mask

Claims (26)

一種硬化性組成物,其含有著色劑、光聚合起始劑、聚合性化合物及多官能硫醇化合物,其中 使前述硬化性組成物硬化來獲得之硬化膜在可見光區域的每1.5μm的膜厚的光學濃度為4.0以上。A curable composition containing a colorant, a photopolymerization initiator, a polymerizable compound, and a polyfunctional thiol compound, wherein a film thickness per 1.5 μm in a visible light region of a cured film obtained by curing the aforementioned curable composition is cured. The optical density is 4.0 or more. 如申請專利範圍第1項所述之硬化性組成物,其中 相對於前述硬化性組成物的總固體成分,前述著色劑的含量為55質量%以上。The curable composition according to item 1 of the scope of patent application, wherein the content of the colorant is 55% by mass or more based on the total solid content of the curable composition. 如申請專利範圍第1項所述之硬化性組成物,其中 相對於前述著色劑的含量,前述多官能硫醇化合物的含量為1~5.5質量%。The curable composition according to item 1 of the scope of patent application, wherein the content of the polyfunctional thiol compound is 1 to 5.5% by mass based on the content of the colorant. 如申請專利範圍第1項至第3項中任一項所述之硬化性組成物,其還含有聚合抑制劑。The hardenable composition according to any one of claims 1 to 3 of the scope of patent application, further comprising a polymerization inhibitor. 如申請專利範圍第4項所述之硬化性組成物,其中 相對於前述多官能硫醇化合物的含量,前述聚合抑制劑的含量為0.1~1.5質量%。The curable composition according to item 4 of the scope of patent application, wherein the content of the polymerization inhibitor is 0.1 to 1.5% by mass based on the content of the polyfunctional thiol compound. 如申請專利範圍第4項所述之硬化性組成物,其中 前述聚合抑制劑含有酚系化合物。The curable composition according to item 4 of the scope of patent application, wherein the polymerization inhibitor contains a phenolic compound. 如申請專利範圍第4項所述之硬化性組成物,其中 前述聚合抑制劑含有2種以上的酚系化合物。The curable composition according to item 4 of the scope of application, wherein the polymerization inhibitor contains two or more phenolic compounds. 如申請專利範圍第4項所述之硬化性組成物,其中 前述聚合抑制劑含有受阻胺系化合物。The hardenable composition according to item 4 of the patent application, wherein the polymerization inhibitor contains a hindered amine compound. 如申請專利範圍第1項至第3項中任一項所述之硬化性組成物,其中 前述著色劑為無機顏料。The curable composition according to any one of claims 1 to 3, wherein the colorant is an inorganic pigment. 如申請專利範圍第9項所述之硬化性組成物,其中 前述無機顏料包含選自由氮化鈦、氮氧化鈦、氮化鈮、氮化釩、含有銀或錫之金屬顔料、以及含有銀及錫之金屬顔料所組成之群組之至少一種。The hardenable composition according to item 9 of the scope of the patent application, wherein the inorganic pigment comprises a material selected from the group consisting of titanium nitride, titanium oxynitride, niobium nitride, vanadium nitride, metallic pigments containing silver or tin, and silver and tin. At least one of the group consisting of metallic pigments of tin. 如申請專利範圍第1項至第3項中任一項所述之硬化性組成物,其中 前述多官能硫醇化合物是具有2個以上的以式(1)表示之基團之化合物,式(1)中,L1 表示單鍵或-CO-,L2 表示單鍵或2價的連結基。The hardenable composition according to any one of claims 1 to 3 in the scope of the patent application, wherein the aforementioned polyfunctional thiol compound is a compound having two or more groups represented by formula (1), In formula (1), L 1 represents a single bond or -CO-, and L 2 represents a single bond or a divalent linking group. 如申請專利範圍第1項至第3項中任一項所述之硬化性組成物,其中 前述多官能硫醇化合物為3官能以上。The curable composition according to any one of claims 1 to 3 in the scope of the patent application, wherein the polyfunctional thiol compound is trifunctional or more. 如申請專利範圍第1項至第3項中任一項所述之硬化性組成物,其中 前述多官能硫醇化合物為選自由季戊四醇四(3-巰基丙酸酯)及三羥甲基丙烷三(3-巰基丙酸酯)所組成之群組之至少一種。The hardenable composition according to any one of claims 1 to 3, wherein the polyfunctional thiol compound is selected from the group consisting of pentaerythritol tetrakis (3-mercaptopropionate) and trimethylolpropane tri At least one of the group consisting of (3-mercaptopropionate). 如申請專利範圍第1項至第3項中任一項所述之硬化性組成物,其中 相對於前述硬化性組成物的總固體成分,前述光聚合起始劑的含量為超過1質量%且小於10質量%。