TW201732298A - Probe card inspection device - Google Patents

Abstract

A probe card inspection device includes a testing circuit board, a flexible probe pin, an interconnected holder, a first solder portion and a second solder portion. The flexible probe pin is used for testing a DUT. The testing circuit board is provided with a soldering pad. The interconnected holder is electrically connected to the testing circuit board and the flexible probe pin. One end of the interconnected holder is coupled to the flexible probe pin with the first solder portion, and the other end of the interconnected holder is coupled to the soldering pad of the testing circuit board with the second solder portion. The first solder portion has a first desoldering melting point, and the second solder portion has a second desoldering melting point higher than the first desoldering melting point.

Description

Probe card detecting device

The invention relates to a probe card detecting device, in particular to a probe card detecting device capable of assisting repeated needle implantation.

Traditional probe cards contain test boards and probe sets. The probe set couples the test circuit board, and the probe of the probe set touches the Device Under Test (DUT) to test the access of the test board to the test object.

In order to replace the probe set of the probe card from the test board in order to re-needle the probes, the user must decouple the probe and the test board in order to allow the probe set to smoothly detach from the test board. . However, because the high temperature caused by the decoupling probe and the test board often inadvertently causes damage to the test pad's pads or internal circuits or probes of the probe set, the probes cannot be placed on the test board. Replant the needle.

To this end, if we can provide a solution design that can solve the above requirements and let the industry stand out from the competition, it becomes an important issue to be solved urgently.

In view of the above, it is an object of the present invention to provide a probe card detecting device for solving the difficulties mentioned in the prior art.

According to an embodiment of the invention, the probe card detecting device comprises a test circuit board, at least one elastic probe, at least one connecting needle holder, at least one first solder portion and at least one second solder portion. The test circuit board includes at least one via pad. One end of the elastic probe is used to test a test object. The connecting pin holder is electrically connected to the elastic probe and the test circuit board. In particular, one end of the connecting pin holder is coupled to the other end of the elastic probe by the first solder portion, and the other end of the connecting pin holder is coupled by the second solder portion. The pad of the board. The first solder portion has a first melting point. The second solder portion is different from the first solder portion and has a second melting point greater than the first melting point.

Thus, since the test circuit board and the elastic probe are not directly coupled together, they are indirectly connected to each other through the connection needle holder, thereby reducing the chance that the elastic probe damages the conduction pad or the internal circuit of the test circuit board. In addition, in order to re-implant these probes on the test circuit board, the temperature difference control of the desoldering tool, that is, the decoupling temperature is controlled at a temperature lower than the second melting point, the present embodiment can only make the elasticity The probe is smoothly separated from the test board, so that the connection pin holder is not separated from the test circuit board, thereby reducing the internal damage caused by the excessive high temperature of the test circuit board.

In one or more embodiments of the present invention, the probe card detecting device further includes a probe set. The probe set includes a probe substrate and the above elastic probe. The probe substrate is detachably connected to the test circuit board, and the elastic probe is fixed on the probe substrate.

In one or more embodiments of the invention, the elastic probe One end protrudes from the probe substrate opposite to one side of the test circuit board for directly contacting the receiving object.

In one or more embodiments of the invention, the probe set further comprises at least one thimble. The thimble is inserted on one side of the probe substrate opposite to the test circuit board, and electrically connected to the end of the elastic probe for directly contacting the receiving object.

In one or more embodiments of the invention, the pad has a receptacle. The connecting needle holder comprises a frame body, a first connecting portion and a second connecting portion. The first connecting portion is located at one end of the frame body for holding the other end of the elastic probe, and the second connecting portion is located at the other end of the frame body for inserting into the jack.

In one or more embodiments of the present invention, the connecting needle holder further includes a limiting portion. The limiting portion is located on the frame body and between the first connecting portion and the second connecting portion for positioning the connecting needle frame on the guiding pad.

