TW201807134A - Adhesive tape for semiconductor processing and method for producing semiconductor chip or semiconductor component using same - Google Patents

Abstract

To provide: an adhesive tape for semiconductor processing, which is suppressed in excessive winding around a conveyance roll, and which is able to be easily separated in a pick-up step; and a method for producing a semiconductor chip or semiconductor component, which uses this adhesive tape for semiconductor processing. An adhesive tape for semiconductor processing, which is configured such that: a vinyl chloride film has a Young's modulus of 200-500 MPa; an adhesive layer contains a (meth)acrylate ester polymer having no hydroxyl group and no carboxyl group; the adhesive layer contains, per 100 parts by mass of the (meth)acrylate ester polymer, from 20 parts by mass to 150 parts by mass of a photopolymerizable compound, from 0.1 part by mass to 10 parts by mass of a curing agent and from 0.1 part by mass to 10 parts by mass of a photopolymerization initiator; and the photopolymerizable compound is a urethane acrylate that has an isophorone diisocyanate skeleton or a tolylene diisocyanate skeleton, while having a weight average molecular weight from 1,000 to 10,000 and 6-15 carbon-carbon double bonds.

Description

Adhesive tape for semiconductor processing and manufacturing method of semiconductor wafer or semiconductor part using the same

The present invention relates to an adhesive tape for semiconductor processing and a method for manufacturing a semiconductor wafer or a semiconductor component using the same.

The adhesive tape (adhesive tape) for semiconductor processing may be conveyed by the rotation of two conveying rollers. At that time, if the adhesive force of the adhesive layer is too large, close adhesion to the roller and winding to the roller may occur. (Hereinafter referred to as a "mounter") and cannot be smoothly conveyed. In addition, the conveyed adhesive tape is bonded to a semiconductor wafer or substrate on which a circuit is formed, and is transferred to: divided into small component pieces (cutting), extending (extending) the adhesive tape, and peeling the component small pieces from the adhesive tape (pickup) )step. The adhesive tape system used in these steps is expected to have sufficient adhesion to the component pieces (wafers) that are divided at the time of dicing, and the adhesive force is reduced to a level that is not lingering when picked up.

In order to achieve the above object, it has been disclosed that a substrate film which is transparent to both ultraviolet rays and electron rays or active rays of either ultraviolet rays or electron rays is coated with an adhesive that undergoes a polymerization hardening reaction due to ultraviolet rays or the like. Agent layer (refer to Patent Documents 1 and 2). This adhesive tape is used in the step of picking up the divided wafer after irradiating ultraviolet rays or the like to the adhesive layer after the dicing step to polymerize and harden the adhesive layer and reduce the adhesive force.

Patent Document 1 International Publication No. 2011/077835

Patent Document 2 Japanese Patent Laid-Open No. 2006-049509

The present invention provides an adhesive tape for semiconductor processing, and a method for manufacturing a semiconductor wafer or a semiconductor component using the same. The adhesive tape for semiconductor processing can suppress tight adhesion due to tight adhesion even when conveyed by the rotation of a plurality of conveying rollers. The resulting excessive winding of the conveying rollers can be easily peeled off during the picking step.

In order to solve the above problems, the present invention adopts the following measures.

(1) An adhesive tape for semiconductor processing, which is an adhesive tape for semiconductor processing having an adhesive layer on a vinyl chloride film, wherein the Young's modulus of the vinyl chloride film is 200 to 500 MPa; the adhesive layer contains no (Hydroxy) and carboxyl (meth) acrylic acid ester polymers, containing 20 to 150 parts by mass of a photopolymerizable compound, and 0.1 to 10 parts by mass based on 100 parts by mass of the (meth) acrylate polymer Hardener and 0.1 to 10 parts by mass of a photopolymerization initiator; the aforementioned photopolymerizable compound is a urethane acrylate having an isophorone diisocyanate skeleton or toluene diisocyanate The isocyanate skeleton has a weight average molecular weight of 1,000 to 10,000 and a carbon-carbon double bond number of 6 to 15.

(2) The adhesive tape for semiconductor processing as described in (1) whose said hardening | curing agent has an isocyanate group or an epoxy group.

(3) A method for manufacturing a semiconductor wafer or a semiconductor part, comprising: attaching a semiconductor wafer or a substrate and a dicing frame with a step of attaching the adhesive tape for semiconductor processing as described in (1) or (2); cutting A step of cutting the semiconductor wafer or the substrate to obtain a semiconductor wafer or a semiconductor part; a light irradiation step of irradiating the adhesive tape for semiconductor processing with ultraviolet light; an expanding step of stretching the adhesive tape for semiconductor processing; A step of picking up the semiconductor wafer or the semiconductor component by the adhesive tape.

