TW201733420A - Manufacturing method of circuit board with cavity - Google Patents
Manufacturing method of circuit board with cavity Download PDFInfo
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- TW201733420A TW201733420A TW105107148A TW105107148A TW201733420A TW 201733420 A TW201733420 A TW 201733420A TW 105107148 A TW105107148 A TW 105107148A TW 105107148 A TW105107148 A TW 105107148A TW 201733420 A TW201733420 A TW 201733420A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 239000000696 magnetic material Substances 0.000 claims abstract description 75
- 230000005291 magnetic effect Effects 0.000 claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 20
- 230000005307 ferromagnetism Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910001172 neodymium magnet Inorganic materials 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 26
- 239000002184 metal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000004020 conductor Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000012792 core layer Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
本發明是有關於一種線路板的製作方法，且特別是有關於一種具有凹槽的線路板的製作方法。The present invention relates to a method of fabricating a circuit board, and more particularly to a method of fabricating a circuit board having a recess.
近年來，隨著科技產業日益發達，電子產品例如筆記型電腦（notebook computer，NB）、平板電腦（tablet computer）與智慧型手機（smart phone）已頻繁地出現在日常生活中。因此，應用於電子產品中的線路板（circuit board）也成為相關技術中的重要角色。線路板的製作方式例如是將銅箔（copper foil）及半固化膠片（prepreg，pp）或其他適用的導電材料或介電材料組成疊層結構後堆疊壓合於核心板（core board）上，而後利用電鍍製程在各疊層結構的通孔或盲孔中填充導電材料來導通各層。此外，為了增加線路板的應用，許多不同種類的元件，例如是晶片，可依據需求配置在多層線路板中，以增加線路板的使用功能。In recent years, with the development of the technology industry, electronic products such as notebook computers (NBs), tablet computers, and smart phones have frequently appeared in daily life. Therefore, circuit boards used in electronic products have also become an important role in related art. The circuit board is formed by laminating a copper foil and a prepreg (pp) or other suitable conductive material or dielectric material into a laminated structure, and then stacking the core board on the core board. Then, a conductive material is filled in the through holes or the blind holes of each laminated structure by an electroplating process to conduct the layers. In addition, in order to increase the application of the circuit board, many different kinds of components, such as wafers, can be arranged in the multilayer circuit board according to requirements to increase the use function of the circuit board.
為了降低線路板配置電子元件後的總厚度，常見作法是在線路板上設置凹槽，並將電子元件配置在凹槽內而內埋於線路板。在線路板上形成凹槽的常見作法是，以雷射加工直接移除疊層結構預定形成凹槽的區塊而形成凹槽。然而，上述作法在形成尺寸較大的凹槽時將提高製作成本，且長時間雷射加工的動作可能使凹槽底部的導電線路產生浮離。另外，目前亦有作法是透過雷射加工在疊層結構上切割出預定形成凹槽的區塊後，透過頂出機構以及貫穿線路板的通孔將切割後的區塊頂出而形成凹槽。然而，上述作法在線路板上形成額外的通孔供頂出機構通過，將影響線路板的結構設計，且面積較小的線路板亦不易製作上述通孔。In order to reduce the total thickness of the circuit board after the electronic components are disposed, it is common practice to provide a groove on the circuit board and arrange the electronic components in the recesses to be buried in the circuit board. A common practice for forming a groove on a circuit board is to directly remove the block in which the laminated structure is intended to form a groove by laser processing to form a groove. However, the above-mentioned method will increase the manufacturing cost when forming a groove having a large size, and the action of laser processing for a long time may cause the conductive line at the bottom of the groove to float. In addition, at present, there is also a method of cutting a block in which a predetermined groove is formed on a laminated structure by laser processing, and then forming a groove by ejecting the cut block through the ejector mechanism and the through hole penetrating the circuit board. . However, the above method forms an additional through hole on the circuit board for the ejector mechanism to pass, which will affect the structural design of the circuit board, and the circuit board having a smaller area is also difficult to manufacture the above-mentioned through hole.
