TW201805098A - Laser scribing apparatus - Google Patents
Laser scribing apparatus Download PDFInfo
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- TW201805098A TW201805098A TW106126283A TW106126283A TW201805098A TW 201805098 A TW201805098 A TW 201805098A TW 106126283 A TW106126283 A TW 106126283A TW 106126283 A TW106126283 A TW 106126283A TW 201805098 A TW201805098 A TW 201805098A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Abstract
Description
本發明涉及一種雷射劃刻裝置。更具體而言,本發明涉及一種能夠在使用雷射光束切割脆性材料基板的時候容易地改變雷射光束的焦距的雷射劃刻裝置。 The invention relates to a laser scribing device. More specifically, the present invention relates to a laser scoring device capable of easily changing the focal length of a laser beam when cutting a brittle material substrate using the laser beam.
在某些情況下,通過使用一種切割物件的方法,使用雷射光束來精確地切割所要切割的物件。這種通過使用雷射光束切割物件的方法還被用來切割脆性材料,如玻璃及金屬材料製成的板。 In some cases, by using a method of cutting an object, a laser beam is used to accurately cut the object to be cut. This method of cutting objects by using a laser beam is also used to cut brittle materials, such as plates made of glass and metal materials.
作為一個示例,通過利用雷射光束來切割用於例如液晶顯示裝置之類的平板顯示器的面板。在相關技術中,用於切割液晶顯示裝置的劃刻裝置通過以下過程來切割基板:將由金剛石或硬質金屬製成的劃刻輪以預定壓力壓靠在基板的表面,然後旋轉並移動劃刻輪以在基板的表面上形成劃刻線,並且在基板上執行裂片過程。 As one example, a panel for a flat panel display such as a liquid crystal display device is cut by using a laser beam. In the related art, a scribe device for cutting a liquid crystal display device cuts a substrate by a process in which a scribe wheel made of diamond or hard metal is pressed against a surface of a substrate with a predetermined pressure, and then the scribe wheel is rotated and moved To form a scribe line on the surface of the substrate, and perform a chipping process on the substrate.
相比之下,使用雷射光束的劃刻裝置通過向基板發射雷射光束,並通過使用冷卻氣體或類似物冷卻基板,由此產生熱應力,而在基板中形成裂縫。作為替代方案,現已提出通過向基板依次發射不同的雷射光束來切割基板的方法。同時,在某些情況下,在通過使用雷射光束切割將構成液晶顯示裝置的兩片基板接合在一起的密封劑或者切割形成在基板上的黑色矩陣(black matrix)之後,使用劃刻輪來切割基板。 In contrast, a scoring device using a laser beam forms a crack in the substrate by emitting a laser beam to the substrate and cooling the substrate by using a cooling gas or the like, thereby generating a thermal stress. As an alternative, a method of cutting a substrate by sequentially emitting different laser beams to the substrate has been proposed. Meanwhile, in some cases, after using a laser beam to cut a sealant that joins two substrates constituting a liquid crystal display device or to cut a black matrix formed on a substrate, a scribing wheel is used to Cut the substrate.
然而,在待切割的基板不平整或者需要調節雷射光束的照射深度的情況下,存在著難以立即調節雷射光束的照射深度的問題。 However, when the substrate to be cut is uneven or the irradiation depth of the laser beam needs to be adjusted, there is a problem that it is difficult to immediately adjust the irradiation depth of the laser beam.
作為一個示例,公佈於2005年11月9日的題為“切割非金屬材料的裝置以及當切割非金屬材料時控制切割深度的方法(Apparatus for cutting Nonmetallic Material and Method of Controlling cutting depth When cutting Nonmetallic material)”的韓國公開專利申請第10-2005-0106156號披露了一種構造,其測量到基板的距離,並通過使用用於調節發射雷射光束的發射裝置的高度的升降裝置來調節雷射光束的焦距。 As an example, published on November 9, 2005, entitled " Apparatus for cutting Nonmetallic Material and Method of Controlling cutting depth When cutting Nonmetallic material ) "Korean Published Patent Application No. 10-2005-0106156 discloses a configuration that measures the distance to a substrate and adjusts the focal length.
