TW201806850A - Composition, method for producing composition, cured film, color filter, light-blocking film, solid-state imaging element, and image display device - Google Patents

Composition, method for producing composition, cured film, color filter, light-blocking film, solid-state imaging element, and image display device Download PDF

Info

Publication number
TW201806850A
TW201806850A TW106109671A TW106109671A TW201806850A TW 201806850 A TW201806850 A TW 201806850A TW 106109671 A TW106109671 A TW 106109671A TW 106109671 A TW106109671 A TW 106109671A TW 201806850 A TW201806850 A TW 201806850A
Authority
TW
Taiwan
Prior art keywords
group
composition
metal nitride
metal
atom
Prior art date
Application number
TW106109671A
Other languages
Chinese (zh)
Other versions
TWI726075B (en
Inventor
久保田誠
Original Assignee
富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=60001079&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW201806850(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 富士軟片股份有限公司 filed Critical 富士軟片股份有限公司
Publication of TW201806850A publication Critical patent/TW201806850A/en
Application granted granted Critical
Publication of TWI726075B publication Critical patent/TWI726075B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00Nitrogen; Compounds thereof
    • C01B21/06Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/22Compounds of iron
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/06Treatment with inorganic compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/10Treatment with macromolecular organic compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D17/00Pigment pastes, e.g. for mixing in paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D17/00Pigment pastes, e.g. for mixing in paints
    • C09D17/004Pigment pastes, e.g. for mixing in paints containing an inorganic pigment
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00Coating compositions based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • C09D7/62Additives non-macromolecular inorganic modified by treatment with other compounds
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Paints Or Removers (AREA)

Abstract

Provided are: a composition with which a cured film exhibiting an excellent light-blocking performance, an excellent resolution, and an excellent electrode corrosion resistance can be produced; and a method for producing the composition; a cured film; a color filter; a light-blocking film; a solid-state imaging element; and moreover an image display device. The composition contains particles containing a metal nitride that contains specific atoms, and these metal nitride-containing particles contain the nitride of a transition metal from among the transition metals of groups 3-11 excluding titanium, wherein the transition metal has an electronegativity of 1.22-2.36.

Description

組成物、組成物的製造方法、硬化膜、濾色器、遮光膜、固態攝影元件及圖像顯示裝置Composition, manufacturing method of composition, cured film, color filter, light-shielding film, solid-state imaging element, and image display device

本發明係一種組成物、組成物的製造方法、硬化膜、濾色器、遮光膜、固態攝影元件及圖像顯示裝置。The invention relates to a composition, a method for producing the composition, a cured film, a color filter, a light-shielding film, a solid-state imaging element, and an image display device.

一直以來,作為黑色粉末,周知有含有氮化鈦之組成物。含有氮化鈦之組成物用於各種用途,例如,用於製作設置於液晶顯示裝置及固態攝像裝置等之遮光膜。 具體而言,用於液晶顯示裝置之濾色器中,為了遮蔽著色像素之間的光並提高對比度等,具備被稱作黑矩陣之遮光膜。 並且,固態攝影元件中,亦為了防止產生噪聲、提高畫質等而設置有遮光膜。目前,在移動電話及PDA(Personal Digital Assistant(個人數字助理))等電子設備的便攜終端搭載有小型且薄型的攝像模組。該種攝像模組通常具備CCD(Charge Coupled Device(電荷耦合元件))圖像感測器及CMOS(Complementary Metal-Oxide Semiconductor(互補型金屬氧化膜半導體))圖像感測器等固態攝影元件及用於在固態攝影元件上形成被攝體像之透鏡。Conventionally, as a black powder, a composition containing titanium nitride has been known. The composition containing titanium nitride is used in various applications, for example, for producing a light-shielding film provided in a liquid crystal display device, a solid-state imaging device, and the like. Specifically, a color filter used in a liquid crystal display device includes a light-shielding film called a black matrix in order to block light between colored pixels, improve contrast, and the like. In addition, a solid-state imaging element is also provided with a light-shielding film in order to prevent noise and improve image quality. At present, a small and thin camera module is mounted on a portable terminal of an electronic device such as a mobile phone and a PDA (Personal Digital Assistant). This type of camera module usually includes solid-state imaging elements such as CCD (Charge Coupled Device) image sensors and CMOS (Complementary Metal-Oxide Semiconductor) image sensors and A lens for forming a subject image on a solid-state imaging element.

而且,近年來,著眼於特定波長的光的透射率,研究代替氮化鈦使用特定波長的光的透射率更低(遮光性較高)之金屬氮氧化物之黑色粉末。例如,專利文獻1中,公開有“一種藍色遮蔽黑色粉末,其為包含釩或鈮的一種或兩種的氮氧化物之黑色粉末,其特徵為,氧含量16wt%以下及氮含量10wt%以上,粉末濃度50ppm的分散液透過光譜中,450nm的透射率X為10.0%以下。”。 [先前技術文獻] [專利文獻]In addition, in recent years, focusing on the transmittance of light of a specific wavelength, research has been conducted on black powders of metal oxynitrides that have a lower transmittance (higher light-shielding property) of using a specific wavelength of light instead of titanium nitride. For example, Patent Document 1 discloses "a blue masking black powder, which is a black powder containing one or two kinds of nitrogen oxides of vanadium or niobium, characterized by an oxygen content of 16 wt% or less and a nitrogen content of 10 wt%. As described above, in the transmission spectrum of the dispersion having a powder concentration of 50 ppm, the transmittance X at 450 nm is 10.0% or less. " [Prior Art Literature] [Patent Literature]

[專利文獻1]:日本特開2012-96945號公報[Patent Document 1]: Japanese Patent Laid-Open No. 2012-96945

專利文獻1中記載的藍色遮蔽黑色粉末作為具有較高遮光性之黑色顏料,具有優異之性質。但是,依本發明人等的研究,發現將含有如上述的黑色顏料之組成物用於在形成有電極圖案之基板上形成加工成圖案狀之硬化膜時,在解像性的提高及電極圖案的劣化(腐蝕)抑制方面,還有可進一步改善之餘地。另外,解像性表示,相對於所希望的微細圖案,所獲得之圖案形狀更接近所希望的形狀,具體而言,所獲得之圖案形狀不比所希望的形狀粗或細。The blue masking black powder described in Patent Document 1 has excellent properties as a black pigment having high light-shielding properties. However, according to research by the present inventors, it has been found that when a composition containing the black pigment as described above is used to form a patterned cured film on a substrate on which an electrode pattern is formed, the resolution is improved and the electrode pattern is improved. In terms of suppressing deterioration (corrosion), there is room for further improvement. In addition, the resolution indicates that the shape of the obtained pattern is closer to the desired shape than the desired fine pattern, and specifically, the shape of the obtained pattern is not thicker or thinner than the desired shape.

本發明的課題在於提供一種能夠製作具有優異之遮光性、優異之解像性及優異之電極的防腐性之硬化膜之組成物。並且,本發明的課題還在於提供一種組成物的製造方法、硬化膜、濾色器、遮光膜、固態攝影元件及圖像顯示裝置。An object of the present invention is to provide a composition capable of producing a cured film having excellent light shielding properties, excellent resolving properties, and excellent electrode corrosion resistance. Another object of the present invention is to provide a method for producing a composition, a cured film, a color filter, a light-shielding film, a solid-state imaging device, and an image display device.

本發明人等為了解決上述課題而進行了深入研究,其結果,發現一種含有包含規定的原子之含金屬氮化物的粒子之組成物,含金屬氮化物的粒子含有在3~11族的過渡金屬中除鈦以外的過渡金屬且電負性為1.22~2.36之過渡金屬的氮化物之組成物能夠解決上述課題,並完成了本發明。 亦即,發現藉由以下結構能夠解決上述課題。The present inventors have conducted intensive research in order to solve the above-mentioned problems, and as a result, have found a composition containing metal nitride-containing particles containing a predetermined atom, and the metal nitride-containing particles containing a transition metal in groups 3 to 11 A composition of a nitride of a transition metal other than titanium and a transition metal having an electronegativity of 1.22 to 2.36 can solve the above problems, and completed the present invention. That is, it was found that the above problems can be solved by the following configuration.

[1]一種組成物,其含有包含原子A之含金屬氮化物的粒子,其中,含金屬氮化物的粒子含有在3~11族的過渡金屬中除鈦以外的過渡金屬且電負性為1.22~2.36之過渡金屬的氮化物,原子A係與構成過渡金屬的氮化物之過渡金屬不同之元素,係選自由硼、鋁、矽、錳、鐵、鎳及銀所組成的群組中的至少1種,含金屬氮化物的粒子中的原子A的含量為0.00005~10質量%。 [2]如[1]所述之組成物,其中,含金屬氮化物的粒子的導電率為100×104 ~600×104 S/m。 [3]如[1]或[2]所述之組成物,其中,含金屬氮化物的粒子的平均一次粒徑為10~50nm。 [4]如[1]至[3]中任一項所述之組成物,其還含有黏結樹脂。 [5]如[4]所述之組成物,其中,黏結樹脂相對於與含金屬氮化物的粒子的質量比為0.3以下。 [6]如[1]至[5]中任一項所述之組成物,過渡金屬係選自由V、Cr、Y、Zr、Nb、Hf、Ta、W及Re所組成的群組中的至少1種。 [7]如[1]至[6]中任一項所述之組成物,過渡金屬係選自由V及Nb所組成的群組中的至少1種。 [8]如[1]至[7]中任一項所述之組成物,其還含有聚合性化合物。 [9]如[1]至[8]中任一項所述之組成物,其還含有聚合起始劑。 [10]如[1]至[9]中任一項所述之組成物,其還含有溶劑,固體成分為10~40質量%。 [11]如[10]所述之組成物,其中,溶劑含有水,水的含量相對於組成物的總質量,為0.1~1質量%。 [12]如[1]至[11]中任一項所述之組成物,其中,含金屬氮化物的粒子的含量相對於組成物的總固體成分,為20~70質量%。 [13]如[1]至[12]中任一項所述之組成物,其還含有分散劑,分散劑含有選自由聚丙烯酸甲酯、聚甲基丙烯酸甲酯及環狀或鏈狀的聚酯所組成的群組中的至少1種結構。 [14]如[13]所述之組成物,其中,分散劑相對於含金屬氮化物的粒子之質量比為0.05~0.30。 [15]如[1]至[14]中任一項所述之組成物,其中,含金屬氮化物的粒子係被含有氫氧化鋁之無機化合物包覆之含金屬氮化物的粒子。 [16]一種組成物的製造方法,其為製造[1]至[15]中任一項所述之組成物的製造方法,其含有藉由熱電漿法獲得含金屬氮化物的粒子之製程。 [17]一種硬化膜,其使用[1]至[15]中任一項所述之組成物來獲得。 [18]一種濾色器,其含有[17]所述之硬化膜。 [19]一種遮光膜,其含有[17]所述之硬化膜。 [20]一種固態攝影元件,其含有[17]所述之硬化膜。 [21]一種圖像顯示裝置,其含有[17]所述之硬化膜。 [發明效果][1] A composition containing metal nitride-containing particles containing atom A, wherein the metal nitride-containing particles contain a transition metal other than titanium among transition metals of Groups 3 to 11 and have an electronegativity of 1.22 A nitride of a transition metal of ~ 2.36. The atom A is an element different from the transition metal constituting the nitride of a transition metal. It is at least one selected from the group consisting of boron, aluminum, silicon, manganese, iron, nickel, and silver. One type, and the content of the atom A in the metal nitride-containing particles is 0.00005 to 10% by mass. [2] The composition according to [1], wherein the conductivity of the metal nitride-containing particles is 100 × 10 4 to 600 × 10 4 S / m. [3] The composition according to [1] or [2], wherein the average primary particle diameter of the metal nitride-containing particles is 10 to 50 nm. [4] The composition according to any one of [1] to [3], further containing a binding resin. [5] The composition according to [4], wherein the mass ratio of the binder resin to the metal nitride-containing particles is 0.3 or less. [6] The composition according to any one of [1] to [5], wherein the transition metal is selected from the group consisting of V, Cr, Y, Zr, Nb, Hf, Ta, W, and Re At least one. [7] The composition according to any one of [1] to [6], wherein the transition metal is at least one selected from the group consisting of V and Nb. [8] The composition according to any one of [1] to [7], further comprising a polymerizable compound. [9] The composition according to any one of [1] to [8], further comprising a polymerization initiator. [10] The composition according to any one of [1] to [9], further containing a solvent, and having a solid content of 10 to 40% by mass. [11] The composition according to [10], wherein the solvent contains water, and the content of water is 0.1 to 1% by mass based on the total mass of the composition. [12] The composition according to any one of [1] to [11], wherein the content of the metal nitride-containing particles is 20 to 70% by mass based on the total solid content of the composition. [13] The composition according to any one of [1] to [12], further containing a dispersant, the dispersant containing a member selected from polymethyl acrylate, polymethyl methacrylate, and cyclic or chain At least one structure in the group consisting of polyester. [14] The composition according to [13], wherein the mass ratio of the dispersant to the metal nitride-containing particles is 0.05 to 0.30. [15] The composition according to any one of [1] to [14], wherein the metal nitride-containing particles are metal nitride-containing particles coated with an inorganic compound containing aluminum hydroxide. [16] A method for producing a composition, which is a method for producing the composition according to any one of [1] to [15], which comprises a process for obtaining particles containing metal nitride by a thermoplasma method. [17] A cured film obtained using the composition according to any one of [1] to [15]. [18] A color filter containing the cured film according to [17]. [19] A light-shielding film containing the hardened film according to [17]. [20] A solid-state imaging element comprising the cured film according to [17]. [21] An image display device comprising the cured film according to [17]. [Inventive effect]

依本發明,能夠提供一種能夠製作具有優異之遮光性、優異之解像性及優異之電極的防腐性之硬化膜之(以下,還稱作“具有本發明的效果”。)組成物。並且,依本發明,能夠提供一種組成物的製造方法、硬化膜、濾色器、遮光膜、固態攝影元件及圖像顯示裝置。According to the present invention, it is possible to provide a composition (hereinafter, also referred to as "having the effect of the present invention") which can produce a cured film having excellent light-shielding properties, excellent resolving properties, and excellent electrode corrosion resistance. Furthermore, according to the present invention, it is possible to provide a method for producing a composition, a cured film, a color filter, a light-shielding film, a solid-state imaging element, and an image display device.

以下,對組成物,按構成組成物之每個成分進行詳細說明。 本說明書中,使用“~”表示之數值範圍表示含有記載於“~”的前後之數值作為下限值及上限值之範圍。 並且,本說明書中的基團(原子團)的表述中,未記載取代及未取代之表述係與不含有取代基者一同還包含含有取代基者。例如,“烷基”不僅包含不含有取代基之烷基(未取代烷基),還包含含有取代基之烷基(取代烷基)。 並且,本說明書中,“活性光線”或“放射線” 例如表示水銀燈的明線光譜及準分子雷射為代表之遠紫外線、極紫外線(EUV:Extreme ultraviolet lithography光)、X射線以及電子束等。並且,本說明書中,“光” 表示活性光線或放射線。關於本說明書中的“曝光”,除非另有指明,則不僅限於基於水銀燈的明線光譜、準分子雷射為代表之遠紫外線、X射線以及EUV光等之曝光,基於電子束及離子束等粒子束之描繪亦包含在曝光中。 並且,本說明書中,“(甲基)丙烯酸酯”表示丙烯酸酯及甲基丙烯酸酯。並且,本說明書中,“(甲基)丙烯酸”表示丙烯酸及甲基丙烯酸。並且,本說明書中,“(甲基)丙烯醯基”表示丙烯醯基及甲基丙烯醯基。並且,本說明書中,“(甲基)丙烯醯胺”表示丙烯醯胺及甲基丙烯醯胺。並且,本說明書中,“單體”與“單體(monomer)”的含義相同。單體與寡聚物及聚合物有所區別,指重量平均分子量為2,000以下的化合物。本說明書中,聚合性化合物係指含有聚合性基團之化合物,可以係單體,亦可以係聚合物。聚合性基團係指參與聚合反應之基團。 [組成物] 上述組成物係含有包含原子A之含金屬氮化物的粒子之組成物,其中,含金屬氮化物的粒子含有在3~11族的過渡金屬中除鈦以外的過渡金屬且電負性為1.22~2.36之過渡金屬的氮化物,原子A係與上述過渡金屬不同之元素,係選自由硼、鋁、矽、錳、鐵、鎳及銀所組成的群組中的至少1種,含金屬氮化物的粒子中的原子A的含量為0.00005~10質量%。對於上述組成物具有本發明的效果之理由,雖尚不明確,但本發明人等推斷如下。另外,並非依據以下推斷限定上述組成物發揮本發明的效果之機制。Hereinafter, the composition will be described in detail for each component constituting the composition. In the present specification, a numerical range indicated by “~” means a range including numerical values described before and after “~” as a lower limit value and an upper limit value. In addition, in the description of the group (atomic group) in the present specification, the expressions that do not describe substitution and unsubstituted refer to those that do not include substituents and those that contain substituents. For example, "alkyl" includes not only an alkyl group (unsubstituted alkyl group) without a substituent, but also an alkyl group (substituted alkyl group) with a substituent. In this specification, "active light" or "radiation" means, for example, a bright line spectrum of a mercury lamp and an extreme ultraviolet (EUV: Extreme ultraviolet lithography light), an X-ray, an electron beam, and the like, represented by an excimer laser. In this specification, "light" means active light or radiation. Regarding "exposure" in this specification, unless otherwise specified, it is not limited to exposure based on the bright line spectrum of a mercury lamp, far-ultraviolet rays, X-rays, and EUV light represented by an excimer laser, and electron beam and ion beam. The depiction of the particle beam is also included in the exposure. In addition, in this specification, "(meth) acrylate" means an acrylate and a methacrylate. In addition, in this specification, "(meth) acrylic acid" means acrylic acid and methacrylic acid. In addition, in this specification, "(meth) acrylfluorenyl" means acrylfluorenyl and methacrylfluorenyl. In addition, in this specification, "(meth) acrylamide" means acrylamide and methacrylamide. In addition, in this specification, "monomer" and "monomer" have the same meaning. A monomer is different from an oligomer and a polymer, and refers to a compound having a weight average molecular weight of 2,000 or less. In this specification, a polymerizable compound means a compound containing a polymerizable group, and may be a monomer or a polymer. A polymerizable group refers to a group that participates in a polymerization reaction. [Composition] The above composition is a composition containing metal nitride-containing particles containing atom A, wherein the metal nitride-containing particles contain a transition metal other than titanium among the transition metals of Groups 3 to 11 and are electrically negatively charged. A nitride of a transition metal having a property of 1.22 to 2.36, the atom A is an element different from the above transition metal, and is at least one selected from the group consisting of boron, aluminum, silicon, manganese, iron, nickel and silver. The content of the atom A in the metal nitride-containing particles is 0.00005 to 10% by mass. Although the reason why the above composition has the effect of the present invention is not clear, the inventors and others have estimated the following. In addition, the mechanism by which the above-mentioned composition exerts the effects of the present invention is not limited based on the following estimation.

上述組成物含有在3~11族的過渡金屬中除鈦以外的過渡金屬且電負性為1.22~2.36之過渡金屬的氮化物。 上述氮化物的價帶由氮2p軌道構成,故與氧化物相比,價帶更靠負側。並且,如上述,上述氮化物包含具有規定的電負性之過渡金屬,故上述價帶與導帶之間的帶隙變得更小。其結果,推斷上述過渡金屬的氮化物係吸收更寬的波長區域的光(遮光性變高)者。另外,本說明書中的電負性表示基於鮑林(Pauling)的定義之電負性。 並且,上述組成物含有原子A。不僅遮光性較高,還能夠控制用於圖案形成之波長(例如,i射線:365nm)中的光的透射性。具體而言,能夠使圖案形成所必需之光透射。亦即,上述組成物具有優異之解像性。而且,上述組成物將原子A的含量設定為規定的範圍,故具有優異之電極的防腐性。The composition contains a nitride of a transition metal other than titanium among transition metals of Groups 3 to 11 and a transition metal having an electronegativity of 1.22 to 2.36. The valence band of the above-mentioned nitride is composed of a nitrogen 2p orbital, and therefore the valence band is closer to the negative side than the oxide. In addition, as described above, since the nitride contains a transition metal having a predetermined electronegativity, the band gap between the valence band and the conduction band becomes smaller. As a result, it is presumed that the nitride system of the transition metal absorbs light in a wider wavelength region (higher light shielding properties). The electronegativity in this specification means an electronegativity based on the definition of Pauling. The composition described above contains an atom A. Not only the light-shielding property is high, but also the transmittance of light at a wavelength (for example, i-ray: 365 nm) used for pattern formation can be controlled. Specifically, light necessary for pattern formation can be transmitted. That is, the above composition has excellent resolvability. In addition, since the above-mentioned composition sets the content of the atom A to a predetermined range, it has excellent corrosion resistance of the electrode.

〔含金屬氮化物的粒子〕 上述含金屬氮化物的粒子係含有原子A之含金屬氮化物的粒子。作為上述含金屬氮化物的粒子含有原子A之態樣,並無特別限制,可以以離子、金屬化合物(亦含有絡合物)、金屬間化合物、合金、氧化物、複合氧化物、氮化物、氮氧化物、硫化物及硫氧化物等任一形態包含。並且,含金屬氮化物的粒子中包含之原子A可作為晶格間位置的雜質而存在,亦可在晶界以非晶質狀態作為雜質而存在。[Metal nitride-containing particle] The metal nitride-containing particle is a metal nitride-containing particle containing atom A. The form in which the metal nitride-containing particles contain atom A is not particularly limited, and may be ions, metal compounds (also containing complexes), intermetallic compounds, alloys, oxides, composite oxides, nitrides, Included in any form such as nitrogen oxides, sulfides, and sulfur oxides. In addition, the atom A contained in the metal nitride-containing particle may exist as an impurity at an inter-lattice position, or may exist as an impurity in an amorphous state at a grain boundary.

<原子A> 原子A包含在含金屬氮化物的粒子中。原子A係與下述過渡金屬不同之元素,係選自由硼、鋁、矽、錳、鐵、鎳及銀所組成的群組中的至少1種。其中,從組成物具有更優異之本發明的效果之角度考慮,選自由鋁、矽、鐵、鎳及銀所組成的群組中的至少1種為較佳,選自由鐵、矽及鎳所組成的群組中的至少1種為更佳。原子A可單獨使用1種,亦可倂用2種以上。<Atom A> The atom A is contained in a metal nitride-containing particle. Atom A is an element different from the following transition metals, and is at least one selected from the group consisting of boron, aluminum, silicon, manganese, iron, nickel, and silver. Among them, at least one selected from the group consisting of aluminum, silicon, iron, nickel, and silver is preferable from the viewpoint that the composition has more excellent effects of the present invention, and is selected from the group consisting of iron, silicon, and nickel. More preferably, at least one of the groups is composed. Atom A may be used alone or in combination of two or more.

含金屬氮化物的粒子中的原子A的含量為0.00005~10質量%。若原子A的含量小於下限值,則可藉由上述組成物獲得之硬化膜的解像性較差。若原子A的含量超過上限值,則可藉由上述組成物獲得之硬化膜的遮光性及電極的防腐性較差。其中,從可藉由上述組成物獲得之硬化膜具有更優異之電極的防腐性的角度考慮,原子A的含量為0.00005質量%以上且小於1%為較佳,0.00005質量%以上且小於0.1%為更佳。 並且,若為0.00005質量%以上且小於10質量%,則可藉由上述組成物獲得之硬化膜具有更優異之遮光性。 其中,含金屬氮化物的粒子中的原子A的含量藉由ICP(Inductively Coupled Plasma:高頻電感耦合電漿)發光分光分析法進行測定。The content of the atom A in the metal nitride-containing particles is 0.00005 to 10% by mass. If the content of the atom A is less than the lower limit value, the resolution of the cured film obtainable from the composition is poor. If the content of the atom A exceeds the upper limit, the light-shielding property of the cured film obtainable from the composition and the corrosion resistance of the electrode are poor. Among them, from the viewpoint that the cured film obtainable from the above composition has more excellent corrosion resistance of the electrode, the content of atom A is preferably 0.00005 mass% or more and less than 1%, and 0.00005 mass% or more and less than 0.1%. For the better. Moreover, if it is 0.00005 mass% or more and less than 10 mass%, the cured film obtainable by the said composition will have more excellent light-shielding property. Among them, the content of atom A in the metal nitride-containing particles was measured by an ICP (Inductively Coupled Plasma) emission spectroscopic analysis method.

<過渡金屬的氮化物> 上述含金屬氮化物的粒子含有在3~11族的過渡金屬中除鈦以外的過渡金屬且電負性為1.22~2.36之過渡金屬的氮化物。作為上述過渡金屬(括號內為電負性),可舉出3族的過渡元素的Sc(1.36)、Dy(1.22)、Ho(1.23)、Er(1.24)、Tm(1.25)、Lu(1.27)、Th(1.3)、Pa(1.5)、U(1.38)、Np(1.36)、Pu(1.28)、Am(1.3)、Cm(1.3)、Bk(1.3)、Cf(1.3)、Es(1.3)、Fm(1.3)、Md(1.3)、No(1.3)、Lr(1.3);4族的Zr(1.33)、Hf(1.3);5族的V(1.63)、Nb(1.6)、Ta(1.5);6族的Cr(1.66)、Mo(2.16)、W(2.36);7族的Mn(1.55)、Tc(1.9)、Re(1.9);8族的Fe(1.83)、Ru(2.2)、Os(2.2);9族的Co(1.88)、Rh(2.28)、Ir(2.2);10族的Ni(1.91)、Pd(2.2)、Pt(2.28);11族的Cu(1.9)、Ag(1.93)。其中,從組成物具有更優異之本發明的效果之角度考慮,Sc、V、Cr、Mn、Fe、Co、Ni、Cu、Y、Zr、Nb、Mo、Tc、Ru、Rh、Pd、Ag、Hf、Ta、W、Re、Os、Ir或Pt為較佳,Sc、V、Cr、Co、Cu、Y、Zr、Mo、Tc、Ru、Rh、Pd、Hf、Ta、W、Re、Os、Ir或Pt為更佳,V、Cr、Y、Zr、Nb、Hf、Ta、W或Re為進一步較佳,V、Cr、Y、Nb、Ta、W或Re尤為佳,V或Nb尤其更佳,Nb為最佳。<Nitride of transition metal> The above-mentioned metal nitride-containing particle contains a transition metal other than titanium among transition metals of Groups 3 to 11 and a transition metal nitride having an electronegativity of 1.22 to 2.36. Examples of the transition metal (electronegativity in parentheses) include Sc (1.36), Dy (1.22), Ho (1.23), Er (1.24), Tm (1.25), Lu (1.27) ), Th (1.3), Pa (1.5), U (1.38), Np (1.36), Pu (1.28), Am (1.3), Cm (1.3), Bk (1.3), Cf (1.3), Es (1.3 ), Fm (1.3), Md (1.3), No (1.3), Lr (1.3); Zr (1.33), Hf (1.3) for Group 4; V (1.63), Nb (1.6), Ta (for Group 5) 1.5); Group 6 Cr (1.66), Mo (2.16), W (2.36); Group 7 Mn (1.55), Tc (1.9), Re (1.9); Group 8 Fe (1.83), Ru (2.2 ), Os (2.2); Group 9 Co (1.88), Rh (2.28), Ir (2.2); Group 10 Ni (1.91), Pd (2.2), Pt (2.28); Group 11 Cu (1.9) , Ag (1.93). Among them, from the standpoint that the composition has more excellent effects of the present invention, Sc, V, Cr, Mn, Fe, Co, Ni, Cu, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag , Hf, Ta, W, Re, Os, Ir or Pt are preferred, Sc, V, Cr, Co, Cu, Y, Zr, Mo, Tc, Ru, Rh, Pd, Hf, Ta, W, Re, Os, Ir, or Pt are more preferred, V, Cr, Y, Zr, Nb, Hf, Ta, W, or Re are further preferred, V, Cr, Y, Nb, Ta, W, or Re are particularly preferred, V or Nb Especially preferred is Nb.

含金屬氮化物的粒子中的“構成過渡金屬的氮化物之過渡金屬”的含量相對於含金屬氮化物的粒子的總質量,10~85質量%為較佳,15~75質量%為更佳,20~70質量%為進一步較佳。含金屬氮化物的粒子中的“構成過渡金屬的氮化物之過渡金屬”的含量能夠藉由ICP(Inductively Coupled Plasma)發光分光分析法進行分析。 含金屬氮化物的粒子中的氮原子(N原子)的含量相對於含金屬氮化物的粒子的總質量,3~60質量%為較佳,5~50質量%為更佳,10~40質量%為進一步較佳。氮原子的含量能夠藉由惰性氣體熔融熱導法進行分析。 含金屬氮化物的粒子作為主成分含有金屬氮化物,可藉由粒子表面的氧化等,含有一部分氧原子。粒子表面的氧化例如在合成金屬氮化物時混入氧的情況或粒徑較小之情況下,變得更顯著。 含金屬氮化物的粒子中的氧原子的含量相對於含金屬氮化物的粒子的總質量,1~40質量%為較佳,1~35質量%為更佳,5~30質量%為進一步較佳。氧原子的含量能夠藉由惰性氣體熔融紅外線吸收法進行分析。The content of the "transition metal constituting a nitride of a transition metal" in the metal nitride-containing particles is preferably 10 to 85% by mass and more preferably 15 to 75% by mass relative to the total mass of the metal nitride-containing particles. 20 to 70% by mass is more preferred. The content of the "transition metal constituting a nitride of a transition metal" in the metal nitride-containing particles can be analyzed by an ICP (Inductively Coupled Plasma) emission spectroscopic analysis method. The content of nitrogen atoms (N atoms) in the metal nitride-containing particles is preferably 3 to 60% by mass, more preferably 5 to 50% by mass, and 10 to 40% by mass relative to the total mass of the metal nitride-containing particles. % Is further preferred. The nitrogen atom content can be analyzed by an inert gas fusion thermal conductivity method. The metal nitride-containing particles contain metal nitride as a main component, and may contain a part of oxygen atoms by oxidation of the particle surface or the like. The oxidation of the particle surface becomes more pronounced, for example, when oxygen is mixed during the synthesis of a metal nitride or when the particle diameter is small. The content of oxygen atoms in the metal nitride-containing particles is preferably 1 to 40% by mass, more preferably 1 to 35% by mass, and 5 to 30% by mass relative to the total mass of the metal nitride-containing particles. good. The content of oxygen atoms can be analyzed by an inert gas melting infrared absorption method.

從經時穩定性及遮光性的觀點考慮,含金屬氮化物的粒子的比表面積為5m2 /g以上100m2 /g以下為較佳,10m2 /g以上60m2 /g以下為更佳。比表面積能夠藉由BET(Brunauer、Emmett、Teller)法求出。From the viewpoint of stability over time and light-shielding properties, the specific surface area of the metal nitride-containing particles is preferably 5 m 2 / g or more and 100 m 2 / g or less, and more preferably 10 m 2 / g or more and 60 m 2 / g or less. The specific surface area can be determined by the BET (Brunauer, Emmett, Teller) method.

含金屬氮化物的粒子可以係包含含金屬氮化物的粒子與金屬微粒之複合微粒。 複合微粒係指,含金屬氮化物的粒子與金屬微粒進行複合化或處於高度分散之狀態之粒子。其中,“進行複合化”表示,粒子由金屬氮化物與金屬的兩個成分構成,“高度分散之狀態”表示,含金屬氮化物的粒子與金屬粒子分別個別地存在,且少量成分的粒子未凝聚而均勻、相同地分散。 作為金屬微粒,並無特別限制,例如可舉出選自銅、金、鉑、鈀、錫、鈷、銠、銥、釕、鋨、鉬、鎢、鈮、鉭、鈣、鉍、銻及鉛、以及該些的合金之至少一種。其中,選自銅、金、鉑、鈀、錫、鈷、銠及銥、以及該些的合金之至少1種為較佳,選自銅、金、鉑及錫、以及該些的合金之至少1種為更佳。 作為含金屬氮化物的粒子中的金屬微粒的含量,相對於含金屬氮化物的粒子的總質量,5~50質量%為較佳,10~30質量%為更佳。The metal nitride-containing particles may be composite particles containing metal nitride-containing particles and metal particles. Composite particles refer to particles in which metal nitride-containing particles and metal particles are composited or in a highly dispersed state. Among them, "combination" indicates that the particles are composed of two components of metal nitride and metal, and "highly dispersed state" indicates that metal nitride-containing particles and metal particles exist separately, and particles with a small amount of components are not Agglomerated and uniformly dispersed. The metal fine particles are not particularly limited, and examples thereof include copper, gold, platinum, palladium, tin, cobalt, rhodium, iridium, ruthenium, osmium, molybdenum, tungsten, niobium, tantalum, calcium, bismuth, antimony, and lead. And at least one of these alloys. Among them, at least one selected from the group consisting of copper, gold, platinum, palladium, tin, cobalt, rhodium, and iridium, and these alloys is preferable, and at least one selected from the group consisting of copper, gold, platinum, tin, and these alloys 1 type is more preferable. The content of the metal fine particles in the metal nitride-containing particles is preferably 5 to 50% by mass, and more preferably 10 to 30% by mass relative to the total mass of the metal nitride-containing particles.

<含金屬氮化物的粒子的製造方法> 製造含金屬氮化物的粒子時,通常利用氣相反應法,具體而言,可舉出電爐法及熱電漿法等。該些製法中,從雜質的混入較少之角度、粒徑易一致之角度及生產率較高之角度等理由考慮,熱電漿法為較佳。 作為基於熱電漿法之含金屬氮化物的粒子的具體的製造方法,例如,可舉出利用金屬微粒製造装置者。金屬微粒製造装置例如由產生熱電漿之電漿炬、向電漿炬內供給金屬原料粉末之材料供給装置、含有冷卻功能之腔室、對所生成之金屬微粒進行分級之旋風分離器、及回收金屬微粒之回收部構成。 另外,本說明書中,金屬微粒表示含有金屬元素之一次粒徑為20nm~40μm的粒子。<Method for Producing Metal Nitride-Containing Particles> When producing metal nitride-containing particles, a gas-phase reaction method is generally used, and specifically, an electric furnace method and a thermo-plasma method are used. Among these production methods, a thermoplasma method is preferred from the viewpoints of a small amount of impurities, a point of easy particle size consistency, and a point of high productivity. As a specific manufacturing method of the metal nitride-containing particle by the pyroplasma method, for example, a person using a metal particle manufacturing apparatus can be mentioned. The metal particle manufacturing device includes, for example, a plasma torch that generates a thermal plasma, a material supply device that supplies metal raw material powder into the plasma torch, a chamber containing a cooling function, a cyclone that classifies the generated metal particles, and recovery. The collection part of the metal fine particles. In addition, in this specification, a metal fine particle means the particle | grains which have a primary particle diameter containing a metal element of 20 nm-40 micrometers.

作為利用金屬微粒製造装置之含金屬氮化物的粒子的製造方法,並無特別限定,能夠利用公知的方法。其中,從下述的規定的平均一次粒徑的含金屬氮化物的粒子的產率提高之角度考慮,利用金屬微粒製造装置製造含金屬氮化物的粒子之方法含有以下所示之製程為較佳。 製程A:向電漿炬內供給不含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程。 製程B:向電漿炬內的熱電漿火焰供給含有過渡金屬之金屬原料粉末,使上述金屬原料粉末蒸發來獲得氣相的原料金屬之製程。 製程C:冷卻上述氣相的原料金屬來獲得含有過渡金屬之金屬微粒之製程。 製程D:向電漿炬內供給含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程。 製程E:向電漿炬內的熱電漿火焰供給含有過渡金屬之金屬微粒,使上述金屬微粒蒸發來獲得氣相的原料金屬之製程。 製程F:冷卻上述氣相的原料金屬來獲得含金屬氮化物的粒子之製程。 並且,含金屬氮化物的粒子的製造方法可在上述的製程C和/或製程F之後依據需要含有下述的製程G。 製程G:對所獲得之粒子進行分級之製程。 而且,亦可在製程A之前、製程A與製程B之間、製程C與製程D之間或製程D與E之間含有以下的製程A2。 製程A2:向含有過渡金屬之金屬原料粉末混合原子A之製程。 而且,亦可在上述製程A2之前含有以下的製程A3-1~A3-3。 製程A3-1:向電漿炬內供給不含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程 製程A3-2:向電漿炬內的熱電漿火焰供給含有原子A之原料粉末,使上述原料粉末蒸發來獲得氣相的原子A之製程 製程A3-3:冷卻上述氣相的原子A來獲得被微粒化之原子A之製程 另外,亦可在製程A3-3之後還含有製程G。 另外,本說明書中,被微粒化之原子A表示含有原子A之一次粒徑為20nm~40μm的粒子。The method for producing metal nitride-containing particles using a metal particle production apparatus is not particularly limited, and a known method can be used. Among them, from the viewpoint of improving the yield of the metal nitride-containing particles having a predetermined average primary particle diameter as described below, it is preferable that the method for producing metal nitride-containing particles using a metal particle manufacturing apparatus includes a process shown below. . Process A: A process of supplying a plasma plasma torch without an inert gas containing nitrogen as a plasma gas to generate a thermal plasma flame. Process B: A process of supplying a metal raw material powder containing a transition metal to a thermoplasma flame in a plasma torch, and evaporating the metal raw material powder to obtain a raw material metal in a gas phase. Process C: a process of cooling the raw metal in the gas phase to obtain metal particles containing a transition metal. Process D: The process of supplying a plasma gas with an inert gas containing nitrogen as a plasma gas to generate a thermoplasma flame. Process E: A process of supplying metal particles containing a transition metal to a thermoplasma flame in a plasma torch, and evaporating the metal particles to obtain a raw material metal in a gas phase. Process F: a process of cooling the raw metal in the gas phase to obtain metal nitride-containing particles. In addition, the method for producing a metal nitride-containing particle may include the following process G as required after the above-mentioned process C and / or process F. Process G: a process of grading the obtained particles. Furthermore, the following process A2 may be included before process A, between process A and process B, between process C and process D, or between process D and E. Process A2: A process in which atom A is mixed into a metal raw material powder containing a transition metal. In addition, the following processes A3-1 to A3-3 may be included before the aforementioned process A2. Process A3-1: Supplying an inert gas containing no nitrogen to the plasma torch as a plasma gas to generate a thermoplasma flame. Process A3-2: Supply the raw material powder containing atom A to the thermoplasma flame in the plasma torch. Process A3-3 for evaporating the raw material powder to obtain atom A in the gas phase: process for cooling atom A in the gas phase to obtain atomized A in micronized state In addition, process G may be included after process A3-3 . In addition, in this specification, atomized atom A means particles containing atom A having a primary particle diameter of 20 nm to 40 μm.

而且,上述含金屬氮化物的粒子的製造方法在製程F之後(含有製程G時,在製程F之後的製程G之後)還含有下述的製程H為較佳。 製程H:將在製程F(或製程G)中獲得之含金屬氮化物的粒子暴露於水蒸氣及氮氣的混合氛圍來進行氮化處理之製程。 另外,依據需要,上述含金屬氮化物的粒子的製造方法亦可在製程H之後還含有製程G。以下,對各製程的較佳態様進行詳細說明。In addition, it is preferable that the method for producing the metal nitride-containing particles includes the following process H after the process F (when the process G is included, after the process G after the process F). Process H: a process in which metal nitride-containing particles obtained in process F (or process G) are subjected to a nitriding treatment by exposing them to a mixed atmosphere of water vapor and nitrogen. In addition, if necessary, the method for producing the metal nitride-containing particles may further include a process G after the process H. Hereinafter, a preferred embodiment of each process will be described in detail.

・製程A 製程A係向電漿炬內供給不含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程。作為熱電漿火焰的產生方法,並無特別限定,可舉出直流電弧放電法、多相電弧放電法、高頻電漿法及混合電漿法等,來自電極的雜質的混入較少之高頻電漿法為較佳。 作為基於高頻電漿法之熱電漿火焰的產生方法,並無特別限制,例如,可舉出向含有高頻振蕩用線圈與石英管之電漿炬內供給電漿氣體,對上述高頻振蕩用線圈施加高頻電流,藉此獲得熱電漿火焰之方法。 作為製程A中的上述電漿氣體,可利用不含有氮氣之惰性氣體。作為不含有氮氣之惰性氣體,可舉出氬氣及氫氣等。不含有氮氣之惰性氣體可單獨使用1種,亦可倂用2種以上。・ Process A Process A is a process of supplying a plasma torch with an inert gas that does not contain nitrogen as the plasma gas to generate a plasma flame. The method for generating the pyroplasma flame is not particularly limited, and examples thereof include a DC arc discharge method, a multi-phase arc discharge method, a high-frequency plasma method, and a hybrid plasma method. The plasma method is preferred. There is no particular limitation on the method for generating the pyroplasma flame by the high-frequency plasma method. For example, a plasma gas is supplied into a plasma torch containing a coil for high-frequency oscillation and a quartz tube, and the high-frequency oscillation A method of applying a high-frequency current with a coil to obtain a pyroplasmic flame. As the plasma gas in the process A, an inert gas containing no nitrogen can be used. Examples of the inert gas that does not contain nitrogen include argon and hydrogen. Inert gas containing no nitrogen can be used alone or in combination of two or more.

・製程A2 製程A2係向含有過渡金屬之金屬原料粉末混合原子A之製程。作為原料金屬粉末及原子A的混合方法,並無特別限制,能夠利用公知的方法。例如,向電漿炬內供給金屬原料粉末之上述材料供給装置可含有混合及分散功能。具體而言,能夠利用國際公開第2010/147098號公報的段落0047~0058中記載之材料供給装置,該內容引入本說明書中。另外,作為含金屬氮化物的粒子的製造方法,亦可在製程A2之前還含有以下的製程A3-1~A3-3。・ Process A2 Process A2 is a process of mixing atom A into a metal raw material powder containing a transition metal. The method for mixing the raw metal powder and the atom A is not particularly limited, and a known method can be used. For example, the above-mentioned material supply device for supplying the metal raw material powder into the plasma torch may include a mixing and dispersing function. Specifically, the material supply device described in paragraphs 0047 to 0058 of International Publication No. 2010/147098 can be used, and this content is incorporated into this specification. In addition, as a method for producing a metal nitride-containing particle, the following processes A3-1 to A3-3 may be included before the process A2.

・製程B 製程B係向電漿炬內的熱電漿火焰供給含有過渡金屬之金屬原料粉末,使上述金屬原料粉末蒸發來獲得氣相的原料金屬之製程。作為向電漿炬內的熱電漿火焰供給金屬原料粉末之方法,並無特別限制,從所獲得之氣相的原料金屬成為更均勻之狀態之角度考慮,利用載體氣體噴霧為較佳。另外,作為載體氣體,利用不含有氮氣之惰性氣體為較佳。不含有氮氣之惰性氣體的態様如上述。 另外,製造含金屬氮化物的粒子之方法含有上述製程A2時,在將金屬原料粉末供給至電漿炬內之間,金屬原料粉末維持均勻的分散狀態為較佳。・ Process B Process B is a process of supplying a metal raw material powder containing a transition metal to a thermoplasma flame in a plasma torch, and evaporating the metal raw material powder to obtain a raw material metal in a gas phase. As a method for supplying the metal raw material powder to the pyroplasma flame in the plasma torch, there is no particular limitation. From the standpoint that the obtained raw material metal in the gas phase becomes more uniform, it is preferable to use a carrier gas spray. In addition, as the carrier gas, an inert gas containing no nitrogen is preferably used. The state of the inert gas not containing nitrogen is as described above. In addition, when the method for producing metal nitride-containing particles contains the above-mentioned process A2, it is preferable that the metal raw material powder is maintained in a uniformly dispersed state between the time when the metal raw material powder is supplied into the plasma torch.

・製程C 製程C係冷卻氣相的原料金屬來獲得含有過渡金屬之金屬微粒之製程。作為冷卻方法,並無特別限制,利用含有冷卻功能之腔室為較佳。將在上述製程B中獲得之氣相的原料金屬導入含有上述冷卻功能之腔室,在腔室內快速冷卻,藉此能夠生成下述的所希望的粒徑的金屬微粒。所生成之金屬微粒例如藉由上述回收部回收。作為腔室內的氛圍,不含有氮氣之惰性氣體為較佳。不含有氮氣之惰性氣體的態様如上述。 另外,藉由經過上述製程A~C,可獲得含有過渡金屬之金屬微粒。含有過渡金屬之金屬微粒易在製程E中蒸發。並且,金屬原料粉末含有雜質時,亦能夠藉由經過上述製程A~C來去除上述雜質。・ Process C Process C is a process of cooling raw material metals in the gas phase to obtain metal particles containing transition metals. The cooling method is not particularly limited, and it is preferable to use a chamber containing a cooling function. The raw metal in the gas phase obtained in the above-mentioned process B is introduced into a chamber containing the above-mentioned cooling function, and rapidly cooled in the chamber, thereby being able to generate metal particles having a desired particle size as described below. The generated metal fine particles are recovered, for example, by the recovery unit. The atmosphere in the chamber is preferably an inert gas that does not contain nitrogen. The state of the inert gas not containing nitrogen is as described above. In addition, metal particles containing a transition metal can be obtained by the processes A to C described above. Metal particles containing transition metals are easily evaporated in Process E. In addition, when the metal raw material powder contains impurities, the impurities can be removed by going through the processes A to C described above.

・製程D 製程D係向電漿炬內供給含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程。作為含有氮之惰性氣體,可舉出氮氣及含有惰性氣體之氮氣。作為惰性氣體,可舉出氬氣及氫氣等。作為含有惰性氣體之氮氣,並無特別限制,氮氣的含量通常為10~90莫耳%左右,30~60莫耳%程度為較佳。其他態様與製程A相同。・ Process D Process D is a process of supplying a plasma torch with an inert gas containing nitrogen as a plasma gas to generate a thermoplasma flame. Examples of the nitrogen-containing inert gas include nitrogen and nitrogen containing an inert gas. Examples of the inert gas include argon and hydrogen. The nitrogen containing the inert gas is not particularly limited, and the content of nitrogen is usually about 10 to 90 mol%, and preferably about 30 to 60 mol%. Other states are the same as in Process A.

・製程E 製程E係向電漿炬內的熱電漿火焰供給含有過渡金屬之金屬微粒,使上述金屬微粒蒸發來獲得氣相的原料金屬之製程。作為向電漿炬內的熱電漿火焰供給金屬微粒之方法,如上述,作為載體氣體,含有氮之惰性氣體為較佳。含有氮之惰性氣體的態様如上述。 製程E中,向熱電漿火焰供給藉由製程A~製程C成為金屬微粒之原料金屬,故易獲得氣相的原料金屬,並且,氣相的原料金屬的狀態亦變得更均勻。・ Process E Process E is a process of supplying metal particles containing a transition metal to a thermoplasma flame in a plasma torch, and evaporating the metal particles to obtain a raw material metal in a gas phase. As a method for supplying the metal particles to the pyroplasma flame in the plasma torch, as described above, as the carrier gas, an inert gas containing nitrogen is preferred. The state of the inert gas containing nitrogen is as described above. In the process E, the raw metal that becomes the metal particles in the process A to the process C is supplied to the pyroplasma flame, so the raw metal in the gas phase is easily obtained, and the state of the raw metal in the gas phase becomes more uniform.

・製程F 製程F係冷卻氣相的原料金屬來獲得含有過渡金屬的氮化物之含金屬氮化物的粒子之製程。冷卻方法的較佳態樣如上述,但作為腔室內的氛圍,含有氮氣之惰性氣體為較佳。含有氮氣之惰性氣體的較佳態樣如上述。• Process F Process F is a process of cooling the raw metal in the gas phase to obtain metal nitride-containing particles containing a transition metal nitride. The preferred aspect of the cooling method is as described above, but as the atmosphere in the chamber, an inert gas containing nitrogen is preferred. A preferred aspect of the inert gas containing nitrogen is as described above.

