TWM523254U - Improved substrate structure of curved circuit board and electronic product - Google Patents

Description

Structural improvement of curved circuit board and electronic products

The present invention relates to a substrate structure having a circuit pattern on its surface, and in particular to a structural improvement of a curved circuit substrate that can meet the requirements of various types of electronic products.

With the rapid development of the global electronic technology industry, the demand for printed circuit boards has grown quite rapidly, and circuit boards have become the key plates for today's consumer electronics products and related information and communication peripheral products. In recent years, the demand for electronic products in the market has been moving towards high performance and diversification. Light, thin and short are only the most basic. How to transform electronic products from planar to three-dimensional surface type is the industry's urgent need. .

For the three-dimensional surface type electronic products, the production of curved circuit boards is one of the key factors for popularization. However, the industry has not proposed a three-dimensional technology that has the characteristics of low cost and simple process, so it is three-dimensional. Compared with the planar circuit structure, the circuit structure is still subject to many limitations in processing, and indirectly, the manufacturing difficulty and cost of the curved circuit substrate cannot be reduced; although the planar circuit can be stereoscopically transmitted through the shear angle or the double-sided adhesive, based on Cost and time considerations are less practical and there is still room for improvement.

In view of the lack of existing technology, the creator of this new creator has been engaged in the design and manufacturing experience of related fields for many years, and actively studies how to make the planar circuit three-dimensional in limited resources and time. The author finally developed this creation.

In view of the deficiencies of the prior art, the purpose of the present invention is to provide a structural improvement of a curved circuit substrate, which is relatively difficult to manufacture and cost, and can conform to various types of electronic products (eg, mobile phones, tablet computers, electronic papers, etc.) Demand.

According to a preferred embodiment of the present invention, the structural improvement of the curved circuit substrate comprises a three-dimensional flexible substrate, a catalyst pattern layer and a three-dimensional line structure. The catalyst pattern layer is disposed on the three-dimensional flexible substrate, and the three-dimensional circuit structure is correspondingly disposed on the catalyst pattern layer, wherein the catalyst pattern layer and the three-dimensional line structure each have a corresponding shape A three-dimensional surface profile of the configuration of the flexible substrate.

According to another preferred embodiment of the present invention, the structural improvement of the curved circuit substrate comprises a three-dimensional flexible substrate, two catalyst pattern layers and two three-dimensional line structures. The two catalyst pattern layers are respectively disposed on the opposite sides of the three-dimensional flexible substrate, and the two three-dimensional circuit structures are respectively formed on the two catalyst pattern layers, wherein the two The catalyst pattern layer and the two three-dimensional line structures each have a three-dimensional surface profile corresponding to the configuration of the three-dimensional flexible substrate.

In addition to this, the present invention also provides an electronic product which is improved in structure using the above curved circuit substrate.

The beneficial effects of the present creation are as follows: The present creation is to "provide a catalyst pattern layer on one side or both sides of a three-dimensional flexible substrate, and correspondingly set a three-dimensional line structure on the catalyst pattern layer to constitute one or two sides. The design of the curved circuit substrate with the three-dimensional line pattern not only reduces the difficulty of the process technology, but also precisely controls the deformation curvature of the curved circuit substrate to ensure the quality of the curved circuit substrate.

In order to further understand the features and technical contents of this creation, please refer to the following detailed description and drawings of this creation, but these descriptions and drawings are only used to illustrate this creation, not the right to this creation. The scope is subject to any restrictions.

1‧‧‧Structural improvement of curved circuit board

10‧‧‧Line substrate

10'‧‧‧Flat composite structure

11‧‧‧Flat type flexible substrate

11'‧‧‧Three-dimensional flexible substrate

12‧‧‧catalyst pattern layer

13‧‧‧Flat circuit structure

13’‧‧‧Three-dimensional line structure

14‧‧‧Protective layer

15‧‧‧Electrical structure

20‧‧‧Molding mould

21‧‧‧ cavity

211‧‧‧plastic surface

22‧‧‧Ventinel

23‧‧‧Auxiliary press fittings

1 is a flow chart of a method of manufacturing a curved circuit substrate according to a first embodiment of the present invention schematic diagram.

2A to 6B are schematic views showing a process of manufacturing a curved circuit substrate according to the first embodiment of the present invention.

Fig. 7 is a schematic view showing the structural improvement of a curved circuit board with a line pattern on one side according to the first embodiment of the present invention.

