TW201742183A - Separable substrate lift pin having a fixing pin to penetrate through the protrusion part of the upper and lower lift pins to replace the portion easily damaged partially for reducing the replacement cost - Google Patents
Separable substrate lift pin having a fixing pin to penetrate through the protrusion part of the upper and lower lift pins to replace the portion easily damaged partially for reducing the replacement cost Download PDFInfo
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Abstract
Description
本發明涉及支撐引入腔室的基板並將基板放置在基板支架上部的基板升降銷及包括該升降銷的基板處理裝置。The present invention relates to a substrate lift pin that supports a substrate introduced into a chamber and places the substrate on an upper portion of the substrate holder, and a substrate processing apparatus including the lift pin.
最近,為了減少基板處理工序及生產成本,基板W的大小變得越來越大,因此,能夠最大限度地防止基板W下垂的升降銷5的數量也隨之增加。Recently, in order to reduce the substrate processing process and the production cost, the size of the substrate W is becoming larger and larger, and therefore, the number of the lift pins 5 that can prevent the substrate W from sagging to the maximum extent is also increased.
一般地說,如圖1至圖3所示,基板處理工序中,現有的升降銷5隨著基板支架1的上下運動而插入至具備於基板支架1的貫通口3,從而能夠沿著上下相對運動,並且將基板W安放、拆卸於基板支架1的上部。Generally, as shown in FIG. 1 to FIG. 3, in the substrate processing step, the conventional lift pins 5 are inserted into the through holes 3 provided in the substrate holder 1 as the substrate holder 1 moves up and down, so that the lift pins 5 can be vertically aligned. The substrate W is moved and detached from the upper portion of the substrate holder 1.
現有技術的韓國公開專利公報第10-2010-0102143號記載了如下的升降:該升降銷包括:銷軸,在基板支撐部的支撐表面上操縱基板,從基板支撐部向基板均勻地傳達熱;銷頭,作為銷軸的端部具有大於銷軸的截面。The prior art Korean Patent Publication No. 10-2010-0102143 describes a lifting and lowering that includes: a pin shaft that manipulates a substrate on a support surface of the substrate supporting portion, and uniformly transmits heat from the substrate supporting portion to the substrate; The pin head, as the end of the pin, has a section that is larger than the pin.
韓國公開專利公報第10-2013-0110921號記載了如下的基板處理裝置:基板板件,放置基板;及升降銷單元,具有升降銷主體與多個重量環,其中升降銷通過配置在基板板件的貫通孔,根據基板板件的升降運動使基板升降移動,多個重量環在嵌入於升降銷主體與升降銷主體下端的狀態下以相反的方向旋轉並且結合於升降銷主體來與升降銷主體緊密地咬合。Japanese Laid-Open Patent Publication No. 10-2013-0110921 discloses a substrate processing apparatus which is a substrate plate, a substrate, and a lift pin unit having a lift pin main body and a plurality of weight rings, wherein the lift pins are disposed on the substrate plate The through hole moves the substrate up and down according to the lifting movement of the substrate plate, and the plurality of weight rings rotate in opposite directions in a state of being embedded in the lower end of the lift pin main body and the lift pin main body, and are coupled to the lift pin main body and the lift pin main body Tightly bite.
韓國公開專利公報第10-2010-0067722號記載了如下的基板升降裝置:可升降的銷板件;邊緣銷,固定設置在銷板件的邊緣區域,並貫通下部電極的邊緣區域;中心銷,以保持固定的偏移距離的狀態下介入銷板件的中心區域上部,根據銷板件的上升貫通下部電極的中心區域;及支撐工具,使中心銷以保持固定偏移距離的狀態下介入銷板件的中心區域上部。Japanese Laid-Open Patent Publication No. 10-2010-0067722 describes a substrate lifting device that can lift and lower a pin plate member, and an edge pin that is fixedly disposed at an edge region of the pin plate member and penetrates an edge region of the lower electrode; a center pin, Engaging the upper portion of the central portion of the pin plate member in a state of maintaining a fixed offset distance, passing through the center portion of the lower electrode according to the rise of the pin plate member; and supporting the tool so that the center pin is inserted into the pin while maintaining a fixed offset distance The upper part of the central area of the panel.
如上所述,現有的升降銷是形成一體的。直接支撐基板的升降銷上部部分容易受損,而一體化的升降銷即使損傷一部分也要更換整個升降銷,因此存在更換費用高的缺點。As described above, the existing lift pins are integrally formed. The upper portion of the lift pin that directly supports the substrate is easily damaged, and the integrated lift pin replaces the entire lift pin even if it is damaged, so there is a disadvantage that the replacement cost is high.
這種升降銷5插入於基板支架1的貫通口3並由上部支撐基板W,因此升降銷5的上部受彎曲負荷,而下部則受軸負荷。一般的材料對軸負荷有較強的耐性,但是對彎曲負荷的耐性較弱,因此為了承受彎曲負荷,升降銷整體要使用強度高並且價格高的材料。Since the lift pin 5 is inserted into the through hole 3 of the substrate holder 1 and supports the substrate W from the upper portion, the upper portion of the lift pin 5 is subjected to a bending load, and the lower portion is subjected to a shaft load. A general material has strong resistance to a shaft load, but is less resistant to a bending load. Therefore, in order to withstand a bending load, a high-strength and high-priced material is used as a whole for the lift pin.
並且,針對現有的基板處理裝置的升降銷5而言,基板W被引入腔室4內部放置在升降銷5的上部的過程中,在基板W與升降銷5之間會發生碰撞。因為這種碰撞,基板W的下部表面或者升降銷5上部會受損,進而產生不良的基板W。Further, in the lift pin 5 of the conventional substrate processing apparatus, when the substrate W is introduced into the upper portion of the lift pin 5 inside the chamber 4, a collision occurs between the substrate W and the lift pin 5. Because of this collision, the lower surface of the substrate W or the upper portion of the lift pin 5 is damaged, resulting in a defective substrate W.
