TW201741393A - Polyamide resin composition containing metal salt of phenylphosphonic acid compound - Google Patents

Polyamide resin composition containing metal salt of phenylphosphonic acid compound Download PDF

Info

Publication number
TW201741393A
TW201741393A TW106103499A TW106103499A TW201741393A TW 201741393 A TW201741393 A TW 201741393A TW 106103499 A TW106103499 A TW 106103499A TW 106103499 A TW106103499 A TW 106103499A TW 201741393 A TW201741393 A TW 201741393A
Authority
TW
Taiwan
Prior art keywords
salt
polyamide
resin composition
polyamine
acid compound
Prior art date
Application number
TW106103499A
Other languages
Chinese (zh)
Inventor
小高一利
Original Assignee
日產化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日產化學工業股份有限公司 filed Critical 日產化學工業股份有限公司
Publication of TW201741393A publication Critical patent/TW201741393A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/53Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317Phosphonic compounds, e.g. R—P(:O)(OR')2
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

Abstract

To provide a polyamide resin composition to which is added a crystal nucleator suitable for promoting the crystallization of a polyamide resin, said composition making it possible to raise the crystallization rate and further improve the higher molding process properties in comparison with polyamide resins. A polyamide resin composition containing a polyamide resin and a crystal nucleator that comprises a metal salt of a phenylphosphonic acid compound represented by formula [1]. (In the formula, R1 and R2 each independently represent a hydrogen atom, C1-10 alkyl group, or C2-11 alkoxycarbonyl group).

Description

含苯基膦酸化合物之金屬鹽的聚醯胺樹脂組成物 Polyamide resin composition containing a metal salt of a phenylphosphonic acid compound

本發明係關於一種聚醯胺樹脂組成物,若更詳述係關於一種包含由苯基膦酸化合物之金屬鹽所成之成核劑之聚醯胺樹脂組成物、及由該樹脂組成物所得之聚醯胺樹脂成形體。 The present invention relates to a polyamide resin composition, and more particularly to a polyamine resin composition comprising a nucleating agent derived from a metal salt of a phenylphosphonic acid compound, and a composition obtained from the resin composition Polyamide resin molded body.

聚醯胺樹脂係一般廣泛被使用作為機械性質、耐藥品性、耐油性等為優異的工程塑料。其中,被分類成生物塑料之聚醯胺610係耐藥品性、耐金屬氯化物性(例如氯化鈣耐性)、低吸水性、尺寸穩定性等的特性為優異,而被期待作為例如食品容器、軸承、連接器、汽車用燃料導管‧軟管(hose)或內裝材、電氣‧電子製品的殼體或零件等的成形材料。 The polyamide resin is generally widely used as an engineering plastic excellent in mechanical properties, chemical resistance, oil resistance, and the like. Among them, polyamine 610 classified into a bioplastic is excellent in chemical resistance, metal chloride resistance (for example, calcium chloride resistance), low water absorption, dimensional stability, and the like, and is expected to be, for example, a food container. Forming materials for bearings, connectors, fuel conduits for automobiles, hoses or interior materials, housings or parts for electrical and electronic products.

然而,由於聚醯胺樹脂之結晶化速度慢,故具有:無法充分地結晶化之情形,在玻璃轉移點(Tg)以上的溫度下則產生軟化之類的缺點。又,在射出成型時的 模具內,藉由以指定的溫度來進行熱處理(退火),從而提升聚醯胺樹脂之結晶化度,但由於結晶化速度慢,故成型循環性差,而生產性存在著問題。 However, since the crystallization speed of the polyamide resin is slow, it is difficult to crystallize sufficiently, and a softening or the like occurs at a temperature higher than the glass transition point (Tg). Also, at the time of injection molding In the mold, heat treatment (annealing) is performed at a predetermined temperature to increase the degree of crystallization of the polyamide resin. However, since the crystallization rate is slow, molding cycleability is poor, and productivity is problematic.

為了解決該等課題,已研究在聚醯胺樹脂中添加成核劑之方法。成核劑係成為結晶性高分子的一次結晶核,促進結晶成長,具有球晶尺寸之微細化及結晶化促進之作用。 In order to solve such problems, a method of adding a nucleating agent to a polyamide resin has been studied. The nucleating agent serves as a primary crystal nucleus of the crystalline polymer, promotes crystal growth, and has a function of refining the spherulite size and promoting crystallization.

迄今為止,作為聚醯胺樹脂的成核劑,係揭示著層狀矽酸鹽(專利文獻1)、滑石(專利文獻2)等。 In the nucleating agent of the polyamide resin, a layered silicate (Patent Document 1), talc (Patent Document 2), and the like have been disclosed.

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

〔專利文獻1〕日本特表2002-527593號公報 [Patent Document 1] Japanese Patent Publication No. 2002-527593

〔專利文獻2〕日本特開2003-89773號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2003-89773

如前述般,為了提高聚醯胺樹脂之結晶化速度,已提案著各種的成核劑,但近年來為了實現聚醯胺樹脂的更高的成型加工性,期待著更有效的成核劑。 As described above, various nucleating agents have been proposed in order to increase the crystallization rate of the polyamide resin, but in recent years, in order to achieve higher molding processability of the polyamide resin, a more effective nucleating agent has been expected.

因此,本發明之目的在於提供一種聚醯胺樹脂組成物,其係添加有適合於促進聚醯胺樹脂之結晶化之成核劑,相較於聚醯胺樹脂之結晶化速度為更快,並可提升成為更高的成型加工性,以及提供將該聚醯胺樹脂組成物進 行結晶化而得到之聚醯胺樹脂成形體。 Accordingly, it is an object of the present invention to provide a polyimide resin composition which is added with a nucleating agent suitable for promoting crystallization of a polyamide resin, which has a faster crystallization rate than a polyamide resin. And can be upgraded to a higher molding processability, and provide the composition of the polyamide resin A polyamide resin molded article obtained by crystallization.

本發明人為了達成上述目的經深入研究之結果發現,藉由在聚醯胺樹脂中作為成核劑添加特定的苯基膦酸化合物之金屬鹽,可促進聚醯胺樹脂之結晶化。 As a result of intensive studies to achieve the above object, the present inventors have found that crystallization of a polyamide resin can be promoted by adding a metal salt of a specific phenylphosphonic acid compound as a nucleating agent in a polyamide resin.

即,本發明作為第1觀點為關於一種聚醯胺樹脂組成物,其係包含聚醯胺樹脂、及由式〔1〕所表示之苯基膦酸化合物之金屬鹽所成之成核劑, (式中,R1及R2係分別獨立表示氫原子、碳原子數1至10的烷基、或碳原子數2至11的烷氧基羰基)。 In other words, the present invention relates to a polyamine resin composition comprising a polyamine resin and a nucleating agent formed from a metal salt of a phenylphosphonic acid compound represented by the formula [1]. (wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxycarbonyl group having 2 to 11 carbon atoms).

