TW201711542A - Circuit boards connecting structure and method for manufacturing same - Google Patents
Circuit boards connecting structure and method for manufacturing same Download PDFInfo
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- TW201711542A TW201711542A TW104125031A TW104125031A TW201711542A TW 201711542 A TW201711542 A TW 201711542A TW 104125031 A TW104125031 A TW 104125031A TW 104125031 A TW104125031 A TW 104125031A TW 201711542 A TW201711542 A TW 201711542A
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
Abstract
Description
本發明涉及電路板製作領域，尤其涉及一種電路板壓接結構及電路板壓接結構製作方法。The present invention relates to the field of circuit board manufacturing, and in particular, to a circuit board crimping structure and a circuit board crimping structure manufacturing method.
軟性電路板具有重量輕、厚度薄、線路密度高、曲折性佳、可靠度高等特點。伴隨電子產品輕薄短小的發展趨勢，軟性電路板的應用日益廣泛。軟性電路板與電子產品零部件的導電線路的連接方式包括插拔和壓接等，其中，壓接是將軟性電路板的連接部與電子產品零部件的的導電線路的連接部藉由導電膠體粘結。然而，軟性電路板的連接部與電子產品零部件的導電線路的連接部僅藉由導電膠體粘結，其剝離強度不足。The flexible circuit board has the characteristics of light weight, thin thickness, high line density, good tortuosity and high reliability. With the development trend of thin and light electronic products, the application of flexible circuit boards is increasingly widespread. The connection manner of the flexible circuit board and the conductive line of the electronic component includes plugging and pressing, etc., wherein the crimping is a connection between the connecting portion of the flexible circuit board and the conductive line of the electronic component by the conductive colloid Bonding. However, the connection portion between the connection portion of the flexible circuit board and the conductive line of the electronic component is bonded only by the conductive paste, and the peel strength is insufficient.
有鑑於此，有必要提供一種克服上述問題的電路板壓接結構及電路板壓接結構製造方法。In view of the above, it is necessary to provide a circuit board crimping structure and a circuit board crimping structure manufacturing method that overcome the above problems.
一種電路板壓接結構，包括第一連接部、第二連接部及形成在所述第一連接部與第二連接部之間的導電膠體。所述第一連接部包括多條第一導線。每條所述第一導線上均形成有第一結合部。所述第二連接部包括多條第二導線。每條所述第二導線上均形成有與所述第一結合部對應的第二結合部。所述第一結合部及第二結合部為凹槽或凸起。所述導電膠體用於粘結所述第一連接部與第二連接部。A circuit board crimping structure includes a first connecting portion, a second connecting portion, and a conductive paste formed between the first connecting portion and the second connecting portion. The first connecting portion includes a plurality of first wires. A first joint portion is formed on each of the first wires. The second connecting portion includes a plurality of second wires. A second joint portion corresponding to the first joint portion is formed on each of the second wires. The first joint portion and the second joint portion are grooves or protrusions. The conductive paste is used to bond the first connecting portion and the second connecting portion.
與先前技術相比，本發明提供的電路板壓接結構，由於所述第一導線上形成有第一結合部，所述第二導線上形成有與第一結合部配合的第二結合部，所述第一結合部與所述第二結合部為凹槽或凸起，藉由凹槽與凸起的配合可以增大所述第一導線與第二導線的結合面積，進而增大所述第一軟性電路板與所述第二軟性電路板的剝離強度。Compared with the prior art, the circuit board crimping structure provided by the present invention has a first bonding portion formed on the first wire, and a second bonding portion that is matched with the first bonding portion is formed on the second wire. The first joint portion and the second joint portion are grooves or protrusions, and the joint area of the first wire and the second wire can be increased by the cooperation of the groove and the protrusion, thereby increasing the Peel strength of the first flexible circuit board and the second flexible circuit board.
圖1係本發明第一實施方式提供的電路板壓接結構壓接後的剖面示意圖。1 is a cross-sectional view showing a crimped structure of a circuit board according to a first embodiment of the present invention after crimping.
圖2係本發明第一實施方式提供的電路板壓接結構壓接前的剖面示意圖。2 is a cross-sectional view showing the circuit board crimping structure provided by the first embodiment of the present invention before crimping.
圖3係本發明第二實施方式提供的電路板壓接結構壓接後的剖面示意圖。3 is a cross-sectional view showing a crimped structure of a circuit board according to a second embodiment of the present invention after crimping.