並且,為了防止基板W的下部面產生瑕疵,現有基板處理裝置的升降銷5將基板2放置到基板支架1上部之後,使升降銷5位置低於基板支架1的上部面,從而不會接觸到基板W。因此,升降銷5與基板之間產生空間,導致基板支架1的熱無法有效傳遞到升降銷5上部的基板W。因此,在基板W產生溫度差,對膜質厚度及均勻性產生了影響。並且,增加了升降銷5的數量,進而升降銷5上部的基板W產生膜質異常及斑紋的現象變嚴重。尤其,LCD及OLED的技術的發展導致解析度的顯著增強,因此非常小的斑點也會造成基板處理產品的品質問題。Further, in order to prevent the occurrence of flaws on the lower surface of the substrate W, the lift pins 5 of the conventional substrate processing apparatus place the substrate 2 on the upper portion of the substrate holder 1, and the position of the lift pins 5 is lower than the upper surface of the substrate holder 1, so that the lift pins 5 are not exposed. Substrate W. Therefore, a space is created between the lift pins 5 and the substrate, so that the heat of the substrate holder 1 cannot be efficiently transmitted to the substrate W at the upper portion of the lift pins 5. Therefore, a temperature difference occurs in the substrate W, which affects the film thickness and uniformity. Further, the number of the lift pins 5 is increased, and the phenomenon that the substrate W on the upper portion of the lift pins 5 causes membranous abnormalities and streaks becomes severe. In particular, the development of LCD and OLED technologies has led to a significant increase in resolution, so very small spots can also cause quality problems in substrate processing products.
(要解決的技術問題)(Technical problem to be solved)
為了解決所述背景技術的問題點,本發明的目的在於提供一種能夠更換升降銷的部分元件,因此更換費用較低的基板升降銷。In order to solve the problems of the background art, it is an object of the present invention to provide a part of an element capable of replacing a lift pin, thereby replacing a substrate lift pin having a lower cost.
本發明的目的在於提供一種承受升降銷受到的彎曲負荷與軸負荷的同時製造成本低廉的基板升降銷。SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate lift pin which is inexpensive to manufacture while receiving a bending load and a shaft load received by a lift pin.
本發明的目的在於提供在將基板放置在升降銷的過程中將基板與升降銷之間的損傷最小化的基板升降銷。It is an object of the present invention to provide a substrate lift pin that minimizes damage between the substrate and the lift pins during placement of the substrate in the lift pins.
(解決問題的手段)(means to solve the problem)
用於解決所述問題的本發明的基板升降銷,作為被插入垂直的貫通口而以上下相對移動來支撐基板的升降銷,其中所述貫通口比形成於基板支架上部面的支撐槽的底面更狹窄,包括:上部升降銷,支撐所述基板的下部面,並且可上下移動地結合於所述基板支架,並且在所述基板支架上升時,被卡接在所述支撐槽而被限制下降;下部升降銷,結合於所述上部升降銷的下部,並且插入於所述貫通口進行上下移動;及固定銷,以水準方向貫通分別形成在所述上、下部升降銷的下部與上部的突出部或者所述突出部與對應的插入部結合的部分,來固定所述上、下升降銷。The substrate lifting pin of the present invention for solving the above problem is a lifting pin that supports a substrate by being relatively moved upward and downward as a vertical through hole, wherein the through hole is larger than a bottom surface of a support groove formed on an upper surface of the substrate holder More narrow, comprising: an upper lifting pin supporting the lower surface of the substrate, and being movably coupled to the substrate holder, and being buckled in the support groove to be lowered when the substrate holder is raised a lower lift pin coupled to the lower portion of the upper lift pin and inserted into the through hole for moving up and down; and a fixing pin extending through the lower portion and the upper portion of the upper and lower lift pins respectively in the horizontal direction The portion or the portion where the protruding portion is combined with the corresponding insertion portion fixes the upper and lower lift pins.
所述突出部在外周面形成螺紋,所述插入部在內周面形成螺紋以對應於所述突出部的螺紋。The protruding portion forms a thread on the outer peripheral surface, and the insertion portion forms a thread on the inner peripheral surface to correspond to the thread of the protruding portion.
所述上部升降銷由金屬材質構成,所述下部升降銷由陶瓷(Ceramic)材質構成。The upper lift pin is made of a metal material, and the lower lift pin is made of a ceramic material.
所述上部升降銷表面被陽極氧化(Anodizing)處理。The upper lift pin surface is anodized.
所述上部升降銷由非金屬材質構成,所述下部升降銷由金屬材質構成。The upper lift pin is made of a non-metallic material, and the lower lift pin is made of a metal material.
所述上部升降銷包括:主體部,插入於所述貫通口,在基板支架上升時,被所述支撐槽卡住而被限制下降;銷部,可上下運動地結合於所述主體部,支撐所述基板的下部面;及彈性部,在所述基板放置到所述基板支架上部面的狀態下施加彈性力,使所述銷部的上部面與所述基板下部面緊貼。The upper lift pin includes a main body portion that is inserted into the through hole, and is restrained to be lowered by the support groove when the substrate holder is raised; the pin portion is coupled to the main body portion so as to be movable up and down, and supported The lower surface of the substrate; and the elastic portion apply an elastic force in a state where the substrate is placed on the upper surface of the substrate holder, so that the upper surface of the pin portion is in close contact with the lower surface of the substrate.
基板升降銷還包括結合部,限制所述銷部對所述主體部的相對性的上下運動並使兩者結合。The substrate lift pin further includes a joint portion that restricts the relative up and down movement of the pin portion to the body portion and combines the two.
所述主體部具有:突出台,在上部外周面被所述支撐槽卡住;導槽,在上部面具有垂直方向的內部空間;及結合孔,以水準方向與所述導槽連通,所述銷部具有:支撐部,支撐所述基板;滑動部,插入於所述導槽;及限制孔,以相比所述結合孔的長度還長的方式沿著垂直方向延伸形成,來以水準方向貫通所述滑動部,所述彈性部位於所述滑動部的下端與所述導槽底面之間,向所述銷部施加向上的彈性力;所述結合部,插入於所述結合孔與所述限制孔。The main body portion has: a protruding table that is caught by the support groove on the upper outer peripheral surface; a guide groove having an inner space in a vertical direction on the upper surface; and a coupling hole that communicates with the guide groove in a horizontal direction, The pin portion has a support portion that supports the substrate, a sliding portion that is inserted into the guide groove, and a restriction hole that is formed to extend in a vertical direction in a manner that is longer than a length of the coupling hole to be in a horizontal direction Through the sliding portion, the elastic portion is located between the lower end of the sliding portion and the bottom surface of the guiding groove, and applies an upward elastic force to the pin portion; the coupling portion is inserted into the coupling hole and the portion Restricted holes.
