JP6829250B2 - Adhesive tape for semiconductor processing and manufacturing method of semiconductor chips or semiconductor parts using it - Google Patents

Description

The present invention relates to an adhesive tape for semiconductor processing and a method for manufacturing a semiconductor chip or a semiconductor component using the adhesive tape.

The adhesive tape for semiconductor processing may be conveyed by the rotation of two conveying rolls. At that time, if the adhesive force of the adhesive layer is too large, it adheres to the roll and the roll is wound ( (Hereinafter referred to as mounter), there were times when smooth transportation was not possible. In addition, the conveyed adhesive tape is attached to a semiconductor wafer or substrate on which a circuit is formed, and is cut into small element pieces (dicing), the adhesive tape is stretched (expanding), and the small element pieces are peeled off from the adhesive tape (pickup). Moved to the process. It is desirable that the adhesive tape used in these steps has sufficient adhesive strength against the element pieces (chips) that are cut during dicing, and that the adhesive strength is reduced to the extent that no adhesive remains during pickup. Is done.

In order to achieve the above object, an adhesive layer that undergoes a polymerization curing reaction by ultraviolet rays or the like is applied to a base film that is transparent to active rays of both ultraviolet rays and electron beams or one of ultraviolet rays and electron beams. (See Patent Documents 1 and 2). This adhesive tape is used in a step of irradiating the pressure-sensitive adhesive layer with ultraviolet rays or the like after the dicing step, polymerizing and curing the pressure-sensitive adhesive layer to reduce the adhesive strength, and then picking up the cut chips.
International Publication No. 2011/077835 Japanese Unexamined Patent Publication No. 2006-049509

The present invention uses an adhesive tape for semiconductor processing, which suppresses excessive wrapping around the transport roll due to close contact even when transported by rotation of a plurality of transport rolls, and which can be easily peeled off in the pickup process, and an adhesive tape thereof. The present invention is to provide a method for manufacturing a semiconductor chip or a semiconductor component.

The present invention employs the following means in order to solve the above problems.
(1) An adhesive tape for semiconductor processing having an adhesive layer on a vinyl chloride film.
The Young's modulus of the vinyl chloride film is 200 to 500 MPa.
The pressure-sensitive adhesive layer contains a (meth) acrylic acid ester polymer having no hydroxyl group and a carboxyl group.
20 parts by mass to 150 parts by mass of the photopolymerizable compound, 0.1 parts by mass to 10 parts by mass of the curing agent, and 0.1 parts by mass of the photopolymerization initiator with respect to 100 parts by mass of the (meth) acrylic acid ester polymer. Contains 10 parts by mass,
The photopolymerizable compound is a urethane acrylate having an isophorone diisocyanate skeleton or a tolylene diisocyanate skeleton, a weight average molecular weight of 1,000 to 10,000, and a carbon-carbon double bond number of 6 to 15. , Adhesive tape for semiconductor processing.
(2) The adhesive tape for semiconductor processing according to (1), wherein the curing agent has an isocyanate group or an epoxy group.
(3) A sticking step of sticking the adhesive tape for semiconductor processing according to (1) or (2) to a semiconductor wafer or substrate and a dicing frame.
A dicing step of dicing the semiconductor wafer or the substrate to obtain a semiconductor chip or a semiconductor component.
A light irradiation step of irradiating the adhesive tape for semiconductor processing with ultraviolet rays,
A method for manufacturing a semiconductor chip or a semiconductor component, comprising an expanding step of stretching the adhesive tape for semiconductor processing and a pick-up step of picking up the semiconductor chip or the semiconductor component from the adhesive tape for semiconductor processing.

The adhesive tape for semiconductor processing according to the present invention as described above can suppress excessive wrapping around the transport roll due to close contact even when transported by rotation of a plurality of transport rolls, and can be easily peeled off in the pickup process. In the method for manufacturing a semiconductor chip or a semiconductor component using this adhesive tape for semiconductor processing, the semiconductor chip or the semiconductor component can be easily picked up.

It is explanatory drawing about the transfer of the tape by the rotation of two transfer rolls.

Hereinafter, suitable embodiments for carrying out the present invention will be described. It should be noted that the embodiments described below show an example of typical embodiments of the present invention, and the scope of the present invention is not narrowly interpreted by this. In the present specification, "(meth) acrylic acid" means both acrylic acid and methacrylic acid, and "(meth) acrylate" means both acrylate and methacrylate. Further, the "semiconductor chip" refers to a chip obtained by fragmenting a silicon wafer or the like, and the "semiconductor component" refers to a chip obtained by packaging a chip into individual pieces.

Hereinafter, the embodiment of the present invention will be described in more detail.
[Adhesive tape for semiconductor processing]
The adhesive tape for semiconductor processing has an adhesive layer on a vinyl chloride film. Hereinafter, each member of the adhesive tape for semiconductor processing will be described.

