TW201737501A - Electrical module and method for forming electrical module - Google Patents

Abstract

An electrical module according to the present invention includes a conductive material which contacts a semiconductive electrode placed on a surface of a first substrate and contacts an opposite electrode placed on a surface of a second substrate and is arranged between the semiconductive electrode and the opposite electrode. The conductive material includes a conductive particle enabling conduction between the semiconductive electrode and the opposite electrode. Some or all part of the conductive particle contacts both the semiconductive electrode and the opposite electrode and penetrates into at least one of the semiconductive electrode and the opposite electrode.

Description

Electrical module and method of manufacturing the same

The invention relates to a method for manufacturing an electrical module and an electrical module. The priority of the Japanese Patent Application No. 2016-161884, filed on Jan.

In recent years, solar cells have attracted attention as power generation devices for clean energy, and the development of solar cells and dye-sensitized solar cells has continued to advance. The dye-sensitized solar cell has high photoelectric conversion efficiency and is easy to mass-produce, so that its structure and manufacturing method have been extensively studied.

In an electrical module in which the above-described dye-sensitized solar cell is required to be sealed, when a plurality of cells are arranged in the same plane, for example, between adjacent cells, in order to connect the first electrode to the first electrode The lower side electrode of the two units is electrically connected, and an element such as an electrolyte is sealed between the electrodes to form a structure of "a sealing material/conducting material (for example, a lead wire, a conductive paste, etc.)/sealing material".

For example, in Patent Document 1, there is disclosed a photoelectric conversion module which will The photoelectric conversion elements including the transparent electrode, the counter electrode, and the sealing insulating portion that is sealed and insulated by the electrodes are arranged in the same plane. In the photoelectric conversion module, in order to electrically connect adjacent photoelectric conversion elements to each other, a part of the transparent electrode member of the first photoelectric conversion element and a part of the opposite electrode member of the second photoelectric conversion element are opposed to each other The conductive material is disposed between the first and second photoelectric conversion elements. Thereby, a series structure between a plurality of cells is formed.

In the conventional electric module represented by the photoelectric conversion element disclosed in Patent Document 1, a metal wire or the like is used as the conductive material, and there is a problem in that the unit is cut by laser or ultrasonic fusion. At this time, it is difficult to cut the conductive material, and it takes time to cut the unit.

As a method for solving the above problems, a method of electrically connecting using a conductive paste having a conductive filler as an adhesive is known.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2001-357897

However, the conventional conductive paste does not have an electrical conductivity sufficient to ensure electrical connection of the photoelectric conversion elements in the electrical module to each other. Specifically, the conventional conductive paste has a problem that the followability to a substrate such as a film is low, and when the conductive paste is peeled off from the substrate, the contact between the conductive paste and the substrate cannot be obtained. Therefore, the use of an electrical module having a conductive paste has a problem of low quality stability.

The present invention has been made in view of the above circumstances, and provides a method capable of ensuring cutting off Electrical modules and methods for manufacturing electrical modules with ease of use and high quality.

The electrical module of the present invention is characterized in that: the conductive material is connected to the first electrode on the first substrate and the second electrode on the second substrate, and is disposed on the first electrode and the second Between the electrodes, the conductive material includes conductive particles capable of conducting between the first electrode and the second electrode, and some or all of the conductive particles are in contact with both the first electrode and the second electrode, and At least one of the first electrode and the second electrode is absent.

According to the above configuration, for example, when a conductive material (or a conductive paste before curing of the conductive material) is disposed between the electrodes constituting the electric module, the conductive particles are dispersed in the extending direction of the electrode. Thereby, the conductive particles in the extending direction of the electrode are relatively soft to each other and are easily cut.

Further, in the thickness direction between the electrodes, the contact between the electrodes is easily and surely obtained by the portion of the conductive particles that is immersed in at least one of the first electrode and the second electrode, and the electrodes are electrically connected to each other. Further, by the conductive particles "incorporating" at least one of the first electrode and the second electrode, the bonding strength between the conductive particles and the electrode is improved, and the electrode is less likely to peel off from the conductive material containing the conductive particles, and the relative position of the electrode and the conductive material The relationship is not easily deviated, and the thickness dimension between the electrodes can be kept constant for a long time. Thereby, the electrical conductivity of the electrical module can be surely maintained, and the quality is stabilized.

In the electric module of the present invention, it is preferable that some or all of the conductive particles pass through either or both of the first electrode and the second electrode.

According to the above configuration, the conductive particles penetrate through either or both of the first electrode and the second electrode, whereby the conductive particles are in contact with the electrode as a whole in the thickness direction, so that the conductive particles are electrically conductive. The conduction between the particles and the electrodes becomes better. Thereby, the electrical conductivity of the electrical module can be more reliably maintained, and the quality is more stably stabilized.

In the electrical module of the present invention, preferably, some or all of the conductive particles are in contact with both the first electrode and the second electrode, and are not included in the first substrate and the second substrate. Both or either.

According to the above configuration, the conductive particles are in contact with both the first electrode and the second electrode, thereby forming the contact between the first electrode and the conductive particles and the contact between the second electrode and the conductive particles, thereby making it easier And the contacts between the electrodes are surely obtained, so that the electrodes are electrically connected to each other. Further, at least a part of the conductive particles "do not enter" either or both of the first substrate and the second substrate, whereby the area and thickness of the conductive particles in contact with the electrode become larger, and thus the conductive particles The bonding strength with the electrode is further improved. Thereby, the electrical conductivity of the electrical module can be more reliably maintained, and the quality is more stably stabilized.

In the electric module of the present invention, preferably, the distance between the first electrode and the second electrode is 30% or more and 250% or less of an average particle diameter of the group of the conductive particles.

According to the above configuration, the first electrode and the second electrode are in such a manner that one or all of the conductive particles are in contact with both the first electrode and the second electrode and are not included in at least one of the first electrode and the second electrode. The distance becomes suitable. Therefore, only a part of the adhesive between the conductive particles in the extending direction of the electrode is relatively soft and is easily cut. Moreover, the electrical conductivity of the electrical module can be reliably maintained, and the quality is stabilized.

In the electrical module of the present invention, the conductive material may further include an auxiliary conductive material having a diameter smaller than a distance between the first electrode and the second electrode in a thickness direction.

According to the above configuration, since the auxiliary conductive material is disposed between the conductive particles between the electrodes, the contacts between the electrodes are easily obtained, and the electrodes are more electrically connected to each other. Thereby, the electrical conductivity of the electrical module can be more reliably maintained, and the quality is more stably stabilized.