As described above, the adhesive tape for semiconductor processing of the present invention suppresses excessive winding of the conveying roller due to close adhesion even when conveyed by the rotation of a plurality of conveying rollers, and can be used in the picking step. Easily peeled off. A manufacturing method of a semiconductor wafer or a semiconductor component using this adhesive tape for semiconductor processing is capable of easily picking up a semiconductor wafer or a semiconductor component.

1‧‧‧ fluororesin roll

2‧‧‧ rubber roller

3‧‧‧ Adhesive tape for semiconductor processing

4‧‧‧ Adhesion due to entrainment

FIG. 1 is an explanatory diagram of conveying an adhesive tape by rotation of two conveying rollers.

Implementation of the invention

Hereinafter, suitable aspects for carrying out the present invention will be described. The embodiment described below shows an example of a representative embodiment of the present invention, and the scope of the present invention is not to be interpreted in a narrow sense. In addition, in this specification, "(meth) acrylic acid" means both acrylic acid and methacrylic acid, and "(meth) acrylic acid ester" means both acrylic acid ester and methacrylic acid ester. In addition, the so-called "semiconductor wafer" refers to a singulated wafer such as a silicon wafer, and the so-called "semiconductor part" refers to a singulated wafer.

Hereinafter, an embodiment of the present invention will be used to explain in more detail.

[Adhesive tape for semiconductor processing]

The adhesive tape for semiconductor processing has an adhesive layer on a vinyl chloride film. Hereinafter, each member of the adhesive tape for semiconductor processing is demonstrated.

<Vinyl chloride film>

As a material of the vinyl chloride film, vinyl chloride resin (polyvinyl chloride), a plasticizer and a stabilizer as needed, etc., and those who knead these materials to form a film can be used. Examples of vinyl chloride resins include: vinyl chloride homopolymers; copolymers of vinyl chloride with monomers such as ethylene, propylene, acrylonitrile, vinylidene chloride, and vinyl acetate; and MBS added to polyvinyl chloride , ABS, nitrile rubber, chlorinated polyethylene, ethylene vinyl alcohol-vinyl chloride graft copolymer, modified polyvinyl chloride resin of various plasticizers.

As the plasticizer, for example, a phthalate plasticizer such as dioctyl phthalate, or an epoxy resin such as epoxidized soybean oil can be used. Polyester based plasticizers such as plasticizers and polyethylene glycol phthalate. The Young's modulus of the vinyl chloride film can be adjusted by the amount of plasticizer added. The Young's modulus of the vinyl chloride film is 200 MPa to 500 MPa, preferably 250 MPa to 400 MPa. The addition amount of the plasticizer for satisfying the Young's modulus in this range may be, for example, 23 to 30 parts by mass relative to 100 parts by mass of the vinyl chloride resin. If the Young's modulus is less than 200 MPa, it is easy to adhere tightly to the roller when the tape is bonded. If the Young's modulus is more than 500 MPa, the semiconductor wafer adjacent to the semiconductor wafer to be picked up when picked up will be impacted by the pin jack. And loosening, so-called wafer loosening occurs. The Young's modulus is a value measured in accordance with the tensile test method of JIS K 7113 (tensile test method for plastic films and sheets).

The stabilizer is not particularly limited, and examples thereof include epoxy-based stabilizers, barium-based stabilizers, calcium-based stabilizers, tin-based stabilizers, zinc-based stabilizers, calcium-zinc-based (Ca-Zn-based), or barium. -Compound stabilizers such as zinc-based (Ba-Zn-based), metal soaps such as fatty acid calcium, fatty acid zinc, and fatty acid barium, hydrotalcite, β-diketone compounds, propylene methacrylate, and methyl methacrylate Copolymers, etc. These stabilizers can be used alone or in combination of two or more. The content of the stabilizer is not particularly limited, and may be 1 to 15 parts by mass based on 100 parts by mass of the vinyl chloride resin.

The method for forming a vinyl chloride resin into a film is not particularly limited, and a calendering film method and a T-die processing method can be used.

The thickness of the vinyl chloride film is preferably 30 μm to 200 μm, and more preferably 50 to 150 μm.

For vinyl chloride films, antistatic treatment can also be applied. As the antistatic treatment, there are a treatment in which an antistatic agent is blended in a vinyl chloride film, a treatment in which an antistatic agent is coated on the surface of the vinyl chloride film, or a treatment by corona discharge.

As the antistatic agent, for example, a quaternary amine salt monomer can be used. Examples of the quaternary amine salt monomer include dimethylaminoethyl (meth) acrylate quaternary chloride, diethylaminoethyl (meth) acrylate quaternary chloride, and methyl Ethylaminoethyl (meth) acrylate quaternary chloride, p-dimethylaminostyrene quaternary chloride and p-diethylaminostyrene quaternary chloride. Among them, dimethylaminoethylmethacrylate quaternary chloride is preferred.

In order to improve the expandability after cutting, a slip agent may be coated on the non-contact surface of the adhesive of the vinyl chloride film, or a slip agent may be mixed into the vinyl chloride film.