In one or more embodiments of the present invention, the end to which the needle holder is attached has a U-shaped connecting portion, an annular connecting portion, a cylindrical connecting portion or a embossed needle-shaped connecting portion.

In one or more embodiments of the present invention, the connecting needle holder has a plurality of ribs that extend laterally and abut against the guiding pads for suspending the connecting needle holder from the socket.

In one or more embodiments of the present invention, the other end of the connecting needle holder has a barb portion or an elastic fitting portion for fixing in one of the sockets of the guiding pad.

In one or more embodiments of the present invention, the first melting point of the first solder portion is 130 degrees Celsius to 200 degrees Celsius.

According to another embodiment of the present invention, the probe card detection device The device includes a test circuit board and a plurality of connection pin holders. The test board contains a plurality of lead pads. The conductive pads are spaced apart from each other, and each of the conductive pads has a receptacle therein. One end of each connecting pin holder is coupled to one of the guiding pads by a solder portion and inserted into the socket of the guiding pad, and the other end is coupled to an elastic probe. The melting point of the solder portion is 220 degrees Celsius to 280 degrees Celsius.

In one or more embodiments of the present invention, the connecting needle holder includes a frame body, a first connecting portion and a second connecting portion. The first connecting portion is located at one end of the frame body for holding the elastic probe, and the second connecting portion is located at the other end of the frame body for extending into the socket.

In one or more embodiments of the present invention, the connecting needle holder further includes a limiting portion. The limiting portion is located between the first connecting portion and the second connecting portion for positioning the connecting needle frame on the guiding pad.

In one or more embodiments of the present invention, the other end of the connecting needle holder has a U-shaped connecting portion, an annular connecting portion, a cylindrical connecting portion or a embossed needle-shaped connecting portion.

In one or more embodiments of the present invention, the connecting needle holder has a plurality of ribs that extend laterally and abut against the guiding pads for suspending the connecting needle holder from the socket.

In one or more embodiments of the present invention, the end of the connecting needle holder has a barb portion or an elastic fitting portion for fixing in the socket.

The above description is only for explaining the problems to be solved by the present invention, the technical means for solving the problems, the effects thereof, and the like, and the specific details of the present invention will be described in detail in the following embodiments and related drawings.

10, 11‧‧ ‧ probe card detection device

100, 101‧‧ ‧ probe set

110‧‧‧Probe substrate

120‧‧‧elastic probe

End of 121, 122‧‧

130‧‧‧ thimble

200, 200A~200F‧‧‧ connecting needle holder

201‧‧‧ first end

202‧‧‧ second end

210‧‧‧ ‧ body

210L‧‧‧Long-axis direction

220‧‧‧First connection

221‧‧‧U-shaped joint

222‧‧‧U-shaped groove

223‧‧‧Annual connection

224‧‧‧Closed opening

224L‧‧‧ opening axial

225‧‧‧tubular connection

226‧‧‧cylinder

226L‧‧‧Long-axis direction

227‧‧‧ Reed needle joint

230‧‧‧Second connection

231‧‧‧Backrest

232‧‧‧ ribbed ribs

233‧‧‧ acute angle

234‧‧‧Elastic Elastic Department

240‧‧‧Limited

241‧‧‧First rib

242‧‧‧second rib

243‧‧‧ angle

300‧‧‧Test circuit board

310‧‧‧ Guide pad

311‧‧‧ jack

400‧‧‧First Solder

500‧‧‧Second solder department

D‧‧‧Test object

The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; A side view of a probe card detecting device according to an embodiment of the present invention; FIG. 3 is a side view of a probe card detecting device according to another embodiment of the present invention; FIGS. 4A to 4D are diagrams according to the present invention. A schematic view of a connection bracket of various embodiments; and FIGS. 5A-5B illustrate schematic views of a connection bracket in accordance with various embodiments of the present invention.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

FIG. 1 is a block diagram showing the use of the probe card detecting device 10. 2 is a side view of the probe card detecting device 10 according to an embodiment of the present invention. As shown in FIG. 1 and FIG. 2 , in the present embodiment, the probe card detecting device 10 includes a probe set 100 , a test circuit board 300 , a plurality of connection pin holders 200 , The first solder portion 400 (such as a solder ball or an electrode) and the second solder portion 500 (such as a solder ball or an electrode). Test circuit board 300 includes a plurality of via pads 310. The conductive pads 310 are disposed on one side of the test circuit board 300 , and each of the conductive pads 310 defines a socket 311 . The probe set 100 includes a probe substrate 110 and a plurality of elastic probes 120. The probe substrate 110 is detachably connected to the test circuit board 300. The probe substrate 110 is directly or indirectly coupled (e.g., soldered) to the test circuit board 300, for example, through a mechanism (not shown). These elastic probes 120 are fixedly concentrated on the probe substrate 110 for testing a D under test (Dut. 1).

In the present embodiment, the elastic probe 120 extends from the end 121 of the test circuit board 300 to one side of the probe substrate 110 opposite to the test circuit board 300 to directly contact the connection pad of the object D (FIG. 1). Or a connection terminal (not shown), however, the invention is not limited thereto. The connection pin holder 200 is interposed between the probe set 100 and the test circuit board 300, and electrically connects the elastic probe 120 and the test circuit board 300 so that the test circuit board 300 can pass through the connection pin holder 200 and the elastic probe 120. Access to the test object D (Fig. 1) for testing.

Specifically, the connecting needle holder 200 includes a first end 201 and a second end 202 opposite to each other. The first end 201 of the connection pin holder 200 is coupled (eg, soldered) to one end of the elastic probe 120 by the first solder portion 400, and the second end 202 of the connection pin holder 200 is coupled (eg, soldered) by the second solder portion 500. One of the pads 310 on the circuit board 300.

It is to be understood that the first solder portion 400 has a first melting point such that when the first solder portion 400 is heated to a temperature of the first melting point, the first solder portion 400 is melted and the connecting needle holder 200 is detached from the elastic probe. 120. For example, the first melting point of the first solder portion 400 is 130 degrees Celsius to 200 degrees Celsius, more specific The first melting point of the first solder portion 400 is 140 degrees Celsius. The second solder portion 500 is different from the first solder portion 400 and has a second melting point greater than the first melting point, so that the second solder portion 500 is melted when the second solder portion 500 is heated to a temperature of the second melting point. The connecting needle holder 200 is disengaged from the guiding pad 310 of the test circuit board 300. For example, the second solder portion 500 has a melting point of 220 degrees Celsius to 280 degrees Celsius, and more specifically, the second melting point of the second solder portion 500 is 240 degrees Celsius. However, as long as the melting points of the first solder portion and the second solder portion are different, the present invention is not limited to whether or not there are different materials, formulations or additives.

As such, in order to re-needle the elastic probe 120 to replace or disassemble the probe set 100, the user only needs to control the temperature to the first melting point of the first solder portion 400 by a desoldering tool, but does not exceed the first The second melting point of the solder portion 500 allows the user to release only the combination of the elastic probe 120 and the connecting needle holder 200, but does not release the connection between the connecting needle holder 200 and the test circuit board 300, so that the elastic probe 120 is smoothly separated. The circuit board 300 is tested without causing internal damage to the test circuit board 300. In addition, since the test circuit board 300 and the elastic probe 120 are indirectly connected to each other through the connection needle holder 200, they are not directly coupled (eg, soldered) together, and therefore, the conductive probe directly damages the conductive pad of the test circuit board 300. 310 or an opportunity for internal circuitry.