<Vinyl chloride film>
As the material of the vinyl chloride film, a vinyl chloride resin (polyvinyl chloride) and, if necessary, a plasticizer and a stabilizer are used, and those obtained by kneading these and then forming a film are used. Examples of the vinyl chloride resin include a vinyl chloride homopolymer; a copolymer of vinyl chloride and a monomer such as ethylene, propylene, acrylic nitrile, vinylidene chloride, and vinyl acetate; MBS, ABS, and nitrile rubber on polyvinyl chloride. , Chlorinated polyethylene, ethylene vinyl alcohol-vinyl chloride graft copolymer, and modified polyvinyl chloride resin to which various plastic agents are added.

As the plasticizer, for example, a phthalate ester plasticizer such as dioctyl phthalate, an epoxy plasticizer such as epoxidized soybean oil, and a polyester plasticizer such as polyethylene glycol diester phthalate can be used. The Young's modulus of the vinyl chloride film can be adjusted by the amount of the plasticizer added. The Young's modulus of the vinyl chloride film is 200 MPa to 500 MPa, preferably 250 MPa to 400 MPa. The amount of the plasticizer added to satisfy the Young's modulus in this range can be, for example, 23 parts by mass to 30 parts by mass with respect to 100 parts by mass of the vinyl chloride resin. If the Young's modulus is less than 200 MPa, it becomes easier to adhere to the roll when the tape is attached, and if the Young's modulus is larger than 500 MPa, the adjacent semiconductor chip of the semiconductor chip to be picked up at the time of pickup will be separated by the impact of pin pushing. So-called chip dispersal occurs. The Young's modulus is a value measured in accordance with the tensile test method of JIS K 7113 (tensile test method for plastic films and sheets).

The stabilizer is not particularly limited, and is, for example, an epoxy-based stabilizer, a barium-based stabilizer, a calcium-based stabilizer, a tin-based stabilizer, a zinc-based stabilizer, a calcium-zinc-based (Ca-Zn-based) or barium-zinc stabilizer. Complex stabilizers such as systems (Ba-Zn system), metal soaps such as fatty acid calcium, fatty acid zinc, and fatty acid barium, hydrotalcites, β-diketone compounds, and copolymers of glycidyl methacrylate and methyl methacrylate. Be done. These stabilizers may be used alone or in combination of two or more. The content of the stabilizer is not particularly limited and may be 1 part by mass to 15 parts by mass with respect to 100 parts by mass of the vinyl chloride resin.

The method for forming a film of vinyl chloride resin is not particularly limited, and a calendar film forming method and a T-die processing method can be used.

The thickness of the vinyl chloride film is preferably 30 μm to 200 μm, more preferably 50 to 150 μm.

The vinyl chloride film may be subjected to antistatic treatment. Examples of the antistatic treatment include a treatment of blending an antistatic agent with a vinyl chloride film, a treatment of applying an antistatic agent to the surface of the vinyl chloride film, and a treatment by corona discharge.

As the antistatic agent, for example, a quaternary amine salt monomer or the like can be used. Examples of the quaternary amine salt monomer include dimethylaminoethyl (meth) acrylate quaternary chloride, diethylaminoethyl (meth) acrylate quaternary chloride, methylethylaminoethyl (meth) acrylate quaternary chloride, and p-dimethyl. Aminostyrene quaternary chloride and p-diethylaminostyrene quaternary chloride can be mentioned. Of these, dimethylaminoethyl methacrylate quaternary chloride is preferable.

In order to improve the expandability after dicing, a slip agent can be applied to the adhesive non-contact surface of the vinyl chloride film, or the slip agent can be kneaded into the vinyl chloride film.

The slip agent is not particularly limited as long as it is a substance that reduces the coefficient of friction between the adhesive tape and the expanding device, and is, for example, a silicone compound such as a silicone resin or a (modified) silicone oil, a fluororesin, a hexagonal boron nitride, carbon black, and the like. Examples thereof include molybdenum disulfide. These friction reducing agents may be a mixture of a plurality of components. Since the electronic components are manufactured in a clean room, it is preferable to use a silicone compound or a fluororesin. Among silicone compounds, a copolymer having a silicone macromonomer unit is preferably used because it has good compatibility with an antistatic agent and can balance antistatic property and expandable property.

The method of using the slip agent and the antistatic agent is not particularly limited, but for example, an adhesive may be applied to one side of the vinyl chloride film, and both or one of the slip agent and the antistatic agent may be applied to the back surface of the vinyl chloride film. And / or one of the antistatic agent may be kneaded into the resin of the vinyl chloride film to form a sheet.

