TW201736009A - Substrate processing apparatus and gap washing method - Google Patents

Abstract

A substrate processing apparatus includes a washing liquid supply unit which supplies a washing liquid to a washing liquid discharge port which is open in the outer circumferential surface of a body, a rotation unit which relatively rotates the opposing member and the body around a rotational axis passing through the central portion of the upper surface of the substrate and a washing control unit which controls the washing liquid supply unit and the rotation unit so as to wash the cylindrical gap, where the washing control unit performs a rotation step of controlling the rotation unit so as to relatively rotate the opposing member and the body and a washing liquid discharging step of controlling the washing liquid supply unit so as to discharge a washing liquid from the washing liquid discharge port simultaneously with the rotation step.

Description

Substrate processing device and gap cleaning method

The present invention relates to a substrate processing method for processing an upper surface of a substrate using a processing fluid, and a gap cleaning method for cleaning a gap between the body and the opposing member facing the substrate. The substrate to be processed includes, for example, a semiconductor wafer, a liquid crystal display device substrate, a plasma display substrate, an FED (Field Emission Display) substrate, a disk substrate, a disk substrate, a magnet disk substrate, and a light. A cover substrate, a ceramic substrate, a solar cell substrate, or the like.

In a manufacturing process of a semiconductor device or a liquid crystal display device, a substrate processing apparatus for processing a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device is used. The single-chip processing type substrate processing apparatus for processing a substrate one by one includes, for example, a rotary chuck that horizontally holds and rotates the substrate, and a processing liquid supply unit that supplies the processing liquid to the substrate held by the rotary chuck The blocking member is opposed to the substrate held by the rotary chuck from above; and the central axis nozzle is housed in a central opening formed in a central portion of the blocking member. The interrupting member is a member that is close to the upper surface of the substrate to interrupt the space from the periphery thereof.

When the substrate processing is performed by the substrate processing apparatus, for example, the processing liquid from the processing liquid supply unit is supplied to the substrate while the blocking member and the central axis nozzle are retracted away from the retracted position above the substrate. Above. Accompany With the supply of the treatment liquid onto the substrate, a treatment liquid mist is generated above the substrate, and the treatment liquid mist may enter the cylindrical gap and adhere to the inner circumferential surface of the interruption member or the outer circumferential surface of the central shaft nozzle. Therefore, it is necessary to wash the cylindrical gap.

Japanese Laid-Open Patent Publication No. 2010-56218 discloses a method of supplying a cleaning liquid from a cleaning liquid nozzle to the lower surface of a shutoff member to wash the lower surface of the shutoff plate.

The cleaning of the cylindrical gap is performed by blowing the cleaning liquid from the cleaning liquid nozzle into the cylindrical gap from below, as described in Japanese Laid-Open Patent Publication No. 2010-56218. However, since the interval between the cylindrical gaps is generally narrow, it is difficult to make the washing liquid from the lower blowing well pass through the cylindrical gap well. Therefore, the cylindrical gap cannot be cleaned well.

Therefore, it is desirable to have a method in which the cylindrical gap partitioned between the outer peripheral surface of the body (the central axis nozzle) and the inner peripheral surface of the opposing member (the blocking member) can be satisfactorily cleaned.

Accordingly, an object of the present invention is to provide a substrate processing apparatus and a gap cleaning method capable of satisfactorily cleaning a cylindrical gap partitioned between an outer circumferential surface of a main body and an inner circumferential surface of a facing member.

The present invention provides a substrate processing apparatus including: a substrate holding unit for holding a substrate in a horizontal posture; and an outer cylindrical body having an outer peripheral surface and a facing portion opposite to an upper central portion of the substrate And extending in an up-and-down direction; the opposite member surrounds the outer circumference of the body, and has an inner peripheral surface formed with a cylindrical gap between the outer peripheral surface of the main body and facing the substrate; a washing liquid discharge port that is opened on the outer peripheral surface of the main body for spitting toward the inner peripheral surface a cleaning liquid supply unit for supplying a cleaning liquid to the cleaning liquid discharge port; and a rotating unit for winding the opposite member and the main body around a rotation axis of a central portion of the upper surface of the substrate a relative rotation; and a cleaning control unit that controls the cleaning liquid supply unit and the rotating unit to wash the cylindrical gap; and the cleaning control unit performs a rotation step and a cleaning liquid discharge step, the rotation The step of controlling the rotating unit to relatively rotate the opposing member and the main body, the cleaning liquid discharging step is controlling the cleaning liquid supply unit to be discharged from the cleaning liquid discharge port in synchronization with the rotating step The step of the cleaning solution.

According to this configuration, the cleaning liquid is discharged from the washing liquid discharge port formed on the outer peripheral surface of the main body toward the inner peripheral surface of the opposing member while the opposing member and the main body are relatively rotated. Since the inner peripheral surface of the opposing member rotates with respect to the outer peripheral surface of the main body, the washing liquid discharged from the washing liquid discharge port is pulled by the rotation of the inner peripheral surface, and flows downward while swirling. That is, a swirling flow directed downward is formed in the cylindrical gap. Therefore, centrifugal force and gravity act on the washing liquid flowing through the cylindrical gap, and by this physical force, the contaminant adhering to the inner peripheral surface and/or the outer peripheral surface can be removed. Thereby, the cylindrical gap can be well cleaned.

In one embodiment of the present invention, the cleaning liquid supply unit includes a cleaning liquid pipe through which the cleaning liquid flows and is inserted into the main body, and the downstream end of the cleaning liquid pipe is attached to The outer peripheral surface of the main body is opened to form the cleaning liquid discharge port.

According to this configuration, the cleaning liquid supply unit includes the cleaning liquid pipe that is inserted into the inside of the main body. That is, the cleaning liquid can be supplied to the washing liquid discharge port formed on the outer peripheral surface of the main body through the inside of the main body. Thereby, it is possible to easily form a structure in which the washing liquid is discharged from the washing liquid discharge port formed on the outer peripheral surface of the main body toward the inner peripheral surface of the opposing member.

Further, the cleaning liquid pipe may include a vertical pipe extending linearly in the vertical direction, and a connection pipe connecting the lower end of the vertical pipe and the cleaning liquid discharge port.

According to this configuration, the cleaning liquid pipe includes a vertical pipe, and a connecting pipe that connects the cleaning liquid discharge port formed on the outer circumferential surface of the main body and the lower end of the vertical pipe. By this means, the cleaning liquid pipe can be easily inserted into the inside of the main body, and the washing liquid is discharged from the washing liquid discharge port formed on the outer peripheral surface of the main body toward the inner peripheral surface of the opposing member.

The washing liquid discharge port may include an inclined discharge port that discharges the washing liquid obliquely downward. According to this configuration, since the cleaning liquid is discharged obliquely downward from the washing liquid discharge port, the increase in the processing liquid supplied to the cylindrical gap can be suppressed. Thereby, the swirling flow toward the lower side can be formed favorably.

The apparatus may further include a gas supply unit that supplies gas to the cylindrical gap from a position above the position at which the cleaning liquid is discharged from the cleaning liquid discharge port in the cylindrical gap. In this case, the cleaning control unit may control the gas supply unit to perform a gas supply step of supplying a gas to the cylindrical gap in synchronization with the rotation step and the cleaning liquid discharge step.

According to this configuration, since the gas is supplied from a portion above the supply position at which the cleaning liquid from the cleaning liquid discharge port is supplied in the cylindrical gap, the increase in the cleaning liquid supplied to the cylindrical gap can be suppressed. Thereby, the swirling flow toward the lower side can be formed more favorably.

The apparatus may further include a processing fluid pipe for circulating a processing fluid to be supplied to the upper surface of the substrate and inserted into the inside of the body. In this case, the opening of the downstream end of the treatment fluid pipe can also form a treatment fluid to be discharged. mouth.

According to this configuration, the system is for discharging the body of the nozzle for treating the fluid. Therefore, the cylindrical gap between the outer circumferential surface of the nozzle and the inner circumferential surface of the opposing member can be favorably cleaned.

The substrate processing apparatus may further include a cleaning liquid blowing unit that blows the cleaning liquid toward the opposite portion of the main body from below. In this case, the cleaning control unit may control the cleaning liquid blowing unit to perform the cleaning step and the cleaning liquid discharging step, and further perform cleaning by blowing the cleaning liquid toward the opposing portion. The cleaning step of the opposite portion of the opposite portion.

According to this configuration, the washing of the cylindrical gap and the washing step of the opposing portion (washing of the opposing portion of the main body) can be performed simultaneously. Thereby, the body can be washed in a short time as compared with the case where the cylindrical gap is washed at a different timing and the opposite portion of the body is washed.

Further, the present invention provides a gap cleaning method for cleaning a cylindrical gap between a peripheral surface of the body and an inner peripheral surface of the opposing member, the body having a central portion opposite to the upper surface of the substrate The opposing portion extends up and down, and the opposing member surrounds the outer circumference of the body and faces the substrate. The gap cleaning method performs the following steps: opening the outer peripheral surface of the body, a step of preparing a cleaning liquid discharge port for discharging the cleaning liquid toward the cylindrical gap; a rotating step of relatively rotating the opposite member and the main body; and discharging the cleaning liquid discharge port in synchronization with the rotating step The cleaning solution of the washing liquid is discharged.

According to this method, the cleaning liquid is discharged from the washing liquid discharge port formed on the outer peripheral surface of the main body toward the inner peripheral surface of the opposing member while the opposing member and the main body are relatively rotated. Since the inner circumferential surface of the opposing member rotates relative to the outer circumferential surface of the body, The washing liquid spouted from the washing liquid outlet is pulled by the inner peripheral surface and flows downward while rotating. That is, a swirling flow directed downward is formed in the cylindrical gap. Therefore, centrifugal force and gravity act on the washing liquid flowing through the cylindrical gap, and by this physical force, the contaminant adhering to the inner peripheral surface and/or the outer peripheral surface can be removed. Thereby, the cylindrical gap can be favorably washed.