然而,相關技術中的這種構造以機械方式控制用於發射雷射光束的發射裝置的高度,存在著響應速度低、因而難以提高基板切割速度的缺點。如果基板切割速度提高,則有難以將雷射光束發射到準確點(位置)的缺點。 However, such a configuration in the related art mechanically controls the height of the emitting device for emitting the laser beam, and has the disadvantage that the response speed is low and it is difficult to increase the substrate cutting speed. If the substrate cutting speed is increased, there is a disadvantage that it is difficult to emit a laser beam to an accurate point (position).
本發明致力於提供一種雷射劃刻裝置,其能夠通過容易地改變雷射光束的焦距來迅即地控制高度。 The present invention has been made in an effort to provide a laser scribing device capable of quickly controlling a height by easily changing a focal length of a laser beam.
本發明的一個示例性實施例提供了一種雷射劃刻裝置,其通過向基板發射雷射光束在基板上執行劃刻(操作),雷射劃刻裝置包括:雷射源,其產生雷射光束;以及雷射發射單元,其接收來自雷射源的雷射光束並將雷射光束發射到基板,其中雷射發射單元包括光學元件,該光學元件改變發射到基板的雷射光束的焦距。 An exemplary embodiment of the present invention provides a laser scribing device that performs scribing (operation) on a substrate by emitting a laser beam to a substrate. The laser scribing device includes a laser source that generates a laser A light beam; and a laser emission unit that receives a laser beam from a laser source and emits the laser beam to a substrate, wherein the laser emission unit includes an optical element that changes a focal length of the laser beam emitted to the substrate.
在一個示例性實施例中,雷射發射單元可包括:反射鏡,其反射從雷射源沿預定方向傳播的雷射光束;可變焦反射鏡,其將由反射鏡 反射的雷射光束反射到基板,並且通過改變反射面的曲率來改變焦距;以及聚光透鏡,其聚集由可變焦反射鏡反射的雷射光束。 In an exemplary embodiment, the laser emitting unit may include: a reflecting mirror that reflects a laser beam propagating from a laser source in a predetermined direction; and a variable-focus mirror that is to be replaced by a reflecting mirror The reflected laser beam is reflected to the substrate, and the focal length is changed by changing the curvature of the reflecting surface; and a condenser lens that collects the laser beam reflected by the variable-angle mirror.
可變焦反射鏡可具有由呈陣列(array)形式的多個微鏡形成的反射面,並且可通過改變多個微鏡的位置或角度來改變反射面的曲率。 The variable-focus mirror may have a reflecting surface formed of a plurality of micromirrors in the form of an array, and the curvature of the reflecting surface may be changed by changing the positions or angles of the plurality of micromirrors.
可變焦反射鏡可包括:壓力室,流體被供給到壓力室中;反射面,其界定壓力室的一個表面;以及閥,其將流體供給到壓力室中,並且可根據壓力室中的流體的量或壓力來改變反射面的曲率。 The variable focus mirror may include: a pressure chamber into which the fluid is supplied; a reflecting surface that defines one surface of the pressure chamber; and a valve that supplies the fluid into the pressure chamber, and may be Amount or pressure to change the curvature of the reflecting surface.
在一個示例性實施例中,雷射發射單元可包括:第二反射鏡,其將從雷射源發出的雷射光束反射到基板;以及可變焦透鏡,其位於由第二反射鏡反射的雷射光束的光路中,並且改變焦點。 In an exemplary embodiment, the laser emitting unit may include: a second reflector that reflects the laser beam emitted from the laser source to the substrate; and a zoom lens that is located in the laser reflected by the second mirror The beam path, and change the focus.
可變焦透鏡可由電活性聚合物(electroactive polymer)製成。 The variable focus lens may be made of an electroactive polymer.
根據本發明,其優點在於可以根據與待切割的物件(對象)的距離,或者根據雷射光束在待切割的物件中的照射深度,來迅即地控制雷射光束的焦距。 According to the present invention, there is an advantage in that the focal length of the laser beam can be controlled quickly according to the distance from the object (object) to be cut or the irradiation depth of the laser beam in the object to be cut.
