TW201718887A - Alloyed silver wire - Google Patents

Alloyed silver wire Download PDF

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TW201718887A
TW201718887A TW105127125A TW105127125A TW201718887A TW 201718887 A TW201718887 A TW 201718887A TW 105127125 A TW105127125 A TW 105127125A TW 105127125 A TW105127125 A TW 105127125A TW 201718887 A TW201718887 A TW 201718887A
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range
core
wire
silver wire
alloyed silver
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TW105127125A
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TWI649434B (en
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卓容德
康一太
金鍾洙
丁炫碩
金泰燁
兮 張
穆拉利 薩蘭加帕尼
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新加坡賀利氏材料私人有限公司
賀利氏東方科技股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006Ag as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261Rods, electrodes, wires
    • B23K35/0272Rods, electrodes, wires with more than one layer of coating or sheathing material
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/06Alloys based on silver
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/43Manufacturing methods
    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/05599Material
    • H01L2224/056Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624Aluminium [Al] as principal constituent
    • HELECTRICITY
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/43Manufacturing methods
    • H01L2224/438Post-treatment of the connector
    • H01L2224/43848Thermal treatments, e.g. annealing, controlled cooling
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    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/4501Shape
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/4501Shape
    • H01L2224/45012Cross-sectional shape
    • H01L2224/45015Cross-sectional shape being circular
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139Silver (Ag) as principal constituent
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554Coating
    • H01L2224/45565Single coating layer
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    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
    • H01L2224/85205Ultrasonic bonding
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    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An alloyed silver wire comprising or consisting of a wire core, the wire core itself consisting of: (a) palladium in an amount in the range of from 0.1 to 3 wt.-%, (b) gold in an amount in the range of from 0.1 to 3 wt.-%, (c) nickel in an amount in the range of from 20 to 700 wt.-ppm, (d) calcium in an amount in the range of from 20 to 200 wt.-ppm, (e) silver in an amount in the range of from 93.91 to 99.786 wt.-%, and (f) 0 to 100 wt.-ppm of further components, wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core, wherein the alloyed silver wire has an average diameter in the range of from 8 to 80 [mu]m.

Description

合金化銀線 Alloyed silver wire

本發明係關於一種8至80μm厚之合金化銀線,其包含以特定重量比包含銀、鈀、金、鎳及鈣之線芯。本發明進一步關於用於製造此類線之方法。 The present invention relates to a 8 to 80 μm thick alloyed silver wire comprising a core comprising silver, palladium, gold, nickel and calcium in a specific weight ratio. The invention further relates to a method for making such a wire.

接線在電子及微電子應用中之用途為眾所周知的現有技術水平。儘管一開始接線係由金製得,但如今使用較便宜之材料,諸如銅、銅合金、銀及銀合金。 The use of wiring in electronic and microelectronic applications is well known in the state of the art. Although the wiring was initially made of gold, less expensive materials such as copper, copper alloys, silver and silver alloys are now used.

關於線幾何結構,最常見的為圓形橫截面之接線及具有近乎矩形橫截面之接合帶。兩種類型之線幾何結構皆具有使其適用於特定應用之其優勢。 With regard to wire geometry, the most common are circular cross-section wires and bond strips having a nearly rectangular cross-section. Both types of line geometry have the advantage of making them suitable for a particular application.

本發明之一目標為提供適合用於線接合應用之合金化銀線,合金化銀線尤其在抗腐蝕性及抗濕性方面得到改善,且亦呈現與線接合應用相關之總體上非常均衡之特性範圍,其包括(例如)寬針腳式接合窗、形成具有良好再現性之軸對稱無空氣焊球(FAB)、低FAB硬度、高針腳式接合拉伸強度、軟線、低電阻率、低電遷移等。 It is an object of the present invention to provide an alloyed silver wire suitable for use in wire bonding applications, which is improved in particular in terms of corrosion resistance and moisture resistance, and which also exhibits a generally balanced balance with wire bonding applications. Range of features including, for example, wide-pin joint windows, axially symmetric airless solder balls (FAB) with good reproducibility, low FAB hardness, high stitch bond tensile strength, cord, low resistivity, low power Migration, etc.

該物品解決方案之貢獻係由形成類別之請求項的標的物提供。形成類別之請求項的從屬性附屬項表示本發明之較佳實施例,其標的物亦對解決上文提及之目標作出貢獻。 The contribution of the item solution is provided by the subject matter of the request item forming the category. The dependent sub-items that form the category of claim items represent preferred embodiments of the present invention, the subject matter of which also contributes to solving the above-mentioned objectives.

在第一態樣中,本發明係關於一種合金化銀線,其包含電線芯或由電線芯組成(下文中亦稱簡稱為「芯」),電線芯本身由以下組 成:(a)鈀,其量在0.1至3wt.-%(重量%)範圍內,較佳在0.5至1.5wt.-%範圍內,(b)金,其量在0.1至3wt.-%範圍內,較佳在0.2至1.5wt.-%範圍內,(c)鎳,其量在20至700wt.-ppm(百萬分之重量、按重量計百萬分之一)範圍內,較佳在275至325wt.-ppm範圍內,(d)鈣,其量在20至200wt.-ppm範圍內,較佳在20至50wt.-ppm範圍內,(e)銀,其量在93.91至99.786wt.-%範圍內,較佳在96.9625至99.2595wt.-%範圍內,及(f)0至100wt.-ppm之其他組分(鈀、金、鎳、鈣及銀以外之組分),其中所有以wt.-%及wt.-ppm為單位之量係基於芯之總重量,其中合金化銀線具有在8至80μm範圍內、或甚至在12至55μm範圍內之平均直徑。 In a first aspect, the present invention relates to an alloyed silver wire comprising a wire core or consisting of a wire core (hereinafter also referred to simply as "core"), the wire core itself being composed of the following group Form: (a) palladium in an amount ranging from 0.1 to 3 wt.-% (% by weight), preferably in the range of 0.5 to 1.5 wt.-%, and (b) gold in an amount of 0.1 to 3 wt.-% Within the range, preferably in the range of 0.2 to 1.5 wt.-%, (c) nickel, in an amount ranging from 20 to 700 wt.-ppm (parts per million by weight, one part per million by weight), Preferably, in the range of 275 to 325 wt.-ppm, (d) calcium, in an amount ranging from 20 to 200 wt.-ppm, preferably in the range of 20 to 50 wt.-ppm, (e) silver, in an amount of 93.91 to 99.786 wt.-%, preferably in the range of 96.9625 to 99.2595 wt.-%, and (f) 0 to 100 wt.-ppm of other components (components other than palladium, gold, nickel, calcium and silver) Wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core, wherein the alloyed silver wire has an average diameter in the range of 8 to 80 μm, or even in the range of 12 to 55 μm.

合金化銀線較佳為用於微電子中之接合的接線。合金化銀線較佳為單件式物品。眾多形狀為已知的且顯得適用於本發明之合金化銀線。較佳形狀為(在橫截面圖中)圓形、橢圓形及矩形形狀。 The alloyed silver wire is preferably a wire for bonding in microelectronics. The alloyed silver wire is preferably a one-piece article. Numerous shapes are known and appear to be suitable for use in the alloyed silver wire of the present invention. The preferred shape is (in cross-sectional view) a circular, elliptical, and rectangular shape.

簡言之,可藉由「量尺寸方法」獲得線或線芯之平均直徑或直徑。根據此方法測定限定長度之合金化銀線的物理重量。基於此重量,使用線材料密度計算線或線芯直徑。直徑經計算為特定線之五個切口上的五個量測值之算術平均值。 In short, the average diameter or diameter of the wire or core can be obtained by the "quantity size method". The physical weight of the alloyed silver wire of defined length is determined according to this method. Based on this weight, the wire or core diameter is calculated using the line material density. The diameter is calculated as the arithmetic mean of the five measurements on the five cuts of a particular line.

對於本發明,術語「接線」包含所有橫截面形狀及所有常見線直徑,但具有圓形橫截面及薄直徑之接線為較佳的。 For the purposes of the present invention, the term "wiring" encompasses all cross-sectional shapes and all common wire diameters, but wires having a circular cross-section and a thin diameter are preferred.

與前述一致,線芯以前文揭示之成比例的比率包含(a)鈀、(b) 金、(c)鎳、(d)鈣及(e)銀。然而,本發明之合金化銀線的芯可以0至100wt.-ppm之總量包含(f)其他組分。在本上下文中,常亦稱為「不可避免的雜質」之其他組分為來源於存在於所用原材料中之雜質或來源於線製造方法之少量化學元素及/或化合物,亦即(f)型其他組分之存在可(例如)來源於存在於銀、鈀、金、鎳及鈣中之一或多者中的雜質。此類其他組分之實例為:Cu、Fe、Si、Mn、Cr、Ce、Mg、La、Al、B、Zr、Ti、S等。其他組分(f)之0至100wt.-ppm的低總量確保線特性之良好再現性。通常不分開添加存在於芯中之其他組分(f)。 Consistent with the foregoing, the proportional ratios previously disclosed in the core include (a) palladium, (b) Gold, (c) nickel, (d) calcium and (e) silver. However, the core of the alloyed silver wire of the present invention may contain (f) other components in a total amount of from 0 to 100 wt.-ppm. In this context, other components often referred to as "inevitable impurities" are derived from impurities present in the raw materials used or from small amounts of chemical elements and/or compounds derived from the wire manufacturing process, ie, type (f) The presence of other components can, for example, be derived from impurities present in one or more of silver, palladium, gold, nickel, and calcium. Examples of such other components are: Cu, Fe, Si, Mn, Cr, Ce, Mg, La, Al, B, Zr, Ti, S, and the like. The low total amount of 0 to 100 wt.-ppm of the other component (f) ensures good reproducibility of the line characteristics. The other component (f) present in the core is usually not added separately.