The lubricant is not particularly limited as long as it can reduce the coefficient of friction between the adhesive tape and the expansion device, and examples thereof include polysiloxanes such as polysiloxane resins and (modified) polysiloxane oils, and fluororesins. , Hexagonal boron nitride, carbon black and molybdenum disulfide. These friction reducing agents may be mixed with a plurality of components. Since the manufacturing of electronic parts is performed in a clean room, it is preferable to use polysiloxane or fluororesin. Among polysiloxane compounds, especially copolymers having a polysiloxane macromonomer unit, are compatible with antistatic agents, and can balance the antistatic property and expandability, so they can be suitably used.

The method of using the lubricant and the antistatic agent is not particularly limited. For example, an adhesive can be coated on one side of a vinyl chloride film, and Either or both of the slip agent and the antistatic agent may be applied on the surface, or both or both of the slip agent and the antistatic agent may be mixed into the resin of the vinyl chloride film to form a sheet.

The vinyl chloride film is laminated with an adhesive on one surface, and the other surface can be an embossed surface having an average surface roughness (Ra) of 0.3 μm to 1.5 μm. By providing an embossed surface on the machine table side of the expansion device, the vinyl chloride film can be easily expanded (stretched) in the expansion step after cutting.

<Adhesive layer>

The adhesive layer is a layer formed using an adhesive, and contains a (meth) acrylate polymer having no hydroxyl group and a carboxyl group, a photopolymerizable compound, a hardener, and a photopolymerization initiator. That is, the adhesive layer system can be formed using an adhesive containing a (meth) acrylate polymer having no hydroxyl group and carboxyl group, a photopolymerizable compound, a hardener, and a photopolymerization initiator. Hereinafter, each member of the adhesive layer will be described.

((Meth) acrylate copolymer)

The (meth) acrylate copolymer does not have a hydroxyl group and a carboxyl group. The "(meth) acrylate copolymer without a hydroxyl group and a carboxyl group" is also simply referred to as "(meth) acrylate copolymer" hereinafter. The (meth) acrylic acid ester copolymer which does not have a hydroxyl group and a carboxyl group is a copolymer of an acrylic acid ester which does not contain a hydroxyl group and a carboxyl group, such as a meth (meth) acrylate, or is copolymerized with such monomers. Copolymers of unsaturated monomers (such as vinyl acetate, styrene, acrylonitrile). Since it does not contain a carboxyl group and a hydroxyl group, it can be easily peeled off at the time of picking up even if it is used in an automatic processing device where the conventional adhesive tape could not be easily peeled off in the picking up step.

Examples of the ester monomer of the (meth) acrylic polymer containing no hydroxyl group and carboxyl group include n-butyl (meth) acrylate, 2-butyl (meth) acrylate, and tert-butyl (meth) acrylate Ester, amyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, (meth) Lauryl acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, ethyl acrylate, 2-methoxyethyl acrylate, isopropyl (meth) acrylate, octadecyl (meth) acrylate , Cyclohexyl (meth) acrylate, benzyl (meth) acrylate, and the like.

(Photopolymerizable compound)

The photopolymerizable compound is a urethane acrylate having an isophorone diisocyanate skeleton or a toluene diisocyanate skeleton. As the urethane acrylate, a urethane acrylate oligomer was used. The urethane acrylate oligomer is a terminal isocyanate amine obtained by reacting a (meth) acrylate having a hydroxyl group with a polyhydric alcohol compound such as a polyester type or a polyether type, and a polyvalent isocyanate compound. It is obtained by reacting an acid ester prepolymer.

Examples of the polyol compound used in the synthesis of the terminal isocyanate urethane prepolymer include polyester diol, polyether diol, polycaprolactone diol, and polycarbonate diol. Among polyvalent isocyanate compounds, in order to obtain a urethane acrylate having an isophorone diisocyanate skeleton or a toluene diisocyanate skeleton, for example, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, iso Fosperidone diisocyanate, these trimers, and adducts with trimethylolpropane.

Examples of the (meth) acrylate having a hydroxyl group include pentaerythritol triacrylate, dehydrated glycerol di (meth) acrylate, and dipentaerythritol pentaacrylate.

The blending amount of the photopolymerizable compound is 20 to 150 parts by mass, and preferably 60 to 110 parts by mass based on 100 parts by mass of the (meth) acrylate copolymer. When the blending amount of the photopolymerizable compound is less than 20 parts by mass, the peelability of the adhesive tape after light irradiation is lowered, and a pick-up failure of a semiconductor wafer is likely to occur. On the other hand, if the blending amount of the photopolymerizable compound is more than 150 parts by mass, the elastic modulus of the adhesive becomes excessively high due to the light irradiation step, and looseness of the wafer occurs during the picking step, resulting in reduced productivity. main reason.