・製程G 製程G係對所獲得之金屬微粒和/或含金屬氮化物的粒子進行分級之製程。作為分級方法,並無特別限制,例如,能夠利用旋風分離器。旋風分離器具有圓錐上的容器,具有在容器內產生迴旋流,利用離心力對粒子進行分級之功能。另外,分級在惰性氣體的氛圍下進行為較佳。惰性氣體的態樣如上述。・ Process G Process G is a process for classifying the obtained metal fine particles and / or metal nitride-containing particles. The classification method is not particularly limited, and for example, a cyclone can be used. The cyclone separator has a container on a cone, and has the function of generating a swirling flow in the container and using centrifugal force to classify particles. The classification is preferably performed in an inert gas atmosphere. The state of the inert gas is as described above.

・製程H 製程H係將含金屬氮化物的粒子暴露於水蒸氣及氮氣的混合氛圍來進行氮化處理之製程。藉由經過該製程,能夠使含金屬氮化物的粒子中的金屬氮化物的含量更多。對於將含金屬氮化物的粒子暴露於水蒸氣及氮氣的混合氛圍之方法,並無特別限制,例如,可舉出將含金屬氮化物的粒子導入於充滿混合有水蒸氣及氮氣之氣體之恆溫槽中,靜置或攪拌規定時間之方法,從含金屬氮化物的粒子的表面及晶界更穩定化之角度考慮,靜置為更佳。 另外,作為水蒸氣及氮氣的混合比例,若在大氣中,則相對濕度成為25~95%之條件為較佳。並且,靜置或攪拌之時間為0.5~72小時為較佳,此時的溫度為10~40℃為較佳。・ Process H Process H is a process in which metal nitride-containing particles are exposed to a mixed atmosphere of water vapor and nitrogen to perform a nitriding treatment. By going through this process, the content of metal nitrides in the metal nitride-containing particles can be increased. The method for exposing the metal nitride-containing particles to a mixed atmosphere of water vapor and nitrogen is not particularly limited, and examples thereof include introducing the metal nitride-containing particles into a constant temperature filled with a gas mixed with water vapor and nitrogen. In the tank, the method of standing or stirring for a predetermined period of time is preferable from the standpoint that the surfaces and grain boundaries of the metal nitride-containing particles are more stable. In addition, as a mixing ratio of water vapor and nitrogen, if the relative humidity is 25 to 95% in the atmosphere, it is preferable. In addition, the time for standing or stirring is preferably 0.5 to 72 hours, and the temperature at this time is preferably 10 to 40 ° C.

・製程A3-1~A3-3 製程A3-1~A3-3係向電漿炬內供給不含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程(A3-1)、向電漿炬內的熱電漿火焰供給含有原子A之原料粉末並使上述原料粉末蒸發來獲得氣相的原子A之製程(A3-2)、及冷卻上述氣相的原子A來獲得包含原子A之微粒之製程(A3-3)。各個製程中的態様如在上述製程A、製程B(代替含有過渡金屬之金屬原料粉末,使用含有原子A之原料粉末)、及製程C(代替含有過渡金屬之金屬微粒,獲得被微粒化之原子A。)中已說明的內容。 另外,藉由經過上述製程,原子A被微粒化,於製程E中原子A變得易於蒸發。並且,藉由經過上述製程,能夠去除含有原子A之原料粉末所含有之雜質(原子A以外的金屬成分等)。・ Process A3-1 ~ A3-3 Process A3-1 ~ A3-3 is a process (A3-1) of supplying a plasma plasma torch without an inert gas containing nitrogen as a plasma gas to generate a thermal plasma flame, The thermo-plasma flame in the torch supplies a raw material powder containing atom A and vaporizes the raw material powder to obtain atom A in the gas phase (A3-2), and cools atom A in the gas phase to obtain particles containing atom A. Process (A3-3). The states in each process are as follows: in the above process A, process B (instead of the metal raw material powder containing the transition metal, using the raw material powder containing the atom A), and process C (instead of the metal particles containing the transition metal, the atomized atom is obtained A.). In addition, by going through the above process, the atom A is atomized, and the atom A is easily evaporated in the process E. In addition, by the above-described process, impurities (metal components other than atom A, etc.) contained in the raw material powder containing atom A can be removed.

(含有原子A之含金屬氮化物的粒子的製造方法的較佳態樣) 作為含有上述原子A之含金屬氮化物的粒子的製造方法的較佳態樣,可舉出從上至下依次具有以下製程之含有原子A之含金屬氮化物的粒子的製造方法。 ・製程A:向電漿炬內供給不含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程。 ・製程B:向電漿炬內的熱電漿火焰供給含有過渡金屬之金屬原料粉末,使上述原料金屬粉末蒸發來獲得氣相的原料金屬之製程。 ・製程C:冷卻上述氣相的原料金屬來獲得含有過渡金屬之金屬微粒之製程。 ・製程G:對所獲得之粒子進行分級之製程。 ・製程A3-1:向電漿炬內供給不含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程 ・製程A3-2:向電漿炬內的熱電漿火焰供給含有原子A之原料粉末,使上述原料粉末蒸發來獲得氣相的原子A之製程 ・製程A3-3:冷卻上述氣相的原子A來獲得被微粒化之原子A之製程 ・製程G:對所獲得之粒子進行分級之製程。 ・製程A2:向含有過渡金屬之金屬原料粉末(此時,為金屬微粒)混合原子A(此時,為被微粒化之原子A)之製程。 ・製程D:向電漿炬內供給含有氮氣之惰性氣體作為電漿氣體來產生熱電漿火焰之製程。 ・製程E:向電漿炬內的熱電漿火焰供給含有過渡金屬之金屬微粒,使上述金屬微粒蒸發來獲得氣相的原料金屬之製程。 ・製程F:冷卻上述氣相的原料金屬來獲得含金屬氮化物的粒子之製程。 ・製程G:對所獲得之粒子進行分級之製程。 ・製程H:將在製程G中獲得之含金屬氮化物的粒子暴露於水蒸氣及氮氣的混合氛圍來進行氮化處理之製程。 另外,上述一系列製程中,可替換製程A~C及製程A3-1~A3-3的順序。亦即,可在製程A3-1~A3-3之後實施製程A~C。(Preferred aspect of the method for producing a metal nitride-containing particle containing atom A) As a preferred aspect of the method for producing a metal nitride-containing particle containing atom A, a method having Method for producing metal nitride-containing particles containing atom A in the following process.・ Process A: A process of supplying a plasma plasma torch without an inert gas containing nitrogen as a plasma gas to generate a thermoplasma flame. • Process B: A process of supplying a metal raw material powder containing a transition metal to a thermoplasma flame in a plasma torch, and evaporating the raw metal powder to obtain a raw metal in a gas phase. • Process C: a process of cooling the raw metal in the gas phase to obtain metal particles containing a transition metal.・ Process G: The process of classifying the obtained particles.・ Process A3-1: A process of supplying a plasma plasma torch containing an inert gas containing no nitrogen as a plasma gas to generate a thermoplasma flame. Process A3-2: Supplying a raw material containing atom A to the plasma plasma torch Powder, the process of evaporating the raw material powder to obtain the atom A of the gas phase, process A3-3: the process of cooling the atom A of the gas phase to obtain the atomized atom A, process G: classifying the obtained particles The process. • Process A2: A process of mixing atom A (in this case, atomized A) into a metal raw material powder (in this case, metal particles) containing a transition metal. • Process D: A process of supplying a plasma gas to an inert gas containing nitrogen as a plasma gas to generate a thermoplasma flame.・ Process E: A process of supplying metal particles containing a transition metal to a thermoplasma flame in a plasma torch, and evaporating the metal particles to obtain a raw material metal in a gas phase. • Process F: a process of cooling the raw metal in the gas phase to obtain metal nitride-containing particles.・ Process G: The process of classifying the obtained particles. • Process H: a process in which metal nitride-containing particles obtained in process G are exposed to a mixed atmosphere of water vapor and nitrogen to perform a nitriding treatment. In addition, in the above series of processes, the order of processes A to C and processes A3-1 to A3-3 can be replaced. That is, the processes A to C can be performed after the processes A3-1 to A3-3.

依上述含有原子A之含金屬氮化物的粒子的製造方法的較佳態樣,能夠去除金屬原料粉末及原料粒子所含有之雜質,且能夠製造具有所希望的平均一次粒徑之含金屬氮化物的粒子。 可去除雜質之機制雖尚不明確,但本發明人等推斷如下。亦即,推斷為過渡金屬和/或原子A藉由電漿處理被離子化,上述離子被冷卻時,過渡金屬、原子A及雜質反映各自的熔點而被微粒化。此時,熔點較低之原子的粒子化較快,熔點較高之原子的粒子化較慢。故,如上述,推斷經過一次電漿處理之微粒(製程B及C、以及製程A3-2及A3-3)為易於成為單一成分(單結晶)者。若對藉由上述來獲得之單一成分的粒子進行分級,則能夠藉由過渡金屬的粒子和/或原子A的粒子與雜質的粒子的密度及/粒徑的不同來去除雜質的粒子。另外,上述分級例如能夠利用旋風分離器等並適當設定分級條件來進行。According to a preferred aspect of the method for producing a metal nitride-containing particle containing the atom A, the metal raw material powder and impurities contained in the raw material particle can be removed, and the metal-containing nitride having a desired average primary particle diameter can be manufactured. particle of. Although the mechanism by which the impurities can be removed is not clear, the inventors have concluded that the mechanism is as follows. That is, it is presumed that the transition metal and / or the atom A are ionized by plasma treatment, and when the ions are cooled, the transition metal, the atom A, and the impurities are micronized reflecting the respective melting points. At this time, the atomization of the lower melting point is faster, and the atomization of the higher melting point is slower. Therefore, as described above, it is inferred that the particles (processes B and C, and processes A3-2 and A3-3) that have undergone a single plasma treatment are likely to be a single component (single crystal). By classifying the particles of a single component obtained as described above, the particles of the transition metal and / or the particles of the atom A and the particles of the impurity have a difference in density and / particle diameter, and the particles of the impurity can be removed. The classification can be performed by using a cyclone or the like and appropriately setting classification conditions.

(原料金屬粉末及原料粉末的純化) 作為能夠在上述製程B中使用之含有過渡金屬之金屬原料粉末(以下,簡單稱作“金屬原料粉末”。)及含有原子A之原料粉末(以下,簡單稱作“原料粉末”。),並無特別限制,高純度者為較佳。金屬原料粉末中的過渡金屬的含量並無特別限定,99.99%以上為較佳,99.999%以上為更佳。並且,原料粉末中的原子A的含量亦相同。(Purification of raw metal powder and raw material powder) As raw metal powder containing transition metals (hereinafter, simply referred to as "metal raw material powder") and raw material powder containing atom A (hereinafter, simple It is called "raw material powder".), And is not particularly limited, and high purity is preferred. The content of the transition metal in the metal raw material powder is not particularly limited, and is preferably 99.99% or more, and more preferably 99.999% or more. The content of the atom A in the raw material powder is also the same.

上述金屬原料粉末和/或原料粉末有時作為雜質含有所希望的過渡金屬和/或原子A以外的原子。作為金屬原料粉末中含有之雜質,可舉出硼、鋁、矽、錳、鐵、鎳及銀等。並且,作為原料粉末中含有之雜質,可舉出金屬元素等。The metal raw material powder and / or raw material powder may contain a desired transition metal and / or atoms other than atom A as impurities. Examples of impurities contained in the metal raw material powder include boron, aluminum, silicon, manganese, iron, nickel, and silver. Examples of the impurities contained in the raw material powder include metal elements.

上述組成物中,藉由將含金屬氮化物的粒子中的原子A的含量設為0.00005~10質量%,發揮本發明的效果。故,若金屬原料粉末和/或原料粉末中包含預想外的上述雜質,則很難將原子A的含量控制在規定的範圍,故變得不易獲得本發明的效果。故,上述含金屬氮化物的粒子的製造方法可在製程B之前(含有製程A2時,為製程A2之前)還含有以下的製程A0。 製程A0:從金屬原料粉末和/或原料粉末去除雜質之製程。In the above composition, the effect of the present invention is exhibited by setting the content of the atom A in the metal nitride-containing particles to 0.00005 to 10% by mass. Therefore, if the metal raw material powder and / or the raw material powder contains the above-mentioned impurities unexpectedly, it is difficult to control the content of the atom A to a predetermined range, so that it is difficult to obtain the effects of the present invention. Therefore, the method for manufacturing the metal nitride-containing particles may include the following process A0 before the process B (when the process A2 is included, before the process A2). Process A0: a process for removing impurities from metal raw material powder and / or raw material powder.

・製程A0 製程A0中,作為從原料金屬粉末和/或原料粉末去除雜質之方法(分離純化方法),並無特別限定,例如,對於鈮,可利用日本特開2012-211048號公報的段落0013~0030中記載之方法,對於其他原料金屬粉末和/或原料粉末,亦能夠利用依據該內容之方法。・ Process A0 In process A0, the method (separation and purification method) of removing impurities from the raw metal powder and / or raw material powder is not particularly limited. For example, for niobium, paragraph 0013 of JP 2012-211048 can be used The method described in ~ 0030 can also be used for other raw material metal powders and / or raw material powders.

(含金屬氮化物的粒子的包覆) 上述含金屬氮化物的粒子可以係被無機化合物包覆之含金屬氮化物的粒子。亦即,可以係具有含金屬氮化物的粒子及包覆含金屬氮化物的粒子之利用無機化合物形成之包覆層之包覆含金屬氮化物的粒子。含有被無機化合物包覆之含金屬氮化物的粒子之上述組成物具有更優異之分散穩定性。 作為無機化合物,並無特別限定,可舉出SiO2 、ZrO2 、TiO2 、GeO2 、Al2 O3 、Y2 O3 、及P2 O5 等氧化物、氫氧化鋁、以及氫氧化鋯等氫氧化物。其中,從易形成更薄的覆膜且易形成包覆率更高之覆膜之角度考慮,氫氧化鋁為較佳。 並且,意圖控制含金屬氮化物的粒子的折射率時,作為低折射率覆膜,氧化矽為較佳,作為高折射率覆膜,氫氧化鋯為較佳。 對於藉由無機化合物包覆含金屬氮化物的粒子之方法,並無特別限制,含金屬氮化物的粒子的製造方法含有下述無機化合物包覆製程為較佳。(Coating of metal nitride-containing particles) The metal nitride-containing particles may be metal nitride-containing particles coated with an inorganic compound. That is, the metal nitride-containing particle may be a metal nitride-containing particle having a coating layer formed of an inorganic compound and having a metal nitride-containing particle and a metal nitride-containing particle. The above-mentioned composition containing metal nitride-containing particles coated with an inorganic compound has more excellent dispersion stability. The inorganic compound is not particularly limited, and examples thereof include oxides such as SiO 2 , ZrO 2 , TiO 2 , GeO 2 , Al 2 O 3 , Y 2 O 3 , and P 2 O 5 , aluminum hydroxide, and hydroxide. Hydroxides such as zirconium. Among them, aluminum hydroxide is preferred from the viewpoint of easily forming a thinner film and easily forming a film with a higher coverage. When the refractive index of the metal nitride-containing particles is intended to be controlled, silicon oxide is preferred as a low refractive index coating, and zirconium hydroxide is preferred as a high refractive index coating. The method for coating the metal nitride-containing particles with an inorganic compound is not particularly limited, and the method for producing a metal nitride-containing particle preferably includes the following inorganic compound coating process.

・無機化合物包覆製程 無機化合物包覆製程係藉由氧化物和/或氫氧化物包覆上述含金屬氮化物的粒子之製程。作為包覆方法,並無特別限制,例如,可舉出以下的濕式塗佈法等。・ Inorganic compound coating process The inorganic compound coating process is a process in which the above-mentioned metal nitride-containing particles are coated with an oxide and / or a hydroxide. The coating method is not particularly limited, and examples thereof include the following wet coating methods.

作為第1濕式塗佈法,首先,混合上述含金屬氮化物的粒子與水來製作漿料。接著,使上述漿料與含有選自由Si、Zr、Ti、Ge、Al、Y及P所組成的群組中的至少1種之水溶性化合物(例如,矽酸鈉)反應,藉由傾析法和/或離子交換樹脂等去除多於的鹼離子之後,使漿料乾燥來獲得被氧化物包覆之含金屬氮化物的粒子。As a first wet coating method, first, the metal nitride-containing particles and water are mixed to prepare a slurry. Next, the slurry is reacted with a water-soluble compound (for example, sodium silicate) containing at least one selected from the group consisting of Si, Zr, Ti, Ge, Al, Y, and P, and decanted. After removing more alkali ions by a method and / or ion exchange resin, etc., the slurry is dried to obtain oxide-containing metal nitride-containing particles.

作為第2濕式塗佈法,首先,混合上述含金屬氮化物的粒子與醇等有機溶劑來製作漿料。接著,在上述漿料中生成含有選自由Si、Zr、Ti、Ge、Al、Y及P所組成的群組中的至少1種之醇鹽等有機金屬化合物,以高溫燒成上述漿料。若以高溫燒成上述漿料,則進行溶膠凝膠反應,可獲得被氧化物包覆之含金屬氮化物的粒子。As a second wet coating method, first, the above-mentioned metal nitride-containing particles and an organic solvent such as an alcohol are mixed to prepare a slurry. Next, an organic metal compound such as an alkoxide containing at least one selected from the group consisting of Si, Zr, Ti, Ge, Al, Y, and P is generated in the slurry, and the slurry is fired at a high temperature. When the slurry is fired at a high temperature, a sol-gel reaction is performed, and metal nitride-containing particles coated with an oxide can be obtained.

作為第3濕式塗佈法,在含金屬氮化物的粒子的存在下,利用尿素與氯化鋁,形成含有離子液體之漿料。從該漿料取出含金屬氮化物的粒子並使其乾燥,之後,燒成上述含金屬氮化物的粒子,藉此可獲得被含有氫氧化鋁之氫氧化物包覆之含金屬氮化物的粒子。As a third wet coating method, a slurry containing an ionic liquid is formed using urea and aluminum chloride in the presence of metal nitride-containing particles. The metal nitride-containing particles are taken out from the slurry and dried, and then the metal nitride-containing particles are fired, whereby metal nitride-containing particles coated with aluminum hydroxide-containing hydroxide can be obtained. .

<含金屬氮化物的粒子的物性> (導電率) 上述含金屬氮化物的粒子的導電率並無特別限制,100×104 ~600×104 S/m為較佳,165×104 ~340×104 S/m為更佳,165×104 S/m~220×104 S/m為進一步較佳,170~190×104 S/m尤為佳。若含金屬氮化物的粒子的導電率的下限值為165×104 S/m以上,上限值為340×104 S/m以下,則藉由含有含金屬氮化物的粒子之後組成物獲得之硬化膜具有更優異之遮光性,且具有優異之電極的防腐性。 另外,本說明書中,導電率表示利用Mitsubishi Chemical Analytech CO., LTD.製造的粉體電阻測定系統MCP-PD51,藉由下述方法測定之導電率。 首先,將規定量的含金屬氮化物的粒子放入上述測定装置的測定容器之後,開始加壓,將壓力變更為0kN、1kN、5kN、10kN、20kN來測定粒子的體積電阻率(ρ)。從該測定結果求出體積電阻率不受壓力影響之條件下的飽和體積電阻率,利用所獲得之飽和體積電阻率,依據σ=1/ρ的關係式計算導電率(σ)。另外,上述試驗在室溫環境下進行。<Physical Properties of Metal Nitride-Containing Particles> (Conductivity) The conductivity of the metal nitride-containing particles is not particularly limited, but 100 × 10 4 to 600 × 10 4 S / m is preferable, and 165 × 10 4 to 340 × 10 4 S / m is more preferable, 165 × 10 4 S / m to 220 × 10 4 S / m is more preferable, and 170 to 190 × 10 4 S / m is more preferable. If the lower limit value of the conductivity of the metal nitride-containing particles is 165 × 10 4 S / m or more and the upper limit value is 340 × 10 4 S / m or less, the composition after the metal nitride-containing particles is used. The obtained cured film has more excellent light-shielding properties and excellent electrode corrosion resistance. In addition, in this specification, the electrical conductivity shows the electrical conductivity measured by the following method using the powder resistance measurement system MCP-PD51 manufactured by Mitsubishi Chemical Analytech CO., LTD. First, a predetermined amount of metal nitride-containing particles are placed in a measurement container of the measurement device, and then pressure is started. The pressure is changed to 0 kN, 1 kN, 5 kN, 10 kN, and 20 kN to measure the volume resistivity (ρ) of the particles. From this measurement result, the saturation volume resistivity under the condition that the volume resistivity is not affected by the pressure is obtained, and the conductivity (σ) is calculated using the obtained saturation volume resistivity according to the relationship of σ = 1 / ρ. The above-mentioned test was performed under a room temperature environment.

(平均一次粒徑) 上述含金屬氮化物的粒子的平均一次粒徑並無特別限制,10~50nm為較佳,10~30nm為更佳,10~27nm為進一步較佳。若平均一次粒徑為27nm以下,則含有含金屬氮化物的粒子之組成物中,含金屬氮化物的粒子變得不易沉澱,其結果,組成物具有更優異之經時穩定性。 另外,本說明書中,平均一次粒徑表示一次粒子的平均粒徑,平均一次粒徑表示藉由下述方法測定之平均一次粒徑。 試料:藉由下述實施例中記載的方法製備分散液(含金屬氮化物的粒子25質量%、分散劑7.5質量%、PGMEA;丙二醇單甲醚乙酸酯溶劑67.5質量%),藉由PGMEA將所獲得之分散液稀釋100倍之後,滴加在碳箔上並使其乾燥者。 另外,作為分散劑,使用使金屬氮化物含有例子以藉由下述方法獲得之圖像中能夠識別含金屬氮化物的粒子的一次粒子之程度分散之分散劑。作為上述分散劑的具體例,可舉出實施例中記載之分散劑。另外,一次粒子係指無凝聚之獨立粒子。 利用透射型電子顯微鏡(TEM:Transmission Electron Microscope),以倍率2万倍觀察上述試料來獲得圖像。所獲得之圖像的含金屬氮化物的粒子中,選擇一次粒子,藉由圖像處理計算上述一次粒子的面積。接著,計算將所獲得之面積換算成圓時的直徑。對4視場量、總計400個含金屬氮化物的粒子的一次粒子進行該操作,對所評價之圓換算的直徑進行算術平均來作為含金屬氮化物的粒子的平均一次粒徑。(Average primary particle diameter) The average primary particle diameter of the metal nitride-containing particles is not particularly limited, but is preferably 10 to 50 nm, more preferably 10 to 30 nm, and even more preferably 10 to 27 nm. When the average primary particle diameter is 27 nm or less, in a composition containing metal nitride-containing particles, the metal nitride-containing particles are less likely to precipitate, and as a result, the composition has more excellent stability over time. In addition, in this specification, an average primary particle diameter means the average particle diameter of a primary particle, and an average primary particle diameter means the average primary particle diameter measured by the following method. Sample: A dispersion liquid (25% by mass of metal nitride-containing particles, 7.5% by mass of dispersant, PGMEA; 67.5% by mass of propylene glycol monomethyl ether acetate solvent) was prepared by the method described in the following Example, and PGMEA was used. After the obtained dispersion was diluted 100 times, it was dropped on a carbon foil and dried. In addition, as the dispersant, a dispersant is used in which an example of a metal nitride is contained so that the primary particles of the metal nitride-containing particles can be recognized in an image obtained by the following method. Specific examples of the dispersant include the dispersants described in the examples. In addition, primary particles refer to independent particles without agglomeration. The transmission electron microscope (TEM: Transmission Electron Microscope) was used to observe the sample at a magnification of 20,000 times to obtain an image. Among the obtained metal nitride-containing particles, primary particles were selected, and the area of the primary particles was calculated by image processing. Next, the diameter when the obtained area was converted into a circle was calculated. This operation was performed on a total of 400 fields of primary particles of metal nitride-containing particles with 4 fields of view, and the average circle-evaluated diameter was arithmetically averaged as the average primary particle diameter of the metal nitride-containing particles.

〔溶劑〕 上述組成物含有溶劑為較佳。作為溶劑,可舉出水及有機溶劑。其中,上述組成物含有有機溶劑為較佳。[Solvent] The composition preferably contains a solvent. Examples of the solvent include water and organic solvents. Among them, it is preferable that the composition contains an organic solvent.

<有機溶劑> 作為有機溶劑,並無特別限制,例如,可舉出丙酮、甲乙酮、環己烷、二氯乙烷、四氫呋喃、甲苯、乙二醇單甲醚、乙二醇單乙醚、乙二醇二甲醚、丙二醇單甲醚、丙二醇單乙醚、乙醯丙酮、環己酮、環戊酮、二丙酮醇、乙二醇單甲醚乙酸酯、乙二醇乙醚乙酸酯、乙二醇單異丙醚、乙二醇單丁醚乙酸酯、3-甲氧基丙醇、甲氧基乙氧基乙醇、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇二甲醚、二乙二醇二乙基醚、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯、3-甲氧基乙酸丙酯、N,N-二甲基甲醯胺、二甲基亞碸、γ-丁內酯、乙酸乙酯、乙酸丁酯、乳酸甲酯及乳酸乙酯等。<Organic solvent> The organic solvent is not particularly limited, and examples thereof include acetone, methyl ethyl ketone, cyclohexane, dichloroethane, tetrahydrofuran, toluene, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol. Dimethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, acetone acetone, cyclohexanone, cyclopentanone, diacetone alcohol, ethylene glycol monomethyl ether acetate, ethylene glycol ether acetate, ethylene glycol Alcohol monoisopropyl ether, ethylene glycol monobutyl ether acetate, 3-methoxypropanol, methoxyethoxyethanol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol Dimethyl ether, diethylene glycol diethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, 3-methoxypropyl acetate, N, N-dimethylformamide, diamine Methyl sulfene, γ-butyrolactone, ethyl acetate, butyl acetate, methyl lactate and ethyl lactate.

上述組成物可含有1種有機溶劑,亦可含有2種以上的有機溶劑,從在調液上述組成物時能夠抑制含金屬氮化物的粒子的粒徑變動之角度考慮,含有2種以上的有機溶劑為較佳。 含有2種以上的有機溶劑時,由選自由上述的3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、乙基溶纖劑乙酸酯、乳酸乙酯、二甘醇二甲醚、乙酸丁酯、3-甲氧基丙酸甲酯、2-庚酮、環己酮、環戊酮、乙基卡必醇乙酸酯、丁基卡必醇乙酸酯、丙二醇單甲醚、及丙二醇單甲醚乙酸酯所組成的群組中的2種以上構成為較佳。The composition may contain one kind of organic solvent or two or more kinds of organic solvents. From the viewpoint of suppressing the particle size variation of the metal nitride-containing particles when the composition is adjusted, the organic composition may contain two or more kinds of organic solvents. A solvent is preferred. When two or more organic solvents are contained, it is selected from the group consisting of methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, and diethylene glycol. Dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone, cyclopentanone, ethylcarbitol acetate, butylcarbitol acetate, propylene glycol It is preferable that two or more types of the group consisting of a monomethyl ether and propylene glycol monomethyl ether acetate are comprised.

上述組成物含有有機溶劑時,作為有機溶劑的含量,相對於組成物的總質量,10~90質量%為較佳,60~90質量%為更佳。含有2種以上的有機溶劑時,其總計量成為上述範圍為較佳。When the composition contains an organic solvent, the content of the organic solvent is preferably 10 to 90% by mass, and more preferably 60 to 90% by mass relative to the total mass of the composition. When two or more kinds of organic solvents are contained, the total amount thereof is preferably in the above range.

<水> 上述組成物可含有水。水可以係有意添加者,亦可以係藉由添加上述組成物中包含之各成分而在組成物中不可避免地含有者。 水的含量相對於組成物的總質量,0.01質量以上為較佳,0.05質量%以上為更佳,0.1質量%以上為進一步較佳,1質量%以下為較佳,0.8質量%以下為更佳,0.7質量%以下為進一步較佳。若水的含量在上述範圍內,製作硬化膜時抑制產生針孔,而且硬化膜的耐濕性得到提高。並且,若水的含量在上述範圍內,則組成物中含有之顆粒易變得更少。<Water> The composition may contain water. Water may be intentionally added, or may be inevitably contained in the composition by adding each component contained in the composition. The content of water relative to the total mass of the composition is preferably 0.01 mass or more, more preferably 0.05 mass% or more, more preferably 0.1 mass% or more, even more preferably 1 mass% or less, and more preferably 0.8 mass% or less. It is more preferably 0.7 mass% or less. When the content of water is within the above range, pinholes are suppressed when a cured film is produced, and the moisture resistance of the cured film is improved. In addition, if the content of water is within the above range, the number of particles contained in the composition tends to be smaller.

上述組成物還含有溶劑時,組成物的固體成分為10~40質量%為較佳。若組成物的固體成分為上限值以下,則組成物中含有之顆粒數易變得更少。並且,若組成物的固體成分為下限值以上,則組成物具有更優異之塗佈性。 並且,含金屬氮化物的粒子的含量相對於組成物的總固體成分,為20~70質量%為較佳。若含金屬氮化物的粒子的含量為下限值以上,則組成物具有更優異之經時穩定性。並且,若含金屬氮化物的粒子的含量為上限值以下,則組成物中含有之顆粒數易變得更少,且可獲得能夠製作具有更優異之解像性之硬化膜之組成物。When the composition further contains a solvent, the solid content of the composition is preferably 10 to 40% by mass. When the solid content of the composition is at most the upper limit value, the number of particles contained in the composition tends to be smaller. In addition, if the solid content of the composition is at least the lower limit value, the composition has more excellent coatability. The content of the metal nitride-containing particles is preferably 20 to 70% by mass based on the total solid content of the composition. When the content of the metal nitride-containing particles is equal to or higher than the lower limit, the composition has more excellent stability over time. In addition, if the content of the metal nitride-containing particles is equal to or less than the upper limit value, the number of particles contained in the composition tends to be smaller, and a composition capable of producing a cured film having more excellent resolvability can be obtained.

〔分散劑〕 上述組成物含有分散劑為較佳。分散劑有助於提高上述上述含金屬氮化物的粒子等黑色顏料的分散性。本說明書中,分散劑為與後述黏結樹脂不同之成分。 作為分散劑,例如,可適當選擇公知的顔料分散劑來使用。其中,高分子化合物為較佳。 作為分散劑,可舉出高分子分散劑〔例如,聚醯胺胺及其鹽、聚羧酸及其鹽、高分子量不飽和酸酯、改性聚胺基甲酸酯、改性聚酯、改性聚(甲基)丙烯酸酯、(甲基)丙烯酸共聚物、萘磺酸福馬林縮合物〕、聚氧乙烯烷基磷酸酯、聚氧乙烯烷基胺及顔料衍生物等。 高分子化合物可依其結構,進一步分類為直鏈狀高分子、末端改質型高分子、接枝型高分子及嵌段型高分子。[Dispersant] The composition preferably contains a dispersant. The dispersant helps improve the dispersibility of the black pigment such as the metal nitride-containing particles. In this specification, a dispersant is a component different from the binder resin mentioned later. As the dispersant, for example, a known pigment dispersant can be appropriately selected and used. Among them, a polymer compound is preferred. Examples of the dispersant include polymer dispersants [for example, polyamidoamine and its salts, polycarboxylic acids and their salts, high molecular weight unsaturated esters, modified polyurethanes, modified polyesters, Modified poly (meth) acrylate, (meth) acrylic copolymer, formalin naphthalenesulfonic acid], polyoxyethylene alkyl phosphate, polyoxyethylene alkylamine, and pigment derivatives. Polymer compounds can be further classified into linear polymers, terminally modified polymers, graft polymers, and block polymers according to their structure.

<高分子化合物> 高分子化合物吸附於作為含金屬氮化物的粒子的較佳態樣之黑色顏料及依據需要倂用之顏料等(以下,還簡單稱作“黑色顏料等”。)被分散體的表面,發揮防止被分散體的再凝聚之作用。故,含有針對顏料表面的固定部位之末端改質型高分子、接枝型高分子、嵌段型高分子為較佳。 另一方面,藉由對含金屬氮化物的粒子的表面進行改質,還能夠促進高分子化合物對含金屬氮化物的粒子的吸附性。<Polymer Compound> A black pigment, which is a preferred form of a polymer compound adsorbed on particles containing metal nitrides, and a pigment used as needed (hereinafter, also simply referred to as "black pigment"). Dispersion The surface plays a role in preventing the re-agglomeration of the dispersion. Therefore, it is preferable to include a terminally modified polymer, a graft polymer, and a block polymer that are fixed to the pigment surface. On the other hand, by modifying the surface of the metal nitride-containing particles, it is also possible to promote the adsorption of the polymer compound to the metal nitride-containing particles.

高分子化合物含有包含接枝鏈之結構單元為較佳。另外,本說明書中,“結構單元”的含義與“重複單元”相同。 含有該種含有接枝鏈之結構單元之高分子化合物藉由接枝鏈具有與溶劑的親和性,故係黑色顏料等著色顏料的分散性及經時之後的分散穩定性(經時穩定性)優異者。並且,藉由存在接枝鏈,含有包含接枝鏈之結構單元之高分子化合物與聚合性化合物或其他能夠倂用之樹脂等具有親和性。其結果,在鹼顯影中不易生成殘渣。 若接枝鏈變長,則立體排斥效果提高而黑色顔料等的分散性得到提高。另一方面,若接枝鏈過長,則向黑色顏料等著色顏料的吸附力下降,黑色顔料等的分散性處於下降的趨勢。故,接枝鏈為氫原子以外的原子數為40~10000者為較佳,氫原子以外的原子數為50~2000者為更佳,氫原子以外的原子數為60~500者為進一步較佳。 其中,接枝鏈表示共聚物的主鏈的根部(從主鏈支化之基團中與主鏈鍵結之原子)至從主鏈支化之基團的末端。The polymer compound preferably contains a structural unit including a graft chain. In addition, in this specification, a "structural unit" has the same meaning as a "repeating unit." The polymer compound containing such a structural unit containing a graft chain has an affinity with a solvent due to the graft chain, and is therefore a dispersibility of a color pigment such as a black pigment and a dispersion stability over time (stability over time). Outstanding. In addition, with the presence of a graft chain, a polymer compound containing a structural unit containing the graft chain has a affinity with a polymerizable compound or another resin that can be used. As a result, residues are less likely to be generated during alkali development. When the graft chain becomes longer, the steric repulsion effect increases and the dispersibility of a black pigment or the like improves. On the other hand, if the graft chain is too long, the adsorption force to a colored pigment such as a black pigment decreases, and the dispersibility of the black pigment or the like tends to decrease. Therefore, the number of atoms other than hydrogen atoms in the graft chain is preferably 40 to 10,000, the number of atoms other than hydrogen atoms is more preferably 50 to 2,000, and the number of atoms other than hydrogen atoms is more preferably 60 to 500. good. Herein, the graft chain represents the root of the main chain of the copolymer (the atom bonded to the main chain from the main chain branched group) to the end of the main chain branched group.

接枝鏈含有聚合物結構為較佳,作為該種聚合物結構,例如可舉出聚(甲基)丙烯酸酯結構(例如,聚(甲基)丙烯酸結構)、聚酯結構、聚胺基甲酸酯結構、聚脲結構、聚醯胺結構及聚醚結構等。 為了提高接枝鏈與溶劑的相互作用性,並藉此提高黑色顏料等的分散性,接枝鏈係含有選自由聚酯結構、聚醚結構及聚(甲基)丙烯酸酯結構所組成的群組中的至少1種之接枝鏈為較佳,含有聚酯結構或聚醚結構的至少任一個之接枝鏈為更佳。The graft chain preferably contains a polymer structure. Examples of the polymer structure include a poly (meth) acrylate structure (for example, a poly (meth) acrylic structure), a polyester structure, and a polyurethane. Ester structure, polyurea structure, polyamidine structure and polyether structure. In order to improve the interaction between the graft chain and the solvent and thereby improve the dispersibility of black pigments, the graft chain contains a group selected from the group consisting of a polyester structure, a polyether structure, and a poly (meth) acrylate structure. A graft chain of at least one type in the group is preferable, and a graft chain containing at least one of a polyester structure or a polyether structure is more preferable.

作為含有該種接枝鏈之巨單體,並無特別限定,能夠適當使用含有反應性雙鍵性基之巨單體。The macromonomer containing such a graft chain is not particularly limited, and a macromonomer containing a reactive double bond group can be appropriately used.

與高分子化合物所含有之含有接枝鏈之結構單元對應,作為適合用於合成高分子化合物之市售的巨單體,可使用AA-6(商品名、TOAGOSEI CO., LTD.)、AA-10(商品名、TOAGOSEI CO., LTD.製造)、AB-6(商品名、TOAGOSEI CO., LTD.製造)、AS-6(商品名、TOAGOSEI CO., LTD.製造)、AN-6(商品名、TOAGOSEI CO., LTD.製造)、AW-6(商品名、TOAGOSEI CO., LTD.製造)、AA-714(商品名、TOAGOSEI CO., LTD.製造)、AY-707(商品名、TOAGOSEI CO., LTD.製造)、AY-714(商品名、TOAGOSEI CO., LTD.製造)、AK-5(商品名、TOAGOSEI CO., LTD.製造)、AK-30(商品名、TOAGOSEI CO., LTD.製造)、AK-32(商品名、TOAGOSEI CO., LTD.製造)、Blemmer PP-100(商品名、NOF CORPORATION.製造)、Blemmer PP-500(商品名、NOF CORPORATION.製造)、Blemmer PP-800(商品名、NOF CORPORATION.製造)、Blemmer PP-1000(商品名、NOF CORPORATION.製造)、Blemmer 55-PET-800(商品名、NOF CORPORATION.製造)、Blemmer PME-4000(商品名、NOF CORPORATION.製造)、Blemmer PSE-400(商品名、NOF CORPORATION.製造)、Blemmer PSE-1300(商品名、NOF CORPORATION.製造)、Blemmer 43PAPE-600B(商品名、NOF CORPORATION.製造)等。其中,使用AA-6(商品名、TOAGOSEI CO., LTD.製造)、AA-10(商品名、TOAGOSEI CO., LTD.製造)、AB-6(商品名、TOAGOSEI CO., LTD.製造)、AS-6(商品名、TOAGOSEI CO., LTD.製造)、AN-6(商品名、TOAGOSEI CO., LTD.製造)及Blemmer PME-4000(商品名、NOF CORPORATION.製造)等為較佳。Corresponds to the structural units containing graft chains contained in polymer compounds. As commercially available macromonomers suitable for the synthesis of polymer compounds, AA-6 (trade name, TOAGOSEI CO., LTD.), AA can be used. -10 (trade name, manufactured by TOAGOSEI CO., LTD.), AB-6 (trade name, manufactured by TOAGOSEI CO., LTD.), AS-6 (trade name, manufactured by TOAGOSEI CO., LTD.), AN-6 (Trade name, manufactured by TOAGOSEI CO., LTD.), AW-6 (trade name, manufactured by TOAGOSEI CO., LTD.), AA-714 (trade name, manufactured by TOAGOSEI CO., LTD.), AY-707 (product Name, manufactured by TOAGOSEI CO., LTD.), AY-714 (trade name, manufactured by TOAGOSEI CO., LTD.), AK-5 (trade name, manufactured by TOAGOSEI CO., LTD.), AK-30 (trade name, (Manufactured by TOAGOSEI CO., LTD.), AK-32 (trade name, manufactured by TOAGOSEI CO., LTD.), Blemmer PP-100 (trade name, manufactured by NOF CORPORATION.), Blemmer PP-500 (trade name, NOF CORPORATION. (Manufactured), Blemmer PP-800 (trade name, manufactured by NOF CORPORATION.), Blemmer PP-1000 (trade name, manufactured by NOF CORPORATION.), Blemmer 55-PET-800 (trade name, NOF CORPORATION.), Blemmer PME-4000 (trade name, manufactured by NOF CORPORATION.), Blemmer PSE-400 (trade name, manufactured by NOF CORPORATION.), Blemmer PSE-1300 (trade name, manufactured by NOF CORPORATION.), Blemmer 43PAPE -600B (trade name, manufactured by NOF CORPORATION.), Etc. Among them, AA-6 (trade name, manufactured by TOAGOSEI CO., LTD.), AA-10 (trade name, manufactured by TOAGOSEI CO., LTD.), And AB-6 (trade name, manufactured by TOAGOSEI CO., LTD.) Are used. , AS-6 (trade name, manufactured by TOAGOSEI CO., LTD.), AN-6 (trade name, manufactured by TOAGOSEI CO., LTD.), Blemmer PME-4000 (trade name, manufactured by NOF CORPORATION.), Etc. are preferred .

上述分散劑含有選自由聚丙烯酸甲酯、聚甲基丙烯酸甲酯及環狀或鏈狀的聚酯所組成的群組中的至少1種結構為較佳。上述分散劑含有選自由聚丙烯酸甲酯、聚甲基丙烯酸甲酯及鏈狀的聚酯所組成的群組中的至少1種結構為更佳。上述分散劑含有選自由聚丙烯酸甲酯、聚甲基丙烯酸甲酯、聚己內酯及聚戊內酯所組成的群組中的至少1種結構為進一步較佳。分散劑可以係在1個分散劑中單獨含有上述結構者,亦可以係在1個分散劑中含有複數個該些結構者。 其中,聚己內酯結構係指作為重複單元含有對ε-己內酯進行開環之結構者。聚戊內酯結構係指作為重複單元含有對δ-戊內酯進行開環之結構者。 作為含有聚己內酯結構之分散劑的具體例,可舉出下述式(1)及下述式(2)中的j及k為5者。並且,作為含有聚戊內酯結構之分散劑的具體例,可舉出下述式(1)及下述式(2)中的j及k為4者。 作為含有聚丙烯酸甲酯結構之分散劑的具體例,可舉出下述式(4)中的X5 為氫原子,且R4 為甲基者。並且,作為含有聚甲基丙烯酸甲酯結構之分散劑的具體例,可舉出下述式(4)中的X5 為甲基,且R4 為甲基者。The dispersant preferably contains at least one structure selected from the group consisting of polymethyl acrylate, polymethyl methacrylate, and cyclic or chain polyester. The dispersant preferably contains at least one structure selected from the group consisting of polymethyl acrylate, polymethyl methacrylate, and a chain-shaped polyester. It is more preferable that the dispersant contains at least one structure selected from the group consisting of polymethyl acrylate, polymethyl methacrylate, polycaprolactone, and polyvalerolactone. The dispersant may be one in which the above-mentioned structures are contained in one dispersant alone, or one in which a plurality of these structures are contained in one dispersant. Here, the polycaprolactone structure refers to a structure containing, as a repeating unit, a ring opening of ε-caprolactone. The polyvalerolactone structure refers to a structure containing, as a repeating unit, a ring opening of δ-valerolactone. Specific examples of the dispersant containing a polycaprolactone structure include those in which j and k in the following formula (1) and the following formula (2) are five. Further, specific examples of the dispersant containing a polyvalerolactone structure include those in which j and k are 4 in the following formula (1) and the following formula (2). Specific examples of the dispersant containing a polymethyl acrylate structure include those in which X 5 in the following formula (4) is a hydrogen atom, and R 4 is a methyl group. Further, as a specific example of polymethyl methacrylate containing structures of the dispersing agent include the following formula (4) X 5 is a methyl group, and R 4 is methyl persons.

(含有接枝鏈之結構單元) 高分子化合物作為含有接枝鏈之結構單元,含有以下述式(1)~式(4)的任一個表示之結構單元為較佳,含有以下述式(1A)、下述式(2A)、下述式(3A)、下述式(3B)及下述(4)的任一個表示之結構單元為更佳。(Constitutional unit containing graft chain) As a structural unit containing a graft chain, a polymer compound preferably contains a structural unit represented by any one of the following formulae (1) to (4), and contains a structural unit represented by the following formula (1A): ), A structural unit represented by any one of the following formula (2A), the following formula (3A), the following formula (3B), and the following (4) is more preferable.

[化學式1] [Chemical Formula 1]

式(1)~式(4)中,W1 、W2 、W3 及W4 分別獨立地表示氧原子或NH。W1 、W2 、W3 及W4 為氧原子為較佳。 式(1)~式(4)中,X1 、X2 、X3 、X4 及X5 分別獨立地表示氫原子或1價的有機基團。作為X1 、X2 、X3 、X4 及X5 ,從合成方面的限制的觀點考慮,分別獨立地為氫原子或碳原子數(碳素原子數)1~12的烷基為較佳,分別獨立地為氫原子或甲基為更佳,甲基為進一步較佳。In Formulae (1) to (4), W 1 , W 2 , W 3, and W 4 each independently represent an oxygen atom or NH. It is preferable that W 1 , W 2 , W 3 and W 4 are oxygen atoms. In the formulae (1) to (4), X 1 , X 2 , X 3 , X 4 and X 5 each independently represent a hydrogen atom or a monovalent organic group. As X 1 , X 2 , X 3 , X 4, and X 5 , from the viewpoint of synthetic limitation, alkyl groups each independently having a hydrogen atom or a carbon number (number of carbon atoms) of 1 to 12 are preferred. Preferably, each independently is a hydrogen atom or a methyl group, and a methyl group is more preferable.

式(1)~式(4)中,Y1 、Y2 、Y3 及Y4 分別獨立地表示2價的連結基,連結基的結構方面並無特別的限制。作為以Y1 、Y2 、Y3 及Y4 表示之2價的連結基,具體而言,可舉出下述(Y-1)~(Y-21)的連結基等為例。下述所示之結構中,A、B分別表示鍵結部位。下述中示出之結構中,從合成的簡便性考慮,(Y-2)或(Y-13)為更佳。In the formulae (1) to (4), Y 1 , Y 2 , Y 3, and Y 4 each independently represent a divalent linking group, and the structure of the linking group is not particularly limited. Specific examples of the divalent linking group represented by Y 1 , Y 2 , Y 3 and Y 4 include the following linking groups (Y-1) to (Y-21). In the structure shown below, A and B each represent a bonding site. Among the structures shown below, (Y-2) or (Y-13) is more preferable from the viewpoint of simplicity of synthesis.

[化學式2] [Chemical Formula 2]

式(1)~式(4)中,Z1 、Z2 、Z3 及Z4 分別獨立地表示1價的有機基團。有機基團的結構並無特別限定,具體而言,可舉出烷基、羥基、烷氧基、芳氧基、雜芳氧基、烷硫醚基、芳硫醚基、雜芳硫醚基及胺基等。該些中,作為以Z1 、Z2 、Z3 及Z4 表示之有機基團,尤其從分散性提高的觀點考慮,具有立體排斥效果者為較佳,分別獨立地為碳原子數5至24的烷基或烷氧基為較佳,其中,分別獨立地為碳原子數5至24的分支烷基、碳原子數5至24的環狀烷基或碳原子數5至24的烷氧基尤為佳。另外,烷氧基中包含之烷基可以係直鏈狀、支鏈狀及環狀的任一個。In Formulas (1) to (4), Z 1 , Z 2 , Z 3, and Z 4 each independently represent a monovalent organic group. The structure of the organic group is not particularly limited, and specific examples include an alkyl group, a hydroxyl group, an alkoxy group, an aryloxy group, a heteroaryloxy group, an alkylthioether group, an arylthioether group, and a heteroarylthioether group. And amine groups. Among these, as the organic group represented by Z 1 , Z 2 , Z 3, and Z 4 , especially from the viewpoint of improving dispersibility, those having a steric repulsive effect are preferred, and each independently has 5 to 6 carbon atoms. An alkyl or alkoxy group of 24 is preferred, wherein each is independently a branched alkyl group having 5 to 24 carbon atoms, a cyclic alkyl group having 5 to 24 carbon atoms or an alkoxy group having 5 to 24 carbon atoms Kew is better. The alkyl group contained in the alkoxy group may be any of linear, branched, and cyclic groups.

式(1)~式(4)中,n、m、p及q分別獨立地為1至500的整數。 並且,式(1)及式(2)中,j及k分別獨立地表示2~8的整數。從組成物的分散穩定性及顯影性的觀點考慮,式(1)及式(2)中的j及k為4~6的整數為較佳,5最為佳。In Formulas (1) to (4), n, m, p, and q are each independently an integer of 1 to 500. In the formulas (1) and (2), j and k each independently represent an integer of 2 to 8. From the viewpoint of the dispersion stability and developability of the composition, j and k in the formulae (1) and (2) are preferably integers of 4 to 6, and 5 is the most preferable.

