TW201742272A - Airtight package manufacturing method and airtight package - Google Patents
Airtight package manufacturing method and airtight package Download PDFInfo
- Publication number
- TW201742272A TW201742272A TW106106711A TW106106711A TW201742272A TW 201742272 A TW201742272 A TW 201742272A TW 106106711 A TW106106711 A TW 106106711A TW 106106711 A TW106106711 A TW 106106711A TW 201742272 A TW201742272 A TW 201742272A
- Authority
- TW
- Taiwan
- Prior art keywords
- side wall
- glass cover
- wall portion
- glass
- container
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000011521 glass Substances 0.000 claims abstract description 107
- 239000003566 sealing material Substances 0.000 claims abstract description 46
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000006059 cover glass Substances 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 13
- 239000011261 inert gas Substances 0.000 claims description 11
- 238000005304 joining Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 230000006837 decompression Effects 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 13
- 238000002844 melting Methods 0.000 abstract description 8
- 230000008018 melting Effects 0.000 abstract description 3
- 239000000843 powder Substances 0.000 description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000002241 glass-ceramic Substances 0.000 description 4
- 239000011358 absorbing material Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052642 spodumene Inorganic materials 0.000 description 1
- OHOBJYLZBONBBA-UHFFFAOYSA-N strontium zinc Chemical compound [Zn+2].[Sr+2] OHOBJYLZBONBBA-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- 229910000500 β-quartz Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/20—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Joining Of Glass To Other Materials (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Laser Beam Processing (AREA)
- Led Device Packages (AREA)
Abstract
Description
本發明係關於一種用以搭載並密封元件之氣密封裝之製造方法及氣密封裝。The present invention relates to a method of manufacturing a hermetic package for mounting and sealing an element, and a hermetic package.
先前，為了搭載LED等元件並密封而使用氣密封裝。此種氣密封裝係藉由將可搭載元件之容器與用以將容器內密封之罩蓋構件接合而構成。正在研究藉由將元件密封於氣密封裝，而抑制水分等與元件接觸，從而提高可靠性。 於下述專利文獻1中，揭示有包含玻璃陶瓷之容器與玻璃蓋經由密封材料接合而成之氣密封裝。於專利文獻1中，作為上述密封材料使用包含低熔點玻璃之玻璃料。又，於專利文獻1中，藉由燒成上述密封材料並使之熔融而將玻璃陶瓷基板與玻璃蓋接合。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2014-236202號公報Previously, a hermetic package was used in order to mount an element such as an LED and seal it. Such a hermetic seal is constructed by joining a container with a loadable component to a cover member for sealing the interior of the container. It is being studied to improve the reliability by sealing the element to the hermetic package and suppressing contact with the element such as moisture. Patent Document 1 listed below discloses a hermetic package in which a container containing a glass ceramic and a cover glass are joined via a sealing material. In Patent Document 1, a glass frit containing a low-melting glass is used as the sealing material. Further, in Patent Document 1, the glass ceramic substrate is bonded to the glass cover by firing the sealing material and melting it. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2014-236202