More specifically, as shown in FIG. 2, each of the connecting needle holders 200 includes a frame body 210, a first connecting portion 220 and a second connecting portion 230. The first connecting portion 220 is located at one end of the frame body 210 and holds the end 122 of the elastic probe 120 such that the end 122 of the elastic probe 120 is coupled to the first connecting portion 220 through the first solder portion 400. The second connecting portion 230 is located at the other end of the frame body 210 and inserted into the insertion hole 311 of the guiding pad 310 so that the connecting pin holder 200 is coupled through the second solder portion 500. On the pad 310. In the embodiment, the connecting needle holder 200 further includes a limiting portion 240. The limiting portion 240 is located between the first connecting portion 220 and the second connecting portion 230 on the frame 210 for positioning the connecting needle holder 200 on the guiding pad 310. In the present embodiment, for example, the limiting portion 240 includes two first ribs 241. These first ribs 241 are in the same plane and respectively extend laterally.

When the second connecting portion 230 of the connecting needle holder 200 protrudes into the insertion hole 311, the first protruding ribs 241 just abut against the guiding pad 310 on the periphery of the insertion hole 311, so that the connecting needle holder 200 is suspended from the guiding connection. On the pad 310 (the jack 311), it does not continue to fall into the jack 311. In addition, the larger adhesion area provided by the first ribs 241 also helps the second solder portion 500 to more securely fix the connecting needle holder to the conductive pad 310 (the insertion hole 311). However, the present invention is not limited thereto, and in other embodiments, it is not necessary to provide these components for connecting the needle holder.

FIG. 3 is a side view of the probe card detecting device 11 according to another embodiment of the present invention. The probe card detecting device 11 of the present embodiment is substantially the same as the circuit test probe 10 of the above-described embodiment, and the difference is that, as shown in FIG. 3, in the present embodiment, the probe set 101 further includes a plurality of ejector pins 130. . The thimbles 130 are interposed on one side of the probe substrate 110 opposite to the test circuit board 300 and electrically connected to the end 121 of the test circuit board 300. For example, the thimble 130 is a pogo-pin connector. One end of the spring type thimble is electrically connected to the elastic probe 120 inside the probe substrate 110, and the spring type thimble is telescopically located on the probe substrate 110 for absorbing the back pressure of the touch object D (Fig. 1). The pressure. Thus, the test circuit board 300 exchanges the test signal with the object D (FIG. 1) by electrically connecting the ejector pin 130 to the object D (FIG. 1).

4A to 4D are schematic views showing the connection brackets 200A to 200D according to various embodiments of the present invention. The connection brackets 200A to 200D of the present embodiment are substantially the same as the connection brackets 200 of the above-described embodiment, and the difference is that, as shown in FIG. 4A and FIG. 2, the connection needle holder 200A has a U-shaped connection portion. 221, the U-shaped connecting portion 221 has a U-shaped groove 222. The U-shaped groove 222 is for receiving the end 122 of the elastic probe 120 (Fig. 2). Since the U-shaped connecting portion 221 provides a large adhesion area, the first solder portion 400 is more securely held by the end 122 of the elastic probe 120 on the U-shaped connecting portion 221.

As another example, as shown in FIG. 4B and FIG. 2, the connecting needle holder 200 has an annular connecting portion 223. The annular connecting portion 223 has a closed opening 224. The opening axial direction 224L of the closed opening 224 and the long axis direction 210L of the frame body 210 are orthogonal to each other. The closed opening 224 is adapted to receive the end 122 of the resilient probe 120 (Fig. 2). Since the closing opening 224 reduces the chance of the end 122 of the elastic probe 120 being easily detached from the annular connecting portion 223, the first solder portion 400 is more securely held by the end 122 of the elastic probe 120 on the annular connecting portion 223.

As another example, as shown in FIGS. 4C and 2, the connecting needle holder 200C has a cylindrical connecting portion 225. The cylindrical connecting portion 225 has a cylindrical groove 226. The long axis direction 226L of the cylindrical groove 226 is coaxial with the long axis direction 210L of the parallel frame body 210. The slot 226 is adapted to receive the end 122 of the resilient probe 120 (Fig. 2). Since the bottom portion of the cylindrical groove 226 can prevent the first solder portion from flowing out of the cylindrical connecting portion 225, the first solder portion 400 is more securely held by the end 122 of the elastic probe 120 on the cylindrical connecting portion 225.