In the electrical module of the present invention, the first electrode or the second electrode may further contain a photographic dye.

According to the above configuration, the sensitizing dye that emits electrons from the light or the like is transferred to the first electrode or the second electrode, and the electrons are further transferred to the other electrode via the conductive particles.

An optical module based on the dye-sensitized type of this principle can be obtained, so that the conductive property can be more surely maintained, and the quality can be more stably stabilized.

A method of manufacturing an electrical module according to the present invention includes a first step of arranging the first electrode and the second electrode at an arbitrary distance, and disposing at least the conductive particles on the first electrode and the second electrode And a second step of pressing the first substrate and the second substrate closer to each other to bond the first substrate and the second substrate.

According to the above configuration, in the first step, the first electrode and the second electrode are disposed to face each other at an arbitrary distance, and in the second step, the first base material and the second base material are bonded together via the conductive material.

According to the above steps, for example, when the conductive paste (conductive material) of the present invention is disposed between the electrodes constituting the electric module, the conductive particles are dispersed in the extending direction of the electrode. Thereby, the conductive particles in the extending direction of the electrode are relatively soft with each other, so that an electrical module that can be easily cut can be obtained.

Further, in the second step, when the first base material and the second base material are bonded together, the first base material and the second base material are pressed toward each other so as to be in the thickness direction between the electrodes Conductive The particles are immersed in at least one of the first electrode and the second electrode. The joint between the electrodes is easily and surely obtained, so that the electrodes are electrically connected to each other, and the bonding strength between the conductive particles and the electrode is improved by the "ignition" of at least one of the first electrode and the second electrode by the conductive particles. Therefore, the electrical conductivity of the electrical module can be surely maintained, and the quality is well stabilized.

In the method of manufacturing an electric module according to the present invention, preferably, in the second step, a distance between the first electrode and the second electrode is 30% or more and 250% or less of an average particle diameter of the group of the conductive particles.

According to the above configuration, the distance between the first electrode and the second electrode is set to be 30% or more and 250% or less of the average particle diameter of the group of conductive particles, whereby a part or all of the conductive particles and the first electrode and the second electrode are used. The distance between the first electrode and the second electrode becomes appropriate in such a manner that the electrodes are in contact with each other and are immersed in at least one of the first electrode and the second electrode. Therefore, only a part of the adhesive between the conductive particles in the extending direction of the electrode is relatively soft, so that an electric module which can be easily cut can be obtained. Moreover, the electrical conductivity is reliably maintained, and an electrical module having good quality and stability can be obtained.

In the method of manufacturing an electrical module according to the present invention, preferably, in the second step, the first substrate and the second substrate are brought closer to each other with a force of 0.4 N or more for each of the conductive particles. Press it.

According to the above configuration, the semiconductor electrode and the counter electrode, the first substrate, and the second substrate are appropriately extruded outward in the thickness direction of the conductive particles by both end portions in the thickness direction of the conductive particles, so that the conductive particles and the first layer The bonding strength between the electrode or the second electrode becomes high, and the conduction between the electrodes is stabilized.

According to the present invention, it is possible to easily perform electrical cutting and to easily cut the first An electrical component between the electrode and the second electrode and capable of electrically connecting the electrodes with high stability.

1‧‧‧Electrical Module

1A, 1B, 1C, 1D, 1A', 1B‧‧‧Dyner-sensitized solar cells (electrical modules)

2‧‧‧First substrate

4‧‧‧Second substrate

6‧‧‧Connecting materials

7‧‧‧Semiconductor electrode (first electrode)

8‧‧‧ opposite electrode (second electrode)

18‧‧‧Binder

20‧‧‧ conductive particles

21‧‧‧Auxiliary conductive substances

Fig. 1 is a plan view showing a dye-sensitized sensitized solar cell according to an embodiment of the present invention.

Fig. 2 is a view showing a dye-sensitized solar cell according to an embodiment of the present invention, and is a cross-sectional view showing a portion of a cross section taken along line B-B of Fig. 1 as viewed in the direction of the arrow.

Fig. 3 is a view showing a dye-sensitized solar cell according to an embodiment of the present invention, and is a cross-sectional view taken along line A-A of Fig. 1 as viewed in the direction of the arrow.

FIG. 4 is a view showing a first modification of the dye-sensitized solar cell according to the embodiment of the present invention, and showing a modification of the dye-sensitized solar cell at a position corresponding to the BB line shown in FIG. A section of a section of the section viewed in the direction of the arrow.

FIG. 5 is a view showing a second modification of the dye-sensitized solar cell according to the embodiment of the present invention, and showing a modification of the dye-sensitized solar cell at a position corresponding to the BB line shown in FIG. A section of a section of the section viewed in the direction of the arrow.

Fig. 6 is a view showing a third modification of the dye-sensitized solar cell according to the embodiment of the present invention, and showing a modification of the dye-sensitized solar cell at a position corresponding to the BB line shown in Fig. 1; A section of a section of the section viewed in the direction of the arrow.

FIG. 7 is a view showing a fourth modification of the dye-sensitized solar cell according to the embodiment of the present invention, and showing a modification of the dye-sensitized solar cell at a position corresponding to the BB line shown in FIG. A section of a section of the section viewed in the direction of the arrow.

Fig. 8 is a view for explaining a method of manufacturing a dye-sensitized solar cell according to an embodiment of the present invention, and is a cross-sectional view of a bonded substrate.

Fig. 9 is a view for explaining a method of manufacturing a dye-sensitized solar cell according to an embodiment of the present invention, and is a cross-sectional view of another bonded substrate.

FIG. 10 is a cross-sectional view showing a method of manufacturing a dye-sensitized solar cell according to an embodiment of the present invention, and showing a state in which the bonded substrates are bonded to each other.

Hereinafter, a method of manufacturing the electric module 1 and the electric module of the present invention will be described with reference to the drawings. In addition, the drawings used in the following description are schematic views, and the ratios of the length, the width, and the thickness are not limited to the actual ones, and may be appropriately changed. Further, the configuration and configuration of the electric module 1 are not limited to the ratios of the length, the width, and the thickness of the drawings.

<Electrical Module>

As shown in FIG. 1 to FIG. 3, the dye-sensitized solar cell (electrical module) 1A is formed by arranging a semiconductor electrode (first electrode) 7 and a counter electrode (second electrode) 8 opposite to each other via a conductive material 6. Electrical module.