下面結合具體實施方式對本發明提供的電路板壓接結構及電路板壓接結構製作方法進行詳細說明。The circuit board crimping structure and the circuit board crimping structure manufacturing method provided by the present invention will be described in detail below with reference to specific embodiments.
請參閱圖1及圖2，本發明第一實施方式提供的電路板壓接結構100包括第一軟性電路板10、第二軟性電路板20及導電膠體30。Referring to FIG. 1 and FIG. 2 , the circuit board crimping structure 100 according to the first embodiment of the present invention includes a first flexible circuit board 10 , a second flexible circuit board 20 , and a conductive paste 30 .
所述第一軟性電路板10包括一個第一連接部11。所述第一連接部11位於所述第一軟性電路板10的端部。所述第一連接部11包括第一基材層12及一個第一導線層13。The first flexible circuit board 10 includes a first connecting portion 11. The first connecting portion 11 is located at an end of the first flexible circuit board 10. The first connecting portion 11 includes a first substrate layer 12 and a first wire layer 13.
所述第一基材層12可為由聚醯亞胺、聚酯等絕緣材料製成的介電層，也可為包括交替堆疊的介電層及導電層的多層結構。本實施方式中，所述第一基材層12為聚醯亞胺或聚酯材料製成的介電層。The first substrate layer 12 may be a dielectric layer made of an insulating material such as polyimide or polyester, or a multilayer structure including alternating dielectric layers and conductive layers. In this embodiment, the first base material layer 12 is a dielectric layer made of polyimide or polyester material.
所述第一導線層13形成在所述第一基材層12上。所述第一導線層13包括多條平行且間隔排列的第一導線131。部分所述第一基材層12從所述第一導線131之間的空隙露出。本實施方式中，每條所述第一導線131的導線寬度均相同，且每兩條相鄰的第一導線131之間的間距相同。每個所述第一導線131上均形成有第一結合部132。所述第一結合部132位於所述第一導線131背離所述第一基材層12的表面上。所述第一結合部132與所述第一導線131可為單獨結構或一體結構。本實施方式中，所述第一結合部132與所述第一導線131為一體結構。所述第一結合部132可為凸起或凹槽。本實施方式中，所述第一結合部132均為凸起，且所述第一結合部132自所述第一導線131的端部沿所述第一導線131的延伸方向延伸。所述第一結合部132與所述第一導線131形成的結構在所述第一導線131線寬方向的截面可呈凸字型或L型。本實施方式中，所述第一結合部132與所述第一導線131形成的結構在所述第一導線131線寬方向的截面呈凸字型。The first wire layer 13 is formed on the first substrate layer 12. The first wire layer 13 includes a plurality of first wires 131 arranged in parallel and spaced apart. A portion of the first substrate layer 12 is exposed from a gap between the first wires 131. In this embodiment, the wire width of each of the first wires 131 is the same, and the spacing between each two adjacent first wires 131 is the same. A first bonding portion 132 is formed on each of the first wires 131. The first bonding portion 132 is located on a surface of the first wire 131 facing away from the first substrate layer 12 . The first bonding portion 132 and the first wire 131 may be a single structure or a unitary structure. In this embodiment, the first joint portion 132 and the first wire 131 are integrally formed. The first joint portion 132 may be a protrusion or a groove. In the embodiment, the first bonding portion 132 is a protrusion, and the first bonding portion 132 extends from the end of the first wire 131 along the extending direction of the first wire 131. The structure formed by the first bonding portion 132 and the first wire 131 may have a convex shape or an L shape in a cross section in the line width direction of the first wire 131. In the present embodiment, the structure in which the first joint portion 132 and the first wire 131 are formed in a line-shaped cross section in the line width direction of the first wire 131 is convex.
可以理解的是，在其他實施方式中，請參閱圖3，部分所述第一導線131上的所述第一結合部132為凸起，部分所述第一導線131上的所述第一結合部132為凹槽，且所述凹槽對應的第一導線131位於所述凸起對應的第一導線131的同一側。It is to be understood that, in other embodiments, referring to FIG. 3, the first bonding portion 132 on the first wire 131 is a protrusion, and the first combination on the first wire 131 is partially The portion 132 is a groove, and the first wire 131 corresponding to the groove is located on the same side of the first wire 131 corresponding to the protrusion.
