TW201801199A - Manufacturing method of three-dimensional electronic components - Google Patents

Abstract

A manufacturing method of three-dimensional electronic components comprises the following steps: providing a pre-formed circuit substrate with at least one curved surface and a pre-molded three-dimensional decoration, wherein the surface profile of the three-dimensional decoration is equal to that of the circuit substrate; and adhering the three-dimensional decoration to cover the at least one curved surface of the circuit substrate by an adhesive layer; wherein the circuit substrate includes a three-dimensional substrate, a patterned catalyst layer conformally formed on the three-dimensional substrate, and a circuit structure formed only on the patterned catalyst layer.

Description

Method of manufacturing electronic component having three-dimensional structure

The present invention relates to a method of fabricating an electronic component, and more particularly to a method of fabricating an electronic component having a three-dimensional structure.

With the rapid development of the global electronic technology industry, consumer demand for electronic products has moved from basic lightness and shortness to higher performance and diversification. One obvious example is the gradual transformation of electronic products from planar to three-dimensional surfaces. Type. One of the most critical factors in popularizing three-dimensional surface type electronic products is the three-dimensional circuit technology. For the molding of a wide variety of 3D stereo circuits, the main way is to embed a metallized circuit (metallized pattern) on the surface of a plastic injection molded (or molded) object, or to metallize the circuit (metallized pattern) Laminated on transparent glass, PET, acrylic, transparent soft substrate to integrate metallized circuit (metallized pattern) with plastic, glass substrate or transparent soft substrate.

Since the 3D stereo circuit can make electrical functional wires or patterns on the surface of the plastic casing to integrate mechanical and electronic functions on the plastic product, the product has both mechanical structure and circuit characteristics, so that more can be provided. Use space while increasing the freedom of electronic product design. Taking 3D stereoscopic circuits as digital communication electronic products as an example, in the past, mobile phone transceiver antenna parts based on printed circuit boards have not been used. Instead, metal is directly fabricated inside (or on the back) of the smart phone case. The 3D stereo circuit of the antenna.

However, the industry has not yet proposed a relatively complete 3D stereoscopic circuit fabrication technology, nor does it have a modularization technology that combines a 3D stereoscopic circuit substrate with an appearance component. The production capacity of electronic products for three-dimensional surface types is limited while prices are high. In view of this, the inventor has been engaged in the design and manufacturing experience of related fields for many years, and actively studied how to use limited resources and time to transform planar electronic products into three-dimensional surface patterns, and finally in all parties. The present invention has been developed with due consideration of the conditions.

The main object of the present invention is to provide a method for manufacturing an electronic component having a three-dimensional structure, which can improve the reliability of the process and ensure good bonding between the circuit substrate and the appearance component.

According to a preferred embodiment of the present invention, the method for manufacturing an electronic component having a three-dimensional structure includes the steps of: providing a curved circuit substrate prepared in advance and a three-dimensional appearance component, wherein the three-dimensional appearance component has Corresponding to a three-dimensional surface profile of the configuration of the curved circuit substrate; and attaching the three-dimensional appearance component to the curved circuit substrate by a glue layer; wherein the curved circuit substrate comprises a three-dimensional substrate And a catalyst pattern layer disposed on the three-dimensional substrate and a three-dimensional line structure correspondingly disposed on the catalyst pattern layer.

According to another preferred embodiment of the present invention, the method for manufacturing an electronic component having a three-dimensional structure includes the steps of: providing a pre-formed curved circuit substrate comprising a three-dimensional substrate and conformally disposed on a catalyst pattern layer on the three-dimensional substrate and a three-dimensional line structure correspondingly disposed on the catalyst pattern layer; placing a glue structure between a planar plastic substrate and the curved circuit substrate; And performing heat treatment to shape the planar plastic substrate into a three-dimensional plastic substrate, wherein the three-dimensional plastic substrate has a three-dimensional surface profile corresponding to a configuration of the curved circuit substrate, and the three-dimensional surface The plastic substrate is melted and adhered to the curved circuit substrate along with a part of the bonding structure.