在一實施例中,本發明之合金化銀線的芯包含小於以下量之其他組分(f):(i)Cu,其量<30wt.-ppm;(ii)Cr、Ce、Mg、La、Al、Be、In、Mn、Ti中之任一者,其量各<2wt.-ppm;(iii)Si、Fe、S中之任一者,其量各<15wt.-ppm。 In one embodiment, the core of the alloyed silver wire of the present invention comprises less than the following components (f): (i) Cu, amount <30 wt.-ppm; (ii) Cr, Ce, Mg, La Any one of Al, Be, In, Mn, and Ti, each of which is <2 wt.-ppm; (iii) any of Si, Fe, and S, each of which is <15 wt.-ppm.

本上下文中之合金化銀線的芯經定義為塊狀材料之均質區域。因為任何塊狀材料始終具有可在一定程度上呈現不同特性之表面區域,所以線芯之特性理解為塊狀材料均質區域之特性。塊狀材料區域之表面就形態、組成(例如硫、氯及/或氧氣含量)及其他特徵而言可為不同的。表面可為線芯之外表面;在此實施例中,本發明之合金化銀線由線芯組成。在一替代方案中,表面可為線芯及疊加於線芯上之塗層之間的界面區域。 The core of the alloyed silver wire in this context is defined as a homogeneous region of the bulk material. Since any bulk material always has a surface area that exhibits different characteristics to some extent, the characteristics of the core are understood to be characteristics of the homogeneous region of the bulk material. The surface of the bulk material region may be different in terms of morphology, composition (e.g., sulfur, chlorine, and/or oxygen content) and other characteristics. The surface may be the outer surface of the core; in this embodiment, the alloyed silver wire of the present invention is composed of a core. In an alternative, the surface can be the interface area between the core and the coating superimposed on the core.

在本發明之上下文中,術語「疊加」用於描述例如線芯之第一物品相對於例如塗層之第二物品的相對位置。「疊加」特徵在於諸如中間層之其他物品可(但不需要)配置於第一及第二物品之間。較佳地,各相對於第一物品之總表面,第二物品至少部分地疊加於第一物品上,例如達至少30%、50%、70%或達至少90%。最佳地,第二物 品完全疊加於第一物品上。 In the context of the present invention, the term "overlay" is used to describe, for example, the relative position of a first item of a core relative to a second item such as a coating. The "overlay" feature is that other items such as the intermediate layer may (but need not) be disposed between the first and second items. Preferably, the second article is at least partially superimposed on the first article relative to the total surface of the first article, for example at least 30%, 50%, 70% or at least 90%. Best, second thing The product is completely superimposed on the first item.

在本發明之上下文中,術語「中間層」係指在合金化銀線之芯及疊加於其上之塗層之間的合金化銀線之區域。在此區域中,存在芯及塗層兩者的材料之組合。 In the context of the present invention, the term "intermediate layer" means the region of the alloyed silver wire between the core of the alloyed silver wire and the coating superimposed thereon. In this region, there is a combination of materials for both the core and the coating.

在本發明之上下文中,術語「厚度」用於定義層在垂直於芯之縱向軸線的方向上的尺寸,該層至少部分地疊加於芯之表面上。 In the context of the present invention, the term "thickness" is used to define the dimension of a layer in a direction perpendicular to the longitudinal axis of the core which is at least partially superimposed on the surface of the core.

在一實施例中,芯具有表面,其中將塗層疊加於芯之表面上。 In an embodiment, the core has a surface in which the coating is superimposed on the surface of the core.

在一實施例中,各相對於芯之總質量,塗層之質量不超過5wt.-%,較佳不超過2wt.-%或更低。當存在塗層時,各相對於芯之總質量,其常具有0.1wt.-%或更高、或0.5wt.-%或更高之最小質量。將少量材料塗覆為塗層保持由線芯材料定義之特徵。另一方面,塗層賦予線表面以特定特徵,諸如相對於環境之惰性、抗腐蝕性、改善之黏結性等。舉例而言,對於直徑為18μm之線,塗層之厚度在20至120nm範圍內。對於具有25μm之直徑的線,塗層可具有(例如)在30至150nm範圍內之厚度。 In one embodiment, the mass of the coating is no more than 5 wt.-%, preferably no more than 2 wt.-% or less, relative to the total mass of the core. When a coating is present, each has a minimum mass of 0.1 wt.-% or higher, or 0.5 wt.-% or higher, relative to the total mass of the core. Coating a small amount of material as a coating maintains the characteristics defined by the core material. On the other hand, the coating imparts specific characteristics to the surface of the wire, such as inertness with respect to the environment, corrosion resistance, improved adhesion, and the like. For example, for a wire having a diameter of 18 μm, the thickness of the coating is in the range of 20 to 120 nm. For wires having a diameter of 25 μm, the coating can have a thickness, for example, in the range of 30 to 150 nm.

在一實施例中,塗層可由貴金屬元素製成。塗層可為該元素之一的單層。在另一實施例中,塗層可為多層,其包括多個疊加相鄰子層,其中各子層由不同貴金屬元素製成。用於沈積此類貴金屬元素於芯上之常用技術為諸如電鍍及無電極電鍍之鍍覆、諸如濺鍍、離子電鍍、真空蒸發及物理氣相沈積之材料自氣相之沈積、及材料自熔融物之沈積。 In an embodiment, the coating may be made of a precious metal element. The coating can be a single layer of one of the elements. In another embodiment, the coating can be a plurality of layers comprising a plurality of superposed adjacent sub-layers, wherein each sub-layer is made of a different precious metal element. Common techniques for depositing such precious metal elements on the core are plating such as electroplating and electroless plating, deposition of materials from the vapor phase such as sputtering, ion plating, vacuum evaporation, and physical vapor deposition, and self-melting of materials. Deposition of matter.

在一實施例中,本發明之合金化銀線或其芯至少特徵在於以下固有特性中之一者(參見如下所述之「測試方法A」):(1)平均線粒度(平均粒度)小於10μm,例如在2至6μm範圍內,較佳在2至4μm範圍內,(2)線晶粒[100]或[101]或[111]定向平面小於7%,例如在1%至5% 範圍內,較佳在2%至3.5%範圍內,(3)線孿晶間界分數小於60%,例如在30%至50%範圍內,較佳在40%至45%範圍內,(4)FAB呈現柱狀晶粒(晶粒經伸長),(5)FAB平均粒度18μm,例如在6至14μm範圍內,較佳在8至12μm範圍內,(6)FAB晶粒[101]定向平面小於45%,例如在30%至40%範圍內,較佳在32%至36%範圍內,(7)FAB孿晶間界分數小於70%,例如在30%至65%範圍內,較佳在60%至65%範圍內,及/或至少特徵在於以下非固有特性中之一者:(α)抗腐蝕性具有不超過5%接合球上升之值,例如在0至5%範圍內(參見如下所述之「測試方法B」),(β)抗濕性具有不超過5%接合球上升之值,例如在0至5%範圍內(參見如下所述之「測試方法C」),(γ)線芯之硬度不超過85HV,例如在50至85HV範圍內,較佳在65至75HV範圍內(參見如下所述之「測試方法D」),(δ)用於針腳式接合之製程窗區域具有至少12000mA.g之值,例如對於直徑為18μm之線,值為13000至14400mA.g(參見如下所述之具體揭示內容及「測試方法E」),(ε)線之電阻率小於2.5μΩ.cm,例如在1.7至2.4μΩ.cm範圍內,較佳在2.2至2.4μΩ.cm範圍內(參見如下所述之「測試方法F」),(ζ)線之屈服強度不超過170MPa,例如在140至170MPa範圍內(參見如下所述之「測試方法G」),(η)線之銀樹突狀生長不超過4μm/s,例如在2至4μm/s範圍內,較佳在2至3μm/s範圍內(參見如下所述之「測試方法H」)。 In one embodiment, the alloyed silver wire of the present invention or a core thereof is characterized by at least one of the following intrinsic properties (see "Test Method A" as described below): (1) the average wire size (average particle size) is less than 10 μm, for example in the range of 2 to 6 μm, preferably in the range of 2 to 4 μm, (2) the line grain [100] or [101] or [111] orientation plane is less than 7%, for example in the range of 1% to 5% Preferably, in the range of 2% to 3.5%, the (3) line twin boundary fraction is less than 60%, for example, in the range of 30% to 50%, preferably in the range of 40% to 45%, (4) FAB exhibits columnar grains (grain elongation), (5) FAB average particle size 18 μm, for example in the range of 6 to 14 μm, preferably in the range of 8 to 12 μm, (6) FAB grain [101] orientation plane is less than 45%, for example in the range of 30% to 40%, preferably 32% to Within the range of 36%, (7) the FAB twin boundary fraction is less than 70%, for example, in the range of 30% to 65%, preferably in the range of 60% to 65%, and/or at least characterized by the following intrinsic properties. One of: (α) corrosion resistance has a value of no more than 5% of the rising of the ball, for example, in the range of 0 to 5% (see "Test Method B" as described below), (β) has no moisture resistance. More than 5% of the value of the joint ball rise, for example, in the range of 0 to 5% (see "Test Method C" as described below), the hardness of the (γ) core does not exceed 85 HV, for example, in the range of 50 to 85 HV, Preferably in the range of 65 to 75 HV (see "Test Method D" as described below), (δ) has a process window area for stitch bonding with at least 12000 mA. The value of g, for example for a line with a diameter of 18 μm, a value of 13,000 to 14400 mA. g (see the specific disclosure below and "Test Method E"), the resistivity of the (ε) line is less than 2.5μΩ. Cm, for example at 1.7 to 2.4 μΩ. Within the range of cm, preferably between 2.2 and 2.4 μΩ. Within the range of cm (see "Test Method F" below), the yield strength of the (ζ) line does not exceed 170 MPa, for example in the range of 140 to 170 MPa (see "Test Method G" as described below), (η) The silver dendritic growth of the line does not exceed 4 μm/s, for example, in the range of 2 to 4 μm/s, preferably in the range of 2 to 3 μm/s (see "Test Method H" as described below).