作為第2觀點為關於第1觀點之聚醯胺樹脂組成物,其中,前述苯基膦酸化合物之金屬鹽係選自由鋰鹽、鈉鹽、鉀鹽、鎂鹽、鈣鹽、鋇鹽、錳鹽、鐵鹽、鈷鹽、鎳鹽、銅鹽、鋅鹽、銀鹽、鋁鹽、及錫鹽所成群之至少一種的金屬鹽。 According to a second aspect, the polyamine resin composition of the first aspect, wherein the metal salt of the phenylphosphonic acid compound is selected from the group consisting of a lithium salt, a sodium salt, a potassium salt, a magnesium salt, a calcium salt, a barium salt, and a manganese salt. a metal salt of at least one of a group of salts, iron salts, cobalt salts, nickel salts, copper salts, zinc salts, silver salts, aluminum salts, and tin salts.

作為第3觀點為關於第2觀點之聚醯胺樹脂組成物,其中,前述苯基膦酸化合物之金屬鹽係選自由鈣鹽、錳鹽、鋅鹽及錫鹽所成群之至少一種的金屬鹽。 The third aspect of the present invention relates to the polyamine resin composition of the second aspect, wherein the metal salt of the phenylphosphonic acid compound is selected from the group consisting of at least one of a calcium salt, a manganese salt, a zinc salt, and a tin salt. salt.

作為第4觀點為關於第3觀點之聚醯胺樹脂組成物, 其中,前述苯基膦酸化合物之金屬鹽為錳鹽。 The fourth aspect is the polyamine resin composition of the third aspect, Wherein the metal salt of the phenylphosphonic acid compound is a manganese salt.

作為第5觀點為關於第1觀點至第4觀點中任一觀點之聚醯胺樹脂組成物,其中,前述成核劑之含有量相對於前述聚醯胺樹脂100質量份為0.001~10質量份。 The polyamine resin composition of any one of the first aspect to the fourth aspect, wherein the content of the nucleating agent is 0.001 to 10 parts by mass based on 100 parts by mass of the polyamide resin. .

作為第6觀點為關於第1觀點至第5觀點中任一觀點之聚醯胺樹脂組成物,其中,前述聚醯胺樹脂係包含選自由聚醯胺6、聚醯胺11、聚醯胺12、聚醯胺46、聚醯胺66、聚醯胺610、聚醯胺612、聚醯胺1010、聚醯胺1212、聚醯胺4T、聚醯胺M5T、聚醯胺6T、聚醯胺6I、聚醯胺9T、聚醯胺10T、及聚醯胺MXD6所成群之至少一種。 The polyamine resin composition according to any one of the first aspect to the fifth aspect, wherein the polyamine resin is selected from the group consisting of polyamine 6, polyamine 11, and polyamine 12 , Polyamide 46, Polyamide 66, Polyamide 610, Polyamide 612, Polyamide 1010, Polyamide 1212, Polyamine 4T, Polyamide M5T, Polyamide 6T, Polyamine 6I At least one of a group of polyamine 9T, polyamine 10T, and polyamine MXD6.

作為第7觀點為關於第6觀點之聚醯胺樹脂組成物,其中,前述聚醯胺樹脂係至少包含聚醯胺610。 According to a seventh aspect of the invention, the polyamine resin composition of the sixth aspect, wherein the polyamine resin comprises at least polyamine 610.

作為第8觀點為關於一種聚醯胺樹脂成形體,其係將第1觀點至第7觀點中任一觀點之聚醯胺樹脂組成物進行結晶化而成。 The eighth aspect of the invention relates to a polyamide resin molded article obtained by crystallizing a polyamide resin composition of any one of the first to seventh aspects.

本發明之聚醯胺樹脂組成物,藉由使用特定的苯基膦酸化合物之金屬鹽來作為成核劑,提高了聚醯胺樹脂之結晶化促進效果,進而,可提供一種成形加工性為優異的聚醯胺樹脂組成物、及將該聚醯胺樹脂組成物進行結晶化而得到之聚醯胺樹脂成形體。 The polyamine resin composition of the present invention can improve the crystallization promoting effect of the polyamide resin by using a metal salt of a specific phenylphosphonic acid compound as a nucleating agent, and further, can provide a form processability. An excellent polyamide resin composition and a polyamide resin molded article obtained by crystallizing the polyamide resin composition.

〔實施發明之最佳形態〕 [Best Practice for Carrying Out the Invention]

以下,對於本發明更詳細地進行說明。 Hereinafter, the present invention will be described in more detail.

<聚醯胺樹脂組成物> <Polyamine resin composition>

本發明之聚醯胺(以下亦稱為PA)樹脂組成物,係包含PA樹脂、及由苯基膦酸化合物之金屬鹽所成之成核劑所構成。 The polyamine (hereinafter also referred to as PA) resin composition of the present invention comprises a PA resin and a nucleating agent made of a metal salt of a phenylphosphonic acid compound.

〔PA樹脂〕 [PA resin]

作為本發明所使用之PA樹脂,可舉出由二胺與二元酸之聚合物所成、或由內醯胺或胺基羧酸之聚合物所成、或由該等的2種以上之共聚物所成者。 The PA resin to be used in the present invention may be a polymer of a diamine and a dibasic acid, a polymer of an indoleamine or an aminocarboxylic acid, or two or more of these. The copolymer is made.

作為前述二胺,可舉出例如四亞甲基二胺、六亞甲基二胺、八亞甲基二胺、九亞甲基二胺、十一亞甲基二胺、十二亞甲基二胺等的脂肪族二胺;間二甲苯二胺等的具有芳香族‧環狀構造的二胺等。 Examples of the diamine include tetramethylene diamine, hexamethylene diamine, octamethylene diamine, nonamethylene diamine, undecyl diamine, and dodecamethylene. An aliphatic diamine such as a diamine; a diamine having an aromatic ‧ ring structure such as m-xylene diamine;

作為前述二羧酸,可舉出例如己二酸、庚烷二羧酸、辛烷二羧酸、壬烷二羧酸、十一烷二羧酸、十二烷二羧酸等的脂肪族二羧酸;對苯二甲酸、間苯二甲酸等的具有芳香族‧環狀構造的二羧酸等。 Examples of the dicarboxylic acid include aliphatic two of adipic acid, heptane dicarboxylic acid, octane dicarboxylic acid, decane dicarboxylic acid, undecane dicarboxylic acid, and dodecane dicarboxylic acid. A carboxylic acid; a dicarboxylic acid having an aromatic ‧ ring structure such as terephthalic acid or isophthalic acid;

作為前述內醯胺,可舉出例如γ-丁內醯胺、ε-己內醯胺、ω-庚內醯胺、ω-月桂內醯胺等的碳原子數6至12的內醯胺類。 Examples of the intrinsic amine include an intrinsic amine having 6 to 12 carbon atoms such as γ-butyrolactam, ε-caprolactam, ω-glycolide, and ω-lauric acid. .

作為前述胺基羧酸,可舉出例如ε-胺基己酸、7-胺基庚酸、11-胺基十一烷酸、12-胺基十二烷酸等的碳原子數6至12的胺基羧酸。 The aminocarboxylic acid may, for example, have 6 to 12 carbon atoms such as ε-aminohexanoic acid, 7-aminoheptanoic acid, 11-aminoundecanoic acid or 12-aminododecanoic acid. Aminocarboxylic acid.

