TW201715939A - Heat dissipation unit and manufacturing method thereof improving the flatness of a plane contacting a heat source - Google Patents

Heat dissipation unit and manufacturing method thereof improving the flatness of a plane contacting a heat source Download PDF

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TW201715939A
TW201715939A TW104135673A TW104135673A TW201715939A TW 201715939 A TW201715939 A TW 201715939A TW 104135673 A TW104135673 A TW 104135673A TW 104135673 A TW104135673 A TW 104135673A TW 201715939 A TW201715939 A TW 201715939A
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heat
heat pipe
base
manufacturing
hole
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TW104135673A
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TWI556718B (en
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林勝煌
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奇鋐科技股份有限公司
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Abstract

A heat dissipation unit and a manufacturing method thereof are provided. The heat dissipation unit comprises a heat pipe and a base. The base has a first side and a second side. The second side is opened with a groove and a plurality of through holes communicating the first side and the second side. The heat pipe has a heat absorption area and a conduction area. The conduction is formed by extending from the heat absorption area toward at least one end opposite to the heat absorption area. The heat pipe corresponds to the portion of the through holes for being received in the through holes, and is aligned with the first side of the base at the same time. Through the heat dissipation unit and the manufacturing method thereof of the present invention, the drawback of the prior art that it is not easy to control precision in aligning protrusions of the heat pipe and the base with two planes of the heat pipe can be eliminated.

Description

散熱單元及其製造方法Heat dissipation unit and manufacturing method thereof

一種散熱單元及其製造方法,尤指一種具有較佳熱接觸平面的散熱單元及其製造方法。A heat dissipating unit and a manufacturing method thereof, in particular, a heat dissipating unit having a preferred thermal contact plane and a manufacturing method thereof.

現行電子設備中具有中央處理單元及其他計算晶片,並當進行運算時皆會產生熱量,故需要散熱元件輔助藉以增加其散熱效率而達到解熱之目的,最常使用之散熱元件如熱管、均溫板、散熱器、散熱鰭片等元件,主要係利用該等元件增加導熱速度或將熱量導至遠端進行遠端散熱,或透過增加散熱面積藉以提升散熱效能,一般中央處理器主要係透過與散熱器接觸傳導熱量,而散熱器係為一種提供增加散熱面積之效果,為令其導熱速度能更為快速則將熱管與散熱器結合,並將散熱器與中央處理器接觸之部位開設孔口或開設凹槽使熱管可直接外露與中央處理器接觸傳導熱量再將熱量傳遞給具有較大散熱面積的散熱器進行散熱,此項由熱管與散熱器結合之散熱元件常被使用,而該項散熱元件仍具有無法被改善的缺失,該缺失係為當於該散熱器一側開設容置熱管之凹槽時,透過穿設或垂直放置之方式將該熱管固定於該凹槽內,但該熱管仍會有局部部位凸露出該散熱器與中央處理器接觸之部位,而造成平整度不佳產生熱阻現象,習知一般係透過將凸出之部位以銑削加工之方式將該部位去除,而由於熱管凸出該散熱器之凹槽的部分並非全然皆為相同高度,以及熱管本身管壁亦具有厚薄不一的情況,當進行銑削加工時相當容易過度切銷而將熱管管壁破壞,令熱管失去功效。故如何改善習知之缺失即為首重之目標。The current electronic device has a central processing unit and other computing chips, and generates heat when performing calculations. Therefore, the heat dissipating component is required to increase the heat dissipation efficiency to achieve the purpose of deheating, and the most commonly used heat dissipating components such as heat pipes and temperature are used. Components such as boards, heat sinks, and heat sink fins are mainly used to increase the heat transfer speed or to conduct heat to the far end for heat dissipation at the far end, or to increase the heat dissipation area to improve heat dissipation performance. Generally, the central processing unit mainly transmits and The heat sink is in contact with the heat transfer, and the heat sink is an effect of increasing the heat dissipation area. In order to make the heat transfer speed faster, the heat pipe is combined with the heat sink, and the heat sink is connected to the central processor to open the hole. Or a recess is formed so that the heat pipe can directly expose the heat conduction to the central processor to transmit heat to the heat sink having a large heat dissipation area, and the heat dissipating component combined with the heat pipe and the heat sink is often used. The heat dissipating component still has a defect that cannot be improved, and the missing is to be placed on the side of the heat sink. In the groove of the tube, the heat pipe is fixed in the groove by way of laying or vertical placement, but the heat pipe still has a partial portion protruding from the portion of the heat sink that is in contact with the central processing unit, and the flatness is not It is good to generate a thermal resistance phenomenon. Generally, the portion is removed by milling the protruding portion, and since the portion of the heat pipe protruding from the groove of the heat sink is not all of the same height, and the heat pipe itself is The wall also has a different thickness. When milling, it is quite easy to over-cut and destroy the heat pipe wall, which makes the heat pipe lose its effect. Therefore, how to improve the lack of knowledge is the first priority.

