CN203912304U - Line structure - Google Patents
Line structure Download PDFInfo
- Publication number
- CN203912304U CN203912304U CN201420055568.9U CN201420055568U CN203912304U CN 203912304 U CN203912304 U CN 203912304U CN 201420055568 U CN201420055568 U CN 201420055568U CN 203912304 U CN203912304 U CN 203912304U
- Authority
- CN
- China
- Prior art keywords
- line
- layer
- base material
- armature
- composite layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a line structure. The line structure comprises a composite material layer and a line layer. The composite material layer is formed by a base material and a reinforcing material. The reinforcing material is disposed inside the base material in a wrapping manner. The line layer is arranged on a surface of the base material of the composite material layer.
Description
Technical field
The utility model is about a kind of line construction, and espespecially a kind of utilization folded subsides processing procedure making electronic circuit method and structure thereof.
Background technology
Early stage takes electronic type product in the time receiving signal, receives signal by telescopic antenna.Because science and technology is constantly promoted, the volume of the many portable electronic products that make is all towards compact design, and therefore traditional telescopic antenna cannot re-use in portable electric product at all.
Therefore, just by stamping technology, sheet metal punching press is formed to the antenna of the support form with bent three-dimensional contouring, antenna volume is dwindled in the portable electric product that can be installed on volume-diminished to be used, but, this kind has specific volume by the stamping forming support shape antenna of sheet metal itself, in the time that the antenna of support shape is installed on that portable electronic product is inner to be used, can cause the thickness of portable electronic product cannot attenuation.
So, utilize the screen printing technology of printed circuit board (PCB) needed antenna pattern to be printed on the Copper Foil of described substrate, carry out etch processes by chemical agent, or utilize, with exposure imaging technology, the Copper Foil on substrate is formed to needed antenna pattern, the making of this kind of antenna can combine with the circuit board of electronic product itself, thickness attenuation that can portable electronic product, the step of the manufacture method of this kind is too numerous and diverse time-consumingly takes a lot of work again.
In recent years, because science and technology is constantly progressive, the laser light that can utilize radium-shine board to export is carved moulding.As long as needed antenna pattern (or electronic circuit pattern) is input into after described laser-engraving machine platform, described laser-engraving machine platform can be complied with inputted antenna pattern (or electronic circuit pattern), by the needed antenna pattern of Copper Foil carve (or electronic circuit pattern) on substrate, although this kind of processing is processed fast, can cause cost of manufacture significantly to increase.
Utility model content
In view of this, main purpose of the present utility model, being to solve tradition utilizes laser engraving to make antenna pattern or the existing shortcoming of electronic circuit pattern, the folded processing procedure that pastes of the utility model utilization is made line construction (as the antenna pattern on circuit board or electronic circuit pattern), can save laser engraving (Laser Direct Structuring, LDS) catalyst using in processing procedure and save and use the demand of radium-shine board, and can significantly reduce required cost.
For reaching above-mentioned purpose, the utility model provides a kind of line construction, comprising: composite layer, formed by base material and armature, and described armature is to be coated on described base material inside; Line layer, is located on the surface of base material of described composite layer.
Preferably, described base material is plastic material, and this plastic material is polyethylene terephthalate, Merlon, polyvinyl chloride, polyethylene or polypropylene.
Preferably, described armature is glass fibre or Kafra fiber.
Preferably, described line layer is Flexible Printed Circuit, has line pattern layer on it.
For reaching above-mentioned purpose, the utility model provides another kind of line construction, comprising: multiple composite layers, and described in each, composite layer is made up of base material and armature, and described armature is to be coated on described base material inside; Multiple line layers;
Preferably, described multiple composite layers stack to intersect with multiple line layers, described multiple line layer are located between described multiple composite layer, to form the circuit board of multilayer electronic circuit.
Preferably, described base material is plastic material, and this plastic material is polyethylene terephthalate, Merlon, polyvinyl chloride, polyethylene or polypropylene.
Preferably, described armature is glass fibre or Kafra fiber.
Preferably, described line layer is Flexible Printed Circuit, has line pattern layer on it.
Brief description of the drawings
Fig. 1 is the folded schematic flow sheet that pastes processing procedure making line construction method of utilization of the present utility model.
Fig. 2 is line construction schematic appearance of the present utility model.
Fig. 3 is the side cross-sectional schematic of Fig. 2.
Fig. 4 is the another kind of folded schematic flow sheet that pastes processing procedure making line construction method that utilizes of the present utility model.
Fig. 5 is the line construction schematic appearance of Fig. 4.
Fig. 6 is the side cross-sectional schematic of Fig. 5.
Fig. 7 is the side cross-sectional schematic of another kind of line construction of the present utility model.