[發明所欲解決之問題] 然而，於搭載耐熱性較低之元件之情形時，若如專利文獻1般燒成玻璃料並使之熔融，則有因燒成時之加熱導致元件特性熱劣化之虞。作為消除該情況之方法，考慮藉由對玻璃料照射雷射局部地進行加熱而將玻璃料熔融之方法。 然而，為了提高封裝之氣密性，較佳為於將玻璃蓋按壓至容器之狀態下將玻璃料熔融，從而使玻璃蓋與容器接合。於燒成玻璃料並使之熔融之情形時，可藉由於玻璃蓋上載置按壓構件，於利用按壓構件將玻璃蓋按壓至容器側之狀態下進行燒成，從而使玻璃蓋密接並接合於容器。然而，於藉由雷射照射使玻璃料熔融之情形時，必須將供雷射光透過之構件用作按壓構件。例如，必須將玻璃板用作按壓構件，於將玻璃板載置於玻璃蓋上之狀態下，自上方照射雷射光。 本發明者們發現，根據上述方法，會產生如下問題。 即，產生如下課題等：1)於玻璃蓋中，僅與玻璃料接觸之側之玻璃蓋表面被加熱，玻璃蓋內部之溫度差變大，因熱應力而導致玻璃蓋產生龜裂；2)存在因玻璃板導致玻璃蓋之表面受損傷之情形；3)難以將玻璃板作為按壓構件而對玻璃蓋均勻地施加荷重。 本發明之目的在於提供一種即便不利用按壓構件按壓玻璃蓋，而藉由雷射照射亦可使玻璃蓋密接並接合於容器之氣密封裝之製造方法及氣密封裝。 [解決問題之技術手段] 本發明之氣密封裝之製造方法之特徵在於：其係用以搭載並密封元件者，且包括：準備容器之步驟，該容器具有搭載上述元件之底部及配置於該底部上之框狀之側壁部，且具有由上述底部及上述側壁部包圍之凹部；準備密封上述凹部之玻璃蓋之步驟；於上述側壁部與上述玻璃蓋之間配置密封材料，並於上述容器之上述側壁部上載置上述玻璃蓋之步驟；藉由將上述玻璃蓋向上述凹部方向吸引而使上述玻璃蓋密接於上述側壁部上之上述密封材料之步驟；及於使上述玻璃蓋密接於上述密封材料之狀態下，照射雷射光而使上述密封材料熔融，從而將上述側壁部與上述玻璃蓋接合之步驟。 於本發明中，於在上述側壁部上載置上述玻璃蓋時，亦可為上述玻璃蓋具有向較上述側壁部更外側突出之外周部，藉由吸引上述外周部而使上述玻璃蓋密接於上述側壁部上之上述密封材料。於此情形時，較佳為進而具有如下步驟於將上述側壁部與上述玻璃蓋接合之後將上述玻璃蓋之上述外周部切斷。 於本發明中，較佳為進而具有如下步驟，即，於載置有上述玻璃蓋之上述容器填充惰性氣體。 於本發明中，較佳為於吸引上述玻璃蓋之步驟中對上述容器內進行減壓。 於本發明中，較佳為上述玻璃蓋之厚度為0.1 mm以上。 本發明之氣密封裝之特徵在於：其係用以搭載並密封元件者，且包括：容器，其具有搭載上述元件之底部及配置於該底部上之框狀之側壁部，且具有由上述底部及上述側壁部包圍之凹部；玻璃蓋，其配置於上述側壁部上，且將上述凹部密封；及密封材料層，其配置於上述側壁部與上述玻璃蓋之間；且上述容器內為置換為惰性氣體之狀態及/或經減壓之狀態。 於本發明之氣密封裝中，較佳為上述玻璃蓋之厚度為0.1 mm以上。 [發明之效果] 根據本發明之製造方法，即便不利用按壓構件按壓玻璃蓋而藉由雷射照射亦可使玻璃蓋密接並接合於容器。 根據本發明之氣密封裝，可製成氣密性較高之封裝，從而可提高封裝之可靠性。[Problems to be Solved by the Invention] However, when a component having a low heat resistance is mounted, if a glass frit is fired and melted as in Patent Document 1, the element characteristics are thermally deteriorated by heating at the time of firing. After that. As a method of eliminating this, a method of melting the glass frit by locally heating the glass frit laser is considered. However, in order to improve the airtightness of the package, it is preferred to melt the glass frit in a state where the glass cover is pressed to the container, thereby joining the glass cover to the container. When the glass frit is fired and melted, the pressing member is placed on the glass lid, and the glass lid is pressed to the container side by the pressing member, and the glass lid is adhered and joined to the container. . However, in the case where the frit is melted by laser irradiation, it is necessary to use a member for transmitting the laser light as a pressing member. For example, it is necessary to use a glass plate as a pressing member, and to irradiate the laser light from above in a state where the glass plate is placed on the glass cover. The inventors have found that according to the above method, the following problems occur. That is, the following problems occur: 1) In the glass cover, the surface of the glass cover on the side in contact with only the glass frit is heated, the temperature difference inside the glass cover is increased, and the glass cover is cracked due to thermal stress; 2) There is a case where the surface of the glass cover is damaged by the glass plate; 3) It is difficult to uniformly apply a load to the glass cover as the pressing member. An object of the present invention is to provide a method and a hermetic package for a hermetic package in which a glass cover can be adhered to and bonded to a container by laser irradiation without pressing the glass cover by a pressing member. [Technical means for solving the problem] The method for manufacturing a hermetic package according to the present invention is characterized in that it is used to mount and seal an element, and includes a step of preparing a container having a bottom portion on which the element is mounted and disposed on the a frame-shaped side wall portion on the bottom portion, and a recess portion surrounded by the bottom portion and the side wall portion; a step of preparing a glass cover