本發明提供一種具有凹槽的線路板的製作方法，其具有較為簡易的製作方式，且其製作過程不影響線路板的結構設計。The invention provides a method for manufacturing a circuit board having a groove, which has a relatively simple manufacturing method, and the manufacturing process does not affect the structural design of the circuit board.
本發明的具有凹槽的線路板的製作方法包括下列步驟。提供一核心板。配置一磁性材料於核心板上。壓合至少一增層結構於核心板上，且增層結構覆蓋磁性材料。切割增層結構預定形成一凹槽且對應於磁性材料的一區塊，使區塊與增層結構的其他部分分離。藉由一磁性元件吸附磁性材料，以移除磁性材料及區塊，從而形成凹槽。The manufacturing method of the grooved wiring board of the present invention comprises the following steps. Provide a core board. A magnetic material is disposed on the core board. At least one build-up structure is pressed onto the core plate, and the build-up structure covers the magnetic material. The cut buildup structure is intended to form a recess and corresponds to a block of magnetic material that separates the block from other portions of the buildup structure. The magnetic material is adsorbed by a magnetic member to remove the magnetic material and the block to form a groove.
基於上述，在本發明的具有凹槽的線路板的製作方法中，磁性材料在增層結構的壓合過程中內埋在核心板與增層結構之間，而增層結構上預定形成凹槽且對應於磁性材料的區塊經由切割而與增層結構的其他部分分離。此後，切割後的區塊可在磁性材料被磁性元件吸附時隨著磁性材料一併移除，從而在增層結構上形成凹槽。據此，本發明的具有凹槽的線路板的製作方法具有較為簡易的製作方式，且其製作過程不影響線路板的結構設計。Based on the above, in the manufacturing method of the grooved circuit board of the present invention, the magnetic material is buried between the core plate and the build-up structure during the press-bonding process of the build-up structure, and the groove is formed on the build-up structure. And the block corresponding to the magnetic material is separated from the other portions of the buildup structure by cutting. Thereafter, the cut block can be removed along with the magnetic material as the magnetic material is adsorbed by the magnetic member, thereby forming a groove in the build-up structure. Accordingly, the method for fabricating the circuit board having the groove of the present invention has a relatively simple manufacturing method, and the manufacturing process thereof does not affect the structural design of the circuit board.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
圖1是本發明一實施例的具有凹槽的線路板的示意圖。請參考圖1，在本實施例中，具有凹槽102的線路板100包括核心板110以及兩增層結構120a、120b，而增層結構120a上具有連通至核心板110的凹槽102。雖然本實施例是以兩層增層結構120a、120b作為舉例說明，但在其他未繪示的實施例中，線路板100也可以具有一層或多層增層結構120a、120b。本發明並不限制增層結構120a、120b的數量，其可依據需求調整。1 is a schematic view of a wiring board having a groove according to an embodiment of the present invention. Referring to FIG. 1, in the present embodiment, the circuit board 100 having the recess 102 includes a core board 110 and two build-up structures 120a, 120b, and the build-up structure 120a has a recess 102 connected to the core board 110. Although the present embodiment is exemplified by two build-up structures 120a, 120b, in other embodiments not shown, the circuit board 100 may have one or more build-up structures 120a, 120b. The invention does not limit the number of build-up structures 120a, 120b, which can be adjusted as needed.