In the following, as an embodiment of the electric module 1 of the present invention, the dye-sensitized solar cell 1A will be described as an example, and the present embodiment can be applied to the formation of the first substrate 2 and the second substrate. The sealing of a plurality of units C between the four, and the various electrical modules in which the units C, C, ..., C are electrically connected in series or in parallel.

Specifically, the dye-sensitized solar cell 1A includes a first base material 2, a second base material 4, a semiconductor electrode 7, a counter electrode 8, an electrolyte 9, and a conductive material 6.

The semiconductor electrode 7 includes a transparent conductive film 3 laminated on the first substrate 2 and a porous semiconductor layer 10 laminated on the transparent conductive film 3.

The counter electrode 8 includes a counter conductive film 5 laminated on the second substrate 4, and a catalyst layer 11 laminated on the counter conductive film 5.

Sealing members 12 and 12 are disposed on both side portions of the conductive material 6 of the dye-sensitized solar cell 1A. The inter-electrode (i.e., between the semiconductor electrode 7 and the counter electrode 8) is followed by the conductive material 6 and the sealing material 12. On the other hand, in the direction crossing the extending direction of the conductive material 6, the insulating layer is insulated by means of ultrasonic fusion or the like (hereinafter, the portion to be insulated is referred to as "insulating portion 13"). In this way, the cells C respectively having the semiconductor layer 10 are hermetically sealed. Then, a gap is formed in the thickness direction between the semiconductor electrode 7 and the counter electrode 8 by the conductive particles 20 contained in the conductive material 6, and the electrolyte 9 is sealed in the gap.

In the dye-sensitized solar cells 1A and 1B, the conductive material 6 is in direct contact with the transparent conductive film 3 and the opposite conductive film 5 constituting the semiconductor electrode 7 and the counter electrode 8. A plurality of patterned portions 25 insulated by laser irradiation or the like are provided at predetermined portions of the transparent conductive film 3 and the opposite conductive film 5.

The transparent conductive film 3 and the opposite conductive film 5 of the adjacent cells C and C are divided into a plurality by the patterning portion 25, and a pattern of the plurality of transparent conductive films 3 and the opposite conductive film 5 is formed. In each of the divided cells C, the opposite conductive film 5 constituting the counter electrode 8 of the first cell C1 and the transparent conductive film 3 constituting the semiconductor electrode 7 adjacent to the second cell C2 of the first cell C1 are used. The conductive material 6 is electrically connected. As a result, the first unit C1 and the second unit C2 are connected in series.

The material of the first base material 2 and the second base material 4 is not particularly limited, and examples thereof include an insulator such as a resin, a semiconductor, a metal, and glass. As the above resin, for example, poly(A) Acrylate, polycarbonate, polyester, polyimine, polystyrene, polyvinyl chloride, polyamide, and the like. The substrate is preferably made of a transparent resin, more preferably a polyethylene terephthalate (PET) film or polyethylene naphthalate, from the viewpoint of producing a light-weight and flexible dye-sensitized solar cell 1A. (PEN) membrane. Furthermore, the material of the first substrate 2 and the material of the second substrate 4 may be different.

The type and material of the transparent conductive film 3 and the counter conductive film 5 are not particularly limited, and a conductive film used in a known dye-sensitized solar cell can be applied, and for example, a film made of a metal oxide can be used. Examples of the metal oxide include tin-doped indium oxide (ITO), fluorine-doped tin oxide (FTO), aluminum-doped zinc oxide (ATO), indium oxide/zinc oxide (IZO), and gallium-doped zinc oxide (GZO).

The semiconductor layer 10 is formed of a material capable of receiving electrons from the adsorbed photosensitive pigment, and is generally preferably porous. The material constituting the semiconductor layer 10 is not particularly limited, and a material of the known semiconductor layer 10 can be applied, and examples thereof include metal oxide semiconductors such as titanium oxide, zinc oxide, and tin oxide.

The photosensitive pigment to be carried on the semiconductor layer 10 is not particularly limited, and examples thereof include known pigments such as organic dyes and metal complex dyes. Examples of the organic dye include a coumarin system, a polyene system, a cyanine system, a hemicyanine system, and a thiophene system. As the metal complex dye, for example, a ruthenium complex or the like can be preferably used.

The material constituting the catalyst layer 11 is not particularly limited, and a known material can be applied, and examples thereof include carbons such as platinum and carbon nanotubes, poly(3,4-ethylenedioxythiophene), and poly(styrenesulfonic acid). (PEDOT/PSS) and other conductive polymers.

The electrolyte 9 is not particularly limited, and an electrolyte used in a known dye-sensitized solar cell can be applied. As the electrolyte 9, for example, iodine and sodium iodide are dissolved in an organic solvent. The electrolyte is made.

A known sensitizing dye (not shown) is adsorbed on the surface of the semiconductor layer 10 that is in contact with the electrolyte 9 and contains a porous interior.

The conductive material 6 is disposed between the plurality of semiconductor layers 10 extending parallel to each other and extending in one direction, and is in contact with the semiconductor electrode 7 on the first substrate 2 and the counter electrode 8 on the second substrate 4, and is disposed on Between the semiconductor electrode 7 and the counter electrode 8.

The conductive material 6 is flattened or pressurized in terms of application or arrangement of the conductive material 6, whereby the conductive particles 20 are easily formed in a single layer without overlapping in the thickness direction. Therefore, as shown in FIG. 3, the conductive particles 20 of the conductive material 6 are disposed in a single layer in the thickness direction between the transparent conductive film 3 and the opposite conductive film 5 by the operation of flattening by pressurization or the like. Further, the conductive particles 20 do not have to be disposed between the transparent conductive film 3 and the opposite conductive film 5 in a single layer.

Specifically, the conductive material 6 contains at least the conductive particles 20. In the present embodiment, the conductive material 6 further includes the adhesive 18 and the conductive paste is cured. Hereinafter, in a broad sense, the conductive paste is also explained as the conductive material 6. Further, the conductive material 6 may be one which suppresses fluidity or which has low fluidity.

As the binder 18, a polymer binder used to form a semiconductor layer of a known dye-sensitized solar cell can be used, and examples thereof include ethyl cellulose, nitrocellulose, polyacrylate, and polyethylene glycol.

The binders 18 may be used alone or in combination of two or more. Even if they are not polymers, the fluidity can be appropriately suppressed.

