TW201724318A - Laser marking system and laser marking method - Google Patents

Abstract

A laser marking system and a laser marking method are provided. The laser marking system includes a laser oscillator; a beam splitter configured to split a laser beam emitted from the laser oscillator into first and second marking laser beams; first and second beam control units disposed on movement paths of the first and second marking laser beams and configured to control characteristics of the first and second marking laser beams due to variations in the refractive indices of the first and second beam control units according to a change in a voltage that is applied; and first and second Galvano scanners configured to control the directions of first and second marking laser beams that have passed through the first and second beam control units.

Description

Laser marking system and laser marking method

The present invention relates to a laser marking system and a laser marking method using the same.

A laser marking system refers to a system for marking desired text, graphics, and the like on a marking object, such as a semiconductor package or wafer, using a laser beam.

In recent years, considering the relatively high price of such a laser marking system, one laser beam emerging from a laser emitter is actively separated into two marked laser beams and simultaneously marked by two heads. Homework research.

However, in the case of separating a laser beam into two marked laser beams while performing a marking operation, the two marked laser beams are illuminated in different strengths. Also, it is not possible to modulate two marker laser beams individually, so it is not possible to mark different words or graphics.

[Problem to be Solved by the Invention] The present invention provides a laser marking system for solving the above problems and a laser marking method using the same. [Means for solving the problem]

An aspect of the laser marking system of the present invention may include: a laser emitter; a beam splitter that splits the laser beam emitted from the laser emitter into a first marker laser beam and a second marker laser beam The first beam control unit and the second beam control unit are disposed on the movement path of the first mark laser beam and the second mark laser beam, and the refractive index changes according to the change of the applied voltage, and the first mark is changed to Controlling the characteristics of the beam and the second marked laser beam; and the first galvanometer scanner and the second galvanometer scanner, the first marking thunder passing through the first beam control portion and the second beam control portion The beam and the direction of the second marked laser beam are controlled.

Each of the first beam control unit and the second beam control unit may include a Böhler box, a driver that applies a voltage to the Boehels box, and a polarizer that polarizes the marked laser beam passing through the Boehels box.

Each of the first beam control unit and the second beam control unit may further include a dumper that absorbs the marked laser beam refracted by the polarizer.

At least one of the first beam control unit and the second beam control unit may perform a mark laser beam passing through the beam control unit by selectively blocking a voltage applied to the Boehels box by the driver Modulation.

The first shape formed on the marking object by the first marking laser beam may be different from the second shape formed in the marking object by the second marking laser beam.

At least one of the first beam control unit and the second beam control unit can adjust the intensity of the marked laser beam passing through the beam control unit by adjusting the magnitude of the voltage applied to the Boehels box by the driver. Adjustment.

The intensity of the first marker laser beam passing through the first beam control portion may be the same as the intensity of the second marker laser beam passing through the second beam control portion.

The laser marking system may further include a first high mirror and a second high mirror disposed between the beam splitter and the first beam control unit and the second beam control unit.

The length of the moving path of the first marked laser beam may be the same as the moving path of the second marked laser beam.

The laser marking system may further include: a first beam expander and a second beam expander, disposed in the first beam control unit and the second beam control unit, and the first galvanometer scanner and the second galvanometer And between the scanners; and the first F-theta lens and the second F-theta lens are disposed in a moving path of the marked laser beam passing through the first galvanometer scanner and the second galvanometer scanner.

Another aspect of the laser marking method of the present invention may include the steps of: generating a laser beam; dividing the laser beam into a first marking laser beam and a second marking laser beam; Controlling at least one of the first marker laser beam and the second marker laser beam by at least one of the first beam control unit and the second beam control unit that changes in the applied voltage and changes in the refractive index And controlling the direction of the first marker laser beam and the second marker laser beam by the first beam control unit and the second beam control unit to mark the first shape and the at least one object to be marked Two shape steps.

The step of controlling characteristics of at least one of the first mark laser beam and the second mark laser beam may be selectively blocked by being applied to the first beam control portion and the second beam control portion The mark laser beam passing through the light flux control unit is modulated by at least one of the voltages.

In the step of marking the first shape and the second shape, the first shape may be different from the second shape.