作為如此般的PA樹脂之具體例,可舉出聚醯胺6、聚醯胺11、聚醯胺12、聚醯胺46、聚醯胺66、聚醯胺610、聚醯胺612、聚醯胺1010、聚醯胺1212、聚醯胺4T、聚醯胺M5T、聚醯胺6T、聚醯胺6I、聚醯胺9T、聚醯胺10T、聚醯胺MXD6等的均聚物;聚醯胺6/66、聚醯胺6/12、聚醯胺11/12等的共聚物。其中,以聚醯胺610為較佳。 Specific examples of such a PA resin include polyamine 6, polyamide 11, polyamine 12, polyamine 46, polyamide 66, polyamide 610, polyamide 612, and polyfluorene. Homopolymer of amine 1010, polyamine 1212, polyamine 4T, polyamine M5T, polyamine 6T, polyamine 6I, polyamine 9T, polyamine 10T, polyamine MXD6, etc. Copolymer of amine 6/66, polyamidamine 6/12, polyamido 11/12, and the like. Among them, polyamine 610 is preferred.

該等的PA樹脂係可單獨使用1種,亦可併用2種以上。 These PA resins may be used alone or in combination of two or more.

作為該等PA樹脂係可適合使用市售者,可舉出例如Arkema(股)製Rilsan(註冊商標)系列、同Pebax(註冊商標)系列、同Hiprolon系列、Daicel-Evonik(股)製Daiamid系列、同Vestamid(註冊商標)系列、Toray(股)製Amilan系列、宇部興產(股)製UBE Nylon系列、同UBESTA系列、東洋紡織(股)製Glamide(註冊商標)系列、(股)Kuraray製Genestar系列、BASF公司製Ultramid(註冊商標)系列、三井化學(股)製Arlen系列等。 As such a PA resin, a commercially available person can be suitably used, and examples thereof include Rilsan (registered trademark) series manufactured by Arkema Co., Ltd., Pebax (registered trademark) series, Hiprolon series, and Daicel-Evonik (Daamimid series). , with the Vestamid (registered trademark) series, the Amilan series of the Toray (share) system, the UBE Nylon series made by Ube Industries Co., Ltd., the UBLSTA series, the Glamide (registered trademark) series of Toyo Textile Co., Ltd., and the Kuraray system. The Genestar series, the Ultramid (registered trademark) series manufactured by BASF, and the Arlen series manufactured by Mitsui Chemicals Co., Ltd.

又,作為本發明所使用之PA樹脂,係亦可為將PA均聚物或PA共聚物作為主體之與其他樹脂之共混聚合物。所謂其他樹脂可舉出後述之汎用的熱可塑性樹脂 /熱可塑性工程塑料、生物降解樹脂等。與其他樹脂之共混聚合物中,其他樹脂之含有量係以50質量%以下為較佳。 Further, the PA resin used in the present invention may be a polymer blended with other resins mainly comprising a PA homopolymer or a PA copolymer. The other resin may be a general-purpose thermoplastic resin to be described later. / Thermoplastic engineering plastics, biodegradable resins, etc. In the polymer blended with other resins, the content of the other resin is preferably 50% by mass or less.

作為前述汎用的熱可塑性樹脂/熱可塑性工程塑料,可舉出例如聚乙烯(PE)、聚乙烯共聚物、聚丙烯(PP)、聚丙烯共聚物、乙烯-丙烯共聚物、聚丁烯(PB)、乙烯-乙烯醇共聚物(EVOH)、乙烯-乙酸乙烯酯共聚物(EVA)、乙烯-丙烯酸乙酯共聚物(EEA)、聚(4-甲基-1-戊烯)等的聚烯烴樹脂;聚苯乙烯(PS)、高衝撃性聚苯乙烯(HIPS)、丙烯腈-苯乙烯共聚物(AS)、丙烯腈-丁二烯-苯乙烯共聚物(ABS)、甲基丙烯酸甲酯-苯乙烯共聚物(MS)等的聚苯乙烯系樹脂;聚甲基丙烯酸甲酯(PMMA)等的(甲基)丙烯酸樹脂;聚氯乙烯樹脂;聚偏二氯乙烯樹脂;聚胺基甲酸乙酯樹脂;聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯(PBT)、聚萘二甲酸乙二酯(PEN)、聚萘二甲酸丁二酯(PBN)等的聚酯樹脂;聚醯亞胺樹脂;聚碳酸酯樹脂;聚苯醚樹脂;改質聚苯醚樹脂;聚縮醛樹脂;聚碸樹脂;聚苯硫醚樹脂等。 Examples of the above-mentioned general-purpose thermoplastic resin/thermoplastic engineering plastics include polyethylene (PE), polyethylene copolymer, polypropylene (PP), polypropylene copolymer, ethylene-propylene copolymer, and polybutene (PB). Polyolefins such as ethylene-vinyl alcohol copolymer (EVOH), ethylene-vinyl acetate copolymer (EVA), ethylene-ethyl acrylate copolymer (EEA), poly(4-methyl-1-pentene) Resin; polystyrene (PS), high-impact polystyrene (HIPS), acrylonitrile-styrene copolymer (AS), acrylonitrile-butadiene-styrene copolymer (ABS), methyl methacrylate - polystyrene resin such as styrene copolymer (MS); (meth)acrylic resin such as polymethyl methacrylate (PMMA); polyvinyl chloride resin; polyvinylidene chloride resin; polyaminocarboxylic acid Ethyl resin; polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polybutylene naphthalate (PBN), etc. Polyester resin; polyimine resin; polycarbonate resin; polyphenylene ether resin; modified polyphenylene ether resin; polyacetal resin; polyfluorene resin; polyphenylene sulfide resin.

作為上述之生物降解樹脂,可舉出例如聚乙醇酸(PGA)、聚乳酸(PLA)、聚(3-羥基丁酸)(PHB)、3-羥基丁酸與3-羥基己酸之共聚物(PHBH)等的聚羥基脂肪酸酯;聚己內酯、聚琥珀酸丁二醇酯、聚琥珀酸/己二酸丁二醇酯、聚琥珀酸/碳酸丁二醇酯、聚琥 珀酸乙二醇酯、聚琥珀酸/己二酸乙二醇酯等的聚酯樹脂;聚乙烯醇;改性澱粉;乙酸纖維素;殼多糖;殼聚糖;木質素等。 Examples of the biodegradable resin include polyglycolic acid (PGA), polylactic acid (PLA), poly(3-hydroxybutyric acid) (PHB), and copolymers of 3-hydroxybutyric acid and 3-hydroxyhexanoic acid. Polyhydroxyalkanoates such as (PHBH); polycaprolactone, polybutylene succinate, polysuccinic acid/butylene adipate, polysuccinic acid/butylene carbonate, polysuccinate Polyester resin such as polyethylene glycolate, polysuccinic acid/ethylene adipate; polyvinyl alcohol; modified starch; cellulose acetate; chitin; chitosan;

〔苯基膦酸化合物之金屬鹽〕 [metal salt of phenylphosphonic acid compound]

本發明所使用之成核劑係由式〔1〕所表示之苯基膦酸化合物之金屬鹽所成。 The nucleating agent used in the present invention is a metal salt of a phenylphosphonic acid compound represented by the formula [1].

