TW201806376A - Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof - Google Patents

Abstract

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

Description

Camera module, molded photosensitive element and manufacturing method thereof

The invention relates to the field of camera modules, and further relates to a camera module manufactured by a molding process, a molding die and a manufacturing method thereof.

The camera module is one of the indispensable components of smart electronic devices, such as, but not limited to, smart phones, cameras, computer equipment, and wearable devices. With the continuous development and popularization of various smart devices, the requirements for camera modules are becoming higher and higher.

In recent years, the rapid development of smart electronic devices has become increasingly thinner and thinner, and camera modules have to adapt to their development, and have increasingly demanded multifunctionality, thinness, and miniaturization, so that electronic devices can do more and more. The thinner, and meet the imaging requirements of the device for the camera module. Therefore, camera module manufacturers continue to devote themselves to designing and manufacturing camera modules that meet these requirements.

Molded packaging technology is a newly developed packaging technology based on traditional COB packaging. As shown in FIG. 1A, the circuit board is packaged by using the existing integrated packaging technology. In this structure, the packaging unit 1 is packaged in the circuit board 2 and the photosensitive chip 3 by an integrated package, and the electronic components on the circuit board and the leads electrically connecting the chip and the circuit board are covered, thereby reducing the camera module. The space occupied by the electronic components independently allows the size of the camera module to be reduced, and solves the problem that the dust attached to the electronic components affects the imaging quality of the camera module.

Compared with the traditional bracket-type COB packaging technology, this packaging technology theoretically has more advantages, but for some time, this packaging technology has only stayed at the theoretical or manual experimental stage and has not been well received. The implementation has not been put into actual production for quantitative production. The reasons are as follows.

First of all, although the integrated packaging technology is a well-known technology in other large industrial fields, it is a new application in the field of camera modules. Different industries need different products to be produced by molding and face different problems. Taking smart phones as an example, the body is getting thinner and lighter, so the thickness is getting less and less. Therefore, the camera module is required to reach such a thickness so as not to increase the overall thickness of the phone. As you can imagine, the camera module The components are machined in a smaller size class, so the ideal structure of the design cannot be produced by conventional methods. In the above structure, it is usually necessary to form a through hole through the packaging portion 1 to provide a light path for the photosensitive wafer 3 on the circuit board 2. This through hole is usually designed as a vertical square pillar. This structure is based on basic theory In terms of structure, there are no particularly large defects, but the problems existing in the actual mass production are not considered. In other words, this technology only stays in the manual test stage, but cannot be put into actual production. More specifically, the packaging process all requires a molding mold. Referring to FIGS. 1B and 1C, when the molding block 4 of the upper mold of the molding mold is a vertical square pillar, during the molding process, the upper mold and the formed packaging portion are formed. At the contact position, when the mold is detached from the molding material, the bottom of the upper mold is sharply ribbed, so that the process of pulling out the mold will affect the shape of the packaging portion 1 formed by the molding, causing it to deform, such as flying. In addition, when the upper mold is pulled out and detached from the packaging portion, the outer side of the upper mold forming block 4 always generates a large frictional force with the packaging portion 1, which may also damage the packaging portion 1. This kind of influence may be neglected in the large-scale industrial field, but in the small-scale and fine-level production field of the camera module, it has become a crucial factor. Therefore, the theoretical structure of the vertical square column through hole is feasible, but it is not appropriate. Implementation in mass production.

Secondly, the camera module is an optical electronic device, and light is an important factor that determines the imaging quality. Referring to FIG. 1D, in the traditional bracket assembly method, the bracket 5 mounted on the circuit board needs to reserve a mounting space 6 for electronic components, so a recessed space is formed. The existence of this space increases the size of the camera module, but the light After incident, it is rarely directly irradiated on the inner wall of the bracket, so there is less reflected light on the inner wall of the bracket, which will not affect the imaging quality of the camera module. When the bracket is replaced with the existing square-shaped encapsulation portion 1, referring to FIG. 1E, compared with the bracket structure, light rays of the same angle of incidence are incident on the lens, and no reflected light is generated in the bracket structure. In the package structure, it will act on the inner wall of the package part 1, and the reflected light easily reaches the photosensitive chip 3, which increases the influence of stray light and reduces the imaging quality of the camera module. Therefore, in terms of optical imaging quality, the package The structure of the through hole forming a square column in the part 1 is not suitable for application.

Finally, when assembling into a camera module, components such as a lens or a motor usually need to be mounted on the packaging unit 1. Therefore, the packaging unit 1 needs to meet a certain structural strength. Therefore, when setting the shape of the packaging unit 1, the light flux, structural strength, light Many aspects, such as reflectivity, ease of demolding, and prevention of demoulding damage to the packaging portion 1 are designed in consideration, and the structure of the existing packaging portion 1 obviously does not take these factors into consideration.

An object of the present invention is to provide a camera module, a molded photosensitive element and a manufacturing method thereof, wherein the camera module includes a molded photosensitive element formed by a molding process, wherein the molded photosensitive element can be formed by molding. Large-scale mass production experiment of the mold through the molding process.

It is an object of the present invention to provide a camera module, a molded photosensitive element thereof, and a manufacturing method thereof, wherein the molded photosensitive element includes a circuit board, a photosensitive element, and an integrally formed component of the circuit board and the photosensitive element. A molding base, the molding base forms a light window, wherein the light window is not a square pillar shape in the prior art, so that in the manufacturing process, a light window forming block of a forming mold is reduced. The damage of the molding base and the extraction of the light window molding block are described.

An object of the present invention is to provide a camera module, a molded photosensitive element and a manufacturing method thereof, wherein at least a part of the molded base integrally extending from the photosensitive element forms an acute angle with the optical axis direction. A first inclination angle of demolding, after the molding base is formed in the molding process, the light window forming block can be smoothly pulled out to reduce friction with the molding base, so that the mold The plastic base can keep the original shape as much as possible to reduce the influence caused when the light window forming block is pulled out.

An object of the present invention is to provide a camera module, a molded photosensitive element and a manufacturing method thereof, wherein the molded base integrally extends from a top surface of the photosensitive element to at least a portion of an inner side surface of the molded base. The included angle with the optical axis is defined as the first tilt angle, so that the light incident on the inner side surface does not easily reach the photosensitive element, and the influence of stray light on imaging quality is reduced.

An object of the present invention is to provide a camera module, a molded photosensitive element and a manufacturing method thereof, wherein an included angle between at least one of the outer side surfaces of the molded base and the direction of the optical axis is an acute angle that facilitates demolding. A second inclination angle, when the partition block of the molding mold is pulled out of the molding base when manufactured by the molding mold, the partition block and the mold of the molding mold are reduced The friction between the outer sides of the plastic base makes the outer side of the molded base as original as possible, and the partition block of the molding mold is easy to pull out.

An object of the present invention is to provide a camera module, a molded photosensitive element, and a manufacturing method thereof, wherein an inner side surface of the first portion of the molded base has an inclined portion extending from the photosensitive element, and extends from the photosensitive element. An inner side surface of the second portion of the first portion and an inner side surface of the third portion extending obliquely from the inner surface of the second portion. An angle between the inner surface of the third portion and the optical axis is defined as a convenient one The third inclination angle, so that when the light window molding block of the molding mold is pulled out, the friction between the base of the light window molding block and the inner side of the top end of the molding base is reduced to obtain the mold. The inner side of the second part of the plastic base is kept as original as possible, and the molding die of the molding die is easy to pull out.

An object of the present invention is to provide a camera module, a molded photosensitive element and a manufacturing method thereof, wherein the first tilt angle is within a predetermined range, which is convenient to pull out and does not damage the connection between the photosensitive element and the circuit board. lead.

An object of the present invention is to provide a camera module, a molded photosensitive element and a manufacturing method thereof, wherein a bottom of the molding die is generally provided with an elastic film layer, and these inclination angles are not right-angled, thereby preventing puncture of the film layer .

An object of the present invention is to provide a camera module, a molded photosensitive element, and a manufacturing method thereof, wherein the molded base has a top side surface, and the angles of the first, second, and third inclination angles are within a predetermined range. Within the range, it is convenient to pull out the light window forming block and the partition block, and not to make the size of the top side too small to provide a stable installation area for the driver or the lens.

An object of the present invention is to provide a camera module, a molded photosensitive element, and a manufacturing method thereof, wherein the angles of the first, second, and third inclination angles are within a predetermined range, which is convenient for the light window forming block. Pulling out is convenient for pulling out the light window forming block, and it can also provide a stable installation area for the filter or the filter lens holder.

An object of the present invention is to provide a camera module, a molded photosensitive element and a manufacturing method thereof, wherein the molded base forms a light window with a slope to increase the light flux, which is in line with the vision of the photosensitive element. Field and angular incidence range requirements.

An object of the present invention is to provide a camera module, a molded photosensitive element, and a manufacturing method thereof, wherein each of the demolding angles is set with a predetermined angle range to ensure the structural strength, light reflectivity, and reduction of the molding. Small release friction.

In order to achieve at least one of the above objects of the invention, an aspect of the present invention provides a molded photosensitive element, which is used in a camera module, which includes at least one circuit board, at least one photosensitive element, and at least one molded base. The molding base is integrated with the circuit board and the photosensitive element through a molding process, wherein the molding base forms at least one light window, and the light window corresponds to the position of the photosensitive element, In addition, the molding base extends obliquely from at least a part of an inner side surface integrally extending from the photosensitive element.

In some embodiments, an included angle between the at least a part of the inner side surface of the molding base and a straight line of the optical axis of the camera module is 10 ° to 80 °.

In some embodiments, the molding base has an inner side surface that extends linearly and integrally from a non-photosensitive area of a top surface of the photosensitive element, so that the entire inner side surface of the molding base is inclined. It extends like a shape, and there is an inclination angle α between the inner side surface of the molding base and the straight line of the optical axis of the camera module. The angle α ranges from 10 ° to 80. °. Such as selected from 10︒ ~ 30︒, 30︒ ~ 45︒, 45︒ ~ 55︒ or 55︒ ~ 80︒.

In some embodiments, the photosensitive element and the circuit board are electrically connected through a set of leads, and when the wire is connected in a wired manner from the photosensitive element toward the circuit board, the value of α is selected from 10︒ ~ 55︒.

In some embodiments, the photosensitive element and the circuit board are electrically connected through a set of leads, and when the wiring of the leads is from the circuit board toward the photosensitive element, the value of α is selected from 10︒ ~ 80︒.