for sealing the recess portion; and a sealing material disposed between the side wall portion and the glass cover, and the container a step of placing the glass cover on the side wall portion; a step of sucking the glass cover in the direction of the concave portion to adhere the glass cover to the sealing material on the side wall portion; and sealing the glass cover to the above In the state of the sealing material, the laser beam is irradiated to melt the sealing material to bond the side wall portion to the glass cover. In the present invention, when the glass cover is placed on the side wall portion, the glass cover may have a peripheral portion that protrudes outward from the side wall portion, and the glass cover may be adhered to the outer peripheral portion by suctioning the outer peripheral portion. The above sealing material on the side wall portion. In this case, it is preferable that the outer peripheral portion of the glass cover is cut after the side wall portion is joined to the glass cover. In the present invention, it is preferable that the container further has an inert gas filled in the container on which the glass cover is placed. In the present invention, it is preferred that the inside of the container is decompressed in the step of sucking the glass cover. In the invention, it is preferable that the thickness of the glass cover is 0.1 mm or more. The hermetic package of the present invention is characterized in that it is used for mounting and sealing components, and includes a container having a bottom portion on which the element is mounted and a frame-shaped side wall portion disposed on the bottom portion, and having the bottom portion And a recessed portion surrounded by the side wall portion; a glass cover disposed on the side wall portion and sealing the recessed portion; and a sealing material layer disposed between the side wall portion and the glass cover; and the inside of the container is replaced by The state of the inert gas and/or the state of the reduced pressure. In the hermetic package of the present invention, it is preferable that the glass cover has a thickness of 0.1 mm or more. [Effect of the Invention] According to the manufacturing method of the present invention, the glass cover can be adhered to and bonded to the container by laser irradiation without pressing the glass cover by the pressing member. According to the hermetic package of the present invention, a package having a high airtightness can be obtained, thereby improving the reliability of the package.
以下，對較佳之實施形態進行說明。但是，以下之實施形態僅為例示，本發明並不限定於以下之實施形態。又，於各圖式中，存在具有實質上相同之功能之構件以相同符號進行參照之情形。 (第1實施形態) 圖1係第1實施形態之氣密封裝之前視剖面圖。如圖1所示，氣密封裝1為用以搭載並密封元件2之氣密封裝。氣密封裝1具備密封元件2之容器3。容器3具備搭載元件2之底部3a及配置於底部3a上之框狀之側壁部3b。容器3具有由底部3a及側壁部3b包圍之凹部3c。容器3例如包含陶瓷、玻璃陶瓷等。作為陶瓷可列舉氧化鋁、氮化鋁、氧化鋯、富鋁紅柱石等。作為玻璃陶瓷可列舉LTCC(Low Temperature Co-fired Ceramics，低溫共燒陶瓷)等。作為LTCC之具體例，可列舉氧化鈦或氧化鈮等無機粉末與玻璃粉末之燒結體等。底部3a及側壁部3b亦可一體地形成。或者亦可由不同體之底部3a及側壁部3b形成。 於底部3a搭載有元件2。元件2並不受特別限定，例如為MEMS(Micro Electro Mechanical Systems，微機電系統)、LD(Laser Diode，雷射二極體)、CCD(Charge Coupled Device，電荷耦合器件)、深紫外線LED(Light Emitting Diode，發光二極體)、其他LED等電子零件。 氣密封裝1包含：玻璃蓋5，其配置於側壁部3b之上部且用以密封凹部3c；及密封材料層4，其配置於側壁部3b及玻璃蓋5之間。側壁部3b之上部與玻璃蓋5由密封材料層4接合。 密封材料層4包含含有低熔點玻璃粉末之密封材料。低熔點玻璃粉末能以更低溫使密封材料熔融，從而可更進一步抑制元件之熱劣化。作為低熔點玻璃粉末例如可使用Bi2 O3 系玻璃粉末、或SnO-P2 O5 系玻璃粉末、V2 O5 -TeO2 系玻璃粉末等。如下述般，於藉由雷射光之照射而使密封材料熔融時，為了提高雷射光之吸收，亦可於玻璃中包含選自CuO、Cr2 O3 、Fe2 O3 、MnO2 等之至少一種顏料。又，密封材料除了上述低熔點玻璃粉末以外亦可包含低膨脹耐火性填料或雷射光吸收材料等。作為低膨脹耐火性填料例如可列舉堇青石、矽鋅礦、氧化鋁、磷酸鋯系化合物、鋯英石、氧化鋯、氧化錫、石英玻璃、β-石英固溶體、β-鋰霞石、鋰輝石。