CN107849643A - Alloying silver wire - Google Patents
Alloying silver wire Download PDFInfo
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- CN107849643A CN107849643A CN201680032772.0A CN201680032772A CN107849643A CN 107849643 A CN107849643 A CN 107849643A CN 201680032772 A CN201680032772 A CN 201680032772A CN 107849643 A CN107849643 A CN 107849643A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
- B23K35/0272—Rods, electrodes, wires with more than one layer of coating or sheathing material
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/05624—Aluminium [Al] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/438—Post-treatment of the connector
- H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45565—Single coating layer
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Abstract
A kind of alloying silver wire formed including core or by core, the core consist of in itself：(a) palladium, its amount is in the range of 0.1 to 3wt. %, (b) it is golden, its amount is in the range of 0.1 to 3wt. %, (c) nickel, its amount is in the range of 20 to 700wt. ppm, (d) calcium, its amount is in the range of 20 to 200wt. ppm, (e) silver-colored, its amount is in the range of 93.91 to 99.786wt. %, and (f) 0 arrives 100wt. ppm other components, amount in units of wherein all ppm by wt. % and wt. is the gross weight based on the core, wherein the alloying silver wire has the average diameter in 8 to 80 μ ms.
Description
The present invention relates to a kind of alloying silver wire of 8 to 80 μ m-thick, and it includes including silver, palladium, gold, nickel with specified weight ratio
With the core of calcium.The invention further relates to manufacture the method for this kind of line.
Purposes of the wiring in electronics and microelectronic applications is well-known state of the art.Although wiring at the beginning
It is to be made by gold, but nowadays uses relatively inexpensive material, such as copper, copper alloy, silver and silver alloy.
On line geometry structure, the most common are the wiring of circular cross section and the engagement with almost rectangular cross section
Band.Two kinds of line geometry structure, which all has, makes it be applied to its advantage of application-specific.
The target of the present invention is suitable for the alloying silver wire of wire bonding application to provide, and alloying silver wire is especially anti-
Improved in terms of corrosivity and moisture resistance, and also present and apply the related characteristic model being generally in admirable proportion to wire bonding
Enclose, it is including (for example) the axial symmetry of wide stitch bond window, formation with well reproduced without air soldered ball (FAB), low FAB
Hardness, high stitch bond tensile strength, flexible cord, low-resistivity, low electromigration etc..
The contribution of the article solution is provided by forming the theme of the technical scheme of classification.Form the technology of classification
The dependence dependent claims of scheme represent the preferred embodiments of the present invention, and its theme also makes tribute to the target for solving to put forward sum above
Offer.
In the first aspect, the present invention relates to a kind of alloying silver wire, it includes wire core or is made up of (hereafter wire core
In also referred to as referred to as " core "), wire core consists of in itself：
(a) palladium, its amount is in the range of 0.1 to 3wt.-% (weight %), preferably in the range of 0.5 to 1.5wt.-%,
(b) golden, its amount is in the range of 0.1 to 3wt.-%, preferably in the range of 0.2 to 1.5wt.-%,
(c) nickel, its amount are excellent in the range of 20 to 700wt.-ppm (million points of weight, the one of million points by weight)
It is selected in the range of 275 to 325wt.-ppm,
(d) calcium, its amount is in the range of 20 to 200wt.-ppm, preferably in the range of 20 to 50wt.-ppm,
(e) silver-colored, its amount preferably arrives 99.2595wt.-% models in the range of 93.91 to 99.786wt.-% 96.9625
In enclosing, and
(f) 0 to 100wt.-ppm other components (component beyond palladium, gold, nickel, calcium and silver),
Wherein all amounts in units of wt.-% and wt.-ppm are the gross weights based on core,
Wherein alloying silver wire has the average diameter in 8 to 80 μ ms or even in 12 to 55 μ ms.
Alloying silver wire is preferably used for the wiring of the engagement in microelectronics.Alloying silver wire is preferably single-piece article.
It is numerous to be shaped as known and seem suitable for alloying silver wire of the invention.Preferable shape for (in cross) it is circular,
Ellipse and rectangular shape.
The average diameter or (briefly) diameter of line or core can be obtained by " method of taking measurements ".According to this method
Determine the physical weight of the alloying silver wire of limit length.Based on this weight, calculate line using wire material density or core is straight
Footpath.Diameter is calculated as the arithmetic mean of instantaneous value of five measured values on five otch of certain line.
For the present invention, term " wiring " includes all shape of cross sections and all common linear diameters, but with circular horizontal
The wiring of section and thin diameter is preferable.
It is consistent with the above, core with the proportional ratio that is disclosed above include (a) palladium, (b) gold, (c) nickel, (d) calcium with
(e) it is silver-colored.However, the core of the alloying silver wire of the present invention can include (f) other components with 0 to 100wt.-ppm total amount.At this
In context, often also referred to as other components of " inevitable impurity " be from the impurity being present in raw materials or
From a small amount of chemical element and/or compound of line manufacture method, i.e., the presence of the other components of (f) type can (such as) derive from
The impurity being present in one or more in silver, palladium, gold, nickel and calcium.The example of this kind of other components is：Cu、Fe、Si、Mn、
Cr, Ce, Mg, La, Al, B, Zr, Ti, S etc..The 0 of other components (f) ensures the good of line characteristic to 100wt.-ppm low total amount
Repeatability.It is generally not separated to add the other components (f) being present in core.
In one embodiment, the core of alloying silver wire of the invention includes other components (f) less than following amount：
(i) Cu, its amount<30wt.-ppm；
(ii) any one in Cr, Ce, Mg, La, Al, Be, In, Mn, Ti, its amount are each<2wt.-ppm；
(iii) any one in Si, Fe, S, its amount are each<15wt.-ppm.
The core of alloying silver wire in this context is defined as the homogenous area of bulk material.Because any bulk material begins
There is the surface region that different qualities can be presented to a certain extent eventually, so the characteristic of core is interpreted as bulk material homogeneous area
The characteristic in domain.The surface in bulk material region is for form, composition (such as sulphur, chlorine and/or oxygen content) and further feature
Can be different.Surface can be the outer surface of core；In this embodiment, alloying silver wire of the invention is made up of core.