上述式〔1〕所表示之苯基膦酸化合物中,式中的R1及R2係分別獨立表示氫原子、碳原子數1至10的烷基、或碳原子數2至11的烷氧基羰基。尚,於此,碳原子數2至11的烷氧基羰基係指烷氧基的碳原子數為1至10的烷氧基羰基。 In the phenylphosphonic acid compound represented by the above formula [1], R 1 and R 2 in the formula each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 2 to 11 carbon atoms. Alkylcarbonyl. Here, the alkoxycarbonyl group having 2 to 11 carbon atoms means an alkoxycarbonyl group having 1 to 10 carbon atoms in the alkoxy group.

作為R1及R2中之前述碳原子數1至10的烷基,可舉出例如甲基、乙基、n-丙基、異丙基、n-丁基、異丁基、tert-丁基等。 Examples of the alkyl group having 1 to 10 carbon atoms in R 1 and R 2 include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, and a tert-butyl group. Base.

又,作為前述碳原子數2至11的烷氧基羰基,可舉出例如甲氧基羰基、乙氧基羰基等。 In addition, examples of the alkoxycarbonyl group having 2 to 11 carbon atoms include a methoxycarbonyl group and an ethoxycarbonyl group.

作為上述式〔1〕所表示之苯基膦酸化合物之具體例,可舉出苯基膦酸、4-甲基苯基膦酸、4-乙基苯基膦酸、4-n-丙基苯基膦酸、4-異丙基苯基膦酸、4-n-丁基 苯基膦酸、4-異丁基苯基膦酸、4-tert-丁基苯基膦酸、3,5-二甲氧基羰基苯基膦酸、3,5-二乙氧基羰基苯基膦酸、2,5-二甲氧基羰基苯基膦酸、2,5-二乙氧基羰基苯基膦酸等。該等化合物係可適合直接使用市售品。 Specific examples of the phenylphosphonic acid compound represented by the above formula [1] include phenylphosphonic acid, 4-methylphenylphosphonic acid, 4-ethylphenylphosphonic acid, and 4-n-propyl group. Phenylphosphonic acid, 4-isopropylphenylphosphonic acid, 4-n-butyl Phenylphosphonic acid, 4-isobutylphenylphosphonic acid, 4-tert-butylphenylphosphonic acid, 3,5-dimethoxycarbonylphenylphosphonic acid, 3,5-diethoxycarbonylbenzene Phosphonic acid, 2,5-dimethoxycarbonylphenylphosphonic acid, 2,5-diethoxycarbonylphenylphosphonic acid, and the like. These compounds are suitable for direct use of commercially available products.

作為形成前述苯基膦酸化合物之金屬鹽之金屬,係可使用1價、2價、及3價的金屬。又,亦可混合2種以上的金屬來使用。 As the metal forming the metal salt of the phenylphosphonic acid compound, a monovalent, divalent, or trivalent metal can be used. Further, two or more kinds of metals may be mixed and used.

作為形成上述金屬鹽之金屬之具體例,可舉出鋰、鈉、鉀、鎂、鈣、鋇、錳、鐵、鈷、鎳、銅、鋅、銀、鋁、錫等。該等藉由金屬所形成的金屬鹽之中,以鈣鹽、錳鹽、鋅鹽、錫鹽為較佳。於其中,就提高PA樹脂之結晶化速度、且可得到成形加工性為優異的PA樹脂組成物來看,特別以錳鹽為最佳。 Specific examples of the metal forming the metal salt include lithium, sodium, potassium, magnesium, calcium, barium, manganese, iron, cobalt, nickel, copper, zinc, silver, aluminum, tin, and the like. Among the metal salts formed by the metals, calcium salts, manganese salts, zinc salts and tin salts are preferred. Among them, in view of the PA resin composition which is excellent in the crystallization rate of the PA resin and which is excellent in moldability, a manganese salt is particularly preferable.

前述苯基膦酸化合物之金屬鹽之製造方法並無特別限制,一般係藉由將苯基膦酸化合物與前述金屬之氯化物、硫酸鹽、或硝酸鹽與氫氧化鈉等的鹼,在水中混合並使其進行反應,使苯基膦酸化合物之金屬鹽析出,並藉由進行過濾、乾燥從而可得到結晶性粉末。又,將苯基膦酸化合物與前述金屬之氧化物、氫氧化物、碳酸鹽、或與有機酸鹽,在水中或有機溶媒中混合並使其反應,之後藉由將溶媒進行過濾或餾除、乾燥從而亦可得到。 The method for producing the metal salt of the phenylphosphonic acid compound is not particularly limited, and is generally obtained by using a phenylphosphonic acid compound and a chloride, a sulfate, or a nitrate of the above metal with a base such as sodium hydroxide in water. The mixture is mixed and reacted to precipitate a metal salt of a phenylphosphonic acid compound, and a crystalline powder can be obtained by filtration and drying. Further, the phenylphosphonic acid compound is mixed with an oxide, a hydroxide, a carbonate or an organic acid salt of the above metal in water or an organic solvent, and then reacted, followed by filtration or distillation of the solvent. It can be obtained by drying.

所得到之粉末的形態係通常成為粒狀結晶、板狀結晶、棒狀結晶、針狀結晶等,進而有時成為該等的結晶為層合的形態。 The form of the obtained powder is usually a granular crystal, a plate crystal, a rod crystal, a needle crystal, or the like, and may be a form in which the crystals are laminated.

就該等的化合物(結晶性粉末)目前市售之情形,可使用市售品。 Commercially available products can be used in the case where such compounds (crystalline powders) are currently commercially available.

上述苯基膦酸化合物之金屬鹽之形成時,苯基膦酸化合物與金屬之化學計量比並無特別限制,一般而言作為苯基膦酸化合物/金屬之化學計量比,以在1/2~2/1的範圍內來使用為較佳。苯基膦酸化合物之金屬鹽中以不包含未形成鹽的游離的苯基膦酸化合物或金屬為較佳。 When the metal salt of the above phenylphosphonic acid compound is formed, the stoichiometric ratio of the phenylphosphonic acid compound to the metal is not particularly limited, and is generally a stoichiometric ratio of the phenylphosphonic acid compound/metal to 1/2 It is preferred to use it within the range of ~2/1. The metal salt of the phenylphosphonic acid compound is preferably a free phenylphosphonic acid compound or metal which does not contain an unformed salt.

前述苯基膦酸化合物之金屬鹽之平均粒子徑係以10μm以下為較佳,又較佳為5μm以下。於此,平均粒子徑(μm)係藉由基於Mie理論之雷射繞射‧散射法來進行測定所得之50%體積徑(中值粒徑)。平均粒子徑越小,則有結晶化速度越快之傾向故為較佳。 The average particle diameter of the metal salt of the phenylphosphonic acid compound is preferably 10 μm or less, and more preferably 5 μm or less. Here, the average particle diameter (μm) is a 50% by volume (median diameter) measured by a laser diffraction ‧ scattering method based on the Mie theory. The smaller the average particle diameter, the better the crystallization rate tends to be.