The hardenable composition according to any one of claims 1 to 3, wherein the content of the photopolymerization initiator is more than 1% by mass based on the total solid content of the hardenable composition, and Less than 10% by mass. 如申請專利範圍第1項至第3項中任一項所述之硬化性組成物,其中 相對於前述硬化性組成物的總固體成分,前述聚合性化合物的含量為超過3.5質量%且小於20質量%。The hardenable composition according to any one of claims 1 to 3, wherein the content of the polymerizable compound is more than 3.5% by mass and less than 20 with respect to the total solid content of the hardenable composition. quality%. 如申請專利範圍第1項至第3項中任一項所述之硬化性組成物,其還含有分散劑,相對於前述硬化性組成物的總固體成分,前述分散劑的含量為17質量%以上。The hardenable composition according to any one of claims 1 to 3 in the patent application scope, further comprising a dispersant, and the content of the dispersant is 17% by mass based on the total solid content of the hardenable composition. the above. 如申請專利範圍第1項至第3項中任一項所述之硬化性組成物,其中 前述光聚合起始劑為肟化合物。The curable composition according to any one of claims 1 to 3 in the scope of application for a patent, wherein the photopolymerization initiator is an oxime compound. 一種硬化膜,其使申請專利範圍第1項至第17項中任一項所述之硬化性組成物硬化來獲得。A hardened film obtained by hardening the hardenable composition described in any one of claims 1 to 17 of the scope of patent application. 一種彩色濾光片,其含有申請專利範圍第18項所述之硬化膜。A color filter includes the hardened film described in claim 18 of the scope of patent application. 一種遮光膜,其含有申請專利範圍第18項所述之硬化膜。A light-shielding film containing the hardened film described in claim 18 of the scope of patent application. 一種固體攝像元件,其含有申請專利範圍第18項所述之硬化膜。A solid-state imaging device includes the hardened film described in claim 18 of the scope of patent application. 一種圖像顯示裝置,其含有申請專利範圍第18項所述之硬化膜。An image display device includes the hardened film described in claim 18 of the scope of patent application. 一種硬化膜的製造方法,其含有: 使用申請專利範圍第1項至第17項中任一項所述之硬化性組成物,在支撐體上形成硬化性組成物層之硬化性組成物層形成製程;以及 對前述硬化性組成物層進行曝光之曝光製程。A method for producing a cured film, comprising: forming a curable composition layer using the curable composition described in any one of claims 1 to 17 to form a curable composition layer on a support; A manufacturing process; and an exposure process for exposing the curable composition layer. 如申請專利範圍第23項所述之硬化膜的製造方法,其中 前述曝光製程中的前述硬化性組成物層的曝光量為200mJ/cm2 以上。The method for manufacturing a cured film according to item 23 of the scope of patent application, wherein the exposure amount of the curable composition layer in the exposure process is 200 mJ / cm 2 or more. 如申請專利範圍第23項所述之硬化膜的製造方法,其中 前述硬化性組成物層形成製程包含在前述支撐體上直接塗佈前述硬化性組成物,從而在前述支撐體上形成前述硬化性組成物層之塗佈製程。The method for manufacturing a cured film according to item 23 of the scope of application, wherein the process of forming the hardenable composition layer includes directly coating the hardenable composition on the support, thereby forming the hardenability on the support. Coating process of the composition layer. 如申請專利範圍第23項至第25項中任一項所述之硬化膜的製造方法,其還含有: 對所曝光之前述硬化性組成物層進行顯影之顯影製程;以及 清洗所顯影之前述硬化性組成物層之清洗製程。The method for manufacturing a cured film according to any one of claims 23 to 25, further comprising: a development process for developing the exposed curable composition layer; and cleaning the developed image. Cleaning process of hardening composition layer.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112534312A (en) * 2018-09-20 2021-03-19 富士胶片株式会社 Light-shielding composition, cured film, color filter, light-shielding film, optical element, solid-state imaging element, and headlamp unit
CN112601912A (en) * 2018-09-07 2021-04-02 富士胶片株式会社 Vehicle headlamp unit, headlamp shading film, and method for manufacturing headlamp shading film