Description of reference numerals
Step 100～108 line construction 10
Composite layer 1 base material 11
Armature 12 line layers 2
Line pattern layer 21 step 200～210
Line construction 20 first composite layers 3
Base material 31 armatures 32
Line layer 4 line pattern layers 41
The second composite layer 5 base materials 51
Armature 52
Embodiment
Relevant the technical content and a detailed description of the present utility model, now coordinate brief description of the drawings as follows:
Please refer to shown in Fig. 1, Fig. 2, Fig. 3, paste processing procedure for utilization of the present utility model is folded and make the flow process of line construction method and the side cross-sectional schematic of line construction outward appearance and Fig. 2.As shown in the figure: the folded processing procedure that pastes of utilization of the present utility model is made line construction method, first,, as step 100, have line layer 2, described line layer 2 is made needed line pattern layer 21 with Flexible Printed Circuit (Flexible Printed Circuit, FPC).In this figure, described line pattern layer 21 is electronic circuit pattern or antenna pattern.
Step 102, have composite layer 1, described composite layer 1 is by base material 11 and clad in the armature 12 of described base material 11 inside and form (as shown in Figure 3), and described armature 12 is coated on described base material 11 inside can strengthen described base material 11 self characters.In this figure, described base material 11 is plastic material, as polyethylene terephthalate (polyethylene terephthalate, PET), Merlon (polycarbonate, PC), polyvinyl chloride (PVC), polyethylene (Polyethylene, PE), polypropylene (Polypropylene, PP) etc.; Described armature 12 is glass fibre (glass fiber) or Kafra fiber (Kevlar).
Step 104, first puts into composite layer 2 in mould (not shown), then line layer 1 is put in mould and is positioned on the surface of described composite layer 2.
Step 106 is put into described composite layer 2 and described line layer 1 after mould successively in above-mentioned steps, by mould add hot pressing processing, described composite layer 2 is combined with described line layer 1.
Step 108, after heating, carries out the demoulding, and takes out line construction 10, on the folded surface that is affixed on described composite layer 2 of described line layer 1 (as shown in Figure 2).
Please refer to shown in Fig. 2, Fig. 3 the side cross-sectional schematic of line construction outward appearance of the present utility model and Fig. 2.As shown in the figure: the line construction 10 completing in above-mentioned making flow process, comprising: composite layer 1 and line layer 2.
Described composite layer 1, is made up of base material 11 and armature 12, and described armature 12 is to be coated on described base material 11 inside, and described armature 12 is coated on described base material 11 inside can strengthen described base material 11 self characters.In this figure, described base material 11 is plastic material, as polyethylene terephthalate (polyethylene terephthalate, PET), Merlon (polycarbonate, PC), polyvinyl chloride (PVC), polyethylene (Polyethylene, PE), polypropylene (Polypropylene, PP) etc.; Described armature 12 is glass fibre (glass fiber) or Kafra fiber (Kevlar).
Described line layer 2, has specific line pattern layer 21, and described line pattern layer 21 is located on the surface of base material 11 of described composite layer 1.Described line pattern layer 21 is made with Flexible Printed Circuit (Flexible Printed Circuit, FPC), and described line pattern layer 21 is electronic circuit pattern or antenna pattern.
Therefore, known by above-mentioned processing procedure, in the time making antenna or circuit board without again by laser engraving (Laser Direct Structuring, LDS) mode is carved contoured beam antenna or electronic circuit on substrate, therefore can save the catalyst using in LDS processing procedure and save the demand that uses radium-shine board, and can significantly reduce required cost.
Please refer to shown in Fig. 4, Fig. 5, is the another kind of folded flow process of processing procedure making line construction method and the line construction schematic appearance of Fig. 4 of pasting of utilizing of the present utility model.As shown in the figure: the folded processing procedure that pastes of utilization of the present utility model is made line construction method, first,, as step 200, have line layer 4, described line layer 4 is made needed line pattern layer 41 with Flexible Printed Circuit (Flexible Printed Circuit, FPC).In this figure, described line pattern layer 41 is electronic circuit pattern or antenna pattern.
Step 202, have the first composite layer 3, described the first composite layer 3 is by base material 31 and clad in the armature 32 of described base material 31 inside and form (as shown in Figure 6), and described armature 32 is coated on described base material 31 inside can strengthen described base material 31 self characters.In this figure, described base material 31 is plastic material, as polyethylene terephthalate (polyethylene terephthalate, PET), Merlon (polycarbonate, PC), polyvinyl chloride (PVC), polyethylene (Polyethylene, PE), polypropylene (Polypropylene, PP) etc.; Described armature 32 is glass fibre (glass fiber) or Kafra fiber (Kevlar).
Step 204, have the second composite layer 5, described the second composite layer 5 is by base material 51 and clad in the armature 52 of described base material 51 inside and form (as shown in Figure 6), and described armature 52 is coated on described base material 51 inside can strengthen described base material 51 self characters.In this figure, described base material 51 is plastic material, as polyethylene terephthalate (polyethylene terephthalate, PET), Merlon (polycarbonate, PC), polyvinyl chloride (PVC), polyethylene (Polyethylene, PE), polypropylene (Polypropylene, PP) etc.; Described armature 52 is glass fibre (glass fiber) or Kafra fiber (Kevlar).
Step 206, the first composite material 3 is first put in mould (not shown), line layer 4 put in mould again and be positioned on the surface of described the first composite layer 3, then the second composite layer 5 is put in mould and is positioned on described line layer 4.
