TW201802647A - Touch panel and manufacturing method thereof - Google Patents

Touch panel and manufacturing method thereof Download PDF

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TW201802647A
TW201802647A TW105122369A TW105122369A TW201802647A TW 201802647 A TW201802647 A TW 201802647A TW 105122369 A TW105122369 A TW 105122369A TW 105122369 A TW105122369 A TW 105122369A TW 201802647 A TW201802647 A TW 201802647A
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substrate
layer
disposed
patterned
upper wire
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TW105122369A
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TWI592849B (en
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彭彥鈞
馬冠炎
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恆顥科技股份有限公司
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Priority to CN201710491765.3A priority patent/CN107621897B/en
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Abstract

A manufacturing method of a touch panel includes following steps. A transparent conductive layer is formed on a first substrate. A first patterned protective layer is formed on the transparent conductive layer. A metal layer is formed on the first patterned protective layer and the transparent conductive layer. A second patterned protective layer is formed on the metal layer, wherein the first patterned protective layer includes an overlapping portion which overlaps a portion of the second patterned protective layer. A patterning process is performed to remove the metal layer uncovered by the second patterned protective layer, and remove the transparent conductive layer uncovered by the first patterned protective layer and/or the second patterned protective layer, so as to form touch sensing electrodes, a bottom conductive line and a top conductive line. Then, the first patterned protective layer uncovered by the metal layer and the second patterned protective layer are removed, and the overlapping portion of the first patterned protective layer is remained.

Description

觸控面板以及其製作方法Touch panel and its making method

本發明係關於一種觸控面板以及其製作方法,尤指一種同時蝕刻透明導電層及金屬層以分別形成觸控感測電極及走線之觸控面板以及其製作方法。The present invention relates to a touch panel and a method of fabricating the same, and more particularly to a touch panel that simultaneously etches a transparent conductive layer and a metal layer to form a touch sensing electrode and a trace, respectively, and a method of fabricating the same.

由於觸控面板具有人機互動的特性,已逐漸取代鍵盤而被廣泛應用於電子裝置的輸入介面上。近年來,觸控感應技術迅速地發展,許多消費性電子產品例如行動電話(mobile phone)、衛星導航系統(GPS navigator system)、平板電腦(tablet PC)以及筆記型電腦(laptop PC)等均有與觸控功能結合的產品推出。觸控面板的技術發展非常多樣化,較常見的技術包括電阻式、電容式以及光學式等。在習知的觸控面板中,設置於可視區的觸控感測電極以及設置於周圍區的走線一般係分別各自形成,其形成的方法可包括曝光微影、蝕刻等步驟。換言之,為了在觸控面板中形成觸控感測電極及走線,至少需要兩道的蝕刻製程,因此無法有效減少製程的數量,進而無法降低製造的成本。Since the touch panel has the characteristics of human-computer interaction, it has gradually replaced the keyboard and is widely used in the input interface of an electronic device. In recent years, touch sensing technology has rapidly developed, and many consumer electronic products such as mobile phones, GPS navigator systems, tablet PCs, and laptop PCs have Product launches combined with touch functionality. The technology development of touch panels is very diverse, and the more common technologies include resistive, capacitive, and optical. In a conventional touch panel, the touch sensing electrodes disposed in the visible area and the traces disposed in the surrounding area are each formed separately, and the method of forming the method may include exposure lithography, etching, and the like. In other words, in order to form the touch sensing electrodes and the traces in the touch panel, at least two etching processes are required, so that the number of processes cannot be effectively reduced, and the manufacturing cost cannot be reduced.

本發明之主要目的之一在於提供一種觸控面板以及其製作方法,藉由同時蝕刻透明導電層及金屬層以分別形成觸控感測電極及走線,藉此可減少製程的數量而可降低製造的成本。One of the main purposes of the present invention is to provide a touch panel and a method for fabricating the same, which can simultaneously form a touch sensing electrode and a trace by separately etching a transparent conductive layer and a metal layer, thereby reducing the number of processes and reducing the number of processes. The cost of manufacturing.

為達上述目的,本發明之一實施例提供一種觸控面板的製作方法,包括下列步驟。於一第一基板之表面上形成一透明導電層。於透明導電層上形成一第一圖案化保護層,第一圖案化保護層係用以在透明導電層上定義出複數個觸控感測電極。於第一圖案化保護層及透明導電層上形成一金屬層。於金屬層上形成一第二圖案化保護層,第二圖案化保護層係用以在金屬層上定義出一上部導線,其中第一圖案化保護層包括一重疊部,重疊部與一部分之第二圖案化保護層重疊,而未與第一圖案化保護層重疊之另一部分之第二圖案化保護層係用以在透明導電層上定義出一下部導線。進行一圖案化製程,以移除未被第二圖案化保護層覆蓋的金屬層以及移除未被第一圖案化保護層或/及第二圖案化保護層覆蓋的透明導電層,以使留下的透明導電層形成觸控感測電極與下部導線,同時使留下的金屬層形成上部導線。移除第二圖案化保護層以及未被金屬層覆蓋之第一圖案化保護層,並留下第一圖案化保護層之重疊部。To achieve the above objective, an embodiment of the present invention provides a method for fabricating a touch panel, including the following steps. A transparent conductive layer is formed on a surface of the first substrate. A first patterned protective layer is formed on the transparent conductive layer, and the first patterned protective layer is used to define a plurality of touch sensing electrodes on the transparent conductive layer. Forming a metal layer on the first patterned protective layer and the transparent conductive layer. Forming a second patterned protective layer on the metal layer, wherein the second patterned protective layer is used to define an upper wire on the metal layer, wherein the first patterned protective layer comprises an overlapping portion, the overlapping portion and a portion of the first The second patterned protective layer is overlapped, and another portion of the second patterned protective layer that is not overlapped with the first patterned protective layer is used to define a lower wire on the transparent conductive layer. Performing a patterning process to remove the metal layer not covered by the second patterned protective layer and removing the transparent conductive layer not covered by the first patterned protective layer or/and the second patterned protective layer to leave The lower transparent conductive layer forms the touch sensing electrode and the lower wire while leaving the remaining metal layer to form the upper wire. The second patterned protective layer and the first patterned protective layer not covered by the metal layer are removed, and the overlap of the first patterned protective layer is left.

為達上述目的,本發明之一實施例提供一種觸控面板,包括一第一基板、一圖案化透明導電層、一圖案化金屬層以及一保護層。第一基板定義有一可視區以及一周圍區位於可視區之至少一側。圖案化透明導電層設置於第一基板之表面上,圖案化透明導電層包括複數個觸控感測電極以及一下部導線。觸控感測電極至少設置於第一基板之可視區內,下部導線設置於第一基板之周圍區內,且下部導線係對應連接於觸控感測電極之其中一者。圖案化金屬層設置於周圍區內之圖案化透明導電層上,其中圖案化金屬層包括一上部導線,且上部導線包括一第一側壁以及一第二側壁,其中第一側壁與對應之下部導線之一第三側壁實質上切齊。保護層設置於上部導線之一部分與對應之圖案化透明導電層之間,且上部導線之另一部分與對應之下部導線直接接觸。To achieve the above objective, an embodiment of the present invention provides a touch panel including a first substrate, a patterned transparent conductive layer, a patterned metal layer, and a protective layer. The first substrate defines a viewing zone and a surrounding zone is located on at least one side of the viewing zone. The patterned transparent conductive layer is disposed on a surface of the first substrate, and the patterned transparent conductive layer includes a plurality of touch sensing electrodes and a lower wire. The touch sensing electrodes are disposed at least in the visible area of the first substrate, the lower wires are disposed in the surrounding area of the first substrate, and the lower wires are correspondingly connected to one of the touch sensing electrodes. The patterned metal layer is disposed on the patterned transparent conductive layer in the surrounding area, wherein the patterned metal layer includes an upper wire, and the upper wire includes a first sidewall and a second sidewall, wherein the first sidewall and the corresponding lower wire One of the third side walls is substantially aligned. The protective layer is disposed between one portion of the upper wire and the corresponding patterned transparent conductive layer, and another portion of the upper wire is in direct contact with the corresponding lower wire.