As another example, as shown in FIG. 4D and FIG. 2, the connecting needle The frame 200D has a corrugated needle-shaped connecting portion 227. The end 122 (Fig. 2) of the elastic probe 120 is clamped to the stencil-shaped connecting portion 227 so that the first solder portion couples the elastic probe held by the embossed needle-shaped connecting portion 227 to the striated pattern. On the needle-shaped connecting portion 227.

However, the present invention is not limited thereto, and in other embodiments, the first connecting portion does not have to be the first connecting portion of these kinds.

As another example, as shown in FIG. 4A, the limiting portion 240 includes three second ribs 242 that extend outwardly from each other. The second ribs 242 are in the same plane, and any two adjacent ribs 242 are separated by an angle 243 of 120 degrees. Thus, referring to FIG. 2, when the second connecting portion 230 of the connecting needle holder 200 protrudes into the insertion hole 311, if the limiting portion 240 includes the second protruding ribs 242, the second protruding ribs 242 are evenly distributed. On the guiding pad 310 on the periphery of the jack 311, the connecting pin holder 200 is suspended from the guiding pad 310 (the jack 311) so as not to fall into the jack 311. As such, the second solder portion 500 can couple the connection bracket positioned on the conductive pad 310 to the test circuit board 300. In addition, the larger adhesion area provided by the second ribs 242 also helps the second solder portion 500 to more securely fix the connecting needle holder to the conductive pad 310 (the insertion hole 311). However, the present invention is not limited thereto, and in other embodiments, the limiting portion does not have to be such a second connecting portion.

5A-5B are schematic views of the connection brackets 200E-200F according to various embodiments of the present invention. As shown in FIG. 5A, the other probe card detecting device 10 of the present embodiment is substantially the same as the circuit test probe of the above-described embodiment, and the difference is that, as shown in FIG. 5A, the connecting needle holder 200 has no limiting portion 240. Positioning the connecting needle holder 200 to the guiding pad 310 only by the second connecting portion 230 on. The second connecting portion 230 has, for example, a barb portion 231. The undercut portion 231 has a plurality of inclined ribs 232. The inclined ribs 232 are circumferentially connected to the frame body 210, and each of the inclined ribs 232 and the frame body 210 has an acute angle 233. Thus, when the hook portion 231 protrudes into the insertion hole 311, the inclined ribs 232 just abut against the inner wall of the insertion hole 311, so that the connection needle holder 200 is not easily removed from the insertion hole 311, thereby positioning the connection needle holder 200 at The lead pad 310 does not continue to fall into the socket 311. As such, the second solder portion 500 can couple the connection bracket 200 positioned on the conductive pad 310 to the test circuit board 300.

As another example, as shown in FIG. 5B, the second connecting portion 230 has an elastic fitting portion 234. The elastic tight portion 234 is slightly larger than the insertion hole 311. Thus, when the elastic fitting portion 234 protrudes into the insertion hole 311, the elastic fitting portion 234 just fits tightly on the inner wall of the insertion hole 311, so that the connection needle holder 200 is not easily removed from the insertion hole 311, thereby connecting the needle holder The 200 is positioned on the conductive pad 310 so as not to fall into the insertion hole 311. As such, the second solder portion 500 can couple the connection bracket positioned on the conductive pad 310 to the test circuit board 300. However, the present invention is not limited thereto. In other embodiments, the limiting portion 240 is not necessarily the second connecting portion 230 of these types.