爰此,為解決上述習知技術之缺點,本發明之主要目的,係提供一種可提升散熱單元與熱源接觸之平面的平整精度的散熱單元。Accordingly, in order to solve the above-mentioned shortcomings of the prior art, the main object of the present invention is to provide a heat dissipating unit capable of improving the flatness of the plane in which the heat radiating unit is in contact with the heat source.

本發明另一目地係提供一種提升散熱單元與熱源接觸之平面的平整精度的散熱單元的製造方法。Another object of the present invention is to provide a method of manufacturing a heat dissipating unit that improves the leveling accuracy of a plane in which a heat radiating unit is in contact with a heat source.

為達上述目的本發明係提供一種散熱單元,係包含:一熱管、一基座;所述基座具有一第一側及一第二側,該第二側開設有一溝槽及複數連通該第一、二側的貫穿孔;該熱管具有一吸熱區及一傳導區,並該傳導區由該吸熱區向相反該吸熱區之方向的至少一端延伸所構形,並該熱管對應該貫穿孔處之部位容設於該等貫穿孔內,並同時與該基座之第一側切齊。The present invention provides a heat dissipating unit, comprising: a heat pipe and a base; the base has a first side and a second side, the second side defines a groove and the plurality of wires are connected a through hole of the first and second sides; the heat pipe has a heat absorption zone and a conduction zone, and the conduction zone is configured by extending from the heat absorption zone to at least one end opposite to the heat absorption zone, and the heat pipe corresponds to the through hole The portion is received in the through holes and simultaneously aligned with the first side of the base.

為達上述目的本發明係提供一種散熱單元之製造方法,係包含下列步驟:In order to achieve the above object, the present invention provides a method for manufacturing a heat dissipating unit, which comprises the following steps:

提供一基座及一熱管;Providing a base and a heat pipe;

於該基座上側成型一溝槽及複數貫穿孔;Forming a groove and a plurality of through holes on the upper side of the base;

將該熱管置入該溝槽內並對該基座上側施以機械加工,將該熱管迫入該溝槽及該貫穿孔內;Inserting the heat pipe into the groove and machining the upper side of the base, and forcing the heat pipe into the groove and the through hole;

對該基座下側施以機械加工,將該熱管凸出該貫穿孔之部位壓入該貫穿孔內使其與該基座下側切齊。The lower side of the base is machined, and the portion of the heat pipe protruding from the through hole is pressed into the through hole to be aligned with the lower side of the base.

藉由本發明之散熱單元及其製造方法,係可改善習知技術中由散熱基板與熱管所組成之散熱單元於組裝時熱管與該散熱基板與熱源接觸之部位精度控制不易等問題。The heat dissipating unit and the manufacturing method thereof of the present invention can improve the problem that the heat dissipating unit composed of the heat dissipating substrate and the heat pipe in the prior art is difficult to control the precision of the portion where the heat pipe and the heat dissipating substrate are in contact with the heat source during assembly.

1‧‧‧散熱單元1‧‧‧heating unit

11‧‧‧熱管11‧‧‧ Heat pipe

111‧‧‧吸熱區111‧‧‧heat absorption zone

112‧‧‧傳導區112‧‧‧Transmission zone

12‧‧‧基座12‧‧‧ Pedestal

121‧‧‧第一側121‧‧‧ first side

122‧‧‧第二側122‧‧‧ second side

123‧‧‧溝槽123‧‧‧ trench

124‧‧‧貫穿孔124‧‧‧through holes

2‧‧‧熱源2‧‧‧heat source

第1圖係為本發明散熱單元第一實施例之立體分解圖;1 is an exploded perspective view of a first embodiment of a heat dissipation unit of the present invention;