The vinyl chloride film can have an adhesive laminated on one side, and the other side can be an embossed surface having an average surface roughness (Ra) of 0.3 μm to 1.5 μm. By installing the embossed surface on the mechanical table side of the expanding device, the vinyl chloride film can be easily expanded (stretched) in the expanding step after dicing.

<Adhesive layer>
The pressure-sensitive adhesive layer is a layer formed by using a pressure-sensitive adhesive, and contains a (meth) acrylic acid ester polymer having no hydroxyl group and a carboxyl group, a photopolymerizable compound, a curing agent, and a photopolymerization initiator. That is, the pressure-sensitive adhesive layer can be formed by using an adhesive containing a (meth) acrylic acid ester polymer having no hydroxyl group and a carboxyl group, a photopolymerizable compound, a curing agent, and a photopolymerization initiator. Hereinafter, each member of the pressure-sensitive adhesive layer will be described.

((Meta) acrylic acid ester copolymer)
The (meth) acrylic acid ester copolymer does not have a hydroxyl group and a carboxyl group. Hereinafter, "a (meth) acrylic acid ester copolymer having no hydroxyl group and a carboxyl group" is also simply referred to as "(meth) acrylic acid ester copolymer". Examples of the (meth) acrylic acid ester copolymer having no hydroxyl group and carboxyl group include a copolymer of an acrylic acid ester containing no hydroxyl group and a carboxyl group such as methyl (meth) acrylate, or copolymerization with these monomers. It is a copolymer obtained by copolymerizing a possible unsaturated monomer (for example, vinyl acetate, styrene, acrylonitrile). Since it does not contain a carboxyl group and a hydroxyl group, it can be easily peeled off when picking up even when an automated processing device is used, which may not be easily peeled off in the pickup process with a conventional adhesive tape.

Examples of the ester monomer of the (meth) acrylic polymer containing no hydroxyl group and carboxyl group include n-butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, and pentyl (meth). Acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, ethyl acrylate, 2 −methoxyethyl acrylate, isopropyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate and the like can be mentioned.

(Photopolymerizable compound)
The photopolymerizable compound is a urethane acrylate having an isophorone diisocyanate skeleton or a tolylene diisocyanate skeleton. As the urethane acrylate, a urethane acrylate oligoma is used. The urethane acrylate oligoma is obtained by reacting a (meth) acrylate having a hydroxyl group with a terminal isocyanate urethane prepolymer obtained by reacting a polyol compound such as a polyester type or a polyether type with a polyisocyanate compound.

As the polyol compound for synthesizing the terminal isocyanate urethane prepolymer, for example, polyester diol, polyether diol, polycaprolactone diol, polycarbonate diol and the like can be used. The polyisocyanate compound includes, for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, isophorone diisocyanate, and a trimer thereof in order to obtain a urethane acrylate having an isophorone diisocyanate skeleton or a tolylene diisocyanate skeleton. , And an adduct with trimethylolpropane can be used.

As the (meth) acrylate having a hydroxyl group, for example, pentaerythritol triacrylate, glycidol di (meth) acrylate, dipentaerythritol pentaacrylate and the like can be used.

The blending amount of the photopolymerizable compound is 20 parts by mass to 150 parts by mass, more preferably 60 parts by mass to 110 parts by mass with respect to 100 parts by mass of the above-mentioned (meth) acrylic acid ester copolymer. If the blending amount of the photopolymerizable compound is less than 20 parts by mass, the peelability of the adhesive tape after light irradiation is lowered, and the pickup failure of the semiconductor chip is likely to occur. On the other hand, if the blending amount of the photopolymerizable compound is more than 150 parts by mass, the elastic modulus of the pressure-sensitive adhesive becomes excessively high in the light irradiation step, and the chips are loosened in the pick-up step, which causes a decrease in productivity. ..

The photopolymerizable compound has a weight average molecular weight (Mw) of 1,000 to 10,000, more preferably 3,000 to 8,000. If the weight average molecular weight is less than 1,000, the adhesion to the roll becomes high, and if the weight average molecular weight is larger than 10,000, the chips are peeled off during dicing, so-called chip skipping occurs. The weight average molecular weight (Mw) can be determined by a gel permeation chromatography (GPC) method.

The number of carbon-carbon double bonds of the photopolymerizable compound is 6 to 15, more preferably 9 to 15. If the number of carbon-carbon double bonds is less than 6, the adhesive strength is not sufficiently reduced and pickup failure occurs. In order to form a structure having a carbon-carbon double bond number of 6 to 15, it can be adjusted by a combination of a polyisocyanate compound of a terminal isocyanate urethane prepolymer and a (meth) acrylate having a hydroxyl group. When the polyisocyanate compound has two isocyanate groups such as 2,4-tolylene diisocyanate and 2,6-tolylene diisocyanate, pentaerythritol triacrylate is a (meth) acrylate having three or more hydroxyl groups. And dipentaerythritol pentaacrylate are used. Further, when having three isocyanate groups such as the trimer or adduct of the isocyanate, glycidol di (meth) acrylate, which is a (meth) acrylate having two hydroxyl groups, can also be used. Those with more than 15 carbon-carbon double bonds are difficult to obtain and expensive. The number of carbon-carbon double bonds can be measured by a titration method.