FIG. 8 is a flow chart showing a method of manufacturing a curved circuit substrate according to a second embodiment of the present invention.

9A to 12 are schematic views showing processes of a method of manufacturing a curved circuit substrate according to a second embodiment of the present invention.

Fig. 13 is a view showing the structural improvement of a curved circuit substrate having a wiring pattern on both sides in accordance with a second embodiment of the present invention.

Fig. 14A is a schematic view showing an electronic product according to the structure of the curved circuit substrate of the present invention.

Fig. 14B is a partial enlarged view of a portion A in Fig. 14A.

Various illustrative embodiments are described more fully hereinafter with reference to the accompanying drawings. However, the inventive concept may be embodied in many different forms and should not be construed as being limited to the illustrative embodiments set forth herein. Rather, these exemplary embodiments are provided so that this description will be thorough and complete, and the scope of the inventive concept will be fully conveyed to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Similar numbers always indicate similar components.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements or signals and the like, such elements or signals are not limited by the terms. These terms are used to distinguish one element from another, or a signal and another. In addition, as used herein, the term "or" may include all combinations of any one or more of the associated listed items.

[First Embodiment]

Please refer to FIG. 1 , and please refer to FIG. 2A to FIG. 6B . FIG. 1 is a schematic flow chart of a method for manufacturing a curved circuit substrate according to a first embodiment of the present invention, and FIGS. 2A to 6B are schematic diagrams of processes corresponding to the manufacturing method.

The manufacturing method of the embodiment is suitable for manufacturing a circuit substrate having a simple curved surface. As shown in FIG. 1 , the method mainly includes the following steps: Step S100: providing a flexible substrate and forming a catalyst pattern layer on the flexible substrate; Step S102: Depositing a metal on the catalyst pattern layer by an electroless plating process to form a wiring substrate, wherein the wiring substrate comprises a planar wiring structure; and step S104: placing the wiring substrate in a molding die and heating so that The planar circuit structure is formed into a three-dimensional line structure, wherein the molding die comprises a three-dimensional molding surface having a concave-convex structure, and the heated circuit substrate is bent and attached to the molding surface.

In step S100, as shown in FIG. 2A and FIG. 2B, the planar flexible substrate 11 may actually be a housing (such as a mobile phone housing) or a component of an electronic product to be assembled, but is not limited thereto. The flat flexible substrate 11 may be made of a thermoplastic material which is hard at normal temperature and softens when heated to a certain temperature; specific examples of the thermoplastic material include: polycarbonate (PC), polypropylene (PP), and propylene. Clear-butadiene-styrene copolymer (ABS), polyethylene terephthalate (PET), and polyimine (P1).

The catalyst pattern layer 12 is printed on the planar flexible substrate 11 in a predetermined line pattern; specifically, the method of forming the catalyst pattern layer 12 includes: placing a screen (not shown) on the planar flexible substrate 11 Above, wherein the screen has a hollow pattern relative to the line pattern, and then a resin-based catalyst material is extruded from above the screen by a doctor blade (not shown), passing through the screen and transferring to the plane The surface of the flexible substrate 11 is molded, and then the catalyst material is baked to harden it. Preferably, the catalyst pattern layer 12 has a thickness of about 0.1 μm to 30 μm.

Further, the catalyst pattern layer 12 includes a catalyst and a hardener, and the catalyst Used to trigger metal deposition in an electroless plating process. Normally, the type of catalyst may vary depending on the metal to be plated. For example, the catalyst may be selected from palladium, silver, carbon, or a combination thereof; 1% to 10% of the catalyst pattern layer 12, and specific examples thereof include: aliphatic amines, cyclic aliphatic amines, polyamines, aromatic amines, acid anhydrides, Lewis acids, and imidazole hardeners. . In this embodiment, the catalyst in the catalyst pattern layer 12 is preferably a palladium catalyst, and specific examples thereof include palladium sulfate, palladium chloride, dichlorodiammine palladium, dichlorotetraammine palladium, and diamine nitrous acid. Palladium and the like.

In step S102, as shown in FIG. 3A and FIG. 3B, the planar flexible substrate 11 on which the upper catalyst pattern layer 12 is printed may be immersed in an electroless plating bath containing one of the metal ions to be plated, and reacted for a certain period of time (eg: After about 5 minutes, the metal ions contained in the electroless plating bath are reductively deposited on the catalyst pattern layer 12 by the catalytic action of the palladium catalyst, thereby forming a planar wiring structure 13. After the step S102 is completed, a wiring substrate 10 is formed.