式(3)中,R3 表示分支或者直鏈的伸烷基,碳原子數1~10的伸烷基為較佳,碳原子數2或3的伸烷基為更佳。p為2~500時,存在複數個之R3 可相互相同亦可互不相同。 式(4)中,R4 表示氫原子或1價的有機基團,作為該1價的有機基團,結構上並無特別限定。作為R4 ,可較佳地舉出氫原子、烷基、芳基及雜芳基,氫原子或烷基為更佳。R4 為烷基時,作為烷基,碳原子數1~20的直鏈狀烷基、碳原子數3~20的分支狀烷基或碳原子數5~20的環狀烷基為較佳,碳原子數1~20的直鏈狀烷基為更佳,碳原子數1~6的直鏈狀烷基為進一步較佳。式(4)中,q為2~500時,接枝共聚物中存在複數個之X5 及R4 可相互相同亦可互不相同。In the formula (3), R 3 represents a branched or linear alkylene group, an alkylene group having 1 to 10 carbon atoms is preferred, and an alkylene group having 2 or 3 carbon atoms is more preferred. When p is 2 to 500, a plurality of R 3 may be the same as each other or different from each other. In the formula (4), R 4 represents a hydrogen atom or a monovalent organic group, and the monovalent organic group is not particularly limited in structure. Examples of R 4 include a hydrogen atom, an alkyl group, an aryl group, and a heteroaryl group, and a hydrogen atom or an alkyl group is more preferable. When R 4 is an alkyl group, the alkyl group is preferably a linear alkyl group having 1 to 20 carbon atoms, a branched alkyl group having 3 to 20 carbon atoms, or a cyclic alkyl group having 5 to 20 carbon atoms. A linear alkyl group having 1 to 20 carbon atoms is more preferred, and a linear alkyl group having 1 to 6 carbon atoms is more preferred. In formula (4), when q is 2 to 500, a plurality of X 5 and R 4 in the graft copolymer may be the same as each other or different from each other.

並且,高分子化合物可含有2種以上的不同結構且含有接枝鏈之結構單元。亦即,高分子化合物的分子中可以包含結構互不相同之以式(1)~式(4)表示之結構單元,並且,式(1)~式(4)中,n、m、p及q分別表示2以上的整數時,式(1)及式(2)中,可在側鏈中包含j及k互不相同之結構,式(3)及式(4)中,分子內存在複數個之R3 、R4 及X5 可相互相同亦可互不相同。In addition, the polymer compound may contain two or more kinds of structural units having different structures and containing a graft chain. That is, the molecules of the polymer compound may include structural units represented by formulas (1) to (4), which are different from each other. In formulas (1) to (4), n, m, p, and When q represents an integer of 2 or more, in the formulae (1) and (2), the side chains may include structures in which j and k are different from each other. In the formulae (3) and (4), there is a complex number in the molecule Each of R 3 , R 4 and X 5 may be the same as each other or different from each other.

作為以式(1)表示之結構單元,從組成物的經時穩定性及顯影性的觀點考慮,以下述式(1A)表示之結構單元為更佳。 並且,作為以式(2)表示之結構單元,從組成物的經時穩定性及顯影性的觀點考慮,以下述式(2A)表示之結構單元為更佳。As the structural unit represented by the formula (1), a structural unit represented by the following formula (1A) is more preferred from the viewpoint of the stability of the composition over time and developability. In addition, as the structural unit represented by the formula (2), a structural unit represented by the following formula (2A) is more preferable from the viewpoint of the stability of the composition over time and developability.

[化學式3] [Chemical Formula 3]

式(1A)中,X1 、Y1 、Z1 及n的含義與式(1)中的X1 、Y1 、Z1 及n相同,較佳範圍亦相同。式(2A)中,X2 、Y2 、Z2 及m的含義與式(2)中的X2 、Y2 、Z2 及m相同,較佳範圍亦相同。In the formula (1A), X 1, X Y 1, Z 1 and n are as defined in the formula (1) is 1, Y 1, Z 1 and n, respectively, preferred ranges are also the same. In formula (2A), X 2, Y 2, Z 2 and m are as defined for the formula X (2) is 2, Y 2, Z 2 and the same as m, the preferred range is also the same.

並且,作為以式(3)表示之結構單元,從組成物的經時穩定性及顯影性的觀點考慮,以下述式(3A)或式(3B)表示之結構單元為更佳。In addition, as the structural unit represented by the formula (3), a structural unit represented by the following formula (3A) or formula (3B) is more preferred from the viewpoint of the stability of the composition over time and developability.

[化學式4] [Chemical Formula 4]

式(3A)或(3B)中,X3 、Y3 、Z3 及p的含義與式(3)中的X3 、Y3 、Z3 及p相同,較佳範圍亦相同。Formula (3A) or (3B) in, 3, Y 3, Z 3 and same p X 3, Y 3, Z 3 and p are defined for the formula X (3) is, preferred ranges are also the same.

高分子化合物作為含有接枝鏈之結構單元,含有以式(1A)表示之結構單元為更佳。As a structural unit containing a graft chain, the polymer compound preferably contains a structural unit represented by formula (1A).

高分子化合物中,含有接枝鏈之結構單元(例如,以上述式(1)~式(4)表示之結構單元)以質量換算,相對於高分子化合物的總質量,以2~90%的範圍包含為較佳,以5~30%的範圍包含為更佳。若在該範圍內包含含有接枝鏈之結構單元,則黑色顏料的分散性較高,形成硬化膜時的顯影性良好。In the polymer compound, the structural unit containing the graft chain (for example, the structural unit represented by the above formula (1) to formula (4)) is 2 to 90% by mass conversion with respect to the total mass of the polymer compound. The range is preferable, and the range of 5 to 30% is more preferable. When the structural unit containing a graft chain is included in this range, the dispersibility of a black pigment is high, and the developability at the time of forming a hardened film is favorable.

(疏水性結構單元) 並且,高分子化合物包含與含有接枝鏈之結構單元不同(亦即,並不相當於含有接枝鏈之結構單元)之疏水性結構單元為較佳。其中,本發明中,疏水性結構單元係不含有酸基(例如,羧酸基、磺酸基、磷酸基、酚性羥基等)之結構單元。(Hydrophobic structural unit) It is preferable that the polymer compound contains a hydrophobic structural unit that is different from the structural unit containing the graft chain (that is, does not correspond to the structural unit containing the graft chain). In the present invention, the hydrophobic structural unit is a structural unit that does not contain an acid group (for example, a carboxylic acid group, a sulfonic acid group, a phosphate group, a phenolic hydroxyl group, and the like).

疏水性結構單元係源自(對應)ClogP值為1.2以上的化合物(單體)之結構單元為較佳,係源自ClogP值為1.2~8的化合物之結構單元為更佳。藉此,能夠更可靠地顯現本發明的效果。The hydrophobic structural unit is preferably a structural unit derived from (corresponding to) a compound (monomer) having a ClogP value of 1.2 or more, and more preferably a structural unit derived from a compound having a ClogP value of 1.2 to 8. Thereby, the effect of this invention can be shown more reliably.

ClogP值係藉由能夠從Daylight Chemical Information System, Inc,獲得之程序“CLOGP”計算之值。該程序提供藉由Hansch, Leo的fragmentapproach(參閱下述文獻)計算出之“計算logP”的值。Fragmentapproach依據化合物的化學結構,將化學結構分割為部分結構(片段),總計分配於該片段之logP貢獻量,藉此推算化合物的logP值。其詳細內容記載於以下文獻中。本發明中,使用藉由程序CLOGP v4.82計算出之ClogP值。 A. J. Leo, Comprehensive Medicinal Chemistry, Vol.4, C. Hansch, P. G. Sammnens,J. B. Taylor and C. A. Ramsden, Eds., p.295, Pergamon Press, 1990 C. Hansch & A. J. Leo. SUbstituent Constants For Correlation Analysis in Chemistry and Biology. John Wiley & Sons. A.J. Leo. Calculating logPoct from structure. Chem. Rev., 93, 1281-1306, 1993.The ClogP value is a value calculated by a program "CLOGP" which can be obtained from Daylight Chemical Information System, Inc. This program provides a "calculated logP" value calculated by the fragmentapproach of Hansch, Leo (see below). Fragmentapproach divides the chemical structure into partial structures (fragments) based on the chemical structure of the compound, and totals the logP contribution amount allocated to the fragment to estimate the logP value of the compound. The details are described in the following documents. In the present invention, the ClogP value calculated by the program CLOGP v4.82 is used. AJ Leo, Comprehensive Medicinal Chemistry, Vol. 4, C. Hansch, PG Sammnens, JB Taylor and CA Ramsden, Eds., P.295, Pergamon Press, 1990 C. Hansch & AJ Leo. SUbstituent Constants For Correlation Analysis in Chemistry and Biology. John Wiley & Sons. AJ Leo. Calculating logPoct from structure. Chem. Rev., 93, 1281-1306, 1993.

logP表示分配係數P(Partition Coefficient)的常用對數,係以定量的數值表示某一有機化合物在油(通常為1-辛醇)與水的2相系的平衡中如何分配之物性值,由以下式表示。 logP=log(Coil/Cwater) 式中,Coil表示油相中的化合物的莫耳濃度,Cwater表示水相中的化合物的莫耳濃度。 若logP的值夾著0而正向(plus)增大,則表示油溶性增加,若絕對值負向(minus)增大,則表示水溶性增加,與有機化合物的水溶性有負相關,作為估計有機化合物的親疏水性之參數而廣泛利用。logP represents the common logarithm of the partition coefficient P (partition coefficient). It is a quantitative value representing the physical property value of how an organic compound is distributed in the two-phase equilibrium of oil (usually 1-octanol) and water. Expression. logP = log (Coil / Cwater) In the formula, Coil represents the Mohr concentration of the compound in the oil phase, and Cwater represents the Mohr concentration of the compound in the water phase. If the value of logP increases with a positive (plus) value between 0, it means that the oil solubility increases, and if the absolute value increases with minus (minus), it means an increase in water solubility. Parameters for estimating the hydrophobicity of organic compounds are widely used.

高分子化合物作為疏水性結構單元,含有選自源自以下述通式(i)~(iii)表示之單體的結構單元之1種以上的結構單元為較佳。The polymer compound preferably contains, as a hydrophobic structural unit, one or more structural units selected from structural units derived from monomers represented by the following general formulae (i) to (iii).

[化學式5] [Chemical Formula 5]

上述式(i)~(iii)中,R1 、R2 及R3 分別獨立地表示氫原子、鹵原子(例如,氟原子、氯原子、溴原子等)或碳原子數為1~6的烷基(例如,甲基、乙基、丙基等)。 R1 、R2 及R3 係氫原子或碳原子數為1~3的烷基為較佳,氫原子或甲基為更佳。R2 及R3 係氫原子尤為佳。 X表示氧原子(-O-)或亞胺基(-NH-),氧原子為較佳。In the formulae (i) to (iii), R 1 , R 2 and R 3 each independently represent a hydrogen atom, a halogen atom (for example, a fluorine atom, a chlorine atom, a bromine atom, etc.) or a carbon atom having 1 to 6 Alkyl (for example, methyl, ethyl, propyl, etc.). R 1 , R 2 and R 3 are more preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and more preferably a hydrogen atom or a methyl group. R 2 and R 3 are particularly preferably hydrogen atoms. X represents an oxygen atom (-O-) or an imine group (-NH-), and an oxygen atom is preferred.

L係單鍵或2價的連結基。作為2價的連結基,可舉出2價的脂肪族基(例如,伸烷基、取代伸烷基、伸烯基、取代伸烯基、伸炔基、取代伸炔基)、2價的芳香族基(例如,伸芳基、取代伸芳基)、2價的雜環基、氧原子(-O-)、硫原子(-S-)、亞胺基(-NH-)、取代亞胺基(-NR31 -,其中,R31 為脂肪族基、芳香族基或雜環基)、羰基(-CO-)及該些的組合等。L is a single bond or a divalent linking group. Examples of the divalent linking group include a divalent aliphatic group (for example, an alkylene group, a substituted alkylene group, an alkylene group, a substituted alkylene group, an alkylene group, a substituted alkylene group), and a divalent Aromatic group (eg, arylene, substituted arylene), divalent heterocyclic group, oxygen atom (-O-), sulfur atom (-S-), imino group (-NH-), substituted An amine group (-NR 31- , wherein R 31 is an aliphatic group, an aromatic group or a heterocyclic group), a carbonyl group (-CO-), a combination thereof, and the like.

2價的脂肪族基可具有環狀結構或分支結構。脂肪族基的碳原子數為1~20為較佳,1~15為更佳,1~10為進一步較佳。脂肪族基可以係不飽和脂肪族基,亦可以係飽和脂肪族基,但飽和脂肪族基為較佳。並且,脂肪族基可具有取代基。取代基的例子可舉出鹵原子、芳香族基及雜環基等。The divalent aliphatic group may have a cyclic structure or a branched structure. The number of carbon atoms of the aliphatic group is preferably 1 to 20, more preferably 1 to 15 and even more preferably 1 to 10. The aliphatic group may be an unsaturated aliphatic group or a saturated aliphatic group, but a saturated aliphatic group is preferred. The aliphatic group may have a substituent. Examples of the substituent include a halogen atom, an aromatic group, and a heterocyclic group.

2價的芳香族基的碳原子數為6~20為較佳,6~15為更佳,6~10為進一步較佳。並且,芳香族基可具有取代基。取代基的例子可舉出鹵原子、脂肪族基、芳香族基及雜環基等。The carbon number of the divalent aromatic group is preferably 6 to 20, more preferably 6 to 15 and even more preferably 6 to 10. The aromatic group may have a substituent. Examples of the substituent include a halogen atom, an aliphatic group, an aromatic group, and a heterocyclic group.

2價的雜環基作為雜環含有5員環或6員環為較佳。雜環上可縮合有其他雜環、脂肪族環或芳香族環。並且,雜環基可具有取代基。作為取代基的例子,可舉出鹵原子、羥基、氧代基(=O)、硫代基(=S)、亞胺基(=NH)、取代亞胺基(=N-R32 ,其中,R32 為脂肪族基、芳香族基或雜環基)、脂肪族基、芳香族基或雜環基。The divalent heterocyclic group preferably contains a 5-membered ring or a 6-membered ring as a heterocyclic ring. The heterocyclic ring may be condensed with other heterocyclic rings, aliphatic rings or aromatic rings. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an oxo group (= O), a thio group (= S), an imino group (= NH), and a substituted imino group (= NR 32) . 32 is an aliphatic group, an aromatic group or a heterocyclic group), an aliphatic group, an aromatic group or a heterocyclic group.

L係單鍵、伸烷基或含有氧化烯結構之2價的連結基為較佳。氧化烯結構係氧乙烯結構或氧丙烯結構為更佳。並且,L可含有重複包含2個以上的氧化烯結構之聚氧化烯結構。作為聚氧化烯結構,聚氧乙烯結構或聚氧丙烯結構為較佳。聚氧乙烯結構以-(OCH2 CH2 )n-表示,n為2以上的整數為較佳,2~10的整數為更佳。An L-based single bond, an alkylene group, or a divalent linking group containing an alkylene oxide structure is preferred. The alkylene oxide structure is more preferably an oxyethylene structure or an oxypropylene structure. In addition, L may contain a polyoxyalkylene structure containing two or more alkylene oxide structures repeatedly. As the polyoxyalkylene structure, a polyoxyethylene structure or a polyoxypropylene structure is preferred. The polyoxyethylene structure is represented by-(OCH 2 CH 2 ) n-, where n is an integer of 2 or more is preferable, and an integer of 2 to 10 is more preferable.

作為Z,可舉出脂肪族基(例如,烷基、取代烷基、不飽和烷基及取代不飽和烷基)、芳香族基(例如,芳基、取代芳基、伸芳基、取代伸芳基)、雜環基或該些的組合。該些基團中可包含氧原子(-O-)、硫原子(-S-)、亞胺基(-NH-)、取代亞胺基(-NR31 -、其中,R31 為脂肪族基、芳香族基或雜環基)、羰基(-CO-)。Examples of Z include an aliphatic group (for example, an alkyl group, a substituted alkyl group, an unsaturated alkyl group, and a substituted unsaturated alkyl group), and an aromatic group (for example, an aryl group, a substituted aryl group, an arylene group, and a substituted arylene group). Aryl), heterocyclyl, or a combination of these. These groups may include an oxygen atom (-O-), a sulfur atom (-S-), an imine group (-NH-), a substituted imine group (-NR 31- , wherein R 31 is an aliphatic group , Aromatic or heterocyclic), carbonyl (-CO-).

脂肪族基可具有環狀結構或分支結構。脂肪族基的碳原子數為1~20為較佳,1~15為更佳,1~10為進一步較佳。脂肪族基中還包含環集合烴基、交聯環式烴基,作為環集合烴基的例子,包含雙環己基、全氫萘基、聯苯基、4-環己基苯基等。作為交聯環式烴環,例如,可舉出:蒎烷(pinane)、莰烷(bornane)、降蒎烷(norpinane)、降莰烷(norbornane)、雙環辛烷環(雙環[2.2.2]辛烷環、雙環[3.2.1]辛烷環等)等2環式烴環;高佈雷烷(homobledane)、金剛烷、三環[5.2.1.02,6]癸烷、三環[4.3.1.12,5]十一烷環等3環式烴環;四環[4.4.0.12,5.17,10]十二烷、全氫-1,4-亞甲基-5,8-亞甲基萘環等4環式烴環等。並且,交聯環式烴環中還包含稠環式烴環,例如,全氫萘(十氫萘)、全氫蒽、全氫菲、全氫苊、全氫芴、全氫茚、全氫葩環等縮合有複數個5~8員環烷烴環之稠環。 與不飽和脂肪族基相比,脂肪族基係飽和脂肪族基為較佳。並且,脂肪族基可具有取代基。取代基的例子可舉出鹵原子、芳香族基及雜環基。其中,脂肪族基作為取代基不具有酸基。The aliphatic group may have a cyclic structure or a branched structure. The number of carbon atoms of the aliphatic group is preferably 1 to 20, more preferably 1 to 15 and even more preferably 1 to 10. The aliphatic group also includes a ring group hydrocarbon group and a crosslinked cyclic hydrocarbon group. Examples of the ring group hydrocarbon group include dicyclohexyl, perhydronaphthyl, biphenyl, 4-cyclohexylphenyl, and the like. Examples of the cross-linked cyclic hydrocarbon ring include pinane, bornane, norpinane, norbornane, and bicyclic octane ring (bicyclic [2.2.2 ] Octane ring, bicyclic [3.2.1] octane ring, etc.) and other bicyclic hydrocarbon rings; homoblane (homobledane), adamantane, tricyclic [5.2.1.02,6] decane, tricyclic [4.3. 1.12,5] undecane ring and other 3-ring hydrocarbon rings; tetracyclic [4.4.0.12, 5.17, 10] dodecane, perhydro-1,4-methylene-5,8-methylene naphthalene ring Etc. 4-ring hydrocarbon ring and so on. In addition, the cross-linked cyclic hydrocarbon ring also includes a condensed cyclic hydrocarbon ring, for example, perhydronaphthalene (decahydronaphthalene), perhydroanthracene, perhydrophenanthrene, perhydrofluorene, perhydrofluorene, perhydroindene, perhydrogen Condensed rings such as fluorene rings are condensed with a plurality of 5 to 8-membered cycloalkane rings. Compared with an unsaturated aliphatic group, an aliphatic group is a saturated aliphatic group. The aliphatic group may have a substituent. Examples of the substituent include a halogen atom, an aromatic group, and a heterocyclic group. Among them, the aliphatic group does not have an acid group as a substituent.

芳香族基的碳原子數為6~20為較佳,6~15為更佳,6~10為進一步較佳。並且,芳香族基可具有取代基。取代基的例子可舉出鹵原子、脂肪族基、芳香族基及雜環基。其中,芳香族基作為取代基不具有酸基。The number of carbon atoms of the aromatic group is preferably 6-20, more preferably 6-15, and still more preferably 6-10. The aromatic group may have a substituent. Examples of the substituent include a halogen atom, an aliphatic group, an aromatic group, and a heterocyclic group. However, the aromatic group does not have an acid group as a substituent.

雜環基作為雜環含有5員環或6員環為較佳。雜環上可縮合有其他雜環、脂肪族環或芳香族環。並且,雜環基可具有取代基。作為取代基的例子,可舉出鹵原子、羥基、氧代基(=O)、硫代基(=S)、亞胺基(=NH)、取代亞胺基(=N-R32 ,其中,R32 為脂肪族基、芳香族基或雜環基)、脂肪族基、芳香族基及雜環基。其中,雜環基作為取代基不具有酸基。The heterocyclic group preferably contains a 5-membered ring or a 6-membered ring as a heterocyclic ring. The heterocyclic ring may be condensed with other heterocyclic rings, aliphatic rings or aromatic rings. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an oxo group (= O), a thio group (= S), an imino group (= NH), and a substituted imino group (= NR 32) . 32 is an aliphatic group, an aromatic group or a heterocyclic group), an aliphatic group, an aromatic group, and a heterocyclic group. However, the heterocyclic group does not have an acid group as a substituent.

上述式(iii)中,R4 、R5 及R6 分別獨立地表示氫原子、鹵原子(例如,氟原子、氯原子、溴原子等)、碳原子數為1~6的烷基(例如,甲基、乙基、丙基等)、Z或L-Z。其中,L及Z的含義與上述中的L及Z相同。作為R4 、R5 及R6 ,氫原子或碳原子數為1~3的烷基為較佳,氫原子為更佳。In the formula (iii), R 4 , R 5 and R 6 each independently represent a hydrogen atom, a halogen atom (for example, a fluorine atom, a chlorine atom, a bromine atom, etc.), and an alkyl group having 1 to 6 carbon atoms (for example, , Methyl, ethyl, propyl, etc.), Z or LZ. Here, the meanings of L and Z are the same as those of L and Z described above. As R 4 , R 5 and R 6 , a hydrogen atom or an alkyl group having 1 to 3 carbon atoms is preferred, and a hydrogen atom is more preferred.

作為以上述通式(i)表示之單體,R1 、R2 及R3 為氫原子或甲基、L為單鍵或伸烷基或者包含氧化烯結構之2價的連結基、X為氧原子或亞胺基、Z為脂肪族基、雜環基或芳香族基之化合物為較佳。 並且,作為以上述通式(ii)表示之單體,R1 為氫原子或甲基、L為伸烷基、Z為脂肪族基、雜環基或芳香族基之化合物為較佳。並且,作為以上述通式(iii)表示之單體,R4 、R5 及R6 為氫原子或甲基、Z為脂肪族基、雜環基或芳香族基之化合物為較佳。As the monomer represented by the general formula (i), R 1 , R 2, and R 3 are a hydrogen atom or a methyl group, L is a single bond or an alkylene group, or a divalent linking group containing an alkylene oxide structure, and X is A compound having an oxygen atom or an imine group and Z being an aliphatic group, a heterocyclic group or an aromatic group is preferred. In addition, as the monomer represented by the general formula (ii), a compound in which R 1 is a hydrogen atom or a methyl group, L is an alkylene group, and Z is an aliphatic group, a heterocyclic group, or an aromatic group is preferable. Further, as the monomer represented by the general formula (iii), a compound in which R 4 , R 5 and R 6 are a hydrogen atom or a methyl group, and Z is an aliphatic group, a heterocyclic group or an aromatic group is preferred.

作為以式(i)~(iii)表示之代表性化合物的例子,可舉出選自丙烯酸酯類、甲基丙烯酸酯類及苯乙烯類等之自由基聚合性化合物。 另外,作為以式(i)~(iii)表示之代表性化合物的例子,能夠參閱日本特開2013-249417號公報的段落0089~0093中記載之化合物,該些內容引入本說明書中。Examples of the representative compounds represented by the formulae (i) to (iii) include radical polymerizable compounds selected from the group consisting of acrylates, methacrylates, and styrenes. In addition, as examples of the representative compounds represented by the formulae (i) to (iii), the compounds described in paragraphs 0089 to 0093 of Japanese Patent Application Laid-Open No. 2013-249417 can be referred to, and these contents are incorporated herein.

高分子化合物中,疏水性結構單元以質量換算,相對於高分子化合物的總質量,以10~90%的範圍包含為較佳,以20~80%的範圍包含為更佳。含量在上述範圍中可實現充分的圖案形成。In the polymer compound, the hydrophobic structural unit is preferably contained in a range of 10 to 90% with respect to the total mass of the polymer compound in terms of mass, and more preferably contained in a range of 20 to 80%. When the content is in the above range, sufficient pattern formation can be achieved.

(可與黑色顏料等形成相互作用之官能基) 高分子化合物能夠導入可與黑色顏料等著色顏料形成相互作用之官能基。其中,高分子化合物還包含含有可與黑色顏料等著色顏料形成相互作用之官能基之結構單元為較佳。 作為可與該黑色顏料等著色顏料形成相互作用之官能基,例如,可舉出酸基、鹼性基、配位性基及具有反應性之官能基等。 高分子化合物具有酸基、鹼性基、配位性基或具有反應性之官能基時,分別含有具有酸基之結構單元、具有鹼性基之結構單元、具有配位性基之結構單元或包含具有反應性之結構單元為較佳。 尤其,高分子化合物進一步含有羧酸基等鹼可溶性基作為酸基,藉此能夠對高分子化合物賦予用於基於鹼顯影之圖案形成的顯影性。 亦即,藉由向高分子化合物導入鹼可溶性基,上述組成物中,作為有助於黑色顏料等著色顏料的分散之分散劑的高分子化合物含有鹼可溶性。含有該種高分子化合物之組成物成為曝光部的遮光性優異者,且未曝光部的鹼顯影性得到提高。 並且,藉由高分子化合物包含含有酸基之結構單元,高分子化合物變得易與溶劑整合且塗佈性亦提高之趨勢。 推測這是因為,含有酸基之結構單元中的酸基易與黑色顏料等著色顏料相互作用,高分子化合物使黑色顏料等著色顏料穩定地分散,並且使黑色顏料等著色顏料分散之高分子化合物的黏度變低,高分子化合物本身亦容易穩定地分散。(Functional group capable of interacting with black pigment and the like) The polymer compound can introduce a functional group capable of interacting with colored pigments such as the black pigment. Among them, it is preferable that the polymer compound further includes a structural unit containing a functional group capable of interacting with a colored pigment such as a black pigment. Examples of the functional group that can interact with a color pigment such as the black pigment include an acid group, a basic group, a coordinating group, and a reactive functional group. When a polymer compound has an acid group, a basic group, a coordinating group, or a reactive functional group, it contains a structural unit having an acid group, a structural unit having a basic group, a structural unit having a coordination group, or It is preferred to include reactive structural units. In particular, the polymer compound further contains an alkali-soluble group such as a carboxylic acid group as an acid group, whereby the polymer compound can be provided with developability for pattern formation by alkali development. That is, by introducing an alkali-soluble group into the polymer compound, the polymer compound in the composition described above contains alkali-solubility as a dispersant that facilitates the dispersion of colored pigments such as black pigments. A composition containing such a polymer compound becomes an excellent light-shielding property of the exposed portion, and the alkali developability of the unexposed portion is improved. In addition, when the polymer compound contains a structural unit containing an acid group, the polymer compound tends to be easily integrated with a solvent, and the coatability is also improved. It is presumed that this is because the acid groups in the structural unit containing acid groups easily interact with colored pigments such as black pigments, the polymer compounds stably disperse the colored pigments such as black pigments, and the polymer compounds that disperse the colored pigments such as black pigments The viscosity becomes low, and the polymer compound itself is easily and stably dispersed.

其中,含有作為酸基的鹼可溶性基之結構單元可以係與上述的含有接枝鏈之結構單元相同的結構單元,亦可以係不同的結構單元,但含有作為酸基的鹼可溶性基之結構單元係與上述的疏水性結構單元不同的結構單元(亦即,並不相當於上述的疏水性結構單元)。Among them, the structural unit containing the alkali-soluble group as the acid group may be the same structural unit as the structural unit containing the graft chain described above, or may be a different structural unit, but the structural unit containing the alkali-soluble group as the acid group It is a structural unit different from the above-mentioned hydrophobic structural unit (that is, does not correspond to the above-mentioned hydrophobic structural unit).

作為可與黑色顏料等著色顏料形成相互作用之官能基亦即酸基,例如有羧酸基、磺酸基、磷酸基或酚性羥基等,羧酸基、磺酸基及磷酸基中的至少1種為較佳,針對黑色顏料等著色顏料的吸附力良好且著色顏料的分散性較高之角度考慮,羧酸基為更佳。 亦即,高分子化合物還包含含有羧酸基、磺酸基及磷酸基中的至少1種之結構單元為較佳。As a functional group that can interact with a color pigment such as a black pigment, that is, an acid group, for example, there are a carboxylic acid group, a sulfonic acid group, a phosphate group, or a phenolic hydroxyl group. One type is preferable, and a carboxylic acid group is more preferable from the viewpoints that a color pigment such as a black pigment has good adsorption and a high dispersibility of the color pigment. That is, it is preferable that the polymer compound further includes a structural unit containing at least one of a carboxylic acid group, a sulfonic acid group, and a phosphoric acid group.

高分子化合物可具有1種或2種以上的含有酸基之結構單元。 高分子化合物可含有包含酸基之結構單元,亦可不含有,但含有時,含有酸基之結構單元的含量以質量換算,相對於高分子化合物的總質量,5~80%為較佳,從抑制基於鹼顯影之圖像強度的損傷之觀點考慮,10~60%為更佳。The polymer compound may have one or two or more kinds of structural units containing an acid group. The polymer compound may or may not contain a structural unit containing an acid group, but when contained, the content of the structural unit containing an acid group is calculated in terms of mass, and it is preferably 5 to 80% relative to the total mass of the polymer compound. From the viewpoint of suppressing damage to the image intensity due to alkali development, 10 to 60% is more preferable.

作為可與黑色顏料等著色顏料形成相互作用之官能基亦即鹼性基,例如有第1級胺基、第2級胺基、第3級胺基、含有N原子之雜環及醯胺基等,從針對黑色顏料等著色顏料的吸附力良好且著色顏料的分散性較高之角度考慮,第3級胺基為較佳。高分子化合物能夠含有1種或2種以上的該些鹼性基。 高分子化合物可含有包含鹼性基之結構單元,亦可不含有,但含有時,含有鹼性基之結構單元的含量以質量換算,相對於高分子化合物的總質量,0.01%以上且50%以下為較佳,從抑制阻礙顯影性之觀點考慮,0.01%以上且30%以下為更佳。Basic groups that are functional groups that can interact with colored pigments such as black pigments include primary amine groups, secondary amine groups, tertiary amine groups, heterocyclic rings containing N atoms, and amidine groups From the viewpoints of good adsorption of color pigments such as black pigments and high dispersibility of the color pigments, a tertiary amine group is preferred. The polymer compound may contain one or more of these basic groups. The polymer compound may or may not contain a structural unit containing a basic group, but when contained, the content of the structural unit containing a basic group is calculated by mass, and is 0.01% or more and 50% or less with respect to the total mass of the polymer compound. From the viewpoint of suppressing the development resistance, it is more preferable to be 0.01% or more and 30% or less.

作為可與黑色顏料等著色顏料形成相互作用之官能基亦即配位性基及具有反應性之官能基,例如可舉出乙醯乙醯氧基、三烷氧基甲矽烷基、異氰酸酯基、酸酐及醯氯等。從針對黑色顏料等著色顏料吸附力良好且著色顏料的分散性較高之角度考慮,乙醯乙醯氧基為較佳。高分子化合物可具有1種或2種以上的該些基團。 高分子化合物可包含含有配位性基之結構單元或含有具有反應性之官能基之結構單元,亦可不含有,但含有時,該些結構單元的含量以質量換算,相對於高分子化合物的總質量,10%以上且80%以下為較佳,從抑制阻礙顯影性之觀點考慮,20%以上且60%以下為更佳。Examples of functional groups that can interact with colored pigments such as black pigments, that is, coordination groups and reactive functional groups include, for example, acetoacetoxy, trialkoxysilyl, isocyanate groups, Acid anhydride and chlorin. From the standpoint of good adsorption of colored pigments such as black pigments and high dispersibility of colored pigments, acetamidine is preferred. The polymer compound may have one or two or more of these groups. The polymer compound may include a structural unit containing a coordinating group or a structural unit containing a reactive functional group, or may not contain it, but when contained, the content of these structural units is expressed in terms of mass relative to the total of the polymer compound. The quality is preferably 10% or more and 80% or less, and more preferably 20% or more and 60% or less from the viewpoint of suppressing the obstructive development property.

上述高分子化合物除了接枝鏈以外還含有可與黑色顏料等著色顏料形成相互作用之官能基時,含有上述的各種可與黑色顏料等著色顏料形成相互作用之官能基即可,並不特別限定該些官能基如何被導入,但高分子化合物含有選自源自以下述通式(iv)~(vi)表示之單體的結構單元之1種以上的結構單元為較佳。When the polymer compound contains a functional group capable of interacting with a coloring pigment such as a black pigment in addition to the graft chain, the above-mentioned various functional groups capable of interacting with a coloring pigment such as a black pigment may be included, which is not particularly limited. How these functional groups are introduced, the polymer compound preferably contains one or more structural units selected from the structural units derived from the monomers represented by the following general formulae (iv) to (vi).

[化學式6] [Chemical Formula 6]

通式(iv)~通式(vi)中,R11 、R12 及R13 分別獨立地表示氫原子、鹵原子(例如,氟原子、氯原子、溴原子等)或碳原子數為1~6的烷基(例如,甲基、乙基、丙基等)。 通式(iv)~通式(vi)中,R11 、R12 及R13 分別獨立地為氫原子或碳原子數為1~3的烷基為較佳,分別獨立地為氫原子或甲基為更佳。通式(iv)中,R12 及R13 分別為氫原子尤為佳。In the general formulae (iv) to (vi), R 11 , R 12 and R 13 each independently represent a hydrogen atom, a halogen atom (for example, a fluorine atom, a chlorine atom, a bromine atom, or the like) or a carbon number of 1 to 6 alkyl (eg, methyl, ethyl, propyl, etc.). In the general formulae (iv) to (vi), it is preferable that R 11 , R 12 and R 13 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and each is independently a hydrogen atom or a methyl group. The base is better. In the general formula (iv), R 12 and R 13 are each preferably a hydrogen atom.

通式(iv)中的X1 表示氧原子(-O-)或亞胺基(-NH-),氧原子為較佳。 並且,通式(v)中的Y表示次甲基或氮原子。X 1 in the general formula (iv) represents an oxygen atom (-O-) or an imine group (-NH-), and an oxygen atom is preferred. In addition, Y in the general formula (v) represents a methine group or a nitrogen atom.

並且,通式(iv)~通式(v)中的L1 表示單鍵或2價的連結基。作為2價的連結基的例子,可舉出2價的脂肪族基(例如,伸烷基、取代伸烷基、伸烯基、取代伸烯基、伸炔基及取代伸炔基)、2價的芳香族基(例如,伸芳基及取代伸芳基)、2價的雜環基、氧原子(-O-)、硫原子(-S-)、亞胺基(-NH-)、取代亞胺鍵(-NR31 ’-,其中,R31 ’為脂肪族基、芳香族基或雜環基)、羰鍵(-CO-)及該些的組合等。In addition, L 1 in the general formulae (iv) to (v) represents a single bond or a divalent linking group. Examples of the divalent linking group include a divalent aliphatic group (for example, an alkylene group, a substituted alkylene group, an alkylene group, a substituted alkylene group, an alkylene group, and a substituted alkylene group), 2 Valence aromatic group (for example, arylene group and substituted arylene group), divalent heterocyclic group, oxygen atom (-O-), sulfur atom (-S-), imino group (-NH-), Substituted imine bond (-NR 31 '-, wherein R 31 ' is an aliphatic group, an aromatic group or a heterocyclic group), a carbonyl bond (-CO-), a combination thereof, and the like.

2價的脂肪族基可具有環狀結構或分支結構。脂肪族基的碳原子數為1~20為較佳,1~15為更佳,1~10為進一步較佳。與不飽和脂肪族基相比,脂肪族基為飽和脂肪族基為較佳。並且,脂肪族基可具有取代基。作為取代基的例子,可舉出鹵原子、羥基、芳香族基及雜環基。The divalent aliphatic group may have a cyclic structure or a branched structure. The number of carbon atoms of the aliphatic group is preferably 1 to 20, more preferably 1 to 15 and even more preferably 1 to 10. It is preferable that the aliphatic group is a saturated aliphatic group compared with an unsaturated aliphatic group. The aliphatic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an aromatic group, and a heterocyclic group.

2價的芳香族基的碳原子數為6~20為較佳,6~15為更佳,6~10為進一步較佳。並且,芳香族基可具有取代基。取代基的例子可舉出鹵原子、羥基、脂肪族基、芳香族基及雜環基。The carbon number of the divalent aromatic group is preferably 6 to 20, more preferably 6 to 15 and even more preferably 6 to 10. The aromatic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an aliphatic group, an aromatic group, and a heterocyclic group.

2價的雜環基作為雜環含有5員環或6員環為較佳。雜環中可縮合有其他雜環、脂肪族環或芳香族環中的1個以上。並且,雜環基可具有取代基。作為取代基的例子,可舉出鹵原子、羥基、氧代基(=O)、硫代基(=S)、亞胺基(=NH)、取代亞胺基(=N-R32 ,其中,R32 為脂肪族基、芳香族基或雜環基)、脂肪族基、芳香族基及雜環基。The divalent heterocyclic group preferably contains a 5-membered ring or a 6-membered ring as a heterocyclic ring. In the heterocyclic ring, one or more of other heterocyclic rings, aliphatic rings, or aromatic rings may be condensed. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an oxo group (= O), a thio group (= S), an imino group (= NH), and a substituted imino group (= NR 32) . 32 is an aliphatic group, an aromatic group or a heterocyclic group), an aliphatic group, an aromatic group, and a heterocyclic group.

L1 係單鍵、伸烷基或包含氧化烯結構之2價的連結基為較佳。氧化烯結構係氧乙烯結構或氧丙烯結構為更佳。並且,L1 可包含重複包含2個以上的氧化烯結構之聚氧化烯結構。作為聚氧化烯結構,聚氧乙烯結構或聚氧丙烯結構為較佳。聚氧乙烯結構以-(OCH2 CH2 )n-表示,n為2以上的整數為較佳,2~10的整數為更佳。L 1 is preferably a single bond, an alkylene group, or a divalent linking group containing an alkylene oxide structure. The alkylene oxide structure is more preferably an oxyethylene structure or an oxypropylene structure. In addition, L 1 may include a polyoxyalkylene structure including two or more alkylene oxide structures repeatedly. As the polyoxyalkylene structure, a polyoxyethylene structure or a polyoxypropylene structure is preferred. The polyoxyethylene structure is represented by-(OCH 2 CH 2 ) n-, where n is an integer of 2 or more is preferable, and an integer of 2 to 10 is more preferable.

通式(iv)~通式(vi)中,Z1 表示接枝鏈以外可與黑色顏料等著色顏料形成相互作用之官能基,羧酸基及第三級胺基為較佳,羧酸基為更佳。In the general formulae (iv) to (vi), Z 1 represents a functional group capable of interacting with a colored pigment such as a black pigment other than the graft chain. A carboxylic acid group and a tertiary amine group are preferred, and a carboxylic acid group For the better.

通式(vi)中,R14 、R15 及R16 分別獨立地表示氫原子、鹵原子(例如,氟、氯、溴等)、碳原子數為1~6的烷基(例如,甲基、乙基及丙基等)、-Z1 或L1 -Z1 。其中,L1 及Z1 的含義與上述中的L1 及Z1 相同,較佳例亦相同。作為R14 、R15 及R16 ,分別獨立地為氫原子、或碳原子數為1~3的烷基為較佳,氫原子為更佳。In the general formula (vi), R 14 , R 15 and R 16 each independently represent a hydrogen atom, a halogen atom (for example, fluorine, chlorine, bromine, etc.), and an alkyl group having 1 to 6 carbon atoms (for example, methyl , ethyl and propyl, etc.), - Z 1 or L 1 -Z 1. Wherein, L 1 and Z 1 meaning the same as the above L 1 and Z 1, preferred embodiments are also the same. R 14 , R 15, and R 16 are each preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and more preferably a hydrogen atom.

作為以通式(iv)表示之單體,R11 、R12 及R13 分別獨立地為氫原子或甲基、L1 為伸烷基或含有氧化烯結構之2價的連結基、X1 為氧原子或亞胺基、Z1 為羧酸基之化合物為較佳。 並且,作為以通式(v)表示之單體,R11 為氫原子或甲基、L1 為伸烷基、Z1 為羧酸基、Y為次甲基之化合物為較佳。 而且,作為以通式(vi)表示之單體,R14 、R15 及R16 分別獨立地為氫原子或甲基、L1 為單鍵或伸烷基、Z1 為羧酸基之化合物為較佳。As the monomer represented by the general formula (iv), R 11 , R 12 and R 13 are each independently a hydrogen atom or a methyl group, L 1 is an alkylene group or a divalent linking group containing an alkylene oxide structure, and X 1 A compound which is an oxygen atom or an imine group and Z 1 is a carboxylic acid group is preferred. Further, as the monomer represented by the general formula (v), a compound in which R 11 is a hydrogen atom or a methyl group, L 1 is an alkylene group, Z 1 is a carboxylic acid group, and Y is a methine group is preferable. Further, as the monomer represented by the general formula (vi), compounds in which R 14 , R 15 and R 16 are each independently a hydrogen atom or a methyl group, L 1 is a single bond or an alkylene group, and Z 1 is a carboxylic acid group compound Is better.

以下,示出以通式(iv)~通式(vi)表示之單體(化合物)的代表例。 作為單體的例子,可舉出甲基丙烯酸、巴豆酸、異巴豆酸、分子內含有加成聚合性雙鍵及羥基之化合物(例如,甲基丙烯酸2-羥乙基)與琥珀酸酐的反應物、分子內含有加成聚合性雙鍵及羥基之化合物與鄰苯二甲酸酐的反應物、分子內含有加成聚合性雙鍵及羥基之化合物與四羥基鄰苯二甲酸酐的反應物、分子內含有加成聚合性雙鍵及羥基之化合物與偏苯三酸酐的反應物、分子內含有加成聚合性雙鍵及羥基之化合物與均苯四甲酸酐的反應物、丙烯酸、丙烯酸二聚物、丙烯酸寡聚物、馬來酸、伊康酸、反丁烯二酸、4-乙烯基安息香酸、乙烯基苯酚及4-羥基苯甲基丙烯醯等。Representative examples of the monomer (compound) represented by the general formulae (iv) to (vi) are shown below. Examples of the monomer include a reaction of methacrylic acid, crotonic acid, isocrotonic acid, a compound containing an addition polymerizable double bond and a hydroxyl group (for example, 2-hydroxyethyl methacrylate) and succinic anhydride Reactants of compounds containing addition polymerizable double bonds and hydroxyl groups in the molecule and phthalic anhydride, reactants of compounds containing addition polymerizable double bonds and hydroxyl groups in the molecule and tetrahydroxyphthalic anhydride, Reactant of compound containing addition polymerizable double bond and hydroxyl group in molecule and trimellitic anhydride, Reactant of compound containing addition polymerizable double bond and hydroxyl group in molecule and pyromellitic anhydride, acrylic acid, acrylic acid dimer, acrylic acid Oligomers, maleic acid, itaconic acid, fumaric acid, 4-vinyl benzoic acid, vinyl phenol, 4-hydroxybenzylpropene, and the like.

從與黑色顏料等著色顏料的相互作用、經時穩定性及向顯影液的浸透性的觀點考慮,含有可與黑色顏料等著色顏料形成相互作用之官能基之結構單元的含量,相對於高分子化合物的總質量,0.05質量%~90質量%為較佳,1.0質量%~80質量%為更佳,10質量%~70質量%為進一步較佳。The content of the structural unit containing a functional group capable of interacting with a coloring pigment such as a black pigment from the viewpoint of interaction with a coloring pigment such as a black pigment, stability over time, and permeability to a developing solution, relative to the polymer The total mass of the compound is preferably from 0.05% by mass to 90% by mass, more preferably from 1.0% by mass to 80% by mass, and even more preferably from 10% by mass to 70% by mass.

(其他結構單元) 而且,為了提高圖像強度等各種性能,高分子化合物可在無損本發明的效果之前提下,進一步含有與含有接枝鏈之結構單元、疏水性結構單元及含有可與黑色顏料等著色顏料形成相互作用之官能基之結構單元不同之、含有各種功能之其他結構單元(例如,具有與用於分散物之分散介質具有親和性之官能基等之結構單元)。 作為該種其他結構單元,例如可舉出源自選自丙烯腈類及甲基丙烯腈類等之自由基聚合性化合物的結構單元。 高分子化合物能夠使用1種或者2種以上的該些其他結構單元,其含量以質量換算,相對於高分子化合物的總質量,0%以上且80%以下為較佳,10%以上且60%以下尤為佳。含量在上述範圍內可維持充分的圖案形成性。(Other structural units) In addition, in order to improve various properties such as image strength, the polymer compound may be further added without impairing the effects of the present invention, and further contains structural units containing graft chains, hydrophobic structural units, and Coloring pigments, such as pigments, have different structural units that form functional groups that interact with each other and contain other structural units with various functions (for example, structural units that have functional groups that have affinity with the dispersion medium used for the dispersion). Examples of such other structural units include structural units derived from a radical polymerizable compound selected from acrylonitrile and methacrylonitrile. The polymer compound can use one or two or more of these other structural units, and its content is expressed in terms of mass, and relative to the total mass of the polymer compound, 0% to 80% is preferred, and 10% to 60% is preferred. The following are particularly preferred. When the content is within the above range, sufficient pattern-formability can be maintained.

(高分子化合物的物性) 高分子化合物的酸值為0mgKOH/g以上且160mgKOH/g以下的範圍為較佳,10mgKOH/g以上且140mgKOH/g以下的範圍為更佳,20mgKOH/g以上且120mgKOH/g以下的範圍為進一步較佳。 若高分子化合物的酸值為160mgKOH/g以下,則更有效地抑制形成硬化膜時的顯影中的圖案剝離。並且,若高分子化合物的酸值為10mgKOH/g以上,則鹼顯影性更加良好。並且,若高分子化合物的酸值為20mgKOH/g以上,則能夠更加抑制黑色顏料等著色顏料的沉澱,能夠使粗大粒子數更少,能夠更加提高組成物的經時穩定性。(Physical properties of polymer compound) The acid value of the polymer compound is preferably in a range of 0 mgKOH / g or more and 160 mgKOH / g or less, more preferably in a range of 10 mgKOH / g or more and 140 mg KOH / g or less, and in a range of 20 mgKOH / g or more and 120 mgKOH. The range below / g is more preferable. When the acid value of the polymer compound is 160 mgKOH / g or less, the pattern peeling during development when forming a cured film is more effectively suppressed. In addition, when the acid value of the polymer compound is 10 mgKOH / g or more, alkali developability is further improved. In addition, if the acid value of the polymer compound is 20 mgKOH / g or more, precipitation of colored pigments such as black pigments can be more suppressed, the number of coarse particles can be reduced, and the stability of the composition over time can be further improved.

高分子化合物的酸值例如能夠由高分子化合物中的酸基的平均含量計算。並且,能夠藉由改變含有高分子化合物的構成成分亦即酸基之結構單元的含量來獲得具有所希望的酸值之樹脂。The acid value of the polymer compound can be calculated, for example, from the average content of acid groups in the polymer compound. In addition, a resin having a desired acid value can be obtained by changing the content of a structural unit that is a component containing a polymer compound, that is, an acid group.

形成硬化膜時,從顯影時的圖案剝離的抑制和顯影性的觀點考慮,高分子化合物的重量平均分子量作為基於GPC(Gel Permeation Chromatography:凝膠滲透層析法)法之聚苯乙烯換算值,4,000以上且300,000以下為較佳,5,000以上且200,000以下為更佳,6,000以上且100,000以下進一步較佳,10,000以上且50,000以下尤為佳。 GPC法基於如下方法,亦即,利用HLC-8020GPC(TOSOH CORPORATION製造),作為管柱使用TSKgel SuperHZM-H、TSKgel SuperHZ4000、TSKgel SuperHZ2000(TOSOH CORPORATION製造、4.6mmID×15cm),作為溶離液使用THF(四氫呋喃)。When forming a cured film, from the viewpoints of suppression of pattern peeling during development and developability, the weight average molecular weight of the polymer compound is a polystyrene conversion value based on GPC (Gel Permeation Chromatography) method, 4,000 or more and 300,000 or less are preferable, 5,000 or more and 200,000 or less are more preferable, 6,000 or more and 100,000 or less are more preferable, and 10,000 or more and 50,000 or less are more preferable. The GPC method is based on a method using HLC-8020GPC (manufactured by TOSOH CORPORATION), and using TSKgel SuperHZM-H, TSKgel SuperHZ4000, TSKgel SuperHZ2000 (manufactured by TOSOH CORPORATION, 4.6mmID × 15cm) as a column, and using THF as the eluent Tetrahydrofuran).