(Hardener)
The curing agent preferably has an isocyanate group or an epoxy group, and examples thereof include a polyfunctional isocyanate curing agent and a polyfunctional epoxy curing agent. Examples of the polyfunctional isocyanate curing agent include an aromatic polyisocyanate curing agent, an aliphatic polyisocyanate curing agent, and an alicyclic polyisocyanate curing agent, and a trimer of these or an adduct with trimethylolpropane can be used. it can.

The aromatic polyisocyanate curing agent is not particularly limited, and is, for example, 1,3-phenylenediocyanate, 4,4'-diphenyldiisocyanate, 1,4-phenylenediocyanate, 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate. Isocyanate, 2,6-tolylene diisocyanate, 4,4'-toluidin diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4', 4'-triphenylmethane triisocyanate, ω, ω'-diisocyanate-1,3-dimethylbenzene, ω, ω'-diisocyanate-1,4-dimethylbenzene, ω, ω'-diisocyanate-1 , 4-Diethylbenzene, 1,4-tetramethylxylylene diisocyanate, 1,3-tetramethylxylylene diisocyanate and the like.

The aliphatic polyisocyanate curing agent is not particularly limited, and for example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, and 1,3-butylene diisocyanate. , Dodecamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate and the like.

The alicyclic polyisocyanate curing agent is not particularly limited, and for example, 3-isocyanate methyl-3,5,5-trimethylcyclohexylisocyanate, 1,3-cyclopentanediisocyanate, 1,3-cyclohexanediisocyanate, 1,4-cyclohexane. Diisocyanate, methyl-2,4-cyclohexanediisocyanate, methyl-2,6-cyclohexanediisocyanate, 4,4'-methylenebis (cyclohexylisocyanate), 1,4-bis (isocyanatemethyl) cyclohexane, and 1,4-bis (isocyanate) Methyl) cyclohexane and the like can be mentioned.

The adduct with trimer or trimethylolpropane is not particularly limited, and an adduct with 2,4-tolylene diisocyanate and trimethylolpropane is preferably used.

The polyfunctional epoxy curing agent mainly refers to a compound having 2 or more epoxy groups and 1 or more tertiary nitrogen atoms, and refers to N, N-glycidyl aniline, N, N-glycidyl toluidine, m-N, N-glycidyl amino. Phenylglycidyl ether, p-N, N-glycidylaminophenylglycidyl ether, triglycidyl isocyanurate, N, N, N', N'-tetraglycidyldiaminodiphenylmethane, N, N, N', N'-tetraglycidyl-m -Xylylene diamine, N, N, N', N', N "-pentaglycidyldiethylenetriamine and the like can be mentioned.

The blending amount of the curing agent is 0.1 part by mass to 10 parts by mass, preferably 1 part by mass to 9 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester copolymer. If the amount of the curing agent blended is less than 0.1 parts by mass, problems tend to occur in chipping (chip chipping) and mounter suitability (degree of wrapping around the transport roll). On the other hand, if the blending amount of the curing agent is more than 10 parts by mass, the adhesive strength is insufficient and the chips are loosened, which causes a decrease in productivity.

(Photopolymerization initiator)
The photopolymerization initiator is not particularly limited, but benzoins, benzoin alkyl ethers, acetophenones, anthraquinones, thioxanthones, ketals, benzophenones, xanthones and the like are used.

Examples of benzoin include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether and the like.
Examples of acetophenones include benzoin alkyl ethers, acetophenone, 2,2-dimethoxy-2-acetophenone, 2,2-diethoxy-2-acetophenone, 1,1-dichloroacetophenone, and 2-hirodoxy-1- {4-[ There are 4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propan-1-one and the like.
Examples of anthraquinones include 2-methylanthraquinone, 2-ethylanthraquinone, 2-tershalibutyl anthraquinone, 1-chloroanthraquinone and the like.
Examples of thioxanthones include 2,4-dimethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone and the like.
Examples of ketals include acetophenone dimethyl ketal, benzyl dimethyl metall, benzyl diphenylsulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, β-chloranthraquinone and the like.

The blending amount of the photopolymerization initiator is 0.1 part by mass to 10 parts by mass, preferably 1 part by mass to 9 parts by mass with respect to 100 parts by mass of the above-mentioned (meth) acrylic acid ester polymer. If the blending amount of the photopolymerization initiator is less than 0.1 parts by mass, the peelability from the adhesive tape after light irradiation is lowered, and the pickup failure of the semiconductor chip is likely to occur. On the other hand, if the blending amount of the photopolymerization initiator is more than 10 parts by weight, the adhesive strength after UV irradiation is excessively lowered, and chip dispersal occurs.