本文所用之術語「固有特性」及「非固有特性」係關於線芯或FAB。固有特性意謂線芯或FAB本身具有之特性(獨立於其他因素),而非固有特性係視線芯或FAB與其他因素(如所用之量測方法及/或量測條件)之關係而定。 As used herein, the terms "intrinsic property" and "non-inherent property" relate to a core or FAB. Inherent characteristics mean the characteristics of the core or FAB itself (independent of other factors), while the intrinsic characteristics depend on the relationship between the line of sight core or FAB and other factors, such as the measurement method used and/or the measurement conditions.

在本發明之一較佳實施例之情況下,線芯之硬度(即接合之前的硬度)小於85HV,較佳在65至75HV範圍內。此外,在接合之前使用本發明之線所處理之FAB的硬度小於80HV,較佳在60至70HV範圍內。線芯及FAB之此硬度或(更精確而言)柔軟度有助於在接合過程中防止損害敏感性基體。實驗亦已顯示本發明之此類軟線呈現極軟FAB特性。若機械敏感性結構排列於結合襯墊之下,則FAB硬度之此限制為尤其有用的。若結合襯墊由如鋁或金之軟材料組成,則此尤為正確。舉例而言,敏感性結構可包含一個或若干個多孔二氧化矽層,其尤其具有小於2.5之介電常數。因為材料可有助於提昇裝置效能,所以此多孔及因此薄弱材料變得愈加常用。因此,本發明之接線的機械特性可經優化以避免此類薄弱層之開裂或其他損害。 In the case of a preferred embodiment of the invention, the hardness of the core (i.e., the hardness prior to bonding) is less than 85 HV, preferably in the range of 65 to 75 HV. Further, the hardness of the FAB treated using the wire of the present invention prior to joining is less than 80 HV, preferably in the range of 60 to 70 HV. This hardness or (more precisely) softness of the core and FAB helps to prevent damage to the sensitive substrate during the bonding process. Experiments have also shown that such cords of the present invention exhibit extremely soft FAB characteristics. This limitation of FAB hardness is especially useful if the mechanically sensitive structure is arranged below the bond pad. This is especially true if the bond pad consists of a soft material such as aluminum or gold. For example, the sensitive structure may comprise one or several porous ceria layers, which in particular have a dielectric constant of less than 2.5. This porous and therefore weak material has become more common because materials can help to improve device performance. Thus, the mechanical properties of the wiring of the present invention can be optimized to avoid cracking or other damage to such weak layers.

在一特定實施例中,本發明之合金化銀線呈現銀樹突狀生長,其速率小於4μm/s,例如在2至小於4μm/s範圍內,較佳在2至3μm/s範圍內,其為4N純銀線之約25μm/s生長速率的約1/10至1/7。 In a particular embodiment, the alloyed silver wire of the present invention exhibits silver dendritic growth at a rate of less than 4 μm/s, such as in the range of 2 to less than 4 μm/s, preferably in the range of 2 to 3 μm/s, It is about 1/10 to 1/7 of the growth rate of about 25 μm/s of the 4N pure silver wire.

在另一有利實施例中,線之電阻率小於3.2μΩ.cm,例如在2.0至2.4μΩ.cm範圍內,較佳在2.2至2.4μΩ.cm範圍內,亦即意謂適用於許多應用。 In another advantageous embodiment, the resistivity of the wire is less than 3.2 μΩ. Cm, for example at 2.0 to 2.4 μΩ. Within the range of cm, preferably between 2.2 and 2.4 μΩ. Within the scope of cm, it means that it is suitable for many applications.

在另一態樣中,本發明亦關於用於製造上文揭示之其實施例中任一者之合金化銀線的方法。方法至少包含以下步驟:(1)提供前驅體物品,其由以下組成:(a)鈀,其量在0.1至3wt.-%範圍內,較佳在0.5至1.5wt.-%範圍內, (b)金,其量在0.1至3wt.-%範圍內,較佳在0.2至1.5wt.-%範圍內,(c)鎳,其量在20至700wt.-ppm範圍內,較佳在275至325wt.-ppm範圍內,(d)鈣,其量在20至200wt.-ppm範圍內,較佳在20至50wt.-ppm範圍內,(e)銀,其量在93.91至99.786wt.-%範圍內,較佳在96.9625至99.2595wt.-%範圍內,及(f)0至100wt.-ppm之其他組分,其中所有以wt.-%及wt.-ppm為單位之量係基於前驅體物品之總重量,(2)伸長前驅體物品以形成線前驅體,直至獲得線芯之所要最終直徑;及(3)最終,在完成方法步驟(2)後,在400至600℃範圍內之烘箱設定溫度下,對所獲得之線前驅體進行帶材退火達0.4至0.8秒範圍內之暴露時間以形成合金化銀線,其中步驟(2)包括在400至800℃之烘箱設定溫度下,對伸長前驅體物品進行中度分批退火達50至150分鐘範圍內之暴露時間的一或多個子步驟,及/或在400至800℃之烘箱設定溫度下,對伸長前驅體物品進行中度帶材退火達0.4秒至1.2秒範圍內之暴露時間的一或多個子步驟。 In another aspect, the invention is also directed to a method for making an alloyed silver wire of any of the embodiments disclosed above. The method comprises at least the following steps: (1) providing a precursor article comprising: (a) palladium in an amount ranging from 0.1 to 3 wt.-%, preferably from 0.5 to 1.5 wt.-%, (b) gold in an amount ranging from 0.1 to 3 wt.-%, preferably in the range of from 0.2 to 1.5 wt.-%, and (c) nickel in an amount ranging from 20 to 700 wt.-ppm, preferably In the range of 275 to 325 wt.-ppm, (d) calcium, in an amount ranging from 20 to 200 wt.-ppm, preferably in the range of 20 to 50 wt.-ppm, (e) silver in an amount of 93.91 to 99.786 wt. In the range of .-%, preferably in the range of 96.9625 to 99.2595 wt.-%, and (f) 0 to 100 wt.-ppm of other components, all in wt.-% and wt.-ppm Based on the total weight of the precursor article, (2) elongating the precursor article to form a wire precursor until the desired final diameter of the core is obtained; and (3) finally, after completing method step (2), at 400 to 600 The obtained wire precursor is subjected to strip annealing for an exposure time in the range of 0.4 to 0.8 seconds at an oven set temperature in the range of ° C to form an alloyed silver wire, wherein the step (2) includes an oven at 400 to 800 ° C. One or more sub-steps of moderately batch annealing the elongated precursor article to an exposure time in the range of 50 to 150 minutes at a set temperature, and/or an elongation precursor at an oven set temperature of 400 to 800 ° C Object One or more sub-steps performed within the exposure time of the annealed strip was moderate from 0.4 to 1.2 seconds range.

在本文中使用術語「帶材退火」。其為允許快速生產具有高再現性之線的連續製程。帶材退火意謂動態地進行退火,此時伸長線前驅體物品或待退火之線前驅體經移動穿過退火烘箱且在已離開退火箱後經纏繞於卷軸上。 The term "strip annealing" is used herein. It is a continuous process that allows rapid production of lines with high reproducibility. Strip annealing means that the annealing is performed dynamically, at which time the elongated wire precursor article or the wire precursor to be annealed is moved through the annealing oven and wound onto the spool after having left the annealing box.

在本文中使用術語「烘箱設定溫度」。其意謂退火烘箱之溫度控 制器中所固定之溫度。退火烘箱可為室爐型烘箱(在分批退火之情況下)或管狀退火烘箱(在帶材退火之情況下)。 The term "oven set temperature" is used herein. It means the temperature control of the annealing oven The temperature fixed in the controller. The annealing oven can be a chamber furnace (in the case of batch annealing) or a tubular annealing oven (in the case of strip annealing).

本發明區分前驅體物品、線前驅體及合金化銀線。術語「前驅體物品」用於彼等線前階段,其尚未達到線芯之所要最終直徑,而術語「線前驅體」用於具有所要最終直徑之線前階段。在完成方法步驟(3)後,亦即在對具有所要最終直徑之線前驅體進行最終帶材退火後,獲得本發明意義上之合金化銀線。 The invention distinguishes precursor articles, wire precursors and alloyed silver wires. The term "precursor article" is used in the pre-wire stage, which has not yet reached the desired final diameter of the core, and the term "line precursor" is used in the pre-line phase with the desired final diameter. After completion of method step (3), i.e., after final strip annealing of the line precursor having the desired final diameter, an alloyed silver line in the sense of the present invention is obtained.

可藉由以所要量之鈀、金、鎳及鈣摻合/摻雜銀來獲得如方法步驟(1)中所提供之前驅體物品。銀合金本身可藉由熟習金屬合金之技術者已知的習知方法來製備,例如藉由以所要比率將銀、鈀、金、鎳及鈣熔融在一起。在此情況下,有可能使用一或多種習知母合金。可例如使用感應爐進行熔融過程,且有利的是在真空下或在惰性氣體氛圍下操作。所用材料可具有例如99.99wt.-%及更高之純度級。可冷卻如此產生之熔融物以形成基於銀之前驅體物品的均質件。通常,此前驅體物品呈棒狀物形式,其具有(例如)2至25mm之直徑及(例如)5至100m之長度。可藉由將該銀合金熔融物澆鑄於室溫之合適模具中,隨後冷卻及固化來製造此棒狀物。 The precursor article as provided in method step (1) can be obtained by blending/doping silver with the desired amount of palladium, gold, nickel and calcium. The silver alloy itself can be prepared by conventional methods known to those skilled in the art of metal alloys, for example, by melting together silver, palladium, gold, nickel and calcium in a desired ratio. In this case, it is possible to use one or more conventional master alloys. The melting process can be carried out, for example, using an induction furnace, and is advantageously operated under vacuum or under an inert gas atmosphere. The material used may have a purity level of, for example, 99.99 wt.-% and higher. The melt thus produced can be cooled to form a homogeneous piece based on the silver precursor article. Typically, the precursor article is in the form of a rod having a diameter of, for example, 2 to 25 mm and a length of, for example, 5 to 100 m. The rod can be made by casting the silver alloy melt into a suitable mold at room temperature, followed by cooling and solidification.