所述限制孔在垂直方向的長度對所述結合孔的垂直方向長度的比例為,1.5倍~3倍。The ratio of the length of the limiting hole in the vertical direction to the length of the vertical direction of the bonding hole is 1.5 to 3 times.
所述彈性部為壓縮螺旋彈簧或碟形彈簧。The elastic portion is a compression coil spring or a disc spring.
所述限制孔的截面為長孔形或長方形。The restriction hole has a long hole shape or a rectangular shape.
在所述升降銷上部放置所述基板之前,所述銷部的上部面與所述突出台的下部面之間的距離大於支撐槽的深度,在所述升降銷上部放置所述基板之後,所述銷部的上部面與所述突出台的下部面之間的距離小於支撐槽的深度。Before the substrate is placed on the upper portion of the lift pin, a distance between an upper surface of the pin portion and a lower surface of the protruding table is greater than a depth of the support groove, after the substrate is placed on the upper portion of the lift pin The distance between the upper surface of the pin-out portion and the lower surface of the projecting table is smaller than the depth of the support groove.
用於解決上述其他問題的本發明的基板處理裝置,包括:腔室,具有處理基板的內部空間;基板支架,在所述腔室內部上下移動來放置所述基板,在上部面形成支撐槽,並且形成比所述支撐槽的底面更狹窄的垂直的貫通口;及上述的升降銷。A substrate processing apparatus according to the present invention for solving the above-mentioned other problems includes a chamber having an internal space for processing a substrate, a substrate holder moving up and down inside the chamber to place the substrate, and a support groove formed on the upper surface. And forming a vertical through hole that is narrower than a bottom surface of the support groove; and the above-described lift pin.
所述基板支架具有加熱所述基板的加熱器。The substrate holder has a heater that heats the substrate.
(發明的效果)(Effect of the invention)
根據本發明的分離型基板升降銷,製作分離型的升降銷,因此能夠部分性地更換容易受損的部分,進而能夠降低更換費用。According to the separate substrate lift pin of the present invention, since the separate lift pin is produced, the portion that is easily damaged can be partially replaced, and the replacement cost can be reduced.
並且,本發明在升降銷的上部使用耐彎曲負荷的材料,而下部則使用耐軸負荷的材料,進而能夠減少升降銷的製造成本的同時提高耐久性。Further, in the present invention, a material having a bending load resistance is used for the upper portion of the lift pin, and a material for the shaft load is used for the lower portion, and the manufacturing cost of the lift pin can be reduced, and the durability can be improved.
並且,本發明在升降銷上部放置基板的過程中彈性支撐基板,進而在基板與升降銷碰撞時防止基板的下部面或升降銷的上部面受損,進而能夠提高耐久性。Further, in the present invention, the substrate is elastically supported during the process of placing the substrate on the upper portion of the lift pin, and further, when the substrate collides with the lift pin, the lower surface of the substrate or the upper surface of the lift pin is prevented from being damaged, and durability can be improved.
並且,本發明通過彈性支撐使升降銷的上部面與基板的下部面緊貼,從而使基板支架的熱量通過升降銷傳遞到升降銷上部的基板,因此能夠保持基板均勻溫度,從此能夠顯著地改善升降銷上部的基板膜質,並能夠防止斑紋的產生,進而顯著減少不合格品。Further, according to the present invention, the upper surface of the lift pin is brought into close contact with the lower surface of the substrate by the elastic support, so that the heat of the substrate holder is transmitted to the substrate on the upper portion of the lift pin through the lift pin, so that the uniform temperature of the substrate can be maintained, and the heat can be remarkably improved. The substrate on the upper part of the lift pin is membranous and can prevent the occurrence of speckles, thereby significantly reducing defective products.
本發明的分離型基板升降銷被插入至垂直的貫通口3,從而隨著基板支架1的上下運動而上下相對運動,並且在基板支架1上部放置、拆卸基板W,其中該貫通口3相比形成於基板支架1的上部面的支撐槽2的底面更狹窄。The split type substrate lifting and lowering pin of the present invention is inserted into the vertical through opening 3 so as to move up and down with the up and down movement of the substrate holder 1, and the substrate W is placed and disassembled on the upper portion of the substrate holder 1, wherein the through hole 3 is compared The bottom surface of the support groove 2 formed on the upper surface of the substrate holder 1 is narrower.
以下,參照圖面以本發明的實施例為中心進行詳細說明。本發明的分離型基板升降銷可分為第一至第三實施例,並且各個實施例的構成要素基本相同,但是一部分結構存在差異。並且,在本發明的各種實施例中起到相同功能與作用的構成要素,在圖面上將使用相同的圖面符號。Hereinafter, a detailed description will be given focusing on an embodiment of the present invention with reference to the drawings. The split type substrate lift pins of the present invention can be classified into the first to third embodiments, and the constituent elements of the respective embodiments are substantially the same, but a part of the structures are different. Further, in the various embodiments of the present invention, the same functions and functions will be used, and the same drawing symbols will be used on the drawings.
如圖4至圖7所示,根據本發明第一實施例的分離型基板升降銷大致由上部升降銷100、下部升降銷200、固定銷300構成。As shown in FIGS. 4 to 7, the split type substrate lift pin according to the first embodiment of the present invention is roughly constituted by an upper lift pin 100, a lower lift pin 200, and a fixed pin 300.
上部升降銷100支撐基板的下表面,並且可上下移動地結合於基板支架1,在基板支架1上升時被卡接在支撐槽2而被限制下降。這種上部升降銷100由頭部110、上部升降銷主體部120及第一突出部130構成。The upper lift pin 100 supports the lower surface of the substrate, and is coupled to the substrate holder 1 so as to be movable up and down. When the substrate holder 1 is raised, it is caught by the support groove 2 and is restricted from falling. The upper lift pin 100 is composed of a head portion 110, an upper lift pin main body portion 120, and a first projecting portion 130.
頭部110上部具有平坦的面來支撐基板的下部面,相比於上部升降銷主體部120頭部110形成更寬的水準截面面積,因此在基板支架1上升時,頭部110被支撐槽2卡住而限制下降。The upper portion of the head portion 110 has a flat surface to support the lower surface of the substrate, and a wider level cross-sectional area is formed than the head portion 110 of the upper lift pin main body portion 120. Therefore, when the substrate holder 1 is raised, the head portion 110 is supported by the groove 2 Stuck and limit the drop.