In an alternative solution, surface can be core and the interface zone being superimposed between the coating on core.
In the context of the present invention, the first article that term " superposition " is used to describe such as core is relative to such as coating
The second article relative position." superposition " be characterised by as intermediate layer other articles can (but need not) be configured at the first He
Between second article.Preferably, the first article is respectively superimposed at least in part relative to the total surface of the first article, the second article
On, such as up at least 30%, 50%, 70% or up at least 90%.Most preferably, the second article is superimposed on the first article completely
On.
In the context of the present invention, term " intermediate layer " refers to the core in alloying silver wire and the coating that is superimposed on it
Between alloying silver wire region.In this region, the combination of the material of core and coating two be present.
In the context of the present invention, term " thickness " is used for definition layer on the direction of the longitudinal axis of core
Size, the layer are superimposed on the surface of core at least in part.
In one embodiment, core has surface, wherein coating is superimposed on the surface of core.
In one embodiment, respectively it is no more than 5wt.-% relative to the gross mass of core, the quality of coating, preferably more than
2wt.-% or lower.When coating be present, respectively relative to the gross mass of core, its often with have 0.1wt.-% or higher or
0.5wt.-% or higher minimum mass.The feature that a small amount of material is kept being defined by core material applied to coating.The opposing party
Face, coating assigns line surface with special characteristic, such as relative to the inertia of environment, corrosion resistance, improved caking property.Citing comes
Say, for a diameter of 18 μm of line, the thickness of coating is in the range of 20 to 120nm.For the line of the diameter with 25 μm, coating
Can have (such as) thickness in the range of 30 to 150nm.
In one embodiment, coating can be made up of precious metal element.Coating can be one individual layer of the element.Another
In embodiment, coating can be multilayer, and it is made up of multiple superposition adjacent sublayers, wherein each sublayer is by different precious metal element systems
Into.For deposit this kind of precious metal element in the common technology on core be as plating and the plating of electrodeless plating, such as sputter, from
Son plating, it is evaporated in vacuo and the material of physical vapour deposition (PVD) is from the deposition of gas phase and material from the deposition of fused mass.
In one embodiment, alloying silver wire of the invention or its core are at least characterised by one in following inherent characteristic
(referring to it is as described below " method of testing A ")：
(1) average line granularity (particle mean size) is less than 10 μm, such as in 2 to 6 μ ms, preferably in 2 to 4 μ ms
It is interior,
(2) line crystal grain [100] or [101] or [111] directional plane are less than 7%, such as in the range of 1% to 5%, preferably
In the range of 2% to 3.5%,
(3) line twin boundary fraction is less than 60%, such as in the range of 30% to 50%, preferably in 40% to 45% scope
It is interior,
(4) columnar grain (crystal grain elongation) is presented in FAB,
(5) FAB particle mean size≤18 μm, such as in 6 to 14 μ ms, preferably in 8 to 12 μ ms,
(6) FAB crystal grain [101] directional plane is less than 45%, such as in the range of 30% to 40%, is preferably arrived 32%
In the range of 36%,
(7) FAB twin boundaries fraction is less than 70%, such as in the range of 30% to 65%, preferably in 60% to 65% model
In enclosing,
And/or at least it is characterised by one in following extrinsic characteristic：
(α) corrosion resistance, which has, is no more than the value that 5% engagement ball rises, such as (referring to following institute in the range of 0 to 5%
State " method of testing B "),
(β) moisture resistance, which has, is no more than the value that 5% engagement ball rises, such as (referring to as described below in the range of 0 to 5%
" method of testing C "),
The hardness of (γ) core is no more than 85HV, such as in the range of 50 to 85HV, (the ginseng preferably in the range of 65 to 75HV
See it is as described below " method of testing D "),
The process window region that (δ) is used for stitch bond has at least 12000mAg value, such as a diameter of 18 μ
M line, be worth for 13000 to 14400mAg (referring to specific disclosure as described below and " method of testing E "),
The resistivity of (ε) line is less than 2.5 μ Ω cm, such as in the range of 1.7 to 2.4 μ Ω cm, is preferably arrived 2.2
In the range of 2.4 μ Ω cm (referring to it is as described below " method of testing F "),
The yield strength of (ζ) line is no more than 170MPa, such as (" is surveyed referring to as described below in the range of 140 to 170MPa
Method for testing G "),
The prominent shape growth of the silver tree of (η) line is no more than 4 μm/s, such as in the range of 2 to 4 μm/s, preferably in 2 to 3 μm/s models
In enclosing (referring to it is as described below " method of testing H ").
Term " inherent characteristic " used herein and " extrinsic characteristic " are related to core or FAB.Inherent characteristic means core
Or the characteristic (independently of other factorses) that FAB has in itself, rather than inherent characteristic be sight core or FAB with other factorses (such as institute
Measuring method and/or measuring condition) relation depending on.
In the case of a preferred embodiment of the present invention, the hardness (hardness before engaging) of core is less than 85HV,
It is preferred that in the range of 65 to 75HV.In addition, it is less than 80HV using the hardness of the FAB handled by the line of the present invention before splicing,
It is preferred that in the range of 60 to 70HV.This of core and FAB hardness or (more precisely) pliability contribute in engaging process
In prevent damage sensitiveness matrix.Experiment has also shown that dead-soft FAB characteristics are presented in this kind of flexible cord of the present invention.If mechanical sensitivity
Property structural arrangement in combine pad under, then this of FAB hardness is limited to what is be particularly useful.If with reference to pad by such as aluminium
Or the soft material composition of gold, then this is especially true.For example, sensitive structures may include one or several porous dioxies
SiClx layer, it especially has the dielectric constant less than 2.5.Because material can help to lifting device efficiency, this it is porous and
Therefore weakened material becomes to commonly use further.Therefore, the mechanical property of the wiring of the present invention can be optimized to avoid this kind of weak floor
Cracking or other infringements.
