JP2016002200A5

JP2016002200A5 -

Info

Publication number: JP2016002200A5
Application number: JP2014123679A
Authority: JP
Filing date: 2014-06-16
Publication date: 2017-07-06
Anticipated expiration: 2034-06-16

Description

次に、図５のフローチャートに沿って、撮像ユニット１の製造方法について説明する。 Then, in accordance with the flowchart of FIG. 5, a method for manufacturing the image pickup unit 1.

図７、図８に示すように、撮像ユニット１Ａ（ケーブル付き配線板２Ａ）では、保持基板４０Ａが、中継配線板３０と類似した構成を有する。すなわち、保持基板４０Ａは、可撓性の第２の基板４１と、第２の接着層４２と、第２の第２電極４３Ａ（以下、「第３電極４３Ａ」という。）を有する導体パターン４３とを含む。第２の基板４１は基板３１と、第２の接着層４２は接着層３２と、第３電極４３Ａは第２電極３３Ａと、それぞれ略同じ構成である。ただし、図７に示すように保持基板４０Ａは、中継配線板３０よりも長さが短く、導体パターン４３は第１電極を有していない。 As shown in FIGS. 7 and 8, in the imaging unit 1 </ b> A (wiring board with cable 2 </ b> A), the holding board 40 </ b> A has a configuration similar to the relay wiring board 30. That is, the holding substrate 40A has a flexible second substrate 41, a second adhesive layer 42, and a conductor pattern 43 having a second second electrode 43A (hereinafter referred to as “third electrode 43A”). Including. The second substrate 41 has substantially the same configuration as the substrate 31, the second adhesive layer 42 has the adhesive layer 32, and the third electrode 43A has the second electrode 33A. However, as shown in FIG. 7, the holding substrate 40A is shorter than the relay wiring board 30 , and the conductor pattern 43 does not have the first electrode.

そして、ケーブル５０の芯線５１が、第２電極３３Ａと第３電極４３Ａにより挟持されており、配線パターン３３と導体パターン４３とが芯線５１を挟持していない回路基板２０側で密着し電気的に接続している状態で、接着層３２および第２の接着層４２により固定されている。なお、保持基板４０Ａは、仮固定するための粘着層パターンを含むことが好ましい。 The core wire 51 of the cable 50 is sandwiched between the second electrode 33A and the third electrode 43A, and the wiring pattern 33 and the conductor pattern 43 are in close contact with each other on the circuit board 20 side where the core wire 51 is not sandwiched. In the connected state, it is fixed by the adhesive layer 32 and the second adhesive layer 42. The holding substrate 40A preferably includes an adhesive layer pattern for temporarily fixing.

撮像ユニット１Ａ等は、撮像ユニット１等が有する効果を有し、さらに、芯線５１が両側から２つの導電体（第２電極３３Ａおよび第３電極４３Ａ）で挟持されているため、接続信頼性が、より高い。 The imaging unit 1A and the like have the effects of the imaging unit 1 and the like, and furthermore, since the core wire 51 is sandwiched between two conductors (second electrode 33A and third electrode 43A) from both sides, connection reliability is improved. ,taller than.

図９に示すように撮像ユニット１Ｂ等の中継配線板３０Ｂは、第２電極３３Ａの配設ピッチＰ２が、第１電極３３Ｃの配設ピッチＰ１よりも広い。このため、例えば、ケーブル５０の外径が、第１電極３３Ｃの配設ピッチＰ１よりも大きい場合であっても、中継配線板３０Ｂにより芯線５１を第２電極３３Ａに接続することができる。 As shown in FIG. 9, in the relay wiring board 30B such as the imaging unit 1B, the arrangement pitch P2 of the second electrodes 33A is wider than the arrangement pitch P1 of the first electrodes 33C. For this reason, for example, even when the outer diameter of the cable 50 is larger than the arrangement pitch P1 of the first electrodes 33C, the core wire 51 can be connected to the second electrode 33A by the relay wiring board 30B .