上部升降銷主體部120為與頭部110下部形成一體或者結合於頭部110下部的棍棒形狀的部件,形成比頭部110的水準截面面積窄,並且插入于貫通口3來升降。The upper lift pin main body portion 120 is a member having a stick shape integrally formed with the lower portion of the head portion 110 or coupled to the lower portion of the head portion 110, and is formed to be narrower than the horizontal cross-sectional area of the head portion 110, and is inserted into the through hole 3 to be raised and lowered.
第一突出部130突出形成在上部升降銷主體部120下部,進而與下部升降銷200結合。優選為,在第一突出部130的外周面形成螺紋,並且形成水準方向貫通第一突出部130的第一結合口131,並向該第一結合口131插入固定銷300。The first protruding portion 130 is formed to protrude at a lower portion of the upper lift pin main body portion 120, and is further coupled with the lower lift pin 200. Preferably, a thread is formed on the outer circumferential surface of the first protruding portion 130, and a first joint opening 131 penetrating the first protruding portion 130 in the horizontal direction is formed, and the fixing pin 300 is inserted into the first joint opening 131.
下部升降銷200結合於上部升降銷100的下部,並插入於貫通口3相對基板支架1進行上下移動。這種下部支撐銷200由下部升降銷主體部210、第二插入部220構成。The lower lift pin 200 is coupled to the lower portion of the upper lift pin 100 and inserted into the through hole 3 to move up and down with respect to the substrate holder 1. Such a lower support pin 200 is composed of a lower lift pin main body portion 210 and a second insertion portion 220.
下部升降銷主體部210為與上部升降銷主體部120的下部面接觸並結合的棍棒形狀部件,形成與上部升降銷主體部120的水準截面相同的截面,並插入於所述貫通口3進行升下降。The lower lift pin main body portion 210 is a whip-shaped member that is in contact with and coupled to the lower surface of the upper lift pin main body portion 120, and has a cross section that is the same as the level cross section of the upper lift pin main body portion 120, and is inserted into the through hole 3 to be raised. decline.
第二插入部220為形成在下部升降銷主體部210上部面的槽,被插入上部升降銷100的第一突出部130,進而結合上、下部升降銷100、200。優選為,在第二插入部220內周面形成螺紋以與第一突出部130的螺紋對應,並且形成與第二插入部220在水準方向上連通的第二固定口221來插入固定銷300。這時,在第一突出部130與第二插入部220螺紋結合而固定的狀態下,第一結合口131與第二固定口221形成相同的中心軸。The second insertion portion 220 is a groove formed in the upper surface of the lower lift pin main body portion 210, is inserted into the first projecting portion 130 of the upper lift pin 100, and further couples the upper and lower lift pins 100, 200. Preferably, a thread is formed on the inner circumferential surface of the second insertion portion 220 to correspond to the thread of the first protrusion 130, and a second fixing port 221 that communicates with the second insertion portion 220 in the horizontal direction is formed to insert the fixing pin 300. At this time, in a state in which the first protruding portion 130 and the second insertion portion 220 are screwed and fixed, the first joint port 131 and the second fixed port 221 form the same central axis.
固定銷300依次插入於下部升降銷200一側的第二固定口221、第一結合口131及下部升降銷200另一側的第二固定口221,以水準方向貫通形成在上部升降銷100下部的第一突出部130與形成在下部升降銷200上部的第二插入部220結合的部分,進而固定上、下部升降銷100、200。The fixing pin 300 is sequentially inserted into the second fixing opening 221 on the lower lifting pin 200 side, the first coupling opening 131 and the second fixing opening 221 on the other side of the lower lifting pin 200, and is formed in the lower direction of the upper lifting pin 100 in the horizontal direction. The first protruding portion 130 is joined to the second insertion portion 220 formed on the upper portion of the lower lifting pin 200, thereby fixing the upper and lower lifting pins 100, 200.
固定銷300插入於第一結合口131與第二固定口221,進而能夠防止上、下部升降銷100、200分離,並且防止第一突出部130與第二插入部220的旋轉,進而能夠防止螺紋結合被鬆開。The fixing pin 300 is inserted into the first joint opening 131 and the second fixing port 221, thereby preventing the upper and lower lift pins 100, 200 from being separated, and preventing the rotation of the first protrusion 130 and the second insert portion 220, thereby preventing the thread from being prevented. The combination is released.
本發明的分離型基板升降銷分開配置上、下部升降銷,進而無需更換整個升降銷,能夠只更換受損部分的升降銷,因此能夠降低更換費用。Since the split type substrate lift pins of the present invention are provided with the upper and lower lift pins separately, and it is possible to replace only the lift pins of the damaged portion without replacing the entire lift pins, the replacement cost can be reduced.
圖6與圖7是示出在根據第一實施例的升降銷的上部放置基板之前與已放置基板的狀態。上部升降銷100的上部為支撐基板的部分,但是上部升降銷100的頭部110被支撐槽2卡住而被限制下降的部分等被碰撞的部分,容易磨損或破損。並且,在支撐基板的過程中,上部升降銷100受彎曲負荷,而下部升降銷200則受軸負荷。6 and 7 are views showing a state in which the substrate has been placed before the substrate is placed on the upper portion of the lift pin according to the first embodiment. The upper portion of the upper lift pin 100 is a portion that supports the substrate, but the portion where the head portion 110 of the upper lift pin 100 is caught by the support groove 2 and is restrained from falling is easily worn or broken. Further, in the process of supporting the substrate, the upper lift pin 100 is subjected to a bending load, and the lower lift pin 200 is subjected to a shaft load.
因此,上部升降銷100由鋁、鈦等金屬材質構成,對彎曲負荷的阻力變大而防止變形,同時能夠防止碰撞時的磨損或破損。Therefore, the upper lift pin 100 is made of a metal material such as aluminum or titanium, and the resistance to the bending load is increased to prevent deformation, and abrasion or breakage at the time of collision can be prevented.
相比於彎曲負荷,下部升降銷200受斷裂強度高的軸負荷,並且不容易發生磨損或破損,因此相比於上部升降銷100,可由強度低並且材料費用低廉的陶瓷(Ceramic)構成。Compared with the bending load, the lower lift pin 200 is subjected to a shaft load having a high breaking strength and is less likely to be worn or broken. Therefore, compared with the upper lift pin 100, ceramics having a low strength and a low material cost can be used.