The present invention has at least the following advantageous effects: a method for manufacturing an electronic component having a three-dimensional structure provided by a preferred embodiment of the present invention The special process design of the surface circuit substrate and the three-dimensional appearance component, and then the three-dimensional appearance component is attached to the curved circuit substrate by a glue layer, can not only simplify the complicated and time-consuming process steps, but also reduce the process The difficulty degree and the improvement of the process yield can also ensure a good combination between the circuit substrate and the appearance component. The manufacturing method of the electronic component having the three-dimensional structure provided by another preferred embodiment of the present invention passes the "pre-made surface" The circuit substrate is then placed on the curved circuit substrate together with the planar plastic substrate and the cemented structure, and then the heat treatment process is designed to form the planar plastic substrate into a three-dimensional plastic substrate, and the gluing structure is The special process design of a part that melts and adheres to a curved circuit substrate can also achieve the aforementioned effects.

In view of the above, the present invention can indeed solve the problems of the current lack of technology and operational difficulty in converting an electronic product of a planar type into an electronic product of a three-dimensional surface type.

The above is only an embodiment of the present invention, and is not intended to limit the scope of the invention. It is still within the scope of patent protection of the present invention to make any substitutions and modifications of the modifications made by those skilled in the art without departing from the spirit and scope of the invention.

S100~S104‧‧‧Steps

S200~S204‧‧‧Steps

100, 100'‧‧‧Electronic components with three-dimensional structure

1‧‧‧Surface circuit substrate

10‧‧‧Fitting surface

11‧‧‧Three-dimensional substrate

12‧‧‧catalyst pattern layer

13‧‧‧Three-dimensional line structure

14‧‧‧Protective layer

15‧‧‧First registration mark

2‧‧‧Three-dimensional structure

20‧‧‧ inside surface

21‧‧‧Ink layer

22‧‧‧Second registration mark

23‧‧‧Positioning holes

2'‧‧‧Flat plastic substrate

2"‧‧‧Three-dimensional plastic substrate

3‧‧‧ glue layer

3'‧‧‧Glued structure

31'‧‧‧Hot melt adhesive layer

32'‧‧‧Ink layer

33’‧‧‧ release layer

4‧‧‧Molding mould

40‧‧‧Molded surface

41‧‧‧Ventinel

5‧‧‧ Holding institutions

1 is a flow chart showing a method of manufacturing an electronic component having a three-dimensional structure according to a first embodiment of the present invention.

2 is a schematic view of a curved circuit substrate according to a first embodiment of the present invention.

3 is an exploded view of an electronic component having a three-dimensional structure according to a first embodiment of the present invention.

4 is a combination diagram of an electronic component having a three-dimensional structure according to a first embodiment of the present invention.

Fig. 5 is a schematic view showing the appearance of the three-dimensional structure and the ink layer thereof according to the first embodiment of the present invention.

Figure 6 is a perspective view of an electronic component having a three-dimensional structure according to a first embodiment of the present invention.

7 is a flow chart showing a method of manufacturing an electronic component having a three-dimensional structure according to a second embodiment of the present invention.

8 is a schematic view (1) of a manufacturing method of a method for manufacturing an electronic component having a three-dimensional structure according to a second embodiment of the present invention.

Figure 9 is a schematic view of a cemented structure of a second embodiment of the present invention.

FIG. 10 is a schematic view (2) of a manufacturing method of a method for manufacturing an electronic component having a three-dimensional structure according to a second embodiment of the present invention.

The invention discloses an innovative method for manufacturing an electronic component having a three-dimensional structure, such as a component of a display or a touch display device, a component of a mobile communication device, an automotive electronic component, a stereoscopic LED component, etc., the method can reduce process difficulty and cost And to ensure a good combination of line substrate and appearance components to meet the needs of the semiconductor, optoelectronics and electronics industries.

The following is a description of an embodiment of the present invention relating to a "method of manufacturing an electronic component having a three-dimensional structure" by a specific specific example, and those skilled in the art can understand the advantages and technical effects of the present invention from the contents disclosed in the specification. The present invention can be implemented or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are merely illustrative and are not described in terms of actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the technical scope of the present invention.