In a specific embodiment, the prominent shape growth of silver tree is presented in alloying silver wire of the invention, and its speed is less than 4 μm/s,
Such as arrive and be less than in the range of 4 μm/s 2, preferably in the range of 2 to 3 μm/s, it is about 25 μm/s growth rates of 4N fine silver lines
About 1/10 to 1/7.
In a further beneficial embodiment, the resistivity of line is less than 3.2 μ Ω cm, such as in 2.0 to 2.4 μ Ω cm scopes
It is interior, preferably in the range of 2.2 to 2.4 μ Ω cm, that is, mean to be applied to many applications.
In another aspect, the invention further relates to the alloying silver for manufacturing any of the embodiment being disclosed above
The method of line.Method comprises at least following steps：
(1) presoma article is provided, it is consisted of：
(a) palladium, its amount is in the range of 0.1 to 3wt.-%, preferably in the range of 0.5 to 1.5wt.-%,
(b) golden, its amount is in the range of 0.1 to 3wt.-%, preferably in the range of 0.2 to 1.5wt.-%,
(c) nickel, its amount is in the range of 20 to 700wt.-ppm, preferably in the range of 275 to 325wt.-ppm,
(d) calcium, its amount is in the range of 20 to 200wt.-ppm, preferably in the range of 20 to 50wt.-ppm,
(e) silver-colored, its amount preferably arrives 99.2595wt.-% models in the range of 93.91 to 99.786wt.-% 96.9625
In enclosing, and
(f) 0 to 100wt.-ppm other components,
Wherein all amounts in units of wt.-% and wt.-ppm are the gross weights based on presoma article,
(2) presoma article is extended to form line presoma, and final diameter is wanted until acquisition core；With
(3) finally, after Method Of Accomplishment step (2), under the baking oven design temperature in the range of 400 to 600 DEG C, to being obtained
The line presoma obtained carries out strand-anneal(ing) up to the open-assembly time in the range of 0.4 to 0.8 second to form alloying silver wire,
Wherein step (2) carries out moderate under 400 to 800 DEG C of baking oven design temperature, to elongation presoma article
Batch annealing up to the open-assembly time in the range of 50 to 150 minutes one or more sub-steps, and/or in 400 to 800 DEG C of baking oven
Under design temperature, to elongation presoma article carry out moderate strand-anneal(ing) up to 0.4 second by 1.2 seconds in the range of open-assembly time one
Or more sub-steps.
Term " strand-anneal(ing) " used herein.It has the continuous work of the line of high reproducibility for the quick production of permission
Skill.Strand-anneal(ing) means dynamically to be annealed, and at this moment extends line presoma article or line presoma to be annealed moves through
Annealing oven and it is wound in after annealing oven has been left on spool.
Term " baking oven design temperature " used herein.It means the temperature fixed in the temperature controller of annealing oven
Degree.Annealing oven can be room type of furnace baking oven (in the case of batch annealing) or tubulose annealing oven (in the situation of strand-anneal(ing)
Under).
The present invention distinguishes presoma article, line presoma and alloying silver wire.Term " presoma article " is used for those lines
Last stage, it not yet reaches the final diameter of wanting of core, and term " line presoma " is used for the line for wanting final diameter
Last stage.After Method Of Accomplishment step (3), i.e., final strand-anneal(ing) is being carried out to the line presoma with wanted final diameter
Afterwards, alloying silver wire in the sense of the present invention is obtained.
Can be by being obtained with the palladium of the desired amount, gold, nickel and calcium blending/silver-doped as provided in method and step (1)
Presoma article.Silver alloy can be prepared by conventional method known to the technical staff in metal alloy field in itself, such as logical
Cross and be fused together silver, palladium, gold, nickel and calcium with wanted ratio.It is in that case it is possible to conventional female using one or more
Alloy.Melting process for example can be carried out using induction furnace, and advantageously operated under vacuo or under atmosphere of inert gases.Institute
Can have such as 99.99wt.-% and Geng Gao purity level with material.So caused fused mass can be cooled down and be based on silver to be formed
Presoma article homogeneous part.Generally, this presoma article is in club form, its have (such as) it is 2 straight to 25mm
Footpath and (such as) 5 arrive 100m length.It can be cast from by the way that the silver alloy fused mass is poured in the proper mold of room temperature, it is then cold
But this club is manufactured with solidification.
If as disclosed in some embodiments of the first aspect of the present invention, the coating in single or multiple lift form is present in
On the core of alloying silver wire, then preferably this coating is coated on line presoma article, the article can not yet extend, not
Final elongation is even fully elongated to wanted final diameter.Technical staff knows how to calculate this painting on presoma article
The thickness of layer, to obtain the coating of the thickness disclosed in the embodiment with line, i.e., has cated presoma article in elongation
To be formed after line presoma.As having revealed that above, the coating of formation material on silver alloy surface is used for according to embodiment
Numerous technologies are known.Optimization technique is such as the plating of plating and electrodeless plating, such as sputter, ion plating, vacuum evaporation
With the material of physical vapour deposition (PVD) from the deposition of gas phase and material from the deposition of fused mass.
In order to by the metal coating in single or multiple lift be added to the first aspect of the present invention some embodiments disclose
On core, it is advantageous that once reach the diameter of wanting of presoma article, i.e. interrupt method step (2).This diameter can be in (example
Such as) in 80 to 200 μ ms.Then can (such as) by one or more electro-plating method steps come coat single or multiple lift metal apply
Layer.Thereafter persistence method step (2) wants final diameter until acquisition core.
In method and step (2), elongation presoma article is to form line presoma, until obtaining the finally straight of core
Footpath.In the context of the present invention, presoma article is extended to form the technology of line presoma as the known and practicality that seems.It is excellent
Selecting technology be rolling, swaged forging, closing mould stretching or similar techniques, wherein closing mould stretching it is further preferred that.In latter case, in some method and steps
It is middle stretching presoma article until reach core want and final diameter.