In some embodiments, the molding base has an outer side surface linearly extending integrally from the circuit board, and there is a gap between the outer side surface of the molding base and a straight line of the optical axis of the camera module. A tilt angle γ that is convenient for demoulding, where the range of γ is 3 ° ~ 45 °. If selected from 3︒ ~ 15︒, 15︒ ~ 30︒, or 30︒ ~ 45︒.

In some embodiments, the molded base has a top-side groove at a top end, the molded base has an inner side surface that is bent and extended, and includes a first part inner side surface that is integrally extended in sequence. The inner side surface of the second portion and the inner side surface of the third portion, the inner side surface of the first portion integrally extends obliquely to a non-photosensitive area of a top surface of the photosensitive element, and the inner side surface of the third portion integrally extends obliquely to the The inner side surface of the second portion, wherein the inner side surface of the second portion and the inner side surface of the third portion define the top side groove.

In some embodiments, there is an inclination angle α between the inner side surface of the first part and the straight line of the optical axis of the camera module to facilitate demolding and avoid stray light, where the magnitude of α is in the range of 10 ° to 80 °, There is an inclination angle β between the inner side surface of the third part and the straight line of the optical axis of the camera module to facilitate demolding and avoid stray light, where β ranges from 3 ° to 30 °.

In some embodiments, the value of α is selected from 10︒ to 30︒, 30︒ to 45︒, 45︒ to 55︒, or 55︒ to 80︒, and the value of β is selected from 3︒ to 15︒, 15︒ to 20︒, or 20︒ ~ 30︒.

In some embodiments, the inner side surface of the second portion is based on being parallel to the top surface of the photosensitive element.

In some embodiments, the molded photosensitive element further has one or more driver pin slots, wherein a wall of the pin slot defining each of the driver pin slots and a straight line of the optical axis of the camera module have An inclination angle δ that is convenient for demoulding, where the range of δ is 3 ° ~ 30 °.

In some embodiments, the molded photosensitive component further includes at least one filter, the filter is overlapped with the photosensitive element, and the molded base is integrally packaged and formed on the filter. , The photosensitive element and the circuit board.

In some embodiments, outside of at least one outer peripheral surface of the outer side surface of the molding base, the substrate of the circuit board is left with a convenient pressing of at least one partition block of a molding mold in a molding process. The combined pressing distance W ranges from 0.1 to 10mm, such as 0.2mm, 0.6mm, 1mm, 2mm, 5mm, etc.

In some embodiments, the material surface of the molded base has a reflectance of less than 5% in the wavelength range of 435-660 nm.

The cross section of the light window of the present invention is configured to have a trapezoidal or multi-step shape that gradually increases from bottom to top to facilitate demolding, prevent damage to the molding base, avoid stray light, and prevent the connection during the molding process. Damage to the photosensitive element and the leads of the circuit board.

The present invention also provides a camera module including at least one lens and the above-mentioned at least one molded photosensitive component. The molded photosensitive component includes at least one circuit board, at least one photosensitive component, and at least one molded base. The molding base is integrated with the circuit board and the photosensitive element through a molding process, wherein the molding base forms at least one light window, and the light window is mentioned for the photosensitive element and the lens. A light path, and at least a part of the inner side of the molding base integrally extending from the photosensitive element extends obliquely.

In some embodiments, the molded photosensitive component further includes at least one filter, the filter is overlapped with the photosensitive element, and the molded base is integrally packaged and formed on the filter. , The photosensitive element and the circuit.

In some embodiments, it further includes at least one filter, and the filter is mounted on the top of the molding base.

In some embodiments, it further includes at least one filter, and the filter is installed in the top groove of the molding base.

In some embodiments, it further comprises at least one filter lens holder and at least one filter, the filter is mounted on the filter lens holder, and the filter lens holder is mounted on the mold Top of the plastic base.

In some embodiments, it further comprises at least one driver mounted on a top side of the molding base so that the molding base supports the driver, wherein the lens is mounted in the driver To achieve autofocus.

In some embodiments, it further includes at least one blocking element in a ring shape to prevent a molding material from reaching a photosensitive region of the photosensitive element in the molding process.

In some embodiments, a plurality of the camera modules are assembled into an array camera module.

In some embodiments, the molded photosensitive element includes a plurality of the photosensitive elements and a plurality of the light windows, so as to form an array camera module with the plurality of lenses.

The present invention also provides an electronic device including one or more of the camera modules described above. The electronic devices include, but are not limited to, mobile phones, computers, televisions, smart wearable devices, vehicles, cameras, and monitoring devices.

The present invention also provides a molding mold, which is used for manufacturing at least one molded photosensitive component of at least one camera module, which includes a first mold and a second mold capable of being separated or closely contacted, wherein the first and The second mold forms at least one molding cavity when they are in close contact, and the molding mold is configured with at least one light window forming block and a base forming guide groove around the light window forming block, When at least one circuit board connected with at least one photosensitive element is installed in the molding cavity, a molding material filled into the molding guide groove of the base undergoes a liquid-to-solid conversion process under temperature control to be solidified and formed. Forming a molded base at a position corresponding to the base forming guide groove, and forming a light window of the molded base at a position corresponding to the light window forming block, wherein the molded base is integrally formed Forming at least a portion of a non-photosensitive area of the circuit board and the photosensitive element to form the molded photosensitive component of the camera module.

In some embodiments, the light window forming block has a sloping inner side molding surface of the base along its outer periphery, so as to form the molded slab integrally linearly extending inner side.

In some embodiments, there is an inclined angle between the molding surface on the inner side of the base of the light window molding block and the vertical line to facilitate demolding, where the size of α is in the range of 10 ° to 80 °.

In some embodiments, the light window forming block includes a pressing head and a groove forming part integrally extending from the pressing head, and the groove forming part has a larger diameter than the pressing head. An inner diameter for forming a top-side groove on the top side of the molding base.

In some embodiments, an inclination angle α between the outer side of the indenter along the outer periphery of the indenter and the vertical line is convenient for demolding and avoiding stray light, where the magnitude of α is in the range of 10 ° to 80 °. The groove forming portion has an inclination angle β between the outer side surface along the outer periphery thereof and the vertical line, wherein the size of β ranges from 3 ° to 30 °. The photosensitive element and the circuit board are electrically connected through a set of leads, and the wire is connected to the circuit board from the photosensitive element toward the circuit board by a value of α selected from 10︒ to 55︒; Wherein, when the lead wires are connected from the circuit board toward the photosensitive element, the value of α is selected from 10︒ to 80.

In some embodiments, the first mold further includes at least one partition block, the partition block has a molding surface on the outer side of the base, and a value of an inclination angle γ, γ between the vertical line and the vertical line is convenient for demolding. Select from 3︒ ~ 45︒.

The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are merely examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

Those skilled in the art should understand that, in the disclosure of the present invention, the terms "vertical", "horizontal", "up", "down", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "level", "top", "bottom", "inside", "outside" and the like are based on the orientations or positional relationships shown in the drawings, which are merely for the convenience of describing the present invention and The description is simplified, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, so the above terms should not be construed as limiting the invention.

It can be understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of one element may be one, and in other embodiments, the number of The number may be plural, and the term "a" cannot be understood as a limitation on the number.

As shown in FIGS. 1 to 8C, it is a camera module according to a first preferred embodiment of the present invention. The camera module can be applied to various electronic devices, such as but not limited to smart phones, wearable devices, computer equipment, televisions, vehicles, cameras, monitoring devices, etc., and the camera module cooperates with the electronic devices. Realize image acquisition and reproduction of target objects.

More specifically, a molded photosensitive element 10 of the camera module 100 and its manufacturing equipment 200. The molded photosensitive element 10 includes a circuit board 11, a molded base 12 and a photosensitive element 13. The molding base 12 of the present invention is integrally packaged and formed on the circuit board 11 and the photosensitive element 13 through the manufacturing equipment 200, so that the molding base 12 can replace the mirror of a conventional camera module. Holder or bracket, and does not need to be similar to the traditional packaging process, the lens holder or bracket needs to be attached to the circuit board by glue.

The camera module 100 further includes a lens 30. The molding base 12 includes a ring-shaped molding body 121 and a light window 122 in the middle to provide a light path for the lens 30 and the photosensitive element 13. The photosensitive element 13 is operatively connected to the circuit board 11. For example, the photosensitive element 13 is connected to the circuit board 11 and located on the top of the circuit board 11 by way of COB (Chip On Board) wiring. side. The photosensitive element 13 and the lens 30 are respectively assembled on both sides of the molding base 12 and are optically aligned so that light passing through the lens 30 can reach the photosensitive through the light window 122 Element, so that the camera module 100 can provide an optical image after photoelectric conversion.

As shown in FIGS. 3A and 3B, the camera module 100 may be a moving focus camera module having a driver 40 such as a voice coil motor, a piezoelectric motor, and the like, and the lens 30 is mounted on the driver 40. The molded base 12 can be used to support the driver 40. A filter 50 may be further disposed on the top side of the molding base 12 for filtering light passing through the lens 30, such as an infrared cut-off filter. In this embodiment of the present invention and the accompanying drawings, a moving focus camera module is taken as an example to describe one way in which the present invention can be implemented, but it is not a limitation. In other embodiments of the present invention, the lens 30 It can be installed on the molded photosensitive element 10 without the driver 40, that is, a certain focus module is formed. Those skilled in the art should understand that the type of the camera module is not In a limitation of the invention, the camera module 100 may be a fixed focus camera module or a moving focus camera module.

The circuit board 11 includes a substrate 111, and a plurality of electronic components 112 formed on the substrate 111, such as a SMT process. The electronic components 112 include, but are not limited to, resistors, capacitors, and driving devices. In this embodiment of the present invention, the molding base 12 is integrally covered with the electronic component 112, thereby preventing dust and sundries from adhering to the electronic component 112 similar to those in a conventional camera module. , And further contaminate the photosensitive element 13, thereby affecting the imaging effect. It can be understood that, in another modified embodiment, it is also possible that the electronic component 112 is buried in the substrate 111, that is, the electronic component 112 may not be exposed to the outside. The substrate 111 of the circuit board 111 may be a rigid PCB, a flexible PCB, a rigid-flexible PCB, a ceramic substrate, or the like. It is worth mentioning that, in this preferred embodiment of the present invention, because the molding base 12 can completely cover these electronic components 112, the electronic components 112 may not be embedded in the substrate 111, so The substrate 111 is only used to form a conductive circuit, so that the thickness of the molded photosensitive component 10 finally made is smaller.