本發明的優點在於,因為可不用機械地控制用於發射雷射光束的雷射發射單元的高度來調節雷射光束的焦距,所以響應性高並且能夠快速和精確地切割物件。 The advantage of the present invention is that since the focal length of the laser beam can be adjusted without mechanically controlling the height of the laser emitting unit for emitting the laser beam, the responsiveness is high and the object can be cut quickly and accurately.
因此,本發明的優點在於,通過根據與工件的距離來改變雷射光束的焦距,可以在例如基板的工件中形成具有均勻深度的劃刻線。 Therefore, the present invention is advantageous in that by changing the focal length of the laser beam according to the distance from the workpiece, it is possible to form a score line having a uniform depth in a workpiece such as a substrate.
上文的概要僅是示例性的,而非旨在成為任何方式的限制。除了上文描述的示例性方案、實施例和特徵之外,通過參照附圖和下面的詳細描述,還將容易領會本發明其它的方案、實施例和特徵。 The summary above is exemplary only, and is not intended to be limiting in any way. In addition to the exemplary schemes, embodiments, and features described above, other schemes, embodiments, and features of the invention will be readily appreciated by reference to the drawings and the following detailed description.
1‧‧‧工作臺 1‧‧‧Workbench
3‧‧‧基板 3‧‧‧ substrate
10‧‧‧雷射發射單元 10‧‧‧Laser Launch Unit
12‧‧‧反射鏡 12‧‧‧Mirror
14‧‧‧可變焦反射鏡 14‧‧‧ variable mirror
16‧‧‧聚光透鏡 16‧‧‧ condenser lens
18‧‧‧距離測量裝置 18‧‧‧ Distance measuring device
19‧‧‧測量單元 19‧‧‧ measuring unit
20‧‧‧雷射源 20‧‧‧Laser source
22‧‧‧基部板 22‧‧‧ base board
24‧‧‧微鏡 24‧‧‧Micromirror
26‧‧‧壓力室 26‧‧‧Pressure chamber
28‧‧‧反射面 28‧‧‧Reflective surface
30‧‧‧閥 30‧‧‧ Valve
40‧‧‧第二反射鏡 40‧‧‧Second Mirror
42‧‧‧可變焦透鏡 42‧‧‧ Variable Lens
d1、d2‧‧‧距離 d1, d2‧‧‧ distance
P1、P2‧‧‧位置 P1, P2‧‧‧Position
圖1是示出根據本發明的第一示例性實施例的雷射劃刻裝置的視圖。 FIG. 1 is a view showing a laser scribing device according to a first exemplary embodiment of the present invention.
圖2是示出根據本發明的第一示例性實施例的劃刻裝置的可變焦反射鏡的一個示例的視圖。 FIG. 2 is a view showing one example of a zoomable mirror of the scribe device according to the first exemplary embodiment of the present invention.
圖3是示出根據本發明的第一示例性實施例的劃刻裝置的可變焦反射鏡的另一個示例性實施例的視圖。 FIG. 3 is a view showing another exemplary embodiment of a zoomable mirror of a scoring device according to a first exemplary embodiment of the present invention.
圖4是示出根據本發明的第二示例性實施例的劃刻裝置的視圖。 FIG. 4 is a view showing a scribing device according to a second exemplary embodiment of the present invention.
應理解的是,這些附圖並非必須按比例繪製,其呈現了闡示本發明基本原理的各個特徵的一定程度上的簡化的表達。此處所披露的本發明的特定設計特徵,例如包括特定尺寸、方向、位置和形狀,應部分地通過特別的預期應用及使用環境來確定。 It should be understood that these drawings are not necessarily drawn to scale, which present a somewhat simplified representation of the various features illustrating the basic principles of the invention. The specific design features of the invention disclosed herein, including, for example, specific dimensions, orientations, locations, and shapes, should be determined in part by the particular intended application and use environment.
在圖中,參考符號在附圖的各圖式中表示本發明的相同或等同部件。 In the figures, reference symbols refer to the same or equivalent parts of the invention in the various figures of the drawings.