The above method may further include a gas supply step of supplying gas to the cylindrical gap from a portion above the position at which the cleaning liquid is discharged from the cleaning liquid discharge port in the cylindrical gap.

According to this method, since the gas is supplied from a portion above the supply position at which the cleaning liquid from the cleaning liquid discharge port is supplied in the cylindrical gap, the increase in the cleaning liquid supplied to the cylindrical gap can be suppressed. Thereby, the swirling flow toward the lower side can be formed more favorably.

The above method may further include a step of cleaning the opposing portion, which, in synchronization with the rotating step and the washing liquid discharging step, blows the washing liquid toward the opposing portion to wash the opposing portion.

According to this method, the washing of the cylindrical gap and the washing step of the opposing portion (washing of the opposing portion of the main body) can be performed simultaneously. Thereby, the body can be washed in a short time as compared with the case where the cylindrical gap is washed at a different timing and the opposite portion of the body is washed.

The above and other objects, features, and advantages of the present invention will be apparent from the description and appended claims

1‧‧‧Substrate processing unit

2‧‧‧Processing unit

3‧‧‧Control device

4‧‧‧ cabin

5‧‧‧Rotary chuck

6‧‧‧Drug supply unit

7‧‧‧ opposite components

8‧‧‧ nozzle

8a‧‧‧Bottom

9‧‧‧Clamping members

10‧‧‧cleaning liquid supply unit

11‧‧‧Under unit

12‧‧‧ cup body

12a‧‧‧Upper

13‧‧‧ partition wall

14‧‧‧FFU (Fan Filter Unit)

15‧‧‧Exhaust pipe

16‧‧‧Rotary motor

17‧‧‧Rotary axis

18‧‧‧Rotating table

19‧‧‧Drug nozzle

20‧‧‧Pharmaceutical piping

21‧‧‧Drug valve

22‧‧‧Nozzle mobile unit

23‧‧‧ 断板

23a‧‧‧Substrate opposite

24‧‧‧Rotary axis

24a‧‧‧ inner circumference

25‧‧‧through holes

25a‧‧‧ inner circumference

25b‧‧‧Conical surface

26‧‧‧Support arm

27‧‧‧Shutter Rotating Unit

28‧‧‧ opposite component lifting unit

29‧‧‧Cylinder gap

29a‧‧‧ Connection location

29b‧‧‧ Connection location

30‧‧‧ surrounding gas discharge

31‧‧‧Ontology

31a‧‧‧Outer surface

31b‧‧‧ opposite

32‧‧‧Clean liquid discharge

33‧‧‧Processing liquid piping

34‧‧‧Central gas piping

35‧‧‧Processing fluid discharge

36‧‧‧Central gas discharge

37‧‧‧ rinse valve

38‧‧‧ flushing fluid supply piping

39‧‧‧Central gas valve

40‧‧‧Central gas supply piping

41‧‧‧ surrounding gas piping

42‧‧‧ surrounding gas valve

43‧‧‧1st flow adjustment valve

44‧‧‧cleaning liquid piping

45‧‧‧Up and down piping

45a‧‧‧Bottom

46‧‧‧Connecting piping

46a‧‧‧ downstream end

47‧‧‧Clean liquid upper valve

48‧‧‧Clean liquid supply piping

48a‧‧ ‧Different positions

50‧‧‧Attraction piping

51‧‧‧Attraction valve

52‧‧‧ below nozzle

53‧‧‧Under the cleaning liquid piping

54‧‧‧Clean liquid lower valve

55‧‧‧2nd flow adjustment valve

56‧‧‧Drive parts containment space

57‧‧‧Connected channel

58‧‧‧ gas seal

70‧‧‧ liquid film

80‧‧‧ liquid film

202‧‧‧Processing unit

205‧‧‧Rotary chuck

207‧‧‧ opposite components

218‧‧‧Rotating table

223‧‧‧ 断板

223a‧‧‧substrate facing

223b‧‧‧锷

223c‧‧‧Rotating chuck abutment

225‧‧‧through holes

225a‧‧‧ inner circumference

226‧‧‧Support arm

229‧‧‧Flange support

230‧‧‧Cylinder

231‧‧‧ opposite member support

232‧‧‧With the Ministry

233‧‧‧Support

234‧‧‧Flange

235‧‧‧1st concave and convex part

236‧‧‧Support body

237‧‧‧Connecting Department

238‧‧‧2nd concave and convex part

240‧‧‧ Maze

241‧‧‧arm support shaft

242‧‧‧arm swing unit

243‧‧‧ Protrusion

244‧‧‧ hole

245‧‧‧arm lifting unit

250‧‧‧ gas supply road

251‧‧‧1st runner

252‧‧‧1st manifold

253‧‧‧2nd runner

254‧‧‧2nd manifold

255‧‧‧ gas jet

A0, A1‧‧‧ rotation axis

A2‧‧‧ Swing axis

A3‧‧‧ central axis

C‧‧‧ wafer carrier

CR‧‧‧Substrate transfer robot

H‧‧‧Robot

IR‧‧‧Transfer robot

LP‧‧‧Loading

R‧‧‧ swirl

W‧‧‧Substrate

W1~W3‧‧‧ interval

1 is a view showing the internal cloth of a substrate processing apparatus according to an embodiment of the present invention; Graphical top view of the bureau.

FIG. 2 is a schematic cross-sectional view for explaining a configuration example of a processing unit included in the substrate processing apparatus.

Fig. 3 is a vertical cross-sectional view of the opposing member provided in the processing unit.

Figure 4 is a bottom plan view of the opposing member.

Fig. 5 is a transverse cross-sectional view for explaining a flow of a washing liquid discharged from a washing liquid discharge port.

Fig. 6 is a vertical cross-sectional view showing the flow of the washing liquid discharged from the washing liquid discharge port.

Fig. 7 is a block diagram for explaining an electrical configuration of a main part of the substrate processing apparatus.

8 is a flow chart for explaining an example of substrate processing of the substrate processing apparatus.

Figure 9 is a schematic cross-sectional view for explaining the steps of the liquid medicine shown in Figure 8.

Figure 10 is a schematic cross-sectional view for explaining the rinsing step shown in Figure 8.

Figure 11 is a schematic cross-sectional view for explaining the spin drying step shown in Figure 8.

Figure 12 is a flow chart for explaining the nozzle cleaning step shown in Figure 8.

Figure 13 is a schematic cross-sectional view for explaining the above nozzle cleaning step.

Fig. 14 is a schematic cross-sectional view showing a configuration example of a processing unit according to another embodiment of the present invention.

Fig. 15 is a cross-sectional view showing, in an enlarged manner, an opposing member included in the processing unit.

1 is a schematic plan view for explaining an internal layout of a substrate processing apparatus 1 for performing a substrate processing method according to a first embodiment of the present invention. The substrate processing apparatus 1 is a one-piece processing method for processing each of the substrates W such as a silicon wafer. Device. In the present embodiment, the substrate W is a disk-shaped substrate. The substrate processing apparatus 1 includes a plurality of processing units 2 that process the substrate W with a processing liquid, and a loading cassette LP for mounting a wafer carrier cassette C that accommodates a plurality of substrates W processed by the processing unit 2; And CR, which transfers the substrate W between the loading cassette LP and the processing unit 2, and a control device (washing control unit) 3 that controls the substrate processing apparatus 1. The transport robot IR transports the substrate W between the wafer cassette C and the substrate transfer robot CR. The substrate transfer robot CR transfers the substrate W between the transfer robot IR and the processing unit 2. The plurality of processing units 2 have, for example, the same configuration.

FIG. 2 is a schematic cross-sectional view for explaining a configuration example of the processing unit 2.

The processing unit 2 includes: a box-shaped pod 4; a rotating chuck (substrate holding unit) 5 that holds a substrate W in a horizontal posture in the pod 4 and causes the substrate W to be wound around the center of the substrate W. The rotation axis A1 is rotated; the chemical supply unit 6 is for supplying the liquid medicine to the substrate W held on the rotary chuck 5; the opposite member 7 is opposed to the substrate W held by the rotary chuck 5 The nozzle 8 has a processing fluid discharge port (a processing liquid discharge port 35 and a center gas discharge port 36) opposed to a central portion of the upper surface of the substrate W held by the rotary chuck 5, and is vertically inserted into the opposite member. a central portion of the cleaning liquid supply unit 10 for supplying the cleaning liquid from the inside of the nozzle 8 toward the washing liquid discharge port (inclined discharge port) 32 formed in the nozzle 8; the lower unit (washing liquid blowing) The unit 11 is configured to blow the treatment fluid discharge port (the treatment liquid discharge port 35 and the central gas discharge port 36) from the lower side toward the nozzle 8 while the substrate W is not held by the rotary chuck 5. a liquid; and a cylindrical cup 12 surrounding the rotating collet 5.

The cabin 4 includes a box-shaped partition wall 13 that houses the rotary chuck 5 and the nozzle, and an FFU (Fan Filter Unit) 14 that serves as a blower unit from the partition wall 13 The upper portion conveys clean air (air filtered by the filter) into the partition wall 13; and an exhaust pipe 15 that discharges the gas in the cabin 4 from the lower portion of the partition wall 13. The FFU 14 is disposed above the partition wall 13 and is mounted on the top wall of the partition wall 13. The FFU 14 delivers clean air from the top wall of the partition wall 13 downwardly into the cabin 4. The exhaust pipe 15 is connected to the bottom of the cup body 12, and the gas in the cabin 4 is led out to an exhaust gas treatment device provided in a factory in which the substrate processing apparatus 1 is installed. Therefore, the FFU 14 and the exhaust pipe 15 are formed with a downflow (downflow) that flows downward in the cabin 4. The processing of the substrate W is performed in a state in which a downflow is formed in the chamber 4.