In this preferred embodiment of the present invention, the photosensitive element 13 is superposed on the flat superposed region of the circuit board 11 located inside the electronic component 112, and the molding process will be performed on the circuit board. 11 and the photosensitive element 13 form the molded base 12 integrally, that is, the molded base 11 is integrated with the circuit board 11 and the photosensitive element 13. The photosensitive element 13 has a top surface 131. The top surface 131 has a central photosensitive region 1311 and a non-photosensitive region 1312 surrounding the photosensitive region 1311. The molding base 12 integrally covers at least a part of the non-photosensitive area 1312 and the circuit board 11.

Further, as shown in FIG. 2, the manufacturing equipment 200 for the molded photosensitive element 10 of the camera module 100 includes a molding die 210, a molding material feeding mechanism 220, a mold fixing device 230, and The temperature control device 250 and a controller 260. The molding material feeding mechanism 220 is used to provide the molding material 14 to the base molding guide groove 215. The mold fixing device 230 is used to control the opening and closing of the molding mold 210, the temperature control device 250 is used to heat or cool the molding material 14, and the controller 260 is in the molding process It is used to automatically control the operation of the molding material supply mechanism 220, the mold fixing device 230, and the temperature control device 250.

The molding die 210 includes a first mold 211 and a second mold 212 that can be opened and closed under the action of the mold fixing device 230. That is, the mold fixing device 230 can convert the first mold 211 and The second mold 212 is separated and closely contacted to form a molding cavity 213. When the mold is closed, the circuit board 11 is fixed in the molding cavity 213, and the liquid molding material 14 enters the mold cavity 213. The molding cavity 213 is integrally formed on the circuit board 11, and the cured base 12 is integrally formed on the circuit board 11 and the photosensitive element 13 after curing.

More specifically, the molding module 210 further includes a light window forming block 214 and a base forming guide groove 215 formed around the light window forming block 214. The first and second molds 211 When the mold is closed with 212, the light window molding block 214 and the base molding guide groove 215 extend in the molding cavity 213, and the liquid molding material 14 is filled into the base molding guide. Slot 215, and the position corresponding to the light window molding block 214 cannot be filled with the liquid molding material 14, so that at the position corresponding to the base molding guide groove 215, the liquid molding material 14 is After curing, a ring-shaped molding body 121 of the molding base 12 can be formed, and the light window 122 of the molding base 12 will be formed at a position corresponding to the light window molding block 214. The molding material 14 may be selected from, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), epoxy resin, and the like.

The first and second molds 211 and 212 may be two molds capable of generating relative movement, such as one of the two molds is fixed and the other is movable; or both molds are movable. The present invention is not limited in this aspect. Not restricted. In the example of this embodiment of the present invention, the first mold 211 is specifically implemented as a fixed upper mold, and the second mold 212 is implemented as a movable lower mold. The fixed upper mold and the movable lower mold are arranged coaxially, for example, the movable lower mold can slide up along a plurality of positioning axes, and can form a tightly closed space when the mold is closed with the fixed upper mold. Mentioned forming cavity 213.

The second mold 212, that is, the lower mold may have a circuit board positioning groove 2121, which may be in the shape of a groove or formed by a positioning post for mounting and fixing the circuit board 11, and the light window is formed. The block 214 and the base forming guide groove 215 may be formed in the first mold 211, that is, formed in the upper mold. When the first and second molds 211 and 212 are closed, the molding cavity is formed. 213. And the liquid molding material 14 is injected into the base forming guide groove 215 on the top side of the circuit board 11 to form the mold on the top side of the circuit board 11 and the photosensitive element 13. Plastic base 12.

It can be understood that the circuit board positioning groove 2121 can also be provided in the first mold 211, that is, the upper mold, for mounting and fixing the circuit board 11, and the light window molding block 214 and the The base forming guide groove 215 may be formed in the second mold 211, and when the first and second molds 211 and 212 are closed, the forming cavity 213 is formed. The circuit board 11 may be arranged face-to-face in the upper mold, and the molding material 14 in a liquid state is injected into the base molding guide groove 215 on the bottom side of the circuit board 11 upside down, so that The molding base 12 is formed on the bottom side of the circuit board 11 inverted.

More specifically, when the first and second molds 211 and 212 are clamped and a molding step is performed, the light window molding block 214 is superposed on the photosensitive area 1311 of the top surface 131 of the photosensitive element 13 and is tight. The liquid-like molding material 14 is prevented from entering the photosensitive area 1311 of the top surface 131 of the photosensitive element 13 on the circuit board 11, so that the molding material 14 can be positioned at a position corresponding to the light window molding block 214. The light window 122 of the molding base 12 is finally formed.

It can be understood that the molding surface of the first mold 211 forming the base molding guide groove 215 can be configured as a flat surface and is on the same plane. In this way, when the molding base 12 is cured and formed, The top surface of the molding base 12 is relatively flat, so as to provide a flat mounting condition for the driver 40, the lens 30, or other bearing components of the lens, and reduce the tilt error of the camera module 100 after assembly. .

It is worth mentioning that the base forming guide groove 215 and the light window forming block 214 can be integrally formed in the first mold 211. Alternatively, the first mold 211 further includes a detachable molding structure, and the molding structure is formed with the base molding guide groove 215 and the light window molding block 214. In this way, according to the shape and size requirements of the molded photosensitive element 10 such as the diameter and thickness of the molding base, the base forming guide grooves 215 and the light window of different shapes and sizes can be designed. Shaped block 214. In this way, it is only necessary to replace different molding structures, that is, the manufacturing equipment can be adapted to the molded photosensitive element 10 required by different specifications. It can be understood that the second mold 212 may also include a detachable fixing block to provide the grooves 2121 of different shapes and sizes, so as to facilitate the replacement of the circuit board 11 adapted to different shapes and sizes.

It can be understood that the molding material 14 may be a hot-melt material such as a thermoplastic plastic material, and the hot-melt material in a solid state is heated and melted into a liquid state by the temperature control device 250. During the molding process, the hot-melt molding material 14 is solidified and formed through a cooling process. The molding material 14 may also be a thermosetting material. The molding material 14 is changed into a liquid state by heating and melting a thermosetting material in a solid state. During the molding process, the thermosetting molding material 14 is cured by a further heating process, and can no longer be melted after curing to form the molding base 12.

It can be understood that, in the molding process of the present invention, the molding material 14 may be a block shape, a granular shape, or a powder shape, which becomes a liquid in the molding mold 210 after being heated. , And then cured to form the molding base 12.

It can be understood that, in this embodiment, the molding process of one circuit board 11 is illustrated, and in application, a plurality of independent circuit boards 11 may also be subjected to the molding process at the same time. Alternatively, the jigsaw operation mentioned in the second embodiment below can also be used.

FIG. 8A to FIG. 8C are schematic diagrams of a manufacturing process of the molded photosensitive element 10 of the camera module 100 according to this preferred embodiment of the present invention. As shown in FIG. 8A, the molding die 210 is in a closed state. In the mold state, the circuit board 11 to be molded and the solid molding material 14 are fixed in place, and the solid molding material 14 is heated, thereby melting the molding material 14 into a liquid state or a half When in the solid state, it is sent into the base forming guide groove 215 and reaches the periphery of the light window forming block 214.

As shown in FIG. 8B, when the base molding guide groove 215 is completely filled with the liquid molding material 14, the liquid molding material 14 is cured and formed into an integral molding after a curing process. The circuit board 11 and the molded base 12 of the photosensitive element 13. Taking the molding material 14 as a thermosetting material as an example, the molding material 14 which is heated and melted into a liquid state is then subjected to a heating process, so as to be solidified.

As shown in FIG. 8C, after the molding material 14 is cured to form the molding base 12, the demolding process of the present invention is performed, that is, the mold fixing device 230 makes the first and second molds 211 and 212 The light window forming blocks 214 are separated from each other, so that the light window 122 is formed in the mold base 12.

In the prior art, as shown in FIG. 1B, the bottom of the square column-shaped molding block 4 has sharp edges. During the drafting process, the sharp edges will cause greater friction with the inner side of the packaging portion 1, which may cause damage. The inner surface of the package portion 1. In the present invention, the structure of the light window forming block 214 of the present invention does not cause damage to the molding base 12.

More specifically, in this embodiment of the present invention, as shown in FIGS. 8A to 8C, the cross-section of the light window forming block 214 is tapered, that is, the light window forming block 214 has a cone shape, such as a truncated cone shape. The interior is solid or may be hollow, that is, similar to a hollow cover, which can be placed on the photosensitive element 13 to facilitate the subsequent molding process.

In this example of the present invention, it is a solid structure, and the light window forming block 214 has a pressing surface 2141 on the bottom side and a linearly extending outer peripheral forming surface extending in a circumferential direction as a base inside侧 shaped surface 2142. The included angle between the molding surface 2142 on the inner side of the base and the vertical line is the first inclination angle α, which is not an included angle of 0 degrees in the prior art, but an acute angle. More specifically, the magnitude of the first included angle α is preferably 10 ° to 80 °, and more preferably 30 ° to 55 °.

It can be understood that, as shown in FIG. 5 and FIG. 6, the molding main body 121 of the molding base 12 of the molded photosensitive member 10 of the camera module 100 of the present invention has a linear shape. An extended inner side surface 124 has the first inclination angle α of the same size between the inner side surface 124 and the linear direction of the optical axis Y of the photosensitive element 13 of the molded photosensitive element 10.

The magnitude of the first included angle α is not larger as possible. As shown in FIG. 6, the photosensitive element 13 is connected to the circuit board 11 through a set of electrical connection structures. More specifically, the electrical connection structure includes a photosensitive element connection pad 132 provided on the non-photosensitive region 1312 of the photosensitive element 13, and a circuit board connection pad provided on the substrate 111 of the circuit board 11. 113, and a lead wire 15 extending between the photosensitive element connecting plate 132 and the circuit board connecting plate 113, so as to achieve a conductive connection between the photosensitive element 13 and the circuit board 11. The lead 15 is, for example, but not limited to, a gold wire, a silver wire, a copper wire, and an aluminum wire. The shapes of the photosensitive element connection plate 132 and the circuit board connection plate 113 may be, for example, but not limited to, a block shape, a spherical shape, and the like. In order to prevent the light window forming block 214 from compressing the lead 15 when the light window forming block 214 is pressed against the photosensitive element during the molding process, the lead 15 is broken. The molding surface 2142 on the inner side of the base of the light window molding block 214 must not exceed the highest point of the lead 15. In addition, the maximum value of the first included angle α is also different according to different wire bonding methods, and will be further specifically analyzed in the following specific examples.