Core will can be in 8 to 80 μ ms, or preferably in 12 to 55 μ ms with final diameter.Art
The known this line die drawing stretching method of technical staff.Conventional tungsten carbide and diamond stretching die can be used, and conventional draw can be used
Lubricant is stretched to support to stretch.
The step of method of the present invention (2), is included under 400 to 800 DEG C of baking oven design temperature, to extending presoma thing
Product carry out moderate batch annealing and arrived up to one or more sub-steps of the open-assembly time in the range of 50 to 150 minutes, and/or 400
Under 800 DEG C of baking oven design temperature, moderate strand-anneal(ing) is carried out up in the range of 0.4 second to 1.2 seconds to elongation presoma article
One or more sub-steps of open-assembly time.One or more can be carried out between two or more more elongations or stretching step to stretch
The moderate annealing steps of long presoma article., can be in three not same orders during stretching in order to illustrate the step by example
Tri- moderate annealing steps of Duan Jinhang, for example, the first moderate batch annealing：In 400 to 800 DEG C of baking oven design temperature scope
It is interior, club is stretched to 2mm diameter and is wound in the open-assembly time on reel up to 50 to 150 minutes, the second moderate band
Annealing：In the range of 400 to 800 DEG C of baking oven design temperature, by presoma article drawing to 47 μm of diameter up to 0.4 to 1.2
The open-assembly time of second, and the 3rd moderate strand-anneal(ing)：In the range of 400 to 800 DEG C of baking oven design temperature, further by forerunner
Body article drawing is to 27 μm of diameter up to open-assembly time of 0.4 to 1.2 seconds.
In method and step (3), the elongation line presoma progress band finally obtained afterwards to Method Of Accomplishment step (2) moves back
Fire.(such as) final strand-anneal(ing) is carried out in the range of 400 to 600 DEG C of baking oven design temperatures up to during the exposure of 0.4 to 0.8 second
Between, or in a preferred embodiment, up to 0.5 to 0.7 second in the range of 400 to 500 DEG C.
Generally by with specify annealing speed by extend line presoma be stretched across conventional annealing baking oven to carry out final band
Material is annealed, and the annealing oven is generally in the cylindrical tube form being distributed with designated length and limiting temperature, and the speed can be
Such as selected in the range of 10 to 60 ms/min.Annealing time/oven temperature parameter can be limited and set by so doing.
In a preferred embodiment, the alloying silver wire of final strand-anneal(ing) is quenched in water, in one embodiment, water can
Contain one or more additives, such as 0.01 to 0.07 volume % additive.Be quenched and mean in water (such as) pass through dipping
Or instil, immediately or quickly (i.e. in 0.2 to 0.6 second) by the alloying silver wire of final strand-anneal(ing) from it in method and step
(3) temperature of experience is cooled to room temperature in.
On one embodiment of the invention, carry out final band at a temperature of sending out the temperature for being now below maximum elongation rate and move back
Fire can cause beneficial to line characteristic, because line morphology can be influenceed in a positive manner., can shadow in a positive manner by this adjustment
Ring other characteristics such as (e.g.) line hardness, ball bond performance etc..
In one embodiment, can be at least low 150 DEG C, for example low in the temperature than obtaining maximum elongation rate value by annealing
Final strand-anneal(ing) is carried out at a temperature of 210 to 240 DEG C；This can cause the elongation values of line after annealing to be no more than maximum elongation rate
The 70% of value, such as 30% to the 60% of maximum elongation rate value.For example, can be in the temperature T than maximum elongation rateΔL(max)Extremely
Method and step (3) is carried out at a temperature of few low 150 DEG C, preferably at least low 180 DEG C or at least low 200 DEG C.Method and step (3)
Temperature is often unlike TΔL(max)It is low more than 250 DEG C.Determined most by the elongation at break of test sample (line) at different temperatures
The temperature T of big elongationΔL(max).Data point is collected in the graph, and it shows the elongation of the function as temperature (DEG C)
(in terms of %).Curve obtained figure is frequently referred to " annealing curve ".In the case of the line based on silver, when elongation reaches (in terms of %)
Observed temperature when maximum.This is the temperature T of maximum elongation rateΔL(max).One example is shown in Fig. 1, and it shows 18 μm of sample 1
The exemplary annealing curve (table 1) of alloying silver wire.Annealing temperature is the variable element of x-axis.Curve map shows that the fracture of line is born
Carry the measured value of (BL, in gram) and elongation (EL, in terms of %).Elongation is determined by extension test.Elongation measurement
In the shown example about 19% typical local maximum is presented in value, and it is obtained under about 700 DEG C of annealing temperature.If
Not at a temperature of this maximum elongation rate, but to sample 1 at 480 DEG C of 220 DEG C lower than the temperature of maximum elongation rate
Line carries out final strand-anneal(ing), then result is about 8% elongation values, and it is worth low more than 40% than maximum elongation rate.
Moderate annealing and the final band of method and step (3) of method and step (2) can be carried out in inertia or reduction atmosphere
Material is annealed.The inert atmosphere and reduction atmosphere of numerous types are known in the art and for purging annealing oven.
In known inert atmosphere, nitrogen or argon are preferable.In known reduction atmosphere, hydrogen is preferable.Another preferred reduction atmosphere is
The mixture of hydrogen and nitrogen.It is preferred that the mixture of hydrogen and nitrogen arrives 10vol.-% hydrogen for 90 nitrogen for arriving 98vol.-% and correspondingly 2,
Wherein total vol.-% is 100vol.-%.It is preferred that the mixture of nitrogen/hydrogen be equal to 93/7,95/5 and 97/3vol.-%/
Vol.-%, its each cumulative volume based on mixture.If some parts on alloying silver wire surface are to caused by the oxygen of air
Oxidation reaction has sensitiveness, then it is further preferred that applying reduction atmosphere in annealing.Blown with the inertia or reducing gas of the type
Wash and preferably arrive 125min in 10-1In the range of, more preferably arrive 90min in 15-1In the range of, optimal arrive 50min in 20-1Model
Enclose interior gas exchange rate (=flow rate of gas [liter/min]:Baking oven inner volume [liter]) under carry out.