[First Embodiment]

Please refer to FIG. 1. FIG. 1 is a flow chart showing a method of manufacturing an electronic component having a three-dimensional structure according to a first embodiment of the present invention. Referring to FIG. 2 to FIG. 6 , firstly, step S100 is performed: providing a pre-formed curved circuit substrate 1 and a three-dimensional appearance component 2; in practice, the curved circuit substrate 1 may be uniaxial or double Axial, The curved circuit board 1 has a bonding surface 10 with respect to the stereoscopic appearance member 2, and the bonding surface 10 may be an Aspheric Surface, a Cambered Surface, or the like. Parabolic Surface, Hyperbolic Surface or Free-Form Surface, but the present invention is not limited thereto, and the stereoscopic appearance member 2 has a three-dimensional surface contour corresponding to the configuration of the curved circuit substrate 1. .

Specifically, the curved circuit substrate 1 includes a three-dimensional substrate 11 , a catalyst pattern layer 12 , a three-dimensional line structure 13 , and a protective layer 14 . The catalyst pattern layer 12 is conformally disposed on the three-dimensional substrate 11 . That is, the catalyst pattern layer 12 is formed along the surface contour of the three-dimensional substrate 11, and the three-dimensional line structure 13 is correspondingly disposed on the catalyst pattern layer 12, and the protective layer 14 covers the surface of the three-dimensional line structure 13 over the entire surface. In this embodiment, the three-dimensional substrate 11 may be made of a thermoplastic material such as polycarbonate (PC), polypropylene (PP), acrylonitrile-butadiene-styrene copolymer (ABS), polyparaphenylene. Ethylene dicarboxylate (PET), polyimine (PI), etc.; the catalyst pattern layer 12 is mainly formed by screen printing and according to a set circuit pattern, and the material of the catalyst pattern layer 12 Containing a catalyst and a hardener, the catalyst can trigger metal deposition in an electroless plating process, and even if metal ions are to be reduced to metal and deposited on the catalyst pattern layer 12 to form a three-dimensional line structure 13; the three-dimensional line structure 13 can be It is made of a metal having good conductivity, such as gold, silver, copper, nickel, aluminum, chromium, etc.; the material of the protective layer 14 can be selected to be the same as that of the three-dimensional substrate 11.

Further, the thickness of the catalyst pattern layer 12 is preferably between 0.1 and 30 μm, and the catalyst contained in the catalyst pattern layer 12 is preferably a palladium (Pd) catalyst, and specific examples thereof include: palladium sulfate, Palladium chloride, palladium dichloride, palladium dichloride, palladium diamine palladium, etc.; further, the content of the hardener contained in the catalyst pattern layer 12 is preferably from 1% to 10%, and specific examples thereof include : fatty amines, cyclic fatty amines, polyamines, aromatic amines, acid anhydrides, Lewis acids and imidazole hardeners. It is worth mentioning that, when the curved circuit substrate 1 is fabricated, a planar circuit substrate (not shown) including a metal wiring pattern can be first formed by electroless plating. Alternatively, the planar composite substrate (not shown) including only the catalyst pattern layer 12 may be three-dimensionally formed, and then the metal may be deposited by electroless plating. In this way, not only the process of the curved circuit substrate 1 can be simplified, but also the difficulty of the process technology can be reduced, and the deformation curvature of the curved circuit substrate 1 can be accurately controlled to ensure the quality of the curved circuit substrate 1.

The shape and size of the three-dimensional structure appearance member 2 can be designed according to the shape and size of the curved circuit substrate 1, and the three-dimensional structure appearance member 2 can be made by In Mold Decoration (IMD); compared with other production techniques, IMD not only simplifies production steps and reduces assembly parts, reducing production time and expense, but also increasing product complexity and durability. For different applications, the three-dimensional structural appearance member 2 may be a transparent or translucent outer casing, and the inner side surface 20 of the three-dimensional structural appearance member 2 may be provided with various patterns to increase the aesthetics of the product, for example, printing or The ink layer 21 is formed by spraying (as shown in FIG. 5), and a patterned metal layer (not shown) may be formed by evaporation or sputtering, or may be subjected to special surface atomization treatment or anode treatment.