As shown in FIG. 8A, the cross-section of the light window forming block 214 is a trapezoid that gradually increases from bottom to top. Accordingly, the cross-section of the light window 122 of the formed molding base 12 gradually opens from bottom to top. An enlarged trapezoid, the inner side surface 124 of the molding base 12 does not match and the preferred range of the first included angle α is 10 ° ~ 80 °, more preferably 30 ° ~ 55 °, which is convenient Demolding without damaging the lead 15. In addition, the light window 122 of the molded base 12 having a ladder-shaped cross section can save material and ensure strength.

It is worth mentioning that the selection of the size range of the first included angle α according to the present invention can also effectively avoid stray light. In an existing camera module with a molded package, referring to FIG. 1E, light is incident from the lens, part of the light reaches the photosensitive chip for photosensitivity, and other part of the light, such as light L in FIG. The inner wall is easily reflected by the inner wall of the encapsulation section 1 and reaches the photosensitive wafer 3, and participates in the photoelectric conversion process of the photosensitive wafer 3, thereby affecting the camera module. Imaging quality. According to an embodiment of the present invention, referring to FIG. 7, light is incident from the lens, part of the light reaches the photosensitive element 13, and part of the light, such as light M in the same direction, is projected onto the inclined molding base 12. The inner side surface 124 is reflected by the inner side surface 124 of the molding base 12, so that the reflected light is far from the photosensitive element 13 without reaching the photosensitive element 13 and participating in the photosensitive element The photosensitivity effect of 13 reduces the influence of the reflected stray light on the imaging quality of the camera module.

It is worth mentioning that, in the present invention, the reflectance of the material surface of the molding base 12 in the wavelength range of 435-660 nm of light is less than 5%. That is, most of the light incident on the surface of the molding base 12 cannot be reflected to form interference stray light reaching the photosensitive element 13, thereby significantly reducing the influence of the reflected stray light.

In addition, as shown in the figure, the molded base 12 has an inner side surface 124 along its inner peripheral direction, an outer side surface 125 along its outer peripheral direction, and an annular top side surface 126. The inner side surface 124 integrally extends from the top surface 131 of the photosensitive element 13, and the outer side surface 125 integrally extends from the top surface 1111 of the substrate 111 of the circuit board 11. The first mold 211 of the molding mold 210 is further provided with one or more partition blocks 216 for forming the outer side 125 of the molding base 12 during a molding process. More specifically, the partition block 216 has a base outer side molding surface 2161 to determine the outer side 125 of the molding base 12 formed by curing the molding material 14 in a molding process. Location and shape. There is a top side molding surface 217 between the partition block 216 and the light window molding block 214 to determine the location of the molding base 12 formed by curing the molding material 14 in the molding process. The position and shape of the top side 126 are described. In the prior art, the outer surface of the packaging part 1 is also perpendicular to the circuit board, that is, the molding surface of the outer surface of the base of the partition block of the mold is in a vertical direction, so that during the demolding process, the molding surface of the outer surface of the base of the mold has been It rubs against the outer surface of the package portion 1, which is inconvenient for demolding operations, and also easily damages the outer surface of the formed package portion 1.

In the present invention, the molding surface 2161 on the outer side of the base has a second tilt angle γ with the vertical direction, and the outer side 125 of the molding base 12 has the same size as the optical axis Y direction. The second inclination angle γ is the second inclination angle γ between the outer surface 125 of the mold base 12 and a vertical line when the mold base 12 is arranged horizontally. In order to facilitate demolding, the angle is an acute angle, and in order to make the top side surface 126 of the molding base 12 have a sufficient size to facilitate the completion of the lens 30 or the driver 40 in the following, The second tilt angle γ cannot be too large. That is, if the second tilt angle γ is too large, and the inner side surface 124 and the outer side surface 125 of the molded base 12 are both inclined, the length of the top side surface 126 will be too small. , The lens 30 or the driver 40 cannot be mounted stably. In addition, in this embodiment, the bottom of the driver 40 has an abutting surface, which is attached to the top side surface 126 of the molding base 12, and when the top side surface 126 of the molding base 12 If the size is too small, if it is smaller than the bonding surface, it may cause inconvenient alignment installation of the driver 40, and the driver 40 may be installed on the top side surface 126 of the molding base 12. It will shake and not be stable. Therefore, in the present invention, the maximum value of the angle of the second tilt angle γ preferably does not exceed 45 °. In addition, the minimum value is to facilitate the demolding operation of the molding process and the processing and manufacturing of the molding die 210. Therefore, in the present invention, the minimum value of the angle of the second tilt angle γ is preferably not less than 3 °. Therefore, a suitable range of the second tilt angle γ of the present invention is 3 ° to 45 °, and more preferably 3 ° to 15 °. It is worth mentioning that, as shown in FIG. 5, in order to facilitate demolding and pressing of the substrate 111 of the circuit board 11, the outer side 125 of the molded base 12 and the An outer edge of the substrate 111 of the circuit board 11 will form a pressing distance W, that is, a region suitable for the partition block 216 to be pressed onto the substrate 111 of the circuit board 11 in a mold process. It is the distance between the position where the outer side surface 125 of the molding base 12 integrally extends from the substrate 111 of the circuit board 11 and the outer edge of the substrate 111 of the circuit board 11. The bonding distance W may be 0.1 to 0.6 mm. For example, in a specific example, the bonding distance W may be 0.2 mm.

It can be understood that, because the first inclination angle α and the second inclination angle γ exist in the above range, that is, the inner side surface 124 and the outer side surface 125 of the molding base 12 have an inclination, Therefore, when the mold is demolded, the frictional force with the first mold 211 is reduced, and it is easy to pull out, so that the molding base 12 has a better molding state. More specifically, as shown in FIG. 8C, when the molding process forms the cured molding base 12 and the demolding operation is started, the light window molding block 214 and the partition block 216 start to rise vertically. Move, the base inner side molding surface 2142 of the light window molding block 214 and the base outer side molding surface 2161 of the partition block 216 and the inner side 124 of the molding base 12, respectively It is separated from the outer side surface 125, so that the base inner side molding surface 2142 of the light window forming block 214 and the base outer side molding surface 2161 of the partition block 216 are not separated from the molding, respectively. The inner side surface 124 and the outer side surface 125 of the base 12 are in frictional contact with each other to damage the inner side surface 124 and the outer side surface 125 of the molded base 12, and at the same time, it can be easily pulled out smoothly.

At the same time, the forming mold 210 forms the shape of the base forming guide groove 215, and there is no dead angle at a right angle, and a suitable slope allows the molding material 14 in a fluid state to enter the base forming guide groove 215. Better mobility. And, the first inclination angle α and the second inclination angle γ are acute angles, unlike the right angle in the prior art, so that the top surface 131 of the photosensitive element 13 of the molded photosensitive element 10 is The included angle with the inner side surface 124 of the molding base 12 becomes a relatively rounded obtuse angle, and the light window molding block 214 and the partition block 216 will not form sharp edges and scratch the molding base. The inner side surface 124 and the outer side surface 125 of 12. Moreover, the setting of the range of the first tilt angle α enables the molding base 12 to avoid stray light from affecting the imaging quality of the camera module 100.

As shown in FIG. 9, according to another modified embodiment, the filter element 50 may be superposed with the photosensitive element 13, and then formed into an integral combination with the filter element 50 through the molding process of the present invention. The photosensitive element 13 and the molded base 12 of the circuit board 11.

As shown in FIGS. 10 to 21, the molded photosensitive element 10 of the camera module 100 according to the second embodiment of the present invention and a manufacturing process thereof. In this embodiment, a molded photosensitive element panel 1000 is manufactured by a puzzle operation, and then the molded photosensitive element 10 is cut.

Accordingly, more specifically, the forming mold 210 forms a forming cavity 213 when the mold is closed, and provides a plurality of light window forming blocks 214 and one or more base panel forming guide grooves 2150, which is equivalent to providing a A plurality of interconnected base-forming guide grooves 215 form a whole guide groove.

Before the molding process, a circuit board assembly 1100 is first manufactured, which includes a plurality of circuit boards 11 connected integrally, and each of the circuit boards 11 can be connected to the photosensitive element 13 by a wire connection.

When the circuit board assembly 1100 to which a plurality of the photosensitive elements 13 are connected is placed in the molding cavity 213, and when the molding die 210 is in a mold clamping state, the molding material 14 in a solid state is The heat is melted and sent to the base panel forming guide groove 2150, so as to fill the periphery of each of the light window forming blocks 214. Finally, the liquid-like molding material 14 undergoes a curing process, so that the liquid-like molding material 14 located in the base panel forming guide groove 2150 is cured and hardened to form an integral molding in the mold. The circuit board assembly 1100 includes each of the circuit board 11 and the molding base 12 on the photosensitive element 13, and these molding bases 12 form an integrated molding base assembly 1200.

In order to closely adhere the molding surface of the first mold 211 to the circuit board 11 and the photosensitive element 13 and facilitate demolding, the molding surface of the first mold 211 is to the circuit board 11 and the photosensitive element 13 is also provided with an elastic film layer 219.

It is worth mentioning that, when each of the molded photosensitive elements 10 of the monomer produced by cutting the molded photosensitive component jigsaw 1000 is used to make a moving focus camera module, that is, an autofocus camera module, the molding The mold 210 is further provided with a plurality of driver pin groove forming blocks 218, and each of the driver pin groove forming blocks 218 extends into the base panel forming guide groove 2150, so that during the molding process, the liquid The molding material 14 does not fill the position corresponding to each of the driver pin groove molding blocks 218, so that after the curing step, in the molding base panel 1200 of the molded photosensitive component panel 1000 A plurality of the light windows 122 and a plurality of driver pin grooves 127 are formed, and the molding base 12 of each of the molded photosensitive elements 10 of the monomer produced by cutting is configured with the driver pin grooves. 127, so that when the moving focus camera module 100 is manufactured, the pin 41 of the driver 40 can be connected to the circuit board 11 of the molded photosensitive element 10 by means of soldering or conductive adhesive sticking.