As the photopolymerization initiator, one or a combination of two or more conventionally known photopolymerization accelerators may be used in combination, if necessary. As the photopolymerization accelerator, a benzoic acid-based agent, a tertiary amine or the like can be used. Examples of the tertiary amine include triethylamine, tetraethylpentamine, dimethylamino ether and the like.

(Adhesive-imparting resin)
A terpene phenol resin completely or partially hydrogenated with a terpene phenol resin may be added to the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer as the pressure-imparting resin.

(Additives, etc.)
Various additives such as a softening agent, an antiaging agent, a filler, a conductive agent, an ultraviolet absorber, and a light stabilizer may be added to the pressure-sensitive adhesive. The content of the additive is not particularly limited, and may be 0 parts by mass to 5 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester polymer.

The thickness of the pressure-sensitive adhesive layer is preferably 5 μm to 15 μm. If the pressure-sensitive adhesive layer is thicker than 15 μm, chipping is likely to occur. Further, if the pressure-sensitive adhesive layer is thinner than 5 μm, the adhesive strength becomes too low, and the chip retention during dicing may be lowered to cause chip skipping, or peeling may occur between the ring frame and the sheet.

<Adhesive tape for semiconductor processing>
The adhesive tape for semiconductor processing according to the present embodiment does not cause excessive wrapping around the roll due to close contact when it is conveyed by the rotation of the two conveying rolls, and even if an automated processing apparatus is used, the pickup process is performed. Can be easily peeled off.

<Manufacturing of adhesive tape for semiconductor processing>
An adhesive layer is applied on a vinyl chloride film to obtain an adhesive tape for semiconductor processing. The method includes, for example, a method of directly applying the adhesive on the vinyl chloride film with a coater such as a gravure coater, a comma coater, a bar coater, a knife coater or a roll coater, or a method of applying the adhesive to the release film / drying and then the vinyl chloride film. There is a way to paste it on. The adhesive may be printed on the vinyl chloride film by convex plate printing, concave plate printing, flat plate printing, flexographic printing, offset printing, screen printing or the like.

[Manufacturing method of semiconductor chips or semiconductor parts]
The method for manufacturing a semiconductor chip or a semiconductor component includes a step of attaching an adhesive tape for semiconductor processing, a dicing step, a light irradiation step, an expanding step, and a picking step in this order.

(1) Pasting step In the pasting step, the adhesive tape for semiconductor processing is pasted on the semiconductor wafer or substrate and the dicing frame (ring frame). The sticking step can be, for example, a step of sticking the semiconductor wafer or the substrate to the adhesive tape for semiconductor processing, and then sticking the adhesive tape for semiconductor processing to the ring frame to fix it. The wafer may be a conventional general-purpose wafer such as a silicon wafer, a gallium nitride wafer, a silicon carbide wafer, or a sapphire wafer. The substrate may be a general-purpose substrate such as a package substrate in which a chip is sealed with a resin, an LED package substrate, or a ceramic substrate.

(2) Dicing process In the dicing process, a silicon wafer or the like is diced to obtain a semiconductor chip or a semiconductor component. For example, a dicing blade (circular rotary blade made of diamond, etc.) is rotated at high speed, and a semiconductor wafer or substrate is cut to cut a semiconductor chip or semiconductor component while cooling with pure water or the like as necessary and washing away cutting chips. obtain.

(3) Light Irradiation Step In the light irradiation step, the photocurable pressure-sensitive adhesive layer is irradiated with active rays such as ultraviolet rays from the vinyl chloride film side. As a light source of ultraviolet rays, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, and a black light can be used. Further, an electron beam may be used instead of the ultraviolet ray, and α ray, β ray, and γ ray can be used as the light source of the electron beam.

The pressure-sensitive adhesive layer is three-dimensionally networked and hardened by light irradiation, and the adhesive strength of the pressure-sensitive adhesive layer is reduced. Since the adhesive tape for semiconductor processing according to the present embodiment does not excessively adhere to the wafer or the like even when heated, a sufficient decrease in adhesive strength can be obtained by irradiation with ultraviolet rays or the like.

