TW201802452A - Gas analytical device Including an illumination part, a light receiving part and an integrated tube - Google Patents

Gas analytical device Including an illumination part, a light receiving part and an integrated tube Download PDF

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TW201802452A
TW201802452A TW106117433A TW106117433A TW201802452A TW 201802452 A TW201802452 A TW 201802452A TW 106117433 A TW106117433 A TW 106117433A TW 106117433 A TW106117433 A TW 106117433A TW 201802452 A TW201802452 A TW 201802452A
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hole
gas
analysis device
light receiving
tube
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TW106117433A
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TWI716598B (en
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赤尾幸造
谷口裕
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富士電機股份有限公司
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Abstract

The issue of the present invention is to decrease the effects caused by dusts or moisture in gases to be analyzed. The solution of the present invention is to provide a gas analytical device which comprises an illumination part, a light receiving part and an integrated tube. The illumination part is configured to illuminate the gas to be analyzed in an air channel with laser light. The light receiving part is disposed face-to-face correspondingly to the illumination part in a manner that they are separated by the air channel, and configured to receive the laser light passed through the gas to be analyzed. The integrated tube is disposed between the illumination part and the light receiving part so that the laser light may pass therethrough. In addition, the tube defines a first hole facing an upper stream of the gas to be analyzed in the air channel and a second hole facing a lower stream of the gas to be analyzed in the air channel.

Description

氣體分析裝置 Gas analysis device

本發明,是關於氣體分析裝置。 The present invention relates to a gas analysis device.

以往,周知有雷射式的氣體分析裝置。氣體分析裝置,是具備:將雷射光照射於分析對象氣體的照射部、以及接受通過分析對象氣體後之雷射光光線的受光部。氣體分析裝置,是依據在受光部的受光量來分析吸收光譜。氣體分析裝置,係依據吸收光譜,分析對象氣體中之對象物質的濃度(例如,請參照專利文獻1)。 Conventionally, a laser-type gas analyzer is known. The gas analysis device includes an irradiating unit that irradiates laser light to the analysis target gas, and a light receiving unit that receives laser light rays passing through the analysis target gas. The gas analyzer analyzes the absorption spectrum based on the amount of light received in the light receiving section. The gas analysis device analyzes the concentration of a target substance in a target gas based on an absorption spectrum (for example, refer to Patent Document 1).

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Literature]

〔專利文獻1〕日本特開2009-270917號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2009-270917

於雷射式氣體分析裝置,在分析對象氣體中含有水氣或是灰塵之情形時,雷射光就會受到水氣或是灰塵而散射或是被吸收。並依水氣或是灰塵的量,會有減少 在受光部之雷射光的受光量,而使得對象物質的濃度難以測量的情形。 In the laser-type gas analysis device, when the gas to be analyzed contains moisture or dust, the laser light is scattered or absorbed by the moisture or dust. Depending on the amount of moisture or dust, A situation where the amount of received laser light in the light-receiving section makes it difficult to measure the concentration of the target substance.

於本發明之一樣態,氣體分析裝置,係具備:照射部、受光部、以及筒為佳;照射部,係對在煙道內流動的分析對象氣體照射雷射光為佳;受光部,係以隔著上述煙道之方式與上述照射部相向配置為佳;受光部,係接受已通過分析對象氣體的雷射光線為佳;筒,係以使上述雷射光通過內部之方式配置在上述照射部與上述受光部之間之一體的筒為佳;於煙道內,使第1孔與第2孔形成於筒為佳。第1孔,係面向分析對象氣體之上游側為佳;第2孔,係面向分析對象氣體的下游側為佳。 As in the present invention, the gas analysis device preferably includes: an irradiating section, a light receiving section, and a tube; the irradiating section is preferably irradiated with laser light to the analysis target gas flowing in the flue; It is better to face the irradiating part through the flue. The light receiving part is better to receive the laser light that has passed through the analysis target gas. The tube is arranged in the irradiating part so that the laser light passes through the inside It is preferable that the tube is a body formed between the light receiving portion and the first hole and the second hole are formed in the tube in the flue. The first hole is preferably facing the upstream side of the analysis target gas; the second hole is preferably facing the downstream side of the analysis target gas.

氣體分析裝置,係具備照射部側導入部與受光部側導入部為佳;照射部側導入部,係將清洗氣體從筒之照射部側的端部導入於筒內為佳;受光部側導入部,係將清洗氣體從筒之受光部側的端部導入於筒內為佳。 The gas analysis device preferably includes an irradiating section side introducing section and a light receiving section side introducing section; the irradiating section side introducing section preferably introduces cleaning gas from the end of the irradiated section side of the cartridge into the cylinder; It is preferable that the cleaning gas is introduced into the cylinder from the end portion on the light receiving portion side of the cylinder.

第2孔,是以與第1孔相向之方式配置在分析對象氣體的下游側為佳;第2孔的開口面積是比第1孔更大為佳。 The second hole is preferably disposed on the downstream side of the analysis target gas so as to face the first hole; and the opening area of the second hole is preferably larger than the first hole.

第1孔及第2孔,係具有長軸為佳;長軸,係朝向筒的長邊方向延伸為佳。 It is preferable that the first hole and the second hole have a long axis; the long axis is preferably extended toward the long side of the cylinder.

氣體分析裝置,更具備罩蓋部為佳;罩蓋部,是與筒分開形成為佳;罩蓋部,是將第1孔局部性地 覆蓋為佳。 The gas analysis device preferably further includes a cover portion; the cover portion is preferably formed separately from the cylinder; the cover portion is a part of the first hole Coverage is better.

罩蓋部,是將第1孔在長軸方向上的中央部予以覆蓋為佳;罩蓋部,是沒有將第1孔在長軸方向上的端部予以覆蓋為佳;第1孔,係具有朝向筒之長邊方向延伸的長軸。 The cover part preferably covers the central part of the first hole in the long axis direction; the cover part preferably does not cover the end of the first hole in the long axis direction; the first hole is It has a long axis extending toward the long side of the tube.

孔部形成於罩蓋部為佳;孔部,係使分析對象氣體通過為佳。 It is preferable that the hole portion is formed in the cover portion; it is preferable that the hole passes the analysis target gas.

罩蓋部,係將第1孔之整體予以覆蓋為佳;孔部,係形成於罩蓋部為佳。 The cover portion is preferably formed by covering the entirety of the first hole; the hole portion is preferably formed by the cover portion.

於罩蓋部,形成有複數個孔部為佳。 Preferably, a plurality of holes are formed in the cover portion.

罩蓋部,是被分割成複數個為佳。 The cover portion is preferably divided into a plurality of pieces.

罩蓋部的下端,是延伸至比第1孔更下側為止為佳。 It is preferable that the lower end of the cover portion extends to a lower side than the first hole.

又,上述之發明的內容概要,並不是將本發明之必要的特徵所有全都予以列舉者。又,此等特徵群之次組合(subcombination)亦當然得以成為發明。 It is to be noted that the summary of the content of the invention described above is not necessarily all of the essential features of the invention. In addition, the subcombination of these feature groups is of course an invention.