It can be understood that, compared with the manufacturing process of the single-mold molded photosensitive member 10 of the first embodiment, in the jigsaw operation, two adjacent two of the two molded bases 12 are formed. The base molding guide grooves 215 are equivalent to intersect together, and a plurality of the light window molding blocks 214 are arranged at a distance from each other, so that the molding material 14 can finally form a molding structure of the molding base. Block jigsaw 1200.

In the step of manufacturing the molded photosensitive element 10 of a single body: the molded photosensitive element jigsaw 1000 may be cut to obtain a plurality of independent molded photosensitive components 10 for use in manufacturing a single-piece imaging Module. It is also possible to cut and separate two or more of the molded light-sensitive components 10 integrally connected from the molded light-sensitive element jig 1000 to be used for making a split-type array camera module, that is, the array camera module Each of the camera modules has an independent molded photosensitive element 10, wherein two or more of the molded photosensitive elements 10 can be connected to a control motherboard of the same electronic device, so that two or more The array camera module manufactured by the molded photosensitive element 10 can transmit images captured by multiple camera modules to the control motherboard for image information processing.

As shown in FIG. 22, the molding process of the jigsaw operation can also be used to make a molded photosensitive assembly 10 having two or more of the light windows 122, where such a molded photosensitive element 10 can be used To make an array camera module with a common substrate. That is, taking the molded photosensitive element 10 of the dual-camera module as an example, in the molding process of each circuit board 11 of the circuit board assembly 1100, one circuit board substrate 111 is correspondingly disposed There are two said light window forming blocks 214, and the two spaced apart said light window forming blocks 214 are surrounded by two integrally connected base forming guide grooves 215, so that after the molding process is completed, each of said circuits The board 11 forms a one-piece molded base having two of the light windows 122 that share one of the circuit board substrates 111, and two of the photosensitive elements 13 and two of the lenses 30 are mounted correspondingly. In addition, the substrate 111 of the circuit board 11 can be connected to a control motherboard of an electronic device. In this way, the array camera module manufactured in this embodiment can transmit images captured by multiple camera modules to the control. The motherboard performs image information processing.

As shown in FIG. 23, according to a modified embodiment, the molding base 12 of the molding process of the present invention can further be integrally extended to form a lens mounting portion 16 with a through hole 161 therein, suitable for Attach the lens 30. It is worth mentioning that the position of the light window forming block 214 and the partitioning block 216 are only arc-shaped chamfer transitions at the corners. It can be understood that, in the above embodiment, the light window forming block 214 and The positions of the partition blocks 216 at the edges and corners can also be configured as arc-shaped chamfered transitions, so as to avoid damage to the molding base 12 formed during demolding.

As shown in FIG. 24, according to another modified embodiment, before the molding process, the photosensitive element 13 may be provided with a ring-shaped barrier element 17, which is mounted or coated on the top surface of the photosensitive element 13. The non-photosensitive area 1312 of 131 is elastic, so that during the molding process, the light window forming block 214 is pressed against the blocking element 17 to prevent the molding material 14 from entering the photosensitive element 13. The light-sensitive area 1311 and the pressing surface 2141 of the light window forming block 214 are spaced from the photosensitive element 13 so that the pressing surface 2141 of the light window forming block 214 will not damage all The photosensitive region 1311 of the photosensitive element 13. In a specific example, the blocking element 17 has a square ring shape and is implemented as a step glue, that is, a glue is applied or glued on the non-photosensitive area 1312 of the top surface 131 of the photosensitive element 13. Then, the blocking element 17 is formed after the glue is cured.

11 to FIG. 15, the structure of the camera module 100 according to the second embodiment of the present invention is further described. The camera module 100 includes a molded photosensitive assembly 10. The molded photosensitive element 10 includes a circuit board 11, a molded base 12 and a photosensitive element 13. The camera module 100 further includes a lens 30. The molding base 12 includes a ring-shaped molding body 121 and a light window 122 in the middle to provide a light path for the lens 30 and the photosensitive element 13. The photosensitive element 13 is operatively connected to the circuit board 11. For example, the photosensitive element 13 is connected to the circuit board 11 through a COB wire and is located on the top side of the circuit board 11. The photosensitive element 13 and the lens 30 are respectively assembled on two sides of the molding base 12 and are aligned optically so that the light passing through the mirror light 30 can reach the light through the light window 122. The light-sensitive element enables the camera module 100 to provide an optical image after the photoelectric conversion effect. As shown in FIG. 25, the camera module 100 is applied in a smart electronic device 300. For example, the camera module 100 is applied to a mobile phone and is arranged along its thickness direction, and one or A plurality of the camera modules 100.

The difference from the first embodiment is that a top-side groove 123 is formed on the top side of the molding base 12 for mounting the filter 50. Alternatively, the top side groove 123 is used to conveniently support an additional filter lens holder 60, and the filter lens holder 60 is used to mount the filter 50, as shown in FIG. 12.

Correspondingly, the circuit board 11 includes a substrate 111 and a plurality of electronic components 112 formed on the substrate 111, such as being mounted by an SMT process. The photosensitive element 13 has a top surface 131 having a central photosensitive region 1311 and a non-photosensitive region 1312 on the outer edge. The molding base 12 is integrally formed on the circuit board 11 and the photosensitive element 13. At least a part of the non-photosensitive region 1312 and covers the electronic component 112.

The molding base 12 has an inner side surface 124, an outer side surface 125, and a top side surface 126, that is, the inner side surface 124 along its inner peripheral direction, the outer side surface 125 along its outer peripheral direction, and an annular shape. The top side surface 126 defines the shape of the annular molded body 121.

In this embodiment, the inner side surface 124 of the molded base 12 is a flat inner surface that extends non-linearly, but is an inner surface that bends and extends. More specifically, it further includes a first portion that extends integrally. The inner side surface 1241, a second part internal side surface 1242, and a third part internal side surface 1243. As shown in the figure, the camera module 100 is arranged in a vertical direction. The inner side surface 1241 of the first portion integrally extends obliquely to the non-photosensitive region 1312 of the photosensitive element 13, and the second portion The inner side surface 1242 extends substantially along the horizontal direction from the first part inner side surface 1241, and the third part inner side surface 1243 integrally extends obliquely from the second part inner side surface 1242. The ring-shaped molding main body 121 of the molding base 12 is formed with a base portion 121 a corresponding to a bottom side, and a step portion 121 b extending integrally from the base portion 121 a. The step portion 121b may form an overall annular step, or may be a multi-segment type, such as a three-segment type, and there is no raised step on one side of the molding base. The step portion 121b has a larger inner diameter than the base portion 121a. The inner surface of the base portion 121a is the first partial inner side surface 1241 of the inner surface 124 of the molding base 12, and the top surface of the base portion 121a is the first surface of the molded base 12. The second partial inner side surface 1242 of the inner side surface 124, the inner surface of the step portion 121b, that is, the third partial inner side surface 1243 of the inner side surface 124 of the molding base 12, the step The top surface of the portion 121 b is the top side surface 126 of the molding base 12.

It can be understood that there is a first inclination angle α between the inner side surface 1241 of the first portion and the linear direction of the optical axis Y of the camera module 100, that is, when the camera module 100 is aligned in the vertical direction, The first inclination angle α is formed between the inner surface 1241 of the first portion and a vertical line. The extending direction of the inner surface 1242 of the second portion is substantially perpendicular to the linear direction of the optical axis Y of the camera module 100. A third inclination angle β exists between the inner side surface 1243 of the third portion and the linear direction of the optical axis Y of the camera module 100, that is, when the camera module 100 is aligned in the vertical direction, the third The third inclination angle β is provided between a part of the inner side surface 1243 and the vertical line.

The outer side 125 of the molded base 12 extending from the top surface 1111 of the substrate 111 of the circuit board 11 may include one or more outer peripheral surfaces 1251, where in the second embodiment of the present invention Because it is possible to make the molded photosensitive element assembly 1000 that is integrally connected, and finally cut to obtain a single molded photosensitive element 10, wherein the molded photosensitive element 10 is formed in the outer peripheral direction of the molded base 12. Some outer peripheral surfaces 1251 of the outer side surface 125 are obtained by cutting so that they can be vertical flat surfaces, and at least one outer peripheral surface 1251 passes through the base of the partition block 216 of the molding die 210 in a molding process. The side molding surface 2161 is defined. As shown in FIG. 21, the front outer peripheral surface 1251 of the molded photosensitive element 10 obtained by cutting is formed by molding the outer surface of the base of the partition block 216 corresponding to the molding die 210. A surface 2161 is formed. The front outer peripheral surface 1251 and the linear direction of the optical axis Y of the camera module 100 have a second tilt angle γ, that is, when the camera module 100 is aligned in the vertical direction, the Between the front outer peripheral surface 1251 and the vertical line Said second inclination angle γ. In addition, the molding base 12 is further formed with one or more driver pin grooves 127, each of which has a pin groove wall surface 1271, and the pin groove wall surface 1271 and the optical axis Y of the camera module 100 There is a fourth inclination angle δ between the straight directions, that is, when the camera module 100 is arranged in the vertical direction, the fourth inclination angle δ is between the pin groove peripheral surface 1271 and the vertical line.

It is worth mentioning that, similar to the above embodiment, as shown in FIG. 14, in order to facilitate demolding and pressing of the substrate 111 of the circuit board 11, the outer side 125 of the molding base 12 The pressing distance from the position where the substrate 111 of the circuit board 11 extends integrally to the outer edge of the substrate 111 of the circuit board 11 is W, and the pressing distance W may be 0.1 to 0.6 mm. For example, this The pressing distance W may be 0.2 mm.

In this embodiment of the present invention, the first tilt angle α ranges from 10 范围 to 80︒. In some specific embodiments, it may be 10︒ to 30︒, or 30︒ to 45︒, or 45︒. ~ 55︒, or 55︒ ~ 80︒. The second tilt angle γ ranges from 3 ° to 45 °. In some specific embodiments, it may be 3 ° to 15 °, or 15 ° to 30 °, or 30 ° to 45 °. The third tilt angle β ranges from 3 ° to 30 °. In some specific embodiments, it may be 3 ° to 15 °, or 15 ° to 20 °, or 20 ° to 30 °. The fourth tilt angle δ ranges from 3 ° to 45 °. In some specific embodiments, it may be 3 ° to 15 °, or 15 ° to 30 °, or 30 ° to 45 °.

The light window forming block 214 and the partition block 216 are in the shape of a truncated cone, and the edges and corners thereof are in a linear transition, or they may be arc-shaped and more rounded, but the angle range of each surface extension is approximately within the above specific range .