又，作為雷射光吸收材料例如可列舉選自Fe、Mn、Cu等之至少1種金屬或包含該金屬之氧化物等化合物。本實施形態之容器3與玻璃蓋5如下述般藉由雷射光之照射而使密封材料熔融從而形成密封材料層4。 較理想為玻璃蓋5之厚度較佳為0.1 mm以上，更佳為0.2 mm以上。藉此，不易破損且可小型化。較理想為玻璃蓋5之厚度較佳為0.7 mm以下，更佳為0.5 mm以下。藉此，可小型化。 凹部3c內亦可置換為惰性氣體。作為惰性氣體例如可列舉N2 或Ar等。藉此，元件2不易劣化且可提高可靠性。 凹部3c內亦可被減壓。於此情形時，可有效地提高氣密性。由此，元件2不易劣化，且可提高可靠性。較理想為較佳為凹部3c內置換為惰性氣體，且被減壓。藉此，可進一步提高可靠性。 (製造方法) 圖2(a)及(b)係用以說明第1實施形態之氣密封裝之製造方法之前視剖面圖。準備圖2(a)所示之容器3。又，準備圖2(b)所示之玻璃蓋5A。 其次，於側壁部3b上配置密封材料4A。本實施形態之密封材料4A係含有雷射光吸收材料之玻璃料。密封材料4A之配置例如可將密封材料4A與適當之有機黏合劑混合而成之糊劑藉由印刷而進行。再者，密封材料4A亦可配置於玻璃蓋5A上之對應區域。其次，以400℃以上且600℃以下之溫度進行燒成。再者，於在側壁部3b上配置密封材料4A並進行燒成之情形時，元件2向容器3之底部3a之搭載係於燒成後實施。 另一方面，準備用以吸引玻璃蓋5A之治具6。圖2(a)所示之治具6具有載置容器3之治具底部6a、及配置於治具底部6a上之框狀之治具側壁部6b。治具6具有由治具底部6a及治具側壁部6b包圍之治具凹部6c、及設置於治具側壁部6b之通氣孔6d。通氣孔6d以可對治具凹部6c內進行排氣之方式設置。於治具側壁部6b之上部設置有封裝材6e。 再者，治具6為用以進行上述吸引之治具之一例，治具6之構成並不受特別限定。 其次，如圖2(a)所示，將容器3載置於治具底部6a。其次，如圖2(b)所示，於側壁部3b上介置密封材料4A並載置玻璃蓋5A。玻璃蓋5A具有外周部5Aa，該外周部5Aa於載置於側壁部3b上時，向較側壁部3b更外側突出。外周部5Aa載置於治具側壁部6b上且覆蓋治具凹部6c。由於治具6具有封裝材6e，故而可較佳地固定玻璃蓋5A。 其次，藉由自治具6之通氣孔6d吸引玻璃蓋5A之外周部5Aa而使玻璃蓋5A密接於側壁部3b上之密封材料4A。由於治具凹部6c內被減壓，故而可使玻璃蓋5A更確實地密接於密封材料4A。由此，可有效地提高氣密封裝1之氣密性，從而可有效地提高可靠性。 較佳為藉由上述吸引，容器3內亦減壓。藉此，可使氣密封裝1為容器3內經減壓之氣密封裝，從而可提高氣密性。除此以外，元件2不易與氧或水分反應，因此，可提高可靠性。 亦可於容器3內填充惰性氣體。例如，亦可預先將載置有玻璃蓋5A之凹部3c內置換為惰性氣體，其後吸引玻璃蓋5A。藉由預先於容器3內填充惰性氣體，可使氣密封裝1為容器3內置換為惰性氣體之氣密封裝，從而可進一步提高可靠性。 其次，如圖2(b)所示，將雷射光L自玻璃蓋5A側照射至密封材料4A。藉此，使密封材料4A熔融，而將側壁部3b與玻璃蓋5A接合。此時，形成圖1所示之密封材料層4。 其次，藉由將玻璃蓋5A之外周部5Aa切斷而獲得圖1所示之氣密封裝1。上述切斷後之玻璃蓋5之大小並不受特別限定，較佳為以於俯視下側壁部3b之外周緣與玻璃蓋5之外周緣一致之方式進行切斷。藉此，可將氣密封裝1較佳地小型化。 再者，如圖3所示之製造方法之變化例般，亦可使用於治具底部16a之載置容器3之部分具有彈簧構件16f之治具16。於此情形時，於吸引玻璃蓋5A之外周部5Aa之步驟中，藉由彈簧構件16f容器3被按壓至玻璃蓋5A側。因此，可使玻璃蓋5A更確實地密接於密封材料4A。 以下，藉由對本實施形態之氣密封裝之製造方法與比較例進行比較，而更詳細地說明本發明之效果。 圖4係用以說明氣密封裝之製造方法之比較例之前視剖面圖。如圖4所示，於比較例中，藉由於玻璃蓋25上載置包含玻璃板之按壓構件27，而將玻璃蓋25向容器23側按壓。藉此，謀求玻璃蓋25與密封材料24A之密接。然而，於此情形時，產生於按壓構件27所相接之玻璃蓋25之部分形成損傷等上述1)～3)之問題。 相對於此，於本實施形態之氣密封裝之製造方法中，藉由吸引玻璃蓋5A而使玻璃蓋5A密接於密封材料4A。因此，可不產生上述1)～3)之問題而高效率地生產氣密性較高之封裝。 於上述實施形態中，藉由吸引玻璃蓋之外周部而吸引玻璃蓋，但本發明並不限定於此。例如，亦可採用如下方法，即，預先於容器之側壁部形成通氣孔，藉由通過該通氣孔對載置有玻璃蓋之容器內進行排氣而吸引玻璃蓋，於接合後將側壁部之通氣孔密封。Hereinafter, preferred embodiments will be described. However, the following embodiments are merely illustrative, and the present invention is not limited to the following embodiments. Further, in each of the drawings, there are cases in which members having substantially the same functions are referred to by the same symbols. (First Embodiment) Fig. 1 is a front cross-sectional view showing a hermetic package according to a first embodiment. As shown in Fig. 1, the hermetic package 1 is a hermetic package for mounting and sealing the element 2. The hermetic package 1 is provided with a container 3 for sealing the element 2. The container 3 is provided with a bottom portion 3a on which the element 2 is mounted and a frame-shaped side wall portion 3b disposed on the bottom portion 3a. The container 3 has a recess 3c surrounded by a bottom portion 3a and a side wall portion 3b. The container 3 contains, for example, ceramics, glass ceramics, or the like. Examples of the ceramics include alumina, aluminum nitride, zirconia, and mullite. Examples of the glass ceramics include LTCC (Low Temperature Co-fired Ceramics). Specific examples of the LTCC include inorganic powders such as titanium oxide and cerium oxide, and sintered bodies of glass powder. The bottom portion 3a and the side wall portion 3b may also be integrally formed. Alternatively, it may be formed by the bottom 3a of the different body and the side wall portion 3b. The component 2 is mounted on the bottom 3a. The element 2 is not particularly