並且,上部升降銷100升下降並且向基板支架1的上部露出,因此容易被處理基板的化學藥品而變質,因此將上部升降銷100的表面進行陽極氧化(Anodizing)處理形成氧化膜,進而能夠保護上部升降銷100的表面。Further, since the upper lift pin 100 is lowered and exposed to the upper portion of the substrate holder 1, it is easily deteriorated by the chemical of the substrate to be processed. Therefore, the surface of the upper lift pin 100 is anodized to form an oxide film, which is further protected. The surface of the upper lift pin 100.
並且,上部升降銷100可由非金屬材質構成,而下部升降銷200可由金屬材質構成。Further, the upper lift pin 100 may be made of a non-metallic material, and the lower lift pin 200 may be made of a metal material.
因此,提高升降銷的耐久性的同時也能夠降低更換費用及製造成本。Therefore, the durability of the lift pins can be improved, and the replacement cost and the manufacturing cost can be reduced.
相比於第一實施例,本發明的第二實施例在突出部與插入部的形成位置上存在差異。在以下省略說明與第一實施例的相同的構成要素,並且參照圖8、圖9以與第一實施例不同的構成要素為中心進行說明。Compared to the first embodiment, the second embodiment of the present invention differs in the position at which the projection and the insertion portion are formed. The same components as those of the first embodiment will be omitted from the description below, and the components different from the first embodiment will be mainly described with reference to FIGS. 8 and 9 .
上部升降銷100由頭部110、上部升降銷主體部120及第一插入部140構成。相比於第一實施例,頭部110與上部升降銷主體部120以相同方式形成,並且作為代替第一突出部的部件形成第一插入部140。The upper lift pin 100 is composed of a head portion 110, an upper lift pin main body portion 120, and a first insertion portion 140. Compared to the first embodiment, the head portion 110 is formed in the same manner as the upper lift pin main body portion 120, and the first insertion portion 140 is formed as a member instead of the first protruding portion.
第一插入部140為形成在上部升降銷主體部120下部面的槽,將被插入下部升降銷200而與下部升降銷200結合。優選為,第一插入部140在內周面形成螺紋,並且形成以水準方向與第一插入部140連通的第一固定口141來插入固定銷300。The first insertion portion 140 is a groove formed on the lower surface of the upper lift pin main body portion 120, and is inserted into the lower lift pin 200 to be coupled to the lower lift pin 200. Preferably, the first insertion portion 140 is formed with a thread on the inner circumferential surface, and a first fixing opening 141 that communicates with the first insertion portion 140 in the horizontal direction is formed to insert the fixing pin 300.
下部升降銷200由下部升降銷主體部210、第二突出部230構成。與第一實施例相比,形成相同的下部升降銷主體部210,並且作為代替第二插入部的部件形成第二突出部230。The lower lift pin 200 is composed of a lower lift pin main body portion 210 and a second projecting portion 230. The same lower lift pin main body portion 210 is formed as compared with the first embodiment, and the second projecting portion 230 is formed as a member instead of the second insertion portion.
第二突出部230突出形成在下部升降銷主體部210上部面,並且插入至上部升降銷100的第一插入部140而與上部升降銷100結合。優選為,在第二突出部230的外周面形成與第一插入部140的螺紋對應的螺紋,並且形成以水準方向貫通第二突出部230的第二結合口231來插入固定銷300。這時,在第一插入部140與第二突出部230螺紋結合而固定的狀態下,第一固定口141與第二結合口231形成相同的中心軸。The second protruding portion 230 is formed to protrude from the upper surface of the lower lift pin main body portion 210, and is inserted into the first insertion portion 140 of the upper lift pin 100 to be coupled with the upper lift pin 100. Preferably, a thread corresponding to the thread of the first insertion portion 140 is formed on the outer circumferential surface of the second protrusion 230, and a second joint opening 231 that penetrates the second protrusion 230 in the horizontal direction is formed to insert the fixing pin 300. At this time, in a state where the first insertion portion 140 and the second protruding portion 230 are screwed and fixed, the first fixing opening 141 and the second coupling opening 231 form the same central axis.
與第一實施例相比,本發明的第三實施例在上部升降銷的構造上存在差異。在以下省略說明與第一實施例相同的構成要素,並參照圖10至圖13,以與第一實施例不同的構成要素為中心進行說明。The third embodiment of the present invention differs in the configuration of the upper lift pins as compared with the first embodiment. The same components as those of the first embodiment will be omitted from the description below, and the components different from the first embodiment will be mainly described with reference to FIGS. 10 to 13 .
與現有的升降銷不同地,第三實施例的分離型基板升降銷在其上部支撐基板的狀態下,將基板W放置在基板支架1上部之後也可彈性支撐基板W,以使升降銷的上部面與基板W的下部面緊貼在一起。Unlike the conventional lift pin, the split type substrate lift pin of the third embodiment can elastically support the substrate W after the substrate W is placed on the upper portion of the substrate holder 1 in a state where the upper substrate supports the substrate, so that the upper portion of the lift pin The face is in close contact with the lower face of the substrate W.
在以下,參照附圖以本發明的實施例為中心進行詳細說明。In the following, detailed description will be made focusing on embodiments of the present invention with reference to the accompanying drawings.
如圖10所示,根據本發明第三實施例的分離型基板升降銷大致由上部升降銷100、下部升降銷200及固定銷300構成,其中上部升降銷100由主體部10、銷部20、彈性部30及結合部40構成。As shown in FIG. 10, the split type substrate lift pin according to the third embodiment of the present invention is substantially composed of an upper lift pin 100, a lower lift pin 200, and a fixed pin 300, wherein the upper lift pin 100 is composed of a main body portion 10 and a pin portion 20, The elastic portion 30 and the joint portion 40 are configured.
上部升降銷100包括主體部10、銷部20、彈性部30。主體部10插入至貫通口3,在基板支架1上升時,被支撐槽2卡住而限制下降。銷部20可上下運動地結合於主體部10來支撐基板W的下部面。彈性部30在基板W放置在基板支架1上部面的狀態下,施加彈性力使銷部20的上部面與基板W下部面緊貼。The upper lift pin 100 includes a main body portion 10, a pin portion 20, and an elastic portion 30. The main body portion 10 is inserted into the through hole 3, and when the substrate holder 1 is raised, it is caught by the support groove 2 to restrict the lowering. The pin portion 20 is coupled to the main body portion 10 in a vertically movable manner to support the lower surface of the substrate W. The elastic portion 30 applies an elastic force in a state where the substrate W is placed on the upper surface of the substrate holder 1, so that the upper surface of the pin portion 20 is in close contact with the lower surface of the substrate W.