有關上述本發明之觸控面板以及其製作方法,下文特列舉本發明之較佳實施例,並配合所附圖式,詳細說明本發明之觸控面板以及其製作方法的構成內容及所欲達成之功效。The touch panel of the present invention and the method for fabricating the same are described below, and the components of the touch panel of the present invention and the manufacturing method thereof are described in detail with reference to the accompanying drawings. The effect.

請參考第1圖至第7圖。第1圖為本發明觸控面板的製作方法的步驟流程圖,第2圖至第7圖繪示了本發明第一實施例之觸控面板的製作方法示意圖。為了方便說明,本發明之各圖式僅為示意以更容易了解本發明,其詳細的比例可依照設計的需求進行調整。本發明第一實施例之觸控面板的製作方法包括下列步驟,首先如第2圖所示,提供一第一基板100,且第一基板100定義有一可視區R1以及一周圍區R2位於可視區R1之至少一側,並於第一基板100之表面上形成一透明導電層102,進行第1圖所示之步驟S10。本實施例之第一基板100可包括玻璃基板、塑膠基板、玻璃膜片、塑膠膜片、透光覆蓋板、顯示器之基板或其他適合之材料或/及功能之基板。透明導電層102的材料可包括透明導電金屬氧化物例如氧化銦錫(indium tin oxide, ITO)、氧化銦鋅(indium zinc oxide, IZO)或氧化鋁鋅(aluminum zinc oxide, AZO)或其他適合之透明導電材料;另外,透明導電層102也可以是由奈米金屬細線、網格狀金屬層或是其他非透明導電材料所形成的,並不限制於透明導電材料。接著,如第3圖所示,進行第1圖所示之步驟S12,於透明導電層102上形成一第一圖案化保護層104。詳細而言,第一圖案化保護層104可經由先於第一基板100上全面形成一光阻材料層(圖未示),再對此光阻材料層進行圖案化製程例如黃光微影與顯影製程而形成第一圖案化保護層104,但本發明並不以此為限。藉此,第一圖案化保護層104可具有後續欲形成之觸控感測電極的圖案。換言之,第一圖案化保護層104係用以在透明導電層102上定義出複數個觸控感測電極的圖案,例如第一圖案化保護層104可用來在後續如蝕刻等用來圖案化透明導電層102之製程中作為遮罩,以使圖案化後的透明導電層102形成觸控感測電極,因此,第一圖案化保護層104可包括複數個電極圖案104a,主要設置在可視區R1,但部分電極圖案104a可延伸至周圍區R2。雖然本實施例之第一圖案化保護層104的材料以光阻材料為例,但不以此為限,例如可以為任何其他對透明導電層102之蝕刻製程具有高蝕刻選擇性的材料或其他抗蝕刻材料。Please refer to Figures 1 to 7. 1 is a flow chart showing steps of a method for fabricating a touch panel of the present invention, and FIGS. 2 to 7 are schematic views showing a method for fabricating a touch panel according to a first embodiment of the present invention. For the convenience of description, the drawings of the present invention are only for the purpose of understanding the present invention, and the detailed proportions thereof can be adjusted according to the design requirements. The manufacturing method of the touch panel of the first embodiment of the present invention includes the following steps. First, as shown in FIG. 2, a first substrate 100 is provided, and the first substrate 100 defines a visible area R1 and a surrounding area R2 is located in the visible area. At least one side of R1 forms a transparent conductive layer 102 on the surface of the first substrate 100, and step S10 shown in Fig. 1 is performed. The first substrate 100 of this embodiment may include a glass substrate, a plastic substrate, a glass film, a plastic film, a light-transmitting cover plate, a substrate of a display, or other suitable material or/and a function of the substrate. The material of the transparent conductive layer 102 may include a transparent conductive metal oxide such as indium tin oxide (ITO), indium zinc oxide (IZO) or aluminum zinc oxide (AZO) or other suitable. The transparent conductive material 102 may be formed of a fine metal nanowire, a mesh metal layer or other non-transparent conductive material, and is not limited to the transparent conductive material. Next, as shown in FIG. 3, step S12 shown in FIG. 1 is performed to form a first patterned protective layer 104 on the transparent conductive layer 102. In detail, the first patterned protective layer 104 can form a photoresist layer (not shown) on the first substrate 100, and then pattern the photoresist layer, such as a yellow photolithography and development process. The first patterned protective layer 104 is formed, but the invention is not limited thereto. Thereby, the first patterned protective layer 104 can have a pattern of subsequent touch sensing electrodes to be formed. In other words, the first patterned protective layer 104 is used to define a plurality of patterns of touch sensing electrodes on the transparent conductive layer 102. For example, the first patterned protective layer 104 can be used to pattern transparent after etching, for example. The conductive layer 102 is used as a mask to form the patterned transparent conductive layer 102 to form the touch sensing electrode. Therefore, the first patterned protective layer 104 may include a plurality of electrode patterns 104a, which are mainly disposed in the visible region R1. However, the partial electrode pattern 104a may extend to the peripheral region R2. Although the material of the first patterned protective layer 104 of the present embodiment is exemplified by a photoresist material, it is not limited thereto, and may be any other material having high etching selectivity for the etching process of the transparent conductive layer 102 or the like. Anti-etching material.

如第4圖所示,進行第1圖所示之步驟S14,於第一圖案化保護層104及透明導電層102上形成一金屬層106,其中金屬層106可全面地形成在第一基板100上,並覆蓋第一圖案化保護層104及透明導電層102。接著,如第5圖所示,進行第1圖所示之步驟S16,於金屬層106上形成一第二圖案化保護層108。本實施例形成第二圖案化保護層108的方法可與上述形成第一圖案化保護層104的方法類似,但不以此為限。第二圖案化保護層108包括用來在金屬層106上定義出走線的圖案,以在後續如蝕刻等圖案化金屬層106之製程中作為遮罩,保護用來形成走線的金屬層106。第5圖係以在周圍區R2中形成兩條走線為例,因此第二圖案化保護層108可包括兩個走線圖案108a,但本發明並不以此為限,可視實際需求設計在周圍區R2中形成一至複數條走線圖案108a。本實施例之第二圖案化保護層108的材料可為光阻材料,但不以此為限,例如可以為任何其他對金屬層106與透明導電層102之蝕刻製程具有高蝕刻選擇性的材料。需注意的是,第一圖案化保護層104與第二圖案化保護層108係部分重疊,如第5圖所示,其中第一圖案化保護層104包括至少一重疊部110,重疊部110與一部分之第二圖案化保護層108重疊。此外,另一部分之第二圖案化保護層108並未與第一圖案化保護層104重疊,其係用以在透明導電層102上定義出走線的圖案。As shown in FIG. 4, a step S14 shown in FIG. 1 is performed to form a metal layer 106 on the first patterned protective layer 104 and the transparent conductive layer 102. The metal layer 106 can be formed entirely on the first substrate 100. The first patterned protective layer 104 and the transparent conductive layer 102 are covered. Next, as shown in FIG. 5, step S16 shown in FIG. 1 is performed to form a second patterned protective layer 108 on the metal layer 106. The method of forming the second patterned protective layer 108 in this embodiment may be similar to the method of forming the first patterned protective layer 104 described above, but is not limited thereto. The second patterned protective layer 108 includes a pattern for defining traces on the metal layer 106 to serve as a mask in a subsequent process of patterning the metal layer 106, such as etching, to protect the metal layer 106 used to form the traces. 5 is an example of forming two traces in the peripheral region R2. Therefore, the second patterned protective layer 108 may include two trace patterns 108a, but the present invention is not limited thereto, and may be designed according to actual needs. One to a plurality of trace patterns 108a are formed in the peripheral region R2. The material of the second patterned protective layer 108 of the present embodiment may be a photoresist material, but not limited thereto, for example, any other material having high etching selectivity for the etching process of the metal layer 106 and the transparent conductive layer 102. . It should be noted that the first patterned protective layer 104 and the second patterned protective layer 108 partially overlap, as shown in FIG. 5 , wherein the first patterned protective layer 104 includes at least one overlapping portion 110 , and the overlapping portion 110 and A portion of the second patterned protective layer 108 overlaps. In addition, another portion of the second patterned protective layer 108 does not overlap the first patterned protective layer 104, which is used to define a pattern of traces on the transparent conductive layer 102.