以下將參照附圖詳細地描述本發明的示例性實施例。首先,對於表示各視圖中的構成元件的參考符號,應注意的是,即使相同的構成元件在不同的圖中被示出,仍將以相同的參考符號來表示它們。而且,在下文對本發明的描述中,如果認為對於本文中包含的公知配置或功能的詳細描述可能會使本發明的主題內容不清楚,則會省略該描述。而且,下文將描述本發明的示例性實施例,但本發明的技術主旨並不限於該實施例,而是可由本領域技術人員進行修改並以多種方式實施。 Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, for reference symbols indicating constituent elements in each view, it should be noted that even if the same constituent elements are shown in different drawings, they will be represented by the same reference symbols. Moreover, in the following description of the present invention, if it is considered that a detailed description of well-known configurations or functions contained herein may make the subject matter of the present invention unclear, the description will be omitted. Also, an exemplary embodiment of the present invention will be described below, but the technical spirit of the present invention is not limited to the embodiment, but may be modified by those skilled in the art and implemented in various ways.
圖1是示出根據本發明的第一示例性實施例的雷射劃刻裝置的視圖。 FIG. 1 is a view showing a laser scribing device according to a first exemplary embodiment of the present invention.
根據本發明的第一示例性實施例的雷射劃刻裝置的特徵在於包括可變焦反射鏡,該可變焦反射鏡改變焦點並反射雷射光束。 The laser scoring device according to the first exemplary embodiment of the present invention is characterized by including a variable-focus mirror that changes focus and reflects a laser beam.
參照圖1,基板3被裝載到工作臺1上。在理想的情況下,基板3具有均勻平坦的表面,但該基板實際上可能具有輕微的高度差。可根據需要來改變發射的雷射光束的深度。本發明通過改變雷射光束的焦距來使雷射光束能夠被準確地發射到期望的部分。圖1中示出了一片基板3,但基板3可以是相結合的多個基板,其中當實際實施本發明時兩片基板被接合在一起。而且,被雷射光束照射的部分可以是基板表面上的一個點或基板中的一個點,或者在某些情況下可以是用於附接結合基板的密封劑。 Referring to FIG. 1, a substrate 3 is loaded on a stage 1. In the ideal case, the substrate 3 has a uniform and flat surface, but the substrate may actually have a slight height difference. The depth of the emitted laser beam can be changed as required. The present invention enables the laser beam to be accurately emitted to a desired portion by changing the focal length of the laser beam. One substrate 3 is shown in FIG. 1, but the substrate 3 may be a plurality of substrates combined, where the two substrates are bonded together when the present invention is actually implemented. Also, the portion irradiated with the laser beam may be a point on the surface of the substrate or a point in the substrate, or may be a sealant for attaching a bonded substrate in some cases.
根據本發明的該示例性實施例的雷射劃刻裝置包括:雷射源20,其產生雷射光束;以及雷射發射單元10,其接收來自雷射源20的雷射光束並將該雷射光束發射到基板3。 The laser scoring device according to this exemplary embodiment of the present invention includes: a laser source 20 that generates a laser beam; and a laser emitting unit 10 that receives the laser beam from the laser source 20 and applies the laser The beam is emitted to the substrate 3.
可根據需要來選擇雷射源20,可以使用各種雷射源,例如CO2雷射器、YAG雷射器、脈衝雷射器、和飛秒雷射器。如有必要,在雷射源20與雷射發射單元10之間或者在雷射發射單元10中可包括至少一個光學元件,例如擴束器和準直器。 The laser source 20 may be selected according to need, and various laser sources may be used, such as a CO 2 laser, a YAG laser, a pulse laser, and a femtosecond laser. If necessary, at least one optical element such as a beam expander and a collimator may be included between the laser source 20 and the laser emitting unit 10 or in the laser emitting unit 10.