若如本發明之第一態樣之一些實施例所揭示,呈單層或多層形式之塗層存在於合金化銀線之芯上,則較佳將此塗層塗覆至線前驅體物品上,該物品可尚未經伸長,未經最終伸長或甚至充分伸長至所要最終直徑。技術人員知道如何計算前驅體物品上之此塗層的厚度,以獲得具有線之實施例所揭示之厚度的塗層,亦即在伸長具有塗層之前驅體物品以形成線前驅體之後。如上文已揭示,根據實施例用於在銀合金表面上形成材料之塗層的眾多技術為已知的。較佳技術為諸如電鍍及無電極電鍍之鍍覆、諸如濺鍍、離子電鍍、真空蒸發及物理氣相沈積之材料自氣相之沈積、及材料自熔融物之沈積。 If, as disclosed in some embodiments of the first aspect of the present invention, a coating in the form of a single layer or multiple layers is present on the core of the alloyed silver wire, it is preferred to apply the coating to the wire precursor article. The article may not have been stretched without final elongation or even sufficient elongation to the desired final diameter. The skilled person knows how to calculate the thickness of this coating on the precursor article to obtain a coating having the thickness disclosed in the embodiment of the wire, i.e., after elongating the body article prior to coating to form a wire precursor. As has been disclosed above, numerous techniques for forming a coating of a material on a surface of a silver alloy in accordance with an embodiment are known. Preferred techniques are plating such as electroplating and electroless plating, deposition of materials from the vapor phase such as sputtering, ion plating, vacuum evaporation, and physical vapor deposition, and deposition of materials from the melt.

為了將呈單層或多層之金屬塗層疊加至本發明之第一態樣的一些實施例揭示之線芯上,有利的是一旦達到前驅體物品之所要直徑,即中斷方法步驟(2)。此直徑可在(例如)80至200μm範圍內。隨後可(例如)藉由一或多種電鍍方法步驟來塗覆單層或多層金屬塗層。其後持續方法步驟(2)直至獲得線芯之所要最終直徑。 In order to superimpose a single or multiple layer metal coating onto the core disclosed in some embodiments of the first aspect of the invention, it is advantageous to interrupt method step (2) once the desired diameter of the precursor article is reached. This diameter can be, for example, in the range of 80 to 200 μm. The single or multiple layer metal coating can then be applied, for example, by one or more plating process steps. Thereafter, method step (2) is continued until the desired final diameter of the core is obtained.

在方法步驟(2)中,伸長前驅體物品以形成線前驅體,直至獲得線芯之所要最終直徑。在本發明之上下文中,伸長前驅體物品以形成線前驅體之技術為已知的且顯得實用。較佳技術為輥軋、型鍛、模拉伸或類似者,其中模拉伸尤佳。在後一情況中,在若干方法步驟中拉伸前驅體物品直至達到線芯之所要及最終直徑。 In method step (2), the precursor article is elongated to form a wire precursor until the desired final diameter of the core is obtained. In the context of the present invention, the technique of elongating a precursor article to form a wire precursor is known and practical. The preferred technique is roll, swage, die drawing or the like, with die stretching being preferred. In the latter case, the precursor article is stretched in several method steps until the desired and final diameter of the core is reached.

線芯之所要及最終直徑可在8至80μm範圍內,或較佳在12至55μm範圍內。熟習此項技術者熟知此線模拉伸方法。可使用習知碳化鎢及金剛石拉伸模,且可使用習知拉伸潤滑劑以支援拉伸。 The desired and final diameter of the core may range from 8 to 80 μm, or preferably from 12 to 55 μm. This wire drawing stretching method is well known to those skilled in the art. Conventional tungsten carbide and diamond tensile dies can be used, and conventional stretching lubricants can be used to support stretching.

本發明之方法的步驟(2)包括在400至800℃之烘箱設定溫度下,對伸長前驅體物品進行中度分批退火達50至150分鐘範圍內之暴露時間的一或多個子步驟,及/或在400至800℃之烘箱設定溫度下,對伸長前驅體物品進行中度帶材退火達0.4秒至1.2秒範圍內之暴露時間的一或多個子步驟。可在兩個或多於兩個多伸長或拉伸步驟之間進行一或多個伸長前驅體物品之中度退火步驟。為了藉由實例說明此步驟,在拉伸期間可在三個不同階段進行三個中度退火步驟,例如,第一中度分批退火:在400至800℃之烘箱設定溫度範圍內,將棒狀物拉伸至2mm之直徑且纏繞於捲筒上達50至150分鐘之暴露時間,第二中度帶材退火:在400至800℃之烘箱設定溫度範圍內,將前驅體物品拉伸至47μm之直徑達0.4至1.2秒之暴露時間,及第三中度帶材退火:在400至800℃之烘箱設定溫度範圍內,進一步將前驅體物品拉伸至27μm之直徑達0.4至1.2秒之暴露時間。 Step (2) of the method of the present invention comprises one or more sub-steps of moderately batch annealing the elongated precursor article to an exposure time in the range of 50 to 150 minutes at an oven set temperature of 400 to 800 ° C, and / or one or more sub-steps of moderately strip annealing the elongated precursor article to an exposure time in the range of 0.4 seconds to 1.2 seconds at an oven set temperature of 400 to 800 °C. One or more intermediate annealing steps of the elongated precursor article may be performed between two or more than two multiple elongation or stretching steps. To illustrate this step by way of example, three moderate annealing steps can be performed at three different stages during stretching, for example, a first moderate batch annealing: in a oven set temperature range of 400 to 800 ° C, the rod is The product is stretched to a diameter of 2 mm and wound on a roll for an exposure time of 50 to 150 minutes, and the second medium strip is annealed: the precursor article is stretched to 47 μm in an oven set temperature range of 400 to 800 °C. The exposure time of 0.4 to 1.2 seconds in diameter and the third moderate strip annealing: further stretching the precursor article to a diameter of 27 μm for 0.4 to 1.2 seconds in an oven set temperature range of 400 to 800 ° C time.

在方法步驟(3)中,最終對完成方法步驟(2)後所獲得之伸長線前驅體進行帶材退火。在(例如)400至600℃烘箱設定溫度範圍內進行最終帶材退火達0.4至0.8秒之暴露時間,或在一較佳實施例中,在400至500℃範圍內達0.5至0.7秒。 In method step (3), the strand precursor obtained after the completion of method step (2) is finally subjected to strip annealing. The final strip annealing is performed at an oven set temperature range of, for example, 400 to 600 ° C for an exposure time of 0.4 to 0.8 seconds, or in a preferred embodiment, between 0.5 and 0.7 seconds in the range of 400 to 500 °C.

通常藉由以指定退火速度將伸長線前驅體拉伸穿過習知退火烘箱來進行最終帶材退火,該退火箱通常呈具有指定長度及限定溫度分佈之圓柱管形式,該速度經選擇介於例如10至60公尺/分鐘範圍內。這樣做可限定及設定退火時間/烘箱溫度參數。 The final strip annealing is typically performed by stretching the elongated wire precursor through a conventional annealing oven at a specified annealing rate, typically in the form of a cylindrical tube having a specified length and a defined temperature profile selected at a rate For example, in the range of 10 to 60 meters per minute. This can define and set the annealing time/oven temperature parameters.

在一較佳實施例中,在水中淬滅最終經帶材退火之合金化銀線,在一實施例中,水可含有一或多種添加劑,例如0.01至0.07體積%之添加劑。在水中淬滅意謂(例如)藉由浸漬或滴注,立即或快速(亦即在0.2至0.6秒內)將最終經帶材退火之合金化銀線自其在方法步驟(3)中經歷之溫度冷卻至室溫。 In a preferred embodiment, the final strip annealed alloyed silver wire is quenched in water. In one embodiment, the water may contain one or more additives, such as from 0.01 to 0.07 volume percent of the additive. Quenching in water means, for example, by impregnation or dripping, the alloyed silver wire which is finally annealed by the strip, either immediately or rapidly (ie within 0.2 to 0.6 seconds), from which it undergoes in method step (3) The temperature was cooled to room temperature.

關於本發明之一實施例,發現在低於最大伸長率之溫度的溫度下進行最終帶材退火可引起有益線特性,此係因為可以積極方式影響線形態。藉由此調整,可以積極方式影響如(例如)線硬度、球接合性能等之其他特性。 With respect to an embodiment of the present invention, it has been found that performing final strip annealing at temperatures below the maximum elongation can result in beneficial line characteristics, since the line morphology can be affected in a positive manner. By this adjustment, other characteristics such as, for example, line hardness, ball joint performance, and the like can be positively affected.