如第6圖所示,進行第1圖所示之步驟S18,隨後進行一圖案化製程(例如蝕刻製程),以移除未被第二圖案化保護層108覆蓋的金屬層106以及移除未被第一圖案化保護層104或/及第二圖案化保護層108覆蓋的透明導電層102,以形成圖案化透明導電層134與圖案化金屬層136,其中留下的圖案化透明導電層134形成觸控感測電極112、第一下部導線114以及第二下部導線118,而留下的圖案化金屬層136形成第一上部導線116以及第二上部導線120。所形成的第一上部導線116可包括一第一側壁124與一第二側壁126,第一下部導線114可包括一第三側壁128。若本實施例之圖案化製程為蝕刻製程時,則可用同一蝕刻劑對金屬層106以及透明導電層102蝕刻,但不以此為限。在其他變化實施例中,亦可分別針對金屬層106以及透明導電層102使用不同的蝕刻劑以進行蝕刻。值得一提的是,因為第一圖案化保護層104之重疊部110的設置使得在圖案化透明導電層134時,觸控感測電極112與第一下部導線114之間不會發生斷開的現象,以避免觸控感測電極112與第一下部導線114之間發生斷路。As shown in FIG. 6, step S18 shown in FIG. 1 is performed, followed by a patterning process (for example, an etching process) to remove the metal layer 106 not covered by the second patterned protective layer 108 and remove the metal layer 106. The transparent conductive layer 102 covered by the first patterned protective layer 104 or/and the second patterned protective layer 108 to form the patterned transparent conductive layer 134 and the patterned metal layer 136, wherein the patterned transparent conductive layer 134 is left. The touch sensing electrode 112, the first lower wire 114 and the second lower wire 118 are formed, and the patterned metal layer 136 is left to form the first upper wire 116 and the second upper wire 120. The first upper wire 116 may include a first sidewall 124 and a second sidewall 126. The first lower wire 114 may include a third sidewall 128. If the patterning process of the embodiment is an etching process, the metal layer 106 and the transparent conductive layer 102 may be etched by the same etchant, but not limited thereto. In other variant embodiments, different etchants may also be used for the metal layer 106 and the transparent conductive layer 102 for etching. It is worth mentioning that, because the overlapping portion 110 of the first patterned protective layer 104 is disposed, when the transparent conductive layer 134 is patterned, no disconnection occurs between the touch sensing electrode 112 and the first lower wire 114. The phenomenon is to avoid an open circuit between the touch sensing electrode 112 and the first lower wire 114.

接著,如第7圖所示,進行第1圖所示之步驟S20,移除第二圖案化保護層108以及未被圖案化金屬層136覆蓋之第一圖案化保護層104,留下的部分保護層104’即為重疊部110。值得一提的是,在本實施例之觸控面板的製作方法中,第一圖案化保護層104留下之重疊部110位於部分第一上部導線116與對應之透明導電層102(即對應的觸控感測電極112)之間,而第一上部導線116之另一部分與對應之第一下部導線114直接接觸連接,且互相連接之第一上部導線116與第一下部導線114構成走線122A。類似的,第二上部導線120與第二下部導線118至少部分重疊而構成走線122B,且走線122A、122B為電性隔絕。另一方面,由於本實施例之蝕刻製程係對金屬層106及透明導電層102一併蝕刻,因此在蝕刻完成後,第一上部導線116的第一側壁124與對應之第一下部導線114之第三側壁128實質上切齊,而第一上部導線116的第二側壁126與重疊部110之第四側壁130實質上切齊。由上述可知,藉由本實施例之觸控面板的製作方法,可透過一道蝕刻製程一併形成觸控感測電極112以及與其連接的走線122A、122B。因此可減少製程的數量,進而可降低製造的成本。藉由上述之製作方法可獲得如第7圖所示之觸控面板10。此外,在本實施例之製作方法中,亦可視需要再形成一裝飾層(未繪示)至少與走線122A、122B重疊。Next, as shown in FIG. 7, step S20 shown in FIG. 1 is performed to remove the second patterned protective layer 108 and the first patterned protective layer 104 not covered by the patterned metal layer 136, and the remaining portion The protective layer 104' is the overlapping portion 110. It is to be noted that, in the manufacturing method of the touch panel of the embodiment, the overlapping portion 110 left by the first patterned protective layer 104 is located at a portion of the first upper conductive line 116 and the corresponding transparent conductive layer 102 (ie, corresponding Between the touch sensing electrodes 112), another portion of the first upper wire 116 is in direct contact connection with the corresponding first lower wire 114, and the interconnected first upper wire 116 and the first lower wire 114 form a walk. Line 122A. Similarly, the second upper wire 120 and the second lower wire 118 at least partially overlap to form the wire 122B, and the wires 122A, 122B are electrically isolated. On the other hand, since the etching process of the embodiment etches the metal layer 106 and the transparent conductive layer 102 together, after the etching is completed, the first sidewall 124 of the first upper wire 116 and the corresponding first lower wire 114 are formed. The third sidewall 128 is substantially aligned, and the second sidewall 126 of the first upper conductor 116 is substantially aligned with the fourth sidewall 130 of the overlap 110. As can be seen from the above, the touch sensing electrode 112 and the traces 122A and 122B connected thereto can be formed through an etching process. Therefore, the number of processes can be reduced, thereby reducing the cost of manufacturing. The touch panel 10 as shown in FIG. 7 can be obtained by the above-described manufacturing method. In addition, in the manufacturing method of the embodiment, a decorative layer (not shown) may be further formed to overlap at least the traces 122A, 122B.

綜上所述,本發明觸控面板的製作方法主要包括第1圖所示之步驟:In summary, the manufacturing method of the touch panel of the present invention mainly includes the steps shown in FIG. 1 :

步驟S10:於一第一基板之表面上形成一透明導電層;Step S10: forming a transparent conductive layer on the surface of a first substrate;

步驟S12:於透明導電層上形成一第一圖案化保護層,第一圖案化保護層係用以在透明導電層上定義出複數個觸控感測電極;Step S12: forming a first patterned protective layer on the transparent conductive layer, wherein the first patterned protective layer is used to define a plurality of touch sensing electrodes on the transparent conductive layer;

步驟S14:於第一圖案化保護層及透明導電層上形成一金屬層;Step S14: forming a metal layer on the first patterned protective layer and the transparent conductive layer;

步驟S16:於金屬層上形成一第二圖案化保護層,第二圖案化保護層係用以在金屬層上定義出至少一上部導線,其中第一圖案化保護層包括一重疊部,重疊部與一部分之第二圖案化保護層重疊,而未與第一圖案化保護層重疊之另一部分之第二圖案化保護層係用以在透明導電層上定義出至少一下部導線;Step S16: forming a second patterned protective layer on the metal layer, wherein the second patterned protective layer is used to define at least one upper wire on the metal layer, wherein the first patterned protective layer comprises an overlapping portion and an overlapping portion a second patterned protective layer overlapping another portion of the second patterned protective layer and not overlapping the first patterned protective layer is used to define at least a lower wire on the transparent conductive layer;

步驟S18:進行一圖案化製程,以移除未被第二圖案化保護層覆蓋的金屬層以及移除未被第一圖案化保護層或/及第二圖案化保護層覆蓋的透明導電層,以使留下的透明導電層形成觸控感測電極與下部導線,同時使留下的金屬層形成上部導線;以及Step S18: performing a patterning process to remove the metal layer not covered by the second patterned protective layer and removing the transparent conductive layer not covered by the first patterned protective layer or/and the second patterned protective layer. So that the remaining transparent conductive layer forms the touch sensing electrode and the lower wire while the remaining metal layer forms the upper wire;

步驟S20:移除第二圖案化保護層以及未被金屬層覆蓋之第一圖案化保護層,並留下第一圖案化保護層之重疊部。Step S20: removing the second patterned protective layer and the first patterned protective layer not covered by the metal layer, and leaving the overlapping portion of the first patterned protective layer.