As the rotary chuck 5, a chuck in which a substrate W is sandwiched in a horizontal direction and a substrate W is horizontally held is used. Specifically, the rotary chuck 5 includes a rotary motor 16 , a rotary shaft 17 that is integral with the drive shaft of the rotary motor 16 , and a disk-shaped rotary table 18 that is mounted substantially horizontally on the rotary shaft 17 . Upper end.

A plurality of (three or more, for example, six) holding members 9 are disposed on the upper surface of the turntable 18 and on the peripheral portion thereof. The plurality of holding members 9 are attached to the upper peripheral portion of the turntable 18, and are disposed at appropriate intervals on the circumference corresponding to the outer peripheral shape of the substrate W.

The rotary chuck 5 is not limited to the clamp type. For example, it is also possible to hold the substrate W in a horizontal posture by vacuum-adsorbing the back surface of the substrate W, and in this state, rotate about a vertical rotation axis, thereby making it possible to rotate the substrate W in a horizontal position. The vacuum suction type (vacuum suction cup) held by the substrate W held by the rotary chuck 5 is rotated.

The chemical solution supply unit 6 includes a chemical liquid nozzle 19, a chemical liquid pipe 20 connected to the chemical liquid nozzle 19, a chemical liquid valve 21 interposed to the chemical liquid pipe 20, and a nozzle moving unit 22 for making the chemical liquid nozzle 19 moves. The chemical liquid nozzle 19 is, for example, a straight tube nozzle that discharges liquid in a state of continuous flow. The liquid medicine from the supply of the liquid medicine is supplied to the medicine Liquid piping 20. In the present embodiment, a sulfuric acid/hydrogen peroxide mixture (SPM) having a high temperature (for example, about 170 ° C to about 180 ° C) is supplied to the chemical liquid pipe 20 as a chemical liquid. The heat of reaction with sulfuric acid and hydrogen peroxide is raised to the above-mentioned high temperature SPM, and is supplied to the chemical liquid pipe 20.

When the chemical liquid valve 21 is opened, the high-temperature SPM supplied from the chemical liquid pipe 20 to the chemical liquid nozzle 19 is discharged downward from the chemical liquid nozzle 19. Further, when the chemical liquid valve 21 is closed, the discharge of the high temperature SPM from the chemical liquid nozzle 19 is stopped. The nozzle moving unit 22 is configured such that the high-temperature SPM discharged from the chemical liquid nozzle 19 is supplied to the upper surface of the substrate W, and the chemical liquid nozzle 19 is retracted to one side of the rotary chuck 5 in a plan view. Move between the retracted positions.

3 is a longitudinal sectional view of the opposing member 7. 4 is a bottom view of the opposing member 7. The opposing member 7 will be described with reference to Figs. 2 to 4 .

The opposing member 7 includes a blocking plate 23 and a rotating shaft 24 that is rotatably provided integrally with the blocking plate 23. The blocking plate 23 has a disk shape having a diameter substantially equal to or larger than the substrate W. The shutter 23 has a substrate opposing surface 23a that is circularly opposed to the entire upper surface of the substrate W. A cylindrical through hole 25 penetrating the shutter 23 up and down is formed in a central portion of the opposing surface 23a of the substrate. The through hole 25 is partitioned by a cylindrical inner peripheral surface 25a. A tapered surface 25b that expands outward as it goes downward is formed at an end portion of the inner peripheral surface 25a.

The rotary shaft 24 is provided to be rotatable about a rotation axis A0 (an axis coincident with the rotation axis A1 of the substrate W) which is vertically extended through the center of the shutter 23. The rotating shaft 24 is cylindrical. The inner circumferential surface 24a of the rotary shaft 24 is formed as a cylindrical surface centered on the rotation axis A0. The internal space of the rotating shaft 24 communicates with the through hole 25 of the blocking plate 23. The inner circumferential surface 24a and the inner circumferential surface 25a of the rotating shaft 24 are shaped In the same circumferential surface. The rotating shaft 24 is rotatably supported by a support arm 26 that extends horizontally above the blocking plate 23.

A blocking plate rotating unit (rotating unit) 27 including an electric motor or the like is coupled to the blocking plate 23. The blocking plate rotating unit 27 rotates the blocking plate 23 and the rotating shaft 24 with respect to the support arm 26 about the rotation axis A0. The various driving components constituting the blocking plate rotating unit 27 are housed in a driving component housing space 56 provided inside the rotating shaft 17 and/or inside the support arm 26.

An opposing member lifting unit 28 including an electric motor, a ball screw, and the like is coupled to the support arm 26. The opposing member lifting unit 28 moves the opposing member 7 (the blocking plate 23 and the rotating shaft 24) and the nozzle 8 together with the supporting arm 26 in the vertical direction.

In the opposing member lifting and lowering unit 28, the opposing member 7 and the nozzle 8 are brought close to the substrate facing surface 23a of the blocking plate 23 at a position close to the upper surface of the substrate W held by the rotary chuck 5 (refer to FIG. 11). The vehicle is raised and lowered between the retracted position (see FIG. 9) disposed above the approaching position. The opposing member lifting unit 28 can be, for example, at four positions (a close position, a lower intermediate position (that is, a nozzle cleaning position. See FIG. 13), an upper intermediate position (that is, a flushing position. See FIG. 10), And the retracted position), the shutter 23 is held. The lower intermediate position is a predetermined position between the approach position and the retracted position. The upper intermediate position is a predetermined position between the lower intermediate position and the retracted position.

The nozzle 8 extends in the vertical direction along the axis of rotation A1 which is the vertical axis passing through the center of the shutter 23 and the substrate W. In the present embodiment, the nozzle 8 functions as a central axis nozzle. The nozzle 8 is disposed above the rotary chuck 5. The nozzle 8 is supported by a support arm 26. The nozzle 8 cannot rotate relative to the support arm 26. The nozzle 8 is lifted and lowered together with the shutter 23, the rotating shaft 24, and the support arm 26. The nozzle 8 is inserted into the internal space of the rotating shaft 24. The lower surface of the nozzle 8 is disposed at substantially the same height as the substrate facing surface 23a of the blocking plate 23 or above the substrate facing surface 23a. The nozzle 8 is surrounded by a cylindrical tubular gap 29 formed around the nozzle 8. The gap size of the cylindrical gap 29 is, for example, about 3 mm, and functions as a flow path through which an inert gas flows. The lower end of the cylindrical gap 29 is opened in a ring shape around the nozzle 8, and a peripheral gas discharge port 30 is formed.

The nozzle 8 includes a cylindrical body 31 extending in the up and down direction. The main body 31 has a cylindrical outer peripheral surface 31a and a facing surface (opposing portion) 31b which is provided at the lower end portion of the main body 31 and faces the upper central portion of the substrate W. The cleaning liquid discharge port 32 is formed in the circumferential direction 31a of the main body 31 and in the middle direction of the upper direction of the main body 31 (the distance W1 (for example, about 50 mm) from the lower end of the main body 31). The cleaning liquid discharge port 32 discharges the washing liquid from the inside toward the outside in a plan view. As shown in Fig. 3, the position at which the cleaning liquid discharge port 32 is formed is located below the connection position 29a of the connecting passage 57 of the cylindrical gap 29.

A treatment liquid pipe (treatment fluid pipe) 33 and a gas pipe (treatment fluid pipe) 34 are inserted into the body 31. The treatment liquid pipe 33 and the central gas pipe 34 extend in the vertical direction. The opening provided at the downstream end of the treatment liquid pipe 33 forms a treatment liquid discharge port (process fluid discharge port) 35. The opening provided at the downstream end of the central gas pipe 34 forms a central gas discharge port (process fluid discharge port) 36. The treatment liquid discharge port 35 and the central gas discharge port 36 are disposed at the same height as the lower end surface of the main body 31. In other words, the processing liquid piping 33 and the lower end of the central gas piping 34 are opened to the opposing surface 31b of the main body 31, and the processing liquid discharge port 35 and the central gas discharge port 36 are formed, respectively.

The treatment liquid pipe 33 is connected to the flushing which is provided with the flushing liquid valve 37 Liquid supply pipe 38. When the rinse liquid valve 37 is opened, the rinse liquid (treatment fluid) is discharged downward from the treatment liquid discharge port 35. The rinse liquid supplied to the treatment liquid pipe 33 is, for example, deionized water (DIW), but is not limited to DIW, and may be carbonated water, electrolytic ionized water, hydrogen water, ozone water, and diluted concentration (for example, about 10 ppm to 100 ppm). Any of the hydrochloric acid waters.

The central gas pipe 34 is connected to the central gas supply pipe 40 through which the central gas valve 39 is placed. When the center gas valve 39 is opened, the gas (treatment fluid) is discharged downward from the center gas discharge port 36. An example of the gas supplied to the central gas pipe 34 and the gas supplied to the cylindrical gap 29 is an inert gas. The inert gas is, for example, any of nitrogen gas and clean air.

The cylindrical gap 29 is partitioned between the outer peripheral surface 31a of the main body 31 and the inner peripheral surfaces 25a and 24a of the opposing member 7 (the blocking plate 23 and the rotating shaft 24). The cylindrical gap 29 surrounds the outer peripheral surface 31a of the body 31. The cylindrical gap 29 is connected to the surrounding gas pipe 41 at a predetermined position above the cleaning liquid discharge port 32. The ambient gas pipe 41 is provided with a first gas flow valve 42 for opening and closing the surrounding gas pipe 41, and a first flow rate adjusting valve 43 for adjusting the opening degree of the surrounding gas pipe 41 to adjust the flow rate of the gas supplied to the cylindrical gap 29. Although not shown, the first flow rate adjustment valve 43 includes a valve body in which a valve seat is provided, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between the open position and the closed position. The other flow regulating valves are also the same. In the present embodiment, the gas supply unit is constituted by the surrounding gas pipe 41, the surrounding gas valve 42, and the first flow rate adjusting valve 43.