第2圖係為本發明散熱單元第一實施例之立體組合圖;Figure 2 is a perspective assembled view of the first embodiment of the heat dissipation unit of the present invention;

第3圖係為本發明散熱單元第一實施例之組合剖視圖;Figure 3 is a sectional view showing the combination of the first embodiment of the heat dissipating unit of the present invention;

第4圖係為本發明散熱單元第二實施例之立體分解圖;Figure 4 is a perspective exploded view of a second embodiment of the heat dissipation unit of the present invention;

第5圖係為本發明散熱單元之製造方法加工示意圖;Figure 5 is a schematic view showing the processing method of the heat dissipation unit of the present invention;

第6圖係為本發明散熱單元之製造方法加工示意圖;Figure 6 is a schematic view showing the processing method of the heat dissipation unit of the present invention;

第7圖係為本發明散熱單元之製造方法第一實施例之步驟流程圖;Figure 7 is a flow chart showing the steps of the first embodiment of the method for manufacturing the heat dissipation unit of the present invention;

第8圖係為本發明散熱單元之製造方法第二實施例之步驟流程圖。Figure 8 is a flow chart showing the steps of the second embodiment of the method for manufacturing the heat dissipation unit of the present invention.

本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

請參閱第1、2、3圖,係為本發明散熱單元第一實施例之立體分解及組合與剖視圖,如圖所示,所述散熱單元1,係包含:一熱管11、一基座12;Referring to the first, second, and third embodiments, the first embodiment of the heat dissipating unit of the present invention is a perspective exploded view and a combination and a cross-sectional view. As shown, the heat dissipating unit 1 includes a heat pipe 11 and a pedestal 12. ;

所述熱管11具有一吸熱區111及一傳導區112,並該傳導區112由該吸熱區111向相反該吸熱區111之方向的至少一端延伸所構形,所述熱管11係為一扁平熱管或D型熱管或圓管之其中任一或相互搭配使用均可。The heat pipe 11 has a heat absorption zone 111 and a conduction zone 112, and the conduction zone 112 is configured by extending from the heat absorption zone 111 to at least one end opposite to the heat absorption zone 111. The heat pipe 11 is a flat heat pipe. Either the D-type heat pipe or the round pipe can be used in combination with each other.

所述基座12具有一第一側121及一第二側122,並該第一、二側121、122對應設置於該基座12之上、下兩側,該第二側122開設有一溝槽123及複數連通該第一、二側121、122的貫穿孔124,該熱管11容設於該溝槽123內,並該熱管11對應容設於該等貫穿孔124處(部分)係凸伸容設於該貫穿孔124內並與該基座12之第一側121切齊。The base 12 has a first side 121 and a second side 122. The first and second sides 121 and 122 are correspondingly disposed on the upper and lower sides of the base 12, and the second side 122 defines a groove. a groove 123 and a plurality of through holes 124 communicating with the first and second sides 121 and 122. The heat pipe 11 is received in the groove 123, and the heat pipe 11 is correspondingly received at the through holes 124. The extension is disposed in the through hole 124 and is aligned with the first side 121 of the base 12 .

該基座12設置貫穿孔124處係與至少一熱源2直接接觸傳導熱量。The susceptor 12 is disposed at the through hole 124 to directly contact the at least one heat source 2 to conduct heat.

由本實施例第3圖中可看出,所述熱管11對應該基座12貫穿孔124之處(部分)凸伸並容設於該貫穿孔124內,並與該基座12之第一側121相切齊,而熱管11其餘部位則容設於該基座12之溝槽123內並與該基座12之第二側122切齊。It can be seen from FIG. 3 that the heat pipe 11 protrudes (partially) corresponding to the through hole 124 of the base 12 and is received in the through hole 124 and the first side of the base 12 121 is phase-cut, and the rest of the heat pipe 11 is received in the groove 123 of the base 12 and is aligned with the second side 122 of the base 12.