請參考第8圖並一併參考第7圖。第8圖繪示了本發明第一實施例之觸控面板的俯視示意圖,且第7圖為沿第8圖中A-A’剖線所繪示之剖面示意圖。由上述可知,本發明提供了根據前述方法所製作的觸控面板,而本發明觸控面板結構之第一實施例介紹如下。如第7圖與第8圖所示,本實施例之觸控面板10包括第一基板100以及設置於第一基板100上的圖案化透明導電層134、圖案化金屬層136和一保護層104’(亦即本實施例製作方法中第一圖案化保護層104之重疊部110)。第一基板100定義有可視區R1以及周圍區R2位於可視區R1之至少一側。在本實施例中,可視區R1係被周圍區R2所環繞。圖案化透明導電層134包括複數個觸控感測電極112,至少設置於第一基板100之可視區R1內,而本實施例之觸控感測電極112有一部分會延伸至周圍區R2,但不以此為限。此外,本實施例之觸控感測電極112的形狀為三角形,但並不以此為限,觸控感測電極112的形狀也可為其他合適的圖形,例如菱形或矩形等。圖案化透明導電層134另包括至少一下部導線設置於第一基板100之周圍區R2內,例如第7圖所示之第一下部導線114與第二下部導線118。以第一下部導線114為例,由於第一下部導線114與觸控感測電極112皆由圖案化透明導電層134所構成,因此第一下部導線114係與對應之觸控感測電極112在周圍區R2直接接觸連接。圖案化金屬層136設置於周圍區R2內之圖案化透明導電層134上,其中圖案化金屬層136包括至少一上部導線,例如對應於第一下部導線114之第一上部導線116以及對應於第二下部導線118之第二上部導線120。第一上部導線116包括第一側壁124以及第二側壁126,其中第一側壁124與對應之第一下部導線114之第三側壁128實質上切齊。再者,保護層104’是在本實施例的製作方法中,經過移除第二圖案化保護層108以及第一圖案化保護層104的步驟後,被圖案化金屬層136覆蓋所留下的第一圖案化保護層104之重疊部110。保護層104’設置於第一上部導線116之一部分與對應之圖案化透明導電層134(即對應之觸控感測電極112)之間,而第一上部導線116之另一部分與對應之第一下部導線114相重疊而直接接觸連接,且第一上部導線116之第二側壁126與保護層104’之第四側壁130實質上切齊。因此,上、下接觸連接之第一上部導線116與第一下部導線114係構成與對應之觸控感測電極112電連接的走線122A。類似的,觸控面板10可於周邊區R2另包括走線122B,其可由第二上部導線120與第二下部導線118所構成,且走線122B亦可與對應之觸控感測電極112連接,但不以此為限。在其他變化實施例中,觸控面板10可依需求而具有更多條的走線。另外,觸控面板10可另包括裝飾層設於周圍區R2內,並至少與圖案化金屬層136重疊。本實施例之觸控面板10可為自容式之觸控面板,但不以此為限。在其他變化實施例中,觸控面板亦可為互容式之觸控面板。Please refer to Figure 8 and refer to Figure 7. 8 is a schematic plan view of a touch panel according to a first embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along line A-A' of FIG. 8. It can be seen from the above that the present invention provides a touch panel fabricated according to the foregoing method, and the first embodiment of the touch panel structure of the present invention is described below. As shown in FIG. 7 and FIG. 8 , the touch panel 10 of the present embodiment includes a first substrate 100 , a patterned transparent conductive layer 134 disposed on the first substrate 100 , a patterned metal layer 136 , and a protective layer 104 . '(i.e., the overlapping portion 110 of the first patterned protective layer 104 in the fabrication method of the present embodiment). The first substrate 100 defines a visible area R1 and a surrounding area R2 on at least one side of the visible area R1. In the present embodiment, the viewable area R1 is surrounded by the surrounding area R2. The patterned transparent conductive layer 134 includes a plurality of touch sensing electrodes 112, which are disposed at least in the visible area R1 of the first substrate 100, and a portion of the touch sensing electrodes 112 of the embodiment extends to the surrounding area R2, but Not limited to this. In addition, the shape of the touch sensing electrode 112 of the present embodiment is a triangle, but not limited thereto, and the shape of the touch sensing electrode 112 may also be other suitable patterns, such as a diamond shape or a rectangle. The patterned transparent conductive layer 134 further includes at least a lower wire disposed in the peripheral region R2 of the first substrate 100, such as the first lower wire 114 and the second lower wire 118 shown in FIG. Taking the first lower wire 114 as an example, since the first lower wire 114 and the touch sensing electrode 112 are both formed by the patterned transparent conductive layer 134, the first lower wire 114 and the corresponding touch sensing The electrode 112 is in direct contact connection at the peripheral zone R2. The patterned metal layer 136 is disposed on the patterned transparent conductive layer 134 in the peripheral region R2, wherein the patterned metal layer 136 includes at least one upper wire, such as a first upper wire 116 corresponding to the first lower wire 114 and corresponding to The second upper wire 120 of the second lower wire 118. The first upper wire 116 includes a first sidewall 124 and a second sidewall 126, wherein the first sidewall 124 is substantially aligned with the third sidewall 128 of the corresponding first lower conductor 114. Moreover, the protective layer 104 ′ is in the manufacturing method of the embodiment, after the step of removing the second patterned protective layer 108 and the first patterned protective layer 104 , the patterned metal layer 136 is covered. The overlapping portion 110 of the first patterned protective layer 104. The protective layer 104' is disposed between a portion of the first upper conductive line 116 and the corresponding patterned transparent conductive layer 134 (ie, the corresponding touch sensing electrode 112), and the other portion of the first upper conductive line 116 corresponds to the first The lower wires 114 overlap and are in direct contact connection, and the second sidewall 126 of the first upper wire 116 is substantially aligned with the fourth sidewall 130 of the protective layer 104'. Therefore, the first upper wire 116 and the first lower wire 114 of the upper and lower contact connections form a wire 122A electrically connected to the corresponding touch sensing electrode 112. Similarly, the touch panel 10 can further include a trace 122B in the peripheral region R2, which can be formed by the second upper lead 120 and the second lower lead 118, and the trace 122B can also be connected to the corresponding touch sensing electrode 112. , but not limited to this. In other variant embodiments, the touch panel 10 can have more stripes as needed. In addition, the touch panel 10 may further include a decorative layer disposed in the surrounding area R2 and overlapping at least the patterned metal layer 136. The touch panel 10 of the present embodiment can be a self-capacitive touch panel, but is not limited thereto. In other variations, the touch panel can also be a mutual-capacitive touch panel.

下文將針對本發明的不同實施例進行說明,且為簡化說明,以下說明主要針對各實施例不同之處進行詳述,而不再對相同之處作重覆贅述。此外,本發明之各實施例中相同之元件係以相同之標號進行標示,以利於各實施例間互相對照。The different embodiments of the present invention are described below, and the following description is mainly for the sake of simplification of the description of the embodiments, and the details are not repeated. In addition, the same elements in the embodiments of the present invention are denoted by the same reference numerals to facilitate the comparison between the embodiments.