limited, and is, for example, MEMS (Micro Electro Mechanical Systems), LD (Laser Diode), CCD (Charge Coupled Device), and deep ultraviolet LED (Light). Emitting Diode, LED, and other electronic components such as LEDs. The hermetic package 1 includes a glass cover 5 disposed on an upper portion of the side wall portion 3b to seal the concave portion 3c, and a sealing material layer 4 disposed between the side wall portion 3b and the glass cover 5. The upper portion of the side wall portion 3b and the glass cover 5 are joined by the sealing material layer 4. The sealing material layer 4 contains a sealing material containing a low-melting glass powder. The low-melting glass powder can melt the sealing material at a lower temperature, thereby further suppressing thermal deterioration of the element. As the low-melting glass powder, for example, Bi 2 O 3 -based glass powder, SnO-P 2 O 5 -based glass powder, V 2 O 5 -TeO 2 -based glass powder, or the like can be used. As described below, when the sealing material is melted by irradiation of laser light, at least at least CuO, Cr 2 O 3 , Fe 2 O 3 , MnO 2 or the like may be contained in the glass in order to increase absorption of the laser light. a pigment. Further, the sealing material may contain a low expansion fire-resistant filler or a laser light absorbing material in addition to the low-melting glass powder. Examples of the low-expansion refractory filler include cordierite, strontium zinc ore, alumina, zirconium phosphate-based compound, zircon, zirconia, tin oxide, quartz glass, β-quartz solid solution, and β-eucryptite. Spodumene. Further, examples of the laser light absorbing material include at least one metal selected from the group consisting of Fe, Mn, and Cu, and a compound containing an oxide of the metal. The container 3 and the cover glass 5 of the present embodiment are melted by laser light to melt the sealing material to form the sealing material layer 4. Preferably, the thickness of the cover glass 5 is preferably 0.1 mm or more, more preferably 0.2 mm or more. Thereby, it is not easily broken and can be miniaturized. Preferably, the thickness of the cover glass 5 is preferably 0.7 mm or less, more preferably 0.5 mm or less. Thereby, it can be miniaturized. The recess 3c may be replaced with an inert gas. Examples of the inert gas include N 2 or Ar. Thereby, the element 2 is less likely to deteriorate and reliability can be improved. The inside of the recess 3c can also be decompressed. In this case, the airtightness can be effectively improved. Thereby, the element 2 is less likely to deteriorate, and reliability can be improved. Preferably, it is preferable that the inside of the recessed portion 3c is replaced with an inert gas and is depressurized. Thereby, the reliability can be further improved. (Manufacturing Method) Fig. 2 (a) and (b) are front cross-sectional views for explaining a method of manufacturing the hermetic package of the first embodiment. Prepare the container 3 shown in Fig. 2(a). Moreover, the glass cover 5A shown in FIG. 2(b) is prepared. Next, the sealing material 4A is placed on the side wall portion 3b. The sealing material 4A of the present embodiment is a glass frit containing a laser light absorbing material. The arrangement of the sealing material 4A can be carried out, for example, by printing a paste obtained by mixing the sealing material 4A with a suitable organic binder. Further, the sealing material 4A may be disposed in a corresponding region