The step of controlling characteristics of at least one of the first mark laser beam and the second mark laser beam may be adjusted to be applied to at least one of the first beam control portion and the second beam control portion The intensity of the marked laser beam passing through the beam control unit is adjusted in accordance with the magnitude of the voltage.

The intensity of the first marker laser beam passing through the first beam control portion may be the same as the intensity of the second marker laser beam passing through the second beam control portion. [Effect of the invention]

The laser marking system according to the embodiment of the present invention and the laser marking method using the same can quickly modulate the marking thunder by controlling the voltage applied to the beam control portion of the moving path disposed on the marking laser beam Beam or adjust the intensity of the above marked laser beam. Therefore, the reliability of the marking operation can be ensured, and the marking time can be shortened and the productivity can be improved.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are given to the same components, and the size or thickness of each component can be exaggerated for clarity of description.

FIG. 1 is a view showing a schematic configuration of a laser marking system 1 of an embodiment.

Referring to Figure 1, the laser marking system 1 includes a laser emitter 10.

The laser emitter 10 can generate or emit a laser beam L. The laser beam L can be a laser beam that is rotated by polarization. For example, the laser beam L can be a P-polarized laser beam.

The laser marking system 1 can mark the marking objects W1, W2 by at least two heads. The laser marking system 1 further includes a beam splitter 20, a first beam control unit 41, a second beam control unit 42, a first galvanometer scanner 61, and a second galvanometer scanner 62.

The beam splitter 20 can split the laser beam L emerging from the laser emitter 10 into at least two marked laser beams. For example, the beam splitter 20 may divide the laser beam L into a first marker laser beam L1 and a second marker laser beam L2.

As an example, the intensity of the divided first marker laser beam L1 and second marker laser beam L2 may be the same as each other. As another example, the intensity of the divided first marker laser beam L1 and second marker laser beam L2 may be different. The difference between the intensity of the first marker laser beam L1 and the intensity of the second marker laser beam L2 may be within 50% of the intensity of the first marker laser beam L1.

The first high mirror 31 and the second high mirror 32 may be disposed in a moving path of the first marker laser beam L1 and the second marker laser beam L2. For example, the first high mirror 31 and the second high mirror 32 may be disposed between the beam splitter 20 and the first beam control portion 41 and the second beam control portion 42 which will be described later.

The first high mirror 31 and the second high mirror 32 may be mirror surfaces having a reflectance of 99% or more. The first high reflection mirror 31 can reflect the first marker laser beam L1 in such a manner that the first marker laser beam L1 moves to the first beam control portion 41 without energy loss. The second high mirror 32 can reflect the second marker laser beam L2 in such a manner that the second marker laser beam L2 moves to the second beam control portion 42 without energy loss.

Although not shown, the first high mirror 31 and the second high mirror 32 can form an appropriate coating layer on the reflective surface in accordance with energy density, wavelength, reflection angle, and use.

The first marker laser beam L1 and the second marker laser beam L2 reflected by the first high mirror 31 and the second high mirror 32 can be moved to the first beam control unit 41 and the second beam control unit 42 via the first beam control unit 41 and the second beam control unit 42 to The first galvanometer scanner 61 and the second galvanometer scanner 62. The first galvanometer scanner 61 can control the direction of the first marked laser beam L1. The second galvanometer scanner 62 can control the direction of the second marked laser beam L2.

In the first galvanometer scanner 61 and the second galvanometer scanner 62, two galvanometer mirrors 601, 602 can be vertically disposed. The desired marker data can be rendered on the marker objects W1, W2 based on the sum of the motion vectors of the two galvanometer mirrors 601, 602. The two galvanometer mirrors 601, 602 can be referred to as X, Y scanners.

The first beam expander 51 and the second beam expander 52 may be disposed between the first galvanometer scanner 61 and the second galvanometer scanner 62 and the first beam control unit 41 and the second beam control unit 42. The first beam expander 51 and the second beam expander 52 convert the first marker laser beam L1 and the second marker laser beam L2 into thicker parallel rays. Although not shown, the first beam expander 51 and the second beam expander 52 may be composed of three sets of lenses. The more the magnification of the lenses of the first beam expander 51 and the second beam expander 52 is increased, the more the first marker laser beam L1 and the second marker laser beam L2 can be converted into thicker parallel rays, and more Reduce the spread angle. The first beam expander 51 and the second beam expander 52 can be used to adjust the first marker laser beam L1 and the second marker laser beam L2 to a desired spot size.

The first F-theta lens 71 and the second F-theta lens 72 are configurable to the first marked laser beam L1 and the second marked laser passing through the first galvanometer scanner 61 and the second galvanometer scanner 62 The path of the beam L2.

The lengths of the movement paths of the first marker laser beam L1 and the second marker laser beam L2 divided by the beam splitter 20 described above may be identical to each other. For example, the movement path of the first marker laser beam L1 between the beam splitter 20 and the first beam control portion 41, and the movement of the second marker laser beam L2 between the beam splitter 20 and the second beam control portion The path can be the same. Thereby, the marking can be performed simultaneously by the two heads.

The first light flux controlling portion 41 is disposed to the moving path of the first mark laser beam L1, and can control the characteristics of the first mark laser beam L1. The second light flux controlling portion 42 is disposed to the moving path of the second mark laser beam L2, and can control the characteristics of the second mark laser beam L2.

The first beam control portion 41 may be disposed between the beam splitter 20 and the first galvanometer scanner 61, and the second beam control portion 42 may be disposed between the beam splitter 20 and the second galvanometer scanner 62.

The characteristics of the first marker laser beam L1 and the second marker laser beam L2 controlled by the first beam control unit 41 and the second beam control unit 42 may include intensity (or power) adjustment of the marker laser beam, marking At least one of the modulation of the laser beam. As an example, at least one of the first beam control unit 41 and the second beam control unit 42 can adjust the intensity of the marked laser beam. As another example, at least one of the first beam control unit 41 and the second beam control unit 42 may change the mark laser beam.

Therefore, the first light flux controlling unit 41 and the second light flux controlling unit 42 can be configured to change the refractive index in accordance with the change in the applied voltage. Thereby, the polarization characteristics of the first marker laser beam L1 and the second marker laser beam L2 passing through the first beam control unit 41 and the second beam control unit 42 are changed.

The first beam control unit 41 and the second beam control unit 42 may respectively include: a Bockels cell 110; a driver 120 that applies a voltage to the Bockels cell 110; and a polarizer 130 that causes the mark to pass through the Blakes box 110 The beam is polarized. The first beam control unit 41 and the second beam control unit 42 may each further include a dumper 140.

The refractive index of the Boxer box 110 can vary depending on the applied voltage. The material of the Boxer box 110 may include ammonium dihydrogen phosphate (ADP), potassium dihydrogen phosphate (KDP), potassium dideuterium phosphate (KD*P), lithium niobate. (lithium niobate, LN), β-barium oxide (BBO), lithium triborate (LBO), and cadmium telluride (CdTe).

The Boxer box 110 can be a wavelength plate that is controlled by voltage. For example, when a specific first voltage is applied to the Boxer box 110, the Boxer box 110 can be actuated as a 1/2 wavelength plate. When a second voltage different from the first voltage is applied to the Boxer box 110, the Brooks box 110 can be actuated as a quarter-wave plate. When no voltage is applied to the Boxer box 110, the Boxer box 110 can pass the marked laser beam directly.

The driver 120 is electrically coupled to the Brooks box 110 to apply a voltage to the Boxer box 110. The refractive index of the Brooks box 110 can be adjusted by adjusting the voltage applied by the driver 120.

The polarizer 130 passes light of a specific polarized light to block other polarized light. For example, the polarizer 130 can pass a P-polarized laser beam that marks the laser beam, refracting the S-polarized laser beam.

The tipper 140 is configured to move the path of the marked laser beam refracted by the polarizer 130. The tipper 140 can absorb the refracted marked laser beam.

As described above, the laser marking system 1 of the embodiment can change the polarization characteristics of the first beam control portion 41 and the second beam control portion 42 by the change of the electric signal without mechanical driving, so that the marked laser beam can be quickly adjusted. Characteristics.

FIG. 2 is a view for explaining the operation of the first light flux controlling unit 41.

Referring to FIG. 2, the first marker laser beam L1 is incident on the Bockels cell 110. The first marked laser beam L1 incident on the Boxer box 110 may be a polarized laser beam. For example, the first marker laser beam L1 can be a P-polarized laser beam.

The driver 120 can apply a voltage to the Brooks box 110 by a pair of electrodes disposed on the Boxer box 110.

As an example, the driver 120 can apply a first voltage to the Brooks box 110 that causes the refractive index of the Boxer box 110 to act as a 1/2 wavelength plate. In the case where a first voltage is applied to the Boxer box 110, the first marker laser beam L1 will change from a P-polarized laser beam to an S-polarized laser beam during passage through the Bockels cell 110.

As another example, the driver 120 may not apply a voltage to the Brooks box 110. Since the Brooks box 110 is in a state where no voltage is applied, the first marker laser beam L1 does not change during the passage of the Böhler box 110 but remains a P-polarized laser beam.

The polarizer 130 can pass the P-polarized laser beam to refract the S-polarized laser beam. Therefore, when the first mark laser beam L1 is changed to the S-polarized laser beam by the Boxer box 110, the first mark laser beam L1 can be refracted by the polarizer 130. Conversely, in the case where the first marker laser beam L1 does not become the S-polarized laser beam by the Boxer box 110, the first marker laser beam L1 may pass without being refracted by the polarizer 130.

As described above, the voltage applied to the Buxel box 110 by the driver 120 is adjusted, whereby the first beam steering portion 41 can selectively block the first marker laser beam L1. Thereby, the first marked laser beam L1 can be adjusted.

For convenience of explanation, in FIG. 2, the first light flux controlling unit 41 is shown as a center, but the second light flux controlling unit may be substantially the same as the first light flux controlling unit 41. Therefore, the second marker laser beam L2 can be modulated by the second beam control unit 42.

3a and 3b are diagrams schematically showing operations of the first light flux control unit 41 and the second light flux control unit 42. 4A is a view showing an example of characteristics of the first marker laser beam L1 and the second marker laser beam L2 in a state before passing through the first light flux control unit 41 and the second light flux control unit 42, and FIG. 4b is a view showing A diagram showing an example of characteristics of the first marker laser beam L1 and the second marker laser beam L2 in a state after the one beam control unit 41 and the second beam control unit 42. 5a and 5b show the shapes of the marking objects W1, W2 by the first marker laser beam L1 and the second marker laser beam L2 passing through the first beam control unit 41 and the second beam control unit 42. Example.

Referring to FIG. 3a, no voltage is applied to the Buxel box 110 of the first beam control portion 41. Thereby, the first marker laser beam L1, which is the P-polarized laser beam, passes through the Böhler box 110 without change, thereby passing through the polarizer 130 without being refracted. Referring to FIG. 3b, a first voltage is applied to the Buxel box 110 of the second light flux controlling portion 42. Thereby, the second marked laser beam L2, which is the P-polarized laser beam, becomes an S-polarized laser beam during the passage through the Bockels cell 110. Thereby, the second marker laser beam L2 is refracted by the polarizer 130.

As described above, the voltages of the Buxel box 110 applied to the first beam control unit 41 and the second beam control unit 42 are changed, thereby being variably passed through the first beam control unit 41 and the second beam control unit 42. The first marker laser beam L1 and the second marker laser beam L2.

For example, before passing through the first beam control unit 41 and the second beam control unit 42 by the beam splitter 20, the first mark laser beam L1 and the second mark laser beam L2 can be used as pulse lasers as shown in the figure. (a) in 4a and (b) in Fig. 4a. In the process of the first beam control portion 41 and the second beam control portion 42 that are separately controlled, the first marker laser beam L1 and the second marker laser beam L2 are selectively blocked, thereby passing the first beam The first marker laser beam L1 and the second marker laser beam L2 of the control unit 41 and the second beam control unit 42 can be turned on/off as shown in (a) of FIG. 4b and (b) of FIG. 4b ( On/off) time is different.

Thereby, the first shape SH1 (refer to FIG. 5a) marked by the first mark laser beam L1 and the second shape SH2 (refer to FIG. 5b) marked by the second mark laser beam L2 may be different.

5a and 5b, the character "D" can be marked on the marking object W1 by the first marking laser beam L1, and the character can be marked on the marking object W2 by the second marking laser beam L2. A". The laser marking system 1 of the embodiment can mark the first shape SH1, that is, the character "D", once on the other object W1, and the second shape SH2, that is, the character, twice on the other object W2. A". Thereafter, the laser marking system 1 can also mark different shapes on the marking objects W1, W2 by the first marking laser beam L1 and the second marking laser beam L2.