雷射發射單元10包括:反射鏡12,其沿預定方向反射從雷射源20發出的雷射光束;可變焦反射鏡14,其反射由反射鏡12反射的雷射光束並且可改變其反射面的曲率;以及聚光透鏡16,其聚集由可變焦反射鏡14反射的雷射光束以便在預定位置形成焦點。 The laser emitting unit 10 includes: a reflecting mirror 12 that reflects a laser beam emitted from the laser source 20 in a predetermined direction; and a zoomable reflecting mirror 14 that reflects the laser beam reflected by the reflecting mirror 12 and can change its reflection surface The curvature of the lens; and a condenser lens 16 that focuses the laser beam reflected by the variable-focus mirror 14 to form a focus at a predetermined position.
在本發明的該示例性實施例中,雷射發射單元10可具有距離測量裝置18。距離測量裝置18可包括測量單元19。在該示例性實施例中,測量單元19可被構造為通過向基板3發射雷射並隨後接收反射的雷射來測量到基板3的距離。 In this exemplary embodiment of the present invention, the laser emitting unit 10 may have a distance measuring device 18. The distance measurement device 18 may include a measurement unit 19. In this exemplary embodiment, the measurement unit 19 may be configured to measure a distance to the substrate 3 by emitting a laser toward the substrate 3 and then receiving a reflected laser.
雷射發射單元10可被構造為能在基板3上方相對於基板3進行移動,使得在雷射發射單元10被固定的狀態下,其上裝載基板3的工作臺1可進行移動、在其上裝載基板3的工作臺1被固定的狀態下,雷射發射單元10可進行移動、或者雷射發射單元10與工作臺1均可進行移動。 The laser emitting unit 10 may be configured to be movable above the substrate 3 relative to the substrate 3, so that, in a state where the laser emitting unit 10 is fixed, the table 1 on which the substrate 3 is loaded can be moved, In a state where the stage 1 on which the substrate 3 is mounted is fixed, the laser emitting unit 10 can be moved, or both the laser emitting unit 10 and the stage 1 can be moved.
在該示例性實施例中,在雷射發射單元10發射雷射光束之前,距離測量裝置18可測量到基板3的距離。亦即,距離測量裝置18可在雷射發射單元10的處理方向上被設置在雷射發射單元10的前方。 In this exemplary embodiment, the distance measuring device 18 may measure the distance to the substrate 3 before the laser emitting unit 10 emits a laser beam. That is, the distance measuring device 18 may be disposed in front of the laser emission unit 10 in the processing direction of the laser emission unit 10.
參照圖1,由距離測量裝置18測得的到基板3的距離為d1,將要被雷射光束照射的位置為P1。根據本發明的劃刻裝置的控制單元(未示出)改變可變焦反射鏡14的反射面的曲率,從而使雷射源20產生的雷射光束被發射到P1。 Referring to FIG. 1, the distance to the substrate 3 measured by the distance measuring device 18 is d1, and the position to be irradiated by the laser beam is P1. The control unit (not shown) of the scoring device according to the present invention changes the curvature of the reflecting surface of the variable-focus mirror 14 so that the laser beam generated by the laser source 20 is emitted to P1.
如圖1的右側所示,在要將雷射光束發射到基板3的位置P2時,到基板3的距離為d2。在此情況下,P2位於在比P1高的位置,P2處雷射光束的焦距需要短於P1處的焦距。劃刻裝置的控制單元使得可變焦反射鏡14的反射面在P2處的曲率小於在P1處的曲率,使得由可變焦反射鏡14反射的雷射光束被發射到位置P2。 As shown on the right side of FIG. 1, when the laser beam is to be emitted to the position P2 of the substrate 3, the distance to the substrate 3 is d2. In this case, P2 is located at a higher position than P1, and the focal length of the laser beam at P2 needs to be shorter than that at P1. The control unit of the scoring device makes the curvature of the reflecting surface of the zoom mirror 14 at P2 smaller than the curvature at P1, so that the laser beam reflected by the zoom mirror 14 is emitted to the position P2.
圖2是示出根據本發明的第一示例性實施例的劃刻裝置的可變焦反射鏡的一個示例的視圖。 FIG. 2 is a view showing one example of a zoomable mirror of the scribe device according to the first exemplary embodiment of the present invention.