高分子化合物能夠依公知的方法合成,作為合成高分子化合物時使用之溶劑,例如可舉出二氯乙烷、環己酮、甲乙酮、丙酮、甲醇、乙醇、丙醇、丁醇、乙二醇單甲醚、乙二醇單乙醚、2-甲氧基乙基乙酸酯、1-甲氧基-2-丙醇、1-甲氧基-2-乙酸丙酯、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、二甲基亞碸、甲苯、乙酸乙酯、乳酸甲酯及乳酸乙酯等。該些溶劑可單獨使用亦可混合2種以上來使用。The polymer compound can be synthesized by a known method. Examples of the solvent used in the synthesis of the polymer compound include dichloroethane, cyclohexanone, methyl ethyl ketone, acetone, methanol, ethanol, propanol, butanol, and ethylene glycol. Monomethyl ether, ethylene glycol monoethyl ether, 2-methoxyethyl acetate, 1-methoxy-2-propanol, 1-methoxy-2-propyl acetate, N, N-dimethyl Methylformamide, N, N-dimethylacetamide, dimethylmethylene, toluene, ethyl acetate, methyl lactate, ethyl lactate, and the like. These solvents may be used alone or in combination of two or more.

作為高分子化合物的具體例,可舉出Kusumoto Chemicals, Ltd.製造“DA-7301”、BYK Chemie公司製造“Disperbyk-101(聚醯胺胺磷酸鹽)、107(羧酸酯)、110(含有酸基之共聚物)、111(磷酸系分散劑)、130(聚醯胺)、161、162、163、164、165、166、170、190(高分子共聚物)”、“BYK-P104、P105(高分子量不飽和聚羧酸)”、EFKA公司製造“EFKA4047、4050~4010~4165(聚胺基甲酸酯系)、EFKA4330~4340(嵌段共聚物)、4400~4402(改性聚丙烯酸酯)、5010(聚醯胺酯)、5765(高分子量聚羧酸鹽)、6220(脂肪酸聚酯)、6745(酞菁衍生物)、6750(偶氮顏料衍生物)”、Ajinomoto Fine-Techno Co., Inc.製造“AJISPER PB821、PB822、PB880、PB881”、KYOEISHA CHEMICAL Co., LTD.製造“FLOREN TG-710(胺基甲酸酯低聚物)”、“Polyflow No.50E、No.300(丙烯酸系共聚物)”、Kusumoto Chemicals, Ltd.製造“DISPARLON KS-860、873SN、874、#2150(脂肪族多元羧酸)、#7004(聚醚酯)、DA-703-50、DA-705、DA-725”、Kao Corporation製造“DEMOL RN、N(萘磺酸福馬林縮聚物)、MS、C、SN-B(芳香族磺酸福馬林縮聚物)”、“HOMOGENOL L-18(高分子聚羧酸)”、“EMULGEN 920、930、935、985(聚氧乙烯壬基苯基醚)”、“ACETAMIN 86(硬脂胺醋酸鹽)”、The Lubrinzol corporation製造“SOLSPERSE 5000(酞菁衍生物)、22000(偶氮顏料衍生物)、13240(聚酯胺)、3000、12000、17000、20000、27000(在末端部含有功能部之高分子)、24000、28000、32000、38500(接枝共聚物)”、Nikkol Chemicals CO., LTD.製造“Nikkor T106(聚氧乙烯山梨醇單油酸酯)、MYS-IEX(聚氧乙烯單硬脂酸酯)”、Kawaken Fine Chemicals CO., LTD.製造HINOAKUTO T-8000E等、Shin-Etsu Chemical Co., Ltd.製造聚有機基團矽氧烷聚合物KP341、Yusho Co Ltd製造“W001:陽離子系界面活性劑”、聚氧乙烯月桂基醚、聚氧乙烯硬脂醚、聚氧乙烯油基醚、聚氧乙烯辛基苯基醚、聚氧乙烯壬基苯基醚、聚乙二醇二月桂酸酯、聚乙二醇二硬脂酸酯、脫水山梨醇脂肪酸酯等非離子系界面活性劑、“W004、W005、W017”等陰離子系界面活性劑、MORISHITA & CO., LTD.製造“EFKA-46、EFKA-47、EFKA-47EA、EFKA聚合物100、EFKA聚合物400、EFKA聚合物401、EFKA聚合物450”、SAN NOPCO LIMITED製造“Disperse Aid 6、Disperse Aid 8、Disperse Aid 15、Disperse Aid 9100”等高分子分散劑、ADEKA CORPORATION製造“Adeka Pluronic L31、F38、L42、L44、L61、L64、F68、L72、P95、F77、P84、F87、P94、L101、P103、F108、L121、P-123”及Sanyo Chemical Industries, Ltd.製造“Ionet(商品名)S-20”等。並且,還能夠使用Acrylic base FFS-6752、Acrylic base FFS-187、Akurikyua-RD-F8及Cyclomer P。 並且,作為兩性樹脂的市售品,例如可舉出BYK Additives&Instruments製造的DISPERBYK-130、DISPERBYK-140、DISPERBYK-142、DISPERBYK-145、DISPERBYK-180、DISPERBYK-187、DISPERBYK-191、DISPERBYK-2001、DISPERBYK-2010、DISPERBYK-2012、DISPERBYK-2025、BYK-9076、Ajinomoto Fine-Techno Co.,Inc.製造的AJISPER PB821、AJISPER PB822及AJISPER PB881等。 該些高分子化合物可單獨使用,亦可組合2種以上來使用。Specific examples of the polymer compound include "DA-7301" manufactured by Kusumoto Chemicals, Ltd., "Disperbyk-101 (polyamidamine phosphate), 107 (carboxylic acid ester), 110 (contained by BYK Chemie) Acid-based copolymers), 111 (phosphoric acid-based dispersant), 130 (polyamidamine), 161, 162, 163, 164, 165, 166, 170, 190 (polymer copolymers), "BYK-P104, P105 (high molecular weight unsaturated polycarboxylic acid) "," EFKA4047, 4050-4010 to 4165 (polyurethane type), EFKA4330 to 4340 (block copolymer), 4400 to 4402 (modified polymer manufactured by EFKA) Acrylate), 5010 (Polyamidate), 5765 (High Molecular Weight Polycarboxylate), 6220 (Fatty Acid Polyester), 6745 (Phthalocyanine Derivatives), 6750 (Azo Pigment Derivatives) ", Ajinomoto Fine- "AJISPER PB821, PB822, PB880, PB881" manufactured by Techno Co., Inc., "FLOREN TG-710 (urethane oligomer)" manufactured by KYOEISHA CHEMICAL Co., LTD., "Polyflow No. 50E, No. .300 (acrylic copolymer) "," DISPARLON KS-860, 87 "manufactured by Kusumoto Chemicals, Ltd. 3SN, 874, # 2150 (aliphatic polycarboxylic acid), # 7004 (polyetherester), DA-703-50, DA-705, DA-725 "," DEMOL RN, N (formma naphthalenesulfonate) manufactured by Kao Corporation Forest polycondensate), MS, C, SN-B (formalin polycondensate of aromatic sulfonic acid) "," HOMOGENOL L-18 (polymeric polycarboxylic acid) "," EMULGEN 920, 930, 935, 985 (polyoxygen Ethylene Nonyl Phenyl Ether) "," ACETAMIN 86 (Stearylamine Acetate) "," SOLSPERSE 5000 (phthalocyanine derivative), 22000 (azo pigment derivative), 13240 (polyesteramine) manufactured by The Lubrinzol corporation , 3000, 12000, 17000, 20000, 27000 (polymers containing functional units at the ends), 24000, 28000, 32000, 38500 (graft copolymers) "," Nikkor T106 (Polymer) manufactured by Nikkol Chemicals CO., LTD. Oxyethylene sorbitol monooleate), MYS-IEX (polyoxyethylene monostearate) ", manufactured by Kawaken Fine Chemicals CO., LTD., HINOAKUTO T-8000E, etc., manufactured by Shin-Etsu Chemical Co., Ltd. Polyorganosiloxane polymer KP341, "W001: cationic surfactant" manufactured by Yusho Co Ltd, Polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene Non-ionic surfactants such as glycol distearate and sorbitan fatty acid esters, anionic surfactants such as "W004, W005, W017", "EFKA-46, EFKA" manufactured by MORISHITA & CO., LTD. -47, EFKA-47EA, EFKA polymer 100, EFKA polymer 400, EFKA polymer 401, EFKA polymer 450 "," Disperse Aid 6, Disperse Aid 8, Disperse Aid 15, Disperse Aid 9100 "manufactured by SAN NOPCO LIMITED Polymer dispersant, "Adeka Pluronic L31, F38, L42, L44, L61, L64, F68, L68, L72, P95, F77, P84, F87, P94, L101, P103, F108, L121, P-123" manufactured by ADEKA CORPORATION, and Sanyo Chemical Industries, Ltd. makes "Ionet (trade name) S-20" and the like. In addition, Acrylic base FFS-6752, Acrylic base FFS-187, Akurikuya-RD-F8, and Cyclomer P can also be used. Examples of commercially available amphoteric resins include DISPERBYK-130, DISPERBYK-140, DISPERBYK-142, DISPERBYK-145, DISPERBYK-180, DISPERBYK-187, DISPERBYK-191, DISPERBYK-2001, manufactured by BYK Additives & Instruments. DISPERBYK-2010, DISPERBYK-2012, DISPERBYK-2025, BYK-9076, AJISPER PB821, AJISPER PB822, and AJISPER PB881 manufactured by Ajinomoto Fine-Techno Co., Inc. and the like. These polymer compounds may be used alone or in combination of two or more kinds.

另外,作為高分子化合物的具體例,能夠參閱日本特開2013-249417號公報的段落0127~0129中記載之高分子化合物,該些內容引入本說明書中。In addition, as a specific example of the polymer compound, reference may be made to the polymer compound described in paragraphs 0127 to 0129 of Japanese Patent Application Laid-Open No. 2013-249417, which are incorporated into the present specification.

並且,作為分散劑,除了上述的高分子化合物以外,還能夠使用日本特開2010-106268號公報的段落0037~0115(對應之US2011/0124824的段落0075~0133欄)的接枝共聚物,該些內容能夠援用並引入本說明書中。 並且,上述以外,還能夠使用日本特開2011-153283號公報的段落0028~0084(對應之US2011/0279759的段落0075~0133欄)的含有包含酸性基經由連結基鍵結而成之側鏈結構之構成成分之高分子化合物,該些內容能夠援用並引入本說明書中。In addition, as the dispersant, in addition to the above-mentioned polymer compound, a graft copolymer of paragraphs 0037 to 0115 (corresponding to the columns of paragraphs 0075 to 0133 of US 2011/0124824) can be used. These contents can be referred to and incorporated into this specification. Furthermore, in addition to the above, it is also possible to use a side chain structure in which paragraphs 0028 to 0084 of Japanese Patent Application Laid-Open No. 2011-153283 (corresponding to columns of paragraphs 0075 to 0133 of US2011 / 0279759) contain acidic groups and are bonded via a linking group The constituent polymer compounds can be referred to and incorporated in this specification.

組成物含有分散劑時,分散劑的含量相對於組成物的總固體成分,0.1~50質量%為較佳,0.5~30質量%為更佳。 分散劑可單獨使用1種,亦可倂用2種以上。倂用2種以上時,總計量成為上述範圍為較佳。When the composition contains a dispersant, the content of the dispersant is preferably 0.1 to 50% by mass, and more preferably 0.5 to 30% by mass, relative to the total solid content of the composition. The dispersant may be used singly or in combination of two or more kinds. When two or more kinds are used, it is preferable that the total measurement falls within the above range.

上述組成物中,上述分散劑相對於上述含金屬氮化物的粒子之質量比(亦即,(組成物中的分散劑的含量)/(組成物中的含金屬氮化物的粒子的含量),以下還稱作“D/P”。)為0.05~0.30為較佳,0.10~0.30為更佳,0.12~0.30為進一步較佳。若上述D/P為0.30以下,則藉由上述組成物形成之硬化膜具有更優異之解像性。若上述D/P為0.05以上,則上述組成物具有更優異之經時穩定性。In the composition, the mass ratio of the dispersant to the metal nitride-containing particles (that is, (content of the dispersant in the composition) / (content of metal nitride-containing particles in the composition), Hereinafter, it is also referred to as "D / P".) 0.05 to 0.30 is preferable, 0.10 to 0.30 is more preferable, and 0.12 to 0.30 is more preferable. When the D / P is 0.30 or less, the cured film formed from the composition has more excellent resolution. When the D / P is 0.05 or more, the composition has more excellent stability over time.

上述組成物中,上述分散劑相對於上述原子A之質量比(亦即,(組成物中的分散劑的含量)/(組成物中的Fe原子的含量))的下限值為0.8以上為較佳,1.0以上為更佳,1.5以上為進一步較佳。上限值為270以下為較佳,150以下為更佳,50以下為進一步較佳。 藉由分散劑相對於原子A之質量比在上述範圍內,上述組成物具有更優異之本發明的效果。尤其,藉由上述質量比在1.5~50的範圍內,上述組成物具有進一步優異之本發明的效果。其理由雖不明確,但認為組成物中的原子A與分散劑相互作用,藉此對圖案形成性(硬化性及解像性)帶來影響。In the above composition, the lower limit value of the mass ratio of the dispersant to the atom A (that is, (the content of the dispersant in the composition) / (the content of Fe atoms in the composition)) is 0.8 or more. Preferably, 1.0 or more is more preferable, and 1.5 or more is more preferable. The upper limit value is preferably 270 or less, more preferably 150 or less, and even more preferably 50 or less. When the mass ratio of the dispersant to the atom A is within the above range, the composition described above has more excellent effects of the present invention. In particular, when the above-mentioned mass ratio is in the range of 1.5 to 50, the composition has further excellent effects of the present invention. Although the reason for this is not clear, it is thought that the atom A in the composition interacts with the dispersant, thereby affecting the pattern-forming property (hardenability and resolvability).

上述組成物中,下述聚合性化合物相對於上述原子A之質量比(亦即,(組成物中的聚合性化合物的含量)/(組成物中的原子A的含量))的下限值為0.7以上為較佳,0.85以上為更佳,1.0以上為進一步較佳。上限值為50以下為較佳,11以下為更佳,7.0以下為進一步較佳。 藉由聚合性化合物相對於原子A之質量比在上述範圍內,組成物具有更優異之本發明的效果。藉由上述含有比例在1.0~7.0的範圍內,組成物具有更優異之本發明的效果。其理由雖不明確,但認為組成物中的原子A與聚合性化合物相互作用,藉此對圖案形成性(硬化性及解像性)帶來影響。In the composition, the lower limit value of the mass ratio of the following polymerizable compound to the atom A (that is, (content of the polymerizable compound in the composition) / (content of the atom A in the composition)) is 0.7 or more is preferable, 0.85 or more is more preferable, and 1.0 or more is more preferable. The upper limit value is preferably 50 or less, more preferably 11 or less, and still more preferably 7.0 or less. When the mass ratio of the polymerizable compound to the atom A is within the above range, the composition has more excellent effects of the present invention. When the content ratio is in the range of 1.0 to 7.0, the composition has more excellent effects of the present invention. Although the reason for this is not clear, it is thought that the atom A in the composition interacts with the polymerizable compound, thereby affecting the pattern-forming property (hardening property and resolving property).

〔黏結樹脂〕 上述組成物含有黏結樹脂為較佳。 作為黏結樹脂,使用線狀有機聚合物為較佳。作為該種線狀有機聚合物,能夠任意地使用公知者。為了實現水顯影或弱鹼性水顯影,選擇對水或弱鹼性水為可溶性或膨潤性之線狀有機聚合物為更佳。其中,作為黏結樹脂,鹼可溶性樹脂(含有促進鹼可溶性之基團之樹脂)尤為佳。 作為黏結樹脂,能夠從線狀有機聚合物且分子(較佳地為以(甲基)丙烯酸系共聚物或苯乙烯系共聚物為主鏈之分子)中含有至少1個促進鹼可溶性之基團之鹼可溶性樹脂中適當選擇。從耐熱性的觀點考慮,聚羥基苯乙烯系樹脂、聚矽氧烷系樹脂、(甲基)丙烯酸樹脂、(甲基)丙烯醯胺系樹脂、(甲基)丙烯酸/(甲基)丙烯醯胺共聚物樹脂、環氧系樹脂及聚醯亞胺系樹脂為較佳,從顯影性控制的觀點考慮,(甲基)丙烯酸樹脂、(甲基)丙烯醯胺系樹脂、(甲基)丙烯酸/(甲基)丙烯醯胺共聚物樹脂及聚醯亞胺系樹脂為更佳。 作為促進鹼可溶性之基團(以下,還稱作酸基),例如,可舉出羧基、磷酸基、磺酸基及酚性羥基等。其中,可溶於有機溶劑且能夠藉由弱鹼性水溶液顯影者為較佳,作為更佳者,可舉出含有源自(甲基)丙烯酸的結構單元之鹼可溶性樹脂。該些酸基可以係僅為1種,亦可以係2種以上。[Binder resin] The composition preferably contains a binder resin. As the binder resin, a linear organic polymer is preferably used. As such a linear organic polymer, a known one can be arbitrarily used. In order to achieve water development or weak alkaline water development, it is more preferable to select a linear organic polymer that is soluble or swellable to water or weak alkaline water. Among them, alkali-soluble resins (resins containing groups that promote alkali-solubility) are particularly preferred as the binding resin. As the binding resin, at least one group that promotes alkali solubility can be obtained from a linear organic polymer and a molecule (preferably, a molecule having a (meth) acrylic copolymer or a styrene copolymer as a main chain). The alkali-soluble resin is appropriately selected. From the viewpoint of heat resistance, polyhydroxystyrene resin, polysiloxane resin, (meth) acrylic resin, (meth) acrylamide resin, (meth) acrylic acid / (meth) acrylic resin Amine copolymer resins, epoxy resins, and polyimide resins are preferred. From the viewpoint of development control, (meth) acrylic resin, (meth) acrylamide resin, and (meth) acrylic acid / (Meth) acrylamide copolymer resin and polyimide resin are more preferable. Examples of the group that promotes alkali solubility (hereinafter also referred to as an acid group) include a carboxyl group, a phosphate group, a sulfonic acid group, and a phenolic hydroxyl group. Among them, those which are soluble in an organic solvent and can be developed with a weakly alkaline aqueous solution are preferred, and more preferred are alkali-soluble resins containing a structural unit derived from (meth) acrylic acid. These acid groups may be only one kind, or two or more kinds.

作為黏結樹脂,例如可舉出在側鏈含有羧酸基之自由基聚合物。作為在側鏈含有羧酸基之自由基聚合物,例如,可舉出日本特開昭59-44615號、日本特公昭54-34327號、日本特公昭58-12577號、日本特公昭54-25957號、日本特開昭54-92723號、日本特開昭59-53836號及日本特開昭59-71048號中記載者。作為在側鏈含有羧酸基之自由基聚合物,可舉出對含有羧酸基之單體單獨或使其共聚之樹脂、含有酸酐之單體單獨或使其共聚來獲得之酸酐單元進行水解、半酯化或半醯胺化之樹脂及藉由不飽和單羧酸及酸酐對環氧樹脂進行改性之環氧丙烯酸酯等。 作為含有羧酸基之單體,可舉出丙烯酸、甲基丙烯酸、衣康酸、巴豆酸、馬來酸、富马酸及4-羧基苯乙烯等。並且,亦可舉出在側鏈含有羧酸基之酸性纖維素衍生物為例。 作為含有酸酐之單體,可舉出馬來酸酐等。此外,對含有羥基之聚合物加成環狀酸酐者等較有用。 並且,含有酸基之縮醛改性聚乙烯醇類黏結樹脂記載於歐洲專利第993966號、歐洲專利第1204000號及日本特開2001-318463號等各公報中。含有酸基之縮醛改性聚乙烯醇類黏結樹脂的膜強度及顯影性的平衡優異,為較佳。 而且,作為水溶性線狀有機聚合物,聚乙烯吡咯烷酮或聚環氧乙烷等較有用。並且,為了提高硬化皮膜的強度,醇溶性尼龍及2,2-雙-(4-羥苯基)-丙烷與環氧氯丙烷的反應物亦即聚醚等亦有用。 並且,國際公開第2008/123097號中記載之聚醯亞胺樹脂亦有用。Examples of the binder resin include a radical polymer containing a carboxylic acid group in a side chain. Examples of the radical polymer containing a carboxylic acid group in a side chain include Japanese Patent Laid-Open No. 59-44615, Japanese Patent No. 54-34327, Japanese Patent No. 58-12577, and Japanese Patent No. 54-25957 No., Japanese Patent Application Laid-Open No. 54-92723, Japanese Patent Application Laid-Open No. 59-53836, and Japanese Patent Application Laid-Open No. 59-71048. Examples of the radical polymer containing a carboxylic acid group in a side chain include hydrolysis of an acid anhydride unit obtained by separately or copolymerizing a monomer containing a carboxylic acid group and an monomer containing an acid anhydride. , Semi-esterified or semi-aminated resins and epoxy acrylates modified by unsaturated monocarboxylic acids and anhydrides. Examples of the carboxylic acid group-containing monomer include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, and 4-carboxystyrene. Moreover, the acidic cellulose derivative which has a carboxylic acid group in a side chain can also be mentioned as an example. Examples of the acid anhydride-containing monomer include maleic anhydride. It is also useful to add a cyclic acid anhydride to a polymer containing a hydroxyl group. In addition, acetal-modified polyvinyl alcohol-based adhesive resins containing acid groups are described in various publications such as European Patent No. 993966, European Patent No. 1204000, and Japanese Patent Laid-Open No. 2001-318463. The acetal-modified polyvinyl alcohol-based adhesive resin containing an acid group is preferable because it has excellent balance of film strength and developability. Moreover, as a water-soluble linear organic polymer, polyvinylpyrrolidone, polyethylene oxide, etc. are useful. In addition, in order to increase the strength of the cured film, alcohol-soluble nylon and polyether, which is a reaction product of 2,2-bis- (4-hydroxyphenyl) -propane and epichlorohydrin, are also useful. In addition, the polyimide resin described in International Publication No. 2008/123097 is also useful.

尤其,該些中,〔苄基(甲基)丙烯酸酯/(甲基)丙烯酸/依據需要為其他加成聚合性乙烯單體〕共聚物及〔(甲基)丙烯酸烯丙酯/(甲基)丙烯酸/依據需要為其他加成聚合性乙烯單體〕共聚物的膜強度、靈敏度及顯影性的平衡優異,為較佳。 作為市售品,例如,可舉出Acrylic base FF-187、FF-426(FUJIKURA KASEI CO., LTD.製造)、Akurikyua-RD-F8(NIPPON SHOKUBAI CO., LTD.)及DAICEL-ALLNEX LTD.製造Cyclomer P(ACA)230AA等。In particular, among these, [benzyl (meth) acrylate / (meth) acrylic acid / other addition polymerizable ethylene monomers as necessary] copolymers) and [allyl (meth) acrylate / (methyl) ) Acrylic acid / other addition polymerizable ethylene monomers as required] Copolymers are excellent in film strength, sensitivity, and developability, and are preferred. Examples of commercially available products include Acrylic base FF-187, FF-426 (manufactured by FUJIKURA KASEI CO., LTD.), Akurikuya-RD-F8 (NIPPON SHOKUBAI CO., LTD.), And DAICEL-ALLNEX LTD. Manufacture of Cyclomer P (ACA) 230AA, etc.

黏結樹脂的製造中,例如,能夠適用基於公知的自由基聚合法之方法。本領域技術人員能夠輕鬆設定藉由自由基聚合法製造鹼可溶性樹脂時的溫度、壓力、自由基起始劑的種類及其量以及溶劑的種類等聚合條件。In the production of the binder resin, for example, a method based on a known radical polymerization method can be applied. Those skilled in the art can easily set polymerization conditions such as temperature, pressure, the type and amount of the radical initiator, and the type of the solvent when the alkali-soluble resin is produced by the radical polymerization method.

並且,作為黏結樹脂,使用包含含有接枝鏈之結構單元及含有酸基(鹼可溶性基)之結構單元之聚合物亦較佳。 含有接枝鏈之結構單元的定義與上述之分散劑所含有之含有接枝鏈之結構單元相同,並且較佳範圍亦相同。 作為酸基,例如有羧酸基、磺酸基、磷酸基或酚性羥基等,羧酸基、磺酸基及磷酸基中的至少1種為較佳,羧酸基為更佳。In addition, as the binder resin, it is also preferable to use a polymer containing a structural unit containing a graft chain and a structural unit containing an acid group (alkali-soluble group). The definition of the structural unit containing the graft chain is the same as the structural unit containing the graft chain contained in the dispersant described above, and the preferred range is also the same. Examples of the acid group include a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a phenolic hydroxyl group. At least one kind of the carboxylic acid group, the sulfonic acid group, and the phosphoric acid group is preferable, and the carboxylic acid group is more preferable.

<含有酸基之結構單元> 作為含有酸基之結構單元,含有選自源自以下述通式(vii)~通式(ix)表示之單量體之結構單元之1種以上結構單元為較佳。<The structural unit containing an acid group> As the structural unit containing an acid group, one or more kinds of structural units selected from structural units derived from a single body represented by the following general formula (vii) to general formula (ix) are preferred. good.

[化學式7] [Chemical Formula 7]

通式(vii)~通式(ix)中,R21 、R22 及R23 分別獨立地表示氫原子、鹵原子(例如,氟原子、氯原子、溴原子等)或碳原子數為1~6的烷基(例如,甲基、乙基、丙基等)。 通式(vii)~通式(ix)中、R21 、R22 及R23 分別獨立地為氫原子或碳原子數為1~3的烷基,分別獨立地為氫原子或甲基為更佳。通式(vii)中,R21 及R23 分別為氫原子尤為佳。In the general formulae (vii) to (ix), R 21 , R 22 and R 23 each independently represent a hydrogen atom, a halogen atom (for example, a fluorine atom, a chlorine atom, a bromine atom, or the like) or a carbon number of 1 to 6 alkyl (eg, methyl, ethyl, propyl, etc.). In the general formulae (vii) to (ix), R 21 , R 22, and R 23 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and each is independently a hydrogen atom or a methyl group. good. In the general formula (vii), R 21 and R 23 are each preferably a hydrogen atom.

通式(vii)中的X2 表示氧原子(-O-)或亞胺基(-NH-),氧原子為較佳。 並且,通式(viii)中的Y表示次甲基或氮原子。X 2 in the general formula (vii) represents an oxygen atom (-O-) or an imine group (-NH-), and an oxygen atom is preferred. In addition, Y in the general formula (viii) represents a methine group or a nitrogen atom.

並且,通式(vii)~通式(ix)中的L2 表示單鍵或2價的連結基。作為2價的連結基的例子,可舉出2價的脂肪族基(例如,伸烷基、取代伸烷基、伸烯基、取代伸烯基、伸炔基及取代伸炔基)、2價的芳香族基(例如,伸芳基及取代伸芳基)、2價的雜環基、氧原子(-O-)、硫原子(-S-)、亞胺基(-NH-)、取代亞胺鍵(-NR41 ’-,其中,R41 ’ 為脂肪族基、芳香族基或雜環基)、羰鍵(-CO-)及該些的組合等。In addition, L 2 in the general formulae (vii) to (ix) represents a single bond or a divalent linking group. Examples of the divalent linking group include a divalent aliphatic group (for example, an alkylene group, a substituted alkylene group, an alkylene group, a substituted alkylene group, an alkylene group, and a substituted alkylene group), 2 Valence aromatic group (for example, arylene group and substituted arylene group), divalent heterocyclic group, oxygen atom (-O-), sulfur atom (-S-), imino group (-NH-), Substituted imine bond (-NR 41 '-, wherein R 41 ' is an aliphatic group, an aromatic group or a heterocyclic group), a carbonyl bond (-CO-), a combination thereof, and the like.

2價的脂肪族基可具有環狀結構或分支結構。脂肪族基的碳原子數為1~20為較佳,1~15為更佳,1~10為進一步較佳。關於脂肪族基,與不飽和脂肪族基相比,飽和脂肪族基為更佳。並且,脂肪族基可具有取代基。作為取代基的例子,可舉出鹵原子、羥基、芳香族基及雜環基。The divalent aliphatic group may have a cyclic structure or a branched structure. The number of carbon atoms of the aliphatic group is preferably 1 to 20, more preferably 1 to 15 and even more preferably 1 to 10. As for the aliphatic group, a saturated aliphatic group is more preferable than an unsaturated aliphatic group. The aliphatic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an aromatic group, and a heterocyclic group.

2價的芳香族基的碳原子數為6~20為較佳,6~15為進一步較佳,6~10為最佳。並且,芳香族基可具有取代基。取代基的例子可舉出鹵原子、羥基、脂肪族基、芳香族基及雜環基。The carbon number of the divalent aromatic group is preferably 6 to 20, 6 to 15 is more preferable, and 6 to 10 is most preferable. The aromatic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an aliphatic group, an aromatic group, and a heterocyclic group.

2價的雜環基作為雜環具有5員環或6員環為較佳。雜環上可縮合有其他雜環、脂肪族環或芳香族環中的1個以上。並且,雜環基可具有取代基。作為取代基的例子,可舉出鹵原子、羥基、氧代基(=O)、硫代基(=S)、亞胺基(=NH)、取代亞胺基(=N-R42 ,其中,R42 為脂肪族基、芳香族基或雜環基)、脂肪族基、芳香族基及雜環基。The divalent heterocyclic group preferably has a 5-membered ring or a 6-membered ring as a heterocyclic ring. One or more of other heterocyclic rings, aliphatic rings, or aromatic rings may be condensed on the heterocyclic ring. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an oxo group (= O), a thio group (= S), an imino group (= NH), and a substituted imino group (= NR 42) . 42 is an aliphatic group, an aromatic group or a heterocyclic group), an aliphatic group, an aromatic group, and a heterocyclic group.

L2 係單鍵、伸烷基或含有氧化烯結構之2價的連結基為較佳。氧化烯結構係氧乙烯結構或氧丙烯結構為更佳。並且,L2 可含有重複包含2個以上的氧化烯結構之聚氧化烯結構。作為聚氧化烯結構,聚氧乙烯結構或聚氧丙烯結構為較佳。聚氧乙烯結構以-(OCH2 CH2 )n-表示,n為2以上的整數為較佳,2~10的整數為更佳。L 2 is preferably a single bond, an alkylene group, or a divalent linking group containing an alkylene oxide structure. The alkylene oxide structure is more preferably an oxyethylene structure or an oxypropylene structure. In addition, L 2 may contain a polyoxyalkylene structure containing two or more alkylene oxide structures repeatedly. As the polyoxyalkylene structure, a polyoxyethylene structure or a polyoxypropylene structure is preferred. The polyoxyethylene structure is represented by-(OCH 2 CH 2 ) n-, where n is an integer of 2 or more is preferable, and an integer of 2 to 10 is more preferable.

通式(vii)~通式(ix)中,Z2 為酸基,羧酸基為較佳。In the general formulae (vii) to (ix), Z 2 is an acid group, and a carboxylic acid group is preferred.

通式(ix)中,R24 、R25 及R26 分別獨立地表示氫原子、鹵原子(例如,氟、氯、溴等)、碳原子數為1~6的烷基(例如,甲基、乙基、丙基等)、-Z2 或L2 -Z2 。其中,L2 及Z2 的含義與上述中的L2 及Z2 相同,較佳例子亦相同。作為R24 、R25 及R26 ,分別獨立地為氫原子或碳原子數為1~3的烷基為較佳,氫原子為更佳。In the general formula (ix), R 24 , R 25 and R 26 each independently represent a hydrogen atom, a halogen atom (for example, fluorine, chlorine, bromine, etc.), and an alkyl group having 1 to 6 carbon atoms (for example, methyl , ethyl, propyl, etc.), - Z 2 or L 2 -Z 2. Wherein, L 2, and the meaning is the same as Z 2 in the above-described L 2 and Z 2, preferred examples are also the same. R 24 , R 25, and R 26 are each preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and more preferably a hydrogen atom.

作為以通式(vii)表示之單量體,R21 、R22 及R23 分別獨立地為氫原子或甲基、L2 為伸烷基或含有氧化烯結構之2價的連結基、X2 為氧原子或亞胺基、Z2 為羧酸基之化合物為較佳。 並且,作為以通式(vii)表示之單量體,R21 為氫原子或甲基、L2 為伸烷基、Z2 為羧酸基、Y為次甲基之化合物為較佳。 而且,作為以通式(ix)表示之單量體,R24 、R25 及R26 分別獨立地為氫原子或甲基、Z2 為羧酸基之化合物為較佳。As a singular body represented by the general formula (vii), R 21 , R 22 and R 23 are each independently a hydrogen atom or a methyl group, L 2 is an alkylene group or a divalent linking group containing an alkylene oxide structure, and X A compound in which 2 is an oxygen atom or an imine group, and Z 2 is a carboxylic acid group is preferred. In addition, as a single body represented by the general formula (vii), a compound in which R 21 is a hydrogen atom or a methyl group, L 2 is an alkylene group, Z 2 is a carboxylic acid group, and Y is a methine group is preferable. Further, as the singular body represented by the general formula (ix), compounds in which R 24 , R 25 and R 26 are each independently a hydrogen atom or a methyl group, and Z 2 is a carboxylic acid group are preferred.

上述黏結樹脂能夠藉由與上述的包含含有接枝鏈之結構單元之分散劑相同之方法合成,並且,其較佳酸值、重量平均分子量亦相同。The above-mentioned adhesive resin can be synthesized by the same method as the above-mentioned dispersant containing a structural unit containing a graft chain, and its preferable acid value and weight average molecular weight are also the same.

上述黏結樹脂可具有1種或2種以上含有酸基之結構單元。 含有酸基之結構單元的含量以質量換算計,相對於上述黏結樹脂的總質量,5~95%為較佳,從抑制基於鹼顯影之圖像強度的損傷之觀點考慮,10~90%為更佳。The above-mentioned adhesive resin may have one or more structural units containing an acid group. The content of the structural unit containing an acid group is, in terms of mass conversion, preferably 5 to 95% relative to the total mass of the above-mentioned adhesive resin. From the viewpoint of suppressing damage to the image strength by alkali development, 10 to 90% is Better.

上述組成物中的黏結樹脂的含量相對於組成物的總固體成分,0.1~30質量%為較佳,0.3~25質量%為更佳。 黏結樹脂可單獨使用1種,亦可倂用2種以上。倂用2種以上時,總計量成為上述範圍為較佳。Content of the binder resin in the said composition is 0.1-30 mass% with respect to the total solid content of a composition, More preferably, it is 0.3-25 mass%. The adhesive resin can be used alone or in combination of two or more. When two or more kinds are used, it is preferable that the total measurement falls within the above range.

黏結樹脂相對於含金屬氮化物的粒子之質量比(亦即,(組成物中的黏結樹脂的含量)/(組成物中的金屬氧化物含有粒子的含量))為0.3以下為較佳,0.25以下為更佳,0.20以下為進一步較佳。另外,對於下限值,並無特別限制,通常為0.01以上,0.02以上為較佳,0.07以上為更佳。 若上限值為0.25以下,則組成物具有更優異之經時穩定性,若為0.014以上,則使用組成物來獲得之硬化膜具有更優異之解像性。The mass ratio of the binding resin to the metal nitride-containing particles (that is, (the content of the binding resin in the composition) / (the content of the metal oxide containing particles in the composition)) is preferably 0.3 or less, and 0.25 The following is more preferred, and 0.20 or less is further preferred. The lower limit is not particularly limited, but is usually 0.01 or more, preferably 0.02 or more, and more preferably 0.07 or more. If the upper limit value is 0.25 or less, the composition has more excellent stability over time, and if it is 0.014 or more, the cured film obtained using the composition has more excellent resolvability.

〔聚合性化合物〕 上述組成物含有聚合性化合物為較佳。 聚合性化合物係包含1個以上的含有烯屬不飽和鍵之基團之化合物為較佳,含有2個以上之化合物為更佳,含有3個以上為進一步較佳,含有5個以上尤為佳。上限例如為15個以下。作為含有烯屬不飽和鍵之基團,例如,可舉出乙烯基、(甲基)烯丙基及(甲基)丙烯醯基等。[Polymerizable Compound] The composition preferably contains a polymerizable compound. The polymerizable compound is preferably a compound containing one or more ethylenically unsaturated bond-containing groups, more preferably two or more compounds, more preferably three or more compounds, and even more preferably five or more compounds. The upper limit is, for example, 15 or less. Examples of the group containing an ethylenically unsaturated bond include a vinyl group, a (meth) allyl group, and a (meth) acrylfluorenyl group.

聚合性化合物例如可以係單體、預聚物及低聚物及該些的混合物以及該些的多聚體等化學形態的任一個。單體為較佳。 聚合性化合物的分子量為100~3000為較佳,250~1500為更佳。 聚合性化合物係3~15官能的(甲基)丙烯酸酯化合物為較佳,3~6官能的(甲基)丙烯酸酯化合物為更佳。 作為單體、預聚物的例子,可舉出不飽和羧酸(例如,丙烯酸、甲基丙烯酸、衣康酸、巴豆酸、異巴豆酸、馬來酸等)和其酯類、醯胺類、以及該些的多聚體,不飽和羧酸與脂肪族多元醇化合物的酯、及不飽和羧酸與脂肪族多元胺化合物的醯胺類、以及該些的多聚體為較佳。並且,亦可適當地使用含有羥基、胺基、巰基等親核性取代基之不飽和羧酸酯或者醯胺類與單官能或多官能異氰酸酯類或者環氧類的加成反應物及上述不飽和羧酸酯或者醯胺類與單官能或多官能的羧酸的脫水縮合反應物等。並且,含有異氰酸酯基、環氧基等親電子性取代基之不飽和羧酸酯或者醯胺類與單官能或多官能的醇類、胺類、硫醇類的反應物、含有鹵素基或甲苯磺醯基等分離性取代基之不飽和羧酸酯或者醯胺類與單官能或多官能的醇類、胺類、硫醇類的反應物亦較佳。並且,還可代替上述不飽和羧酸,使用不飽和膦酸、苯乙烯等苯乙烯衍生物及被取代為乙烯基醚、烯丙基醚等之化合物組。 作為該些的具體化合物,本發明中亦能夠適當使用日本特開2009-288705號公報的段落0095~0108中記載之化合物。The polymerizable compound may be, for example, any of chemical forms such as a monomer, a prepolymer, an oligomer, a mixture of these, and a polymer of these. A monomer is preferred. The molecular weight of the polymerizable compound is preferably 100 to 3000, and more preferably 250 to 1500. The polymerizable compound is preferably a 3 to 15-functional (meth) acrylate compound, and more preferably a 3 to 6-functional (meth) acrylate compound. Examples of monomers and prepolymers include unsaturated carboxylic acids (for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.), and esters and amines thereof. And these polymers, esters of unsaturated carboxylic acids and aliphatic polyhydric alcohol compounds, amidines of unsaturated carboxylic acids and aliphatic polyamine compounds, and these polymers are preferred. In addition, an addition reaction product of an unsaturated carboxylic acid ester or amidoamine containing a nucleophilic substituent such as a hydroxyl group, an amine group, or a mercapto group with a monofunctional or polyfunctional isocyanate or epoxy, and the above-mentioned Dehydration condensation reactants of saturated carboxylic acid esters or amidoamines with monofunctional or polyfunctional carboxylic acids, and the like. In addition, unsaturated carboxylic acid esters containing an electrophilic substituent such as an isocyanate group or an epoxy group, or a reaction product of amidines with monofunctional or polyfunctional alcohols, amines, or thiols, or a halogen group or toluene Unsaturated carboxylic acid esters such as sulfonyl groups and the like or reactants of amidoamines with monofunctional or polyfunctional alcohols, amines, and thiols are also preferred. Further, instead of the unsaturated carboxylic acid, a styrene derivative such as an unsaturated phosphonic acid or styrene, or a compound group substituted with a vinyl ether, an allyl ether, or the like can be used. As these specific compounds, the compounds described in paragraphs 0095 to 0108 of Japanese Patent Application Laid-Open No. 2009-288705 can also be suitably used in the present invention.

聚合性化合物係含有1個以上的包含烯屬不飽和鍵之基團、且常壓下具有100℃以上的沸點之化合物亦較佳。例如,能夠參閱日本特開2013-29760號公報的段落0227、日本特開2008-292970號公報的段落0254~0257中記載之化合物,該內容引入本申請說明書中。The polymerizable compound is also preferably a compound containing one or more groups containing an ethylenically unsaturated bond and having a boiling point of 100 ° C. or higher under normal pressure. For example, the compounds described in paragraph 0227 of Japanese Patent Application Laid-Open No. 2013-29760 and paragraphs 0254 to 0257 of Japanese Patent Application Laid-Open No. 2008-292970 can be referred to, and the contents are incorporated into the present specification.

聚合性化合物還能夠使用雙季戊四醇三丙烯酸酯(作為市售品,KAYARAD D-330;Nippon Kayaku CO., LTD.製造)、雙季戊四醇四丙烯酸酯(作為市售品,KAYARAD D-320;Nippon Kayaku CO., LTD.製造)、雙季戊四醇五(甲基)丙烯酸酯(作為市售品,KAYARAD D-310;Nippon Kayaku CO., LTD.製造)、雙季戊四醇六(甲基)丙烯酸酯(作為市售品,KAYARAD DPHA;Nippon Kayaku CO., LTD.製造、A-DPH-12E;Shin-Nakamura Chemical CO., LTD製造)及該些(甲基)丙烯醯基經由乙二醇殘基、丙二醇殘基之結構(例如,由Sartomer company Inc.市售之SR454、SR499)為較佳。還能夠使用該些的低聚物類型。並且,還能夠使用NK酯A-TMMT(季戊四醇四丙烯酸酯、Shin-Nakamura Chemical CO., LTD製造)及KAYARAD RP-1040(Nippon Kayaku CO., LTD.製造)等。 以下示出較佳聚合性化合物的態様。As the polymerizable compound, dipentaerythritol triacrylate (as a commercially available product, KAYARAD D-330; manufactured by Nippon Kayaku CO., LTD.), And dipentaerythritol tetraacrylate (as a commercially available product, KAYARAD D-320; Nippon Kayaku) can also be used. CO., LTD.), Dipentaerythritol penta (meth) acrylate (as a commercially available product, KAYARAD D-310; manufactured by Nippon Kayaku CO., LTD.), Dipentaerythritol hexa (meth) acrylate (as a commercial product) Sale product, KAYARAD DPHA; manufactured by Nippon Kayaku CO., LTD., A-DPH-12E; manufactured by Shin-Nakamura Chemical CO., LTD) and these (meth) acrylfluorenyl groups via ethylene glycol residues, propylene glycol residues The basic structure (for example, SR454, SR499 marketed by Sartomer company Inc.) is preferable. These oligomer types can also be used. In addition, NK ester A-TMMT (pentaerythritol tetraacrylate, manufactured by Shin-Nakamura Chemical CO., LTD) and KAYARAD RP-1040 (manufactured by Nippon Kayaku CO., LTD.) Can also be used. The following is a description of the state of a preferable polymerizable compound.

聚合性化合物可具有羧酸基、磺酸基及磷酸基等酸基。作為含有酸基之聚合性化合物,脂肪族聚羥基化合物與不飽和羧酸的酯為較佳,使非芳香族羧酸酐與脂肪族聚羥基化合物的未反應的羥基進行反應來使其具有酸基之聚合性化合物為更佳,該酯中,脂肪族聚羥基化合物為季戊四醇和/或雙季戊四醇者為進一步較佳。作為市售品,例如,可舉出TOAGOSEI CO., LTD.製造的ARONIX TO-2349、M-305、M-510及M-520等。The polymerizable compound may have acid groups such as a carboxylic acid group, a sulfonic acid group, and a phosphoric acid group. As the polymerizable compound containing an acid group, an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid is preferred, and a non-aromatic carboxylic anhydride and an unreacted hydroxyl group of the aliphatic polyhydroxy compound are reacted to have an acid group. The polymerizable compound is more preferable. Among the esters, the aliphatic polyhydroxy compound is pentaerythritol and / or dipentaerythritol. Examples of commercially available products include ARONIX TO-2349, M-305, M-510, and M-520 manufactured by TOAGOSEI CO., LTD.

作為含有酸基之聚合性化合物的較佳酸值,為0.1~40mgKOH/g,5~30mgKOH/g為更佳。若聚合性化合物的酸值為0.1mgKOH/g以上,則顯影溶解特性良好,若為40mgKOH/g以下,則在製造和操作上有利。而且,光聚合性能良好且硬化性優異。The preferable acid value of the polymerizable compound containing an acid group is 0.1 to 40 mgKOH / g, and more preferably 5 to 30 mgKOH / g. When the acid value of the polymerizable compound is 0.1 mgKOH / g or more, the development and dissolution characteristics are good, and when it is 40 mgKOH / g or less, it is advantageous in terms of manufacturing and handling. In addition, the photopolymerization performance is good and the curability is excellent.

關於聚合性化合物,含有己內酯結構之化合物亦為較佳態様。 作為含有己內酯結構之化合物,只要在分子內含有己內酯結構,則並無特別限定,例如,可舉出藉由使三羥甲基乙烷、二三羥甲基乙烷、三羥甲基丙烷、二三羥甲基丙烷、季戊四醇、雙季戊四醇、三季戊四醇、甘油、雙甘油、三羥甲基三聚氰胺等多元醇與(甲基)丙烯酸及ε-己內酯進行酯化來獲得之、ε-己內酯改性多官能(甲基)丙烯酸酯。其中,具有以下述通式(Z-1)表示之己內酯結構之化合物為較佳。As for the polymerizable compound, a compound containing a caprolactone structure is also preferable. The compound containing a caprolactone structure is not particularly limited as long as it contains a caprolactone structure in the molecule, and examples thereof include trimethylolethane, ditrimethylolethane, and trihydroxymethyl. Polyols such as methylpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, tripentaerythritol, glycerol, diglycerin, and trimethylol melamine are obtained by esterification with (meth) acrylic acid and ε-caprolactone Ε-caprolactone modified polyfunctional (meth) acrylate. Among them, a compound having a caprolactone structure represented by the following general formula (Z-1) is preferable.

[化學式8] [Chemical Formula 8]

通式(Z-1)中,6個R全部為以下述通式(Z-2)表示之基團,或6個R中的1~5個為以下述通式(Z-2)表示之基團,剩餘為以下述通式(Z-3)表示之基團。In the general formula (Z-1), all 6 Rs are groups represented by the following general formula (Z-2), or 1 to 5 of the 6 Rs are represented by the following general formula (Z-2) The remainder is a group represented by the following general formula (Z-3).

[化學式9] [Chemical Formula 9]

通式(Z-2)中,R1 表示氫原子或甲基,m表示1或2的數,“*”表示係鍵結鍵。In the general formula (Z-2), R 1 represents a hydrogen atom or a methyl group, m represents a number of 1 or 2, and "*" represents a bonding bond.

[化學式10] [Chemical Formula 10]

通式(Z-3)中,R1 表示氫原子或甲基,“*”表示係鍵結鍵。In the general formula (Z-3), R 1 represents a hydrogen atom or a methyl group, and "*" represents a bonding bond.