The conductive particles 20 are dispersed in the conductive paste and can electrically connect the electrodes of the dye-sensitized solar cell 1A to each other. The conductive particles 20 can be as conductive particles as the metal particles themselves It is electrically conductive, and may be, for example, a particle formed by a metal layer having at least a surface having conductivity.

The conductive particles 20 are capable of conducting between the semiconductor electrode 7 and the counter electrode 8. As shown in FIGS. 2 and 3, some or all of the conductive particles 20 are in contact with at least one of the semiconductor electrode 7 and the counter electrode 8, and are immersed in at least one of the semiconductor electrode 7 and the counter electrode 8.

As shown in FIG. 2, some or all of the conductive particles 20 preferably pass through either or both of the semiconductor electrode 7 and the counter electrode 8, and are immersed in both the first substrate 2 and the second substrate 4. Or either. Incidentally, in FIG. 2, all of the conductive particles 20 penetrate both the semiconductor electrode 7 and the counter electrode 8, and are immersed in both the first substrate 2 and the second substrate 4.

With such a configuration, the surface of the conductive particles 20 is surely in contact with the semiconductor electrode 7 and the inner wall of the counter electrode 8 through which the conductive particles 20 penetrate, and both ends in the thickness direction of the conductive particles 20 are buried in the first base. The state of the inside of the material 2 and the second substrate 4.

The dye-sensitized solar cell 1B shown in Fig. 4 is a first modification of the dye-sensitized solar cell 1A.

As shown in FIG. 4, part or all of the conductive particles 20 may be in contact with both the semiconductor electrode 7 and the counter electrode 8, and both end portions of the conductive particles 20 in the thickness direction may be disposed on the semiconductor electrode 7 and the opposite direction. The inside of either or both of the electrodes 8.

With such a configuration, the surface of the conductive particles 20 is surely brought into contact with the surface of the semiconductor electrode 7 and the counter electrode 8 in which the conductive particles 20 are buried.

The shape of the conductive particles 20 shown in FIG. 2 and FIG. 4 is an example, and the shape of the conductive particles 20 is not included as long as the conductive particles 20 are disposed between the electrodes as described above and function as a spacer. Special restrictions. Examples of the shape of such a conductive particle include a polygonal shape, an elliptical shape, a needle shape, a star shape, and a substantially spherical shape.

A second modification of the dye-sensitized solar cell 1C dye-sensitized solar cell 1A shown in Fig. 5 .

The conductive particles 20 of the dye-sensitized solar cells 1A and 1B have a polygonal shape, and as shown in FIG. 5, the conductive particles 20 of the dye-sensitized solar cell 1C have a spherical shape, for example. Part or all of the spherical conductive particles 20 are in contact with both the semiconductor electrode 7 and the counter electrode 8, and both ends of the conductive particles 20 in the thickness direction are immersed in either the semiconductor electrode 7 or the counter electrode 8 or One. In other words, both end portions of one or all of the conductive particles 20 in the thickness direction are located inside or both of the semiconductor electrode 7 and the counter electrode 8.

In the configuration of the dye-sensitized solar cell 1C, the surface of the conductive particles 20 is surely brought into contact with the surface of the semiconductor electrode 7 and the counter electrode 8 in which the conductive particles 20 are buried. In addition, both ends of the conductive particles 20 in the thickness direction are fixed at predetermined positions by either or both of the semiconductor electrode 7 and the counter electrode 8, and therefore, the conductive is oxidized with respect to the whole of the dye-sensitized solar cell 1C. The position of the particles 20 is also not easily offset, so that the conductive particles 20 and the semiconductor electrode 7 and the counter electrode 8 can be surely kept electrically conductive.

A third modification of the dye-sensitized solar cell 1D dye-sensitized solar cell 1A shown in Fig. 6 .

The conductive particles 20 of the dye-sensitized solar cell 1D are spherical, for example, similarly to the conductive particles 20 of the dye-sensitized solar cell 1C. As shown in FIG. 6, one or both of the spherical conductive particles 20 are in contact with both the semiconductor electrode 7 and the counter electrode 8. At least the semiconductor electrode 7 and the counter electrode 8 are extruded outward in the thickness direction by both end portions in the thickness direction of the spherical conductive particles 20. In the configuration illustrated in FIG. 6, the first base material 2 and the second base material 4 are also extruded outward in the thickness direction of the conductive particles 20.

In the case where the semiconductor electrode 7 and the counter electrode 8 are extruded to the outside in the thickness direction by both end portions in the thickness direction of the conductive particles 20 as in the configuration of the dye-sensitized solar cell 1D, the following cases are conceivable: for example, with the dye-sensitized solar cell 1C The conductive particles 20 are harder than the conductive particles 20 of the dye-sensitized solar cell 1D; compared with the semiconductor electrode 7 and the counter electrode 8 of the dye-sensitized solar cell 1C, the semiconductor electrode of the dye-sensitized solar cell 1D 7 and the case where the counter electrode 8 is soft or has high elasticity, and the like.

In the case of producing the dye-sensitized solar cell of the present embodiment, the first base material 2 and the second base material 4 are bonded to each other at a predetermined interval in the thickness direction. Description of the manufacturing method of the solar cell 1A. In this case, when the first substrate 2 and the second substrate 4 are narrowed and the conductive particles 20 are bonded to each other, the shape of the conductive particles 20 after the bonding is restored, as long as the shape is restored. When the material 12 or the conductive material 6 is in an uncured state, the semiconductor electrode 7 and the counter electrode 8 may be extruded outward in the thickness direction by both end portions of the conductive particles 20 in the thickness direction. For example, it is considered that if the average particle diameter of the conductive particles 20 is 10% or more, the first substrate is crushed so that the thickness of the conductive particles 20 becomes 90% or less of the average particle diameter. 2, when the second base material 4 is bonded, the semiconductor electrode 7 and the counter electrode 8, the first base material 2, and the second base material 4 are bonded to the thickness of the conductive particles 20 by both end portions in the thickness direction of the conductive particles 20. Extrusion is moderately outward in the direction. It is considered that when the conductive particles 20 are flattened so that the thickness of the conductive particles 20 becomes 90% or less of the average particle diameter as described above, they are applied to the first substrate 2 from the outer sides of the first substrate 2 and the second substrate 4. The force of the second substrate 4 is preferably 0.4 N or more for each of the conductive particles 20.