FIG. 6 is another view for explaining the operation of the first light flux controlling unit 41, and FIG. 7 is a view schematically showing the operation of the first light flux controlling unit 41 of FIG.

Referring to Figures 6 and 7, a second voltage different from the first voltage can be applied to the Boxer box 110. For example, the second voltage can be less than the first voltage.

The refractive index of the Boxer's capsule 110 may be different from the refractive index when the first voltage is applied to the Brooks box 110 or no voltage is applied because a second voltage is applied to the Boxer box 110. Thereby, the first marker laser beam L1, which is the P-polarized laser beam, becomes a marked laser beam having P-polarization characteristics and S-polarization characteristics during the passage through the Bockels cell 110.

The S-polarized laser beam of the first marker laser beam L1 is refracted by the polarizer 130, and only the P-polarized laser beam can pass through the polarizer 130. Therefore, the power (or intensity) of the first marker laser beam L1 is attenuated during the passage through the first beam control portion 41.

For convenience of explanation, although the first light flux controlling unit 41 is illustrated as a center in FIGS. 6 and 7, the second light flux controlling unit may be substantially the same as the first light flux controlling unit 41. Thereby, the power (or intensity) of the second marker laser beam L2 can be reduced by the second beam control portion.

8A is a view showing an example of characteristics of the first marker laser beam L1 and the second marker laser beam L2 before the first beam control unit 41 and the second beam control unit 42 are passed, and FIG. 8b shows the passage. A diagram showing an example of characteristics of the first marker laser beam L1 and the second marker laser beam L2 in a state after the one beam control unit 41 and the second beam control unit 42.

Referring to FIG. 1 and FIG. 8a, when the laser beam is split into the first mark laser beam L1 and the second mark laser beam L2 by the beam splitter 20, the first mark laser beam L1 and the second mark laser beam The bundle L2 can be different. For example, as shown in (a) of FIG. 8a and (b) of FIG. 8a, the power of the first mark laser beam L1 may be about 52% of the power of the laser beam, and the power of the second mark laser beam L2 may be It is about 48% of the power of the laser beam.

As described above, when the powers of the first marker laser beam L1 and the second marker laser beam L2 are different, the reliability of the work is degraded when performing precise operations such as semiconductor scribing operations.

However, as described based on FIGS. 6 and 7, the first marker laser beam L1 and the first marker laser beam L1 can be adjusted by adjusting the voltage applied to the Buxel box 110 of the first beam control portion 41 and the second beam control portion 42. The power of at least one of the second marked laser beam L2 is attenuated. For example, as shown in Figure 8b, the power of the first marked laser beam L1 can be attenuated. Therefore, the laser marking system 1 of the embodiment can be the same as the power of the first mark laser beam L1 and the second mark laser beam L2 as in (a) of FIG. 8b and (b) of FIG. 8b. The first beam control unit 41 and the second beam control unit 42 are controlled.

On the other hand, in the above embodiment, the example in which the first light flux controlling unit 41 is controlled has been mainly described. However, the present invention is not limited thereto, and the first light beam controlling unit 41 and the second light beam controlling unit 42 are controlled. At least one of them can implement various modifications.

Hereinafter, a laser marking method using the above-described laser marking system 1 will be described.

Fig. 9 is a sequence diagram showing an example of a laser marking method of the embodiment. Referring to Figures 1 and 9, the laser emitter 10 can generate a laser beam L (step S10). The laser beam L can be a laser beam that is rotated by polarization. For example, the laser beam L can be a P-polarized laser beam.

The laser beam L can be divided into a first mark laser beam L1 and a second mark laser beam L2 by the beam splitter 20 (step S20). As an example, the intensity of the first marker laser beam L1 may be the same as the intensity of the second marker laser beam L2. As another example, the intensity of the first marker laser beam L1 may be different from the intensity of the second marker laser beam L2. The difference between the intensity of the first marker laser beam L1 and the intensity of the second marker laser beam L2 may be within 50% of the intensity of the first marker laser beam L1.

The first marker laser beam L1 and the second marker laser beam L2 that are divided can control the characteristics of the marker laser beam by the first beam control unit 41 and the second beam control unit 42. For example, at least one of the first mark laser beam L1 and the second mark laser beam L2 may be variably adjusted, or at least one of the first mark laser beam L1 and the second mark laser beam L2 may be adjusted strength.