參閱第4圖,係為本發明散熱單元第二實施例之立體分解圖,本實施利係採用圓形熱管11與基座12結合之方式作一說明,當該圓形熱管11置入該基座12之溝槽123(本實施例溝槽形狀係採圓弧形)內時,該熱管11部分凸出該基座12之溝槽123,係可藉由機械加工(沖壓、輥軋)將該熱管11凸出溝槽123之部位迫入該溝槽123內,並同時填入該貫穿孔124內,令該熱管11定型於該溝槽123及該貫穿孔124內與其緊密結合,而受機械加工加壓壓迫後,該熱管11亦有部分部位由該貫穿孔124凸出該基座12的第一側121,係可再次透過機械加工之方式將該部位壓回該貫穿孔124內,並與該基座12之第一側121切齊,令該熱管11受變形之兩側與該基座12之第一、二側121、122對應切齊,本實施例係採用沖壓加工(第5圖所示)作為說明,但並不引以為限,亦可為輥軋(如第6圖所示)。4 is a perspective exploded view of a second embodiment of the heat dissipating unit of the present invention. The present embodiment is described by combining a circular heat pipe 11 and a base 12, and the circular heat pipe 11 is placed in the base. When the groove 123 of the seat 12 (the groove shape of the embodiment is a circular arc shape), the heat pipe 11 partially protrudes from the groove 123 of the base 12, and can be machined (stamped, rolled) The portion of the heat pipe 11 that protrudes from the groove 123 is forced into the groove 123 and simultaneously filled into the through hole 124, so that the heat pipe 11 is shaped in the groove 123 and the through hole 124 to be tightly coupled thereto. After the mechanical compression and compression, the heat pipe 11 also has a portion of the first side 121 of the base 12 protruding from the through hole 124, and the portion can be pressed back into the through hole 124 by mechanical machining. And the first side 121 of the base 12 is aligned, so that the two sides of the heat pipe 11 are aligned with the first and second sides 121 and 122 of the base 12, and the embodiment is stamped. 5 is shown as an illustration, but not limited to, and can also be rolled (as shown in Figure 6).

請參閱第7圖,係為本發明散熱單元之製造方法第一實施例之步驟流程圖,並一併參閱前述第1~4圖以及第5、6圖加工示意圖,如圖所示,所述散熱單元之製造方法,係包含下列步驟:Please refer to FIG. 7 , which is a flow chart of the steps of the first embodiment of the manufacturing method of the heat dissipating unit of the present invention, and together with the processing diagrams of FIGS. 1 to 4 and 5 and 6 , as shown in the figure. The manufacturing method of the heat dissipation unit includes the following steps:

S1:提供一基座及一熱管;S1: providing a base and a heat pipe;

係提供一基座12及一熱管11,所述基座12係可選自銅、鋁材質其中任一或及其合金,所述熱管11係為一扁平熱管或D型熱管或圓管其中任一。A susceptor 12 and a heat pipe 11 are provided. The susceptor 12 can be selected from any one of copper and aluminum materials or alloys thereof. The heat pipe 11 is a flat heat pipe or a D-type heat pipe or a pipe. One.

S2:於該基座上側成型一溝槽及複數貫穿孔;S2: forming a groove and a plurality of through holes on the upper side of the base;

於該基座12之上側(第二側122)透過除料加工形成一溝槽123,並將設置於該基座12靠近中央處之溝槽123設置複數貫穿孔124,該等貫穿孔124貫該基座12並連通至該基座12之下側(第一側121)平面。A groove 123 is formed on the upper side (the second side 122) of the susceptor 12 by a material removal process, and a plurality of through holes 124 are formed in the groove 123 disposed near the center of the susceptor 12, and the through holes 124 are The susceptor 12 is also connected to the plane of the lower side (first side 121) of the susceptor 12.

S3: 將該熱管置入該溝槽內並對該基座上側施以機械加工,將該熱管迫入該溝槽及該貫穿孔內;S3: placing the heat pipe into the groove and machining the upper side of the base, and forcing the heat pipe into the groove and the through hole;

將所述熱管11對應置入該基座12之溝槽123內,並透過機械加工對該熱管施以壓力將熱管迫入該溝槽以及熱管對應該貫穿孔之部位同時迫入該貫穿孔,所述機械加工係為沖壓加工或輥軋加工或鍛造加工其中任一,並該等機械加工可以為一次性加工(沖壓加工如第5圖所示)或為反複性多次加工(鍛造加工如第6圖所示、滾軋加工如第7圖所示)。The heat pipe 11 is correspondingly placed into the groove 123 of the susceptor 12, and the heat pipe is subjected to mechanical processing to force the heat pipe into the groove and the portion of the heat pipe corresponding to the through hole is simultaneously forced into the through hole. The machining is any one of stamping or rolling or forging, and the machining may be one-time processing (pressing processing as shown in Fig. 5) or repeating multiple processing (forging processing, such as Figure 6 shows the rolling process as shown in Figure 7.