1‧‧‧分析對象氣體 1‧‧‧ analysis target gas

2‧‧‧雷射光 2‧‧‧ laser light

6‧‧‧清洗氣體 6‧‧‧ cleaning gas

8‧‧‧清洗氣體 8‧‧‧ cleaning gas

10‧‧‧照射部 10‧‧‧ Irradiation Department

12‧‧‧雷射元件 12‧‧‧laser element

14‧‧‧準直透鏡 14‧‧‧ Collimating lens

16‧‧‧框體 16‧‧‧Frame

18‧‧‧照射部側透光窗 18‧‧‧ side light transmission window

20‧‧‧受光部 20‧‧‧Light receiving section

22‧‧‧集光透鏡 22‧‧‧ collection lens

24‧‧‧受光元件 24‧‧‧ light receiving element

25‧‧‧信號處理部 25‧‧‧Signal Processing Department

26‧‧‧框體 26‧‧‧Frame

28‧‧‧受光部側透光窗 28‧‧‧Side light transmission window

30‧‧‧筒 30‧‧‧ tube

30a‧‧‧照射部側連結管 30a‧‧‧ side connection tube

30b‧‧‧受光部側連結管 30b‧‧‧ side connecting tube

32‧‧‧第1孔 32‧‧‧ 1st hole

34‧‧‧第2孔 34‧‧‧ 2nd hole

36‧‧‧凸緣 36‧‧‧ flange

37‧‧‧凸緣 37‧‧‧ flange

38‧‧‧端部 38‧‧‧ tip

42‧‧‧照射部側導入部 42‧‧‧Irradiation section side introduction section

44‧‧‧受光部側導入部 44‧‧‧ Light-receiving part side introduction part

50‧‧‧罩蓋部 50‧‧‧ Cover section

52‧‧‧支撐部 52‧‧‧ support

54‧‧‧下端 54‧‧‧ bottom

56‧‧‧孔部 56‧‧‧ Hole

60‧‧‧煙道 60‧‧‧chimney

62‧‧‧側壁 62‧‧‧ sidewall

100‧‧‧氣體分析裝置 100‧‧‧Gas analysis device

第1圖是顯示本發明第1實施形態中之氣體分析裝置100之概要的立體圖。 Fig. 1 is a perspective view showing an outline of a gas analysis device 100 in a first embodiment of the present invention.

第2圖是本發明第1實施形態中之氣體分析裝置100的剖視圖。 Fig. 2 is a sectional view of the gas analysis device 100 in the first embodiment of the present invention.

第3圖是筒30的側視圖。 FIG. 3 is a side view of the cartridge 30.

第4圖是筒30的上視圖。 FIG. 4 is a top view of the cartridge 30.

第5圖是本發明第2實施形態中之氣體分析裝置100的側視圖。 Fig. 5 is a side view of a gas analysis device 100 according to a second embodiment of the present invention.

第6圖是沿著本發明第2實施形態中之氣體分析裝置100之AA’線的剖視圖。 Fig. 6 is a cross-sectional view taken along line AA 'of the gas analysis device 100 according to the second embodiment of the present invention.

第7圖是顯示第2實施形態中之氣體分析裝置100之變形例的側視圖。 Fig. 7 is a side view showing a modification of the gas analysis device 100 in the second embodiment.

第8圖是顯示第2實施形態中之氣體分析裝置100之其他變形例的側視圖。 Fig. 8 is a side view showing another modification of the gas analysis device 100 in the second embodiment.

第9圖是顯示第2實施形態中之氣體分析裝置100之其他變形例的側視圖。 Fig. 9 is a side view showing another modified example of the gas analysis device 100 in the second embodiment.

〔用以實施發明的實施形態〕 [Embodiment for Implementing the Invention]

以下,透過發明的實施形態來說明本發明,不過,以下的實施形態並非是用來限定申請專利範圍中所述之發明。又,並無限定在實施形態中所說明之特徵的所有組合是發明之解決手段所必須者。 Hereinafter, the present invention will be described using embodiments of the invention. However, the following embodiments are not intended to limit the invention described in the scope of patent application. It should be noted that all combinations of the features described in the embodiments are not necessarily required for solving the invention.

在本專利說明書中,是使用X軸、Y軸、以及Z軸之直角座標系來說明技術性事項。直角座標系,只不過是用來特定構成要件的相對位置,而並非是用以限定特定之方向者。例如,Z軸並不表示是用來限定相對於地面之高度方向者。又,+Z軸方向與-Z軸方向為相互逆向的方向。在沒有記載正負,而記載Z軸方向之情形時,是 指與+Z軸及-Z軸平行的方向。 In this patent specification, technical matters are described using a rectangular coordinate system of the X axis, the Y axis, and the Z axis. The rectangular coordinate system is only used to specify the relative positions of the constituent elements, not to limit the specific direction. For example, the Z axis is not meant to be used to define the height direction relative to the ground. The + Z-axis direction and the -Z-axis direction are mutually opposite directions. When the positive and negative are not recorded, but the Z-axis direction is recorded, it is Refers to directions parallel to the + Z and -Z axes.

第1圖,是顯示本發明第1實施形態中之氣體分析裝置100之概要的立體圖。氣體分析裝置100,是用以分析在煙道60內流動的分析對象氣體1。在本例中,分析對象氣體1,是朝向Z軸方向流動。煙道60,可以是從鍋爐或是燃燒爐所排出之氣體的流路。鍋爐或是燃燒爐,可以是燃燒煤、重油、或是燃燒垃圾。不過在此,煙道60,並不限定為氣體流路。在本專利說明書中之煙道60,可以是包含有可供分析對象氣體1流動之內部空間的機器,也可以是容器、煙囪、排氣導管、脫硝裝置、化學廠設備,鐵鋼廠設備、以及加熱爐等之各種機器。 FIG. 1 is a perspective view showing the outline of a gas analysis device 100 according to the first embodiment of the present invention. The gas analyzer 100 analyzes the analysis target gas 1 flowing in the flue 60. In this example, the analysis target gas 1 flows in the Z-axis direction. The flue 60 may be a flow path of a gas discharged from a boiler or a combustion furnace. Boilers or burners can be coal, heavy oil, or garbage. However, here, the flue 60 is not limited to a gas flow path. The flue 60 in this patent specification may be a machine containing an internal space in which the analysis target gas 1 can flow, or a container, a chimney, an exhaust duct, a denitration device, a chemical plant equipment, a steel plant equipment And various equipment such as heating furnaces.

氣體分析裝置100,可以是將測量用的氣體抽出至煙道60外部不要的直接插入式的雷射式氣體分析計。氣體分析裝置100,係具備照射部10及受光部20。照射部10及受光部20,是被配置在煙道60的外部。照射部10及受光部20,是以隔著煙道60的方式相向地配置。在本例中,照射部10及受光部20,是沿著X軸方向而配置。照射部10,是對在煙道60內流動的分析對象氣體1照射雷射光2。受光部20,是接受通過分析對象氣體1後之雷射光2光線。 The gas analysis device 100 may be a direct-insertion type laser gas analyzer that extracts measurement gas to the outside of the flue 60 and is unnecessary. The gas analysis device 100 includes an irradiation unit 10 and a light receiving unit 20. The irradiating section 10 and the light receiving section 20 are arranged outside the flue 60. The irradiating section 10 and the light receiving section 20 are arranged to face each other with the flue 60 interposed therebetween. In this example, the irradiation section 10 and the light receiving section 20 are arranged along the X-axis direction. The irradiation unit 10 irradiates the laser light 2 to the analysis target gas 1 flowing in the flue 60. The light-receiving unit 20 receives laser light 2 which has passed through the analysis target gas 1.

本例的氣體分析裝置100,係具備:配置在照射部10與受光部20之間之一體的筒30。所謂一體的筒30,是指將照射部10與受光部20之間予以連結的管狀體。一體的筒30,只要在照射部10與受光部20之間不 被分斷開,是可以使複數個筒相接合而構成。筒30,是以使雷射光2通過內部之方式所配置。本例的筒30,其長邊方向是以平行於X軸方向之方式所配置。為了使雷射光2不會受到筒30的內壁所干涉,雷射光2以通過筒30的中心軸附近為佳。 The gas analysis device 100 of this example includes a cylinder 30 that is disposed between the irradiation unit 10 and the light receiving unit 20. The integrated tube 30 refers to a tubular body that connects the irradiation unit 10 and the light receiving unit 20. The integrated tube 30 is not required between the irradiation section 10 and the light receiving section 20. It is divided and disconnected, and it is comprised by joining several cylinders. The tube 30 is arranged so that the laser light 2 passes through the inside. The cylinder 30 of this example is arranged so that its longitudinal direction is parallel to the X-axis direction. In order to prevent the laser light 2 from being interfered by the inner wall of the tube 30, it is preferable that the laser light 2 passes near the central axis of the tube 30.