Further, although the spherical conductive particles 20 are exemplified in FIGS. 5 and 6, the shape of the conductive particles 20 is not particularly limited as described above, and may be a polygonal shape or an elliptical shape. Needle shape or star shape or shape other than these. In the case where such a conductive particle 20 having a shape other than a spherical shape is used, it may be in a state in which both end portions of a part or all of the thickness direction of the conductive particle 20 are located at the semiconductor electrode as shown in FIG. 7 and the inner side of either or both of the counter electrodes 8, or at least both ends of the semiconductor electrode 7 and the counter electrode 8 in the thickness direction of one or all of the conductive particles 20 as shown in FIG. The state is extruded to the outside of the thickness direction of the conductive particles 20.

In the configuration of the dye-sensitized solar cell 1D, the surface of the conductive particles 20 is surely brought into contact with the surface of the semiconductor electrode 7 and the counter electrode 8 in which the conductive particles 20 are buried. Further, since the semiconductor electrode 7 and the counter electrode 8 are in contact with the entire end portions of the conductive particles 20 in the thickness direction, the contact area between the conductive particles 20 and the semiconductor electrode 7 and the counter electrode 8 is higher than that of the dye-sensitized solar cell 1A. The configuration of 1B and 1C is expanded, and the conduction of the conductive particles 20 with the semiconductor electrode 7 and the counter electrode 8 can be more reliably maintained. Further, both end portions in the thickness direction of the conductive particles 20 are fixed at predetermined positions by either or both of the semiconductor electrode 7 and the counter electrode 8, and therefore are electrically conductive with respect to the entire bending of the dye-sensitized solar cell 1D. The position of the particles 20 is also not easily offset, so that the conductive particles 20 and the semiconductor electrode 7 and the counter electrode 8 can be surely kept electrically conductive.

The average particle diameter of the conductive particles 20 is, for example, 5 μm or more and 500 μm or less.

In the case where the conductive paste contains a conductive material in addition to the conductive particles 20, the conductive particles 20 having a desired average particle diameter contain one of a plurality of conductive substances contained in the conductive paste. % or more is preferably 10% by mass or more, more preferably 40% by mass or more, and still more preferably 70% by mass or more. Thereby, the distance between the electrodes is easily kept constant.

Conductive particles that can be considered for the distance between the semiconductor electrode 7 and the counter electrode 8 The physical properties such as the elasticity of 20, the degree of unevenness in shape or particle diameter, and the like are appropriately set. The distance between the semiconductor electrode 7 and the counter electrode 8 is preferably, for example, 30% or more and 250% or less, more preferably 40% or more and 150% or less, and still more preferably 50% or more, and more preferably an average particle diameter of the group of the conductive particles 20. 120% or less, particularly preferably 60% or more and 90% or less. Thereby, as shown in FIG. 3, both ends in the thickness direction of the conductive particles 20 are easily disposed inside the semiconductor electrode 7 and the counter electrode 8. In particular, if the distance between the semiconductor electrode 7 and the counter electrode 8 is 60% or more and 90% or less of the average particle diameter of the group of the conductive particles 20, the thickness interval between the semiconductor electrode 7 and the counter electrode 8 is smaller than that of the conductive particles 20. The average particle diameter is appropriately reduced. As shown in FIG. 2, the conductive particles 20 penetrate the semiconductor electrode 7 and the counter electrode 8, and are easily immersed in the first substrate 2 and the second substrate 4.

The material of the conductive particles 20 is not particularly limited as long as it has hardness to the extent that it can be immersed in the first base material 2 and the second base material 4, and is electrically conductive, and is not particularly limited, and examples thereof include gold. Metal particles such as silver, copper, chromium, titanium, platinum, nickel, tin, zinc, lead, tungsten, iron, and aluminum. Further, examples thereof include particles composed of an alloy or a compound containing the metals, particles composed of a conductive resin, or carbon-based particles such as carbon black. Furthermore, a metal having conductivity such as electroless nickel is coated on a resin particle or the like.

In the present embodiment, it is preferable that the conductive particles 20 contain 99.9% by mass to 30% by mass of the binder 18 with respect to 0.1% by mass to 80% by mass of the conductive particles 20 from the viewpoint of moderately dispersing the conductive particles 20 in the conductive paste. . By including the binder 18 and the conductive particles 20 in the conductive paste in such a mass ratio, the conductive particles 20 are appropriately dispersed in the conductive paste as described above, whereby the hardness of the conductive paste is easily disposed on the electrode. . In addition, in the conductive paste and the conductive material 6, the conductive particles 20 which are suitable for the conduction between the electrodes can be held, and the conductive particles 20 can be contained to the extent that the conductive material 6 is easily insulated or cut by ultrasonic waves or the like. Furthermore, The conductive paste and the conductive material 6 may contain an appropriate amount of a tackifier for improving the viscosity or preventing precipitation of the conductive particles 20 composed of metal particles.

A fourth modification of the dye-sensitized solar cell 1A' shown in Fig. 7 is a dye-sensitized solar cell 1A.

As shown in FIG. 7, the conductive material 6 preferably includes an auxiliary conductive material 21 in addition to the binder 18 and the conductive particles 20. For example, when the auxiliary conductive material 21 is in the form of particles, when it is included in the conductive material 6 and disposed between the electrodes, the auxiliary conductive material 21 has a diameter smaller than the interval between the electrodes in the thickness direction. In addition, in FIG. 7, the modification of the dye-sensitized solar cell 1A shown in FIG. 1 - FIG. The same configuration can be applied to 1C and 1D.

The average particle diameter of the auxiliary conductive material 21 is preferably, for example, 80% or less, more preferably 50% or less, more preferably 50% or less, based on the purpose of the gap between the conductive particles 20 in the conductive material 6. Good is less than 30%. Thereby, the above object can be attained, and the conductivity of the conductive material 6 is further improved, whereby the electrical properties between the electrodes are stably stabilized and conducted.

The auxiliary conductive material 21 may be a particulate material or a fiber having a smaller diameter than the conductive particles 20 as long as it has conductivity and does not inhibit the conductivity of the conductive particles 20.

Examples of the material of the auxiliary conductive material 21 include metals such as gold, silver, copper, chromium, titanium, platinum, nickel, tin, zinc, lead, tungsten, iron, and aluminum; compounds containing the metals; and conductive resins. Or a carbon material such as carbon black. It may be the same substance as the conductive particles 20.