具體來說，在本實施例中，核心板110包括介電層112以及配置在介電層112的相對兩側的兩金屬層114，例如是採用雙面具有導電材（例如銅箔（copper foil））的基板或其他適用的基板作為核心板110。並且，金屬層114可經由圖案化製程（例如蝕刻（etching））形成未繪示的導電線路，而介電層112可藉由鑽孔製程（例如機械鑽孔（mechanical drill）或雷射鑽孔（laser drill））形成未繪示的貫孔，而後在貫孔內電鍍（plating）導電材料，以構成導通導電線路的導電孔（未繪示）。然而，本發明並不限制核心板110的組成，其可依據需求調整。Specifically, in the embodiment, the core board 110 includes a dielectric layer 112 and two metal layers 114 disposed on opposite sides of the dielectric layer 112, for example, having a double-sided conductive material (for example, copper foil). The substrate or other suitable substrate is used as the core board 110. Moreover, the metal layer 114 can form an unillustrated conductive line via a patterning process (eg, etching), and the dielectric layer 112 can be drilled by a drilling process (eg, mechanical drill or laser drilling). A laser hole is formed to form a through hole (not shown), and then a conductive material is plated in the through hole to constitute a conductive hole (not shown) that conducts the conductive line. However, the present invention does not limit the composition of the core board 110, which can be adjusted as needed.
再者，在本實施例中，增層結構120a、120b配置在核心板110的相對兩側。各增層結構120a、120b包括介電層122以及金屬層124，其中介電層122例如是半固化膠片（prepreg，pp），而金屬層124例如是銅箔，但本發明不以此為限制。介電層122及金屬層124對應構成各增層結構120a、120b，而後分別壓合於核心層110上。並且，各增層結構120a、120b上的金屬層124可經由圖案化製程形成導電線路，而後透過配置在介電層112上的導電孔（未繪示）電性連接至核心層110的導電線路（由金屬層114構成）。然而，本發明並不限制增層結構120a、120b的組成，其可依據需求調整。Moreover, in the present embodiment, the build-up structures 120a, 120b are disposed on opposite sides of the core board 110. Each of the build-up structures 120a, 120b includes a dielectric layer 122 and a metal layer 124, wherein the dielectric layer 122 is, for example, a prepreg (pp), and the metal layer 124 is, for example, a copper foil, but the invention is not limited thereto. . The dielectric layer 122 and the metal layer 124 respectively constitute the respective buildup structures 120a and 120b, and are then respectively pressed onto the core layer 110. The metal layer 124 on each of the build-up structures 120a, 120b can be electrically connected to the core layer 110 through a conductive via (not shown) disposed on the dielectric layer 112. (consisting of metal layer 114). However, the invention does not limit the composition of the build-up structures 120a, 120b, which can be adjusted as needed.
另外，在本實施例中，增層結構120a上具有連通至核心板110的凹槽102。所述凹槽102可用於容置線路板100所需的電子元件（未繪示），例如是晶片，使其內埋於線路板100內並與導電線路（由金屬層114或124構成）彼此電性連接。另外，雖然本實施例是以在增層結構120a上形成凹槽102作為舉例說明，但在其他未繪示的實施例中，凹槽102亦可形成於增層結構120b上。或者，在線路板100配置更多層增層結構120a、120b的情況下，凹槽102亦可位在其中一至多層增層結構120a、120b上，即凹槽102的尺寸可依據需求調整，本發明不以此限制。In addition, in the present embodiment, the buildup structure 120a has a recess 102 that communicates with the core panel 110. The recess 102 can be used to accommodate electronic components (not shown) required for the circuit board 100, such as a wafer, which is buried in the circuit board 100 and is electrically connected to the conductive line (consisting of the metal layer 114 or 124). Electrical connection. In addition, although the embodiment is illustrated by forming the groove 102 on the build-up structure 120a, in other embodiments not shown, the groove 102 may also be formed on the build-up structure 120b. Alternatively, in the case where the circuit board 100 is provided with more layer buildup structures 120a, 120b, the recesses 102 may also be located on one to the plurality of buildup structures 120a, 120b, that is, the size of the recess 102 may be adjusted according to requirements. The invention is not limited by this.
為了在線路板100上形成凹槽102，常見作法是以雷射加工直接移除增層結構120a預定形成凹槽102的區塊而形成凹槽102。然而，上述作法在形成尺寸較大的凹槽時將提高製作成本，且長時間雷射加工的動作可能使凹槽102底部的導電線路（由金屬層114或124構成）產生浮離，進而影響其導電效果。另外，目前亦有作法是透過雷射加工在增層結構120a上切割出預定形成凹槽102的區塊後，透過頂出機構以及貫穿線路板100的通孔將切割後的區塊頂出，從而在線路板上構成凹槽。然而，上述作法在線路板上形成額外的通孔供頂出機構通過，將影響線路板的結構設計，且面積較小的線路板亦不易製作上述通孔。In order to form the recess 102 on the wiring board 100, it is common practice to form the recess 102 by laser processing to directly remove the block in which the build-up structure 120a is intended to form the recess 102. However, the above method will increase the manufacturing cost when forming a groove having a larger size, and the action of laser processing for a long time may cause the conductive line at the bottom of the groove 102 (consisting of the metal layer 114 or 124) to float, thereby affecting Its conductive effect. In addition, at present, the cutting block is ejected through the ejector mechanism and the through hole extending through the circuit board 100 after the block forming the groove 102 is cut out on the build-up structure 120a by laser processing. Thereby, a groove is formed on the wiring board. However, the above method forms an additional through hole on the circuit board for the ejector mechanism to pass, which will affect the structural design of the circuit board, and the circuit board having a smaller area is also difficult to manufacture the above-mentioned through hole.
藉此，為了有效改善上述問題，本實施例的具有凹槽102的線路板100的製作方法包括下列步驟。在步驟S110中，提供核心板110，並配置磁性材料130（繪示於圖2）於核心板110上。在步驟S120中，壓合增層結構120a、120b於核心板110上，且增層結構120a覆蓋磁性材料130。在步驟S130中，切割增層結構120a預定形成凹槽102且對應於磁性材料130的區塊126，使區塊126與增層結構120a的其他部分分離。在步驟S140中，藉由磁性元件60吸附磁性材料130，以移除磁性材料130及區塊126，從而形成凹槽102。以下將以文字搭配圖式說明本實施例的具有凹槽102的線路板100的製作方法。Thereby, in order to effectively improve the above problem, the manufacturing method of the circuit board 100 having the recess 102 of the present embodiment includes the following steps. In step S110, the core board 110 is provided, and a magnetic material 130 (shown in FIG. 2) is disposed on the core board 110. In step S120, the build-up structure 120a, 120b is pressed onto the core board 110, and the build-up structure 120a covers the magnetic material 130. In step S130, the cut buildup structure 120a is predetermined to form the recess 102 and corresponds to the block 126 of the magnetic material 130, separating the block 126 from the other portions of the buildup structure 120a. In step S140, the magnetic material 130 is adsorbed by the magnetic member 60 to remove the magnetic material 130 and the block 126, thereby forming the groove 102. Hereinafter, a method of fabricating the wiring board 100 having the recess 102 of the present embodiment will be described with a textual arrangement.
圖2至圖6是圖1的具有凹槽的線路板的製作流程示意圖。首先，請參考圖2，在步驟S110中，提供核心板110，並配置磁性材料130於核心板110上。在本實施例中，有關核心板110的組成請參照前述說明，在此不多加贅述。再者，磁性材料130例如是含鐵材料，並具有鐵磁性。較佳地，磁性材料130的含鐵量大於70%，例如採用由不鏽鋼所製成的薄片作為磁性材料130，但本發明並不限制磁性材料130的種類，其可依據需求調整。2 to FIG. 6 are schematic diagrams showing the manufacturing process of the circuit board having the groove of FIG. 1. First, referring to FIG. 2, in step S110, the core board 110 is provided, and the magnetic material 130 is disposed on the core board 110. In the present embodiment, please refer to the foregoing description for the composition of the core board 110, and details are not described herein. Further, the magnetic material 130 is, for example, a ferrous material and has ferromagnetism. Preferably, the magnetic material 130 has an iron content of more than 70%, for example, a sheet made of stainless steel is used as the magnetic material 130, but the present invention does not limit the kind of the magnetic material 130, which can be adjusted as needed.
另外，在本實施例中，具有凹槽102的線路板100的製作方法更包括，在提供核心板110的步驟之後，配置於離形膜140於核心板110上，並配置磁性材料130於離形膜140上。換言之，本實施例在磁性材料130與核心板110之間配置離形膜140，有利於後續形成凹槽102的動作（詳述於後續內容）。在本實施例中，離形膜140的邊緣與磁性材料130的邊緣切齊，即離形膜140與磁性材料130具有相同的外輪廓。然而，在其他未繪示的實施例中，離形膜140的邊緣可以大於磁性材料130的邊緣，本發明不以此為限制。In addition, in the embodiment, the manufacturing method of the circuit board 100 having the recess 102 further includes, after the step of providing the core board 110, disposed on the core film 110 on the core film 110, and disposing the magnetic material 130 away from the core board 110. On the film 140. In other words, in this embodiment, the release film 140 is disposed between the magnetic material 130 and the core plate 110, which facilitates the subsequent action of forming the groove 102 (detailed in the following). In the present embodiment, the edge of the release film 140 is aligned with the edge of the magnetic material 130, that is, the release film 140 has the same outer contour as the magnetic material 130. However, in other embodiments not shown, the edge of the release film 140 may be larger than the edge of the magnetic material 130, and the invention is not limited thereto.
接著，請參考圖3，在步驟S120中，壓合增層結構120a、120b於核心板110上，且增層結構120a覆蓋磁性材料130。有關增層結構120a、120b的組成請參照前述說明，在此不多加贅述。並且，增層結構120a、120b的數量可依據需求調整為多層，本發明不以此為限制。在本實施例中，增層結構120a覆蓋磁性材料130，使其具有對應於磁性材料130的區塊126。更進一步地說，區塊126在線路板100的垂直投影方向上重疊於磁性材料130。此外，雖然本實施例是以磁性材料130直接配置在離形膜140及核心板110上作為舉例說明，但在其他未繪示的實施例中，磁性材料130也可以夾置在位於核心板110同一側的兩層增層結構120a之間，其可依據預定形成凹槽102的位置與深度（即區塊126的位置與尺寸）調整，本發明不以此為限制。Next, referring to FIG. 3, in step S120, the build-up structure 120a, 120b is pressed onto the core board 110, and the build-up structure 120a covers the magnetic material 130. Please refer to the foregoing description for the composition of the build-up structures 120a and 120b, and no further description is provided here. Moreover, the number of the build-up structures 120a, 120b can be adjusted to multiple layers according to requirements, and the invention is not limited thereto. In the present embodiment, the build-up structure 120a covers the magnetic material 130 to have a block 126 corresponding to the magnetic material 130. Further, the block 126 is overlapped with the magnetic material 130 in the vertical projection direction of the wiring board 100. In addition, although the magnetic material 130 is directly disposed on the release film 140 and the core plate 110 as an example, in other embodiments not shown, the magnetic material 130 may also be sandwiched on the core plate 110. Between the two layers of the layered structure 120a on the same side, it can be adjusted according to the position and depth of the groove 102 to be formed (ie, the position and size of the block 126), and the invention is not limited thereto.
接著，請參考圖4，在步驟S130中，切割增層結構120a預定形成凹槽102且對應於磁性材料130的區塊126，使區塊126與增層結構120a的其他部分分離。在本實施例中，切割增層結構120a的步驟包括雷射加工，但本發明不以此為限制。其中，切割增層結構120a的步驟包括沿著磁性材料130的邊緣（如切割線C）切割區塊126，使區塊126的邊緣與磁性材料130的邊緣切齊。更進一步地，由於離形膜140的邊緣與磁性材料130的邊緣切齊，故上述切割增層結構120a的步驟亦可視為是沿著離形膜140的邊緣（即切割線C）切割區塊126，使區塊126的邊緣與離形膜140的邊緣切齊。如此，區塊126、離形膜140與磁性材料130具有相同的外輪廓，且其在核心板110上的垂直投影彼此重合。然而，在其他未繪示的實施例中，離形膜140的邊緣可以大於磁性材料130的邊緣。如此，切割增層結構120a的步驟包括沿著離形膜140的邊緣切割區塊126，使區塊126的邊緣與離形膜140的邊緣切齊，而上述切割增層結構120a的步驟亦可視為是沿著磁性材料130的外側切割區塊126，使區塊126的邊緣大於磁性材料130的邊緣。Next, referring to FIG. 4, in step S130, the cut buildup structure 120a is predetermined to form the recess 102 and corresponds to the block 126 of the magnetic material 130, separating the block 126 from the other portions of the buildup structure 120a. In the present embodiment, the step of cutting the build-up structure 120a includes laser processing, but the invention is not limited thereto. Wherein, the step of cutting the build-up structure 120a includes cutting the block 126 along an edge of the magnetic material 130 (such as the cut line C) such that the edge of the block 126 is aligned with the edge of the magnetic material 130. Further, since the edge of the release film 140 is aligned with the edge of the magnetic material 130, the step of cutting the build-up structure 120a may also be regarded as cutting the block along the edge of the release film 140 (ie, the cutting line C). 126, the edge of the block 126 is aligned with the edge of the release film 140. As such, the block 126, the release film 140 and the magnetic material 130 have the same outer contour, and their vertical projections on the core plate 110 coincide with each other. However, in other embodiments not shown, the edge of the release film 140 may be larger than the edge of the magnetic material 130. Thus, the step of cutting the build-up structure 120a includes cutting the block 126 along the edge of the release film 140 such that the edge of the block 126 is aligned with the edge of the release film 140, and the step of cutting the build-up structure 120a is also visible. To cut the block 126 along the outside of the magnetic material 130, the edge of the block 126 is made larger than the edge of the magnetic material 130.
由此可知，在本實施例中，區塊126的邊緣較佳地與離形膜140的邊緣切齊，使離形膜140分布在區塊126的整個底面上。如此，區塊126透過離形膜140與核心板110隔離，而易於在後續步驟中從核心板110上移除，但本發明不以此為限制。相對地，區塊126的邊緣亦可與磁性材料130的邊緣切齊，使磁性材料130分布在區塊126的整個底面上，但磁性材料130亦可分布在區塊126的部分底面上，只要磁性材料130的鐵磁性足以使磁性材料130經由吸附後帶動區塊126一併往外移除即可，本發明並不限制磁性材料130於區塊126上的分布範圍。It can be seen that in the present embodiment, the edge of the block 126 is preferably aligned with the edge of the release film 140 such that the release film 140 is distributed over the entire bottom surface of the block 126. As such, the block 126 is isolated from the core plate 110 by the release film 140 and is easily removed from the core plate 110 in a subsequent step, but the invention is not limited thereto. In contrast, the edge of the block 126 may also be aligned with the edge of the magnetic material 130 such that the magnetic material 130 is distributed over the entire bottom surface of the block 126, but the magnetic material 130 may also be distributed over a portion of the bottom surface of the block 126, as long as The ferromagnetic property of the magnetic material 130 is sufficient to allow the magnetic material 130 to be removed outwardly through the adsorption-driven block 126. The present invention does not limit the distribution of the magnetic material 130 on the block 126.
接著，請參考圖5，在步驟S140中，藉由磁性元件60吸附磁性材料130，以移除磁性材料130及區塊126，從而形成凹槽102。在本實施例中，磁性元件60例如電磁鐵（electromagnet）、釹鐵硼磁鐵（NdFeB magnet）或者其他適用元件，但本發明不以此為限制。當磁性元件60相對移動至線路板100外側，例如是相對移動至線路板100上方時，具有鐵磁性的磁性材料130可被磁性元件60吸附。此時，由於區塊126已與增層結構120a的其他部分分離，且區塊126位在磁性材料130與磁性元件60之間（即位在磁性材料130經由吸附後朝向磁性元件60移動的路徑上），故區塊126可隨著磁性材料130被磁性元件60吸附而一併往線路板100外側（例如是線路板100上方）移動，而從增層結構120a上移除。如此，增層結構120a在區塊126移除之後產生凹陷空間，而即為線路板100所預定形成的凹槽102。Next, referring to FIG. 5, in step S140, the magnetic material 130 is adsorbed by the magnetic member 60 to remove the magnetic material 130 and the block 126, thereby forming the groove 102. In the present embodiment, the magnetic element 60 is, for example, an electromagnet, a NdFeB magnet or other suitable components, but the invention is not limited thereto. When the magnetic member 60 is relatively moved to the outside of the wiring board 100, for example, relatively moved above the wiring board 100, the magnetic material 130 having ferromagnetism can be adsorbed by the magnetic member 60. At this time, since the block 126 has been separated from the other portions of the build-up structure 120a, and the block 126 is located between the magnetic material 130 and the magnetic element 60 (i.e., on the path of the magnetic material 130 moving toward the magnetic element 60 via adsorption) Therefore, the block 126 can be removed from the build-up structure 120a as the magnetic material 130 is adsorbed by the magnetic member 60 and moved to the outside of the circuit board 100 (for example, above the circuit board 100). As such, the build-up structure 120a creates a recessed space after the block 126 is removed, that is, the recess 102 that the circuit board 100 is intended to form.
最後，請參考圖6，在形成凹槽102的步驟（步驟S140）之後，移除離形膜140。在本實施例中，在藉由磁性元件60吸附磁性材料130而移除磁性材料130及區塊126的步驟之後，凹槽102暴露出離形膜140。之後，離形膜140可透過吹氣（air blow）或清洗（rinse）製程從凹槽102內移除，進而使凹槽102暴露出核心板110上的導電圖案（由金屬層114形成）。藉此，未繪示的電子元件，例如晶片，可進一步配置在凹槽102內，並與核心板110或增層結構120a上的導電圖案（由金屬層114或124形成）電性連接，從而內埋於線路板110內。藉此，本實施例的具有凹槽102的線路板100的製作方法具有較為簡易的製作方式，且其製作過程不影響線路板100的結構設計。Finally, referring to FIG. 6, after the step of forming the groove 102 (step S140), the release film 140 is removed. In the present embodiment, after the step of removing the magnetic material 130 and the block 126 by the magnetic material 60 adsorbing the magnetic material 130, the groove 102 exposes the release film 140. Thereafter, the release film 140 can be removed from the recess 102 by an air blow or rinse process, thereby exposing the recess 102 to a conductive pattern (formed by the metal layer 114) on the core board 110. Thereby, an electronic component, such as a wafer, not shown, may be further disposed in the recess 102 and electrically connected to the conductive pattern (formed by the metal layer 114 or 124) on the core board 110 or the build-up structure 120a, thereby It is buried in the circuit board 110. Therefore, the manufacturing method of the circuit board 100 having the recess 102 of the embodiment has a relatively simple manufacturing method, and the manufacturing process thereof does not affect the structural design of the circuit board 100.
綜上所述，在本發明的具有凹槽的線路板的製作方法中，磁性材料在增層結構的壓合過程中內埋在核心板與增層結構之間（亦可內埋在同一側的多層增層結構之間），且磁性材料對應於增層結構上預定形成凹槽之處，而後增層結構上預定形成凹槽且對應於磁性材料的區塊經由切割而與增層結構的其他部分分離，使得切割後的區塊可在磁性材料被磁性元件吸附時隨著磁性材料一併往外移動，而在增層結構上留下凹陷空間，從而構成凹槽。上述作法不需長時間雷射加工而提高製作成本或使凹槽底部的導電線路產生浮離，也不需在線路板上形成額外的通孔供頂出機構通過而影響線路板的結構設計或提高製作難度。據此，本發明的具有凹槽的線路板的製作方法具有較為簡易的製作方式，且其製作過程不影響線路板的結構設計。In summary, in the manufacturing method of the grooved circuit board of the present invention, the magnetic material is buried between the core plate and the build-up structure during the press-bonding process of the build-up structure (may also be buried on the same side) Between the multi-layer build-up structures, and the magnetic material corresponds to a predetermined formation of a groove on the build-up structure, and the post-growth structure is predetermined to form a groove and the block corresponding to the magnetic material is cut and the structure is formed The other portions are separated such that the cut block can move away from the magnetic material as the magnetic material is attracted by the magnetic member, leaving a recessed space on the build-up structure to form the groove. The above method does not require long-time laser processing to increase the manufacturing cost or float the conductive lines at the bottom of the groove, and does not need to form additional through holes on the circuit board for the ejector mechanism to pass and affect the structural design of the circuit board or Improve the difficulty of production. Accordingly, the method for fabricating the circuit board having the groove of the present invention has a relatively simple manufacturing method, and the manufacturing process thereof does not affect the structural design of the circuit board.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
60‧‧‧磁性元件
100‧‧‧線路板
102‧‧‧凹槽
110‧‧‧核心板
112、122‧‧‧介電層
114、124‧‧‧金屬層
120a、120b‧‧‧增層結構
126‧‧‧區塊
130‧‧‧磁性材料
140‧‧‧離形膜
C‧‧‧切割線60‧‧‧Magnetic components
100‧‧‧ circuit board
102‧‧‧ Groove
110‧‧‧ core board
112, 122‧‧‧ dielectric layer
114, 124‧‧‧ metal layer
120a, 120b‧‧‧ layered structure
126‧‧‧ Block
130‧‧‧ Magnetic materials
140‧‧‧Dissecting film
C‧‧‧ cutting line
圖1是本發明一實施例的具有凹槽的線路板的示意圖。 圖2至圖6是圖1的具有凹槽的線路板的製作流程示意圖。1 is a schematic view of a wiring board having a groove according to an embodiment of the present invention. 2 to FIG. 6 are schematic diagrams showing the manufacturing process of the circuit board having the groove of FIG. 1.
100‧‧‧線路板 100‧‧‧ circuit board
102‧‧‧凹槽 102‧‧‧ Groove
110‧‧‧核心板 110‧‧‧ core board
112、122‧‧‧介電層 112, 122‧‧‧ dielectric layer
114、124‧‧‧金屬層 114, 124‧‧‧ metal layer
120a、120b‧‧‧增層結構 120a, 120b‧‧‧ layered structure
Claims (10)
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| TW105107148A TWI572265B (en) | 2016-03-09 | 2016-03-09 | Manufacturing method of circuit board with cavity |
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| TWI772212B (en) * | 2021-10-20 | 2022-07-21 | 大陸商慶鼎精密電子（淮安）有限公司 | Embedded circuit board and method for manufacturing the same |
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| FI113810B (en) * | 1999-05-11 | 2004-06-15 | Nokia Corp | Process for producing a magnetic power component and a magnetic power component |
| TWI392413B (en) * | 2010-06-30 | 2013-04-01 | Mutual Tek Ind Co Ltd | Circuit board having embedded component and manufacturing method of the same |
| US9101072B2 (en) * | 2011-10-31 | 2015-08-04 | Tripod Technology Corporation | Method of embedding magnetic component in substrate |
| TWI513392B (en) * | 2014-04-15 | 2015-12-11 | Unimicron Technology Corp | Manufacturing method for circuit structure embedded with electronic device |
| TWI513379B (en) * | 2014-07-02 | 2015-12-11 | Nan Ya Printed Circuit Board | Embedded passive component substrate and method for fabricating the same |
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