Correspondingly, the entire molding surface of the first mold 211 of the molding mold 210 is configured to form the molding base 12 of the above structure. More specifically, as shown in the figure, the light window forming block 214 includes a bottom pressing portion 214a and a top side groove forming portion 214b. The pressing head 214 a and the groove forming portion 214 b are used to form the light window 122 of the molding base 12, and the groove forming portion 214 b is used to The top side groove 123 is formed on the top side.

It can be understood that the light window molding block 214 includes a pressing surface 2141 on the bottom side, and a molding surface 2142 on the inner side of the base in the outer circumferential direction. Further, in this embodiment, the inner side molding surface 2142 of the base of the light window molding block 214 includes a first partial molding surface 21421, a second partial molding surface 21422, and a third partial molding that extend integrally. Face 21423. The first part inner side surface 1241, the second part inner side surface 1242, and the third part inner side surface 1243 are respectively corresponding to form an integral extension of the inner side of the molding base 12.

In this embodiment of the present invention, as shown in the figure, the camera module 100 is placed vertically, and the linear direction of the optical axis Y of the photosensitive element 13 of the camera module 100 is parallel to a vertical line. Correspondingly, there is the first inclination angle α between the first partial molding surface 21421 and the vertical line, and the size ranges from 10︒ to 80︒, and the third partial molding surface 21423 has the distance between the vertical line and the vertical line. The third inclination angle β is in a range of 3 ° to 30 °.

Correspondingly, the bottom side of the pressing head 214a forms the pressing surface 2141 of the light window forming block 214, and the outer side of the pressing head 214a forms the first portion of the light window forming block 214 A molding surface 21421, a bottom side surface of the groove molding portion 214b forming the second partial molding surface 21422 of the light window molding block 214, and an outer side surface of the groove molding portion 214b forming the light window molding block 214 The third partial molding surface 21423, the pressing head portion 214a and the groove molding portion 214b are configured in a truncated cone shape. The pressing head 214a and the groove forming portion 214b have a trapezoidal cross-section, thereby preventing damage to the elastic film layer 219. More specifically, taking the groove forming part 214b as an example, the forming block in the prior art has sharp edges and corners, and it is easy to form the second part forming surface 21422 and the third part during the demolding process. Where the surface 21423 meets, the elastic film layer 219 is pierced. The groove forming portion 214b has an obtuse angle between the second partial forming surface 21422 and the third partial forming surface 21423 on the bottom side and the outer peripheral side, respectively, so as to facilitate the removal of the groove forming portion 214b. mold.

Corresponding to at least one outer peripheral surface 1251 of the outer side surface 125 of the molded photosensitive member 10, the partition block 216 has a base outer side molding surface 2161, and the second inclination between the partition block 216 and a vertical line Angle γ, its suitable size range is 3︒ ~ 45︒.

The plurality of driver pin groove forming blocks 218 further provided by the forming mold 210 have a pin groove side forming surface 2181, and the fourth inclination angle δ between the lead groove forming surface and a vertical line is suitable. The range is 3︒ ~ 30︒.

Accordingly, the above-mentioned configuration of the first mold 211 and the molding base of the molding mold 210 of the present invention have the following advantages.

In a first aspect, the demolding operation of the light window forming block 214 and the partition block 216 configured by the first mold 211 is facilitated. That is, because the first inclination angle α, the second inclination angle γ, the third inclination angle β, and the fourth inclination angle δ are provided at an acute angle for convenient demolding, the light window forming block 214 The friction between the partition block 216 and the molding base 12 is reduced, and it is easy to pull out. The molding base 12 can obtain a better molding state. As shown in FIG. 19, as long as the light window forming block 214 and the partition block 216 are separated from the molding base 12 and there is a relative displacement up and down, the light window forming block 214 and the partition block 216 There is no longer any friction with the molding base 12, that is, the inside molding surfaces 21421, 21422, and 21423 of the base of the light window molding block 214 and the inside surface 1241 of the molding base 12 1242 and 1243 are separated, the base side molding surface 2161 of the partition block 216 is separated from the outer side 125 of the molding base 12, so that the light window molding block 214 and the partition The block 216 and the molding base 12 can be pulled out relatively smoothly, thereby reducing the influence on the molding state of the molding base 12.

In the second aspect, the molding die 210 forms the shape of the base panel forming guide groove 2150, and there is no dead angle at right angles, and a suitable slope allows the molding material 14 in a fluid state to enter the base assembly. When the plate guide groove 215 is formed, the fluidity is better. That is, the molding material 14 is usually in a fluid state during the molding process, and needs to flow in the molding cavity 213, and the size of the flow area affects the filling effect. The structure of the base panel forming guide groove 2150 of the present invention can increase the flow speed, so that it can be molded in a shorter time, and is more helpful for the molding of the molded base 12

A third-party manufacturer's plane, the first inclination angle α, the second inclination angle γ, the third inclination angle β, and the fourth inclination angle δ, which are acute angles, are different from the right angle in the prior art. The window forming block 214 and the partitioning block 216 do not form sharp edges to scratch the inner side surface 124 and the outer side surface 125 of the molding base 12.

In a fourth aspect, the acute inclination angle α, the second inclination angle γ, the third inclination angle β, and the fourth inclination angle δ are set such that the molding base 12 has The inner side surface 124, at least a part of the outer side surface 125 and the lead groove wall surface 1271 are in an inclined state, so that the volume of the molding base 12 is relatively small, and the overall molding material 14 needs to be reduced.

In a fifth aspect, the setting of the range of the first tilt angle α and the third tilt angle β of the acute angle enables the molding base 12 to prevent stray light from affecting the imaging quality of the camera module 100. More specifically, it reduces the possibility of stray light reaching the photosensitive element 13. That is, when the stray light in the camera module 100 is incident on the bent inner surface 124 of the molding base 12, the inclined inner portion 1241 and the first portion The three-part inner side surface 1243 and the second-part inner side surface 1242 extending in the horizontal direction reflect incident stray light away from the photosensitive element 13 so that the stray light does not easily reach the photosensitive element 13 and affects the imaging mode. The imaging quality of the group 100 has an effect.

In addition, the values of the first inclination angle α, the second inclination angle γ, and the third inclination angle β are also in order to enable the molded base 12 to better perform the function of its bracket, such as Ensure that the top side 126 has sufficient size to facilitate the completion of the lens 30 or the driver 40, and ensure that the second side inner side 1242 has sufficient size to facilitate the installation of the filter 50 or The filter lens holder 60. That is, the values of the first inclination angle α, the second inclination angle γ, and the third inclination angle β cannot be too large, so that the length of the top side 126 is too small to give the lens 30 or the The driver 40 provides a stable mounting position. In addition, the first inclination angle α also needs to be considered that the light window forming block 214 cannot be pressed to the lead 15, and the lead 15 is broken.

In the following, the range of values of the first inclination angle α, the second inclination angle γ, and the third inclination angle β will be specifically described with seven examples of the second embodiment of FIGS. 26 to 32. . In these seven examples, the first inclination angle α is provided between the inner side surface 1241 of the first portion of the molded base 12 and a vertical line. At least one outer peripheral surface 1251 of the outer side surface 125 has the second inclination angle γ between the vertical line, and the third partial inner side surface 1243 of the inner side surface 124 of the molding base 12 is perpendicular to the vertical line. There is the third tilt angle β therebetween. The distance between the position where the first portion inner surface 1241 of the molding base 12 is connected to the photosensitive element 13 and the position where the first portion inner surface 1241 and the second portion inner surface 1242 are connected is L1 , The distance between the connection position between the inner surface 1241 of the first portion and the inner surface 1242 of the second portion and the connection position between the top surface 126 and the inner surface 1243 of the third portion is L2, the molding The length of the top side surface 126 of the base 12 is L3, and the distance between the top side surface 126 of the molded base 12 and the top surface of the substrate 111 of the circuit board 11 is H1. The distance between the inner surface 1242 of the second portion and the top surface of the substrate 111 of the circuit board 11 is H2, and the distance between the highest point of the lead 15 and the photosensitive element 13 is H3.

As shown in FIG. 26 to FIG. 28, in these three examples, the wired connection method between the photosensitive element 13 and the circuit board 11 is from the photosensitive element 13 to the circuit board 11. That is, by providing the photosensitive element connecting plate 132 on the photosensitive element 13, a wire bonding jig is first wired on the top of the photosensitive element connecting plate 132 to form one of the leads 15 connected to the photosensitive element connecting plate 132. The first end 151 will then raise the preset position, and then move toward the circuit board connection plate 113 and lower again to form the lead connected to the circuit board connection plate 113 at the top of the circuit board connection plate 113. A second end 152 of 15 so that the lead 15 extends in a curved shape, and the top end of the lead 15 cannot be used by the inner side of the base of the first portion of the light window molding block 214 during the molding process. The molding surface 21421 is crushed, so that the magnitude of the first tilt angle α has a maximum limit.

As shown in FIG. 29 to FIG. 32, in these four examples, the wired connection between the photosensitive element 13 and the circuit board 11 is from the circuit board 11 to the photosensitive element 13. That is, by providing the circuit board connection plate 113 on the circuit board 11, a wire bonding jig is first wired on the top of the circuit board connection plate 113 to form a lead wire 15 connected to the circuit board connection plate 113. The second end 152 will then raise the preset position, and then translate toward the circuit board connection plate 113 and form the opposite of the lead 15 connected to the photosensitive element connection plate 132 on the top of the inductive light element connection plate 132. The first end 151, so that the lead 15 extends in a curved shape, and the top end of the lead 15 cannot be used by the molding portion of the first portion of the inner side of the light window forming block 214 during the molding process. Squeezed so that the magnitude of the first tilt angle α has a maximum limit. In addition, in order to make the inner side surface 1242 of the second portion and the top side surface 126 have sufficient dimensions, the second tilt angle γ and the third tilt angle β should not be too large. That is, there is a restriction relationship between the range of values of the second tilt angle γ and the third tilt angle β and the parameters L1, L2, L3, H1, H2, and H3.

As shown in FIG. 26, the angle α is 10 °, the angle β is 3 °, and the angle γ is 3 °. The value of L1 is 0.23mm, the value of L2 is 1.09mm, the value of L3 is 0.99mm, the value of H1 is 1.30mm, the value of H2 is 0.93mm, and the value of H3 is 0.17mm. The first tilt angle α, the second tilt angle γ, and the third tilt angle β have appropriate minimum values.