Furthermore, the material of the planar wiring structure 13 can be determined according to the requirements of the electronic product. For example, the material of the planar wiring structure 13 can be selected from metals having good conductivity such as gold, silver, copper, nickel, aluminum or chromium. In addition, the electroless plating process is a chemical copper process, and the reaction time is about 5 to 500 minutes, but the actual reaction time depends on the thickness of the planar line structure 13; the electroless plating bath used in the chemical copper process is An alkaline plating bath (such as a copper chloride plating bath), wherein the temperature of the plating bath is about 20 ° C to 100 ° C, and the pH of the plating bath is about 9 to 14.

In step S104, as shown in FIG. 4 and FIG. 5A, the molding die 20 has a cavity 21 and at least one vent hole 22 at the bottom of the cavity 21. The cavity 21 is provided with a three-dimensional (3D) plastic having a concave-convex structure. The profile 211 and the concave and convex design of the molding surface 211 conform to the configuration of the electronic product. Further, the circuit substrate 10 can be held on the molding die 20 by a plurality of auxiliary pressing members 23, and the wiring substrate 10 can be directly heated through a heating furnace (not shown); preferably, the heating furnace It can be used together with an air suction device (not shown) to draw air from the vent hole 22 by using an air suction device while heating the circuit substrate 10 to generate a negative pressure along the molding surface 211 away from the molding surface 211. Direction The wiring substrate 10 is applied to the wiring substrate 10 to bend and conform to the molding surface 211.

In this embodiment, the molding die 20 may be directly placed in the heating furnace or fixed at a suitable position in the heating furnace by the machine member. The material of the molding die 20 may be metal, ceramic or other suitable high temperature resistant material; The heating method of the furnace is not particularly limited as long as it can be heated to 150 ° C to 600 ° C depending on the glass transition temperature (Tg) of the substrate 10.

Referring to FIG. 5A and FIG. 5B together, it should be noted that the present embodiment can help the circuit substrate 10 to bend except that "the vacuum is applied from the bottom of the cavity 21 to apply a negative pressure to the circuit substrate 10". It is also possible to apply a positive pressure to the wiring substrate 10 at the same time according to the thickness requirement of the product; for example, a high-pressure gas can be generated by using a blowing device (not shown), and is applied from above the molding die 20 and away from the molding surface 211. The direction of the profile 211 is blown toward the wiring substrate 10.

As shown in Figs. 6A and 6, after completion of step S104, the planar wiring structure 13 can be formed into a three-dimensional wiring structure 13'; preferably, the thickness of the three-dimensional wiring structure 13' is from 0.1 μm to 30 μm. It should be noted that the curvature of the three-dimensional line structure 13' can be adjusted according to the configuration of the electronic product. For example, the configuration of the three-dimensional line structure 13' can be uniaxial, biaxial, triaxial or multiaxial. .

Referring to FIG. 7, the manufacturing method of this embodiment may further include step S106: forming a protective layer 14 to cover the three-dimensional line structure 13'. Specifically, a protective layer 14 can be directly coated on the outside of the curved circuit substrate by a plastic injection molding method. In this embodiment, the material of the protective layer 14 may be the same as that of the planar flexible substrate 11, and may also be selected from other suitable plastic materials, for example, polymethyl methacrylate (PMMA), polyether enamel (PES), fiber. Alkyl ester, polyvinyl chloride (PVC), benzocyclobutene (BCB), and acrylic resin.

Further, after the step S100 to the step S106 are completed, the structural improvement 1 of the curved circuit substrate having only one line pattern on one side is formed, which includes a three-dimensional flexible substrate 11', a catalyst pattern layer 12, and a three-dimensional line structure 13', the catalyst pattern layer 12 is conformally disposed on one side of the three-dimensional flexible substrate 11', and the three-dimensional line structure 13' Correspondingly disposed on the catalyst pattern layer 12, wherein the catalyst pattern layer 12 and the three-dimensional line structure 13' each have a three-dimensional surface contour corresponding to the configuration of the three-dimensional flexible substrate 11', that is, the three-dimensional flexible substrate 11' The surface of the catalyst pattern layer 12 and the three-dimensional line structure 13' have a stereoscopic effect.