可以理解的是，在其他實施方式中，每兩條相鄰的第一導線131之間的間距也可不全相同。例如，所述第一導線層13最外兩側的兩條第一導線131與相鄰的第一導線131的間距可以設置為大於或小於其他相鄰第一導線131之間的間距。所述第二導線層23的第二導線231與所述第一導線131一一對應。此時，由於所述第一導線層13最外兩側的兩條第一導線131與相鄰的第一導線131的間距不同於其他相鄰第一導線131之間的間距，因此，可以起到防呆的作用。It can be understood that, in other embodiments, the spacing between each two adjacent first wires 131 may not be the same. For example, the distance between the two first wires 131 on the outermost sides of the first wire layer 13 and the adjacent first wires 131 may be set to be larger or smaller than the spacing between the other adjacent first wires 131. The second wires 231 of the second wire layer 23 are in one-to-one correspondence with the first wires 131. At this time, since the distance between the two first wires 131 on the outermost sides of the first wire layer 13 and the adjacent first wires 131 is different from the spacing between the other adjacent first wires 131, To the role of foolproof.
可以理解的是，在其他實施方式中，每條所述第一導線131的寬度也可不全相同。It can be understood that in other embodiments, the width of each of the first wires 131 may not be the same.
所述第二軟性電路板20包括一個第二連接部21。所述第二連接部21位於所述第二軟性電路板20的端部。所述第二連接部21壓接在所述第一連接部11上。所述第二連接部21包括一個第二基材層22及一個第二導線層23。The second flexible circuit board 20 includes a second connection portion 21. The second connecting portion 21 is located at an end of the second flexible circuit board 20. The second connecting portion 21 is crimped onto the first connecting portion 11 . The second connecting portion 21 includes a second substrate layer 22 and a second wire layer 23.
所述第二基材層22可為由聚醯亞胺、聚酯等絕緣材料製成的介電層、也可為包括交替堆疊的介電層及導電層的多層結構。本實施方式中，所述第二基材層22與所述第一基材層12的結構相同，為由聚醯亞胺或聚酯材料製成的介電層。The second substrate layer 22 may be a dielectric layer made of an insulating material such as polyimide or polyester, or a multilayer structure including alternating dielectric layers and conductive layers. In the present embodiment, the second base material layer 22 has the same structure as the first base material layer 12 and is a dielectric layer made of a polyimide or a polyester material.
所述第二導線層23形成在所述第二基材層22上。所述第二導線層23與所述第一導線層13相對設置。所述第二導線層23包括多條平行且間隔排列的第二導線231。本實施方式中，所述多條第二導線231與所述多條第一導線131一一對應。部分所述第二基材層22從所述第二導線231之間的空隙露出。本實施方式中，每條所述第二導線231的導線寬度與對應的第一導線131的導線寬度相同，且每兩條相鄰第二導線231之間的間距與對應的相鄰兩條第一導線131之間的間距相同。所述每個所述第二導線231上均形成有與對應第一導線131上的第一結合部132配合的第二結合部232。所述第二結合部232可為凸起或凹槽。本實施方式中，所述第二結合部232均為凹槽，且所述第二結合部232自所述第二導線231的段沿所述第二導線231的延伸方向延伸。所述第二結合部232由所述第二導線231背離所述第二基材層22的表面的向所述第二導線231內部凹陷形成。所述第二結合部232與所述第二導線231形成的結構在所述第二導線231線寬方向的截面可呈凹字型或倒L型。本實施方式中，所述第二結合部232與所述第二導線231形成的結構在所述第二導線231線寬方向的截面呈凹字型。所述第二結合部232在所述第二導線231線寬方向上的寬度大於所述第一結合部132在所述第一導線131的線寬方向上的寬度。本實施方式中，所述第二結合部232在所述第二導線231線寬方向上的寬度與所述第一結合部132在所述第一導線131線寬方向上的寬度的差值約為0.2微米。The second wire layer 23 is formed on the second substrate layer 22. The second wire layer 23 is disposed opposite to the first wire layer 13 . The second wire layer 23 includes a plurality of second wires 231 arranged in parallel and spaced apart. In this embodiment, the plurality of second wires 231 are in one-to-one correspondence with the plurality of first wires 131. A portion of the second substrate layer 22 is exposed from a gap between the second wires 231. In this embodiment, the wire width of each of the second wires 231 is the same as the wire width of the corresponding first wire 131, and the spacing between each two adjacent second wires 231 and the corresponding adjacent two The spacing between one of the wires 131 is the same. Each of the second wires 231 is formed with a second joint portion 232 that cooperates with the first joint portion 132 on the corresponding first wire 131. The second joint portion 232 can be a protrusion or a groove. In this embodiment, the second bonding portions 232 are all grooves, and the second bonding portion 232 extends from the segment of the second wire 231 along the extending direction of the second wire 231. The second bonding portion 232 is formed by recessing the second wire 231 away from the surface of the second substrate layer 22 toward the inside of the second wire 231. The structure formed by the second joint portion 232 and the second wire 231 may have a concave shape or an inverted L shape in a cross section in the line width direction of the second wire 231. In the present embodiment, the structure in which the second joint portion 232 and the second wire 231 are formed has a concave cross section in the line width direction of the second wire 231. The width of the second bonding portion 232 in the line width direction of the second wire 231 is larger than the width of the first bonding portion 132 in the line width direction of the first wire 131. In this embodiment, a difference between a width of the second bonding portion 232 in a line width direction of the second wire 231 and a width of the first bonding portion 132 in a line width direction of the first wire 131 is about It is 0.2 microns.