於筒30的管壁,形成有第1孔32及第2孔34。第1孔32,是面向分析對象氣體1的上游側。另一方面,第2孔34,是面向分析對象氣體1的下游側。第2孔34,是設在與第1孔32相向的位置。分析對象氣體1,是從第1孔32流入後從第2孔34流出。因此,被第1孔32與第2孔34所夾隔的空間區域,是顯露於分析對象氣體環境中。於被第1孔32與第2孔34所夾隔的空間區域中,雷射光2,通過分析對象氣體1。又,為了不使分析對象氣體1流入至照射部10側及受光部20側,亦可以從位於筒30之X軸方向的兩端朝向中央將清洗氣體6及清洗氣體8導入於筒30內。 A first hole 32 and a second hole 34 are formed in the tube wall of the cylinder 30. The first hole 32 faces the upstream side of the analysis target gas 1. On the other hand, the second hole 34 faces the downstream side of the analysis target gas 1. The second hole 34 is provided at a position facing the first hole 32. The analysis target gas 1 flows in from the first hole 32 and flows out from the second hole 34. Therefore, the space region sandwiched by the first hole 32 and the second hole 34 is exposed to the analysis target gas environment. In the space region sandwiched between the first hole 32 and the second hole 34, the laser light 2 passes through the analysis target gas 1. In order to prevent the analysis target gas 1 from flowing into the irradiation unit 10 side and the light receiving unit 20 side, the cleaning gas 6 and the cleaning gas 8 may be introduced into the cylinder 30 from both ends located in the X-axis direction of the cylinder 30 toward the center.

氣體分析裝置100,是依據由受光部20所接受的受光量來分析吸收光譜。氣體分析裝置100,是從吸收光譜,來分析分析對象氣體1中所含有之對象物質的濃度。對象物質,可以是HCl、NH3、O2、CO、CO2、HF、CH4、NOX及H2O等之氣體成分。於本專利說明書中,分析對象氣體1,並沒有特別地限定。分析對象氣體1,可以是乾餾氣體、產生的氣體、排放氣體、鐵鋼廠氣體、製程氣體、以及爐內氣體等之各種氣體。 The gas analyzer 100 analyzes the absorption spectrum based on the amount of light received by the light receiving unit 20. The gas analyzer 100 analyzes the concentration of a target substance contained in the analysis target gas 1 from an absorption spectrum. The target substance may be a gas component such as HCl, NH 3 , O 2 , CO, CO 2 , HF, CH 4 , NOX, and H 2 O. In this patent specification, the analysis target gas 1 is not particularly limited. The analysis target gas 1 may be various gases such as carbonized gas, generated gas, exhaust gas, iron and steel plant gas, process gas, and furnace gas.

氣體分析裝置100,是可以依據在特定的波長中之雷射光2的衰減量來分析對象物質的濃度。具體而言,依據藍伯特-比爾(Lambert-Beer)定律,雷射光2的衰減量,是取決於對象物質的濃度以及存在有該對象物質之區域的測量光路長。將藍伯特-比爾的數式顯示於〔數式1〕。在本例中,測量光路長Ls,是由位於第1孔32之X軸方向上的長度所限定。依氣體分析裝置100所進行的處理本身,由於是與以往的雷射式氣體分析裝置相同,故詳細說明省略之。 The gas analysis device 100 can analyze the concentration of the target substance based on the amount of attenuation of the laser light 2 at a specific wavelength. Specifically, according to Lambert-Beer's law, the amount of attenuation of the laser light 2 depends on the concentration of the target substance and the measurement optical path length of the area where the target substance is present. The expression of Lambert-Bill is shown in [Equation 1]. In this example, the measurement optical path length Ls is defined by the length located in the X-axis direction of the first hole 32. Since the processing performed by the gas analysis device 100 is the same as that of the conventional laser gas analysis device, detailed description is omitted.

〔數式1〕I(L)=I(O).exp〔-ks.Ns.Ls〕 [Equation 1] I (L) = I (O). exp [-ks. Ns. Ls]

在此,I(L)為受光量。 Here, I (L) is the amount of received light.

I(O)為照射光量(發光量)。 I (O) is the amount of light (light emission).

Ks是氣體常數。 Ks is the gas constant.

Ns是對象物質的濃度(vol/%)。 Ns is the concentration (vol /%) of the target substance.

Ls是測量光路長。 Ls is the measurement optical path length.

第2圖,是本發明第1實施形態中之氣體分析裝置100的剖視圖。第2圖,是顯示被安裝於煙道60之狀態的氣體分析裝置100。在本例中,煙道60,是形成為朝向Z軸方向延伸的圓筒管狀。煙道60的形狀,並不限定於圓筒形狀。安裝氣體分析裝置100的煙道60,係具有0.5m以上的煙道寬度。在其一例中,煙道寬度為2m以上20m以下。煙道寬度,可以是與分析對象氣體1的 流動方向垂直之方向上之煙道的側壁間的間隔。 FIG. 2 is a cross-sectional view of the gas analysis device 100 according to the first embodiment of the present invention. FIG. 2 shows the gas analysis device 100 in a state where it is installed in the flue 60. In this example, the flue 60 is formed into a cylindrical tube shape extending in the Z-axis direction. The shape of the flue 60 is not limited to a cylindrical shape. The flue 60 to which the gas analysis device 100 is installed has a flue width of 0.5 m or more. In one example, the flue width is 2 m or more and 20 m or less. The flue width can be the same as that of the analysis target gas 1. Space between the side walls of the flue in the direction perpendicular to the direction of flow.

於煙道60中,於相互相向的側壁62a及側壁62b的各部分形成有孔。側壁62a及側壁62b,是分別為照射部10側及受光部20側的側壁。筒30是被插入於:在側壁62a及側壁62b所形成的孔,筒30以被固定於煙道60為佳。筒30,從防蝕性的觀點而言,以不鏽鋼所形成為佳。不過,筒30的材料並沒有限定。筒30的內徑,是以大可大至通過筒30之中的雷射光2不會與筒30的內側面產生干涉的程度,小可小至在筒30內流動的清洗氣體6、8的流速不會變得過低的程度為佳。在其一例中,筒30的內徑為1cm以上5cm以下。 In the flue 60, a hole is formed in each portion of the side wall 62a and the side wall 62b facing each other. The side walls 62a and 62b are the side walls of the irradiated portion 10 side and the light receiving portion 20 side, respectively. The tube 30 is inserted into a hole formed in the side wall 62 a and the side wall 62 b. The tube 30 is preferably fixed to the flue 60. The barrel 30 is preferably formed of stainless steel from the viewpoint of corrosion resistance. However, the material of the cylinder 30 is not limited. The inner diameter of the cylinder 30 is as large as the laser light 2 passing through the cylinder 30 does not interfere with the inner side of the cylinder 30, and as small as the cleaning gas 6, 8 flowing in the cylinder 30 It is preferable that the flow velocity does not become too low. In one example, the inner diameter of the tube 30 is 1 cm or more and 5 cm or less.

筒30,是從煙道60的側壁62a及側壁62b突出於煙道60的外部。筒30,以於照射部10側的突出部分具備凸緣36a為佳。於凸緣36a與照射部10之間,以設置照射部側連結管30a為佳。於本例的照射部側連結管30a,設置有凸緣37a。在本例中,藉由連結凸緣36a與凸緣37a,使筒30與照射部側連結管30a連通。 The cylinder 30 protrudes from the side wall 62 a and the side wall 62 b of the flue 60 outside the flue 60. The barrel 30 is preferably provided with a flange 36a at a protruding portion on the side of the irradiation section 10. Between the flange 36a and the irradiation part 10, it is preferable to provide the irradiation part side connection pipe 30a. A flange 37a is provided on the irradiation-unit-side connection pipe 30a of this example. In this example, by connecting the flange 36a and the flange 37a, the tube 30 and the irradiation-unit-side connection tube 30a are communicated.