(4) Expanding step, (5) Picking up step In the expanding step, the adhesive tape is stretched to widen the distance between the semiconductor chips or the semiconductor parts, and the chips or parts are pushed up with a needle pin or the like. After that, the chip or component is adsorbed by a vacuum collet or air tweezers, peeled from the adhesive layer of the adhesive tape for semiconductor processing, and picked up (pickup process). In the adhesive tape according to the present embodiment, the adhesive strength is sufficiently reduced while maintaining the elastic modulus of the adhesive by irradiation with ultraviolet rays or the like, so that the chip or part and the adhesive layer can be easily peeled off. Therefore, the pickup is good, and defects such as adhesive residue do not occur.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the interpretation of the present invention is not limited by these Examples.
(Example 1)
The adhesive tape according to Example 1 was produced by the following formulation. The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape is a photopolymerizable compound a (UN-3320HS, Negami Kogyo Co., Ltd.) in 100 parts by mass of the (meth) acrylic acid ester copolymer a (AR-72L, manufactured by Nippon Zeon Co., Ltd.). Peel off the adhesive solution containing 85 parts by mass of the polyfunctional isocyanate curing agent a (Coronate L-45E, manufactured by Toso) and 5 parts by mass of the photopolymerization initiator a (Irgacure651, manufactured by BASF). A pressure-sensitive adhesive layer is formed by applying the pressure-sensitive adhesive layer on the film with a polymer coater so that the thickness after drying is 10 μm, and the pressure-sensitive adhesive layer is applied on vinyl chloride film b (FUZB-2950, manufactured by Achilles, thickness 80 μm). Adhesive tape was obtained by laminating on.

(Examples 2 to 16, Comparative Examples 1 to 12)
Adhesive tapes of Examples 2 to 16 and Comparative Examples 1 to 12 were obtained in the same manner as in Example 1 except that the formulations shown in Tables 1 and 2 were used.

The numerical values for the (meth) acrylic acid ester polymer, the photopolymerizable compound, the curing agent and the photopolymerization initiator in Tables 1 and 2 are the mass when the (meth) acrylic acid ester copolymer is 100 parts by mass. Indicates a part, etc. The details of the vinyl chloride film, the (meth) acrylic acid ester copolymer, the photopolymerizable compound, the curing agent and the photopolymerization initiator are as follows.

<Vinyl chloride film>
Vinyl chloride film a: GM-311 (manufactured by Diaplus Film), Young's modulus: 110 MPa
Vinyl chloride film b: FUZB-2950 (manufactured by Achilles), Young's modulus: 200 MPa
Vinyl chloride film c: FUZB-2850 (manufactured by Achilles), Young's modulus: 260 MPa
Vinyl chloride film d: FUZB-2650 (manufactured by Achilles), Young's modulus: 350 MPa
Vinyl chloride film e: FUZB-2550 (manufactured by Achilles), Young's modulus: 450 MPa

<Adhesive layer>
((Meta) acrylic acid ester copolymer)
a: A copolymer of AR-72L (manufactured by Nippon Zeon), n-butyl acrylate 15% by mass, ethyl acrylate 70% by mass, 2-methoxyethyl acrylate 15% by mass, Tg: -32.0 ° C., weight average molecular weight 1.5 million, no hydroxyl group, no carboxyl group)
b: Copolymer of n-butyl acrylate 14% by mass, ethyl acrylate 70% by mass, 2-methoxyethyl acrylate 15% by mass, acrylic acid 1% by mass, Tg: -30.9 ° C., weight average molecular weight 1.5 million, acrylic With carboxyl group derived from acid c: Copolymer of n-butyl acrylate 14% by mass, ethyl acrylate 70% by mass, 2-methoxyethyl acrylate 15% by mass, 2-hydroxyethyl acrylate 1% by mass, Tg: -31.6 ℃, weight average molecular weight 1.5 million, with hydroxyl groups derived from 2-hydroxyethyl acrylate

(Photopolymerizable compound)
a: UN-3320HS (manufactured by Negami Kogyo Co., Ltd.), isocyanate skeleton: isophorone diisocyanate trimeric, carbon-carbon double bond number: 15, weight average molecular weight 5,000, with isophorone diisocyanate skeleton b: 2,4-triene diisocyanate Urethane acrylate oligoma obtained by reacting dipentaerythritol pentaacrylate with a molar ratio of 1: 2, isocyanate skeleton: 2,4-tolylene diisocyanate, carbon-carbon double bond number: 10, weight average molecular weight 5,000, triene. With diisocyanate skeleton c: UN-904 (manufactured by Negami Kogyo Co., Ltd.), isocyanate skeleton: hexamethylene diisocyanate, number of carbon-carbon double bonds: 10, weight average molecular weight 5,000, isophorone diisocyanate and triene diisocyanate without skeleton d: UF- 8001G (manufactured by Kyoeisha Chemical Co., Ltd.), isocyanate skeleton: isophorone diisocyanate monomer, number of carbon-carbon double bonds: 2, weight average molecular weight 4,500, with isophorone diisocyanate skeleton e: 2,4-triendiisocyanate with pentaerythritol tri Urethane acrylate oligoma isocyanate skeleton obtained by reacting acrylate at a molar ratio of 1: 2, 2,4-tolylene diisocyanate, number of carbon-carbon double bonds: 6, weight average molecular weight: 1,000, with triendiisocyanate skeleton f: UN-905 (manufactured by Negami Kogyo Co., Ltd.), isocyanate skeleton: isophorone diisocyanate trimeric, number of carbon-carbon double bonds: 15, weight average molecular weight: 40,000 to 200,000, with isophorone diisocyanate skeleton