主體部10可具有:導槽11,具有在上部面垂直方向的內部空間;結合孔12,以水準方向與導槽11連通;及突出台13,向上部外周面突形成。The main body portion 10 may have a guide groove 11 having an inner space perpendicular to the upper surface, a coupling hole 12 communicating with the guide groove 11 in the horizontal direction, and a projecting table 13 projecting from the outer peripheral surface of the upper portion.
導槽11使銷部20對於主體部10上下移動,結合孔12的截面可形成為圓形、長孔形、四邊形等,突出台13在基板支架1上升時,被支撐槽2卡住而限制主體部10下降。The guide groove 11 moves the pin portion 20 up and down with respect to the main body portion 10. The cross section of the coupling hole 12 can be formed into a circular shape, a long hole shape, a quadrangular shape or the like, and the protruding table 13 is restrained by the support groove 2 when the substrate holder 1 ascends, thereby restricting The main body portion 10 is lowered.
銷部20具備:支撐部21,上部具有平坦的面以支撐基板W;滑動部22,插入至導槽11;限制孔23,以相比結合孔12還長的長度沿著垂直方向延伸形成,並且沿著水準方向貫通滑動部22。The pin portion 20 is provided with a support portion 21 having a flat surface to support the substrate W, a sliding portion 22 inserted into the guide groove 11, and a restriction hole 23 extending in a vertical direction with a length longer than the coupling hole 12, And the sliding portion 22 is penetrated in the horizontal direction.
針對主體部10銷部20可做相對的上下運動,限制孔23的垂直方向長度相對結合孔12的垂直方向長度的比例為1.5倍~3倍。若垂直方向長度的比例太小,則銷部20幾乎無法對主體部10移動,相反若太大,則相對於主體部10的銷部20的上下運動範圍會不必要地擴大。並且,限制孔23的截面可形成長孔形或長方形。The pin portion 20 of the main body portion 10 can be moved up and down, and the ratio of the length of the vertical direction of the hole 23 to the length of the vertical direction of the coupling hole 12 is 1.5 times to 3 times. If the ratio of the length in the vertical direction is too small, the pin portion 20 can hardly move to the main body portion 10. On the other hand, if it is too large, the range of up and down movement of the pin portion 20 with respect to the main body portion 10 is unnecessarily enlarged. Also, the cross section of the restriction hole 23 may be formed into a long hole shape or a rectangular shape.
彈性部30位於滑動部22的下端與導槽11底面之間可向銷部20施加向上的彈性力,以使銷部20的上部面與基板W緊貼。這時,彈性部30可使用壓縮螺旋彈簧或碟形彈簧,只要像波紋管(bellows)等能夠利用彈性而使銷部20與基板W緊貼的,任何形狀都可以。The elastic portion 30 is located between the lower end of the sliding portion 22 and the bottom surface of the guide groove 11 to apply an upward elastic force to the pin portion 20 such that the upper surface of the pin portion 20 is in close contact with the substrate W. At this time, the elastic portion 30 may be a compression coil spring or a disc spring, and any shape may be used as long as the pin portion 20 and the substrate W can be brought into close contact with each other like a bellows or the like.
結合部40依次插入至主體部10一側的結合孔12、銷部20的限制孔23及主體部10另一側的結合孔12,從而限制銷部20對主體部10的上下運動,使銷部20不脫離主體部10地結合。尤其,可設計成結合部40位於限制孔23的最上端時,銷部20的支撐部21下部面不接觸主體部10的上部面及基板支架1。由此,能夠防止因支撐部21下部面與主體部10上部面或基板支架1接觸而導致的微粒的產生,進而能夠提高本發明的基板升降銷的耐久性。The joint portion 40 is sequentially inserted into the joint hole 12 on the side of the main body portion 10, the restricting hole 23 of the pin portion 20, and the joint hole 12 on the other side of the main body portion 10, thereby restricting the up and down movement of the pin portion 20 to the main body portion 10, so that the pin The portion 20 is joined without being separated from the main body portion 10. In particular, when the joint portion 40 is located at the uppermost end of the restricting hole 23, the lower surface of the support portion 21 of the pin portion 20 does not contact the upper surface of the main body portion 10 and the substrate holder 1. Thereby, generation of fine particles due to contact between the lower surface of the support portion 21 and the upper surface of the main body portion 10 or the substrate holder 1 can be prevented, and the durability of the substrate lift pins of the present invention can be improved.
下面,參考圖11至圖13,說明根據利用本發明的基板升降銷的基板處理裝置,基板W被引入腔室4內部,並放置到基板支架1上部執行工藝之前的過程。Next, a process before the substrate is introduced into the upper portion of the chamber 4 and placed on the upper portion of the substrate holder 1 according to the substrate processing apparatus using the substrate lifting and lowering pin of the present invention will be described with reference to Figs. 11 to 13 .
首先,如圖11所示,作為基板W尚未放置到本發明的基板升降銷上部的狀態,銷部20根據彈性部30而上升,結合部40位於限制孔23的最下端。這時,銷部20的上部面與突出台13的下部面之間的距離D大於支撐槽的深度h。First, as shown in FIG. 11, as the substrate W is not placed on the upper portion of the substrate lift pin of the present invention, the pin portion 20 is raised in accordance with the elastic portion 30, and the joint portion 40 is located at the lowermost end of the restricting hole 23. At this time, the distance D between the upper surface of the pin portion 20 and the lower surface of the protruding table 13 is larger than the depth h of the support groove.
其次,如圖12所示,作為機械臂將基板W引入腔室4內部並安放到銷部20上部的狀態,銷部20因基板W的自身重力而下降,結合部40位於限制孔23的最上端。這時,銷部20的上部面與突出台13的下部面之間的距離d小於支撐槽的深度h。Next, as shown in FIG. 12, as the robot arm introduces the substrate W into the inside of the chamber 4 and is placed in the upper portion of the pin portion 20, the pin portion 20 is lowered by the gravity of the substrate W, and the joint portion 40 is located at the most limit hole 23. Upper end. At this time, the distance d between the upper surface of the pin portion 20 and the lower surface of the protruding table 13 is smaller than the depth h of the support groove.