[Second embodiment]

Please refer to FIG. 8 , and please refer to FIG. 9A to FIG. 12 . FIG. 8 is a schematic flowchart of a method for manufacturing a curved circuit substrate according to a second embodiment of the present invention, and FIG. 9A to FIG. 12 are corresponding to the curved circuit substrate of the embodiment. Schematic diagram of the manufacturing process.

First of all, it is explained that, compared with the manufacturing method of the first embodiment, the first method is to first form a planar wiring substrate by electroless plating, and then convert the planar wiring substrate (including the wiring pattern) into a body. Process design; the manufacturing method of the present embodiment adopts a process design of "forming a 3D composite substrate (excluding a wiring layer) and then forming a circuit pattern on the surface of the 3D composite substrate by electroless plating," For manufacturing circuit boards with complex curved surfaces.

As shown in FIG. 9A and FIG. 9B, the manufacturing method of the embodiment first performs step S200: providing a planar flexible substrate 11 and forming a catalyst pattern layer 12 on the planar flexible substrate 11 to obtain a planar composite. Structure 10'. In the step S200, the features and formation methods of the planar flexible substrate 11 and the catalyst pattern layer 12 can be referred to the first embodiment, and thus are not described herein.

As shown in FIG. 10, FIG. 11A and FIG. 11B, the manufacturing method then performs step S202: placing the planar composite structure in a molding die and heating to form the planar composite structure into a three-dimensional composite structure, wherein The molding die comprises a three-dimensional molding surface having a concave-convex structure, and the heated planar composite structure is bent and attached to the molding surface. Specifically, the planar composite structure 10' can be held on the molding die 20 by a plurality of auxiliary pressing members 23, and the wiring substrate 10 can be directly heated through a heating furnace (not shown).

Preferably, when the planar composite structure 10' is softened by heat, it can be used for pumping The air is vented from the vent hole 22 to generate a negative pressure applied to the planar composite structure 10' in a direction away from the molding surface 211 toward the molding surface 211, and may be combined with the air blowing device according to the thickness requirement of the product (Fig. The high pressure gas is blown toward the planar composite structure 10' to simultaneously generate a positive pressure applied to the planar composite structure 10' in a direction away from the molding surface 211 toward the molding surface 211.

As shown in FIGS. 12 and 13, the manufacturing method then performs step S204: depositing a metal on the catalyst pattern layer 12 of the three-dimensional composite structure (not shown) by an electroless plating process to form a three-dimensional line structure 13'. In the step S204, the operating conditions of the electroless plating process and the features of the three-dimensional circuit structure 13' can be referred to the first embodiment, and thus will not be described herein.

Referring to FIG. 8 and FIG. 13, the manufacturing method of this embodiment may further include step S206: forming a protective layer 14 to cover the three-dimensional line structure 13'. For the feature and the manner of forming the protective layer 14 in the step S206, reference may be made to the first embodiment, and thus no further details are provided herein.

In a further step, after the step S200 to the step S206 are completed, the structural improvement 1 of the curved circuit substrate with the line pattern on both sides is formed, which comprises a three-dimensional flexible substrate 11' and two catalyst pattern layers. 12 and two three-dimensional line structures 13', two catalyst pattern layers 12 are respectively conformably disposed on opposite sides of the three-dimensional flexible substrate 11', and two three-dimensional line structures 13' are respectively formed in two The two catalyst pattern layers 12 and the two three-dimensional line structures 13 ′ each have a three-dimensional surface contour corresponding to the configuration of the three-dimensional flexible substrate 11 ′, that is, the three-dimensional flexible substrate 11 ′. The two catalyst pattern layers 12 and the surfaces of the two three-dimensional line structures 13' each have a stereoscopic effect.

It should be noted that the manufacturing methods of the first and second embodiments described above can be used to fabricate a structural improvement 1 of a curved circuit substrate with a line pattern on one or both sides to increase the practicality; of course, it is necessary to be in a three-dimensional flexible substrate. At least one conductive structure 15 is embedded in 11', and the two transparent line structures 13' respectively located on opposite sides of the three-dimensional flexible substrate 11' are electrically connected through the arrangement of the conductive structures 15.