なお、図１０等では、中継配線板３０Ｂは保持基板４０と接着しているが、第２実施形態のように中継配線板３０Ｂと略同じ保持基板４０Ａと接着していてもよい。 In FIG. 10 and the like, the relay wiring board 30B is bonded to the holding board 40, but may be bonded to the holding board 40A substantially the same as the relay wiring board 30B as in the second embodiment.

Claims

An imaging device having an imaging unit formed on the light receiving surface;
A circuit board on which a connection terminal electrically connected to the imaging unit is disposed on the main surface;
A relay wiring board including a substrate, an adhesive layer, and a wiring pattern, wherein the first electrode of the wiring pattern having a first electrode and a second electrode is electrically connected to the connection terminal;
A cable having a core wire;
A holding substrate fixed to the relay wiring board by the adhesive layer in a state where the core wire is sandwiched between the second electrode and the core wire and the second electrode are electrically connected to each other. An imaging unit comprising:

The imaging unit according to claim 1, wherein an adhesive layer pattern for temporarily fixing the holding substrate is disposed on the relay wiring board.

The imaging unit according to claim 1, wherein the adhesive layer is made of an ultraviolet curable resin.

2. The relay wiring board and the circuit board are fixed by the adhesive layer in a state where the connection terminal and the first electrode are electrically connected by being in close contact with each other. The imaging unit according to claim 3.

3. The provisional fixing of the relay wiring board according to claim 2 , wherein the relay wiring board and the circuit board are in close contact with each other and are electrically connected by the adhesive layer pattern of the relay wiring board. Imaging unit.

The holding substrate includes a second substrate, a second adhesive layer, and a conductor pattern having a third electrode that is a second second electrode,
The core wire is sandwiched between the second electrode and the third electrode;
The wiring pattern and the conductor pattern are fixed by the adhesive layer and the second adhesive layer in a state of being electrically connected by being in close contact with each other at a portion where the core wire is not sandwiched. The imaging unit according to any one of claims 1 to 5.

The imaging unit according to any one of claims 1 to 6, wherein the circuit board is a multilayer wiring board, and the connection terminals are also disposed on a side surface orthogonal to the main surface. .

8. The imaging unit according to claim 1, wherein a BGA-type or CSP-type electronic component is solder-mounted on the circuit board. 9.

The imaging unit according to any one of claims 1 to 8, wherein an arrangement pitch of the second electrodes is wider than an arrangement pitch of the first electrodes.

The imaging unit according to claim 9, wherein a portion of the relay wiring board and the holding substrate that sandwiches the core wire is curved and deformed in the width direction.

The imaging unit according to any one of claims 1 to 10, wherein the imaging unit is disposed at a distal end portion of the endoscope.

A cable having a core wire;
A relay wiring board including a substrate, an adhesive layer, and a wiring pattern having a first electrode and a second electrode;
A holding substrate fixed to the relay wiring board by the adhesive layer in a state where the core wire is sandwiched between the second electrode and the core wire and the second electrode are electrically connected to each other. A wiring board with a cable, comprising: a circuit board on which a connection terminal electrically connected to the first electrode of the wiring pattern of the relay wiring board is disposed.

A relay wiring board including a substrate, an adhesive layer made of an ultraviolet curable resin, a wiring pattern having a first electrode and a second electrode, and an adhesive layer pattern; a holding substrate bonded to the relay wiring board; Preparing a cable having a core wire electrically connected to the wiring pattern;
The core wire of the cable clamped between the second electrode and the holding substrate, in a state in which said said wire second electrode is electrically connected by contact, the holding substrate and the relay circuit board And temporarily fixing through the adhesive layer pattern,
Inspecting the connection state of the cable;
A method of manufacturing a wiring board with a cable, comprising: a step of curing the adhesive layer by irradiating ultraviolet rays, and bonding and fixing the relay wiring board and the holding substrate.