在一實施例中,可在比藉由退火獲得最大伸長率值之溫度至少低150℃、例如低210至240℃之溫度下進行最終帶材退火;此可導致退火後線之伸長率值不超過最大伸長率值之70%,例如最大伸長率值之30%至60%。舉例而言,可在比最大伸長率之溫度T△L(max)至少低150℃、較佳至少低180℃、或至少低200℃之溫度下進行方法步驟(3)。方法步驟(3)之溫度常不比T△L(max)低超過250℃。藉由測試樣品(線)在不同溫度下之斷裂伸長率來測定最大伸長率之溫度T△L(max)。在曲線圖中收集資料點,其顯示作為溫度(℃)之函數的伸長率(以%計)。所得曲線圖常稱為「退火曲線」。在基於銀之線的情況下,當伸 長率(以%計)達至最大時觀測溫度。此為最大伸長率之溫度T△L(max)。一實例顯示於圖1中,其顯示樣品1之18μm合金化銀線的例示性退火曲線(表1)。退火溫度為x軸之可變參數。曲線圖顯示線之斷裂負載(BL,以公克計)及伸長率(EL,以%計)的量測值。藉由拉伸測試來測定伸長率。伸長率量測值呈現在所顯示之實例中約19%之典型局部最大值,其在約700℃之退火溫度下獲得。若不在此最大伸長率之溫度下,而是在比最大伸長率之溫度低220℃之480℃下對樣品1之線進行最終帶材退火,則結果為約8%之伸長率值,其比最大伸長率值低超過40%。 In one embodiment, the final strip annealing may be performed at a temperature at least 150 ° C lower than the temperature at which the maximum elongation value is obtained by annealing, for example, 210 to 240 ° C lower; this may result in an elongation value of the wire after annealing. Exceeding 70% of the maximum elongation value, such as 30% to 60% of the maximum elongation value. For example, method step (3) can be carried out at a temperature at least 150 ° C lower than the maximum elongation temperature T ΔL (max) , preferably at least 180 ° C lower, or at least 200 ° C lower. The temperature of method step (3) is often not lower than T ΔL(max) by more than 250 °C. The maximum elongation temperature T ΔL(max) is determined by testing the elongation at break of the sample (line) at different temperatures. Data points were collected in the graph showing elongation (in %) as a function of temperature (°C). The resulting graph is often referred to as the "annealing curve." In the case of a silver based line, the temperature is observed when the elongation (in %) is reached to the maximum. This is the temperature T ΔL(max) of the maximum elongation. An example is shown in Figure 1, which shows an exemplary annealing profile for the 18 [mu]m alloyed silver wire of Sample 1 (Table 1). The annealing temperature is a variable parameter of the x-axis. The graph shows the measured values of the breaking load (BL, in grams) and elongation (EL, in %) of the wire. The elongation was measured by a tensile test. The elongation measurements show a typical local maximum of about 19% in the example shown, which is obtained at an annealing temperature of about 700 °C. If the final strip annealing is performed on the line of sample 1 at a temperature lower than the maximum elongation of 420 ° C at a temperature lower than the maximum elongation, the result is an elongation value of about 8%, which is The maximum elongation value is less than 40%.

可在惰性或還原氛圍中進行方法步驟(2)之中度退火以及方法步驟(3)之最終帶材退火。眾多類型之惰性氛圍以及還原氛圍為此項技術中已知的且用於吹洗退火烘箱。在已知惰性氛圍中,氮或氬為較佳的。在已知還原氛圍中,氫為較佳的。另一較佳還原氛圍為氫及氮之混合物。較佳氫及氮之混合物為90至98vol.-%之氮及相應地2至10vol.-%之氫,其中總vol.-%為100vol.-%。較佳氮/氫之混合物等於93/7、95/5及97/3vol.-%/vol.-%,其各基於混合物之總體積。若合金化銀線表面之某些部分對由空氣之氧所致之氧化反應具有敏感性,則尤佳在退火中施加還原氛圍。用該等類型之惰性或還原氣體吹洗較佳在處於10至125min-1範圍內、更佳處於15至90min-1範圍內、最佳處於20至50min-1範圍內之氣體交換速率(=氣體流動速率[公升/分鐘]:烘箱內體積[公升])下進行。 The intermediate annealing of method step (2) and the final strip annealing of method step (3) can be carried out in an inert or reducing atmosphere. Numerous types of inert atmospheres and reducing atmospheres are known in the art and are used in purge annealing ovens. Nitrogen or argon is preferred in known inert atmospheres. Hydrogen is preferred in known reducing atmospheres. Another preferred reducing atmosphere is a mixture of hydrogen and nitrogen. Preferably, the mixture of hydrogen and nitrogen is from 90 to 98 vol.-% nitrogen and correspondingly from 2 to 10 vol.-% hydrogen, wherein the total vol.-% is 100 vol.-%. Preferably, the nitrogen/hydrogen mixture is equal to 93/7, 95/5 and 97/3 vol.-%/vol.-%, each based on the total volume of the mixture. If some portion of the surface of the alloyed silver wire is sensitive to oxidation by air, it is preferred to apply a reducing atmosphere during annealing. Such a type of inert or reducing gas purge is preferably in the range of 10 to 125min -1, more preferably in the range of 15 to 90min -1, optimal gas exchange rate at the range 20 to 50min -1 (= Gas flow rate [liters per minute]: volume in the oven [liters]).

咸信前驅體物品材料之組成(其與成品合金化銀線芯之彼者相同)及在方法步驟(2)及(3)期間之主要退火參數的獨特組合對獲得呈現至少一種上文揭示之固有及/或非固有的特性之本發明的線而言為重要的。中度及最終帶材退火步驟之溫度/時間條件允許獲得或調整合金化銀線芯之固有及非固有的特性。 A unique combination of the composition of the precursor material material (which is identical to the other of the finished alloyed silver wire core) and the primary annealing parameters during method steps (2) and (3) provides at least one of the above disclosed The line of the invention of inherent and/or extrinsic properties is important. The temperature/time conditions of the moderate and final strip annealing steps allow for the intrinsic and extrinsic properties of the alloyed silver core to be obtained or adjusted.

完成方法步驟(3)後,完成本發明之合金化銀線。為了充分受益於其特性,有利的是或立即(亦即毫不耽擱)將其用於線接合應用,例如在完成方法步驟(3)後不超過10天內。或者,為了保持合金化銀線之寬線接合製程窗特性且為了防止其氧化或受到其他化學侵蝕,通常在完成方法步驟(3)之後立即(亦即毫不耽擱)將成品線纏繞及真空密封,例如在完成方法步驟(3)後<1至5小時內,且隨後儲存以供進一步用作接線。儲存於真空密封條件下不應超出6個月。在打開真空密封件後,應在不超過10天內將合金化銀線用於線接合。 Upon completion of method step (3), the alloyed silver wire of the present invention is completed. In order to fully benefit from its characteristics, it is advantageous or immediately (ie, without delay) to use it for wire bonding applications, such as no more than 10 days after completing method step (3). Alternatively, in order to maintain the characteristics of the wide wire bonding process window of the alloyed silver wire and to prevent oxidation or other chemical attack, the finished wire is usually wound and vacuum sealed immediately after the completion of the method step (3) (ie without delay). , for example, within <1 to 5 hours after completion of method step (3), and then stored for further use as a wire. Store under vacuum tight conditions should not exceed 6 months. After opening the vacuum seal, the alloyed silver wire should be used for wire bonding in less than 10 days.

較佳的是,在無塵室條件(US FED STD 209E無塵室標準,1k標準)下進行所有方法步驟(1)至(3)以及纏繞及真空密封。 Preferably, all process steps (1) through (3) and winding and vacuum sealing are carried out in clean room conditions (US FED STD 209E clean room standard, 1k standard).

本發明之第三態樣為藉由前文揭示的本發明之第二態樣的方法或其一實施例,合金化銀線為可獲得的。已發現該合金化銀線較適合用作線接合應用中之接線。線接合技術為技術人員所熟知。在線接合過程中,典型的是形成球接合(第1接合)及針腳式接合(第2接合,楔形接合)。在形成接合期間施加某一力(通常以公克計),藉由施加超音波能(通常以毫安計)來支持該力。線接合方法中之施加力上限及下限之差及施加超聲波能上限及下限之差的數學乘積定義線接合製程窗:(施加力上限-施加力下限)(施加超聲波能上限-施加超聲波能下限)=線接合製程窗。 A third aspect of the invention is that the alloyed silver wire is obtainable by the method of the second aspect of the invention disclosed above or an embodiment thereof. This alloyed silver wire has been found to be more suitable for use in wire bonding applications. Wire bonding techniques are well known to the skilled person. In the wire bonding process, ball bonding (first bonding) and stitch bonding (second bonding, wedge bonding) are typically formed. A force is applied (usually in grams) during the formation of the joint, which is supported by the application of ultrasonic energy (usually in milliamps). The mathematical product of the difference between the upper and lower limits of the applied force and the difference between the upper and lower limits of the applied ultrasonic energy in the wire bonding method defines the wire bonding process window: (the upper limit of the applied force - the lower limit of the applied force) . (Upper limit of applied ultrasonic energy - lower limit of applied ultrasonic energy) = wire bonding process window.

線接合製程窗定義力/超聲波能組合之區域,該區域允許形成符合規格之線接合,亦即該線接合通過如(僅舉幾個為例)習知拉伸測試、球剪切測試及球拉伸測試之習知測試。 The wire bonding process window defines the area of the force/ultrasonic energy combination that allows for the formation of a wire bond that conforms to the specification, that is, the wire is joined by, for example, a conventional tensile test, a ball shear test, and a ball. A well-known test for tensile testing.

換句話說,第1接合(球接合)製程窗區域為用於接合中之力上限及下限之差與施加超聲波能上限及下限之差的乘積,其中所得接合必須符合某些球剪切測試規格,例如0.0085公克/平方微米之球剪切、黏附於接合襯墊上等,而第2接合(針腳式接合)製程窗區域為用於接合 中之力上限及下限之差與施加超聲波能上限及下限之差的乘積,其中所得接合必須符合某些拉伸測試規格,例如2.5公克之拉力,黏附於鉛上等。 In other words, the first bonding (ball bonding) process window region is the product of the difference between the upper and lower limits of the force used in the bonding and the difference between the upper and lower limits of the applied ultrasonic energy, wherein the resulting bonding must conform to certain ball shear test specifications. For example, a ball of 0.0085 g/m 2 is sheared, adhered to the bonding pad, etc., and a second bonding (pin bonding) process window area is used for bonding The difference between the upper and lower limits of the force and the difference between the upper and lower limits of the applied ultrasonic energy, wherein the resulting joint must meet certain tensile test specifications, such as a tensile force of 2.5 grams, adhered to lead, and the like.