Referring to FIG. 14A and FIG. 14B , it is further noted that the structure of the curved circuit substrate manufactured by the manufacturing methods of the first and second embodiments described above is improved, and the curved surface form and the line pattern are designed according to the electronic product. The requirements are adjusted; and during the shaping process, the three-dimensional line structure 13' can have excellent bending resistance and can be tightly coupled with the three-dimensional flexible substrate 11' without occurrence of breakage or breakage defects.

[Possible effects of the examples]

First of all, the present invention creates a three-dimensional line structure on one or both sides of a three-dimensional flexible substrate, and a three-dimensional line structure on the catalyst pattern layer to form a single-sided or double-sided three-dimensional line pattern. The design of the curved circuit substrate not only reduces the difficulty of the process technology, but also precisely controls the deformation curvature of the curved circuit substrate to ensure the quality of the curved circuit substrate.

According to the above, the structural improvement of the circuit substrate of the present invention solves the problems of the lack of technology and the operation difficulty of the three-dimensional planar circuit structure, and meets the requirements of the semiconductor, optoelectronic, electronic and other industries.

Furthermore, the structural improvement of the circuit surface substrate of the present invention is relatively difficult and costly to manufacture, and the roll-to-roll (R2R) can be applied for continuous production, so it is suitable for industrial mass production.

The above description is only an embodiment of the present invention, and is not intended to limit the scope of patent protection of the present invention. Anyone who is familiar with the art of the artist, within the spirit and scope of the creation, the equivalent of the change and retouching is still within the scope of the patent protection of the creation.

1‧‧‧Structural improvement of curved circuit board

11'‧‧‧Three-dimensional flexible substrate

12‧‧‧catalyst pattern layer

13’‧‧‧Three-dimensional line structure

14‧‧‧Protective layer

Claims (12)

A structural improvement of a curved circuit substrate comprises: a three-dimensional flexible substrate; a catalyst pattern layer disposed conformally on the three-dimensional flexible substrate; and a three-dimensional circuit structure correspondingly disposed on the catalyst pattern layer Wherein the catalyst pattern layer and the three-dimensional line structure each have a three-dimensional surface profile corresponding to the configuration of the three-dimensional flexible substrate. The structure of the curved circuit substrate according to claim 1 is improved, wherein the three-dimensional flexible substrate is a plastic substrate. The structure of the curved circuit substrate according to claim 2, wherein the plastic substrate is a polycarbonate (PC) substrate, a polypropylene (PP) substrate, and an acrylonitrile-butadiene-styrene copolymer ( ABS) substrate, a polyethylene terephthalate (PET) substrate or a polyimine (PI) substrate. The structure of the curved circuit substrate according to claim 1 is improved, wherein the catalyst pattern layer has a thickness of from 0.1 μm to 30 μm, and the three-dimensional line structure has a thickness of from 0.1 μm to 30 μm. The structural improvement of the curved circuit substrate according to claim 1, further comprising a protective layer, and the protective layer conformally covers the three-dimensional line structure. A structural improvement of a curved circuit substrate comprises: a three-dimensional flexible substrate; two catalyst pattern layers respectively disposed conformally on opposite sides of the three-dimensional flexible substrate; and two three-dimensional circuit structures, respectively Correspondingly formed on the two catalyst pattern layers; wherein the two catalyst pattern layers and the two three-dimensional line structures each have a three-dimensional surface contour corresponding to the configuration of the three-dimensional flexible substrate. The structure of the curved circuit substrate according to claim 6 is improved, wherein the three-dimensional flexible substrate is a plastic substrate. The structural improvement of the curved circuit substrate according to claim 7, wherein the plastic substrate a polycarbonate (PC) substrate, a polypropylene (PP) substrate, an acrylonitrile-butadiene-styrene copolymer (ABS) substrate, a polyethylene terephthalate (PET) substrate or A polyimine (PI) substrate. The structure of the curved circuit substrate according to claim 6, wherein the thickness of the two catalyst pattern layers is between 0.1 μm and 30 μm, and the thickness of the two three-dimensional line structures is between 0.1 μm and 30 μm. The structural improvement of the curved circuit substrate according to claim 6, further comprising two protective layers, the two protective layers respectively conformally covering the two three-dimensional line structures. The structure of the curved circuit substrate according to claim 6 is improved, wherein at least one conductive structure is embedded in the three-dimensional flexible substrate, and at least one of the conductive structures is respectively connected to the two three-dimensional line structures. An electronic product improved using the structure of a curved circuit substrate as described in claim 1 or 6.