When the ambient gas valve 42 is opened, the gas flows through the cylindrical gap 29 at a flow rate corresponding to the opening degree of the first flow rate adjusting valve 43, and the gas is discharged downward from the surrounding gas discharge port 30. The gas supplied to the surrounding gas pipe 41 and supplied to the cylinder An example of the gas of the gap 29 is an inert gas. The inert gas is, for example, any of nitrogen gas and clean air.

The cylindrical gap 29 communicates with the drive component accommodating space 56 via the connecting passage 57. A gas seal 58 such as a labyrinth or the like is interposed in the passage 57 such that the ambient gas that drives the component accommodating space 56 does not flow out into the cabin 4 via the connecting passage 57 (the ambient gas that drives the component accommodating space 56 and The ambient gas in the tank 4 is interrupted).

The cleaning liquid supply unit 10 includes a cleaning liquid pipe 44 that is inserted into the inside of the main body 31, a cleaning liquid supply pipe 48 that is connected to the cleaning liquid pipe 44, and a cleaning liquid upper valve 47 that opens and closes. The cleaning liquid supply pipe 48 and the second flow rate adjustment valve 55 adjust the opening degree of the cleaning liquid supply pipe 48 to adjust the flow rate of the cleaning liquid supplied to the cleaning liquid pipe 44. The cleaning liquid pipe 44 includes a pipe 45 that extends in the vertical direction in the vertical direction, and a connecting pipe 46 that connects the lower end 45a of the vertical pipe 45 and the cleaning liquid discharge port 32. The cleaning liquid pipe 44 is not opened at the lower end surface of the body 31. The connecting pipe 46 is a linear pipe and is inclined at a predetermined angle (for example, about 30°) with respect to the vertical direction. Therefore, the cleaning liquid discharge port 32 discharges the cleaning liquid obliquely downward at an inclination of about 30° with respect to the vertical direction. Further, the downstream end (the downstream end of the cleaning liquid pipe) 46a of the connection pipe 46 does not protrude radially outward from the outer peripheral surface 31a of the body 31. In other words, the cleaning liquid discharge port 32 is provided on the same surface as the outer peripheral surface 31a. The vertical pipe 45 and the connecting pipe 46 may be different members or may be integrally formed.

When the cleaning liquid upper valve 47 is opened, the cleaning liquid is discharged obliquely downward from the cleaning liquid discharge port 32. The cleaning liquid supplied to the cleaning liquid pipe 44 is, for example, water. The water is, for example, deionized water (DIW), but is not limited to DIW, and may be any of carbonated water, electrolytic ionized water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 ppm to 100 ppm). The cleaning liquid supplied to the lower nozzle 52 is also the same.

In the cleaning liquid supply pipe 48 and the branching position 48a between the base end of the cleaning liquid pipe 44 and the cleaning liquid upper valve 47, the suction pipe 50 for sucking the cleaning liquid inside the cleaning liquid pipe 44 is branched and connected. One end. A suction valve 51 for opening and closing the suction pipe 50 is interposed in the suction pipe 50. The other end of the suction pipe 50 is connected to a suction device (not shown). When the suction valve 51 is opened, the suction device 51 is vented to the lower portion of the branching position 48a of the cleaning liquid supply pipe 48, and the inside of the downstream portion is sucked. liquid.

Fig. 5 is a transverse cross-sectional view for explaining a flow of the washing liquid discharged from the washing liquid discharge port 32. Fig. 6 is a vertical cross-sectional view for explaining a flow of the washing liquid discharged from the washing liquid discharge port 32. As shown in Fig. 5, the cleaning liquid discharge port 32 extends from the inside to the outside in the radial direction of the body 31 of the nozzle 8.

When the nozzle 8 is cleaned, the blocking plate rotating unit 27 (see FIG. 2) rotates the blocking plate 23 and the rotating shaft 24, and opens the cleaning liquid upper valve 47 (see FIG. 2). As a result, as shown in FIG. 5 and FIG. 6, the opposing member 7 is rotated with respect to the main body 31 of the nozzle 8, and the cleaning liquid discharge port 32 formed on the outer peripheral surface 31a of the main body 31 faces the rotating shaft 24. The inner peripheral surface 24a discharges the washing liquid. Since the inner peripheral surface 24a is rotated with respect to the outer peripheral surface 31a, the washing liquid discharged from the washing liquid discharge port 32 is pulled by the rotation of the inner peripheral surface 24a, and flows downward while rotating. That is, a swirling flow R directed downward is formed in the cylindrical gap 29.

Moreover, the washing liquid discharge port 32 discharges the washing liquid obliquely downward. Since the washing liquid is discharged obliquely downward from the washing liquid discharge port 32, the increase in the washing liquid supplied to the cylindrical gap 29 can be suppressed. Thereby, the swirling flow R directed downward can be formed favorably in the cylindrical gap 29.

The lower unit 11 includes a lower nozzle 52 which is washed upwards and discharged. The liquid; the cleaning liquid lower pipe 53, which guides the cleaning liquid toward the lower nozzle 52; and the cleaning liquid lower valve 54, which is interposed in the cleaning liquid lower pipe 53. When the cleaning liquid lower valve 54 is opened, the cleaning liquid is supplied from the cleaning liquid lower pipe 53 toward the lower nozzle 52. Thereby, the washing liquid is discharged upward from the lower nozzle 52. The cleaning liquid supplied to the lower nozzle 52 is, for example, water.

As shown in FIG. 2, the cup body 12 is disposed on the outer side of the substrate W held by the rotary chuck 5 (the direction separated from the rotation axis A1). The cup 12 is wrapped around the turntable 18. When the processing liquid (chemical liquid or rinsing liquid) is supplied to the substrate W in a state where the substrate W is rotated by the rotary chuck 5, the processing liquid supplied to the substrate W is detached from the periphery of the substrate W. When the processing liquid is supplied to the substrate W, the upper end portion 12a of the cup body 12 that is opened upward is disposed above the rotating table 18. Therefore, the treatment liquid discharged around the substrate W is taken up by the cup 12. Then, the treatment liquid picked up from the cup 12 is sent to a recovery device or a waste liquid device (not shown).

FIG. 7 is a block diagram for explaining an electrical configuration of a main part of the substrate processing apparatus 1.

The control device 3 is configured using, for example, a microcomputer. The control device 3 includes an arithmetic unit such as a CPU, a memory unit such as a fixed memory element and a hard disk drive, and an input/output unit. The memory unit stores the program executed by the arithmetic unit.

The control device 3 controls the operations of the rotary motor 16, the nozzle moving unit 22, the shutter rotating unit 27, the opposing member lifting unit 28, and the like in accordance with a predetermined program. Further, the control device 3 controls the chemical liquid valve 21, the rinse liquid valve 37, the central gas valve 39, the peripheral gas valve 42, the first flow rate adjustment valve 43, the cleaning liquid upper valve 47, the suction valve 51, and the cleaning liquid lower valve. 54. Opening and closing operations of the second flow rate adjusting valve 55 and the like.

FIG. 8 is a flow chart for explaining an example of substrate processing of the substrate processing apparatus 1. Figure 9 is a schematic cross-sectional view for explaining the chemical liquid step (S2). Figure 10 is used to say A schematic cross-sectional view of the rinsing step (S3). Figure 11 is a schematic cross-sectional view for explaining the spin drying step (S4).

Hereinafter, an example of substrate processing will be described with reference to FIGS. 2, 7, and 8. And it is suitable to refer to FIG. 9 to FIG. This substrate processing example is a photoresist removal process for removing the photoresist formed on the upper surface of the substrate W.

When the substrate W is subjected to the photoresist removal process by the processing unit 2, the substrate W after the ion implantation process at a high dose is carried into the interior of the pod 4 (step S1). The ambient gas valve 42 is opened from the front of the loading of the substrate W, and the inert gas from the surrounding gas pipe 41 is supplied to the cylindrical gap 29. The supply flow rate at this time (that is, the discharge flow rate from the ambient gas discharge port 30) is adjusted to a small flow rate (about 10 (liter/min)) by the adjustment of the first flow rate adjustment valve 43. It is assumed that the substrate W that has been carried in has not been subjected to a process for ashing the photoresist.

Specifically, the control device 3 retracts the opposing member 7 and the nozzle 8 to the retracted position, and the substrate transfer robot CR holding the substrate W in a state where the chemical liquid nozzle 19 is retracted from above the rotary chuck 5 (refer to the figure) 1) The robot H (see FIG. 1) enters the inside of the cabin 4, and the substrate W is transferred to the spin chuck 5 with the surface of the substrate W (the photoresist forming surface) facing upward. Then, the control device 3 starts rotating the substrate W by the rotation motor 16. Then, the substrate W is raised to a predetermined liquid processing speed (in the range of 1 to 500 rpm, for example, about 10 rpm), and maintained at this liquid processing speed.

When the rotation speed of the substrate W reaches the liquid processing speed, the control device 3 performs a chemical liquid step of supplying the high temperature SPM to the substrate W (step S2). In the chemical liquid step (S2), the SPM discharged from the chemical liquid nozzle 19 is immersed in the upper center portion of the substrate W.

Specifically, the control device 3 controls the nozzle moving unit 22 to move the chemical liquid nozzle 19 from the home position toward the center position. Thereby, the chemical liquid nozzle 19 is disposed above the central portion of the substrate W.

After the chemical liquid nozzle 19 is placed above the substrate W, the control device 3 opens the chemical liquid valve 21. Thereby, a high temperature (for example, about 170 ° C to about 180 ° C) SPM is discharged from the discharge port of the chemical liquid nozzle 19, and is immersed in the central portion of the upper surface of the substrate W. The SPM that is placed on the upper surface of the substrate W is subjected to centrifugal force generated by the rotation of the substrate W, and flows outward along the upper surface of the substrate W. Thereby, as shown in FIG. 9, the entire upper surface of the substrate W is covered by the liquid film 70 of SPM. Thereby, the photoresist is removed from the surface of the substrate W at a high temperature SPM.