The photopolymerizable compound has a weight average molecular weight (Mw) of 1,000 to 10,000, and preferably 3,000 to 8,000. When the weight-average molecular weight is less than 1,000, the adhesion to the roll becomes high, and when the weight-average molecular weight is more than 10,000, the wafer is peeled off during dicing, and so-called wafer scattering occurs. The weight average molecular weight (Mw) can be determined by a gel permeation chromatography (GPC) method.

The number of carbon-carbon double bonds of the photopolymerizable compound is 6 to 15, preferably 9 to 15. When the number of carbon-carbon double bonds is less than 6, the adhesive force cannot be sufficiently reduced, and pick-up failure occurs. In order to have a structure having 6 to 15 carbon-carbon double bonds, it can be adjusted by a combination of a polyvalent isocyanate compound of a terminal isocyanate urethane prepolymer and a (meth) acrylate having a hydroxyl group. When the polyvalent isocyanate compound is 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, or the like having two isocyanate groups, a pentaerythritol triacrylate or (meth) acrylate having three or more hydroxyl groups is used. Dipentaerythritol pentaacrylate. Further, in the case of the above-mentioned trimer or adduct of an isocyanate having three or more isocyanate groups, dehydration of a (meth) acrylate having two hydroxyl groups may be used. Glycerol di (meth) acrylate. Those with more than 15 carbon-carbon double bonds are difficult to obtain and expensive. The number of carbon-carbon double bonds can be measured by a titration method.

(hardener)

As a hardening | curing agent, it is preferable to have an isocyanate group or an epoxy group, and a polyfunctional isocyanate hardening agent and a polyfunctional epoxy hardening agent are mentioned. Examples of the polyfunctional isocyanate hardener include an aromatic polyisocyanate hardener, an aliphatic polyisocyanate hardener, and an alicyclic polyisocyanate hardener. Their terpolymers or adducts with trimethylolpropane can be used. .

The aromatic polyisocyanate hardener is not particularly limited, and examples thereof include 1,3-phenylene diisocyanate, 4,4'-diphenyl diisocyanate, 1,4-phenylene diisocyanate, and 4,4 '-Diphenylmethane diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5 -Triisocyanate benzene, dimethoxyaniline diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4 ', 4'-triphenylmethane triisocyanate, ω, ω'-diisocyanate-1,3 -Dimethylbenzene, ω, ω'-diisocyanate-1,4-dimethylbenzene, ω, ω'-diisocyanate-1,4-diethylbenzene, 1,4-tetramethylxylylene Diisocyanate and 1,3-tetramethylxylylene diisocyanate.

The aliphatic polyisocyanate hardener is not particularly limited, and examples thereof include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, and 1,2-propylene diisocyanate. , 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, dodecylene diisocyanate, and 2,4,4-trimethylhexamethylene diisocyanate.

The alicyclic polyisocyanate hardener is not particularly limited, and examples thereof include 3-isocyanatemethyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, and 1,3 -Cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylene Bis (cyclohexyl isocyanate), 1,4-bis (isocyanatemethyl) cyclohexane, 1,4-bis (isocyanatemethyl) cyclohexane, and the like.

The terpolymer or the addition product with trimethylolpropane is not particularly limited, and an addition product of 2,4-toluene diisocyanate and trimethylolpropane can be suitably used.

The polyfunctional epoxy hardener mainly refers to a compound having two or more epoxy groups and one or more tertiary nitrogen atoms. Examples include N, N-epoxypropylaniline and N, N-epoxypropylmethyl. Aniline, mN, N-glycidylaminophenylglycidyl ether, pN, N-glycidylaminophenylglycidyl ether, triglycidyl isotricyanate, N, N, N ', N'-tetraglycidylaminodiphenylmethane, N, N, N', N'-tetraglycidyl-m-phenyldimethyldiamine, N, N, N ', N', N "-pentaepoxypropyldiethylenetriamine and the like.

The blending amount of the curing agent is from 0.1 to 10 parts by mass, and preferably from 1 to 9 parts by mass, based on 100 parts by mass of the (meth) acrylate copolymer. If the blending amount of the hardener is less than 0.1 parts by mass, problems are likely to occur in chipping (chip defect) and adhesion (degree of winding with respect to the conveying roller). On the other hand, if the blending amount of the hardening agent is more than 10 parts by mass, the adhesive force is insufficient, and wafer loosening occurs, which is a cause of lowering productivity.

(Photopolymerization initiator)

The photopolymerization initiator is not particularly limited, but benzoin, benzoin alkyl ethers, acetophenones, anthraquinones, thioxanthone, ketal, and diphenylketone can be used. Class or Ketones and so on.

Examples of benzoin include benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin propyl ether.

Examples of acetophenones include acetoin alkyl ethers, acetophenone, 2,2-dimethoxy-2-acetophenone, 2,2-diethoxy-2-acetophenone, 1,1-dichloroacetophenone, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propanyl) -benzyl] phenyl} -2-methyl-propane 1-one and so on.

Examples of anthraquinones include 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, and 1-chloroanthraquinone.