As an example, the voltage applied to the Buxel box 110 of at least one of the first beam control unit 41 and the second beam control unit 42 can be selectively blocked. For example, the first voltage may be applied to the Böhler box 110 of the first beam control unit 41, and no voltage may be applied to the Böhler box 110 of the second beam control unit. Thereby, the first marker laser beam L1 cannot be blocked by the first beam control unit 41, and the second marker laser beam L2 passes through the second beam control unit 42. As described above, the first marker laser beam L1 and the second marker laser beam L2 that pass through the first beam control unit 41 and the second beam control unit 42 can be differently modulated. Therefore, the first shape SH1 and the second shape SH2 which are marked on the mark objects W1 and W2 by the first mark laser beam L1 and the second mark laser beam L2 are different.

As another example, the magnitude of the voltage applied to the Böhler box 110 applied to at least one of the first beam control unit 41 and the second beam control unit 42 can be adjusted. Thereby, the intensity of the first marker laser beam L1 and the second marker laser beam L2 passing through the first beam control unit 41 and the second beam control unit 42 can be adjusted. Therefore, even if the intensity of the first marker laser beam L1 and the second marker laser beam L2 split by the beam splitter 20 is slightly different, the first beam control unit 41 and the second can be similarly adjusted. The intensity of the first mark laser beam L1 and the second mark laser beam L2 that are irradiated to the object to be marked W1, W2 by the light beam control unit 42.

The first galvanometer scanner 61 and the second galvanometer scanner 62 can control the irradiation directions of the first marker laser beam L1 and the second marker laser beam L2. The first galvanometer scanner 61 and the second galvanometer scanner 62 may be different by differently controlling the illumination directions of the first marker laser beam L1 and the second marker laser beam L2 having different characteristics. The first shape SH1 and the second shape SH2 are marked to the marking objects W1, W2.

In the above embodiment, the laser beam L has been described as an example of the P-polarized laser beam. However, the S-polarized laser beam may or may not be a polarized laser beam. In this case, the configuration relating to the polarized laser beam can also be appropriately changed.

The embodiments of the present invention have been described above, but the above-described embodiments are merely examples, and those skilled in the art should understand that various modifications and equivalent embodiments can be implemented in accordance with the embodiments described above.

1‧‧‧Laser marking system
10‧‧‧Laser transmitter
20‧‧‧beam splitter
31, 32‧‧‧ first high mirror and second high mirror
41, 42‧‧‧ first beam control unit and second beam control unit
51, 52‧‧‧ first beam expander and second beam expander
61, 62‧‧‧ first galvanometer scanner and second galvanometer scanner
71, 72‧‧‧ first F-theta lens and second F-theta lens
110‧‧‧Buckels box
120‧‧‧ drive
130‧‧‧Polarizer
140‧‧‧ dumper
601, 602‧‧‧ galvanometer mirror
L‧‧‧Laser beam
L1, L2‧‧‧ mark laser beam
P‧‧‧P polarized laser beam
S‧‧‧S polarized laser beam
S10 ~ S40‧‧‧ steps
SH1‧‧‧ first shape
SH2‧‧‧ second shape
W1, W2‧‧‧ mark object

Fig. 1 is a view showing a schematic configuration of a laser marking system of an embodiment. Fig. 2 is a view for explaining the operation of the first light flux controlling unit. 3a and 3b are diagrams schematically showing operations of the first light flux controlling unit and the second light flux controlling unit. 4A is a view showing an example of characteristics of a first marker laser beam and a second marker laser beam before a first beam control unit and a second beam control unit, and FIG. 4b shows a first beam control unit. A diagram showing an example of characteristics of the first marker laser beam and the second marker laser beam in a state after the second beam control unit. 5a and 5b show an example of the shape of the object marked by the first marker laser beam and the second marker laser beam passing through the first beam control unit and the second beam control unit. Fig. 6 is another view for explaining the operation of the first light flux controlling unit. Fig. 7 is a view schematically showing an operation of the first light flux controlling unit of Fig. 6; 8A is a view showing an example of characteristics of a first marker laser beam and a second marker laser beam in a state before passing through the first beam control unit and the second beam control unit, and FIG. 8b shows a first beam control unit. A diagram showing an example of characteristics of the first marker laser beam and the second marker laser beam in a state after the second beam control unit. Fig. 9 is a sequence diagram showing an example of a laser marking method of the embodiment.