In the chemical liquid step (S2), a large amount of SPM mist is generated around the upper surface of the substrate W by the supply of the high temperature SPM toward the substrate W, and the SPM mist floats above the substrate W. In the chemical liquid step (S2), the opposing member 7 and the nozzle 8 are located at the retracted position (for example, the substrate opposing surface 23a of the blocking plate 23 is separated upward from the upper surface of the rotating table 18 by a predetermined interval W2 (refer to the figure). 9). The interval W2 is, for example, about 150 mm), and an inert gas having a small flow rate (for example, about 10 (liter/min)) is discharged from the surrounding gas discharge port 30, but due to the SPM in the chemical liquid step (S2) The amount of mist generated is large, so the SPM mist may still enter the cylindrical gap 29 from the surrounding gas discharge port 30. In this case, the SPM mist may adhere to the inner circumferential surface 25a of the blocking plate 23, the inner circumferential surface 24a of the rotating shaft 24, or the outer circumferential surface 31a of the body 31. It can be inferred that the SPM mist will enter the depth of the cylindrical gap 29. Further, it is also possible that the SPM mist adheres to the lower end portion (opposing portion) 8a of the nozzle 8. The chemical mist (such as SPM mist) adhering to the nozzles 8 causes dust particles to become a cause of substrate contamination.

After the SPM spit starts and after the predetermined chemical treatment period, the knot The liquid medicine step (S2). Specifically, the control device 3 closes the chemical liquid valve 21, stops the discharge of the high temperature SPM from the chemical liquid nozzle 19, and then controls the nozzle moving unit 22 to retract the chemical liquid nozzle 19 to the retracted position.

Next, a rinsing step of supplying the rinsing liquid to the upper surface of the substrate W is performed (step S3). Specifically, the control device 3 controls the opposing member lifting unit 28, and as shown in FIG. 10, the opposing member 7 and the nozzle 8 are disposed at the upper intermediate position. The upper intermediate position is, for example, a position at which the substrate opposing surface 23a of the blocking plate 23 is separated upward from the upper surface of the rotating table 18 by about 60 mm.

Then, the control device 3 opens the flushing liquid valve 37. As a result, as shown in FIG. 10, the rinse liquid is discharged from the processing liquid discharge port 35 of the nozzle 8 toward the center portion of the upper surface of the substrate W. The rinsing liquid discharged from the processing liquid discharge port 35 is immersed in the center portion of the upper surface of the substrate W, and is subjected to centrifugal force generated by the rotation of the substrate W, and flows toward the peripheral portion of the substrate W on the upper surface of the substrate W. Then, the SPM on the substrate W is pushed outward by the rinsing liquid, and is discharged toward the periphery of the substrate W, so that the liquid film 70 of the SPM on the substrate W is covered with the entire surface of the substrate W. The liquid film 80 is replaced. That is, the SPM is rinsed by the rinse liquid. Then, when a predetermined time elapses after the flushing liquid valve 37 is opened, the control device 3 closes the flushing liquid valve 37 to stop the discharge of the flushing liquid from the processing liquid discharge port 35.

Next, a spin drying step of drying the substrate W is performed (step S4). Specifically, the control device 3 controls the opposing member lifting unit 28 to lower the opposing member 7 and arrange it at the approaching position. The approaching position is, for example, a position where the substrate opposing surface 23a of the blocking plate 23 is separated upward by about 1.5 mm from the upper surface of the rotating table 18, and when the opposing member 7 is in the approaching position, the blocking plate 23 places the upper surface of the substrate W. Interrupted from the space around it.

Further, the control device 3 controls the rotary motor 16 to accelerate the substrate W to a dry rotation speed (for example, several thousand rpm) which is larger than the rotation speed of the chemical liquid step (S2) and the rinsing step (S3), and the dry rotation speed is thereby made The substrate W is rotated. Thereby, a large centrifugal force is applied to the liquid on the substrate W, and the liquid adhering to the substrate W is detached from the periphery of the substrate W. In this manner, the liquid is removed from the substrate W, and the substrate W is further dried.

Further, in the spin drying step (S4), the control device 3 controls the shutter rotation unit 27 to rotate the shutter 23 and the rotary shaft 24 at a high speed in the same direction and at substantially the same speed as the substrate W.

Further, in the spin drying step (S4), the control device 3 adjusts the first flow rate adjusting valve 43 to increase the flow rate of the inert gas supplied from the surrounding gas pipe 41 to the cylindrical gap 29 to a large flow rate (for example, about 150 liters /Minute)). Thereby, a stable airflow of the inert gas flowing from the central portion of the substrate W to the peripheral portion is generated in the gap between the upper surface of the substrate W and the substrate opposing surface 23a of the blocking plate 23, and the vicinity of the upper surface of the substrate W is further formed. The ambient gas is interrupted from its surroundings.

Then, when a predetermined time elapses after the high-speed rotation of the substrate W is started, the control device 3 controls the rotary motor 16 to stop the rotation of the substrate W driven by the rotary chuck 5, and controls the shutter rotation unit 27 to cause the shutter 23 and The rotation of the rotary shaft 24 is stopped. Moreover, the control device 3 adjusts the first flow rate adjustment valve 43 to reduce the flow rate of the inert gas supplied from the surrounding gas pipe 41 to the cylindrical gap 29 to a small flow rate (for example, about 10 (liter/min)).

Next, the substrate W is carried out from the inside of the cabin 4 (step S5). Before the substrate W is carried out, the control device 3 controls the opposing member lifting unit 28 to raise the opposing member 7 and the nozzle 8 to the retracted position.

Next, the control device 3 causes the robot H of the substrate transfer robot CR Enter the interior of the cabin 4. Then, the control device 3 causes the robot H of the substrate transfer robot CR to hold the substrate W on the rotary chuck 5. Then, the control device 3 retracts the robot H of the substrate transfer robot CR from the inside of the cabin 4. Thereby, the processed substrate W is carried out from the cabin 4.

Further, in the above substrate processing example, in the chemical liquid step (S2), after the high temperature SPM is supplied to the substrate W, H ₂ O _{2 may be} supplied to the upper surface of the substrate W. In this case, the SPM on the substrate W is replaced by H ₂ O ₂ , and soon, the entire upper surface of the substrate W is covered with a liquid film of H ₂ O ₂ .

Further, in the above substrate processing example, the second chemical liquid supply step of supplying the chemical liquid onto the upper surface of the substrate W may be performed after the rinsing step (S3) is completed. In this case, it is preferable that the chemical liquid used in the second chemical liquid step is a chemical liquid different from the chemical liquid used in the chemical liquid step (S2). When high-temperature SPM is used as the chemical liquid in the chemical liquid step (S2), hydrofluoric acid and SC1 (including a mixed liquid of NH ₄ OH and H ₂ O ₂ ) can be used as the chemical liquid in the second chemical liquid step. In the case where the second chemical liquid step is performed, a second rinsing step of rinsing the chemical liquid on the substrate W with the rinsing liquid is then performed.

However, in the chemical liquid step (S2), a large amount of chemical mist (SPM mist, etc.) generated around the upper surface of the substrate W not only adheres to the lower end portion 8a of the nozzle 8, but may also adhere to the outer periphery of the body 31. The surface 31a, the inner circumferential surface 24a of the rotating shaft 24, or the inner circumferential surface 25a of the blocking plate 23. The chemical mist (such as SPM mist) adhering to the nozzles 8 causes dust particles to become a cause of substrate contamination. In the spin drying step (S4), the inert gas having a large flow rate flows through the cylindrical gap 29, and the dust particles adhering to the inner peripheral surface 24a or the outer peripheral surface 31a of the main body 31 may be discharged from the surrounding gas discharge port 30. . In the spin drying step (S4), if the dust particles are discharged onto the upper surface of the substrate W, the substrate W after the chemical liquid treatment is contaminated.

In order to wash the chemical mist adhering to the outer surface (outer peripheral surface 31a or the opposite surface 31b) of the main body 31 of the nozzle 8, it is conceivable to perform the countermeasure of blowing the washing liquid to the nozzle 8 from below (the following description is directed to the opposite direction). Partial washing step). However, in this measure, only the portion in the vicinity of the surrounding gas discharge port 30 in the cylindrical gap 29 can be washed. As described above, since the chemical mist (SPM mist or the like) enters the depth of the cylindrical gap 29, it is necessary to wash the entire cylindrical gap 29 well.

Therefore, in the substrate processing example, the nozzle cleaning step of the cleaning nozzle 8 is prepared (step S6, which is indicated by a broken line in Fig. 8). The nozzle cleaning step (S6) is not performed every time the substrate processing example is performed, but is performed every predetermined time or every predetermined number of substrates. That is, after the substrate W is carried out, when the nozzle is not washed, a new substrate process is started on the next substrate W. On the other hand, after the substrate W is carried out, if the nozzle is cleaned, the nozzle cleaning step (S6) is performed.

In the nozzle cleaning step (S6), the cylindrical gap 29 is washed by the cleaning liquid, and the lower end portion 8a of the nozzle 8 is closed by the cleaning liquid (that is, the treatment liquid discharge port 35 and the central gas are discharged). The area of the outlet 36 is washed (the cleaning step of the opposite part).

Fig. 12 is a flow chart for explaining the nozzle cleaning step (S6) shown in Fig. 8. Figure 13 is a schematic cross-sectional view for explaining the nozzle washing step (S6).

The ambient gas valve 42 is in an open state from the start of the nozzle cleaning step (S6). At this time, the supply flow rate of the inert gas from the surrounding gas pipe 41 to the cylindrical gap 29 is adjusted to a small flow rate (for example, about 10 (liter/min)).