筒30,於受光部20側的部分,亦具有與照射部10側的部分相同的構成。具體而言,筒30,以於受光部20側的突出部分具備凸緣36b為佳。於凸緣36b與受光部20之間,以設置受光部側連結管30b為佳。在本例中,藉由連結凸緣36b與凸緣37b,使筒30與受光部側連結管30b連通。又,由於照射部側連結管30a、凸緣37a、凸緣36a、筒30、凸緣36b、凸緣37b、以及受光部 側連結管30b,是依排列順序,構成將照射部10與受光部20之間予以連結的管狀體,故可說是此等整體構成一體的筒。 The portion of the tube 30 on the light receiving portion 20 side also has the same configuration as that of the portion on the irradiation portion 10 side. Specifically, it is preferable that the tube 30 is provided with a flange 36 b on a protruding portion on the light receiving unit 20 side. Between the flange 36b and the light receiving unit 20, it is preferable to provide a light receiving unit side connecting pipe 30b. In this example, the tube 30 and the light-receiving-part-side connecting tube 30b are communicated by connecting the flange 36b and the flange 37b. In addition, the irradiating section-side connecting tube 30a, flange 37a, flange 36a, tube 30, flange 36b, flange 37b, and light receiving section Since the side connection tubes 30b constitute a tubular body that connects the irradiation section 10 and the light receiving section 20 in the order of arrangement, it can be said that these are integrally formed tubes.

如以上說明,藉由使用凸緣36(36a、36b)及凸緣37(37a、37b),對於筒30對煙道60的安裝、以及經由凸緣37之照射部10與受光部20的安裝可以分別進行施工。因此,可以將本例的氣體分析裝置100容易地安裝於煙道60。不過,氣體分析裝置100,並不並限於此種施工情形,其筒30亦可以直接地連接於照射部10及受光部20。 As described above, by using the flanges 36 (36a, 36b) and the flanges 37 (37a, 37b), the mounting of the cylinder 30 to the flue 60 and the mounting of the irradiation section 10 and the light receiving section 20 through the flange 37 are performed. Can be constructed separately. Therefore, the gas analysis device 100 of this example can be easily installed in the flue 60. However, the gas analysis device 100 is not limited to such a construction situation, and the tube 30 may be directly connected to the irradiation section 10 and the light receiving section 20.

照射部10,係包含:雷射元件12、準直透鏡(collimated lens)14、框體16、以及照射部側透光窗18。雷射元件12,可以是分散回饋型(DFB)雷射,亦可以是垂直共振腔面射型雷射(Vertical Cavity Surface Emitting LASER)。雷射元件12,可以是能夠變更輸出之雷射光2波長的波長可調雷射元件。準直透鏡14,是將從雷射元件12所出射的雷射光2作為平行光線。 The irradiation unit 10 includes a laser element 12, a collimated lens 14, a frame 16, and a light transmitting window 18 on the irradiation unit side. The laser element 12 may be a distributed feedback (DFB) laser or a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting LASER). The laser element 12 may be a wavelength-tunable laser element capable of changing the two wavelengths of laser light output. The collimator lens 14 uses the laser light 2 emitted from the laser element 12 as parallel light.

框體16,是用以將雷射元件12及準直透鏡14收納於內部。於框體16的一部分,設有照射部側透光窗18。通過準直透鏡14的雷射光2,通過照射部側透光窗18後朝框體16的外部前進。照射部側透光窗18,是以從相對於雷射光2之光軸的垂直面傾斜地設置為佳。照射部側連結管30a,是以包圍照射部側透光窗18的方式固定於框體16。照射部側連結管30a的端部,是以藉由 照射部側透光窗18及框體16所封止為佳。 The frame 16 is used to house the laser element 12 and the collimator lens 14 inside. A part of the frame body 16 is provided with an irradiation unit side light transmission window 18. The laser light 2 that has passed through the collimator lens 14 passes through the light-transmitting window 18 on the side of the irradiation unit and advances toward the outside of the housing 16. The irradiation unit side light transmission window 18 is preferably provided obliquely from a vertical plane with respect to the optical axis of the laser light 2. The irradiation unit-side connecting pipe 30 a is fixed to the frame body 16 so as to surround the irradiation unit-side light transmitting window 18. The end of the irradiation section-side connecting pipe 30a is formed by The light-transmitting window 18 and the frame 16 on the side of the irradiation unit are preferably sealed.

受光部20,係包含:集光透鏡22、受光元件24、信號處理部25、框體26、及受光部側透光窗28。集光透鏡22,是用以將通過分析對象氣體1後的雷射光2集光於受光元件24。受光元件24,是對應受光量來輸出電氣信號的元件。例如,受光元件24,具有光二極體或是光電晶體。受光元件24,是以輸出對應受光量的電流為佳。信號處理部25,是以接受來自受光元件24的電流,並將接受到的電流變換成電壓為佳。信號處理部25,是以將變換後的電壓予以檢波及濾波處理,產生去除雜訊後的信號。信號處理部25,是以使用去除雜訊後的信號,來算出對象物質的濃度為佳。 The light receiving unit 20 includes a light collecting lens 22, a light receiving element 24, a signal processing unit 25, a frame 26, and a light receiving unit side light transmission window 28. The light collecting lens 22 collects the laser light 2 that has passed through the analysis target gas 1 onto the light receiving element 24. The light receiving element 24 is an element that outputs an electric signal in accordance with the amount of light received. For example, the light receiving element 24 includes a photodiode or a photo-crystal. The light receiving element 24 preferably outputs a current corresponding to the amount of light received. The signal processing unit 25 preferably receives a current from the light receiving element 24 and converts the received current into a voltage. The signal processing unit 25 performs detection and filtering processing on the converted voltage to generate a signal after noise removal. The signal processing unit 25 preferably calculates the concentration of the target substance using the noise-removed signal.

框體26,是用以將集光透鏡22、受光元件24、以及信號處理部25收納於內部。於框體26的一部分,設有受光部側透光窗28。通過受光部側透光窗28的雷射光2入射於框體26內。受光部側透光窗28,是以從相對於雷射光2之光軸的垂直面傾斜地設置為佳。受光部側連結管30b,是以包圍受光部側透光窗28的方式固定於框體26。受光部側連結管30b的端部,是以藉由受光部側透光窗28及框體26所封止為佳。 The housing 26 is used to house the light collecting lens 22, the light receiving element 24, and the signal processing unit 25 inside. A light-receiving portion-side light transmission window 28 is provided on a part of the frame 26. The laser light 2 passing through the light-receiving-portion-side light-transmitting window 28 is incident into the housing 26. It is preferable that the light-receiving-portion-side light-transmitting window 28 is inclined from a vertical plane with respect to the optical axis of the laser light 2. The light-receiving-part-side connecting pipe 30b is fixed to the housing 26 so as to surround the light-receiving-part-side light transmitting window 28. The end portion of the light-receiving-part-side connecting tube 30b is preferably sealed by the light-receiving-part-side transmissive window 28 and the frame 26.

氣體分析裝置100,係具備:用以導入清洗氣體6、8的照射部側導入部42及受光部側導入部44。照射部側導入部42,是從筒30之照射部10側的端部,將清洗氣體6導入於筒30內。另一方面,受光部側導入部 44,是從筒30之受光部20側的端部,將清洗氣體8導入於筒30內。清洗氣體6、8可以是空氣或是氮氣。 The gas analysis device 100 includes an irradiation unit side introduction unit 42 and a light receiving unit side introduction unit 44 for introducing the cleaning gases 6 and 8. The irradiation section side introduction section 42 introduces the cleaning gas 6 into the cylinder 30 from the end on the irradiation section 10 side of the cylinder 30. On the other hand, the light-receiving part-side introduction part 44 is a cleaning gas 8 introduced into the cylinder 30 from the end portion on the light-receiving portion 20 side of the cylinder 30. The cleaning gas 6, 8 may be air or nitrogen.