It is believed that the composition (it is identical with that of final alloy silver wire core) of presoma article material and in method and step
(2) unique combination of the main annealing parameter and during (3) to obtain present it is at least one be disclosed above it is intrinsic and/or non-solid
It is important for the line of the invention of some characteristics.Temperature/time conditions of moderate and final strand-anneal(ing) step allow to obtain
Obtain or adjust the intrinsic and extrinsic characteristic of alloying silver wire core.
After Method Of Accomplishment step (3), the alloying silver wire of the present invention is completed.In order to be fully benefit from its characteristic, favourable
It is or (i.e. delay not) uses it for wire bonding application immediately, such as is no more than afterwards in 10 days in Method Of Accomplishment step (3).Or
Person, in order to keep the wide line joint technology window property of alloying silver wire and in order to prevent it from aoxidizing or by other chemical erosions,
(do not stopped over) immediately by product line winding and vacuum sealing, such as in completion side generally after Method Of Accomplishment step (3)
After method step (3)<In 1 to 5 hours, and then it is stored for being further used as wiring.Should it not be stored under the conditions of vacuum sealing
Beyond 6 months.After vacuum seal is opened, alloying silver wire should be used for wire bonding in no more than 10 days.
Preferably, all methods are carried out under dust free room condition (US FED STD 209E clean room requirements, 1k standards)
Step (1) arrives (3) and winding and vacuum sealing.
The third aspect of the present invention is by the method or one embodiment of the second aspect of the present invention being disclosed above, and is closed
Aurification silver wire is obtainable.Have found the alloying silver wire compared with the wiring being suitable as in wire bonding application.Wire bonding skill
Art is known to technical staff.In online engaging process, ball bond (the 1st engagement) and stitch bond the (the 2nd are typically formed
Engagement, wedge bond).Apply a certain power (generally in gram) during engagement is formed, by applying ultrasonic wave energy (generally with milli
Peace meter) support the power.The difference and the ultrasonic wave energy upper and lower bound of application of applying power upper and lower bound in wire connecting method
Poor mathematical product definition wires joint technology window：
(the applying power upper limit-applying power lower limit) (applying the ultrasonic wave energy upper limit-application ultrasound wave energy lower limit)=wire bonding
Process window.
Wire bonding process window defines the region of power/ultrasonic wave energy combination, and the region, which allows to form line up to specification, to be connect
Close, i.e., described wire bonding is by such as (being only several cited as an example) routine of conventional extension test, ball shearing test and ball extension test
Test.
In other words, the 1st engagement (ball bond) process window region is the difference for the power upper and lower bound in engagement with applying
Add the poor product of ultrasonic wave energy upper and lower bound, wherein gained engagement has to comply with some ball shearing test specifications, such as
The ball shearing of 0.0085 gram/square micron, to be adhered to joint liner first-class, and the 2nd engagement (stitch bond) process window region
For poor product of the difference for the power upper and lower bound in engagement with applying ultrasonic wave energy upper and lower bound, wherein gained engages
Some extension test specifications, such as 2.5 grams of pulling force are had to comply with, it is first-class to be adhered to lead.
For commercial Application, for the reason for the wire connecting method robustness, being desired to have the wide line joint technology window, (power is (with g
Meter) than ultrasonic wave energy (in terms of mA)).Pole the wide line joint technology window is presented in the line of the present invention.
The following non-limiting examples explanation present invention.These examples are used for the exemplary of the present invention and illustrated, and anyway
It is not intended to limit the scope of the present invention or claim.
Example
Prepare FAB：
According to being described in《KNS techniques users' guidebook (the KNS Process User Guide for Free of free air balls
AirBall)》(Ku Lisuofa Industrial Co., Ltd (Kulicke＆Soffa Industries Inc), Washington fort, guest's sunset method
Buddhist nun Asia, the U.S., on May 31st, 2009 in 2002) in program operated.Roasted by carrying out conventional electric flame off (EFO)
Burn, (single stage, 18mA EFO electric currents, 455 μ s EFO times) is calcined by standard to prepare FAB.
Method of testing A. to J.
All tests and measurement are carried out under T=20 DEG C and relative humidity RH=50%.
A. line and FAB EBSD (EBSD) map analysis：
Measurement line and FAB structures used in mainly comprise the following steps sample preparation, so as to obtain good Kikuchi (Kikuchi) figure and
Calculation value：
Line first by epoxy resin potting with or without FAB, and be polished according to standard Metallographic Techniques.In final samples
Ground in product preparation process using ion to remove any mechanically deform, pollution and the oxide layer on line surface.With golden sputtered ions
The cross-sectional sample surface of grinding.The ion for then carrying out two other bouts is ground and golden sputter.Without chemical etching or
Ion(ic) etching.
Sample, which is loaded into, to be had with normal FESEM (field emission scanning electron microscope) sample holder surfaces into 70 °
In the FESEM of the holder at angle.FESEM is additionally provided with EBSD detectors.Acquisition contains the electron backscattered of line crystalline information
Pattern (EBSP).
Crystal grain orienting fraction, particle mean size of these patterns etc. are further analyzed (using referred to as QUANTAX EBSD programs
Software, its by Brooker (Bruker) research and develop).The point being similarly oriented is grouped together to form structural constituent.
In order to distinguish different structure component, 15 ° of maximum allowance angle is used.It is with reference to fixed by line drawing direction setting
To.Calculated by measuring the percentage with the crystal parallel to [100] of reference orientation, [101] and [111] directional plane
[100], [101] and [111] percentage composition.
The particle mean size of the crystal orientation between the adjacent cells point more than minimum value (being herein 10 °) is defined in analysis, with
Determine grain boundary sites.EBSD softwares calculate the area of each crystal grain and are translated into equivalent diameter, and equivalent diameter is defined as
" average grain size ".The all crystal grains of the longitudinal direction of the line along length in~100 μm are calculated, to determine average crystal grain chi
Very little average value and standard deviation.