As shown in FIG. 2 to FIG. 4, step S102 is performed: the three-dimensional appearance component 2 is attached to the curved circuit substrate 1 by a glue layer 3; in practice, the glue layer 3 can be formed on the curved circuit substrate 1 in advance. The bonding surface 10 or the inner side surface 20 of the curved circuit board 1 is bonded. In this embodiment, the material of the glue layer 3 may be UV resin, Optical Clear Resin (OCR), Pressure Sensitive Adhesives (PSA), Silicone, Epoxy, and cyano. Ethyl propionate (ECA), or Cyanoacrylate, etc., but the present invention is not limited thereto; the bonding layer 3 can be formed on the bonding surface 10 of the curved circuit board 1 by spraying, transfer or immersion. Or the entire surface or part of the inner side surface 20 of the three-dimensional structural appearance member 2, the present invention does not limit the molding aspect of the glue layer 3.

The at least one first alignment mark 15 can be formed on the bonding surface 10 of the curved circuit substrate 1 without affecting the bonding of the curved circuit substrate 1 and the three-dimensional appearance component 2, and is on the inner side of the three-dimensional appearance component 2 Surface 20 forms at least one second pair The bit mark 22, and the first alignment mark 15 and the second alignment mark 22 are opposed to each other. Thereby, when the curved circuit board 1 and the three-dimensional appearance component 2 are attached, the first and second alignment marks 15 and 22 can be selected as reference points to adjust the attachment position of the stereoscopic appearance member 2, that is, the curved circuit The substrate 1 and the three-dimensional structure appearance member 2 can be superposed and positioned through the first and second alignment marks 15, 22 to avoid the yield being too low due to misalignment. Incidentally, the first and second registration marks 15, 22 may be L-shaped, T-shaped or cross-shaped, and the present invention is not limited thereto.

After the step S102 is completed, the step S104 is further performed: performing a pressurization or decompression defoaming process to eliminate air bubbles between the curved circuit substrate 1 and the stereoscopic appearance member 2, so that an electronic component having a three-dimensional structure can be fabricated. 100. The relevant technical details of the pressurization or depressurization defoaming treatment are well known to those skilled in the art, and thus will not be further described herein.

It should be noted that after the step S104 is completed, the post-process processing can be further performed according to the actual requirements of the product. For example, at least one positioning hole 23 can be formed on the three-dimensional structure appearance member 2 for assembly and use by using the in-mold injection method.

[Second embodiment]

Please refer to FIG. 7. FIG. 7 is a flowchart of a method for manufacturing an electronic component having a three-dimensional structure according to a second embodiment of the present invention. Referring to FIG. 8 to FIG. 10, first, step S200 is performed to provide a curved circuit substrate 1 which is prepared in advance. The structural features of the curved circuit substrate 1 can be seen in the first embodiment, so in this embodiment, Do not repeat them.

As shown in FIG. 8 and FIG. 9, step S202 is performed to place a glued structure 3' between a planar plastic substrate 2' and the curved circuit substrate 1; in practice, the curved circuit substrate 1 can be fixed. On the molding die 4, wherein the molding die 4 has a three-dimensional (3D) molding surface 40, and the molding surface 40 conforms to the concave-convex design of the bonding surface 10 of the curved circuit substrate 1, and is glued by at least one holding mechanism 5. The structure 3' is positioned above the curved circuit substrate 1 together with the planar plastic substrate 2'. In this embodiment, flat The material of the planar plastic substrate 2' may be a composite plastic of PET, PC, ABS, MMA, or the like, but the invention is not limited thereto, and a predetermined shape may be formed on the planar plastic substrate 2' as needed. a pattern (not shown); the glue structure 3' mainly comprises a hot melt adhesive layer 31' and an ink layer 32' formed on the hot melt adhesive layer 31', wherein the hot melt adhesive layer 31' is used for The planar plastic substrate 2' is adhered and fixed to the curved circuit substrate 1 after being three-dimensionally formed, and the ink layer 32' may be formed by printing or spraying to increase the aesthetics of the product.

Incidentally, the ink layer 32' may be covered with a release layer 33' on its surface depending on the material. Specifically, if the ink layer 32' does not have the ability to prevent scratches, the release layer 33' is required to be protected. On the other hand, if the ink layer 32' has good scratch resistance, an additional release layer 33' is not required.