最後,如圖13所圖示,作為基板支架1上升而在基板支架1的上部安放基板W的狀態下,主體部10下降直至對於基板支架1突出台13被基板支架1的支撐槽2卡住為止,銷部20下降直至基板支架1的上部面與銷部20的上部面呈一條直線為止,之後即使升降銷再下降,因彈性部30向銷部20施加向上的彈性力,因此銷部20的上部面與基板W的下部面緊貼。這時,銷部20的上部面與突出台13的下部面之間的距離等於支撐槽的深度h。Finally, as shown in FIG. 13 , in a state where the substrate holder 1 is raised and the substrate W is placed on the upper portion of the substrate holder 1 , the main body portion 10 is lowered until the protruding stage 13 of the substrate holder 1 is caught by the support groove 2 of the substrate holder 1 . The pin portion 20 is lowered until the upper surface of the substrate holder 1 is aligned with the upper surface of the pin portion 20, and thereafter, even if the lift pin is lowered again, the elastic portion 30 applies an upward elastic force to the pin portion 20, so the pin portion 20 The upper surface of the substrate is in close contact with the lower surface of the substrate W. At this time, the distance between the upper surface of the pin portion 20 and the lower surface of the projecting table 13 is equal to the depth h of the support groove.
如上所述,以基板W放置到基板支架1與銷部20的上部的狀態進行基板處理工藝,基板支架1可由向基板W傳遞熱的加熱器構成。As described above, the substrate processing process is performed in a state where the substrate W is placed on the upper portion of the substrate holder 1 and the pin portion 20, and the substrate holder 1 can be constituted by a heater that transfers heat to the substrate W.
因此,如圖3所示,解決了現有的基板處理裝置中因升降銷5與基板W之間存在空間而基板支架1的熱量無法傳遞到基板W的問題,基板支架1能夠通過升降銷5向基板W傳遞熱,進而能夠使得基板W保持均勻的溫度。Therefore, as shown in FIG. 3, in the conventional substrate processing apparatus, the problem that the heat of the substrate holder 1 cannot be transmitted to the substrate W due to the space existing between the lift pins 5 and the substrate W is solved, and the substrate holder 1 can be lifted by the lift pins 5 The substrate W transfers heat, which in turn enables the substrate W to maintain a uniform temperature.
上部升降銷100的第一突出部130形成在主體部10的下部面,並且下部升降銷200與固定銷300與第一實施例相同。The first protruding portion 130 of the upper lift pin 100 is formed on the lower surface of the main body portion 10, and the lower lift pin 200 and the fixing pin 300 are the same as the first embodiment.
這時,為了提高向基板傳達熱的導熱率,上部升降銷100由導熱率高的金屬材質構成,而下部升降銷200可由諸如陶瓷的非金屬材質構成,能夠防止因劃痕等而產生微粒。At this time, in order to improve the thermal conductivity of heat to the substrate, the upper lift pin 100 is made of a metal material having a high thermal conductivity, and the lower lift pin 200 may be made of a non-metal material such as ceramic, and it is possible to prevent particles from being generated by scratches or the like.
根據本發明另一方面的基板處理裝置由腔室4、基板支架1及上述的升降銷構成。A substrate processing apparatus according to another aspect of the present invention comprises a chamber 4, a substrate holder 1, and the above-described lift pins.
腔室4具有處理基板W的內部空間。The chamber 4 has an internal space in which the substrate W is processed.
基板支架1在腔室4內部上下移動來放置基板W,並在基板支架1的上部面形成支撐槽2,並且形成比支撐槽2的底面窄的垂直的貫通口3。這時,基板支架1可由對基板W加熱的加熱器構成。The substrate holder 1 is moved up and down inside the chamber 4 to place the substrate W, and a support groove 2 is formed on the upper surface of the substrate holder 1, and a vertical through hole 3 narrower than the bottom surface of the support groove 2 is formed. At this time, the substrate holder 1 can be constituted by a heater that heats the substrate W.
升降銷5利用上述實施例的分離型基板升降銷。The lift pin 5 uses the split type substrate lift pin of the above embodiment.
利用本發明的分離型基板升降銷的基板處理裝置,不僅可利用於半導體製造設備、LCD或OLED等玻璃(GLASS)顯示器製造設備及晶圓製造設備,還可適用於各種基板處理裝置。The substrate processing apparatus using the separation type substrate lifting and lowering pin of the present invention can be used not only for semiconductor manufacturing equipment, glass (GLASS) display manufacturing equipment such as LCD or OLED, but also for wafer manufacturing equipment, and can be applied to various substrate processing apparatuses.
在以上以圖面為中心說明了本發明的具體實施例,但是本發明的權利範圍以在權利要求範圍記載的技術思想為中心影響到其變形物或均等物是顯而易見的。The specific embodiments of the present invention have been described above with reference to the drawings, but the scope of the present invention is obvious to those skilled in the art.