所述導電膠體30形成在所述第一連接部11與所述第二連接部21之間，用於粘結所述第一連接部11與第二連接部21。所述導電膠體30填充所述多條第一導線131之間、所述多條第二導線231之間以及所述第一結合部132與所述第二結合部232之間的空隙。所述第一導線層13與所述第二導線層23藉由所述導電膠體30電性連接。The conductive paste 30 is formed between the first connecting portion 11 and the second connecting portion 21 for bonding the first connecting portion 11 and the second connecting portion 21. The conductive paste 30 fills a gap between the plurality of first wires 131, between the plurality of second wires 231, and between the first bonding portion 132 and the second bonding portion 232. The first wire layer 13 and the second wire layer 23 are electrically connected by the conductive paste 30 .
可以理解的是，其他實施方式中，所述第一連接部11還包括金屬保護層，如鎳金層、鍍錫層等。所述金屬保護層包覆在所述第一導線層13的第一導線131及第一結合部132的表面，此時，部分所述第一基材層12仍可從相鄰的第一導線131之間的空隙露出。所述第二連接部21還包括金屬保護層。所述金屬保護層包覆在所述第二導線層23的第二導線231及第二結合部232的表面，此時，部分所述第二基材層22仍可從相鄰的第二導線231之間的空隙露出。It can be understood that, in other embodiments, the first connecting portion 11 further includes a metal protective layer such as a nickel gold layer, a tin plating layer, or the like. The metal protective layer is coated on the surface of the first wire 131 and the first bonding portion 132 of the first wire layer 13. At this time, part of the first substrate layer 12 can still be from the adjacent first wire. The gap between 131 is exposed. The second connecting portion 21 further includes a metal protective layer. The metal protective layer is coated on the surface of the second wire 231 and the second bonding portion 232 of the second wire layer 23, and at this time, part of the second substrate layer 22 can still be from the adjacent second wire. The gap between 231 is exposed.