為了將苯基膦酸化合物之金屬鹽之平均粒子徑設為10μm以下,可將上述之方法所得到之結晶性粉末,因應所需利用均勻器、亨舍爾攪拌機(HENSCHEL MIXER)、Loedige mixer等的具有剪切力之混合機、或球磨機、棒盤粉碎機、粉碎機、inomizer粉碎機、噴射磨機等的乾式粉碎機來製成微粉末。又,使用水、能與水混合的有機溶媒、及該等的混合溶液並利用球磨機、珠磨機、砂磨機、研磨機等濕式粉碎機亦可製成微粉末。 In order to set the average particle diameter of the metal salt of the phenylphosphonic acid compound to 10 μm or less, the crystal powder obtained by the above method can be used in a uniformizer, a Henschel mixer (HENSCHEL MIXER), a Loedige mixer, etc., as needed. A dry mill having a shearing force, or a ball mill, a bar mill, a pulverizer, an inomizer pulverizer, a jet mill, or the like, to prepare a fine powder. Further, a fine powder can also be produced by using a water, an organic solvent which can be mixed with water, and a mixed solution thereof, and using a wet pulverizer such as a ball mill, a bead mill, a sand mill or a grinder.

前述苯基膦酸化合物之金屬鹽之添加量,相對於PA樹脂100質量份為0.001~10質量份,較佳為0.01~5質量份,又較佳為0.1~2質量份。藉由將添加量設為0.001質量份以上,從而可得到充分的結晶化速度。 又,即使是超過10質量份,也並不能進一步加快結晶化速度,故在10質量份以下來使用就經濟上是有利的。 The amount of the metal salt of the phenylphosphonic acid compound added is 0.001 to 10 parts by mass, preferably 0.01 to 5 parts by mass, more preferably 0.1 to 2 parts by mass, per 100 parts by mass of the PA resin. By setting the addition amount to 0.001 part by mass or more, a sufficient crystallization rate can be obtained. Moreover, even if it exceeds 10 mass parts, the crystallization rate cannot be further accelerated, and it is economically advantageous to use it in 10 mass parts or less.

〔其他的添加劑〕 [Other additives]

本發明之PA樹脂組成物中,只要是無損及本發明之效果,亦可條配周知的無機填充劑。作為無機填充劑,可舉出例如玻璃纖維、碳纖維、滑石、雲母、矽石、高嶺土、黏土、矽灰石、玻璃珠粒、玻璃薄片、鈦酸鉀、碳酸鈣、硫酸鎂、氧化鈦等。該等的無機填充劑之形狀係可為纖維狀、粒狀、板狀、針狀、球狀、粉末中任一。該等的無機填充劑係可相對於PA樹脂100質量份為300質量份以內進行使用。 The PA resin composition of the present invention may be blended with a well-known inorganic filler as long as it does not impair the effects of the present invention. Examples of the inorganic filler include glass fiber, carbon fiber, talc, mica, vermiculite, kaolin, clay, apatite, glass beads, glass flakes, potassium titanate, calcium carbonate, magnesium sulfate, and titanium oxide. The shape of the inorganic filler may be any of a fibrous form, a granular form, a plate shape, a needle shape, a spherical shape, and a powder. These inorganic fillers can be used within 300 parts by mass of 100 parts by mass of the PA resin.

本發明之PA樹脂組成物中,只要是不損及本發明之效果,亦可調配周知的阻燃劑。作為阻燃劑,可舉出例如溴系或氯系等的鹵素系阻燃劑;三氧化銻、五氧化銻等的銻系阻燃劑;氫氧化鋁、氫氧化鎂、聚矽氧系化合物等的無機系阻燃劑;紅磷、磷酸酯類、聚磷酸銨、磷腈等的磷系阻燃劑;三聚氰胺、蜜白胺、蜜勒胺、三聚二氰胺、氰尿酸三聚氰胺、磷酸三聚氰胺、焦磷酸三聚氰胺、聚磷酸三聚氰胺、聚磷酸三聚氰胺‧蜜白胺‧蜜勒胺複鹽、烷基膦酸三聚氰胺、苯基膦酸三聚氰胺、硫酸三聚氰胺、甲磺酸蜜白胺等的三聚氰胺系阻燃劑;PTFE等的氟樹脂等。該等的阻燃劑係可相對於PA樹脂100質量份為200質量份以內進行使用。 The PA resin composition of the present invention may be blended with a known flame retardant as long as it does not impair the effects of the present invention. Examples of the flame retardant include a halogen-based flame retardant such as bromine or chlorine; an antimony-based flame retardant such as antimony trioxide or antimony pentoxide; and aluminum hydroxide, magnesium hydroxide, and polyoxymethane compound. Inorganic flame retardants; phosphorus-based flame retardants such as red phosphorus, phosphates, ammonium polyphosphate, phosphazene; melamine, melam, melem, melamine, melamine cyanurate, phosphoric acid Melamine resistance of melamine, melamine pyrophosphate, melamine polyphosphate, melamine polyphosphate, melamamine ‧ melemamine double salt, alkyl phosphinate melamine, phenylphosphonic acid melamine, melamine sulfate, meyl sulfamate A flammable agent such as PTFE or the like. These flame retardants can be used within 200 parts by mass of 100 parts by mass of the PA resin.

進而,本發明之PA樹脂組成物中,只要不損及本發明之效果,因應所需亦可適當調配一般所添加之添加劑例如末端密封劑、水解抑制劑、熱穩定劑、光穩定劑、熱線吸收劑、紫外線吸收劑、抗氧化劑、衝撃改良劑、可塑劑、相溶化劑、矽烷系、鈦系、鋁系等的各種偶合劑、發泡劑、防靜電劑、脫模劑、滑劑、抗菌抗黴劑、顏料、染料、香料、其他的各種填充劑、其他的成核劑、其他的熱可塑性樹脂等。 Further, in the PA resin composition of the present invention, as long as the effects of the present invention are not impaired, generally added additives such as an end sealant, a hydrolysis inhibitor, a heat stabilizer, a light stabilizer, and a hot wire may be appropriately formulated as needed. Absorbent, ultraviolet absorber, antioxidant, scouring improver, plasticizer, compatibilizer, decane, titanium, aluminum, etc., various coupling agents, foaming agents, antistatic agents, mold release agents, lubricants, Antibacterial and antifungal agents, pigments, dyes, perfumes, various other fillers, other nucleating agents, other thermoplastic resins, and the like.