S4:對該基座下側施以機械加工,將該熱管凸出該貫穿孔之部位壓入該貫穿孔內使其與該基座下側切齊。S4: machining the lower side of the base, and pressing the portion of the heat pipe protruding from the through hole into the through hole to be aligned with the lower side of the base.

該熱管11對應該基座12之該等貫穿孔124處,因受機械加工迫入該貫穿孔124內,並有部分由該貫穿孔124凸出該基座12之下側(第一側121)表面之熱管11部位,透過機械加工之方式將該熱管11凸露出該基座12之該等貫穿孔124的部分加壓迫入該基座12之貫穿孔124內,令該等熱管11凸出該貫穿孔124之部位與該基座12之下側(第一側121)表面切齊。The heat pipe 11 corresponds to the through holes 124 of the base 12, is mechanically forced into the through hole 124, and partially protrudes from the through hole 124 to the lower side of the base 12 (the first side 121) The portion of the heat pipe 11 on the surface is mechanically processed to expose the portion of the heat pipe 11 that protrudes through the through holes 124 of the base 12 into the through hole 124 of the base 12, so that the heat pipes 11 protrude. The portion of the through hole 124 is aligned with the surface of the lower side (first side 121) of the susceptor 12.

請參閱第8圖,係為本發明散熱單元之製造方法第二實施例之步驟流程圖,本實施例包含下列步驟:Please refer to FIG. 8 , which is a flow chart of the second embodiment of the manufacturing method of the heat dissipation unit of the present invention. The embodiment includes the following steps:

S1:提供一基座及一熱管;S1: providing a base and a heat pipe;

S2:於該基座上側成型一溝槽及複數貫穿孔;S2: forming a groove and a plurality of through holes on the upper side of the base;

S3: 將該熱管置入該溝槽內並對該基座上側施以機械加工,將該熱管迫入該溝槽及該貫穿孔內;S3: placing the heat pipe into the groove and machining the upper side of the base, and forcing the heat pipe into the groove and the through hole;

S4:對該基座下側施以機械加工,將該熱管凸出該貫穿孔之部位壓入該貫穿孔內使其與該基座下側切齊。S4: machining the lower side of the base, and pressing the portion of the heat pipe protruding from the through hole into the through hole to be aligned with the lower side of the base.

惟本實施例係與前述第一實施例部分內容相同,故在此將不再贅述,本實施與前述第一實施例之不同處在於,更具有一步驟S5:透過切銷加工對該基座之凸台處進行精加工,藉此令該凸台之表面平整度提升。However, this embodiment is the same as that of the foregoing first embodiment, and therefore will not be described again herein. The difference between the present embodiment and the foregoing first embodiment is that there is a step S5: the pedestal is processed through the cutting process. Finishing is performed at the boss to improve the surface flatness of the boss.

將經過機械加工後之基座12與熱管11表面再一次以切銷加工之方式提昇表面之精度,所述切銷加工係可為銑削加工或刨削加工或研磨加工其中任一。The surface of the pedestal 12 and the heat pipe 11 after machining is once again subjected to a cutting process to improve the accuracy of the surface, and the cutting process can be any one of milling or planing or grinding.

透過本發明之製造方法係可大幅改善習知熱管與基座結合後精度控制不易之缺失,以及改善習知熱管與基座結合後不緊密造成熱阻現象等缺失。Through the manufacturing method of the present invention, the lack of precision control of the conventional heat pipe and the pedestal can be greatly improved, and the loss of the thermal resistance phenomenon caused by the combination of the conventional heat pipe and the susceptor is not improved.