Examples of thioxanthone include 2,4-dimethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone, etc. .

Examples of ketals include acetophenone dimethyl ketal, benzyl dimethyl methanol, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, and bibenzyl , Biacetyl, β-chloroanthraquinone, etc.

The blending amount of the photopolymerization initiator relative to 100 parts by mass of the (meth) acrylate polymer is 0.1 to 10 parts by mass, and preferably 1 to 9 parts by mass. When the blending amount of the photopolymerization initiator is less than 0.1 parts by mass, the peelability of the adhesive tape after light irradiation is reduced, and pick-up defects of a semiconductor wafer are liable to occur. On the other hand, if the blending amount of the photopolymerization initiator is more than 10 parts by mass, the adhesive force after UV irradiation is excessively reduced, and wafer loosening occurs.

As the photopolymerization initiator, if necessary, one or more conventional photopolymerization accelerators may be used in combination. As the photopolymerization accelerator, benzoic acid-based or tertiary amines can be used. Examples of the tertiary amine include triethylamine, tetraethylpentamine, and dimethylamino ether.

(Tackifying resin)

In the adhesive constituting the adhesive layer, as a tackifying resin, a terpene phenol resin which is completely or partially hydrogenated may be added.

(Additives, etc.)

Various additives such as softeners, anti-aging agents, fillers, conductive agents, ultraviolet absorbers, and light stabilizers can be added to the adhesive. The content of the additives is not particularly limited, and may be 0 to 5 parts by mass based on 100 parts by mass of the (meth) acrylate polymer.

The thickness of the adhesive layer is preferably 5 μm to 15 μm. If the adhesive layer is thicker than 5 μm, chipping easily occurs. In addition, if the adhesive layer is thinner than 5 μm, the adhesive force may be too low, the wafer retention during dicing may be reduced, and wafer scattering may occur, or peeling may occur between the ring frame and the sheet.

<Adhesive Tape for Semiconductor Processing>

When the adhesive tape for semiconductor processing of this embodiment is conveyed by the rotation of two conveying rollers, excessive roll-up of the rollers due to close adhesion does not occur, and even if an automatic processing device is used, it can be used at the picking step. It can be easily peeled off.

<Manufacture of Adhesive Tape for Semiconductor Processing>

An adhesive layer is coated on a vinyl chloride film to form an adhesive tape for semiconductor processing. As a method thereof, for example, a method of directly applying an adhesive on a vinyl chloride film by a coating machine such as a gravure coater, a notch wheel coater, a bar coater, a knife coater, or a roll coater, or a peeling film A method of applying / drying an adhesive and bonding it to a vinyl chloride film. Adhesives can be printed on vinyl chloride films by letterpress, gravure, offset, flexographic, offset or screen printing.

[Manufacturing method of semiconductor wafer or semiconductor part]

A method for manufacturing a semiconductor wafer or a semiconductor part includes an attaching step, a dicing step, a light irradiation step, an expanding step, and a picking step in this order.

(1) Attachment steps

In the attaching step, an adhesive tape for semiconductor processing is attached to a semiconductor wafer or substrate and a dicing frame (ring frame). The attaching step may be, for example, a step of attaching a semiconductor wafer or a substrate to an adhesive tape for semiconductor processing, and then attaching the adhesive tape for semiconductor processing to a ring frame and fixing it. The wafer system may be a conventional wafer such as a silicon wafer, a gallium nitride wafer, a silicon carbide wafer, or a sapphire wafer. The substrate may be a general-purpose substrate such as a package substrate in which a wafer is sealed with a resin, an LED package substrate, a ceramic substrate, and the like.

(2) Cutting step

In the dicing step, a silicon wafer or the like is cut to obtain a semiconductor wafer or a semiconductor part. For example, a cutting blade (a circular rotary blade made of diamond, etc.) is rotated at a high speed, and if necessary, cooling and washing are performed with pure water or the like Swarf, while dividing the semiconductor wafer or substrate, a semiconductor wafer or a semiconductor part is obtained.

(3) Light irradiation step

In the light irradiation step, the light-curable adhesive layer is irradiated with active light such as ultraviolet rays from the vinyl chloride film side. As the ultraviolet light source, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, and black light can be used. In addition, an electron beam may be used instead of ultraviolet rays, and as a light source of the electron beam, α rays, β rays, and γ rays may be used.

The adhesive layer undergoes three-dimensional network formation and hardens by light irradiation, reducing the adhesive force of the adhesive layer. Since the adhesive tape for semiconductor processing of this embodiment is not excessively adhered to a wafer or the like even when heated, it is possible to obtain sufficient adhesive force reduction by irradiation of ultraviolet rays or the like.