Step 208, in above-mentioned steps, successively described the first composite layer 3, line layer 4 and described the second composite layer 5 are put into after mould, by the heat treated of mould, described the first composite layer 3, line layer 4 and described the second composite layer 5 are combined (as shown in Figure 6).
Step 210, after heat treated, carries out the demoulding, and takes out line construction 20, and described line layer 1 is coated between described the first composite layer 3 and described the second composite layer 5.
Please refer to shown in Fig. 5, Fig. 6, is the line construction outward appearance of Fig. 4 and the side cross-sectional schematic of Fig. 5.As shown in the figure: the line construction 20 completing in above-mentioned making flow process, comprising: the first composite layer 3, line layer 4 and the second composite layer 5.
Described the first composite layer 3, is made up of base material 31 and armature 32, and described armature 32 is to be coated on described base material 31 inside, and described armature 32 is coated on described base material 31 inside can strengthen described base material 31 self characters.In this figure, described base material 31 is plastic material, as polyethylene terephthalate (polyethylene terephthalate, PET), Merlon (polycarbonate, PC), polyvinyl chloride (PVC), polyethylene (Polyethylene, PE), polypropylene (Polypropylene, PP) etc.; Described armature 32 is glass fibre (glass fiber) or Kafra fiber (Kevlar).
Described line layer 4, has specific line pattern layer 41, and described line pattern layer 41 is located on the surface of base material 31 of described composite layer 3.Described line pattern layer 41 is made with Flexible Printed Circuit (Flexible Printed Circuit, FPC), and described line pattern layer 41 is electronic circuit pattern or antenna pattern.
Described the second composite layer 5, is made up of base material 51 and armature 52, and described armature 52 is coated on described base material 51 inside can strengthen described base material 51 self characters, and described the second composite layer 5 is located on described line layer 4.In this figure, described base material 51 is plastic material, as polyethylene terephthalate (polyethylene terephthalate, PET), Merlon (polycarbonate, PC), polyvinyl chloride (PVC), polyethylene (Polyethylene, PE), polypropylene (Polypropylene, PP) etc.; Described armature 52 is glass fibre (glass fiber) or Kafra fiber (Kevlar).
Therefore, known by above-mentioned processing procedure, in the time making antenna or circuit board without again by laser engraving (Laser Direct Structuring, LDS) mode is carved contoured beam antenna or electronic circuit on substrate, therefore can save the catalyst using in LDS processing procedure and save the demand that uses radium-shine board, and can significantly reduce required cost.
Further, when the mould that is above-mentioned use has the housing face shaping of specific products, after mould pressurizing is processed, can described the second composite layer 5 form the shell body (as shown in Figure 5, Figure 6) of product, as described in described line layer (as antenna) 4 is located in the first composite layer 3 and as described between the second composite layer 5, to form a concealed antenna.
Further again, be multiple composite layers 1 and multiple line layer 2 to be stacked in mould to intersect, after mold heated pressing, multiple line layers 2 are located between described multiple composite layer 1, to form the circuit board (as shown in Figure 7) of multilayer electronic circuit.
Above are only preferred embodiment of the present utility model, be not used for limiting the scope that the utility model is implemented.Be that all equalizations of doing according to the utility model claim change and modify, be all the utility model the scope of the claims and contain.
Claims (8)
1. a line construction, is characterized in that, comprising:
Composite layer, is made up of base material and armature, and described armature is to be coated on described base material inside;
Line layer, is located on the surface of base material of described composite layer.
2. line construction as claimed in claim 1, wherein, described base material is plastic material, this plastic material is polyethylene terephthalate, Merlon, polyvinyl chloride, polyethylene or polypropylene.
3. line construction as claimed in claim 2, wherein, described armature is glass fibre or Kafra fiber.
4. line construction as claimed in claim 3, wherein, described line layer is Flexible Printed Circuit, has line pattern layer on it.
5. a line construction, is characterized in that, comprising:
Multiple composite layers, described in each, composite layer is made up of base material and armature, and described armature is to be coated on described base material inside;
Multiple line layers;
Wherein, described multiple composite layers stack to intersect with multiple line layers, described multiple line layer are located between described multiple composite layer, to form the circuit board of multilayer electronic circuit.
6. line construction as claimed in claim 5, wherein, described base material is plastic material, this plastic material is polyethylene terephthalate, Merlon, polyvinyl chloride, polyethylene or polypropylene.
7. line construction as claimed in claim 6, wherein, described armature is glass fibre or Kafra fiber.
8. line construction as claimed in claim 7, wherein, described line layer is Flexible Printed Circuit, has line pattern layer on it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420055568.9U CN203912304U (en) | 2014-01-28 | 2014-01-28 | Line structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420055568.9U CN203912304U (en) | 2014-01-28 | 2014-01-28 | Line structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203912304U true CN203912304U (en) | 2014-10-29 |
Family
ID=51786544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420055568.9U Expired - Fee Related CN203912304U (en) | 2014-01-28 | 2014-01-28 | Line structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203912304U (en) |
-
2014
- 2014-01-28 CN CN201420055568.9U patent/CN203912304U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141029 Termination date: 20180128 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |