TW201735747A - Classifying method for expansion and shrinkage of circuit boards employing drilling holes at different positions to achieve classification purpose - Google Patents

Classifying method for expansion and shrinkage of circuit boards employing drilling holes at different positions to achieve classification purpose Download PDF

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TW201735747A
TW201735747A TW105108384A TW105108384A TW201735747A TW 201735747 A TW201735747 A TW 201735747A TW 105108384 A TW105108384 A TW 105108384A TW 105108384 A TW105108384 A TW 105108384A TW 201735747 A TW201735747 A TW 201735747A
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classification
target
reading
circuit board
hole
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TW105108384A
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Chinese (zh)
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shu-min Lu
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Always Well Technology Co Ltd
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Abstract

The present invention discloses a classifying method for the expansion and shrinkage of circuit boards, which relates to a classifying method for circuit boards after lamination that may cause some expansion or shrinkage phenomenon of printed circuit boards. The main process includes the following steps: reading the exposure target; interpreting the exposure target and defining the classification of expansion or shrinkage; drilling a positioning target hole; drilling a classifying target hole according to the belonged classification; reading the positioning target hole and the classification target hole and calculating the pitches; and, performing the classification based on the pitches. Thus, the present invention may effectively enhance the classifying efficiency to meet the requirement of manufacturers for classifying the expansion and shrinkage phenomenon during the manufacturing process.

Description

電路板漲縮分類方法 Circuit board scaling method

本發明「電路板漲縮分類方法」,其主要係有關於一種將電路板經過製程所產生漲縮現象進行分類之技術領域。 The invention relates to a method for classifying a circuit board expansion and contraction, which mainly relates to a technical field for classifying a shrinkage phenomenon caused by a circuit board through a process.

習知印刷電路板在製程中,經過壓合後,往往會因為溫度、壓力、濕度、玻纖及壓合機精密性等問題,造成印刷電路板產生些許漲縮現象,因此複數塊印刷電路板必須依據其漲縮狀態之不同而進行分類,一般業界會將漲縮值分成三類或三類以上,再提供給前製程的壓合機,或後製程之鑽孔機、曝光機,以作為後續因應調整的依據。 Conventional printed circuit boards in the process, after pressing, often due to temperature, pressure, humidity, glass fiber and press machine precision and other issues, resulting in a slight increase in the printed circuit board, so a number of printed circuit boards It must be classified according to the different state of its expansion and contraction. Generally, the industry will divide the expansion and contraction value into three or more types, and then provide it to the press machine of the pre-process, or the drilling machine and exposure machine of the post-process, as Subsequent basis for adjustment.

傳統進行電路板漲縮分類的方法,係設置一搬移機構將電路板依收到的類別判斷訊號進行分類擺放,再將各別不同區的複數塊電路板分別運送給其他製程作業,習知分類因為都只是以位置分區堆疊,並沒有在每片電路板上作標記,如此不但不利於機器判讀或記錄,更常因作業疏失易造成混料,甚至導致後續完全無法判別其所屬類別。 The traditional method for classifying the board's ups and downs is to set up a moving mechanism to classify the board according to the received category judgment signals, and then transport the plurality of boards in different areas to other process operations separately. Because the classification is only based on the location partition, it is not marked on each circuit board, which is not only not conducive to machine interpretation or recording, but also often causes mixing due to job loss, and even leads to the subsequent failure to determine the category.

發明人有鑑於此,遂特以研創成本案,期能藉 本案之提出,俾改進現有分類之缺點,期使分類之方法能更臻完善、理想與實用。發明人依據累積數十年從事該行業之豐富經驗,與多件國內外專利之申請與取得經驗,戮力謀求解決之道,終而有本發明之完成。發明人冀望能藉由本案之提出,能夠盡一己之力,貢獻自身的才能回饋於產業界。 In view of this, the inventor can use the research to create a cost case. The proposal of this case is to improve the shortcomings of the existing classifications, and to make the classification method more perfect, ideal and practical. The inventor has completed the invention according to the accumulated experience of decades of experience in the industry, the application and experience of many domestic and foreign patents, and the efforts to solve the problem. The inventor hopes that with the proposal of this case, he will be able to contribute his own talents to the industry.

為改善習知電路板漲縮分類易因混料造成後續無法判別,且機器也無法記錄與讀取等缺失,本發明主要目的在於:提供一種創新的電路板分類方法,其直接以鑽孔方式依據漲縮現像進行不同位置的鑽孔,再依據該鑽孔的位置或孔距進行讀取,即能獲知所屬之漲縮分類;藉此,能提供分類放置,以達成分類目的。其優點在於即便不小心混料,也能利用讀取方式獲知其分類,再者,因提供機具讀取功能,也能用以進行漲縮狀況之記錄與管理。 In order to improve the classification of the conventional circuit board, it is easy to discriminate due to the mixing, and the machine can not record and read. The main purpose of the present invention is to provide an innovative circuit board classification method, which is directly drilled. According to the expansion and contraction image, the drilling is performed at different positions, and then according to the position or the hole distance of the drilling hole, the classification of the expansion and contraction can be known; thereby, the classification placement can be provided to achieve the classification purpose. The advantage is that even if it is inadvertently mixed, the classification can be obtained by reading, and further, the tool reading function can be used to record and manage the expansion and contraction status.

為達上述目的,本發明具體之內容為:該步驟流程包括:讀取曝光靶、判讀曝光靶並界定漲縮分類、鑽定位靶孔、依所屬分類鑽分類靶孔、讀取定位靶孔與分類靶孔並計算間距、依間距進行分類。 In order to achieve the above object, the specific content of the present invention is as follows: the step process includes: reading an exposure target, interpreting the exposure target, defining a classification of the expansion and contraction, drilling the target hole, classifying the target hole according to the classification, and reading the target hole and The target holes are classified and the spacing is calculated and classified according to the spacing.

所述該讀取曝光靶,係以一讀取設備,例如X-RAY進行讀取電路板上的曝光靶位置。 The read exposure target is read by a reading device, such as an X-RAY, on an exposed target position on the circuit board.

所述該判讀曝光靶並界定漲縮分類,係依據該曝光靶之位置,經彙整統計一定數量或經事先設定好之分類範圍,例如五百片電路板之曝光靶位置數據,經計算後定義該漲縮分類。 The reading the exposure target and defining the classification of the expansion and contraction according to the position of the exposure target, and collecting a certain number or a predetermined classification range, for example, the exposure target position data of five hundred circuit boards, is calculated and calculated. The classification of the increase and decrease.

所述該鑽定位靶孔,係於電路板上一設定位置以鑽靶機鑽出一個或一個以上的定位靶孔。 The drill positioning target hole is tied to a set position on the circuit board to drill one or more positioning target holes by the drilling target machine.

所述該依所屬分類鑽分類靶孔,係於電路板上依據漲縮分類以鑽靶機鑽出一分類靶孔。 The classification target hole is classified according to the classification, and the classification target hole is drilled by the drilling target machine according to the classification of the expansion and contraction on the circuit board.

所述該讀取定位靶孔與分類靶孔並計算間距,係以一讀取設備,例如CCD讀取該定位靶孔與分類靶孔之間距並進行計算。 The reading locates the target hole and classifies the target hole and calculates the spacing, and reads the distance between the positioning target hole and the sorting target hole by a reading device, such as a CCD, and performs calculation.

所述該依間距進行分類,經獲知該電路板之分類後,即以自動化設備,例如機械手臂,搬移或置放至指定之分類處。 The sorting is performed according to the interval, and after the classification of the circuit board is known, it is moved or placed to a designated classification by an automated device such as a robot arm.

本案之優點為:利用本案,能有效提高分類效率,特別是因為在電路板上形成實體記號,即便不小心混料也能再以讀取方式獲知漲縮分類,至於該數據也能提供漲縮狀況之記錄與管理;再者,也能提高生產線自動化程度及節省人力。 The advantage of this case is that the use of this case can effectively improve the classification efficiency, especially because the physical mark is formed on the circuit board, even if it is accidentally mixed, the classification of the expansion and contraction can be obtained by reading, and the data can also provide the expansion and contraction. Recording and management of the situation; in addition, it can also improve the automation of the production line and save manpower.

1‧‧‧讀取曝光靶 1‧‧‧Read exposure target

2‧‧‧判讀曝光靶並界定漲縮分類 2‧‧‧ Interpreting exposure targets and defining classification

3‧‧‧鑽定位靶孔 3‧‧‧Drilling target hole

4‧‧‧依所屬分類鑽分類靶孔 4‧‧‧Drilling classification target holes according to their classification

5‧‧‧讀取定位靶孔與分類靶孔並計算間距 5‧‧‧Read the target hole and the classification target hole and calculate the spacing

6‧‧‧依間距進行分類 6‧‧‧Classification by spacing

7‧‧‧電路板 7‧‧‧ boards

70‧‧‧定位靶孔 70‧‧‧Target target hole

71‧‧‧第一分類靶孔 71‧‧‧First classification target hole

72‧‧‧第二分類靶孔 72‧‧‧Second classification target hole

73‧‧‧第三分類靶孔 73‧‧‧ third classification target hole

74‧‧‧第四分類靶孔 74‧‧‧ fourth classification target hole

75‧‧‧第五分類靶孔 75‧‧‧ fifth classification target hole

79‧‧‧曝光靶 79‧‧‧ exposure target

第一圖:係為本發明之步驟流程圖。 The first figure is a flow chart of the steps of the present invention.

第二圖:係為本發明電路板各孔位之示意圖。 The second figure is a schematic diagram of the holes of the circuit board of the present invention.

第三圖:係本發明中電路板第一分類靶孔與定位靶孔間距為長度A之示意圖。 The third figure is a schematic diagram of the distance between the first classification target hole and the positioning target hole of the circuit board in the present invention.

第四圖:係本發明中電路板第三分類靶孔與定位靶孔間距為長度C之示意圖。 The fourth figure is a schematic diagram of the length of the third classification target hole and the positioning target hole of the circuit board in the present invention.

茲謹就本發明「電路板漲縮分類方法」之結構組成,及其所產生之功效,配合圖式,舉一本案之較佳實施例詳細說明如下。 The structure of the "board boarding and shrinking classification method" of the present invention, and the effects thereof, together with the drawings, a preferred embodiment of the present invention will be described in detail below.

首請參閱第一圖、第二圖所示,本案「電路板漲縮分類方法」,其步驟流程包括:步驟一:讀取曝光靶1,利用一讀取設備,例如X-RAY鑽靶機讀取電路板7已預設之曝光靶79孔位記號;步驟二:判讀曝光靶並界定漲縮分類2,就該曝光靶79之誤差位置判讀漲縮所屬分類;步驟三:鑽定位靶孔3,於電路板7上鑽設一個或一個以上的定位靶孔70,其可被視為是基準靶孔;步驟四:依所屬分類鑽分類靶孔4,依據步驟二之分類結果分出複數像限,在每一電路板7上相對於定位靶孔70旁鑽設不同距離之一個分類靶孔,以第二圖來說,可能鑽設有第一分類孔71、第二分類孔72、第三分類孔73、第四分類孔74或第五分類孔75其中一者;步驟五:讀取定位靶孔與分類靶孔並計算間距5,由於每一分類孔與該定位靶孔70存在不同間距,因此利用一讀取設備,例如CCD讀取該不同間距值可得知該電路板7之所屬分類;步驟六:依間距進行分類6,係依據步驟五之間距讀取結果,以機械手臂或自動化設備將複數電路板7依所屬分類進行放置。 First, please refer to the first figure and the second figure. In this case, the "board classification method" includes the following steps: Step 1: Read the exposure target 1 and use a reading device such as an X-RAY drill target machine. Reading the exposure target 79 hole mark of the circuit board 7; Step 2: Interpreting the exposure target and defining the expansion and contraction classification 2, and correcting the classification of the error position of the exposure target 79; Step 3: drilling the target hole 3. One or more positioning target holes 70 are drilled on the circuit board 7, which can be regarded as a reference target hole; Step 4: Drilling the classified target holes 4 according to the classification, and dividing the plural according to the classification result of the second step In the quadrant, a sorting target hole of different distances is drilled on each of the circuit boards 7 with respect to the positioning target hole 70. In the second figure, the first sorting hole 71 and the second sorting hole 72 may be drilled. One of the third sorting hole 73, the fourth sorting hole 74 or the fifth sorting hole 75; Step 5: reading the positioning target hole and the sorting target hole and calculating the spacing 5, since each sorting hole and the positioning target hole 70 exist Different spacing, so using a reading device, such as a CCD, to read the different spacing values That belongs to the circuit board 7 of the classification; Step Six: 6 by classifying the pitch, pitch-based reading step based on the results of five, to a robot arm or complex automation equipment to the circuit board 7 is placed by Category.

如第二圖,該定位靶孔70旁若鑽設有一第一分類孔71,則該定位靶孔70與第一分類孔71形成間距為 長度A(即如第三圖);該定位靶孔70旁若鑽設有一第二分類孔72,其間便形成有一長度B之間距;若該定位靶孔70旁鑽設有一第三分類孔73,其間便形成有一長度C之間距(即如第四圖);該定位靶孔70旁若鑽設有一第四分類孔74,其間便形成有一長度D之間距;若該定位靶孔70旁鑽設有一第五分類孔75,其間便形成有一長度E之間距;該不同間距A、B、C、D、E即可提供識別其漲縮分類。 As shown in the second figure, if a first sorting hole 71 is drilled beside the positioning target hole 70, the positioning target hole 70 and the first sorting hole 71 form a spacing therebetween. a length A (ie, as shown in the third figure); a second sorting hole 72 is formed next to the positioning target hole 70, and a length B is formed therebetween; if the positioning target hole 70 is drilled with a third sorting hole 73 , a length C is formed therebetween (ie, as shown in the fourth figure); a fourth sorting hole 74 is formed next to the positioning target hole 70, and a length D is formed therebetween; if the positioning target hole 70 is drilled A fifth sorting aperture 75 is provided, and a length E is formed therebetween; the different spacings A, B, C, D, and E provide for identifying the classification of the expansion and contraction.

藉由上述步驟,本案即能將電路板依據漲縮現像進行分類;綜上所述,本發明「電路板漲縮分類方法」,依現行專利法規定,在產業上確實得以利用,於申請前未曾見於刊物或公開使用,且非為公眾所知悉之技術。再者,本案有效解決先前技術中長期存在的問題並達成相關使用者與消費者長期的需求,得佐證本發明並非能輕易完成。本案完全符合專利法規定之「產業利用性」、「新穎性」與「進步性」等要件,爰依法提請專利,懇請 鈞局詳查,並儘早為准予專利之審定,以保護申請人之智慧財產權,俾勵創新。 Through the above steps, the present invention can classify the circuit board according to the image of the zooming and shrinking; in summary, the "board boarding and shrinking classification method" of the present invention is actually utilized in the industry according to the current patent law, before the application It has not been seen in publications or publicly available, and is not a technology known to the public. Furthermore, the present invention effectively solves the long-standing problems in the prior art and achieves long-term needs of related users and consumers, and it is corroborated that the present invention is not easily accomplished. The case is in full compliance with the requirements of "industry useability", "novelty" and "progressiveness" as stipulated in the Patent Law. The patents are submitted in accordance with the law, and the Bureau is invited to conduct a detailed investigation and to approve the patent as soon as possible to protect the wisdom of the applicant. Property rights, encourage innovation.

本發明雖藉由前述實施例來描述,但仍可變化其形態與細節,於不脫離本發明之精神而達成,並由熟悉此項技藝之人士可了解。前述本案之較佳實施例,僅係藉本案原理可以具體實施的方式之一,但並不以此為限制,應依後附之申請專利範圍所界定為準。 The present invention has been described by way of example only, and it is to be understood by those skilled in the art. The preferred embodiment of the present invention is only one of the ways in which the present invention can be implemented in a specific manner, but is not limited thereto, and should be defined in the scope of the appended patent application.

1‧‧‧讀取曝光靶 1‧‧‧Read exposure target

2‧‧‧判讀曝光靶並界定漲縮分類 2‧‧‧ Interpreting exposure targets and defining classification

3‧‧‧鑽定位靶孔 3‧‧‧Drilling target hole

4‧‧‧依所屬分類鑽分類靶孔 4‧‧‧Drilling classification target holes according to their classification

5‧‧‧讀取定位靶孔與分類靶孔並計算間距 5‧‧‧Read the target hole and the classification target hole and calculate the spacing

6‧‧‧依間距進行分類 6‧‧‧Classification by spacing

Claims (4)

一種電路板漲縮分類方法,包括下述步驟:步驟一:讀取曝光靶,讀取電路板上預設之曝光靶孔位記號;步驟二:判讀曝光靶並界定漲縮分類,就該曝光靶之位置判讀漲縮所屬分類;步驟三:鑽定位靶孔,於電路板上鑽設一個或一個以上的定位靶孔;步驟四:依所屬分類鑽分類靶孔,依據步驟二之分類結果,在每一電路板上相對於定位靶孔旁鑽設分類靶孔;步驟五:讀取定位靶孔與分類靶孔並計算間距,讀取該電路板上該分類孔與該定位靶孔之間距,以得知該電路板之所屬分類;步驟六:依間距進行分類,係依據步驟五之間距讀取結果,將該電路板依所屬分類進行放置。 A circuit board scaling method includes the following steps: Step 1: reading an exposure target, reading a preset exposure target hole mark on the circuit board; Step 2: interpreting the exposure target and defining a zoom classification, the exposure The position of the target is determined by the classification of the expansion and contraction; Step 3: drilling the target hole and drilling one or more positioning target holes on the circuit board; Step 4: drilling the target hole according to the classification, according to the classification result of step 2, Drilling a sorting target hole on each circuit board relative to the positioning target hole; Step 5: reading the positioning target hole and the sorting target hole and calculating the spacing, and reading the distance between the sorting hole and the positioning target hole on the circuit board In order to know the classification of the circuit board; step 6: classify according to the interval, according to the reading result between the steps of step 5, the board is placed according to the classification. 如申請專利範圍第1項所述電路板漲縮分類方法,其中該步驟一之讀取曝光靶係利用一讀取設備,其包括以X-RAY鑽靶機進行讀取。 The circuit board expansion and contraction classification method according to claim 1, wherein the step (1) of reading the exposure target system uses a reading device, which comprises reading by an X-RAY drill target machine. 如申請專利範圍第1項所述電路板漲縮分類方法,其中該步驟五係以一讀取設備,至少包括以CCD進行定位靶孔與分類靶孔之讀取。 The circuit board expansion and contraction classification method according to claim 1, wherein the step 5 is a reading device, and at least comprises reading the target hole and the classification target hole by using a CCD. 如申請專利範圍第1項所述電路板漲縮分類方法,其中該步驟五係以機械手臂或自動化設備其中任一者將複數電路板依所屬分類進行放置。 The circuit board expansion and contraction classification method according to claim 1, wherein the step 5 is to place the plurality of circuit boards according to the classification according to any one of a robot arm or an automation device.
TW105108384A 2016-03-18 2016-03-18 Classifying method for expansion and shrinkage of circuit boards employing drilling holes at different positions to achieve classification purpose TW201735747A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
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CN107911943A (en) * 2017-10-24 2018-04-13 江苏博敏电子有限公司 A kind of harmomegathus means to save the situation of printed wiring board
CN112272449A (en) * 2020-10-20 2021-01-26 惠州市特创电子科技有限公司 Circuit board production system and expansion and contraction board separating device
TWI745760B (en) * 2019-10-05 2021-11-11 捷惠自動機械股份有限公司 Automatic classification and orientation method and equipment for circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107911943A (en) * 2017-10-24 2018-04-13 江苏博敏电子有限公司 A kind of harmomegathus means to save the situation of printed wiring board
CN107911943B (en) * 2017-10-24 2020-02-18 江苏博敏电子有限公司 Printed circuit board expansion and shrinkage remediation method
TWI745760B (en) * 2019-10-05 2021-11-11 捷惠自動機械股份有限公司 Automatic classification and orientation method and equipment for circuit board
CN112272449A (en) * 2020-10-20 2021-01-26 惠州市特创电子科技有限公司 Circuit board production system and expansion and contraction board separating device

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