In the nozzle cleaning step (S6), the control device 3 controls the opposing member lifting unit 28 to lower the opposing member 7 and the nozzle 8 and arrange them at the lower intermediate position (step T1). This lower intermediate position is, for example, the opposite surface 31b of the body 31 of the nozzle 8. The position of the space W3 (refer to FIG. 13) is separated upward from the upper surface of the turntable 18. The interval W3 is, for example, about 10 mm.

After the opposing member 7 and the nozzle 8 are disposed at the lower intermediate position, the control device 3 controls the blocking plate rotating unit 27 to rotate the blocking plate 23 at the nozzle washing speed (for example, about 800 rpm) (T2: rotation step). . Thereby, the blocking plate 23 and the rotating shaft 24 are relatively rotated with respect to the nozzle 8. Further, simultaneously with the start of the rotation of the shutter 23 and the rotary shaft 24, the control device 3 controls the rotary motor 16 while maintaining the state in which the nozzle 8 is stationary, so that the rotary table 18 has a predetermined low rotational speed (for example, 100 rpm) rotation.

When the rotation speed of the shutter 23 reaches the nozzle cleaning speed, the control device 3 opens the cleaning liquid upper valve 47 (see FIG. 2) and the cleaning liquid lower valve 54 (see FIG. 2) (step T3).

By opening the cleaning liquid upper valve 47, the washing liquid is discharged obliquely downward from the washing liquid discharge port 32 (washing liquid discharging step). The discharge flow rate of the washing liquid discharged from the washing liquid discharge port 32 is, for example, about 800 (liter/min). As a result, as shown in FIG. 5 and FIG. 6, the opposing member 7 is rotated from the main body 31 of the nozzle 8 to the rotating shaft 24 from the cleaning liquid discharge port 32 formed on the outer peripheral surface 31a of the main body 31. The inner peripheral surface 24a discharges the washing liquid. As a result, a swirling flow R directed downward is formed in the cylindrical gap 29.

In addition, in synchronization with the discharge of the cleaning liquid from the cleaning liquid discharge port 32, the inert gas is supplied from a portion above the supply position of the cleaning liquid supplied from the cleaning liquid discharge port 32 in the cylindrical gap 29 ( Gas supply step). Thereby, the rise of the washing liquid supplied to the cylindrical gap 29 can be suppressed, and the swirling flow R directed downward can be formed more satisfactorily.

In addition, by opening the cleaning liquid lower valve 54, the lead nozzle 52 is directed toward the lead The cleaning liquid is discharged vertically, and the cleaning liquid is blown to the lower end portion (opposing portion) 8a of the nozzle 8, and the lower end portion 8a is washed (the cleaning step of the opposite portion). At this time, the discharge flow rate of the cleaning liquid from the lower nozzle 52 is such that the cleaning liquid which is blown upward from the lower nozzle 52 reaches the lower end portion of the nozzle 8 disposed at the lower intermediate position (the position shown in FIG. 12). The flow rate of 8a, for example, about 1500 (liters per minute).

The discharge of the cleaning liquid from the cleaning liquid discharge port 32 and the lower nozzle 52 is continued until a predetermined washing period (for example, about 30 seconds) elapses (step T4).

When the washing period has elapsed since the discharge of the washing liquid has elapsed (YES in step T4), the control device 3 closes the cleaning liquid upper valve 47 and the cleaning liquid lower valve 54 (step T5). Thereby, the discharge of the washing liquid from the washing liquid discharge port 32 and the discharge of the washing liquid from the lower nozzle 52 are stopped.

After the cleaning liquid upper valve 47 is closed, the control device 3 opens the suction valve 51. Thereby, the washing liquid in the downstream side portion of the divergent position 48a in the cleaning liquid supply pipe 48 is sucked (step T6). After the SPM is sucked to the front end (lower end surface) of the SPM and retreated to a predetermined position, the control device 3 closes the suction valve 51.

Further, after the cleaning liquid upper valve 47 and the cleaning liquid lower valve 54 are closed, the control device 3 controls the blocking plate rotating unit 27 to stop the rotation of the blocking plate 23 and the rotating shaft 24 (step T7), and controls The opposing member lifting unit 28 raises the opposing member 7 and the nozzle 8 to the retracted position (step T8). Thereby, the nozzle washing step (S6) is ended.

As described above, according to the present embodiment, the cleaning liquid discharge port 32 formed on the outer peripheral surface 31a of the main body 31 is opposed to the inner peripheral surface 24a of the opposing member 7 while the main body 31 of the opposing member 7 and the nozzle 8 are relatively rotated. Spit out the cleaning solution. Since the inner peripheral surface 24a is rotated with respect to the outer peripheral surface 31a, the washing liquid discharged from the washing liquid discharge port 32 is pulled by the rotation of the inner peripheral surface 24a, and flows downward while swirling. That is, The cylindrical gap 29 is generated with a swirling flow. Therefore, centrifugal force and gravity act on the cleaning liquid flowing through the cylindrical gap 29, and the physical force can be removed to adhere to the inner circumferential surface 25a, the inner circumferential surface 24a, and/or the outer circumferential surface 31a. Contaminants. Thereby, the cylindrical gap 29 can be satisfactorily washed.

Further, the cleaning liquid supply unit 10 includes a cleaning liquid pipe 44 that is inserted into the inside of the body 31. Further, the cleaning liquid pipe 44 includes a vertical pipe 45 and a connecting pipe 46 extending obliquely downward from the upper end of the vertical pipe 45. By this means, the cleaning liquid pipe 44 can be easily inserted into the inside of the main body 31, and the washing liquid is discharged from the washing liquid discharge port 32 formed on the outer peripheral surface 31a toward the inner peripheral surface 24a.

Since the opposing member 7 is rotatable, it is necessary to arrange the cleaning liquid pipe 44 so as not to interfere with the opposing member 7. In the present embodiment, since the cleaning liquid pipe 44 is inserted into the inside of the main body 31, the cleaning liquid can be satisfactorily supplied to the cleaning liquid discharge port 32 without interfering with the opposing member 7.

Further, as described above, the labyrinth of the drive unit accommodating space 56 (see FIG. 2) and the ambient gas in the cabin 4 (see FIG. 2) are interrupted, and a labyrinth is provided in the connecting passage 57 (refer to FIG. 2). Wait for the gas seal 58 (see Figure 2). When the liquid such as the cleaning liquid is supplied into the driving component housing space 56, the driving components in the driving component housing space 56 may be affected. Therefore, it is desirable that the liquid such as the cleaning liquid does not enter the connecting passage 57 from the cylindrical gap 29. . Since the cleaning liquid discharge port 32 is disposed below the connection position 29a of the connecting passage 57 of the cylindrical gap 29, it is difficult for the cleaning liquid to enter the connecting passage 57. In particular, in the present embodiment, the cleaning liquid is discharged obliquely downward from the cleaning liquid discharge port 32, and is synchronized with the discharge of the cleaning liquid from the cleaning liquid discharge port 32, and is in the cylindrical gap 29 from above. Since the inert gas is supplied, the rise of the washing liquid supplied to the cylindrical gap 29 can be surely suppressed. Thereby, the swirling flow R toward the lower side can be formed favorably.

Further, in the present embodiment, the cleaning of the cylindrical gap 29 (discharge of the cleaning liquid from the cleaning liquid discharge port 32) and the cleaning of the lower end portion 8a of the nozzle 8 are performed in synchronization (the cleaning step of the opposite portion) ). Thereby, the cleaning of the nozzle 8 can be performed in a short time as compared with the case where the cleaning of the cylindrical gap 29 and the cleaning of the lower end portion 8a of the nozzle 8 are performed at different times.

Fig. 14 is a schematic cross-sectional view showing a configuration example of a processing unit 202 according to another embodiment of the present invention.

In the embodiment shown in FIG. 14 , the same components as those in the above-described embodiment (the embodiment shown in FIG. 1 to FIG. 13 ) are denoted by the same reference numerals as those in FIGS. 1 to 13 , and the description thereof is omitted. The main difference between the processing unit 202 and the processing unit 2 of the above-described embodiment is that the opposing member 207 is supported by the rotating chuck 205 integrally rotatable in the processing liquid processing. That is, the opposing member 207 is a driven type opposing member (blocking member) that rotates with the rotating chuck 205.

The processing unit 202 includes a cabin 4, a rotating chuck (substrate holding unit) 205 that holds a substrate W in a horizontal posture in the cabin 4, and causes the substrate W to wrap around a vertical axis of rotation A1 passing through the center of the substrate W. Rotating; the chemical supply unit 6; the facing member 207 facing the substrate W held by the rotating chuck 205; the nozzle 8 being inserted into the central portion of the facing member 207; the cleaning liquid supply Unit 10; lower unit 11; and cup 12.

The rotary chuck 205 is the same as the rotary chuck 5, and is a clamp type in which the substrate W is sandwiched in the horizontal direction and the substrate W is horizontally held. The rotary chuck 205 includes a rotary motor 16 , a rotary shaft 17 , and a disk-shaped rotary table 218 that is mounted substantially horizontally at the upper end of the rotary shaft 17 . A plurality of (three or more, for example, six) clamps are disposed on the circumference of the rotary table 218 and centered on the rotation axis A1. Member 9. A plurality of (three or more) opposing member supporting portions 231 for supporting the opposing member 207 from below are disposed on the upper surface of the rotary table 218 and centered on the rotation axis A1. The distance between the opposing member support portion 231 and the rotation axis A1 is set to be larger than the distance between the clamp member 9 and the rotation axis A1.

Further, the rotating chuck 205 is not limited to the clamp type. For example, the back surface of the substrate W may be vacuum-adsorbed, and the substrate W may be held in a horizontal posture, and in this state, rotated about a vertical rotation axis. The vacuum suction type (vacuum suction cup) which is rotated by the substrate W held by the rotary chuck 205.