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7090628B2 (en) * 2017-09-20 2022-06-24 富士フイルム株式会社 Coloring composition, cured film, pattern forming method, color filter, solid-state image sensor and image display device
WO2020059484A1 (en) * 2018-09-18 2020-03-26 富士フイルム株式会社 Composition, film, optical filter, solid-state imaging element, infrared sensor, method for producing optical filter, camera module, compound, and dispersion composition
JP7331855B2 (en) * 2018-09-26 2023-08-23 Jsr株式会社 Photosensitive resin composition, method for forming resist pattern, and method for producing plated model
JP7236671B2 (en) * 2018-12-25 2023-03-10 パナソニックIpマネジメント株式会社 COMPOSITION FOR LIGHT EMITTING ELEMENT ENCLOSURE AND LIGHT EMITTING DEVICE
WO2021215155A1 (en) * 2020-04-20 2021-10-28 日産化学株式会社 Photocurable composition
KR20220056740A (en) * 2020-10-28 2022-05-06 덕산네오룩스 주식회사 Photo-curable composition comprising inorganic particle, and Display device
KR20220094479A (en) * 2020-12-29 2022-07-06 덕산네오룩스 주식회사 Resin, resin composition and display device using the same

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62275228A (en) * 1986-02-18 1987-11-30 Toshiba Corp Display device and its manufacture
JPH0387744A (en) * 1989-08-31 1991-04-12 Asahi Chem Ind Co Ltd Photosensitive resin composition with excellent light resistance
JP2004198542A (en) * 2002-12-16 2004-07-15 Showa Denko Kk Color filter black matrix resist composition and photosensitive composition used for same composition
JP2004198717A (en) * 2002-12-18 2004-07-15 Showa Denko Kk Color filter black matrix resist composition and carbon black dispersed liquid composition used for same composition
KR101225527B1 (en) * 2004-10-26 2013-01-23 쇼와 덴코 가부시키가이샤 Thiol compound, and photosensitive composition and black matrix resist composition using the compound
JP2006154774A (en) * 2004-10-26 2006-06-15 Showa Denko Kk Black matrix resist composition containing thiol compound
JP2006156801A (en) 2004-11-30 2006-06-15 Fujifilm Electronic Materials Co Ltd Light-shielding film forming composition, light-shielding film for solid-state imaging element using same, and solid-sate imaging element
JP2006227223A (en) * 2005-02-16 2006-08-31 Fuji Photo Film Co Ltd Composition for pattern formation, pattern forming material, and pattern forming method
JP4828196B2 (en) * 2005-10-04 2011-11-30 富士フイルム株式会社 Dark color wall forming method, color filter, manufacturing method thereof, and display device
JP5151126B2 (en) * 2005-11-30 2013-02-27 東洋インキScホールディングス株式会社 Black composition and color filter using the same
JP5529370B2 (en) * 2007-10-03 2014-06-25 新日鉄住金化学株式会社 Photosensitive resin composition for black resist containing polyfunctional thiol compound, black matrix for color filter using the same, and color filter
JP2009237294A (en) * 2008-03-27 2009-10-15 The Inctec Inc Photosensitive resin composition for forming black matrix
JP5241289B2 (en) * 2008-03-31 2013-07-17 富士フイルム株式会社 Polymerizable composition, light-shielding color filter, and solid-state imaging device
JP2010256891A (en) * 2009-04-01 2010-11-11 Toyo Ink Mfg Co Ltd Photosensitive coloring composition and color filter
TWI483999B (en) * 2009-06-15 2015-05-11 Toray Industries Black composite fine particle, black resin composition, color filter substrate and liquid crystal display
JP2014182253A (en) * 2013-03-19 2014-09-29 Toppan Printing Co Ltd Black photosensitive resin composition, color filter and liquid crystal display device
JP2015045706A (en) * 2013-08-27 2015-03-12 東洋インキScホールディングス株式会社 Color filter coloring composition and color filter
TWI636083B (en) * 2014-04-16 2018-09-21 三菱化學股份有限公司 Substrate with light shielding material, color filter, and liquid crystal display
KR20190021493A (en) * 2014-05-01 2019-03-05 후지필름 가부시키가이샤 Coloring composition, film, color filter, method for forming pattern, method for producing color filter, solid-state imaging device, and infrared sensor
TWI671343B (en) * 2014-06-27 2019-09-11 日商富士軟片股份有限公司 Thermosetting resin composition, cured film, method for producing cured film, and semiconductor device
KR102363104B1 (en) * 2015-08-31 2022-02-15 후지필름 가부시키가이샤 Coloring photosensitive composition, cured film, color filter, light-shielding film, solid-state imaging element, image display device, and method for manufacturing cured film

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