(Hardener)
a: Coronate L-45E (manufactured by Tosoh), adduct of 2,4-tolylene diisocyanate and trimethylolpropane b: E-5XM (manufactured by Soken Chemical Co., Ltd.), N, N, N', N'-tetraglycidyl -1,3-benzenedi (methaneamine)
(Photopolymerization initiator)
a: IRGACURE651 (manufactured by BASF), benzyl dimethyl ketal b: IRGACURE127 (manufactured by BASF), 2-hirodoxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl}- 2-Methyl-Propane-1-one

<Evaluation>
The evaluation was carried out as follows.
(1) Young's modulus measuring method In the present invention, Young's modulus was measured under the following conditions in accordance with the tensile test method of JIS K 7113 (tensile test method for plastic films and sheets). The Young's modulus is defined by the equation Em = Δσ / Δε using the straight line portion at the beginning of the tensile stress-strain curve, and is defined by the measured value in the machining direction (MD) and the machining direction. It is an average value with the measured value in the orthogonal transverse direction (TD). Here, Em: Young's modulus (tensile elastic modulus, Pa), Δσ: difference in stress due to the original average cross-sectional area between two linear points (Pa), Δε: difference in strain between the same two points.
Equipment: RTG1210 (manufactured by Orientec)
Width: 20 mm
Distance between chucks: 50 mm
Tensile speed: 5 mm / min

(2) Weight average molecular weight (Mw)
It was measured by gel permeation chromatography (GPC).
Equipment: GPC-8020 SEC system (manufactured by Tosoh Corporation)
Column: TSK Guard HZ-L + HZM-N 6.0 x 150 mm x 3
Flow rate: 0.5 ml / min
Detector: RI-8020
Concentration: 0.2 wt / Vol%
Injection volume: 20 μL
Column temperature: 40 ° C
System temperature: 40 ° C
Solvent: THF
Calibration curve: Created using standard polystyrene (manufactured by PL) Weight average molecular weight (Mw): Polystyrene conversion value

(3) Evaluation of chipping, chip retention, pick-up property and mounter suitability An adhesive tape for semiconductor processing was attached to a silicon wafer having a diameter of 8 inches and a thickness of 0.15 mm and a ring frame, and dicing and pick-up were performed.

The conditions of the dicing process were as follows.
Dicing device: DAD341 manufactured by DISCO
Dicing blade: NBC-ZH205O-27HEEE manufactured by DISCO
Dicing blade shape: outer diameter 55.56 mm, blade width 35 μm, inner diameter 19.05 mm
Dicing blade rotation speed: 40,000 rpm
Dicing blade Feed speed: 100 mm / sec Dicing size: 1.0 mm square Cut amount into adhesive tape: 30 μm
Cutting water temperature: 25 ° C
Cutting water volume: 1.0 liter / minute

Light irradiation process uses a Ushio Inc. UVC-4800-4, the illuminance of the wavelength 365nm is 280 mW / cm ^2, was irradiated with integrated irradiation dose 150 mJ / cm ^2.

The conditions of the pickup process were as follows.
Pickup device: CAP-300II manufactured by Canon Machinery Inc.
Expanding amount: 8 mm
Needle pin shape: 70 μmR
Number of needle pins: 1 Needle pin push-up height: 0.5 mm

Evaluations such as chipping were performed as follows.
(3-1) Chipping For chipping, 50 chips were randomly selected, the four sides of the back surface of the chips were observed with a microscope of 500 times, and the maximum chip size was evaluated according to the following criteria. ..
◎ (Excellent): Maximum chip size is less than 25 μm ○ (Good): Maximum chip size is 25 μm or more and less than 50 μm × (impossible): Maximum chip size is 50 μm or more

(3-2) Chip Retention The chip retention was evaluated by the following criteria based on the residual ratio (number) of semiconductor chips in which the semiconductor chips were held on the adhesive sheet after the dicing step.
◎ (Excellent): Tip skipping is less than 5% ○ (Good): Tip skipping is 5% or more and less than 10% × (No): Tip skipping is 10% or more

(3-3) Pickup property The pick-up property was evaluated according to the following criteria based on the rate (number) of semiconductor chips that could be picked up in the pickup process.
◎ (excellent): Chip pickup success rate is 95% or more ○ (Good): Chip pickup success rate is 80% or more and less than 95% × (impossible): Chip pickup success rate is less than 80%