As shown in FIG. 27, the angle α is 30 °, the β angle is 20 °, and the angle γ is 30 °. The value of L1 is 0.38mm, the value of L2 is 1.25mm, the value of L3 is 0.21mm, the value of H1 is 1.34mm, the value of H2 is 0.93mm, and the value of H3 is 0.17mm.

As shown in FIG. 28, the angle α is 55 °, the β angle is 30 °, and the angle γ is 45 °. The value of L1 is 0.54mm, the value of L2 is 0.39mm, the value of L3 is 0.42mm, the value of H1 is 0.86mm, the value of H2 is 0.38mm, and the value of H3 is 0.17mm. Wherein, when the wire connection between the photosensitive element 13 and the circuit board 11 is from the photosensitive element 13 to the circuit board 11, the maximum value of the first inclination angle α is 55 °.

More specifically, as shown in FIG. 29, the angle α is 10 °, the β angle is 30 °, and the angle γ is 45 °. The L1 value is 0.23mm, the L2 value is 1.28mm, the L3 value is 0.82mm, the H1 value is 1.30mm, the H2 value is 0.93mm, and the H3 value is 0.13mm. The magnitude of the first tilt angle α is a suitable minimum value, and the magnitude of the second tilt angle γ and the third tilt angle β are appropriate maximum values.

As shown in FIG. 30, the angle α is 30 °, the β angle is 20 °, and the angle γ is 30 °. The value of L1 is 0.38mm, the value of L2 is 1.24mm, the value of L3 is 0.21mm, the value of H1 is 1.34mm, the value of H2 is 0.93mm, and the value of H3 is 0.13mm.

As shown in FIG. 31, the angle α is 45 °, the angle β is 15 °, and the angle γ is 15 °. The value of L1 is 0.73mm, the value of L2 is 0.65mm, the value of L3 is 1.88mm, the value of H1 is 1.33mm, the value of H2 is 1.00mm, and the value of H3 is 0.13mm.

As shown in FIG. 32, the angle α is 80 °, the angle β is 3 °, and the angle γ is 3 °. The value of L1 is 1.57mm, the value of L2 is 0.15mm, the value of L3 is 2.19mm, the value of H1 is 1.45mm, the value of H2 is 0.54mm, and the value of H3 is 0.13mm. Wherein, the wiring connection method between the photosensitive element 13 and the circuit board 11 is from the circuit board 11 to the photosensitive element 13, because the lead wire does not lead to the wiring method in FIG. 26 to FIG. 28. When the lead wire needs to be raised, the position of the highest point of the lead wire 51 is lowered, and the maximum value of the first tilt angle α is 80 °. And in this example, the magnitudes of the second tilt angle γ and the third tilt angle β are appropriate minimum values.

It can be understood that the specific values of the parameters L1, L2, L3, H1, H2, and H3 are merely examples and do not limit the present invention. In practical applications, according to the camera module 100 and the molded photosensitive element 10 specifications can vary.

According to this embodiment of the present invention, according to the data as an example, it can be shown that a suitable range of the first tilt angle α is 10 是 to 80︒, and a suitable range of the second tilt angle γ is 3︒. ~ 45 °, and a suitable range of the third tilt angle β is 3 ° to 30 °.

Those skilled in the art should understand that the embodiments of the present invention shown in the above description and the accompanying drawings are merely examples and do not limit the present invention. The object of the invention has been completely and effectively achieved. The function and structural principle of the present invention have been shown and explained in the embodiments, and the embodiments of the present invention may have any deformation or modification without departing from the principle.

1‧‧‧Packaging Department
2‧‧‧ circuit board
3‧‧‧ Photosensitive Chip
4‧‧‧ Upper mold forming block
5‧‧‧ bracket
6‧‧‧installation space
10‧‧‧ molded photosensitive element
11‧‧‧Circuit Board
12‧‧‧ molded base
13‧‧‧ Photosensitive element
15‧‧‧ Lead
16‧‧‧Lens mounting section
17‧‧‧ barrier element
30‧‧‧ lens
40‧‧‧Driver
41‧‧‧pin
50‧‧‧ Filter
60‧‧‧ Filter lens holder
100‧‧‧ camera module
111‧‧‧ substrate
112‧‧‧Electronic components
113‧‧‧Circuit board connection plate
121‧‧‧ ring shaped body
121a‧‧‧Abutment Department
121b‧‧‧Step
122‧‧‧light window
123‧‧‧Top side groove
124‧‧‧ inside
125‧‧‧ outside
126‧‧‧Top side
127‧‧‧Driver pin slot
131‧‧‧Top surface
132‧‧‧Photosensitive element connecting plate
151‧‧‧ the first end
152‧‧‧second end
200‧‧‧Manufacturing equipment
210‧‧‧Forming mold
220‧‧‧Molding material supply mechanism
230‧‧‧Mould fixing device
250‧‧‧Temperature control device
260‧‧‧controller
211‧‧‧The first mold
212‧‧‧Second Mould
214‧‧‧Light window forming block
214a‧‧‧press head
214b‧‧‧Groove forming section
215‧‧‧Base forming guide groove
216‧‧‧ divider
217‧‧‧Top side molding surface
218‧‧‧Driver pin groove forming block
219‧‧‧ film
300‧‧‧ Smart Electronic Equipment
1000‧‧‧ Molded Photosensitive Element
1100‧‧‧Circuit board jigsaw
1111‧‧‧Top surface
1200‧‧‧moulded base
1241‧‧‧Part 1 inside
1242‧‧‧Inner side of part two
1243‧‧‧Part 3 inside
1251‧‧‧outer surface
1271‧‧‧Lead groove wall surface
1311‧‧‧ Sensitive area
1312‧‧‧ Non-sensitive area
2121‧‧‧Circuit board positioning slot
2141‧‧‧Compression surface
2142‧‧‧Inner side molding surface
2150‧‧‧Base plate forming guide groove
2161‧‧‧Forming surface of base
21421‧‧‧Part I molding surface
21422‧‧‧Part 2 molding surface
21423‧‧‧Part III molding surface
L1‧‧‧Distance
L2‧‧‧distance
L3‧‧‧ length
H1‧‧‧Distance
H2‧‧‧distance
H3‧‧‧ Distance
W‧‧‧ Pressing distance α‧‧‧ First tilt angle β‧‧‧ Third tilt angle γ‧‧‧ Second tilt angle δ‧‧‧ Fourth tilt

FIG. 1A is a schematic structural diagram of a photosensitive element packaged in a conventional process. FIG. 1B is a schematic diagram of a molding process of a conventional photosensitive component. FIG. 1C is a schematic diagram of a demolding process of a photosensitive component in a conventional integrated packaging process. FIG. 1D is a schematic diagram of a light path of a camera module packaged by a conventional COB method. FIG. 1E is a schematic diagram of an optical path of a camera module with a conventional integrated package. FIG. 2 is a schematic block diagram of a manufacturing apparatus of a molded photosensitive element of a camera module according to a first preferred embodiment of the present invention. 3A is an exploded perspective view of a camera module according to a first preferred embodiment of the present invention. FIG. 3B is a cross-sectional view of the camera module according to the first preferred embodiment of the present invention, taken along a length direction thereof. 4 is a schematic perspective view of a molded photosensitive component of a camera module according to the first preferred embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of a molded photosensitive member of a camera module according to the first preferred embodiment of the present invention, taken along line A-A in FIG. 4. FIG. 6 is a partially enlarged schematic view illustrating an inclination angle of a molded photosensitive element of a camera module according to the above-mentioned first preferred embodiment of the present invention to facilitate demolding. FIG. 7 is a schematic diagram of stray light avoidance of the camera module according to the first preferred embodiment of the present invention. FIG. 8A is a cross-sectional view when a liquid molding material is pushed into a base molding guide groove in the molding mold of the molding photosensitive member according to the first preferred embodiment of the present invention, and the cross-sectional view corresponds to FIG. 4. A cross-sectional view in the direction of the AA line shown in FIG. FIG. 8B is a view corresponding to AA in FIG. 4 to form a molding base by performing a molding step in the molding mold of the manufacturing apparatus for molding the photosensitive element according to the above-mentioned first preferred embodiment of the present invention. Sectional view in line direction. FIG. 8C is a schematic diagram of a demolding process of the molded photosensitive member according to the first preferred embodiment of the present invention after molding. FIG. 9 is a schematic structural diagram of another modified embodiment of the molded photosensitive member according to the first preferred embodiment of the present invention. FIG. 10 is an exploded perspective view of a camera module according to a second preferred embodiment of the present invention. 11 is a cross-sectional view of a camera module according to the above-mentioned second preferred embodiment of the present invention, taken along a length direction thereof. FIG. 12 is a cross-sectional view of a modified embodiment of a camera module according to the above-mentioned second preferred embodiment of the present invention. 13 is a schematic perspective view of a molded photosensitive component of a camera module according to the second preferred embodiment of the present invention. 14 is a schematic cross-sectional view of a molded photosensitive member of a camera module according to the second preferred embodiment of the present invention, taken along the line C-C in FIG. 13. FIG. 15 is a partially enlarged schematic view illustrating an inclination angle of a molded photosensitive element of a camera module according to the second preferred embodiment of the present invention to facilitate demolding. FIG. 16 illustrates a cross-sectional view when a liquid molding material is pushed into a base panel molding guide groove in the molding mold of the molding photosensitive member according to the above-mentioned second preferred embodiment of the present invention, where the cross-sectional view corresponds to A cross-sectional view taken along the line CC in FIG. 13. FIG. 17 illustrates a cross-sectional view when a liquid molding material is pushed into a base panel molding guide groove in the molding mold of the molding photosensitive member according to the above-mentioned second preferred embodiment of the present invention, where the cross-sectional view corresponds to A cross-sectional view taken along the line CC in FIG. 13. FIG. 18 illustrates a molding base panel corresponding to the direction of the EE line in FIG. 13 by performing a molding step in the molding mold of the molding photosensitive member according to the above-mentioned second preferred embodiment of the present invention. Sectional view. FIG. 19 is a schematic view showing a demolding process of the molded photosensitive member according to the second preferred embodiment of the present invention after molding. FIG. 20 is a schematic diagram of the three-dimensional structure of the molded photosensitive element panel manufactured according to the molding process of the second embodiment of the present invention. FIG. 21 is a schematic structural view of a single molded photosensitive element obtained by cutting the molded photosensitive component panel manufactured according to the molding process of the second embodiment of the present invention. FIG. 22 is a cross-sectional view of the molded photosensitive member according to another modified embodiment of the above-mentioned second embodiment of the present invention. 23 is a schematic cross-sectional view of a camera module according to another modified embodiment of the second preferred embodiment of the present invention. 24 is a schematic cross-sectional view of a camera module according to another modified embodiment of the second preferred embodiment of the present invention. FIG. 25 is a schematic structural diagram of the camera module applied to a mobile phone according to the present invention. FIG. 26 is a partially enlarged schematic view illustrating a tilt angle of a first example of the molded photosensitive element manufactured according to the molding process of the above-mentioned second embodiment of the present invention to facilitate demolding. FIG. 27 is a partially enlarged schematic view illustrating a tilt angle for facilitating demolding of the second example of the molded photosensitive element manufactured according to the molding process of the above-mentioned second embodiment of the present invention. FIG. 28 is a partially enlarged schematic view illustrating a tilt angle of a third example of the molded photosensitive element manufactured according to the molding process of the second embodiment of the present invention to facilitate demolding. FIG. 29 is a partially enlarged schematic view illustrating an inclination angle for facilitating demolding of the fourth example of the molded photosensitive member manufactured according to the molding process of the above-mentioned second embodiment of the present invention. FIG. 30 is a partially enlarged schematic view illustrating a tilt angle of a fifth example of the molded photosensitive element manufactured according to the molding process of the second embodiment of the present invention to facilitate demolding. FIG. 31 is a partially enlarged schematic view illustrating a tilt angle of a sixth example of the molded photosensitive element manufactured according to the molding process of the second embodiment of the present invention to facilitate demolding. FIG. 32 is a partially enlarged schematic view illustrating a tilt angle of a seventh example of the molded photosensitive element manufactured according to the molding process of the second embodiment of the present invention to facilitate demolding.