(4) Expansion step, (5) Picking step

In the expansion step, the adhesive tape is stretched in order to increase the distance between the semiconductor wafers or the semiconductor components, and the wafers or components are pushed up with pins or the like. Then, a wafer or a component is adsorbed with a vacuum chuck, air tweezers, or the like, and is peeled off from the adhesive layer of the adhesive tape for semiconductor processing to be picked up (pickup step). In the pressure-sensitive adhesive tape of this embodiment, since the elastic modulus of the pressure-sensitive adhesive is maintained by irradiation with ultraviolet rays or the like, sufficient adhesive force is reduced, so the peeling between the wafer or component and the pressure-sensitive adhesive layer becomes easy, and picking up Good, and no defects such as residues occurred.

Examples

Hereinafter, the present invention will be described more specifically by showing examples, but the explanation of the present invention is not limited by these examples.

(Example 1)

The adhesive tape of Example 1 was produced using the following formulation. The adhesive constituting the adhesive layer of the adhesive tape contains 85 parts by mass of a photopolymerizable compound a (UN-3320HS) with respect to 100 parts by mass of the (meth) acrylate copolymer a (AR-72L, manufactured by Japan Zeon Corporation). , Manufactured by Genjo Industrial Co., Ltd.), 5 parts by mass of polyfunctional isocyanate hardener a (Coronate L-45E, manufactured by Tosoh Corporation), and 5 parts by mass of photopolymerization initiator a (Irgacure 651, manufactured by BASF). The solution was dried so that the thickness became 10 μm. The solution was coated on a release film with a notch wheel coater to form an adhesive layer, and the adhesive layer was laminated on a vinyl chloride film b (FUZB-2950, manufactured by ACHILLES). , Thickness 80 μm) to obtain an adhesive tape.

(Examples 2 to 16, Comparative Examples 1 to 12)

Except having used the formulation of Tables 1 and 2, it carried out similarly to Example 1, and obtained the adhesive tape of Examples 2-16 and Comparative Examples 1-12.

The values of the (meth) acrylate polymer, the photopolymerizable compound, the hardener, and the photopolymerization initiator in Tables 1 and 2 represent the mass when the (meth) acrylate copolymer is regarded as 100 parts by mass. Serving etc. The details of the vinyl chloride film, the (meth) acrylate copolymer, the photopolymerizable compound, the curing agent, and the photopolymerization initiator are as follows.

<Vinyl chloride film>

Vinyl chloride film a: GM-311 (manufactured by DiaPlus Film), Young's modulus: 110 MPa

Vinyl chloride film b: FUZB-2950 (manufactured by ACHILLES), Young's modulus: 200 MPa

Vinyl chloride film c: FUZB-2850 (manufactured by ACHILLES), Young's modulus: 260 MPa

Vinyl chloride film d: FUZB-2650 (manufactured by ACHILLES), Young's modulus: 350 MPa

Vinyl chloride film e: FUZB-2550 (manufactured by ACHILLES), Young's modulus: 450 MPa

<Adhesive layer> ((Meth) acrylate copolymer)

a: AR-72L (manufactured by ZEON, Japan), a copolymer of 15% by mass of n-butyl acrylate, 70% by mass of ethyl acrylate, and 15% by mass of 2-methoxyethyl acrylate, Tg: -32.0 ° C , Weight average molecular weight 1.5 million, no hydroxyl, carboxyl)

b: 14% by mass of n-butyl acrylate, 70% by mass of ethyl acrylate, 15% by mass of 2-methoxyethyl acrylate, 1% by mass of copolymer of acrylic acid, Tg: -30.9 ° C, weight average molecular weight 1.5 million with carboxyl groups from acrylic acid

c: Copolymer of 14% by mass of n-butyl acrylate, 70% by mass of ethyl acrylate, 15% by mass of 2-methoxyethyl acrylate, and 1% by mass of 2-hydroxyethyl acrylate copolymer, Tg: -31.6 ℃, weight average molecular weight 1.5 million, there are hydroxyl groups from 2-hydroxyethyl acrylate

(Photopolymerizable compound)

a: UN-3320HS (manufactured by Genjo Industries, Ltd.), isocyanate skeleton: isophorone diisocyanate terpolymer, number of carbon-carbon double bonds: 15, weight average molecular weight 5,000, isophorone diisocyanate skeleton

b: For urethane acrylate oligomers obtained by reacting 2,4-toluene diisocyanate with dipentaerythritol pentaacrylate at a molar ratio of 1: 2, isocyanate skeleton: 2,4-toluene diisocyanate, Number of carbon-carbon double bonds: 10, weight average molecular weight 5,000, toluene diisocyanate skeleton

c: UN-904 (manufactured by Genjo Industries, Ltd.), isocyanate skeleton: hexamethylene diisocyanate, number of carbon-carbon double bonds: 10, weight average molecular weight 5,000, no isophorone diisocyanate and toluene diisocyanate skeleton

d: UF-8001G (manufactured by Kyoeisha Chemical Co., Ltd.), isocyanate skeleton: isophorone diisocyanate monomer, carbon-carbon double bond number: 2, weight average molecular weight 4,500, isophorone diisocyanate skeleton

e: Urethane acrylate oligomer formed by reacting pentaerythritol triacrylate with 2,4-toluene diisocyanate at a molar ratio of 1: 2