〔聚醯胺樹脂組成物之製造方法〕 [Method for Producing Polyamide Resin Composition]

本發明之PA樹脂組成物係可藉由混合前述PA樹脂與由前述苯基膦酸化合物之金屬鹽所成之成核劑來製造。作為成核劑之混合方法並無特別限制,可舉出例如於成形前在含有PA樹脂或PA樹脂與其他的添加劑之組成物中混合成核劑之方法、於成形時在含有PA樹脂或PA樹脂與其他的添加劑之組成物中混合成核劑之方法(例如側進料SIDE FEED)等。又,製造PA樹脂時,亦可在二胺、及二羧酸或其活性化體之單體中混合成核劑來製造PA樹脂組成物。 The PA resin composition of the present invention can be produced by mixing the above PA resin with a nucleating agent made of the metal salt of the aforementioned phenylphosphonic acid compound. The method of mixing the nucleating agent is not particularly limited, and examples thereof include a method of mixing a nucleating agent with a composition containing a PA resin or a PA resin and another additive before molding, and a PA resin or PA at the time of molding. A method of mixing a nucleating agent with a composition of a resin and other additives (for example, side feed SIDE FEED). Further, when the PA resin is produced, a nucleating agent may be mixed with a monomer of a diamine, a dicarboxylic acid or an activated product thereof to produce a PA resin composition.

作為本發明之PA樹脂組成物,係以降溫結晶化溫度(在將熔融狀態的樹脂組成物冷卻的過程中樹脂進行結晶化之溫度)Tcc為188℃以上為較佳,以191℃以上為又較佳。 The PA resin composition of the present invention is preferably a temperature at which the temperature is lowered (the temperature at which the resin is crystallized during cooling of the resin composition in a molten state) Tcc is preferably 188 ° C or higher, and more preferably 191 ° C or higher. Preferably.

<聚醯胺樹脂成形體> <Polyamine resin molded body>

本發明之PA樹脂成形體係包含已結晶化的前述PA樹脂、及由前述苯基膦酸化合物之金屬鹽所成之成核劑所構成。又,作為本發明之PA樹脂成形體之球晶徑,係以30μm以下為較佳,以20μm以下為又較佳。藉由將球晶徑設為30μm以下,可得到表面更平滑的PA樹脂成形體。 The PA resin molding system of the present invention comprises the crystallized PA resin and a nucleating agent made of the metal salt of the phenylphosphonic acid compound. In addition, the spherulite diameter of the PA resin molded body of the present invention is preferably 30 μm or less, and more preferably 20 μm or less. By setting the spherulite diameter to 30 μm or less, a PA resin molded body having a smoother surface can be obtained.

如此般的PA樹脂成形體係可藉由例如使用本發明之PA樹脂組成物,並使此者中所包含之PA樹脂進行結晶化而得到。作為使PA樹脂進行結晶化之方法並無特別限制,例如在將PA樹脂組成物成形為指定的形狀的過程中,將前述PA樹脂組成物加熱至結晶化溫度以上後,進行冷卻即可。又,在上述過程中,將前述PA樹脂組成物加熱至結晶化溫度以上後,進行急冷並以非晶質狀態作成成形體,再加熱此者亦可以進行結晶化。 Such a PA resin molding system can be obtained, for example, by using the PA resin composition of the present invention and crystallizing the PA resin contained in the above. The method of crystallizing the PA resin is not particularly limited. For example, in the process of molding the PA resin composition into a predetermined shape, the PA resin composition may be heated to a crystallization temperature or higher and then cooled. Further, in the above process, after the PA resin composition is heated to a temperature higher than the crystallization temperature, it is rapidly cooled and formed into a molded body in an amorphous state, and further heated to carry out crystallization.

本發明之PA樹脂成形體係具有優異的機械性強度及耐熱性。 The PA resin molding system of the present invention has excellent mechanical strength and heat resistance.

形成本發明之PA樹脂組成物時,藉由使用一般的射出成形、吹塑成形、真空成形、壓縮成形等的慣用的成形法,可容易地製造各種成形品。 When the PA resin composition of the present invention is formed, various molded articles can be easily produced by a conventional molding method such as general injection molding, blow molding, vacuum molding, or compression molding.

〔實施例〕 [Examples]

以下,可舉出實施例來更具體的說明本發明,但本發明並非被限定於下述之實施例者。 Hereinafter, the present invention will be specifically described by way of Examples, but the present invention is not limited to the examples described below.

尚,實施例中,樣品之調製及物性之分析所使用的裝置及條件係如以下般。 In the examples, the apparatus and conditions used for the preparation of the sample and the analysis of the physical properties are as follows.

(1)示差掃瞄熱量測定(DSC) (1) Differential Scanning Calorimetry (DSC)

裝置:(股)Perkinelmer JAPAN製Diamond DSC Device: (share) Perkinelmer JAPAN made Diamond DSC

又,代號係表示以下之意。 Also, the code name indicates the following.

PA610:聚醯胺610〔Daicel-Evonik(股)製Vestamid(註冊商標)Terra HS16 Natural〕 PA610: Polyamide 610 [Vestamid (registered trademark) Terra HS16 Natural by Daicel-Evonik Co., Ltd.]

PPA:苯基膦酸〔日產化學工業(股)製〕 PPA: phenylphosphonic acid [Nissan Chemical Industry Co., Ltd.]

PPA-Zn:苯基膦酸鋅〔日產化學工業(股)製Eco-promote(註冊商標)〕 PPA-Zn: Zinc Phenylphosphonate (Eco-promote (registered trademark) manufactured by Nissan Chemical Industries Co., Ltd.)

HFIPA:1,1,1,3,3,3-六氟-2-丙醇 HFIPA: 1,1,1,3,3,3-hexafluoro-2-propanol

〔製造例1〕苯基膦酸鈣(PPA-Ca)之製造 [Production Example 1] Production of calcium phenylphosphonate (PPA-Ca)

在具備有攪拌機的反應容器中,裝入氯化鈣二水合物[和光純藥工業(股)製]7.4g(50mmol)及水100g,攪拌後成為均勻的溶液。接著,對在室溫(大約23℃)進行攪拌之該溶液,加入使PPA7.8g(50mmol)及氫氧化鈉4.2g(105mmol)溶解在水68g中之溶液,進而攪拌1小時。藉由減壓過濾,過濾取得所生成的固體並進行水洗。藉由將所得到之濕品在200℃下乾燥6小時,從而可得到作為目的之白色粉末的苯基膦酸鈣(PPA-Ca)。 In a reaction vessel equipped with a stirrer, 7.4 g (50 mmol) of calcium chloride dihydrate [manufactured by Wako Pure Chemical Industries, Ltd.] and 100 g of water were placed, and the mixture was stirred to obtain a uniform solution. Next, to the solution which was stirred at room temperature (about 23 ° C), a solution of 7.8 g (50 mmol) of PPA and 4.2 g (105 mmol) of sodium hydroxide dissolved in 68 g of water was added, and the mixture was further stirred for 1 hour. The resulting solid was collected by filtration under reduced pressure and washed with water. The obtained wet product was dried at 200 ° C for 6 hours to obtain a calcium phenylphosphonate (PPA-Ca) as a target white powder.

〔製造例2〕苯基膦酸錳(PPA-Mn)之製造 [Manufacturing Example 2] Production of Manganese Phenylphosphonate (PPA-Mn)

除了使用氯化錳四水合物〔和光純藥工業(股)製〕9.9g(50mmol),來替代氯化鈣二水合物以外,與製造例1相同地操作,從而可得到作為目的之淺粉紅色粉末的苯基膦酸錳(PPA-Mn)。 In the same manner as in Production Example 1, except that 9.9 g (50 mmol) of manganese chloride tetrahydrate (manufactured by Wako Pure Chemical Industries, Ltd.) was used instead of calcium chloride dihydrate, a pale pink as a purpose was obtained. Color powder of manganese phenylphosphonate (PPA-Mn).