12‧‧‧ molded base

13‧‧‧ Photosensitive element

15‧‧‧ Lead

111‧‧‧ substrate

112‧‧‧Electronic components

113‧‧‧Circuit board connection plate

121‧‧‧ ring shaped body

121a‧‧‧Abutment Department

121b‧‧‧Step

124‧‧‧ inside

125‧‧‧ outside

126‧‧‧Top side

132‧‧‧Photosensitive element connecting plate

1312‧‧‧ Non-sensitive area

1241‧‧‧Part 1 inside

1242‧‧‧Inner side of part two

1243‧‧‧Part 3 inside

1251‧‧‧outer surface

α‧‧‧First tilt angle

β‧‧‧ third tilt angle

γ‧‧‧ second tilt angle

Claims (25)

A molded photosensitive component is applied to a camera module, which includes at least one circuit board, at least one photosensitive element, and at least one molded base. The molded base is connected with the circuit board and the substrate through a molding process. The photosensitive element is integrated, wherein the molded base forms at least one light window, the light window corresponds to the position of the photosensitive element, and at least a part of the inner side of the molded base integrally extends from the photosensitive element It extends obliquely. The molded photosensitive element according to item 1 of the scope of patent application, wherein an included angle between the at least a part of an inner side surface of the molded base and a straight line of an optical axis of the camera module is 10 ^o to 80 ^o . The molded photosensitive element according to item 1 of the scope of the patent application, wherein the molded base has an inner side surface linearly extending integrally from a non-photosensitive region of a top surface of the photosensitive element, so that the All the inner sides of the molding base extend obliquely, and there is an inclination angle α between the inner side of the molding base and the straight line of the optical axis of the camera module, where the value of the inclination angle α Select from 10 ^o ~ 30 ^o , 30 ^o ~ 45 ^o , 45 ^o ~ 55 ^o or 55 ^o ~ 80 ^o . The molded photosensitive element according to item 3 of the scope of the patent application, wherein the photosensitive element and the circuit board are connected through a set of leads, and the wire is connected from the photosensitive element toward the photosensitive element. When describing the circuit board, the value of α is selected from 10 ^° to 55 ^° . The molded photosensitive element according to item 3 of the scope of the patent application, wherein the photosensitive element and the circuit board are connected through a set of leads, and the wire is connected from the circuit board toward the circuit board. When the photosensitive element is described, the value of α is selected from 10 ^° to 80 ^° . The molded photosensitive element according to item 1 of the patent application scope, wherein the molded base has an outer side surface linearly extending integrally from the circuit board, wherein the outer side of the molded base is in contact with the There is an inclination angle γ between the straight lines of the optical axis of the camera module to facilitate demolding. The value of γ is selected from ^o ~ ^15o , ^15o ~ ^30o , or ^30o ~ ^45o . The molded photosensitive element according to item 1 of the scope of patent application, wherein the molded base has a top-side groove at a top end, and the molded base has an inner side surface that is bent and extended, and includes an integral body in order. A first portion inner side surface, a second portion inner side surface, and a third portion inner side surface, which are integrally inclined to extend from a non-photosensitive area of a top surface of the photosensitive element, The three-part inner side surface integrally extends obliquely to the second-part inner side surface, wherein the second-part inner side surface and the third-part inner side surface define the top-side groove. The molded photosensitive element according to item 7 of the scope of patent application, wherein an inclination angle exists between an inner surface of the first portion and a straight line of an optical axis of the camera module, and an inner surface of the third portion and the camera There is an inclination angle β between the straight lines of the optical axis of the module, where the value of α is selected from 10 ^o ~ 30 ^o , 30 ^o ~ 45 ^o , 45 ^o ~ 55 ^o or 55 ^o ~ 80 ^o , and the value of beta is selected from 3 ^o ~ 15 ^o , 15 ^o ~ 20 ^o , or 20 ^o ~ 30 ^o . The molded photosensitive element according to item 8 of the scope of application for a patent, wherein the photosensitive element and the circuit board are connected through a set of leads, and the wire is connected from the photosensitive element toward the photosensitive element. When describing the circuit board, the value of α is selected from 10︒ to 55︒. The molded photosensitive element according to item 8 of the scope of the patent application, wherein the photosensitive element and the circuit board are connected through a set of leads, and the wire is connected from the circuit board toward the circuit board. When the photosensitive element is described, the value of α is selected from 10︒ to 80︒. The molded photosensitive element according to item 7 of the scope of patent application, wherein the molded base has an outer side linearly extending integrally from the circuit board, wherein the outer side of the molded base includes A plurality of outer peripheral surfaces are arranged in a direction, and at least one of the outer peripheral surface and a straight line of the optical axis of the camera module has an inclination angle γ which is convenient for demolding, wherein the value of γ is selected from 3︒-15︒, 15︒ ~ 30︒, or 30︒ ~ 45︒. The molded photosensitive element according to item 1 of the scope of patent application, wherein the molded photosensitive element further has one or more driver pin grooves, and a pin groove wall surface defining each of the driver pin grooves and the driver pin groove There is an inclination angle δ between the straight lines of the optical axis of the camera module to facilitate demolding. The range of δ is 3 ° ~ 30 °. The molded photosensitive element according to item 1 of the scope of patent application, wherein the molded photosensitive element further includes at least one filter, the filter is overlapped with the photosensitive element, and the molded base The filter, the photosensitive element, and the circuit board are integrally packaged and formed. The molded photosensitive element according to item 1 of the scope of patent application, wherein at least one outer peripheral surface of an outer side surface of the molding base, a substrate of the circuit board is left with a molding die in a molding process. The pressing distance W of the at least one partition block that is convenient for pressing is in the range of 0.1 to 10 mm. The molded photosensitive element according to item 1 of the scope of patent application, wherein the surface of the material of the molded base has a reflectance of less than 5% at a wavelength range of 435-660nm. A camera module is characterized in that it comprises at least one lens and the molded photosensitive component according to any one of claims 1 to 15 of the scope of patent application. The camera module according to item 16 of the patent application scope, wherein the camera module is a fixed focus camera module or an auto focus camera module. The camera module according to item 16 of the scope of patent application, further comprising at least one filter holder and at least one filter, the filter is mounted on the filter holder, and the filter The lens mount is mounted on the top of the molded base. A molding mold is used for manufacturing at least one molded photosensitive element of at least one camera module. The molding mold includes a first mold and a second mold capable of being separated from each other or being in close contact with each other. At least one forming cavity is formed when they are in close contact, and the forming mold is configured with at least one light window forming block and a base forming guide groove located around the light window forming block in the forming cavity. At least one circuit board connected with at least one photosensitive element is installed in the molding cavity, and a molding material filled into the molding guide groove of the base undergoes a temperature-controlled conversion process to solidify and mold. A molding base is formed at a position of the base molding guide groove, and a light window of the molding base is formed at a position corresponding to the light window molding block, wherein the molding base is integrally formed with the circuit. A plate and at least a portion of a non-photosensitive area of the photosensitive element to form the molded photosensitive component of the camera module. The molding die according to item 19 of the scope of the patent application, wherein the light window molding block has a molding surface of the inner side of the base extending obliquely along the outer periphery thereof for forming the inner linearly extending inner part of the molding base. side. The molding die according to item 20 of the scope of the patent application, wherein an inclined angle between the molding surface of the inner side of the base of the light window molding block and a vertical line is convenient for demolding, and the size range of α is 10 ° ~ 80 °. The molding die according to item 19 of the scope of the patent application, wherein the light window forming block includes a pressing head and a groove forming part integrally extending on the pressing head, and the groove forming part is more than The pressing head has a larger inner diameter for forming a top-side groove on the top side of the molding base. The molding die according to item 22 of the scope of the patent application, wherein the indenter has an inclination angle α between the outer side surface of the outer periphery of the indenter and the vertical line, where the magnitude of α is in the range of 10 ° to 80 °. The groove forming portion has an inclination angle β between the outer side surface along the outer periphery thereof and the vertical line, wherein the size of β ranges from 3 ° to 30 °. The molding die according to item 23 of the scope of the patent application, wherein the photosensitive element and the circuit board are connected through a set of leads, and the wire is connected from the photosensitive element toward the circuit. In the case of a board, the value of α is selected from 10︒ to 55︒; where the wire is connected from the circuit board toward the photosensitive element, the value of α is selected from 10︒ to 80. The molding mold according to any one of claims 19 to 24, wherein the first mold further includes at least one partition block, and the partition block has a molding surface on the outer side of the base, which is perpendicular to the vertical line. There is an inclination angle γ which is convenient for demolding, and the value of γ is selected from 3︒ ~ 45︒.