FIG. 15 is a cross-sectional view showing the opposite member 207 included in the enlarged processing unit 202. The opposing member 207 will be described with reference to Figs. 14 and 15 .

The opposing member 207 includes: a blocking plate 223; an engaging portion 232 that is integrally movably mounted to the blocking plate 223; and a supporting portion 233 that is attached to the front end of the support arm 226 and that is engaged with the engaging portion 232. The combination is used to support the shutter 223 from above.

The blocking plate 223 has a disk shape having a larger diameter than the substrate W. The blocking plate 223 has a circular substrate facing surface 223a that is circularly opposed to the entire upper surface of the substrate W, an annular dome portion 223b that protrudes downward from the peripheral edge portion of the substrate opposing surface 223a, and The rotary chuck abutting portion 223c protrudes slightly inward from the periphery of the substrate opposing surface 223a. A through hole 225 that vertically penetrates the opposing member 207 is formed in a central portion of the substrate facing surface 223a. The through hole 225 is partitioned by a cylindrical inner peripheral surface 225a. It is also possible to form a tapered surface which is developed outward toward the lower side at the lower end portion of the inner peripheral surface 225a.

The engaging portion 232 is formed on the upper surface of the blocking plate 223, and has a cylindrical portion 230 fixed in a state surrounding the periphery of the through hole 225, a flange portion 234 extending radially outward from the upper end of the cylindrical portion 230, and a flange portion 234 formed thereon. First unevenness on the upper surface of the flange portion 234 Department 235. The flange portion 234 is located above the flange support portion 229 which will be described later in the support portion 233, and the outer circumference of the flange portion 234 is larger than the inner circumference of the flange support portion 229.

The first uneven portion 235 is provided by alternately arranging an annular concave portion and an annular convex portion concentrically. In other words, the first uneven portion 235 has a comb-tooth shape.

The support portion 233 has, for example, a substantially disk-shaped support portion body 236; a horizontal flange support portion 229 centered on the central axis A3; and a connection portion 237 that connects the support portion body 236 and the flange support portion 229; The second uneven portion 238 is formed below the flange portion 234. The support body 236 is fixed to the front end of the support arm 226.

The second uneven portion 238 is opposed to the upper side of the first uneven portion 235 of the engaging portion 232. The second uneven portion 238 is provided by alternately arranging an annular concave portion and an annular convex portion concentrically. In other words, the second uneven portion 238 has a comb-tooth shape. When the support arm 226 is in the lower position (the state in which the blocking plate 223 is supported by the rotary chuck 205), the first uneven portion 235 and the second uneven portion 238 are meshed with each other with a small gap therebetween, and by the second The uneven portion 238 and the first uneven portion 235 are partitioned with a labyrinth 240.

The support arm 226 is supported by an arm support shaft 241 that extends substantially vertically on the side of the rotary chuck 205. An arm swing unit 242 composed of a motor or the like is coupled to the arm support shaft 241. An arm lifting unit 245 composed of a servo motor or a ball screw mechanism or the like is coupled to the arm support shaft 241.

By the arm swinging unit 242, the support arm 226 can be swung in the horizontal plane centering on the vertical swing axis A2 set on the side of the rotary chuck 205. By this swinging, the opposing member 207 can be rotated about the swing axis A2.

The nozzle 8 is surrounded by a cylindrical tubular gap formed around the nozzle 8 in the same manner as in the embodiment shown in Figs. 1 to 13 . Since the cylindrical gap is the same as the cylindrical gap 29 of the above-described embodiment, the same reference numerals are given to the same components, and a detailed description of the cylindrical gap will be omitted. In the present embodiment, the nozzle 8 has a basic form as a scanning nozzle that can change the supply position of the processing fluid on the upper surface of the substrate W.

By the arm lifting unit 245, the support arm 226 can be raised and lowered between the lower position (the position shown in FIG. 15) and the upper position (the position shown in FIG. 14), whereby the opposing member 207 can be blocked. The plate 223 is close to the processing position (the position shown in FIG. 15) held on the upper surface of the substrate W of the rotary chuck 205, and the retracted position (the position shown in FIG. 14) which is largely retracted above the rotary chuck 205. ) Lifting between.

Specifically, in a state where the support arm 226 is at the upper position, the flange support portion 229 of the support portion 233 is engaged with the flange portion 234, and the engagement portion 232, the blocking plate 223, and the nozzle 8 are supported by the support portion. Part 233. That is, the shutter 223 is suspended by the support arm 226.

When the support arm 226 is in the upper position, the protrusion 243 protruding from the upper surface of the flange support portion 229 is engaged with the hole 244 formed in the flange portion 234 at intervals in the circumferential direction, and the shutter is blocked. The 223 is positioned in the circumferential direction on the support portion 233.

When the arm lifting unit 245 lowers the support arm 226 from the upper position, the blocking plate 223 also descends from the retracted position. Then, when the rotary chuck abutting portion 223c of the blocking plate 223 abuts against the opposing member supporting portion 231, the blocking plate 223 and the nozzle 8 are supported by the opposing member supporting portion 231. Then, if the arm lifting unit 245 lowers the support arm 226, the flange support portion 229 of the support portion 233 is engaged with the flange portion 234. The engagement portion 232, the blocking plate 223, and the nozzle 8 are detached from the support portion 233 and supported by the rotary chuck 205. In this state, the shutter 223 is rotated in accordance with the rotation of the rotary chuck 205 (the rotary table 218).

When the processing liquid processing is performed on the substrate W held by the rotary chuck 205, the control device 3 controls the arm swing unit 242 to swing the support arm 226 around the arm support shaft 241, and arranges the opposing member 207 above the rotary chuck 205. . In this state, the arm lifting unit 245 lowers the support arm 226. After the engaging portion 232, the blocking plate 223, and the nozzle 8 are transferred to the rotating chuck 205, the support arm 226 is stopped to descend at the lower position. Thereby, the blocking plate 223 is placed at the processing position (the position shown in FIG. 15). In this state, the shutter 223 rotates in accordance with the rotation of the rotary chuck 205 (the rotary table 218). In other words, when the substrate W is held by the rotary chuck 205 and the support arm 226 is placed at the lower position, the rotational driving force is input from the rotary motor 16 to the rotary shaft 17, so that the rotary table 218 and the substrate W can be rotated. The blocking plate 223 is rotated about the rotation axis A1.

In this state, that is, the state in which the blocking plate 223 is disposed at the processing position (the position shown in FIG. 15) (the state in which the support arm 226 is at the lower position), the first uneven portion 235 and the second uneven portion 238 are not in contact with each other. And close to each other. The first uneven portion 235 and the second uneven portion 238 each having a comb-tooth shape are meshed with each other with a slight gap therebetween, whereby the labyrinth 240 is partitioned between the support portion 233 and the engaging portion 232. The labyrinth 240 is in communication with the cylindrical gap 29. At the time of the processing of the substrate W, when the blocking plate 223 is rotated in accordance with the rotation of the rotary chuck 205, the first uneven portion 235 is rotated, but the second uneven portion 238 is not rotated.

A gas supply path 250 for supplying a gas (for example, an inert gas such as nitrogen gas) to the labyrinth 240 is connected to the labyrinth 240. The gas supply channel 250 includes: a first flow channel 251 extending from the support arm 226 to the support body 236; the ring The first branch pipe 252 is connected to the first flow path 251; the plurality of gas injection ports 255 are opened below the support portion body 236; and the annular second branch pipe 254 is connected to each gas injection. Port 255; and 1 or a plurality of second flow passages 253 connecting the first branch pipe 252 and the second branch pipe 254. The gas from the gas supply source is supplied to the first flow path 251 of the gas supply path 250. An example of the gas supplied to the first flow path 251 is an inert gas. The inert gas is, for example, any of nitrogen gas and clean air. The gas supplied to the gas supply path 250 is discharged from the gas injection port 255 toward the labyrinth 240. The gas discharged from the gas injection port 255 is supplied to the labyrinth 240 and then supplied to the cylindrical gap 29. That is, a gas downflow is formed in the cylindrical gap 29 by the gas discharge from the gas injection port 255. Further, the discharge of the gas from the gas injection port 255 serves as a gas seal for preventing the entry of the ambient gas from the side of the cylindrical gap 29 in the labyrinth 240.

The cleaning liquid discharge port 32 (see FIG. 3 and the like) is disposed below the connection position 29b of the labyrinth of the cylindrical gap 29.

Also in the present embodiment, as in the case of the embodiment shown in Figs. 1 to 13, the nozzle cleaning step (S6. See Figs. 8 and 12) is performed.

In the present embodiment, by the execution of the nozzle cleaning step (S6), in addition to the functions and effects described in the embodiments shown in Figs. 1 to 13, the following effects can be obtained.

That is, a liquid such as a cleaning liquid is not required to be supplied into the labyrinth 240. Since the cleaning liquid discharge port 32 (see FIG. 3 and the like) is disposed below the connection position 29b of the labyrinth of the cylindrical gap 29, it is difficult for the washing liquid discharged from the washing liquid discharge port 32 to enter the labyrinth 240. In particular, the cleaning liquid is discharged from the cleaning liquid discharge port 32 obliquely downward, and is synchronized with the discharge of the cleaning liquid from the cleaning liquid discharge port 32. Since the inert gas is supplied from the upper side in the cylindrical gap 29, the rise of the washing liquid supplied to the cylindrical gap 29 can be surely suppressed. Thereby, the entry of the cleaning liquid toward the labyrinth 240 can be surely prevented.

Although the two embodiments of the present invention have been described above, the present invention may be embodied in other forms.