Particle mean size does not include twin boundary (the also referred to as CSL twin boundaries of ∑ 3) in calculating.Twin boundary be by around
Between adjacent bonds Jingjing farmland<111>60 ° of rotation descriptions of directional plane.The quantity of point depends on step-length, and it is less than average crystalline substance
The 1/5 of particle size.
B. the salting liquid Soak Test of ball is engaged：
Al-0.5wt.-%Cu joint sheets are arrived into thread ball engagement.By the test device with the line so engaged at 25 DEG C
It is soaked in salting liquid up to 10 minutes, with deionization (DI) water washing, and is then washed with acetone.Salting liquid includes 20wt.-
Ppm NaCl are in deionized water.Rising ball is detected with 100 × magnifying power under low-powered microscope (Nikon (Nikon) MM-40)
Quantity.The observed result of higher rising ball quantity shows that severe interface current corrodes.
C. the moisture resistance test of ball is engaged：
Al-0.5wt.-%Cu joint sheets are arrived into thread ball engagement.To have in high accelerated stress test (HAST) room such
The test device of closing line is stored in 130 DEG C of temperature, 85% relative humidity (RH) is assigned 8 hours, and then in low-powered microscope
The quantity of rising ball is detected under (Nikon MM-40) with 100 × magnifying power.The observed result of higher rising ball quantity shows severe circle
Surface current corrodes.
D. micro-Vickers hardness (Vickers Micro-hardness)：
Hardness is measured using the Mitutoyo HM-200 test equipments with Vickers (Vickers) indentor.10mN is pressed
The power of trace load is applied to the test sample of line up to the residence time of 12 seconds.Tested on the center of core and on FAB.
E. stitchbonding process window region：
The measurement in joint technology window region is carried out by standardization program.Use KNS-iConn jointing machine instruments (Ku Lisuofa
Industrial Co., Ltd, Washington fort, Pennsylvania, the U.S.) engagement p-wire.Technique window values are based on flat with 18 μm
The line of equal diameter, wherein being made up of with the fingers of wire bonding silver.
By overcoming two chife failure models to export four angles of process window：
(1) supplying too low power and ultrasonic wave energy causes line can not be adhered in fingers (NSOL, non-stick on
Lead finger), and
(2) supplying high-tensile strength and ultrasonic wave energy causes line short-tail (SHTL).
F. resistivity：
The both ends of test sample (line that i.e. length is 1.0 meters) are connected to the power supply of offer constant current/voltage.With dress
Put resistance of the recording needle to supply voltage.Measurement apparatus is HIOKI model 3280-10, and with least ten test sample come weight
Repetition measurement tries.The arithmetic mean of instantaneous value of measured value is used for calculating given below.
Resistance R is calculated according to R=V/I.
Ratio resistance ρ is calculated according to ρ=(R × A)/L, wherein A is the average cross-section of line, and L is for measuring voltage
Line length between two measurement points of device.
Calculated according to the ρ of σ=1/ and compare electrical conductivity.
G. elongation (EL)：
Use the tensile properties of Instron-5564 instrument test lines.254mm gauge lengths (L) are directed to 2.54cm/min speed
P-wire.Load and the elongation in fracture (fracture or break) are obtained according to ASTM standard F219-96.Elongation is
The difference of the gauge length (△ L) of the top-stitching of extension test starting and ending, it was normally reported as (100 △ L/L) (in percentage),
It is calculated with the duty factor elongation percentage tensile diagram recorded.With fracture and yield load divided by line region come tensile strength calculated
And yield strength.Throughput measures, the line for full-length of weighing and the actual diameter that line is measured using its density.
H. the electro-migration testing of line：
Under the low-powered microscope Nikon MM40 of 50 × magnifying power object lens, on PTFE plates with centimetre in distance make two
Bar line keeping parallelism.Water droplet is formed between the two lines of stand-by electrical connection by micropipet.One line is connected to positive pole
And negative pole is connected to by another, and apply 5V to line.In closed circuit two lines are applied with 5V biass, is connected in series to 10k Ω
Resistor.Make closing of circuit by using few drops of deionized waters wetting two lines as electrolyte.Silver in the electrolyte from
Cathodic electromigration forms silver tree to anode and dashed forward, and two lines bridge together sometimes.The speed of the exsule length of silver tree is strongly depend on conjunction
Gold addition.A diameter of 75 μm of the line tested.
Example 1
In every case, a certain amount of silver (Ag), palladium with least 99.99% purity (" 4N ") are melted in crucible
(Pd) it is and golden (Au).A small amount of silver-nickel and silver-calcium foundry alloy are added in fused mass, and added group is determined by stirring
That divides is uniformly distributed.Use following silver-nickel and silver-platinum foundry alloy：
For the alloy of table 1, addition foundry alloy Ag-0.5wt.-%Ni and Ag-0.5wt.-%Ca respective combination.
It is in then the core presoma article of 8mm club forms with fused mass continuously casting.If then walked in dry tensile
Core presoma article is stretched in rapid to form the core presoma of the designated diameter with 18 ± 0.5 μm.The cross section of core
Substantially circular shape.
Moderate is carried out to the club for being stretched to 2mm diameters and being wound on reel under 500 DEG C of baking oven design temperature
Batch annealing was up to open-assembly time of 60 minutes.To the presoma for the diameter for being stretched to 47 μm under 600 DEG C of baking oven design temperature
Article carries out the second moderate strand-anneal(ing) up to the open-assembly time of 0.8 second, and to being stretched to 27 under 600 DEG C of baking oven design temperature
μm the presoma article of diameter carry out the 3rd moderate strand-anneal(ing) up to open-assembly time of 0.6 second.Temperature is set in 480 DEG C of baking ovens
Final strand-anneal(ing) is carried out up to the open-assembly time of 0.6 second to 18 μm of core presomas under degree, is then containing 0.05vol.-% tables
The line so obtained is quenched in the water of face activating agent.Moderate batch annealing is carried out using argon purge gas, and uses 95vol.-%
Nitrogen:5vol.-% nitrogen purging mixed gas carries out strand-anneal(ing).