於本專利說明書中,所謂筒30之照射部10側的端部,是指以第1孔32為基準之位在照射部10側之筒30的區域,特別是指:位在側壁62a與照射部10之間之筒30(或是照射部側連結管30a)的區域。於本專利說明書中,所謂筒30之受光部20側的端部,是指以第1孔32為基準之位在受光部20側位於之筒30的區域,特別是指:位在側壁62b與受光部20之間之筒30(或是受光部側連結管30b)的區域。 In this patent specification, the end portion on the side of the irradiated portion 10 of the tube 30 refers to the area of the tube 30 on the side of the irradiated portion 10 based on the first hole 32, and particularly refers to the side wall 62a and the irradiated portion. The area of the tube 30 (or the irradiation-part-side connection tube 30a) between the sections 10. In this patent specification, the end portion of the tube 30 on the light receiving portion 20 side refers to a region of the tube 30 located on the light receiving portion 20 side with reference to the first hole 32, and particularly refers to the positions of the side walls 62b and The area of the tube 30 (or the light-receiving-unit-side connecting tube 30b) between the light-receiving sections 20.

照射部側導入部42及受光部側導入部44,亦可以分別是清洗氣體流入口。在本例中,照射部側導入部42及受光部側導入部44,是設在煙道60的外部。本例的照射部側導入部42,是設在照射部側連結管30a;本例的受光部側導入部44,是設在受光部側連結管30b。從照射部側導入部42所導入的清洗氣體6,係一面充滿於筒30內,且同時朝向煙道60的中央流動。同樣地,從受光部側導入部44所導入的清洗氣體8,是朝向煙道60的中央流動。清洗氣體6及清洗氣體8,係從第2孔34而排出至筒30之外。 The irradiating part-side introduction part 42 and the light-receiving part-side introduction part 44 may each be a purge gas inlet. In this example, the irradiating section-side introduction section 42 and the light-receiving section-side introduction section 44 are provided outside the flue 60. The irradiating-unit-side introduction portion 42 of this example is provided on the irradiating-unit-side connection tube 30a; the light-receiving-unit-side introduction portion 44 of this example is provided on the light-receiving-unit-side connection tube 30b. The cleaning gas 6 introduced from the irradiation section side introduction section 42 is filled in the cylinder 30 on one side and flows toward the center of the flue 60 at the same time. Similarly, the cleaning gas 8 introduced from the light-receiving-part-side introduction part 44 flows toward the center of the flue 60. The cleaning gas 6 and the cleaning gas 8 are discharged from the second hole 34 to the outside of the cylinder 30.

第3圖,是筒30的側視圖。第2孔34,是以與第1孔32相向之方式配置在分析對象氣體1的下游側。第2孔34,從Z軸方向來觀察筒30的外形,是以包含第1孔32的外形之方式來配置為佳。第2孔34,其開 口面積是比第1孔32更大。藉由如此地形成第1孔32及第2孔34,可以降低已通過第1孔32的分析對象氣體1在通過第2孔34時的壓力損失。因此,分析對象氣體1是難以不通過第2孔34就在筒30內流入至照射部10側及受光部20側。 FIG. 3 is a side view of the cylinder 30. The second hole 34 is disposed on the downstream side of the analysis target gas 1 so as to face the first hole 32. The second hole 34 is preferably arranged so that the outer shape of the cylinder 30 is viewed from the Z-axis direction so as to include the outer shape of the first hole 32. 2nd hole 34, which opens The mouth area is larger than the first hole 32. By forming the first hole 32 and the second hole 34 in this manner, the pressure loss of the analysis target gas 1 that has passed through the first hole 32 when passing through the second hole 34 can be reduced. Therefore, it is difficult for the analysis target gas 1 to flow into the irradiating section 10 and the light receiving section 20 in the cylinder 30 without passing through the second hole 34.

第1孔32與第2孔34,以使其位於X軸方向的中心位置一致為佳,並使其位於Y軸方向的中心位置一致為佳。第1孔32之位於X軸方向(長軸方向)的長度L1,是以比第2孔34之位於X軸方向的長度L2還短為佳。第1孔32之長軸方向的長度L1可以是0.3m以上1m以下。作為其一例,長度L1為0.5m。於本例的氣體分析裝置100,其及於第1孔32之長軸方向的長度L1的區域,是暴露在分析對象氣體1中。並對應長度L1來決定測量光路長Ls。 It is preferable that the first hole 32 and the second hole 34 are aligned with each other in the center position in the X-axis direction, and the center positions in the Y-axis direction are preferably aligned. The length L1 of the first hole 32 in the X-axis direction (long-axis direction) is preferably shorter than the length L2 of the second hole 34 in the X-axis direction. The length L1 in the long axis direction of the first hole 32 may be 0.3 m or more and 1 m or less. As an example, the length L1 is 0.5 m. In the gas analysis device 100 of this example, the area of the length L1 in the long axis direction of the first hole 32 is exposed to the analysis target gas 1. The measurement optical path length Ls is determined corresponding to the length L1.

第1孔32,亦可以是筒30之表面的切缺。從Y軸方向觀察筒30之情形下,第1孔32的切缺厚度D2,作為其一例,是筒30之外徑D1的1/4。第2孔34的切缺厚度D3,也可以是筒30之外徑D1的1/4。不過,厚度D3亦可以比厚度D2更大。此情形時,第2孔34之Y軸方向的寬度就會比第1孔32更大,而可以減低通過第1孔32時的壓力損失。 The first hole 32 may be a cutout on the surface of the cylinder 30. When the tube 30 is viewed from the Y-axis direction, the cutout thickness D2 of the first hole 32 is, as an example, 1/4 of the outer diameter D1 of the tube 30. The cutout thickness D3 of the second hole 34 may be 1/4 of the outer diameter D1 of the cylinder 30. However, the thickness D3 may be larger than the thickness D2. In this case, the width of the second hole 34 in the Y-axis direction is larger than that of the first hole 32, and the pressure loss when passing through the first hole 32 can be reduced.

第4圖,是筒30的上視圖。第1孔32,是以形成為長方形狀為佳。不過,不同於本例,第1孔32是形成為橢圓形亦可。第1孔32,以具有延伸於筒30之長 邊方向(X軸方向)的長軸,並具有延伸於Y軸方向的短軸為佳。第2孔34,亦是以形成為具有延伸於X軸方向之長軸的長方形或是橢圓形為佳。藉由第1孔32及第2孔34的長軸朝向筒30的長邊方向延伸,即使筒30的直徑較細之情形時,亦可以確保有能夠維持分析感應精度的測量光路長Ls。 FIG. 4 is a top view of the cartridge 30. The first hole 32 is preferably formed in a rectangular shape. However, unlike this example, the first hole 32 may be formed in an oval shape. The first hole 32 has a length extending to the barrel 30 It is preferable that the long axis in the lateral direction (X-axis direction) and the short axis extending in the Y-axis direction. The second hole 34 is also preferably formed in a rectangular or elliptical shape having a long axis extending in the X-axis direction. By extending the long axes of the first hole 32 and the second hole 34 toward the long side of the tube 30, even when the diameter of the tube 30 is small, the measurement optical path length Ls that can maintain the accuracy of the analysis and induction can be ensured.

根據本例的氣體分析裝置100,可以減輕由存在於分析對象氣體1中的水氣及灰塵所造成之對分析結果的影響。在本例中,由水氣及灰塵所造成的影響,是被限定在由第1孔32及第2孔34所開口的區域。特別是,即使是在煙道60的寬度較大,若不採取增大照射部10與受光部20的距離就無法設置氣體分析裝置100的環境下,可以將測量光路長Ls設為比煙道60的寬度還短的長度,藉此,可以減輕水氣及灰塵的影響。由於水氣及灰塵的影響被減輕,所以氣體分析裝置100,可以安定地分析對象物質的濃度。 According to the gas analysis device 100 of this example, it is possible to reduce the influence on the analysis result caused by the moisture and dust existing in the analysis target gas 1. In this example, the influence caused by water vapor and dust is limited to the area opened by the first hole 32 and the second hole 34. In particular, even in the environment where the width of the flue 60 is large, the measurement optical path length Ls can be set to be larger than the flue in an environment where the gas analysis device 100 cannot be installed without increasing the distance between the irradiation section 10 and the light receiving section 20. The width of 60 is also a short length, which can reduce the influence of moisture and dust. Since the influence of moisture and dust is reduced, the gas analysis device 100 can stably analyze the concentration of the target substance.