Finally, the various embodiments disclosed above are not intended to limit the invention, and those skilled in the art can be protected in various modifications and refinements without departing from the spirit and scope of the invention. In the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10‧‧‧Probe card detection device

100‧‧‧ probe set

110‧‧‧Probe substrate

120‧‧‧elastic probe

End of 121, 122‧‧

200‧‧‧Connecting needle holder

201‧‧‧ first end

202‧‧‧ second end

210‧‧‧ ‧ body

220‧‧‧First connection

230‧‧‧Second connection

240‧‧‧Limited

241‧‧‧First rib

300‧‧‧Test circuit board

310‧‧‧ Guide pad

311‧‧‧ jack

400‧‧‧First Solder

500‧‧‧Second solder department

Claims (16)

A probe card detecting device comprising: at least one elastic probe, one end of the elastic probe is used for testing a test object; a test circuit board comprising at least one conductive pad; at least one first solder portion having a first a melting point; at least one second solder portion different from the first solder portion and having a second melting point greater than the first melting point; and at least one connecting pin holder electrically connecting the elastic probe to the test circuit board, One end of the connecting pin holder is coupled to the other end of the elastic probe by the first solder portion, and the other end of the connecting pin holder is coupled to the guiding pad by the second solder portion. The probe card detecting device of claim 1, further comprising: a probe set comprising a probe substrate and the elastic probe, the probe substrate being detachably connected to the test circuit board, the elastic probe fixed On the probe substrate. The probe card detecting device of claim 2, wherein the end of the elastic probe extends from the probe substrate to a side of the test circuit board for directly contacting the object to be tested. The probe card detecting device of claim 2, wherein the probe set further comprises at least one thimble, the thimble being inserted on one side of the probe substrate opposite to the test circuit board, and electrically connected to the elastic probe The end is used for directly contacting the object to be tested. The probe card detecting device of claim 1, wherein the guiding pad has a jack; and the connecting pin holder comprises a frame body, a first connecting portion and a second connecting portion, the first connecting portion The other end of the frame is located at one end of the frame for holding the other end of the elastic probe, and the second connecting portion is located at the other end of the frame for inserting into the socket. The probe card detecting device of claim 5, wherein the connecting needle holder further comprises a limiting portion, the limiting portion is located on the frame and between the first connecting portion and the second connecting portion The positioning needle holder is positioned on the guiding pad. The probe card detecting device according to claim 1, wherein the end of the connecting needle holder has a U-shaped connecting portion, an annular connecting portion, a cylindrical connecting portion or a stylus-shaped connecting portion. The probe card detecting device of claim 1, wherein the connecting pin holder has a plurality of laterally extending ribs for abutting against the guiding pad. The probe card detecting device of claim 1, wherein the other end of the connecting needle holder has a barb portion or an elastic fitting portion for fixing in one of the sockets of the guiding pad. The probe card detecting device of claim 1, wherein the first melting point of the first solder portion is 130 degrees Celsius to 200 degrees Celsius. A probe card detecting device comprising: a test circuit board comprising a plurality of guiding pads, wherein the guiding pads are spaced apart from each other, each of the guiding pads has a jack therein; and a plurality of connecting pin holders, One end of each of the connecting pin holders is coupled to one of the guiding pads by a solder portion, and is inserted into the socket of the guiding pad, and the other end is coupled to an elastic probe. The melting point of the solder portion is 220 degrees Celsius to 280 degrees Celsius. The probe card detecting device of claim 11, wherein each of the connecting pin holders comprises a frame body, a first connecting portion and a second connecting portion, wherein the first connecting portion is located at one end of the frame body. The elastic probe is fixed, and the second connecting portion is located at the other end of the frame for inserting into the jack. The probe card detecting device of claim 12, wherein each of the connecting pin holders further comprises a limiting portion, wherein the limiting portion is located at the first connecting portion and the second connecting portion For positioning the connecting needle holder on the guiding pad. The probe card detecting device of claim 11, wherein the other end of each of the connecting needle holders has a U-shaped connecting portion, an annular connecting portion, a cylindrical connecting portion or a skein-shaped connecting portion. unit. The probe card detecting device of claim 11, wherein each of the connecting pin holders comprises a plurality of ribs extending laterally and against the guiding pad for connecting the connecting needle frame Hanging on this jack. The probe card detecting device of claim 11, wherein the end of each of the connecting pin holders has a barb portion or an elastic fitting portion for fixing in one of the sockets.