As shown in FIG. 8 and FIG. 10, then, step S204 is performed to perform heat treatment to form the planar plastic substrate 2' into a three-dimensional plastic substrate 2", and the three-dimensional plastic substrate 2" follows the glue structure 3 A part of the portion is melted and adhered to the curved circuit board 1; in practice, the planar plastic substrate 2' and the glue structure 3' can be simultaneously heated by a heating furnace (not shown), and the heating temperature can be introduced. The temperature is in the range of from 150 ° C to 460 ° C, but the invention is not limited thereto, and the desired heating temperature is adjusted by the glass transition temperature (Tg) of the material. In this embodiment, when the three-dimensional plastic substrate 2" is softened by heat, it can be pumped together with an air extracting device (not shown) to generate a negative pressure along the curved circuit board 1 away from the curved circuit substrate 1. The direction is applied to the planar plastic substrate 2' to help the planar plastic substrate 2' softened by heat to be bent along the three-dimensional surface profile of the curved circuit substrate 1, and then melted by hot melt due to heat. The glue layer 31' is attached to the bonding surface 10 of the curved circuit board 1.

In order to meet the thickness requirements of different products, a blowing device (not shown) can be used to generate a high-pressure gas to the planar plastic substrate 2' to simultaneously generate a positive pressure along the 2' away from the planar plastic substrate. The direction of the planar plastic substrate 2' is applied to the planar plastic substrate 2'. After the step S204 is completed, the electronic component 100' having a three-dimensional structure can be fabricated, and the post-process processing can be performed according to the actual requirements of the product (for example, Simple processing of small size positioning holes).

[Possible effects of the examples]

First, a method for manufacturing an electronic component having a three-dimensional structure according to a preferred embodiment of the present invention is characterized in that "the surface circuit substrate and the three-dimensional structure component are separately fabricated, and then the three-dimensional structure component is attached to the surface by a glue layer. The special process design on the curved circuit board not only simplifies the complicated and time-consuming process steps, but also reduces the process difficulty and improves the process yield. It also ensures good bonding between the circuit substrate and the appearance components. . The manufacturing method of the electronic component having the three-dimensional structure provided by another preferred embodiment of the present invention is performed by “pre-fabricating the curved circuit substrate, and then placing the planar plastic substrate together with the glue structure on the curved circuit substrate, and then performing heat treatment. The process design is such that the planar plastic substrate is molded into a three-dimensional plastic substrate and is melted and adhered to the curved circuit substrate with a part of the glue structure. The above-mentioned effects can also be achieved.

In view of the above, the present invention can indeed solve the problems of the current lack of technology and operational difficulty in converting an electronic product of a planar type into an electronic product of a three-dimensional surface type.

Furthermore, in the case where the curved circuit board is prepared in advance, the planar circuit board including the metal wiring pattern is first formed by electroless plating, and then planarized, or the planar pattern including only the catalyst pattern layer is first formed. After the composite substrate is three-dimensionally and then deposited by electroless plating, the deformation curvature of the curved circuit substrate can be accurately controlled, and the three-dimensional circuit structure (3D stereo circuit) can be ensured to have good uniformity, small porosity, and stretchability. Characteristics such as deflection.

The above is only an embodiment of the present invention, and is not intended to limit the scope of the invention. It is still within the scope of patent protection of the present invention to make any substitutions and modifications of the modifications made by those skilled in the art without departing from the spirit and scope of the invention.

S100~S104‧‧‧Steps

Claims (13)