根據本例的本例之氣體分析裝置100,在從照射部10到第1孔32所遍及的區域中,筒30內是被清洗氣體6所充滿。同樣地,在從受光部20到第1孔32所遍及的區域中,筒30內是被清洗氣體8所充滿。因此,分析對象氣體1,由於不會從第1孔32及第2孔34流入於照射部10側及受光部20側,故可以防止位於測量光路長Ls以外區域中之雷射光2的衰減。 According to the gas analysis device 100 of this example, in the area extending from the irradiation section 10 to the first hole 32, the inside of the cylinder 30 is filled with the cleaning gas 6. Similarly, in a region extending from the light receiving section 20 to the first hole 32, the inside of the cylinder 30 is filled with the cleaning gas 8. Therefore, since the analysis target gas 1 does not flow from the first hole 32 and the second hole 34 to the irradiation section 10 side and the light receiving section 20 side, it is possible to prevent the attenuation of the laser light 2 located in a region other than the measurement optical path length Ls.

由於第1孔32及第2孔34是以整齊排列於 煙道60內之分析對象氣體1的流動方向(Z軸方向)之方式所配置,所以分析對象氣體1有效地從第1孔32流入並從第2孔34流出。因此,於筒30內,在與測量光路長Ls相對應的區域中,分析對象氣體1產生從第1孔32朝向往第2孔34方向的流動。藉此,在與測量光路長Ls相對應的區域中,清洗氣體6、8,受到分析對象氣體1的流動而被流往Z軸方向,然後從第2孔34被排出。由此緣故,可以防止清洗氣體6、8深入地侵入於與測量光路長Ls相對應的區域。 Since the first hole 32 and the second hole 34 are arranged neatly Since the analysis target gas 1 in the flue 60 is arranged in the flow direction (Z-axis direction), the analysis target gas 1 effectively flows in from the first hole 32 and flows out from the second hole 34. Therefore, in the tube 30, in the region corresponding to the measurement optical path length Ls, the analysis target gas 1 flows from the first hole 32 toward the second hole 34. Thereby, in the area corresponding to the measurement optical path length Ls, the cleaning gases 6 and 8 are flowed in the Z-axis direction upon receiving the flow of the analysis target gas 1, and then discharged from the second hole 34. For this reason, it is possible to prevent the cleaning gas 6, 8 from penetrating deeply into the area corresponding to the measurement optical path length Ls.

根據本例的氣體分析裝置100,筒30,由於是以雷射光2通過內部之方式配置在照射部10與受光部20之間之一體的筒,所以是在煙道60之照射部10側的側壁62a與受光部20側的側壁62b之間被兩側支承地支撐。因此,相較於筒30被懸臂支撐之情形,可以減輕筒30的撓曲及彎曲,而可以防止雷射光2之光軸的偏離。 According to the gas analysis device 100 of this example, the cylinder 30 is a cylinder arranged between the irradiating unit 10 and the light receiving unit 20 so that the laser light 2 passes through the inside. The side wall 62a and the side wall 62b on the side of the light receiving unit 20 are supported on both sides so as to be supported. Therefore, compared with the case where the barrel 30 is supported by the cantilever, the bending and bending of the barrel 30 can be reduced, and the deviation of the optical axis of the laser light 2 can be prevented.

第5圖是本發明第2實施形態中之氣體分析裝置100的側視圖。第6圖是沿著本發明第2實施形態中之氣體分析裝置100之AA’線的剖視圖。本例的氣體分析裝置100,具有罩蓋部50。其他的構造,是與第1實施形態的氣體分析裝置100相同。罩蓋部50,是為了減輕灰塵及水氣之影響的遮蔽物。罩蓋部50,從防蝕性的觀點而言,以不鏽鋼形成為佳。不過,筒30的材料並沒有限定。 Fig. 5 is a side view of a gas analysis device 100 according to a second embodiment of the present invention. Fig. 6 is a cross-sectional view taken along line AA 'of the gas analysis device 100 according to the second embodiment of the present invention. The gas analysis device 100 of this example includes a cover portion 50. The other structures are the same as those of the gas analysis device 100 according to the first embodiment. The cover portion 50 is a cover for reducing the influence of dust and moisture. The cover portion 50 is preferably formed of stainless steel from the viewpoint of corrosion resistance. However, the material of the cylinder 30 is not limited.

罩蓋部50,是與筒30分開形成。所謂罩蓋部 50是與筒30分開形成,是指罩蓋部50與筒30於Z軸方向上分離地設置。在本例中,如第6圖所示,筒30的外側面與罩蓋部50的內側面於Z軸方向上分隔有一間隔距離H1。作為其一例者,間隔距離H1,可以是筒30的直徑以上。罩蓋部50,是以中介支撐部52地固定在筒30為佳。 The cover portion 50 is formed separately from the tube 30. So-called cover 50 is formed separately from the cylinder 30 and means that the cover portion 50 and the cylinder 30 are provided separately from each other in the Z-axis direction. In this example, as shown in FIG. 6, the outer side surface of the cylinder 30 and the inner side surface of the cover portion 50 are separated by a distance H1 in the Z-axis direction. As an example, the separation distance H1 may be equal to or greater than the diameter of the cylinder 30. The cover portion 50 is preferably fixed to the barrel 30 with the intermediate support portion 52 interposed therebetween.

罩蓋部50,由於是與筒30分開形成,所以分析對象氣體1藉由擴散可以充分地進入設有第1孔32的區域,也就是與測量光路長Ls相對應的區域。因此,在與測量光路長Ls相對應的區域中,可以防止對象物質的濃度與本來的濃度造成差異。另一方面,灰塵及水氣,相較於作為對象物質的分子,粒徑較大且重。由此緣故,灰塵及水氣,相較於作為對象物質的分子,由於擴散不易,所以難以充分地進入設有第1孔32的區域。因此,藉由設置罩蓋部50,可以減輕灰塵及水氣的影響,同時可以正確地分析對象物質的濃度。 Since the cover portion 50 is formed separately from the tube 30, the analysis target gas 1 can sufficiently enter the area provided with the first hole 32 by diffusion, that is, the area corresponding to the measurement optical path length Ls. Therefore, in a region corresponding to the measurement optical path length Ls, it is possible to prevent the concentration of the target substance from being different from the original concentration. On the other hand, dust and moisture are larger and heavier in particle size than the molecules of the target substance. For this reason, it is difficult for dust and water vapor to sufficiently enter the area where the first hole 32 is provided because the diffusion is not as easy as for the molecules of the target substance. Therefore, by providing the cover portion 50, the influence of dust and water vapor can be reduced, and the concentration of the target substance can be accurately analyzed.

罩蓋部50的下端54,是以延伸至比第1孔32更下側為止為佳。在本例中,是以分析對象氣體1的上游側為上,以分析對象氣體1的下游側為下。在本例中,罩蓋部50之下端54的位置P2,是比第1孔32之切缺的上表面的位置P1更低。如此地,藉由罩蓋部50的下端54,延伸至比第1孔32更下側為止,可以防止堆積於罩蓋部50的灰塵掉落於第1孔32內。 The lower end 54 of the cover portion 50 is preferably extended to a lower side than the first hole 32. In this example, the upstream side of the analysis target gas 1 is made upward, and the downstream side of the analysis target gas 1 is made downward. In this example, the position P2 of the lower end 54 of the cover portion 50 is lower than the position P1 of the upper surface of the cutout of the first hole 32. In this way, by lowering the lower end 54 of the cover portion 50 to a lower side than the first hole 32, it is possible to prevent dust accumulated on the cover portion 50 from falling into the first hole 32.