1‧‧‧基板支撐銷
2‧‧‧支撐槽
3‧‧‧貫通口
4‧‧‧腔室
5‧‧‧升降銷
10‧‧‧主體部
11‧‧‧導槽
12‧‧‧結合孔
13‧‧‧突出台
20‧‧‧銷部
21‧‧‧頭部
22‧‧‧滑動部
23‧‧‧限制孔
30‧‧‧彈性部
40‧‧‧結合部
100‧‧‧上部升降銷
110‧‧‧頭部
120‧‧‧上部升降銷主體部
130‧‧‧第一突出部
140‧‧‧第一插入部
200‧‧‧下部升降銷
210‧‧‧下部升降銷主體部
220‧‧‧第二插入部
230‧‧‧第二突出部
300‧‧‧固定銷
W‧‧‧基板1‧‧‧Substrate support pin
2‧‧‧Support slot
3‧‧‧through
4‧‧‧ chamber
5‧‧‧lifting pin
10‧‧‧ Main body
11‧‧‧ Guide slot
12‧‧‧Combination hole
13‧‧‧Outstanding platform
20‧‧‧ Department of Sales
21‧‧‧ head
22‧‧‧Sliding section
23‧‧‧Restricted holes
30‧‧‧Flexible Department
40‧‧‧Combination Department
100‧‧‧Upper lift pin
110‧‧‧ head
120‧‧‧Upper lift pin body
130‧‧‧First protrusion
140‧‧‧First Insertion Department
200‧‧‧ lower lift pin
210‧‧‧ Lower lift pin body
220‧‧‧Second Insertion Department
230‧‧‧Second protrusion
300‧‧‧fixed pin
W‧‧‧Substrate
圖1係示出在現有的基板處理裝置的升降銷上部放置基板之前的狀態的剖視圖。 圖2係示出在現有的基板處理裝置的升降銷上部已放置基板的狀態的剖視圖。 圖3係示出現有的基板處理裝置的基板支架處於上升狀態的剖視圖。 圖4係根據本發明第一實施例的升降銷的剖視圖。 圖5係根據本發明第一實施例的升降銷的組裝圖。 圖6係示出在根據本發明第一實施例的升降銷上部放置基板之前的狀態的剖視圖。 圖7係示出在根據本發明第一實施例的升降銷上部放置基板的狀態的剖視圖。 圖8係根據本發明第二實施例的升降銷的剖視圖。 圖9係根據本發明第二實施例的升降銷的組裝圖。 圖10係根據本發明第三實施例的升降銷的組裝圖。 圖11係示出在根據本發明第三實施例的升降銷上部放置基板之前的狀態的剖視圖。 圖12係示出在根據本發明第三實施例的升降銷上部已放置基板的狀態的剖視圖。 圖13係示出在根據本發明第三實施例的基板支架上升的狀態的剖視圖。Fig. 1 is a cross-sectional view showing a state before a substrate is placed on an upper portion of a lift pin of a conventional substrate processing apparatus. 2 is a cross-sectional view showing a state in which a substrate has been placed on an upper portion of a lift pin of a conventional substrate processing apparatus. 3 is a cross-sectional view showing a substrate holder of a conventional substrate processing apparatus in a raised state. Figure 4 is a cross-sectional view of a lift pin in accordance with a first embodiment of the present invention. Figure 5 is an assembled view of a lift pin in accordance with a first embodiment of the present invention. Fig. 6 is a cross-sectional view showing a state before the substrate is placed on the upper portion of the lift pin according to the first embodiment of the present invention. Fig. 7 is a cross-sectional view showing a state in which a substrate is placed on the upper portion of the lift pin according to the first embodiment of the present invention. Figure 8 is a cross-sectional view of a lift pin in accordance with a second embodiment of the present invention. Figure 9 is an assembled view of a lift pin in accordance with a second embodiment of the present invention. Figure 10 is an assembled view of a lift pin in accordance with a third embodiment of the present invention. Figure 11 is a cross-sectional view showing a state before a substrate is placed on an upper portion of a lift pin according to a third embodiment of the present invention. Figure 12 is a cross-sectional view showing a state in which a substrate has been placed on the upper portion of the lift pin according to the third embodiment of the present invention. Figure 13 is a cross-sectional view showing a state in which a substrate holder according to a third embodiment of the present invention is raised.
1‧‧‧基板支撐銷 1‧‧‧Substrate support pin
2‧‧‧支撐槽 2‧‧‧Support slot
3‧‧‧貫通口 3‧‧‧through
20‧‧‧銷部 20‧‧‧ Department of Sales
30‧‧‧彈性部 30‧‧‧Flexible Department
100‧‧‧上部升降銷 100‧‧‧Upper lift pin
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105116882A TW201742183A (en) | 2016-05-30 | 2016-05-30 | Separable substrate lift pin having a fixing pin to penetrate through the protrusion part of the upper and lower lift pins to replace the portion easily damaged partially for reducing the replacement cost |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105116882A TW201742183A (en) | 2016-05-30 | 2016-05-30 | Separable substrate lift pin having a fixing pin to penetrate through the protrusion part of the upper and lower lift pins to replace the portion easily damaged partially for reducing the replacement cost |
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Publication Number | Publication Date |
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TW201742183A true TW201742183A (en) | 2017-12-01 |
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Application Number | Title | Priority Date | Filing Date |
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TW105116882A TW201742183A (en) | 2016-05-30 | 2016-05-30 | Separable substrate lift pin having a fixing pin to penetrate through the protrusion part of the upper and lower lift pins to replace the portion easily damaged partially for reducing the replacement cost |
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CN110055517A (en) * | 2019-04-28 | 2019-07-26 | 云谷(固安)科技有限公司 | Plasma cavity and its substrate bearing device |
CN110265333A (en) * | 2019-06-21 | 2019-09-20 | 北京北方华创微电子装备有限公司 | Bogey and processing chamber |
CN111566797A (en) * | 2018-01-09 | 2020-08-21 | 瓦里安半导体设备公司 | Lift pin system for wafer processing |
CN113818003A (en) * | 2020-06-19 | 2021-12-21 | 拓荆科技股份有限公司 | Film preparation method and equipment |
TWI791215B (en) * | 2021-03-09 | 2023-02-01 | 南韓商Psk 控股公司 | Apparatus for treating substrate and method of treating substrate |
TWI831544B (en) * | 2021-12-31 | 2024-02-01 | 南韓商細美事有限公司 | Lift pin unit, substrate support unit and substrate treating apparatus comprising the same |
US11955362B2 (en) | 2017-09-13 | 2024-04-09 | Applied Materials, Inc. | Substrate support for reduced damage substrate backside |
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2016
- 2016-05-30 TW TW105116882A patent/TW201742183A/en unknown
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Publication number | Priority date | Publication date | Assignee | Title |
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US11955362B2 (en) | 2017-09-13 | 2024-04-09 | Applied Materials, Inc. | Substrate support for reduced damage substrate backside |
CN111566797A (en) * | 2018-01-09 | 2020-08-21 | 瓦里安半导体设备公司 | Lift pin system for wafer processing |
TWI788481B (en) * | 2018-01-09 | 2023-01-01 | 美商瓦里安半導體設備公司 | Lift pin system and lift pin assembly for wafer handling |
CN111566797B (en) * | 2018-01-09 | 2023-11-21 | 瓦里安半导体设备公司 | Lift pin system and lift pin assembly for wafer processing |
CN110055517A (en) * | 2019-04-28 | 2019-07-26 | 云谷(固安)科技有限公司 | Plasma cavity and its substrate bearing device |
CN110265333A (en) * | 2019-06-21 | 2019-09-20 | 北京北方华创微电子装备有限公司 | Bogey and processing chamber |
CN113818003A (en) * | 2020-06-19 | 2021-12-21 | 拓荆科技股份有限公司 | Film preparation method and equipment |
TWI791215B (en) * | 2021-03-09 | 2023-02-01 | 南韓商Psk 控股公司 | Apparatus for treating substrate and method of treating substrate |
TWI831544B (en) * | 2021-12-31 | 2024-02-01 | 南韓商細美事有限公司 | Lift pin unit, substrate support unit and substrate treating apparatus comprising the same |
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