1‧‧‧Laser marking system

10‧‧‧Laser transmitter

20‧‧‧beam splitter

31, 32‧‧‧ high mirror

41, 42‧‧‧ Beam Control Department

51, 52‧‧‧ Beam expander

61, 62‧‧‧ galvanometer scanner

71, 72‧‧‧F-theta lens

110‧‧‧Buckels box

120‧‧‧ drive

130‧‧‧Polarizer

140‧‧‧ dumper

601, 602‧‧‧ galvanometer mirror

L‧‧‧Laser beam

L1, L2‧‧‧ mark laser beam

W1, W2‧‧‧ mark object

Claims (15)

A laser marking system, comprising: a laser emitter; a beam splitter that splits a laser beam emitted from the laser emitter into a first marker laser beam and a second marker laser beam; The control unit and the second light flux control unit are disposed on the movement paths of the first marker laser beam and the second marker laser beam, and the refractive index changes according to the change of the applied voltage, and the first marker laser beam and Controlling characteristics of the second marked laser beam; and first galvanometer scanner and second galvanometer scanner for first marked laser beam passing through the first beam control portion and the second beam control portion And controlling the direction of the second marked laser beam. The laser marking system of claim 1, wherein the first beam control unit and the second beam control unit respectively comprise: a Bockels box; a driver applying a voltage to the Bockels box; A polarizer polarizes the marked laser beam passing through the Bockels cell. The laser marking system of claim 2, wherein the first beam control portion and the second beam control portion each further comprise a dumper that absorbs the marked laser beam refracted by the polarizer. . The laser marking system of claim 2, wherein at least one of the first beam control portion and the second beam control portion is selectively blocked by the driver to be applied to the bob The voltage applied by the Kerr box modulates the marked laser beam passing through the beam control. The laser marking system of claim 4, wherein the first shape of the marking object is formed by the first marking laser beam and the marking object is formed by the second marking laser beam. The second shape is different. The laser marking system of claim 2, wherein at least one of the first beam control portion and the second beam control portion is adapted to be applied to the Bockels box by the driver. The intensity of the marked laser beam passing through the beam control unit is adjusted by the magnitude of the voltage. The laser marking system of claim 6, wherein the intensity of the first marked laser beam passing through the first beam control portion and the second marked laser beam passing through the second beam control portion are The same strength. The laser marking system of claim 1, further comprising a first high mirror and a second disposed between the beam splitter and the first beam control unit and the second beam control unit High mirror. The laser marking system of claim 1, wherein the length of the moving path of the first marking laser beam is the same as the moving path of the second marking laser beam. The laser marking system of claim 1, further comprising: a first beam expander and a second beam expander disposed in the first beam control unit and the second beam control unit and the first Between the galvanometer scanner and the second galvanometer scanner; and the first F-theta lens and the second F-theta lens are disposed through the first galvanometer scanner and the second galvanometer The path of the scanner's marked laser beam. A laser marking method comprising the steps of: generating a laser beam; dividing the laser beam into a first marking laser beam and a second marking laser beam; by changing according to an applied voltage And a step of controlling at least one of the first marker laser beam and the second marker laser beam by at least one of the first beam control unit and the second beam control unit having a change in refractive index; and The step of marking the first shape and the second shape on at least one of the marking objects by controlling the directions of the first marking laser beam and the second marking laser beam of the first light flux controlling unit and the second light flux controlling unit . The laser marking method of claim 11, wherein the step of controlling characteristics of at least one of the first marker laser beam and the second marker laser beam is selectively blocked A voltage applied to at least one of the first light flux controlling unit and the second light flux controlling unit is modulated to the marked laser beam passing through the light beam controlling unit. The laser marking method of claim 12, wherein in the step of marking the first shape and the second shape, the first shape is different from the second shape. The laser marking method of claim 11, wherein the step of controlling characteristics of at least one of the first marker laser beam and the second marker laser beam is applied to the The intensity of the labeled laser beam passing through the light flux controlling unit is adjusted by the magnitude of the voltage of at least one of the first light flux controlling unit and the second light beam controlling unit. The laser marking method of claim 14, wherein the intensity of the first marked laser beam passing through the first beam control portion and the second marked laser beam passing through the second beam control portion The same strength.