含有己內酯結構之聚合性化合物例如由Nippon Kayaku CO., LTD.作為KAYARAD DPCA系列而市售,DPCA-20(上述式(Z-1)~(Z-3)中,m=1,以式(Z-2)表示之基團的數=2,R1 全部為氫原子之化合物)、DPCA-30(同式,m=1,以式(Z-2)表示之基團的數=3,R1 全部為氫原子之化合物)、DPCA-60(同式,m=1,以式(Z-2)表示之基團的數=6,R1 全部為氫原子之化合物)、DPCA-120(同式中,m=2,以式(Z-2)表示之基團的數=6,R1 全部為氫原子之化合物)等。A polymerizable compound containing a caprolactone structure is marketed, for example, by Nippon Kayaku CO., LTD. As the KAYARAD DPCA series. DPCA-20 (in the above formulas (Z-1) to (Z-3), m = 1, and The number of groups represented by formula (Z-2) = 2, compounds where R 1 is all a hydrogen atom), DPCA-30 (same formula, m = 1, the number of groups represented by formula (Z-2) = 3. Compounds in which R 1 is all a hydrogen atom), DPCA-60 (same formula, m = 1, the number of groups represented by formula (Z-2) = 6, compounds in which R 1 is all a hydrogen atom), DPCA -120 (a compound in which m = 2, the number of groups represented by the formula (Z-2) = 6, and all of R 1 is a hydrogen atom) and the like.

聚合性化合物還能夠使用以下述通式(Z-4)或(Z-5)表示之化合物。As the polymerizable compound, a compound represented by the following general formula (Z-4) or (Z-5) can be used.

[化學式11] [Chemical Formula 11]

通式(Z-4)及(Z-5)中,E分別獨立地表示-((CH2y CH2 O)-、或-((CH2y CH(CH3 )O)-,y分別獨立地表示0~10的整數,X分別獨立地表示(甲基)丙烯醯基、氫原子或羧酸基。 通式(Z-4)中,(甲基)丙烯醯基的總計為3個或4個,m分別獨立地表示0~10的整數,各m的總計為0~40的整數。 通式(Z-5)中,(甲基)丙烯醯基的總計為5個或6個,n分別獨立地表示0~10的整數,各n的總計為0~60的整數。In the general formulae (Z-4) and (Z-5), E each independently represents-((CH 2 ) y CH 2 O)-, or-((CH 2 ) y CH (CH 3 ) O)-, y each independently represents an integer of 0 to 10, and X each independently represents a (meth) acrylfluorenyl group, a hydrogen atom, or a carboxylic acid group. In the general formula (Z-4), the total number of (meth) acrylfluorenyl groups is three or four, m each independently represents an integer of 0 to 10, and the total of each m is an integer of 0 to 40. In the general formula (Z-5), the total number of (meth) acrylfluorenyl groups is five or six, n each independently represents an integer of 0-10, and the total of each n is an integer of 0-60.

通式(Z-4)中,m為0~6的整數為較佳,0~4的整數為更佳。 並且,各m的總計為2~40的整數為較佳,2~16的整數為更佳,4~8的整數為進一步較佳。 通式(Z-5)中,n為0~6的整數為較佳,0~4的整數為更佳。 並且,各n的總計為3~60的整數為較佳,3~24的整數為更佳,6~12的整數為進一步較佳。 並且,通式(Z-4)或通式(Z-5)中的-((CH2y CH2 O)-或-((CH2y CH(CH3 )O)-為氧原子側的末端與X鍵結之形態為較佳。In the general formula (Z-4), an integer of 0 to 6 is preferable, and an integer of 0 to 4 is more preferable. In addition, an integer of 2 to 40 in total for each m is preferable, an integer of 2 to 16 is more preferable, and an integer of 4 to 8 is even more preferable. In the general formula (Z-5), an integer of 0 to 6 is more preferable, and an integer of 0 to 4 is more preferable. In addition, an integer of 3 to 60 in total for each n is preferable, an integer of 3 to 24 is more preferable, and an integer of 6 to 12 is even more preferable. And-((CH 2 ) y CH 2 O)-or-((CH 2 ) y CH (CH 3 ) O)-in the general formula (Z-4) or (Z-5) is an oxygen atom The form of the side end and the X bond is more preferable.

以通式(Z-4)或通式(Z-5)表示之化合物可單獨使用1種,亦可倂用2種以上。尤其,通式(Z-5)中的6個X全部為丙烯醯基之形態、通式(Z-5)中的6個X全部為丙烯醯基之化合物與6個X中的至少1個為氫原子之化合物的混合物之態様為較佳。藉由設為該種結構,能夠更加提高顯影性。The compound represented by the general formula (Z-4) or the general formula (Z-5) may be used singly or in combination of two or more kinds. In particular, at least one of the six X's in the general formula (Z-5) is a propylene fluorenyl group, and the six X's in the general formula (Z-5) are all acryl fluorinyl groups. The state of a mixture of compounds which are hydrogen atoms is preferred. With such a structure, developability can be further improved.

並且,作為以通式(Z-4)或通式(Z-5)表示之化合物在聚合性化合物中的總含量,20質量%以上為較佳,50質量%以上為更佳。The total content of the compound represented by the general formula (Z-4) or the general formula (Z-5) in the polymerizable compound is preferably 20% by mass or more, and more preferably 50% by mass or more.

以通式(Z-4)或通式(Z-5)表示之化合物能夠藉由作為以往公知的製程之以下製程合成:藉由開環加成反應,使環氧乙烷或環氧丙烷與季戊四醇或雙季戊四醇鍵結開環骨架之製程;及例如使(甲基)丙烯醯氯與開環骨架的末端羥基反應來導入(甲基)丙烯醯基之製程。各製程係廣為人知之製程,本領域技術人員能夠輕鬆合成以通式(Z-4)或(Z-5)表示之化合物。The compound represented by the general formula (Z-4) or the general formula (Z-5) can be synthesized by the following process, which is a conventionally known process: by the ring-opening addition reaction, ethylene oxide or propylene oxide is reacted with A process of pentaerythritol or dipentaerythritol bonding to a ring-opening skeleton; and a process of introducing a (meth) acrylfluorenyl group by reacting (meth) acrylfluorene chloride with a terminal hydroxyl group of the ring-opening skeleton, for example. Each process is a well-known process, and those skilled in the art can easily synthesize a compound represented by the general formula (Z-4) or (Z-5).

以通式(Z-4)或通式(Z-5)表示之化合物中,季戊四醇衍生物和/或雙季戊四醇衍生物為更佳。 具體而言,可舉出以下述式(a)~(f)表示之化合物(以下,還稱作“例示化合物(a)~(f)”。),其中,例示化合物(a)、(b)、(e)、(f)為較佳。Among the compounds represented by the general formula (Z-4) or the general formula (Z-5), a pentaerythritol derivative and / or a dipentaerythritol derivative is more preferable. Specific examples include compounds represented by the following formulae (a) to (f) (hereinafter, also referred to as "exemplary compounds (a) to (f)"). Among them, exemplary compounds (a) and (b) ), (E), (f) are preferred.

[化學式12] [Chemical Formula 12]

[化學式13] [Chemical Formula 13]

作為以通式(Z-4)、(Z-5)表示之聚合性化合物的市售品,例如可舉出Sartomer company Inc.製造的含有4個氧化乙烯鏈之4官能丙烯酸酯亦即SR-494、Nippon Kayaku CO., LTD.製造的含有6個亞戊基氧(pentyleneoxy)鏈之6官能丙烯酸酯亦即DPCA-60、含有3個異丁烯氧鏈之3官能丙烯酸酯亦即TPA-330等。Examples of commercially available polymerizable compounds represented by the general formulae (Z-4) and (Z-5) include SR-, which is a four-functional acrylic ester containing four ethylene oxide chains manufactured by Sartomer company Inc. 494. DPCA-60, a 6-functional acrylate containing 6 pentyleneoxy chains, manufactured by Nippon Kayaku CO., LTD., And TPA-330, a 3-functional acrylate containing 3 isobutylene oxygen chains, etc. .

作為聚合性化合物,日本特公昭48-41708號公報、日本特開昭51-37193號公報、日本特公平2-32293號公報、日本特公平2-16765號公報中記載之胺基甲酸酯丙烯酸酯類;日本特公昭58-49860號公報、日本特公昭56-17654號公報、日本特公昭62-39417號公報及日本特公昭62-39418號公報中記載之含有環氧乙烷系骨架之胺基甲酸酯化合物類亦較佳。並且,還能夠藉由使用日本特開昭63-277653號公報、日本特開昭63-260909號公報及日本特開平1-105238號公報中記載之、在分子內含有胺基結構和/或硫醚結構之加成聚合性化合物類,獲得感光速度非常優異之組成物。 作為市售品,可舉出胺基甲酸酯低聚物UAS-10、UAB-140(Sanyo Kokusaku Pulp CO., LTD.製造)、UA-7200(Shin-Nakamura Chemical CO., LTD製造)、DPHA-40H(Nippon Kayaku CO., LTD.製造)、UA-306H、UA-306T、UA-306I、AH-600、T-600及AI-600(KYOEISHA CHEMICAL CO., LTD製造)等。As the polymerizable compound, urethane acrylic acid described in Japanese Patent Publication No. 48-41708, Japanese Patent Application Publication No. 51-37193, Japanese Patent Publication No. 2-32293, and Japanese Patent Publication No. 2-16765. Esters; amines containing ethylene oxide skeletons described in Japanese Patent Publication No. 58-49860, Japanese Patent Publication No. 56-17654, Japanese Patent Publication No. 62-39417, and Japanese Patent Publication No. 62-39418 Carbamate compounds are also preferred. In addition, it is also possible to use an amine structure and / or sulfur contained in the molecule by using those described in JP-A-63-277653, JP-A-63-260909, and JP-A-105238. Additive polymerizable compounds having an ether structure can obtain a composition having a very excellent photosensitivity. Examples of commercially available products include urethane oligomers UAS-10, UAB-140 (manufactured by Sanyo Kokusaku Pulp CO., LTD.), UA-7200 (manufactured by Shin-Nakamura Chemical CO., LTD), DPHA-40H (manufactured by Nippon Kayaku CO., LTD.), UA-306H, UA-306T, UA-306I, AH-600, T-600, and AI-600 (manufactured by KYOEISHA CHEMICAL CO., LTD), etc.

並且,聚合性化合物的SP(Solubility Parameter:溶解度參數)值為9.50以上為較佳,10.40以上為更佳,10.60以上為進一步較佳。 另外,本說明書中,關於SP值,除非另有指明,則藉由Hoy法求出(H.L. Hoy Journal of Painting,1970,Vol. 42,76-118)。並且,對於SP值,省略單位而示出,但其單位為cal1/2 cm-3/2In addition, the SP (Solubility Parameter) value of the polymerizable compound is preferably 9.50 or more, more preferably 10.40 or more, and even more preferably 10.60 or more. In this specification, the SP value is obtained by the Hoy method unless otherwise specified (HL Hoy Journal of Painting, 1970, Vol. 42, 76-118). In addition, the SP value is shown by omitting the unit, but the unit is cal 1/2 cm -3/2 .

並且,從改善顯影殘渣的觀點考慮,組成物包含含有卡多骨架之聚合性化合物亦較佳。 作為含有卡多骨架之聚合性化合物,具有9,9-二芳基芴骨架之聚合性化合物為較佳,以下述式(Q3)表示之化合物為更佳。From the viewpoint of improving the development residue, it is also preferable that the composition contains a polymerizable compound containing a Cardo skeleton. As the polymerizable compound containing a Cardo skeleton, a polymerizable compound having a 9,9-diarylfluorene skeleton is preferable, and a compound represented by the following formula (Q3) is more preferable.

通式(Q3) [化學式14] Formula (Q3) [Chemical Formula 14]

上述通式(Q3)中,Ar11 ~Ar14 分別獨立地表示含有以虛線包圍之苯環之芳基。X1 ~X4 分別獨立地表示含有聚合性基團之取代基,上述取代基中的碳原子可被雜原子取代。a及b分別獨立地表示1~5的整數,c及d分別獨立地表示0~4的整數。R1 ~R4 分別獨立地表示取代基,e、f、g及h分別獨立地表示0以上的整數,e、f、g及h的上限值分別為從Ar11 ~Ar14 能夠具有之取代基的數減去a、b、c或d之值。其中,Ar11 ~Ar14 分別獨立地為作為稠環之一而含有以虛線包圍之苯環之多環芳香族烴基時,X1 ~X4 及R1 ~R4 可分別獨立地取代為以虛線包圍之苯環,亦可取代為以虛線包圍之苯環以外的環。In the general formula (Q3), Ar 11 to Ar 14 each independently represent an aryl group containing a benzene ring surrounded by a dotted line. X 1 to X 4 each independently represent a polymerizable group-containing substituent, and the carbon atom in the substituent may be substituted with a hetero atom. a and b each independently represent an integer of 1 to 5, and c and d each independently represent an integer of 0 to 4. R 1 to R 4 each independently represent a substituent, e, f, g, and h each independently represent an integer of 0 or more, and the upper limits of e, f, g, and h are respectively from Ar 11 to Ar 14 The number of substituents minus the value of a, b, c or d. However, when Ar 11 to Ar 14 are each independently a polycyclic aromatic hydrocarbon group containing a benzene ring surrounded by a dotted line as one of the fused rings, X 1 to X 4 and R 1 to R 4 may be independently substituted with The benzene ring surrounded by a dotted line may be replaced by a ring other than the benzene ring surrounded by a dotted line.

上述通式(Q3)中,Ar11 ~Ar14 所表示之含有以虛線包圍之苯環之芳基為碳原子數6~14的芳基為較佳,碳原子數6~10的芳基(例如,苯基、萘基)為更佳,苯基(限於以虛線包圍之苯環)為進一步較佳。In the general formula (Q3), the aryl group containing a benzene ring surrounded by a dotted line represented by Ar 11 to Ar 14 is preferably an aryl group having 6 to 14 carbon atoms, and an aryl group having 6 to 10 carbon atoms ( For example, phenyl, naphthyl) is more preferred, and phenyl (limited to a benzene ring surrounded by a dotted line) is more preferred.

上述通式(Q3)中,X1 ~X4 分別獨立地表示含有聚合性基團之取代基,上述取代基中的碳原子可被雜原子取代。作為X1 ~X4 所表示之含有聚合性基團之取代基,並無特別限制,但含有聚合性基團之脂肪族基為較佳。 作為具有X1 ~X4 所表示之聚合性基團之脂肪族基,並無特別限制,但聚合性基團以外的碳原子數為1~12的伸烷基為較佳,碳原子數2~10的伸烷基為更佳,碳原子數2~5的伸烷基為進一步較佳。 並且,含有X1 ~X4 所表示之聚合性基團之脂肪族基中,上述脂肪族基被雜原子取代時,被-NR-(R為取代基)、氧原子、硫原子取代為較佳,上述脂肪族基中不相鄰之-CH2 -被氧原子或硫原子取代為更佳,上述脂肪族基中不相鄰之-CH2 -被氧原子取代為進一步較佳。含有X1 ~X4 所表示之聚合性基團之脂肪族基的1~2處被雜原子取代為較佳,被雜原子取代1處為更佳,與Ar11 ~Ar14 所表示之含有以虛線包圍之苯環之芳基相鄰之1處被雜原子取代為進一步較佳。 作為含有X1 ~X4 所表示之聚合性基團之脂肪族基中含有之聚合性基團,能夠進行自由基聚合或陽離子聚合之聚合性基團(以下,還分別稱作自由基聚合性基團及陽離子聚合性基團)為較佳。 作為自由基聚合性基團,能夠使用通常周知之自由基聚合性基團,作為較佳者,能夠舉出含有能夠進行自由基聚合之烯屬不飽和鍵之聚合性基團,具體而言,可舉出乙烯基、(甲基)丙烯醯氧基等。其中,(甲基)丙烯醯氧基為較佳,丙烯醯氧基為更佳。 作為陽離子聚合性基團,能夠使用通常周知之陽離子聚合性基團,具體而言,可舉出脂環式醚基、環狀縮醛基、環狀內酯基、環狀硫醚基、螺環原酸酯基、乙烯氧基等。其中,脂環式醚基、乙烯氧基為較佳,環氧基、氧雜環丁基、乙烯氧基尤為佳。 Ar1 ~Ar4 所含有之取代基所含有之上述聚合性基團為自由基聚合性基團為較佳。 Ar1 ~Ar4 中的2個以上包含含有聚合性基團之取代基,Ar1 ~Ar4 中的2~4個包含含有聚合性基團之取代基為較佳,Ar1 ~Ar4 中的2或3個包含含有聚合性基團之取代基為更佳,Ar1 ~Ar4 中的2個包含含有聚合性基團之取代基為進一步較佳。 Ar11 ~Ar14 分別獨立地為作為稠環之一含有以虛線包圍之苯環之多環芳香族烴基時,X1 ~X4 可分別獨立地取代為以虛線包圍之苯環,亦可取代為以虛線包圍之苯環以外的環。In the general formula (Q3), X 1 to X 4 each independently represent a substituent containing a polymerizable group, and a carbon atom in the substituent may be substituted with a hetero atom. The polymerizable group-containing substituent represented by X 1 to X 4 is not particularly limited, but a polymerizable group-containing aliphatic group is preferred. The aliphatic group having a polymerizable group represented by X 1 to X 4 is not particularly limited, but an alkylene group having 1 to 12 carbon atoms other than the polymerizable group is preferred, and the number of carbon atoms is 2 An alkylene group of -10 is more preferable, and an alkylene group of 2 to 5 carbons is more preferable. In the aliphatic group containing a polymerizable group represented by X 1 to X 4 , when the aliphatic group is substituted with a hetero atom, it is substituted with -NR- (R is a substituent), an oxygen atom, and a sulfur atom. Jia, the aliphatic group of non-adjacent -CH 2 - is substituted with an oxygen atom or a sulfur atom is more preferably the aliphatic group of non-adjacent -CH 2 - is substituted with an oxygen atom is further preferred. 1 to 2 positions of the aliphatic group containing the polymerizable group represented by X 1 to X 4 are preferably substituted with hetero atoms, more preferably 1 position is substituted with hetero atoms, and contained in the range represented by Ar 11 to Ar 14 It is further preferred that the aryl group of the benzene ring surrounded by a dashed line is substituted with a hetero atom next to it. As the polymerizable group contained in the aliphatic group containing the polymerizable group represented by X 1 to X 4 , a polymerizable group capable of radical polymerization or cationic polymerization (hereinafter, also referred to as a radical polymerizable property, respectively) And a cationic polymerizable group) are preferred. As the radically polymerizable group, a generally known radically polymerizable group can be used, and a preferable one includes a polymerizable group containing an ethylenically unsaturated bond capable of radical polymerization, and specifically, Examples include vinyl, (meth) acryloxy, and the like. Among them, (meth) acrylic fluorenyloxy is more preferable, and propylene fluorenyloxy is more preferable. As the cationically polymerizable group, generally known cationically polymerizable groups can be used, and specifically, an alicyclic ether group, a cyclic acetal group, a cyclic lactone group, a cyclic thioether group, and a spiro Cyclic orthoester, vinyloxy, etc. Among them, an alicyclic ether group and a vinyloxy group are preferable, and an epoxy group, an oxetanyl group, and a vinyloxy group are particularly preferable. The polymerizable group contained in the substituents contained in Ar 1 to Ar 4 is preferably a radical polymerizable group. Two or more of Ar 1 to Ar 4 include a polymerizable group-containing substituent, and two to four of Ar 1 to Ar 4 include a polymerizable group-containing substituent is preferred, and Ar 1 to Ar 4 It is more preferable that 2 or 3 of which contains a polymerizable group-containing substituent, and 2 of Ar 1 to Ar 4 contain a polymerizable group-containing substituent. When Ar 11 to Ar 14 are each independently a polycyclic aromatic hydrocarbon group containing a benzene ring surrounded by a dotted line as one of the fused rings, X 1 to X 4 may be independently replaced by a benzene ring surrounded by a dotted line, or may be substituted. It is a ring other than a benzene ring surrounded by a dotted line.

上述通式(Q3)中,a及b分別獨立地表示1~5的整數,1或2為較佳,a及b均為1為更佳。 上述通式(Q3)中,c及d分別獨立地表示0~5的整數,0或1為較佳,c及d均為0為更佳。In the above general formula (Q3), a and b each independently represent an integer of 1 to 5, 1 or 2 is more preferred, and a and b are both more preferably 1. In the above general formula (Q3), c and d each independently represent an integer of 0 to 5, 0 or 1 is more preferable, and both c and d are more preferably 0.

上述通式(Q3)中,R1 ~R4 分別獨立地表示取代基。作為R1 ~R4 所表示之取代基,並無特別限制,例如,可舉出鹵原子、鹵化烷基、烷基、烯基、醯基、羥基、羥基烷基、烷氧基、芳基、雜芳基、脂環基等。R1 ~R4 所表示之取代基為烷基、烷氧基或芳基為較佳,碳原子數1~5的烷基、碳原子數1~5的烷氧基或苯基為更佳,甲基、甲氧基或苯基為進一步較佳。 上述通式(Q3)中,Ar11 ~Ar14 分別獨立地為作為稠環之一含有以虛線包圍之苯環之多環芳香族烴基時,R1 ~R4 可分別獨立地取代為以虛線包圍之苯環,亦可取代為以虛線包圍之苯環以外的環。In the general formula (Q3), R 1 to R 4 each independently represent a substituent. The substituents represented by R 1 to R 4 are not particularly limited, and examples thereof include a halogen atom, a halogenated alkyl group, an alkyl group, an alkenyl group, a fluorenyl group, a hydroxyl group, a hydroxyalkyl group, an alkoxy group, and an aryl group. , Heteroaryl, alicyclic and the like. The substituent represented by R 1 to R 4 is preferably an alkyl group, an alkoxy group, or an aryl group, and an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or a phenyl group is more preferable. Of these, methyl, methoxy or phenyl is further preferred. In the general formula (Q3), when Ar 11 to Ar 14 are each independently a polycyclic aromatic hydrocarbon group containing a benzene ring surrounded by a dotted line as one of the fused rings, R 1 to R 4 may be independently substituted by dotted lines. The surrounding benzene ring may be replaced by a ring other than the benzene ring surrounded by a dotted line.

上述通式(Q3)中,e、f、g及h分別獨立地表示0以上的整數,e、f、g及h的上限值分別為從Ar11 ~Ar14 能夠具有之取代基的數減去a、b、c或d之值。 e、f、g及h分別獨立地0~8為較佳,0~2為更佳,0為進一步較佳。 Ar11 ~Ar14 分別獨立地為作為稠環之一含有以虛線包圍之苯環之多環芳香族烴基時,e、f、g及h為0或1為較佳,0為更佳。In the general formula (Q3), e, f, g, and h each independently represent an integer of 0 or more, and the upper limits of e, f, g, and h are the numbers of substituents that can be included from Ar 11 to Ar 14 respectively. Subtract the value of a, b, c, or d. e, f, g, and h are each independently 0 to 8 is preferable, 0 to 2 is more preferable, and 0 is further preferable. When Ar 11 to Ar 14 are each independently a polycyclic aromatic hydrocarbon group containing a benzene ring surrounded by a dotted line as one of the fused rings, e, f, g, and h are preferably 0 or 1, and 0 is more preferable.

作為以上述式(Q3)表示之化合物,例如,可舉出9,9‘-二[4-(2-丙烯醯氧基乙氧基)苯基]芴等。作為含有9,9-二芳基芴骨架之聚合性化合物,還能夠較佳地使用日本特開2010-254732號公報記載之化合物類。Examples of the compound represented by the formula (Q3) include 9,9'-di [4- (2-propenyloxyethoxy) phenyl] fluorene and the like. As the polymerizable compound containing a 9,9-diarylfluorene skeleton, the compounds described in Japanese Patent Application Laid-Open No. 2010-254732 can also be preferably used.

作為該種含有卡多骨架之聚合性化合物,並無限定,例如,可舉出Oncoat EX系列(NAGASE & CO., LTD製造)及Ogsol (Osaka Gas Chemicals Co., Ltd.製造)等。The polymerizable compound containing a Cardo skeleton is not limited, and examples thereof include Oncoat EX series (manufactured by NAGASE & CO., LTD) and Ogsol (manufactured by Osaka Gas Chemicals Co., Ltd.).

組成物含有聚合性化合物時,聚合性化合物的含量相對於組成物的總固體成分,0.1~40質量%為較佳。下限例如為0.5質量%以上為更佳,1質量%以上為進一步較佳。上限例如為30質量%以下為更佳,20質量%以下為進一步較佳。 聚合性化合物可以係單獨1種,亦可倂用2種以上。倂用2種以上時,總計量成為上述範圍為較佳。When the composition contains a polymerizable compound, the content of the polymerizable compound is preferably 0.1 to 40% by mass based on the total solid content of the composition. The lower limit is more preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is, for example, preferably 30% by mass or less, and more preferably 20% by mass or less. The polymerizable compound may be used alone or in combination of two or more. When two or more kinds are used, it is preferable that the total measurement falls within the above range.

〔聚合起始劑〕 上述組成物含有聚合起始劑為較佳。 作為聚合起始劑,並無特別限制,能夠從公知的聚合起始劑中適當選擇,例如,具有感光性者(所謂的光聚合起始劑)為較佳。 上述組成物除了含金屬氮化物的粒子以外,還含有光聚合起始劑及上述聚合性化合物時,藉由活性光線或放射線的照射而硬化,故有時被稱作“感光性組成物”。 作為光聚合起始劑,只要具有引發聚合性化合物的聚合之能力,則並無特別限制,能夠從公知的光聚合起始劑中適當選擇。例如,對從紫外線區域至可見光線具有感光性者為較佳。並且,聚合起始劑可以係與被光激發之光敏劑產生某些作用,並生成活性自由基之活性劑,亦可以係依據聚合性化合物的種類而引發陽離子聚合之起始劑。 並且,光聚合起始劑含有至少1種於約300nm~800nm(330nm~500nm為更佳。)的範圍內具有至少約50莫耳吸光系數之化合物為較佳。[Polymerization Initiator] The composition preferably contains a polymerization initiator. The polymerization initiator is not particularly limited, and can be appropriately selected from known polymerization initiators. For example, those having a photosensitivity (so-called photopolymerization initiator) are preferred. When the composition contains a photopolymerization initiator and the polymerizable compound in addition to the metal nitride-containing particles, the composition is sometimes called a "photosensitive composition" because it is hardened by irradiation with active light or radiation. The photopolymerization initiator is not particularly limited as long as it has the ability to initiate polymerization of a polymerizable compound, and can be appropriately selected from known photopolymerization initiators. For example, it is preferable to have sensitivity from the ultraviolet region to visible light. In addition, the polymerization initiator may be an active agent that generates some action with a photoexcited photosensitizer and generates an active radical, or may be an initiator that initiates cationic polymerization depending on the type of the polymerizable compound. In addition, the photopolymerization initiator preferably contains at least one compound having a light absorption coefficient of at least about 50 moles in a range of about 300 nm to 800 nm (more preferably 330 nm to 500 nm.).

作為光聚合起始劑,例如,可舉出鹵化烴衍生物(例如,含有三嗪骨架者、含有噁二唑骨架者等)、醯基氧化膦等醯基膦化合物、六芳基雙咪唑、肟衍生物等肟化合物、有機過氧化物、硫代化合物、酮化合物、芳香族鎓鹽、酮肟醚、胺基苯乙酮化合物、羥基苯乙酮等。 作為上述含有三嗪骨架之鹵代烴化合物,例如,可舉出若林等著、Bull.Chem.Soc.Japan,42、2924(1969)記載之化合物、英國專利1388492號說明書記載之化合物、日本特開昭53-133428號公報記載之化合物、德國專利3337024號說明書記載之化合物、基於F.C.Schaefer等之J.Org.Chem.;29、1527(1964)記載之化合物、日本特開昭62-58241號公報記載之化合物、日本特開平5-281728號公報記載之化合物、日本特開平5-34920號公報記載之化合物、美國專利第4212976號說明書中記載之化合物等。Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (for example, those containing a triazine skeleton and those containing an oxadiazole skeleton), fluorenylphosphine compounds such as fluorenylphosphine oxide, hexaarylbisimidazole, Oxime compounds such as oxime derivatives, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, ketoxime ethers, aminoacetophenone compounds, hydroxyacetophenone, and the like. Examples of the triazine skeleton-containing halogenated hydrocarbon compound include Wooling et al., A compound described in Bull. Chem. Soc. Japan, 42, 2924 (1969), a compound described in British Patent No. 1384492, and Japanese special Compounds described in Japanese Patent Publication No. 53-133428, compounds described in German Patent No. 3337024, compounds based on J. Org. Chem. Of FC Schaefer, etc .; compounds described in 29, 1527 (1964), Japanese Patent Application Laid-Open No. 62-58241 Compounds described in the gazette, compounds described in JP-A-5-281728, compounds described in JP-A-5-34920, compounds described in the specification of US Patent No. 4212976, and the like.

並且,從曝光靈敏度的觀點考慮,選自由三鹵甲基三嗪化合物、苄基二甲基縮酮化合物、α-羥基酮化合物、α-胺基酮化合物、醯基膦化合物、氧化膦化合物、茂金屬化合物、肟化合物、三芳基咪唑二聚體、鎓類化合物、苯并噻唑化合物、二苯甲酮化合物、苯乙酮化合物及其衍生物、環戊二烯-苯-鐵絡合物及其鹽、鹵代甲基噁二唑化合物以及3-芳基取代香豆素化合物所組成的群組中的化合物為較佳。From the viewpoint of exposure sensitivity, it is selected from the group consisting of a trihalomethyltriazine compound, a benzyldimethylketal compound, an α-hydroxyketone compound, an α-aminoketone compound, a fluorenylphosphine compound, a phosphine oxide compound, Metallocene compounds, oxime compounds, triarylimidazole dimers, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds and their derivatives, cyclopentadiene-benzene-iron complexes, and The compound in the group consisting of a salt, a halomethyloxadiazole compound, and a 3-aryl substituted coumarin compound is preferable.

三鹵甲基三嗪化合物、α-胺基酮化合物、醯基膦化合物、氧化膦化合物、肟化合物、三芳基咪唑二聚體、鎓類化合物、二苯甲酮化合物或苯乙酮化合物為進一步較佳,選自由三鹵甲基三嗪化合物、α-胺基酮化合物、肟化合物、三芳基咪唑二聚體及二苯甲酮化合物所組成的群組中的至少1種化合物尤為佳。Trihalomethyltriazine compounds, α-aminoketone compounds, fluorenylphosphine compounds, phosphine oxide compounds, oxime compounds, triarylimidazole dimers, onium compounds, benzophenone compounds or acetophenone compounds are further Preferably, at least one compound selected from the group consisting of a trihalomethyltriazine compound, an α-aminoketone compound, an oxime compound, a triarylimidazole dimer, and a benzophenone compound is particularly preferred.

尤其,使用上述組成物製作遮光膜時,需要以銳利的形狀形成微細的圖案,故與硬化性一同在未曝光部無殘渣地進行顯影較為重要。從該種觀點考慮,使用肟化合物作為光聚合起始劑尤為佳。尤其,形成微細的圖案時,硬化用曝光中利用步進曝光,但該曝光機有時會被鹵素損傷,還需要將光聚合起始劑的添加量抑制得較低。故,若考慮該些方面,則形成微細圖案時,作為光聚合起始劑,使用肟化合物尤為佳。 作為光聚合起始劑的具體例,例如,能夠參閱日本特開2013-29760號公報的段落0265~0268,該內容引入本申請說明書中。In particular, when a light-shielding film is produced using the above-mentioned composition, it is necessary to form a fine pattern in a sharp shape, and it is therefore important to develop it in the unexposed portion without residue with the hardenability. From such a viewpoint, it is particularly preferable to use an oxime compound as a photopolymerization initiator. In particular, when a fine pattern is formed, step exposure is used for the exposure for hardening. However, the exposure machine may be damaged by halogen, and it is necessary to suppress the addition amount of the photopolymerization initiator to be low. Therefore, when considering these points, it is particularly preferable to use an oxime compound as a photopolymerization initiator when forming a fine pattern. As a specific example of the photopolymerization initiator, for example, paragraphs 0265 to 0268 of Japanese Patent Application Laid-Open No. 2013-29760 can be referred to, and this content is incorporated into the specification of the present application.

作為光聚合起始劑,亦可適當地使用羥基苯乙酮化合物、胺基苯乙酮化合物及醯基膦化合物。更具體而言,例如,還能夠使用日本特開平10-291969號公報中記載之胺基苯乙酮系起始劑及日本專利第4225898號公報中記載之醯基膦系起始劑。 作為羥基苯乙酮系起始劑,能夠使用IRGACURE-184、DAROCUR-1173、IRGACURE-500、IRGACURE-2959、IRGACURE-127(商品名:均為BASF公司製造)。 作為胺基苯乙酮系起始劑,能夠使用作為市售品之IRGACURE-907、IRGACURE-369或IRGACURE-379EG(商品名:均為BASF公司製造)。胺基苯乙酮系起始劑還能夠使用吸收波長與365nm或405nm等長波光源匹配之日本特開2009-191179號公報中記載之化合物。 作為醯基膦系起始劑,能夠使用作為市售品之IRGACURE-819或DAROCUR-TPO(商品名:均為BASF公司製造)。As a photopolymerization initiator, a hydroxyacetophenone compound, an aminoacetophenone compound, and a fluorenylphosphine compound can also be used suitably. More specifically, for example, an aminoacetophenone-based initiator described in Japanese Patent Application Laid-Open No. 10-291969 and a fluorenylphosphine-based initiator described in Japanese Patent No. 4225898 can also be used. As the hydroxyacetophenone-based initiator, IRGACURE-184, DAROCUR-1173, IRGACURE-500, IRGACURE-2959, and IRGACURE-127 (trade names: all manufactured by BASF Corporation) can be used. As the aminoacetophenone-based initiator, commercially available IRGACURE-907, IRGACURE-369, or IRGACURE-379EG (trade names: all manufactured by BASF Corporation) can be used. As the aminoacetophenone-based initiator, a compound described in Japanese Patent Application Laid-Open No. 2009-191179 can be used in which the absorption wavelength matches a long-wave light source such as 365 nm or 405 nm. As a fluorenylphosphine-based initiator, IRGACURE-819 or DAROCUR-TPO (trade name: both manufactured by BASF) can be used as commercially available products.

(肟化合物) 作為光聚合起始劑,可更佳地舉出肟化合物(肟系起始劑)。尤其,肟化合物為高靈敏度且聚合效率較高,能夠與色材濃度無關地進行硬化,易將色材的濃度設計為較高,故較佳。 作為肟化合物的具體例,可使用日本特開2001-233842號公報記載之化合物、日本特開2000-80068號公報記載之化合物或日本特開2006-342166號公報記載之化合物。 在本發明中作為能夠較佳地使用之肟化合物,例如,可舉出3-苯甲醯氧基亞胺基丁烷-2-酮、3-乙醯氧基亞胺基丁烷-2-酮、3-丙醯氧基亞胺基丁烷-2-酮、2-乙醯氧基亞胺基戊烷-3-酮、2-乙醯氧基亞胺基-1-苯基丙烷-1-酮、2-苯甲醯氧基亞胺基-1-苯基丙烷-1-酮、3-(4-甲苯磺醯氧基)亞胺基丁烷-2-酮及2-乙氧基羰氧基亞胺基-1-苯基丙烷-1-酮等。 並且,還可舉出J.C.S.Perkin II(1979年)pp.1653-1660)、J.C.S.Perkin II(1979年)pp.156-162、Journal of Photopolymer Science and Technology(1995年)pp.202-232、日本特開2000-66385號公報記載之化合物、日本特開2000-80068號公報、特表2004-534797號公報及日本特開2006-342166號公報的各公報中記載之化合物等。 市售品中,亦可較佳地使用IRGACURE-OXE01(BASF公司製造)、IRGACURE-OXE02(BASF公司製造)、IRGACURE-OXE03(BASF公司製造)或IRGACURE-OXE04(BASF公司製造)。並且,還能夠使用TR-PBG-304(常州強力電子新材料有限公司製造)、Adeka Arkls NCI-831及Adeka Arkls NCI-930(ADEKA CORPORATION製造)或N-1919(含咔唑·肟酯骨架光起始劑(ADEKA CORPORATION製造)。(Oxime compound) As a photopolymerization initiator, an oxime compound (oxime type initiator) is mentioned more suitably. In particular, the oxime compound has high sensitivity and high polymerization efficiency, and can be hardened irrespective of the color material concentration, and it is easy to design the color material concentration to be high, so it is preferable. As specific examples of the oxime compound, a compound described in JP 2001-233842, a compound described in JP 2000-80068, or a compound described in JP 2006-342166 can be used. As the oxime compound that can be preferably used in the present invention, for example, 3-benzyloxyiminobutane-2-one and 3-ethoxyiminobutane-2-one can be mentioned. Ketone, 3-propionyloxyiminobutane-2-one, 2-acetoxyiminopentane-3-one, 2-acetoxyimino-1-phenylpropane- 1-keto, 2-benzyloxyimino-1-phenylpropane-1-one, 3- (4-toluenesulfonyloxy) iminobutane-2-one, and 2-ethoxy Carbonyloxyimino-1-phenylpropane-1-one and the like. In addition, JCSPerkin II (1979) pp.1653-1660), JCSPerkin II (1979) pp.156-162, Journal of Photopolymer Science and Technology (1995) pp.202-232, Japan Compounds described in JP-A-2000-66385, JP-A-2000-80068, JP-A-2004-534797, and JP-A-2006-342166. Among commercially available products, IRGACURE-OXE01 (made by BASF), IRGACURE-OXE02 (made by BASF), IRGACURE-OXE03 (made by BASF), or IRGACURE-OXE04 (made by BASF) can be preferably used. In addition, TR-PBG-304 (manufactured by Changzhou Power Electronics New Materials Co., Ltd.), Adeka Arkls NCI-831 and Adeka Arkls NCI-930 (manufactured by ADEKA CORPORATION) or N-1919 (containing carbazole · oxime ester skeleton light) Starter (manufactured by ADEKA CORPORATION).

並且,作為上述記載以外的肟化合物,可使用:在咔唑N位連結有肟之日本特表2009-519904號公報中記載之化合物;在二苯基酮部位導入有雜取代基之美國專利第7626957號公報中記載之化合物;在色素部位導入有硝基之日本特開2010-15025號公報及美國專利公開2009-292039號公報中記載之化合物;國際公開專利2009-131189號公報中記載之酮肟化合物;在同一分子內含有三嗪骨架與肟骨架之美國專利7556910號公報中記載之化合物;在405nm具有極大吸收且對g射線光源具有良好的靈敏度之日本特開2009-221114號公報中記載之化合物;等。 例如可較佳地參閱日本特開2013-29760號公報的段落0274~0275,該內容引入本申請說明書中。 具體而言,作為肟化合物,以下述式(OX-1)表示之化合物為較佳。另外,肟的N-O鍵可以係(E)體的肟化合物,亦可以係(Z)體的肟化合物,還可以係(E)體與(Z)體的混合物。In addition, as the oxime compound other than the above, the compound described in Japanese Patent Publication No. 2009-519904 in which an oxime is linked to the N-position of carbazole; and US Patent No. Compounds described in Gazette No. 7626957; compounds described in Japanese Patent Application Laid-Open No. 2010-15025 and U.S. Patent Publication No. 2009-292039 in which a nitro group is introduced into a pigment part; ketones described in International Publication No. 2009-131189 An oxime compound; a compound described in U.S. Patent No. 7,565,910 containing a triazine skeleton and an oxime skeleton in the same molecule; and Japanese Unexamined Patent Publication No. 2009-221114, which has a maximum absorption at 405 nm and a good sensitivity to a g-ray light source Of compounds; etc. For example, paragraphs 0274 to 0275 of Japanese Patent Application Laid-Open No. 2013-29760 can be referred to preferably, and the contents are incorporated into the specification of the present application. Specifically, as the oxime compound, a compound represented by the following formula (OX-1) is preferred. The N-O bond of the oxime may be the oxime compound of the (E) form, the oxime compound of the (Z) form, or a mixture of the (E) form and the (Z) form.

[化學式15] [Chemical Formula 15]

通式(OX-1)中,R及B分別獨立地表示一價的取代基,A表示二價的有機基團,Ar表示芳基。 作為通式(OX-1)中以R表示之一價的取代基,一價的非金屬原子團為較佳。 作為一價的非金屬原子團,可舉出烷基、芳基、醯基、烷氧羰基、芳氧羰基、雜環基、烷基硫代羰基及芳基硫代羰基等。並且,該些基團可具有1個以上的取代基。並且,前述取代基可進一步被其他取代基取代。 作為取代基,可舉出鹵原子、芳氧基、烷氧羰基或芳氧羰基、醯氧基、醯基、烷基及芳基等。 作為通式(OX-1)中以B表示之一價的取代基,芳基、雜環基、芳基羰基或雜環羰基為較佳。該些基團可具有1個以上的取代基。作為取代基,可例示前述取代基。 作為通式(OX-1)中以A表示之二價的有機基團,碳原子數1~12的伸烷基、伸環烷基或伸炔基為較佳。該些基團可具有1個以上的取代基。作為取代基,可例示前述取代基。In the general formula (OX-1), R and B each independently represent a monovalent substituent, A represents a divalent organic group, and Ar represents an aryl group. As the monovalent substituent represented by R in the general formula (OX-1), a monovalent non-metal atomic group is preferred. Examples of the monovalent nonmetal atomic group include an alkyl group, an aryl group, a fluorenyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a heterocyclic group, an alkylthiocarbonyl group, and an arylthiocarbonyl group. These groups may have one or more substituents. The substituent may be further substituted with another substituent. Examples of the substituent include a halogen atom, an aryloxy group, an alkoxycarbonyl group or an aryloxycarbonyl group, a fluorenyloxy group, a fluorenyl group, an alkyl group, and an aryl group. As the monovalent substituent represented by B in the general formula (OX-1), an aryl group, a heterocyclic group, an arylcarbonyl group or a heterocyclic carbonyl group is preferred. These groups may have one or more substituents. Examples of the substituent include the aforementioned substituents. As the divalent organic group represented by A in the general formula (OX-1), an alkylene group, a cycloalkylene group, or an alkynyl group having 1 to 12 carbon atoms is preferred. These groups may have one or more substituents. Examples of the substituent include the aforementioned substituents.

作為光聚合起始劑,還能夠使用含有氟原子之肟化合物。作為含有氟原子之肟化合物的具體例,可舉出:日本特開2010-262028號公報中記載之化合物;日本特表2014-500852號公報中記載之化合物24、36~40;日本特開2013-164471號公報中記載之化合物(C-3);等。該內容引入本說明書中。As the photopolymerization initiator, a fluorine atom-containing oxime compound can also be used. Specific examples of the fluorine atom-containing oxime compound include compounds described in Japanese Patent Application Laid-Open No. 2010-262028; compounds 24, 36-40 of Japanese Patent Application No. 2014-500852; Japanese Patent Laid-Open No. 2013 Compound (C-3) described in Gazette-164471; etc. This content is incorporated into this specification.

作為光聚合起始劑,還能夠使用以下述通式(1)~(4)表示之化合物。As the photopolymerization initiator, compounds represented by the following general formulae (1) to (4) can also be used.

[化學式16] [Chemical Formula 16]

[化學式17] [Chemical Formula 17]

式(1)中,R1 及R2 分別獨立地表示碳原子數1~20的烷基、碳原子數4~20的脂環式烴基、碳原子數6~30的芳基或碳原子數7~30的芳烷基,R1 及R2 為苯基時,苯基彼此可鍵結而形成茀基,R3 及R4 分別獨立地表示氫原子、碳原子數1~20的烷基、碳原子數6~30的芳基、碳原子數7~30的芳烷基或碳原子數4~20的雜環基,X表示直接鍵結或羰基。In formula (1), R 1 and R 2 each independently represent an alkyl group having 1 to 20 carbon atoms, an alicyclic hydrocarbon group having 4 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a carbon number An aralkyl group of 7 to 30. When R 1 and R 2 are phenyl groups, the phenyl groups can be bonded to each other to form a fluorenyl group. R 3 and R 4 each independently represent a hydrogen atom and an alkyl group having 1 to 20 carbon atoms. An aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or a heterocyclic group having 4 to 20 carbon atoms, and X represents a direct bond or a carbonyl group.

式(2)中,R1 、R2 、R3 及R4 的含義與式(1)中的R1 、R2 、R3 及R4 相同,R5 表示-R6 、-OR6 、-SR6 、-COR6 、-CONR6 R6 、-NR6 COR6 、-OCOR6 、-COOR6 、-SCOR6 、-OCSR6 、-COSR6 、-CSOR6 、-CN、鹵原子或羥基,R6 表示碳原子數1~20的烷基、碳原子數6~30的芳基、碳原子數7~30的芳烷基或碳原子數4~20的雜環基,X表示直接鍵結或羰基,a表示0~4的整數。 (2), R 1, R 2, 1 , R 2, R 3 and the same formula the meanings of R 4 in the formula R (1) in R 3 and R 4, R 5 represents -R 6, -OR 6, -SR 6 , -COR 6 , -CONR 6 R 6 , -NR 6 COR 6 , -OCOR 6 , -COOR 6 , -SCOR 6 , -OCSR 6 , -COSR 6 , -CSOR 6 , -CN, halogen atom or Hydroxyl group, R 6 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or a heterocyclic group having 4 to 20 carbon atoms, and X represents direct Bonded or carbonyl, a represents an integer of 0 to 4.

式(3)中,R1 表示碳原子數1~20的烷基、碳原子數4~20的脂環式烴基、碳原子數6~30的芳基或碳原子數7~30的芳烷基,R3 及R4 分別獨立地表示氫原子、碳原子數1~20的烷基、碳原子數6~30的芳基、碳原子數7~30的芳烷基或碳原子數4~20的雜環基,X表示直接鍵結或羰基。In formula (3), R 1 represents an alkyl group having 1 to 20 carbon atoms, an alicyclic hydrocarbon group having 4 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arane having 7 to 30 carbon atoms. R 3 and R 4 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a carbon number of 4 to A heterocyclic group of 20, X represents a direct bond or a carbonyl group.

式(4)中,R1 、R3 及R4 的含義與式(3)中的R1 、R3 及R4 相同,R5 表示-R6 、-OR6 、-SR6 、-COR6 、-CONR6 R6 、-NR6 COR6 、-OCOR6 、-COOR6 、-SCOR6 、-OCSR6 、-COSR6 、-CSOR6 、-CN、鹵原子或羥基,R6 表示碳原子數1~20的烷基、碳原子數6~30的芳基、碳原子數7~30的芳烷基或碳原子數4~20的雜環基,X表示直接鍵結或羰基,a表示0~4的整數。Formula (4), R 1, R 3 and R 4 defined for the formula (3) in R 1, the same as R 3 and R 4, R 5 represents -R 6, -OR 6, -SR 6 , -COR 6 , -CONR 6 R 6 , -NR 6 COR 6 , -OCOR 6 , -COOR 6 , -SCOR 6 , -OCSR 6 , -COSR 6 , -CSOR 6 , -CN, halogen atom or hydroxyl group, R 6 represents carbon Alkyl group having 1 to 20 carbon atoms, aryl group having 6 to 30 carbon atoms, aralkyl group having 7 to 30 carbon atoms or heterocyclic group having 4 to 20 carbon atoms, X represents direct bonding or carbonyl group, a Represents an integer from 0 to 4.

上述式(1)及式(2)中,R1 及R2 分別獨立地為甲基、乙基、正丙基、異丙基、環己基或苯基為較佳。R3 為甲基、乙基、苯基、甲苯基或二甲苯基為較佳。R4 為碳原子數1~6的烷基或苯基為較佳。R5 為甲基、乙基、苯基、甲苯基或萘基為較佳。X為直接鍵結為較佳。 並且,上述式(3)及(4)中,R1 分別獨立地為甲基、乙基、正丙基、異丙基、環己基或苯基為較佳。R3 為甲基、乙基、苯基、甲苯基或二甲苯基為較佳。R4 為碳原子數1~6的烷基或苯基為較佳。R5 為甲基、乙基、苯基、甲苯基或萘基為較佳。X為直接鍵結為較佳。 作為以式(1)及式(2)表示之化合物的具體例,例如,可舉出日本特開2014-137466號公報的段落號0076~0079中記載之化合物。該內容引入本說明書中。In the above formula (1) and formula (2), it is preferable that R 1 and R 2 are each independently methyl, ethyl, n-propyl, isopropyl, cyclohexyl or phenyl. R 3 is preferably methyl, ethyl, phenyl, tolyl or xylyl. R 4 is preferably an alkyl group or a phenyl group having 1 to 6 carbon atoms. R 5 is preferably methyl, ethyl, phenyl, tolyl or naphthyl. X is preferably directly bonded. Further, in the formulae (3) and (4), it is preferable that R 1 is independently methyl, ethyl, n-propyl, isopropyl, cyclohexyl, or phenyl. R 3 is preferably methyl, ethyl, phenyl, tolyl or xylyl. R 4 is preferably an alkyl group or a phenyl group having 1 to 6 carbon atoms. R 5 is preferably methyl, ethyl, phenyl, tolyl or naphthyl. X is preferably directly bonded. Specific examples of the compounds represented by the formulas (1) and (2) include, for example, compounds described in paragraphs 0076 to 079 of Japanese Patent Application Laid-Open No. 2014-137466. This content is incorporated into this specification.