A method for manufacturing an electronic component having a three-dimensional structure includes the steps of: providing a pre-formed curved circuit substrate and a three-dimensional appearance component, the stereoscopic appearance component having a configuration corresponding to the curved circuit substrate a three-dimensional surface profile; and the three-dimensional structure appearance member is attached to the curved circuit substrate by a glue layer; wherein the curved circuit substrate comprises a three-dimensional substrate, and is disposed conformally on the three-dimensional substrate The upper catalyst pattern layer and a three-dimensional line structure correspondingly disposed on the catalyst pattern layer. A method of manufacturing an electronic component having a three-dimensional structure according to claim 1, wherein the three-dimensional appearance component is made by an in-mold decorative molding (IMD) technique. The method for manufacturing an electronic component having a three-dimensional structure according to claim 1, wherein in the step of providing the curved circuit substrate and the three-dimensional appearance component prepared in advance, the method further comprises: using printing or spraying The inner side surface of the three-dimensional structure appearance member forms an ink layer. The method of manufacturing an electronic component having a three-dimensional structure according to claim 1, wherein the curved circuit substrate has a bonding surface, and the bonding surface is an Aspheric Surface or a Cambered Surface. , Parabolic Surface, Hyperbolic Surface, or Free-Form Surface. The method for manufacturing an electronic component having a three-dimensional structure according to claim 4, wherein in the step of attaching the three-dimensional structure appearance member to the curved circuit substrate by the glue layer, the method further comprises: utilizing Forming the glue layer on the bonding surface of the curved circuit substrate or the inner side surface of the three-dimensional structure appearance member by spraying, transferring or immersing; and transmitting at least one first alignment position through the curved circuit substrate Mark and the stereo knot After the at least one second alignment mark of the appearance member is overlapped and positioned, the curved circuit substrate and the three-dimensional structure appearance member are adhered and fixed together by the glue layer. The method for manufacturing an electronic component having a three-dimensional structure according to claim 1, wherein after the step of attaching the three-dimensional appearance component to the curved circuit substrate by the bonding layer, the method further comprises: performing Pressurization or vacuum defoaming treatment. A method for manufacturing an electronic component having a three-dimensional structure includes the steps of: providing a pre-formed curved circuit substrate comprising a three-dimensional substrate, a catalyst pattern layer conformally disposed on the three-dimensional substrate, and a three-dimensional line structure correspondingly disposed on the catalyst pattern layer; placing a glue structure between a planar plastic substrate and the curved circuit substrate; and performing heat treatment to make the planar plastic base The material is formed into a three-dimensional plastic substrate, wherein the three-dimensional plastic substrate has a three-dimensional surface profile corresponding to the configuration of the curved circuit substrate, and the three-dimensional plastic substrate occurs with a part of the glue structure Melt and adhere to the curved circuit substrate. The manufacturing method of the electronic component having a three-dimensional structure according to claim 7, wherein in the step of placing the bonding structure between the planar plastic substrate and the curved circuit substrate, the method further comprises: pre- A predetermined pattern is formed on the planar plastic substrate. The method of manufacturing an electronic component having a three-dimensional structure according to claim 7, wherein the bonding structure comprises a hot melt adhesive layer and an ink layer formed on the hot melt adhesive layer; The step of placing the glue structure between the planar plastic substrate and the curved circuit substrate further comprises: fixing the curved circuit substrate to a molding die, the molding die comprising a curved circuit A three-dimensional (3D) molding surface conforming to the configuration of the substrate, and the bonding structure is positioned together with the planar plastic substrate over the curved circuit substrate. A method of manufacturing an electronic component having a three-dimensional structure as described in claim 9, The curved circuit substrate has a bonding surface, and the bonding surface is an Aspheric Surface, a Cambered Surface, a Parabolic Surface, a Hyperbolic Surface, or a Free Surface (Free -Form Surface); in the step of performing the heat treatment, the three-dimensional plastic substrate is adhered to the curved circuit substrate by the hot melt adhesive layer melted by heating On the surface. A method of manufacturing an electronic component having a three-dimensional structure according to claim 10, wherein the temperature of the heat treatment is between 150 ° C and 460 ° C. The method of manufacturing an electronic component having a three-dimensional structure according to claim 10, wherein the planar plastic substrate is oriented away from the curved circuit substrate toward the curved circuit substrate while the heat treatment is being performed. A negative pressure is applied to help the planar plastic substrate to bend along the mating surface of the curved circuit substrate. The method of manufacturing an electronic component having a three-dimensional structure according to claim 10, wherein the planar plastic substrate is oriented away from the curved circuit substrate toward the curved circuit substrate while the heat treatment is being performed. Applying a negative pressure and applying a positive pressure to the planar plastic substrate adjacent to the planar plastic substrate away from the planar plastic substrate to assist the planar plastic substrate along the The bonding surface of the curved circuit substrate generates a bending deformation.