請參考第9圖,其繪示了本發明第一實施例之第一變化實施例之觸控面板的剖面示意圖,且其剖面對應第8圖中的A-A’剖線。如第9圖所示,本變化實施例與第一實施例不同的地方在於,觸控面板10A另包括裝飾層138設置於周圍區R2內,並且設於第一基板100與圖案化金屬層136之間,與圖案化金屬層136部分重疊,並遮蔽圖案化金屬層136,例如第一上部導線116與第二上部導線120,因此使用者從觸控面不會看到圖案化金屬層136。裝飾層138係由抗光材質所構成,所述抗光材質定義為光通過其介面會發生損失的材質,以用於遮蔽電子裝置中不欲被看到的元件或光線,例如圖案化金屬層136。裝飾層138的材質可包括陶瓷、有機材料、有機材料與無機材料之混合物或有機-無機混成化合物,其可為單層結構或多層堆疊結構。舉例而言,裝飾層138的材質可為感光樹脂(例如有色光阻)或非感光樹脂(例如油墨)。此外,本變化實施例之第一基板100可為玻璃基板,用來作為觸控面板10A的蓋板,但不以此為限。Referring to FIG. 9, a cross-sectional view of a touch panel according to a first variation of the first embodiment of the present invention is shown, and a cross section thereof corresponds to a line A-A' in FIG. As shown in FIG. 9 , the difference between the embodiment and the first embodiment is that the touch panel 10A further includes a decorative layer 138 disposed in the peripheral region R2 and disposed on the first substrate 100 and the patterned metal layer 136. There is a partial overlap with the patterned metal layer 136 and shielding the patterned metal layer 136, such as the first upper wire 116 and the second upper wire 120, so that the user does not see the patterned metal layer 136 from the touch surface. The decorative layer 138 is composed of a light-resistant material, which is defined as a material through which light is lost through the interface, for shielding elements or light that are not to be seen in the electronic device, such as a patterned metal layer. 136. The material of the decorative layer 138 may include ceramics, organic materials, a mixture of organic materials and inorganic materials, or an organic-inorganic hybrid compound, which may be a single layer structure or a multilayer stack structure. For example, the decorative layer 138 may be made of a photosensitive resin (for example, a colored photoresist) or a non-photosensitive resin (for example, an ink). In addition, the first substrate 100 of the modified embodiment may be a glass substrate, which is used as a cover of the touch panel 10A, but is not limited thereto.

請參考第10圖,其繪示了本發明第一實施例之第二變化實施例之觸控面板的剖面示意圖,且其剖面對應第8圖中的A-A’剖線。如第10圖所示,本變化實施例與第一實施例不同的地方在於,觸控面板10B可另包括第二基板200,第二基板200可例如為觸控面板10B之一蓋板,可包括硬質蓋板例如保護玻璃(cover glass)或塑膠蓋板,此外也可以是可撓式(flexible)蓋板例如薄玻璃、塑膠蓋板或塑膠膜片,或是其他適合材料所形成之蓋板。此外,觸控面板10B可包括裝飾層138設置於第二基板200之表面上並位於周圍區R2內,並且設於第二基板200與圖案化金屬層136(例如第一上部導線116與第二上部導線120)之間,與圖案化金屬層136部分重疊。再者,觸控面板10B可包括一黏著層140,設置於第一基板100與第二基板200之間,用以黏合第一基板100及第二基板200。黏著層140可例如為光學膠(Optical Clear Adhesive)等,但不以此為限。換言之,可先分別於第一基板100及第二基板200各自形成所需要的結構,例如於第一基板100上形成第一實施例所述之結構以及於第二基板200上形成裝飾層138,再經黏著層140將第二基板200與第一基板100之一表面黏合,使得第一基板100位於圖案化金屬層136與裝飾層138之間,以製作出本變化實施例之觸控面板10B,但不以此為限。此外,在其他變化實施例中,第二基板200可經黏著層140與第一基板100之另一表面黏合(黏著層140位於第一基板100與第二基板200之間),使得圖案化金屬層136位於第一基板100與裝飾層138之間,亦即第一上部導線116與第二上部導線120位於第一基板100與裝飾層138之間,並使裝飾層138部分重疊第一上部導線116與第二上部導線120。Referring to FIG. 10, a cross-sectional view of a touch panel according to a second modified embodiment of the first embodiment of the present invention is shown, and a cross section thereof corresponds to a line A-A' in FIG. As shown in FIG. 10, the difference between the embodiment and the first embodiment is that the touch panel 10B can further include a second substrate 200. The second substrate 200 can be, for example, a cover of the touch panel 10B. Including a hard cover such as a cover glass or a plastic cover, or a flexible cover such as a thin glass, a plastic cover or a plastic diaphragm, or a cover formed of other suitable materials. . In addition, the touch panel 10B may include a decorative layer 138 disposed on the surface of the second substrate 200 and located in the surrounding area R2, and disposed on the second substrate 200 and the patterned metal layer 136 (eg, the first upper wires 116 and the second Between the upper wires 120), the patterned metal layer 136 partially overlaps. In addition, the touch panel 10B can include an adhesive layer 140 disposed between the first substrate 100 and the second substrate 200 for bonding the first substrate 100 and the second substrate 200. The adhesive layer 140 can be, for example, an optical adhesive (Optical Clear Adhesive) or the like, but is not limited thereto. In other words, the first substrate 100 and the second substrate 200 may be respectively formed into a desired structure, for example, the structure described in the first embodiment is formed on the first substrate 100 and the decorative layer 138 is formed on the second substrate 200. The second substrate 200 is bonded to the surface of the first substrate 100 via the adhesive layer 140, so that the first substrate 100 is located between the patterned metal layer 136 and the decorative layer 138 to form the touch panel 10B of the modified embodiment. , but not limited to this. In addition, in other modified embodiments, the second substrate 200 may be bonded to the other surface of the first substrate 100 via the adhesive layer 140 (the adhesive layer 140 is located between the first substrate 100 and the second substrate 200), so that the patterned metal The layer 136 is located between the first substrate 100 and the decorative layer 138, that is, the first upper wire 116 and the second upper wire 120 are located between the first substrate 100 and the decorative layer 138, and the decorative layer 138 partially overlaps the first upper wire. 116 and the second upper wire 120.

請參考第11圖與第12圖。第11圖繪示了本發明第二實施例之觸控面板的俯視示意圖,第12圖繪示了本發明第二實施例之觸控面板的剖面示意圖,其中第12圖為沿第11圖中的A-A’剖線的剖面圖。本實施例與第一實施例不同的地方在於,觸控面板20另包括第二基板200,其中第一基板100包括一組觸控感測電極112及與其對應之走線122A、122B,第二基板200包括另一組觸控感測電極212及與其對應之走線222(僅示於第11圖),觸控感測電極112與觸控感測電極212可分別至少設置於第一基板100與第二基板200之可視區R1,而與觸控感測電極112對應設置之走線122A、122B以及與觸控感測電極212對應設置之走線222分別設置於第一基板100與第二基板200之周圍區R2。此外第一基板100、第二基板200可分別包括類似第一實施例所述之結構並由其製作方法形成,但並不以此為限。本實施例之觸控感測電極112、212為長條形之電極,各自沿不同方向延伸且交錯設置,但不以此為限。此外,舉例而言,第一基板100可為塑膠膜片,而第二基板200可為玻璃基板,以同時作為觸控面板20之保護玻璃。換言之,第二基板200可作為觸控面板20之蓋板,但不以此為限。另外,觸控感測電極112係設置於第一基板100之第一表面142上,觸控感測電極212係設置於第二基板200之第二表面144上,其中第二表面144係面對第一基板100。本實施例之第一基板100與第二基板200可以第一基板100之第一表面142靠近第二基板200之第二表面144的方式藉由黏著層140黏貼。此外,在其他變化實施例中,第二基板200可經黏著層140與第一基板100之另一表面黏合(黏著層140設於第一基板100與第二基板200之間),使得第一基板100位於第二基板200與觸控感測電極112之間,亦即第一基板100位於第二基板200與第一和第二上部導線116、120之間。本實施例之觸控面板20可為自容式或互容式觸控面板,但不以此為限。此外,觸控面板20可另包括裝飾層138,例如設置於第二基板200之第二表面144上以及周圍區R2內,並至少與走線122A、122B、222部分重疊,但不以此為限。裝飾層138亦可依需求設置於周圍區R2內其他適合的地方,以用於遮蔽觸控面板20中不欲被看到的元件或光線。Please refer to Figure 11 and Figure 12. 11 is a top plan view of a touch panel according to a second embodiment of the present invention, and FIG. 12 is a cross-sectional view showing a touch panel according to a second embodiment of the present invention, wherein FIG. 12 is a view along FIG. A section of the A-A' line. The difference between the embodiment and the first embodiment is that the touch panel 20 further includes a second substrate 200. The first substrate 100 includes a set of touch sensing electrodes 112 and corresponding traces 122A, 122B, and a second The substrate 200 includes another set of touch sensing electrodes 212 and corresponding traces 222 (shown only in FIG. 11 ). The touch sensing electrodes 112 and the touch sensing electrodes 212 can be respectively disposed on the first substrate 100 . The traces 122A and 122B corresponding to the touch sensing electrodes 112 and the traces 222 corresponding to the touch sensing electrodes 212 are respectively disposed on the first substrate 100 and the second The surrounding area R2 of the substrate 200. In addition, the first substrate 100 and the second substrate 200 may respectively be formed by a method similar to that described in the first embodiment, but are not limited thereto. The touch sensing electrodes 112 and 212 of the present embodiment are elongated electrodes, each extending in different directions and staggered, but not limited thereto. In addition, for example, the first substrate 100 may be a plastic film, and the second substrate 200 may be a glass substrate to serve as a cover glass for the touch panel 20 at the same time. In other words, the second substrate 200 can serve as a cover for the touch panel 20, but is not limited thereto. In addition, the touch sensing electrodes 112 are disposed on the first surface 142 of the first substrate 100, and the touch sensing electrodes 212 are disposed on the second surface 144 of the second substrate 200, wherein the second surface 144 is facing The first substrate 100. The first substrate 100 and the second substrate 200 of the present embodiment may be adhered by the adhesive layer 140 in such a manner that the first surface 142 of the first substrate 100 is close to the second surface 144 of the second substrate 200. In addition, in other modified embodiments, the second substrate 200 may be adhered to the other surface of the first substrate 100 via the adhesive layer 140 (the adhesive layer 140 is disposed between the first substrate 100 and the second substrate 200), so that the first The substrate 100 is located between the second substrate 200 and the touch sensing electrode 112 , that is, the first substrate 100 is located between the second substrate 200 and the first and second upper wires 116 , 120 . The touch panel 20 of the present embodiment can be a self-contained or a mutual-capacitive touch panel, but is not limited thereto. In addition, the touch panel 20 may further include a decorative layer 138, for example, disposed on the second surface 144 of the second substrate 200 and in the surrounding area R2, and at least partially overlap the traces 122A, 122B, and 222, but not limit. The decorative layer 138 can also be disposed at other suitable places in the surrounding area R2 as needed to shield components or light in the touch panel 20 that are not to be seen.