尚,所得到之苯基膦酸錳在乾燥後當下為酐,但在空氣環境下、在室溫(大約23℃)係成為一水合物。 Further, the obtained phenylphosphonate is an anhydride immediately after drying, but is monohydrate at room temperature (about 23 ° C) in an air atmosphere.

〔製造例3〕苯基膦酸錫(PPA-Sn)之製造 [Production Example 3] Production of tin phenylphosphinate (PPA-Sn)

除了使用氯化錫(II)[和光純藥工業(股)製]9.5g(50mmol),來替代氯化鈣二水合物以外,與製造例1相同地操作,可得到作為目的之象牙色粉末的苯基膦酸錫(PPA-Sn)。 An ivory powder as a target can be obtained in the same manner as in Production Example 1, except that 9.5 g (50 mmol) of tin chloride (II) [manufactured by Wako Pure Chemical Industries, Ltd.] is used instead of calcium chloride dihydrate. Tin phenylphosphonate (PPA-Sn).

〔實施例1~4〕 [Examples 1 to 4]

相對於100質量份之PA610,加入作為成核劑之表1所記載的化合物0.5質量份、及HFIPA900質量份,藉由利用超音波洗淨器(輸出150W),在室溫(大約23℃)下進行超音波照射30分鐘,從而得到聚醯胺樹脂組成物。 0.5 parts by mass of the compound described in Table 1 as a nucleating agent and 900 parts by mass of HFIPA were added to 100 parts by mass of PA610 by using an ultrasonic cleaner (output 150 W) at room temperature (about 23 ° C). Ultrasonic irradiation was performed for 30 minutes to obtain a polyamide resin composition.

藉由將該樹脂組成物滴入至60℃的加熱板上並使溶媒蒸發,從而得到包含成核劑之非晶(非晶質)狀態之聚醯胺樹脂薄膜狀成形體。 The resin composition was dropped onto a hot plate at 60° C. and the solvent was evaporated to obtain a polyimide film-form molded body in an amorphous (amorphous) state containing a nucleating agent.

對於所得到之非晶薄膜狀成形體,依據以下之程序來測定降溫結晶化溫度(Tcc)及半結晶化時間(t1/2)。將 結果合併表示於表1中。 The temperature-lowering crystallization temperature (Tcc) and the half-crystallization time (t 1/2 ) of the obtained amorphous film-like molded body were measured according to the following procedure. The results are combined and shown in Table 1.

〔降溫結晶化溫度(Tcc)〕 [cooling crystallization temperature (Tcc)]

從非晶薄膜狀成形體切出大約2mg。使用DSC將該薄膜片以100℃/分昇溫至250℃,並直接在250℃保持1分鐘後,測定以20℃/分來進行冷卻時,所觀測到來自於聚醯胺之結晶化的發熱(結晶化焓△Hc)波峰頂點之溫度作為降溫結晶化溫度(Tcc)。Tcc的值越大,在相同條件下的結晶化速度越快,表示作為成核劑具有優異的效果。 About 2 mg was cut out from the amorphous film-like formed body. The film sheet was heated to 250 ° C at 100 ° C /min by DSC, and immediately after being kept at 250 ° C for 1 minute, when the measurement was carried out at 20 ° C / min, the heat of crystallization from polyamine was observed. The temperature at the peak of the peak of (crystallization 焓 ΔHc) is taken as the temperature crystallization temperature (Tcc). The larger the value of Tcc, the faster the crystallization rate under the same conditions, indicating that it has an excellent effect as a nucleating agent.

〔半結晶化時間(t1/2)〕 [semi-crystallization time (t 1/2 )]

從非晶薄膜狀成形體切出大約2mg。使用DSC將該薄膜片以100℃/分昇溫至250℃,並直接在250℃保持1分鐘,接著,測定以100℃/分冷卻至150℃,並直接保持在150℃時,到達150℃之後來自於聚醯胺之結晶化的發熱(結晶化焓△Hc)達到波峰為止的時間作為半結晶化時間(t1/2)。t1/2的值越小,在相同條件下的結晶化速度越快,表示作為成核劑具有優異的效果。 About 2 mg was cut out from the amorphous film-like formed body. The film piece was heated to 250 ° C at 100 ° C / min using DSC, and kept at 250 ° C for 1 minute, then measured to cool to 150 ° C at 100 ° C / min, and directly maintained at 150 ° C, after reaching 150 ° C The time from the crystallization of polyamine to the crystallization (crystallization 焓 ΔHc) reaching the peak was taken as the half crystallization time (t 1/2 ). The smaller the value of t 1/2 is, the faster the crystallization rate under the same conditions is, indicating that it has an excellent effect as a nucleating agent.

〔比較例1〕 [Comparative Example 1]

除了不添加成核劑以外,係與實施例1進行相同地操作、評估。將結果合併表示於表1中。 The operation and evaluation were carried out in the same manner as in Example 1 except that the nucleating agent was not added. The results are combined and shown in Table 1.

〔參考例〕 [Reference example]

除了將成核劑變更成滑石〔Nippon-talc(股)製Micro-aceP-8〕以外,係與實施例1進行相同地操作、評估。將結果合併表示於表1中。 The operation and evaluation were carried out in the same manner as in Example 1 except that the nucleating agent was changed to talc (Micro-ace P-8 manufactured by Nippon-talc Co., Ltd.). The results are combined and shown in Table 1.

由表1之結果可確認到,相較於未加入成核劑者(比較例1),作為成核劑使用特定的苯基膦酸化合物之金屬鹽者(實施例1~4)係顯示出高的Tcc及快的t1/2,具有結晶化促進效果。特別是可確認到使用苯基膦酸錳者,即使是與使用以往所使用的滑石(參考例)者相比,亦顯示出高的Tcc及快的t1/2,具有極為優異的結晶化促進效果。 From the results of Table 1, it was confirmed that the metal salt of a specific phenylphosphonic acid compound (Examples 1 to 4) was used as a nucleating agent as compared with the case where no nucleating agent was added (Comparative Example 1). High Tcc and fast t 1/2 have a crystallization promoting effect. In particular, it has been confirmed that the use of manganese phenylphosphonate exhibits a high Tcc and a fast t 1/2 even when compared with the conventionally used talc (reference example), and has extremely excellent crystallization. Promote the effect.

即,藉由在聚醯胺樹脂中作為成核劑添加特定的苯基膦酸化合物之金屬鹽,提高了聚醯胺樹脂之結晶化速度,且可提供耐熱性、成形加工性為優異的聚醯胺樹脂組成物。 In other words, by adding a metal salt of a specific phenylphosphonic acid compound as a nucleating agent to the polyamine resin, the crystallization rate of the polyamide resin is improved, and the heat resistance and the moldability are excellent. A guanamine resin composition.