對於工業應用,出於線接合方法魯棒性之原因,期望具有寬線接合製程窗(力(以g計)比超聲波能(以mA計))。本發明之線呈現極寬線接合製程窗。 For industrial applications, it is desirable to have a wide wire bonding process window (force (in g) versus ultrasonic energy (in mA) for reasons of wire bonding method robustness. The wire of the present invention exhibits an extremely wide wire bonding process window.

以下非限制性實例說明本發明。此等實例用於本發明之例示性闡明,且無論如何並不意欲限制本發明之範疇或申請專利範圍。 The following non-limiting examples illustrate the invention. The examples are intended to be illustrative of the invention and are not intended to limit the scope of the invention or the scope of the invention.

實例Instance

製備FAB: Prepare FAB:

根據描述於KNS Process User Guide for Free Air Ball(Kulicke & Soffa工業公司,Fort Washington,PA,美國,2002年,2009年5月31日)中之程序進行操作。藉由進行習知電火炬(EFO)焙燒,藉由標準焙燒(單步驟,18mA之EFO電流,455μs之EFO時間)來製備FAB。 The procedure is described in accordance with the procedure described in the KNS Process User Guide for Free Air Ball (Kulicke & Soffa Industries, Fort Washington, PA, USA, 2002, May 31, 2009). FAB was prepared by conventional roasting (EFO) roasting by standard calcination (single step, 18 mA EFO current, 455 μs EFO time).

測試方法A.至J.Test method A. to J.

在T=20℃及相對濕度RH=50%下進行所有測試及量測。 All tests and measurements were performed at T = 20 ° C and relative humidity RH = 50%.

A.線及FAB之電子反向散射繞射(EBSD)圖分析: A. Line and FAB electronic backscatter diffraction (EBSD) map analysis:

量測線及FAB結構所用之主要步驟為樣品製備,從而獲得良好菊池(Kikuchi)圖及組分計算值:首先使用環氧樹脂罐封有或無FAB之線,且按照標準金相技術進行拋光。在最終樣品製備步驟中應用離子研磨以移除線表面之任何機械變形、污染及氧化層。用金濺鍍經離子研磨之橫截面樣品表面。隨後進行兩個另外回合之離子研磨及金濺鍍。不進行化學蝕刻或離子蝕刻。 The main steps used in the measurement line and FAB structure are sample preparation to obtain a good Kikuchi diagram and component calculations: firstly, epoxy resin cans are sealed with or without FAB and polished according to standard metallographic techniques. . Ion milling is applied during the final sample preparation step to remove any mechanical deformation, contamination, and oxide layers from the wire surface. The surface of the ion-milled cross-section sample was sputtered with gold. Two additional rounds of ion milling and gold sputtering were then performed. No chemical etching or ion etching is performed.

將樣品載入至具有與正常FESEM(場發射掃描電子顯微鏡)樣品固持器表面成70°角之固持器的FESEM中。FESEM另外配備有EBSD 偵測器。獲得含有線結晶信息之電子反向散射圖案(EBSP)。 The sample was loaded into a FESEM with a holder at a 70[deg.] angle to the surface of the normal FESEM (field emission scanning electron microscope) sample holder. FESEM is additionally equipped with EBSD Detector. An electron backscatter pattern (EBSP) containing linear crystal information is obtained.

進一步分析此等圖案之晶粒定向分數、平均粒度等(使用稱作QUANTAX EBSD程式之軟體,其由Bruker研發)。類似定向之點分組在一起以形成結構組分。 The grain orientation fraction, average particle size, etc. of these patterns were further analyzed (using a software called QUANTAX EBSD program, developed by Bruker). Points similar to orientation are grouped together to form structural components.

為了區分不同結構組分,使用15°之最大公差角度。將線拉伸方向設定為參考定向。藉由量測具有平行於參考定向之[100]、[101]及[111]定向平面之晶體的百分比來計算[100]、[101]及[111]結構百分比。 In order to distinguish between different structural components, a maximum tolerance angle of 15° is used. Set the line stretch direction to the reference orientation. The [100], [101], and [111] structure percentages were calculated by measuring the percentage of crystals having planes of [100], [101], and [111] oriented parallel to the reference orientation.

分析界定大於最小值(本文為10°)之相鄰晶格點之間的結晶定向之平均粒度,以確定晶界位置。EBSD軟體計算各晶粒之面積且將其轉化為等效圓直徑,等效圓直徑定義為「平均晶粒尺寸」。計算沿長度在~100μm內之線的縱向方向之所有晶粒,以確定平均晶粒尺寸之平均值及標準差。 The average particle size of the crystal orientation between adjacent lattice points greater than the minimum (here, 10°) is defined to determine the grain boundary position. The EBSD software calculates the area of each grain and converts it into an equivalent circle diameter, which is defined as the "average grain size". All grains in the longitudinal direction of the line along the length in the range of ~100 μm were calculated to determine the average and standard deviation of the average grain size.

平均粒度計算中不包括孿晶間界(亦稱作Σ3 CSL孿晶間界)。孿晶間界係由圍繞相鄰結晶晶疇之間的<111>定向平面之60°旋轉描述。點之數量取決於步長,其小於平均晶粒尺寸之1/5。 The twin boundaries (also known as the Σ3 CSL twin boundaries) are not included in the average particle size calculation. The intertwined boundary is described by a 60° rotation around the <111> orientation plane between adjacent crystalline domains. The number of dots depends on the step size, which is less than 1/5 of the average grain size.

B.接合球之鹽溶液浸泡測試: B. Bonding ball salt solution soaking test:

將線球接合至Al-0.5wt.-%Cu接合墊。在25℃下將具有如此接合之線的測試裝置浸泡於鹽溶液中達10分鐘,用去離子(DI)水洗滌,且隨後用丙酮洗滌。鹽溶液包含20wt.-ppm NaCl於去離子水中。在低倍顯微鏡(Nikon MM-40)下以100X放大率檢測上升球之數量。較高上升球數量之觀測結果表明重度界面電流腐蝕。 The ball was bonded to an Al-0.5 wt.-% Cu bond pad. The test device with the wire thus joined was immersed in the salt solution for 10 minutes at 25 ° C, washed with deionized (DI) water, and then washed with acetone. The salt solution contained 20 wt.-ppm NaCl in deionized water. The number of ascending spheres was measured at a magnification of 100X under a low power microscope (Nikon MM-40). Observations of the number of higher rising balls indicate severe interface current corrosion.

C.接合球之抗濕性測試: C. Wet resistance test of the joint ball:

將線球接合至Al-0.5wt.-%Cu接合墊。在高加速應力測試(HAST)室中將具有如此接合線之測試裝置儲存在130℃溫度、85%相對濕度(RH)下達8小時,且隨後在低倍顯微鏡(Nikon MM-40)下以100X放大 率檢測上升球之數量。較高上升球數量之觀測結果表明重度界面電流腐蝕。 The ball was bonded to an Al-0.5 wt.-% Cu bond pad. The test device with such a bond wire was stored in a high accelerated stress test (HAST) chamber at 130 ° C temperature, 85% relative humidity (RH) for 8 hours, and then under a low power microscope (Nikon MM-40) at 100X. amplification Rate to detect the number of rising balls. Observations of the number of higher rising balls indicate severe interface current corrosion.

D.維氏微硬度(Vickers Micro-hardness): D. Vickers Micro-hardness:

使用具有維氏(Vickers)壓痕器之Mitutoyo HM-200測試設備量測硬度。將10mN壓痕負載之力施加至線之測試樣品達12秒之停留時間。在線芯之中心上及FAB上進行測試。 Hardness was measured using a Mitutoyo HM-200 test apparatus with a Vickers indenter. A force of 10 mN indentation load was applied to the test sample of the line for a residence time of 12 seconds. Test on the center of the wire core and on the FAB.

E.針腳式接合製程窗區域: E. Pin-joining process window area:

藉由標準程序進行接合製程窗區域之量測。使用KNS-iConn接合機工具(Kulicke & Soffa工業公司,Fort Washington,PA,美國)接合測試線。製程窗值係基於具有18μm之平均直徑的線,其中與線接合之引線指狀物由銀組成。 The measurement of the bonding process window area is performed by a standard procedure. Test lines were joined using a KNS-iConn bonding machine tool (Kulicke & Soffa Industries, Fort Washington, PA, USA). The process window value is based on a line having an average diameter of 18 μm, wherein the wire fingers bonded to the wire are composed of silver.

藉由克服兩個主要故障模式導出製程窗之四個角:(1)供應過低力及超聲波能導致線無法黏附於引線指狀物上(NSOL,non-stick on lead finger),及(2)供應過高力及超聲波能導致線短尾(SHTL)。 The four corners of the process window are derived by overcoming two major failure modes: (1) supply of low force and ultrasonic energy can cause the wire to adhere to the lead finger (NSOL, non-stick on lead finger), and (2) The supply of high force and ultrasonic energy can lead to short tail (SHTL).

F.電阻率: F. Resistivity:

將測試樣品(亦即長度為1.0公尺之線)的兩端連接至提供恆定電流/電壓之電源。用裝置記錄針對供應電壓之電阻。量測裝置為HIOKI模型3280-10,且用至少10個測試樣品來重複測試。量測值之算術平均值用於以下給出之計算。 Connect both ends of the test sample (that is, a line length of 1.0 meters) to a power source that supplies a constant current/voltage. The device is used to record the resistance to the supply voltage. The measurement device is the HIOKI model 3280-10 and the test is repeated with at least 10 test samples. The arithmetic mean of the measured values is used for the calculations given below.