(3-4) Mounter suitability The mounter suitability is that the adhesive tape 3 in which the adhesive layer is arranged on the fluororesin-based roll side is placed between the fluororesin-based roll 1 and the rubber roll 2 having a diameter of 5 cm and closely adhered at 1 kPa at 1 m / sec. It was evaluated by the wrapping when it was conveyed (see FIG. 1). This evaluation was carried out indoors at room temperature of 23 ± 2 ° C. and humidity of 50 ± 2%.
◎ (Excellent): Tape wrapping is less than 1/4 of the circumference of the fluororesin roll ○ (Good): Tape wrapping is 1/4 or more and less than 1/3 of the circumference of the fluororesin roll × ( Impossible): Tee wrapping is 1/3 or more of the circumference of the fluororesin roll

(3-5) Comprehensive Judgment In the above evaluation from chipping to mounter aptitude, the worst evaluation result was taken as the comprehensive judgment.

From the results of Tables 1 and 2, the adhesive tapes for semiconductor processing of Examples 1 to 12 have good mounter suitability at the time of tape mounting, can suppress chip skipping and chipping in the dicing process, and are easy in the pickup process. It was found that it could be peeled off. The comparative example was defective as shown below.
In Comparative Example 1, since the Young's modulus of the vinyl chloride film was low, it is considered that poor chipping, pick-up property, and mounter suitability occurred.
In Comparative Examples 2 and 3, since the (meth) acrylic acid ester copolymer contained a carboxyl group or a hydroxyl group, it is considered that the pick-up property was poor.
In Comparative Example 4, it is considered that the pick-up property and the chip retention property were poor because the number of parts by mass of the photopolymerizable compound was too small.
In Comparative Example 5, it is considered that the chipping, the pick-up property, and the mounter suitability were deteriorated because the mass number of the photopolymerizable compound was excessive.
In Comparative Example 6, since the isocyanate skeleton of the photopolymerizable compound is hexamethylene diisocyanate, it is considered that the mounter suitability was poor.
In Comparative Example 7, it is considered that the pick-up property was poor because the number of carbon-carbon double bonds of the photopolymerizable compound was small.
In Comparative Example 8, since the weight average molecular weight of the photopolymerizable compound was not appropriate, it is considered that the adhesion to the chip was poor and the chip retention was poor.
In Comparative Example 9, it is considered that the chipping and mounter suitability were poor because the number of parts by mass of the curing agent was too small.
In Comparative Example 10, it is considered that the chip retention was poor because the number of parts by mass of the curing agent was excessive.
In Comparative Example 11, it is considered that the pick-up property was poor because the number of parts by mass of the photopolymerization initiator was too small.
In Comparative Example 12, it is considered that the pick-up property was poor because the number of parts by mass of the photopolymerization initiator was excessive.

According to the adhesive tape according to the present invention, even in a processing device in which the pressure-sensitive adhesive surface and the roll come into contact with each other, it is difficult to adhere to the roll, and even if an automated processing device is used, the adhesive can be easily peeled off in the pick-up process. Therefore, the adhesive tape according to the present invention is suitably used for manufacturing a semiconductor chip or a semiconductor component manufactured by dicing, picking up, or the like.

1 Fluororesin-based roll 2 Rubber roll 3 Adhesive tape for semiconductor processing 4 Mounter generated by wrapping

Claims (3)

An adhesive tape for semiconductor processing having an adhesive layer on a vinyl chloride film.
The Young's modulus of the vinyl chloride film is 200 to 500 MPa.
The pressure-sensitive adhesive layer contains a (meth) acrylic acid ester polymer having no hydroxyl group and a carboxyl group.
20 parts by mass to 150 parts by mass of the photopolymerizable compound, 0.1 parts by mass to 10 parts by mass of the curing agent, and 0.1 parts by mass of the photopolymerization initiator with respect to 100 parts by mass of the (meth) acrylic acid ester polymer. Contains 10 parts by mass,
The photopolymerizable compound is a urethane acrylate having an isophorone diisocyanate skeleton or a tolylene diisocyanate skeleton, a weight average molecular weight of 1,000 to 10,000, and a carbon-carbon double bond number of 6 to 15. , Adhesive tape for semiconductor processing. The adhesive tape for semiconductor processing according to claim 1, wherein the curing agent has an isocyanate group or an epoxy group. A sticking step of sticking the adhesive tape for semiconductor processing according to claim 1 or 2 to a semiconductor wafer or substrate and a dicing frame.
A dicing step of dicing the semiconductor wafer or the substrate to obtain a semiconductor chip or a semiconductor component.
A light irradiation step of irradiating the adhesive tape for semiconductor processing with ultraviolet rays,
A method for manufacturing a semiconductor chip or a semiconductor component, comprising an expanding step of stretching the adhesive tape for semiconductor processing and a pick-up step of picking up the semiconductor chip or the semiconductor component from the adhesive tape for semiconductor processing.

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