參照圖2,可變焦反射鏡14可包括基部板22和設置在基部板22上的多個微鏡24。該多個微鏡24設置為陣列的形式,且其角度或位置可被單獨地控制。隨著該多個微鏡24的位置被調節,可以改變被微鏡陣列反射的雷射光束的焦距。由韓國專利第10-1208273號披露的微鏡控制系統控制的微鏡陣列可被例舉為微鏡陣列的一個示例。 Referring to FIG. 2, the zoom mirror 14 may include a base plate 22 and a plurality of micromirrors 24 provided on the base plate 22. The plurality of micromirrors 24 are arranged in the form of an array, and their angles or positions can be individually controlled. As the positions of the plurality of micromirrors 24 are adjusted, the focal length of the laser beam reflected by the micromirror array can be changed. The micromirror array controlled by the micromirror control system disclosed in Korean Patent No. 10-1208273 can be exemplified as an example of the micromirror array.
圖3是示出根據本發明的第一示例性實施例的劃刻裝置的可變焦反射鏡的另一個示例性實施例的視圖。 FIG. 3 is a view showing another exemplary embodiment of a zoomable mirror of a scoring device according to a first exemplary embodiment of the present invention.
參照圖3,可變焦反射鏡14包括:壓力室26;凹形的反射面28,其形成在壓力室26的一側;以及閥30,其將流體供給到壓力室26中。閥30可與壓力源(未示出)連接。反射面28可由柔性材料製成。將被供給到壓力室26中的流體可以是液相流體(例如水或油之類)或者氣體。基於通過閥30供給的流體的量或壓力,來控制反射面28的曲率。 Referring to FIG. 3, the zoom mirror 14 includes: a pressure chamber 26; a concave reflecting surface 28 formed on one side of the pressure chamber 26; and a valve 30 that supplies fluid into the pressure chamber 26. The valve 30 may be connected to a pressure source (not shown). The reflecting surface 28 may be made of a flexible material. The fluid to be supplied into the pressure chamber 26 may be a liquid phase fluid (such as water or oil) or a gas. The curvature of the reflecting surface 28 is controlled based on the amount or pressure of the fluid supplied through the valve 30.
將圖3A與圖3B進行對比,在圖3A中供給到壓力室26中的流體的量或壓力高於或大於圖3B中的流體的量或壓力。因此,在圖3A中反射面28的曲率大於圖3B中的曲率。 Comparing FIG. 3A with FIG. 3B, the amount or pressure of the fluid supplied to the pressure chamber 26 in FIG. 3A is higher or greater than the amount or pressure of the fluid in FIG. 3B. Therefore, the curvature of the reflecting surface 28 in FIG. 3A is larger than that in FIG. 3B.
圖4是示出根據本發明的第二示例性實施例的劃刻裝置的視圖。 FIG. 4 is a view showing a scribing device according to a second exemplary embodiment of the present invention.
根據本發明的第二示例性實施例的劃刻裝置可包括雷射發射單元10和雷射源20,還可包括距離測量裝置18。雷射發射單元10包括:第二反射鏡40,其將從雷射源20傳播的雷射光束向下反射;以及可變焦透鏡42,其位於第二反射鏡40的光路中並改變焦點。 The scribing device according to the second exemplary embodiment of the present invention may include a laser emitting unit 10 and a laser source 20, and may further include a distance measuring device 18. The laser emitting unit 10 includes a second reflecting mirror 40 that reflects the laser beam propagated from the laser source 20 downward, and a variable focus lens 42 that is located in the optical path of the second reflecting mirror 40 and changes the focus.