本發明實施方式提供的電路板壓接結構100，由於所述第一導線131上形成有第一結合部132，所述第二導線231上形成有與第一結合部132配合的第二結合部232，所述第一結合部132與所述第二結合部232為凹槽或凸起，藉由對應的凹槽與凸起的配合可以增大所述第一導線131與第二導線231的結合面積，進而增大所述第一軟性電路板10與所述第二軟性電路板20的剝離強度。In the circuit board crimping structure 100 provided by the embodiment of the present invention, a first joint portion 132 is formed on the first wire 131, and a second joint portion that is engaged with the first joint portion 132 is formed on the second wire 231. 232, the first bonding portion 132 and the second bonding portion 232 are grooves or protrusions, and the first wire 131 and the second wire 231 can be increased by the cooperation of the corresponding grooves and protrusions. The bonding area increases the peel strength of the first flexible circuit board 10 and the second flexible circuit board 20.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式及所列之數據為作試驗及參考之所用，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only for the preferred embodiment of the present invention and the data listed therein are used for testing and reference, and the scope of patent application in this case cannot be limited thereby. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
100‧‧‧電路板壓接結構100‧‧‧Circuit board crimping structure
10‧‧‧第一軟性電路板10‧‧‧First flexible circuit board
20‧‧‧第二軟性電路板20‧‧‧Second flexible circuit board
30‧‧‧導電膠體30‧‧‧Electrical colloid
11‧‧‧第一連接部11‧‧‧ First connection
12‧‧‧第一基材層12‧‧‧First substrate layer
13‧‧‧第一導線層13‧‧‧First wire layer
131‧‧‧第一導線131‧‧‧First wire
132‧‧‧第一結合部132‧‧‧ first joint
21‧‧‧第二連接部21‧‧‧Second connection
22‧‧‧第二基材層22‧‧‧Second substrate layer
23‧‧‧第二導線層23‧‧‧Second wire layer
231‧‧‧第二導線231‧‧‧second wire
232‧‧‧第二結合部232‧‧‧Second junction
無no
100‧‧‧電路板壓接結構 100‧‧‧Circuit board crimping structure
10‧‧‧第一軟性電路板 10‧‧‧First flexible circuit board
20‧‧‧第二軟性電路板 20‧‧‧Second flexible circuit board
30‧‧‧導電膠體 30‧‧‧Electrical colloid
11‧‧‧第一連接部 11‧‧‧ First connection
12‧‧‧第一基材層 12‧‧‧First substrate layer
13‧‧‧第一導線層 13‧‧‧First wire layer
131‧‧‧第一導線 131‧‧‧First wire
132‧‧‧第一結合部 132‧‧‧ first joint
21‧‧‧第二連接部 21‧‧‧Second connection
22‧‧‧第二基材層 22‧‧‧Second substrate layer
23‧‧‧第二導線層 23‧‧‧Second wire layer
231‧‧‧第二導線 231‧‧‧second wire
232‧‧‧第二結合部 232‧‧‧Second junction
Claims (10)
The circuit board crimping structure according to claim 1, wherein the first and second circuit boards are included, the first connecting portion is located at an end of the first circuit board, and the second connecting portion is located at the end The end of the second board.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510366516.2A CN106304631A (en) | 2015-06-29 | 2015-06-29 | Circuit board crimping structure and circuit board crimping structure manufacture method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201711542A true TW201711542A (en) | 2017-03-16 |
| TWI608772B TWI608772B (en) | 2017-12-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104125031A TWI608772B (en) | 2015-06-29 | 2015-07-31 | Circuit boards connecting structure and method for manufacturing same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106304631A (en) |
| TW (1) | TWI608772B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107741676A (en) * | 2017-10-19 | 2018-02-27 | 武汉华星光电半导体显示技术有限公司 | One kind coupling crimp type terminal structure and display device |
| CN111867273A (en) * | 2019-04-24 | 2020-10-30 | 鹏鼎控股(深圳)股份有限公司 | Circuit board connection structure and manufacturing method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6137063A (en) * | 1998-02-27 | 2000-10-24 | Micron Technology, Inc. | Electrical interconnections |
| JP2007141956A (en) * | 2005-11-15 | 2007-06-07 | Three M Innovative Properties Co | Printed-circuit board connection method |
| TW200919662A (en) * | 2007-10-16 | 2009-05-01 | Advanced Semiconductor Eng | Tenon-type package structure and method thereof |
| KR100907576B1 (en) * | 2008-02-13 | 2009-07-14 | 엘에스엠트론 주식회사 | Semiconductor device for prevention short circuit between electrode and semiconductor package using the same |
| JP2011151103A (en) * | 2010-01-20 | 2011-08-04 | Fujikura Ltd | Electronic component interconnecting structure and connecting method |
| TWI400021B (en) * | 2010-08-30 | 2013-06-21 | Zhen Ding Technology Co Ltd | Method for manufacturing printed circuit board module |
| WO2012121292A1 (en) * | 2011-03-09 | 2012-09-13 | 日立化成工業株式会社 | Tape for connecting circuits, reel of adhesive, use of laminated tape as circuit connecting material, use of laminated tape for manufacture of circuit connecting material, and method for manufacturing circuit-connected body |
-
2015
- 2015-06-29 CN CN201510366516.2A patent/CN106304631A/en active Pending
- 2015-07-31 TW TW104125031A patent/TWI608772B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI608772B (en) | 2017-12-11 |
| CN106304631A (en) | 2017-01-04 |
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