on the cover glass 5A. Next, firing is performed at a temperature of 400 ° C or more and 600 ° C or less. In the case where the sealing material 4A is placed on the side wall portion 3b and fired, the mounting of the element 2 to the bottom portion 3a of the container 3 is performed after firing. On the other hand, the jig 6 for sucking the glass cover 5A is prepared. The jig 6 shown in Fig. 2(a) has a jig bottom portion 6a on which the container 3 is placed, and a frame-shaped jig side wall portion 6b disposed on the jig bottom portion 6a. The jig 6 has a jig recess 6c surrounded by the jig bottom portion 6a and the jig side wall portion 6b, and a vent hole 6d provided in the jig side wall portion 6b. The vent hole 6d is provided to exhaust the inside of the jig recess 6c. An encapsulating material 6e is provided on an upper portion of the jig side wall portion 6b. Further, the jig 6 is an example of a jig for performing the above-described suction, and the configuration of the jig 6 is not particularly limited. Next, as shown in Fig. 2(a), the container 3 is placed on the bottom 6a of the jig. Next, as shown in FIG. 2(b), the sealing material 4A is placed on the side wall portion 3b, and the glass cover 5A is placed thereon. The glass cover 5A has an outer peripheral portion 5Aa that protrudes outward from the side wall portion 3b when placed on the side wall portion 3b. The outer peripheral portion 5Aa is placed on the jig side wall portion 6b and covers the jig recess 6c. Since the jig 6 has the encapsulating material 6e, the glass cover 5A can be preferably fixed. Next, the outer peripheral portion 5Aa of the cover glass 5A is sucked by the vent hole 6d of the agitator 6, and the cover glass 4A is adhered to the seal member 4A on the side wall portion 3b. Since the inside of the jig recessed portion 6c is decompressed, the glass cover 5A can be more reliably adhered to the sealing material 4A. Thereby, the airtightness of the hermetic package 1 can be effectively improved, and the reliability can be effectively improved. Preferably, the inside of the container 3 is also decompressed by the above suction. Thereby, the hermetic package 1 can be hermetically sealed in the container 3 by decompression, and the airtightness can be improved. In addition to this, the element 2 is less likely to react with oxygen or moisture, and therefore reliability can be improved. The container 3 can also be filled with an inert gas. For example, the inside of the recessed portion 3c on which the glass cover 5A is placed may be replaced with an inert gas, and then the glass cover 5A may be sucked. By filling the inside of the container 3 with an inert gas in advance, the hermetic package 1 can be a hermetic package in which the inside of the container 3 is replaced with an inert gas, and the reliability can be further improved. Next, as shown in FIG. 2(b), the laser light L is irradiated from the glass cover 5A side to the sealing material 4A. Thereby, the sealing material 4A is melted, and the side wall portion 3b is joined to the glass cover 5A. At this time, the sealing material layer 4 shown in Fig. 1 is formed. Next, the hermetic package 1 shown in Fig. 1 is obtained by cutting the outer peripheral portion 5Aa of the cover glass 5A. The size of the glass cover 5 after the cutting is not particularly limited, and it is preferable to cut so that the outer peripheral edge of the side wall portion 3b coincides with the outer periphery of the glass cover 5 in