如第5圖所示,本例的罩蓋部50,是將第1 孔32在長軸方向(X軸方向)上的中央部予以覆蓋。罩蓋部50,沒有將第1孔32在長軸方向上的端部38a、38b予以覆蓋。由於罩蓋部50沒有覆蓋第1孔32的端部38a,所以在第1孔32的端部38a,分析對象氣體1的流動不會受到罩蓋部50所阻絕,而可確保分析對象氣體1的流動。因此,清洗氣體6,係受到第1孔32之端部38a附近的分析對象氣體1的流動而被流往Z軸方向,然後從第2孔34被排出。由此緣故,可以防止清洗氣體6深入地侵入於與測量光路長Ls相對應的區域。同樣地,也可以防止清洗氣體8,深入地侵入於與測量光路長Ls相對應的區域。 As shown in FIG. 5, the cover portion 50 of this example is the first The center of the hole 32 in the long axis direction (X-axis direction) is covered. The cover portion 50 does not cover the end portions 38 a and 38 b of the first hole 32 in the longitudinal direction. Since the cover portion 50 does not cover the end portion 38a of the first hole 32, the flow of the analysis target gas 1 at the end portion 38a of the first hole 32 is not blocked by the cover portion 50, and the analysis target gas 1 can be secured Flow. Therefore, the cleaning gas 6 is caused to flow in the Z-axis direction by the flow of the analysis target gas 1 near the end portion 38 a of the first hole 32, and is then discharged from the second hole 34. For this reason, the cleaning gas 6 can be prevented from penetrating deeply into the area corresponding to the measurement optical path length Ls. Similarly, the cleaning gas 8 can be prevented from penetrating deeply into the area corresponding to the measurement optical path length Ls.

第7圖,是顯示第2實施形態中之氣體分析裝置100之變形例的側視圖。在本例的氣體分析裝置100中,罩蓋部50是將第1孔32的整體予以覆蓋。於本專利說明書中,所謂罩蓋部50是將第1孔32的整體予以覆蓋,意思是指罩蓋部50之X軸方向上的長度是比第1孔32之X軸方向上的長度更長,並且,罩蓋部50之Y軸方向上的長度是比第1孔32之Y軸方向上的長度更長。於罩蓋部50,係形成有使分析對象氣體1通過的孔部56。除了罩蓋部50的差異之外,其他的構造,是與第5圖所示的氣體分析裝置100相同。 Fig. 7 is a side view showing a modification of the gas analysis device 100 in the second embodiment. In the gas analysis device 100 of this example, the cover portion 50 covers the entire first hole 32. In this patent specification, the cover portion 50 covers the entirety of the first hole 32, which means that the length in the X-axis direction of the cover portion 50 is greater than the length in the X-axis direction of the first hole 32. The length of the cover portion 50 in the Y-axis direction is longer than the length of the first hole 32 in the Y-axis direction. A hole portion 56 through which the analysis target gas 1 passes is formed in the cover portion 50. The structure is the same as that of the gas analysis device 100 shown in FIG. 5 except for the difference in the cover portion 50.

孔部56,是以形成於罩蓋部50在X軸方向上的中央部為佳。本例之孔部56的大小,是比第1孔32在Y軸方向上的寬度還小。孔部56的大小,是以不會因 灰塵及水氣而阻塞孔目之方式來決定。 The hole portion 56 is preferably formed in a central portion of the cover portion 50 in the X-axis direction. The size of the hole portion 56 in this example is smaller than the width of the first hole 32 in the Y-axis direction. The size of the hole 56 is It is determined by the way that dust and water block the holes.

根據本例的氣體分析裝置100,作為遮蔽物發揮功能的罩蓋部50是比第1孔32更大,罩蓋部50是將第1孔32的整體予以覆蓋。因此,可以更進一步地降低水氣及灰塵的影響。藉由孔部56,由於可以確保分析對象氣體1從第1孔32往第2孔34的流動,所以可以防止清洗氣體6、8深入地侵入於形成有第1孔32的區域。 According to the gas analysis device 100 of this example, the cover portion 50 functioning as a shield is larger than the first hole 32, and the cover portion 50 covers the entirety of the first hole 32. Therefore, the influence of moisture and dust can be further reduced. Since the flow of the analysis target gas 1 from the first hole 32 to the second hole 34 is ensured by the hole portion 56, it is possible to prevent the cleaning gas 6 and 8 from penetrating deeply into the area where the first hole 32 is formed.

於本例的氣體分析裝置100,亦可以如第5圖所示地,罩蓋部50以將第1孔32在長軸方向上的中央部予以覆蓋,而不會將第1孔32在長軸方向上的端部38予以覆蓋之方式形成,且同時又設有孔部56為佳。 In the gas analysis device 100 of this example, as shown in FIG. 5, the cover portion 50 may cover the center portion of the first hole 32 in the long axis direction, instead of covering the first hole 32 in the long direction. The end portion 38 in the axial direction is formed so as to cover it, and it is also preferable to provide a hole portion 56 at the same time.

第8圖,是顯示第2實施形態中之氣體分析裝置100之其他變形例的側視圖。本例的氣體分析裝置100,於罩蓋部50係形成有:孔部56a、孔部56b、以及孔部56c。其他的構造,是與第7圖所示的例子相同。複數個孔部56之中,孔部56b,是形成於罩蓋部50在X軸方向上的中央部。孔部56a及孔部56c,是以形成在:與第1孔32在長軸方向上的端部38a及端部38b相向的位置為佳。不過,形成於罩蓋部50的複數個孔部的數量及位置,並沒有限制。於罩蓋部50,亦可以是形成有孔部56a和孔部56c,而不形成有孔部56b。 Fig. 8 is a side view showing another modification of the gas analysis device 100 in the second embodiment. In the gas analysis device 100 of this example, a hole portion 56a, a hole portion 56b, and a hole portion 56c are formed in the cover portion 50. The other structure is the same as the example shown in FIG. Among the plurality of hole portions 56, the hole portion 56 b is formed at a central portion of the cover portion 50 in the X-axis direction. The hole portion 56a and the hole portion 56c are preferably formed at positions facing the end portion 38a and the end portion 38b of the first hole 32 in the major axis direction. However, the number and positions of the plurality of hole portions formed in the cover portion 50 are not limited. The cover part 50 may be formed with the hole part 56a and the hole part 56c, and the hole part 56b may not be formed.

於罩蓋部50,藉由孔部56形成複數個,相較於孔部56為一個之情形,易於防止清洗氣體6、8深入地侵入於形成有第1孔32的區域。特別是,藉由孔部56a 及孔部56c是形成在:與第1孔32在長軸方向上的端部38a、38b相向的位置,可易於防止清洗氣體6、8深入地侵入於與測量光路長Ls相對應的區域。 In the cover portion 50, a plurality of holes 56 are formed. Compared with the case where there is only one hole portion 56, it is easy to prevent the cleaning gas 6, 8 from penetrating deeply into the area where the first holes 32 are formed. In particular, through the hole portion 56a The hole portion 56c is formed at a position facing the end portions 38a and 38b of the first hole 32 in the major axis direction, and it is easy to prevent the cleaning gas 6 and 8 from penetrating deeply into the area corresponding to the measurement optical path length Ls.