請參考第13圖,其繪示了本發明第二實施例之第一變化實施例之觸控面板的剖面示意圖,且其剖面對應第11圖中的A-A’剖線。如第13圖所示,本變化實施例之觸控感測電極112係設置於第一基板100之第一表面142上,觸控感測電極212係設置於第二基板200之第二表面144上,其中第二表面144係為第二基板200相反於第一基板100的表面,而第二基板200另具有相反於第二表面144之第三表面146,其面對第一基板100之第一表面142。本變化實施例與第二實施例不同的地方在於,第一基板100與第二基板200可以第一基板100之第一表面142靠近第二基板200之第三表面146的方式藉由黏著層1401黏貼。另一方面,本變化實施例之觸控面板20A可另包括蓋板148,並藉由黏著層1402將蓋板148黏貼於第二基板200之第二表面144。此外,本變化實施例之第一基板100、第二基板200的材料皆為膜片,但不以此為限。舉例而言,在其他變化實施例中,第一基板100、第二基板200也可為玻璃基板,或者第一基板100、第二基板200的其中一者的材料為膜片,而另一者的材料為玻璃。另值得一提的是,第一基板100、第二基板200可分別包括類似第一實施例所述之結構並由其製作方法形成,且並不以此為限。再者,觸控面板20A可另包括裝飾層138,設置於蓋板148面對第二基板200的表面上,裝飾層138位於周圍區R2內並至少與走線122A、122B、222部分重疊,但不以此為限。裝飾層138亦可依需求設置於周圍區R2內其他適合的地方,以用於遮蔽觸控面板20A中不欲被看到的元件或光線。Referring to FIG. 13, a cross-sectional view of a touch panel according to a first variation of the second embodiment of the present invention is shown, and a cross section thereof corresponds to a line A-A' in FIG. As shown in FIG. 13 , the touch sensing electrodes 112 of the present embodiment are disposed on the first surface 142 of the first substrate 100 , and the touch sensing electrodes 212 are disposed on the second surface 144 of the second substrate 200 . The second surface 144 is opposite to the surface of the first substrate 100, and the second substrate 200 has a third surface 146 opposite to the second surface 144 facing the first substrate 100. A surface 142. The difference between the embodiment of the present embodiment and the second embodiment is that the first substrate 100 and the second substrate 200 can be adjacent to the third surface 146 of the second substrate 200 by the first surface 142 of the first substrate 100 by the adhesive layer 1401. Paste. On the other hand, the touch panel 20A of the modified embodiment may further include a cover 148, and the cover 148 is adhered to the second surface 144 of the second substrate 200 by the adhesive layer 1402. In addition, the materials of the first substrate 100 and the second substrate 200 of the modified embodiment are all diaphragms, but are not limited thereto. For example, in other variant embodiments, the first substrate 100 and the second substrate 200 may also be glass substrates, or the material of one of the first substrate 100 and the second substrate 200 is a diaphragm, and the other is The material is glass. It is also to be noted that the first substrate 100 and the second substrate 200 may respectively be formed by a method similar to that described in the first embodiment, and are not limited thereto. In addition, the touch panel 20A may further include a decorative layer 138 disposed on the surface of the cover plate 148 facing the second substrate 200. The decorative layer 138 is located in the surrounding area R2 and at least partially overlaps the traces 122A, 122B, and 222. But not limited to this. The decorative layer 138 can also be disposed at other suitable places in the surrounding area R2 as needed to shield components or light in the touch panel 20A that are not to be seen.

綜上所述,根據本發明之觸控面板以及其製作方法,本發明係在透明導電層上形成第一圖案化保護層,以定義出觸控感測電極的圖案,在還未圖案化透明導電層,在第一圖案化保護層形成金屬層,再於金屬層上形成第二圖案化保護層,定義出走線的圖案,之後利用第一圖案化保護層與第二圖案化保護層當作遮罩,同時移除曝露出的透明導電層及金屬層,以分別形成觸控感測電極及走線,藉此可減少製程的數量而降低製造的成本。 以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。In summary, according to the touch panel of the present invention and the manufacturing method thereof, the present invention forms a first patterned protective layer on the transparent conductive layer to define a pattern of the touch sensing electrodes, which has not been patterned transparently. a conductive layer, a metal layer is formed on the first patterned protective layer, and a second patterned protective layer is formed on the metal layer to define a trace pattern, and then the first patterned protective layer and the second patterned protective layer are used as The mask removes the exposed transparent conductive layer and the metal layer to form the touch sensing electrodes and the traces, respectively, thereby reducing the number of processes and reducing the manufacturing cost. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

10、10A、10B、20、20A‧‧‧觸控面板
100‧‧‧第一基板
200‧‧‧第二基板
102‧‧‧透明導電層
104‧‧‧第一圖案化保護層
104a‧‧‧電極圖案
104’‧‧‧保護層
106‧‧‧金屬層
108‧‧‧第二圖案化保護層
108a‧‧‧走線圖案
110‧‧‧重疊部
112、212‧‧‧觸控感測電極
114‧‧‧第一下部導線
116‧‧‧第一上部導線
118‧‧‧第二下部導線
120‧‧‧第二上部導線
122A、122B、222‧‧‧走線
124‧‧‧第一側壁
126‧‧‧第二側壁
128‧‧‧第三側壁
130‧‧‧第四側壁
134‧‧‧圖案化透明導電層
136‧‧‧圖案化金屬層
138‧‧‧裝飾層
140、1401、1402‧‧‧黏著層
142‧‧‧第一表面
144‧‧‧第二表面
146‧‧‧第三表面
148‧‧‧蓋板
R1‧‧‧可視區
R2‧‧‧周圍區
S10、S12、S14、S16、S18、S20‧‧‧步驟
10, 10A, 10B, 20, 20A‧‧‧ touch panel
100‧‧‧First substrate
200‧‧‧second substrate
102‧‧‧Transparent conductive layer
104‧‧‧First patterned protective layer
104a‧‧‧electrode pattern
104'‧‧‧Protective layer
106‧‧‧metal layer
108‧‧‧Second patterned protective layer
108a‧‧‧Line pattern
110‧‧‧ overlap
112, 212‧‧‧ touch sensing electrodes
114‧‧‧First lower wire
116‧‧‧First upper wire
118‧‧‧Second lower wire
120‧‧‧Second upper wire
122A, 122B, 222‧‧‧ Trace
124‧‧‧First side wall
126‧‧‧ second side wall
128‧‧‧ third side wall
130‧‧‧fourth sidewall
134‧‧‧ patterned transparent conductive layer
136‧‧‧ patterned metal layer
138‧‧‧Decorative layer
140, 1401, 1402‧‧‧ adhesive layer
142‧‧‧ first surface
144‧‧‧ second surface
146‧‧‧ third surface
148‧‧‧ cover
R1‧‧ visible area
R2‧‧‧ surrounding area
S10, S12, S14, S16, S18, S20‧‧ steps