以下示出可在上述組成物中較佳地使用之肟化合物的具體例。Specific examples of the oxime compound that can be preferably used in the composition are shown below.

[化學式18] [Chemical Formula 18]

肟化合物係在350nm~500nm的波長區域具有極大吸收波長者為較佳,在360nm~480nm的波長區域具有極大吸收波長者為更佳,365nm及405nm的吸光度較高者為進一步較佳。 肟化合物中,關於365nm或405nm中的莫耳吸光系數,從靈敏度的觀點考慮,1,000~300,000為較佳,2,000~300,000為更佳,5,000~200,000為進一步較佳。 化合物的莫耳吸光系數能夠利用公知的方法,例如,藉由紫外可見分光光度計(Varian公司製造Cary-5 spctrophotometer),利用乙酸乙酯溶劑,以0.01g/L的濃度進行測定為較佳。 光聚合起始劑可依據需要組合2種以上來使用。The oxime compounds are more preferably those having a maximum absorption wavelength in a wavelength region of 350 nm to 500 nm, more preferably those having a maximum absorption wavelength in a wavelength region of 360 nm to 480 nm, and those having higher absorbances at 365 nm and 405 nm are more preferred. Among the oxime compounds, the Mohr absorption coefficient at 365 nm or 405 nm is more preferably 1,000 to 300,000, more preferably 2,000 to 300,000, and even more preferably 5,000 to 200,000 from the viewpoint of sensitivity. The Molar absorption coefficient of the compound can be measured by a known method, for example, using a UV-visible spectrophotometer (Cary-5 spctrophotometer manufactured by Varian Corporation) and an ethyl acetate solvent at a concentration of 0.01 g / L. A photopolymerization initiator can be used in combination of 2 or more types as needed.

上述組成物含有聚合起始劑時,聚合起始劑的含量相對於組成物中的總固體成分,0.1~30質量%為較佳,1~25質量%為更佳,1~10質量%為進一步較佳。上述組成物可僅包含1種聚合起始劑,亦可含有2種以上。包含2種以上時,其總計量成為上述範圍為較佳。When the composition contains a polymerization initiator, the content of the polymerization initiator relative to the total solid content in the composition is preferably 0.1 to 30% by mass, more preferably 1 to 25% by mass, and 1 to 10% by mass. Further preferred. The said composition may contain only 1 type of polymerization initiator, and may contain 2 or more types. When two or more kinds are included, it is preferable that the total measurement falls within the above range.

〔其他任意成分〕 上述組成物可還含有以下的任意成分。[Other optional components] The composition may further contain the following optional components.

<界面活性劑> 關於上述組成物,從更加提高塗佈性之觀點考慮,可含有各種界面活性劑。作為界面活性劑,能夠使用氟系界面活性劑、非離子系界面活性劑、陽離子系界面活性劑、陰離子系界面活性劑及矽酮系界面活性劑等各種界面活性劑。<Surfactant> The composition may contain various surfactants from the viewpoint of further improving the coatability. As the surfactant, various surfactants such as a fluorine-based surfactant, a non-ionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant can be used.

藉由使上述組成物中含有氟系界面活性劑,製備成塗佈液時的液體特性(尤其,流動性)更加提高,能夠更加改善塗佈厚度的均勻性和省液性。亦即,利用適用含有氟系界面活性劑之組成物之塗佈液來形成膜時,被塗佈面與塗佈液之間的界面張力下降,向被塗佈面的潤濕性得到改善,向被塗佈面的塗佈性得到提高。故,能夠更佳地形成厚度不均較小之均勻厚度的膜。By containing a fluorine-based surfactant in the composition, the liquid characteristics (especially, fluidity) when the coating liquid is prepared can be further improved, and the uniformity of coating thickness and the liquid saving property can be further improved. That is, when a film is formed by using a coating liquid containing a composition containing a fluorine-based surfactant, the interfacial tension between the coated surface and the coating liquid decreases, and the wettability to the coated surface is improved. The applicability to the surface to be coated is improved. Therefore, it is possible to form a film having a uniform thickness with less variation in thickness.

氟系界面活性劑中的氟含有率為3~40質量%為較佳,5~30質量%為更佳,7~25質量%為進一步較佳。氟含有率在該範圍內之氟系界面活性劑在塗佈膜的厚度的均勻性和省液性方面有效,組成物中的溶解性亦良好。The fluorine content in the fluorine-based surfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and even more preferably 7 to 25% by mass. A fluorine-based surfactant having a fluorine content within this range is effective in terms of the uniformity of the thickness of the coating film and the liquid saving property, and the solubility in the composition is also good.

作為氟系界面活性劑,例如,可舉出Megafac F171、Megafac F172、Megafac F173、Megafac F176、Megafac F177、Megafac F141、Megafac F142、Megafac F143、Megafac F144、Megafac R30、Megafac F437、Megafac F475、Megafac F479、Megafac F482、Megafac F554、Megafac F780、RS-72-K(以上,DIC CORPORATION製造)、Fluorado FC430、Fluorado FC431、Fluorado FC171(以上,3M Japan Limited製造)、Surflon S-382、Surflon SC-101、Surflon SC-103、Surflon SC-104、Surflon SC-105、Surflon SC-1068、Surflon SC-381、Surflon SC-383、Surflon S-393、Surflon KH-40(以上,ASAHI GLASS CO., LTD.製造)、PF636、PF656、PF6320、PF6520、PF7002(OMNOVA SOLUTIONS INC.製造)等。氟系界面活性劑還能夠使用日本特開2015-117327號公報的段落0015~0158中記載之化合物。作為氟系界面活性劑,還能夠使用嵌段聚合物,作為具體例,例如,可舉出日本特開2011-89090號公報中記載之化合物。 氟系界面活性劑還能夠較佳地使用如下含氟高分子化合物,其含有源自含有氟原子之(甲基)丙烯酸酯化合物之重複單元及源自含有2個以上(5個以上為較佳)伸烷氧基(乙烯氧基、丙烯氧基為較佳)之(甲基)丙烯酸酯化合物之重複單元,下述化合物亦作為可在本發明中使用之氟系界面活性劑來例示。Examples of the fluorine-based surfactants include Megafac F171, Megafac F172, Megafac F173, Megafac F176, Megafac F177, Megafac F141, Megafac F142, Megafac F143, Megafac F144, Megafac F475479, Megafac F475, Megafac F475479 , Megafac F482, Megafac F554, Megafac F780, RS-72-K (above, manufactured by DIC Corporation), Fluorado FC430, Fluorado FC431, Fluorado FC171 (above, manufactured by 3M Japan Limited), Surflon S-382, Surflon SC-101, Surflon SC-103, Surflon SC-104, Surflon SC-105, Surflon SC-1068, Surflon SC-381, Surflon SC-383, Surflon S-393, Surflon KH-40 (above, manufactured by ASAHI GLASS CO., LTD. ), PF636, PF656, PF6320, PF6520, PF7002 (manufactured by OMNOVA SOLUTIONS INC.), Etc. As the fluorine-based surfactant, a compound described in paragraphs 0015 to 0158 of JP-A-2015-117327 can also be used. As the fluorine-based surfactant, a block polymer can also be used. As a specific example, for example, a compound described in Japanese Patent Application Laid-Open No. 2011-89090 can be mentioned. As the fluorine-based surfactant, a fluorine-containing polymer compound containing a repeating unit derived from a (meth) acrylate compound containing a fluorine atom and a source containing 2 or more (5 or more is preferable) can also be preferably used. ) Repeating units of (meth) acrylate compounds of alkoxy groups (ethyleneoxy group and propyleneoxy group are preferred). The following compounds are also exemplified as fluorine-based surfactants that can be used in the present invention.

[化學式19] [Chemical Formula 19]

上述化合物的重量平均分子量為3,000~50,000為較佳,例如為14,000。 並且,還能夠將在側鏈含有烯屬不飽和基之含氟聚合物用作氟系界面活性劑。作為具體例,可舉出日本特開2010-164965號公報0050~0090段落及0289~0295段落中記載之化合物,例如DIC CORPORATION製造的Megafac RS-101、RS-102、RS-718K、RS-72-K等。The weight average molecular weight of the compound is preferably 3,000 to 50,000, and is, for example, 14,000. In addition, a fluorine-containing polymer containing an ethylenically unsaturated group in a side chain can also be used as a fluorine-based surfactant. Specific examples include compounds described in paragraphs 0050 to 0090 and 0289 to 0295 of Japanese Patent Application Laid-Open No. 2010-164965, such as Megafac RS-101, RS-102, RS-718K, and RS-72 manufactured by DIC Corporation. -K and so on.

作為非離子系界面活性劑,具體而言,可舉出甘油、三羥甲基丙烷、三羥甲基乙烷以及該些的乙氧基化物及丙氧基化物(例如,甘油丙氧基化物、甘油乙氧基化物等)、聚氧乙烯月桂基醚、聚氧乙烯硬脂醚、聚氧乙烯油基醚、聚氧乙烯辛基苯基醚、聚氧乙烯壬基苯基醚、聚乙二醇二月桂酸酯、聚乙二醇二硬脂酸酯、脫水山梨醇脂肪酸酯(BASF公司製造的Pluronic L10、L31、L61、L62、10R5、17R2、25R2、TETRONIC 304、701、704、901、904、150R1)、SOLSPERSE 20000(The Lubrizol corporatin製造)等。並且,還能夠使用Wako Pure Chemical Industries, Ltd.製造的NCW-101、NCW-1001、NCW-1002。Specific examples of the nonionic surfactant include glycerol, trimethylolpropane, trimethylolethane, and ethoxylates and propoxylates (for example, glycerol propoxylate) , Glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylen Glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester (Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2, TETRONIC 304, 701, 704, 901, 904, 150R1), SOLSPERSE 20000 (made by The Lubrizol corporatin), etc. Furthermore, NCW-101, NCW-1001, NCW-1002 manufactured by Wako Pure Chemical Industries, Ltd. can also be used.

作為陽離子系界面活性劑,具體而言,可舉出酞菁衍生物(商品名:EFKA-745、MORISHITA & CO., LTD.製造)、有機矽氧烷聚合物KP341(Shin-Etsu Chemical Co., Ltd.製造)、(甲基)丙烯酸系(共)聚合物Polyflow No.75、No.90、No.95(KYOEISHA CHEMICAL CO., LTD製造)、W001(Yusho Co Ltd製造)等。Specific examples of the cationic surfactant include a phthalocyanine derivative (trade name: EFKA-745, manufactured by MORISHITA & CO., LTD.), And an organosiloxane polymer KP341 (Shin-Etsu Chemical Co. , Ltd.), (meth) acrylic (co) polymer Polyflow No. 75, No. 90, No. 95 (manufactured by KYOEISHA CHEMICAL CO., LTD), W001 (manufactured by Yusho Co Ltd), and the like.

作為陰離子系界面活性劑,具體而言,可舉出W004、W005、W017(Yusho Co Ltd製造)、Sandetto BL(Sanyo Chemical Industries, Ltd.製造)等。Specific examples of the anionic surfactant include W004, W005, W017 (manufactured by Yusho Co Ltd), Sandetto BL (manufactured by Sanyo Chemical Industries, Ltd.), and the like.

作為矽酮系界面活性劑,例如,可舉出Toray Silicone DC3PA、Toray Silicone SH7PA、Toray Silicone DC11PA、Toray Silicone SH21PA、Toray Silicone SH28PA、Toray Silicone SH29PA、Toray Silicone SH30PA、Toray Silicone SH8400(以上,Dow Corning Toray CO., LTD.製造)、TSF-4440、TSF-4300、TSF-4445、TSF-4460、TSF-4452(以上,Momentive Performance Materials Inc.製造)、KP341、KF6001、KF6002(以上,Shin-Etsu Chemical Co., Ltd.製造)、BYK307、BYK323、BYK330(以上,BYK Additives & Instruments製造)等。Examples of the silicone-based surfactants include Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, Toray Silicone SH8400 (above, Dow Corning Toray CO., LTD.), TSF-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (above, manufactured by Momentive Performance Materials Inc.), KP341, KF6001, KF6002 (above, Shin-Etsu Chemical Co., Ltd.), BYK307, BYK323, BYK330 (above, manufactured by BYK Additives & Instruments), etc.

界面活性劑可僅使用1種,亦可組合2種以上。界面活性劑的含量相對於本發明的組成物的總固體成分,0.001~2.0質量%為較佳,0.005~1.0質量%為更佳。The surfactant may be used singly or in combination of two or more kinds. The content of the surfactant is preferably 0.001 to 2.0% by mass, and more preferably 0.005 to 1.0% by mass based on the total solid content of the composition of the present invention.

<著色劑> 上述組成物可含有含金屬氮化物的粒子以外的著色劑(以下,還簡單稱作“著色劑”。)。 著色劑例如為了調整組成物的色度而使用,能夠在OD(Optical Density)值不下降之範圍內,將含金屬氮化物的粒子的一部分替換為著色劑。作為該種著色劑,可舉出顔料(黑色有機顏料及彩色有機顏料以及無機顏料)及染料等。<Colorant> The composition may contain a coloring agent (hereinafter, simply referred to as a "coloring agent") other than the metal nitride-containing particles. The colorant is used, for example, to adjust the chromaticity of the composition, and a part of the metal nitride-containing particles can be replaced with the colorant within a range in which the OD (Optical Density) value does not decrease. Examples of such a coloring agent include pigments (black organic pigments, color organic pigments, and inorganic pigments) and dyes.

(顏料) 作為顔料,並無特別限制,能夠使用公知的顏料。作為彩色有機顏料,例如可舉出:染料索引(C.I.)顏料黃1,2,3,4,5,6,10,11,12,13,14,15,16,17,18,20,24,31,32,34,35,35:1,36,36:1,37,37:1,40,42,43,53,55,60,61,62,63,65,73,74,77,81,83,86,93,94,95,97,98,100,101,104,106,108,109,110,113,114,115,116,117,118,119,120,123,125,126,127,128,129,137,138,139,147,148,150,151,152,153,154,155,156,161,162,164,166,167,168,169,170,171,172,173,174,175,176,177,179,180,181,182,185,187,188,193,194,199,213,214等; C.I.顏料橙 2,5,13,16,17:1,31,34,36,38,43,46,48,49,51,52,55,59,60,61,62,64,71,73等; C.I.顏料紅 1,2,3,4,5,6,7,9,10,14,17,22,23,31,38,41,48:1,48:2,48:3,48:4,49,49:1,49:2,52:1,52:2,53:1,57:1,60:1,63:1,66,67,81:1,81:2,81:3,83,88,90,105,112,119,122,123,144,146,149,150,155,166,168,169,170,171,172,175,176,177,178,179,184,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246,254,255,264,270,272,279等; C.I.顏料綠 7,10,36,37,58,59等; C.I.顏料紫 1,19,23,27,32,37,42等; C.I.顏料藍 1,2,15,15:1,15:2,15:3,15:4,15:6,16,22,60,64,66,79,80等。(Pigment) The pigment is not particularly limited, and a known pigment can be used. Examples of color organic pigments include: Dye Index (CI) Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24 , 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 42, 43, 53, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77 , 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125 , 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171 , 172,173,174,175,176,177,179,180,181,182,185,187,188,193,194,199,213,214, etc .; CI Pigment Orange 2,5,13,16,17 : 1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73, etc .; CI Pigment Red 1, 2, 3, 4 , 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48: 1, 48: 2, 48: 3, 48: 4, 49, 49: 1, 49: 2 , 52: 1, 52: 2, 53: 1, 57: 1, 60: 1, 63: 1, 66, 67 , 81: 1, 81: 2, 81: 3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172 , 175, 176, 177, 178, 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255 , 264, 270, 272, 279, etc .; CI Pigment Green 7, 10, 36, 37, 58, 59, etc .; CI Pigment Violet 1, 19, 23, 27, 32, 37, 42, etc .; CI Pigment Blue 1, 2 , 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 22, 60, 64, 66, 79, 80 and so on.

並且,作為綠色顔料,還能夠使用分子中的鹵原子數為平均10~14個、溴原子為平均8~12個、氯原子為平均2~5個之鹵化鋅酞菁顔料。作為具體例,可舉出國際公開第2015/118720號中記載之化合物。 該些有機顔料可單獨或者為了提高顏色純度而組合複數種來使用。In addition, as the green pigment, a zinc halide phthalocyanine pigment having an average number of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms can be used. Specific examples include compounds described in International Publication No. 2015/118720. These organic pigments can be used alone or in combination in order to improve color purity.

黑色顔料能夠使用各種公知的黑色顔料。例如,可舉出碳黑和/或以下示出之含黑色金屬有機顏料。作為含黑色金屬有機顏料,可舉出包含選自含有Co、Cr、Cu、Mn,Ru、Fe、Ni、Sn、Ti及Ag所組成的群組中的1種或2種以上的金屬元素之金屬氧化物。該些能夠僅使用1種,並且,還能夠作為2種以上的混合物來使用。並且,可藉由對黑色顔料進一步組合其他色調的無機顔料,製備成具有所希望的遮光性。作為可組合來使用之具體的無機顔料的例子,例如,可舉出鋅白、鉛白、鋅鋇白、氧化鈦、氧化鉻、氧化鐵、沉降性硫酸鋇及重晶石粉、鉛紅、氧化鐵紅、鉻黃、鋅黃(鋅黃1種、鋅黃2種)、群青藍、普魯士藍(亞鐵氰化鐵鉀)鋯石灰色、鐠黃、鉻鈦黃、鉻綠、孔雀、維多利亞綠、鐵藍(與普魯士藍無關)、釩鋯藍、鉻錫紅、錳紅、橙紅等。尤其,為了顯現紫外至紅外的較廣的波長域中的遮光性,不僅能夠單獨使用該些黑色顔料或其他色調,亦可混合複數種顔料來使用。As the black pigment, various known black pigments can be used. Examples thereof include carbon black and / or a black metal-containing organic pigment shown below. Examples of the black metal-containing organic pigment include one or more metal elements selected from the group consisting of Co, Cr, Cu, Mn, Ru, Fe, Ni, Sn, Ti, and Ag. Metal oxide. These can be used alone, and can also be used as a mixture of two or more. In addition, a black pigment can be further combined with an inorganic pigment of another hue to produce a desired light-shielding property. Examples of specific inorganic pigments that can be used in combination include zinc white, lead white, zinc barium white, titanium oxide, chromium oxide, iron oxide, precipitated barium sulfate and barite powder, lead red, and oxide. Iron red, chrome yellow, zinc yellow (1 zinc yellow, 2 zinc yellow), ultramarine blue, Prussian blue (ferrous potassium ferrocyanide), zircon gray, ochre yellow, chrome titanium yellow, chrome green, peacock, Victoria Green, iron blue (unrelated to Prussian blue), vanadium zirconium blue, chrome tin red, manganese red, orange red, etc. In particular, in order to express light-shielding properties in a wide wavelength range from ultraviolet to infrared, not only these black pigments or other shades, but also a plurality of pigments may be used in combination.

黑色顔料的平均一次粒徑為5nm以上為較佳,10nm以上為更佳。從相同的觀點考慮,作為上限,10μm以下為較佳,1μm以下為更佳,100nm以下為進一步較佳。黑色顏料的平均一次粒徑表示藉由與含金屬氮化物的粒子的平均一次粒徑相同的方法測定之平均一次粒徑。The average primary particle diameter of the black pigment is preferably 5 nm or more, and more preferably 10 nm or more. From the same viewpoint, the upper limit is preferably 10 μm or less, more preferably 1 μm or less, and even more preferably 100 nm or less. The average primary particle diameter of the black pigment indicates the average primary particle diameter measured by the same method as the average primary particle diameter of the metal nitride-containing particles.

(染料) 作為染料,例如可使用日本特開昭64-90403號公報、日本特開昭64-91102號公報、日本特開平1-94301號公報、日本特開平6-11614號公報、日本特登2592207號、美國專利4808501號說明書、美國專利5667920號說明書、美國專利505950號說明書、日本特開平5-333207號公報、日本特開平6-35183號公報、日本特開平6-51115號公報及日本特開平6-194828號公報等中公開之色素。若作為化學結構予以區分,則能夠使用吡唑偶氮化合物、吡咯亞甲基化合物、苯胺偶氮化合物、三苯甲烷化合物、蒽醌化合物、亞苄基化合物、氧雜菁(oxonol)化合物、吡唑並三唑偶氮化合物、吡啶酮偶氮化合物、花青化合物、啡噻嗪化合物及吡咯並吡唑甲亞胺化合物等。並且,作為染料,可使用色素多聚體。作為色素多聚體,可舉出日本特開2011-213925號公報及日本特開2013-041097號公報中記載之化合物。(Dye) As the dye, for example, Japanese Patent Application Laid-Open No. 64-90403, Japanese Patent Application Laid-Open No. 64-91102, Japanese Patent Application Laid-Open No. 1-94301, Japanese Patent Application Laid-Open No. 6-11614, and Japanese Patent Publication No. 2592207, U.S. Patent No. 4,850,001, U.S. Patent No. 5,667,920, U.S. Patent No. 505950, Japanese Patent Laid-Open No. 5-333207, Japanese Patent Laid-Open No. 6-35183, Japanese Patent Laid-Open No. 6-51115, and Japanese Patent No. 6-51115 The pigment disclosed in Kaihei 6-194828 and the like. When distinguished as a chemical structure, a pyrazole azo compound, a pyrrole methylene compound, an aniline azo compound, a triphenylmethane compound, an anthraquinone compound, a benzylidene compound, an oxonol compound, and pyridine can be used. Zolotriazole azo compounds, pyridone azo compounds, cyanine compounds, phenothiazine compounds, pyrrolopyrazomethine compounds, and the like. As the dye, a pigment multimer can be used. Examples of the pigment multimer include compounds described in Japanese Patent Application Laid-Open No. 2011-213925 and Japanese Patent Application Laid-Open No. 2013-041097.

上述組成物可除了著色劑以外,還依據需要包含體質顏料。作為該種體質顏料,例如能夠舉出硫酸鋇、碳酸鋇、碳酸鈣、二氧化矽、鹼性碳酸鎂、矾土白、光澤白、鈦白及水滑石等。該些體質顏料能夠單獨使用或混合2種以上來使用。體質顏料的使用量相對於著色劑100質量份,通常為0~100質量份,5~50質量份為較佳,10~40質量份為更佳。著色劑及體質顏料能夠藉由聚合物對其表面進行改質來使用。The composition may contain an extender pigment in addition to the colorant, if necessary. Examples of the constitution pigment include barium sulfate, barium carbonate, calcium carbonate, silicon dioxide, basic magnesium carbonate, alumina white, gloss white, titanium white, and hydrotalcite. These extender pigments can be used alone or in combination of two or more. The usage-amount of an extender pigment is 0-100 mass parts normally with respect to 100 mass parts of colorants, 5-50 mass parts is preferable, 10-40 mass parts is more preferable. Colorants and extender pigments can be used by modifying the surface of polymers.

著色劑可單獨使用1種,亦可倂用2種以上。作為著色劑,可含有紅色、藍色、黃色、綠色及紫色等著色有機顔料。倂用遮光性顔料(具體而言,含金屬氮化物的粒子)與著色有機顔料時,相對於遮光性顔料,使用1~40質量%的著色有機顔料為較佳。從調整色調之觀點考慮,倂用紅色顔料與遮光性顔料為較佳,雖並無特別限定,但作為紅色顔料,顏料紅254為較佳。並且,從提高遮光性之觀點考慮,倂用黄色顔料與遮光性顔料為較佳,雖然並無特別限定,但作為黄色顔料,顏料黃150為較佳。The colorant may be used singly or in combination of two or more kinds. The colorant may contain colored organic pigments such as red, blue, yellow, green, and purple. When using light-shielding pigments (specifically, metal nitride-containing particles) and colored organic pigments, it is preferable to use 1 to 40% by mass of the colored organic pigments relative to the light-shielding pigment. From the viewpoint of adjusting color tone, red pigments and light-shielding pigments are preferred, and although not particularly limited, pigment red 254 is preferred as the red pigment. In addition, from the viewpoint of improving light-shielding properties, yellow pigments and light-shielding pigments are preferred. Although not particularly limited, pigment yellow 150 is preferred as a yellow pigment.

上述組成物含有著色劑時,著色劑的含量相對於組成物的總固體成分,20~80質量%為較佳,30~70質量%為更佳,35~60質量%為進一步較佳。When the composition contains a colorant, the content of the colorant is more preferably 20 to 80% by mass, more preferably 30 to 70% by mass, and still more preferably 35 to 60% by mass relative to the total solid content of the composition.

<顔料衍生物> 上述組成物能夠含有顔料衍生物。作為顔料衍生物,例如,可舉出含有藉由酸性基、鹼性基或鄰苯二甲酸亞胺甲基取代有機顏料的一部分之結構之化合物。 作為用於構成顔料衍生物之有機顔料,可舉出二氧代吡咯并吡咯系顔料、偶氮系顔料、酞菁系顔料、蒽醌系顔料、喹吖啶酮系顔料、二噁嗪系顔料、紫環酮系顔料、苝系顔料、硫靛系顔料、異吲哚啉系顔料、異吲哚啉酮系顔料、喹酞酮系顔料、士林系顔料及金屬絡合物系顔料等。 並且,作為顔料衍生物所含有之酸性基,磺酸基、羧酸基及其四級銨鹽基為較佳,羧酸基及磺酸基為進一步較佳,磺酸基尤為佳。作為顔料衍生物所含有之鹼性基,胺基為較佳,三級胺基為更佳。 作為顔料衍生物的具體例,例如,可舉出下述化合物。並且,可參閱日本特開2011-252065號公報的段落0162~0183的記載,該內容引入本說明書中。<Pigment derivative> The said composition can contain a pigment derivative. Examples of the pigment derivative include compounds having a structure in which a part of the organic pigment is substituted with an acidic group, a basic group, or an iminomethyl phthalate. Examples of the organic pigment used to constitute the pigment derivative include dioxopyrrolopyrrole-based pigments, azo-based pigments, phthalocyanine-based pigments, anthraquinone-based pigments, quinacridone-based pigments, and dioxazine-based pigments. , Ringone-based pigments, fluorene-based pigments, thioindigo-based pigments, isoindolinone-based pigments, isoindolinone-based pigments, quinophthalone-based pigments, Shihlin-based pigments, and metal complex-based pigments. In addition, as the acidic group contained in the pigment derivative, a sulfonic acid group, a carboxylic acid group, and a quaternary ammonium salt group thereof are preferred, a carboxylic acid group and a sulfonic acid group are further preferred, and a sulfonic acid group is particularly preferred. As the basic group contained in the pigment derivative, an amine group is preferable, and a tertiary amine group is more preferable. Specific examples of the pigment derivative include the following compounds. In addition, reference can be made to the descriptions in paragraphs 0162 to 0183 of Japanese Patent Application Laid-Open No. 2011-252065, which are incorporated into this specification.

[化學式20] [Chemical Formula 20]

上述組成物含有顔料衍生物時,顔料衍生物的含量相對於著色劑的總質量,1~30質量%為較佳,3~20質量%為進一步較佳。上述組成物可僅包含1種顔料衍生物,亦可含有2種以上。含有2種以上時,其總計量成為上述範圍為較佳。When the composition contains a pigment derivative, the content of the pigment derivative is preferably 1 to 30% by mass, and more preferably 3 to 20% by mass relative to the total mass of the colorant. The said composition may contain only 1 type of pigment derivative, and may contain 2 or more types. When two or more kinds are contained, the total amount is preferably in the above range.

<矽烷偶聯劑> 矽烷偶聯劑係指在分子中含有水解性基團及其以外的官能基之化合物。另外,烷氧基等水解性基團與矽原子鍵結。 水解性基團係指,與矽原子直接鍵結,並且可藉由水解反應和/或縮合反應生成矽氧烷鍵之取代基。作為水解性基團,例如,可舉出鹵原子、烷氧基、醯氧基及烯氧基。水解性基團含有碳原子時,其碳原子數為6以下為較佳,4以下為更佳。碳原子數4以下的烷氧基或碳原子數4以下的烯氧基尤為佳。 並且,在基板上形成硬化膜時,為了提高基板與硬化膜之間的黏附性,矽烷偶聯劑不包含氟原子及矽原子(其中,水解性基團所鍵結之矽原子除外)為較佳,不包含氟原子、矽原子(其中,水解性基團所鍵結之矽原子除外)、被矽原子取代之伸烷基、碳原子數8以上的直鏈烷基及碳原子數3以上的支鏈烷基為較佳。<Silane coupling agent> A silane coupling agent is a compound which contains a hydrolyzable group and the functional group other than that in a molecule | numerator. A hydrolyzable group such as an alkoxy group is bonded to a silicon atom. A hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and can generate a siloxane bond through a hydrolysis reaction and / or a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, a fluorenyloxy group, and an alkenyloxy group. When the hydrolyzable group contains a carbon atom, the number of carbon atoms is preferably 6 or less, and more preferably 4 or less. An alkoxy group having 4 or less carbon atoms or an alkenyl group having 4 or less carbon atoms is particularly preferred. In addition, when forming a cured film on a substrate, in order to improve the adhesion between the substrate and the cured film, the silane coupling agent does not contain fluorine atoms and silicon atoms (except for silicon atoms bonded by hydrolyzable groups). It does not contain fluorine atom, silicon atom (except silicon atom bonded by hydrolyzable group), alkylene group substituted by silicon atom, straight-chain alkyl group having 8 or more carbon atoms, and 3 or more carbon atoms Is preferably a branched alkyl group.

矽烷偶聯劑含有以以下的式(Z)表示之基團為較佳。*表示鍵結位置。 式(Z)*-Si-(RZ13 式(Z)中,RZ1 表示水解性基團,其定義如上述。The silane coupling agent preferably contains a group represented by the following formula (Z). * Indicates the bonding position. Formula (Z) *-Si- (R Z1 ) 3 In formula (Z), R Z1 represents a hydrolyzable group, and its definition is as described above.

矽烷偶聯劑含有選自由(甲基)丙烯醯氧基、環氧基及氧雜環丁基所組成的群組中的1種以上的硬化性官能基為較佳。硬化性官能基可直接與矽原子鍵結,亦可經由連結基與矽原子鍵結。 另外,作為上述矽烷偶聯劑中包含之硬化性官能基的較佳態樣,還可舉出自由基聚合性基團。It is preferable that the silane coupling agent contains one or more hardenable functional groups selected from the group consisting of (meth) acrylic fluorenyloxy, epoxy, and oxetanyl. The hardening functional group may be directly bonded to the silicon atom, or may be bonded to the silicon atom through a linking group. Moreover, as a preferable aspect of the curable functional group contained in the said silane coupling agent, a radical polymerizable group is mentioned.

矽烷偶聯劑的分子量並無特別限制,從操作性觀點考慮,100~1000的情況較多,270以上為較佳,270~1000為更佳。The molecular weight of the silane coupling agent is not particularly limited. From the viewpoint of operability, it is often 100 to 1,000, more preferably 270 or more, and more preferably 270 to 1,000.

作為矽烷偶聯劑的較佳態樣之一,可舉出以式(W)表示之矽烷偶聯劑X。 式(W) RZ2 -Lz-Si-(RZ13 Rz1 表示水解性基團,定義如上述。 Rz2 表示硬化性官能基,定義如上述,較佳範圍亦如上述。 Lz表示單鍵或2價的連結基。Lz表示2價的連結基時,作為2價的連結基,可舉出鹵原子可取代之伸烷基、鹵原子可取代之伸芳基、-NR12 -、-CONR12 -、-CO-、-CO2 -、SO2 NR12 -、-O-、-S-、-SO2 -或該些的組合。其中,選自由碳原子數2~10的鹵原子可取代之伸烷基及碳原子數6~12的鹵原子可取代之伸芳基所組成的群組中的至少1種、或包含該些基團與選自由-NR12 -、-CONR12 -、-CO-、-CO2 -、SO2 NR12 -、-O-、-S-及SO2 -所組成的群組中的至少1種基團的組合之基團為較佳,包含碳原子數2~10的鹵原子可取代之伸烷基、-CO2 -、-O-、-CO-、-CONR12 -或該些基團的組合之基團為更佳。其中,上述R12 表示氫原子或甲基。One of the preferable aspects of the silane coupling agent includes a silane coupling agent X represented by the formula (W). The formula (W) R Z2 -Lz-Si- (R Z1 ) 3 R z1 represents a hydrolyzable group, and is defined as described above. R z2 represents a hardenable functional group, as defined above, and the preferred range is also as described above. Lz represents a single bond or a divalent linking group. When Lz represents a divalent linking group, examples of the divalent linking group include a halogen atom-substituted alkylene group, a halogen atom-substituted alkylene group, -NR 12- , -CONR 12- , -CO- , -CO 2- , SO 2 NR 12- , -O-, -S-, -SO 2 -or a combination of these. Among them, at least one selected from the group consisting of an alkylene group having a halogen atom number of 2 to 10 and an alkylene group having a halogen atom number of 6 to 12 and including these A group and at least 1 selected from the group consisting of -NR 12- , -CONR 12- , -CO-, -CO 2- , SO 2 NR 12- , -O-, -S-, and SO 2- The combination of these groups is preferably a group including an alkylene group which may be substituted by a halogen atom having 2 to 10 carbon atoms, -CO 2- , -O-, -CO-, -CONR 12 -or these groups. The combination of groups is more preferred. Here, the above R 12 represents a hydrogen atom or a methyl group.

作為矽烷偶聯劑X,可舉出N-β-胺乙基-γ-胺丙基-甲基二甲氧基矽烷(Shin-Etsu Chemical Co., Ltd.製商品名 KBM-602)、N-β-胺乙基-γ-胺丙基-三甲氧基矽烷(Shin-Etsu Chemical Co., Ltd.製商品名 KBM-603)、N-β-胺乙基-γ-胺丙基-三乙氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造商品名 KBE-602)、γ-胺丙基-三甲氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造商品名 KBM-903)、γ-胺丙基-三乙氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造商品名 KBE-903)、3-甲基丙烯醯氧基丙基三甲氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造商品名 KBM-503)及環氧丙氧基辛基三甲氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造商品名 KBM-4803)等。Examples of the silane coupling agent X include N-β-aminoethyl-γ-aminopropyl-methyldimethoxysilane (trade name: KBM-602, manufactured by Shin-Etsu Chemical Co., Ltd.), N -β-aminoethyl-γ-aminopropyl-trimethoxysilane (trade name KBM-603 manufactured by Shin-Etsu Chemical Co., Ltd.), N-β-aminoethyl-γ-aminopropyl-tri Ethoxysilane (trade name KBE-602 manufactured by Shin-Etsu Chemical Co., Ltd.), γ-aminopropyl-trimethoxysilane (trade name KBM-903 manufactured by Shin-Etsu Chemical Co., Ltd.), γ-Aminopropyl-triethoxysilane (Shin-Etsu Chemical Co., Ltd. product name KBE-903), 3-Methacryloxypropyltrimethoxysilane (Shin-Etsu Chemical Co. , Ltd. (trade name: KBM-503), Glycidoxyoctyltrimethoxysilane (trade name, KBM-4803, manufactured by Shin-Etsu Chemical Co., Ltd.), and the like.

作為矽烷偶聯劑的其他較佳態樣,可舉出在分子內至少具有矽原子、氮原子、硬化性官能基,且含有與矽原子鍵結之水解性基團之矽烷偶聯劑Y。 該矽烷偶聯劑Y在分子內具有至少1個矽原子即可,矽原子能夠與以下的原子、取代基鍵結。該些可以係相同的原子、取代基,亦可不同。可鍵結之原子、取代基可舉出氫原子、鹵原子、羥基、碳原子數1至20的烷基、烯基、炔基、芳基、可用烷基和/或芳基取代之胺基、甲矽烷基、碳原子數1至20的烷氧基、芳氧基等。該些取代基可進一步被甲矽烷基、烯基、炔基、芳基、烷氧基、芳氧基、硫代烷氧基、可用烷基和/或芳基取代之胺基、鹵原子、磺醯胺基、烷氧基羰基、醯胺基、尿素基、銨基、烷基銨基、羧酸基或其鹽、磺基或其鹽等。 另外,矽原子上鍵結有至少1個水解性基團。水解性基團的定義如上述。 矽烷偶聯劑Y中可包含以式(Z)表示之基團。Other preferable aspects of the silane coupling agent include a silane coupling agent Y having at least a silicon atom, a nitrogen atom, and a hardenable functional group in the molecule, and containing a hydrolyzable group bonded to the silicon atom. The silane coupling agent Y only needs to have at least one silicon atom in the molecule, and the silicon atom can be bonded to the following atoms and substituents. These may be the same atom or substituent, or may be different. Examples of the bondable atom and substituent include a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group having 1 to 20 carbon atoms, an alkenyl group, an alkynyl group, an aryl group, and an amine group which may be substituted by an alkyl group and / or an aryl group. , Silyl, alkoxy, aryloxy having 1 to 20 carbon atoms, and the like. These substituents may be further substituted by silyl, alkenyl, alkynyl, aryl, alkoxy, aryloxy, thioalkoxy, amine groups which may be substituted with alkyl and / or aryl, halogen atoms, Sulfonamido, alkoxycarbonyl, amido, urea, ammonium, alkylammonium, carboxylic acid or a salt thereof, sulfo or a salt thereof, and the like. In addition, at least one hydrolyzable group is bonded to the silicon atom. The definition of the hydrolyzable group is as described above. The silane coupling agent Y may contain a group represented by the formula (Z).

矽烷偶聯劑Y在分子內具有至少1個以上的氮原子,氮原子以2級胺基或者3級胺基的形態存在為較佳,亦即,氮原子作為取代基含有至少1個有機基團為較佳。另外,作為胺基的結構,可以以含氮雜環的部分結構的形態存在於分子內,亦可作為苯胺等取代胺基存在。 其中,作為有機基團,可舉出烷基、烯基、炔基、芳基或該些的組合。該些可進一步具有取代基,作為可導入之取代基,可舉出甲矽烷基、烯基、炔基、芳基、烷氧基、芳氧基、硫代烷氧基、胺基、鹵原子、磺醯胺基、烷氧基羰基、羰基氧基、醯胺基、尿素基、伸烷氧基銨基、烷基銨基、羧酸基或其鹽、磺基等。 並且,氮原子經由任意的有機連結基與硬化性官能基鍵結為較佳。作為較佳之有機連結基,可舉出可導入到上述氮原子及與其鍵結之有機基團之取代基。The silane coupling agent Y has at least one nitrogen atom in the molecule, and it is preferable that the nitrogen atom exists in the form of a secondary amine group or a tertiary amine group, that is, the nitrogen atom contains at least one organic group as a substituent. Mission is better. The structure of the amine group may exist in the molecule in the form of a partial structure of a nitrogen-containing heterocyclic ring, or may exist as a substituted amine group such as aniline. Among them, examples of the organic group include an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a combination thereof. These may further have a substituent, and examples of the substituent that can be introduced include silyl, alkenyl, alkynyl, aryl, alkoxy, aryloxy, thioalkoxy, amine, and halogen atoms. , Sulfonylamino, alkoxycarbonyl, carbonyloxy, sulfonylamino, urea, alkoxyammonium, alkylammonium, carboxylic acid or its salt, sulfo, and the like. In addition, the nitrogen atom is preferably bonded to the curable functional group via an arbitrary organic linking group. Preferred examples of the organic linking group include substituents which can be introduced into the nitrogen atom and an organic group bonded thereto.

矽烷偶聯劑Y中包含之硬化性官能基的定義如上述,較佳範圍亦如上述。 矽烷偶聯劑Y中,在一分子中可以具有至少1個以上的硬化性官能基,但亦可取含有2個以上的硬化性官能基之態樣,從靈敏度、穩定性的觀點考慮,含有2~20個硬化性官能基為較佳,含有4~15個為更佳,在分子內含有6~10個硬化性官能基為進一步較佳。The definition of the hardenable functional group contained in the silane coupling agent Y is as described above, and the preferred range is also as described above. The silane coupling agent Y may have at least one hardenable functional group in one molecule, but it may take the form of containing two or more hardenable functional groups. From the viewpoint of sensitivity and stability, it contains 2 -20 hardenable functional groups are more preferred, 4 to 15 are more preferred, and 6 to 10 hardenable functional groups are more preferably contained in the molecule.

矽烷偶聯劑X及矽烷偶聯劑Y的分子量並無特別限制,可舉出上述範圍(270以上為較佳)。The molecular weights of the silane coupling agent X and the silane coupling agent Y are not particularly limited, and examples thereof include the above range (270 or more is preferred).

上述組成物中的矽烷偶聯劑的含量相對於組成物中的總固體成分,0.1~10質量%為較佳,0.5~8質量%為更佳,1.0~6質量%為進一步較佳。The content of the silane coupling agent in the composition is more preferably 0.1 to 10% by mass, more preferably 0.5 to 8% by mass, and even more preferably 1.0 to 6% by mass based on the total solids in the composition.

上述組成物可單獨包含1種矽烷偶聯劑,亦可包含2種以上。組成物含有2種以上的矽烷偶聯劑時,其總計在上述範圍內即可。The said composition may contain 1 type of silane coupling agent individually, and may contain 2 or more types. When the composition contains two or more kinds of silane coupling agents, the total amount may be within the above range.

<紫外線吸收劑> 上述組成物可含有紫外線吸收劑。藉此,能夠將硬化膜的圖案形狀設為更優異(精細)者。 作為紫外線吸收劑,能夠使用水楊酸鹽系、二苯甲酮系、苯并三唑系、取代丙烯腈系及三嗪系紫外線吸收劑。作為該些的具體例,能夠使用日本特開2012-068418號公報的段落0137~0142(對應之US2012/0068292的段落0251~0254)的化合物,能夠援用該些內容並引入本說明書中。 此外,二乙基胺基-苯基磺醯基系紫外線吸收劑(DAITO CHEMICAL CO., LTD.製造、商品名:UV-503)等亦可較佳地使用。 作為紫外線吸收劑,可舉出日本特開2012-32556號公報的段落0134~0148中例示之化合物。 紫外線吸收劑的含量相對於組成物的總固體成分,0.001~15質量%為較佳,0.01~10質量%為更佳,0.1~5質量%為進一步較佳。<Ultraviolet absorbent> The said composition may contain an ultraviolet absorber. Thereby, the pattern shape of a cured film can be made more excellent (fine). As the ultraviolet absorber, a salicylate-based, benzophenone-based, benzotriazole-based, substituted acrylonitrile-based, or triazine-based ultraviolet absorber can be used. As specific examples of these, compounds of paragraphs 0137 to 0142 of Japanese Patent Application Laid-Open No. 2012-068418 (corresponding to paragraphs 0251 to 0254 of US2012 / 0068292) can be used, and these contents can be incorporated into this specification. In addition, a diethylamino-phenylsulfonyl-based ultraviolet absorber (manufactured by DAITO CHEMICAL CO., LTD., Trade name: UV-503) and the like can also be preferably used. Examples of the ultraviolet absorber include compounds exemplified in paragraphs 0134 to 0148 of Japanese Patent Application Laid-Open No. 2012-32556. The content of the ultraviolet absorber is more preferably 0.001 to 15% by mass, more preferably 0.01 to 10% by mass, and still more preferably 0.1 to 5% by mass with respect to the total solid content of the composition.

<聚合抑制劑> 上述組成物可含有聚合抑制劑。作為聚合抑制劑,可舉出對苯二酚、對甲氧基苯酚、二-第三丁基-對甲酚、鄰苯三酚 、第三丁基鄰苯二酚、對苯醌、4,4’-硫代雙(3-甲基-6-第三丁基苯酚)、2,2’-亞甲基雙(4-甲基-6-第三丁基苯酚)、N-亞硝基苯基羥基胺亞鈰鹽等。 聚合抑制劑的含量相對於組成物的總固體成分,0.01~5質量%為較佳。上述組成物可僅包含1種聚合抑制劑,亦可包含2種以上。含有2種以上時,其總計量成為上述範圍為較佳。 並且,可依據需要,為了防止氧引起之聚合阻礙,添加山嵛酸和/或山嵛酸醯胺等高級脂肪酸衍生物等,在塗佈之後的乾燥過程中使其局部存在於塗佈膜的表面。高級脂肪酸衍生物的含量相對於組成物的總固體成分,0.5~10質量%為較佳。<Polymerization inhibitor> The said composition may contain a polymerization inhibitor. Examples of the polymerization inhibitor include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, catechol, tert-butylcatechol, p-quinone, 4, 4'-thiobis (3-methyl-6-third butylphenol), 2,2'-methylenebis (4-methyl-6-third butylphenol), N-nitroso Phenylhydroxylamine cerium salt and the like. The content of the polymerization inhibitor is preferably 0.01 to 5% by mass based on the total solid content of the composition. The said composition may contain only 1 type of polymerization inhibitor, and may contain 2 or more types. When two or more kinds are contained, the total amount is preferably in the above range. In addition, if necessary, in order to prevent the polymerization from being hindered by oxygen, a higher fatty acid derivative such as behenic acid and / or behenyl behenate may be added, and it may be locally present in the coating film during the drying process after coating. surface. The content of the higher fatty acid derivative is preferably 0.5 to 10% by mass based on the total solid content of the composition.

除了上述成分以外,上述組成物中亦可進一步添加以下成分。例如,可舉出敏化劑、共敏化劑、交聯劑、硬化促進劑、填料、熱硬化促進劑、增塑劑、稀釋劑及感脂化劑等,而且,還可依據需要添加對基板表面的黏附促進劑及其他助劑類(例如,導電性粒子、填充劑、消泡劑、阻燃劑、流平劑、剝離促進劑、抗氧化劑、香料、界面張力調整劑及鏈轉移劑等)等公知的添加劑。 該些成分例如能夠參閱日本特開2012-003225號公報的段落號0183~0228(對應之美國專利申請公開第2013/0034812號說明書的<0237>~<0309>)、日本特開2008-250074號公報的段落號0101~0102、段落號0103~0104、段落號0107~0109及日本特開2013-195480號公報的段落號0159~0184等的記載,該些內容引入本申請說明書中。In addition to the above components, the following components may be further added to the above composition. For example, sensitizers, co-sensitizers, cross-linking agents, hardening accelerators, fillers, thermal hardening accelerators, plasticizers, diluents, and fat sensitizers can be added. Adhesion promoters and other auxiliaries on the substrate surface (for example, conductive particles, fillers, defoamers, flame retardants, leveling agents, peeling accelerators, antioxidants, fragrances, interfacial tension modifiers, and chain transfer agents Etc.) and other well-known additives. These components can be referred to, for example, Japanese Patent Application Publication No. 2012-003225, paragraph numbers 0183 to 0228 (corresponding to US Patent Application Publication No. 2013/0034812, <0237> to <0309>), Japanese Patent Application Laid-Open No. 2008-250074 The descriptions of paragraph numbers 0101 to 0102, paragraph numbers 0103 to 0104, paragraph numbers 0107 to 0109, and paragraph numbers 0159 to 0184 of Japanese Patent Application Laid-Open No. 2013-195480 are incorporated in this specification.

〔組成物的製造方法〕 上述組成物的製造方法含有以下的混合及分散製程。並且,含有靜置製程和/或過濾製程為更佳。以下,對各製程,對較佳態樣進行詳細說明。[Manufacturing method of composition] The manufacturing method of the composition includes the following mixing and dispersion processes. In addition, it is more preferable to include a standing process and / or a filtering process. In the following, the preferred aspects of each process are described in detail.