根據R=V/I計算電阻R。 The resistance R is calculated from R=V/I.

根據ρ=(R x A)/L計算比電阻ρ,其中A為線之平均截面積,且L為用於量測電壓之裝置的兩個量測點之間的線長度。 The specific resistance ρ is calculated from ρ = (R x A) / L, where A is the average cross-sectional area of the line, and L is the line length between the two measurement points of the means for measuring the voltage.

根據σ=1/ρ計算比電導率。 The specific conductivity is calculated from σ = 1 / ρ.

G.伸長率(EL): G. Elongation (EL):

使用Instron-5564儀器測試線之拉伸特性。以2.54cm/min速度針 對254mm標距(L)測試線。按照ASTM標準F219-96獲取斷裂(fracture或break)上之負載及伸長率。伸長率為拉伸測試起始及結束之間線之標距(△L)之差,其通常報告為(100.△L/L)(以百分比計),其用所記錄之負載比延伸率拉伸圖來計算。用斷裂及屈服負載除以線區域來計算拉伸強度及屈服強度。藉由量尺寸方法、稱重標準長度之線及使用其密度來量測線之實際直徑。 The tensile properties of the test line were tested using an Instron-5564 instrument. Needle at 2.54cm/min For the 254mm gauge (L) test line. The load and elongation on the fracture or break were obtained in accordance with ASTM Standard F219-96. Elongation is the difference between the gauge length (ΔL) of the line between the start and end of the tensile test, which is usually reported as (100.ΔL/L) (in percent), using the recorded load ratio elongation Stretch the graph to calculate. The tensile strength and yield strength are calculated by dividing the fracture and yield load by the line area. The actual diameter of the wire is measured by the size method, the line of the standard length is weighed, and the density is used.

H.線之電遷移測試: H. Line electromigration test:

在50X放大率之低倍顯微鏡Nikon MM40的接物鏡下,在PTFE板上以公釐內之距離使兩條線保持平行。藉由微量吸管在待用電連接之兩條線之間形成水滴。將一條線連接至正極且將另一條連接至負極,且向線施加5V。在閉路中對兩條線施加5V偏壓,將其串聯至10kΩ電阻器。藉由使用作為電解質之數滴去離子水潤濕兩條線來使電路閉合。銀在電解質中自陰極電遷移至陽極形成銀樹突,有時兩條線橋接在一起。銀樹突生長之速率強烈依賴於合金添加。所測試之線的直徑為75μm。 The two wires were kept parallel on the PTFE plate at a distance of within a centimeter at a low magnification microscope of Nikon MM40 at 50X magnification. Water droplets are formed between the two wires to be electrically connected by a micropipette. One wire is connected to the positive electrode and the other is connected to the negative electrode, and 5V is applied to the wire. Apply a 5V bias to the two wires in a closed circuit and connect them in series to a 10kΩ resistor. The circuit is closed by wetting the two wires with a few drops of deionized water as an electrolyte. Silver electromigrates from the cathode to the anode in the electrolyte to form silver dendrites, sometimes the two wires are bridged together. The rate at which silver dendrites grow strongly depends on alloy addition. The diameter of the tested line was 75 μm.

實例1Example 1

在各情況下,在坩堝中熔融一定量的具有至少99.99%純度(「4N」)之銀(Ag)、鈀(Pd)及金(Au)。將少量銀-鎳及銀-鈣母合金添加至熔融物中,且藉由攪拌確定所添加之組分的均勻分佈。使用以下銀-鎳及銀-鉑母合金: In each case, a certain amount of silver (Ag), palladium (Pd), and gold (Au) having a purity of at least 99.99% ("4N") is melted in the crucible. A small amount of silver-nickel and silver-calcium master alloy was added to the melt, and the uniform distribution of the added components was determined by stirring. Use the following silver-nickel and silver-platinum master alloys:

針對表1之合金,添加母合金Ag-0.5wt.-%Ni及Ag-0.5wt.-%Ca之相應組合。 For the alloy of Table 1, a corresponding combination of the master alloys Ag-0.5 wt.-% Ni and Ag-0.5 wt.-% Ca was added.

隨後用熔融物連續鑄造呈8mm棒狀物形式之線芯前驅體物品。隨後在若干拉伸步驟中拉伸線芯前驅體物品以形成具有18±0.5μm之 指定直徑的線芯前驅體。線芯之橫斷面基本上為圓形形狀。 The core precursor article in the form of a 8 mm rod was then continuously cast from the melt. The core precursor article is then stretched in several stretching steps to form 18±0.5 μm A core precursor with a specified diameter. The cross section of the core is substantially circular in shape.

在500℃之烘箱設定溫度下對拉伸至2mm直徑及捲繞於捲筒上之棒狀物進行中度分批退火達60分鐘之暴露時間。在600℃之烘箱設定溫度下對拉伸至47μm之直徑的前驅體物品進行第二中度帶材退火達0.8秒之暴露時間,且在600℃之烘箱設定溫度下對拉伸至27μm之直徑的前驅體物品進行第三中度帶材退火達0.6秒之暴露時間。在480℃之烘箱設定溫度下對18μm線芯前驅體進行最終帶材退火達0.6秒之暴露時間,隨後在含有0.05vol.-%界面活性劑之水中淬滅如此獲得之線。使用氬吹洗氣體進行中度分批退火,而使用95vol.-%氮:5vol.-%氮吹洗混合氣體進行帶材退火。 The rods stretched to a diameter of 2 mm and wound onto a roll were subjected to a moderate batch annealing at an oven set temperature of 500 ° C for an exposure time of 60 minutes. The second intermediate strip annealing was performed on the precursor article having a diameter of 47 μm at an oven set temperature of 600 ° C for an exposure time of 0.8 seconds, and was stretched to a diameter of 27 μm at an oven set temperature of 600 ° C. The precursor article was subjected to a third moderate strip annealing for an exposure time of 0.6 seconds. The 18 μm core precursor was subjected to final strip annealing at an oven set temperature of 480 ° C for an exposure time of 0.6 seconds, followed by quenching the line thus obtained in water containing 0.05 vol.-% of surfactant. A moderate batch annealing was performed using an argon purge gas, and strip annealing was performed using a 95 vol.-% nitrogen: 5 vol.-% nitrogen purge mixed gas.

藉由此程序,製造本發明之合金化銀線的若干不同樣品1至5及4N純度之比較性銀線(參考)。 By this procedure, comparative silver lines of 1 to 5 and 4N purity of several different samples of the alloyed silver wire of the present invention were produced (reference).

表1顯示本發明之不同線(樣品1至5)的組成。鈀含量在1至3wt.-%範圍內。金含量在1至1.5wt.-%範圍內。鎳添加量在30至300wt.-ppm間變化。鈣含量各自地保持在30及50wt.-ppm。 Table 1 shows the composition of the different lines (samples 1 to 5) of the present invention. The palladium content is in the range of 1 to 3 wt.-%. The gold content is in the range of 1 to 1.5 wt.-%. The amount of nickel added varies from 30 to 300 wt.-ppm. The calcium content was each maintained at 30 and 50 wt.-ppm.

量測線樣品1至5之粒度且報告平均粒度。在各情況下,結果在2至5μm範圍內。針對樣品1,平均粒度為2.91μm。 The particle size of the sample 1 to 5 was measured and the average particle size was reported. In each case, the results were in the range of 2 to 5 μm. For Sample 1, the average particle size was 2.91 μm.

以下表2顯示接合線之抗腐蝕性及抗濕性、第2接合製程窗之性能及FAB形成之效能的評估結果。將上文所定義之線樣品1至5以及4N純銀比較性線接合至Al-0.5wt.-%Cu接合墊,且根據上文揭示之測試 方法進行測試。除了針對75μm線進行之電遷移測試,所有測試係針對18μm鎳進行。 Table 2 below shows the evaluation results of the corrosion resistance and moisture resistance of the bonding wires, the performance of the second bonding process window, and the performance of FAB formation. Wire samples 1 to 5 and 4N pure silver comparative wires as defined above were bonded to an Al-0.5 wt.-% Cu bond pad and tested according to the above disclosure Method to test. Except for electromigration testing for 75 μm lines, all tests were performed on 18 μm nickel.

所有線樣品產生較適用於工業應用之程序窗。觀測到接合球之抗腐蝕性及抗濕性的顯著改善。特定言之,線樣品1顯示接近零之值(亦即2球上升),相較於4N純銀線(參考)其為特別的改善。 All line samples produce a program window that is more suitable for industrial applications. A significant improvement in the corrosion resistance and moisture resistance of the joined balls was observed. In particular, line sample 1 shows a value close to zero (i.e., 2 balls rise), which is a particularly improved compared to the 4N pure silver line (reference).

此外,線樣品1至5之銀樹突狀生長大大低於4N純銀線之銀樹突狀生長。 In addition, the silver dendritic growth of line samples 1 to 5 was much lower than the silver dendritic growth of the 4N pure silver line.

表3顯示線樣品1之平均粒度及結構組分(線、FAB及熱影響區(HAZ))。 Table 3 shows the average particle size and structural components of Line Sample 1 (line, FAB, and heat affected zone (HAZ)).