When the auxiliary conductive material 21 is fibrous, the fiber diameter of the auxiliary conductive material 21 is preferably 45% or less, more preferably 30%, with respect to the average particle diameter of the group of the conductive particles 20. Hereinafter, it is more preferably 15% or less. Moreover, the aspect ratio of the fiber length of the auxiliary conductive material 21 is, for example, about 2 or more and 500 or less. Further, the fiber diameter and the aspect ratio can be appropriately adjusted so as not to impede the conductivity of the conductive particles 20.

The shape or size of the auxiliary conductive material 21 may be uniform or non-uniform, and is not particularly limited.

Further, the conductive paste may include a binder, an adhesive, an organic solvent, a tackifier, and the like in addition to the binder 18, the conductive particles 20, and the auxiliary conductive material 21. This adhesive has a function of holding the electrodes of the dye-sensitized solar cells 1A, 1B, 1C, 1D, and 1A' exemplified in FIGS. 1 to 7 at a predetermined interval in a state of being aligned. Specifically, the resin material containing at least one of a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin is used as the adhesive, but is not particularly limited thereto.

Examples of the resin material of the adhesive include a vinyl acetate resin emulsion type adhesive, an ethylene-vinyl acetate copolymer resin, and an EVA (ethylene-vinyl acetate-vinyl chloride terpolymer) emulsion type adhesive. A-olefin (isobutylene-maleic anhydride resin)-based adhesive, acrylic resin-based emulsion type adhesive, styrene-butadiene rubber-based emulsion type adhesive, vinyl acetate resin-based solvent-based adhesive, acrylic resin Solvent-based adhesive, vinyl chloride resin-based solvent-based adhesive, chloroprene rubber-based solvent-based adhesive, chloroprene rubber-based solvent-based frankincense adhesive, nitrile rubber-based solvent-based adhesive, and recycled rubber Solvent-based styrene-butadiene rubber (SBR) solvent-based adhesive, amine ester resin-based adhesive, polyoxynoxy resin-based adhesive, denatured polyoxyn resin-based adhesive, epoxy-denatured Polyoxynized resin adhesive, second generation of acrylic adhesives (SGA) adhesive, starch based adhesive, polymer cement mortar, epoxy resin mortar, ammonium sulfonate Lipid-based adhesive, a hot-melt adhesive agent.

Further, as described above, as long as it has a function of maintaining the state in which the electrodes are disposed to face each other at a predetermined interval, an adhesive having a high viscosity can be used as the adhesive. Examples of the adhesive material having a high viscosity include rubber, acrylic, polyoxymethylene or amine esters, but are not particularly limited thereto. Specific examples thereof include natural rubber, acrylate copolymer, polyoxyxylene rubber, and amine ester resin.

The organic solvent contained in the conductive paste is an auxiliary medium for maintaining the dispersed state of the conductive particles or the binder resin. Examples of such an organic solvent include water, ethyl acetate, ester-based, alcohol-based and ketone-based solvents, tetrahydrofuran, hexane, and aromatic solvents. However, the organic solvent is not particularly limited.

<Method of Manufacturing Electrical Module>

Next, an embodiment of a method of manufacturing the electric module 1 of the present invention will be described with reference to an example of a method of manufacturing the dye-sensitized solar cell 1A (hereinafter also referred to simply as "manufacturing method").

The manufacturing method of the present embodiment is a method of producing a dye-sensitized solar cell 1A, comprising: a first step of arranging at least an arbitrary distance between the semiconductor electrode 7 and the counter electrode 8 to dispose at least the conductive particles 20 in the semiconductor Between the electrode 7 and the counter electrode 8; and a second step of pressing and bonding the first substrate and the second substrate so as to be close to each other. Hereinafter, each step will be specifically described.

[First step]

First, using a known method of producing a dye-sensitized solar cell having a roll-to-roll method, a transparent conductive film 3 is formed at a predetermined position on the first substrate 2 continuously formed in a predetermined direction P for forming a cell. Then, the semiconductor layer 10 is formed at a predetermined position, and after the sealing material 12 is formed on both sides (i.e., around) of the semiconductor layer 10, the electrolyte 9 is laminated. Thereby, as shown in Figure 8. As shown in the figure, the bonded substrate 31 including the semiconductor electrode 7 and the sealing material 12 and having the gap S formed at an appropriate position can be obtained. In addition, the predetermined direction P may be freely set in consideration of the manufacturing situation or the like, and may be, for example, a direction parallel to the extending direction of the conductive material 6.

Next, using a known method for producing a dye-sensitized solar cell, the opposite conductive film 5 is formed at a predetermined position on the second substrate 4 continuously formed in the predetermined direction P for forming a cell, and then, in a predetermined manner The position forms the catalyst layer 11. Thereby, as shown in FIG. 9, the bonding substrate 32 provided with the counter electrode 8 is obtained.

Next, as shown in FIG. 10, the conductive paste supply portion 34 is filled with a gap containing at least the adhesive 18 and the conductive particles 20 in the gap (between the first electrode and the second electrode) S of the bonded substrate 31. Paste, forming a conductive material 6. Actually, it is considered that the sealing material 12 or the wiring material or the like is crushed and expanded in the second step described below, and the conductive paste may be slightly thicker than the predetermined thickness.

[Second step]

Then, as shown in FIG. 10, the semiconductor layer 10 of the bonded base material 31 and the catalyst layer 11 of the bonded base material 32 are opposed to each other, and the bonded base material 31 and the bonded base material 32 are brought close to each other. The pair of rolls 41 and 42 are disposed along the thickness direction in a state where the predetermined distance between the bonded base materials 31 and 32 in the thickness direction, and the bonded base material (first base material) 31 and the bonding base are used. The material (second substrate) 32 is pressed closer to each other. The ultraviolet ray irradiation unit 46 is vertically irradiated with the ultraviolet ray UV, and the sealing material 12 made of the ultraviolet ray curable resin is cured, whereby the bonded base material 31 and the bonded base material 32 are bonded together. Thereafter, as time passes, the fluidity of the conductive paste or the like is lowered to moderately harden. Thereby, the dispersion and the like of the conductive particles 20 in the conductive material 6 are stabilized.