By this program, manufacture the alloying silver wire of the present invention some different samples 1 to 5 and 4N purity it is comparative
Silver wire (reference).
Table 1：The chemical composition of silver alloy 1 to 5
Table 1 shows the composition of not collinear (sample 1 to 5) of the present invention.Palladium content is in the range of 1 to 3wt.-%.Gold content
In the range of 1 to 1.5wt.-%.Nickel addition changes 30 between 300wt.-ppm.Calcium content is respectively maintained at 30 Hes
50wt.-ppm。
Measure the granularity of line sample 1 to 5 and report particle mean size.In every case, as a result in 2 to 5 μ ms.For
Sample 1, particle mean size are 2.91 μm.
Table 2 below shows the effect that the corrosion resistance and moisture resistance of closing line, the performance of the 2nd joint technology window and FAB are formed
The assessment result of energy.Line sample 1 to 5 defined above and the comparative wire bonding of 4N fine silver are connect to Al-0.5wt.-%Cu
Pad is closed, and is tested according to the method for testing being disclosed above.Except the electro-migration testing carried out for 75 μm of lines, all tests
It is to be carried out for 18 μm of lines.
Table 2：The some test results obtained from line sample 1 to 5；Assess：++++splendid, +++ good, ++ satisfied ,+poor
Wired sample produce the program window for being relatively applied to commercial Application.Observe the corrosion resistance and moisture resistance of engagement ball
Significantly improve.In particular, line sample 1 shows the value (i.e. 2 balls rising) close to zero, and compared to 4N fine silver line (reference), it is
It is special to improve.
In addition, the silver tree of line sample 1 to 5 dashes forward, shape growth is significantly less than the prominent shape growth of silver tree of 4N fine silver lines.
Table 3 shows the particle mean size and structural constituent (line, FAB and heat affected area (HAZ)) of line sample 1.
Table 3：The structural analysis of 18 μm of line samples 1 of annealing
Brief description of the drawings
Fig. 1 shows the exemplary annealing curve of 18 μm of silver-palladium-gold-nickel-calcium alloy lines (sample 1, referring to table 1).Pass through tune
Annealing time selection is steady state value by the speed of whole portable cord.Annealing temperature is the variable element of x-axis.Curve map shows the disconnected of line
Split the measured value of load (BL, in gram) and elongation (EL, in terms of %).Elongation is determined by extension test.Elongation
In the shown example about 19% typical local maximum is presented in measured value, and it is obtained under about 700 DEG C of annealing temperature.
The annealing of sample wire 1 is carried out at 480 DEG C, its 220 DEG C lower than the temperature of maximum elongation rate according to Fig. 1.This generation about 8% is stretched
Long rate value, it is worth low more than 40% than maximum elongation rate.
Fig. 2 shows the exemplary ion grinding cross sectional image of 18 μm of silver-palladium-gold-nickel-calcium alloy lines (sample 1, table 1).
Grain form, HAZ and the FAB of three diverse location lines are obvious.Line sample 1 is annealed under 480 DEG C, 7.5%EL.
Using 1.8 ball and linear dimension ratio (BSR) and 18mA EFO electric currents and 455 μ s EFO times.
Claims (16)
1. a kind of alloying silver wire formed including core or by core, the core consist of in itself：
(a) palladium, its amount in the range of 0.1 to 3wt.-%,
(b) it is golden, its amount in the range of 0.1 to 3wt.-%,
(c) nickel, its amount in the range of 20 to 700wt.-ppm,
(d) calcium, its amount in the range of 20 to 200wt.-ppm,
(e) it is silver-colored, its amount in the range of 93.91 to 99.786wt.-%, and
(f) 0 to 100wt.-ppm other components,
Wherein all amounts in units of wt.-% and wt.-ppm are the gross weights based on the core,
Wherein described alloying silver wire has the average diameter in 8 to 80 μ ms.
2. alloying silver wire according to claim 1, it has the average diameter in 12 to 55 μ ms.
3. alloying silver wire according to claim 1 or 2, wherein the palladium amount is in the range of 0.5 to 1.5wt.-%.
4. alloying silver wire according to any one of the preceding claims, wherein the gold amount arrives 1.5wt.-% models 0.2
In enclosing.
5. alloying silver wire according to any one of the preceding claims, wherein the nickel amount arrives 325wt.-ppm 275
In the range of.
6. alloying silver wire according to any one of the preceding claims, wherein the calcium amount arrives 50wt.-ppm models 20
In enclosing.
7. alloying silver wire according to any one of the preceding claims, wherein the silver amount arrives 96.9625
In the range of 99.2595wt.-%.
8. alloying silver wire according to any one of the preceding claims, it has circular, ellipse in cross
Or rectangular shape.
9. alloying silver wire according to any one of the preceding claims, wherein the core has surface, wherein described
Surface is outer surface or the interface zone between the core and the coating being superimposed on the core.
10. alloying silver wire according to claim 9, it has the coating being superimposed on the core, wherein the painting
The multilayer that layer forms for the individual layer made of precious metal element or by multiple superposition adjacent sublayers, wherein each sublayer is by your different gold
Category element is made.
11. alloying silver wire according to any one of the preceding claims, wherein the core is at least characterised by following
One in inherent characteristic：
(1) average line granularity is less than 10 μm,
(2) line crystal grain [100] or [101] or [111] directional plane are less than 7%,
(3) line twin boundary fraction is less than 60%,
(4) columnar grain is presented in FAB,
(5) FAB particle mean size≤18 μm,
(6) FAB crystal grain [101] directional plane is less than 45%,
(7) FAB twin boundaries fraction is less than 70%,
And/or at least it is characterised by one in following extrinsic characteristic：
(α) corrosion resistance, which has, is no more than the value that 5% engagement ball rises,
(β) moisture resistance, which has, is no more than the value that 5% engagement ball rises,
The hardness of (γ) described core is no more than 85HV,
The process window region that (δ) is used for stitch bond has at least 12000mAg value,
The resistivity of (ε) described line is less than 2.5 μ Ω cm,
The yield strength of (ζ) described line is no more than 170MPa,
The prominent shape growth of the silver tree of (η) described line is no more than 4 μm/s.