 

1‧‧‧散熱單元 1‧‧‧heating unit

11‧‧‧熱管 11‧‧‧ Heat pipe

111‧‧‧吸熱區 111‧‧‧heat absorption zone

112‧‧‧傳導區 112‧‧‧Transmission zone

12‧‧‧基座 12‧‧‧ Pedestal

121‧‧‧第一側 121‧‧‧ first side

122‧‧‧第二側 122‧‧‧ second side

123‧‧‧溝槽 123‧‧‧ trench

124‧‧‧貫穿孔 124‧‧‧through holes

2‧‧‧熱源 2‧‧‧heat source

Claims (9)

一種散熱單元,係包含:
一基座,具有一第一側及一第二側,該第二側開設有一溝槽及複數連通該第一、二側的貫穿孔;
一熱管,具有一吸熱區及一傳導區,並該傳導區由該吸熱區向相反該吸熱區之方向的至少一端延伸所構形,並該熱管對應該貫穿孔處之部位係凸伸容設於該等貫穿孔內,並同時與該基座之第一側切齊。
A heat dissipation unit comprising:
a pedestal having a first side and a second side, the second side defines a groove and a plurality of through holes communicating with the first and second sides;
a heat pipe having a heat absorbing zone and a conducting zone, wherein the heat conducting zone is configured to extend from at least one end of the heat absorbing zone toward the opposite heat absorbing zone, and the heat pipe corresponds to a portion of the through hole Within the through holes and simultaneously with the first side of the base.
如申請專利範圍第1項所述之散熱單元,其中所述熱管係為一扁平熱管或D型熱管其中任一。The heat dissipating unit according to claim 1, wherein the heat pipe is any one of a flat heat pipe or a D heat pipe. 如申請專利範圍第1項所述之散熱單元,其中所述第一側及該第二側係相對應分設於該基座之下、上兩側。The heat dissipating unit of claim 1, wherein the first side and the second side are correspondingly disposed under the base and on the upper side. 如申請專利範圍第1項所述之散熱單元,其中該基座對應設置該貫穿孔處係與至少一熱源直接接觸傳導熱量。The heat dissipating unit of claim 1, wherein the base is disposed in contact with the at least one heat source to directly conduct heat. 一種散熱單元製造方法,係包含下列步驟:
提供一基座及一熱管;
於該基座上側成型一溝槽及複數貫穿孔;
將該熱管置入該溝槽內並對該基座上側施以機械加工,將該熱管迫入該溝槽及該貫穿孔內;
對該基座下側施以機械加工,將該熱管凸出該貫穿孔之部位壓入該貫穿孔內使其與該基座下側切齊。
A method for manufacturing a heat dissipation unit includes the following steps:
Providing a base and a heat pipe;
Forming a groove and a plurality of through holes on the upper side of the base;
Inserting the heat pipe into the groove and machining the upper side of the base, and forcing the heat pipe into the groove and the through hole;
The lower side of the base is machined, and the portion of the heat pipe protruding from the through hole is pressed into the through hole to be aligned with the lower side of the base.
如申請專利範圍第5項所述之散熱單元製造方法,其中該等貫穿孔係設置於該基座靠近中央處之溝槽。The method for manufacturing a heat dissipating unit according to claim 5, wherein the through holes are disposed in a groove near the center of the base. 如申請專利範圍第5項所述之散熱單元製造方法,其中所述機械加工係為沖壓加工或輥軋加工或鍛造加工其中任一。The method for manufacturing a heat dissipating unit according to claim 5, wherein the machining is any one of press working or rolling or forging. 如申請專利範圍第5項所述之散熱單元製造方法,其中
對該基座下側施以機械加工,將該熱管凸出該貫穿孔之部位壓入該貫穿孔內使其與該基座下側切齊此步驟後,更具有一步驟:透過切銷加工對該基座之凸台處進行精加工,藉此令該凸台之表面平整度提升。
The method for manufacturing a heat dissipating unit according to claim 5, wherein the lower side of the base is machined, and a portion of the heat pipe protruding from the through hole is pressed into the through hole to be placed under the base After the side is cut in this step, there is a further step: finishing the boss of the base through the cutting process, thereby improving the surface flatness of the boss.
如申請專利範圍第5項所述之散熱單元製造方法,其中
所述熱管係為一扁平熱管或D型熱管或圓形熱管其中任一。
The method for manufacturing a heat dissipating unit according to claim 5, wherein the heat pipe is any one of a flat heat pipe or a D heat pipe or a circular heat pipe.
TW104135673A 2015-10-29 2015-10-29 Heat dissipation unit and manufacturing method thereof TWI556718B (en)

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