Isocyanate backbone: 2,4-toluene diisocyanate, number of carbon-carbon double bonds: 6, weight average molecular weight: 1,000, with toluene diisocyanate backbone

f: UN-905 (manufactured by Genjo Industries, Ltd.), isocyanate skeleton: isophorone diisocyanate terpolymer, number of carbon-carbon double bonds: 15, weight average molecular weight: 40,000 to 200,000, and isophorone diisocyanate skeleton

(hardener)

a: Coronate L-45E (manufactured by Tosoh Corporation), an adduct of 2,4-toluene diisocyanate and trimethylolpropane

b: E-5XM (manufactured by Soken Chemical Co., Ltd.), N, N, N ’, N’-tetraepoxypropyl-1,3-benzenedi (methaneamine)

(Photopolymerization initiator)

a: IRGACURE651 (manufactured by BASF), benzyldimethylketal

b: IRGACURE127 (manufactured by BASF), 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propanyl) -benzyl] phenyl} -2-methyl-propane- 1-keto

<Evaluation>

The evaluation is performed as follows.

(1) Young's modulus measurement method

In the present invention, the Young's modulus is measured under the following conditions of the tensile test method in accordance with JIS K 7113 (tensile test method for plastic films and sheets). The Young's modulus uses the initial straight portion of the tensile stress-strain curve, and is defined by the formula Em = △ σ / △ ε. The average value of the measured values in the transverse direction (TD) of the direction. Here, Em: Young's modulus (tensile elastic modulus, Pa), Δσ: difference (Pa) of stress obtained from the original average cross-sectional area between two linear points, Δε: same 2 The difference in strain between points.

Device: RTG1210 (manufactured by ORIENTEC)

Width: 20mm

Distance between chucks: 50mm

Stretching speed: 5mm / min

(2) Weight average molecular weight (Mw)

Determined by gel permeation chromatography (GPC).

Device: GPC-8020 SEC system (manufactured by Tosoh Corporation)

Column: TSK Guard HZ-L + HZM-N 6.0 × 150mm × 3

Flow: 0.5ml / min

Detector: RI-8020

Concentration: 0.2wt / Vol%

Injection volume: 20 μL

Column temperature: 40 ℃

System temperature: 40 ° C

Solvent: THF

Calibration curve: prepared using standard polystyrene (PL company)

Weight average molecular weight (Mw): Polystyrene conversion value

(3) Evaluation of chipping, wafer retention, picking, and adhesion

The semiconductor processing adhesive tape was bonded to a silicon wafer having a diameter of 8 inches and a thickness of 0.15 mm and a ring frame, and was cut and picked up.

The conditions of the cutting step are as follows.

Cutting device: DAD341 by DISCO

Cutter: NBC-ZH205O-27HEEE, manufactured by DISCO

Cutting knife shape: 55.56mm outer diameter, 35μm blade width, 19.05mm inner diameter

Cutting knife rotation: 40,000rpm

Cutting knife feed speed: 100mm / s

Cutting size: 1.0mm square

Cut-in amount for adhesive tape: 30 μm

Cutting water temperature: 25 ℃

Cutting water volume: 1.0 liter / minute

The light irradiation step was performed using UVC-4800-4 manufactured by USHIO Electric Co., Ltd., and irradiated with an illuminance of 365 nm in a wavelength of 280 mW / cm ² and a cumulative irradiation amount of 150 mJ / cm ² .

The conditions of the picking step are as follows.

Pickup device: CAP-300II by Canon Machinery

Expansion: 8mm

Pin shape: 70μmR

Number of pins: 1

Pin jack height: 0.5mm

The evaluation of collapse and the like is as follows.

(3-1) chipping

The chipping was performed by randomly selecting 50 picked wafers, and observing the four sides of the back surface of the wafer with a microscope at 500 times. The size of the largest defect was evaluated by the following criteria.

◎ (Excellent): The size of the largest defect is less than 25 μm

○ (Good): The size of the largest defect is 25 μm or more and less than 50 μm

× (Failure): The size of the largest defect is 50 μm or more

(3-2) Wafer retention

The wafer retentivity was evaluated after the dicing step based on the remaining percentage (number) of semiconductor wafers held by the semiconductor wafer to-be-adhered sheet by the following criteria.

◎ (Excellent): The chip scattering is less than 5%

○ (Good): The chip scattering is more than 5% and less than 10%

× (Failure): The scattering of the wafer is more than 10%

(3-3) Pickup

The pick-up property is evaluated in the pick-up step based on the semiconductor wafer pick-up rate (number) by the following criteria.