In the second step, the distance between the semiconductor electrode 7 and the counter electrode 8 is thick. The degree interval is preferably 30% or more and 250% or less, more preferably 40% or more and 150% or less, and still more preferably 50% or more and 120% or less, particularly preferably 50% or more and 120% or less, of the average particle diameter of the group of the conductive particles 20. It is 60% or more and 90% or less. Moreover, it is preferable to appropriately adjust the distance between the pair of rollers 41 and 42 in the vertical direction and the pressing force, etc., so that the distance between the semiconductor electrode 7 and the counter electrode 8 is the above-described condition. By adjusting the distance between the semiconductor electrode 7 and the counter electrode 8, when the bonded substrates 31 and 32 are pressed and bonded to each other, at least a part of the conductive particles 20 penetrates the semiconductor electrode 7 and the counter electrode 8, and is easy to be Both the first substrate 2 and the second substrate 4 are introduced.

The dye-sensitized solar cell 1A shown in Figs. 1 and 3 can be obtained by the above first step and second step.

Further, the method of manufacturing the dye-sensitized solar cells 1B, 1C, and 1D shown in FIGS. 4 to 6 is such that the distance between the semiconductor electrode 7 and the counter electrode 8 is appropriately adjusted so that the conductive particles 20 are in the second step. At least a part of both ends in the thickness direction are disposed in the semiconductor electrode 7 and the counter electrode 8, and are the same as the method of manufacturing the dye-sensitized solar cell 1A. In the method of manufacturing the dye-sensitized solar cell 1A' shown in FIG. 7, the method of manufacturing the dye-sensitized solar cell 1A is the same as that of the above-described dye-sensitized solar cell 1A except that the conductive paste 21 is contained in the conductive paste.

In the electric module 1 and the manufacturing method of the dye-sensitized solar cells 1A, 1B, 1C, 1D, and 1A' described above, the semiconductor electrode 7 and the counter electrode 8 constituting the electric module 1 are disposed. When there is a conductive paste containing at least the binder 18 and the conductive particles 20, the conductive particles 20 are dispersed in the extending direction of the semiconductor electrode 7 and the counter electrode 8. Then, the first base material 2 and the second base material 4 including the semiconductor electrode 7 and the counter electrode 8 are pressed and adhered to each other so as to be flattened and bonded to each other, whereby the conductive particles 20 are easily disposed in a single layer. On the same side (ie, one side of the electrode). Therefore, the conductive material 6 after the conductive paste is cured is disposed between the electrodes At this time, the conductive particles 20 are in a state of being singular (that is, in a single layer) in the gap S between the electrodes in the thickness direction. Thereby, according to the electric module 1 and the manufacturing method thereof, the electric module 18 in which the adhesive 18 or the adhesive agent between the conductive particles 20 in the extending direction of the electrode is relatively soft and can be easily cut can be obtained.

Further, in the electric module 1 and the method of manufacturing the same, at least one of the semiconductor electrode 7 and the counter electrode 8 is absent in the conductive particles 20 in the thickness direction between the semiconductor electrode 7 and the counter electrode 8. In some cases, the contact between the semiconductor electrode 7 and the counter electrode 8 is easily and surely obtained, and the electrodes are electrically connected to each other. Further, when the conductive particles 20 are "missed" at least one of the semiconductor electrode 7 and the counter electrode 8, the bonding strength between the conductive particles 20 and the electrodes is increased, and the electrode is less likely to peel off from the conductive material 6 containing the conductive particles 20. The relative positional relationship between the electrode composed of the semiconductor electrode 7 and the counter electrode 8 and the conductive material 6 is not easily deviated, and the thickness between the electrodes can be kept constant for a long period of time. Therefore, according to the electrical module 1 and the method of manufacturing the same, the electrical conductivity of the electrical module 1 can be reliably maintained, and the quality of the electrical module 1 can be satisfactorily stabilized. In other words, the electrical module 1 can be easily electrically cut, and the conductive material 6 between the semiconductor electrode 7 and the counter electrode 8 can be easily cut and the electrodes can be electrically connected to each other with high stability.

As in the case of the dye-sensitized solar cells 1A, 1B, 1C, 1D, and 1A', at least a part of the conductive particles 20 are "immersed" in either or both of the first substrate 2 and the second substrate 4, so that The thickness of the conductive particles 20 in contact with the semiconductor electrode 7 and the counter electrode 8 becomes larger, and the bonding strength between the conductive particles 20 and the electrodes is further improved. Further, as in the dye-sensitized solar cells 1A, 1B, 1C, 1D, and 1A', some or all of the conductive particles 20 pass through either or both of the semiconductor electrode 7 and the counter electrode 8, whereby the conductive particles 20 The semiconductor electrode 7 and the counter electrode 8 are connected to each other in the thickness direction, so that the conductive particles 20 and the semiconductor electrode can be formed. 7 and the conduction of the counter electrode 8 are better. With such a configuration, the conductivity of the dye-sensitized solar cells 1A, 1B, 1C, 1D, and 1A' can be more reliably maintained, and the quality of the dye-sensitized solar cells 1A, 1B, 1C, 1D, and 1A' can be made better. The ground is stable.

Further, according to the electric module 1 and the method of manufacturing the same, the distance between the semiconductor electrode 7 and the counter electrode 8 can be 30% or more and 250% or less of the average particle diameter of the group of the conductive particles 20, and some or all of them can be used. The conductive particles 20 are in contact with both the semiconductor electrode 7 and the counter electrode 8, and are immersed in at least one of the semiconductor electrode 7 and the counter electrode 8, so that the distance between the semiconductor electrode 7 and the counter electrode 8 is appropriate. Therefore, only a portion of the adhesive 18 between the conductive particles 20 in the extending direction of the electrode is relatively soft and can be easily cut.

Like the dye-sensitized solar cell 1A', the conductive material 6 further contains the auxiliary conductive material 21, whereby the auxiliary conductive material 21 is disposed in the gap between the conductive particles 20 between the electrodes, and the contact between the electrodes can be easily formed. The electrodes are made to conduct more well with each other. Thereby, the conductivity of the dye-sensitized solar cell 1A' can be more reliably maintained, and the quality of the dye-sensitized solar cell 1A' can be more stably stabilized.

The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the specific embodiment, and various modifications and changes can be made without departing from the spirit and scope of the invention.

For example, the conductive material 6 itself can also function as the sealing material 12 and also serve as the sealing material 12.

In the present embodiment, the conductive paste or the conductive material 6 in which the conductive particles 20 are directly dispersed in the binder 18 is exemplified. However, the conductive particles 20 may be via an appropriate auxiliary material (not shown) or The sealing material is indirectly held in the adhesive to integrate the materials. Further, in the case where the auxiliary material is not present, the adhesive 18 may be omitted. The non-conductive material which can comprise such an auxiliary material is, for example, a resin material containing at least one of a resin such as a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin, or a fiber material or cellulose constituting a known fiber. , polyvinyl alcohol and other materials. Further, as the auxiliary material, a known sealing material used in an electric module such as a solar battery may be used in addition to the above-described examples.