第1圖為本發明觸控面板的製作方法的步驟流程圖。 第2圖至第7圖繪示了本發明第一實施例之觸控面板的製作方法示意圖。 第8圖繪示了本發明第一實施例之觸控面板的俯視示意圖。 第9圖繪示了本發明第一實施例之第一變化實施例之觸控面板的剖面示意圖。 第10圖繪示了本發明第一實施例之第二變化實施例之觸控面板的剖面示意圖。 第11圖繪示了本發明第二實施例之觸控面板的俯視示意圖。 第12圖繪示了本發明第二實施例之觸控面板的剖面示意圖。 第13圖繪示了本發明第二實施例之第一變化實施例之觸控面板的剖面示意圖。FIG. 1 is a flow chart showing the steps of a method for manufacturing a touch panel of the present invention. 2 to 7 are schematic views showing a manufacturing method of the touch panel according to the first embodiment of the present invention. FIG. 8 is a schematic top plan view of a touch panel according to a first embodiment of the present invention. FIG. 9 is a cross-sectional view showing a touch panel according to a first variation of the first embodiment of the present invention. FIG. 10 is a cross-sectional view showing a touch panel of a second modified embodiment of the first embodiment of the present invention. 11 is a top plan view of a touch panel according to a second embodiment of the present invention. FIG. 12 is a cross-sectional view showing a touch panel of a second embodiment of the present invention. FIG. 13 is a cross-sectional view showing a touch panel according to a first variation of the second embodiment of the present invention.

S10、S12、S14、S16、S18、S20‧‧‧步驟 S10, S12, S14, S16, S18, S20‧‧ steps

Claims (21)

一種觸控面板的製作方法,包括: 於一第一基板之表面上形成一透明導電層; 於該透明導電層上形成一第一圖案化保護層,該第一圖案化保護層係用以在該透明導電層上定義出複數個觸控感測電極; 於該第一圖案化保護層及該透明導電層上形成一金屬層; 於該金屬層上形成一第二圖案化保護層,該第二圖案化保護層係用以在該金屬層上定義出一上部導線,其中該第一圖案化保護層包括一重疊部,該重疊部與一部分之該第二圖案化保護層重疊,而未與該第一圖案化保護層重疊之另一部分之該第二圖案化保護層係用以在該透明導電層上定義出一下部導線; 進行一圖案化製程,以移除未被該第二圖案化保護層覆蓋的該金屬層以及移除未被該第一圖案化保護層或/及該第二圖案化保護層覆蓋的該透明導電層,以使留下的該透明導電層形成該等觸控感測電極與該下部導線,並使留下的該金屬層形成該上部導線;以及 移除該第二圖案化保護層以及未被該金屬層覆蓋之該第一圖案化保護層,並留下該第一圖案化保護層之該重疊部。A method for fabricating a touch panel, comprising: forming a transparent conductive layer on a surface of a first substrate; forming a first patterned protective layer on the transparent conductive layer, wherein the first patterned protective layer is used to a plurality of touch sensing electrodes are defined on the transparent conductive layer; a metal layer is formed on the first patterned protective layer and the transparent conductive layer; and a second patterned protective layer is formed on the metal layer. The second patterned protective layer is configured to define an upper conductive line on the metal layer, wherein the first patterned protective layer comprises an overlapping portion, and the overlapping portion overlaps with a portion of the second patterned protective layer, and The second patterned protective layer of the other portion of the first patterned protective layer is overlapped to define a lower wire on the transparent conductive layer; performing a patterning process to remove the second patterned The metal layer covered by the protective layer and the transparent conductive layer not covered by the first patterned protective layer or/and the second patterned protective layer are removed to form the transparent conductive layer to form the touch Sensing electricity And the lower wire, and leaving the metal layer to form the upper wire; and removing the second patterned protective layer and the first patterned protective layer not covered by the metal layer, and leaving the first The overlapping portion of the protective layer is patterned. 如請求項1所述之製作方法,其中該第一圖案化保護層之該重疊部位於該上部導線之一部分與對應之該透明導電層之間,且該上部導線之另一部分與對應之該下部導線直接接觸。The manufacturing method of claim 1, wherein the overlapping portion of the first patterned protective layer is located between a portion of the upper wire and the corresponding transparent conductive layer, and another portion of the upper wire corresponds to the lower portion The wires are in direct contact. 如請求項1所述之製作方法,其中該上部導線包括一第一側壁與一第二側壁,該第一側壁與對應之該下部導線之一第三側壁實質上切齊。The manufacturing method of claim 1, wherein the upper wire comprises a first side wall and a second side wall, the first side wall being substantially aligned with a third side wall of the corresponding lower wire. 如請求項3所述之製作方法,其中該上部導線之該第二側壁與該重疊部之一第四側壁實質上切齊。The manufacturing method of claim 3, wherein the second sidewall of the upper wire is substantially aligned with a fourth sidewall of the overlapping portion. 如請求項1所述之製作方法,其中該上部導線與該下部導線構成至少一走線。The manufacturing method of claim 1, wherein the upper wire and the lower wire form at least one trace. 如請求項1所述之製作方法,另包括於該第一基板上形成一裝飾層,其中該裝飾層設置於該上部導線與該第一基板之間,且該裝飾層與該上部導線部分重疊。The manufacturing method of claim 1, further comprising forming a decorative layer on the first substrate, wherein the decorative layer is disposed between the upper wire and the first substrate, and the decorative layer partially overlaps the upper wire . 如請求項1所述之製作方法,另包括: 提供一第二基板,其表面設置有一裝飾層;以及 利用一黏著層黏合該第一基板與該第二基板,其中該黏著層設置於該第一基板與該第二基板之間,該第一基板設置於該上部導線與該裝飾層之間,且該裝飾層與該上部導線部分重疊。The manufacturing method of claim 1, further comprising: providing a second substrate having a decorative layer disposed on the surface thereof; and bonding the first substrate and the second substrate with an adhesive layer, wherein the adhesive layer is disposed on the first substrate Between a substrate and the second substrate, the first substrate is disposed between the upper wire and the decorative layer, and the decorative layer partially overlaps the upper wire. 如請求項1所述之製作方法,另包括: 提供一第二基板,其表面設置有一裝飾層;以及 利用一黏著層黏合該第一基板與該第二基板,其中該黏著層設置於該第一基板與該第二基板之間,該上部導線設置於該第一基板與該裝飾層之間,且該裝飾層與該上部導線部分重疊。The manufacturing method of claim 1, further comprising: providing a second substrate having a decorative layer disposed on the surface thereof; and bonding the first substrate and the second substrate with an adhesive layer, wherein the adhesive layer is disposed on the first substrate Between a substrate and the second substrate, the upper wire is disposed between the first substrate and the decorative layer, and the decorative layer partially overlaps the upper wire. 如請求項1所述之製作方法,另包括: 提供一第二基板,其表面設置有一裝飾層與複數個觸控感測電極;以及 利用一黏著層黏合該第一基板與該第二基板,其中該第一基板表面上的該等觸控感測電極與該第二基板表面上的該等觸控感測電極設置於該第一基板與該第二基板之間,且該裝飾層與該上部導線部分重疊。The manufacturing method of claim 1, further comprising: providing a second substrate having a decorative layer and a plurality of touch sensing electrodes disposed on the surface; and bonding the first substrate and the second substrate by using an adhesive layer, The touch sensing electrodes on the surface of the first substrate and the touch sensing electrodes on the surface of the second substrate are disposed between the first substrate and the second substrate, and the decorative layer and the The upper wires partially overlap. 如請求項1所述之製作方法,另包括: 提供一第二基板,其表面設置有一裝飾層與複數個觸控感測電極;以及 利用一黏著層黏合該第一基板與該第二基板,其中該第一基板設置於該上部導線與該第二基板之間,且該裝飾層與該上部導線部分重疊。The manufacturing method of claim 1, further comprising: providing a second substrate having a decorative layer and a plurality of touch sensing electrodes disposed on the surface; and bonding the first substrate and the second substrate by using an adhesive layer, The first substrate is disposed between the upper wire and the second substrate, and the decorative layer partially overlaps the upper wire. 如請求項1所述之製作方法,另包括: 提供一第二基板與一蓋板,其中該第二基板表面設置有複數個觸控感測電極,該蓋板表面設置有一裝飾層; 利用一黏著層黏合該第一基板與該第二基板,其中該第二基板設置於該第一基板表面上的該等觸控感測電極與該第二基板表面上的該等觸控感測電極之間;以及 利用另一黏著層黏合該第二基板與該蓋板,其中該裝飾層設置於該第二基板與該蓋板之間,且該裝飾層與該上部導線部分重疊。The method of claim 1, further comprising: providing a second substrate and a cover, wherein the second substrate surface is provided with a plurality of touch sensing electrodes, the cover surface is provided with a decorative layer; Adhesively bonding the first substrate and the second substrate, wherein the second substrate is disposed on the touch sensing electrodes on the surface of the first substrate and the touch sensing electrodes on the surface of the second substrate And bonding the second substrate and the cover with another adhesive layer, wherein the decorative layer is disposed between the second substrate and the cover, and the decorative layer partially overlaps the upper wire. 一種觸控面板,包括: 一第一基板,定義有一可視區以及一周圍區位於該可視區之至少一側; 一圖案化透明導電層,設置於該第一基板之表面上,該圖案化透明導電層包括: 複數個觸控感測電極,至少設置於該第一基板之該可視區內;以及 一下部導線,設置於該第一基板之該周圍區內,該下部導線係對應連接於該等觸控感測電極之其中一者; 一圖案化金屬層,設置於該周圍區內之該圖案化透明導電層上,其中該圖案化金屬層包括一上部導線,該上部導線包括一第一側壁以及一第二側壁,其中該第一側壁與對應之該下部導線之一第三側壁實質上切齊;以及 一保護層,設置於該上部導線之一部分與對應之該圖案化透明導電層之間,且該上部導線之另一部分與對應之該下部導線直接接觸。A touch panel includes: a first substrate defining a visible area and a surrounding area on at least one side of the visible area; a patterned transparent conductive layer disposed on a surface of the first substrate, the patterned transparent The conductive layer includes: a plurality of touch sensing electrodes disposed at least in the visible area of the first substrate; and a lower wire disposed in the surrounding area of the first substrate, the lower wire is correspondingly connected to the One of the touch sensing electrodes; a patterned metal layer disposed on the patterned transparent conductive layer in the surrounding region, wherein the patterned metal layer includes an upper wire, the upper wire includes a first a sidewall and a second sidewall, wherein the first sidewall is substantially aligned with a third sidewall of the corresponding lower conductor; and a protective layer disposed on a portion of the upper conductor and the corresponding patterned transparent conductive layer And another portion of the upper wire is in direct contact with the corresponding lower wire. 如請求項12所述之觸控面板,其中該上部導線之該第二側壁與該保護層之一第四側壁實質上切齊。The touch panel of claim 12, wherein the second sidewall of the upper wire is substantially aligned with a fourth sidewall of the protective layer. 如請求項12所述之觸控面板,其包括至少一走線,由該上部導線與該下部導線互相重疊所構成。The touch panel of claim 12, comprising at least one trace formed by overlapping the upper wire and the lower wire. 如請求項12所述之觸控顯示裝置,更包括一裝飾層,設置於該第一基板之該周圍區。The touch display device of claim 12, further comprising a decorative layer disposed in the surrounding area of the first substrate. 如請求項15所述之觸控顯示裝置,其中該裝飾層設於該圖案化金屬層與該第一基板之間,且該裝飾層與該圖案化金屬層部分重疊。The touch display device of claim 15, wherein the decorative layer is disposed between the patterned metal layer and the first substrate, and the decorative layer partially overlaps the patterned metal layer. 如請求項12所述之觸控顯示裝置,另包括: 一第二基板,其表面設置有一裝飾層;以及 一黏著層,設置於該第一基板與該第二基板之間,其中該第一基板設置於該上部導線與該裝飾層之間,且該裝飾層與該上部導線部分重疊。The touch display device of claim 12, further comprising: a second substrate having a decorative layer disposed on the surface thereof; and an adhesive layer disposed between the first substrate and the second substrate, wherein the first The substrate is disposed between the upper wire and the decorative layer, and the decorative layer partially overlaps the upper wire. 如請求項12所述之觸控顯示裝置,另包括: 一第二基板,其表面設置有一裝飾層;以及 一黏著層,設置於該第一基板與該第二基板之間,其中該上部導線設置於該第一基板與該裝飾層之間,且該裝飾層與該上部導線部分重疊。The touch display device of claim 12, further comprising: a second substrate having a decorative layer disposed on the surface thereof; and an adhesive layer disposed between the first substrate and the second substrate, wherein the upper wire And disposed between the first substrate and the decorative layer, and the decorative layer partially overlaps the upper wire. 如請求項12所述之觸控顯示裝置,另包括: 一第二基板,其表面設置有一裝飾層與複數個觸控感測電極;以及 一黏著層,設置於該第一基板與該第二基板之間,其中該第一基板表面上的該等觸控感測電極與該第二基板表面上的該等觸控感測電極設置於該第一基板與該第二基板之間,且該裝飾層與該上部導線部分重疊。The touch display device of claim 12, further comprising: a second substrate having a decorative layer and a plurality of touch sensing electrodes disposed on the surface; and an adhesive layer disposed on the first substrate and the second The touch sensing electrodes on the surface of the first substrate and the touch sensing electrodes on the surface of the second substrate are disposed between the first substrate and the second substrate, and the The decorative layer partially overlaps the upper wire. 如請求項12所述之觸控顯示裝置,另包括: 一第二基板,其表面設置有一裝飾層與複數個觸控感測電極;以及 一黏著層,設置於該第一基板與該第二基板之間,其中該第一基板設置於上部導線與該第二基板之間,且該裝飾層與該上部導線部分重疊。The touch display device of claim 12, further comprising: a second substrate having a decorative layer and a plurality of touch sensing electrodes disposed on the surface; and an adhesive layer disposed on the first substrate and the second Between the substrates, the first substrate is disposed between the upper wire and the second substrate, and the decorative layer partially overlaps the upper wire. 如請求項12所述之觸控顯示裝置,另包括: 一第二基板,其表面設置有複數個觸控感測電極,其中該上部導線位於該第一基板與該第二基板之間; 一蓋板,其表面設置有一裝飾層,其中該裝飾層位於該蓋板與該第二基板之間;以及 二黏著層,分別設置於該第一基板與該第二基板之間以及該蓋板與該第二基板之間。The touch display device of claim 12, further comprising: a second substrate, the surface of which is provided with a plurality of touch sensing electrodes, wherein the upper wire is located between the first substrate and the second substrate; a cover layer having a decorative layer disposed on the surface thereof, wherein the decorative layer is located between the cover plate and the second substrate; and a second adhesive layer disposed between the first substrate and the second substrate and the cover plate and Between the second substrates.
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