可變焦透鏡42被構造為能改變焦點。本發明的特徵在於可變 焦透鏡42通過改變透鏡的形狀來改變焦點。在該示例性實施例中,可變焦透鏡42可以是可變焦流體透鏡,其構造為使得其內部充滿流體,並且通過調節充滿其內部的流體的量來改變其形狀。替代性地,可變焦透鏡42可以是電活性聚合物(EAP),其形狀隨著施加到EAP上的電壓而改變。在該示例性實施例中,通過在凝膠態中混合聚氯乙烯(PVC)與塑化劑來製造EAP。使用EAP製造的可變焦透鏡42的優點在於,可以隨著施加的電壓迅即地改變形狀,且可提高響應速度。 The variable focus lens 42 is configured to be able to change the focus. The invention is characterized by variable The focus lens 42 changes the focus by changing the shape of the lens. In this exemplary embodiment, the variable focus lens 42 may be a variable focus fluid lens configured such that its interior is filled with fluid, and its shape is changed by adjusting the amount of fluid that fills its interior. Alternatively, the variable focus lens 42 may be an electroactive polymer (EAP), the shape of which changes with the voltage applied to the EAP. In this exemplary embodiment, EAP is manufactured by mixing polyvinyl chloride (PVC) and a plasticizer in a gel state. The advantage of using the variable focus lens 42 manufactured by EAP is that the shape can be changed quickly with the applied voltage, and the response speed can be improved.
如上文所述,在說明書和附圖中已描述和闡示了這些示例性實施例。選擇並描述這些示例性實施例是為了說明本發明的一些特定的原理及其實際應用,從而使得本領域其他技術人員能夠做出並運用本發明的各種示例性實施例以及各種替代方案和改型。如前文的描述所顯現的,本發明的特定方面並不受這裡所闡示的具體細節的限制,因此可以預見本領域技術人員能夠想到其它的改型和應用或其等同物。然而,在考慮說明書和附圖之後,本領域技術人員將容易領會本發明的許多改變、修改和變型及其它用途和應用。不背離本發明的主旨和範圍的所有這些改變、修改和改型以及其它用途和應用均視為被本發明所涵蓋,本發明僅由隨附的申請專利範圍所限定。 As mentioned above, these exemplary embodiments have been described and illustrated in the specification and drawings. These exemplary embodiments were chosen and described in order to explain some specific principles of the invention and their practical applications, thereby enabling others skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications. . As apparent from the foregoing description, certain aspects of the present invention are not limited by the specific details set forth herein, and it is foreseen that those skilled in the art will be able to think of other modifications and applications or their equivalents. However, after considering the specification and drawings, those skilled in the art will readily appreciate many changes, modifications, and variations of the invention and other uses and applications. All such changes, modifications, and alterations without departing from the spirit and scope of the invention, as well as other uses and applications, are considered to be covered by the invention, and the invention is limited only by the scope of the accompanying patent applications.
1‧‧‧工作臺 1‧‧‧Workbench
3‧‧‧基板 3‧‧‧ substrate
10‧‧‧雷射發射單元 10‧‧‧Laser Launch Unit
12‧‧‧反射鏡 12‧‧‧Mirror
14‧‧‧可變焦反射鏡 14‧‧‧ variable mirror
16‧‧‧聚光透鏡 16‧‧‧ condenser lens
18‧‧‧距離測量裝置 18‧‧‧ Distance measuring device
19‧‧‧測量單元 19‧‧‧ measuring unit
20‧‧‧雷射源 20‧‧‧Laser source
d1、d2‧‧‧距離 d1, d2‧‧‧ distance
P1、P2‧‧‧位置 P1, P2‧‧‧Position
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KR20180015353A (en) * | 2016-08-03 | 2018-02-13 | 주식회사 탑 엔지니어링 | Laser scribing appratus |
SG11202008643PA (en) * | 2018-04-09 | 2020-10-29 | Tokyo Electron Ltd | Laser processing device, laser processing system, and laser processing method |
TWI719764B (en) * | 2019-12-17 | 2021-02-21 | 鈦昇科技股份有限公司 | Mold cleaning machine |
CN113132566B (en) * | 2019-12-30 | 2022-09-23 | 中芯集成电路(宁波)有限公司 | Camera module and imaging method |
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WO2009148022A1 (en) * | 2008-06-04 | 2009-12-10 | 三菱電機株式会社 | Laser processing device and laser processing system |
US8038066B2 (en) * | 2009-04-29 | 2011-10-18 | Hand Held Products, Inc. | Laser scanner with deformable lens |
US9289850B2 (en) * | 2011-04-08 | 2016-03-22 | Mitsubishi Electric Corporation | Laser machining device |
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