於第1孔32的端部38a中,係藉由罩蓋部50並沒有阻絕分析對象氣體1的流動,而可以確保分析對象氣體1的流動。因此,清洗氣體6,係受到通過孔部56a後之分析對象氣體1的流動而被流往Z軸方向,然後從第2孔34被排出。由此緣故,清洗氣體6不會深入地侵入於與測量光路長Ls相對應的區域。同樣地,清洗氣體8,也不會深入地侵入於與測量光路長Ls相對應的區域。 In the end portion 38 a of the first hole 32, the flow of the analysis target gas 1 can be ensured because the cover portion 50 does not block the flow of the analysis target gas 1. Therefore, the cleaning gas 6 is caused to flow in the Z-axis direction by the flow of the analysis target gas 1 after passing through the hole portion 56 a, and is then discharged from the second hole 34. For this reason, the cleaning gas 6 does not penetrate deeply into the area corresponding to the measurement optical path length Ls. Similarly, the cleaning gas 8 does not penetrate deeply into the area corresponding to the measurement optical path length Ls.

第9圖,是顯示第2實施形態中之氣體分析裝置100之其他變形例的側視圖。在本例的氣體分析裝置100中,罩蓋部50是被分割成複數個罩蓋部50a、50b。複數個罩蓋部50a及罩蓋部50b,是以空出事先決定好的間隙沿著X軸方向排列為佳。其他的構造,是與第5圖所示的例子相同。鄰接的複數個罩蓋部50a、50b之間的間隙,是不會阻絕分析對象氣體1的流動地發揮於孔部56b相同的功能。因此,藉由本變形例亦可防止清洗氣體6及清洗氣體8深入地侵入於與測量光路長相對應的區域。在本例中,罩蓋部50雖是被分割成2個罩蓋部50a及50b,不過罩蓋部50,也可以被分割成3個以上的罩蓋部。 Fig. 9 is a side view showing another modified example of the gas analysis device 100 in the second embodiment. In the gas analysis device 100 of this example, the cover portion 50 is divided into a plurality of cover portions 50a and 50b. The plurality of cover portions 50a and the cover portions 50b are preferably arranged along the X-axis direction with a gap determined in advance. The other structure is the same as the example shown in FIG. 5. The gaps between the adjacent cover portions 50 a and 50 b have the same function as the hole portion 56 b without blocking the flow of the analysis target gas 1. Therefore, according to this modification, it is also possible to prevent the cleaning gas 6 and the cleaning gas 8 from penetrating deeply into the area corresponding to the measurement optical path length. In this example, although the cover portion 50 is divided into two cover portions 50a and 50b, the cover portion 50 may be divided into three or more cover portions.

以上,雖已使用實施形態來說明本發明,但本發明的技術性範圍並不侷限在記載於上述實施形態的範 圍。各實施形態及各變形例是可以相互地組合。於上述實施形態中,對於本業業者明顯能夠施加各種的變更或是改良。由申請專利範圍之記載可明確得知,施加有該各種的變更或是改良的形態亦被包含於本發明的技術性範圍。 As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range described in the said embodiment. Around. Each embodiment and each modification can be mutually combined. In the embodiment described above, it is obvious that various changes or improvements can be added to the industry. It is clear from the description of the scope of the patent application that the various modifications or improvements are also included in the technical scope of the present invention.

1‧‧‧分析對象氣體 1‧‧‧ analysis target gas

2‧‧‧雷射光 2‧‧‧ laser light

6‧‧‧清洗氣體 6‧‧‧ cleaning gas

8‧‧‧清洗氣體 8‧‧‧ cleaning gas

10‧‧‧照射部 10‧‧‧ Irradiation Department

20‧‧‧受光部 20‧‧‧Light receiving section

30‧‧‧筒 30‧‧‧ tube

32‧‧‧第1孔 32‧‧‧ 1st hole

34‧‧‧第2孔 34‧‧‧ 2nd hole

60‧‧‧煙道 60‧‧‧chimney

100‧‧‧氣體分析裝置 100‧‧‧Gas analysis device

Claims (11)

一種氣體分析裝置,其特徵為具備:照射部,係對在煙道內流動的分析對象氣體照射雷射光、及受光部,係以隔著上述煙道之方式與上述照射部相向地配置,並接受已通過上述分析對象氣體的上述雷射光線、以及一體的筒,係以使上述雷射光通過內部之方式配置在上述照射部與上述受光部之間,並於上述煙道內,形成有面向上述分析對象氣體之上游側的第1孔與面向上述分析對象氣體之下游側的第2孔。 A gas analysis device comprising: an irradiating unit for irradiating laser light and a light receiving unit for an analysis target gas flowing in a flue; and a light receiving unit arranged to face the irradiating unit through the flue and The integrated tube receiving the laser light passing through the analysis target gas and the integrated tube are arranged between the irradiating section and the light receiving section so that the laser light passes through the inside, and are formed in the flue with a facing The first hole on the upstream side of the analysis target gas and the second hole facing the downstream side of the analysis target gas. 如申請專利範圍第1項所述的氣體分析裝置,其中,具備:照射部側導入部,係將清洗氣體從上述筒之照射部側的端部導入於上述筒內、以及受光部側導入部,係將清洗氣體從上述筒之受光部側的端部導入於上述筒內。 The gas analysis device according to item 1 of the scope of patent application, further comprising: an irradiating section side introduction section for introducing a cleaning gas into the cylinder from an end portion of the irradiating section side of the cylinder, and a light receiving section side introduction section The cleaning gas is introduced into the cylinder from an end portion on the light receiving portion side of the cylinder. 如申請專利範圍第1項所述的氣體分析裝置,其中,上述第2孔,是以與上述第1孔相向之方式配置在上述分析對象氣體的下游側,並且其開口面積比上述第1孔更大。 The gas analysis device according to item 1 of the scope of patent application, wherein the second hole is disposed on the downstream side of the analysis target gas so as to face the first hole, and has an opening area larger than that of the first hole. Bigger. 如申請專利範圍第1項所述的氣體分析裝置,其中, 上述第1孔及上述第2孔,具有朝向上述筒之長邊方向延伸的長軸。 The gas analysis device according to item 1 of the scope of patent application, wherein: The first hole and the second hole have a long axis extending in a longitudinal direction of the tube. 如申請專利範圍第1項所述的氣體分析裝置,其中,更具備罩蓋部,其是與上述筒分開形成,並將上述第1孔局部性地覆蓋。 The gas analysis device according to item 1 of the scope of patent application, further comprising a cover portion which is formed separately from the tube and covers the first hole locally. 如申請專利範圍第5項所述的氣體分析裝置,其中,上述罩蓋部,是將上述第1孔在長軸方向上的中央部予以覆蓋,而沒有將上述第1孔在長軸方向上的端部予以覆蓋,且上述第1孔具有朝向上述筒的長邊方向延伸的長軸。 The gas analysis device according to item 5 of the scope of patent application, wherein the cover portion covers the central portion of the first hole in the long axis direction, and does not cover the first hole in the long axis direction. An end portion of the first hole is covered, and the first hole has a long axis extending in a longitudinal direction of the tube. 如申請專利範圍第5項所述的氣體分析裝置,其中,於上述罩蓋部,形成有使上述分析對象氣體通過的孔部。 The gas analysis device according to claim 5, wherein a hole portion is formed in the cover portion to pass the analysis target gas. 如申請專利範圍第7項所述的氣體分析裝置,其中,上述罩蓋部,是將上述第1孔之整體予以覆蓋,並形成有上述孔部。 The gas analysis device according to item 7 of the scope of patent application, wherein the cover portion covers the entire first hole and is formed with the hole portion. 如申請專利範圍第7項所述的氣體分析裝置,其中,於上述罩蓋部,形成有複數個上述孔部。 The gas analysis device according to claim 7 in the patent application scope, wherein the cover portion is formed with a plurality of the hole portions. 如申請專利範圍第5項所述的氣體分析裝置,其 中,上述罩蓋部,是被分割成複數個。 The gas analysis device according to item 5 of the patent application scope, which In the above, the cover portion is divided into a plurality of pieces. 如申請專利範圍第5項所述的氣體分析裝置,其中,上述罩蓋部的下端,是延伸至比上述第1孔更下側為止。 The gas analysis device according to claim 5 in which the lower end of the cover portion extends to a lower side than the first hole.
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