plan view. Thereby, the hermetic package 1 can be preferably miniaturized. Further, as in the modification of the manufacturing method shown in FIG. 3, the jig 16 having the spring member 16f in the portion where the container 3 is placed on the bottom portion 16a of the jig may be used. In this case, in the step of sucking the outer peripheral portion 5Aa of the cover glass 5A, the container 3 is pressed to the side of the cover glass 5A by the spring member 16f. Therefore, the cover glass 5A can be more reliably adhered to the sealing material 4A. Hereinafter, the effects of the present invention will be described in more detail by comparing the manufacturing method of the hermetic package of the present embodiment with a comparative example. Fig. 4 is a front cross-sectional view for explaining a comparative example of a method of manufacturing a hermetic package. As shown in FIG. 4, in the comparative example, the glass cover 25 was pressed to the container 23 side by the glass member 25 by which the press member 27 containing the glass plate was mounted. Thereby, the glass cover 25 and the sealing material 24A are adhered. However, in this case, the portions of the glass cover 25 that the pressing member 27 is in contact with each other form the problems of the above 1) to 3). On the other hand, in the method of manufacturing a hermetic package of the present embodiment, the cover glass 5A is adhered to the sealing material 4A by suction of the cover glass 5A. Therefore, the package having high airtightness can be efficiently produced without causing the problems of the above 1) to 3). In the above embodiment, the glass cover is sucked by sucking the outer peripheral portion of the cover glass, but the present invention is not limited thereto. For example, a method may be adopted in which a vent hole is formed in advance in a side wall portion of the container, and a glass lid is sucked by venting the inside of the container in which the glass lid is placed through the vent hole, and the side wall portion is joined after joining. The vent is sealed.
1‧‧‧氣密封裝 2‧‧‧元件 3‧‧‧容器 3a‧‧‧底部 3b‧‧‧側壁部 3c‧‧‧凹部 4‧‧‧密封材料層 4A‧‧‧密封材料 5‧‧‧玻璃蓋 5A‧‧‧玻璃蓋 5Aa‧‧‧外周部 6‧‧‧治具 6a‧‧‧治具底部 6b‧‧‧治具側壁部 6c‧‧‧治具凹部 6d‧‧‧通氣孔 6e‧‧‧封裝材 16‧‧‧治具 16a‧‧‧治具底部 16f‧‧‧彈簧構件 23‧‧‧容器 24A‧‧‧密封材料 25‧‧‧玻璃蓋 27‧‧‧按壓構件 L‧‧‧雷射光1‧‧‧ Air-sealed equipment 2‧‧‧ Components 3‧‧‧ Container 3a‧‧‧Bottom 3b‧‧‧Side wall 3c‧‧‧ recess 4‧‧‧ Sealing material layer 4A‧‧‧ Sealing material 5‧‧‧ Glass cover 5A‧‧ ‧ Glass cover 5Aa‧‧‧Outer part 6‧‧‧ Fixture 6a‧‧ ‧ Fixture bottom 6b‧‧ ‧ Fixture side wall 6c‧‧ ‧ Fixture recess 6d‧‧ vent hole 6e‧ ‧‧Packing material 16‧‧‧ fixture 16a‧‧ ‧ fixture bottom 16f‧‧ ‧ spring member 23 ‧ ‧ container 24A ‧ ‧ sealing material 25 ‧ ‧ glass cover 27 ‧ ‧ pressing member L‧ ‧ laser
圖1係本發明之第1實施形態之氣密封裝之前視剖面圖。 圖2(a)及(b)係用以說明本發明之第1實施形態之氣密封裝之製造方法之前視剖面圖。 圖3係用以說明本發明之第1實施形態之氣密封裝之製造方法之變化例之前視剖面圖。 圖4係用以說明氣密封裝之製造方法之比較例之前視剖面圖。Fig. 1 is a front cross-sectional view showing a hermetic package according to a first embodiment of the present invention. 2 (a) and (b) are front cross-sectional views for explaining a method of manufacturing a hermetic package according to a first embodiment of the present invention. Fig. 3 is a front cross-sectional view showing a modification of the method of manufacturing the hermetic package according to the first embodiment of the present invention. Fig. 4 is a front cross-sectional view for explaining a comparative example of a method of manufacturing a hermetic package.