Claims (8)

一種聚醯胺樹脂組成物,其係包含聚醯胺樹脂、及由式〔1〕所表示之苯基膦酸化合物之金屬鹽所成之成核劑, (式中,R1及R2係分別獨立表示氫原子、碳原子數1至10的烷基、或碳原子數2至11的烷氧基羰基)。 A polyamine resin composition comprising a polyamine resin and a nucleating agent formed from a metal salt of a phenylphosphonic acid compound represented by the formula [1], (wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxycarbonyl group having 2 to 11 carbon atoms). 如請求項1之聚醯胺樹脂組成物,其中,前述苯基膦酸化合物之金屬鹽係選自由鋰鹽、鈉鹽、鉀鹽、鎂鹽、鈣鹽、鋇鹽、錳鹽、鐵鹽、鈷鹽、鎳鹽、銅鹽、鋅鹽、銀鹽、鋁鹽、及錫鹽所成群之至少一種的金屬鹽。 The polyamine resin composition of claim 1, wherein the metal salt of the phenylphosphonic acid compound is selected from the group consisting of a lithium salt, a sodium salt, a potassium salt, a magnesium salt, a calcium salt, a barium salt, a manganese salt, and an iron salt. a metal salt of at least one of a group consisting of a cobalt salt, a nickel salt, a copper salt, a zinc salt, a silver salt, an aluminum salt, and a tin salt. 如請求項2之聚醯胺樹脂組成物,其中,前述苯基膦酸化合物之金屬鹽係選自由鈣鹽、錳鹽、鋅鹽、及錫鹽所成群之至少一種的金屬鹽。 The polyamine resin composition of claim 2, wherein the metal salt of the phenylphosphonic acid compound is selected from the group consisting of a metal salt of at least one of a calcium salt, a manganese salt, a zinc salt, and a tin salt. 如請求項3之聚醯胺樹脂組成物,其中,前述苯基膦酸化合物之金屬鹽為錳鹽。 The polyamine resin composition of claim 3, wherein the metal salt of the phenylphosphonic acid compound is a manganese salt. 如請求項1至請求項4中任一項之聚醯胺樹脂組成物,其中,前述成核劑之含有量相對於前述聚醯胺樹脂100質量份為0.001~10質量份。 The polyamine resin composition of any one of Claims 1 to 4, wherein the content of the nucleating agent is 0.001 to 10 parts by mass based on 100 parts by mass of the polyamide resin. 如請求項1至請求項5中任一項之聚醯胺樹脂組成物,其中,前述聚醯胺樹脂係包含選自由聚醯胺6、聚 醯胺11、聚醯胺12、聚醯胺46、聚醯胺66、聚醯胺610、聚醯胺612、聚醯胺1010、聚醯胺1212、聚醯胺4T、聚醯胺M5T、聚醯胺6T、聚醯胺6I、聚醯胺9T、聚醯胺10T、及聚醯胺MXD6所成群之至少一種。 The polyamine resin composition according to any one of claims 1 to 5, wherein the polyamine resin is selected from the group consisting of polyamines and poly Guanamine 11, Polyamide 12, Polyamide 46, Polyamide 66, Polyamide 610, Polyamide 612, Polyamide 1010, Polyamide 1212, Polyamine 4T, Polyamide M5T, Poly At least one of the group consisting of guanamine 6T, polyamido 6I, polyamidamine 9T, polydecylamine 10T, and polyamidamine MXD6. 如請求項6之聚醯胺樹脂組成物,其中,前述聚醯胺樹脂係至少包含聚醯胺610。 The polyamine resin composition of claim 6, wherein the polyamine resin comprises at least polyamine 610. 一種聚醯胺樹脂成形體,其係將請求項1至請求項7中任一項之聚醯胺樹脂組成物進行結晶化而成。 A polyamide resin molded article obtained by crystallizing the polyamidamide resin composition according to any one of claims 1 to 7.
TW106103499A 2016-02-01 2017-02-02 Polyamide resin composition containing metal salt of phenylphosphonic acid compound TW201741393A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016017040 2016-02-01

Publications (1)

Publication Number Publication Date
TW201741393A true TW201741393A (en) 2017-12-01

Family

ID=59500288

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106103499A TW201741393A (en) 2016-02-01 2017-02-02 Polyamide resin composition containing metal salt of phenylphosphonic acid compound

Country Status (3)

Country Link
JP (1) JP6908892B2 (en)
TW (1) TW201741393A (en)
WO (1) WO2017135189A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6849939B2 (en) * 2016-07-14 2021-03-31 日産化学株式会社 Aromatic polyetherketone resin composition containing a phosphonate metal salt
CN109666294B (en) * 2018-12-27 2021-08-20 会通新材料(上海)有限公司 Polyamide 56 composition with improved crystallization rate and application thereof
CN114085519B (en) * 2021-11-26 2023-12-19 上海金发科技发展有限公司 Polyamide composition and preparation method and application thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE789440A (en) * 1971-09-30 1973-03-29 Ciba Geigy MANGANESE (II) SALTS OF PHOSPHONIC HEMI-ESTERS USED AS POLYAMIDE STABILIZERS
JPH0723448B2 (en) * 1986-10-03 1995-03-15 旭化成工業株式会社 Polyamide resin composition
US8445718B2 (en) * 2009-05-12 2013-05-21 Nissan Chemical Industries, Ltd. Method for producing phosphonic acid metal salt fine particles
CN102482303B (en) * 2009-09-09 2015-07-22 日产化学工业株式会社 Method For Producing Metal Phosphonate And Thermoplastic Resin Composition Containing Metal Phosphonate
TWI631163B (en) * 2011-09-30 2018-08-01 日產化學工業股份有限公司 Poly(3-hydroxalkanoate)resin composition
JP2016222742A (en) * 2013-10-30 2016-12-28 日産化学工業株式会社 Polylactic acid resin composition excellent in hydrolysis resistance

Also Published As

Publication number Publication date
JP6908892B2 (en) 2021-07-28
WO2017135189A1 (en) 2017-08-10
JPWO2017135189A1 (en) 2018-11-22

Similar Documents

Publication Publication Date Title
TWI488859B (en) Method for producing metal phosphonate and thermoplastic resin composition containing metal phosphonate
JP5958713B2 (en) Poly (3-hydroxyalkanoate) resin composition
JP4973848B2 (en) Polylactic acid resin composition
JP6908892B2 (en) Polyamide resin composition containing a metal salt of a phenylphosphonic acid compound
TW201912771A (en) Synergistic flame retardant combinations for polymer compositions and the use thereof
US10899720B2 (en) Polyester resin composition containing amino-triazine derivative
JP6849953B2 (en) Polyamide resin composition containing a carboxylic acid derivative
WO2012011576A1 (en) Crystalline resin composition
JP2012236867A (en) Method for producing crystal nucleating agent for resin
JP6849939B2 (en) Aromatic polyetherketone resin composition containing a phosphonate metal salt
US9035100B2 (en) Method for producing phenylphosphonic acid metal salt composition, and crystal nucleating agent therefrom
JP2008063512A (en) Polylactic acid ionomer resin and its production method, polylactic acid ionomer resin composition
JP5477567B2 (en) Polylactic acid resin composition