圖1顯示18μm銀-鈀-金-鎳-鈣合金線(樣品1,參見表1)之例示性退火曲線。藉由調整移動線之速度將退火時間選擇為恆定值。退火溫度為x軸之可變參數。曲線圖顯示線之斷裂負載(BL,以公克計)及伸長率(EL,以%計)的量測值。藉由拉伸測試來測定伸長率。伸長率量測值呈現在所顯示之實例中約19%之典型局部最大值,其在約700℃之退火溫度下獲得。樣品線1之退火在480℃下進行,根據圖1其比最大伸長率之溫度低220℃。此產生約8%之伸長率值,其比最大伸長率值低超過40%。 Figure 1 shows an exemplary annealing curve for a 18 μm silver-palladium-gold-nickel-calcium alloy wire (Sample 1, see Table 1). The annealing time is selected to be a constant value by adjusting the speed of the moving line. The annealing temperature is a variable parameter of the x-axis. The graph shows the measured values of the breaking load (BL, in grams) and elongation (EL, in %) of the wire. The elongation was measured by a tensile test. The elongation measurements show a typical local maximum of about 19% in the example shown, which is obtained at an annealing temperature of about 700 °C. Annealing of sample line 1 was carried out at 480 ° C, which according to Figure 1 was 220 ° C lower than the temperature of the maximum elongation. This produces an elongation value of about 8% which is more than 40% lower than the maximum elongation value.

圖2顯示18μm銀-鈀-金-鎳-鈣合金線(樣品1,表1)之例示性離子研磨橫截面圖像。三個不同位置線之晶粒形態、HAZ及FAB為明顯的。在480℃、7.5% EL下對線樣品1進行退火。應用1.8之球與線尺寸比率(BSR)及18mA之EFO電流及455μs之EFO時間。 Figure 2 shows an exemplary ion mill cross-sectional image of a 18 μm silver-palladium-gold-nickel-calcium alloy wire (Sample 1, Table 1). The grain morphology, HAZ and FAB of the three different position lines are obvious. Line sample 1 was annealed at 480 ° C, 7.5% EL. The ball-to-wire size ratio (BSR) of 1.8 and the EFO current of 18 mA and the EFO time of 455 μs were applied.

Claims (16)

一種包含線芯或由線芯組成之合金化銀線,該線芯本身由以下組成:(a)鈀,其量在0.1至3wt.-%範圍內,(b)金,其量在0.1至3wt.-%範圍內,(c)鎳,其量在20至700wt.-ppm範圍內,(d)鈣,其量在20至200wt.-ppm範圍內,(e)銀,其量在93.91至99.786wt.-%範圍內,及(f)0至100wt.-ppm之其他組分,其中所有以wt.-%及wt.-ppm為單位之量係基於該芯之總重量,其中該合金化銀線具有在8至80μm範圍內之平均直徑。 An alloyed silver wire comprising a core or consisting of a core, the core itself consisting of (a) palladium in an amount ranging from 0.1 to 3 wt.-%, and (b) gold in an amount from 0.1 to In the range of 3 wt.-%, (c) nickel, in an amount ranging from 20 to 700 wt.-ppm, (d) calcium, in an amount ranging from 20 to 200 wt.-ppm, (e) silver, in an amount of 93.91 And other components in the range of 99.786 wt.-%, and (f) 0 to 100 wt.-ppm, wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core, wherein The alloyed silver wire has an average diameter in the range of 8 to 80 μm. 如請求項1之合金化銀線,其具有在12至55μm範圍內之平均直徑。 The alloyed silver wire of claim 1 having an average diameter in the range of 12 to 55 μm. 如請求項1之合金化銀線,其中該鈀量在0.5至1.5wt.-%範圍內。 The alloyed silver wire of claim 1, wherein the amount of palladium is in the range of 0.5 to 1.5 wt.-%. 如請求項1之合金化銀線,其中該金量在0.2至1.5wt.-%範圍內。 The alloyed silver wire of claim 1, wherein the amount of gold is in the range of 0.2 to 1.5 wt.-%. 如請求項1之合金化銀線,其中該鎳量在275至325wt.-ppm範圍內。 The alloyed silver wire of claim 1, wherein the amount of nickel is in the range of 275 to 325 wt.-ppm. 如請求項1之合金化銀線,其中該鈣量在20至50wt.-ppm範圍內。 The alloyed silver wire of claim 1, wherein the amount of calcium is in the range of 20 to 50 wt.-ppm. 如請求項1之合金化銀線,其中該銀量在96.9625至99.2595wt.-%範圍內。 The alloyed silver wire of claim 1, wherein the amount of silver is in the range of 96.9625 to 99.2595 wt.-%. 如請求項1之合金化銀線,其在橫截面圖中具有圓形、橢圓形或矩形形狀。 The alloyed silver wire of claim 1, which has a circular, elliptical or rectangular shape in cross-sectional view. 如請求項1之合金化銀線,其中該線芯具有表面,其中該表面為外表面或介於該線芯及疊加於該線芯上之塗層之間的界面區 域。 The alloyed silver wire of claim 1, wherein the core has a surface, wherein the surface is an outer surface or an interface region between the core and a coating superposed on the core area. 如請求項9之合金化銀線,其具有疊加於該線芯上之塗層,其中該塗層為由貴金屬元素製成之單層或包括多個疊加相鄰子層之多層,其中各子層由不同貴金屬元素製成。 An alloyed silver wire according to claim 9, which has a coating layer superimposed on the core, wherein the coating is a single layer made of a precious metal element or a plurality of layers including a plurality of adjacent sub-layers, wherein each of the sub-layers The layers are made of different precious metal elements. 如請求項1之合金化銀線,其中該線芯至少特徵在於以下固有特性中之一者:(1)平均線粒度小於10μm,(2)線晶粒[100]或[101]或[111]定向平面小於7%,(3)線孿晶間界分數小於60%,(4)FAB呈現柱狀晶粒,(5)FAB平均粒度18μm,(6)FAB晶粒[101]定向平面小於45%,(7)FAB孿晶間界分數小於70%,及/或至少特徵在於以下非固有特性中之一者:(α)抗腐蝕性具有不超過5%接合球上升之值,(β)抗濕性具有不超過5%接合球上升之值,(γ)該線芯之硬度不超過85HV,(δ)用於針腳式接合之製程窗區域具有至少12000mA.g之值,(ε)該線之電阻率小於2.5μΩ.cm,(ζ)該線之屈服強度不超過170MPa,(η)該線之銀樹突狀生長不超過4μm/s。 The alloyed silver wire of claim 1, wherein the core is characterized by at least one of the following intrinsic characteristics: (1) an average line size of less than 10 μm, (2) a line grain [100] or [101] or [111 ] The orientation plane is less than 7%, the (3) line twin boundary fraction is less than 60%, (4) FAB exhibits columnar grains, and (5) FAB average grain size 18μm, (6) FAB grain [101] orientation plane is less than 45%, (7) FAB twin boundary fraction is less than 70%, and / or at least one of the following non-inherent characteristics: (α) corrosion resistance The property has a value of not more than 5% of the rising of the bonding ball, (β) the moisture resistance has a value of not more than 5% of the rising of the bonding ball, (γ) the hardness of the core does not exceed 85 HV, and (δ) is used for the stitching. The process window area has at least 12000 mA. The value of g, (ε) the resistivity of the line is less than 2.5μΩ. Cm, (ζ) The yield strength of the line does not exceed 170 MPa, and (η) the silver dendritic growth of the line does not exceed 4 μm/s. 一種用於製造如前述請求項中任一項之合金化銀線的方法,其中該方法至少包含以下步驟:(1)提供具有如請求項1之線芯組成的前驅體物品,(2)伸長該前驅體物品以形成線前驅體,直至獲得該線芯之所要最終直徑;及 (3)在完成方法步驟(2)後,在400至600℃範圍內之烘箱設定溫度下,對所獲得之線前驅體進行最終帶材退火達0.4至0.8秒範圍內之暴露時間以形成該合金化銀線,其中步驟(2)包括在400至800℃之烘箱設定溫度下,對該伸長前驅體物品進行中度分批退火達50至150分鐘範圍內之暴露時間的一或多個子步驟,及/或在400至800℃之烘箱設定溫度下,對該伸長前驅體物品進行中度帶材退火達0.4秒至1.2秒範圍內之暴露時間的一或多個子步驟。 A method for producing an alloyed silver wire according to any of the preceding claims, wherein the method comprises at least the steps of: (1) providing a precursor article having a core composition as claimed in claim 1, (2) elongating The precursor article to form a wire precursor until the desired final diameter of the core is obtained; (3) after the method step (2) is completed, the obtained wire precursor is subjected to final strip annealing at an oven set temperature in the range of 400 to 600 ° C for an exposure time in the range of 0.4 to 0.8 seconds to form the An alloyed silver wire, wherein step (2) comprises one or more sub-steps of moderately batch annealing the elongated precursor article to an exposure time in the range of 50 to 150 minutes at an oven set temperature of 400 to 800 °C. And/or one or more sub-steps of moderately strip annealing the elongated precursor article to an exposure time in the range of 0.4 seconds to 1.2 seconds at an oven set temperature of 400 to 800 °C. 如請求項12之方法,其中在400至500℃範圍內之烘箱設定溫度下進行該最終帶材退火達0.5至0.7秒範圍內之暴露時間。 The method of claim 12, wherein the final strip annealing is performed at an oven set temperature in the range of 400 to 500 ° C for an exposure time in the range of 0.5 to 0.7 seconds. 如請求項12之方法,其中在可含有一或多種添加劑之水中淬滅該經最終帶材退火之合金化銀線。 The method of claim 12, wherein the final strip annealed alloyed silver wire is quenched in water that may contain one or more additives. 如請求項12之方法,其中在惰性或還原氛圍中進行方法步驟(2)之該中度退火以及方法步驟(3)之該最終帶材退火。 The method of claim 12, wherein the moderate annealing of method step (2) and the final strip annealing of method step (3) are carried out in an inert or reducing atmosphere. 一種合金化銀線,其可獲得自如請求項12之方法。 An alloyed silver wire which is obtainable by the method of claim 12.
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