2‧‧‧元件 2‧‧‧ components
3‧‧‧容器 3‧‧‧ Container
3a‧‧‧底部 3a‧‧‧ bottom
3b‧‧‧側壁部 3b‧‧‧ Sidewall
3c‧‧‧凹部 3c‧‧‧ recess
4A‧‧‧密封材料 4A‧‧‧ Sealing material
5A‧‧‧玻璃蓋 5A‧‧‧glass cover
5Aa‧‧‧外周部 5Aa‧‧‧The outer part
6‧‧‧治具 6‧‧‧ fixture
6a‧‧‧治具底部 6a‧‧‧The bottom of the fixture
6b‧‧‧治具側壁部 6b‧‧‧Jig side wall
6c‧‧‧治具凹部 6c‧‧‧ fixture recess
6d‧‧‧通氣孔 6d‧‧‧vents
6e‧‧‧封裝材 6e‧‧‧Package
L‧‧‧雷射光 L‧‧‧Laser light
Claims (8)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016098351A JP2017208391A (en) | 2016-05-17 | 2016-05-17 | Method for manufacturing airtight package and airtight package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201742272A true TW201742272A (en) | 2017-12-01 |
Family
ID=60326355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106106711A TW201742272A (en) | 2016-05-17 | 2017-03-01 | Airtight package manufacturing method and airtight package |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2017208391A (en) |
| TW (1) | TW201742272A (en) |
| WO (1) | WO2017199491A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7108179B2 (en) * | 2018-05-31 | 2022-07-28 | 日亜化学工業株式会社 | Manufacturing method of cap, light emitting device and manufacturing method thereof |
| JP2021183655A (en) * | 2020-05-21 | 2021-12-02 | 信越化学工業株式会社 | Abrasive agent for polishing synthetic quartz glass substrate and manufacturing method abrasive agent, and polishing method of synthetic quartz glass substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4397339B2 (en) * | 2005-03-30 | 2010-01-13 | オリジン電気株式会社 | Electronic component package manufacturing method and manufacturing apparatus |
-
2016
- 2016-05-17 JP JP2016098351A patent/JP2017208391A/en active Pending
-
2017
- 2017-02-14 WO PCT/JP2017/005255 patent/WO2017199491A1/en active Application Filing
- 2017-03-01 TW TW106106711A patent/TW201742272A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017199491A1 (en) | 2017-11-23 |
| JP2017208391A (en) | 2017-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI687381B (en) | Manufacturing method of airtight package and airtight package | |
| TWI708407B (en) | Manufacturing method of hermetic package | |
| TW201742272A (en) | Airtight package manufacturing method and airtight package | |
| TWI660927B (en) | Hermetically sealed package and manufacturing method thereof | |
| TW201806089A (en) | Airtight package and method for producing airtight package | |
| JP7351136B2 (en) | Joined body manufacturing method and joined body manufacturing apparatus | |
| TW201806088A (en) | Airtight package manufacturing method and airtight package | |
| WO2018055846A1 (en) | Light emitting element mounting substrate, method for manufacturing same, and light emitting element mounting package | |
| US11652331B2 (en) | Method for producing a housing cover for a laser component and housing cover for a laser component and laser component | |
| WO2021060217A1 (en) | Optical semiconductor device production method, and optical semiconductor device | |
| JP2019091849A (en) | Manufacturing method of package and wavelength conversion member | |
| WO2018185997A1 (en) | Semiconductor package and semiconductor device |