For example, in the chemical liquid step (S2), as in the case of the above embodiment, in the case where SPM is used as the chemical liquid, in order to favorably remove the photoresist formed on the upper surface (surface) of the substrate W, the substrate may be used. A method of supplying a lower temperature SPM to the upper surface of W and heating the upper surface of the substrate W with an infrared heater or the like. In this case, a large amount of SPM mist is generated around the upper surface of the substrate W in the chemical liquid step (S2), and the SPM mist may enter the cylindrical gap 29 from the surrounding gas discharge port 30, so that the nozzle is used for washing. The washing of the nozzle 8 in the step (S6) can be effectively dealt with.

Further, in the chemical liquid step (S2), a chemical liquid other than SPM may be used as the chemical liquid. Specifically, the chemical solution may also be H ₂ O ₂ , sulfuric acid, IPA (isopropyl alcohol), hydrofluoric acid, SC1 (including a mixture of NH ₄ OH and H ₂ O ₂ ), SC ₂ (containing HCl and H _{2 ).} Mixture of O ₂ ), ammonium fluoride, buffered hydrofluoric acid (mixture of hydrofluoric acid and ammonium fluoride), FFOM (liquid containing HF and O ₃ ), AOM (liquid containing NH ₄ OH and O ₃ ) ), HOM (liquid containing H ₂ SO ₄ and O ₃ ), and the like.

Further, in each of the above embodiments, the case where the main body 31 of the nozzle 8 is columnar (cylindrical) has been described, but the main body may have a cylindrical shape. In other words, the treatment fluid pipe (the treatment liquid pipe 33 or the gas pipe 34) and the cleaning liquid pipe 44 may be inserted into the tubular body.

Further, in each of the above embodiments, the case where the main body 31 of the nozzle 8 is an outer cylinder has been described, but the outer peripheral surface of the main body may not be a cylindrical surface. It can be constituted by a polygonal cylinder surface centered on the rotation axis A0. In this case, a substantially cylindrical tubular gap 29 is formed between the inner circumferential surfaces 25a and 24a of the opposing member 7 and the outer circumferential surface 31a of the main body 31. Similarly, the inner circumferential surfaces 25a and 24a of the opposing member 7 may be constituted by a polygonal cylindrical surface. However, in order to realize the smooth flow of the swirling flow R, it is preferable that the inner circumferential surfaces 25a and 24a are cylindrical surfaces.

Further, the case where the connecting passage 57 is connected to the cylindrical gap 29 and the driving component accommodating space 56 has been described. However, the connecting passage 57 may be a space that connects the cylindrical gap 29 and other spaces. Specifically, the connecting passage 57 can also communicate with the cylindrical gap 29 and the inside of the cabin 4.

Further, the washing liquid used for washing the nozzle 8 is not limited to water such as deionized water (DIW), and a washing liquid (for example, SC1 (including a mixture of NH ₄ OH and H ₂ O ₂ ) may be used. )).

Further, in the nozzle cleaning step (S6), as a method of relatively rotating the nozzle 8 and the opposing member 7 (rotating shaft 24), the nozzle 8 can be rotated while the opposing member 7 is stationary, and the opposing direction can be made. Both the member 7 and the nozzle 8 rotate in mutually opposite directions.

Further, in each of the above-described embodiments, the nozzle 8 is provided with a central axis nozzle in which the processing liquid pipe 33 (treatment fluid pipe) and the central gas pipe 34 (treatment fluid pipe) are provided, but is provided in the center axis nozzle. The treatment fluid pipe may include one or more process liquid pipes, but does not include a gas pipe, or may include one or more gas pipes, but does not include a treatment liquid pipe.

Further, in the nozzle cleaning step (S6), the rotation of the rotating shaft 24 and the blocking plate 23 may be performed without rotating the rotating table 18.

In addition, in the nozzle cleaning step (S6), the gas from the surrounding gas can also be stopped. The supply of the inert gas of the pipe 41 toward the cylindrical gap 29 is provided.

Further, the cylindrical gap 29 may be washed at different timings (discharge of the cleaning liquid from the cleaning liquid discharge port 32) and the lower end portion 8a of the nozzle 8 may be washed (from the cleaning unit of the unit 11 below). Blowing).

Moreover, the discharge direction of the washing liquid from the washing liquid discharge port 32 is not limited to the obliquely downward direction, and may be a horizontal direction. In this case, as in the above embodiment, it is desirable to form the descending gas flow of the inert gas in the nozzle cleaning step (S6).

Further, the treatment fluid pipe may not be inserted into the body 31. That is, the body 31 may not be the body of the nozzle 8.

In addition, the cleaning liquid pipe 44 does not include the vertical pipe 45 and the connection pipe 46 that connects the lower end of the vertical pipe 45 and the cleaning liquid discharge port 32, but bends the cleaning liquid pipe 44 and The downstream end is connected to the form of the cleaning liquid discharge port 32.

In addition, the cleaning liquid supply unit may supply the cleaning liquid to the cleaning liquid discharge port 32 by a method other than inserting the cleaning liquid pipe 44 into the inside of the main body 31.

Further, in each of the above-described embodiments, the case where the substrate processing apparatus 1 is a device for processing the disk-shaped substrate W has been described. However, the substrate processing device 1 may be a polygonal substrate for processing a glass substrate for a liquid crystal display device or the like. Substrate device.

Although the embodiments of the present invention have been described in detail, the present invention is not limited to the specific examples and the scope of the present invention. This can only be limited by the scope of the additional patent application.

This application is related to the Japanese Patent Special Purpose 2016-28311 submitted to the Japanese Patent Office on February 17, 2016, and the Japanese National Patent on January 25, 2017. Japanese Patent Application No. 2017-11643, the entire disclosure of which is hereby incorporated by reference.

7‧‧‧ opposite components

8‧‧‧ nozzle

23‧‧‧ 断板

24‧‧‧Rotary axis

24a‧‧‧ inner circumference

25‧‧‧through holes

25a‧‧‧ inner circumference

29‧‧‧Cylinder gap

30‧‧‧ surrounding gas discharge

31‧‧‧Ontology

31a‧‧‧Outer surface

32‧‧‧Clean liquid discharge

R‧‧‧ swirl

Claims (10)

A substrate processing apparatus comprising: a substrate holding unit for holding a substrate in a horizontal posture; and an outer cylindrical body having an outer peripheral surface and an opposite portion facing the upper central portion of the substrate, and facing a vertical member extending around the outer circumference of the body, having an inner peripheral surface formed with a cylindrical gap between the outer peripheral surface of the main body and facing the substrate; the cleaning liquid a discharge port that is opened on the outer peripheral surface of the main body to discharge the cleaning liquid toward the radially outer side of the main body; and a cleaning liquid supply unit for supplying the cleaning liquid to the washing liquid discharge port; And the opposite member and the body are relatively rotated about a rotation axis passing through a central portion of the upper surface of the substrate; and a cleaning control unit that controls the cleaning liquid supply unit and the rotating unit to wash the cylindrical gap The cleaning control unit performs a rotation step and a cleaning liquid discharge step of controlling the rotation unit to relatively rotate the opposite member and the body. The step of cleaning fluid discharge line is synchronized with the rotation step of controlling the cleaning liquid supply means and discharging the cleaning liquid discharge port from said cleaning liquid. The substrate processing apparatus according to claim 1, wherein the cleaning liquid supply unit includes a cleaning liquid pipe through which the cleaning liquid flows and is inserted into the main body, and the downstream end of the cleaning liquid pipe is attached to the above The outer peripheral surface of the main body is opened to form the washing liquid discharge port. The substrate processing apparatus according to claim 1 or 2, wherein the cleaning liquid piping includes: a vertical pipe, which extends linearly in a vertical direction; and a connecting pipe, which is connected The lower end of the vertical pipe is connected to the washing liquid discharge port. The substrate processing apparatus according to claim 1 or 2, wherein the cleaning liquid discharge port includes an inclined discharge port for discharging the cleaning liquid obliquely downward. The substrate processing apparatus according to claim 1 or 2, further comprising a gas supply unit that is higher than a position above the position at which the cleaning liquid is discharged from the cleaning liquid discharge port in the cylindrical gap, In the cylindrical gap supply gas, the cleaning control unit further performs a gas supply step of controlling the gas supply unit to supply gas to the cylindrical gap in synchronization with the rotation step and the cleaning liquid discharge step. The substrate processing apparatus according to claim 1 or 5, further comprising a processing fluid pipe for circulating a processing fluid to be supplied to the upper surface of the substrate and inserted into the inside of the body, wherein the downstream end of the processing fluid pipe The opening forms a treatment fluid discharge port. The substrate processing apparatus according to claim 1 or 5, further comprising a cleaning liquid blowing unit that blows the cleaning liquid from the lower side toward the opposite portion of the main body, wherein the cleaning control unit further performs cleaning of the opposite portion In the step of controlling the cleaning liquid blowing unit, in synchronization with the rotating step and the cleaning liquid discharging step, the cleaning liquid is blown toward the opposing portion to wash the opposing portion. A gap cleaning method for cleaning a cylindrical gap partitioned between an outer circumferential surface of the body and an inner circumferential surface of the opposing member, the body having an opposite portion to the upper central portion of the substrate and Extending up and down, the opposing member surrounds the outer circumference of the body and faces the substrate; the gap cleaning method performs the following steps: opening on the outer peripheral surface of the body, preparing to face the tube a step of discharging the washing liquid discharge port of the washing liquid; a rotating step of relatively rotating the opposing member and the body; and a washing liquid discharging step of discharging the washing liquid from the washing liquid discharge port in synchronization with the rotating step. The gap cleaning method according to claim 8, further comprising a gas supply step of the portion above the position at which the cleaning liquid is discharged from the cleaning liquid discharge port in the cylindrical gap The cylindrical gap supplies gas. The gap cleaning method according to claim 8 or 9, further comprising a cleaning step of the opposing portion, which is performed in synchronization with the rotating step and the washing liquid discharging step, and is sprayed with the washing liquid toward the opposing portion. The opposite part.