<混合及分散製程> 混合及分散製程係藉由公知的混合方法(例如,攪拌機、均質器、高壓乳化装置、濕式粉碎機及濕式分散機)混合上述成分來獲得組成物之製程。 混合及分散製程中,可集中配合構成組成物之各成分,亦可在將各成分溶解或分散於有機溶劑之後依次配合。並且,配合時的投入順序及作業條件並不特別受限。並且,混合及分散製程可含有製作分散液之製程。<Mixing and Dispersing Process> The mixing and dispersing process is a process for obtaining a composition by mixing the above components by a known mixing method (for example, a mixer, a homogenizer, a high-pressure emulsifying device, a wet pulverizer, and a wet disperser). In the mixing and dispersing process, the components constituting the composition may be blended in a concentrated manner, or the components may be blended sequentially after being dissolved or dispersed in an organic solvent. In addition, the input sequence and working conditions at the time of cooperation are not particularly limited. In addition, the mixing and dispersion process may include a process for preparing a dispersion.

(製作分散液之製程) 製作分散液之製程係混合含金屬氮化物的粒子、分散劑與溶劑,藉由上述方法使含金屬氮化物的粒子分散來製作分散液之製程。能夠向所製作之分散液混合其餘的成分來製造組成物。 製作上述分散液之製程中,作為用於顔料的分散之機械力,可舉出壓縮、壓榨、衝擊、裁斷或氣蝕等。作為該些工藝的具體例,可舉出珠磨、砂磨、輥磨、高速葉輪、混砂、噴射流混合、高壓濕式微粒化及超聲波分散等。並且,能夠適當使用“分散技術大全、株式會社資訊機構發行、2005年7月15日”及“以懸浮液(suspension)(固/液分散系統)為中心之分散技術與工業應用的實際綜合資料集、經營開發中心r出版部發行、1978年10月10日”中記載之製程及分散機。 並且,在製作上述分散液之製程中,可進行基於鹽磨製程之顔料的微細化處理。用於鹽磨製程之原材料、設備及處理條件等例如能夠使用日本特開2015-194521號及日本特開2012-046629號中記載者。 並且,上述組成物的製造方法含有藉由熱電漿法獲得上述含金屬氮化物的粒子之製程為較佳。獲得含金屬氮化物的粒子之製程在混合上述各成分之前實施。基於熱電漿法之含金屬氮化物的粒子的具體的製造製程的態樣如上述。(Manufacturing Process of Dispersion Liquid) The manufacturing process of the dispersion liquid is a manufacturing process of mixing the metal nitride-containing particles, the dispersant, and the solvent, and dispersing the metal nitride-containing particles by the method described above. The remaining components can be mixed with the produced dispersion liquid to produce a composition. In the manufacturing process of the dispersion liquid, as the mechanical force for dispersing the pigment, compression, pressing, impact, cutting, or cavitation can be mentioned. Specific examples of these processes include bead mill, sand mill, roll mill, high-speed impeller, sand mixing, jet stream mixing, high-pressure wet micronization, and ultrasonic dispersion. In addition, it is possible to appropriately use "Distribution Technology Encyclopedia, Issued by Information Corporation, July 15, 2005" and "Distribution Technology (Suspension (Solid / Liquid Dispersion System) Centered Dispersion Technology and Practical Comprehensive Information on Industrial Applications" Collected and distributed by the Publishing Department of the Business Development Center, October 10, 1978. In addition, in the process for preparing the dispersion, the pigment can be refined by a salt milling process. The raw materials, equipment, and processing conditions used in the salt milling process can be, for example, those described in Japanese Patent Application Laid-Open No. 2015-194521 and Japanese Patent Application No. 2012-046629. In addition, it is preferable that the method for producing the composition includes a process of obtaining the metal nitride-containing particles by a thermoplasma method. The process for obtaining the metal nitride-containing particles is performed before mixing the above components. The specific manufacturing process of the metal nitride-containing particle based on the thermoplasma method is as described above.

<靜置製程> 上述含金屬氮化物的粒子在供給至混合及分散製程、或製作分散液之製程之前,經過以下的靜置製程為較佳。 靜置製程係將藉由熱電漿法獲得之含金屬氮化物的粒子在其製造之後並不暴露於大氣,而是在氧濃度得到控制之密封容器內,靜置規定時間(12~72小時為較佳,12~48小時為更佳,12~24小時為進一步較佳)之製程。此時,密封容器內的水分的含量得到控制為更佳。<Still Process> Before supplying the above-mentioned metal nitride-containing particles to a mixing and dispersion process or a process for preparing a dispersion, it is preferable to go through the following still process. The stationary process is a process in which the particles containing metal nitrides obtained by the pyroplasma method are not exposed to the atmosphere after they are manufactured, but in a sealed container whose oxygen concentration is controlled, and allowed to stand for a predetermined time (12 to 72 hours) Preferably, 12 to 48 hours is more preferred, and 12 to 24 hours is more preferred). At this time, the content of water in the sealed container is more preferably controlled.

此時,密封容器內的氧(O2 )濃度及水分的含量分別為100ppm以下為較佳,10ppm以下為更佳,1ppm以下為進一步較佳。 密封容器內的氧(O2 )濃度及水分的含量能夠藉由調整供給至密封容器內之惰性氣體中的氧濃度及水分量來進行調整。作為惰性氣體,使用氮氣及氬氣為較佳,其中,使用氮氣為更佳。 若經過上述靜置製程,則含金屬氮化物的粒子的表面及晶界變得穩定。藉此,能夠抑制使用組成物來獲得之硬化膜的針孔的產生。 另外,上述靜置製程能夠被在含金屬氮化物的粒子的製造方法中說明之製程H替代,從組成物具有更優異之本發明的效果之角度考慮,藉由製程H代替為較佳。At this time, the oxygen (O 2 ) concentration and the moisture content in the sealed container are preferably 100 ppm or less, more preferably 10 ppm or less, and even more preferably 1 ppm or less. The oxygen (O 2 ) concentration and the water content in the sealed container can be adjusted by adjusting the oxygen concentration and the amount of water in the inert gas supplied into the sealed container. As the inert gas, nitrogen and argon are preferred, and nitrogen is more preferred. After the above-mentioned standing process, the surfaces and grain boundaries of the metal nitride-containing particles become stable. This makes it possible to suppress the occurrence of pinholes in the cured film obtained using the composition. In addition, the above-mentioned standing process can be replaced by the process H described in the method for producing metal nitride-containing particles. From the viewpoint that the composition has more excellent effects of the present invention, it is preferable to replace the process H.

<過濾製程> 過濾製程係藉由過濾器對藉由上述混合及分散製程製造之組成物進行過濾之製程。過濾製程中,能夠從組成物去除異物和/或減少缺陷。 作為過濾器,只要係一直以來用於過濾用途等者,則能夠不特別受限地使用。例如,可舉出基於PTFE (polytetrafluoroethylene:聚四氟乙烯)等氟樹脂、尼龍等聚醯胺系樹脂、聚乙烯、聚丙烯(PP)等聚烯烴樹脂(含有高密度、超高分子量)等之過濾器。該些原材料中,聚丙烯(含有高密度聚丙烯)、尼龍為較佳。 過濾器的孔徑為0.1~7.0μm程度為較適宜,0.2~2.5μm程度為較佳,0.2~1.5μm程度為更佳,0.3~0.7μm為進一步較佳。藉由設為該範圍,能夠抑制顔料的過濾堵塞,並且能夠可靠地去除顔料中包含之雜質或凝聚物等微細的異物。 使用過濾器時,可組合不同過濾器。此時,藉由第1過濾器的過濾可僅進行1次,亦可進行2次以上。組合不同過濾器來進行2次以上的過濾時,第2次之後的孔徑與第1次過濾的孔徑相比,相同或更大為較佳。並且,亦可組合在上述範圍內不同之孔徑的第1過濾器。此處的孔徑能夠參閱過濾器製造商的公稱值。作為市售的過濾器,例如,能夠從由NIHON PALL LTD.、Toyo Roshi Kaisha, Ltd.、Nihon Entegris K.K.(原Mykrolis Corpration)或KITZ MICROFILTER CORPORATION等提供之各種過濾器中選擇。 第2過濾器能夠使用由與上述第1過濾器相同的材料等形成者。第2過濾器的孔徑為0.2~10.0μm程度為較適宜,0.2~7.0μm程度為較佳,0.3~6.0μm程度為進一步較佳。<Filtration process> The filtration process is a process of filtering a composition manufactured by the above mixing and dispersing process through a filter. In the filtration process, foreign matter can be removed from the composition and / or defects can be reduced. The filter can be used without particular limitation as long as it has been conventionally used for filtering purposes and the like. Examples include fluororesins such as PTFE (polytetrafluoroethylene), polyamide resins such as nylon, and polyolefin resins (including high density and ultra high molecular weight) such as polyethylene and polypropylene (PP). filter. Among these raw materials, polypropylene (containing high-density polypropylene) and nylon are preferred. The pore diameter of the filter is preferably about 0.1 to 7.0 μm, more preferably about 0.2 to 2.5 μm, more preferably about 0.2 to 1.5 μm, and even more preferably 0.3 to 0.7 μm. By setting it as this range, it is possible to suppress filtration clogging of the pigment, and to reliably remove fine foreign matters such as impurities or aggregates contained in the pigment. When using filters, different filters can be combined. In this case, the filtration by the first filter may be performed only once, or may be performed twice or more. When two or more filtrations are performed by combining different filters, the pore diameter after the second filtration is preferably the same as or larger than the pore diameter of the first filtration. In addition, the first filters having different pore diameters within the above range may be combined. The pore size here can refer to the nominal value of the filter manufacturer. As commercially available filters, for example, various filters provided by NIHON PALL LTD., Toyo Roshi Kaisha, Ltd., Nihon Entegris K.K. (formerly Mykrolis Corpration), or KITZ MICROFILTER CORPORATION can be selected. The second filter can be formed using the same material as the first filter. The pore diameter of the second filter is preferably about 0.2 to 10.0 μm, more preferably about 0.2 to 7.0 μm, and more preferably about 0.3 to 6.0 μm.

[硬化膜(遮光膜)] 上述硬化膜使用上述組成物來獲得。上述硬化膜中包含含金屬氮化物的粒子。上述硬化膜適宜用作遮光膜,具體而言,適宜用於圖像感測器的受光部周邊部分的遮光。 以下,作為一例,對硬化膜用作圖像感測器的受光部周邊部分的遮光膜之情況進行說明。 上述遮光膜係使用上述組成物(尤其,上述感光性組成物)來形成者。使用上述組成物來獲得之遮光膜的解像性及電極的防腐性優異。[Hardened film (light-shielding film)] The hardened film is obtained using the above composition. The cured film contains metal nitride-containing particles. The cured film is suitably used as a light-shielding film, and specifically, is suitable for light-shielding a peripheral portion of a light-receiving portion of an image sensor. Hereinafter, a case where a cured film is used as a light-shielding film in a peripheral portion of a light-receiving portion of an image sensor will be described as an example. The said light-shielding film is formed using the said composition (especially the said photosensitive composition). The light-shielding film obtained by using the above composition is excellent in resolvability and electrode corrosion resistance.

作為遮光膜的膜厚,並無特別限定,從遮光膜具有更優異之本發明的效果之角度考慮,以乾燥後的膜厚計,0.2μm以上且50μm以下為較佳,0.3μm以上且10μm以下為更佳,0.3μm以上且5μm以下為進一步較佳。上述組成物的每單位體積的光學濃度較高(遮光性較高),故與以往使用黑色顏料之組成物相比,還能夠更加減小膜厚。 作為遮光膜的尺寸(設置於感測器受光部周邊之遮光膜的一邊的長度),從遮光膜具有更優異之本發明的效果之角度考慮,0.001mm以上且10mm以下為較佳,0.05mm以上且7mm以下為更佳,0.1mm以上且3.5mm以下為進一步較佳。上述組成物的每單位體積的光學濃度較高,故減少塗佈量等,有利於微細加工,且解像性及電極的防腐性優異,故能夠在上述範圍內尤其較佳地使用。The film thickness of the light-shielding film is not particularly limited. In view of the fact that the light-shielding film has more excellent effects of the present invention, the film thickness after drying is preferably 0.2 μm or more and 50 μm or less, and 0.3 μm or more and 10 μm. The following is more preferred, and more preferably 0.3 μm to 5 μm. The above-mentioned composition has a high optical density per unit volume (high light-shielding property), and therefore it is possible to further reduce the film thickness compared with a conventional composition using a black pigment. As the size of the light-shielding film (the length of one side of the light-shielding film provided around the light-receiving portion of the sensor), from the standpoint that the light-shielding film has more excellent effects of the present invention, 0.001 mm or more and 10 mm or less is preferred, and 0.05 mm It is more preferable that it is 7 mm or more, and it is more preferable that it is 0.1 mm or more and 3.5 mm or less. The above-mentioned composition has a high optical density per unit volume, so reducing the amount of coating, etc., is advantageous for microfabrication, and is excellent in resolvability and electrode corrosion resistance. Therefore, it can be used particularly preferably within the above range.

〔硬化膜的製造方法〕 接著,對上述硬化膜(遮光膜)的製造方法,將含有黑矩陣之濾色器的製造方法為例進行說明。 含有上述黑矩陣之濾色器在基板上含有使用上述組成物來獲得之硬化膜(黑矩陣)。 以下,對含有上述黑矩陣之濾色器的製造方法,按每個製程進行詳細說明。[Manufacturing Method of Cured Film] Next, a manufacturing method of the above-mentioned cured film (light-shielding film) will be described by taking a method of manufacturing a color filter including a black matrix as an example. The color filter containing the above-mentioned black matrix includes a cured film (black matrix) obtained by using the above composition on a substrate. Hereinafter, a method for manufacturing a color filter including the black matrix will be described in detail for each process.

含有上述黑矩陣之濾色器的製造方法含有以下的組成物層形成製程、曝光製程及顯影製程。 組成物層形成製程:在基板上塗佈上述組成物來形成組成物層(塗佈膜)之製程。 曝光製程:經由光罩(以下,還簡單稱作“遮罩”。)對上述組成物層進行曝光之製程。 顯影製程:對曝光之後的組成物層進行顯影來形成圖案狀的硬化膜(遮光膜)之製程。The manufacturing method of the color filter containing the said black matrix contains the following composition layer formation process, exposure process, and development process. Composition layer forming process: a process in which the above composition is coated on a substrate to form a composition layer (coating film). Exposure process: a process of exposing the composition layer through a photomask (hereinafter, also simply referred to as a “mask”). Development process: a process of developing the composition layer after exposure to form a patterned cured film (light-shielding film).

具體而言,直接或經由其他層,將上述組成物塗佈於基板上來形成組成物層(組成物層形成製程),經由規定的遮罩圖案進行曝光,僅使被光照射之塗佈膜部分硬化(曝光製程),藉由用顯影液進行顯影(顯影製程),藉此能夠製造本發明的濾色器。 以下,對含有上述黑矩陣之濾色器的製造方法中的各製程進行說明。Specifically, the composition is coated on a substrate directly or via another layer to form a composition layer (composition layer forming process), and exposure is performed through a predetermined mask pattern, and only a portion of the coating film irradiated with light is exposed. The color filter of the present invention can be produced by curing (exposure process) and developing with a developer (developing process). Hereinafter, each process in the manufacturing method of the color filter containing the said black matrix is demonstrated.

<組成物層形成製程> 組成物層形成製程係在基板上塗佈上述組成物來形成組成物層(塗佈膜)之製程。 作為基板,例如,用於液晶顯示裝置等之無鹼玻璃、鈉玻璃、Pyrex(註冊商標)玻璃、石英玻璃及對該些附著透明導電膜者、用於固態攝影元件等之光電轉換元件基板(例如,矽酮基板等)、CCD(Charge Coupled Device(電荷耦合元件))基板、以及CMOS(Complementary Metal-Oxide Semiconductor(互補型金屬氧化膜半導體))基板等。 並且,為了改善與上部層的黏附、防止物質的擴散或者基板表面的平坦化,可在該些基板上,依據需要設置底塗層。<Composition Layer Formation Process> The composition layer formation process is a process in which the composition is applied on a substrate to form a composition layer (coating film). As the substrate, for example, alkali-free glass, soda glass, Pyrex (registered trademark) glass, quartz glass used for liquid crystal display devices, and photoelectric conversion element substrates for solid-state imaging elements such as those with a transparent conductive film attached thereto ( Examples include silicone substrates, CCD (Charge Coupled Device) substrates, and CMOS (Complementary Metal-Oxide Semiconductor) substrates. In addition, in order to improve adhesion to the upper layer, prevent the diffusion of substances, or flatten the surface of the substrate, an undercoat layer may be provided on these substrates as needed.

作為向基板上塗佈上述組成物之塗佈方法,能夠適用狹縫塗佈法、噴墨法、旋塗法、流延塗佈法、輥塗法及網版印刷法等各種塗佈方法。As a coating method for applying the composition to a substrate, various coating methods such as a slit coating method, an inkjet method, a spin coating method, a cast coating method, a roll coating method, and a screen printing method can be applied.

製造固態攝影元件用的含有黑矩陣之濾色器時,作為組成物的塗佈膜厚,從解像性的觀點考慮,0.35μm以上且1.5μm以下為較佳,0.40μm以上且1.0μm以下為更佳。When manufacturing a black matrix-containing color filter for a solid-state imaging element, the coating film thickness of the composition is preferably 0.35 μm or more and 1.5 μm or less, and 0.40 μm or more and 1.0 μm or less from the viewpoint of resolution. For the better.

塗佈於基板上之組成物通常在70℃以上且110℃以下且2分鐘以上且4分鐘以下的程度的條件下進行乾燥。藉此,能夠形成組成物層。The composition applied to the substrate is usually dried under conditions of 70 ° C. to 110 ° C. and 2 minutes to 4 minutes. Thereby, a composition layer can be formed.

<曝光製程> 曝光製程係經由遮罩對在組成物層形成製程中形成之組成物層(塗佈膜)進行曝光,僅使被光照射之塗佈膜部分硬化之製程。 曝光藉由活性光線或放射線的照射來進行為較佳,尤其,可較佳地使用g射線、h射線及i射線等紫外線,高壓水銀燈為更佳。照射強度為5~1500mJ/cm2 為較佳,10~1000mJ/cm2 為更佳。並且,從提高解像性的觀點考慮,固態攝影元件用的遮光膜形成中,基於i射線步進機之曝光為較佳。<Exposure Process> The exposure process is a process of exposing the composition layer (coating film) formed in the composition layer forming process through a mask, and curing only a part of the coating film irradiated with light. The exposure is preferably performed by irradiation with active light or radiation. In particular, ultraviolet rays such as g-rays, h-rays, and i-rays can be preferably used, and a high-pressure mercury lamp is more preferable. The irradiation intensity is preferably 5 to 1500 mJ / cm 2, and more preferably 10 to 1000 mJ / cm 2 . In addition, from the viewpoint of improving the resolution, in the formation of a light-shielding film for a solid-state imaging element, exposure by an i-ray stepper is preferable.

<顯影製程> 接著曝光製程進行鹼顯影處理(顯影製程),使曝光製程中的光未照射部分溶出於鹼水溶液。藉此,僅殘留已光硬化之部分(被光照射之塗佈膜部分)。 作為顯影液,製作固態攝影元件用的含有黑矩陣之遮光性濾色器時,不會對基底的電路等帶來損傷之有機鹼顯影液為較佳。作為顯影溫度,通常為20~30℃,顯影時間為20~90秒。<Development process> Next, the alkali exposure process (development process) is performed in the exposure process, and the light irradiation part in an exposure process is melt | dissolved in the alkali aqueous solution. Thereby, only the light-hardened portion (the portion of the coating film irradiated with light) remains. As the developing solution, an organic alkali developing solution that does not cause damage to the circuit of the substrate or the like when producing a light-shielding color filter containing a black matrix for a solid-state imaging element is preferred. The development temperature is usually 20 to 30 ° C, and the development time is 20 to 90 seconds.

作為鹼性水溶液,例如,可舉出無機系顯影液及有機系顯影液。作為無機系顯影液,可舉出將氫氧化鈉、氫氧化鉀、碳酸鈉、碳酸氫鈉、矽酸鈉或偏矽酸鈉,溶解成濃度為0.001~10質量%,較佳地為0.01~1質量%之鹼性水溶液。作為有機系顯影液,可舉出將氨水、乙胺、二乙胺、二甲基乙醇胺、四甲基氫氧化銨、四乙基氫氧化銨、膽鹼、吡咯、哌啶或1,8-二氮雜雙環-[5.4.0]-7-十一碳烯等有機鹼性化合物,溶解成濃度為0.001~10質量%,較佳地為0.01~1質量%之鹼性水溶液。鹼性水溶液中,例如還能夠添加適量的甲醇及乙醇等水溶性有機溶劑和/或界面活性劑等。另外,使用包含該種鹼性水溶液之顯影液時,通常在顯影後以純水清洗(沖洗)為較佳。Examples of the alkaline aqueous solution include an inorganic developer and an organic developer. Examples of the inorganic developer include sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate, or sodium metasilicate, and the concentration thereof is 0.001 to 10% by mass, and preferably 0.01 to 1% by mass alkaline aqueous solution. Examples of the organic developer include ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline, pyrrole, piperidine, or 1,8- An organic basic compound such as diazabicyclo- [5.4.0] -7-undecene is dissolved into an alkaline aqueous solution having a concentration of 0.001 to 10% by mass, preferably 0.01 to 1% by mass. To the alkaline aqueous solution, for example, an appropriate amount of a water-soluble organic solvent such as methanol and ethanol and / or a surfactant can be added. In addition, when using a developing solution containing such an alkaline aqueous solution, it is usually preferable to wash (rinse) with pure water after development.

作為顯影方法,例如能夠利用旋覆浸沒顯影方法及噴淋顯影方法等。As a development method, a spin-on immersion development method, a shower development method, etc. can be used, for example.

另外,含有上述硬化膜(黑矩陣)之濾色器的製造方法可在上述顯影製程之後含有藉由加熱和/或曝光對硬化膜進行硬化之硬化製程。Moreover, the manufacturing method of the color filter containing the said hardened film (black matrix) may include the hardening process which hardens a hardened film by heating and / or exposure after the said development process.

含有上述硬化膜(黑矩陣)之濾色器的解像性及電極的防腐性優異。 藉此,含有上述硬化膜(黑矩陣)之濾色器適於CCD圖像感測器和/或CMOS圖像感測器等固態攝影元件。尤其適於超過100万像素之高解像性的CCD圖像感測器和/或CMOS圖像感測器等。亦即,含有上述硬化膜之濾色器適於固態攝影元件。並且,濾色器可含有如下結構,亦即,在藉由隔壁例如分割成格子狀之空間,埋入有形成各顏色像素之硬化膜。 上述硬化膜(黑矩陣)例如配置於構成CCD圖像感測器和/或CMOS圖像感測器等之各像素的受光部與用於聚光的微透鏡之間。The color filter containing the above-mentioned cured film (black matrix) is excellent in resolvability and electrode corrosion resistance. Accordingly, the color filter containing the cured film (black matrix) is suitable for a solid-state imaging element such as a CCD image sensor and / or a CMOS image sensor. It is particularly suitable for high-resolution CCD image sensors and / or CMOS image sensors of over 1 million pixels. That is, a color filter containing the cured film is suitable for a solid-state imaging element. In addition, the color filter may include a structure in which a hardened film forming each color pixel is embedded in a space partitioned into a grid shape by a partition wall, for example. The cured film (black matrix) is disposed, for example, between a light receiving portion of each pixel constituting a CCD image sensor and / or a CMOS image sensor, and a microlens for condensing light.

[固態攝影元件] 上述固態攝影元件含有上述硬化膜(黑矩陣)。上述固態攝影元件具有含有黑矩陣而且依據需要而含有包含其他顏色(3色或者4色)的像素之圖案狀皮膜之濾色器為較佳。 上述固態攝影元件只要含有上述黑矩陣且作為固態攝影元件發揮作用,則並無特別限制,例如,可舉出在基板上含有包含構成固態攝影元件(CCD圖像感測器及CMOS圖像感測器等)的受光區之複數個光電二極體及多晶矽等之受光元件,在基板的受光元件形成面的相反側的面含有上述黑矩陣之固態攝影元件。 並且,濾色器亦可具有如下結構,亦即,在藉由隔壁例如分割成格子狀之空間,埋入有形成各顏色像素之硬化膜。此時的隔壁相對於各顏色像素為低折射率為較佳。作為含有該種結構之攝像元件的例子,可舉出日本特開2012-227478號公報及特開2014-179577號公報中記載的固態攝影元件。[Solid-state imaging element] The solid-state imaging element includes the cured film (black matrix). The solid-state imaging element preferably includes a color filter including a black matrix and a pattern-shaped film including pixels of other colors (3 colors or 4 colors) as required. The solid-state imaging element is not particularly limited as long as it contains the black matrix and functions as a solid-state imaging element. For example, the solid-state imaging element may include a solid-state imaging element (CCD image sensor and CMOS image sensor) on the substrate. Light-receiving area, such as a plurality of photodiodes, polycrystalline silicon, and other light-receiving elements, the solid-state imaging element of the black matrix is included on the surface opposite to the light-receiving element formation surface of the substrate. In addition, the color filter may have a structure in which a hardened film forming each color pixel is embedded in a space partitioned into a grid shape by a partition wall, for example. It is preferable that the partition wall has a low refractive index for each color pixel. Examples of the imaging element including such a structure include solid-state imaging elements described in Japanese Patent Application Laid-Open No. 2012-227478 and Japanese Patent Application Laid-Open No. 2014-179577.

[圖像顯示裝置] 上述硬化膜適於液晶顯示裝置及有機電致發光顯示裝置等圖像顯示裝置。[Image display device] The cured film is suitable for an image display device such as a liquid crystal display device and an organic electroluminescence display device.

對於圖像顯示裝置的定義及各圖像顯示裝置的詳細內容,例如記載於“電子顯示裝置(佐佐木 昭夫著、Kogyo Chosakai Publishing CO., LTD. 1990年發行)”、“顯示裝置(伊吹 順章著、產業圖書(株)平成元年發行)”等中。並且,對於液晶顯示裝置,例如記載於“第二代液晶顯示器技術(內田 龍男編輯、Kogyo Chosakai Publishing CO., LTD. 1994年發行)”。上述硬化膜例如適於上述“第二代液晶顯示器技術”中記載之方式的液晶顯示裝置。The definition of image display devices and the details of each image display device are described in, for example, "Electronic display device (by Sasaki Akio, Kogyo Chosakai Publishing CO., LTD. 1990)", "Display device (Ibuki Junaki Book, Industrial Book Co., Ltd., published in the first year of Heisei) ". The liquid crystal display device is described in, for example, “Second-generation liquid crystal display technology (edited by Ryuo Uchida, Kogyo Chosakai Publishing CO., LTD., 1994)”. The cured film is suitable for, for example, a liquid crystal display device according to the method described in the "second generation liquid crystal display technology".

作為含有上述硬化膜之液晶顯示裝置的一態様,例如,至少1個係在光透射性的一對基板之間至少含有濾色器、液晶層及液晶驅動機構(含有單純矩陣驅動方式及有源矩陣驅動方式)之液晶顯示裝置。上述液晶顯示裝置含有複數個像素組,構成該像素組之各像素含有相互藉由上述硬化膜(黑矩陣)分離之濾色器。As one aspect of a liquid crystal display device including the cured film, for example, at least one of the light-transmitting pair of substrates includes at least a color filter, a liquid crystal layer, and a liquid crystal driving mechanism (including a simple matrix driving method and an active device). Matrix driving method). The liquid crystal display device includes a plurality of pixel groups, and each pixel constituting the pixel group includes a color filter separated from each other by the hardened film (black matrix).

並且,作為上述液晶顯示裝置的其他態様,至少1個係在光透射性的一對基板之間至少含有濾色器、液晶層及液晶驅動機構,液晶驅動機構含有有源元件(例如,TFT(Thin Film Transistor(薄膜晶體管))),且各有源元件之間包含含有上述硬化膜(黑矩陣)之濾色器。In addition, as another aspect of the liquid crystal display device, at least one of the light-transmitting pair of substrates includes at least a color filter, a liquid crystal layer, and a liquid crystal driving mechanism. The liquid crystal driving mechanism includes an active element (for example, a TFT ( Thin Film Transistor)), and each active element includes a color filter containing the hardened film (black matrix) described above.

含有上述硬化膜之濾色器適於彩色TFT(Thin Film Transistor(薄膜晶體管))方式的液晶顯示裝置。對於彩色TFT方式的液晶顯示裝置,例如記載於“彩色TFT液晶顯示器(KYORITSU SHUPPAN CO., LTD.1996年發行)”。而且,上述濾色器還適於:IPS(In Plane Switching(平面轉換))等橫向電場驅動方式;MVA(Multi-domain Vertical Alignment(多域垂直對準))等像素分割方式;等視角被擴大之液晶顯示裝置、STN(Super-Twist Nematic(超扭曲向列))、TN(Twisted Nematic(扭曲向列))、VA(Vertical Alignment(豎向定線))、OCS(on-chip spacer(片上間隔))、FFS(fringe field switching(邊緣場開關))及R-OCB(Reflective Optically Compensated Bend(反射式光學補償彎管))等。The color filter including the cured film is suitable for a color TFT (Thin Film Transistor) liquid crystal display device. A color TFT-type liquid crystal display device is described in, for example, "color TFT liquid crystal display (KYORITSU SHUPPAN CO., LTD. 1996)". In addition, the above color filters are also suitable for: lateral electric field driving methods such as IPS (In Plane Switching); pixel segmentation methods such as MVA (Multi-domain Vertical Alignment); and other perspectives are enlarged LCD display device, STN (Super-Twist Nematic), TN (Twisted Nematic), VA (Vertical Alignment), OCS (on-chip spacer) Interval)), FFS (fringe field switching) and R-OCB (Reflective Optically Compensated Bend).

上述濾色器適於明亮且高精細的COA(Color-filter On Array(濾色器陣列))方式的液晶顯示裝置。關於COA方式的液晶顯示裝置,對於濾色器之要求特性,除了通常的要求特性以外,有時還要求對於層間絶縁膜之要求特性,亦即,低介電常數及剝離液耐性。含有上述濾色器之COA方式的液晶顯示裝置具有更優異之解像性,或具有更優異之耐久性。另外,為了滿足低介電常數的要求特性,可在濾色器層上進一步含有樹脂覆膜。The color filter is suitable for a bright and high-definition COA (Color-filter On Array) type liquid crystal display device. In the liquid crystal display device of the COA method, the required characteristics of the color filter may require the required characteristics of the interlayer insulation film in addition to the usual required characteristics, that is, the low dielectric constant and the resistance to the release liquid. The COA-type liquid crystal display device including the color filter has more excellent resolvability or more excellent durability. In addition, in order to meet the required characteristics of a low dielectric constant, a resin film may be further included on the color filter layer.

對於該些圖像顯示方式,例如記載於“EL、PDP、LCD顯示器-技術與市場的最新動向-(TORAY Research Center,Inc.調查研究部門2001年發行)”的43頁等。另外,上述中,EL表示Electroluminescence(電致發光)的省略,PDP表示Plasma Display Panel的省略,LCD表示liquid crystal display(液晶顯示器)的省略。These image display methods are described in, for example, page 43 of "EL, PDP, and LCD Display-Latest Trends in Technology and Market-(TORAY Research Center, Inc. Survey and Research Division 2001)". In the above, EL means omission of Electroluminescence, PDP means omission of Plasma Display Panel, and LCD means omission of liquid crystal display.

上述液晶顯示裝置除了上述濾色器以外,亦可由電極基板、偏光膜、相位差膜、背光、間隔物及視角保護膜等各種構件構成。上述濾色器能夠適用於由該些公知構件構成之液晶顯示裝置。對於該些構件,例如記載於“’94液晶顯示器周邊材料・化學製品市場(島 健太郎CMC-Group. 1994年發行)”、“2003液晶関連市場的現狀與未來展望(下卷)(表良吉Fuji Chimera Research Institute, Inc.、2003年發行)”。 關於背光,記載於SID meeting Digest 1380(2005)(A.Konno et.al)和月刊顯示器2005年12月號的18~24頁(島 康裕)、月刊顯示器2005年12月號的25~30頁(八木隆明)等。The liquid crystal display device may include various members such as an electrode substrate, a polarizing film, a retardation film, a backlight, a spacer, and a viewing angle protective film in addition to the color filter. The color filter can be applied to a liquid crystal display device including these known members. These components are described in, for example, "'94 Liquid Crystal Display Peripheral Materials and Chemicals Market (Shimadaro CMC-Group. Issued in 1994)", "Current Status and Future Outlook of the Liquid Crystal Related Market in 2003 (Volume 2) (Table Ryoji Fuji Chimera Research Institute, Inc., 2003). " The backlight is described in SID meeting Digest 1380 (2005) (A. Konno et.al) and the monthly display of December 2005, pages 18 to 24 (Island Kangyu), and the monthly display of December 2005, pages 25 to 30. (Yaki Takaki) and so on.

並且,上述硬化膜適於個人計算機、平板電腦、移動電話、智能手機及數位相機等便攜式設備;多功能打印機及掃描儀等OA(Office Automation(辦公室自動化))設備;監視攝影機、條碼讀取器及自動存提款機(ATM:automated teller machine)、高速相機及使用人臉圖像認證之本人認證等產業用設備;車載用相機設備;內窺鏡、膠囊內窺鏡及導管等醫療用相機設備;生物體感測器、生物感測器(Biosensor)、軍事偵查用相機、立體地圖用相機、氣象及海洋觀測相機、陸地資源偵查相機、以及宇宙的天文及深空目標用勘探相機等航天設備等中使用之光學濾波器及模組的遮光構件及遮光層,進一步適於防反射構件以及防反射層。In addition, the above-mentioned cured film is suitable for portable devices such as personal computers, tablet computers, mobile phones, smart phones, and digital cameras; OA (Office Automation) devices such as multifunction printers and scanners; surveillance cameras, and bar code readers And industrial teller machines (ATM: automated teller machine), high-speed cameras, and personal authentication using face image authentication; automotive camera equipment; medical cameras such as endoscopes, capsule endoscopes, and catheters Equipment; biosensors, biosensors, military surveillance cameras, stereo map cameras, meteorological and ocean observation cameras, land resource surveillance cameras, and space astronomy and deep space target exploration cameras The light-shielding members and light-shielding layers of optical filters and modules used in equipment are further suitable for anti-reflection members and anti-reflection layers.

上述硬化膜還能夠使用於微型LED(Light Emitting Diode)及微型OLED(Organic Light Emitting Diode)等用途。上述硬化膜除了微型LED及微型OLED中使用之光學濾波器及光學薄膜以外,還適於賦予遮光功能或防反射功能之構件。 作為微型LED及微型OLED的例子,可舉出日本特表2015-500562號及日本特表2014-533890中記載者。The cured film can also be used in applications such as micro LED (Light Emitting ode Diode) and micro OLED (Organic Light Emitting Diode). In addition to the optical filters and optical films used in micro LEDs and micro OLEDs, the cured film is also suitable for members that provide a light-shielding function or an anti-reflection function. Examples of micro LEDs and micro OLEDs include those described in Japanese Patent Publication No. 2015-500562 and Japanese Patent Publication No. 2014-533890.

上述硬化膜適合作為量子點顯示器中使用之光學濾波器及光學薄膜。並且,適合作為賦予遮光功能及防反射功能之構件。 作為量子點顯示器的例子,可舉出美國專利申請公開第2013/0335677號、美國專利申請公開第2014/0036536號、美國專利申請公開第2014/0036203號及美國專利申請公開第2014/0035960號中記載者。 [實施例]The cured film is suitable as an optical filter and an optical film used in a quantum dot display. Furthermore, it is suitable as a member which provides a light shielding function and an antireflection function. Examples of quantum dot displays include U.S. Patent Application Publication No. 2013/0335677, U.S. Patent Application Publication No. 2014/0036536, U.S. Patent Application Publication No. 2014/0036203, and U.S. Patent Application Publication No. 2014/0035960 Recorder. [Example]

以下,依據實施例,對上述組成物等進行更詳細說明。關於以下的實施例所示之材料、使用量、比例、處理內容、處理步驟等,只要不脫離本發明的宗旨,則能夠適當變更。藉此,本發明的範圍並不應藉由以下示出之實施例限定性地解釋。Hereinafter, the above-mentioned composition and the like will be described in more detail based on examples. The materials, usage amounts, proportions, processing contents, processing steps, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Accordingly, the scope of the present invention should not be interpreted restrictively by the embodiments shown below.

[含金屬氮化物的粒子P-1的製作] 藉由以下的方法製作了含金屬氮化物的粒子P-1。 首先,準備作為過渡金屬含有鈮之Mituwa Chemistry.製造的鈮(粉末)<100-325mesh>作為原料(以下,還稱作“金屬原料粉末”。)。接著,藉由ICP發光分光分析法分析了該金屬原料粉末中包含之雜質的含量。另外,ICP發光分光分析法中,利用了Seiko Instruments Inc.製造的ICP發光分光分析装置“SPS3000”(商品名)。[Production of Metal Nitride-Containing Particles P-1] The metal nitride-containing particles P-1 were produced by the following method. First, niobium (powder) <100-325 mesh> manufactured by Mituwa Chemistry, which contains niobium as a transition metal, is prepared as a raw material (hereinafter, also referred to as "metal raw material powder"). Next, the content of impurities contained in the metal raw material powder was analyzed by ICP emission spectroscopic analysis. In the ICP emission spectroscopic analysis method, an ICP emission spectroscopic analysis device "SPS3000" (trade name) manufactured by Seiko Instruments Inc. was used.

接著,將上述金屬原料粉末在Ar氣中進行電漿處理(處理條件基於下述的電漿處理(1))來進行了金屬微粒化。測定了所獲得之金屬微粒的平均一次粒徑,其結果,為80nm。另外,平均一次粒徑藉由以下方法求出。 試料:藉由與後述之[含金屬氮化物的粒子分散液的製備]相同的方法製備分散液(金屬微粒25質量%、下述分散劑A7.5質量%、PGMEA;丙二醇單甲醚乙酸酯溶劑67.5質量%),藉由PGMEA將所獲得之分散液稀釋100倍之後,滴加在碳箔上並使其乾燥者。 利用透射型電子顯微鏡(TEM:Transmission Electron Microscope),以倍率2万倍觀察上述試料來獲得了圖像。藉由圖像處理計算出了所獲得之圖像中的金屬微粒的面積。接著,計算出將所獲得之面積換算為圓時的直徑。對4視場量、總計400個(在各視場確認到約3000個金屬微粒)金屬微粒進行該操作,對所評價之圓換算的直徑進行算術平均來作為金屬微粒的平均一次粒徑。Next, the metal raw material powder was subjected to a plasma treatment in Ar gas (processing conditions are based on the following plasma treatment (1)) to perform metal micronization. When the average primary particle diameter of the obtained metal fine particles was measured, it was 80 nm. The average primary particle diameter was determined by the following method. Sample: A dispersion liquid (metal fine particles 25% by mass, the following dispersant A7.5% by mass, PGMEA; propylene glycol monomethyl ether acetic acid) was prepared by the same method as [Preparation of metal nitride-containing particle dispersion liquid] described later. Ester solvent (67.5% by mass), and the obtained dispersion was diluted 100 times with PGMEA, and then the solution was dropped on a carbon foil and dried. The transmission electron microscope (TEM: Transmission Electron Microscope) was used to observe the sample at a magnification of 20,000 times to obtain an image. The area of the metal particles in the obtained image was calculated by image processing. Next, the diameter when the obtained area was converted into a circle was calculated. This operation was performed on a total of 400 metal particles of 4 fields of view (about 3,000 metal particles were confirmed in each field of view), and the circle-evaluated diameter was arithmetically averaged as the average primary particle diameter of the metal particles.

並且,藉由上述方法測定了金屬微粒中包含之雜質,其結果,未檢測出雜質。另外,藉由上述方法未檢測出雜質表示雜質的含量相對於金屬微粒的總質量小於20ppm。In addition, the impurities contained in the metal fine particles were measured by the above method. As a result, no impurities were detected. In addition, if no impurity is detected by the above method, the content of the impurity is less than 20 ppm with respect to the total mass of the metal fine particles.

<電漿處理(1)> 藉由以下方法進行了電漿處理(1)。亦即,將依據國際公開第2010/147098號小冊子的圖1中記載的黑色複合微粒製造装置之装置用作金屬微粒製造装置,依據以下條件進行了電漿處理(1)。 ・對高頻振蕩用線圈施加之高頻電壓:頻率、約4MHz、電壓、約80kVA・電漿氣體:氬氣(供給量 100L/min) ・載體氣體:氬氣(供給量 10L/min) ・腔室內氛圍:氬氣(供給量 1000L/min、腔室內流速 5m/sec) ・旋風分離器內氛圍:氬氣、內壓:50kPa ・從腔室向旋風分離器供給材料的速度:10m/s(平均值)<Plasma treatment (1)> Plasma treatment (1) was performed by the following method. That is, the apparatus according to the black composite fine particle manufacturing apparatus described in FIG. 1 of the International Publication No. 2010/147098 pamphlet was used as a metal fine particle manufacturing apparatus, and plasma processing was performed under the following conditions (1).・ High-frequency voltage applied to the coil for high-frequency oscillation: frequency, about 4MHz, voltage, about 80kVA ・ plasma gas: argon (supply amount 100L / min) ・ carrier gas: argon (supply amount 10L / min) ・Atmosphere in the chamber: Argon (supply amount 1000L / min, flow velocity in the chamber 5m / sec) ・ Atmosphere in the cyclone: Argon, internal pressure: 50kPa ・ Speed of supplying material from the chamber to the cyclone: 10m / s (average value)

接著,作為含有原子A之原料粉末,準備Fe粉JFE STEEL CORPORATION製造的JIP 270M,依據上述電漿處理(1)的條件進行電漿處理來使原子A微粒化。此時,藉由與上述相同的方法測定了所獲得之微粒中包含之雜質,其結果,未檢測出雜質。Next, as a raw material powder containing atom A, Fe powder JIP 270M manufactured by JFE Steel Corporation was prepared, and plasma treatment was performed under the conditions of the above plasma treatment (1) to atomize A. At this time, the impurities contained in the obtained fine particles were measured by the same method as described above, and as a result, no impurities were detected.

接著,混合藉由上述來獲得之金屬微粒及已微粒化之原子A,從而獲得了原料金屬粉末。對於該原料金屬粉末,藉由在氮氣中進行電漿處理(處理條件依據下述的電漿處理(2))來獲得了含金屬氮化物的粒子。Next, the metal fine particles obtained by the above and atomized atom A were mixed to obtain a raw metal powder. This raw metal powder was subjected to a plasma treatment in nitrogen (processing conditions are based on the plasma treatment (2) described below) to obtain metal nitride-containing particles.

<電漿處理(2)> 藉由以下方法進行了電漿處理(2)。另外,所使用之装置與電漿處理(1)相同。 ・對高頻振蕩用線圈施加之高頻電壓:頻率、約4MHz、電壓、約80kVA・電漿氣體:氬氣及氮氣(供給量 分別為50L/min) ・載體氣體:氮氣(供給量 10L/min) ・腔室內氛圍:氮氣(供給量 1000L/min、腔室內流速 5m/sec) ・旋風分離器內氛圍:氮氣、內壓 50kPa ・從腔室向旋風分離器供給材料的速度:10m/s(平均值)<Plasma treatment (2)> Plasma treatment (2) was performed by the following method. In addition, the equipment used is the same as the plasma treatment (1).・ High-frequency voltage applied to the coil for high-frequency oscillation: frequency, about 4MHz, voltage, about 80kVA ・ plasma gas: argon and nitrogen (supply amounts are 50L / min) ・ carrier gas: nitrogen (supply amount 10L / min) ・ Atmosphere in the chamber: Nitrogen (supply amount 1000L / min, flow velocity in the chamber 5m / sec) ・ Atmosphere in the cyclone: Nitrogen, internal pressure 50kPa ・ Speed of supplying material from the chamber to the cyclone: 10m / s (average value)

利用Ar氣,將結束電漿處理(2)之後的含金屬氮化物的粒子,藉由NIHON SHINTECH CO., LTD.製造的分流型濕度供給裝置SRH,在若在大氣中則成為相對濕度95%之條件下導入20℃的氮氣,並靜置24小時。之後,利用Hosokawa Micron Group製造的TTSP分離器,以產率成為10%之條件,對所獲得之含金屬氮化物的粒子進行分級,從而獲得了含金屬氮化物的粒子P-1的粉末。另外,向分離器供給了氮氣。Using Ar gas, the metal nitride-containing particles after the plasma treatment (2) is completed, the relative humidity of 95% in the atmosphere through the split-type humidity supply device SRH manufactured by NIHON SHINTECH CO., LTD. Under the conditions, nitrogen at 20 ° C was introduced and left to stand for 24 hours. Thereafter, the obtained metal nitride-containing particles were classified using a TTSP separator manufactured by Hosokawa Micron Group under the condition that the yield became 10%, thereby obtaining a powder of metal nitride-containing particles P-1. In addition, nitrogen was supplied to the separator.

測定了含金屬氮化物的粒子P-1的平均一次粒徑,其結果,為12nm。並且,測定了含金屬氮化物的粒子P-1的導電率,其結果,為180×104 S/m。 另外,平均一次粒徑係藉由上述方法測定之平均一次粒徑。 另外,上述導電率係藉由下述方法測定之導電率。 導電率的測定利用Mitsubishi Chemical Analytech CO., LTD.製造的粉體電阻測定系統MCP-PD51,藉由下述方法測定。 首先,將1g含金屬氮化物的粒子裝入上述測定装置的φ20mm的測定容器之後,開始加壓,將壓力變更為0kN、1kN、5kN、10kN、20kN來測定了粒子的體積電阻率(ρ)。從其測定結果求出體積電阻率不受壓力影響之條件下的飽和體積電阻率,利用所獲得之飽和體積電阻率,藉由σ=1/ρ的關係式計算出了導電率(σ)。另外,上述試驗在室溫環境下進行。The average primary particle diameter of the metal nitride-containing particles P-1 was measured. As a result, it was 12 nm. The conductivity of the metal nitride-containing particles P-1 was measured. As a result, it was 180 × 10 4 S / m. The average primary particle diameter is the average primary particle diameter measured by the method described above. In addition, the said electric conductivity is the electric conductivity measured by the following method. The measurement of the electrical conductivity was measured by the following method using a powder resistance measurement system MCP-PD51 manufactured by Mitsubishi Chemical Analytech CO., LTD. First, 1 g of metal nitride-containing particles were charged into a φ20 mm measuring container of the above-mentioned measuring device, and then pressure was started. The pressure was changed to 0 kN, 1 kN, 5 kN, 10 kN, and 20 kN to measure the volume resistivity (ρ) of the particles. . From the measurement results, the saturation volume resistivity under the condition that the volume resistivity is not affected by the pressure is obtained. Using the obtained saturation volume resistivity, the conductivity (σ) is calculated from the relationship of σ = 1 / ρ. The above-mentioned test was performed under a room temperature environment.

[含金屬氮化物的粒子P-2~P-7、P-C1及P-C5的製作] 將原子A的含量設為如表1中記載,除此以外,藉由與含金屬氮化物的粒子P-1相同的方法製作了含金屬氮化物的粒子P-2~P-7、P-C1及P-C5。 另外,上述含金屬氮化物的粒子的製作中的金屬微粒的平均一次粒徑、含金屬氮化物的粒子的平均一次粒徑及導電率綜合示於表1。[Production of Metal Nitride-Containing Particles P-2 to P-7, P-C1, and P-C5] In addition to setting the content of the atom A as described in Table 1, the content of the atom A was determined by comparing with the metal nitride-containing particles. Particle P-1 was produced in the same manner as metal nitride-containing particles P-2 to P-7, P-C1, and P-C5. In addition, the average primary particle diameter of the metal fine particles, the average primary particle diameter of the metal nitride-containing particles, and the electrical conductivity during the production of the metal nitride-containing particles are shown in Table 1.

[含金屬氮化物的粒子P-C2的製作] 未向過渡金屬原料添加原子A,除此以外,藉由與含金屬氮化物的粒子P-1相同的方法製作了含金屬氮化物的粒子P-C2。 另外,上述含金屬氮化物的粒子的製作中的金屬微粒的平均一次粒徑、含金屬氮化物的粒子的平均一次粒徑及導電率綜合示於表1。[Production of Metal Nitride-Containing Particles P-C2] A metal nitride-containing particle P was produced by the same method as the metal nitride-containing particle P-1 except that atom A was not added to the transition metal raw material. -C2. In addition, the average primary particle diameter of the metal fine particles, the average primary particle diameter of the metal nitride-containing particles, and the electrical conductivity during the production of the metal nitride-containing particles are shown in Table 1.