[Examples]

Next, an embodiment which is implemented to confirm the effects of the manufacturing method of the electric module and the electric module of the present invention will be described. Furthermore, the invention is not limited to the following examples.

A dye-sensitized solar cell 1D (see FIG. 6) was produced using the PET film as the first substrate 2 and the second substrate 4.

(Example 1)

For the production of the dye-sensitized solar cell 1D, Micropearl: AU100 (average diameter: 100 μm, manufacturer: Sekisui Chemical Co., Ltd.) was used as the conductive particle 20 by a compression tester (Model: DUH-W201, manufacturer: In the thickness direction of the first base material 2 and the second base material 4, the outer surface of the first base material 2 and the second base material 4 are bonded to each of the conductive particles 20 so as to be 0.4 N. In the dye-sensitized solar cell 1D obtained, as shown in FIG. 6, the semiconductor electrode 7 and the counter electrode 8 are extruded outward in the thickness direction of the conductive particles 20 by both end portions in the thickness direction of the conductive particles 20. The first base material 2 and the second base material 4 in which the wiring portions of the conductive particles 20 are disposed are formed with convex portions. The convex portion has substantially the same shape as the spherical portion at both end portions in the thickness direction of the substantially spherical micropearl as the conductive particles 20, and is convex from the surface of each of the first base material 2 and the second base material 4. Part of it. Moreover, in the present embodiment, the direction opposite to the direction of the flattening (ie, the lower side in FIG. 6, the first substrate 2) The side of the flattened direction (that is, the upper side in FIG. 6 and the side of the second base material 4) is larger in size in the thickness direction of the conductive particles 20 than in the side.

It is considered that when the first base material 2 and the second base material 4 are bonded together by applying a force of 0.4 N as described above, the bonding strength between the conductive particles 20 and the semiconductor electrode 7 or the counter electrode 8 can be improved.

(Example 2)

A dye-sensitized solar cell 1D was produced in the same manner as in Example 1 except that copper powder having a needle shape (average size of the longest portion: 90 μm) was used as the conductive particles 20. In the dye-sensitized solar cell 1D of the second embodiment, the first base material 2 and the second base material 4 in which the wiring portions of the conductive particles 20 are disposed are formed with convex portions. It has been confirmed that both the semiconductor electrode 7 and the counter electrode 8 are absent from both ends of the conductive particles 20 in the thickness direction in the convex portion, and the first substrate 2 and the second substrate are also absent.

(Comparative example)

In the case of producing the dye-sensitized solar cell 1D, as the conductive particles 20, Micropearl having a soft core (average diameter: 100 μm, manufacturer: Sekisui Chemical Co., Ltd.) was used as the conductive particles 20 in the above-mentioned Example 1 and Example 2. That is, the similar product of the Micropearl (average diameter: 100 μm, manufacturer: Sekisui Chemical Co., Ltd.) different from the core of the Micropearl used in Example 1, by the above compression tester from the first substrate 2 and The outer side in the thickness direction of the second base material 4 was bonded by applying a force of 0.065 N so that the conductive particles 20 were crushed. In the obtained dye-sensitized solar cell 1D, no convex portion was formed.

It is considered that when the first base material 2 and the second base material 4 are bonded by applying a force of 0.065 N as described above, there are the conductive particles 20 in which the wiring portions of the conductive particles 20 are disposed, and the semiconductor electrode 7 or the counter electrode 8 The unbonded portion of the crucible makes it difficult to increase the conductive particles 20 and the semiconductor The bonding strength of the pole 7 or the counter electrode 8.

1‧‧‧Electrical Module

1A‧‧‧Dye-sensitized solar cells (electrical modules)

2‧‧‧First substrate

3‧‧‧Transparent conductive film

4‧‧‧Second substrate

5‧‧‧ opposite conductive film

6‧‧‧Connecting materials

7‧‧‧Semiconductor electrode (first electrode)

8‧‧‧ opposite electrode (second electrode)

9‧‧‧ Electrolytes

10‧‧‧Semiconductor layer

11‧‧‧ catalyst layer

12‧‧‧ Sealing material

18‧‧‧Binder

20‧‧‧ conductive particles

25‧‧‧The Ministry of Patterning

C1‧‧‧ first unit

C2‧‧‧Second unit

Claims (9)

An electrical module is provided with a conductive material, the conductive material is connected to the first electrode on the first substrate and the second electrode on the second substrate, and is disposed between the first electrode and the second electrode The conductive material includes conductive particles capable of conducting between the first electrode and the second electrode, and some or all of the conductive particles are in contact with both the first electrode and the second electrode, and are absent At least one of the first electrode and the second electrode. The electrical module of claim 1, wherein the part or all of the conductive particles penetrate through either or both of the first electrode and the second electrode. The electrical module of claim 1 or 2, wherein the part or all of the conductive particles are in contact with both the first electrode and the second electrode, and are immersed in the first substrate and the first Two or either of the two substrates. The electric module according to any one of claims 1 to 3, wherein a distance between the first electrode and the second electrode is 30% or more and 250% or less of an average particle diameter of the group of the conductive particles. The electric module according to any one of claims 1 to 4, wherein the conductive material further comprises an auxiliary conductive material, the diameter of the auxiliary conductive material being smaller than the thickness between the first electrode and the second electrode The interval between directions is small. The electrical module of any one of claims 1 to 5, wherein the first electrode or the second electrode contains a phytochrome. A method of manufacturing an electrical module, the method of manufacturing an electrical module according to any one of claims 1 to 6, which has: a first step: aligning the first electrode and the second electrode at an arbitrary distance, at least disposing the conductive particles between the first electrode and the second electrode; and second step: the first base The material and the second substrate are pressed toward each other to bond the first substrate to the second substrate. The method of manufacturing an electrical module according to claim 7, wherein the second step is such that the distance between the first electrode and the second electrode is 30% or more and 250% of an average particle diameter of the group of conductive particles. the following. The method of manufacturing an electrical module according to claim 7 or 8, wherein in the second step, the first substrate and the second substrate are used in close proximity to each other for each of the conductive particles. Press for a force of 0.4N or more.