◎ (Excellent): The picking success rate of the wafer is above 95%

○ (Good): The pick-up success rate of the wafer is more than 80% and less than 95%

× (Failure): The success rate of wafer picking is less than 80%

(3-4) Adhesive ability

Adhesive ability is between 1mPa and 5cm in diameter fluororesin-based roller 1 and rubber roller 2 which are tightly adhered, and is used for winding the adhesive tape 3 with an adhesive layer arranged on the fluororesin-based roller side at 1m / sec. get on Evaluation (see Figure 1). The evaluation was performed in a room with a room temperature of 23 ± 2 ° C and a humidity of 50 ± 2%.

◎ (excellent): The tape winding system is smaller than 1/4 of the circumference of the fluororesin-based roller.

○ (Good): 1/4 or more and less than 1/3 of the circumference of the roll-up fluororesin-based roll of the tape

× (Failure): 1/3 or more of the circumference of the fluororesin-based roll of the tape

(3-5) Comprehensive judgment

In the evaluation from the collapse to the adhesion ability described above, the worst evaluation result was comprehensively judged.

From the results of Tables 1 and 2, it can be seen that the adhesiveness of the adhesive tape system for semiconductor processing in Examples 1 to 12 during mounting was good, the wafer scattering and chipping in the dicing step was suppressed, and it was easily peeled off in the picking step. . It should be noted that the comparative examples are defective as described below.

In Comparative Example 1, since the Young's modulus of the vinyl chloride film was low, it was judged that defects occurred in chipping, picking property, and adhesion ability.

In Comparative Examples 2 and 3, a carboxyl group or a hydroxyl group was contained in the (meth) acrylate copolymer, and it was judged that the pick-up property was defective.

In Comparative Example 4, since the parts by mass of the photopolymerizable compound were too small, it was judged that defects occurred in the pick-up property and the wafer holding property.

In Comparative Example 5, since the mass parts of the photopolymerizable compound were excessive, it was judged that defects occurred in chipping, picking property, and adhesion ability.

In Comparative Example 6, since the isocyanate skeleton possessed by the photopolymerizable compound was hexamethylene diisocyanate, it was judged that a defect occurred in the adhesion ability.

In Comparative Example 7, since the number of carbon-carbon double bonds of the photopolymerizable compound was small, it was judged that a defect occurred in the pickup property.

In Comparative Example 8, the weight-average molecular weight of the photopolymerizable compound was inappropriate, and it was judged that the adhesion to the wafer was poor, and defective wafer retention occurred.

In Comparative Example 9, since the mass parts of the hardener were too small, it was judged that defects occurred in chipping and adhesion.

In Comparative Example 10, since the mass parts of the hardener were excessive, it was judged that a defect occurred in the wafer holding property.

In Comparative Example 11, since the parts by mass of the photopolymerization initiator were too small, it was judged that a defect occurred in the pickup property.

In Comparative Example 12, since the mass parts of the photopolymerization initiator were excessive, it was judged that a defect occurred in pick-up property.

Industrial availability

According to the adhesive tape of the present invention, even in a processing device where the adhesive surface is in contact with the roller, it is difficult to adhere closely to the roller, and even if an automated processing device is used, it can be easily peeled off in the picking step. Therefore, the adhesive tape system of the present invention can be applied to the manufacture of semiconductor wafers or semiconductor parts manufactured by cutting, picking, and the like.

1‧‧‧ fluororesin roll

2‧‧‧ rubber roller

3‧‧‧ Adhesive tape for semiconductor processing

4‧‧‧ Adhesion due to entrainment

Claims (3)

An adhesive tape for semiconductor processing is an adhesive tape for semiconductor processing having an adhesive layer on a vinyl chloride film, wherein the Young's modulus of the vinyl chloride film is 200 to 500 MPa; the adhesive layer contains no hydroxyl and carboxyl groups (Meth) acrylate polymer, and contains 20 to 150 parts by mass of a photopolymerizable compound and 0.1 to 10 parts by mass of a hardener relative to 100 parts by mass of the (meth) acrylate polymer. And 0.1 parts by mass to 10 parts by mass of a photopolymerization initiator; the photopolymerizable compound is a urethane acrylate, and the urethane acrylate has an isophorone diisocyanate skeleton or a toluene diisocyanate skeleton, The weight average molecular weight is 1,000 to 10,000, and the number of carbon-carbon double bonds is 6 to 15. The adhesive tape for semiconductor processing according to claim 1, wherein the hardener has an isocyanate group or an epoxy group. A method for manufacturing a semiconductor wafer or a semiconductor part, comprising: attaching a semiconductor wafer or a substrate and a dicing frame with a step of attaching the adhesive tape for semiconductor processing as claimed in claim 1 or 2; cutting the semiconductor wafer or the A cutting step of obtaining a semiconductor wafer or a semiconductor part from a substrate; a step of irradiating ultraviolet light to the adhesive tape for semiconductor processing; an expanding step of stretching the adhesive tape for semiconductor processing; and picking up the semiconductor from the adhesive tape for semiconductor processing A step of picking up a wafer or the semiconductor part.