[含金屬氮化物的粒子P-8~P-15的製作] 使用表1所示之過渡金屬原料,將原子A的含量設為如表1中記載,除此以外,藉由與含金屬氮化物的粒子P-1相同的方法製作了含金屬氮化物的粒子P-8~P-15。 另外,上述含金屬氮化物的粒子的製作中的金屬微粒的平均一次粒徑、含金屬氮化物的粒子的平均一次粒徑及導電率綜合示於表1。[Production of Metal Nitride-Containing Particles P-8 to P-15] The transition metal raw materials shown in Table 1 were used, and the content of atom A was set as described in Table 1. In addition to this, metal nitrogen-containing particles were used. The particles P-1 of the compound were prepared in the same manner as the particles P-8 to P-15 of the metal nitride. In addition, the average primary particle diameter of the metal fine particles, the average primary particle diameter of the metal nitride-containing particles, and the electrical conductivity during the production of the metal nitride-containing particles are shown in Table 1.

[含金屬氮化物的粒子P-C3及P-C4的製作] 代替過渡金屬原料使用表1所示之各原料,未添加原子A,除此以外,藉由與含金屬氮化物的粒子P-1相同的方法製作了含金屬氮化物的粒子P-C3及P-C4。 另外,上述含金屬氮化物的粒子的製作中的金屬微粒的平均一次粒徑、含金屬氮化物的粒子的平均一次粒徑及導電率綜合示於表1。[Preparation of Metal Nitride-Containing Particles P-C3 and P-C4] Instead of the transition metal raw material, each of the raw materials shown in Table 1 was used, and atom A was not added. 1 In the same manner, metal nitride-containing particles P-C3 and P-C4 were produced. In addition, the average primary particle diameter of the metal fine particles, the average primary particle diameter of the metal nitride-containing particles, and the electrical conductivity during the production of the metal nitride-containing particles are shown in Table 1.

表1中的過渡金屬原料等及原子A的原料中的各略號如下。The abbreviations in the transition metal raw materials and the like in Table 1 and the raw materials of the atom A are as follows.

・Nb粉:Mituwa Chemistry.製造的鈮(粉末)<100-325mesh> ・V粉:TAIYO KOKO Co., LTD.製造的金屬釩粉末VHO ・Zr粉:Wako Pure Chemical Industries, Ltd.製造的鋯粉末 ・鉭Nodular:Global Advanced Metal製造的鉭Nodular ・Hf粉:Furuuchi Chemical Corporation製造的鉿粉末 ・Y粉:NIPPON YTTRIUM CO., LTD.製造的釔粉末 ・Cr粉:Copyright Kosei Pharmaceutical CO., LTD.製造的脫氣電解金屬鉻粉 ・Re粉:Rhenium Alloys, Inc.製造的錸粉末 ・W粉:Eurotungsten製造的鎢粉末AW3110 ・Al粉:METAL POWDER CO., LTD.製造的鋁粉末No.22000 ・Si粉:Furuuchi Chemical Corporation製造的矽粉末 ・Fe粉:Fe粉JFE STEEL CORPORATION製造的JIP 270M ・Ni粉:Ni粉 Toho Titanium Corporation製造的300奈米品 ・Ag粉:Ag粉Mitsui Mining & Smelting Co., Ltd.製造的SPQ03R・ Nb powder: Niobium (powder) made by Mituwa Chemistry. <100-325mesh> ・ V powder: Metal vanadium powder VHO made by TAIYO KOKO Co., LTD. ・ Zr powder: Zirconium powder made by Wako Pure Chemical Industries, Ltd.・ Tantalum Nodular: Tantalum Nodular manufactured by Global Advanced Metal ・ Hf powder: Hafnium powder manufactured by Furuchi Chemical Corporation ・ Y powder: Yttrium powder manufactured by NIPPON YTTRIUM CO., LTD. ・ Cr powder: manufactured by Copyright Kosei Pharmaceutical CO., LTD. Degassing electrolytic metal chromium powder Re powder: Rhenium alloy powder manufactured by Rhenium Alloys, Inc. W powder: tungsten powder AW3110 manufactured by Eurotungsten ・ Al powder: aluminum powder No. 22000 manufactured by METAL POWDER CO., LTD. Powder: Silicon powder manufactured by Furuchi Chemical Corporation ・ Fe powder: Fe powder JIP 270M manufactured by JFE STEEL CORPORATION ・ Ni powder: Ni powder 300 nm product manufactured by Toho Titanium Corporation ・ Ag powder: Ag powder Mitsui Mining & Smelting Co., Ltd. made SPQ03R

另外,以下的表1中的“ppm”表示質量ppm。 並且,表中,“未檢測出”表示藉由上述測定方法測定之結果,未檢測出雜質,具體而言,表示小於20質量ppm。並且,“未添加”表示為添加原子A,“未測定”表示由於未添加上述原子A,因而未進行測定。藉此,“未測定”表示實際上小於20質量ppm(計算上為小於5質量ppm)。In addition, "ppm" in the following Table 1 represents mass ppm. In addition, in the table, "not detected" indicates a result of measurement by the above-mentioned measurement method, no impurity was detected, and specifically, less than 20 mass ppm. In addition, "not added" means that the atom A is added, and "not measured" means that the above-mentioned atom A is not added, so the measurement is not performed. By this, "not measured" means that it is actually less than 20 mass ppm (calculated to be less than 5 mass ppm).

[表1] [Table 1]

<分散劑> 作為分散劑,使用了以下結構的分散劑A~C。分散劑A及C中,各結構單元中記載的數值表示相對於所有結構單元之各結構單元的質量%。分散劑B中,各結構單元中記載的文字表示相對於所有結構單元之各結構單元的mol%。<Dispersant> As the dispersant, dispersants A to C having the following structures were used. In the dispersants A and C, the numerical value described in each structural unit represents the mass% of each structural unit with respect to all the structural units. In Dispersant B, the characters described in each structural unit represent the mol% of each structural unit with respect to all the structural units.

・分散劑A [化學式21] ・ Dispersant A [Chemical Formula 21]

・分散劑B [化學式22] ・ Dispersant B [Chemical Formula 22]

・分散劑C [化學式23] ・ Dispersant C [Chemical Formula 23]

<黏結樹脂> 作為黏結樹脂,使用了以下樹脂A及樹脂B。以下,分別示出樹脂A及樹脂B的結構。樹脂A及樹脂B中,各結構單元中記載的數字表示相對於所有結構單元之各結構單元的mol%。<Adhesive resin> As the adhesive resin, the following resin A and resin B were used. The structures of resin A and resin B are shown below. In Resin A and Resin B, the number described in each structural unit represents the mol% of each structural unit with respect to all the structural units.

・樹脂A:Akurikyua RD-F8(商品名、NIPPON SHOKUBAI CO., LTD.製造) [化學式24] ・ Resin A: Akurikuya RD-F8 (trade name, manufactured by NIPPON SHOKUBAI CO., LTD.) [Chemical Formula 24]

・樹脂B [化學式25] ・ Resin B [Chemical Formula 25]

上述樹脂B的式中,各略號表示以下內容。 BzMA:甲基丙烯酸芐酯 MMA:甲基丙烯酸甲酯 HEMA:甲基丙烯酸-2-羥基乙酯In the formula of the resin B, each abbreviation indicates the following. BzMA: benzyl methacrylate MMA: methyl methacrylate HEMA: 2-hydroxyethyl methacrylate

<聚合性化合物> ・聚合性化合物M1:二季戊四醇六丙烯酸酯(Nippon Kayaku CO., LTD.製造、商品名“KAYARAD”、參閱下述式) [化學式26] <Polymerizable compound> ・ Polymerizable compound M1: dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku CO., LTD., Trade name "KAYARAD", see formula below) [Chemical formula 26]

・聚合性化合物M2:PET-30(季戊四醇三丙烯酸酯、Nippon Kayaku CO., LTD.製造)・ Polymerizable compound M2: PET-30 (Pentaerythritol triacrylate, manufactured by Nippon Kayaku CO., LTD.)

<聚合起始劑> ・OXE-02:Irgacure OXE02(商品名、BASF Japan Ltd製造)<Polymerization initiator> ・ OXE-02: Irgacure OXE02 (trade name, manufactured by BASF Japan Ltd)

<聚合抑制劑> ・PMF:對甲氧基苯酚<Polymerization inhibitor> ・ PMF: p-methoxyphenol

<界面活性劑> ・F-556:Megafac F-556(DIC CORPORATION製造)<Surfactant> ・ F-556: Megafac F-556 (manufactured by DIC Corporation)

<有機溶劑> ・PGMEA:丙二醇單甲醚乙酸酯 ・CPN:環戊酮 ・乙酸Bu:乙酸丁酯<Organic solvents> ・ PGMEA: propylene glycol monomethyl ether acetate ・ CPN: cyclopentanone ・ Bu acetate: butyl acetate

[含金屬氮化物的粒子分散液的製備] 首先,藉由攪拌機(IKA Works GmbH & CO. KG製造EUROSTAR),將含金屬氮化物的粒子、分散劑及有機溶劑混合15分鐘來獲得了上述成分的混合液。接著,對所獲得之混合液,使用SHINMARU ENTERPRISES CORPORATION製造的NPM-Pilot,在下述條件下進行分散處理來獲得了含金屬氮化物的粒子分散液。另外,以分散劑相對於含金屬氮化物的粒子之質量比(D/P)成為表3的實施例及比較例所示之值之方式進行了添加。[Preparation of Metal Nitride-Containing Particle Dispersion Liquid] First, the metal nitride-containing particles, a dispersant, and an organic solvent were mixed for 15 minutes with a mixer (EURA manufactured by IKA Works GmbH & CO. KG) to obtain the above-mentioned components. Mixed liquid. Next, the obtained mixed liquid was subjected to a dispersion treatment under the following conditions using NPM-Pilot manufactured by SHINMARU ENTERPRISES CORPORATION to obtain a metal nitride-containing particle dispersion liquid. Moreover, it added so that the mass ratio (D / P) of a dispersing agent with respect to the metal nitride containing particle may become the value shown in the Example and the comparative example of Table 3.

<分散條件> ・微珠徑:φ0.05mm、(NIKKATO CORPORATION製造氧化鋯珠、YTZ) ・微珠填充率:65體積% ・研磨圓周速度:10m/sec ・分離器圓周速度:13m/s ・進行分散處理之混合液量:15kg ・循環流量(泵供給量):90kg/hour ・處理液溫度:19~21℃ ・冷卻水:水 ・處理時間:22小時左右<Dispersion conditions> ・ Bead diameter: φ0.05mm, (zirconia beads, YTZ manufactured by NIKKATO CORPORATION) ・ Bead filling rate: 65% by volume ・ Grinding peripheral speed: 10m / sec ・ Separator peripheral speed: 13m / s ・Amount of mixed liquid for dispersion treatment: 15kg • Circulation flow (pump supply): 90kg / hour • Temperature of treatment liquid: 19 ~ 21 ℃ • Cooling water: Water • Treatment time: about 22 hours

[組成物的製備] 接著,混合並攪拌上述含金屬氮化物的粒子分散液、黏結樹脂、聚合性化合物、聚合起始劑、聚合抑制劑及界面活性劑,獲得了下述表2及3所示之實施例及比較例的各組成物。另外,表2中的各成分的含量均為質量%。[Preparation of composition] Next, the above-mentioned metal nitride-containing particle dispersion liquid, a binding resin, a polymerizable compound, a polymerization initiator, a polymerization inhibitor, and a surfactant were mixed and stirred, and the following Tables 2 and 3 were obtained. Each composition of Examples and Comparative Examples is shown. In addition, the content of each component in Table 2 is all by mass.

[表2][Table 2]

<組成物中的水分量的測定> 關於實施例及比較例的各組成物的水分量,藉由以Karl Fischer 方法作為測定原理之MKV-710(商品名、KYOTO ELECTRONICS INDUSTRY CO., LTD.製造)進行了測定。將結果示於表3。<Measurement of Moisture Content in Composition> About the moisture content of each composition in Examples and Comparative Examples, MKV-710 (trade name, KYOTO ELECTRONICS INDUSTRY CO., LTD.) ). The results are shown in Table 3.

[評價試驗] 對實施例及比較例的各組成物進行了以下的各評價試驗。將結果綜合示於表3。[Evaluation Test] The following evaluation tests were performed on each composition of Examples and Comparative Examples. The results are shown in Table 3.

〔OD值〕 在厚度0.7mm、10cm方形的玻璃板(EagleXG,Corning Incorporated製造)上,使用各組成物,藉由旋轉塗佈形成了塗膜。此時,依據各組成物的固體成分濃度,以膜厚成為1.5μm之方式調整了轉速。將所形成之塗膜,在加熱板上藉由100℃、2分鐘的熱處理使其乾燥,從而獲得了硬化膜。對含有所獲得之硬化膜之基板,藉由分光光度計U-4100(Hitachi High-Technologies Corporation.製造)測定了OD值。OD值越大,硬化膜越具有優異之遮光性。另外,藉由以下基準進行了評價。實際使用中,“C”以上為較佳。 A:OD值超過4 B:OD值超過3且為4以下 C:OD值超過2且為3以下 D:OD值為2以下[OD value] A coating film was formed by spin coating on a glass plate (EagleXG, manufactured by Corning Incorporated) with a thickness of 0.7 mm and 10 cm square, using each composition. At this time, the rotation speed was adjusted so that the film thickness became 1.5 μm based on the solid content concentration of each composition. The formed coating film was dried on a hot plate by a heat treatment at 100 ° C for 2 minutes to obtain a cured film. The OD value of the substrate containing the obtained cured film was measured with a spectrophotometer U-4100 (manufactured by Hitachi High-Technologies Corporation.). The larger the OD value, the more excellent the light-shielding property of the cured film. In addition, evaluation was performed based on the following criteria. In practical use, "C" or more is preferred. A: OD value exceeds 4 B: OD value exceeds 3 and is 4 or less C: OD value exceeds 2 and is 3 or less D: OD value is 2 or less

〔經時穩定性〕 向φ50mm且容量100mL的容器,添加100mL的含金屬氮化物的粒子分散液,在室溫下靜置9分鐘。靜置之後,抽取上清液1cm量的含金屬氮化物的粒子分散液,藉由蒸乾測定了其固體成分濃度。藉由下述式計算出靜置前後的含金屬氮化物的粒子分散液的固體成分的變化率,並且藉由下述基準評價了其值。實際使用中,“C”以上為較佳。 (式)固體成分變化率=(初始固體成分濃度)-(上清液1cm量的固體成分濃度) A:固體成分變化率小於3% B:固體成分變化率為3%以上且小於7% C:固體成分變化率為7%以上且小於12% D:固體成分變化率為12%以上[Stability over time] To a container having a diameter of 50 mm and a capacity of 100 mL, 100 mL of a metal nitride-containing particle dispersion was added, and left to stand at room temperature for 9 minutes. After being left to stand, a 1-cm metal-nitride-containing particle dispersion liquid was collected from the supernatant, and its solid content concentration was measured by evaporation to dryness. The change rate of the solid content of the metal nitride-containing particle dispersion before and after standing was calculated by the following formula, and the value was evaluated by the following criteria. In practical use, "C" or more is preferred. (Formula) Solid content change rate = (Initial solid content concentration)-(Solid content concentration of 1 cm of supernatant) A: Solid content change rate is less than 3% B: Solid content change rate is more than 3% and less than 7% C : Solid content change rate is 7% or more and less than 12% D: Solid content change rate is 12% or more

〔顆粒數〕 製備藉由PGMEA將上述組成物稀釋成500倍之試料溶液,藉由流式粒子圖像分析裝置(商品名“FPIA”、Malvern Instruments Ltd製造),測定了該試料溶液10ml中包含之10μm以上尺寸的含金屬氮化物的粒子的數量。藉由以下基準進行了評價。實際使用中,“C”以上為較佳。 A:顆粒數為3個以下 B:顆粒數為4~10個 C:顆粒數為11~20個 D:顆粒數為21個以上[Number of Particles] A sample solution in which the above composition was diluted 500 times with PGMEA was prepared, and a flow particle image analysis apparatus (trade name "FPIA", manufactured by Malvern Instruments Ltd.) was used to measure the content of the sample solution in 10 ml. The number of metal nitride-containing particles having a size of 10 μm or more. Evaluation was performed based on the following criteria. In practical use, "C" or more is preferred. A: The number of particles is 3 or less B: The number of particles is 4 to 10 C: The number of particles is 11 to 20 D: The number of particles is 21 or more

〔解像性〕 在8英寸的矽基板上塗佈上述組成物來製作了塗膜。塗膜的製作利用Tokyo Electron Limited製造的Coater Developer ACT8進行,依據各組成物的固體成分濃度,以膜厚成為1.5μm之方式調整了轉速。對所獲得之塗膜,作為預烘處理,利用加熱板進行100℃、2分鐘的熱處理。對上述預烘後的附帶塗膜的基板,利用i射線步進機(Canon Inc.製造FPA3000i5+),通過形成有10μm寬度的島狀圖案之光罩,對上述塗膜進行了曝光(負)。對曝光後的塗膜,利用Tokyo Electron Limited製造的Coater Developer ACT8,作為顯影液使用CD-2060(FUJIFILM Electronic Materials CO., LTD.製造),進行30秒鐘的旋覆浸沒顯影,顯影之後藉由純水進行了沖洗處理。對顯影後的塗膜進行後烘(溫度:220℃、時間:10分鐘)。藉由測長SEM(Scanning Electron Microscope)測定了後烘後的塗膜的圖案形狀。具體而言,測定島狀的寬度,並藉由以下基準進行了評價。實際使用中,“C”以上為較佳。 A:島狀的寬度為9.5μm~10.5μm B:島狀的寬度為8μm以上且小於9.5μm、或超過10.5μm且為12μm以下 C:島狀的寬度為小於8μm或超過12μm D:圖案剝落或因顯影不足而未形成島狀。[Resolution] An 8-inch silicon substrate was coated with the above composition to prepare a coating film. The coating film was produced using Coater Developer ACT8 manufactured by Tokyo Electron Limited, and the rotation speed was adjusted so that the film thickness became 1.5 μm according to the solid content concentration of each composition. The obtained coating film was heat-treated at 100 ° C. for 2 minutes using a hot plate as a pre-baking treatment. The pre-baked substrate with a coating film was exposed (negative) to the coating film with an i-ray stepper (FPA3000i5 + manufactured by Canon Inc.) through a mask having an island-shaped pattern having a width of 10 μm. Coater Developer ACT8 manufactured by Tokyo Electron Limited was used for the exposed coating film, and CD-2060 (manufactured by FUJIFILM Electronic Materials CO., LTD.) Was used as a developer. The coating was subjected to spin-on immersion development for 30 seconds. Pure water was rinsed. The developed coating film was post-baked (temperature: 220 ° C, time: 10 minutes). The pattern shape of the post-bake coating film was measured by a scanning electron microscope (Scanning Electron Microscope). Specifically, the width of the island was measured and evaluated by the following criteria. In practical use, "C" or more is preferred. A: Island-like width is 9.5 μm to 10.5 μm B: Island-like width is 8 μm or more and less than 9.5 μm, or more than 10.5 μm and 12 μm or less C: Island-like width is less than 8 μm or more than 12 μm D: Pattern peeling Or an island is not formed due to insufficient development.

〔電極的防腐性〕 使用組成物,在圖像感測裝置基板上藉由旋轉塗佈形成了塗佈膜。將塗佈膜,在加熱板上以100℃、2min的條件進行了預烘處理。對預烘處理後的基板,利用i射線曝光装置(FPA3000i5+、Canon Inc.製造),在基板上的受光部外周部分形成切割線及包覆電極部以外之遮光層。而且,利用加熱板進行了220℃、5min的加熱處理(後烘製程)。遮光膜形成處理之後,將基板在130℃、相對濕度90%的條件下暴露7天之後,藉由接合線形成了配線。藉由Canon Machinery Inc.製造的接合線檢査装置評價了斷線的產生。所評價之晶片為50個,每一晶片的配線數為40。評價藉由以下的基準進行。實際使用中,“C”以上為較佳。 A:斷線為1個以下 B:斷線為2個以上且小於5個 C:斷線為5個以上且小於10個 D:斷線為10個以上[Corrosion Resistance of Electrode] A coating film was formed on the image sensor device substrate by spin coating using the composition. The coating film was pre-baked on a hot plate at 100 ° C for 2 minutes. With respect to the substrate after the pre-baking treatment, an i-ray exposure device (FPA3000i5 +, manufactured by Canon Inc.) was used to form a cutting line and a light-shielding layer other than the electrode portion on the peripheral portion of the light-receiving portion on the substrate. In addition, a heating plate was subjected to a heat treatment at 220 ° C. for 5 minutes (post-baking process). After forming the light-shielding film, the substrate was exposed to 130 ° C. and a relative humidity of 90% for 7 days, and then wiring was formed by bonding wires. The occurrence of disconnection was evaluated by a bonding wire inspection device manufactured by Canon Machinery Inc. The number of evaluated wafers was 50, and the number of wirings per wafer was 40. Evaluation was performed by the following criteria. In practical use, "C" or more is preferred. A: The number of broken wires is less than one B: The number of broken wires is 2 or more and less than 5 C: The number of broken wires is 5 or more and less than 10 D: The number of broken wires is 10 or more

[表3] [table 3]

從表3所示之結果可知,使用含金屬氮化物的粒子含有在3~11族的過渡金屬中除鈦以外的過渡金屬且電負性為1.22~2.36之過渡金屬的氮化物之實施例1~32的組成物來製作之硬化膜(遮光膜)具有優異之遮光性、優異之解像性及優異之電極的防腐性。另一方面,使用比較例1~5的組成物來製作之硬化膜(遮光膜)未獲得所希望的效果。 並且,使用過渡金屬分別係鈮、釩、鉭、釔、鉻、錸或鎢之實施例3、8、10、12、13、14及15的組成物來製作之硬化膜(遮光膜)具有比使用過渡金屬係鋯或鉿之實施例9或11的組成物來製作之硬化膜(遮光膜)更優異之OD值(遮光性)。其中,使用過渡金屬分別係鈮或釩之實施例3或8的組成物來製作之硬化膜(遮光膜)具有進一步優異之OD值。 並且,固體成分為10~40質量%之實施例21的組成物與固體成分超過40質量%的實施例22的組成物相比,顆粒數更少。 並且,水的含量為0.1~1質量%之實施例23的組成物與超過1質量%的實施例24的組成物相比,顆粒數更少。 並且,含金屬氮化物的粒子的含量相對於組成物的總固體成分為20~70質量%之實施例2的組成物與小於20質量%之實施例29的組成物相比,具有更優異之經時穩定性。並且,上述實施例2的組成物與超過70質量%之實施例28的組成物相比,顆粒數更少,並且,所獲得之硬化膜(遮光膜)具有更優異之解像性。 並且,分散劑相對於含金屬氮化物的粒子之質量比為0.05~0.30之實施例2的組成物與上述質量比小於0.05之實施例32的組成物相比,具有更優異之經時穩定性。並且,使用實施例2的組成物來製作之硬化膜(遮光膜)與使用實施例18的組成物來製作之硬化膜(遮光膜)相比,具有更優異之解像性。From the results shown in Table 3, it can be seen that Example 1 using metal nitride-containing particles containing a transition metal other than titanium among transition metals of Groups 3 to 11 and a transition metal having a electronegativity of 1.22 to 2.36 A cured film (light-shielding film) made of a composition of ~ 32 has excellent light-shielding properties, excellent resolvability, and excellent electrode corrosion resistance. On the other hand, the desired effect was not obtained with the cured film (light-shielding film) produced using the composition of Comparative Examples 1 to 5. In addition, the hardened films (light-shielding films) produced using the compositions of Examples 3, 8, 10, 12, 13, 14, and 15 in which transition metals are niobium, vanadium, tantalum, yttrium, chromium, rhenium, or tungsten, respectively, have a specific ratio. The hardened film (light-shielding film) produced using the composition of Example 9 or 11 made of transition metal-based zirconium or hafnium has a better OD value (light-shielding property). Among them, the hardened film (light-shielding film) produced using the composition of Example 3 or 8 in which the transition metal is niobium or vanadium, respectively, has a further excellent OD value. In addition, the composition of Example 21 having a solid content of 10 to 40% by mass has fewer particles than the composition of Example 22 having a solid content of more than 40% by mass. In addition, the composition of Example 23 having a water content of 0.1 to 1% by mass has fewer particles than the composition of Example 24 exceeding 1% by mass. In addition, the composition of Example 2 in which the content of the metal nitride-containing particles is 20 to 70% by mass relative to the total solid content of the composition is more excellent than the composition of Example 29 which is less than 20% by mass. Stability over time. In addition, the composition of Example 2 described above has fewer particles than the composition of Example 28 exceeding 70% by mass, and the obtained cured film (light-shielding film) has more excellent resolvability. In addition, the composition of Example 2 having a mass ratio of the dispersant with respect to the metal nitride-containing particles of 0.05 to 0.30 has more excellent stability over time than the composition of Example 32 having a mass ratio of less than 0.05. . In addition, the cured film (light-shielding film) produced using the composition of Example 2 has a better resolving property than the cured film (light-shielding film) produced using the composition of Example 18.

[含金屬氮化物的粒子P-1(A)的製作及評價] 藉由以下方法製作了含金屬氮化物的粒子P-1(A),該含金屬氮化物的粒子P-1(A)為對藉由上述方法製作而成之含金屬氮化物的粒子P-1的表面包覆氫氧化鋁而成者。 首先,將含金屬氮化物的粒子P-1稱重100g,並添加到750mL的純水中,使其良好地分散來獲得了漿料。接著,向將作為氧化鋁的濃度10質量%的氯化鋁水溶液220g及尿素160g溶解於500mL水之溶液,添加上述漿料並均勻混合來獲得了混合物。以90℃將該混合物加熱8小時,並冷卻至室溫。過濾冷卻後的混合物,之後進行水洗,在110℃下乾燥24小時之後,進一步以600℃燒成5小時,從而獲得了含金屬氮化物的粒子P-1的表面被氫氧化鋁包覆之含金屬氮化物的粒子P-1(A)。上述含金屬氮化物的粒子P-1(A)的平均一次粒徑為13nm,導電率為100S/m。 接著,使用含金屬氮化物的粒子P-1(A),藉由與上述實施例1相同的方法,製作了分散液及組成物,對OD值、解像性、電極的腐食性、經時穩定性及顆粒進行了評價,其結果,為與使用含金屬氮化物的粒子P-1之實施例1相同的結果。[Production and evaluation of metal nitride-containing particles P-1 (A)] The metal nitride-containing particles P-1 (A) and the metal nitride-containing particles P-1 (A) were produced by the following method. The surface of the metal nitride-containing particles P-1 produced by the above method is coated with aluminum hydroxide. First, 100 g of metal nitride-containing particles P-1 were weighed and added to 750 mL of pure water to disperse them well to obtain a slurry. Next, a solution obtained by dissolving 220 g of an aluminum chloride aqueous solution having a concentration of 10% by mass as alumina and 160 g of urea in 500 mL of water was added to the above slurry and uniformly mixed to obtain a mixture. The mixture was heated at 90 ° C for 8 hours and cooled to room temperature. The cooled mixture was filtered, washed with water, dried at 110 ° C. for 24 hours, and then fired at 600 ° C. for 5 hours. Thus, the surface of the metal nitride-containing particles P-1 was coated with aluminum hydroxide. Particles of metal nitride P-1 (A). The average primary particle diameter of the metal nitride-containing particles P-1 (A) was 13 nm, and the electrical conductivity was 100 S / m. Next, using the metal nitride-containing particles P-1 (A), a dispersion liquid and a composition were prepared by the same method as in Example 1 above, and the OD value, resolution, electrode rottenness, and time The stability and particles were evaluated, and the results were the same as those of Example 1 using the metal nitride-containing particles P-1.

[含金屬氮化物的粒子P-2(A)~P-15(A)的製作及評價] 藉由與上述含金屬氮化物的粒子P-1(A)相同的方法,使用含金屬氮化物的粒子P-2~P-15,製作了含金屬氮化物的粒子P-2(A)~P-15(A)。將各個平均一次粒徑及導電率示於表4。 接著,使用含金屬氮化物的粒子P-2(A)~P-15(A),藉由與上述實施例2~32相同的方法,製作分散液及組成物,對OD值、解像性、電極的腐食性、經時穩定性及顆粒進行了評價,其結果,分別為與使用含金屬氮化物的粒子P-2~P-15之實施例2~32結果相同。[Production and Evaluation of Metal Nitride-Containing Particles P-2 (A) to P-15 (A)] The metal nitride-containing particles were used in the same manner as the above-mentioned metal nitride-containing particles P-1 (A). The particles P-2 to P-15 were made of metal nitride-containing particles P-2 (A) to P-15 (A). Table 4 shows the average primary particle size and the electrical conductivity. Next, using the metal nitride-containing particles P-2 (A) to P-15 (A), a dispersion liquid and a composition were prepared by the same method as in Examples 2 to 32 above, and the OD value and resolution were determined. The electrode's rottenness, stability over time, and particles were evaluated. The results were the same as those of Examples 2 to 32 using particles P-2 to P-15 containing metal nitrides.

[表4] [Table 4]

實施例1中,將聚合起始劑從OXE-02替代為Irgacure OXE03(商品名、BASF公司製造),除此以外,藉由相同的方法進行了評價,其結果,得知可獲得與實施例1相同的結果。而且,與實施例1相比,相對於曝光量之鲁棒較廣,即使在減少曝光量時,亦能夠維持解像性。In Example 1, the polymerization initiator was replaced from OXE-02 to Irgacure OXE03 (trade name, manufactured by BASF), and the same method was used for evaluation. As a result, it was found that the same results as in Example can be obtained. 1 same result. Moreover, compared with Example 1, it is more robust with respect to the exposure amount, and it is possible to maintain the resolution even when the exposure amount is reduced.

實施例1中,將聚合起始劑從OXE-02替代為Adeka Arkls NCI-831(ADEKA CORPORATION製造),除此以外,藉由相同的方法進行了評價,其結果,得知可獲得與實施例1相同的結果。而且,與實施例1相比,相對於曝光量之鲁棒較廣,即使在減少曝光量時,亦能夠維持了解像性。In Example 1, except that the polymerization initiator was replaced with Adeka Arkls NCI-831 (manufactured by ADEKA CORPORATION) from OXE-02, it was evaluated by the same method. As a result, it was found that the same results as in Example can be obtained. 1 same result. Moreover, compared with Example 1, the robustness with respect to the exposure amount is wider, and even when the exposure amount is reduced, the visibility can be maintained.

實施例1中,將聚合性化合物從聚合性化合物M1替代為聚合性化合物M2,除此以外,藉由相同的方法進行了評價,其結果得知可獲得與實施例1相同的結果。Except that the polymerizable compound was replaced by the polymerizable compound M1 with the polymerizable compound M2 in Example 1, it was evaluated by the same method. As a result, it was found that the same results as in Example 1 were obtained.

實施例1中,將聚合性化合物從聚合性化合物M1,在不改變相對於所有各組成物之聚合性化合物的含量之前提下,替代為聚合性化合物M1及M2的混合物(質量比1:1),除此以外,藉由相同的方法進行了評價,其結果,得知可獲得與實施例1相同的結果。In Example 1, the polymerizable compound was extracted from the polymerizable compound M1 without changing the content of the polymerizable compound with respect to all the components, and replaced with a mixture of the polymerizable compounds M1 and M2 (mass ratio 1: 1) ), Except that evaluation was performed by the same method. As a result, it was found that the same result as that of Example 1 can be obtained.

實施例1中,代替溶劑CPN使用了PGMEA,除此以外,藉由相同的方法進行了評價,其結果,得知可獲得與實施例1相同的結果。Except that PGMEA was used instead of the solvent CPN in Example 1, it was evaluated by the same method. As a result, it was found that the same result as in Example 1 was obtained.

實施例1中,代替溶劑CPN及乙酸Bu使用了PGMEA,除此以外,藉由相同的方法進行了評價,其結果,得知可獲得與實施例1相同的結果。Except that PGMEA was used instead of the solvents CPN and Bu acetate in Example 1, it was evaluated by the same method. As a result, it was found that the same results as in Example 1 were obtained.

實施例1中,未使用界面活性劑F-556,除此以外,藉由相同的方法進行了評價。評價結果,得知可獲得與實施例1相同的結果。Except that the surfactant F-556 was not used in Example 1, it evaluated by the same method. As a result of the evaluation, it was found that the same results as in Example 1 were obtained.

實施例1中,未使用聚合抑制劑PMF,除此以外,藉由相同的方法進行了評價。評價結果,得知可獲得與實施例1相同的結果。Evaluation was performed in the same manner as in Example 1 except that the polymerization inhibitor PMF was not used. As a result of the evaluation, it was found that the same results as in Example 1 were obtained.

<碳黑分散物(CB分散液)的製備> 上述顏料分散物的製備中,代替含金屬氮化物的粒子,使用了碳黑(商品名“Color Black S170”、Degussa-Hüls AG製造、平均一次粒徑17nm、BET比表面積200m2 /g、藉由氣黑方式製造之碳黑),除此以外,藉由與上述相同的方法製作分散物來獲得了碳黑分散物。<Preparation of Carbon Black Dispersion (CB Dispersion Liquid)> In the preparation of the pigment dispersion described above, carbon black (trade name "Color Black S170", manufactured by Degussa-Hüls AG was used instead of metal nitride-containing particles), and averaged once. A carbon black dispersion was obtained by preparing a dispersion by the same method as described above, except that the particle diameter was 17 nm, the BET specific surface area was 200 m 2 / g, and carbon black was produced by a gas black method.

實施例1的組成物的製備中,代替以在組成物中含有21質量%的含金屬氮化物的粒子P-1之方式添加之含金屬氮化物的粒子分散液,使用了含有含金屬氮化物的粒子P-1之含金屬氮化物的粒子分散液與上述CB分散液的混合物[組成物中的含金屬氮化物的粒子P-1:組成物的碳黑=5:2(質量比)。組成物中的含金屬氮化物的粒子P-1與碳黑的總計含量為21質量%。],除此以外,藉由相同的方法製作組成物,並用其進行了評價。評價結果,成為與實施例1相同的OD值,得知可獲得與實施例1相同的遮光性。In the preparation of the composition of Example 1, a metal nitride-containing particle dispersion was used instead of the metal nitride-containing particle dispersion liquid added so that the composition contained 21% by mass of metal nitride-containing particles P-1. A mixture of the metal nitride-containing particle dispersion liquid of the particles P-1 and the CB dispersion liquid [metal nitride-containing particle P-1 in the composition: carbon black of the composition = 5: 2 (mass ratio). The total content of the metal nitride-containing particles P-1 and carbon black in the composition was 21% by mass. ] Except that a composition was produced by the same method and evaluated using it. As a result of the evaluation, the same OD value as in Example 1 was obtained, and it was found that the same light-shielding property as in Example 1 was obtained.

<彩色顏料分散物(PY分散液)的製備> 上述含金屬氮化物的粒子分散液的製備中,代替含金屬氮化物的粒子,使用了顏料黃150(Hangzhou Star-up Pigment Co., Ltd.製、商品名6150顏料黄5GN),除此以外,藉由相同的方法獲得了彩色顏料分散物(PY分散液)。<Preparation of Color Pigment Dispersion (PY Dispersion)> In the preparation of the metal nitride-containing particle dispersion, Pigment Yellow 150 (Hangzhou Star-up Pigment Co., Ltd.) was used instead of the metal nitride-containing particles. (Product name, 6150 Pigment Yellow 5GN), and a color pigment dispersion (PY dispersion) was obtained by the same method.

實施例1的組成物的製備中,代替以組成物中含有21質量%的含金屬氮化物的粒子P-1之方式添加之含金屬氮化物的粒子分散液,使用了含有含金屬氮化物的粒子P-1之顏料分散液與上述PY分散液的混合物[組成物中的含金屬氮化物的粒子P-1:組成物中的顏料黃150=6:1(質量比)。組成物中的含金屬氮化物的粒子P-1與顏料黃150的總計含量為21質量%。],除此以外,藉由相同的方法製備組成物,並用該組成物進行了評價。評價結果,成為與實施例1相同的OD值,得知可獲得與實施例1相同的遮光性,可獲得黑色更濃之膜。In the preparation of the composition of Example 1, a metal nitride-containing particle dispersion liquid was used instead of the metal nitride-containing particle dispersion liquid added so that the composition contained 21% by mass of the metal nitride-containing particles P-1. A mixture of the pigment dispersion liquid of particles P-1 and the PY dispersion liquid [metal nitride-containing particles P-1 in the composition: pigment yellow 150 in the composition = 6: 1 (mass ratio). The total content of the metal nitride-containing particles P-1 and Pigment Yellow 150 in the composition was 21% by mass. ], Except that a composition was prepared by the same method and evaluated using the composition. As a result of the evaluation, the same OD value as in Example 1 was obtained, and it was found that the same light-shielding property as that in Example 1 was obtained, and a film having a thicker black was obtained.

no

no

no

Claims (21)

一種組成物,其含有包含原子A之含金屬氮化物的粒子, 前述含金屬氮化物的粒子含有在3~11族的過渡金屬中除鈦以外的過渡金屬且電負性為1.22~2.36之過渡金屬的氮化物, 前述原子A係與構成前述過渡金屬的氮化物之過渡金屬不同之元素,且係選自由硼、鋁、矽、錳、鐵、鎳及銀所組成的群組中的至少1種, 前述含金屬氮化物的粒子中的前述原子A的含量為0.00005~10質量%。A composition containing metal nitride-containing particles containing atom A, the metal nitride-containing particles containing a transition metal other than titanium among transition metals of Groups 3 to 11 and having a transition having an electronegativity of 1.22 to 2.36 A metal nitride, the atom A is an element different from the transition metal constituting the nitride of the transition metal, and is at least 1 selected from the group consisting of boron, aluminum, silicon, manganese, iron, nickel, and silver. For example, the content of the atom A in the metal nitride-containing particles is 0.00005 to 10% by mass. 如申請專利範圍第1項所述之組成物,其中 前述含金屬氮化物的粒子的導電率為100×104 ~600×104 S/m。The composition according to item 1 of the scope of patent application, wherein the electrical conductivity of the aforementioned metal nitride-containing particles is 100 × 10 4 to 600 × 10 4 S / m. 如申請專利範圍第1項或第2項所述之組成物,其中 前述含金屬氮化物的粒子的平均一次粒徑為10~50nm。The composition according to item 1 or item 2 of the scope of patent application, wherein the average primary particle diameter of the metal nitride-containing particles is 10 to 50 nm. 如申請專利範圍第1項或第2項所述之組成物,其還含有黏結樹脂。The composition according to item 1 or item 2 of the scope of patent application, further comprising a binding resin. 如申請專利範圍第4項所述之組成物,其中 前述黏結樹脂相對於前述含金屬氮化物的粒子的質量比為0.3以下。The composition according to item 4 of the scope of patent application, wherein the mass ratio of the binder resin to the metal nitride-containing particles is 0.3 or less. 如申請專利範圍第1項或第2項所述之組成物,其中 前述過渡金屬係選自由V、Cr、Y、Zr、Nb、Hf、Ta、W及Re所組成的群組中的至少1種。The composition as described in claim 1 or 2, wherein the transition metal is at least 1 selected from the group consisting of V, Cr, Y, Zr, Nb, Hf, Ta, W, and Re. Species. 如申請專利範圍第1項或第2項所述之組成物,其中 前述過渡金屬係選自由V及Nb所組成的群組中的至少1種。The composition according to claim 1 or claim 2, wherein the transition metal is at least one selected from the group consisting of V and Nb. 如申請專利範圍第1項或第2項所述之組成物,其還含有聚合性化合物。The composition according to item 1 or 2 of the scope of patent application, further comprising a polymerizable compound. 如申請專利範圍第1項或第2項所述之組成物,其還含有聚合起始劑。The composition according to item 1 or item 2 of the scope of patent application, further comprising a polymerization initiator. 如申請專利範圍第1項或第2項所述之組成物,其還含有溶劑,且固體成分為10~40質量%。The composition according to item 1 or item 2 of the scope of patent application, which further contains a solvent and has a solid content of 10 to 40% by mass. 如申請專利範圍第10項所述之組成物,其中 前述溶劑含有水,前述水的含量相對於前述組成物的總質量為0.1~1質量%。The composition according to claim 10, wherein the solvent contains water, and the content of the water is 0.1 to 1% by mass based on the total mass of the composition. 如申請專利範圍第1項或第2項所述之組成物,其中 前述含金屬氮化物的粒子的含量相對於前述組成物的總固體成分為20~70質量%。The composition according to claim 1 or 2, wherein the content of the metal nitride-containing particles is 20 to 70% by mass based on the total solid content of the composition. 如申請專利範圍第1項或第2項所述之組成物,其還含有分散劑,前述分散劑含有選自由聚丙烯酸甲酯、聚甲基丙烯酸甲酯及環狀或鏈狀的聚酯所組成的群組中的至少1種結構。The composition according to item 1 or item 2 of the scope of patent application, further comprising a dispersant, the dispersant contains a material selected from polymethyl acrylate, polymethyl methacrylate, and cyclic or chain polyester At least one structure in a group. 如申請專利範圍第13項所述之組成物,其中 前述分散劑相對於前述含金屬氮化物的粒子之質量比為0.05~0.30。The composition according to item 13 of the scope of patent application, wherein the mass ratio of the dispersant to the metal nitride-containing particles is 0.05 to 0.30. 如申請專利範圍第1項或第2項所述之組成物,其中 前述含金屬氮化物的粒子係被含有氫氧化鋁之無機化合物包覆之含金屬氮化物的粒子。The composition according to claim 1 or 2, wherein the metal nitride-containing particles are metal nitride-containing particles coated with an inorganic compound containing aluminum hydroxide. 一種組成物的製造方法,其為製造申請專利範圍第1項至第15項中任一項所述之組成物的製造方法, 其含有藉由熱電漿法獲得前述含金屬氮化物的粒子之製程。A method for manufacturing a composition, which is a method for manufacturing a composition according to any one of claims 1 to 15 of a patent application scope, and comprises a process for obtaining the aforementioned metal nitride-containing particles by a thermoplasma method . 一種硬化膜,其使用申請專利範圍第1項至第15項中任一項所述之組成物來獲得。A cured film obtained by using the composition described in any one of claims 1 to 15 of the scope of patent application. 一種濾色器,其含有申請專利範圍第17項所述之硬化膜。A color filter containing the hardened film described in claim 17 of the scope of patent application. 一種遮光膜,其含有申請專利範圍第17項所述之硬化膜。A light-shielding film comprising the hardened film described in item 17 of the scope of patent application. 一種固態攝影元件,其含有申請專利範圍第17項所述之硬化膜。A solid-state photographic element comprising the hardened film described in claim 17 of the scope of patent application. 一種圖像顯示裝置,其含有申請專利範圍第17項所述之硬化膜。An image display device includes the hardened film described in claim 17 of the scope of patent application.
TW106109671A 2016-04-08 2017-03-23 Composition, method for manufacturing composition, cured film, color filter, light-shielding film, solid-state imaging element, and image display device TWI726075B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-078032 2016-04-08
JP2016078032 2016-04-08

Publications (2)

Publication Number Publication Date
TW201806850A true TW201806850A (en) 2018-03-01
TWI726075B TWI726075B (en) 2021-05-01

Family

ID=60001079

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106109671A TWI726075B (en) 2016-04-08 2017-03-23 Composition, method for manufacturing composition, cured film, color filter, light-shielding film, solid-state imaging element, and image display device

Country Status (4)

Country Link
JP (1) JP6571275B2 (en)
KR (2) KR102210003B1 (en)
TW (1) TWI726075B (en)
WO (1) WO2017175550A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI798453B (en) * 2018-07-20 2023-04-11 日商富士軟片股份有限公司 Light-shielding resin composition, cured film, color filter, light-shielding film, solid-state imaging device, image display device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102028970B1 (en) * 2016-10-26 2019-10-07 동우 화인켐 주식회사 Metal oxide photosensitive resin composition, color filter and image display device produced using the same
JP7029546B2 (en) * 2018-09-11 2022-03-03 富士フイルム株式会社 Light-shielding composition, cured film, color filter, light-shielding film, solid-state image sensor, image display device
CN111253782B (en) * 2020-02-12 2022-03-22 首钢集团有限公司 Modified anticorrosive hydrotalcite, water-based intelligent anticorrosive paint, preparation method and coating

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102827A (en) * 1985-10-29 1987-05-13 Natl Res Inst For Metals Production of metallic or ceramic fine grain
JP2539712B2 (en) * 1991-09-19 1996-10-02 喜清 荻野 Nitride powder
JPH08100201A (en) * 1994-09-30 1996-04-16 Takeshi Masumoto Composite superfine particles and their production
JP5010071B2 (en) * 2000-07-18 2012-08-29 株式会社東芝 Cold storage material, manufacturing method thereof, and refrigerator using the cold storage material
JP4285530B2 (en) * 2006-11-28 2009-06-24 セイコーエプソン株式会社 Microsphere forming method and microsphere forming apparatus
JP2010111570A (en) * 2008-10-10 2010-05-20 Neturen Co Ltd Y2o3 composite bead
GB2467161A (en) * 2009-01-26 2010-07-28 Sharp Kk Nitride nanoparticles
TWI483999B (en) * 2009-06-15 2015-05-11 Toray Industries Black composite fine particle, black resin composition, color filter substrate and liquid crystal display
JP2011050829A (en) * 2009-08-31 2011-03-17 Teijin Ltd Method and apparatus for manufacturing particulate
JP5769223B2 (en) * 2009-10-22 2015-08-26 戸田工業株式会社 Ferromagnetic particle powder and production method thereof, anisotropic magnet and bonded magnet
JP5747475B2 (en) * 2010-10-29 2015-07-15 三菱マテリアル電子化成株式会社 Blue shielding black powder and its production method and use
JP5831866B2 (en) * 2011-01-21 2015-12-09 戸田工業株式会社 Ferromagnetic particle powder and method for producing the same, anisotropic magnet, bonded magnet, and compacted magnet
JP5864959B2 (en) * 2011-08-31 2016-02-17 富士フイルム株式会社 Gray composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI798453B (en) * 2018-07-20 2023-04-11 日商富士軟片股份有限公司 Light-shielding resin composition, cured film, color filter, light-shielding film, solid-state imaging device, image display device
US12072568B2 (en) 2018-07-20 2024-08-27 Fujifilm Corporation Light-shielding resin composition, cured film, color filter, light-shielding film, solid-state imaging element, and image display device

Also Published As

Publication number Publication date
WO2017175550A1 (en) 2017-10-12
TWI726075B (en) 2021-05-01
KR20180115331A (en) 2018-10-22
JP6571275B2 (en) 2019-09-04
JPWO2017175550A1 (en) 2019-03-14
KR102210003B1 (en) 2021-02-01
KR20210011080A (en) 2021-01-29

Similar Documents

Publication Publication Date Title
TWI740942B (en) Curable composition, cured film, color filter, light-shielding film, solid-state imaging element, image display device, and manufacturing method of cured film
TWI699614B (en) Composition, composition manufacturing method, cured film, color filter, light shielding film, solid-state imaging element, and image display device
TWI774679B (en) Curable composition, cured film, color filter, light-shielding film, solid-state imaging element, image display device, manufacturing method of cured film, and polyfunctional thiol compound
TWI790993B (en) Black composition, cured film, color filter, light-shielding film, solid-state imaging element, and image display device
JP7109624B2 (en) Composition, cured film, color filter, light-shielding film, solid-state imaging device, and image display device
TWI726075B (en) Composition, method for manufacturing composition, cured film, color filter, light-shielding film, solid-state imaging element, and image display device
TW201827507A (en) Curable composition, compound, cured film, method for producing cured film, method for producing color filter, solid state imaging device, and infrared sensor
TWI705298B (en) Resin composition, resin film, color filter, light shielding film, solid-state imaging device, and image display device
TW201728656A (en) Dispersion composition, curable composition, light-blocking film, color filter, and solid-state imaging device
TW201731927A (en) Method for producing cured film, cured film, solid-state image capture element, and image display device