A kind of 12. method for manufacturing alloying silver wire according to any one of the preceding claims, wherein the side
Method comprises at least following steps：
(1) provide with the presoma article formed according to the core of any one of claim 1 to 7,
(2) the presoma article is extended to form line presoma, and final diameter is wanted until the acquisition core；With
(3) after Method Of Accomplishment step (2), under the baking oven design temperature in the range of 400 to 600 DEG C, to before the line that is obtained
Drive body and carry out final strand-anneal(ing) up to the open-assembly time in the range of 0.4 to 0.8 second to form the alloying silver wire,
Wherein step (2) carries out moderate under 400 to 800 DEG C of baking oven design temperature, to the elongation presoma article
Batch annealing up to the open-assembly time in the range of 50 to 150 minutes one or more sub-steps, and/or in 400 to 800 DEG C of baking oven
Under design temperature, the elongation presoma article is carried out moderate strand-anneal(ing) up to 0.4 second by 1.2 seconds in the range of open-assembly time
One or more sub-steps.
13. according to the method for claim 12, wherein carrying out institute under baking oven design temperature in the range of 400 to 500 DEG C
Final strand-anneal(ing) is stated up to the open-assembly time in the range of 0.5 to 0.7 second.
14. the method according to claim 12 or 13, wherein institute can be quenched in the water containing one or more additives
State the alloying silver wire of final strand-anneal(ing).
15. the method according to any one of claim 12 to 14, wherein carrying out method step in inertia or reduction atmosphere
Suddenly the moderate annealing and the final strand-anneal(ing) of method and step (3) of (2).
16. a kind of alloying silver wire, it can be obtained by the method according to any one of claim 12 to 15.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG10201508103Q | 2015-09-29 | ||
| SG10201508103QA SG10201508103QA (en) | 2015-09-29 | 2015-09-29 | Alloyed silver wire |
| PCT/SG2016/000015 WO2017058103A1 (en) | 2015-09-29 | 2016-09-05 | Alloyed silver wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107849643A true CN107849643A (en) | 2018-03-27 |
Family
ID=56958987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680032772.0A Pending CN107849643A (en) | 2015-09-29 | 2016-09-05 | Alloying silver wire |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6619458B2 (en) |
| KR (2) | KR102083717B1 (en) |
| CN (1) | CN107849643A (en) |
| SG (1) | SG10201508103QA (en) |
| TW (1) | TWI649434B (en) |
| WO (1) | WO2017058103A1 (en) |
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| US20070278634A1 (en) * | 2006-05-30 | 2007-12-06 | Mk Electron Co., Ltd. | Au-ag based alloy wire for semiconductor package |
| CN103681568A (en) * | 2012-09-04 | 2014-03-26 | 赫劳斯材料工艺有限及两合公司 | Silver alloy wire for bonding applications |
| CN104372197A (en) * | 2014-09-26 | 2015-02-25 | 四川威纳尔特种电子材料有限公司 | Silver alloy wire for semiconductor packaging, and its making method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013033811A (en) * | 2011-08-01 | 2013-02-14 | Tatsuta Electric Wire & Cable Co Ltd | Ball bonding wire |
| US8940403B2 (en) * | 2012-01-02 | 2015-01-27 | Wire Technology Co., Ltd. | Alloy wire and methods for manufacturing the same |
| DE102013000057B4 (en) * | 2012-01-02 | 2016-11-24 | Wire Technology Co., Ltd. | ALLOY WIRE AND METHOD FOR THE PRODUCTION THEREOF |
| JP5529992B1 (en) * | 2013-03-14 | 2014-06-25 | タツタ電線株式会社 | Bonding wire |
| JP5399581B1 (en) * | 2013-05-14 | 2014-01-29 | 田中電子工業株式会社 | High speed signal bonding wire |
| MY175700A (en) * | 2014-01-31 | 2020-07-06 | Tatsuta Electric Wire & Cable Co Ltd | Wire bonding and method of manufacturing wire bonding |
-
2015
- 2015-09-29 SG SG10201508103QA patent/SG10201508103QA/en unknown
-
2016
- 2016-08-24 TW TW105127125A patent/TWI649434B/en active
- 2016-09-05 KR KR1020177035325A patent/KR102083717B1/en active IP Right Grant
- 2016-09-05 KR KR1020197034183A patent/KR102169059B1/en active IP Right Grant
- 2016-09-05 JP JP2017563231A patent/JP6619458B2/en active Active
- 2016-09-05 WO PCT/SG2016/000015 patent/WO2017058103A1/en active Application Filing
- 2016-09-05 CN CN201680032772.0A patent/CN107849643A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070278634A1 (en) * | 2006-05-30 | 2007-12-06 | Mk Electron Co., Ltd. | Au-ag based alloy wire for semiconductor package |
| CN103681568A (en) * | 2012-09-04 | 2014-03-26 | 赫劳斯材料工艺有限及两合公司 | Silver alloy wire for bonding applications |
| CN104372197A (en) * | 2014-09-26 | 2015-02-25 | 四川威纳尔特种电子材料有限公司 | Silver alloy wire for semiconductor packaging, and its making method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI649434B (en) | 2019-02-01 |
| TW201718887A (en) | 2017-06-01 |
| KR102083717B1 (en) | 2020-03-02 |
| WO2017058103A1 (en) | 2017-04-06 |
| JP2018530899A (en) | 2018-10-18 |
| SG10201508103QA (en) | 2017-04-27 |
| KR20180039015A (en) | 2018-04-17 |
| KR20190131629A (en) | 2019-11-26 |
| KR102169059B1 (en) | 2020-10-23 |
| JP6619458B2 (en) | 2019-12-11 |
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